TWI777566B - Splicing electronic device and driving method - Google Patents
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
- G06F3/1423—Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display
- G06F3/1446—Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display display composed of modules, e.g. video walls
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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Abstract
Description
本案涉及一種電子裝置及驅動方法。詳細而言,本案涉及一種拼接電子裝置及驅動方法。This case relates to an electronic device and a driving method. In detail, this case relates to a splicing electronic device and a driving method.
現今拼接裝置用以同步顯示分割畫面,每一拼接屏幕之空間需設計連接閘口,藉以互相連接。因此,拼接屏幕之空間無法作有效率的運用。Today's splicing devices are used to synchronously display split screens, and each splicing screen space needs to be designed with a connection gate to connect to each other. Therefore, the space of the splicing screen cannot be used efficiently.
此外,拼接裝置更用以實現觸控的功能。拼接裝置之電容式觸控面板經常無法快速辨別導體或非導體的觸控。In addition, the splicing device is further used to realize the touch function. Capacitive touch panels for splicing devices often cannot quickly distinguish between conductive and non-conductive touches.
因此,上述技術尚存諸多缺陷,而有待本領域從業人員研發出其餘適合的觸控感測電路。Therefore, the above technology still has many defects, and other suitable touch sensing circuits need to be developed by practitioners in the art.
本案的一面向涉及一種拼接電子裝置。拼接電子裝置包含複數個屏幕。複數個屏幕位於基板之上,並包含主屏幕及複數個副屏幕。主屏幕用以接收第一顯示訊號,藉以輸出複數個第二顯示訊號。複數個副屏幕依序拼接於主屏幕,藉以接收複數個第二顯示訊號。主屏幕及複數個副屏幕用以於第一階段分別根據第一顯示訊號及複數個第二顯示訊號共同顯示畫面。主屏幕及複數個副屏幕用以於第二階段接收觸控訊號。One aspect of the present case relates to a splicing electronic device. The tiled electronic device includes a plurality of screens. A plurality of screens are located on the substrate, and include a main screen and a plurality of sub-screens. The main screen is used for receiving the first display signal, so as to output a plurality of second display signals. A plurality of sub-screens are sequentially spliced to the main screen, so as to receive a plurality of second display signals. The main screen and the plurality of sub-screens are used to jointly display a picture according to the first display signal and the plurality of second display signals respectively in the first stage. The main screen and the plurality of sub-screens are used for receiving touch signals in the second stage.
本案的另一面向涉及一種驅動方法,適用於一種拼接電子裝置。驅動方法包含以下步驟:於第一階段取得拼接電子裝置之複數個屏幕之位置資訊;於第一階段根據複數個屏幕之位置資訊設定複數個屏幕之主屏幕之位置;於第一階段傳送第一顯示訊號至主屏幕;於第一階段藉由主屏幕根據第一顯示訊號依序輸出複數個第二顯示訊號至複數個屏幕之複數個副屏幕;於第一階段藉由主屏幕及複數個副屏幕分別根據第一顯示訊號及複數個第二顯示訊號以顯示複數個分割畫面;以及於第二階段驅動複數個屏幕以接收物體之觸控訊號。Another aspect of the present application relates to a driving method, which is suitable for a splicing electronic device. The driving method includes the following steps: obtaining the position information of the plurality of screens of the spliced electronic device in the first stage; setting the positions of the main screens of the plurality of screens according to the position information of the plurality of screens in the first stage; transmitting the first stage in the first stage Display signals to the main screen; in the first stage, the main screen sequentially outputs a plurality of second display signals to a plurality of sub-screens of the plurality of screens according to the first display signal; in the first stage, the main screen and a plurality of sub-screens are used The screen displays a plurality of divided screens according to the first display signal and the plurality of second display signals respectively; and drives the plurality of screens in the second stage to receive the touch signal of the object.
以下將以圖式及詳細敘述清楚說明本案之精神,任何所屬技術領域中具有通常知識者在瞭解本案之實施例後,當可由本案所教示之技術,加以改變及修飾,其並不脫離本案之精神與範圍。The following will clearly illustrate the spirit of this case with drawings and detailed descriptions. Anyone with ordinary knowledge in the technical field who understands the embodiments of this case can make changes and modifications by using the techniques taught in this case, which does not deviate from the principles of this case. spirit and scope.
本文之用語只為描述特定實施例,而無意為本案之限制。單數形式如“一”、“這”、“此”、“本”以及“該”,如本文所用,同樣也包含複數形式。The language used herein is for the purpose of describing particular embodiments and is not intended to be limiting. The singular forms such as "a", "the", "the", "this" and "the", as used herein, also include the plural forms.
關於本文中所使用之『包含』、『包括』、『具有』、『含有』等等,均為開放性的用語,即意指包含但不限於。 關於本文中所使用之用詞(terms),除有特別註明外,通常具有每個用詞使用在此領域中、在本案之內容中與特殊內容中的平常意義。某些用以描述本案之用詞將於下或在此說明書的別處討論,以提供本領域技術人員在有關本案之描述上額外的引導。 The terms "comprising", "including", "having", "containing", etc. used in this document are all open-ended terms, meaning including but not limited to. Regarding the terms (terms) used in this article, unless otherwise specified, they usually have the ordinary meaning of each term used in this field, in the content of this case and in the special content. Certain terms used to describe the present case are discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance in the description of the present case.
