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TWI778398B - Keyswitch device - Google Patents

Keyswitch device Download PDF

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Publication number
TWI778398B
TWI778398B TW109127432A TW109127432A TWI778398B TW I778398 B TWI778398 B TW I778398B TW 109127432 A TW109127432 A TW 109127432A TW 109127432 A TW109127432 A TW 109127432A TW I778398 B TWI778398 B TW I778398B
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Taiwan
Prior art keywords
hole
keyboard
braided layer
heat dissipation
light guide
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TW109127432A
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Chinese (zh)
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TW202207259A (en
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謝朝進
張文瀚
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群光電子股份有限公司
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Priority to TW109127432A priority Critical patent/TWI778398B/en
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Publication of TWI778398B publication Critical patent/TWI778398B/en

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Abstract

A keyswitch device includes a base plate, a plurality of keyswitch assemblies, a backlight module, and a woven fiber layer. The keyswitch assemblies are disposed on the base plate. The backlight module is disposed under the base plate and has a heat-dissipating channel passing through the backlight module. The backlight module includes a light guide plate. The woven fiber layer is located between the base plate and the light guide plate and blocks the heat-dissipating channel.

Description

鍵盤keyboard

本發明是有關於一種鍵盤。The present invention relates to a keyboard.

近年來,筆記型電腦隨著輕、薄等設計潮流不斷演進,機體內的散熱就成為其中一個主要議題。在鍵盤部分,背光模組漸漸成為標準配備之一。In recent years, notebook computers have continued to evolve with design trends such as lightness and thinness, and heat dissipation in the body has become one of the main issues. In the keyboard part, the backlight module has gradually become one of the standard equipment.

然而,若為了散熱而在背光模組上設計散熱孔,恐會產生漏光問題。因此,如何提出一種可解決上述問題的鍵盤,是目前業界亟欲投入研發資源解決的問題之一。However, if heat dissipation holes are designed on the backlight module for heat dissipation, there may be a problem of light leakage. Therefore, how to propose a keyboard that can solve the above-mentioned problems is one of the problems that the industry is eager to invest in research and development resources to solve.

有鑑於此,本發明之一目的在於提出一種可有解決上述問題的鍵盤。In view of this, one objective of the present invention is to provide a keyboard that can solve the above problems.

為了達到上述目的,依據本發明之一實施方式,一種鍵盤包含底板、複數個按鍵組件、背光模組以及纖維編織層。按鍵組件設置於底板上。背光模組設置於底板下,並具有貫穿背光模組之散熱通道。背光模組包含導光板纖維編織層位於底板與導光板之間,並遮擋散熱通道。In order to achieve the above object, according to an embodiment of the present invention, a keyboard includes a bottom plate, a plurality of key assemblies, a backlight module and a fiber braided layer. The button assembly is arranged on the bottom plate. The backlight module is arranged under the bottom plate and has a heat dissipation channel running through the backlight module. The backlight module comprises a light guide plate fiber braided layer located between the bottom plate and the light guide plate, and blocks the heat dissipation channel.

於本發明的一或多個實施方式中,纖維編織層覆蓋且接觸導光板面對底板的一側。In one or more embodiments of the present invention, the fiber braided layer covers and contacts the side of the light guide plate facing the bottom plate.

於本發明的一或多個實施方式中,導光板具有第一通孔。背光模組進一步包含反射片。反射片設置於導光板遠離底板的一側,並具有與第一通孔連通之第二通孔。散熱通道至少由第一通孔與第二通孔構成。In one or more embodiments of the present invention, the light guide plate has a first through hole. The backlight module further includes a reflection sheet. The reflection sheet is arranged on the side of the light guide plate away from the bottom plate, and has a second through hole communicated with the first through hole. The heat dissipation channel is composed of at least a first through hole and a second through hole.

於本發明的一或多個實施方式中,背光模組進一步包含遮光片。遮光片設置於導光板遠離反射片的一側,並具有與第一通孔及第二通孔連通之第三通孔。散熱通道進一步由第三通孔構成。In one or more embodiments of the present invention, the backlight module further includes a light shielding sheet. The light shielding sheet is arranged on the side of the light guide plate away from the reflection sheet, and has a third through hole communicating with the first through hole and the second through hole. The heat dissipation channel is further constituted by a third through hole.

於本發明的一或多個實施方式中,纖維編織層覆蓋且接觸遮光片遠離導光板的一側。In one or more embodiments of the present invention, the fiber braided layer covers and contacts a side of the light shielding sheet away from the light guide plate.

於本發明的一或多個實施方式中,纖維編織層疊合於導光板與遮光片之間。In one or more embodiments of the present invention, the fiber braided layer is laminated between the light guide plate and the light shielding sheet.

於本發明的一或多個實施方式中,纖維編織層包含凹陷部。凹陷部係位於散熱通道內,並覆蓋第一通孔的內壁。In one or more embodiments of the present invention, the fiber braid includes depressions. The concave portion is located in the heat dissipation channel and covers the inner wall of the first through hole.

於本發明的一或多個實施方式中,凹陷部完全覆蓋且接觸第一通孔的內壁。In one or more embodiments of the present invention, the recessed portion completely covers and contacts the inner wall of the first through hole.

