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TWI777566B - Splicing electronic device and driving method - Google Patents

Splicing electronic device and driving method Download PDF

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Publication number
TWI777566B
TWI777566B TW110118050A TW110118050A TWI777566B TW I777566 B TWI777566 B TW I777566B TW 110118050 A TW110118050 A TW 110118050A TW 110118050 A TW110118050 A TW 110118050A TW I777566 B TWI777566 B TW I777566B
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screens
screen
signal
touch
display
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TW110118050A
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TW202246968A (en
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魏福呈
廖致霖
陳俊達
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大陸商業成科技(成都)有限公司
大陸商業成光電(深圳)有限公司
大陸商業成光電(無錫)有限公司
英特盛科技股份有限公司
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/14Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • G06F3/1423Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display
    • G06F3/1446Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display display composed of modules, e.g. video walls
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/04164Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads

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  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Multimedia (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Controls And Circuits For Display Device (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Control Of El Displays (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

A splicing electronic device includes a substrate and a plurality of screens. The screens are located on the substrate and include a main screen and a plurality of secondary screens. The main screen is configured to receive a first display signal so as to output a plurality of second display signals. The secondary screens are spliced on the main screen in sequence so as to receive the second display signals. The main screen and the secondary screens display a plurality of split screens according to the first display signal and the second display signals together at a first stage. The main screen and the secondary screens are configured to receive a touch signal at a second stage.

Description

拼接電子裝置及驅動方法Splicing electronic device and driving method

本案涉及一種電子裝置及驅動方法。詳細而言,本案涉及一種拼接電子裝置及驅動方法。This case relates to an electronic device and a driving method. In detail, this case relates to a splicing electronic device and a driving method.

現今拼接裝置用以同步顯示分割畫面,每一拼接屏幕之空間需設計連接閘口,藉以互相連接。因此,拼接屏幕之空間無法作有效率的運用。Today's splicing devices are used to synchronously display split screens, and each splicing screen space needs to be designed with a connection gate to connect to each other. Therefore, the space of the splicing screen cannot be used efficiently.

此外,拼接裝置更用以實現觸控的功能。拼接裝置之電容式觸控面板經常無法快速辨別導體或非導體的觸控。In addition, the splicing device is further used to realize the touch function. Capacitive touch panels for splicing devices often cannot quickly distinguish between conductive and non-conductive touches.

因此,上述技術尚存諸多缺陷,而有待本領域從業人員研發出其餘適合的觸控感測電路。Therefore, the above technology still has many defects, and other suitable touch sensing circuits need to be developed by practitioners in the art.

本案的一面向涉及一種拼接電子裝置。拼接電子裝置包含複數個屏幕。複數個屏幕位於基板之上,並包含主屏幕及複數個副屏幕。主屏幕用以接收第一顯示訊號,藉以輸出複數個第二顯示訊號。複數個副屏幕依序拼接於主屏幕,藉以接收複數個第二顯示訊號。主屏幕及複數個副屏幕用以於第一階段分別根據第一顯示訊號及複數個第二顯示訊號共同顯示畫面。主屏幕及複數個副屏幕用以於第二階段接收觸控訊號。One aspect of the present case relates to a splicing electronic device. The tiled electronic device includes a plurality of screens. A plurality of screens are located on the substrate, and include a main screen and a plurality of sub-screens. The main screen is used for receiving the first display signal, so as to output a plurality of second display signals. A plurality of sub-screens are sequentially spliced to the main screen, so as to receive a plurality of second display signals. The main screen and the plurality of sub-screens are used to jointly display a picture according to the first display signal and the plurality of second display signals respectively in the first stage. The main screen and the plurality of sub-screens are used for receiving touch signals in the second stage.

本案的另一面向涉及一種驅動方法,適用於一種拼接電子裝置。驅動方法包含以下步驟:於第一階段取得拼接電子裝置之複數個屏幕之位置資訊;於第一階段根據複數個屏幕之位置資訊設定複數個屏幕之主屏幕之位置;於第一階段傳送第一顯示訊號至主屏幕;於第一階段藉由主屏幕根據第一顯示訊號依序輸出複數個第二顯示訊號至複數個屏幕之複數個副屏幕;於第一階段藉由主屏幕及複數個副屏幕分別根據第一顯示訊號及複數個第二顯示訊號以顯示複數個分割畫面;以及於第二階段驅動複數個屏幕以接收物體之觸控訊號。Another aspect of the present application relates to a driving method, which is suitable for a splicing electronic device. The driving method includes the following steps: obtaining the position information of the plurality of screens of the spliced electronic device in the first stage; setting the positions of the main screens of the plurality of screens according to the position information of the plurality of screens in the first stage; transmitting the first stage in the first stage Display signals to the main screen; in the first stage, the main screen sequentially outputs a plurality of second display signals to a plurality of sub-screens of the plurality of screens according to the first display signal; in the first stage, the main screen and a plurality of sub-screens are used The screen displays a plurality of divided screens according to the first display signal and the plurality of second display signals respectively; and drives the plurality of screens in the second stage to receive the touch signal of the object.

以下將以圖式及詳細敘述清楚說明本案之精神,任何所屬技術領域中具有通常知識者在瞭解本案之實施例後,當可由本案所教示之技術,加以改變及修飾,其並不脫離本案之精神與範圍。The following will clearly illustrate the spirit of this case with drawings and detailed descriptions. Anyone with ordinary knowledge in the technical field who understands the embodiments of this case can make changes and modifications by using the techniques taught in this case, which does not deviate from the principles of this case. spirit and scope.

本文之用語只為描述特定實施例,而無意為本案之限制。單數形式如“一”、“這”、“此”、“本”以及“該”,如本文所用,同樣也包含複數形式。The language used herein is for the purpose of describing particular embodiments and is not intended to be limiting. The singular forms such as "a", "the", "the", "this" and "the", as used herein, also include the plural forms.

關於本文中所使用之『包含』、『包括』、『具有』、『含有』等等,均為開放性的用語,即意指包含但不限於。 關於本文中所使用之用詞(terms),除有特別註明外,通常具有每個用詞使用在此領域中、在本案之內容中與特殊內容中的平常意義。某些用以描述本案之用詞將於下或在此說明書的別處討論,以提供本領域技術人員在有關本案之描述上額外的引導。 The terms "comprising", "including", "having", "containing", etc. used in this document are all open-ended terms, meaning including but not limited to. Regarding the terms (terms) used in this article, unless otherwise specified, they usually have the ordinary meaning of each term used in this field, in the content of this case and in the special content. Certain terms used to describe the present case are discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance in the description of the present case.

第1A圖為根據本案一些實施例繪示的拼接電子裝置1000之示意圖。在一些實施例中,請參閱第1A圖,拼接電子裝置1000包含基板(圖中未示)及複數個屏幕1100。複數個屏幕1100位於基板之上。複數個屏幕1100之屏幕數量為4個。複數個屏幕1100包含屏幕1110、屏幕1120、屏幕1130及屏幕1140。屏幕1120拼接於屏幕1110之右側邊界(圖式右側)。屏幕1130沿相同方向拼接於屏幕1120之右側邊界。屏幕1140再沿相同方向拼接於屏幕1130之右側邊界。換言之,屏幕1110、屏幕1120、屏幕1130及屏幕1140排列於同一橫列上。須說明的是,複數個屏幕1100之間的間隙或拼接區具有一定寬度,以使得拼接電子裝置1000能折疊。須注意的是,本案之拼接方式雖往右側延展,但不以圖式實施例為限。FIG. 1A is a schematic diagram of a splicing electronic device 1000 according to some embodiments of the present application. In some embodiments, please refer to FIG. 1A , the splicing electronic device 1000 includes a substrate (not shown in the figure) and a plurality of screens 1100 . A plurality of screens 1100 are located on the substrate. The number of screens of the plurality of screens 1100 is four. The plurality of screens 1100 include a screen 1110 , a screen 1120 , a screen 1130 and a screen 1140 . The screen 1120 is spliced on the right border of the screen 1110 (the right side of the drawing). The screen 1130 is spliced to the right border of the screen 1120 in the same direction. The screen 1140 is then spliced to the right border of the screen 1130 in the same direction. In other words, the screen 1110, the screen 1120, the screen 1130 and the screen 1140 are arranged in the same row. It should be noted that the gaps or splicing areas between the plurality of screens 1100 have a certain width, so that the splicing electronic device 1000 can be folded. It should be noted that although the splicing method in this case extends to the right side, it is not limited to the illustrated embodiment.

