TWI783359B - High-density connecting device - Google Patents

Abstract

A high-density connecting device includes a first connecting module and a second connecting module. The first connecting module has a first housing assembly, a first circuit board and a first socket connector. The second connecting module has a second housing assembly, a second circuit board and a second socket connector. When the first connecting module and the second connecting module are mated mutually, joining ends of the first and second circuit boards are respectively inserted in the first socket connector and the second socket connect, so that the joining ends of the first and second connecting modules are electrically connected with the first socket connect and the second socket connect. Thus, the connecting device can provide high-density signal contacts.

Description

High Density Connection Device

The invention relates to a high-density connection device, in particular to a connection device with high-density contact points.

The existing connector is a connection device that electrically connects cables, circuit boards and other circuit components, and has been widely used in various electronic products around our lives. Existing connectors can be used in medical equipment and other fields. The integration of new technologies and new functions of contact point equipment required by some medical equipment, and the improvement of demand functions. Relatively, the number of points available for transmission of connectors increases. A single connector The number of touchpoints is limited.

The technical problem to be solved by the present invention is to provide a high-density connection device which can effectively increase the density of contact points and generate high-density signal contact points.

In order to solve the above technical problems, the present invention provides a high-density connection device, Including: a first connection module, the first connection module includes a first shell group, a first circuit board and a first socket connector, the first socket connector is arranged on one side of the first circuit board , and the first receptacle connector is electrically connected to the first circuit board, the first circuit board and the first receptacle connector are arranged in the first housing group, and one end of the first circuit board forms a first A joint end, at least one side of the first joint end is provided with a plurality of first contacts, the first receptacle connector is disposed on one side of the first circuit board close to the first joint end; and a second connection module, the The second connection module includes a second shell group, a second circuit board and a second socket connector, the second socket connector is arranged on one side of the second circuit board, and the second socket connector is electrically Connected to the second circuit board, the second circuit board and the second receptacle connector are arranged in the second shell group, one end of the second circuit board forms a second joint end, and at least one side of the second joint end A plurality of second contacts are provided, and the second socket connector is arranged on one side of the second circuit board close to the second joint end; wherein when the first connection module and the second connection module are plugged into each other , the first joint end of the first circuit board can be inserted into the second socket connector, so that the first joint end of the first circuit board is electrically connected with the second socket connector, and the second circuit board The second engaging end of the second circuit board can be inserted into the first socket connector, so that the second engaging end of the second circuit board is electrically connected with the first socket connector.

In order to solve the above technical problems, the present invention also provides a high-density connection device, including: a first connection module, the first connection module includes a first shell group and two first circuit boards, the two first circuit boards One end of the board forms a first joint end, and at least one side of the first joint end is provided with a plurality of first contacts; and a second connection module, the second connection module includes a second shell group, a second a circuit board, a first socket connector and a second socket connector, the first socket connector is arranged on one side of the second circuit board, and the first socket connector is electrically connected to the second circuit board, The second receptacle connector is arranged on the other side of the second circuit board, and the second receptacle connector is electrically connected to the second circuit board, the second circuit board, the first receptacle connector and the second The socket connector is arranged in the second housing group; and wherein when the first connection module and the second connection module are inserted into each other, the first joint ends of the two first circuit boards can be respectively inserted into the The first socket connector and the second socket connector electrically connect the first joint ends of the two first circuit boards to the first socket connector and the second socket connector respectively.

The beneficial effect of the present invention is that the high-density connection device provided by the present invention includes a first connection module and a second connection module, and the first connection module and the second connection module include a first socket connector, a second When the socket connector and the two circuit boards, the first connection module and the second connection module are plugged together, the joint ends of the two circuit boards are respectively inserted into the first socket connector and the second socket connector, so that the two circuit boards The joint ends are respectively electrically connected to the first socket connector and the second socket connector. Therefore, it is possible to generate high-density signal contact points in a limited volume.

In order to enable a further understanding of the features and technical content of the present invention, please refer to the following detailed description and drawings of the high-density connection device of the present invention. be restricted.

The following are specific examples to illustrate the implementation methods disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[first embodiment]

Referring to FIG. 1 to FIG. 6 , the present invention provides a high-density connection device, including a first connection module 100 and a second connection module 200 . Please refer to FIG. 8 to FIG. 11 again, the first connection module 100 includes a first housing group 1, a first circuit board 2 and a first socket connector 3, and the first housing group 1 can be a combined structure , composed of multiple components to form a hollow body. In this embodiment, the first shell group 1 may include a first shell 11, a first cover 12 and a first joint 13, and the first joint 13 is arranged at one end (front end) of the first shell 11. ), in this embodiment, the first cover 12 is disposed between the first housing 11 and the first connector 13 . The first connector 13 has a first body 131, a first space 132 and a slot 133 (as shown in FIG. 9 ) are formed in the first body 131, and a The first partition 134 is provided with a first through hole 135 and a second through hole 136 on the first partition 134 .

