TWI785087B - Dressing device and dressing method for substrate back surface polishing member - Google Patents

Abstract

An object of the invention is to prevent cleaning liquid and sludge and the like from splashing onto the surroundings when cleaning and dressing a polishing member that polishes the rear surface of a substrate. A dressing device 200 incorporates a bath member 203 which comprises a top panel section 201 and a cylindrical skirt section 202 provided on the bottom surface side of the top panel section 201, so as to be able to house a polishing pad 131 from above. The bath member 203 comprises a two-fluid nozzle 204 which ejects a cleaning liquid and a gas onto a polishing surface of the polishing pad, a dress board 205 capable of contacting the polishing surface of the polishing pad 131, and a rinse nozzle 206 which supplies a rinse to the contact surface between the polishing surface of the polishing pad 131 and the dress board 205. Splashing of the cleaning liquid, polishing debris, and sludge onto the surroundings is prevented by the skirt section 202.

Description

Trimming device and trimming method for back grinding member of substrate

The invention relates to a trimming device and a trimming method of a grinding member on the back of a substrate.

For example, in the manufacturing process of semiconductor devices, before the exposure process such as patterns, the back surface of the semiconductor wafer (sometimes simply referred to as wafer in the following description) is polished with a polishing member such as a polishing pad, so as to improve the surface area of the substrate back surface. flatness and eliminate machining distortion without scratches or dirt.

However, in such a grinding process using a grinding member, sludge (shavings) may be generated during grinding. When the sludge enters the pores or grooves of the polishing pad, the polishing efficiency will be reduced, and the desired polishing process cannot be completed.

In view of this problem, in order to maintain the performance of the polishing pad within an appropriate range, some people regularly clean or dress (file) the polishing pad.

As an apparatus for cleaning and dressing such a polishing pad, for example, a polishing apparatus of a polishing member that polishes the wafer surface from above the wafer has been proposed (Patent Document 1). This grinding device has: a grinding plate equipped with a grinding wheel for dressing; a supporting mechanism for the grinding plate supports the grinding plate so that it can be moved to a position higher than the holding surface of the chuck seat holding the substrate, and lower than The evacuation position of the holding surface of the chuck seat; and the cleaning fluid injection mechanism, which sprays cleaning fluid to the grinding surface of the grinding pad positioned on the upper side of the sharpening plate.

[Prior Art Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-69601

However, the technology described in the above-mentioned Patent Document 1 is a grinding device for grinding a grinding member with a downward facing surface, and usually cannot be directly applied to dressing a back grinding member with an upward grinding surface, so we need a device suitable for dressing a back grinding member. Generally speaking, cleaning and dressing of such a grinding member is carried out while rotating the grinding member, so how to prevent sludge or cleaning liquid from flying around at this time is really important.

The present invention is completed in view of this point, and its purpose is: when cleaning and dressing the grinding member used to grind the back surface of the substrate, prevent the cleaning liquid, sludge, or grinding wheel waste generated during the dressing from flying to the surrounding area. If necessary, clean and trim as appropriate.

In order to achieve the above object, the present invention is a trimming device for trimming a grinding member used to grind the back surface of a substrate, and is characterized in that it includes: a groove member, including a top cover part, and a bottom surface side of the top cover part, which is formed in a cylindrical shape. skirt, and the grinding member can be stored from above; the nozzle is arranged on the trough member, and sprays cleaning liquid and gas to the grinding surface of the stored grinding member; and the dressing member is arranged on the trough member , and can abut against the grinding surface of the stored grinding member; and the trimming device is arranged at a position where the grinding object, that is, the substrate, does not overlap each other in a plan view.

According to the present invention, when cleaning and dressing the grinding member, since it is carried out in a state where the grinding member is stored from above by the groove member, even if the grinding member is rotated while cleaning and dressing is performed, at this time The cleaning liquid, grinding wheel waste chips or sludge scattered to the surroundings will still touch the inner side of the skirt of the trough member and fall directly, and will not scatter around the trough member. Also, since the dressing device itself is arranged at a position where the substrate to be polished, that is, the substrate to be polished, does not overlap with each other in a plan view, the dropped cleaning liquid, grinding wheel waste, or sludge will not adhere to the substrate to be polished on the backside.

In addition, the term "storing the grinding member from above" here refers to a state in which the lower end of the skirt is positioned below at least the grinding surface of the grinding member.

The present invention may include a nozzle for supplying a rinse liquid to the polishing surface of the polishing member.

Preferably, the lower end of the skirt is positioned lower than the surface of the substrate to be polished.

The trimming member can be proposed to be made: for example, the grinding surface side of the grinding member is flat (but has a small surface roughness required for grinding), and the trimming member has a shape covering more than half of the grinding member .

The trimming member may be made to be rotatable.

The trimming member can be manufactured as follows: its outer shape is cylindrical, the peripheral surface of the trimming member is configured to abut against the grinding surface of the grinding member, and the trimming member rotates following the rotation of the grinding member.

In this case, the trimming member may be formed in a push-out shape in which the diameters of one end and the other end are different.

In addition, the trimming member may be made so as to be able to swing arbitrarily around a fulcrum set other than the end in the longitudinal direction.

The trimming member may be installed in the groove member by an elastic member.

It is also possible that the trimming member is arranged on the groove member by a free joint.

It is also possible that the cleaning solution has been heated.

