TWI780787B - Photosensitive resin composition, color filter and display device using the same - Google Patents

Abstract

A photosensitive resin composition includes colorlants (A) having at least one pigment, a resin composition (B), a photopolymerizable monomer(C), a photoinitiator (D) and an organic solvent (E), wherein the resin composition (B) includes a semiconductor material with conductivity, and the color of the semiconductor material is the same as the color of the colorant (A). Also, the semiconductor material is contained in a range of 5 weight percent (wt%) to 10 wt% based on the total weight of the photosensitive resin composition.

Description

Photosensitive resin composition, color filter and display device using same

The present invention relates to a photosensitive resin composition, a color filter and a display device using the same, and in particular to a wide color gamut (wide color gamut; WCG) photosensitive resin composition, and a color filter using the same Color filters and display devices.

Display devices have been widely used in daily life, including various portable or non-portable electronic products, equipment in the workplace, smart home appliances, vehicles, or public purposes, etc., to provide relevant information and/or interactive modes to enhance Convenience and fun for users in life and work. The photoresist plays an important role in the display device, for example, it can form a light transmission layer or a light shielding and reflection layer of the display device.

Taking a color liquid crystal display device as an example, a color filter is used in the color liquid crystal display device to present a color display image. A color filter includes photoresist layers of different colors, and a typical color filter includes photoresists of four colors, such as red, green, blue, and black. In addition to the optical characteristics of the color filter, its color characteristics also have a key influence on the display effect of the color liquid crystal display device.

Although current photoresist compositions are generally adequate, they do not fully meet all requirements, and there are still various attempts and adjustments for photoresist compositions in color filters. For example, the development of photoresist compositions with wide color gamut enables display devices to achieve better color saturation.

Some embodiments of the present invention disclose a photosensitive resin composition, including a colorant (A) containing at least one pigment, a resin composition (B), a photopolymerizable monomer (C), and a photopolymerization initiator (D) and the organic solvent (E), wherein the resin composition (B) contains a conductive semiconductor material, and the color of the semiconductor material is the same color system as that of the colorant (A), wherein, The semiconductor material accounts for a range of 5% to 10% by weight of the total weight of the photosensitive resin composition.

Some embodiments of the present invention disclose a color filter formed of the above-mentioned photosensitive resin composition.

Some embodiments of the present invention disclose a display device, comprising at least one light-transmitting layer or a light-shielding and reflecting layer, wherein the light-transmitting layer or the light-shielding and reflecting layer comprises the above-mentioned photosensitive resin composition applied to formed on a substrate and cured.

Current display devices not only need to have good optical display effects, such as including color filters with high penetration (high transparency) or high shading and high light reflection effects, but also need excellent color display effects. Furthermore, in addition to the common liquid crystal display, the mainstream of display technology development in recent years, such as organic light-emitting diode (OLED) display, is also becoming more and more popular. Light-emitting diodes (Mini LEDs) and submillimeter light-emitting diodes Micro LEDs have also attracted much attention. With the development of new types of display technology, the demand for new types of photoresists is also increasing, and the requirements for color rendering are also higher.

In recent years, the development of display devices has gradually shifted from focusing on high image quality to focusing on high color development. In order to achieve high color requirements, the color gamut performance of the color photosensitive resin composition is also very important. When the color gamut is wider, the color saturation of the display device is also better and more vivid. In the current color photosensitive resin composition, the pigment of the color is added to the composition, or the dye of the color is further added to enhance the color saturation of the color.

In order to meet the above needs, embodiments of the present disclosure provide a photosensitive resin composition, and a color filter and a display device using the photosensitive resin composition. The photosensitive resin composition proposed according to some embodiments includes a resin composition, the resin composition includes a semiconductor material with conductivity, and the color of the semiconductor material is the same as that of the colorant in the photosensitive resin composition The colors are in the same color system, so as to enhance the color saturation of the color material, so that the display device can achieve a wide color gamut (WCG) color effect. In some embodiments, the photosensitive resin composition has a blue colorant, and the resin composition may include a blue-based semiconductor material to increase the color saturation of the photosensitive resin composition. Moreover, in some embodiments, the photosensitive resin composition is applied on the substrate of the display device, and subjected to photolithography process, and cured to form at least one light-transmitting layer or one light-shielding and reflecting layer.

Various embodiments are presented below for detailed description. It should be understood that the content of the embodiment is only used as an example for illustration, and does not limit the scope of the present disclosure, and the present disclosure can still be implemented using other features, components, methods and parameters. The embodiments are presented only to illustrate the technical features of the present disclosure, and are not intended to limit the patent scope of the present disclosure. Those with ordinary knowledge in the technical field will be able to make equal modifications and changes according to the descriptions in the following specification without departing from the spirit of the present disclosure.

Some embodiments of the present disclosure relate to a photosensitive resin composition, including a colorant (A) containing at least one pigment, a resin composition (B), a photopolymerization initiator (D) and an organic solvent (E), wherein The resin composition (B) includes a conductive semiconductor material, and the color of the semiconductor material is the same as that of the colorant (A). In some embodiments, the semiconductor material accounts for a range of 5% to 10% by weight of the total weight of the photosensitive resin composition. In some embodiments, a semiconductor material of the same color system as that of the colorant (A) is added to improve the color saturation of the photoresist layer made from the photosensitive resin composition, and further make the photosensitive resin The color gamut of the display device of the composition is wider. In addition, in some embodiments, the addition of the semiconductor material can be mixed with other resins of the resin composition (B) to effectively maintain uniform dispersion, and precipitation will not easily occur, so it will not affect the reliability of the photosensitive resin composition. Reliability.

Moreover, some embodiments of the present disclosure relate to a color filter, which is formed by the photosensitive resin composition of the embodiments. In addition, some embodiments of the present disclosure relate to a display device, including at least one photoresist layer, which can be used as a light transmission layer or a light shielding and reflection layer in the display device. Wherein, the light-transmitting layer or the light-shielding and reflecting layer is formed by applying the photosensitive resin composition of some embodiments of the present disclosure on a substrate and performing an optical lithography process. The method of applying the photosensitive resin composition is, for example (but not limited to), using a knife coater, a slit coater, a spin coater, an inkjet machine, or a combination of any two of the aforementioned mechanisms. placed above the substrate. Because in the photosensitive resin composition proposed in the embodiment, the semiconductor material of the resin composition (B) can be effectively maintained evenly dispersed after being mixed with other resins, and precipitation is not easy to occur, so the addition of the semiconductor material will not affect the photosensitive resin composition. The coating on the substrate and the optical properties after the photolithography process can also improve the color saturation of the photosensitive resin composition because its own color and the color of the colorant (A) are in the same color system.