第1A圖為根據本案一些實施例繪示的拼接電子裝置1000之示意圖。在一些實施例中,請參閱第1A圖,拼接電子裝置1000包含基板(圖中未示)及複數個屏幕1100。複數個屏幕1100位於基板之上。複數個屏幕1100之屏幕數量為4個。複數個屏幕1100包含屏幕1110、屏幕1120、屏幕1130及屏幕1140。屏幕1120拼接於屏幕1110之右側邊界(圖式右側)。屏幕1130沿相同方向拼接於屏幕1120之右側邊界。屏幕1140再沿相同方向拼接於屏幕1130之右側邊界。換言之,屏幕1110、屏幕1120、屏幕1130及屏幕1140排列於同一橫列上。須說明的是,複數個屏幕1100之間的間隙或拼接區具有一定寬度,以使得拼接電子裝置1000能折疊。須注意的是,本案之拼接方式雖往右側延展,但不以圖式實施例為限。FIG. 1A is a schematic diagram of a splicing
第1B圖為根據本案一些實施例繪示的拼接電子裝置1000A之示意圖。在一些實施例中,請參閱第1B圖,相較於第1A圖之拼接電子裝置1000,拼接電子裝置1000A之屏幕數量增為6個。拼接電子裝置1000A之拼接形狀變更為3直行2橫列的排列方式。拼接電子裝置1000A包含基板(圖中未示)及複數個屏幕1100A。複數個屏幕1100A包含屏幕1110A、屏幕1120A、屏幕1130A、屏幕1140A、屏幕1150A及屏幕1160A。屏幕1120A拼接於屏幕1110A之右側邊界(圖式右側)。屏幕1130A拼接於屏幕1120A之右側邊界。屏幕1140A拼接於屏幕1130A之下側邊界(圖式下側)。屏幕1150A拼接於屏幕1120A之下側邊界及屏幕1140之左側邊界(圖式左側)。屏幕1160A拼接於屏幕1110A之下側邊界及屏幕1150A之左側邊界。須說明的是,複數個屏幕1100A之間的間隙或拼接區具有一定寬度,以使得拼接電子裝置1000A能折疊。須注意的是,拼接方式雖依照標號順序拼接,但不以圖式實施例為限。FIG. 1B is a schematic diagram of a splicing
在一些實施例中,請參閱第1A圖及第1B圖,屏幕之屏幕數量不以圖式實施例為限。In some embodiments, please refer to FIG. 1A and FIG. 1B , the number of screens on the screen is not limited to the embodiment shown in the drawings.
第2圖為根據本案一些實施例繪示的拼接電子裝置1000之詳細電路方塊示意圖。在一些實施例中,請參閱第1A圖至第2圖,第2圖之拼接電子裝置1000對應至第1A圖之拼接電子裝置1000或第1B圖之拼接電子裝置1000A。FIG. 2 is a detailed circuit block diagram of the splicing
在一些實施例中,請參閱第2圖,拼接電子裝置1000包含複數個屏幕1100及裝置管理端1200。複數個屏幕1100包含主屏幕1110及複數個副屏幕(屏幕1120及屏幕1130)。主屏幕1110包含電源1111、處理器1112、時序控制器1113、顯示面板1114、觸控電極層1115及裝置控制器1119。副屏幕1120包含電源1121、處理器1122、時序控制器1123、顯示面板1124及觸控電極層1125。副屏幕1130包含電源1131、處理器1132、時序控制器1133、顯示面板1134及觸控電極層1135。須說明的是,僅主屏幕1110具有裝置控制器1119。In some embodiments, please refer to FIG. 2 , the splicing
在一些實施例中,請參閱第1A圖及第2圖,裝置管理端1200用以偵測第1A圖之屏幕數量及拼接形狀,以產生顯示訊號DS1。In some embodiments, please refer to FIG. 1A and FIG. 2 , the
在一些實施例中,請參閱第1B圖及第2圖,裝置管理端1200用以偵測第1B圖之屏幕數量及拼接形狀,以產生顯示訊號DS1。In some embodiments, please refer to FIG. 1B and FIG. 2 , the
在一些實施例中,請參閱第2圖,電源1111用以提供主屏幕1110所需之電壓。電源1121用以提供副屏幕1120所需之電壓。電源1131用以提供副屏幕1130所需之電壓。在一些實施例中,電源1111用以提供電源1121及電源1131電壓,以再提供給副屏幕1120及副屏幕1130所需的電壓。In some embodiments, please refer to FIG. 2 , the
在一些實施例中,裝置控制器1119用以接收顯示訊號DS1。裝置控制器1119根據顯示訊號DS1取得主屏幕1110的顯示資料以及複數個副屏幕(屏幕1120及屏幕1130)之顯示訊號(顯示訊號DS2及顯示訊號DS3)。在一些實施例中,裝置控制器1119根據顯示訊號DS1輸出控制訊號CS1至處理器1112。在一些實施例中,裝置控制器1119具有無線通訊之功能以接收顯示訊號DS1。In some embodiments, the
