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TWI785621B - 電子元件載板及其佈線方法 - Google Patents

電子元件載板及其佈線方法 Download PDF

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TWI785621B
TWI785621B TW110118665A TW110118665A TWI785621B TW I785621 B TWI785621 B TW I785621B TW 110118665 A TW110118665 A TW 110118665A TW 110118665 A TW110118665 A TW 110118665A TW I785621 B TWI785621 B TW I785621B
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laminates
electronic component
component carrier
wires
laminate
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TW202247727A (zh
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高耀華
陳建全
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環球聯通科技股份有限公司
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Priority to US17/449,032 priority patent/US11751339B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
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    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers

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Abstract

一種電子元件載板及其佈線方法，該電子元件載板包含複數沿上下方向彼此相間隔排列的層板、複數沿上下方向與該等層板交錯排列的絕緣層、複數穿設該等層板及該等絕緣層的導電銷，及複數連接該等導電銷外周面且線長及線徑相等的導線。由於該等導電銷的外徑及該等導線的長度及線徑皆相同，因此阻抗相等而不需另外調整，進而克服習知阻抗不均之問題，當該電子元件載板作為檢測載板使用時，可確保檢測精準性。

Description

電子元件載板及其佈線方法
本發明是有關於一種載板及佈線方法，特別是指一種電子元件載板及其佈線方法。
印刷電路板是現代科技產品中不可或缺的載板元件，其主要是用來搭載電子元件並導通特定電路，現時印刷電路板的佈線製程，是在塑膠板的單面或兩面上依照所需的電路印製出導電銅箔，若印刷電路板為雙層板，則需要在塑膠板的兩面上印製導電銅箔，並在塑膠板上開設導孔(via)，使兩面的導電銅箔可以相連接。只要將各式電子元件安裝在完成後的印刷電路板上，導電銅箔就會將這些電子元件連接起來而組成完整的電路。
有鑑於科技不斷發展，電子產品功能日益複雜，印刷電路板的電路複雜度也不斷上升，單層板或雙層板的形式已然無法滿足需求，因此出現了多層板形式的印刷電路板。多層式印刷電路板是先準備多層表面印製有銅箔線路的層板，並依需求在層板上進行開孔，接著將這些層板與絕緣的膠片上下交錯疊合，並透過高溫高 壓的壓合機將彼此緊密結合，前面所述的開孔會彼此相連而形成貫通所有層板的導通孔(plate through hoe)、單向開通至外層層板的盲孔(blind via hole)，以及僅在內層部分層板之間相連通的埋孔(beried via hole)。這些導通孔、盲孔及埋孔是透過內部電鍍銅的方式與各層板上的銅箔線路相連，從而完成佈線，這些銅箔線路會再與電子元件或連接器等進行連接。但這些銅箔線路的線長甚至是線徑往往並不相等，導致訊號傳輸時產生阻抗不均之問題，需要透過其他方式來調整阻抗匹配，且調整效果有限，此問題在高頻訊號傳輸時尤為嚴重。當測試載板(load board)等需要進行高精密檢測的載板出現此類問題時，將會大幅影響檢測結果的可信度。
因此，本發明之目的，即在提供一種可避免阻抗不均而能提高訊號傳輸精確性的電子元件載板。
於是，本發明電子元件載板，包含複數沿上下方向彼此相間隔排列的層板、複數沿上下方向與該等層板交錯排列的絕緣層、複數穿設該等層板及該等絕緣層的導電銷，及複數連接該等導電銷且線長及線徑相等的導線。每一層板形成複數由頂面延伸至底面的貫孔，該層板的每一貫孔與相鄰層板的其中一貫孔對齊，沿上下方向相互對齊的該等貫孔相互連通而構成一插槽。每一絕緣層設置於兩相鄰層板之間。該等導電銷插置於該等插槽中。每一導線連 接其中一導電銷之外周面，且被包覆於其中一絕緣層中，從而位於相對應的兩個層板之間，該導線沿該等層板的水平方向延伸走線。
本發明之另一目的，即在提供前述電子元件載板的佈線方法。
於是，本發明電子元件載板的佈線方法，包含一前置步驟、一穿置步驟、一走線步驟、一填層步驟，及一疊層步驟。在該前置步驟中，準備複數層板，每一層板形成複數由頂面延伸至底面的貫孔。在該穿置步驟中，將該等導電銷穿過其中一層板之該等貫孔。在該走線步驟中，將複數長度等長且線徑等寬的導線連接於該等導電銷之外周面上，每一導線在該層板的頂面或底面上沿水平方向走線。在該填層步驟中，在該層板的頂面覆蓋一層絕緣層，該絕緣層包覆該等導線。在該疊層步驟中，以下一個層板重複進行該穿置步驟、該走線步驟，及該填層步驟，直至所有的層板上下疊層排列後，將該等層板及該等絕緣層壓合製成一電子元件載板。
本發明之功效在於：該等導線連接該等導電銷的外周面，由於該等導電銷的外徑及該等導線的長度及線徑皆相同，因此阻抗相等而不需另外調整，進而克服習知阻抗不均之問題，當該電子元件載板作為檢測載板使用時，可確保檢測精準性。
11:前置步驟
12:穿置步驟
13:走線步驟
14:填層步驟
15:疊層步驟
2:層板
21:貫孔
3:導電銷
4:導線
5:絕緣層
6:電子元件載板
7:連接器
本發明之其它的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是一流程圖，說明本發明電子元件載板的佈線方法之一實施例；圖2是一立體圖，說明本實施例中之一前置步驟；圖3是一立體圖，說明本實施例中之一穿置步驟；圖4是一立體圖，說明本實施例中之一走線步驟；圖5是一立體圖，說明本實施例中之一填層步驟；及圖6是一立體圖，說明本實施例所製成之一電子元件載板。
參閱圖1與圖2，本發明電子元件載板的佈線方法之一實施例，包含一前置步驟11、一穿置步驟12、一走線步驟13、一填層步驟14，及一疊層步驟15。在該前置步驟11中，準備複數層板2，每一層板2上形成有複數排列成矩陣且各自由頂面延伸至底面的貫孔21。在本實施例中，該層板2可以是塑膠板或密集板。該等貫孔21也可視需求排列成不同形狀，不應以矩陣之排列方式為限。
參閱圖1及圖3，在該穿置步驟12中，選擇一欲置於最底層的一個層板2，將該等導電銷3分別穿設該層板2之該等貫孔21。需要特別說明的是，本實施例中是以導電銷3數量與該等貫孔21數量相同為例，在實際考量走線等需求後，該等導電銷3的數量可以 小於該等貫孔21之數量。
參閱圖1及圖4，在該走線步驟13中，將數條長度等長且線徑等寬的銅製導線4焊接在該等導電銷3之外周面上，且每一條導線4在該層板2的頂面及底面沿水平方向走線(圖4中的走線路徑僅是示意，實際路徑可繞可彎，不限於直線)。該等導線4的數量可視走線的線路需求決定，也就是不見得會與該等導電銷3的數量相等。參閱圖1及圖5，在該填層步驟14中，在該層板2的頂面覆蓋一層絕緣層5，該絕緣層5會包覆該等導線4。
參閱圖1及圖6，在該疊層步驟15中，選擇下一個層板2，並重複進行該穿置步驟12、該走線步驟13，及該填層步驟14，也就是將該等導電銷3穿過該等貫孔21，使該層板2疊置於該絕緣層5上，接著依照需求將複數導線4焊接於相對應的導電銷3上，且該等導線4在該層板2的頂面及底面(也可以僅在頂面或底面)沿水平方向走線，而後在該層板2的頂面再覆蓋一層絕緣層5以包覆該等導線4。如此不斷進行前述流程直至該等層板2全數上下疊層排列，最後透過壓合將該等層板2及該等絕緣層5壓合製成一電子元件載板6。該電子元件載板6之每一層板2的每一個貫孔21，會與相鄰兩層板2的一個貫孔21對齊並相互連通，所有沿上下方向相互對齊的該等貫孔21相互連通而構成一插槽，該等導電銷3分別位於該等插槽中。
該等導線4是連接於該等導電銷3的外周面上，由於該等 導電銷3的外徑相同，該等導線4的線長及線徑也相同，從而可確保阻抗相同以克服習知之問題。當該等導線4要與連接器7接合時，該等導線4會沿水平方向穿出該等層板2及該等絕緣層5之外，透過預先的走線設計，可使該等導線4的末端位於相同的平面位置上，以與連接器7接合。此外，該等導電銷3為實心結構，因此具有較佳之結構強度，可提升該電子元件載板6之耐用性。
綜上所述，本發明透過相同線長及線徑的該等導線4，連接外徑相同的該等導電銷3，使阻抗值相同而可使訊號傳輸穩定，並可良好地應用於傳輸高頻信號，故確實能達成本發明之目的。
惟以上所述者，僅為本發明之實施例而已，當不能以此限定本發明實施之範圍，凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。
2········ 層板 21······ 貫孔 3········ 導電銷 4········ 導線 5········ 絕緣層 6········ 電子元件載板 7········ 連接器

