TWI778282B - Multi-chip organic light emitting diode flexible lamp module structure - Google Patents
Multi-chip organic light emitting diode flexible lamp module structure Download PDFInfo
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- 239000011521 glass Substances 0.000 claims abstract description 79
- 239000003292 glue Substances 0.000 claims description 12
- 239000003086 colorant Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000002419 bulk glass Substances 0.000 description 2
- 230000002860 competitive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 210000004508 polar body Anatomy 0.000 description 2
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
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Abstract
一種多片式有機發光二極體可撓燈片模組結構,包含:在軟性印刷電路板上配置複數條第一電極導線,以及至少一條第二電極導線,第一電極導線與第二電極導線各預留複數對應的電性接觸區,同時配置有複數個有機發光二極體玻璃燈片於軟性印刷電路板上並與對應的電性接觸區作電性連接;本發明藉由將有機發光二極體玻璃燈片與軟性印刷電路板結合,以利用軟性印刷電路板的可彎曲性,讓由多個有機發光二極體玻璃燈片組成之模組具可撓性。 A multi-chip organic light emitting diode flexible lamp module structure, comprising: a plurality of first electrode wires and at least one second electrode wire are arranged on a flexible printed circuit board, the first electrode wires and the second electrode wires Each of a plurality of corresponding electrical contact areas is reserved, and a plurality of organic light emitting diode glass lamps are arranged on the flexible printed circuit board and are electrically connected with the corresponding electrical contact areas; The diode glass light sheet is combined with the flexible printed circuit board to utilize the flexibility of the flexible printed circuit board to make the module composed of a plurality of organic light emitting diode glass light sheets flexible.
Description
本發明是有關一種OLED(Organic Light-Emitting Diode,有機發光二極體)的技術,尤指一種透過將軟性電路板與多個玻璃型OLED結合,使其達到具備可彎曲性的多片式有機發光二極體可撓燈片模組結構。 The present invention relates to an OLED (Organic Light-Emitting Diode, organic light-emitting diode) technology, in particular to a flexible multi-chip organic light-emitting diode (OLED) technology that combines a flexible circuit board with a plurality of glass-type OLEDs. Light-emitting diode flexible lamp module structure.
市面上的OLED元件大多是採用玻璃基板32製作(如圖1所示),此種OLED玻璃燈片因製程技術成熟,因此其製作成本較低,但由於玻璃基板32本身不具可撓性,導致此種OLED玻璃燈片無法設計成曲面的構型,在產品的應用性上會受到較大的限制。 Most of the OLED elements on the market are made of glass substrate 32 (as shown in FIG. 1 ). This kind of OLED glass light sheet has a low manufacturing cost due to the mature process technology. However, because the glass substrate 32 itself is not flexible, it leads to Such an OLED glass light sheet cannot be designed into a curved configuration, and the applicability of the product will be greatly restricted.
因此,市面上有一種具有可撓性的OLED元件,其主要是利用塑膠基板52(通常是PI基板)替換掉玻璃基板32,並在PI基板52上塗佈具有水氧阻隔功能的阻隔層(barrier layer)54,且在OLED元件蒸鍍完後,利用CVD(Chemical Vapor Deposition,化學氣相沉積)與PVD(Physical Vapor Deposition,物理氣相沉積)兩種製程交替進行薄膜封裝(thin_film encapsulation)56,最後再貼上保護層58,然而,此種具可撓性的OLED元件雖然較薄較輕,且具可撓性,但須投入的CVD製程設備費用極為昂貴,且製程
良率不高,所製作得OLED元件成本也較高許多,因此目前此類產品市場上尚未能順利地大量採用。
Therefore, there is a flexible OLED device on the market, which mainly replaces the glass substrate 32 with a plastic substrate 52 (usually a PI substrate), and coats the
由上所述,目前習知具有可撓性的OLED元件仍有相當多的問題,故,本案發明人鑑於上述之問題,乃亟思加以改良創新,並經長時間的實務研究後,終於成功研發完成本件多片式有機發光二極體可撓燈片模組結構,可兼具考量到量產成熟度與製造成本,極具有產品競爭力。 From the above, there are still quite a few problems with the known flexible OLED devices. Therefore, in view of the above problems, the inventor of the present case has urgently thought about improvement and innovation, and after a long period of practical research, he finally succeeded. The multi-chip organic light-emitting diode flexible lamp module structure has been developed and completed, which can take into account both the maturity of mass production and manufacturing cost, and is extremely competitive.