在一些實施例中,處理器1112根據控制訊號CS1輸出時序控制訊號TS1至時序控制器1113。在一些實施例中,處理器1112用以接收控制訊號CS1,藉以傳送顯示訊號DS2至副屏幕1120之處理器1122以及傳送顯示訊號DS3至副屏幕1130之處理器1132。在一些實施例中,處理器1112可分別傳送顯示訊號DS2及顯示訊號DS3至對應的副屏幕。在一些實施例中,處理器1112可傳送顯示訊號DS2及顯示訊號DS3至次級的處理器1122,再藉由次級處理器1122將顯示訊號傳送至下一級處理器1132。須說明的是,該些處理器傳送顯示訊號的順序及路徑不以圖式實施例為限。In some embodiments, the
第3A圖為根據本案一些實施例繪示的之拼接電子裝置1000之電路方塊示意圖。在一些實施例中,如第3A圖所示,第3A圖之電路架構對應至第2圖之複數個屏幕1100其中一者。拼接電子裝置1000更包含驅動積體電路(driving integrated circuit)1116以及觸控電路1117。FIG. 3A is a schematic circuit block diagram of a splicing
在一些實施例中,驅動積體電路1116耦接於時序控制器1113及顯示面板1114。觸控電路1117耦接於時序控制器1113及觸控電極層1115。In some embodiments, the driving
在一些實施例中,請參閱第2圖及第3A圖,上述處理器1112、處理器1122及處理器1132包含中央處理器(Central Processing Unit, CPU)、通信處理器及高階運算功能的超級電腦其中至少一個。在一些實施例中,高階運算功能的超級電腦包含精簡指令集電腦(reduced instruction set computer, RISC)及進階精簡指令集機器(Advanced RISC Machine)。In some embodiments, please refer to FIG. 2 and FIG. 3A, the
在一些實施例中,請參閱第3A圖,時序控制器1113用以提供圖像訊號至驅動積體電路1116。時序控制器1113可同時控制複數個驅動積體電路以控制屏幕的顯示畫面或分割畫面。在一些實施例中,時序控制器1113用以接收從處理器1112的複數種訊號。複數種訊號用以控制拼接電子裝置以進行顯示或觸控。複數種訊號包含輸入訊號、水平同步訊號(horizontal synchronizing signal)、重直同步訊號(vertical synchronizing signal),主時鐘訊號(master clock signal)、掃描控制訊號、數據控制訊號及發光控制訊號。In some embodiments, please refer to FIG. 3A , the
在一些實施例中,驅動積體電路1116用以提供控制訊號,藉以控制位於拼接電子裝置1000之薄膜電晶體基板上的複數條控制線(圖中未示)。在一些實施例中,顯示面板1114採用類似於內嵌式觸控技術(In cell touch),複數條控制線耦接於拼接電子裝置1000中的每一發光二極體(圖中未示) ,發光二極體包含微發光二極體 (micro light diode , μ-LED) ,與觸控電極一同設置在包含積體電路的基板上,進一步來說,積體電路包含薄膜電晶體(Thin-Film Transistor, TFT)或微驅動積體電路(Micro driver integrated circuit)。與常見的內崁式觸控面板相同的是,相較於外掛式觸控面板將觸控感應器外置於液晶顯示模組上,可以減少整體厚度並簡化製程。In some embodiments, the driving
在一些實施例中,觸控電路1117用以驅動觸控電極層1115之紅外線發光二極體(Infrared light-emitting diode, IR LED),藉以感應物體之觸控訊號。在一些實施例中,觸控電路1117用以接收觸控電極層1115之紅外線感應器、光學感應器及電容器之觸控訊號。In some embodiments, the
第3B圖為根據本案一些實施例繪示的之拼接電子裝置1000之部分結構之側視示意圖。在一些實施例中,請參閱第3B圖,第3B圖之結構位於第2圖之每一複數個屏幕1100中。第3B圖之結構包含基板B、積體電路IC1~IC6、發光二極體L1~L3、紅外線發光二極體IL1、紅外線感測器IS1以及光感測器PS1。FIG. 3B is a schematic side view of a partial structure of the spliced
在一些實施例中,基板B包含玻璃基板、柔性基板、印刷電路板(Printed circuit board, PCB)。In some embodiments, the substrate B includes a glass substrate, a flexible substrate, and a printed circuit board (PCB).
在一些實施例中,積體電路IC1~IC6包含薄膜電晶體(Thin-Film Transistor, TFT)或微驅動積體電路(Micro driver integrated circuit)。In some embodiments, the integrated circuits IC1 to IC6 include thin film transistors (Thin-Film Transistor, TFT) or micro driver integrated circuits (Micro driver integrated circuits).