In some embodiments, the coloring agent (A) of the photosensitive resin composition may contain one or more pigments. The pigment of the coloring agent is not particularly limited, and known pigments can be used, for example, for example, the color index (The Society of Dyers and Colourists Publishing) are classified as pigments (pigment) compounds.

The colorant (A) includes, for example, blue pigments, red pigments, green pigments, yellow pigments, white pigments, black pigments, pigments of other colors, or a combination of the aforementioned pigments. Furthermore, the pigments of each color may include a combination of one or more of its color pigments.

Furthermore, in some embodiments, the pigment of the colorant (A) refers to a dispersion liquid including pigments of various colors. The dispersions of various colors of pigments include, for example, acrylic pigment dispersants, mixtures of pigment dispersing resins and propylene glycol monomethyl ether acetate, or other suitable substances, which are uniformly dispersed by a bead mill.

In some embodiments, the colorant (A) may include a blue pigment, such as a phthalocyanine pigment, or other suitable substances. Specifically, for example, C.I. Pigment Blue 15, C.I. Pigment Blue 15:1, C.I. Pigment Blue 15:2, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:6, C.I. Pigment Blue 16. C.I. Pigment Blue 22, C.I. Pigment Blue 60, C.I. Pigment Blue 64, C.I. Pigment Blue 80 and other blue pigments. Alternatively, in some embodiments, the colorant may include, for example, C.I. Pigment Violet 1, C.I. Pigment Violet 19, C.I. Pigment Violet 23, C.I. Pigment Violet 27, C.I. Pigment Violet 29, C.I. Pigment Violet 30, C.I. 37. C.I. Pigment Violet 40, C.I. Pigment Violet 42, C.I. Pigment Violet 50 and other purple pigments. In some examples, blue pigment systems include, but are not limited to, C.I. Pigment Blue 15:6.

In some embodiments, the colorant (A) may include a red pigment, such as a diketopyrrolopyrrole pigment, an anthraquinone pigment, or a combination thereof, or other suitable substances. Specifically, C.I. Pigment Red 9, C.I. Pigment Red 97, C.I. Pigment Red 105, C.I. Pigment Red 122, C.I. Pigment Red 123, C.I. Pigment Red 144, C.I. Pigment Red 149, C.I. Pigment Red 166, C.I. Pigment Red 175, C.I. Pigment Red 176, C.I. Pigment Red 177, C.I. Pigment Red 180, C.I. Pigment Red 192, C.I. Pigment Red 209, C.I. Pigment Red 215, C.I. Pigment Red 216, C.I. Pigment Red 224, C.I. Pigment Pigment Red 242, C.I. Pigment Red 254, C.I. Pigment Red 255, C.I. Pigment Red 264, C.I. Pigment Red 265, C.I. Pigment Red 291, C.I. Pigment Red 295.

In some embodiments, the colorant (A) may include a green pigment, such as a phthalocyanine pigment, an imine metal complex pigment, and the like. Specifically, for example, C.I. Pigment Green 1, C.I. Pigment Green 4, C.I. Pigment Green 7, C.I. Pigment Green 8, C.I. Pigment Green 36, C.I. Pigment Green 58, C.I. Pigment Green 63, and the like can be used. In some embodiments, the colorant of the present invention may include a halogenated metal phthalocyanine pigment as a pigment. Halogenated metal phthalocyanine pigments include copper halide phthalocyanine pigments and zinc halide phthalocyanine pigments, and zinc halide phthalocyanine pigments such as C.I. Pigment Green 58 and C.I. Pigment Green 59 are particularly preferable.

In some embodiments, the colorant (A) may include a yellow pigment, such as monoazo pigment, monoazo lake pigment, disazo pigment, anthraquinone Anthraquinone pigment, monoazo pyrazolone pigment, condensed azo pigment, isoindoline pigment, benzimidazolone pigment, Azomethine metal complex pigments, quinophthalone pigments, quinoxaline pigments, etc. Specifically, for example, C.I. Pigment Yellow 1, C.I. Pigment Yellow 2, C.I. Pigment Yellow 3, C.I. Pigment Yellow 4, C.I. Pigment Yellow 5, C.I. Pigment Yellow 6, C.I. Pigment Yellow 10, C.I. Pigment Yellow 12, C.I. Yellow 13, C.I. Pigment Yellow 14, C.I. Pigment Yellow 15, C.I. Pigment Yellow 16, C.I. Pigment Yellow 17, C.I. Pigment Yellow 18, C.I. Pigment Yellow 20, C.I. Pigment Yellow 24, C.I. Pigment Yellow 31, C.I. Yellow 34, C.I. Pigment Yellow 35, C.I. Pigment Yellow 35:1, C.I. Pigment Yellow 36, C.I. Pigment Yellow 36:1, C.I. Pigment Yellow 37, C.I. Pigment Yellow 37:1, C.I. Pigment Yellow 40, C.I. Pigment Yellow 42, C.I. Pigment Yellow 43, C.I. Pigment Yellow 53, C.I. Pigment Yellow 55, C.I. Pigment Yellow 60, C.I. Pigment Yellow 61, C.I. Pigment Yellow 62, C.I. Pigment Yellow 63, C.I. Pigment Yellow 65, C.I. Pigment Yellow 73, C.I. Pigment Yellow 77, C.I. Pigment Yellow 81, C.I. Pigment Yellow 83, C.I. Pigment Yellow 86, C.I. Pigment Yellow 93, C.I. Pigment Yellow 94, C.I. Pigment Yellow 95, C.I. Pigment Yellow 97, C.I. Pigment Yellow 98, C.I. Pigment Yellow 101, C.I. Pigment Yellow 104, C.I. Pigment Yellow 106, C.I. Pigment Yellow 108, C.I. Pigment Yellow 109, C.I. Pigment Yellow 110, C.I. Pigment Yellow 113, C.I. Pigment Yellow 114, C.I. Pigment Yellow 117, C.I. Pigment Yellow 118, C.I. Pigment Yellow 119, C.I. Pigment Yellow 120, C.I. Pigment Yellow 123, C.I. Pigment Yellow 125, C.I. Pigment Yellow 126, C.I. Pigment Yellow 127, C.I. Pigment Yellow 137, C.I. Pigment Yellow 138, C.I. Pigment Yellow 139, C.I. Pigment Yellow 147, C.I. Pigment Yellow 148, C.I. Pigment Yellow 150, C.I. Pigment Yellow 151, C.I. Pigment Yellow 152, C.I. Pigment Yellow 155, C.I. Pigment Yellow 156, C.I. Pigment Yellow 161, C.I. Pigment Yellow 162, C.I. Pigment Yellow 164, C.I. Pigment Yellow 166, C.I. Pigment Yellow 167, C.I. Pigment Yellow 168, C.I. Pigment Yellow 171, C.I. Pigment Yellow 172, C.I. Pigment Yellow 173, C.I. Pigment Yellow 174, C.I. Pigment Yellow 175, C.I. Pigment Yellow 176, C.I. Pigment Yellow 177, C.I. Pigment Yellow 179, C.I. Pigment Yellow 180, C.I. Pigment Yellow 181, C.I. Pigment Yellow 182, C.I. Pigment Yellow 185, C.I. Pigment Yellow 187, C.I. Pigment Yellow 188, C.I. Pigment Yellow 193, C.I. C.I. Pigment Yellow 213, C.I. Pigment Yellow 214 and other yellow pigments. In some examples, the yellow pigment system includes C.I. Pigment Yellow 139.