為解決前述習知技術之問題,本發明之目的是在於提供一種多片式有機發光二極體可撓燈片模組結構,以解決有機發光二極體(Organic Light-Emitting Diode,OLED)玻璃燈片不具可撓性之問題。 In order to solve the aforementioned problems of the prior art, the purpose of the present invention is to provide a multi-piece organic light-emitting diode flexible lamp module structure to solve the problem of organic light-emitting diode (Organic Light-Emitting Diode, OLED) glass The light sheet is not flexible.
為達成上述之目的,本發明所提供之多片式有機發光二極體可撓燈片模組結構主要包括一軟性印刷電路板(Flexible Printed Circuit,FPC)、複數第一電極導線、至少一第二電極導線及複數有機發光二極體玻璃燈片,其中,該第一電極導線是與該第二電極導線大致上平行設置於軟性印刷電路板上,且該第一電極導線是由軟性印刷電路板之一端向軟性印刷電路板之另一端延伸一距離後,彎折向第二電極導線的方向延伸,且該等第一電極導線延伸向第二電極導線的自由端均預留有第一電性連接區,而該第二電極導線對應該等第一電極連接區之位置也預留有複數第二電極連接區。 In order to achieve the above purpose, the multi-chip organic light emitting diode flexible lamp module structure provided by the present invention mainly includes a flexible printed circuit board (Flexible Printed Circuit, FPC), a plurality of first electrode wires, at least one first Two electrode wires and a plurality of organic light emitting diode glass lamps, wherein the first electrode wires and the second electrode wires are substantially parallel to the flexible printed circuit board, and the first electrode wires are formed by the flexible printed circuit After one end of the board extends a distance to the other end of the flexible printed circuit board, it is bent and extended in the direction of the second electrode wire, and the free ends of the first electrode wires extending to the second electrode wire are all reserved with a first electric wire. A plurality of second electrode connection areas are also reserved at the positions of the second electrode wires corresponding to the first electrode connection areas.
該等有機發光二極體玻璃燈片是可以使用黏膠或UV膠黏貼於軟性印刷電路板上,且各個有機發光二極體玻璃燈片上設有一第二電極 與至少一第一電極,每一個有機發光二極體玻璃燈片均是與軟性印刷電路板上一組對應的第一電性連接區及第二電性連接區相對應,且每一個有機發光二極體玻璃燈片的第一電極及第二電極可以是分別以銀膠、錫焊或ACF(Anisotropic Conductive Film_異方性導電膠)等方式之一與第一電性連接區及第二電性連接區做電性連接。 The organic light emitting diode glass light sheets can be pasted on the flexible printed circuit board using adhesive or UV glue, and each organic light emitting diode glass light sheet is provided with a second electrode With at least one first electrode, each organic light emitting diode glass light piece is corresponding to a set of corresponding first electrical connection regions and second electrical connection regions on the flexible printed circuit board, and each organic light-emitting The first electrode and the second electrode of the diode glass lamp can be connected to the first electrical connection area and the second electrode by one of silver glue, soldering or ACF (Anisotropic Conductive Film_Anisotropic Conductive Film), respectively. The electrical connection area is electrically connected.
其中,上述的有機發光二極體玻璃燈片,其發光面是背向該軟性印刷電路板。 Wherein, the light-emitting surface of the above-mentioned organic light-emitting diode glass lamp sheet is facing away from the flexible printed circuit board.
其中,上述的軟性印刷電路板在各組相對應的第一電性連接區及第二電性連接區間均開設有一開口,而有機發光二極體玻璃燈片其發光面是面向軟性印刷電路板的開口,且有機發光二極體玻璃燈片可以是以銀膠、錫焊或ACF等方式之一與第一電性連接區及第二電性連接區作電性連接,上述銀膠、錫焊或ACF,是從有機發光二極體玻璃燈片側邊,繞至有機發光二極體玻璃燈片相對發光面的另一面與第一電極及第二電極作電性連接。 Wherein, the above-mentioned flexible printed circuit board has an opening in each corresponding first electrical connection area and second electrical connection area, and the light-emitting surface of the organic light emitting diode glass lamp is facing the flexible printed circuit board opening, and the organic light emitting diode glass lamp can be electrically connected to the first electrical connection area and the second electrical connection area by one of silver glue, soldering or ACF, etc. The above-mentioned silver glue, tin The welding or ACF is from the side of the OLED glass lamp piece to the other side of the OLED glass lamp piece opposite to the light-emitting surface for electrical connection with the first electrode and the second electrode.
