TWI785337B - Endoscopic photography and light source structure - Google Patents

Abstract

An endoscope photography and light source structure, comprising: a circuit board, one of which faces upwards and is defined as an installation surface, on which a main component area and a light source area are defined; an imaging module, with An image sensor is arranged on the circuit board and located in the main element area, a lens group is arranged on the top of the image sensor, and a layer of light-proof elements is fixed around the side of the imaging module; a plurality of light-emitting diodes a bulk chip, arranged on the circuit board and electrically connected to the circuit board by the contacts at the bottom thereof, and located in the light source area; and a phosphor glue, arranged on the circuit board and covering the plurality of light-emitting diodes The wafer is located in the light source area, and the phosphor glue is also pasted on the light-proof element around the imaging module.

Description

Endoscopic photography and light source structure

The invention relates to an endoscope, in particular to an endoscope photography and light source structure.

According to the current field of endoscopes, the end of the endoscope lens is usually where the imaging module and light source are installed. Since the image sensor (usually a CCD charge-coupled device) is combined with the lens group to form an imaging module, and the light-emitting diode is a finished product made separately, therefore, in assembly, usually The imaging module is installed on a circuit board, and the light-emitting diode is installed on another circuit board, and then assembled, and then installed in the metal tube at the head end of the endoscope.

my country's No. I674876 patent is the previous technology applied by the applicant of this case. The case discloses that the imaging module is arranged on a circuit board, and the light source (ie light-emitting diode) is arranged on another annular circuit board and is set on the taking It is a technology that assembles around the image module and then installs it in the metal tube at the head end of the endoscope. In the technology of this case, since the imaging module and the light source are manufactured on different circuit boards, a gap is required for their assembly, which not only requires more steps in assembly, but also cannot be further miniaturized.

my country's patent No. M589532 is also the previous technology applied by the applicant of this case. The case discloses that the imaging module is set on a circuit board, and the light source (ie light-emitting diode) is set on another ring-shaped circuit board and is set on the circuit board. The technology of combining around the imaging module and then installing it in the metal tube at the head end of the endoscope. The technology of this case also has the problem that there are many processes in assembly, and it cannot be further miniaturized.

The main purpose of the present invention is to provide an endoscope photography and light source structure, which can integrate the light source and imaging module on one surface of the same circuit board, thereby reducing the number of devices installed in the metal tube at the head end of the endoscope. installation process, and can also achieve the effect of miniaturization of the overall structure.

Based on the above-mentioned shortcoming of the prior art, the present invention proposes a kind of endoscope photographing and light source structure, comprises: a circuit board, its one board surface faces up and is defined as the installation surface, defines a mutually non-overlapping one on the installation surface The main element area and a light source area; an imaging module, which has an image sensor arranged on the circuit board and located in the main element area, a lens group is arranged on the top of the image sensor, and the side of the imaging module A layer of light-tight elements is fixed around it; a plurality of light-emitting diode chips are arranged on the circuit board and each is electrically connected to the circuit board by the contact at the bottom, and is located in the light source area; and a fluorescent powder The glue is arranged on the circuit board and covers the plurality of light-emitting diode chips, and is located in the light source area. The phosphor glue is also pasted on the light-proof element around the imaging module.

In this way, the present invention integrates the light source and the imaging module on one surface of the same circuit board, thereby reducing the installation process in the metal tube at the head end of the endoscope, and also achieving the miniaturization of the overall structure effect.

In order to describe the technical characteristics of the present invention in detail, the following preferred embodiments are given below and described in conjunction with the drawings, wherein:

As shown in Fig. 1 to Fig. 5, a kind of endoscope photographing and light source structure 10 proposed by a preferred embodiment of the present invention mainly consists of a circuit board 11, an imaging module 21, a plurality of light-emitting diode chips 31 and a fluorescent powder glue 41, wherein:

In the circuit board 11 , one surface faces upward and is defined as the mounting surface 12 , and a main component area 121 and a light source area 122 are defined on the mounting surface 12 which do not overlap with each other. In Fig. 1 to Fig. 5, since the main element area 121 is blocked by the imaging module 21, it is only marked on the edge of the imaging module 21 when the figure number is marked, but it can be clearly seen from Fig. 4 See the positions of the main device area 121 and the light source area 122 . The circuit board 11 is generally preferably a rigid circuit board 11 , however, a flexible circuit board 11 can also be used, and is not limited to the rigid circuit board 11 . In this embodiment, the circuit board 11 is in the shape of a disc, the main element area 121 is located at the center of the top surface of the circuit board 11, and the light source area 122 is located around the main element area 121 in a ring shape. The diode chips 31 are located in the light source area 122 and are distributed equidistantly in a ring shape.