第1B圖為根據本案一些實施例繪示的拼接電子裝置1000A之示意圖。在一些實施例中,請參閱第1B圖,相較於第1A圖之拼接電子裝置1000,拼接電子裝置1000A之屏幕數量增為6個。拼接電子裝置1000A之拼接形狀變更為3直行2橫列的排列方式。拼接電子裝置1000A包含基板(圖中未示)及複數個屏幕1100A。複數個屏幕1100A包含屏幕1110A、屏幕1120A、屏幕1130A、屏幕1140A、屏幕1150A及屏幕1160A。屏幕1120A拼接於屏幕1110A之右側邊界(圖式右側)。屏幕1130A拼接於屏幕1120A之右側邊界。屏幕1140A拼接於屏幕1130A之下側邊界(圖式下側)。屏幕1150A拼接於屏幕1120A之下側邊界及屏幕1140之左側邊界(圖式左側)。屏幕1160A拼接於屏幕1110A之下側邊界及屏幕1150A之左側邊界。須說明的是,複數個屏幕1100A之間的間隙或拼接區具有一定寬度,以使得拼接電子裝置1000A能折疊。須注意的是,拼接方式雖依照標號順序拼接,但不以圖式實施例為限。FIG. 1B is a schematic diagram of a splicing electronic device 1000A according to some embodiments of the present application. In some embodiments, please refer to FIG. 1B , compared with the splicing electronic device 1000 of FIG. 1A , the number of screens of the splicing electronic device 1000A is increased to six. The splicing shape of the splicing electronic device 1000A is changed to an arrangement of 3 straight rows and 2 horizontal columns. The splicing electronic device 1000A includes a substrate (not shown in the figure) and a plurality of screens 1100A. The plurality of screens 1100A include a screen 1110A, a screen 1120A, a screen 1130A, a screen 1140A, a screen 1150A, and a screen 1160A. The screen 1120A is spliced to the right border of the screen 1110A (the right side of the drawing). Screen 1130A is spliced to the right border of screen 1120A. The screen 1140A is spliced to the lower border (the lower side of the drawing) of the screen 1130A. The screen 1150A is spliced on the lower border of the screen 1120A and the left border of the screen 1140 (the left side of the drawing). The screen 1160A is spliced on the lower border of the screen 1110A and the left border of the screen 1150A. It should be noted that the gaps or splicing areas between the plurality of screens 1100A have a certain width, so that the splicing electronic device 1000A can be folded. It should be noted that although the splicing method is spliced in the order of the labels, it is not limited to the embodiment in the drawings.

在一些實施例中,請參閱第1A圖及第1B圖,屏幕之屏幕數量不以圖式實施例為限。In some embodiments, please refer to FIG. 1A and FIG. 1B , the number of screens on the screen is not limited to the embodiment shown in the drawings.

第2圖為根據本案一些實施例繪示的拼接電子裝置1000之詳細電路方塊示意圖。在一些實施例中,請參閱第1A圖至第2圖,第2圖之拼接電子裝置1000對應至第1A圖之拼接電子裝置1000或第1B圖之拼接電子裝置1000A。FIG. 2 is a detailed circuit block diagram of the splicing electronic device 1000 according to some embodiments of the present application. In some embodiments, please refer to FIGS. 1A to 2 , the splicing electronic device 1000 in FIG. 2 corresponds to the splicing electronic device 1000 in FIG. 1A or the splicing electronic device 1000A in FIG. 1B .

在一些實施例中,請參閱第2圖,拼接電子裝置1000包含複數個屏幕1100及裝置管理端1200。複數個屏幕1100包含主屏幕1110及複數個副屏幕(屏幕1120及屏幕1130)。主屏幕1110包含電源1111、處理器1112、時序控制器1113、顯示面板1114、觸控電極層1115及裝置控制器1119。副屏幕1120包含電源1121、處理器1122、時序控制器1123、顯示面板1124及觸控電極層1125。副屏幕1130包含電源1131、處理器1132、時序控制器1133、顯示面板1134及觸控電極層1135。須說明的是,僅主屏幕1110具有裝置控制器1119。In some embodiments, please refer to FIG. 2 , the splicing electronic device 1000 includes a plurality of screens 1100 and a device management terminal 1200 . The plurality of screens 1100 include a main screen 1110 and a plurality of sub-screens (screen 1120 and screen 1130). The main screen 1110 includes a power supply 1111 , a processor 1112 , a timing controller 1113 , a display panel 1114 , a touch electrode layer 1115 and a device controller 1119 . The secondary screen 1120 includes a power supply 1121 , a processor 1122 , a timing controller 1123 , a display panel 1124 and a touch electrode layer 1125 . The secondary screen 1130 includes a power supply 1131 , a processor 1132 , a timing controller 1133 , a display panel 1134 and a touch electrode layer 1135 . It should be noted that only the home screen 1110 has the device controller 1119 .

在一些實施例中,請參閱第1A圖及第2圖,裝置管理端1200用以偵測第1A圖之屏幕數量及拼接形狀,以產生顯示訊號DS1。In some embodiments, please refer to FIG. 1A and FIG. 2 , the device management terminal 1200 is used to detect the number of screens and the splicing shape of FIG. 1A to generate the display signal DS1 .

在一些實施例中,請參閱第1B圖及第2圖,裝置管理端1200用以偵測第1B圖之屏幕數量及拼接形狀,以產生顯示訊號DS1。In some embodiments, please refer to FIG. 1B and FIG. 2 , the device management terminal 1200 is used for detecting the number of screens and the splicing shape of FIG. 1B to generate the display signal DS1 .

在一些實施例中,請參閱第2圖,電源1111用以提供主屏幕1110所需之電壓。電源1121用以提供副屏幕1120所需之電壓。電源1131用以提供副屏幕1130所需之電壓。在一些實施例中,電源1111用以提供電源1121及電源1131電壓,以再提供給副屏幕1120及副屏幕1130所需的電壓。In some embodiments, please refer to FIG. 2 , the power supply 1111 is used to provide the voltage required by the main screen 1110 . The power supply 1121 is used to provide the voltage required by the secondary screen 1120 . The power supply 1131 is used to provide the voltage required by the secondary screen 1130 . In some embodiments, the power supply 1111 is used to provide the voltages of the power supply 1121 and the power supply 1131 to provide the voltages required by the secondary screen 1120 and the secondary screen 1130 .