其中,上述的軟性印刷電路板的複數第一電極導線,是位於第二電極導線之一側或兩側。 Wherein, the plurality of first electrode wires of the above-mentioned flexible printed circuit board are located on one side or both sides of the second electrode wires.
其中,上述軟性印刷電路板上的第二電極導線為兩條或兩條以上時,該等第二電極導線之間設有相互連接的接點。 Wherein, when there are two or more second electrode wires on the flexible printed circuit board, the second electrode wires are provided with interconnected contacts.
1:軟式印刷電路板 1: Flexible printed circuit board
11:第一電極導線 11: The first electrode lead
111:第一電性連接區 111: The first electrical connection area
12:第二電極導線 12: Second electrode lead
121:第二電性連接區 121: the second electrical connection area
122:接點 122: Contact
13:開口 13: Opening
2:有機發光二極體玻璃燈片 2: Organic Light Emitting Diode Glass Lamp
21:發光面 21: Glowing Surface
22:第一電極 22: The first electrode
23:第二電極 23: Second electrode
3:銀膠 3: Silver glue
32:玻璃基板 32: Glass substrate
38:保護層 38: Protective layer
40:陽極 40: Anode
42:有機層 42: Organic layer
44:陰極 44: Cathode
46:乾燥劑 46: Desiccant
48:UV膠 48: UV glue
50:接觸墊 50: Contact pad
52:塑膠基板(PI基板) 52: Plastic substrate (PI substrate)
54:阻隔層 54: Barrier layer
56:薄膜封裝 56: Thin Film Encapsulation
58:保護層 58: Protective layer
60:陽極 60: Anode
62:有機層 62: organic layer
64:陰極 64: Cathode
70:接觸墊 70: Contact pad
圖1為有機發光二極體玻璃燈片之示意圖; 圖2為習知具有可撓性的OLED塑膠基板元件之示意圖;圖3為本發明多片式有機發光二極體可撓燈片模組結構第一實施例之示意圖;圖4為本發明多片式有機發光二極體可撓燈片模組結構第一實施例之組裝示意圖與該虛線A-A之橫切面示意圖;圖5為本發明多片式有機發光二極體可撓燈片模組結構第二實施例之示意圖;圖6為本發明多片式有機發光二極體可撓燈片模組結構第二實施例之組裝示意圖與該虛線B-B之橫切面示意圖;圖7為本發明多片式有機發光二極體可撓燈片模組結構第三實施例之組裝示意圖;圖8為本發明多片式有機發光二極體可撓燈片模組結構第四實施例之示意圖;圖9為本發明多片式有機發光二極體可撓燈片模組結構第五實施例之示意圖;圖10為本發明多片式有機發光二極體可撓燈片模組結構第六實施例之示意圖一;圖11為本發明多片式有機發光二極體可撓燈片模組結構第六實施例之示意圖二;以及圖12為本發明多片式有機發光二極體可撓燈片模組結構第六實施例之示意圖三。 FIG. 1 is a schematic diagram of an organic light emitting diode glass lamp; FIG. 2 is a schematic diagram of a conventional flexible OLED plastic substrate element; FIG. 3 is a schematic diagram of a first embodiment of the structure of a multi-chip organic light emitting diode flexible lamp module according to the present invention; The assembly schematic diagram of the first embodiment of the chip OLED flexible lamp module structure and the cross-sectional schematic diagram of the dotted line A-A; FIG. 5 is the multi-chip OLED flexible lamp module structure of the present invention. The schematic diagram of the second embodiment; FIG. 6 is the assembly schematic diagram of the second embodiment of the multi-chip organic light emitting diode flexible lamp module structure of the present invention and the cross-sectional schematic diagram of the dotted line B-B; FIG. 8 is a schematic diagram of the fourth embodiment of the multi-chip OLED flexible lamp module structure according to the present invention; FIG. 9 It is a schematic diagram of the fifth embodiment of the structure of the multi-chip organic light emitting diode flexible lamp module structure of the present invention; FIG. 10 is the sixth embodiment of the multi-chip organic light emitting diode flexible lamp module structure of the present invention. Schematic 1; FIG. 11 is a schematic diagram 2 of the sixth embodiment of the structure of the multi-chip organic light emitting diode flexible lamp module of the present invention; and FIG. 12 is the multi-chip organic light emitting diode flexible lamp module of the present invention. Schematic diagram 3 of the sixth embodiment of the group structure.