The present invention may include an imaging device for monitoring the grinding surface of the grinding member. In addition, it may be provided with a laser displacement meter for monitoring the surface state of the polishing surface of the polishing member. Here, the surface state of the polished surface may be, for example, the amount of wear or contamination of the polished surface.

According to another point of view, the present invention is a method for trimming a grinding member for grinding the back surface of a substrate, which is characterized in that: "Having a top cover part, and being provided on the bottom surface side of the top cover part and forming a cylindrical skirt part , and the grinding member can be accommodated from above”, the tank member is at a position where the substrate, which is the object of grinding, does not overlap with each other in a plan view, and on the inside of the tank member, the grinding member is rotated while The grinding surface of the grinding member is cleaned by supplying a cleaning liquid, and the dressing member provided on the groove member is brought into contact with the grinding surface of the grinding member to perform dressing while rotating the grinding member.

According to yet another viewpoint, the present invention is a method for trimming a grinding member for grinding the back surface of a substrate, which is characterized in that: "Having a top cover part, and being provided on the bottom surface side of the top cover part and forming a cylindrical skirt part, and the grinding member can be accommodated from above", the groove member is located at a position where the substrate does not overlap with the grinding object in plan view, and the grinding surface of the grinding member is supplied to the inner side of the groove member. Cleaning is carried out with a cleaning solution, and while the grinding member is rotated around a point other than the center of the grinding member, dressing is performed by contacting the dressing member provided on the groove member with the grinding surface of the grinding member.

In this case, the pressing force of the polishing member against the back surface of the substrate when the back surface of the substrate is ground may be adjusted inside the groove member.

According to yet another viewpoint, the present invention is a method of cleaning and dressing a grinding member using the dressing device equipped with a photographing device, which is characterized in that the cleaning is performed according to the surface state of the grinding surface of the grinding member photographed by the photographing device and trimming.

According to the present invention, when cleaning and dressing the grinding member used to grind the back surface of the substrate, the cleaning liquid or sludge is prevented from being scattered around, and for the substrate as the back grinding object, the cleaning liquid or the grinding wheel waste, or It is silt flying attached thereto. Therefore, the polishing member for polishing the back surface of the substrate can be properly cleaned and conditioned.

1: Substrate processing system

10: Cassette loading and unloading station

11: Processing station

12: Exposure device

13:Interface station

20: Cassette loading table

21: Cassette loading plate

22: Transport channel

23:Wafer transfer device

30: Development processing device

31: Bottom anti-reflection film forming device

32: Photoresist coating device

33: Upper anti-reflection film forming device

40: Heat treatment device

41: Hydrophobic treatment device

42: Peripheral exposure device

50, 51, 52, 53, 54, 55, 56: transfer device

60, 61, 62: transfer device

70, 81, 90: Wafer transfer device

70a, 81a, 90a: transfer arm

80: Transfer shuttle transfer device

91: transfer device

100: Back grinding device

110: control department

111: frame

112: holding member

113: ring member

114: Nozzle

115: support body

120: discharge pipe

121: exhaust pipe

130: grinding mechanism

131: Grinding pad

132: Support body

133: support column

134: support arm

135: Driving mechanism

136: guide rail

200: Dressing device

201: top cover

202: Skirt

203: Groove member

204: Two-fluid nozzle

205: trimming board

206: Rinsing nozzle

250, 260: trimming components

251: Support member

252: Install components

253: pivot

254: spring

300, 400: Dressing device

401: free joint

401a: cross shaft frame

401b, 401c: fixed part

410:Laser Displacement Meter

411: window

412: window components

413:Laser irradiation department

413a: Irradiated surface

421: gas nozzle

422: spout

423: Guidance components

423a: Bevel

431: Support body

C: Cassette

D: Wafer transfer area

G1: the first block

G2: the second block

G3: The third block

G4: The fourth block

L: laser light

W: Wafer

[ Fig. 1 ] is a plan view schematically showing a substrate processing system including a trimming device according to this embodiment.

[ Fig. 2 ] is a front view of the substrate processing system shown in Fig. 1 .

[ Fig. 3 ] is a rear view of the substrate processing system of Fig. 1 .

[ Fig. 4 ] is a plan view showing a schematic configuration of a back grinding device provided with a dressing device according to this embodiment.

[ Fig. 5 ] is a front view of the back grinding device shown in Fig. 4 .

[ Fig. 6 ] is a perspective view of a trimming device according to an embodiment.

[ Fig. 7 ] is a side view schematically showing the inside of the trimming device according to the embodiment.

[ Fig. 8 ] is a bottom view of a trimming device according to an embodiment.

[ Fig. 9 ] is a front view schematically showing the state of the inside when trimming is performed by the trimming device according to the embodiment.

[Fig. 10] is a bottom view of a trimming device made into a trimming plate that can be rotated.

[ Fig. 11 ] is a side view schematically showing the state of the interior when static pressure is applied by the trimming device according to the embodiment.

[ Fig. 12 ] is a perspective view of a trimming device having a rod-shaped trimming member.

[ Fig. 13 ] is a perspective view showing a state of trimming with a rod-shaped trimming member.

[FIG. 14] It is a front view of the support member showing that the stick-shaped dressing member can be shaken.

[Fig. 15] It is a front view of a support member supporting a rod-shaped trimming member forming a push-pull shape.

[Fig. 16] is a perspective view of a trimming device with a free joint and a laser displacement gauge.

[ Fig. 17 ] is a bottom view of the trimming device in Fig. 16 .

[ Fig. 18 ] is a perspective view of a free joint used in the trimming device of Fig. 16 .