於本發明的一或多個實施方式中,纖維編織層包含凹陷部。凹陷部係位於散熱通道內,並遠離底板凹陷。In one or more embodiments of the present invention, the fiber braid includes depressions. The concave portion is located in the heat dissipation channel and is concave away from the bottom plate.

於本發明的一或多個實施方式中,纖維編織層完全覆蓋散熱通道。In one or more embodiments of the present invention, the fiber braided layer completely covers the heat dissipation channel.

於本發明的一或多個實施方式中,纖維編織層包含樹脂纖維、合成纖維、棉纖維、麻纖維或絲綢纖維。In one or more embodiments of the present invention, the woven fiber layer comprises resin fibers, synthetic fibers, cotton fibers, hemp fibers or silk fibers.

於本發明的一或多個實施方式中,纖維編織層的網孔寬度介於0.015 mm至0.03 mm之範圍。In one or more embodiments of the present invention, the mesh width of the fiber braided layer ranges from 0.015 mm to 0.03 mm.

於本發明的一或多個實施方式中,纖維編織層由複數條纖維交錯形成。纖維之間形成至少一網孔。網孔對應於散熱通道。In one or more embodiments of the present invention, the fiber braided layer is formed by interlacing a plurality of fibers. At least one mesh is formed between the fibers. The mesh holes correspond to the heat dissipation channels.

綜上所述,於本發明的鍵盤中,纖維編織層被使用來覆蓋背光模組的散熱通道,不僅能有效解決背光模組由散熱通道漏光的問題,還能利用纖維編織層本身的通風性而使得散熱通道仍能夠保持其散熱作用。To sum up, in the keyboard of the present invention, the fiber braided layer is used to cover the heat dissipation channel of the backlight module, which can not only effectively solve the problem of light leakage from the heat dissipation channel of the backlight module, but also utilize the ventilation of the fiber braided layer itself. So that the heat dissipation channel can still maintain its heat dissipation effect.

以上所述僅係用以闡述本發明所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本發明之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above descriptions are only used to describe the problems to be solved by the present invention, the technical means for solving the problems, and their effects, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。在所有圖式中相同的標號將用於表示相同或相似的元件。Several embodiments of the present invention will be disclosed in the drawings below, and for the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the invention, these practical details are unnecessary. In addition, for the purpose of simplifying the drawings, some well-known structures and elements will be shown in a simple and schematic manner in the drawings. The same reference numbers will be used throughout the drawings to refer to the same or similar elements.

請參照第1圖,其為繪示根據本發明一實施方式之鍵盤100的示意圖。如第1圖所示,本實施方式之鍵盤100可以是供桌上型電腦使用之外接鍵盤(例如,PS2介面之鍵盤或USB介面之鍵盤)或是包含鍵盤形式之輸入裝置的電腦系統(例如,筆記型電腦或膝上型電腦),但並不以此為限。換言之,本發明之鍵盤100之概念可以應用於任何以按鍵裝置作為輸入介面的電子產品。Please refer to FIG. 1 , which is a schematic diagram illustrating a keyboard 100 according to an embodiment of the present invention. As shown in FIG. 1 , the keyboard 100 of this embodiment can be an external keyboard (eg, a PS2 interface keyboard or a USB interface keyboard) used by a desktop computer or a computer system including an input device in the form of a keyboard (eg, Notebook or Laptop), but not limited thereto. In other words, the concept of the keyboard 100 of the present invention can be applied to any electronic product using a key device as an input interface.

請參照第2圖,其為繪示第1圖中之鍵盤100的部分元件的爆炸圖。如第1圖與第2圖所示,鍵盤100包含底板110、複數個按鍵組件120(於第2圖中省略,請見第1圖)、背光模組130以及纖維編織層140。底板110可為金屬 (例如鋁、鋼、合金等) 或塑料材質所製成之硬質板體而具有支撐組件之功能。按鍵組件120設置於底板110上。背光模組130設置於底板110下。纖維編織層140位於底板110與背光模組130之間,因此不會影響按鍵組件120的活動。背光模組130包含導光板131、反射片132以及光源模組133排列於纖維編織層140下。光源模組133包含軟性電路板以及設置於其上的光源(圖未示,例如發光二極體)。光源配置以發光進入導光板131。反射片132設置於導光板131遠離底板110的一側(亦即,設置於導光板131的下方),並配置以將行進於導光板131內的光線向上反射,使得光線由導光板131的上表面離開。導光板131可由導光材料所製成而具有導引光線之功能,例如導光板131可由聚碳酸酯 (Polycarbonate,PC)、壓克力塑膠 (Polymethyl Methacrylate,PMMA) 或玻璃材料所製成之板體。Please refer to FIG. 2 , which is an exploded view showing some components of the keyboard 100 in FIG. 1 . As shown in FIGS. 1 and 2 , the keyboard 100 includes a bottom plate 110 , a plurality of key assemblies 120 (omitted in FIG. 2 , see FIG. 1 ), a backlight module 130 and a fiber braided layer 140 . The bottom plate 110 can be a rigid plate body made of metal (such as aluminum, steel, alloy, etc.) or plastic material and has the function of supporting the components. The key assembly 120 is disposed on the bottom plate 110 . The backlight module 130 is disposed under the bottom plate 110 . The fiber braided layer 140 is located between the bottom plate 110 and the backlight module 130 , and therefore does not affect the movement of the key assembly 120 . The backlight module 130 includes a light guide plate 131 , a reflection sheet 132 and a light source module 133 arranged under the fiber braided layer 140 . The light source module 133 includes a flexible circuit board and a light source (not shown, such as a light emitting diode) disposed thereon. The light source is configured to emit light into the light guide plate 131 . The reflection sheet 132 is disposed on the side of the light guide plate 131 away from the bottom plate 110 (ie, disposed below the light guide plate 131 ), and is configured to reflect the light traveling in the light guide plate 131 upward, so that the light is transmitted from the upper part of the light guide plate 131 . surface left. The light guide plate 131 can be made of a light guide material and has the function of guiding light. For example, the light guide plate 131 can be a plate made of polycarbonate (Polycarbonate, PC), acrylic (Polymethyl Methacrylate, PMMA) or glass material. body.

