TWI783680B - Heat dissipation assembly and electronic assembly - Google Patents

Abstract

A heat dissipation assembly and an electronic assembly. Heat dissipation assembly is configured for a working fluid to flow therein and includes a plurality of condensers and fan. Each condenser includes first tank, second tank and a plurality of tubes. In each condenser, two opposite ends of each tube are respectively connected to first and second tanks, a gap is formed between two adjacent tubes, and working fluid flows from first tank to second tank via tubes. First and second tanks and tubes of condensers for heat dissipation channel connected to gaps between tubes. Fan is disposed on condensers and connected to heat dissipation channel to blow heat dissipation airflow flowing from heat dissipation channel to gaps between tubes, thereby cooling working fluid in tubes.

Description

Thermal components and electronic components

The present invention relates to a heat dissipation component and an electronic component, in particular to a heat dissipation component comprising a plurality of condensers surrounding a heat dissipation channel and an electronic component comprising the heat dissipation component.

Generally, in an immersion cooling system or a drip cooling system, the dielectric liquid submerged or dripped onto the heat source will flow into a monolithic condenser installed in the rack to condense into a liquid state after being evaporated into a gaseous state.

However, the traditional monolithic condenser is no longer sufficient to meet the heat dissipation requirements of high calorific heat sources. Although increasing the size of the monolithic condenser can improve the cooling capacity of the monolithic condenser, it will compress the space for the server to be installed in the rack. That is to say, the current immersion cooling system or drip cooling system has the problem that it is difficult to effectively utilize the limited space in the rack while improving the cooling capacity of the condenser.

In addition, hot air from the monolithic condenser is exhausted from the side of the server that contains the service opening. Therefore, the hot air may be blown onto the maintenance personnel when the maintenance personnel are repairing the components of the server, thereby making it difficult for the maintenance personnel to perform maintenance smoothly.

The present invention provides a cooling assembly and an electronic assembly to effectively utilize the limited space in the rack while improving the heat dissipation capacity of the condenser, and prevent the hot air discharged from the electronic device from affecting maintenance personnel's maintenance of the electronic device.

A heat dissipation assembly disclosed in an embodiment of the present invention is used for a working fluid to flow and includes a plurality of condensers and a fan. Each of the condensers includes a first tank, a second tank and a plurality of flow tubes. In each condenser, opposite ends of each flow tube are connected to the first box and the second box respectively, and a heat dissipation gap is formed between two adjacent flow tubes, and the working fluid is used to pass through the flow tube from the first box to the second box. One tank flows to the second tank. The first box body, the second box body and the flow tube of the condenser jointly surround a heat dissipation channel. The heat dissipation channel communicates with the heat dissipation gap between the flow tubes. The fan is arranged on the condenser and communicated with the heat dissipation passage for guiding a heat dissipation airflow to flow between the heat dissipation passage and the heat dissipation gap between the flow pipes of the condenser, thereby cooling the working fluid flowing in the flow pipe.

An electronic component disclosed in another embodiment of the present invention is used for a working fluid to flow and includes a cabinet, a frame, an electronic device, a heat dissipation component and a filter element. The rack is arranged on the cabinet. The electronic device is arranged in the rack. The heat dissipation component includes multiple condensers and a fan. Each of the condensers includes a first tank, a second tank and a plurality of flow tubes. In each condenser, opposite ends of each flow tube are connected to the first box and the second box respectively, and a heat dissipation gap is formed between two adjacent flow tubes, and the working fluid is used to pass through the flow tube from the first box to the second box. One tank flows to the second tank. The first box body, the second box body and the flow tube of the condenser jointly surround a heat dissipation channel. The heat dissipation channel communicates with the heat dissipation gap between the flow tubes. The fan is arranged on the condenser and communicated with the heat dissipation passage for guiding a heat dissipation airflow to flow between the heat dissipation passage and the heat dissipation gap between the flow pipes of the condenser, thereby cooling the working fluid flowing in the flow pipe. The heat dissipation component is arranged on the cabinet and on one side of the rack. The condenser of the heat dissipation component is connected with the electronic device. The filter element is arranged on the side of the heat dissipation assembly away from the frame so that the heat dissipation airflow guided by the fan of the heat dissipation assembly passes through the filter element before passing through the heat dissipation channel.

