TWI779668B - Heat dissipation net of a thermostatic plate - Google Patents

Abstract

A heat dissipation net of a thermostatic plate takes an advantage of a conduction portion formed on the heat dissipation net which has a plurality of holes. The conduction portion is formed by a plurality of recessed areas and protruding areas. A curved surface is formed on the holes and located at the recessed area and the protruding area to thereby improve a capillary action of the heat dissipation net during a heat dissipation process effectively. When the heat dissipation net is disposed on the base, a space is formed between each protruding area and the base. Thus, a working fluid material filled in the thermostatic plate is vapored after absorbing heat energy of a heat source and conducted quickly through the capillary action of the conduction portion to thereby increase the heat dissipation efficiency.

Description

Heat dissipation net on the uniform temperature plate

The invention relates to a design of a vapor chamber, in particular to a heat dissipation net on the vapor chamber that can quickly solve the problem of heat dissipation.

In recent years, the development of electronic products has become more and more popular, especially the functions of electronic components are also increasing and changing, and they are gradually developing in the direction of high speed and light weight. The requirements of high speed, high frequency and miniaturization make electronic products Components are smaller in size and have more powerful functions, and their computing performance requirements are relatively higher and higher. Relatively, the heat generation and convection current of these electronic components are also higher and higher. increase, which leads to higher and higher heating density of electronic components. However, when the overall appearance of the electronic product is also towards a thin, light and short design, the limited space for the installation of these electronic components is also extremely compressed, and When the computing performance of the electronic components is in operation, if the heat cannot be dissipated effectively, the electronic components will be damaged due to overheating, so that the predetermined working performance cannot be achieved, and there is room for improvement.

In view of this, there is an industry to develop a vapor chamber. Referring to Fig. 1 and Fig. 2, the conventional vapor chamber 1 includes a base plate 11, a heat dissipation net 12 arranged on the base plate 11, and a cooling net 12 arranged on the base plate 11. And the cooling net 12 is surrounded by a cover 13 (shown by a phantom line in the figure), and a working fluid 14 between the cover 13 and the base plate 11; wherein, the base plate 11 and the cover cover When 13 is connected, there is an accommodating area a just enough for the cooling net 12 to be placed between the two, and the bottom plate 11 and the cover 13 combine the cooling net 12 to the accommodation area by means of heat compression Inner a; In addition, the heat dissipation net 12 is interwoven with a plurality of metal wires 121 in an orderly manner to form a plurality of pores 122, and the heat dissipation net 12 will be cut according to the position where it is installed and the shape of the vapor chamber 1; When the vapor chamber 1 is placed in surface contact with an electronic component (not shown in the figure) that generates high heat for heated contact, the working fluid 14 contained in it will absorb heat and carry out gas flow. The conduction movement of heat transfer can delay the movement of the pores 122 from high temperature to low temperature to dissipate heat, so that the electronic components can effectively maintain normal operation.

However, after use, it was found that in view of the fact that the heat dissipation net 12 is formed by weaving the metal wires 121 in a warp and weft manner, when the heat dissipation net 12 is fixed on the bottom plate 11 by hot pressing, the The metal wires 121 of the heat dissipation net 123 are easily deformed during the heat-pressing process, and even partially stick to the base plate 11, resulting in unclear or obstructed heat dissipation guide paths, and the heat dissipation net 12 and the base plate 11 This combination will affect heat dissipation. After all, the working fluid 14 absorbs the heat energy of the heat source and vaporizes quickly. The gasified working fluid 14 moves to the low temperature and conducts heat outwards only by the capillary action of the heat dissipation net. However, in the process of heat conduction, it is easily affected by the deformation of the cooling net, resulting in the inability to conduct the heat quickly, which needs to be improved.

Therefore, the object of the present invention is to provide a heat dissipation net disposed on the vapor chamber, which can conduct heat outward quickly to improve heat dissipation efficiency.

Therefore, the heat dissipation net on the uniform temperature plate of the present invention mainly lies in the fact that the heat dissipation net is provided with a conduction portion, the conduction portion has a recessed area and a protruding area, and a gap is formed between the protruding area and the bottom plate. micro-gap, and the pores located at the recessed area and the protruding area are twisted due to the setting of the recessed area and the protruding area; The coordinated setting of the out area is beneficial to increase the micro-gap space between the combination of the cooling net and the bottom plate and the cover, and there will be no excessive close fit. The curved surface shape formed by the setting of the protruding area effectively enables the working fluid to quickly switch the outlet path when performing heat dissipation and guiding work, so that the heat removal path cannot be blocked, and the heat dissipation speed can be effectively increased, and further Through the arrangement of the conduction part, sufficient heat dissipation guide space is effectively provided between the bottom plate and the cover, which not only effectively reduces the backflow resistance and the cohesion of the working fluid, but also avoids the heat dissipation space and the outward export path of the working fluid. It is blocked to solve the problem of poor heat dissipation at high temperature, and can more effectively maintain the best heat dissipation effect.