The first socket connector 3 is disposed on one side (top surface) of the first circuit board 2 , and the first socket connector 3 is electrically connected to the first circuit board 2 . The first receptacle connector 3 can be various types of electrical connectors, and its type and structure are not limited. A first terminal 32 and other components, these first terminals 32 can be used to transmit power, signals and so on. Since the first receptacle connector 3 is a prior art, it will not be described in detail.

The first circuit board 2 and the first receptacle connector 3 are arranged in the first shell group 1. In the space 132, one end of the first circuit board 2 forms a first joint end 21, and the first receptacle connector 3 is arranged on one side of the first circuit board 2 close to the first joint end 21, and the first joint end 21 A plurality of first contacts 22 are provided on at least one side, and preferably, a plurality of first contacts 22 are provided on both sides (top and bottom) of the first joint end 21 . The first joint end 21 of the first circuit board 2 can extend into the slot 133 through the first through hole 135, so as to support the stable positioning of the first circuit board 2, and the first receptacle connector 3 can be connected with the second through hole. 136, when the first connection module 100 and the second connection module 200 are inserted into each other, the second joint end 71 of the second circuit board 7 can be inserted into the first socket connector 3 through the second through hole 136, It is used to guide the stable insertion of the second circuit board 7 . The first circuit board 2 can be electrically connected to a cable 10 .

The second connection module 200 includes a second housing group 6, a second circuit board 7 and a second socket connector 8, the second housing group 6 can be a combined structure, composed of a plurality of components, So as to form a hollow body. In this embodiment, the second shell group 6 may include a second shell 61, a second cover 62 and a second joint 63, the second joint 63 is disposed at one end of the second shell 61, In this embodiment, the second joint 63 is disposed between the second housing 61 and the second cover 62 . The second joint 63 has a second body 631, forming a cylinder 632 and a second space 633 (as shown in Figure 9 ) in the second body 631, the cylinder 632 corresponds to the slot 133, so that the first When the connecting module 100 and the second connecting module 200 are plugged together, the post 632 can be inserted into the slot 133 . The second space 633 is located in the cylinder 632 , and one end of the cylinder 632 has a second partition 634 , and the second partition 634 defines a third through hole 635 and a fourth through hole 636 .

The second socket connector 8 is disposed on one side (bottom surface) of the second circuit board 7 , and the second socket connector 8 is electrically connected to the second circuit board 7 . The second receptacle connector 8 can be various types of electrical connectors, and its type and structure are not limited. A second terminal 82 and other components, these second terminals 82 can be used to transmit power, signals and so on. Since the second receptacle connector 8 is a prior art, it will not be described in detail.

The second circuit board 7 and the second socket connector 8 are arranged in the second shell group 6. In this embodiment, the second circuit board 7 and the second socket connector 8 are arranged on the second side of the second joint 63. In the space 633, one end of the second circuit board 7 forms a second joint end 71, and the second socket connector 8 is arranged on one side of the second circuit board 7 close to the second joint end 71, and the second joint end 71 A plurality of second contacts 72 are provided on at least one side, and preferably, a plurality of second contacts 72 are provided on both sides (top and bottom) of the second joint end 71 . The second joint end 71 of the second circuit board 7 can protrude out of the post 632 through the third through hole 635 to support the second circuit board 7 in a stable position. The second socket connector 8 can correspond to the fourth through hole 636, so that when the first connection module 100 and the second connection module 200 are inserted into each other, the first joint end 21 of the first circuit board 2 can pass through the fourth through hole 636. The through hole 636 is inserted into the second socket connector 8 to guide the insertion of the first circuit board 2 stably.

Please refer to FIG. 10 and FIG. 11, when the first connection module 100 and the second connection module 200 are inserted into each other, the first joint end 21 of the first circuit board 2 can be inserted into the second socket connector 8 , make the first contact point 22 of the first joint end 21 of the first circuit board 2 contact with the second terminal 82 of the second socket connector 8, connect the first joint end 21 of the first circuit board 2 with the second socket device 8 is electrically connected. At the same time, the second joint end 71 of the second circuit board 7 can be inserted into the first socket connector 3, so that the second contact point 72 of the second joint end 71 of the second circuit board 7 is connected to the first socket connector 3. The first terminals 32 are in contact with each other, so that the second joint end 71 of the second circuit board 7 is electrically connected with the first socket connector 3 . The first circuit board 2, the first socket connector 3, the second circuit board 7, and the second socket connector 8 are inserted into each other, and the first connection module 100 and the second connection module 200 can form a hermaphrodite connection. The unit can generate high-density signal contact points in a limited volume.

