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TWI786163B - 用於ｐｃｂ切割與洗滌之方法及裝置 - Google Patents

用於ｐｃｂ切割與洗滌之方法及裝置 Download PDF

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TWI786163B
TWI786163B TW107127462A TW107127462A TWI786163B TW I786163 B TWI786163 B TW I786163B TW 107127462 A TW107127462 A TW 107127462A TW 107127462 A TW107127462 A TW 107127462A TW I786163 B TWI786163 B TW I786163B
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pcb
units
washing
pcb units
panel
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TW201910018A (zh
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申允錫
丁鍾才
张德春
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新加坡商洛克系统私人有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/04—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of metal, e.g. skate blades
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06F—LAUNDERING, DRYING, IRONING, PRESSING OR FOLDING TEXTILE ARTICLES
    • D06F33/00—Control of operations performed in washing machines or washer-dryers 
    • D06F33/04—Control of operations performed in washing machines or washer-dryers  non-electrically
    • D06F33/06—Control of operations performed in washing machines or washer-dryers  non-electrically substantially mechanically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/088—Using a vapour or mist, e.g. cleaning using water vapor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1554—Rotating or turning the PCB in a continuous manner
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
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  • Manufacturing & Machinery (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Processing Of Solid Wastes (AREA)
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Abstract

本發明揭示一種用於洗滌複數個PCB單元的方法，該方法包括下列步驟：接收複數個PCB單元，該等PCB單元配置成一向下突出的凸塊面；洗滌該等PCB單元的該凸塊面；翻轉該等PCB單元以向下突出一球焊面；然後洗滌該球焊面。