在一些實施例中,積體電路IC1~IC6、發光二極體L1~L3、紅外線發光二極體IL1、紅外線感測器IS1以及光感測器PS均位於基板B之上。須說明的是,結構的排列方式及數量不以圖式實施例為限。In some embodiments, the integrated circuits IC1 ˜ IC6 , the light emitting diodes L1 ˜ L3 , the infrared light emitting diode IL1 , the infrared sensor IS1 and the photo sensor PS are all located on the substrate B. It should be noted that the arrangement and quantity of the structures are not limited to the embodiments in the drawings.
在一些實施例中,發光二極體L1~L3包含微發光二極體 (micro light diode , μ-LED)用以顯示畫面。紅外線發光二極體IL1用以發出紅外線以感測目標物。紅外線感測器IS1用以接收紅外線訊號。光感測器PS1用以感測光強度。In some embodiments, the light-emitting diodes L1-L3 include micro light-emitting diodes (μ-LEDs) for displaying images. The infrared light emitting diode IL1 is used for emitting infrared rays to sense the target. The infrared sensor IS1 is used for receiving infrared signals. The light sensor PS1 is used for sensing light intensity.
第4圖為根據本案一些實施例繪示的拼接電子裝置1000之觸控感測電路示意圖。在一些實施例中,請參閱第3A圖至第4圖,第4圖之觸控感測電路位於第3A圖之觸控電極層1115及觸控電路1117其中至少一者。第4圖之觸控感測電路包含第一電路EC1、第二電路EC2、儲存電容Cst及耦合電容Cm。FIG. 4 is a schematic diagram of a touch sensing circuit of the splicing
在一些實施例中,第一電路EC1用以根據從觸控電極層1115的觸控訊號以決定儲存電容Cst之電壓準位。須說明的是,當使用者手指觸控拼接電子裝置1000時,使用者手指之電容會影響耦合電容Cm。第4圖之觸控感測電路之第一電路EC1響應耦合電容Cm之電位變化,藉以記錄耦合電容Cm之電位變化於儲存電容Cst。在一些實施例中,第一電路EC1包含放大器OP2及電容Cs。In some embodiments, the first circuit EC1 is used to determine the voltage level of the storage capacitor Cst according to the touch signal from the
在一些實施例中,第二電路EC2包含放大器OP1及二極體D1。二極體D1之陰極端耦接於第一電路EC1及放大器OP1之第一輸入端。二極體D1之陽極端耦接於放大器OP1之輸出端。第一電路EC1及第二電路EC2根據觸控訊號共同決定儲存電容Cst之電壓準位。In some embodiments, the second circuit EC2 includes an amplifier OP1 and a diode D1. The cathode terminal of the diode D1 is coupled to the first circuit EC1 and the first input terminal of the amplifier OP1. The anode terminal of the diode D1 is coupled to the output terminal of the amplifier OP1. The first circuit EC1 and the second circuit EC2 jointly determine the voltage level of the storage capacitor Cst according to the touch signal.
在一些實施例中,為使本案之觸控感測電路之驅動方法易於理解,請一併參閱第4圖及第5圖,第5圖為根據本案一些實施例繪示的之觸控感測電路之驅動訊號示意圖。In some embodiments, in order to make the driving method of the touch sensing circuit of the present application easy to understand, please refer to FIG. 4 and FIG. 5 together, and FIG. 5 illustrates the touch sensing according to some embodiments of the present application. Schematic diagram of the driving signal of the circuit.
在一些實施例中,V Drive為交流電源。開關S1用以驅動第二電路EC2。開關S2及開關S3用以驅動第一電路EC1。V Cst為儲存電容Cst兩端之電位。在一些實施例中,開關S1、開關S2及開關S3包含電晶體及訊號源至少其中一者。須說明的是,開關S1、開關S2及開關S3用以表達訊號的輸入位置,並不以圖式實施例為限。 In some embodiments, V Drive is an AC power source. The switch S1 is used to drive the second circuit EC2. The switch S2 and the switch S3 are used to drive the first circuit EC1. V Cst is the potential across the storage capacitor Cst. In some embodiments, switch S1 , switch S2 and switch S3 include at least one of a transistor and a signal source. It should be noted that the switch S1 , the switch S2 and the switch S3 are used to express the input position of the signal, and are not limited to the embodiment shown in the drawings.
