TWI781750B - Method of welding ceramic with target material by laser reduction firing - Google Patents
Method of welding ceramic with target material by laser reduction firing Download PDFInfo
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- TWI781750B TWI781750B TW110132893A TW110132893A TWI781750B TW I781750 B TWI781750 B TW I781750B TW 110132893 A TW110132893 A TW 110132893A TW 110132893 A TW110132893 A TW 110132893A TW I781750 B TWI781750 B TW I781750B
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- 238000000034 method Methods 0.000 title claims abstract description 69
- 239000000919 ceramic Substances 0.000 title claims abstract description 65
- 238000003466 welding Methods 0.000 title claims abstract description 43
- 238000010304 firing Methods 0.000 title claims abstract description 20
- 239000013077 target material Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 23
- 239000007769 metal material Substances 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 claims description 9
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 150000004706 metal oxides Chemical class 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 4
- 229940116318 copper carbonate Drugs 0.000 claims description 4
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000008187 granular material Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229940067573 brown iron oxide Drugs 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
Description
本發明係有關一種運用雷射還原燒成法焊熔陶瓷與目標物之方法，係一種用於製造陶瓷複合產品的工業製造技術者。 The present invention relates to a method for welding and melting ceramics and targets by using laser reduction firing method, and is an industrial manufacturing technique for manufacturing ceramic composite products.
陶瓷因具高硬度、高耐熱性等優良特性，所以在機械與醫學等各領域裡都有廣泛的應用，但因陶瓷本身的性質仍有缺陷，所以為增加應用的廣泛性，可能會需要將陶瓷與其它材料製成複合構造，而焊熔為可選擇的方式之一，但目前未有可靠的手段來達成；例如因陶瓷無法導電，所以在電子電路領域的使用上仍有所限制，雖可考慮將陶瓷與金屬合製成複合結構，但因陶瓷與金屬具膨脹係數不同等性質差異，所以使用一般的焊槍等加工技術來進行處理時，可能會發生金屬無法穩定固著於陶瓷、陶瓷爆裂等情況，仍無有效且可靠的方式來完成金屬與陶瓷之複合。 Because of its high hardness, high heat resistance and other excellent characteristics, ceramics are widely used in various fields such as machinery and medicine. However, due to the nature of ceramics, there are still defects, so in order to increase the versatility of applications, it may be necessary to use Ceramics and other materials are made of composite structures, and welding is one of the options, but there is no reliable means to achieve it; for example, ceramics are not conductive, so their use in the field of electronic circuits is still limited, although It can be considered to combine ceramics and metals into a composite structure, but due to the different properties of ceramics and metals such as different expansion coefficients, when using general welding guns and other processing techniques for processing, it may happen that the metal cannot be stably fixed on the ceramics or ceramics. There is still no effective and reliable way to complete the composite of metal and ceramics.
有鑑於上述缺失弊端，本發明人認為具有改正之必要，遂以從事相關技術以及產品設計製造之多年經驗，秉持優良設計理念，針對以上不良處加以研究創作，在經過不斷的努力後，終乃推出本發明運用雷射還原燒成法焊熔陶瓷與目標物之方法，期以更正產品結構以提升產品優良之功效。 In view of the above shortcomings, the inventor believes that it is necessary to correct it. Based on his many years of experience in related technologies and product design and manufacturing, and adhering to the excellent design concept, he researched and created the above shortcomings. After continuous efforts, he finally achieved Introduced the method of welding and melting ceramics and target objects using the laser reduction firing method in the present invention, hoping to correct the product structure and improve the excellent efficacy of the product.
本發明運用雷射還原燒成法焊熔陶瓷與目標物之方法之主要目的，係提供一種可有效將陶瓷與目標物合製成複合構造的方法流程者。 The main purpose of the present invention is to provide a method for effectively combining ceramics and objects into a composite structure by using the laser reduction firing method to weld and fuse ceramics and objects.