According to the heat dissipation assembly and the electronic assembly disclosed in the above embodiments, the first box body, the second box body, and the flow tubes of the condensers together form a heat dissipation channel, and the heat dissipation channel communicates with the heat dissipation gap between the flow tubes. Therefore, the fan connected to the heat dissipation passage can guide the heat dissipation airflow to flow between the heat dissipation passage and the heat dissipation gap between the flow pipes, thereby effectively cooling the working fluid flowing in the flow pipes. In this way, the limited space in the rack can be effectively utilized while improving the cooling capacity of the condenser.

In addition, the fan can guide the cooling air flow from the cooling gap between the flow tubes to the cooling channel. In this way, the heat-dissipating airflow guided by the fan can be discharged away from the electronic device without affecting maintenance personnel's maintenance of the electronic device.

Furthermore, the fan can guide the heat dissipation airflow from the heat dissipation channel to the heat dissipation gap between the flow pipes, and the filter element is arranged on the side of the heat dissipation assembly away from the frame. Therefore, the heat dissipation airflow guided by the fan passes through the filter element before passing through the heat dissipation channel. In this way, the filter element can prevent dust from accumulating on the fan or condenser, thereby preventing the performance of the fan or condenser from being reduced due to dust.

The detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation modes, the content is enough for anyone with ordinary knowledge in the field to understand the technical content of the embodiments of the present invention and implement them accordingly, and according to the disclosure of this specification Anyone with ordinary knowledge in the art can easily understand the related objectives and advantages of the present invention. The following examples are to further describe the concept of the present invention in detail, but not to limit the scope of the present invention in any way.

See Figures 1 through 3. FIG. 1 is a perspective view of a heat dissipation assembly according to a first embodiment of the present invention. FIG. 2 is an exploded view of the heat dissipation assembly in FIG. 1 . FIG. 3 is an exploded view of the condenser of the heat dissipation assembly in FIG. 1 .

In this embodiment, the heat dissipation component 10 is used for a working fluid (not shown) to flow and for example communicated with an immersion cooling system (not shown). The working fluid is, for example, a dielectric fluid. It should be noted that the immersion cooling system can be an immersion cooling system in which the heat source (not shown) is completely immersed in the working fluid or a drip cooling system in which the working fluid drops onto the heat source.

In this embodiment, the cooling assembly 10 includes a plurality of condensers 100, a plurality of first connecting pipes 200, a plurality of second connecting pipes 300, an inflow pipe 400, an outflow pipe 500, a fan frame 600, and a plurality of fans 700 And a windshield 800 .

In this embodiment, the condensers 100 each include a first box body 110, two first cover plates 115, a second box body 120, two second cover plates 125, a plurality of flow tubes 130, and a cooling fin set 140 , a first mounting plate 150 and a second mounting plate 160 .

The first box body 110 , the second box body 120 and the flow tube 130 of the condensers 100 together define a cooling channel 170 . The first boxes 110 of the condensers 100 together surround a first opening 180 . The second boxes 120 of the condensers 100 jointly surround a second opening 190 . The first opening 180 and the second opening 190 communicate with opposite ends of the heat dissipation channel 170 respectively. The first boxes 110 of the condensers 100 communicate with each other through the first connecting pipe 200 . The second tanks 120 of the condensers 100 communicate with each other through the second connecting pipe 300 . The inflow pipe 400 communicates with one of the first connection pipes 200 and is used for inflowing gaseous working fluid. The outflow pipe 500 communicates with one of the second connecting pipes 300 and is used for the liquid working fluid to flow out.

In other embodiments, the cooling assembly may not need to include the first connecting pipe 200 and the second connecting pipe 300. In such an embodiment, the first tanks of the condensers may not need to communicate with each other. The second tanks may not need to communicate with each other, and the condensers may each include an outflow pipe and an inflow pipe.