於一些實施方式中,鍵盤100可進一步包含電路板 (圖未示)。電路板可設置於底板110與按鍵組件120之間,且其上設有按鍵電路,藉以在按鍵組件120的鍵帽觸發時產生對應之按鍵訊號。於一些實施方式中,前述電路板可為硬質之印刷電路板或軟性電路板,但本發明並不以此為限。In some embodiments, the keyboard 100 may further include a circuit board (not shown). The circuit board can be disposed between the bottom plate 110 and the key assembly 120, and a key circuit is disposed thereon, so as to generate a corresponding key signal when the key cap of the key assembly 120 is triggered. In some embodiments, the aforementioned circuit board may be a rigid printed circuit board or a flexible circuit board, but the invention is not limited thereto.

於一些實施方式中,按鍵組件120還可進一步包含連接件 (圖未示)。連接件可為剪刀式連接件、蝶式連接件或機械式開關等。連接件一端連接前述之鍵帽,另一端連接底板110,藉此將前述鍵帽組裝於底板110,並且導引前述鍵帽相對於底板110進行升降位移。In some embodiments, the button assembly 120 may further include a connector (not shown). The connector can be a scissor connector, a butterfly connector or a mechanical switch. One end of the connector is connected to the aforementioned keycap, and the other end is connected to the base plate 110 , thereby assembling the aforementioned keycap to the base plate 110 and guiding the aforementioned keycap to move up and down relative to the base plate 110 .

於一些實施方式中,按鍵組件120還可進一步包含復位件 (圖未示)。復位件可設置於底板110上,位於底板110與前述鍵帽之間,並位於按鍵電路的上方。當鍵帽接受外力而被下壓時,復位件將對鍵帽產生一抗力,進而提供使用者按壓之手感。當施加於鍵帽的外力釋放之後,復位件可提供下壓之鍵帽回復至原始未按壓之位置的回復力。於一些實施方式中,復位件可為彈性件,例如橡膠圓頂、金屬圓頂或彈片。於其他一些實施方式中,復位件亦可為其他具有類似功能之元件,例如磁性元件。In some embodiments, the button assembly 120 may further include a reset member (not shown). The reset member can be disposed on the bottom plate 110, between the bottom plate 110 and the aforementioned keycap, and above the key circuit. When the keycap receives an external force and is pressed down, the reset element will generate a resistance to the keycap, thereby providing a user with a pressing feeling. When the external force applied to the keycap is released, the restoring element can provide a restoring force for the depressed keycap to return to the original unpressed position. In some embodiments, the reset member may be an elastic member, such as a rubber dome, a metal dome, or a spring. In other embodiments, the reset element can also be other elements with similar functions, such as magnetic elements.

請參照第3圖至第5圖。第3圖為繪示第2圖中之導光板131與纖維編織層140的上視圖。第4圖為繪示根據本發明一實施方式之纖維編織層140的局部上視圖。第5圖為繪示第2圖中之背光模組130與纖維編織層140的剖面示意圖。如第3圖與第5圖所示,於本實施方式中,背光模組130具有貫穿其之複數個散熱通道C。藉此,例如當本發明的鍵盤100設置於筆記型電腦(圖未示)的主機殼體時,主機殼體內的發熱源(例如,處理器)所產生的熱即可經由背光模組130的散熱通道C散逸至主機殼體外。具體來說,如第5圖所示,每一散熱通道C是由導光板131的一個第一通孔131a與反射片132的一個第二通孔132a相互連通而構成。纖維編織層140覆蓋且接觸導光板131遠離反射片132的一側,藉以遮擋散熱通道C。換言之,纖維編織層140覆蓋且接觸導光板131,並設置於導光板131面對底板110的一側。如第3圖所示,纖維編織層140完全覆蓋散熱通道C。纖維編織層140可透過黏合的方式設置於導光板131遠離反射片132的一側,但不以此為限。Please refer to Figures 3 to 5. FIG. 3 is a top view showing the light guide plate 131 and the fiber braided layer 140 in the second figure. FIG. 4 is a partial top view illustrating a fiber braided layer 140 according to an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of the backlight module 130 and the fiber braided layer 140 in FIG. 2 . As shown in FIG. 3 and FIG. 5 , in this embodiment, the backlight module 130 has a plurality of heat dissipation channels C passing through it. Thus, for example, when the keyboard 100 of the present invention is installed in the main body casing of the notebook computer (not shown), the heat generated by the heat source (eg, the processor) in the main body casing can pass through the backlight module. The heat dissipation channel C of 130 is dissipated to the outside of the host casing. Specifically, as shown in FIG. 5 , each heat dissipation channel C is formed by a first through hole 131 a of the light guide plate 131 and a second through hole 132 a of the reflection sheet 132 communicating with each other. The fiber braided layer 140 covers and contacts the side of the light guide plate 131 away from the reflection sheet 132 , so as to block the heat dissipation channel C. As shown in FIG. In other words, the fiber braided layer 140 covers and contacts the light guide plate 131 and is disposed on the side of the light guide plate 131 facing the bottom plate 110 . As shown in FIG. 3 , the fiber braided layer 140 completely covers the heat dissipation channel C. As shown in FIG. The fiber braided layer 140 may be disposed on the side of the light guide plate 131 away from the reflection sheet 132 by means of adhesion, but is not limited thereto.