The aforementioned and other technical contents, features and effects of the present invention will be clearly understood in the following detailed description of preferred embodiments with reference to the drawings.

Referring to Fig. 3, a preferred embodiment of the present invention, the vapor chamber 3 of this embodiment includes a bottom plate 31, a cooling net 32 that is arranged on the bottom plate 31 and is interwoven by a plurality of metal wires 320 to form a plurality of pores 321, A cover 33 (shown by a phantom line in the figure) that is located on the base plate 31 and encloses the cooling net 32, and a working fluid 34 between the cover cover 33 and the base plate 31; wherein, the When the bottom plate 31 is connected with the cover 33 , a receiving area b just enough for the cooling net 31 is formed, and the bottom plate 31 and the cover 33 are connected to form a vacuum state.

Continuing from the above, a conduction portion 322 is formed on the cooling net 32, and the conduction portion 322 has a recessed area 323 and a protruding area 324, and the recessed area 323 and the protruding area 324 are arranged in a rhombus pattern (please refer to FIG. Refer to Appendix 1), and there is a micro-gap c space between the protruding area 324 and the bottom plate 31, without forming an excessively close fit with the bottom plate 31, and making the cooling net 32 because of the recessed area 323 and the protruding area 324, the overall shape of the height difference is formed (that is, as shown in the cross-sectional view of Figure 4), and moreover the recessed area 323 and the protruding area 324 are located The pores 321 are curved in view of the recessed area 323 and the protruding area 324, and the conduction portion 322 can form multiple non-overlapping arrangements on the cooling net 32 (as shown in FIG. 5 ), Of course, the conduction portion 322 can be arranged in different configurations as shown in FIG. 6 and FIG. According to the key requirements of the heat dissipation network 32, different positions are planned and set to meet different high-temperature heat removal requirements, and the heat dissipation network 32 can be appropriately cut according to the different shapes of the temperature chamber 31, especially Yes, in this embodiment, the metal wire 320 is set with a wire with high thermal conductivity, and at the same time, the heat dissipation net 32 needs to be bonded to the accommodating area b between the bottom plate 31 and the cover 33 by hot pressing In view of the uneven temperature of the hot pressing mold (not shown in the figure), the design of the heat dissipation net 32 formed on the concave area 323 and the protruding area 324 during the bonding process can be Make the heat dissipation net 32 form a recovery effect of rebound rigidity when it bears the gravity of the hot pressure, so as to properly block the pressure gravity generated by the hot pressing mold, so that the metal wires of the heat dissipation net 32 will not be produced during the hot pressing process. Excessive deformation and sticking on the base plate 31 will occur.

Referring to Fig. 2 to Fig. 3, at first this temperature chamber 3 is arranged on the electronic component (not shown in the figure), promptly this bottom plate 31 is arranged on the place that easily generates a large amount of heat with surface contact mode, then when this electronic component is activated When in use, the electronic components will generate a large amount of high-temperature heat during continuous operation. At this time, the working fluid 34 contained in the vapor chamber 3 will form a vaporized state due to heating after contacting the high-temperature heat , and then begin to use the heat dissipation net 32 to carry out the derivation and movement of high-temperature heat, and then the working fluid 34 will move from the high-temperature place to the low-temperature place, and center on the pore 321 where it is currently, so as to facilitate the generation of gasification The efficient directional way of the working fluid quickly guides the high-temperature heat to the low-temperature place to exchange heat with the outside, and then passes through the pores 321 at the conduction part 322 due to the recessed area 323 and the protrusion. The setting of the area 324 forms a curved surface pattern, which can effectively improve the capillary phenomenon of the heat dissipation process of the heat dissipation net 32, and the space design with a micro gap c between the heat dissipation net 31 and the bottom plate 31, so as to guide the heat dissipation path on the heat dissipation net 32 In addition to being expanded, the heat dissipation space will not be compressed but sufficient, and the outward guiding path of the working fluid 34 will not be blocked, effectively greatly improving the capillary phenomenon of the heat dissipation process of the heat dissipation net 32 , and then condense into a liquid state and reflow, so that the cycle of work can not only prevent the working fluid 34 that absorbs high-temperature heat from being excessively polymerized in situ, so as to avoid the agglomeration of high-temperature heat, but also export high-temperature heat to the outside. It can also effectively accelerate the return of the working fluid 34 at the low temperature to the high temperature for derivation and diffusion, so as to avoid the problem that the electronic components cannot operate normally due to local overheating, and effectively improve the heat dissipation effect.