在一些實施例中,請參閱第4圖及第5圖,本案之第二電路EC2並聯第一電路EC1,並藉由第二電路EC2內部的放大器OP1及二極體D1以快速累積於儲存電容Cst之電位V
Cst。詳細而言,於非導體感測的情況下,交流電源V
Drive需持續提供電壓。當交流電源V
Drive為正電位時,第二電路EC2根據開關S1導通,以於儲存電容Cst累績交流電源V
Drive之正電位。此時,第一電路EC1不導通。當交流電源V
Drive為負電位時,第一電路EC1根據開關S3導通,以於儲存電容Cst累績交流電源V
Drive之負電位。此時,第二電路EC2不導通。據此,本案藉由第一電路EC1及第二電路EC2交替導通以將感測的電荷以快速累積於儲存電容Cst。須說明的是,上述觸控電極層1115包含兩種電容以進行導體或非導體之感測。當導體觸控拼接電子裝置1000時,兩種電容均會變小。當非導體觸控拼接電子裝置1000時,兩種電容之一者會變大,兩種電容之另中一者會變小。藉由兩種電容之變化以辨別導體或非導體。
In some embodiments, please refer to FIG. 4 and FIG. 5, the second circuit EC2 in this case is connected in parallel with the first circuit EC1, and is quickly accumulated in the storage capacitor by the amplifier OP1 and the diode D1 inside the second circuit EC2 The potential V Cst of Cst . Specifically, in the case of non-conductor sensing, the AC power source V Drive needs to continuously provide voltage. When the AC power V Drive is at a positive potential, the second circuit EC2 is turned on according to the switch S1 to accumulate the positive potential of the AC power V Drive in the storage capacitor Cst. At this time, the first circuit EC1 is not turned on. When the AC power V Drive is at a negative potential, the first circuit EC1 is turned on according to the switch S3 to accumulate the negative potential of the AC power V Drive in the storage capacitor Cst. At this time, the second circuit EC2 is not turned on. Accordingly, in this case, the first circuit EC1 and the second circuit EC2 are turned on alternately to quickly accumulate the sensed charges in the storage capacitor Cst. It should be noted that the above-mentioned
在一些實施例中,請參閱第4圖及第5圖,本案之第二電路EC2將儲存電容Cst兩端之電位V Cst抬升至電位V1。在相同時間下,現今觸控電路架構僅能將儲存電容Cst兩端之電位V Cst抬升至電位V2。在一些實施例中,如第5圖所示,電位V1約為電位V2之兩倍,但不以圖式實施例為限。 In some embodiments, please refer to FIG. 4 and FIG. 5 , the second circuit EC2 in this case raises the potential V Cst across the storage capacitor Cst to the potential V1 . At the same time, the current touch circuit structure can only raise the potential V Cst across the storage capacitor Cst to the potential V2. In some embodiments, as shown in FIG. 5 , the potential V1 is approximately twice the potential V2 , but is not limited to the embodiment shown in the figure.
在一些實施例中,為使本案之驅動方法易於理解,請一併參閱第1A圖至第6圖,第6圖為根據本案一些實施例繪示的驅動方法600之步驟流程示意圖。驅動方法600包含以下步驟:In some embodiments, in order to make the driving method of the present application easy to understand, please refer to FIGS. 1A to 6 together. FIG. 6 is a schematic diagram illustrating the steps of the
於步驟610中,取得拼接電子裝置之複數個屏幕之位置資訊。In
在一些實施例中,請參閱第1A圖、第2圖及第6圖,裝置管理端1200取得第1A圖之拼接裝置1000之屏幕數量為4個,拼接裝置1000之拼接形狀為一橫列,此為第1A圖之屏幕之位置資訊。In some embodiments, please refer to FIG. 1A , FIG. 2 , and FIG. 6 , the
在一些實施例中,請參閱第1B圖、第2圖及第6圖,裝置管理端1200取得第1B圖之拼接裝置1000A之屏幕數量為6個,拼接裝置1000A之拼接形狀為3直行2橫列,此為第1B圖之屏幕之位置資訊。In some embodiments, please refer to FIG. 1B , FIG. 2 , and FIG. 6 , the
須說明的是,拼接裝置之拼接方式可為陣列(array)排列。換言之,拼接裝置之拼接方式可為(M*N)矩陣,M為正整數,N為正整數。拼接裝置之拼接方式不以第1A圖及第1B圖之實施例為限。It should be noted that the splicing method of the splicing device may be arranged in an array. In other words, the splicing manner of the splicing device may be a (M*N) matrix, where M is a positive integer and N is a positive integer. The splicing method of the splicing device is not limited to the embodiment shown in FIG. 1A and FIG. 1B .