Since these condensers 100 are similar in structure, only the structure of a single condenser 100 will be described in detail below. The first box body 110 has a first through slot 1100 . The two first cover plates 115 are respectively fixed on opposite sides of the first box body 110 to cover the first through-slot 1100 , thereby preventing the working fluid from leaking out of the first through-slot 1100 . The second box body 120 has a second through slot 1200 . The two second cover plates 125 are respectively fixed on opposite sides of the second box body 120 to cover the second through-slot 1200 , thereby preventing the working fluid from leaking from the second through-slot 1200 . In this embodiment, the flow tube 130 is, for example, a circular tube. Opposite ends of each flow tube 130 are respectively communicated with the first slot 1100 of the first box body 110 and the second slot 1200 of the second box body 120 , and the working fluid is used to flow from the first box body 110 through the flow tube 130 . The first through slot 1100 flows to the second through slot 1200 of the second box body 120 . A heat dissipation gap 1300 communicating with the heat dissipation channel 170 is formed between two adjacent flow tubes 130 . The flow tube 130 runs through the cooling fin set 140 and opposite ends of the cooling fin set 140 are respectively fixed to the first box body 110 and the second box body 120 through the first mounting plate 150 and the second mounting plate 160 . Please refer to FIG. 4 . FIG. 4 is a partial enlarged view of the schematic cross-sectional view of the heat dissipation component in FIG. 1 . In this embodiment, the flow tube 130 includes a plurality of first flow tubes 1301 and a plurality of second flow tubes 1302 . The first flow tubes 1301 are arranged parallel to each other on a first reference plane P1. The second flow tubes 1302 are arranged parallel to each other on a second reference plane P2. The first reference plane P1 is parallel to the second reference plane P2. The first flow tubes 1301 and the second flow tubes 1302 are offset from each other.

In other embodiments, the condenser does not need to include the first mounting plate 150 and the second mounting plate 160 and directly welds the opposite ends of the cooling fin group to the first box body and the second box body respectively. In other embodiments, the condenser does not need to include the cooling fin set 140 .

Please refer to Figures 1 through 3 again. In this embodiment, the fan frame 600 includes a first board 610 , a plurality of support columns 620 , a second board 630 and a plurality of protrusions 640 . The first board body 610 is disposed on the first opening 180 and has a plurality of installation openings 611 . These installation openings 611 communicate with the heat dissipation channel 170 . Two opposite ends of each support column 620 are respectively fixed to the first plate body 610 and the second plate body 630 . The protrusion 640 protrudes from the second board 630 .

These fans 700 are respectively provided with these installation ports 611 and communicated with the heat dissipation channel 170 to guide the heat dissipation airflow F1, F2 to flow between the heat dissipation channel 170 and the heat dissipation gap 1300 between the flow pipe 130, and then used to cool the flow in the flow. The working fluid in tube 130. In this embodiment, the fan 700 is used to guide the heat dissipation airflow F1 from the heat dissipation channel 170 to the heat dissipation gap 1300 between the flow tubes 130 of the condenser 100 , or to guide the heat dissipation airflow F2 from between the flow tubes 130 The heat dissipation gap 1300 flows into the heat dissipation channel 170 . In other embodiments, the first board of the fan frame can also be disposed in the heat dissipation channel and spaced from the first opening, so that the fan is located in the heat dissipation channel and spaced from the first opening.

In this embodiment, the windshield 800 is sandwiched between the protrusion 640 and the second box body 120 and located at the second opening 190 . Therefore, the windshield 800 can prevent the heat exchange efficiency between the working fluid and the heat dissipation airflows F1 , F2 guided by the fan 700 from decreasing due to the heat dissipation airflows F1 , F2 flowing out from the second opening 190 . In other embodiments, the heat dissipation component does not need to include the windshield 800 .

In this embodiment, since the first flow pipes 1301 and the second flow pipes 1302 are offset from each other, the condenser 100 can include more flow pipes 130 so that more working fluids can flow to the flow pipes 130 . In this way, the heat exchange efficiency between the working fluid and the cooling airflow F1 guided by the fan 700 can be improved.

It should be noted that the present invention is not limited to the arrangement of the flow tubes. Please refer to FIG. 5 . FIG. 5 is a partial enlarged view of a cross-sectional schematic diagram of a heat dissipation assembly according to a second embodiment of the present invention. In this embodiment, the flow tubes 130a of each condenser 100a only include a plurality of first flow tubes 1301a arranged parallel to each other along the first reference plane P1a and do not include the second flow tubes arranged parallel to each other on the second reference plane.