在一些實施例中,裝置控制器1119用以接收顯示訊號DS1。裝置控制器1119根據顯示訊號DS1取得主屏幕1110的顯示資料以及複數個副屏幕(屏幕1120及屏幕1130)之顯示訊號(顯示訊號DS2及顯示訊號DS3)。在一些實施例中,裝置控制器1119根據顯示訊號DS1輸出控制訊號CS1至處理器1112。在一些實施例中,裝置控制器1119具有無線通訊之功能以接收顯示訊號DS1。In some embodiments, the device controller 1119 is used for receiving the display signal DS1. The device controller 1119 obtains the display data of the main screen 1110 and the display signals (display signal DS2 and display signal DS3 ) of the plurality of sub-screens (screen 1120 and screen 1130 ) according to the display signal DS1 . In some embodiments, the device controller 1119 outputs the control signal CS1 to the processor 1112 according to the display signal DS1. In some embodiments, the device controller 1119 has the function of wireless communication to receive the display signal DS1.

在一些實施例中,處理器1112根據控制訊號CS1輸出時序控制訊號TS1至時序控制器1113。在一些實施例中,處理器1112用以接收控制訊號CS1,藉以傳送顯示訊號DS2至副屏幕1120之處理器1122以及傳送顯示訊號DS3至副屏幕1130之處理器1132。在一些實施例中,處理器1112可分別傳送顯示訊號DS2及顯示訊號DS3至對應的副屏幕。在一些實施例中,處理器1112可傳送顯示訊號DS2及顯示訊號DS3至次級的處理器1122,再藉由次級處理器1122將顯示訊號傳送至下一級處理器1132。須說明的是,該些處理器傳送顯示訊號的順序及路徑不以圖式實施例為限。In some embodiments, the processor 1112 outputs the timing control signal TS1 to the timing controller 1113 according to the control signal CS1. In some embodiments, the processor 1112 is configured to receive the control signal CS1 , so as to transmit the display signal DS2 to the processor 1122 of the secondary screen 1120 and to transmit the display signal DS3 to the processor 1132 of the secondary screen 1130 . In some embodiments, the processor 1112 can respectively transmit the display signal DS2 and the display signal DS3 to the corresponding secondary screen. In some embodiments, the processor 1112 may transmit the display signal DS2 and the display signal DS3 to the secondary processor 1122 , and then the secondary processor 1122 transmits the display signal to the next-level processor 1132 . It should be noted that the sequence and path of the processors transmitting the display signals are not limited to the embodiment shown in the drawings.

第3A圖為根據本案一些實施例繪示的之拼接電子裝置1000之電路方塊示意圖。在一些實施例中,如第3A圖所示,第3A圖之電路架構對應至第2圖之複數個屏幕1100其中一者。拼接電子裝置1000更包含驅動積體電路(driving integrated circuit)1116以及觸控電路1117。FIG. 3A is a schematic circuit block diagram of a splicing electronic device 1000 according to some embodiments of the present application. In some embodiments, as shown in FIG. 3A , the circuit structure in FIG. 3A corresponds to one of the plurality of screens 1100 in FIG. 2 . The splicing electronic device 1000 further includes a driving integrated circuit 1116 and a touch control circuit 1117 .

在一些實施例中,驅動積體電路1116耦接於時序控制器1113及顯示面板1114。觸控電路1117耦接於時序控制器1113及觸控電極層1115。In some embodiments, the driving IC 1116 is coupled to the timing controller 1113 and the display panel 1114 . The touch circuit 1117 is coupled to the timing controller 1113 and the touch electrode layer 1115 .

在一些實施例中,請參閱第2圖及第3A圖,上述處理器1112、處理器1122及處理器1132包含中央處理器(Central Processing Unit, CPU)、通信處理器及高階運算功能的超級電腦其中至少一個。在一些實施例中,高階運算功能的超級電腦包含精簡指令集電腦(reduced instruction set computer, RISC)及進階精簡指令集機器(Advanced RISC Machine)。In some embodiments, please refer to FIG. 2 and FIG. 3A, the processor 1112, the processor 1122, and the processor 1132 include a central processing unit (CPU), a communication processor, and a supercomputer with high-level computing functions at least one of them. In some embodiments, the supercomputer with high-level computing functions includes a reduced instruction set computer (RISC) and an advanced reduced instruction set machine (Advanced RISC Machine).

在一些實施例中,請參閱第3A圖,時序控制器1113用以提供圖像訊號至驅動積體電路1116。時序控制器1113可同時控制複數個驅動積體電路以控制屏幕的顯示畫面或分割畫面。在一些實施例中,時序控制器1113用以接收從處理器1112的複數種訊號。複數種訊號用以控制拼接電子裝置以進行顯示或觸控。複數種訊號包含輸入訊號、水平同步訊號(horizontal synchronizing signal)、重直同步訊號(vertical synchronizing signal),主時鐘訊號(master clock signal)、掃描控制訊號、數據控制訊號及發光控制訊號。In some embodiments, please refer to FIG. 3A , the timing controller 1113 is used for providing the image signal to the driving IC 1116 . The timing controller 1113 can simultaneously control a plurality of driving integrated circuits to control the display screen or split screen of the screen. In some embodiments, the timing controller 1113 is used for receiving a plurality of signals from the processor 1112 . A plurality of signals are used to control the splicing electronic device for display or touch. The plurality of signals include an input signal, a horizontal synchronizing signal, a vertical synchronizing signal, a master clock signal, a scan control signal, a data control signal and a lighting control signal.

在一些實施例中,驅動積體電路1116用以提供控制訊號,藉以控制位於拼接電子裝置1000之薄膜電晶體基板上的複數條控制線(圖中未示)。在一些實施例中,顯示面板1114採用類似於內嵌式觸控技術(In cell touch),複數條控制線耦接於拼接電子裝置1000中的每一發光二極體(圖中未示) ,發光二極體包含微發光二極體 (micro light diode , μ-LED) ,與觸控電極一同設置在包含積體電路的基板上,進一步來說,積體電路包含薄膜電晶體(Thin-Film Transistor, TFT)或微驅動積體電路(Micro driver integrated circuit)。與常見的內崁式觸控面板相同的是,相較於外掛式觸控面板將觸控感應器外置於液晶顯示模組上,可以減少整體厚度並簡化製程。In some embodiments, the driving IC 1116 is used to provide control signals to control a plurality of control lines (not shown) on the thin film transistor substrate of the splicing electronic device 1000 . In some embodiments, the display panel 1114 adopts an in-cell touch technology, and a plurality of control lines are coupled to each light-emitting diode (not shown) in the splicing electronic device 1000 , The light-emitting diode includes a micro light-emitting diode (μ-LED), which is disposed on a substrate including an integrated circuit together with the touch electrodes. Further, the integrated circuit includes a thin-film transistor (Thin-Film Transistor, TFT) or Micro driver integrated circuit. Similar to the common built-in touch panel, the touch sensor is externally placed on the liquid crystal display module compared to the external touch panel, which can reduce the overall thickness and simplify the manufacturing process.

在一些實施例中,觸控電路1117用以驅動觸控電極層1115之紅外線發光二極體(Infrared light-emitting diode, IR LED),藉以感應物體之觸控訊號。在一些實施例中,觸控電路1117用以接收觸控電極層1115之紅外線感應器、光學感應器及電容器之觸控訊號。In some embodiments, the touch circuit 1117 is used to drive the infrared light-emitting diode (IR LED) of the touch electrode layer 1115 to sense the touch signal of the object. In some embodiments, the touch circuit 1117 is used for receiving touch signals from the infrared sensor, the optical sensor and the capacitor of the touch electrode layer 1115 .