於步驟620中,根據複數個屏幕之位置資訊設定主屏幕之位置。In
在一些實施例中,請參閱第1A圖、第2圖及第6圖,裝置管理端1200根據第1A圖之屏幕之位置資訊設定主屏幕之位置複數個屏幕1100之兩側,並以主屏幕之位置為起點,沿順時針或逆時針方向設定複數個副屏幕之位置。複數個屏幕1100包含中央區域、第一側(圖式左側)及第二側(圖式右側)。屏幕1120之位置及屏幕1130之位置位於中央區域。屏幕1110之位置位於第一側。屏幕1140之位置位於第二側。舉例而言,現今主屏幕設定於屏幕1110之位置。In some embodiments, please refer to FIG. 1A , FIG. 2 , and FIG. 6 , the
在一些實施例中,請參閱第1B圖、第2圖及第6圖,裝置管理端根據第1B圖之屏幕之位置資訊設定主屏幕之位置位於複數個屏幕1100A之兩側。複數個屏幕1100A包含中央區域、第一側(圖式左側)及第二側(圖式右側)。屏幕1120A之位置及屏幕1150A之位置位於中央區域。屏幕1110A之位置及屏幕1160A之位置位於第一側。屏幕1130A之位置及屏幕1140A之位置位於第二側。換言之,主屏幕之位置可位於屏幕1110A之位置、屏幕1130A之位置、屏幕1140A之位置及屏幕1160A之位置其中一者。舉例而言,現今主屏幕設定於屏幕1110A之位置(左下方位置)。In some embodiments, please refer to FIG. 1B , FIG. 2 , and FIG. 6 , the device management terminal sets the position of the main screen to be located on both sides of the plurality of
在一些實施例中,上述裝置管理端用以設定顯示器之種類。顯示器包含液晶顯示器(liquid-crystal display, LCD)、有機發光顯示器(Organic Light Emitting Display, OLED)、次發光二極體(mini Light Emitting Diode, mini-LED)顯示器及微發光二極體 (micro Light Emitting Diode, μ-LED) 顯示器。In some embodiments, the above-mentioned device management terminal is used to set the type of the display. Displays include liquid-crystal display (LCD), organic light-emitting display (OLED), sub-light-emitting diode (mini Light Emitting Diode, mini-LED) display and micro-light-emitting diode (micro Light Emitting Diode) Emitting Diode, μ-LED) display.
於步驟630中,傳送第一顯示訊號至主屏幕。In
在一些實施例中,請參閱第1A圖、第1B圖、第2圖及第6圖,裝置管理端1200傳送顯示訊號DS1至上述主屏幕之位置。In some embodiments, please refer to FIG. 1A , FIG. 1B , FIG. 2 and FIG. 6 , the
於步驟640中,藉由主屏幕根據第一顯示訊號依序輸出複數個第二顯示訊號至複數個屏幕之複數個副屏幕。In
在一些實施例中,請參閱第1A圖、第2圖及第6圖,裝置管理端1200根據顯示訊號DS1依序輸出複數個顯示訊號(例如:顯示訊號DS2及顯示訊號DS3)至複數個屏幕之複數個副屏幕(例如:副屏幕1120、副屏幕1130及副屏幕1140)。In some embodiments, please refer to FIG. 1A , FIG. 2 , and FIG. 6 , the
在一些實施例中,請參閱第1A圖、第2圖及第6圖,藉由主屏幕1110之裝置控制器1119及處理器1112根據顯示訊號DS1輸出顯示訊號DS2至副屏幕1120。接著,處理器1122藉由副屏幕1120根據顯示訊號DS2輸出次級顯示訊號DS3至副屏幕1130之處理器1132。In some embodiments, please refer to FIG. 1A , FIG. 2 and FIG. 6 , the
在一些實施例中,請參閱第1B圖、第2圖及第6圖,現今主屏幕被設定位於第1B圖式中屏幕1110A之位置。因此,現今屏幕1120A、屏幕1130A、屏幕1140A、屏幕1150A及屏幕1160A均為副屏幕。換言之,僅主屏幕1110A包含上述裝置控制器。接著,主屏幕1110A之裝置控制器根據顯示訊號DS1依照標號順序或依照逆時鐘順序輸出複數個顯示訊號至圖式中屏幕1120A之位置、屏幕1130A之位置、屏幕1140A之位置、屏幕1150A之位置及屏幕1160A之位置,其餘詳細操作相同於第1A圖之主屏幕1110之操作,於此不作贅述。須說明的是,屏幕之排列順序不以圖式實施例為限。In some embodiments, please refer to FIG. 1B, FIG. 2, and FIG. 6, the home screen is now set to be located at the position of the
於步驟650中,藉由主屏幕及複數個副屏幕分別根據第一顯示訊號及複數個第二顯示訊號顯示複數個分割畫面。In
在一些實施例中,請參閱第1A圖、第2圖及第6圖,主屏幕(屏幕1110)根據顯示訊號DS1顯示分割畫面。複數個副屏幕(屏幕1120、屏幕1130及屏幕1140)根據顯示訊號(例如:顯示訊號DS2及顯示訊號DS3)顯示分割畫面。主屏幕與複數個副屏幕顯示的分割畫面可拼接出一個完整的顯示畫面。在一些實施例中,主屏幕(屏幕1110)可單獨顯示一個完整的顯示畫面。In some embodiments, please refer to FIG. 1A , FIG. 2 and FIG. 6 , the main screen (screen 1110 ) displays the split screen according to the display signal DS1 . A plurality of sub-screens (
在一些實施例中,請參閱第1B圖、第2圖及第6圖,主屏幕(1110A)與複數個副屏幕(屏幕1120A至屏幕1160A)顯示的分割畫面可拼接出一個完整的顯示畫面。在一些實施例中,主屏幕(屏幕1110A)可單獨顯示一個完整的顯示畫面。In some embodiments, please refer to FIG. 1B , FIG. 2 and FIG. 6 , the divided images displayed on the main screen ( 1110A ) and the plurality of sub-screens (
於步驟660中,驅動複數個屏幕以接收物體之觸控訊號。In
在一些實施例中,請參閱第2圖、第4圖及及第6圖,每一複數個屏幕之時序控制器(例如:時序控制1113)分別驅動觸控電極層(例如:觸控電極層1115)以接收物體之觸控訊號。接著,第4圖之觸控感測電路接收物體之觸控訊號辨別物體為導體或非導體。In some embodiments, please refer to FIG. 2 , FIG. 4 and FIG. 6 , the timing controller (eg, timing control 1113 ) of each of the plurality of screens drives the touch electrode layer (eg, the touch electrode layer) respectively 1115) to receive the touch signal of the object. Next, the touch sensing circuit of FIG. 4 receives the touch signal of the object to identify whether the object is a conductor or a non-conductor.