At least one spring connector 9 may also be arranged on the first circuit board 2 or the second circuit board 7. In this embodiment, at least one spring connector 9 is arranged on the second circuit board 7 (as shown in FIG. 7 ), the spring connector 9 includes a third insulating body (insulating body) 91 and a plurality of spring terminals 92. In this embodiment, the third insulating body 91 is a two-piece combined design, but it is not limited. The three insulating bodies 91 are provided with a plurality of slots 911 at intervals, and the spring terminals 92 are arranged on the third insulating body 91, and each of the spring terminals 92 has a contact portion 921 and at least one leg portion 922, the contact portion 921 Extending in a spiral shape, the contact portion 921 is formed with a slit 923, the pin portion 922 is connected to the contact portion 921, and the pin portion 922 can be electrically connected to the second circuit board 7 (or the first circuit board 2), the springs The contact portions 921 of the terminals 92 respectively protrude into the wire grooves 911, so the wires 20 (conducting portions) (as shown in FIG. 7 and FIG. 18 ) can be respectively inserted into the wire grooves 911 of the insulating body 91, And the wires 20 are clamped by the contact parts 921 of the spring terminals 92 respectively, so that the wires 20 are clamped in the gaps 923 of the spring terminals 92, so that the wires 20 and the spring terminals 92 are electrically connected, so that The wire 20 can be electrically connected to the second circuit board 7 (or the first circuit board 2 ) through the spring connector 9 . The spring connector 9 can be used for clamping the wire rod 20 with a small wire diameter, and there will be no problems of easy disconnection and poor welding due to welding.

[Second embodiment]

Please refer to Fig. 12 to Fig. 17, the main difference between this embodiment and the above-mentioned first embodiment is that in this embodiment, both the first socket connector 3 and the second socket connector 8 are arranged on the second circuit board 7, the The first socket connector 3 is arranged on one side (top surface) of the second circuit board 7, and the first socket connector 3 is electrically connected to the second circuit board 7, and the second socket connector 8 is arranged on the second circuit board 7, and the second socket connector 8 is electrically connected to the second circuit board 7.

The second circuit board 7, the first receptacle connector 3 and the second receptacle connector 8 are arranged in the second housing group 6. In this embodiment, a cylinder 632 and a space ( second space 633), this space (second space 633) is located in the cylinder 632, and one end of the cylinder 632 has a partition (second partition 634), and the partition (second partition 634) is provided with Two through holes (the third through hole 635 and the fourth through hole 636). The second circuit board 7, the first receptacle connector 3 and the second receptacle connector 8 are arranged in the space (second space 633) of the second joint 63, and the second connection of the second circuit board 7 in the above-mentioned implementation The end 71 is omitted, and the first receptacle connector 3 and the second receptacle connector 8 are respectively disposed on two sides of the second circuit board 7 close to one end.

The first socket connector 3 and the second socket connector 8 can correspond to the two through holes (the third through hole 635 and the fourth through hole 636) respectively, so that when the first connection module 100 and the second connection module 200 are inserted into each other , the first joint ends 21 of the two first circuit boards 2 can be respectively inserted into the first receptacle connector 3 and the second receptacle connector 8 through two through holes (the third through hole 635 and the fourth through hole 636) for guiding The two first circuit boards 2 are stably inserted. In this embodiment, there are two first circuit boards 2 of the first connection module 100, and the two first circuit boards 2 are arranged in the first housing group 1, and the two first circuit boards 2 can be arranged in The first connector 13 is inside the first body 131 , and the first connecting ends 21 of the two first circuit boards 2 extend into the slot 133 .

When the first connection module 100 and the second connection module 200 are inserted into each other, the first joint ends 21 of the two first circuit boards 2 can be respectively inserted into the first receptacle connector 3 and the second receptacle connector 8, Make the first contacts 22 of the first joint ends 21 of the two first circuit boards 2 contact with the first terminal 32 of the first receptacle connector 3 and the second terminal 82 of the second receptacle connector 8 respectively, so that the two first The first joint end 21 of the circuit board 2 is electrically connected to the first socket connector 3 and the second socket connector 8 respectively. The first connection module 100 and the second connection module 200 of this embodiment have two pairs of connection units, which can generate high-density signal contact points in a limited volume.