The imaging module 21 has an image sensor 22 disposed on the circuit board 11 and located in the main element area 121, the top of the image sensor 22 is provided with a lens group 24, and the side surface of the imaging module 21 is surrounded. A layer of light-tight element 26 is fixedly provided to cover the image sensor 22 and the lens group 24, so as to ensure that no light enters the side of the image sensor 22 and the lens group 24 to cause the image sensor. Detector 22 senses glare. In actual implementation, the light-tight element 26 can be a layer of black paint that is coated on the outer peripheral wall of the image-taking module 21 to prevent light, or a layer of light-proof plastic film is attached to the image-taking module 21. Like the outer peripheral wall of the module 21, or one layer of opaque plate is pasted on the outer peripheral wall of the imaging module 21, from the concept of reducing the volume, the mode of coating black paint takes up less volume (because of its thickness It is very thin), and there is no plastic film that requires additional consideration of assembly, so it is a better choice, and if an opaque plate is used, when the image sensor 22 and the lens group 24 are assembled, it will be The light-tight plate (that is, the light-tight element 26 ) is assembled together to form a combined element group. In addition, the opaque element 26 can also be further coated on the position where the image sensor 22 and the lens group 24 meet to further ensure that the light emitted by the plurality of light-emitting diode chips 31 will not The lens group 24 is irradiated from the handover position, thereby preventing the image sensor 22 from sensing glare. 4 shows that the aperture of the lens group 24 is larger than the aperture of the image sensor 22, so the bottom of the lens group 24 will be partially exposed outside the joint position with the image sensor 22. Herein The opaque element 26 will also be set during actual implementation to prevent light from entering the lens group 24 from here. However, if the aperture of the lens group 24 is smaller than the aperture of the image sensor 22, there will be no The situation of Fig. 4 occurs, and the bottom surface of the lens group 24 has no exposed part, so there is no need to arrange the opaque layer on the bottom surface of the lens group 24. The explanation of this part is mainly to illustrate the situation in Fig. 4 Below, the opaque element 26 is in a state of being applied by coating. In addition, since the opaque element 26 is covered outside the imaging module 21, it may be easily confused with the image sensor 22 and the lens group 24 on the label of the figure number. The ones marked in 4 are the clearest. The imaging module 21 has the functions of photographing and capturing images.

The plurality of light-emitting diode chips 31 are arranged on the circuit board 11 and electrically connected to the circuit board 11 by contacts at the bottom thereof, and are located in the light source area 122 . The plurality of light-emitting diode chips 31 are installed on the circuit board 11 using a chip on board (COB, chip on board) process in actual implementation. Through this process, each of the light-emitting diode chips 31 can be placed The volume occupied is less, and compared with general packaged light emitting diode elements, the present invention can arrange more light emitting diode chips 31 in the light source region 122 to provide a higher brightness light source.

The phosphor glue 41 is arranged on the circuit board 11 and covers the plurality of light-emitting diode chips 31, and is located in the light source area 122. The phosphor glue 41 is also pasted on the image-taking module 21 around the Opaque element 26 . In practical implementation, the fluorescent powder glue 41 is selected from the known fluorescent powder glue 41 in the market, so its detailed structure or composition will not be repeated here. In addition, a protective film 42 can be optionally provided on the outer peripheral surface of the fluorescent powder glue 41 , the bottom edge of the protective film 42 touches the top surface of the circuit board 11 , and the top edge is not lower than the phosphor powder glue 41 . The outer edge of the top can provide protection to the fluorescent powder glue 41 to facilitate assembly. Furthermore, the top surface of the fluorescent powder glue 41 can be set as a flat shape during actual implementation, so that the outgoing angle of the light emitted by the plurality of light-emitting diode chips 31 can not be changed, and the phosphor powder glue 41 The top surface of the light-emitting diode chip 31 can be set lower than the top edge of the light-proof element 26, thereby ensuring that the light emitted by the plurality of light-emitting diode chips 31 will not enter the lens from the side through the phosphor glue 41 Group 24. In addition, the top surface of the phosphor glue 41 can also be changed to a convex surface or other shapes according to requirements, so as to obtain other optical characteristics, so as to change the outgoing angles of the light emitted by the plurality of light-emitting diode chips 31, so as to satisfy user needs.

In addition to the above-mentioned elements, this first embodiment can also add elements as needed, for example, a lens transparent protective sheet 241 can also be set on the top of the lens group 24, and this lens transparent protective sheet 241 can make the lens group 24 The lens group 24 is protected by being separated from the outside world, and since the lens transparent protection sheet 241 is also a part of the lens group 24 , the light-proof element 26 is also arranged around the sides. In addition, a light source translucent protection sheet 411 can also be provided on the top of the fluorescent powder glue 41 to separate the fluorescent powder glue 41 from the outside, thereby providing protection for the fluorescent powder glue 41. The light source The light-transmitting protective sheet 411 only needs to be light-transmitting, and does not necessarily need to be transparent.

As shown in FIG. 4 , in the aforementioned structure, since the phosphor glue 41 is arranged on the circuit board 11 and also attached to the opaque element 26 around the imaging module, therefore, on the whole, the The circuit board 11 , the imaging module 21 and the plurality of light emitting diode chips 31 are all pasted by the phosphor glue 41 to form an integrated imaging and light source module. The bottom surface of the circuit board 11 can be used to electrically connect with other electronic components or wires.