Claims (4)

  1. 一種電子元件載板，包含：複數層板，沿上下方向彼此相間隔排列，每一層板形成複數由頂面延伸至底面的貫孔，該層板的每一貫孔與相鄰層板的其中一貫孔對齊，沿上下方向相互對齊的該等貫孔相互連通而構成一插槽；複數絕緣層，沿上下方向與該等層板交錯排列，每一絕緣層設置於兩相鄰層板之間；複數導電銷，穿設該等層板及該等絕緣層，並插置於該等插槽中；及複數導線，彼此線長及線徑相等，每一導線連接其中一導電銷之外周面，且被包覆於其中一絕緣層中，從而位於相對應的兩個層板之間，該導線沿該等層板的水平方向延伸走線。
  2. 如請求項1所述的電子元件載板，其中，每一導線是以焊接方式連接相對應之導電銷。
  3. 一種電子元件載板的佈線方法，包含：一前置步驟，準備複數層板，每一層板形成複數由頂面延伸至底面的貫孔；一穿置步驟，將複數導電銷穿過其中一層板之該等貫孔；一走線步驟，將複數長度等長且線徑等寬的導線連接於該等導電銷之外周面上，每一導線在該層板的頂面或底面上沿水平方向走線； 一填層步驟，在該層板的頂面覆蓋一層絕緣層，該絕緣層包覆該等導線；及一疊層步驟，以下一個層板重複進行該穿置步驟、該走線步驟，及該填層步驟，直至所有的層板上下疊層排列後，將該等層板及該等絕緣層壓合製成一電子元件載板。
  4. 如請求項3所述電子元件載板的佈線方法，其中，在該走線步驟中，該等導線是以焊接方式連接於該等導電銷的外周面。
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