為達到前揭之目的，本發明運用雷射還原燒成法焊熔陶瓷與目標物之方法，當以金屬導線為目標物時包括有以下步驟：導電層成型程序，將氧化金屬材料設置於一陶瓷基板上，並使用一雷射裝置所產生的雷射來照射陶瓷基板上的氧化金屬材料，進而對氧化金屬材料產生還原燒效果，使其成為固著於陶瓷基板上的導電層；清理程序，清除導電層範圍外未受燒結的氧化金屬材料；目標物設置程序，將金屬導線置放於陶瓷基板上，使導線與導電層相接；焊材設置程序，將作為焊材使用的氧化金屬材料設置於陶瓷基板上，使其與陶瓷基板、導線及導電層相接；焊熔程序，使用雷射來照射氧化金屬材料，使其成為熔接陶瓷基板、導線與導電層的焊接層；清潔程序，清除焊接層範圍外未受燒結的氧化金屬材料。 In order to achieve the purpose disclosed above, the present invention uses the laser reduction firing method to weld the ceramics and the target object. When the metal wire is used as the target object, the following steps are included: the conductive layer forming process, and the oxidized metal material is placed on a On the ceramic substrate, and use the laser generated by a laser device to irradiate the oxidized metal material on the ceramic substrate, and then produce a reduction firing effect on the oxidized metal material, making it a conductive layer fixed on the ceramic substrate; cleaning procedure , to remove unsintered oxidized metal materials outside the range of the conductive layer; the target setting program, place the metal wire on the ceramic substrate, so that the wire and the conductive layer are connected; the welding material setting program, set the oxidized metal used as the welding material The material is placed on the ceramic substrate so that it is in contact with the ceramic substrate, wires and conductive layer; the welding process uses laser to irradiate the oxidized metal material to make it a welding layer that welds the ceramic substrate, wire and conductive layer; cleaning process , Remove the unsintered oxidized metal material outside the welding layer.
而與以往具無法將金屬穩定固著於陶瓷等缺點相比，本發明利用了陶瓷與氧化金屬皆具有良好的雷射能量吸收特性，使其能產生融流而完成焊接，進而讓導線能穩定固著於陶瓷上，以完成具實用潛力價值的陶瓷金屬複合構造，並且目標物並不限於金屬導線，因此可製造多種的陶瓷複合構造，顯見本發明為具有進步性的創作。 Compared with the previous disadvantages of not being able to stably fix metal to ceramics, this invention utilizes the good laser energy absorption characteristics of both ceramics and oxidized metals, enabling them to generate melt flow and complete welding, thereby making the wires stable. It is fixed on ceramics to complete a ceramic-metal composite structure with practical potential value, and the target object is not limited to metal wires, so various ceramic composite structures can be produced. It is obvious that the present invention is a progressive creation.
S1:導電層成型程序 S1: Conductive layer forming procedure
S2:清理程序 S2: Cleanup procedure
S3:目標物設置程序 S3: Target setting procedure
S4:焊材設置程序 S4: Welding material setting procedure
S5:焊熔程序 S5: Welding procedure
S6:清潔程序 S6: Cleaning procedure
第一圖係本發明運用雷射還原燒成法焊熔陶瓷與目標物之方法的流程方塊圖。 The first figure is a flow block diagram of the method of using the laser reduction firing method to weld and fuse ceramics and objects in the present invention.
第二圖係本發明運用雷射還原燒成法焊熔陶瓷與目標物之方法的導電層設置程序之示意圖。 The second figure is a schematic diagram of the conductive layer setting procedure of the method of using the laser reduction firing method to weld and melt the ceramic and the target object in the present invention.
第三圖係本發明運用雷射還原燒成法焊熔陶瓷與目標物之方法的目標物設置程序之示意圖。 The third figure is a schematic diagram of the target setting procedure of the method of using the laser reduction firing method to weld and melt the ceramic and the target in the present invention.
第四圖係本發明運用雷射還原燒成法焊熔陶瓷與目標物之方法的焊熔程序之示意圖。 The fourth figure is a schematic diagram of the welding process of the method of welding and melting ceramics and targets using the laser reduction firing method in the present invention.
第五圖係對本發明所製出的陶瓷金屬複合構造進行導電測試之示意圖。 The fifth figure is a schematic diagram of the conduction test of the ceramic-metal composite structure produced by the present invention.
第六圖係本發明運用雷射還原燒成法焊熔陶瓷與目標物之方法以陶瓷為目標物之示意圖。 Figure 6 is a schematic diagram of the method of welding and melting ceramics and targets using the laser reduction firing method in the present invention, with ceramics as the target.
第七圖係作為目標物的陶瓷焊固於陶瓷基板上後之示意圖。 The seventh figure is a schematic diagram after the target ceramic is welded and solidified on the ceramic substrate.