[Advantageous Effects of Embodiment]

The beneficial effect of the present invention is that the high-density connection device provided by the present invention includes a first connection module and a second connection module, and the first connection module and the second connection module include a first socket connector, a second When the socket connector and the two circuit boards, the first connection module and the second connection module are plugged together, the joint ends of the two circuit boards are respectively inserted into the first socket connector and the second socket connector, so that the two circuit boards The joint ends are respectively electrically connected to the first socket connector and the second socket connector. Therefore, it is possible to generate high-density signal contact points in a limited volume.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

1: The first shell group 11: The first shell 12: The first cover 13: First connector 131: The first body 132: The first space 133: slot 134: the first partition 135: First piercing 136: Second perforation 2: The first circuit board 21: First joint end 22: The first contact 3: First socket connector 31: the first insulating body 32: first terminal 6: Second shell group 61: second shell 62: Second cover 63: Second connector 631: The second body 632: column 633: second space 634: second partition 635: The third piercing 636: Fourth piercing 7: Second circuit board 71: second joint end 72: Second contact 8: Second socket connector 81: the second insulating body 82: Second terminal 9: Spring connector 91: the third insulating body 911: trunking 92: Spring terminal 921: contact part 922: Connecting feet 923: Gap 10: Cable 20: wire 100: The first connection module 200: Second connection module

Fig. 1 is a perspective view (1) of a separated state of the high-density connection device of the present invention.

Fig. 2 is a perspective view (2) of a separated state of the high-density connection device of the present invention.

Fig. 3 is a perspective view (1) of the joint state of the high-density connection device of the present invention.

Fig. 4 is a perspective view (2) of a joint state of the high-density connection device of the present invention.

FIG. 5 is an exploded perspective view (1) of the high-density connection device of the present invention.

Fig. 6 is a three-dimensional exploded view (2) of the high-density connection device of the present invention.

Fig. 7 is an exploded perspective view of the spring connector of the present invention.

Fig. 8 is a sectional view taken along line VIII-VIII of Fig. 2 .

Fig. 9 is a detailed view of part IX of Fig. 8 .

Fig. 10 is a sectional view taken along line X-X in Fig. 3 .

Fig. 11 is a detailed view of part XI of Fig. 10 .

FIG. 12 is an exploded perspective view (1) of a high-density connection device according to another embodiment of the present invention.

FIG. 13 is a three-dimensional exploded view (2) of a high-density connection device according to another embodiment of the present invention.

Fig. 14 is a cross-sectional view of a high-density connection device in a separated state according to another embodiment of the present invention.

Fig. 15 is a detailed view of part XV in Fig. 14 .

Fig. 16 is a cross-sectional view of a joint state of a high-density connection device according to another embodiment of the present invention.

Fig. 17 is a detailed view of part XVII in Fig. 16 .

Fig. 18 is a cross-sectional view of the wire clamped by the spring connector of the present invention.

1: The first shell group

13: First connector

131: The first body

132: The first space

133: slot

134: the first partition

135: First piercing

136: Second perforation

2: The first circuit board

21: First joint end

22: The first contact

3: First socket connector

31: the first insulating body

32: first terminal

6: Second shell group

61: second shell

62: Second cover

63: Second connector

631: The second body

632: column

633: second space

634: second partition

635: The third piercing

636: Fourth piercing

7: Second circuit board

71: second joint end

72: Second contact

8: Second socket connector

81: the second insulating body

82: Second terminal

Claims (8)