[ Fig. 19 ] (a) and (b) are explanatory diagrams showing how the dressing plate in the dressing device of Fig. 16 is inclined following the polishing pad.

[ Fig. 20 ] is an explanatory diagram showing the state of measurement with a laser displacement meter.

[ Fig. 21 ] is an explanatory diagram showing how air is ejected to the window member.

[Fig. 22] is an explanatory diagram showing how the polishing pad is turned and dressed.

[ Fig. 23 ] is a side view schematically showing the inside of the dressing device having the function of rotating the polishing pad.

[ Fig. 24 ] is an explanatory diagram showing the followability of the trimming pad when the polishing pad is turned in the case where the trimming board is installed by a free joint.

Embodiments of the present invention will be described below while referring to the drawings. In this specification and drawings, elements having substantially the same functions and configurations are given the same symbols to omit repeated descriptions.

<Substrate processing system>

First, the configuration of a substrate processing system including the trimming device according to this embodiment will be described. FIG. 1 is a plan view schematically showing a schematic configuration of a substrate processing system 1 . 2 and 3 are respectively a front view and a rear view schematically showing the internal structure of the substrate processing system 1 . In addition, the substrate processing system 1 performs predetermined processing on a wafer W as a substrate to be processed.

As shown in FIG. 1 , the substrate processing system 1 has a configuration obtained by integrally connecting the following parts: a cassette loading and unloading station 10 for loading and unloading a cassette C accommodating a plurality of wafers W; A plurality of processing devices performing predetermined processing in the circle W; and the transfer of the wafer W between the interface station 13 and the exposure device 12 adjacent to the processing station 11 .

A cassette loading table 20 is provided at the cassette loading and unloading station 10 . The cassette mounting table 20 is provided with a plurality of cassette mounting plates 21 for mounting the cassette C when loading and unloading the cassette C to the outside of the substrate processing system.

A wafer transfer device 23 is provided at the cassette loading and unloading station 10 , and the wafer transfer device 23 can move arbitrarily along a transfer lane 22 extending in the X direction as shown in FIG. 1 . The wafer transfer device 23 can move arbitrarily along the vertical direction and around the vertical axis (theta direction), and can move the cassette C on each cassette loading plate 21 and the third block G3 of the processing station 11 described later. The transfer device transfers the wafer W between the two.

A plurality of blocks equipped with various devices, for example, four blocks, that is, the first block G1 to the fourth block G4 are provided in the processing station 11 . For example, a second block G2 is provided on the back side of the processing station 11 (the side in the positive X direction in FIG. 1 , the upper side in the drawing). Also, the third block G3 is provided on the side of the cassette loading and unloading station 10 of the processing station 11 (the negative side of the Y direction in FIG. 1 ), and on the interface station 13 side of the processing station 11 (the positive direction of the Y direction in FIG. 1 side) is provided with a fourth block G4.

As shown in FIG. 2, a plurality of liquid processing devices are arranged in the first block G1. For example, in order from the bottom, there are: a development treatment device 30, which develops the wafer W; anti-reflection film”); photoresist coating device 32, which is used as a processing liquid coating device for coating photoresist on wafer W to form a processing film; An antireflection film (hereinafter referred to as "upper antireflection film") was formed.

For example, the development processing device 30 , the lower anti-reflection film forming device 31 , the resist coating device 32 , and the upper anti-reflection film forming device 33 are arranged in parallel in the horizontal direction every three. In addition, the number and arrangement of the developing processing devices 30 , lower anti-reflection film forming devices 31 , resist coating devices 32 , and upper anti-reflection film forming devices 33 can be selected arbitrarily.

The development processing device 30 , lower anti-reflection film forming device 31 , resist coating device 32 , and upper anti-reflection film forming device 33 perform, for example, a spin coating method for coating a predetermined processing liquid on the wafer W. In the spin coating method, the processing liquid is sprayed onto the wafer W from, for example, a coating nozzle, and the wafer W is rotated to spread the processing liquid on the surface of the wafer W.

For example, as shown in FIG. 3 , in the second block G2, there are arranged side by side along the vertical direction and the horizontal direction: a heat treatment device 40, which performs heat treatment of so-called heating or cooling of the wafer W; Hydrophobization treatment is performed for the fixation of both wafer W and wafer W; and the peripheral exposure device 42 exposes the outer peripheral portion of wafer W. Similarly, the number or arrangement of the heat treatment devices 40 , hydrophobization treatment devices 41 , and peripheral exposure devices 42 can also be selected arbitrarily.

For example, a plurality of transfer devices 50, 51, 52, 53, 54, 55, 56 are provided in sequence from the bottom in the third block G3, and a plurality of transfer devices are provided in sequence from the bottom in the fourth block G4 60, 61, 62.

As shown in FIG. 1 , a wafer transfer area D is formed in an area surrounded by the first block G1 to the fourth block G4 . In the wafer transfer area D, a plurality of wafer transfer devices 70 are arranged, and the wafer transfer devices 70 have transfer arms 70 a that can move arbitrarily along, for example, the Y direction, the X direction, the θ direction, and the vertical direction. The wafer transfer device 70 moves within the wafer transfer area D, and can transfer the wafer W to the surrounding first block G1, second block G2, third block G3, and fourth block G4. scheduled device.

In addition, as shown in FIG. 3, a transfer shuttle transfer device 80 is provided in the wafer transfer area D, and the transfer shuttle transfer device 80 linearly transfers wafers between the third block G3 and the fourth block G4. W.