第7圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。在一些實施例中,請參閱第6圖及第7圖,本案之拼接電子裝置1000及拼接電子裝置1000A更新所有分割畫面的時間為一幀(frame)。詳細而言,更新一幀的時間由複數個顯示階段701及複數個導體觸控感測階段703所組成,此為本案之拼接電子裝置1000及拼接電子裝置1000A之第一驅動模式。於顯示階段701中,拼接電子裝置1000或拼接電子裝置1000A執行步驟610至步驟650。於導體觸控感測階段703中,拼接電子裝置1000或拼接電子裝置1000A執行步驟660。FIG. 7 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application. In some embodiments, please refer to FIG. 6 and FIG. 7 , the time for the splicing
第8圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。在一些實施例中,請參閱第6圖至第8圖,相較於第7圖,第8圖之實施例為本案之拼接電子裝置1000及拼接電子裝置1000A之第二驅動模式。在此驅動模式下,更新一幀的時間由複數個顯示階段701及複數個非導體觸控感測階段705所組成。詳細步驟相同於第7圖之實施例,於此不作贅述。FIG. 8 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application. In some embodiments, please refer to FIGS. 6 to 8. Compared with FIG. 7, the embodiment of FIG. 8 is the second driving mode of the splicing
第9圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。在一些實施例中,請參閱第6圖至第9圖,第9圖之實施例為本案之拼接電子裝置1000及拼接電子裝置1000A之第三驅動模式。在此驅動模式下,更新一幀的時間由複數個顯示階段701、複數個導體觸控感測階段703及複數個非導體觸控感測階段705所組成。於顯示階段701中,拼接電子裝置1000或拼接電子裝置1000A執行步驟610至步驟650。於導體觸控感測階段703及非導體觸控感測階段705中,拼接電子裝置1000或拼接電子裝置1000A執行步驟660。FIG. 9 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application. In some embodiments, please refer to FIGS. 6 to 9, the embodiment of FIG. 9 is the third driving mode of the splicing
第10圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。在一些實施例中,請參閱第6圖至第10圖,相較於第9圖,第10圖之實施例為本案之拼接電子裝置1000及拼接電子裝置1000A之第四驅動模式,僅改變導體觸控感測階段703及非導體觸控感測階段705之驅動順序。詳細步驟相同於第9圖之實施例,於此不作贅述。FIG. 10 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application. In some embodiments, please refer to FIGS. 6 to 10. Compared with FIG. 9, the embodiment of FIG. 10 is the fourth driving mode of the splicing
第11圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。在一些實施例中,請參閱第6圖至第11圖,第11圖之實施例為本案之拼接電子裝置1000及拼接電子裝置1000A之第五驅動模式。第11圖之實施例表示導體觸控感測階段703及非導體觸控感測階段705可同時進行。換言之,本案之拼接電子裝置1000及拼接電子裝置1000A可同時進行導體感測及非導體感測。FIG. 11 is a schematic diagram illustrating the driving timing of the splicing electronic device according to some embodiments of the present application. In some embodiments, please refer to FIGS. 6 to 11 , the embodiment of FIG. 11 is the fifth driving mode of the splicing
依據前述實施例,本案提供一種拼接電子裝置及驅動方法,藉由本案之觸控感測電路以提高辨別導體及非導體之觸控感應速度,並藉由本案之驅動方法以使訊號可分區域控制屏幕顯示。According to the aforementioned embodiments, the present application provides a splicing electronic device and a driving method. The touch sensing circuit of the present application improves the touch sensing speed of distinguishing conductors and non-conductors, and the driving method of the present application enables signals to be divided into regions. Control screen display.
雖然本案以詳細之實施例揭露如上,然而本案並不排除其他可行之實施態樣。因此,本案之保護範圍當視後附之申請專利範圍所界定者為準,而非受於前述實施例之限制。Although this case is disclosed above with detailed embodiments, this case does not exclude other possible implementations. Therefore, the protection scope of this case should be determined by the scope of the appended patent application, rather than being limited by the foregoing embodiments.