A high-density connection device, comprising: a first connection module, the first connection module includes a first shell group, a first circuit board and a first socket connector, the first socket connector is arranged on the One side of the first circuit board, and the first socket connector is electrically connected to the first circuit board, the first circuit board and the first socket connector are arranged in the first housing group, the first circuit board One end of one end forms a first joint end, and at least one side of the first joint end is provided with a plurality of first contacts, and the first receptacle connector is arranged on one side of the first circuit board close to the first joint end; and a first joint end Two connection modules, the second connection module includes a second shell group, a second circuit board and a second socket connector, the second socket connector is arranged on one side of the second circuit board, and the first circuit board Two receptacle connectors are electrically connected to the second circuit board, the second circuit board and the second receptacle connector are arranged in the second housing group, one end of the second circuit board forms a second joint end, the second circuit board At least one side of the second joint end is provided with a plurality of second contacts, and the second socket connector is disposed on one side of the second circuit board close to the second joint end; wherein when the first connection module and the second connection When the modules are plugged together, the first joint end of the first circuit board can be inserted into the second socket connector, so that the first joint end of the first circuit board is electrically connected to the second socket connector, And the second joint end of the second circuit board can be inserted into the first socket connector, so that the second joint end of the second circuit board is electrically connected with the first socket connector. The high-density connection device according to claim 1, wherein a plurality of first contacts are provided on both sides of the first joint end, and a plurality of second contacts are provided on both sides of the second joint end. The high-density connection device as claimed in item 1, wherein the first housing group includes A first housing and a first connector, the first connector is arranged at one end of the first housing, the first connector has a first body, a first space and a slot are formed in the first body , there is a first partition between the first space and the slot, the first partition is provided with a first through hole and a second through hole, the first circuit board and the first socket connector are arranged on the In the first space, the first joint end of the first circuit board can extend into the slot through the first through hole, and the first socket connector corresponds to the second through hole. The high-density connection device as described in claim 3, wherein the second housing group includes a second housing and a second joint, the second joint is arranged at one end of the second housing, and the second joint has A second body, a column and a second space are formed in the second body, the column corresponds to the slot, when the first connection module and the second connection module are plugged together, the column The body can be inserted into the slot, the second space is located in the cylinder, one end of the cylinder has a second partition, the second partition is provided with a third through hole and a fourth through hole, the second The circuit board and the second socket connector are arranged in the second space, the second joint end of the second circuit board can protrude out of the cylinder through the third through hole, the second socket connector and the fourth corresponding to the perforation. The high-density connection device as described in claim 1, wherein at least one spring connector is arranged on the second circuit board or the first circuit board, and the spring connector includes an insulating body and a plurality of spring terminals, and the insulating body is spaced apart from A plurality of slots are provided, the spring terminals are arranged on the insulating body, each of the spring terminals has a contact portion and at least one pin portion, the contact portion extends in a spiral shape, the contact portion is formed with a slit, the The pin portion is connected to the contact portion, the pin portion is electrically connected to the second circuit board or the first circuit board, the contact portions of the spring terminals extend into the slots respectively, and the spring terminals The slots can be used to hold wires. A high-density connection device, comprising: a first connection module, the first connection module includes a first shell group and two second A circuit board, one end of the two first circuit boards each forms a first joint end, at least one side of the first joint end is provided with a plurality of first contacts; and a second connection module, the second connection module includes A second shell group, a second circuit board, a first socket connector and a second socket connector, the first socket connector is arranged on one side of the second circuit board, and the first socket connector is electrically Sexually connected to the second circuit board, the second socket connector is arranged on the other side of the second circuit board, and the second socket connector is electrically connected to the second circuit board, the second circuit board, the The first receptacle connector and the second receptacle connector are arranged in the second housing group; and when the first connection module and the second connection module are plugged together, the second connection of the two first circuit boards A joint end can be inserted into the first socket connector and the second socket connector respectively, so that the first joint ends of the two first circuit boards are electrically connected to the first socket connector and the second socket connector respectively. sexual connection; the first shell group includes a first housing and a first connector, the first connector is arranged at one end of the first housing, the first connector has a first body, the first body A slot is formed, the two first circuit boards are arranged in the first body, and the first joint ends of the two first circuit boards extend into the slot; the second shell group includes a second shell and A second connector, the second connector is arranged at one end of the second housing, the second connector has a second body, a cylinder and a space are formed in the second body, the cylinder and the slot Correspondingly, when the first connection module and the second connection module are plugged together, the column can be inserted into the slot, the space is located in the column, and one end of the column has a partition, the There are two through holes on the partition, the second circuit board, the first socket connector and the second socket connector are arranged in the space, and the first socket connector and the second socket connector are connected to the two socket connectors respectively. corresponding to the perforation. The high-density connection device as claimed in item 6, wherein the two ends of the first joint A plurality of the first contacts are arranged on each surface. The high-density connection device as described in claim 6, wherein at least one spring connector is arranged on the second circuit board or the first circuit board, and the spring connector includes an insulating body and a plurality of spring terminals, and the insulating body is spaced apart from A plurality of slots are provided, the spring terminals are arranged on the insulating body, each of the spring terminals has a contact portion and at least one pin portion, the contact portion extends in a spiral shape, the contact portion is formed with a slit, the The pin portion is connected to the contact portion, the pin portion is electrically connected to the second circuit board or the first circuit board, the contact portions of the spring terminals extend into the slots respectively, and the spring terminals The slots can be used to hold wires.

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