第3B圖為根據本案一些實施例繪示的之拼接電子裝置1000之部分結構之側視示意圖。在一些實施例中,請參閱第3B圖,第3B圖之結構位於第2圖之每一複數個屏幕1100中。第3B圖之結構包含基板B、積體電路IC1~IC6、發光二極體L1~L3、紅外線發光二極體IL1、紅外線感測器IS1以及光感測器PS1。FIG. 3B is a schematic side view of a partial structure of the spliced electronic device 1000 according to some embodiments of the present application. In some embodiments, please refer to FIG. 3B, the structure of FIG. 3B is located in each of the plurality of screens 1100 of FIG. 2 . The structure of FIG. 3B includes a substrate B, integrated circuits IC1-IC6, light-emitting diodes L1-L3, an infrared light-emitting diode IL1, an infrared sensor IS1, and a photo sensor PS1.

在一些實施例中,基板B包含玻璃基板、柔性基板、印刷電路板(Printed circuit board, PCB)。In some embodiments, the substrate B includes a glass substrate, a flexible substrate, and a printed circuit board (PCB).

在一些實施例中,積體電路IC1~IC6包含薄膜電晶體(Thin-Film Transistor, TFT)或微驅動積體電路(Micro driver integrated circuit)。In some embodiments, the integrated circuits IC1 to IC6 include thin film transistors (Thin-Film Transistor, TFT) or micro driver integrated circuits (Micro driver integrated circuits).

在一些實施例中,積體電路IC1~IC6、發光二極體L1~L3、紅外線發光二極體IL1、紅外線感測器IS1以及光感測器PS均位於基板B之上。須說明的是,結構的排列方式及數量不以圖式實施例為限。In some embodiments, the integrated circuits IC1 ˜ IC6 , the light emitting diodes L1 ˜ L3 , the infrared light emitting diode IL1 , the infrared sensor IS1 and the photo sensor PS are all located on the substrate B. It should be noted that the arrangement and quantity of the structures are not limited to the embodiments in the drawings.

在一些實施例中,發光二極體L1~L3包含微發光二極體 (micro light diode , μ-LED)用以顯示畫面。紅外線發光二極體IL1用以發出紅外線以感測目標物。紅外線感測器IS1用以接收紅外線訊號。光感測器PS1用以感測光強度。In some embodiments, the light-emitting diodes L1-L3 include micro light-emitting diodes (μ-LEDs) for displaying images. The infrared light emitting diode IL1 is used for emitting infrared rays to sense the target. The infrared sensor IS1 is used for receiving infrared signals. The light sensor PS1 is used for sensing light intensity.

第4圖為根據本案一些實施例繪示的拼接電子裝置1000之觸控感測電路示意圖。在一些實施例中,請參閱第3A圖至第4圖,第4圖之觸控感測電路位於第3A圖之觸控電極層1115及觸控電路1117其中至少一者。第4圖之觸控感測電路包含第一電路EC1、第二電路EC2、儲存電容Cst及耦合電容Cm。FIG. 4 is a schematic diagram of a touch sensing circuit of the splicing electronic device 1000 according to some embodiments of the present application. In some embodiments, please refer to FIGS. 3A to 4 , the touch sensing circuit in FIG. 4 is located in at least one of the touch electrode layer 1115 and the touch circuit 1117 in FIG. 3A . The touch sensing circuit of FIG. 4 includes a first circuit EC1, a second circuit EC2, a storage capacitor Cst and a coupling capacitor Cm.

在一些實施例中,第一電路EC1用以根據從觸控電極層1115的觸控訊號以決定儲存電容Cst之電壓準位。須說明的是,當使用者手指觸控拼接電子裝置1000時,使用者手指之電容會影響耦合電容Cm。第4圖之觸控感測電路之第一電路EC1響應耦合電容Cm之電位變化,藉以記錄耦合電容Cm之電位變化於儲存電容Cst。在一些實施例中,第一電路EC1包含放大器OP2及電容Cs。In some embodiments, the first circuit EC1 is used to determine the voltage level of the storage capacitor Cst according to the touch signal from the touch electrode layer 1115 . It should be noted that, when the user's finger touches the splicing electronic device 1000, the capacitance of the user's finger will affect the coupling capacitance Cm. The first circuit EC1 of the touch sensing circuit in FIG. 4 responds to the potential change of the coupling capacitor Cm, so as to record the potential change of the coupling capacitor Cm in the storage capacitor Cst. In some embodiments, the first circuit EC1 includes an amplifier OP2 and a capacitor Cs.

在一些實施例中,第二電路EC2包含放大器OP1及二極體D1。二極體D1之陰極端耦接於第一電路EC1及放大器OP1之第一輸入端。二極體D1之陽極端耦接於放大器OP1之輸出端。第一電路EC1及第二電路EC2根據觸控訊號共同決定儲存電容Cst之電壓準位。In some embodiments, the second circuit EC2 includes an amplifier OP1 and a diode D1. The cathode terminal of the diode D1 is coupled to the first circuit EC1 and the first input terminal of the amplifier OP1. The anode terminal of the diode D1 is coupled to the output terminal of the amplifier OP1. The first circuit EC1 and the second circuit EC2 jointly determine the voltage level of the storage capacitor Cst according to the touch signal.

在一些實施例中,為使本案之觸控感測電路之驅動方法易於理解,請一併參閱第4圖及第5圖,第5圖為根據本案一些實施例繪示的之觸控感測電路之驅動訊號示意圖。In some embodiments, in order to make the driving method of the touch sensing circuit of the present application easy to understand, please refer to FIG. 4 and FIG. 5 together, and FIG. 5 illustrates the touch sensing according to some embodiments of the present application. Schematic diagram of the driving signal of the circuit.

在一些實施例中,V Drive為交流電源。開關S1用以驅動第二電路EC2。開關S2及開關S3用以驅動第一電路EC1。V Cst為儲存電容Cst兩端之電位。在一些實施例中,開關S1、開關S2及開關S3包含電晶體及訊號源至少其中一者。須說明的是,開關S1、開關S2及開關S3用以表達訊號的輸入位置,並不以圖式實施例為限。 In some embodiments, V Drive is an AC power source. The switch S1 is used to drive the second circuit EC2. The switch S2 and the switch S3 are used to drive the first circuit EC1. V Cst is the potential across the storage capacitor Cst. In some embodiments, switch S1 , switch S2 and switch S3 include at least one of a transistor and a signal source. It should be noted that the switch S1 , the switch S2 and the switch S3 are used to express the input position of the signal, and are not limited to the embodiment shown in the drawings.

在一些實施例中,請參閱第4圖及第5圖,本案之第二電路EC2並聯第一電路EC1,並藉由第二電路EC2內部的放大器OP1及二極體D1以快速累積於儲存電容Cst之電位V Cst。詳細而言,於非導體感測的情況下,交流電源V Drive需持續提供電壓。當交流電源V Drive為正電位時,第二電路EC2根據開關S1導通,以於儲存電容Cst累績交流電源V Drive之正電位。此時,第一電路EC1不導通。當交流電源V Drive為負電位時,第一電路EC1根據開關S3導通,以於儲存電容Cst累績交流電源V Drive之負電位。此時,第二電路EC2不導通。據此,本案藉由第一電路EC1及第二電路EC2交替導通以將感測的電荷以快速累積於儲存電容Cst。須說明的是,上述觸控電極層1115包含兩種電容以進行導體或非導體之感測。當導體觸控拼接電子裝置1000時,兩種電容均會變小。當非導體觸控拼接電子裝置1000時,兩種電容之一者會變大,兩種電容之另中一者會變小。藉由兩種電容之變化以辨別導體或非導體。 In some embodiments, please refer to FIG. 4 and FIG. 5, the second circuit EC2 in this case is connected in parallel with the first circuit EC1, and is quickly accumulated in the storage capacitor by the amplifier OP1 and the diode D1 inside the second circuit EC2 The potential V Cst of Cst . Specifically, in the case of non-conductor sensing, the AC power source V Drive needs to continuously provide voltage. When the AC power V Drive is at a positive potential, the second circuit EC2 is turned on according to the switch S1 to accumulate the positive potential of the AC power V Drive in the storage capacitor Cst. At this time, the first circuit EC1 is not turned on. When the AC power V Drive is at a negative potential, the first circuit EC1 is turned on according to the switch S3 to accumulate the negative potential of the AC power V Drive in the storage capacitor Cst. At this time, the second circuit EC2 is not turned on. Accordingly, in this case, the first circuit EC1 and the second circuit EC2 are turned on alternately to quickly accumulate the sensed charges in the storage capacitor Cst. It should be noted that the above-mentioned touch electrode layer 1115 includes two kinds of capacitors for conducting sensing of conductors or non-conductors. When the conductor touches and splices the electronic device 1000 , both capacitances become smaller. When the non-conductor touch-splicing electronic device 1000 is used, one of the two capacitances will become larger, and the other of the two capacitances will become smaller. A conductor or a non-conductor can be distinguished by the change of the two capacitances.