The transfer shuttle transfer device 80 can linearly and arbitrarily move along, for example, the Y direction in FIG. 3 . In addition, the shuttle transfer device 80 moves in the Y direction while supporting the wafer W, and can transfer the wafer between the transfer device 52 of the third block G3 and the transfer device 62 of the fourth block G4. W.

As shown in FIG. 1 , a wafer transfer device 81 is provided beside the positive direction side in the X direction of the third block G3 . The wafer transfer device 81 has a transfer arm 81 a that can be arbitrarily moved along, for example, the X direction, the θ direction, and the vertical direction. The wafer transfer device 81 moves up and down with the wafer W supported by the transfer arm 81a, and can transfer the wafer W to each transfer device in the third block G3.

The interface station 13 is provided with a wafer transfer device 90 , a transfer device 91 , and a substrate back grinding device 100 which will be described later. The wafer transfer device 90 has a transfer arm 90 a that can be arbitrarily moved along, for example, the Y direction, the θ direction, and the vertical direction. The wafer transfer device 90 supports the wafer W by, for example, the transfer arm 90a, and can transfer the wafer W between each transfer device, the transfer device 91, the back grinding device 100, and the exposure device 12 in the fourth block G4.

As shown in FIG. 1 , the above substrate processing system 1 is provided with a control unit 110 . The control unit 110 is, for example, a computer, and has a program storage unit (not shown). A program for controlling the processing of the wafer W in the substrate processing system 1 is stored in the program storage unit. The program is, for example, a computer-readable hard disk (HD), floppy disk (FD), compact disk (CD), magneto-optical disk (MO), memory card and other computer-readable storage media that are recorded on, and may be installed to the control unit 110 from the storage medium.

<Back grinding device 100>

Next, the configuration of a back grinding apparatus 100 for a substrate provided with a trimming apparatus according to an embodiment of the present invention will be described.

FIG. 4 is a plan view schematically showing a schematic configuration of the back grinding apparatus 100 . FIG. 5 is a side view schematically showing a schematic configuration of the back grinding apparatus 100 .

In the back grinding apparatus 100 , for example, three holding members 112 for horizontally holding the wafer W to be polished are provided inside a frame 111 with an opening formed on the top surface. The holding member 112 is arranged on the inner periphery of the rotatable ring member 113 provided in the frame body 111, and moves toward the center of the wafer W by a holding member driving mechanism (not shown) provided on the ring member 113. Direction movement can push the peripheral portion of the wafer W arbitrarily, and the wafer W can be held in a horizontal state under the pushing state. In addition, the wafer W held can be rotated by the rotation of the ring member 113 .

On the bottom of the frame body 111 , a nozzle 114 for spraying a cleaning liquid onto the back surface of the wafer W held by the holding member 112 is provided via the support body 115 .

Also, the bottom of the frame body 111 is further provided with: a discharge pipe 120 for discharging cleaning liquid, etc.; The airflow.

<Grinding mechanism 130>

Inside the housing 111, a polishing mechanism 130 for polishing the back surface of the wafer W held in a horizontal state by the holding member 112 is provided. In the polishing mechanism 130 , a polishing pad 131 is fixed to the top surface of a support body 132 , and this polishing pad 131 serves as a polishing member that comes into contact with the wafer W when the backside of the wafer W is polished.

The support body 132 is disposed on the top of a rotatable support column 133 , and the support column 133 is disposed on a support arm 134 extending along the horizontal direction. The supporting arm 134 is disposed on the driving mechanism 135 extending along the Y direction inside the frame body 111 , and can move arbitrarily along the Y direction along the longitudinal direction of the driving mechanism 135 . In addition, the support arm 134 is also freely movable in the vertical direction. In addition, the bottom of the driving mechanism 135 in the frame body 111 can move arbitrarily along the X direction along the guide rail 136 provided along the X direction. According to this configuration, the polishing pad 131 can move three-dimensionally within the frame body 111 .

<Trimming device 200>

As shown in FIG. 4 , the trimming device 200 according to the embodiment is installed in the frame body 111 separately from the wafer W so that the wafer W held by the holding member 112 does not overlap each other in a plan view.

FIG. 6 is a perspective view of the trimming device 200, FIG. 7 is a front view showing a schematic configuration of the trimming device 200, and FIG. 8 is a bottom view.

As shown in these FIGS. 6 to 8 , the trimming device 200 has a top cover part 201 and a cylindrical skirt part 202 provided on the bottom surface side of the top cover part 201 . The top cover portion 201 and the skirt portion 202 form a groove member 203 . In addition, the skirt portion 202 has an inner diameter capable of accommodating the polishing pad 131 and a length in the vertical direction.

The top cover portion 201 is provided with a two-fluid nozzle 204 penetrating through the top cover portion 201 to inject gas and cleaning liquid into the tank member 203 at the same time. Moreover, a dressing plate 205 as a dressing member for dressing the polishing pad 131 is provided on the inner bottom surface of the top cover portion 201 . As shown in FIG. 8 , the trimming plate 205 has a shape obtained by cutting a part of the disk with a straight line, and has a size that covers more than half of the polishing pad 131 and does not cover a part of the polishing pad 131 . Also, as shown in FIG. 9 , a two-fluid nozzle 204 for ejecting gas and cleaning liquid is provided above the portion of the polishing pad 131 not covered by the dressing plate 205 .