於一些實施方式中,纖維編織層140係由纖維細線編織而成整片式結構。具體來說,如第4圖所示,纖維編織層140係由橫向延伸的複數個纖維141a以及縱向延伸的複數個纖維141b編織而成。纖維141a、141b係上下交錯。具體來說,每一條纖維141a係交替地由上方與下方依序通過纖維141b,每一條纖維141b亦交替地由上方與下方依序通過纖維141a。纖維141a、141b之間形成複數個網孔141c。當光線由下方的光源模組133照射來時,會有一部分的光線被纖維141a、141b遮擋而無法通過,僅有微量的光線能由網孔141c通過,從而實現纖維編織層140的遮光效果。並且,由於是編織而成,因此纖維編織層140並非完全密閉而能讓空氣經由網孔141c流通。當纖維編織層140設置於導光板131上時,對應於散熱通道C的網孔141c可達到透氣進而散熱的效果。In some embodiments, the fiber braided layer 140 is a one-piece structure woven from fiber strands. Specifically, as shown in FIG. 4, the fiber braided layer 140 is woven from a plurality of fibers 141a extending in the lateral direction and a plurality of fibers 141b extending in the longitudinal direction. The fibers 141a, 141b are staggered up and down. Specifically, each fiber 141a passes through the fiber 141b alternately from above and below, and each fiber 141b also passes through the fiber 141a alternately from above and below. A plurality of mesh holes 141c are formed between the fibers 141a and 141b. When the light is irradiated by the light source module 133 below, a part of the light is blocked by the fibers 141a and 141b and cannot pass through, and only a small amount of light can pass through the mesh hole 141c, thereby realizing the shading effect of the fiber braided layer 140. In addition, since it is woven, the fiber braided layer 140 is not completely airtight, but allows air to flow through the mesh 141c. When the fiber braided layer 140 is disposed on the light guide plate 131, the mesh holes 141c corresponding to the heat dissipation channel C can achieve the effect of ventilation and heat dissipation.

藉由前述結構配置,纖維編織層140不僅能有效解決背光模組130由散熱通道C直接漏光的問題,還能利用其本身的通風性而使得散熱通道C仍能夠保持其散熱作用。With the aforementioned structure and configuration, the fiber braided layer 140 can not only effectively solve the problem of direct light leakage from the backlight module 130 through the heat dissipation channel C, but also utilize its own ventilation properties so that the heat dissipation channel C can still maintain its heat dissipation effect.

於一些實施方式中,纖維編織層140包含樹脂纖維、合成纖維、棉纖維、麻纖維或絲綢纖維,但本發明並不以此為限。In some embodiments, the woven fiber layer 140 includes resin fibers, synthetic fibers, cotton fibers, hemp fibers or silk fibers, but the present invention is not limited thereto.

於一些實施方式中,纖維編織層140為網紗層、織布層或不織布層,但本發明並不以此為限。In some embodiments, the fiber braided layer 140 is a mesh layer, a woven fabric layer or a non-woven fabric layer, but the present invention is not limited thereto.

於一些實施方式中,纖維編織層140的網孔141c寬度介於0.015公釐 (millimeter, mm) 至0.03公釐之範圍。若網孔141c寬度大於此範圍時,纖維編織層140的遮光能力會明顯變差;若網孔141c寬度小於此範圍時,纖維編織層140的透氣性會明顯變差。換言之,藉由上述的網孔141c的寬度設計,可利於網孔141c在不過大而影響纖維編織層140之遮光能力的情況下達到透氣性的效果,網孔141c寬度在上述範圍內可以同時具有足夠的遮光能力與透氣性。然而,可視實際應用,透過調整纖維編織層140的網孔141c的寬度,進而調整纖維編織層140的遮光能力及/或透氣性。In some embodiments, the width of the meshes 141c of the fiber woven layer 140 is in the range of 0.015 millimeters (millimeter, mm) to 0.03 millimeters. If the width of the mesh hole 141c is larger than this range, the shading ability of the fiber braided layer 140 will be significantly deteriorated; if the mesh hole 141c width is smaller than this range, the air permeability of the fiber braided layer 140 will be significantly deteriorated. In other words, through the above-mentioned width design of the mesh holes 141c, the mesh holes 141c can achieve the effect of air permeability without being too large to affect the light-shielding ability of the fiber woven layer 140. The mesh holes 141c can have a width within the above range Sufficient shade and breathability. However, depending on the practical application, the shading ability and/or the air permeability of the fiber woven layer 140 can be adjusted by adjusting the width of the mesh holes 141c of the fiber woven layer 140 .