〔請參閱第一圖至第四圖〕本發明係有關一種運用雷射還原燒成法焊熔陶瓷與目標物之方法，其包括以下步驟：導電層成型程序(S1)，如第二圖所示將粉末或顆粒狀的氧化金屬材料設置於一陶瓷基板上，並使用一雷射裝置所產生的雷射來照射陶瓷基板上的氧化金屬材料，進而對氧化金屬材料產生還原燒效果，使其成為固著於陶瓷基板上的導電層；清理程序(S2)，清除導電層範圍外未受燒結的氧化金屬材料；目標物設置程序(S3)，如第三圖所示將目標物置放於陶瓷基板上，使目標物與導電層相接，在此目標物為金屬導線；焊材設置程序(S4)，將作為焊材使用的氧化金屬材料設置於陶瓷基板上，使其與陶瓷基板、導電層及目標物相接；焊熔程序(S5)，如第四圖所示使用雷射來照射設置好的氧化金屬材料，使其成為熔接陶瓷基板、導電層及目標物的焊接層； 清潔程序(S6)，清除焊接層範圍外未受燒結的氧化金屬材料。 [Please refer to the first figure to the fourth figure] The present invention is related to a method of using laser reduction firing method to weld ceramics and objects, which includes the following steps: Conductive layer forming procedure (S1), as shown in the second figure It shows that the powder or granular metal oxide material is placed on a ceramic substrate, and the laser generated by a laser device is used to irradiate the oxide metal material on the ceramic substrate, thereby producing a reduction burning effect on the oxide metal material, making it Become a conductive layer fixed on the ceramic substrate; cleaning procedure (S2), remove the unsintered oxide metal material outside the scope of the conductive layer; target setting procedure (S3), place the target on the ceramic as shown in the third figure On the substrate, the target object is connected to the conductive layer, where the target object is a metal wire; the welding material setting program (S4), the oxide metal material used as the welding material is arranged on the ceramic substrate, so that it is connected to the ceramic substrate and the conductive layer. The layer and the target object are connected; the welding process (S5), as shown in the fourth figure, uses laser to irradiate the set metal oxide material, making it a welding layer for welding the ceramic substrate, conductive layer and target object; Cleaning procedure (S6), removing unsintered oxidized metal materials outside the range of the welding layer.
〔請參閱第一圖至第四圖〕本發明所使用的雷射裝置可為市面上所販售的二氧化碳雷射雕刻機，而用來成型導電層與作為焊材使用的氧化金屬材料可為第二圖所示的紅棕色氧化鐵Fe2O3或第四圖所示的藍綠色碳酸銅CuCO3，所使用的目標物之金屬導線則可為銅線或鐵線；進行導電層成型程序(S1)時雷射裝置功率為20W，雷射光點的直徑為0.2mm，而照射時是循多條平行間隔的路徑進行，照射氧化鐵時，光點的移動速度設定為1mm/sec，間隔為0.05mm，而照射碳酸銅時，光點的移動速度為4mm/sec，間隔為0.02mm，後進行焊熔程序(S5)時，光點的移動速度可設定為1mm/sec，間隔為0.3mm，當然上述的雷射裝置選擇、參數設定、材料選擇等等僅為較佳實施例而不加以限定；〔請一併參閱第五圖〕而製出的陶瓷金屬複合構造經三用電錶測試後，確實具有導電效果。 [Please refer to the first figure to the fourth figure] The laser device used in the present invention can be a carbon dioxide laser engraving machine sold on the market, and the metal oxide material used to form the conductive layer and be used as a welding material can be The red-brown iron oxide Fe 2 O 3 shown in the second picture or the blue-green copper carbonate CuCO 3 shown in the fourth picture, the metal wire of the target object used can be copper wire or iron wire; carry out the conductive layer forming process In (S1), the power of the laser device is 20W, the diameter of the laser spot is 0.2mm, and the irradiation is carried out along a plurality of parallel and spaced paths. When irradiating iron oxide, the moving speed of the spot is set to 1mm/sec. is 0.05mm, and when copper carbonate is irradiated, the moving speed of the light spot is 4mm/sec, and the interval is 0.02mm. After the welding process (S5), the moving speed of the light spot can be set to 1mm/sec, and the interval is 0.3mm. mm, of course, the above-mentioned laser device selection, parameter setting, material selection, etc. are only preferred embodiments and are not limited; Finally, it does have a conductive effect.