在一些實施例中,請參閱第4圖及第5圖,本案之第二電路EC2將儲存電容Cst兩端之電位V Cst抬升至電位V1。在相同時間下,現今觸控電路架構僅能將儲存電容Cst兩端之電位V Cst抬升至電位V2。在一些實施例中,如第5圖所示,電位V1約為電位V2之兩倍,但不以圖式實施例為限。 In some embodiments, please refer to FIG. 4 and FIG. 5 , the second circuit EC2 in this case raises the potential V Cst across the storage capacitor Cst to the potential V1 . At the same time, the current touch circuit structure can only raise the potential V Cst across the storage capacitor Cst to the potential V2. In some embodiments, as shown in FIG. 5 , the potential V1 is approximately twice the potential V2 , but is not limited to the embodiment shown in the figure.

在一些實施例中,為使本案之驅動方法易於理解,請一併參閱第1A圖至第6圖,第6圖為根據本案一些實施例繪示的驅動方法600之步驟流程示意圖。驅動方法600包含以下步驟:In some embodiments, in order to make the driving method of the present application easy to understand, please refer to FIGS. 1A to 6 together. FIG. 6 is a schematic diagram illustrating the steps of the driving method 600 according to some embodiments of the present application. The driving method 600 includes the following steps:

於步驟610中,取得拼接電子裝置之複數個屏幕之位置資訊。In step 610, the location information of the plurality of screens of the spliced electronic device is obtained.

在一些實施例中,請參閱第1A圖、第2圖及第6圖,裝置管理端1200取得第1A圖之拼接裝置1000之屏幕數量為4個,拼接裝置1000之拼接形狀為一橫列,此為第1A圖之屏幕之位置資訊。In some embodiments, please refer to FIG. 1A , FIG. 2 , and FIG. 6 , the device management terminal 1200 obtains that the number of screens of the splicing device 1000 in FIG. 1A is 4, and the splicing shape of the splicing device 1000 is a row, This is the location information of the screen in Figure 1A.

在一些實施例中,請參閱第1B圖、第2圖及第6圖,裝置管理端1200取得第1B圖之拼接裝置1000A之屏幕數量為6個,拼接裝置1000A之拼接形狀為3直行2橫列,此為第1B圖之屏幕之位置資訊。In some embodiments, please refer to FIG. 1B , FIG. 2 , and FIG. 6 , the device management terminal 1200 obtains the number of screens of the splicing device 1000A in FIG. 1B is 6, and the splicing shape of the splicing device 1000A is 3 straight and 2 horizontal row, which is the position information of the screen in Figure 1B.

須說明的是,拼接裝置之拼接方式可為陣列(array)排列。換言之,拼接裝置之拼接方式可為(M*N)矩陣,M為正整數,N為正整數。拼接裝置之拼接方式不以第1A圖及第1B圖之實施例為限。It should be noted that the splicing method of the splicing device may be arranged in an array. In other words, the splicing manner of the splicing device may be a (M*N) matrix, where M is a positive integer and N is a positive integer. The splicing method of the splicing device is not limited to the embodiment shown in FIG. 1A and FIG. 1B .

於步驟620中,根據複數個屏幕之位置資訊設定主屏幕之位置。In step 620, the position of the main screen is set according to the position information of the plurality of screens.

在一些實施例中,請參閱第1A圖、第2圖及第6圖,裝置管理端1200根據第1A圖之屏幕之位置資訊設定主屏幕之位置複數個屏幕1100之兩側,並以主屏幕之位置為起點,沿順時針或逆時針方向設定複數個副屏幕之位置。複數個屏幕1100包含中央區域、第一側(圖式左側)及第二側(圖式右側)。屏幕1120之位置及屏幕1130之位置位於中央區域。屏幕1110之位置位於第一側。屏幕1140之位置位於第二側。舉例而言,現今主屏幕設定於屏幕1110之位置。In some embodiments, please refer to FIG. 1A , FIG. 2 , and FIG. 6 , the device management terminal 1200 sets the position of the main screen according to the position information of the screen in FIG. The position is the starting point, and the positions of multiple sub-screens are set clockwise or counterclockwise. The plurality of screens 1100 include a central area, a first side (left side in the drawing) and a second side (right side in the drawing). The position of the screen 1120 and the position of the screen 1130 are located in the central area. The position of the screen 1110 is on the first side. The position of the screen 1140 is on the second side. For example, the home screen is currently set at the position of screen 1110 .

在一些實施例中,請參閱第1B圖、第2圖及第6圖,裝置管理端根據第1B圖之屏幕之位置資訊設定主屏幕之位置位於複數個屏幕1100A之兩側。複數個屏幕1100A包含中央區域、第一側(圖式左側)及第二側(圖式右側)。屏幕1120A之位置及屏幕1150A之位置位於中央區域。屏幕1110A之位置及屏幕1160A之位置位於第一側。屏幕1130A之位置及屏幕1140A之位置位於第二側。換言之,主屏幕之位置可位於屏幕1110A之位置、屏幕1130A之位置、屏幕1140A之位置及屏幕1160A之位置其中一者。舉例而言,現今主屏幕設定於屏幕1110A之位置(左下方位置)。In some embodiments, please refer to FIG. 1B , FIG. 2 , and FIG. 6 , the device management terminal sets the position of the main screen to be located on both sides of the plurality of screens 1100A according to the position information of the screen in FIG. 1B . The plurality of screens 1100A include a central area, a first side (left side in the drawing) and a second side (right side in the drawing). The position of screen 1120A and the position of screen 1150A are located in the central area. The position of screen 1110A and the position of screen 1160A are on the first side. The position of screen 1130A and the position of screen 1140A are on the second side. In other words, the position of the main screen may be at one of the position of screen 1110A, the position of screen 1130A, the position of screen 1140A, and the position of screen 1160A. For example, the home screen is currently set at the position of the screen 1110A (the lower left position).

在一些實施例中,上述裝置管理端用以設定顯示器之種類。顯示器包含液晶顯示器(liquid-crystal display, LCD)、有機發光顯示器(Organic Light Emitting Display, OLED)、次發光二極體(mini Light Emitting Diode, mini-LED)顯示器及微發光二極體 (micro Light Emitting Diode, μ-LED) 顯示器。In some embodiments, the above-mentioned device management terminal is used to set the type of the display. Displays include liquid-crystal display (LCD), organic light-emitting display (OLED), sub-light-emitting diode (mini Light Emitting Diode, mini-LED) display and micro-light-emitting diode (micro Light Emitting Diode) Emitting Diode, μ-LED) display.