Further, in the skirt portion 202, a rinse nozzle 206 for supplying rinse liquid in the horizontal direction is provided on the bottom surface side of the trim plate 205. As shown in FIG.

The dressing device 200 according to the embodiment has the above configuration, and a dressing method using the dressing device 200 will be described next.

<Trimming method>

Cleaning and dressing of the polishing pad 131 by the dressing device 200 are performed, for example, as follows. First, make the support column 133 under the groove member 203, and then raise the support column 133, and as shown in FIG. In this state, the polishing pad 131 is While rotating, gas (such as nitrogen) and cleaning liquid (such as pure water) are sprayed toward the polishing surface of the top surface of the polishing pad 131 from the two-fluid nozzle 204 . Thereby, the polishing surface of the polishing pad 131 is cleaned.

Moreover, in order to dress the polishing pad 131, the present invention further raises the polishing pad 131 as shown in FIG. In this state, the polishing pad 131 can be dressed by rotating the polishing pad 131 while supplying the rinsing liquid from the rinsing nozzle 206 toward the contact surface between the polishing surface of the polishing pad 131 and the dressing plate 205 .

As described above, by using the dressing method according to the dressing device 200 of the embodiment, the cleaning and dressing of the polishing pad 131 can be performed in a state where the polishing surface of the polishing pad 131 is accommodated in the groove member 203 having an opening formed on the bottom surface. Even if the grinding pad 131 is rotated while cleaning and dressing are performed, the cleaning fluid or grinding wheel waste or sludge scattered around at this time will still touch the inner side of the skirt portion 202 of the groove member 203 and fall directly. Therefore, it is not scattered around the outside of the tank member 203 . In addition, since the trimming device 200 itself is arranged at a position where the wafer W, the object of grinding, does not overlap with each other in a plan view, the dropped cleaning liquid, grinding wheel waste, or sludge will not adhere to the wafer W as the object of back grinding. Wafer W. Furthermore, by positioning the lower end of the skirt portion 202 below the surface of the wafer W, it is possible to more reliably prevent cleaning fluid, grinding wheel waste, or sludge from flying and adhering to the wafer W.

Also, the cleaning fluid or grinding wheel waste chips or sludge falling from the tank member 203 are discharged from the discharge pipe 120 provided at the bottom of the frame body 111, but in order to prevent the ambient gas in the frame body 111 from being Contamination can also be provided with a discharge tray under the trough member 203, and then discharged from the frame body 111 after being temporarily blocked by the discharge tray.

When dressing, a rinse liquid is supplied to the polishing surface of the polishing pad 131 from the rinse nozzle 206 , and a rinse liquid or a cleaning liquid may be supplied from the two-fluid nozzle 204 . In this case, flushing nozzle 206 is not required.

In addition, as shown in FIG. 10, a circular trimming plate is used as the trimming plate 205, and it may manufacture so that the trimming plate 205 may rotate. Thereby, dressing can be performed more efficiently.

This embodiment uses pure water as the cleaning liquid, but of course it is not limited to pure water. Moreover, by using the heated one as the cleaning liquid, the cleaning effect can be further improved.

In addition, when polishing the back surface of the wafer with the polishing pad 131, it is necessary to adjust the contact pressure to a predetermined value. In the trimming apparatus 200 according to the embodiment, by setting the bottom surface of the trimming plate 205 at the same height as the back surface of the wafer W, confirmation and adjustment of the contact pressure can be performed in advance. This kind of confirmation and adjustment process is called static stability against pressure.

That is, as shown in FIG. 11 , the rotation of the polishing pad 131 is stopped, the supply of the rinse liquid is also stopped, and the spraying from the two-fluid nozzle 204 is stopped, and the polishing pad 131 is raised against the dressing plate 205 in this state. Thereby, static stabilization of the pressing pressure can be performed. In addition, in order to properly adjust the pressing pressure, for example, an appropriate pressure sensor may be provided in advance on the trimming plate 205 .

Next, an example of procedures for polishing, cleaning, trimming, and clamping pressure static stabilization of the wafer W when the above trimming apparatus 200 is used will be described.

<Program example 1>

First, before performing back grinding on the first piece of the batch of wafers W to be back ground, the polishing pad 131 is moved to the trimming device 200, and then the pressing force on the back of the wafer W is statically stabilized. Next, the polishing pad 131 that has been statically stabilized by the contact pressure is moved to the back grinding apparatus 100 side, and the back grinding of the wafer W is performed. Thereafter, when the back grinding of the wafer W is completed, the polishing pad 131 is moved to the dressing apparatus 200 side, and dressing and cleaning are performed. This program example is an example in which dressing and cleaning are performed every time the polishing of one wafer W is completed. In particular, this program example is very helpful in the case where sludge enters the pores of the polishing surface of the polishing pad 131 even if the polishing process is performed only once, and the performance is greatly degraded.

<Program example 2>

First, before performing back grinding on the first piece of the batch of wafers W to be back ground, the polishing pad 131 is moved to the trimming device 200, and then the pressing force on the back of the wafer W is statically stabilized. Next, the polishing pad 131 that has been statically stabilized by the contact pressure is moved to the back grinding apparatus 100 side, and the back grinding of the wafer W is performed. Thereafter, when the backside grinding of the wafer W is completed, the polishing pad 131 is moved to the dresser 200 side, and only cleaning is performed. When the cleaning is finished, the polishing pad 131 is moved to the back grinding apparatus 100 side, and the back grinding of the wafer W is performed. As such, until a certain number of polishing sheets is reached, only cleaning is performed after the polishing is completed. At the point in time when the predetermined number of pieces is reached, Both conditioning and cleaning are then performed. This program example is very helpful for the situation that one polishing process does not degrade the performance of the polishing pad 131 too much, but the predetermined polishing process can be implemented.