以下將以圖式與附件描述具體之實施例,以說明本發明之實施態樣,惟其並非用以限制本發明所欲保護之範疇。 Specific embodiments will be described below with drawings and appendices to illustrate the implementation of the present invention, but they are not intended to limit the scope of protection of the present invention.
請參閱圖3~4,為本發明多片式有機發光二極體可撓燈片模組結構第一實施例的示意圖及組裝示意圖,本實施例中,主要包括有一軟性印刷電路板1及複數個有機發光二極體玻璃燈片2,該軟性印刷電路板1上平行設置有複數條第一電極導線11及一條第二電極導線12,該第二電極導線12是設在該等第一電極導線11之一側,其中,該等第一電極導線11是由該軟性印刷電路板1之一端朝該軟性刷電路板1之另一端延伸一距離後,彎折向該第二電極導線12方向延伸,且該等第一電極導線11朝向第二電極導線12之自由端,均預留有一第一電性連接區111,該第二電極導線12上設有複數與該等第一電性連接區111相同數量的第二電性連接區121,且該等第二電性連接區121是分別對應該等第一電性連接區111的位置。
Please refer to FIGS. 3 to 4 , which are schematic diagrams and assembly diagrams of the first embodiment of the structure of the multi-chip organic light emitting diode flexible lamp module according to the present invention. In this embodiment, it mainly includes a flexible printed
該等有機發光二極體玻璃燈片2均包括一發光面21、一第一電極22及一第二電極23,該等有機發光二極體玻璃燈片2是以黏膠或UV膠黏貼於該軟式印刷電路板1上,且該等有機發光二極體玻璃燈片2之發光面21是背向該軟性印刷電路板1,同時,每一個有機發光二極體玻璃燈片2,是分別與一組對應的第一電性連接區111及第二電性連接區121以銀膠、錫焊或ACF(Anisotropic Conductive Film_異方性導電膠)做電性連接,其中,第一電極22是與第一電性連接區111電性連接,第二電極23是與第二電性連接區121連接。
The organic light emitting diode
由上所述,在第一實施例中,該等有機發光二極體玻璃燈片
2是黏貼於軟式印刷電路板1上,而由於軟式印刷電路板1本身具可撓性,因此,可依據需求將軟式印刷電路板1彎折至所需的曲度,並利用其上所設之複數有機發光二極體玻璃燈片2的發光面21進行發光,以克服有機發光二極體玻璃燈片2本身不具可撓性之問題。同時,由於每一個有機發光二極體玻璃燈片2,均是分別與一組相對應第一電性連接區111及第二電性連接區121電性連接,因此,每一個有機發光二極體玻璃燈片2均可單獨控制是否進行發光,及可控制每一個有機發光二極體玻璃燈片2發光的光色與其他有機發光二極體玻璃燈片2發光的光色相同或不同。此外,為了縮減軟式印刷電路板1的寬度,該等第一電極導線11走線,亦可配置於有機發光二極體玻璃燈片2之下,以節省軟式印刷電路板1的使用,並增加本發明燈片模組結構的可撓性。
From the above, in the first embodiment, the organic light emitting
請參閱圖5~6,為本發明多片式有機發光二極體可撓燈片模組結構的第二實施例,在本實施例中,主要包括有一軟性印刷電路板1及複數個有機發光二極體玻璃燈片2,該軟性印刷電路板1上平行設置有複數條第一電極導線11及一條第二電極導線12,該第二電極導線12是設在該等第一電極導線11之一側,其中,該等第一電極導線11是由該軟性印刷電路板1之一端朝該軟性刷電路板1之另一端延伸一距離後彎折向該第二電極導線12方向延伸,且該等第一電極導線11朝向第二電極導線12之自由端均預留有一第一電性連接區111,該第二電極導線12上設有複數與該等第一電性連接區111相同數量的第二電性連接區121,且該等第二電性連接區121是分別對應該等第一電性連接區111的位置,另外,該軟性印刷電路板1上於該等第一電極導線11及該等第二電極導線12之間開設有複數個開口13,每一開
口13的位置均分別對應一組相對應的第一電性連接區111及第二電性連接區121。
Please refer to FIGS. 5-6 , which are the second embodiment of the multi-chip organic light emitting diode flexible lamp module structure of the present invention. In this embodiment, it mainly includes a flexible printed
該等有機發光二極體玻璃燈片2均包括一發光面21、一第一電極22及一第二電極23,該等有機發光二極體玻璃燈片2是以黏膠或UV膠黏貼於該軟式印刷電路板1上,該等有機發光二極體玻璃燈片2之發光面21均是面向該軟性印刷電路板1的開口13,同時,每一個有機發光二極體玻璃燈片2是分別與一組對應的第一電性連接區111及第二電性連接區121以銀膠3或、錫焊做電性連接,其中,銀膠3或錫焊是從有機發光二極體玻璃燈片2側邊,繞至有機發光二極體玻璃燈片2相對發光面21的另一面,與第一電極22與第二電極23作電性連接。