於步驟630中,傳送第一顯示訊號至主屏幕。In step 630, the first display signal is sent to the main screen.

在一些實施例中,請參閱第1A圖、第1B圖、第2圖及第6圖,裝置管理端1200傳送顯示訊號DS1至上述主屏幕之位置。In some embodiments, please refer to FIG. 1A , FIG. 1B , FIG. 2 and FIG. 6 , the device management terminal 1200 transmits the display signal DS1 to the position of the main screen.

於步驟640中,藉由主屏幕根據第一顯示訊號依序輸出複數個第二顯示訊號至複數個屏幕之複數個副屏幕。In step 640, the main screen sequentially outputs a plurality of second display signals to a plurality of sub-screens of the plurality of screens according to the first display signal.

在一些實施例中,請參閱第1A圖、第2圖及第6圖,裝置管理端1200根據顯示訊號DS1依序輸出複數個顯示訊號(例如:顯示訊號DS2及顯示訊號DS3)至複數個屏幕之複數個副屏幕(例如:副屏幕1120、副屏幕1130及副屏幕1140)。In some embodiments, please refer to FIG. 1A , FIG. 2 , and FIG. 6 , the device management terminal 1200 sequentially outputs a plurality of display signals (eg, a display signal DS2 and a display signal DS3 ) to a plurality of screens according to the display signal DS1 a plurality of sub-screens (eg: sub-screen 1120, sub-screen 1130 and sub-screen 1140).

在一些實施例中,請參閱第1A圖、第2圖及第6圖,藉由主屏幕1110之裝置控制器1119及處理器1112根據顯示訊號DS1輸出顯示訊號DS2至副屏幕1120。接著,處理器1122藉由副屏幕1120根據顯示訊號DS2輸出次級顯示訊號DS3至副屏幕1130之處理器1132。In some embodiments, please refer to FIG. 1A , FIG. 2 and FIG. 6 , the device controller 1119 and the processor 1112 of the main screen 1110 output the display signal DS2 to the sub-screen 1120 according to the display signal DS1 . Next, the processor 1122 outputs the secondary display signal DS3 to the processor 1132 of the secondary screen 1130 through the secondary screen 1120 according to the display signal DS2.

在一些實施例中,請參閱第1B圖、第2圖及第6圖,現今主屏幕被設定位於第1B圖式中屏幕1110A之位置。因此,現今屏幕1120A、屏幕1130A、屏幕1140A、屏幕1150A及屏幕1160A均為副屏幕。換言之,僅主屏幕1110A包含上述裝置控制器。接著,主屏幕1110A之裝置控制器根據顯示訊號DS1依照標號順序或依照逆時鐘順序輸出複數個顯示訊號至圖式中屏幕1120A之位置、屏幕1130A之位置、屏幕1140A之位置、屏幕1150A之位置及屏幕1160A之位置,其餘詳細操作相同於第1A圖之主屏幕1110之操作,於此不作贅述。須說明的是,屏幕之排列順序不以圖式實施例為限。In some embodiments, please refer to FIG. 1B, FIG. 2, and FIG. 6, the home screen is now set to be located at the position of the screen 1110A in the FIG. 1B. Therefore, the current screen 1120A, the screen 1130A, the screen 1140A, the screen 1150A, and the screen 1160A are all secondary screens. In other words, only the home screen 1110A includes the above-described device controller. Next, the device controller of the main screen 1110A outputs a plurality of display signals to the position of the screen 1120A, the position of the screen 1130A, the position of the screen 1140A, the position of the screen 1150A and the The position of the screen 1160A and other detailed operations are the same as the operations of the main screen 1110 in FIG. 1A , and will not be repeated here. It should be noted that the arrangement order of the screens is not limited to the embodiment in the drawings.

於步驟650中,藉由主屏幕及複數個副屏幕分別根據第一顯示訊號及複數個第二顯示訊號顯示複數個分割畫面。In step 650, a plurality of split screens are displayed on the main screen and the plurality of sub-screens according to the first display signal and the plurality of second display signals, respectively.

在一些實施例中,請參閱第1A圖、第2圖及第6圖,主屏幕(屏幕1110)根據顯示訊號DS1顯示分割畫面。複數個副屏幕(屏幕1120、屏幕1130及屏幕1140)根據顯示訊號(例如:顯示訊號DS2及顯示訊號DS3)顯示分割畫面。主屏幕與複數個副屏幕顯示的分割畫面可拼接出一個完整的顯示畫面。在一些實施例中,主屏幕(屏幕1110)可單獨顯示一個完整的顯示畫面。In some embodiments, please refer to FIG. 1A , FIG. 2 and FIG. 6 , the main screen (screen 1110 ) displays the split screen according to the display signal DS1 . A plurality of sub-screens (screen 1120, screen 1130 and screen 1140) display split screens according to display signals (eg, display signal DS2 and display signal DS3). The split screen displayed by the main screen and a plurality of sub-screens can be spliced to form a complete display screen. In some embodiments, the main screen (screen 1110) may display a complete display by itself.

在一些實施例中,請參閱第1B圖、第2圖及第6圖,主屏幕(1110A)與複數個副屏幕(屏幕1120A至屏幕1160A)顯示的分割畫面可拼接出一個完整的顯示畫面。在一些實施例中,主屏幕(屏幕1110A)可單獨顯示一個完整的顯示畫面。In some embodiments, please refer to FIG. 1B , FIG. 2 and FIG. 6 , the divided images displayed on the main screen ( 1110A ) and the plurality of sub-screens (screens 1120A to 1160A ) can be spliced into a complete display screen. In some embodiments, the main screen (screen 1110A) may display a complete display by itself.

於步驟660中,驅動複數個屏幕以接收物體之觸控訊號。In step 660, a plurality of screens are driven to receive touch signals of objects.

在一些實施例中,請參閱第2圖、第4圖及及第6圖,每一複數個屏幕之時序控制器(例如:時序控制1113)分別驅動觸控電極層(例如:觸控電極層1115)以接收物體之觸控訊號。接著,第4圖之觸控感測電路接收物體之觸控訊號辨別物體為導體或非導體。In some embodiments, please refer to FIG. 2 , FIG. 4 and FIG. 6 , the timing controller (eg, timing control 1113 ) of each of the plurality of screens drives the touch electrode layer (eg, the touch electrode layer) respectively 1115) to receive the touch signal of the object. Next, the touch sensing circuit of FIG. 4 receives the touch signal of the object to identify whether the object is a conductor or a non-conductor.

第7圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。在一些實施例中,請參閱第6圖及第7圖,本案之拼接電子裝置1000及拼接電子裝置1000A更新所有分割畫面的時間為一幀(frame)。詳細而言,更新一幀的時間由複數個顯示階段701及複數個導體觸控感測階段703所組成,此為本案之拼接電子裝置1000及拼接電子裝置1000A之第一驅動模式。於顯示階段701中,拼接電子裝置1000或拼接電子裝置1000A執行步驟610至步驟650。於導體觸控感測階段703中,拼接電子裝置1000或拼接電子裝置1000A執行步驟660。FIG. 7 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application. In some embodiments, please refer to FIG. 6 and FIG. 7 , the time for the splicing electronic device 1000 and the splicing electronic device 1000A to update all the divided pictures is one frame. Specifically, the time for updating one frame consists of a plurality of display stages 701 and a plurality of conductor touch sensing stages 703 , which is the first driving mode of the splicing electronic device 1000 and the splicing electronic device 1000A of the present invention. In the display stage 701 , the splicing electronic device 1000 or the splicing electronic device 1000A performs steps 610 to 650 . In the conductor touch sensing stage 703 , the splicing electronic device 1000 or the splicing electronic device 1000A executes step 660 .