As mentioned above, the dressing and cleaning of the polishing pad 131 should be carried out every time the back grinding is performed, or only cleaning should be performed until the predetermined number of sheets is reached. This judgment can be made based on the photographing results of the polishing pad 131, for example. For example, a camera etc. is set in the dressing device 200 to take pictures of the grinding surface of the polishing pad 131, and judge according to the grayscale or RGB data of the image of the surface state of the grinding surface of the polishing pad 131 captured by the camera, and then It can also be implemented.

Also, although it is related to the assembly accuracy of each member of the dressing device 200, even if there is some difference in the assembly, the dressing of the polishing pad 131 is properly performed without being affected by it. For this reason, the trimming plate 205 may be provided on the top cover portion 201 by an elastic member such as a spring.

In this embodiment, the trimming plate 205 is formed in a shape obtained by cutting a part of the disk with a straight line, and has a configuration in which the trimming plate 205 is fixed to the bottom surface of the top cover portion 201 . However, it is also possible to use a rod-shaped trimming member having a cylindrical shape instead.

12 to 14 show a trimming device 300 using the trimming member 250 in a cylindrical shape. 12 is a perspective view, FIG. 13 is a perspective view showing the trimming member 250 in the groove member 203, and FIG. 14 is a front view thereof.

In this example, the dressing member 250 is located on, for example, the diameter of the polishing pad 131 and has a length that is longer than the diameter of the polishing pad 131 . Also, the trimming member 250 does not necessarily have a length longer than the diameter, as long as it is located on the diameter of the polishing pad 131 and has a length at least reaching the center of the polishing pad 131 . The trimming member 250 is mounted on the supporting member 251 shown in FIG. 13 in a manner that can rotate arbitrarily around its axis. The supporting member 251 is mounted on the inner bottom surface of the groove member 203 of the mounting member 252 provided on the top cover 201 through a pivot 253 , and the supporting member 251 can swing arbitrarily with the pivot 253 as a fulcrum. Moreover, one end of the spring 254 is respectively fixed to both ends of the supporting member 251 , and the other end of the spring 254 is respectively fixed to the mounting member 252 .

With this rod-shaped dressing member 250, as shown in FIG. 14, it can be arbitrarily rocked with the support shaft 253 as a fulcrum, so even if the assembly of the various members of the dressing device 200 as described above is changed, or the polishing pad 131 Shaking due to vibration or the like can still make the dressing member 250 always abut against the polishing surface of the polishing pad 131 . In addition, the spring 254 is not necessary.

In addition, the rod-shaped trimming member 250 as described above can also be manufactured as a trimming member 260 having a push-out shape with one end and the other end having different diameters as shown in FIG. 15 . Using the dressing member 260 having a push-out shape, it is also possible to sufficiently follow the polishing surface of the polishing pad 131 to dress the polishing surface of the polishing pad 131 .

That is, by making the trimming member 260 into a push-pull shape, the torque that the trimming member 260 receives due to the rotation of the polishing pad 131 can be different. Although the force acting on both ends of the trimming member 260 due to the rotation of the polishing pad 131 is the same, the distance from the supporting member 251 to the trimming surface of the trimming member 260 is The torque on the shorter side, that is, the larger diameter side becomes larger, whereby the rotation of the trimming member 260 can be properly performed.

Also, for the above-mentioned rod-shaped trimming members 250, 260, the length of the trimming members 250, 260 is set to be longer than the diameter of the polishing pad 131, of course, it can also be set to be longer than the radius of the polishing pad 131.

<Trimming device with free joint>

Further, a trimming device according to another embodiment will be described. The trimming device 400 shown in the perspective view of FIG. 16 and the bottom view in FIG. 17 shows an example in which the trimming plate 205 is set on the groove member 203 by a free joint.

In this example, the trimming plate 205 is fixed to the top cover portion 201 of the tank member 203 by a free joint 401 as shown in FIG. 18 . This free joint 401 adopts the structure of "universal joint type free joint using a cross-shaped cross shaft frame 401a", and it does not need to rotate the shaft like the drive shaft and driven shaft, as long as it can absorb the trimming plate 205 Angle changes caused by tilting, shaking, etc. are sufficient. In this example, the fixed part 401b corresponding to one shaft of the free joint is fixed to the top cover part 201, and the fixed part 401c corresponding to the other shaft is fixed to the top surface of the trimming plate 205.

As shown in FIG. 19( a ), the trimming device 400 constituted in this way, since the trimming plate 205 is fixed on the top cover portion 201 of the groove member 203 by the free joint 401 as described above, even if the polishing pad 131 is tilted, it can still Absorbs the angle change caused by the inclination and shaking of the trimming plate 205 . Therefore, as shown in FIG. 19(b), even if the polishing pad 131 is tilted due to the assembly of the device, etc., the trimming plate 205 still follows the tilting of the polishing pad 131. and the bottom surface of the trimming plate 205 is always in uniform contact with the entire surface of the polishing pad 131, so that predetermined trimming can be performed.