在一些實施方式中,可透過上述纖維141a、141b的顏色進而調整纖維編織層140的遮光能力。舉例來說,以黑色的纖維141a、141b所編織而成的纖維編織層140的遮光能力優於以白色的纖維141a、141b所編織而成的纖維編織層140。In some embodiments, the light-shielding ability of the fiber braided layer 140 can be adjusted through the colors of the fibers 141a and 141b. For example, the shading ability of the fiber woven layer 140 woven with black fibers 141a and 141b is better than that of the fiber woven layer 140 woven with white fibers 141a and 141b.

另外,如第2圖與第3圖所示,纖維編織層140亦可進行圖案化而形成複數個透光部142,且透光部142分別對應上方的按鍵組件120。於一些實施方式中,透光部142可利用模具沖壓或雷射等方式切割形成,但本發明並不以此為限。光線可經由前述透光部142而照射至按鍵組件120。當行進於導光板131內的光線由導光板131的上表面或導光板131的第一通孔131a離開時,會被纖維編織層140遮擋而僅有微量的光線能由網孔141c通過。由此可知,纖維編織層140能降低通過的光線的亮度,藉以達到遮光的效果。In addition, as shown in FIG. 2 and FIG. 3 , the fiber braided layer 140 can also be patterned to form a plurality of light-transmitting parts 142 , and the light-transmitting parts 142 correspond to the upper button assemblies 120 respectively. In some embodiments, the light-transmitting portion 142 may be formed by cutting with die stamping or laser, but the present invention is not limited thereto. The light can be irradiated to the key assembly 120 through the aforementioned light-transmitting portion 142 . When the light traveling in the light guide plate 131 exits from the upper surface of the light guide plate 131 or the first through hole 131a of the light guide plate 131, it will be blocked by the fiber braided layer 140 and only a small amount of light can pass through the mesh hole 141c. It can be seen from this that the fiber braided layer 140 can reduce the brightness of the passing light, thereby achieving the effect of shading.

請參照第6圖,其為繪示根據本發明另一實施方式之背光模組230與纖維編織層140的剖面示意圖。相較於第5圖所示的實施方式,本實施方式的背光模組230進一步包含遮光片234。遮光片234例如為印有油墨之聚酯膠膜 (mylar)。遮光片234設置於導光板131遠離反射片132的一側,並具有與第一通孔131a及第二通孔132a連通之第三通孔234a。散熱通道C由第一通孔131a、第二通孔132a與第三通孔234a構成。纖維編織層140覆蓋且接觸遮光片234遠離導光板131的一側。纖維編織層140可透過黏合的方式設置於遮光片234遠離導光板131的一側,但不以此為限。藉由增設遮光片234,可以更確保光線只能由導光板131未被遮光片234遮擋的部位離開而抵達上方的按鍵組件120。而散熱通道C因受纖維編織層140覆蓋,可遮蔽由散熱通道C離開的光線,達到避免漏光之效果,還能利用纖維編織層140之纖維141a、141b間的一個或多個網孔141c使得受纖維編織層140覆蓋的散熱通道C仍能夠保持其散熱作用。Please refer to FIG. 6 , which is a schematic cross-sectional view illustrating a backlight module 230 and a fiber woven layer 140 according to another embodiment of the present invention. Compared with the embodiment shown in FIG. 5 , the backlight module 230 of this embodiment further includes a light shielding sheet 234 . The light shielding sheet 234 is, for example, a polyester film (mylar) printed with ink. The light shielding sheet 234 is disposed on the side of the light guide plate 131 away from the reflection sheet 132 , and has a third through hole 234 a communicating with the first through hole 131 a and the second through hole 132 a. The heat dissipation channel C is composed of a first through hole 131a, a second through hole 132a and a third through hole 234a. The fiber braided layer 140 covers and contacts the side of the light shielding sheet 234 away from the light guide plate 131 . The fiber braided layer 140 may be disposed on the side of the light shielding sheet 234 away from the light guide plate 131 by means of adhesion, but is not limited thereto. By adding the light shielding sheet 234 , it can be further ensured that the light can only leave the portion of the light guide plate 131 that is not blocked by the light shielding sheet 234 and reach the upper button assembly 120 . Since the heat dissipation channel C is covered by the fiber braided layer 140 , the light leaving the heat dissipation channel C can be shielded to avoid light leakage. The heat dissipation channel C covered by the fiber braided layer 140 can still maintain its heat dissipation effect.