第8圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。在一些實施例中,請參閱第6圖至第8圖,相較於第7圖,第8圖之實施例為本案之拼接電子裝置1000及拼接電子裝置1000A之第二驅動模式。在此驅動模式下,更新一幀的時間由複數個顯示階段701及複數個非導體觸控感測階段705所組成。詳細步驟相同於第7圖之實施例,於此不作贅述。FIG. 8 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application. In some embodiments, please refer to FIGS. 6 to 8. Compared with FIG. 7, the embodiment of FIG. 8 is the second driving mode of the splicing electronic device 1000 and the splicing electronic device 1000A of the present invention. In this driving mode, the time for updating one frame consists of a plurality of display stages 701 and a plurality of non-conductive touch sensing stages 705 . The detailed steps are the same as those of the embodiment in FIG. 7 , and are not repeated here.

第9圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。在一些實施例中,請參閱第6圖至第9圖,第9圖之實施例為本案之拼接電子裝置1000及拼接電子裝置1000A之第三驅動模式。在此驅動模式下,更新一幀的時間由複數個顯示階段701、複數個導體觸控感測階段703及複數個非導體觸控感測階段705所組成。於顯示階段701中,拼接電子裝置1000或拼接電子裝置1000A執行步驟610至步驟650。於導體觸控感測階段703及非導體觸控感測階段705中,拼接電子裝置1000或拼接電子裝置1000A執行步驟660。FIG. 9 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application. In some embodiments, please refer to FIGS. 6 to 9, the embodiment of FIG. 9 is the third driving mode of the splicing electronic device 1000 and the splicing electronic device 1000A of the present invention. In this driving mode, the time for updating one frame consists of a plurality of display stages 701 , a plurality of conductor touch sensing stages 703 and a plurality of non-conductor touch sensing stages 705 . In the display stage 701 , the splicing electronic device 1000 or the splicing electronic device 1000A performs steps 610 to 650 . In the conductive touch sensing stage 703 and the non-conductive touch sensing stage 705 , the splicing electronic device 1000 or the splicing electronic device 1000A performs step 660 .

第10圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。在一些實施例中,請參閱第6圖至第10圖,相較於第9圖,第10圖之實施例為本案之拼接電子裝置1000及拼接電子裝置1000A之第四驅動模式,僅改變導體觸控感測階段703及非導體觸控感測階段705之驅動順序。詳細步驟相同於第9圖之實施例,於此不作贅述。FIG. 10 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application. In some embodiments, please refer to FIGS. 6 to 10. Compared with FIG. 9, the embodiment of FIG. 10 is the fourth driving mode of the splicing electronic device 1000 and the splicing electronic device 1000A of the present invention, and only the conductors are changed. The driving sequence of the touch sensing stage 703 and the non-conductive touch sensing stage 705 . The detailed steps are the same as those of the embodiment in FIG. 9, and are not repeated here.

第11圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。在一些實施例中,請參閱第6圖至第11圖,第11圖之實施例為本案之拼接電子裝置1000及拼接電子裝置1000A之第五驅動模式。第11圖之實施例表示導體觸控感測階段703及非導體觸控感測階段705可同時進行。換言之,本案之拼接電子裝置1000及拼接電子裝置1000A可同時進行導體感測及非導體感測。FIG. 11 is a schematic diagram illustrating the driving timing of the splicing electronic device according to some embodiments of the present application. In some embodiments, please refer to FIGS. 6 to 11 , the embodiment of FIG. 11 is the fifth driving mode of the splicing electronic device 1000 and the splicing electronic device 1000A of the present invention. The embodiment of FIG. 11 shows that the conductive touch sensing stage 703 and the non-conductive touch sensing stage 705 can be performed simultaneously. In other words, the splicing electronic device 1000 and the splicing electronic device 1000A of the present application can simultaneously perform conductor sensing and non-conductor sensing.

依據前述實施例,本案提供一種拼接電子裝置及驅動方法,藉由本案之觸控感測電路以提高辨別導體及非導體之觸控感應速度,並藉由本案之驅動方法以使訊號可分區域控制屏幕顯示。According to the aforementioned embodiments, the present application provides a splicing electronic device and a driving method. The touch sensing circuit of the present application improves the touch sensing speed of distinguishing conductors and non-conductors, and the driving method of the present application enables signals to be divided into regions. Control screen display.

雖然本案以詳細之實施例揭露如上,然而本案並不排除其他可行之實施態樣。因此,本案之保護範圍當視後附之申請專利範圍所界定者為準,而非受於前述實施例之限制。Although this case is disclosed above with detailed embodiments, this case does not exclude other possible implementations. Therefore, the protection scope of this case should be determined by the scope of the appended patent application, rather than being limited by the foregoing embodiments.

對本領域技術人員而言,在不脫離本案之精神和範圍內,當可對本案作各種之更動與潤飾。基於前述實施例,所有對本案所作的更動與潤飾,亦涵蓋於本案之保護範圍內。For those skilled in the art, various changes and modifications can be made to this case without departing from the spirit and scope of this case. Based on the foregoing embodiments, all changes and modifications made to this case are also covered by the protection scope of this case.

1000~1000A:拼接電子裝置 1100~1100A:屏幕 1110~1140:屏幕 1110A~1140A:屏幕 1111~1131:電源 1112~1132:處理器 1113~1133:時序控制器 1114~1134:顯示面板 1115~1135:觸控電極層 1119:裝置控制器 1200:裝置管理端 DS1~DS3:顯示訊號 CS1:控制訊號 TS1:時序控制訊號 1116:驅動積體電路 1117:觸控電路 B:基板 L1~L3:發光二極體 IC1~IC6:積體電路 IL1:紅外線二極體 IS1:紅外線感測器 PS1:光感測器 V Drive:交流電源 Cm:耦合電容 Cst:儲存電容 Cs:電容 EC1~EC2:電路 D1:二極體 OP1~OP2:放大器 S1~S3:開關 V Cst:電位 V1~V2:電位 600:方法 610~660:步驟 701:顯示階段 703:導體觸控感測階段 705:非導體觸控感測階段 1000~1000A: Splicing electronic device 1100~1100A: Screen 1110~1140: Screen 1110A~1140A: Screen 1111~1131: Power supply 1112~1132: Processor 1113~1133: Timing controller 1114~1134: Display panel 1115~1135: Touch electrode layer 1119: Device controller 1200: Device management terminal DS1~DS3: Display signal CS1: Control signal TS1: Timing control signal 1116: Driving IC 1117: Touch circuit B: Substrate L1~L3: Light emitting diode Body IC1~IC6: Integrated Circuit IL1: Infrared Diode IS1: Infrared Sensor PS1: Photo Sensor V Drive : AC Power Supply Cm: Coupling Capacitor Cst: Storage Capacitor Cs: Capacitor EC1~EC2: Circuit D1: Two Pole body OP1~OP2: Amplifier S1~S3: Switch V Cst : Potential V1~V2: Potential 600: Method 610~660: Step 701: Display stage 703: Conductive touch sensing stage 705: Non-conductive touch sensing stage