〔請參閱第一圖、第六圖與第七圖〕而除了焊熔金屬導線外，也能以陶瓷作為目標物，如第六圖所示此處以800℃燒成的陶瓷作為陶瓷基板，1245℃燒成的陶瓷作為目標物，而氧化金屬材料則使用藍綠色碳酸銅，並欲以陶瓷為目標物進行焊熔時，僅需進行目標物設置程序(S3)、焊材設置程序(S4)、焊熔程序(S5)與清潔程序(S6)，進而將具不同特性的陶瓷製作成第七圖所示的複合構造。 [Please refer to Figure 1, Figure 6, and Figure 7] In addition to soldering molten metal wires, ceramics can also be used as the target. As shown in Figure 6, ceramics fired at 800°C are used as ceramic substrates here, 1245 The ceramic fired at ℃ is used as the target object, and the blue-green copper carbonate is used for the oxidized metal material. When welding and melting with the ceramic as the target object, only the target object setting procedure (S3) and the welding material setting procedure (S4) are required. , Welding process (S5) and cleaning process (S6), and then the ceramics with different characteristics are made into the composite structure shown in the seventh figure.
唯以上所述者，僅為本發明之一較佳實施例而已，當不能以之限定本發明之範圍。即大凡依申請專利範圍所作之均等變化與修飾，皆應仍屬本創作專利涵蓋之範圍內。 What is described above is only a preferred embodiment of the present invention, and should not be used to limit the scope of the present invention. That is to say, all equivalent changes and modifications made according to the scope of the patent application should still fall within the scope covered by this creation patent.
綜上所述，當知本發明具有新穎性、進步性，且本發明未見之於任何刊物，當符合專利法第22條之規定。 To sum up, it should be known that the present invention is novel and progressive, and the present invention has not been published in any publications, and it should comply with the provisions of Article 22 of the Patent Law.
S1:導電層成型程序 S1: Conductive layer forming procedure
S2:清理程序 S2: Cleanup procedure
S3:目標物設置程序 S3: Target setting procedure
S4:焊材設置程序 S4: Welding material setting procedure
S5:焊熔程序 S5: Welding procedure
S6:清潔程序 S6: Cleaning procedure
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| TW110132893A TWI781750B (en) | 2021-09-03 | 2021-09-03 | Method of welding ceramic with target material by laser reduction firing |
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Citations (6)
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|---|---|---|---|---|
| US5306891A (en) * | 1992-04-02 | 1994-04-26 | Motorola, Inc. | Laser welding process for attaching metal to ceramic substrate |
| CN102140036A (en) * | 2011-01-27 | 2011-08-03 | 长春理工大学 | Ceramic and metal dual-laser beam partial transient liquid-phase welding method |
| TWI487618B (en) * | 2011-11-10 | 2015-06-11 | Alanod Gmbh & Co Kg | Laserschweissbares verbundmaterial |
| TW201600212A (en) * | 2014-04-21 | 2016-01-01 | Corning Inc | Laser welding of high thermal expansion glass and glass ceramic |
| JP2017144485A (en) * | 2016-02-17 | 2017-08-24 | 株式会社ナ・デックスプロダクツ | Laser welding method |
| CN110342908A (en) * | 2018-04-05 | 2019-10-18 | 日亚化学工业株式会社 | The manufacturing method of ceramic composite, projector light source and ceramic composite |
-
2021
- 2021-09-03 TW TW110132893A patent/TWI781750B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5306891A (en) * | 1992-04-02 | 1994-04-26 | Motorola, Inc. | Laser welding process for attaching metal to ceramic substrate |
| CN102140036A (en) * | 2011-01-27 | 2011-08-03 | 长春理工大学 | Ceramic and metal dual-laser beam partial transient liquid-phase welding method |
| TWI487618B (en) * | 2011-11-10 | 2015-06-11 | Alanod Gmbh & Co Kg | Laserschweissbares verbundmaterial |
| TW201600212A (en) * | 2014-04-21 | 2016-01-01 | Corning Inc | Laser welding of high thermal expansion glass and glass ceramic |
| JP2017144485A (en) * | 2016-02-17 | 2017-08-24 | 株式会社ナ・デックスプロダクツ | Laser welding method |
| CN110342908A (en) * | 2018-04-05 | 2019-10-18 | 日亚化学工业株式会社 | The manufacturing method of ceramic composite, projector light source and ceramic composite |
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