In some embodiments, colorant (A) may include a white pigment. White pigments include, for example, white oxides. Specifically, for example, CI Pigment White 4, CI Pigment White 5, CI Pigment White 6, CI Pigment White 6:1, CI Pigment White 7, CI Pigment White 18, CI Pigment White 18:1, CI Pigment White 19. CI Pigment White 20, CI Pigment White 22, CI Pigment White 25, CI Pigment White 26, CI Pigment White 27, CI Pigment White 28, CI Pigment White 32, etc. These white pigments may be used alone or in combination of two or more. Taking CI Pigment White 6 as an example, the metal oxide particles contained in CI Pigment White 6, titanium dioxide (TiO ₂ ), are cheap and have excellent reflectance due to high refractive index. Furthermore, titanium dioxide (TiO ₂ ) has a rutile structure and has excellent whiteness. Therefore, titanium dioxide is often preferred for use as an effective white colorant.

In some embodiments, colorant (A) may include a black pigment. The black pigment includes, for example, carbon black, organic black, other suitable substances, or a combination of the foregoing.

In some embodiments of the present invention, the above-mentioned pigments can be used alone or in combination of two or more to increase color purity.

Furthermore, according to some embodiments, the colorant (A) of the photosensitive resin composition may include one or more dyes mixed with at least one pigment. The dye of the colorant is not particularly limited, as long as it can be appropriately selected according to the spectral spectrum of the desired color filter.

The dye usable in the examples is not particularly limited, and known dyes can be used, and examples thereof include solvent dyes, acid dyes, direct dyes, and mordant dyes. Examples of dyes include compounds classified as substances having a hue other than pigments in the Color Index (published by The Society of Dyers and Colourists), and known dyes described in Dyeing Notes (Yorsensha). In addition, depending on the chemical structure, azo dyes, cyanine dyes, triphenylmethane dyes, xanthene dyes, phthalocyanine dyes, naphthoquinone dyes, quinone imine dyes, methine dyes, azomethine dyes, Acid dyes, acridine dyes, styryl dyes, coumarin dyes, cyanine dyes, anthraquinone dyes, azo dyes, squarylium dyes, dipyrromethene dyes, quinoline dyes, porphyrin dyes, quinoline dyes phyllochrome dyes and nitro dyes, etc. In some examples, the colorant (A) further includes an xanthanone dye.

Furthermore, the weight percentage of the coloring agent (A) in the embodiment in the solids of the photosensitive resin composition can be properly adjusted according to practical applications. For example, the colorant (A) comprising a white pigment is generally applicable as a reflective layer and a light shielding layer of a display device. In some other embodiments, it is also possible to contain a small amount of colorant (A) of white pigment particles in the solid of the photosensitive resin composition to allow light to pass through efficiently. In some examples of application as a light-shielding and reflective layer of a display device, the colorant (A) containing white pigments accounts for a relatively high weight percentage in the solids of the photosensitive resin composition to produce sufficient shielding properties.

In some embodiments, if the total weight of the photosensitive resin composition is 100 parts by weight, the colorant (A) is, for example (but not limited to), 10 parts by weight to 55 parts by weight of the total weight of the photosensitive resin composition ( That is, 10wt%~55wt%). In some other embodiments, if the total weight of the photosensitive resin composition is 100 parts by weight, the colorant (A) accounts for 20 to 55 parts by weight of the total weight of the photosensitive resin composition (that is, 20wt%~55 wt%). The proportion of the colorant (A) is properly adjusted according to the color requirements of the photosensitive resin composition of each color and the optical transmittance of the applied color filter.

In addition, according to actual needs, the photosensitive resin composition may also contain a dispersant, so that the colorant (A) can be uniformly dispersed in the solution. As said dispersant, cationic, anionic, nonionic, amphoteric, polyester, polyamine, acrylic surfactant, etc. are mentioned, for example. These dispersants may be used alone or in combination of two or more.

In some embodiments, the resin composition (B) of the photosensitive resin composition includes a semiconductor material having conductivity. In some embodiments, the semiconductor material includes a conductive polymer. Furthermore, the color of the semiconductor material and the color of the colorant (A) are, for example, the same color system. For example, if there is a blue coloring agent in the photosensitive resin composition, the resin composition (B) of the embodiment may include a blue semiconductor material; if there is a red coloring agent in the photosensitive resin composition, then The resin composition (B) of the embodiment may include a red-based semiconductor material; if the photosensitive resin composition has a green colorant, the resin composition (B) of the embodiment may include a green-based semiconductor material. According to the photosensitive resin composition proposed in this disclosure, the color saturation of the color of the composition can be improved.

In some embodiments, taking the total weight of the photosensitive resin composition as 100%, the semiconductor material can be (but not limited to) 5% by weight (wt%) to 10% by weight of the total weight of the photosensitive resin composition % (wt%) range.

In some embodiments, semiconductor materials or conductive polymers may be added to a photoresist formulation. The aforementioned semiconductor material is, for example but not limited to, a conductive polymer solution comprising polystyrene sulfonate, or other suitable organic conductive semiconductor materials, or a combination thereof. In some examples, conductive polymers including, for example, poly(3,4-ethylenedioxythiophene)-polystyrene sulfonate (Poly(3,4-ethylenedioxythiophene)-Polystyrene sulfonate; PEDOT:PSS) can be used. A conductive polymer solution is mixed with one or more other resins to provide the resin composition (B) of the photosensitive resin composition of some embodiments of the present disclosure.