In addition, since the dressing device 400 constructed in this way is different from elastic bodies such as sponges, the repulsive force will not change due to position or displacement, so that uniform surface pressure can be obtained all the time. Also, compared to rubber or sponge, it does not deteriorate over time, and there are no individual differences. In addition, it is also possible to precisely adjust the positions of both the dressing plate 205 and the polishing pad 131 .

<Trimming device with laser displacement meter>

The trimming device 400 shown in FIG. 16 is further provided with a laser displacement gauge 410 in addition to the free joint 401 . The laser displacement meter 410 irradiates the surface of the polishing pad 131 in the groove member 203 of the dressing device 400 with laser light L through the window portion 411 formed in the top cover portion 201 to detect the surface of the polishing pad 131 ( Abrasion of the grinding wheel part of the top surface). As shown in FIG. 20 , a window member 412 made of a light-transmitting material such as a transparent acrylic plate or a glass plate is provided on the window portion 411 . The window member 412 prevents cleaning liquid from adhering to the irradiation surface 413a of the laser irradiation portion 413 during trimming.

Since the amount of abrasion of the grinding wheel portion on the surface (top surface) of the polishing pad 131 can be detected by the laser light L from the laser displacement meter 410, the polishing pad 131 can be replaced at an appropriate timing. In addition, it is preferable to measure the wear amount of the grinding wheel portion on the surface (top surface) of the polishing pad 131 with the laser displacement meter 410, for example, after finishing dressing. At this time, since the cleaning solution during rinsing remains on the surface of the polishing pad 131 , it is preferable to remove the water on the surface of the polishing pad 131 when measuring with the laser displacement meter 410 .

At this time, similarly to the dressing device 200, the dressing device 400 is provided with a two-fluid nozzle 204 for injecting gas and cleaning liquid into the groove member 203 at the same time, so by only spraying the gas on the surface of the polishing pad 131, it can be easily The water on the surface of the polishing pad 131 is removed. Thereby, the thickness of the grinding wheel portion on the surface of the polishing pad 131 can be accurately measured, and the amount of abrasion with high precision can be detected.

In addition, when using this type of laser displacement meter for detection, and confirming the results of the polishing pad after the grinding wheel surface has been cleaned and the polishing pad that is obviously dirty and discolored by visual observation, it is found that the detection distance is different. This difference is greater than the error of the laser displacement meter, and it is also too large in terms of the influence of the blockage caused by foreign matter (the measurement result has been confirmed to have a difference of about 0.3 mm), so it can be seen that the difference in surface color is also affected. It can be seen from this that, for example, referring to the measurement results and the data corresponding to the degree of dirt, the degree of dirt is detected, or the measurement results of the same steps before the grinding process, and even after cleaning or trimming are compared to determine whether It is also feasible to order the grinding pad.

Moreover, when measuring the thickness of the grinding wheel portion on the surface of the polishing pad 131 with the laser displacement meter 410, by cooperating with the rotation of the polishing pad 131, it is possible to obtain the partial wear of the polishing pad 131 in the in-plane circumferential direction. change curve. Thereby, the surface state of the polishing pad 131 can be grasped and managed appropriately. At this time, the surface state of the polishing pad 131 can be grasped more accurately by measuring the degree of contamination described above together.

On the other hand, it cannot be denied that the cleaning liquid at the time of dressing adheres to the bottom surface side of the window member 412 of the window portion 411 . In response to such a situation, as shown in FIGS. 16 and 21 , the trimming device 400 is provided with a gas nozzle 421 that blows gas toward the bottom surface side of the window member 412 . Thereby, as shown in FIG. 21 , from the gas nozzle 421 The gas blown out from the ejection port 422 can blow off the water droplets of the cleaning solution adhering to the bottom surface side of the window member 412 . Therefore, it is possible to prevent the measurement from being adversely affected by water droplets or the like adhering to the window member 412 .

In addition, as shown in FIG. 21, in the trimming device 400, a guide member 423 having an inclined surface 423a is provided on the side opposite to the discharge port 422 of the gas nozzle 421, and the gas sprayed from the discharge port 422 of the gas nozzle 421 Gas (eg air) is guided obliquely downward. This prevents the water droplets blown off by the gas from touching other members of the tank member 203 to be reflected, and to adhere to the window member 412 again.

<Revolution trimming>

In the above-mentioned dressing devices 200, 400, the polishing pad 131 itself is supported by the rotatable support column 133 through the support body 132, and when the polishing pad 131 is brought into contact with the dressing plate 205 for dressing, the The polishing pad 131 itself is rotated around the support column 133 . This so-called self-rotation dressing method of the polishing pad 131 has no problem with the dressing itself or the polishing pad 131 itself, but the dressing plate 205 is worn between the part that is always in contact with the polishing pad 131 and other parts. The possibility of a difference in quantity.

In view of this, as shown in FIG. 22 , the polishing pad 131 itself is not rotated, but the polishing pad 131 is rotated around a place other than its center, and the polishing pad 131 is brought into contact with the trimming plate 205. Can. It can be said that dressing may be performed by making the polishing pad 131 revolve relative to the dressing plate 205 to perform dressing.

Thereby, the polishing pad 131 can be brought into contact with the entire surface of the dressing board 205 for dressing, and as a result, uneven wear of the dressing board 205 can be prevented, and the dressing board 205 can be effectively used to the end. Of course, the turning action is to set the radius of turning so that any part of the polishing pad 131 is in contact with the dressing plate 205 during the turning action, so that the polishing pad 131 can be evenly dressed.

With regard to the device implementing this so-called revolution type dressing, as shown in FIG. That's it.