Please refer to FIG. 6 . FIG. 6 is a schematic side view of an electronic component according to an embodiment of the present invention. In this embodiment, the electronic assembly 20 is used for a working fluid to flow and includes a cabinet 21, a rack 22, and an electronic device 23, as described above with reference to FIGS. 1 to 4 according to the first embodiment of the present invention. The heat dissipation component 10 and a filter element 24 . The rack 22 is disposed on the cabinet 21 . The electronic device 23 is disposed in the rack 22 and is, for example, a server. The cooling assembly 10 is disposed on the cabinet 21 and located on one side of the rack 22 . The condenser 100 of the heat dissipation component 10 communicates with the electronic device 23 for cooling the heat source (not shown) in the electronic device 23 . The filter element 24 is disposed on a side of the heat dissipation assembly 10 away from the frame 22 such that the heat dissipation airflow F1 guided by the fan 700 of the heat dissipation assembly 10 passes through the filter element 24 before passing through the heat dissipation channel 170 .

According to the heat dissipation assembly and the electronic assembly disclosed in the above embodiments, the first box body, the second box body, and the flow tubes of the condensers together form a heat dissipation channel, and the heat dissipation channel communicates with the heat dissipation gap between the flow tubes. Therefore, the fan connected to the heat dissipation passage can guide the heat dissipation airflow to flow between the heat dissipation passage and the heat dissipation gap between the flow pipes, thereby effectively cooling the working fluid flowing in the flow pipes. In this way, the limited space in the rack can be effectively utilized while improving the cooling capacity of the condenser.

In addition, the fan can guide the cooling air flow from the cooling gap between the flow tubes to the cooling channel. In this way, the heat-dissipating airflow guided by the fan can be discharged away from the electronic device without affecting maintenance personnel's maintenance of the electronic device.

Furthermore, the fan can guide the heat dissipation airflow from the heat dissipation channel to the heat dissipation gap between the flow pipes, and the filter element is arranged on the side of the heat dissipation assembly away from the frame. Therefore, the heat dissipation airflow guided by the fan passes through the filter element before passing through the heat dissipation channel. In this way, the filter element can prevent dust from accumulating on the fan or condenser, thereby preventing the performance of the fan or condenser from being reduced due to dust.

In an embodiment of the present invention, the cooling assembly and the electronic assembly of the present invention can be applied to a server, and the server can be used for artificial intelligence (English: Artificial Intelligence, referred to as AI) computing, edge computing (Edge Computing), It can also be used as a 5G server, cloud server or Internet of Vehicles server.

Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

10: Cooling components 100: condenser 110: the first box 1100: the first slot 115: The first cover 120: the second box 1200: Second slotting 125: Second cover plate 130: flow tube 1300: cooling gap 1301: first stream tube 1302: second flow pipe 140: cooling fin group 150: The first mounting plate 160: Second mounting plate 170: cooling channel 180: first opening 190: second opening 200: the first connecting pipe 300: the second connecting pipe 400: Inflow pipe 500: outflow tube 600: fan bracket 610: The first plate body 611: Installation port 620: support column 630: the second plate body 640: Bump 700: fan 800: windshield P1: first reference plane P2: Second reference plane F1, F2: cooling airflow 100a: condenser 130a: flow tube P1a: first reference plane 1301a: first flow pipe 20: Electronic components 21: cabinet 22: Rack 23: Electronic device 24: filter element

FIG. 1 is a perspective view of a heat dissipation assembly according to a first embodiment of the present invention. FIG. 2 is an exploded view of the heat dissipation assembly in FIG. 1 . FIG. 3 is an exploded view of the condenser of the heat dissipation assembly in FIG. 1 . FIG. 4 is a partially enlarged view of a schematic cross-sectional view of the heat dissipation component in FIG. 1 . FIG. 5 is a partial enlarged view of a schematic cross-sectional view of a heat dissipation assembly according to a second embodiment of the present invention. FIG. 6 is a schematic side view of an electronic component according to an embodiment of the invention.