背光模組230與纖維編織層140的堆疊方式並不以第6圖所示之實施方式為限。請參照第7圖,其為繪示根據本發明另一實施方式之背光模組330與纖維編織層140的剖面示意圖。如第7圖所示,背光模組330包含反射片132、導光板131以及遮光片234,這些元件的功能與相對位置係相同或相似於第6圖所示的實施方式,因此可參照前述相關說明,在此恕不贅述。相較於第6圖所示的實施方式,本實施方式的纖維編織層140係疊合於導光板131與遮光片234之間。換言之,於本實施方式中,纖維編織層140係整合於背光模組330。The stacking method of the backlight module 230 and the fiber braided layer 140 is not limited to the embodiment shown in FIG. 6 . Please refer to FIG. 7 , which is a schematic cross-sectional view illustrating a backlight module 330 and a fiber woven layer 140 according to another embodiment of the present invention. As shown in FIG. 7 , the backlight module 330 includes a reflective sheet 132 , a light guide plate 131 and a light shielding sheet 234 . The functions and relative positions of these elements are the same or similar to the embodiment shown in FIG. 6 . Explanation, which will not be repeated here. Compared with the embodiment shown in FIG. 6 , the fiber braided layer 140 of this embodiment is superimposed between the light guide plate 131 and the light shielding sheet 234 . In other words, in this embodiment, the fiber braided layer 140 is integrated with the backlight module 330 .

請參照第8圖,其為繪示根據本發明另一實施方式之背光模組430與纖維編織層440的剖面示意圖。如第8圖所示,背光模組430包含反射片132以及導光板131,這些元件的功能與相對位置係相同或相似於第5圖所示的實施方式,因此可參照前述相關說明,在此恕不贅述。相較於第5圖所示的實施方式,本實施方式的纖維編織層440包含平貼部441以及凹陷部442。平貼部441平貼於導光板131遠離反射片132的一側。凹陷部442係位於散熱通道C內,並覆蓋第一通孔131a的內壁。藉此,纖維編織層440可以進一步增進遮擋由散熱通道C漏出光線的效果。Please refer to FIG. 8 , which is a schematic cross-sectional view of a backlight module 430 and a fiber braided layer 440 according to another embodiment of the present invention. As shown in FIG. 8 , the backlight module 430 includes a reflective sheet 132 and a light guide plate 131 . The functions and relative positions of these elements are the same or similar to the embodiment shown in FIG. 5 . I won't go into details. Compared with the embodiment shown in FIG. 5 , the fiber braided layer 440 of this embodiment includes a flat portion 441 and a concave portion 442 . The flat part 441 is flatly attached to the side of the light guide plate 131 away from the reflection sheet 132 . The recessed portion 442 is located in the heat dissipation channel C and covers the inner wall of the first through hole 131a. Thereby, the fiber braided layer 440 can further enhance the effect of blocking the light leaking from the heat dissipation channel C. As shown in FIG.

為了更好地解決背光模組430於散熱通道C的漏光問題,可設計使凹陷部442完全覆蓋且接觸第一通孔131a的內壁,如第8圖所示。In order to better solve the problem of light leakage of the backlight module 430 in the heat dissipation channel C, the concave portion 442 can be designed to completely cover and contact the inner wall of the first through hole 131a, as shown in FIG. 8 .

於實際應用中,纖維編織層140具有一定之柔軟性,可先將第5圖中所示之纖維編織層140設置於導光板131上,再利用工具將纖維編織層140位於散熱通道C正上方的部分擠入散熱通道C中,即可形成第8圖所示之纖維編織層440。也就是說,第5圖中所示之纖維編織層140未受到工具擠壓的部分形成第8圖所示之纖維編織層440的平貼部441,第5圖中所示之纖維編織層140受到工具擠入散熱通道C的部分形成第8圖所示之纖維編織層440的凹陷部442。In practical applications, the fiber braided layer 140 has a certain degree of flexibility. The fiber braided layer 140 shown in FIG. 5 can be placed on the light guide plate 131 first, and then the fiber braided layer 140 can be positioned directly above the heat dissipation channel C by using a tool. The part of the fiber is squeezed into the heat dissipation channel C to form the fiber braided layer 440 shown in FIG. 8 . That is to say, the portion of the woven fiber layer 140 shown in FIG. 5 that is not pressed by the tool forms the flat portion 441 of the woven fiber layer 440 shown in FIG. 8, and the woven fiber layer 140 shown in FIG. 5 is formed. The portion squeezed by the tool into the heat dissipation channel C forms the concave portion 442 of the fiber braided layer 440 shown in FIG. 8 .