對本領域技術人員而言,在不脫離本案之精神和範圍內,當可對本案作各種之更動與潤飾。基於前述實施例,所有對本案所作的更動與潤飾,亦涵蓋於本案之保護範圍內。For those skilled in the art, various changes and modifications can be made to this case without departing from the spirit and scope of this case. Based on the foregoing embodiments, all changes and modifications made to this case are also covered by the protection scope of this case.
1000~1000A:拼接電子裝置
1100~1100A:屏幕
1110~1140:屏幕
1110A~1140A:屏幕
1111~1131:電源
1112~1132:處理器
1113~1133:時序控制器
1114~1134:顯示面板
1115~1135:觸控電極層
1119:裝置控制器
1200:裝置管理端
DS1~DS3:顯示訊號
CS1:控制訊號
TS1:時序控制訊號
1116:驅動積體電路
1117:觸控電路
B:基板
L1~L3:發光二極體
IC1~IC6:積體電路
IL1:紅外線二極體
IS1:紅外線感測器
PS1:光感測器
V
Drive:交流電源
Cm:耦合電容
Cst:儲存電容
Cs:電容
EC1~EC2:電路
D1:二極體
OP1~OP2:放大器
S1~S3:開關
V
Cst:電位
V1~V2:電位
600:方法
610~660:步驟
701:顯示階段
703:導體觸控感測階段
705:非導體觸控感測階段
1000~1000A: Splicing
參照後續段落中的實施方式以及下列圖式,當可更佳地理解本案的內容: 第1A圖為根據本案一些實施例繪示的拼接電子裝置之示意圖; 第1B圖為根據本案一些實施例繪示的拼接電子裝置之示意圖; 第2圖為根據本案一些實施例繪示的拼接電子裝置之詳細電路方塊示意圖; 第3A圖為根據本案一些實施例繪示的之拼接電子裝置之電路方塊示意圖; 第3B圖為根據本案一些實施例繪示的之拼接電子裝置之部分結構側視示意圖。; 第4圖為根據本案一些實施例繪示的拼接電子裝置之觸控感測電路示意圖; 第5圖為根據本案一些實施例繪示的之觸控感測電路之驅動訊號示意圖; 第6圖為根據本案一些實施例繪示的驅動方法之步驟流程示意圖; 第7圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖; 第8圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖; 第9圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖; 第10圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖;以及 第11圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。 The content of this case can be better understood with reference to the embodiments in the following paragraphs and the following drawings: FIG. 1A is a schematic diagram of a splicing electronic device according to some embodiments of the present application; FIG. 1B is a schematic diagram of a splicing electronic device according to some embodiments of the present application; FIG. 2 is a detailed circuit block diagram of a splicing electronic device according to some embodiments of the present application; FIG. 3A is a schematic circuit block diagram of a splicing electronic device according to some embodiments of the present application; FIG. 3B is a schematic side view of a partial structure of a splicing electronic device according to some embodiments of the present application. ; FIG. 4 is a schematic diagram of a touch sensing circuit of a splicing electronic device according to some embodiments of the present application; FIG. 5 is a schematic diagram of driving signals of the touch sensing circuit according to some embodiments of the present application; FIG. 6 is a schematic flowchart of steps of a driving method according to some embodiments of the present application; FIG. 7 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application; FIG. 8 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application; FIG. 9 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application; FIG. 10 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application; and FIG. 11 is a schematic diagram illustrating the driving timing of the splicing electronic device according to some embodiments of the present application.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date and number) none Foreign deposit information (please note in the order of deposit country, institution, date and number) none
1000:拼接電子裝置 1000: Splicing Electronics
1100:屏幕 1100: Screen
1110~1130:屏幕 1110~1130: Screen
1111~1131:電源 1111~1131: Power
1112~1132:處理器 1112~1132: Processor
1113~1133:時序控制器 1113~1133: Timing Controller
1114~1134:顯示面板 1114~1134: Display panel
1115~1135:觸控電極層 1115~1135: Touch electrode layer
1119:裝置控制器 1119: Device Controller
1200:裝置管理端 1200: Device management terminal
DS1~DS3:顯示訊號 DS1~DS3: Display signal
CS1:控制訊號 CS1: Control signal
TS1:時序控制訊號 TS1: Timing control signal
Claims (8)
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110534291.2A CN113190201B (en) | 2021-05-17 | 2021-05-17 | Splicing electronic device and driving method |
| CN202110534291.2 | 2021-05-17 |
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| Publication Number | Publication Date |
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| TWI777566B true TWI777566B (en) | 2022-09-11 |
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| CN113900550B (en) * | 2021-09-26 | 2024-05-17 | 上海中航光电子有限公司 | Display panel and touch positioning method |
| CN114299819B (en) * | 2021-12-24 | 2023-06-02 | 业成科技(成都)有限公司 | Tiled display device and driving method |
| US12142190B1 (en) * | 2023-11-29 | 2024-11-12 | Novatek Microelectronics Corp. | Display control system for splicing screen |
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| TW202246968A (en) | 2022-12-01 |
| CN113190201A (en) | 2021-07-30 |
| CN113190201B (en) | 2023-07-25 |
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