In some examples, when the aforementioned conductive polymer containing polystyrene sulfonate is used as the semiconductor material of the resin composition (B), if the conductive polymer solution containing polystyrene sulfonate is prepared into a After the thin film, the thickness of the film layer is, for example, 1.8 microns (um), and the film is measured with a UV-vis spectrometer (model; SHIMADZU UV-3600i PLUS), and its absorption value is 0.05~0.18 at a wavelength of 200nm~400nm. When the wavelength is 400nm~500nm, its absorption value is 0.16~0.25; when the wavelength is 500nm~600nm, its absorption value is 0.23~0.32; 0.33~0.48.

In some embodiments, the aforementioned semiconductor material is, for example (but not limited to), blue poly(3,4-ethylenedioxythiophene)-polystyrene sulfonate (PEDOT:PSS), to be combined with one or more other The resins are mixed to form the resin composition (B) of the photosensitive resin composition. Adding poly(3,4-ethylenedioxythiophene)-polystyrene sulfonate (PEDOT:PSS) to a photosensitive resin composition with a blue colorant can improve the blue color of the photosensitive resin composition saturation.

The constituent units of poly(3,4-ethylenedioxythiophene)-polystyrene sulfonate (PEDOT:PSS) are shown in formula (I),

式(I)。

Formula (I).

In some embodiments, the resin composition (B) of the photosensitive resin composition includes other resin materials mixed with the above-mentioned semiconductor materials in addition to the above-mentioned semiconductor materials. In some examples, the semiconductor material is, for example (but not limited to), in the range of about 29% by weight to about 59% by weight of the total weight of all components of the resin composition (B). However, it is understood that other semiconductor materials may also be applicable in other weight percentages of the resin composition (B), and the present disclosure is not limited to the above numerical ranges.

Moreover, in some examples, in the resin composition (B) of the photosensitive resin composition, the semiconductor material is, for example (but not limited to), 22% by weight of the total weight of the colorant (A) to a range of 45% by weight. However, photosensitive resin compositions of different colors may have different weight percentages of the coloring agent (A), and in the resin composition (B) of the photosensitive resin composition of the embodiment, the above-mentioned semiconducting material relative to the coloring agent (A) The weight percentage of can be changed and adjusted to meet the needs of practical applications, so the present disclosure is not limited to the above numerical range.

Moreover, in some examples, the resin composition (B) of the photosensitive resin composition of the embodiment may include one or more other resin materials in addition to the above-mentioned semiconductor materials such as conductive polymers, such as the following formula The first resin having the structural unit represented by the formula (II), or the second resin having the structural unit represented by the formula (III).

Formula (II)

Formula (III)

In some examples, the resin composition (B) of the photosensitive resin composition of the embodiment may further include a mixture of the above-mentioned first resin and the above-mentioned second resin in addition to the above-mentioned semiconductor material such as a conductive polymer. In the content of subsequent related experiments, the structures and preparation methods of the above-mentioned first resin and the above-mentioned second resin will be described in more detail.

Moreover, in some examples, the resin composition (B) of the photosensitive resin composition of the embodiment may also contain one or more suitable dispersants to mix with the above-mentioned semiconductor materials and other resins to achieve uniformity in the resin. The effect of dispersion is not easy to agglomerate and settle, so that the whole photosensitive resin composition can effectively maintain uniform dispersion, and precipitation is not easy to occur. In some embodiments, the dispersant accounts for 0.0001% by weight to 10% by weight of the total weight of the resin composition (B). Therefore, the addition of the semiconductor material in the embodiment will not affect the optical properties of the photosensitive resin composition after coating and lithography process on the substrate. However, the color of the semiconductor material itself and the color of the colorant (A) in the embodiment are in the same color system, which can improve the color saturation of the photosensitive resin composition.

In some embodiments, the photosensitive resin composition includes a photopolymerizable monomer (C). The photopolymerizable monomer (C) is not particularly limited, and examples thereof may include, but are not limited to, (meth)acrylic acid, acrylate, styrene, vinyl acetate, or any combination thereof. Examples of acrylates may include, but are not limited to, butyl acrylate (BA), methyl acrylate (MA), 2-ethylhexyl acrylate (2-EHA), butyl methacrylate (MBA), methyl methacrylate ester (MMA), tricyclodecanyl methacrylate, dipentaerythritol hexaacrylate, or any combination of the foregoing. In some embodiments, the photopolymerizable monomer (C) includes dipentaerythritol hexaacrylate (KAYARAD (registered trademark) DPHA; manufactured by Nippon Kayaku Co., Ltd.). In some examples, the photopolymerizable monomer (C) includes dipentaerythritol hexaacrylate.

In some embodiments, the photosensitive resin composition further includes a photopolymerization initiator (D). The photopolymerization initiator (D) used is not particularly limited as long as it can effectively harden the photosensitive resin composition after the lithography process, and one or a combination of various commercially available photoinitiators can be used Use 2 or more.

In some embodiments, the photopolymerization initiator (D) may use a phosphine oxide compound alone. In some other embodiments, the photopolymerization initiator (D) can be selected from one or more triazine (triazine) compounds, one or more acetophenone (acetophenone) compounds, one or more biimidazole compounds, one or more A variety of oxime-based compounds, or a combination of the foregoing. In some other embodiments, the aforementioned triazine-based compounds, acetophenone-based compounds, biimidazole-based compounds, and oxime-based compounds can also be used together with phosphine oxide compounds.

In some embodiments, the phosphine oxide compound includes, for example, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, and the like. The photosensitive resin composition prepared by using a photopolymerization initiator (D) containing a phosphine oxide compound can form a thicker coating film, and can obtain a good white coating due to lower yellowing, especially suitable for (But not limited to) for forming light shielding layers of display devices.

Furthermore, specific examples of the photopolymerization initiator (D) that can be used in combination with the phosphine oxide compound are as follows.

In some embodiments, triazine compounds include, for example: 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis (Trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperonyl-1,3,5- Triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6 -[2-(5-Methyl-furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2 -yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)ethenyl] -1,3,5-triazine, or 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)ethenyl]-1,3,5- Triazines.

In some embodiments, the acetophenone compounds include, for example: diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, benzyl dimethyl ketal, 2- Hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-propan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4-methyl thiophenyl)-2-morpholinyl-propan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butan-1-one, 2- Hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propan-1-one, or 2-(4-methyl-benzyl)-2-(dimethylamino)- 1-(4-Morpholinylphenyl)-butan-1-one.

In some embodiments, the biimidazole-based compounds include, for example: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2 ,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra (Alkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(trialkoxyphenyl)biimidazole, 2,2- Bis(2,6-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, or the phenyl in the 4,4',5,5' positions is Alkoxycarbonyl-substituted imidazole compounds.