請參照第9圖以及第10圖。第9圖為繪示根據本發明另一實施方式之背光模組530與纖維編織層440的剖面示意圖。第10圖為繪示根據本發明另一實施方式之背光模組630與纖維編織層440的剖面示意圖。如第9圖所示,背光模組530包含反射片132、導光板131以及遮光片234,這些元件的功能與相對位置係相同或相似於第6圖所示的實施方式,因此可參照前述相關說明,在此恕不贅述。如第10圖所示,背光模組630包含反射片132、導光板131以及遮光片234,這些元件的功能與相對位置係相同或相似於第7圖所示的實施方式,因此可參照前述相關說明,在此恕不贅述。分別相較於第6圖與第7圖所示的實施方式,第9圖與第10圖所示的實施方式皆改為採用第8圖所示之纖維編織層440,同樣可更好地解決背光模組530、630於散熱通道C的漏光問題。Please refer to Figure 9 and Figure 10. FIG. 9 is a schematic cross-sectional view illustrating a backlight module 530 and a fiber braided layer 440 according to another embodiment of the present invention. FIG. 10 is a schematic cross-sectional view illustrating a backlight module 630 and a fiber braided layer 440 according to another embodiment of the present invention. As shown in FIG. 9 , the backlight module 530 includes a reflective sheet 132 , a light guide plate 131 and a light shielding sheet 234 . The functions and relative positions of these elements are the same or similar to the embodiment shown in FIG. 6 . Explanation, which will not be repeated here. As shown in FIG. 10, the backlight module 630 includes a reflective sheet 132, a light guide plate 131 and a light shielding sheet 234. The functions and relative positions of these elements are the same or similar to the embodiment shown in FIG. description, which will not be repeated here. Compared with the embodiments shown in Fig. 6 and Fig. 7, the embodiments shown in Figs. 9 and 10 are changed to use the fiber woven layer 440 shown in Fig. 8, which can also better solve the problem. The problem of light leakage in the heat dissipation channel C of the backlight modules 530 and 630 .

由以上對於本發明之具體實施方式之詳述,可以明顯地看出,纖維編織層被使用來覆蓋背光模組的散熱通道,不僅能有效解決背光模組由散熱通道漏光的問題,還能利用纖維編織層本身的通風性而使得散熱通道仍能夠保持其散熱作用。From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the fiber braided layer is used to cover the heat dissipation channel of the backlight module, which can not only effectively solve the problem of light leakage from the heat dissipation channel of the backlight module, but also use The ventilation of the fiber woven layer itself enables the heat dissipation channel to maintain its heat dissipation effect.

雖然本發明已以實施方式揭露如上,然其並不用以限定本發明,任何熟習此技藝者,在不脫離本發明的精神和範圍內,當可作各種的更動與潤飾,因此本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be determined by the scope of the appended patent application.

100:鍵盤 110:底板 120:按鍵組件 130,230,330,430,530,630:背光模組 131:導光板 131a:第一通孔 132:反射片 132a:第二通孔 133:光源模組 140,440:纖維編織層 141a,141b:纖維 141c:網孔 142:透光部 234:遮光片 234a:第三通孔 441:平貼部 442:凹陷部 C:散熱通道100: Keyboard 110: Bottom plate 120: Button assembly 130, 230, 330, 430, 530, 630: Backlight Modules 131: light guide plate 131a: first through hole 132: Reflector 132a: second through hole 133: Light source module 140,440: Fiber Braid 141a, 141b: Fiber 141c: mesh 142: Translucent part 234: Shades 234a: third through hole 441: Flat applicator 442: Depression C: cooling channel

為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為繪示根據本發明一實施方式之鍵盤的示意圖。 第2圖為繪示第1圖中之鍵盤的部分元件的爆炸圖。 第3圖為繪示第2圖中之導光板與纖維編織層的上視圖。 第4圖為繪示根據本發明一實施方式之纖維編織層的局部上視圖。 第5圖為繪示第2圖中之背光模組與纖維編織層的剖面示意圖。 第6圖為繪示根據本發明另一實施方式之背光模組與纖維編織層的剖面示意圖。 第7圖為繪示根據本發明另一實施方式之背光模組與纖維編織層的剖面示意圖。 第8圖為繪示根據本發明另一實施方式之背光模組與纖維編織層的剖面示意圖。 第9圖為繪示根據本發明另一實施方式之背光模組與纖維編織層的剖面示意圖。 第10圖為繪示根據本發明另一實施方式之背光模組與纖維編織層的剖面示意圖。In order to make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows: FIG. 1 is a schematic diagram illustrating a keyboard according to an embodiment of the present invention. FIG. 2 is an exploded view showing some components of the keyboard in FIG. 1 . FIG. 3 is a top view showing the light guide plate and the fiber braided layer in FIG. 2 . FIG. 4 is a partial top view illustrating a fiber braided layer according to an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of the backlight module and the fiber braided layer in FIG. 2 . FIG. 6 is a schematic cross-sectional view illustrating a backlight module and a fiber braided layer according to another embodiment of the present invention. FIG. 7 is a schematic cross-sectional view illustrating a backlight module and a fiber braided layer according to another embodiment of the present invention. FIG. 8 is a schematic cross-sectional view illustrating a backlight module and a fiber braided layer according to another embodiment of the present invention. FIG. 9 is a schematic cross-sectional view illustrating a backlight module and a fiber braided layer according to another embodiment of the present invention. FIG. 10 is a schematic cross-sectional view illustrating a backlight module and a fiber braided layer according to another embodiment of the present invention.