Of course, it is also possible to make the polishing pad 131 itself rotate (autorotate) when performing such orbital dressing.

Similarly, when functioning in a revolution mode, the trimming plate 205 may be installed on the top cover portion 201 of the groove member 203 via the free joint 401 as described above. Thereby, as shown in FIG. 24 , even if the polishing pad 131 is tilted while turning, the trimming plate 205 is still tilted following the tilt, so that the bottom surface of the trimming plate 205 can always be in contact with the polishing pad 131 .

The embodiments of the present invention have been described above, but the present invention is not limited to these examples. It is obvious that those who have ordinary knowledge in the technical field can conceive various modifications or amendments within the scope of the technical ideas described in the claims. Such modifications or amendments are of course regarded as belonging to the technical scope of the present invention.

[Industrial Utilization]

The present invention is useful for the conditioning process of the grinding member used to grind the backside of the wafer.

131‧‧‧Grinding pad

132‧‧‧Support

133‧‧‧Support column

200‧‧‧Trimming device

201‧‧‧Top cover

202‧‧‧Skirt

203‧‧‧Slot component

204‧‧‧Two-fluid nozzle

205‧‧‧Trimming plate

206‧‧‧Rinse nozzle

Claims (15)

A trimming device for grinding members on the back of a substrate, which trims a grinding member for grinding the back of a substrate, comprising: a groove member having a top cover, and a cylindrical skirt provided on the bottom side of the top cover, The grinding member can be accommodated from above; the nozzle is arranged in the groove member and supplies cleaning liquid to the grinding surface of the accommodated grinding member; and the dressing member is arranged in the groove member and can be connected with the accommodated grinding member and the trimming device of the substrate backside grinding member is arranged at a position where the substrate does not overlap with each other in a plan view and the grinding object, that is, the substrate. According to claim 1 of the patent application, the device for trimming the back grinding member of the substrate, wherein, the lower end of the skirt is arranged at a position lower than the surface of the substrate to be polished. The device for trimming the grinding member on the back surface of the substrate as claimed in claim 1 or 2 of the patent scope, wherein, the side of the trimming member close to the grinding surface of the grinding member is flat, and the trimming member has a surface covering more than half of the grinding member And not cover the shape of a part of the grinding member; the nozzle for supplying the cleaning liquid is arranged above the part of the grinding member not covered by the trimming member. The device for trimming the grinding member on the back surface of the substrate as claimed in claim 1 or 2 of the scope of the patent application, wherein the trimming member is rotatable. The device for trimming the grinding member on the back of the substrate as claimed in claim 1 or 2 of the scope of the patent application, wherein the trimming member has a rod shape, and the trimming member is arranged so that its peripheral surface can abut against the grinding surface of the grinding member, And the dressing member rotates following the rotation of the grinding member. According to claim 5 of the patent application, the device for trimming the grinding member on the back of the substrate, wherein the trimming member is formed into a push-pull shape with different diameters at one end and the other end. The dressing device of substrate back grinding member according to claim 5, wherein the dressing member can swing arbitrarily around a fulcrum set at a place other than the end in the longitudinal direction. The device for trimming substrate backside grinding members according to claim 1 or 2 of the patent application, wherein the trimming members are arranged in the groove member by means of elastic members. The trimming device of the substrate backside grinding member as claimed in claim 1 or 2 of the patent application, wherein the trimming member is set in the groove member by a free joint. The device for trimming the grinding member on the back surface of the substrate as claimed in claim 1 or 2 of the patent claims includes a camera device for monitoring the grinding surface of the grinding member. The device for trimming a grinding member on the back of a substrate as claimed in claim 1 or 2 of the patent claims includes a laser displacement meter for monitoring the surface state of the grinding surface of the grinding member. A method for trimming a grinding member on the back of a substrate, used for trimming a grinding member for grinding the back of a substrate; the method for trimming a back grinding member of a substrate uses a groove member, the groove member has a top cover portion, and a The bottom surface side and form a cylindrical skirt, and the grinding member can be accommodated from above, at a position where the substrate and the grinding object, that is, the substrate, do not overlap each other in a plan view, and on the inside of the groove member, the grinding member can be used on one side. When rotating, cleaning liquid is supplied to the grinding surface of the grinding member for cleaning, and while the grinding member is rotated, the dressing member provided on the groove member contacts the grinding surface of the grinding member to perform dressing. A method for trimming a grinding member on the back of a substrate, used for trimming a grinding member for grinding the back of a substrate; the method for trimming a back grinding member of a substrate uses a groove member, the groove member has a top cover portion, and a The bottom surface side and form a cylindrical skirt, and the grinding member can be accommodated from above, in a position where the plan view and the grinding object, that is, the substrate, do not overlap each other, and on the inner side of the groove member, between the grinding member The grinding surface is cleaned by supplying a cleaning liquid, and the grinding member is rotated around a point other than the center of the grinding member, and the dressing member provided on the groove member is brought into contact with the grinding surface of the grinding member. Trimming. The method for trimming a back grinding member of a substrate as claimed in claim 12 or 13 of the patent application, wherein, inside the groove member, the pressing force of the grinding member on the back of the substrate during back grinding of the substrate is adjusted. A method for trimming a grinding member on the back of a substrate, using the trimming device for a grinding member on the back of a substrate described in item 10 of the scope of patent application to clean and dress the grinding member, characterized in that: according to the grinding surface of the grinding member captured by the photographing device Surface condition for cleaning and finishing.

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