The organic light emitting diode
由上所述,在第二實施例中,該等有機發光二極體玻璃燈片2透過發光面21所發的光,會通過軟式印刷電路板1的開口13,且由於每一個有機發光二極體玻璃燈片2,均是分別與一組相對應第一電性連接區111及第二電性連接區121電性連接,因此,每一個有機發光二極體玻璃燈片2均可單獨控制是否進行發光,及可控制每一個有機發光二極體玻璃燈片2發光的光色與其他有機發光二極體玻璃燈片2發光的光色相同或不同,且由於該等有機發光二極體玻璃燈片2是黏貼於軟式印刷電路板1上,而由於軟式印刷電路板1本身具可撓性,因此,可依據需求將軟式印刷電路板1彎折至所需的曲度,並利用其上所設之複數有機發光二極體玻璃燈片2進行發光,以克服有機發光二極體玻璃燈片2本身不具可撓性之問題。
From the above, in the second embodiment, the light emitted by the organic light emitting diode
請參閱圖7,為本發明多片式有機發光二極體可撓燈片模組結構的第三實施例,在本實施例中,主要包括一軟性印刷電路板1及複數個
有機發光二極體玻璃燈片2,該軟性印刷電路板1上平行設置有一條第二電極導線12及複數條第一電極導線11,其中該等第一電極導線11是設於該第二電極導線12的兩側,該第二電極導線12上預留有複數第二電性連接區121,該等設於該第二電極導線12兩側之第一電極導線11均是由該軟式印刷電路板1之一端,向該軟式印刷電路板1之另一端延伸一距離後彎折向該第二電極導線12方向延伸,且該等第一電極導線11朝向第二電極導線12之自由端,均預留有一與該等第二電性連接區121對應的第一電性連接區111。
Please refer to FIG. 7 , which is the third embodiment of the structure of the multi-chip organic light emitting diode flexible lamp module structure of the present invention. In this embodiment, it mainly includes a flexible printed
該等有機發光二極體玻璃燈片2均包括一發光面21、二第一電極22及一第二電極23,該等第一電極22是分別設於該第二電極23的兩側,該等有機發光二極體玻璃燈片2是以黏膠或UV膠黏貼於該軟式印刷電路板1上,該等有機發光二極體玻璃燈片2之發光面21是背向該軟性印刷電路板1,同時,每一個有機發光二極體玻璃燈片2是分別與一組對應的第一電性連接區111及第二電性連接區121以銀膠、錫焊或ACF(Anisotropic Conductive Film_異方性導電膠)做電性連接,其中,第二電極23是與第二電性連接區121連接,而第一電極22是分別與第二電性連接區121兩側的第一電性連接區111做電性連接。
The organic light emitting
由上所述,在第三實施例中,該等有機發光二極體玻璃燈片2是黏貼於軟式印刷電路板1上,而由於軟式印刷電路板1本身具可撓性,因此,可依據需求將軟式印刷電路板1彎折至所需的曲度,並利用其上所設之複數有機發光二極體玻璃燈片2的發光面21進行發光,以克服有機發光二極體玻璃燈片2本身不具可撓性之問題。同時,由於每一個有機發光二極體玻璃燈片2均是分別與一組相對應的第一電性連接區111及第二電性連接區
121做電性連接,因此,每一個有機發光二極體玻璃燈片2均可單獨控制是否進行發光,及可控制每一個有機發光二極體玻璃燈片2發光的光色與其他有機發光二極體玻璃燈片2發光的光色相同或不同。
From the above, in the third embodiment, the organic light emitting diode
再者,由於第三實施例中,每一個有機發光二極體玻璃燈片2均具有兩個第一電極22,且每一個第一電極22均與一條第一電極導線11的第一電性連接區111做電性連接,因此,每一個有機發光二極體玻璃燈片2均可利用兩個第一電極22,同時控制發光面21進行發光,或者也可以讓兩個第一電極將發光面區21分成兩個區域,而由兩個電極22分別控制其中一個區域進行發光,進而達到使同一個發光面21可發出相同的光色與圖案或不同的光色與圖案。
Furthermore, because in the third embodiment, each organic light emitting diode
請參閱圖8,為本發明多片式有機發光二極體可撓燈片模組結構的第四實施例,在第四實施例中,主要包括一軟式印刷電路板1及複數有機發光二極體玻璃燈片2,該軟式印刷電路板1上設有兩條相互平行的第二電極導線12,且該等第二電極導線12的同一側,均設有複數條與第二電極導線12平行的第一電極導線11,而該等有機發光二極體玻璃燈片2,是設於該等第二電極導線12與其一側的該等第一電極導線11之間。亦即第四實施例為兩個第一實施例的組合。
Please refer to FIG. 8 , which is a fourth embodiment of the structure of a multi-chip organic light emitting diode flexible lamp module according to the present invention. In the fourth embodiment, it mainly includes a flexible printed