130:背光模組130: Backlight module

131:導光板131: light guide plate

131a:第一通孔131a: first through hole

132:反射片132: Reflector

132a:第二通孔132a: second through hole

140:纖維編織層140: Fiber Braid

C:散熱通道C: cooling channel

Claims (12)

一種鍵盤,包含:一底板;複數個按鍵組件,設置於該底板上;一背光模組,設置於該底板下,並具有貫穿該背光模組之一散熱通道,該背光模組包含一導光板;以及一纖維編織層,位於該底板與該導光板之間,並遮擋該散熱通道,其中該纖維編織層由複數條纖維交錯形成,該些纖維之間形成至少一網孔,該至少一網孔對應於該散熱通道。 A keyboard, comprising: a base plate; a plurality of key assemblies arranged on the base plate; a backlight module set under the base plate and having a heat dissipation channel running through the backlight module, the backlight module comprising a light guide plate ; And a fiber braided layer, located between the bottom plate and the light guide plate, and shields the heat dissipation channel, wherein the fiber braided layer is formed by a plurality of fibers staggered, at least one mesh is formed between these fibers, the at least one mesh The holes correspond to the heat dissipation channels. 如請求項1所述之鍵盤,其中該纖維編織層覆蓋且接觸該導光板面對該底板的一側。 The keyboard of claim 1, wherein the fiber braided layer covers and contacts a side of the light guide plate facing the bottom plate. 如請求項1所述之鍵盤,其中該導光板具有一第一通孔,該背光模組進一步包含:一反射片,設置於該導光板遠離該底板的一側,並具有與該第一通孔連通之一第二通孔,其中該散熱通道至少由該第一通孔與該第二通孔構成。 The keyboard according to claim 1, wherein the light guide plate has a first through hole, and the backlight module further comprises: a reflection sheet disposed on a side of the light guide plate away from the bottom plate and having a through hole connected to the first through hole. The hole communicates with a second through hole, wherein the heat dissipation channel is formed by at least the first through hole and the second through hole. 如請求項3所述之鍵盤,其中該背光模組進一步包含一遮光片,該遮光片設置於該導光板遠離該反射片的一側,並具有與該第一通孔及該第二通孔連通之一第三通孔,且該散熱通道進一步由該第三通孔構 成。 The keyboard of claim 3, wherein the backlight module further comprises a light-shielding sheet, the light-shielding sheet is disposed on a side of the light guide plate away from the reflection sheet, and has the first through hole and the second through hole A third through hole is communicated with, and the heat dissipation channel is further formed by the third through hole to make. 如請求項4所述之鍵盤,其中該纖維編織層覆蓋且接觸該遮光片遠離該導光板的一側。 The keyboard of claim 4, wherein the fiber braided layer covers and contacts a side of the light shielding sheet away from the light guide plate. 如請求項4所述之鍵盤,其中該纖維編織層疊合於該導光板與該遮光片之間。 The keyboard of claim 4, wherein the fiber braided layer is laminated between the light guide plate and the light shielding sheet. 如請求項3所述之鍵盤,其中該纖維編織層包含一凹陷部,該凹陷部係位於該散熱通道內,並覆蓋該第一通孔的內壁。 The keyboard of claim 3, wherein the fiber braided layer includes a concave portion, and the concave portion is located in the heat dissipation channel and covers the inner wall of the first through hole. 如請求項7所述之鍵盤,其中該凹陷部完全覆蓋且接觸該第一通孔的內壁。 The keyboard of claim 7, wherein the recessed portion completely covers and contacts the inner wall of the first through hole. 如請求項1所述之鍵盤,其中該纖維編織層包含一凹陷部,該凹陷部係位於該散熱通道內,並遠離該底板凹陷。 The keyboard of claim 1, wherein the fiber braided layer includes a concave portion, and the concave portion is located in the heat dissipation channel and is concave away from the bottom plate. 如請求項1所述之鍵盤,其中該纖維編織層完全覆蓋該散熱通道。 The keyboard of claim 1, wherein the fiber braided layer completely covers the heat dissipation channel. 如請求項1所述之鍵盤,其中該纖維編織層包含樹脂纖維、合成纖維、棉纖維、麻纖維或絲綢纖 維。 The keyboard of claim 1, wherein the woven fiber layer comprises resin fibers, synthetic fibers, cotton fibers, hemp fibers or silk fibers dimension. 如請求項1所述之鍵盤,其中該纖維編織層的一網孔寬度介於0.015mm至0.03mm之範圍。 The keyboard of claim 1, wherein a mesh width of the fiber braided layer is in the range of 0.015mm to 0.03mm.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12154729B2 (en) 2023-02-10 2024-11-26 Darfon Electronics Corp. Lighting keyboard and backlight module for the same
US12525414B2 (en) 2021-01-05 2026-01-13 Darfon Electronics Corp. Illuminated keyswitch structure and illuminating module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201966108U (en) * 2011-01-04 2011-09-07 江苏传艺科技有限公司 Light-emitting keyboard structure for laptop
TWI652711B (en) * 2018-01-09 2019-03-01 達方電子股份有限公司 Luminous keyboard and backlight module thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201966108U (en) * 2011-01-04 2011-09-07 江苏传艺科技有限公司 Light-emitting keyboard structure for laptop
TWI652711B (en) * 2018-01-09 2019-03-01 達方電子股份有限公司 Luminous keyboard and backlight module thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12525414B2 (en) 2021-01-05 2026-01-13 Darfon Electronics Corp. Illuminated keyswitch structure and illuminating module
US12154729B2 (en) 2023-02-10 2024-11-26 Darfon Electronics Corp. Lighting keyboard and backlight module for the same

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