Among these exemplified biimidazole compounds, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis (2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2-bis(2,6-dichlorophenyl)-4,4',5, 5'-tetraphenyl-1,2'-biimidazole.

In some embodiments, the oxime-based compound includes, for example, o-ethoxycarbonyl-α-oxoimino-1-phenyl-propan-1-one and the like. Among some examples, O-acyl oxime compounds (trade names: BASF OXE-01 and BASFOXE-02) available from BASF Corporation are representative of commercially available products.

Furthermore, in some embodiments proposed in this disclosure, acetophenone compound (trade name: Tronly PBG-327) and O-acyl oxime compound (trade name: BASF OXE-01) are used as photopolymerization initiators ) as photopolymerization initiator (D).

In addition, other types of photopolymerization initiators generally used in the related art may be additionally used in combination with the above-mentioned photoinitiators as long as the beneficial effects of the embodiments of the present disclosure are not impaired. Furthermore, photoinitiation adjuvant commonly used in the related field may additionally be used in combination with the above-mentioned photopolymerization initiator (D). The photoinitiation assistant is, for example, one or more amine compounds and carboxylic acid compounds.

In some embodiments, the amine compound of the photoinitiation auxiliary agent includes, for example: aliphatic amine compounds, such as triethanolamine, methyldiethanolamine, triisopropanolamine, etc.; and aromatic amine compounds, such as 4-dimethylaminobenzene Methyl formate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, ethyl 2-dimethylaminobenzoate, N,N-Dimethyl-p-toluidine, 4,4'-bis(dimethylamino)benzophenone (known as Michler's ketone), 4,4'-bis(diethylamino) Benzophenone. In addition, the amine compound is preferably an aromatic amine compound.

In some embodiments, the carboxylic acid compound of the photoinitiation aid includes, for example, aromatic heteroacetic acid, such as phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methylethylphenylthio Acetic acid, dimethylphenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, dichlorophenylthioacetic acid, N-phenyl Glycine, Phenoxyacetic Acid, Naphthylthioacetic Acid, N-Naphthylglycine, Naphthyloxyacetic Acid.

The weight percentage of the photopolymerization initiator (D) in the photosensitive resin composition can be determined according to actual application conditions, so that the polymerization reaction can be quickly completed when the photosensitive resin composition is subjected to a lithography process, and the production efficiency can be improved. According to some embodiments, based on the total weight of the photosensitive resin composition, the photopolymerization initiator (D) accounts for about 0.1 wt % to about 5.0 wt % of the photosensitive resin composition.

According to some embodiments of the present disclosure, the organic solvent (E) included in the photosensitive resin composition is a solvent combination. In some embodiments, the solvent system having a boiling point temperature of 150° C. to 230° C. accounts for 1% to 50% by weight of the solvent combination.

In some embodiments, the organic solvent (E) includes, for example, ethylene glycol monoalkyl ether, such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, etc.; Diethylene glycol dialkyl ethers, such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, etc.; ethylene glycol alkyl ether acetic acid Esters, such as methyl cellosolve acetate, ethyl cellosolve acetate, etc.; alkylene glycol alkyl ether acetates, such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, Propylene glycol monopropyl ether acetate, methoxybutyl acetate, methoxypentyl acetate, etc.; aromatic hydrocarbons, such as benzene, toluene, xylene or mesitylene, etc.; ketones, such as methyl ethyl acetate ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, cyclohexanone, etc.; alcohols, such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol or glycerin, etc.; esters Classes, such as ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, etc.; and cyclic esters, such as γ-butyrolactone, etc.

In terms of practicability and drying capacity, organic solvents (E) are preferably, for example, alkylene glycol alkyl ether acetates, ketones or esters, such as ethyl 3-ethoxy propionate or formaldehyde Base 3-methoxypropionate, etc. And the organic solvent (E) is more preferably propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxy propionate or methyl 3-methoxy propionate etc.

Furthermore, in some examples (such as related experiments) proposed in this disclosure, a mixed solvent of propylene glycol methyl ether acetate (Propylene glycol methyl ether acetate; PGMEA; purchased from Shangren Chemical Co., Ltd.) was used as the organic solvent ( E). The chemical formula of propylene glycol monomethyl ether acetate (PGMEA) is as follows.

According to the photosensitive resin composition proposed in the embodiment, the composition and content of the organic solvent (E) can be properly selected according to the actual application, so that the application of a coating machine, such as a knife coater, a slit coater, a spin coater, etc. When the photosensitive resin composition is coated by a cloth machine, an inkjet machine, or a combination of any two of the aforementioned mechanisms, it can have good coating properties.

According to some embodiments of the present disclosure, the photosensitive resin composition may further include a leveling agent. Leveling agent is a commonly used coating additive, which can promote the formation of a flat, smooth and uniform coating film during the drying and film forming process of the coating. Leveling agents comprise pure substances or mixtures which are completely soluble in organic solvents or partially soluble in organic solvents. In some embodiments, the leveling agent includes organosilicon-based surfactants, fluorine-based surfactants, organosilicon-based surfactants with fluorine atoms, or a combination thereof. The aforementioned active agent may have a polymerizable group in a side chain.

In addition, in some embodiments, the photosensitive resin composition may further include an appropriate amount of antioxidant. Antioxidants improve thermal stability by preventing oxidation of the photosensitive resin composition. Antioxidants include: primary antioxidants, which prevent oxidation by directly participating in oxidation; secondary antioxidants, which are used to prevent excessive consumption of primary antioxidants; and mixtures thereof.

In addition, in some embodiments, the photosensitive resin composition may further include an appropriate amount of other additives, such as other polymer compounds, curing agents, tackifiers, UV absorbers, etc., according to application requirements.

In order to make the above and other purposes, features, and advantages of this disclosure more obvious and easy to understand, the relevant experiments are carried out below, and the content and results of some experiments on the blue photosensitive resin composition are listed in the text for illustration. . Include the blue photosensitive resin compositions of several comparative examples and embodiments with different components and/or proportioning in the experimental content listed, and carry out chromaticity measurement to the photosensitive resin composition in these examples, and Analyze changes in gamut size.

Furthermore, in related experiments, the full-film color chips made of the photosensitive resin compositions of the comparative examples and the examples were measured with a colorimeter (Otsuka TLCF-110SF), and the calculation was performed on National Television in the United States. The color gamut size changes under the National Television System Committee (NTSC) Color Gamut specification.