另外,請參閱圖9,為本發明多片式有機發光二極體可撓燈片模組結構的第五實施例,而在第五實施例中,該軟式印刷電路板1上設有三條相互平行的第二電極導線12,且該等第二電極導線12的同一側均設有複數條與第二電極導線12平行的第一電極導線11,而該等有機發光二極體玻璃燈片2是設於該等第二電極導線12與其一側的該等第一電極導線11之
間,亦即第五實施例為三個第一實施例的組合,由上所述,本發明多片式有機發光二極體可撓燈片模組結構,係可透過組合多個第一實施例,來擴充一軟性印刷電路板1上有機發光二極體玻璃燈片2的數量,同時也使有機發光二極體在軟性印刷電路板上不僅可以單排設置也可多排設置,進而增加本發明多片式有機發光二極體可撓燈片模組結構的使用範疇,而不致被限制僅能提供複數單一排列的有機發光二極體玻璃燈片2,同時,以此為例,本發明多片式有機發光二極體可撓燈片模組結構,也可透過組合多個第二實施例或第三實施例,或將第一實施例、第二實施例與第三實施例其中至少兩種進行組合,以使本發明多片式有機發光二極體可撓燈片模組結構在應用上能更加的多樣化,避免限制本發明的使用範圍。
In addition, please refer to FIG. 9 , which is a fifth embodiment of the structure of the multi-chip organic light emitting diode flexible lamp module structure of the present invention, and in the fifth embodiment, the flexible printed
另外,請參閱圖10~12,為本發明多片式有機發光二極體可撓燈片模組結構的第六實施例,在圖10中,該第二電極導線12為單獨一條設置在軟式印刷電路板1上的設置方式,且該第二電極導線12上設有複數個預設的預留的第二電性連接區121,然而此種設置的方式,會出現電流經過的第二電性連接區121的數量越多,而導致設置在第二電極導線12越後方的第二電性連接區121的電壓降(IR drop)越大,致使有機發光二極體玻璃燈片2依據排列位置的前後,而出現發光亮度越來越弱的狀況。
In addition, please refer to FIGS. 10-12 , which are the sixth embodiment of the structure of the multi-chip organic light emitting diode flexible light sheet module according to the present invention. In FIG. 10 , the
因此,如圖11所示,本發明多片式有機發光二極體可撓燈片模組結構的軟式印刷電路板1可設置兩條相鄰的第二電極導線12a、12b,其中一條第二電極導線12a上依舊預留有複數第二電性連接區121,另一條第二電極導線12b上並未設置第二電性連接區121,而是在其末端以一接點122與設有第二電性連接區121的第二電極導線12a末端連接,透過此種設計,
當電流由設有第二電性連接區121的第二電極導線12a兩端輸入,以有效改善因電流通過多個第二電性連接區121,而導致有機發光二極體玻璃燈片2發光亮度減弱的狀況。
Therefore, as shown in FIG. 11 , the flexible printed
另外,如圖12所示,前述接點122的設置也不限制僅在連接兩條第二電極導線12a、12c的末端,其同樣可以設置於連接兩條第二電極導線12a、12c的中間位置及末端,透過同時由設有第二電性連接區121的第二電極導線12a兩端及中間輸入電流的方式,進而使得每一個有機發光二極體玻璃燈片2的發光效果一致,避免有機發光二極體玻璃燈片2的發光效果因所設置的位置而產生不同。
In addition, as shown in FIG. 12 , the arrangement of the
再者,由於第一電極導線的長度也會影響電流通過的強弱,因此,本發明多片式有機發光二極體可撓燈片模組結構中,軟性印刷電路板1上的複數第一電極導線12越長,其第一電極導線的寬度也越粗(圖中未示),用以減少第一電及導線長度對電流通過的影響。
Furthermore, since the length of the first electrode wire will also affect the strength of the current passing through, therefore, in the multi-chip OLED flexible lamp module structure of the present invention, the plurality of first electrodes on the flexible printed
綜上所陳,本發明所提供的多片式有機發光二極體可撓燈片模組結構,透過將有機發光二極體玻璃燈片2與軟性印刷電路板1結合,以藉由軟性印刷電路板1的可彎曲性,讓由多個有機發光二極體玻璃燈片2組成之模組具可撓性,且由於現有有機發光二極體玻璃燈片2的封裝製程成熟且成本也較低,因此相較以PI基板製成的OLED元件而言,本發明多片式有機發光二極體可撓燈片模組結構更具經濟效益及市場競爭力。
To sum up, in the multi-piece OLED flexible lamp module structure provided by the present invention, by combining the organic light emitting