10: Cooling components

100: condenser

110: the first box

120: the second box

130: flow tube

1300: cooling gap

140: cooling fin group

170: cooling channel

200: the first connecting pipe

300: the second connecting pipe

400: Inflow pipe

500: outflow pipe

600: fan bracket

640: Bump

700: fan

800: windshield

F1, F2: cooling airflow

Claims (9)

A heat dissipation component is used for a working fluid to flow, the heat dissipation component comprises: a plurality of condensers, each of which comprises a first box body, a second box body and a plurality of flow tubes, in each of the condensers , the opposite ends of each of the flow tubes communicate with the first box and the second box respectively, a heat dissipation gap is formed between two adjacent flow tubes, and the working fluid is used to pass through the flow tubes The tubes flow from the first box to the second box, and the first boxes, the second boxes and the flow tubes of the condensers jointly surround a heat dissipation channel, and the heat dissipation channel communicates with The heat dissipation gaps between the flow pipes; a fan is arranged on the condensers and communicated with the heat dissipation passages to guide a heat dissipation airflow between the heat dissipation passages and the flow pipes of the condensers flow between the heat dissipation gaps, and then used to cool the working fluid flowing in the flow tubes; and a fan frame, the first boxes of the condensers jointly surround and communicate with the heat dissipation channel A first opening, the fan frame is arranged in the first opening and includes an installation opening, the installation opening communicates with the heat dissipation channel, and the fan is arranged in the installation opening. The heat dissipation assembly as described in claim 1, wherein each of the condensers further includes a heat dissipation fin set, and in each of the condensers, the flow tubes pass through the heat dissipation fin set and the opposite ends of the heat dissipation fin set respectively fixed on the first box body and the second box body. The heat dissipation assembly as described in claim 2, wherein each of the condensers further includes a first mounting plate and a second mounting plate, and in each of the condensers, the opposite sides of the cooling fin group pass through the first The installation board and the second installation board are fixed on the first box body and the second box body. The heat dissipation assembly according to claim 1, wherein in each of the condensers, the flow tubes include a plurality of first flow tubes, and the first flow tubes are arranged parallel to each other on a first reference plane. The heat dissipation assembly as described in claim 4, wherein in each of the condensers, the flow tubes further include a plurality of second flow tubes, and the second flow tubes are arranged parallel to each other on a second reference plane, the The first reference plane is parallel to the second reference plane, and the first flow tubes and the second flow tubes are offset from each other. The heat dissipation assembly as described in claim 1 further includes a windshield, the second boxes of the condensers jointly form a second opening, and the first opening and the second opening are respectively communicated with the heat dissipation channel The opposite ends of the fan frame include a first board, a plurality of support columns, a second board and a plurality of protrusions, the first board is arranged in the first opening, and the installation port is located in the first The plate body, the opposite ends of each support column are respectively fixed to the first plate body and the second plate body, the protrusions protrude from the second plate body, and the windshield plate is sandwiched between the protrusions And between the second boxes and located at the second opening. The heat dissipation assembly as described in claim 1 further includes a plurality of first connecting pipes and a plurality of second connecting pipes, the first boxes of the condensers pass through the The first connecting pipes communicate with each other, and the second tanks of the condensers communicate with each other through the second connecting pipes. The heat dissipation assembly as described in claim 7 further includes an inlet pipe and an outlet pipe, the inlet pipe is connected to one of the first connecting pipes, and the outlet pipe is connected to one of the second connecting pipes. An electronic component is used for a working fluid to flow, the electronic component includes: a cabinet; a rack, arranged in the cabinet; an electronic device, arranged in the rack; a heat dissipation assembly, including: a plurality of condensers , each of the condensers includes a first box, a second box and a plurality of flow tubes, in each of the condensers, the opposite ends of each of the flow tubes communicate with the first box and the second A heat dissipation gap is formed between two adjacent flow tubes, and the working fluid is used to flow from the first box to the second box through the flow tubes, and the condensers The first boxes, the second boxes, and the flow pipes jointly surround a heat dissipation channel, and the heat dissipation channel communicates with the heat dissipation gaps between the flow pipes; and a fan is arranged on the condensing and communicated with the heat dissipation passage to guide a heat dissipation airflow to flow between the heat dissipation passage and the heat dissipation gaps between the flow tubes of the condensers, thereby cooling the flow in the flow tubes The working fluid in; Wherein the heat dissipation assembly is arranged on the cabinet and on one side of the frame, the condensers of the heat dissipation assembly are connected to the electronic device; and a filter element is arranged on the side of the heat dissipation assembly away from the frame so that The heat dissipation airflow guided by the fan of the heat dissipation assembly first passes through the filter element before passing through the heat dissipation channel.

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