Description

用於PCB切割與洗滌之方法及裝置
本發明係關於印刷電路板(PCB，printed circuit board)的處理，尤其係關於從一面板分離出PCB及後續處理。
在印刷電路板(PCB)變成更複雜裝置的處理中，退貨造成的浪費變成比退貨通過有限數量處理步驟的積體電路還昂貴的問題。對於印刷電路板而言，較大的材料成本顯然是一個問題，但是進一步具備更多處理來建構該等PCB到後續處理階段涉及更長的製造路徑，因此退貨代表更高的成本。
PCB退貨之一態樣是由於切割PCB以及切割過程中的碎屑干擾或損壞這單元而造成損壞。由於PCB退貨造成成本調高，因此重點是減少在該切割處理期間的這種退貨原因。
在第一態樣中，本發明提供一種用於洗滌複數個PCB單元的方法，該方法包括下列步驟：接收複數個PCB單元，該等PCB單元配置成一 向下突出的凸塊面；洗滌該等PCB單元的凸塊面，然後翻轉該等PCB單元以向下突出一球焊面；及洗滌該球焊面。
在第二態樣中，本發明提供一種用於洗滌複數個PCB單元的洗滌站，其包括：一洗滌單元，其配置成洗滌該等PCB單元並去除其毛邊；及一翻轉器，用於翻轉該等PCB單元；其中該洗滌單元配置成洗滌該等PCB單元一側並去除其毛邊，並且該翻轉器配置成翻轉該等PCB單元以暴露該等PCB單元的相對側，而該洗滌單元進一步配置成洗滌該相對側並去除其毛邊。
因此，本發明用於洗滌一PCB的兩側並去除其毛邊，減少退貨與浪費。
在第三態樣中，本發明提供一種IC單元卸載系統，其包括：一滑槽，其位於一網板與一卸載區域之間，該滑槽具有複數個通道，每個通道都配置成接收一單元，並且尺寸化以使該單元的一部分突出到該滑槽的一頂面上方；該等通道在一接收端處具有一第一間距，並且在一卸載端處具有一第二間距，該第一間距小於該第二間距；一抽取器，其配置成沿著該滑槽從該接收端移動至該卸載端，該抽取器具有一閘門，該閘門具有一定位成靠近該滑槽的頂面之單元接觸面；該單元接觸面配置成接觸該等單元，並且隨著該抽取器沿著該滑槽移動，沿著該個別通道抽取該等單元；其中該單元接觸面配置成允許該等單元橫向滑動通過該單元接觸面，以從該第一間距移動至該第二間距。
在第四態樣中，本發明提供一種用於卸載IC單元的方法，該方法包括下列步驟：將該等單元傳遞至一滑槽的通道，該滑槽介於一網板與 一卸載區域間；該等通道的間距從一第一間距改變成一第二間距，從一接收端改變至一卸載端，該第一間距小於該第二間距；將具備一單元接觸面的一抽取器沿著該滑槽從該接收端移動至該卸載端；該單元接觸面配置成接觸該等單元；通過單元接觸面沿著該個別通道抽取該等單元；在該等通道內將該等單元從該第一間距橫向移動至該第二間距。
5:裝置
10:面板匣
15:檢測裝置
17:滑床
20:裝載站
25:面板咬合臂
35:切割區域
40:夾台
45:翻轉器
50:洗滌站
55:乾燥區
60:網板
65:處理器
70:分類
75:移除
80:托盤
85:卸載區域
112:洗滌循環
160:PCB
165:凸塊面
170:球焊面
175:洗滌與去毛邊程序
180:翻轉
200:卸載系統
205:工作台
210:遞送滑槽
211:通道
212:單元接觸面
215:轉移點
217:頂面
220:第二間距
225:抽取器
230:末端卡匣
235:連動推送器
240:蓋子
245:推送
250:閘門
252:橫向滑動
255:單元
260:抽取
270:單元
275:單元
280:最終堆送器
282:滾柱
285:插腳
290:末端
300:推送
90、95、100、105、110、115、120、125、130、135、140、145、150、155:步驟
本發明將參考示意說明本發明可能配置的附圖來進一步描述。本發明的其他配置也是可能的，因此附圖的特殊性理解不應認為代替本發明前述說明的通性。
第一圖為根據本發明之一具體實施例的該切割與分類裝置之平面圖；第二圖為PCB面板流過根據本發明之進一步具體實施例的該切割與分類裝置之流程圖；第三圖為根據本發明之進一步具體實施例的一洗滌循環之示意圖；第四圖為根據本發明之進一步具體實施例的一單元卸載系統之立體圖；第五圖為第四圖中該單元卸載系統的平面圖；第六圖為根據本發明之進一步具體實施例的一單元推送器系統之立體圖；第七圖為第六圖中該單元推送器系統的平面圖；第八圖為根據本發明之進一步具體實施例的一單元抽取器系統之立體圖； 第九圖為第八圖中該單元抽取器系統的平面圖。
第一圖和第二圖顯示用於PCB的一切割與分類裝置。在本說明書，該裝置5包括一面板匣10、90用於載入95 PCB基板至一裝載站20。該等PCB已在大型單一面板內使用設置裝置5將該等PCB切割成個別單元來製造。
該等PCB面板以經由一推送器(未顯示)裝載(步驟95)至一平台上，由沿著一滑床17運行的檢測裝置15進行檢測(步驟100)。該檢測檢查該面板的方位與其他資料，以將諸如PCB類型、面板大小、PCB大小等等的特定參數輸入該控制系統，最終用於切割期間。
一旦檢測之後，通過沿著前述滑床17運行的一面板接合臂25，將該面板裝載(步驟105)至一夾台40。該面板放入切割區域35之內，其中一對鋸子將該面板切割(步驟110)成個別PCB單元。在此具體實施例中，該對鋸子沿著一共用軸線定向。一旦該面板內沿著該軸線的切割已經完成，則通過切割區域35之內一轉台旋轉該面板，然後該等鋸子沿著該直角軸線完成該處理。然後將該已切割面板送回夾台40，然後將該等已切割PCB單元遞送至洗滌站50。
一翻轉器45配置成卡住該面板成一體，以避免許多已切割PCB 160的相對移動。因此，可卡住整個面板。在該翻轉處理之前，將該面板放入洗滌站50之內，然後洗滌該等PCB 160的該第一表面，並且從底下洗滌(步驟115)。接著，翻轉(步驟120)該面板，以暴露相對表面，然後洗滌該 相對表面並從底下洗刷(步驟125)。然後將該面板遞送至乾燥區55來吹乾(步驟130)，並去除黏在該面板上的任何碎屑。
將該等個別PCB單元遞送至網板60，然後從底下檢驗(步驟140)每一PCB的該球焊面170，並且從上方檢驗(步驟145)該凸塊面165。然後，單獨拾取該等PCB單元並遞送(步驟150)至處置器65，將許多PCB分類70至許多托盤80，包括移除75未通過之前檢驗的單元。
接著將其中分類(步驟150)該等PCB單元的托盤80與托盤蓋一起封裝(步驟155)，並送至卸載區域85，最終從裝置5移除。
該處理的特定特徵為洗滌循環(步驟112)，這確保在卸載之前去除該PCB 160兩側上的毛邊並清潔。因為在前述先前技術中的問題只能翻轉單一PCB面板，因此在該切割循環期間只能清潔並去除一側的毛邊。根據本發明之一具體實施例的洗滌循環(步驟112)與先前技術不同之處在於，首先以該凸塊面165向下裝載該面板，並以此面向切割該面板。因為在切割之後直接在洗滌站50內套用該第一洗滌步驟，因此會先洗滌該凸塊面165，然後翻轉(步驟120)允許洗滌該球焊面170，然後接著進行乾燥與後續卸載處理。因此，本發明根據此具體實施例，通過完整清潔該等PCB 160遠離該切割中心以及兩面，減少退貨以及客戶端浪費。
第三圖顯示根據本發明之一具體實施例的該洗滌循環之示意圖。該洗滌站50以球焊面170往上突出並且凸塊面165往下突出的狀態接收一PCB 160，該凸塊面165經過洗滌與去毛邊程序175，並且在完成之後，PCB 160翻轉180，以暴露該球焊面170。在該洗滌循環的最終步驟，在該球 焊面170上完成該洗滌與去毛邊程序175，然後將PCB 160遞送至乾燥與其他下游工作站。
第四圖至第九圖顯示一積體電路(IC，integrated circuit)單元卸載系統200，用於個體化、洗滌及/或檢測之後單元的分配。該單元卸載系統200可適用於一系列單元處理系統。系統200不受上游處理的約束，而是可適用於分配來自網板60的單元。因此，本發明係關於將單元從一網板60遞送至一卸載區域85。
在目前的系統中，該網板60從該上游處理轉換而來，例如沿著一橫向滑床(未顯示)。或者，該網板60可透過一單元拾取器將該等單元置放於工作台205上，接收來自上游的單元。
透過一連動推送器235，將該等單元以組為單位推送，諸如每組6個，每一單元對應一橡膠插腳285，在目前的具體實施例內為6插腳。該等插腳285將單元255同時推送245至一遞送滑槽210上。該連動推送器235可包括位於已經推送的該等單元上之一蓋子240，以確保該等單元在施加推力時不會彎曲和凸起。連動推送器240進一步包括一過載感測器，以若該等單元黏住，或無法自由移動至滑槽210，則該過載感測器送出一信號來停止該連動推送器235，避免該等單元受損。
在將該等單元遞送245至滑槽210時，該連動推送器235退出至該啟動位置，並且該網板60位移來讓下一個單元群組對齊該滑槽210的通道211，用於遞送245下一個群組。在本說明書將了解，該通道211大小經過調整，以允許該等單元的一部分從通道211突出。
此時，抽取器225移動至滑槽210的近端。如第七圖和第八圖中所示，隨著該抽取器225往回移動，閘門250開啟，以清潔滑槽210。在到達近端時，閘門250關閉，讓該閘門250的一單元接觸面212靠近該滑槽210的一頂面217。然後，該抽取器225往前移動遠離該連動推送器235，單元接觸面212沿著該滑槽210將該等單元與該抽取器225一起抽出260。抽取器225進一步包括一蓋子240，以防止該等單元在向前拉動時移位。抽取器225進一步包括一過載感測器，類似於該連動推送器235。
請注意，該滑槽210的該等通道211間隔並不一致，但是在一轉移點215之前相隔第一間距，因此該等通道211之間的間隙比第二間距220還要寬。該滑槽210之末端290上的該等通道211的第二間距220對應至末端卡匣230，其中該等單元最終遞送至此進行後續卸載。如此，該抽取器225必須從接收該等單元的該第一間距調整為對應至卡匣230的一第二間距220。
當該抽取器225通過轉移點215時，該抽取器225通過允許該單元沿著該閘門250的該單元接觸面212橫向滑動252來達成這一點。
如前述，在該滑槽210的末端290上，抽取器225的閘門250開啟，並且該抽取器225返回來接收下一批單元。
此時單元270位於該滑槽的末端290上，準備遞送至該卸載區域，使得卡匣230準備好接收該等單元270。此時，最終推送器280開始往前移動。在開始移動時，該最終推送器280的插腳285在該等通道211之下。隨著該最終推送器280移動，一滾柱282遇到一凸輪，將最終推送器280提高來 對準插腳285與該等通道211，以對單元275施力，並將該等單275元推送300至卡匣230。
然後抽出該最終推送器280，準備從該抽取器225接收單元。
5:裝置
10:面板匣
15:檢測裝置
17:滑床
20:裝載站
25:面板接合臂
35:切割區域
40:夾台
45:翻轉器
50:洗滌站
55:乾燥區
60:網板
65:處置器
70:分類
75:移除
80:托盤
85:卸載區域