In related experiments, the preparation methods of the first resin, the second resin and/or the third resin selected for the photosensitive resin compositions in the comparative examples and examples are described as follows. In the subsequent description of the composition and analysis and detection results of each comparative example and embodiment, it will not be repeated.

＜First Resin＞

The first resin used in the experiment was self-synthesized. Please refer to the following Preparation Example 1 for its synthesis method.

[Preparation Example 1]

After placing 213.6 g of propylene glycol monomethyl ether acetate in a flask equipped with a stirring device, a dropping funnel, a condenser, a thermometer, and a gas introduction tube, the mixture was stirred while being replaced with nitrogen, and the temperature was raised to 90° C. Then, the methyl methacrylate of 20.0g (0.20 mol), the tricyclodecanyl methacrylate of 88.0g (0.40 mol) and the methacrylic acid of 34.4g (0.4 mol) Add 4.0 g of t-butylperoxy-2-ethylhexanoate to the resulting monomer mixture, and drop it into the aforementioned flask from the dropping funnel. After completion of the dropping, the copolymerization reaction was carried out by stirring at 95° C. for 3 hours to produce a copolymer.

Then, after replacing the aforementioned flask with air, add 42.6 g (0.3 mol) of epoxypropyl methacrylate, 0.6 g of triphenylphosphine (catalyst) and 0.6 g of hydroquinone (polymerization inhibitor) ), carry out 6 hours ring-opening addition reaction at 120 ℃, manufacture copolymer. Next, 221.3 g of propylene glycol monomethyl ether was added to this reaction solution to obtain a copolymer solution with a solid content concentration of 30% by mass (solid content acid value: 30 mgKOH/g, weight average molecular weight: 37,100).

The copolymer (first resin) produced in Preparation Example 1 has a structural unit of the following formula (II).

Formula (II)

＜Second resin＞

The second resin used in the experiment was self-synthesized. Please refer to the following Preparation Examples 2-1 and 2-2 for its synthesis method. In some embodiments, the resin in Preparation Example 2-1 (abbreviated as B2-1 resin) and the resin in Preparation Example 2-2 (abbreviated as B2-2 resin) can be selected or used in combination.

[Preparation Example 2-1]

In a flask equipped with a reflux condenser, a dropping funnel, and a stirrer, an appropriate amount of nitrogen gas was flowed to form a nitrogen atmosphere, and 100 parts of propylene glycol monomethyl ether acetate was put in, and while stirring, the mixture was heated to 85°C. Next, 19 parts of methacrylic acid (for forming the structural unit on the left side of the following formula (III-1)), 3,4-epoxytricyclic acrylic acid, and 3,4-epoxytricyclo A mixture of [5.2.1.02,6]decane-8-yl ester and 3,4-epoxytricyclo[5.2.1.02,6]decane-9-yl ester (the molar ratio is 50 : 50) (trade name "E-DCPA", manufactured by Daicel Co., Ltd.) 171 parts dissolved in 40 parts of propylene glycol monomethyl ether acetate.

On the other hand, 26 parts of a polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) dissolved in propylene glycol monohydrate was dropped into the flask over about 5 hours using another dripping pump. A solution made of 120 parts of methyl ether acetate. After the dripping of the polymerization initiator is completed, keep the same temperature for about 3 hours, and then cool to room temperature to obtain a copolymer solution with a solid content of 43.5% (resin B2-1, having the following formula (III-1 ) of the constituent units). The obtained resin B2-1 had a weight average molecular weight (Mw) of 8000, a molecular weight distribution (Mw/Mn) of 1.98, and an acid value of 53 mg-KOH/g in terms of solid content.

式(III-1) The constituent units of resin B2-1 are represented by the following formula (III-1).

Formula (III-1)

[Preparation Example 2-2]

In the flask equipped with a reflux condenser, a dropping funnel, and a stirrer, a nitrogen atmosphere was replaced, and 280 parts of propylene glycol monomethyl ether acetate were added, and heated to 80° C. while stirring. Next, 38 parts of acrylate, 3,4-epoxytricyclo[5.2.1.02,6]decane-8-yl acrylate and 3,4-epoxytricyclo[5.2.1.02]6)decane-9- A mixture of acrylate acrylate (the content ratio is 1:1 by molar ratio) was added dropwise to a mixed solution of 289 parts and 125 parts of propylene glycol monomethyl ether acetate over 5 hours.

On the other hand, a solution in which 33 parts of 2,2-azobis(2,4-dimethylvaleronitrile) was dissolved in 235 parts of propylene glycol monomethyl ether acetate was dropped over 6 hours. After the dropwise addition, the mixture was kept at 80°C for 4 hours, then cooled to room temperature to obtain a copolymer solution of 35.1% solid content, a viscosity of 125mPas measured by a B-type viscometer (23°C) (i.e. resin B2-2 , having a constituent unit of the following formula (III)). The weight average molecular weight (Mw) of the obtained copolymer was 9.2×10 ³ , the molecular weight distribution (Mw/Mn) was 2.08, and the acid value (solid content conversion value) was 77 mgKOH/g.

式(III) For the constituent units of resin B2-2, refer to formula (III).

Formula (III)

＜Third Resin＞

The third resin used in the experiment was self-synthesized. Please refer to the following Preparation Example 3 for its synthesis method. The third resin is a semiconductor material that can increase the blue color saturation proposed by some embodiments.

[Preparation Example 3]

Add 0.15 mg of monomer 2,5-dibromo-3,4-ethylenedioxythiophene (2,5-Dibromo-3,4-ethylenedioxythiophene; DBEDOT) to 0.3 ml of methanol solution and stir well. Afterwards, 0.2 g of polystyrene sulfonate (Polystyrene sulfonate; PSS) was added and stirred evenly. Next, polymerize on a heating plate at 120°C for 20 minutes. After completion, the polymerized poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate (Poly(3,4-ethylenedioxythiophene) -Polystyrene sulfonate; can be expressed as "PEDOT:PSS" or "PEDOT/PSS") was dissolved in pure water, and methanol was added to stir and filtered. Then, the filtered product is baked in a vacuum oven at 45° C. to obtain the material of the third resin.

Coating the material of the third resin on the glass substrate by spin coating. Then, after heating at 120°C for 20 minutes, a film with a film thickness of 1.8 microns (um) can be obtained, and then measured with a UV-Vis spectrometer (model; SHIMADZU UV-3600i PLUS), the material can be obtained in When the wavelength is 200nm~400nm, its absorption value is 0.05~0.18; when the wavelength is 400nm~500nm, its absorption value is 0.16~0.25; when the wavelength is 500nm~600nm, the absorption value is 0.23~0.32; ~0.35, the absorption value is 0.33~0.48 when the wavelength is 700nm~900nm. The material used in this experiment is polystyrene sulfonate (trade name: TF-67A02; manufactured by Taiwan Fluoro Technology).