It can be seen from the above that the present invention can achieve the effect of convenient assembly. When assembling the endoscope, the integrated imaging and light source module of the present invention can be installed in the head end metal tube 99 of the endoscope at one time, thereby reducing the number of installations on the head end of the endoscope. The installation process in the metal pipe 99 can also achieve the effect of miniaturization of the overall structure.

The circuit board 11 of the present invention is not necessarily circular, and its shape can also be changed according to requirements. In another form as shown in Figure 6, the circuit board 11' is in the shape of a long rectangle, the main element area 121' is located at the center of the top surface of the circuit board 11', and the light source area 122' is located in the main element area 121' on both sides. Also, as shown in FIG. 7 , the circuit board 11'' is approximately trapezoidal but cut off on both sides, the main component area 121'' is located in the middle of the circuit board 11'', and the light source area 122'' It is located on both sides of the main device area 121 ″. The two forms here are all different from the form of the aforementioned circular circuit board 11, and can be suitably plugged into the head end metal tube 99 of the endoscope with various needs, and also can achieve the aforementioned reduction of installation process and overall The effect of structural miniaturization.

The lens transparent protection sheet 241, the light source light transmission protection sheet 411 and the protection film 42 described above all are elements that can be added or not added as required. When these elements are not provided, the present invention can equally The effect of reducing the installation process and miniaturizing the overall structure is achieved.

10: Endoscopic photography and light source structure 11,11’,11”: circuit board 12: Mounting surface 121,121’,121”: main component area 122,122’,122”: light source area 21: Image capture module 22: Image sensor 24: Lens group 241: Lens transparent protective film 26: Opaque element 31: Light-emitting diode chip 41: Phosphor glue 411:Light source light transmission protection sheet 42: Protective film 99: metal tube

Fig. 1 is an assembled perspective view of a preferred embodiment of the present invention. Fig. 2 is a side view of a preferred embodiment of the present invention. Fig. 3 is a top view of a preferred embodiment of the present invention. Fig. 4 is a sectional view along line 4-4 in Fig. 3 . Fig. 5 is a schematic diagram of assembly of a preferred embodiment of the present invention. Fig. 6 is another implementation pattern diagram of a preferred embodiment of the present invention. Fig. 7 is yet another implementation pattern diagram of a preferred embodiment of the present invention.

11: Circuit board

12: Mounting surface

121: Main component area

122: light source area

21: Image capture module

22: Image sensor

24: Lens group

241: Lens transparent protective film

26: Opaque element

31: Light-emitting diode chip

41: Phosphor glue

411:Light source light transmission protection sheet

42: Protective film

Claims (9)

An endoscope photography and light source structure includes: a circuit board, one of which faces upwards and is defined as an installation surface, on which a main component area and a light source area that do not overlap each other are defined; The imaging module has an image sensor disposed on the circuit board and located in the main element area, the top of the image sensor is provided with a lens group, and a layer of light-proof elements is fixed around the side of the imaging module; A plurality of light-emitting diode chips are arranged on the circuit board and each is electrically connected to the circuit board by the contacts at the bottom thereof, and are located in the light source area; and a fluorescent powder glue is arranged on the circuit board and covers the plurality of The light-emitting diode chip is located in the light source area, and the phosphor glue is also pasted on the opaque element around the imaging module and filled between the imaging module and the circuit board. According to the endoscope photography and light source structure described in Claim 1, a protective film is provided on the outer peripheral surface of the fluorescent powder glue. According to the endoscope photography and light source structure described in claim 2, wherein: the bottom edge of the protective film is in contact with the top surface of the circuit board, and the top edge is not lower than the top outer edge of the phosphor glue. According to the endoscope photography and light source structure described in Claim 1, wherein: the top surface of the fluorescent powder glue is flat and lower than the top edge of the opaque element. According to the endoscope photography and light source structure described in Claim 1, wherein: the circuit board is in the shape of a long rectangle, the main element area is located at the center of the top surface of the circuit board, and the light source area is located on both sides of the main element area . According to the endoscope photography and light source structure described in claim 1, wherein: the circuit board is in the shape of a disc, the main element area is located at the center of the top surface of the circuit board, and the light source area is located around the main element area The plurality of light-emitting diode chips are located in the light source area and distributed equally in a ring shape. According to the endoscope photography and light source structure described in Claim 1, wherein: the top of the lens group has a lens transparent protection sheet, and the lens transparent protection sheet separates the lens group from the outside world. According to the endoscope photography and light source structure described in Claim 1, wherein: the top of the fluorescent powder glue is provided with a light source light transmission protection sheet, and the light source light transmission protection sheet separates the fluorescent powder glue from the outside world. According to the endoscope photography and light source structure described in Claim 1, wherein: the opaque element is selected from one of opaque paint, opaque plastic film or opaque plate.

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