Claims (4)

  1. 一種用於切割與洗滌複數個PCB單元的方法，該方法包括下列步驟：切割一PCB面板，以將該PCB面板分離成複數個個別PCB單元；接收該等PCB單元於一翻轉器上，該等PCB單元配置成一向上突出之球焊面以及一向下突出的凸塊面；洗滌該等PCB單元的該凸塊面並去除其毛邊；使用該翻轉器翻轉該等PCB單元以向下突出該球焊面，以暴露該球焊面；及洗滌該球焊面並去除其毛邊。
  2. 如請求項1之方法，其中該翻轉步驟包括以單一步驟翻轉該等PCB單元。
  3. 如請求項1至2中任一項之方法，進一步包括乾燥該等PCB單元的步驟。
  4. 一種用於切割與洗滌複數個PCB單元的切割與分類裝置，其包括：一切割區域，其配置成將一PCB面板分離成複數個個別的PCB單元；及一洗滌站，包括一洗滌單元，其配置成洗滌該等PCB單元並去除其毛邊；及一翻轉器，用於翻轉該等PCB單元；其中該洗滌單元配置成洗滌該等PCB單元向下突出的一側並去除其毛邊，並且該翻轉器配置成翻轉該等PCB單元，使該些PCB單元之一相 對側向下突出，以暴露該相對側，而該洗滌單元進一步配置成洗滌該相對側並去除其毛邊。
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US20020182308A1 (en) * 2001-04-03 2002-12-05 Lee David M. Method for electroless gold plating of conductive traces on printed circuit boards

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* Cited by examiner, † Cited by third party
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