The constituent unit of the third resin such as poly(3,4-ethylenedioxythiophene)-polystyrenesulfonate (PEDOT:PSS) is represented by the following formula (I).

式(I)

Formula (I)

<Other components of the photosensitive resin composition>

In the photosensitive resin compositions of Comparative Examples and Examples proposed in the following experiments, the components used except for the resin composition (B) are arranged as follows. Refer to Table 1.

光聚合起始劑 苯乙酮化合物(商品名：Tronly PBG-327)和O-醯基肟化合物(商品名：BASF OXE-01；購自巴斯夫(BASF)公司) 流平劑 聚醚改性矽油(Toray Silicone SH8400；東麗道康寧(股)製造) 有機溶劑 丙二醇單甲基醚乙酸酯(Propylene glycol methyl ether acetate，PGMEA)之混和溶劑(購自上仁化工有限公司)

Table 1 constitute compound blue colorant Use a mixture of CI Pigment Blue 15:6 and xanthanone dyes photopolymerizable monomer Dipentaerythritol hexaacrylate (Dipentaerythritol hexaacrylate, DPHA) (registered trademark KAYARAD); purchased from Nippon Kayaku Co., Ltd.

Photopolymerization initiator Acetophenone compound (trade name: Tronly PBG-327) and O-acyl oxime compound (trade name: BASF OXE-01; purchased from BASF (BASF) company) leveling agent Polyether-modified silicone oil (Toray Silicone SH8400; manufactured by Toray Dow Corning Co., Ltd.) Organic solvents Propylene glycol methyl ether acetate (Propylene glycol methyl ether acetate, PGMEA) mixed solvent (purchased from Shangren Chemical Co., Ltd.)

When carrying out relevant experiments, the raw materials proposed in the comparative examples and examples were synthesized into a photosensitive resin and then coated on a glass substrate. For example, the coating thickness may be in the range of 1 micrometer (um) to 4 micrometers (um). Then, after standing still, exposing and baking at a temperature of 200° C. to 250° C. for 20 minutes to 25 minutes, a test piece sample of the full-film color chip can be obtained. Then, use a color measuring machine (Otsuka TLCF-110SF) to measure the color, match the measured blue color point with the color point of the fixed red photosensitive resin and the fixed color point of the green photosensitive resin. Calculate the change in color gamut under NTSC standard of the semiconductor material with the blue color added in the embodiment relative to the photosensitive resin composition containing only the blue pigment and dye.

Table 2 lists the components used in Comparative Examples 1 to 3 and Examples 1 to 5 of the blue photosensitive resin composition and their weight percentages (wt %), wherein the total weight of the blue photosensitive resin composition is Let it be 100 weight%. Furthermore, the experimental film thickness of the test piece samples of these examples is 2.0 microns (um).

Table 2 also lists the color gamut or/and color gamut size change (∆NTSC, %) of the blue photosensitive resin compositions of the comparative examples and examples under the NTSC standard. In these experiments, the measured blue color point is matched with the color point of the fixed red photosensitive resin (for example, Rx=0.68, Ry=0.32) and the fixed color point of the green photosensitive resin (for example, Gx= 0.265, Gy=0.69), to calculate the color gamut size change of the blue photosensitive resin composition of the embodiment under the NTSC standard.

In Table 2, the blue photosensitive resin composition of Comparative Example 1 has a 100% NTSC color gamut (ie, expressed as ∆NTSC value by 100%). And the NTSC value of the blue photosensitive resin composition of each embodiment is divided by the NTSC value (expressed in %) of Comparative Example 1, as the color gamut size change of the composition under the NTSC standard (expressed as ∆NTSC, % ). And according to the obtained results, evaluations are given for the blue photosensitive resin compositions of each example, as shown in Table 2.

The color gamut size change (∆NTSC, %) is evaluated as follows:

The case where ∆NTSC is less than or equal to 100% is evaluated as X, that is, compared with the NTSC color gamut of Comparative Example 1, the NTSC color gamut of this example becomes smaller or the color gamut is equivalent, indicating that this example cannot produce more Wide NTSC color gamut;

When ∆NTSC is greater than 100% and less than 103%, it is evaluated as △, that is, compared with the NTSC color gamut of Comparative Example 1, the NTSC color gamut of this example has been improved, resulting in an acceptable widening range of NTSC color gamut; and

When ∆NTSC is greater than 103%, it is evaluated as "O", that is, compared with the NTSC color gamut of Comparative Example 1, the NTSC color gamut of this example becomes wider, and a valuable color gamut improvement has been produced.

Table 2 percentage Comparative example 1 Comparative example 2 Comparative example 3 Example 1 Example 2 Example 3 Example 4 Example 5 blue paint 12.4 dye 10 first resin 16.9 6.8 14.9 11.9 11.9 4.3 second resin 16.9 10.1 11.9 7.6 third resin 2.0 5.0 10.0 5.0 5.0 photopolymerizable monomer 4.2 Photopolymerization initiator 2.09 leveling agent 0.01 Organic solvents 54.4 NTSC (%) 72.0 72.3 72.1 73.6 74.9 75.6 75.3 75.1 ∆NTSC (%) 100 100 100 102 105 105 105 104 Evaluation x x x △ o o o o

As shown in Table 2, the ratio of the total weight of the resin contained in the resin composition (B) of the comparative example and the example to the total weight of the photosensitive resin composition is the same. In Examples 1 to 3, the resin composition (B) includes the first resin and the third resin (i.e. blue semiconductor material), wherein the third resin accounts for 2 wt of the total weight of the photosensitive resin composition %, 5 wt%, 10 wt%. According to the results in Table 2, the third resin (i.e. blue semiconductor material) is 2 wt% of the total weight of the photosensitive resin composition, and the composition has an NTSC color gamut of 102%. Although the photosensitive resin composition of Example 1 did not achieve the valuable color gamut improvement set value of 103%, compared with the comparative example, the addition of the third resin (i.e. blue semiconductor material) did change the NTSC color gamut. wide. When the third resin (i.e. blue semiconductor material) is present at 5% and 10% by weight of the total weight of the photosensitive resin composition, the composition has an NTSC color gamut of 105%.