To sum up the above, the heat dissipation net installed on the uniform temperature plate of the present invention is designed with a conduction part on the multi-pore of the heat dissipation net, and the recessed area of the conduction part and the protrusion area are used to form a curved surface on the pores. In this way, the heat dissipation space between the cooling net and the bottom plate of the chamber will not be compressed but is sufficient, and the outward guiding path will not be blocked, so when the inside of the chamber When the working fluid conducts heat dissipation and guiding work, it can not only prevent the excessive polymerization of the working fluid that absorbs high-temperature heat in the original place, but also effectively improve the capillary phenomenon of the heat dissipation process of the heat dissipation network, and can effectively increase the heat energy of the working fluid absorbed by the heat source. The speed of heat dissipation exchange is accelerated, and the working fluid flowing to the low temperature is accelerated and then returned to the high temperature for derivation and diffusion, so as to avoid the problem of excessive local temperature and effectively improve the heat dissipation effect.

But the above is only to illustrate the preferred embodiments of the present invention, and should not limit the scope of the present invention, that is, all the simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the description of the invention , should still fall within the scope covered by the patent of the present invention.

(knowledge) 1: vapor chamber 11: Bottom plate 12: cooling net 13: cover 14: Working fluid 121: metal wire 122: porosity a: containment area (this invention) 3: vapor chamber 31: Bottom plate 32: cooling net 33: cover 34: working fluid 320: metal wire 321: porosity 322: Conduction Department 323: Depressed area 324: protruding area b: containment area c: micro gap

Figure 1 is a schematic diagram of a conventional temperature chamber. Fig. 2 is a schematic cross-sectional view of A-A of a conventional temperature chamber. Fig. 3 is a schematic diagram of the connection between the vapor chamber and the heat dissipation structure in a preferred embodiment of the present invention. Fig. 4 is a B-B sectional schematic view of the preferred embodiment in Fig. 3 . Fig. 5 is a schematic diagram of another implementation of the heat dissipation network of the preferred embodiment. Fig. 6 is a schematic diagram of yet another implementation of the cooling net of the preferred embodiment. Fig. 7 is a schematic cross-sectional view of C-C of the preferred embodiment in Fig. 6 . Attachment 1 is a partial structural diagram of the forming of the conduction part of the heat dissipation net of the present invention.

(this invention)

3: vapor chamber

31: Bottom plate

32: cooling net

33: cover

320: metal wire

321: porosity

322: Conduction Department

323: Depressed area

324: protruding area

Claims (3)

A heat dissipation net arranged on a temperature chamber, the heat chamber comprises a base plate, a heat dissipation net disposed on the base plate, a cover disposed on the base plate and enclosing the heat dissipation net, and A working fluid between the cover and the bottom plate, wherein the heat dissipation net is interwoven with a plurality of metal wires to form a plurality of pores; it is characterized in that: a conduction part is formed on the heat dissipation net, and the conduction part has a concave area and a protruding area The settings, and a micro-gap is formed between the protruding area and the bottom plate, so that the overall shape of the cooling net is formed with a height difference, and the pores located at the concave area and the protruding area are due to the concave area and the protruding area. The area is arranged to form a curved surface, so that when the heat dissipation net is combined between the bottom plate and the cover by thermal compression, the concave area and the convex area are formed on the heat dissipation net, so that the heat dissipation net can be formed. The heat dissipation net forms a rebound rigid recovery function when it bears the gravity of the hot pressure, so as to properly block the pressure gravity generated by the hot pressing mold, so that the metal wire of the heat dissipation net will not be excessively deformed during the hot pressing process and stick to it. On the bottom plate, the outward guiding path of the working fluid will not be blocked. According to claim 1, the heat dissipation net arranged on the uniform temperature plate, wherein, the conduction part can be arranged in multiple lanes. According to the heat dissipation net provided on the vapor chamber according to Claim 1, wherein, the concave area of the conduction part and the convex area are arranged in a rhombic shape.

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