上列詳細說明係針對本發明之一可行實施例之具體說明,惟該實施例並非用以限制本發明之專利範圍,凡未脫離本發明技藝特徵所為之等效實施或變更,均應包含於本案之專利範圍中。 The above detailed description is a specific description of a feasible embodiment of the present invention, but this embodiment is not intended to limit the patent scope of the present invention. Any equivalent implementation or modification that does not depart from the technical characteristics of the present invention shall be included in the within the scope of the patent in this case.
1‧‧‧軟式印刷電路板 1‧‧‧Flexible Printed Circuit Board
11‧‧‧第一電極導線 11‧‧‧First electrode lead
111‧‧‧第一電性連接區 111‧‧‧First electrical connection area
12‧‧‧第二電極導線 12‧‧‧Second electrode lead
121‧‧‧第二電性連接區 121‧‧‧Second electrical connection area
2‧‧‧有機發光二極體玻璃燈片 2‧‧‧Organic Light Emitting Diode Glass Lamp
21‧‧‧發光面 21‧‧‧Light-emitting surface
22‧‧‧第一電極 22‧‧‧First electrode
23‧‧‧第二電極 23‧‧‧Second electrode
Claims (10)
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201117376A (en) * | 2009-09-08 | 2011-05-16 | Global Oled Technology Llc | Tiled display with overlapping flexible substrates |
| TW201216760A (en) * | 2010-10-11 | 2012-04-16 | Au Optronics Corp | Organic light-emitting diode module |
| US20150103519A1 (en) * | 2011-08-04 | 2015-04-16 | Universal Display Corporation | Organic light emitting device assembly |
| TW201535182A (en) * | 2014-03-06 | 2015-09-16 | Wintek Corp | Flexible device and method for manufacturing the same |
| TWI622195B (en) * | 2017-05-11 | 2018-04-21 | Luminescence Technology Corporation | Structure and manufacturing method of horizontal tandem organic photovoltaic element |
-
2019
- 2019-07-22 TW TW108125802A patent/TWI778282B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201117376A (en) * | 2009-09-08 | 2011-05-16 | Global Oled Technology Llc | Tiled display with overlapping flexible substrates |
| TW201216760A (en) * | 2010-10-11 | 2012-04-16 | Au Optronics Corp | Organic light-emitting diode module |
| US20150103519A1 (en) * | 2011-08-04 | 2015-04-16 | Universal Display Corporation | Organic light emitting device assembly |
| TW201535182A (en) * | 2014-03-06 | 2015-09-16 | Wintek Corp | Flexible device and method for manufacturing the same |
| TWI622195B (en) * | 2017-05-11 | 2018-04-21 | Luminescence Technology Corporation | Structure and manufacturing method of horizontal tandem organic photovoltaic element |
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