Furthermore, in the photosensitive resin composition of Example 4, the resin composition (B) contains the second resin and the third resin, wherein the third resin accounts for 5 wt% of the total weight of the photosensitive resin composition, and the The composition also has an NTSC color gamut of 105%. In the photosensitive resin composition of Example 5, the resin composition (B) comprises the first resin, the second resin and the third resin, wherein the third resin accounts for 5 wt% of the total weight of the photosensitive resin composition, This composition also has an NTSC color gamut of 104% (over 103%), yielding a valuable color gamut improvement.

Furthermore, in Examples 2, 4, and 5, the third resin (i.e. blue semiconductor material) accounts for about 29% by weight (i.e. 5/16.9*100%) of the total weight of the resin composition (B). In Example 3, the third resin (i.e. blue semiconductor material) accounts for about 59% by weight (i.e. 10/16.9*100%) of the total weight of the resin composition (B). Certainly, these ratio values calculated according to the results in Table 2 are for illustrative purposes only, and are not intended to limit the range of the addition ratio of the semiconductor material in the resin composition (B) of the embodiment of the present disclosure.

In addition, in Examples 2, 4, and 5, the third resin (i.e. blue semiconductor material) accounts for about 22% by weight (i.e. 5/22.4*100%) of the total weight of the colorant (A). In Example 3, the third resin (i.e. blue semiconductor material) accounts for about 45% by weight (i.e. 10/22.4*100%) of the total weight of the colorant (A). Certainly, these ratio values calculated according to the results in Table 2 are for illustrative purposes only, and are not intended to limit the range of the addition ratio of the semiconductor material of the same color system as the colorant relative to the colorant (A) in the embodiment of the present disclosure.

Therefore, according to the experiments proposed in some embodiments of the present disclosure, in a photosensitive resin composition of a single color (such as blue), the resin composition (B) and the colorant (A) containing the semiconductor material of the embodiment are used. ), the photopolymerizable monomer (C), the photopolymerization initiator (D) and the organic solvent (E) can have an NTSC color gamut of more than 103%, resulting in valuable color gamut improvement. Moreover, in some other embodiments, other colors can also be similarly improved, and a display device using a photoresist layer comprising these photosensitive resin compositions can also achieve an improvement of NTSC color gamut of more than 105%. .

In summary, the embodiments of the present disclosure provide a photosensitive resin composition, and a color filter and a display device using the photosensitive resin composition. The photosensitive resin composition proposed in the embodiment includes a resin composition, the resin composition includes a semiconductor material with conductivity, and the color of the semiconductor material is the same color as the colorant in the photosensitive resin composition system to enhance the overall color saturation of the photosensitive resin composition. According to the results of related experiments mentioned above, compared with the comparative example, adding the semiconductor material of the same color system as the colorant in the embodiment can increase the NTSC color gamut. The photosensitive resin composition disclosed in the present disclosure can be applied on a substrate of a display device, and subjected to an optical lithography process to form at least one light-transmitting layer or a light-shielding and reflecting layer. When the photosensitive resin composition of the embodiment is applied on the substrate of the display device, the coating film state of the composition on the substrate and the color saturation after the lithography process can be further enhanced, so that the display device can achieve a wide color gamut color effect.

Although the present invention has been disclosed above with several preferred embodiments, it is not intended to limit the present invention, and anyone with ordinary knowledge in the technical field may make any changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

none.

none.

Claims (11)

A photosensitive resin composition comprising: a coloring agent (A) containing at least one pigment, a resin composition (B), a photopolymerizable monomer (C), a photopolymerization initiator (D) and an organic solvent (E), Wherein the resin composition (B) comprises: a semiconductor material having conductivity, and the color of the semiconductor material is the same color system as that of the colorant (A), wherein the semiconductor material occupies The range of 5% to 10% by weight of the total weight of the photosensitive resin composition; and the first resin having the structural unit represented by formula (II), or the first resin having the structural unit represented by formula (III) Two resins, or a mixture of the aforementioned first resin and the aforementioned second resin,

The photosensitive resin composition according to claim 1, wherein the colorant (A) contains at least one blue pigment, or contains one or more dyes mixed with the at least one blue pigment, wherein the semiconductor The material is a blue polymer. The photosensitive resin composition according to claim 1, wherein the semiconductor material includes a conductive polymer. The photosensitive resin composition as described in claim 1, wherein a thin film made of the semiconductor material is measured with a UV-vis spectrometer, and its absorption value is 0.05~0.18 at a wavelength of 200nm~400nm, and at a wavelength of 200nm~400nm. The absorption value is 0.16~0.25 at 400nm~500nm, 0.23~0.32 at the wavelength of 500nm~600nm, 0.28~0.35 at the wavelength of 600nm~700nm, and 0.33 at the wavelength of 700nm~900nm ~0.48. The photosensitive resin composition as claimed in item 1, wherein the semiconductor material comprises poly(3,4-ethylenedioxythiophene)-polystyrene sulfonate (Poly(3,4-ethylenedioxythiophene)-Polystyrene sulfonate ; PEDOT:PSS), its constituent unit is as shown in formula (I),

The photosensitive resin composition as described in Claim 5, wherein the resin composition (B) further comprises other resin materials mixed with the semiconductor material, and the semiconducting The conductive material accounts for the range of 29% by weight to 59% by weight of the total weight of the resin composition (B). The photosensitive resin composition as described in Claim 6, wherein the other resins except the semiconductor material in the resin composition (B) are combined with the colorant (A) and the photopolymerizable monomer (C), a standard composition formed by the photopolymerization initiator (D) and the organic solvent (E) has 100% National Television System Committee (National Television System Committee; NTSC) color gamut (Color Gamut ), the resin composition (B) comprising the semiconductor material, the colorant (A), the photopolymerizable monomer (C), the photopolymerization initiator (D) and the organic Solvent (E) forms a composition with greater than 100% NTSC color gamut. The photosensitive resin composition according to claim 1, wherein the semiconductor material accounts for the range of 22% to 45% by weight of the total weight of the colorant (A). The photosensitive resin composition as described in Claim 1, wherein said colorant (A) further comprises xanthanone dye; and/or wherein said photopolymerization initiator (D) comprises one or more oximes (oxime ) series compounds, one or more acetophenone series compounds, or a combination of the foregoing; and/or wherein the organic solvent (E) is a combination of solvents, wherein the solvent system has a boiling point temperature of 150°C to 230°C Accounting for 1% by weight to 50% by weight of the solvent combination. A color filter formed of the photosensitive resin composition as described in any one of Claims 1-9. A display device comprising at least one light-transmitting layer or a light-shielding layer and a reflection layer, wherein the light transmission layer or the light shielding and reflection layer is formed by applying the photosensitive resin composition as described in any one of Claims 1 to 9 on a substrate and curing it.