參照後續段落中的實施方式以及下列圖式,當可更佳地理解本案的內容: 第1A圖為根據本案一些實施例繪示的拼接電子裝置之示意圖; 第1B圖為根據本案一些實施例繪示的拼接電子裝置之示意圖; 第2圖為根據本案一些實施例繪示的拼接電子裝置之詳細電路方塊示意圖; 第3A圖為根據本案一些實施例繪示的之拼接電子裝置之電路方塊示意圖; 第3B圖為根據本案一些實施例繪示的之拼接電子裝置之部分結構側視示意圖。; 第4圖為根據本案一些實施例繪示的拼接電子裝置之觸控感測電路示意圖; 第5圖為根據本案一些實施例繪示的之觸控感測電路之驅動訊號示意圖; 第6圖為根據本案一些實施例繪示的驅動方法之步驟流程示意圖; 第7圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖; 第8圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖; 第9圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖; 第10圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖;以及 第11圖為根據本案一些實施例繪示的之拼接電子裝置之驅動時序示意圖。 The content of this case can be better understood with reference to the embodiments in the following paragraphs and the following drawings: FIG. 1A is a schematic diagram of a splicing electronic device according to some embodiments of the present application; FIG. 1B is a schematic diagram of a splicing electronic device according to some embodiments of the present application; FIG. 2 is a detailed circuit block diagram of a splicing electronic device according to some embodiments of the present application; FIG. 3A is a schematic circuit block diagram of a splicing electronic device according to some embodiments of the present application; FIG. 3B is a schematic side view of a partial structure of a splicing electronic device according to some embodiments of the present application. ; FIG. 4 is a schematic diagram of a touch sensing circuit of a splicing electronic device according to some embodiments of the present application; FIG. 5 is a schematic diagram of driving signals of the touch sensing circuit according to some embodiments of the present application; FIG. 6 is a schematic flowchart of steps of a driving method according to some embodiments of the present application; FIG. 7 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application; FIG. 8 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application; FIG. 9 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application; FIG. 10 is a schematic diagram of the driving timing of the splicing electronic device according to some embodiments of the present application; and FIG. 11 is a schematic diagram illustrating the driving timing of the splicing electronic device according to some embodiments of the present application.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date and number) none Foreign deposit information (please note in the order of deposit country, institution, date and number) none

1000:拼接電子裝置 1000: Splicing Electronics

1100:屏幕 1100: Screen

1110~1130:屏幕 1110~1130: Screen

1111~1131:電源 1111~1131: Power

1112~1132:處理器 1112~1132: Processor

1113~1133:時序控制器 1113~1133: Timing Controller

1114~1134:顯示面板 1114~1134: Display panel

1115~1135:觸控電極層 1115~1135: Touch electrode layer

1119:裝置控制器 1119: Device Controller

1200:裝置管理端 1200: Device management terminal

DS1~DS3:顯示訊號 DS1~DS3: Display signal

CS1:控制訊號 CS1: Control signal

TS1:時序控制訊號 TS1: Timing control signal

Claims (8)

一種拼接電子裝置,包含:複數個屏幕,位於一基板之上,並包含:一主屏幕,用以接收一第一顯示訊號,藉以輸出複數個第二顯示訊號;以及複數個副屏幕,依序拼接於該主屏幕,藉以接收該些第二顯示訊號;其中該主屏幕及該些副屏幕用以於一第一階段分別根據該第一顯示訊號及該些第二顯示訊號顯示複數個分割畫面,且該主屏幕及該些副屏幕用以於一第二階段接收一觸控訊號,其中每一該些屏幕包含一觸控電極層,且該觸控電極層包含一觸控感測電路,其中該觸控電極層用以於該第二階段接收該觸控訊號,其中該觸控感測電路包含一第一電路及一儲存電容,且該第一電路用以根據該觸控訊號以決定該儲存電容之一電壓準位,其中該觸控感測電路包含一第二電路,其中該第二電路包含一放大器及一二極體,其中該二極體之一陰極端耦接於該第一電路及該放大器之一第一輸入端,且該二極體之一陽極端耦接於該放大器之一輸出端,其中該第一電路及該第二電路根據該觸控訊號共同決定該儲存電容之該電壓準位。 A splicing electronic device, comprising: a plurality of screens, located on a substrate, and comprising: a main screen for receiving a first display signal, so as to output a plurality of second display signals; and a plurality of sub-screens, in sequence spliced on the main screen to receive the second display signals; wherein the main screen and the sub-screens are used to display a plurality of split screens according to the first display signal and the second display signal respectively in a first stage , and the main screen and the sub screens are used to receive a touch signal in a second stage, wherein each of the screens includes a touch electrode layer, and the touch electrode layer includes a touch sensing circuit, The touch electrode layer is used for receiving the touch signal in the second stage, wherein the touch sensing circuit includes a first circuit and a storage capacitor, and the first circuit is used for determining according to the touch signal A voltage level of the storage capacitor, wherein the touch sensing circuit includes a second circuit, wherein the second circuit includes an amplifier and a diode, wherein a cathode terminal of the diode is coupled to the first A circuit and a first input terminal of the amplifier, and an anode terminal of the diode is coupled to an output terminal of the amplifier, wherein the first circuit and the second circuit jointly determine the storage capacitor according to the touch signal the voltage level. 如請求項1所述之拼接電子裝置,其中該主屏幕包含一裝置控制器及一第一處理器,其中該裝置控制器與該第一處理器互相耦接,且該裝置控制器用以根據該 第一顯示訊號輸出一第一訊號至該第一處理器,其中該第一處理器根據該第一訊號輸出該些第二顯示訊號至該些副屏幕。 The splicing electronic device as claimed in claim 1, wherein the main screen includes a device controller and a first processor, wherein the device controller and the first processor are coupled to each other, and the device controller is used for according to the The first display signal outputs a first signal to the first processor, wherein the first processor outputs the second display signals to the secondary screens according to the first signal. 如請求項2所述之拼接電子裝置,其中每一該些副屏幕包含一第二處理器,且該第二處理器用以接收該些第二顯示訊號其中一者。 The splicing electronic device of claim 2, wherein each of the sub-screens includes a second processor, and the second processor is used for receiving one of the second display signals. 一種驅動方法,適用於一拼接電子裝置,該驅動方法包含:於一第一階段取得該拼接電子裝置之複數個屏幕之一位置資訊;於該第一階段根據該些屏幕之該位置資訊設定該些屏幕之一主屏幕之一位置;於該第一階段傳送一第一顯示訊號至該主屏幕;於該第一階段藉由該主屏幕根據該第一顯示訊號依序輸出複數個第二顯示訊號至該些屏幕之複數個副屏幕;於該第一階段藉由該主屏幕及該些副屏幕分別根據該第一顯示訊號及該些第二顯示訊號以顯示複數個分割畫面;於一第二階段驅動該些屏幕以接收一物體之一觸控訊號;藉由每一該些屏幕之一觸控電極層之一觸控感測電路於該第二階段接收該觸控訊號;藉由該觸控感測電路之一第一電路根據該觸控訊號以決 定該觸控感測電路之一儲存電容之一電壓準位,其中該觸控感測電路包含一第二電路,其中該第二電路包含一放大器及一二極體,其中該二極體之一陰極端耦接於該第一電路及該放大器之一第一輸入端,且該二極體之一陽極端耦接於該放大器之一輸出端;以及藉由每一該些屏幕之該觸控電極層之該觸控感測電路之該第一電路及該第二電路根據該觸控訊號共同決定該觸控感測電路之該儲存電容之該電壓準位。 A driving method suitable for a splicing electronic device, the driving method comprising: obtaining a position information of a plurality of screens of the splicing electronic device in a first stage; setting the position information according to the position information of the screens in the first stage a position of one of the main screens of the screens; a first display signal is sent to the main screen in the first stage; a plurality of second displays are sequentially output from the main screen according to the first display signal in the first stage signal to a plurality of sub-screens of the screens; in the first stage, the main screen and the sub-screens respectively display a plurality of split screens according to the first display signal and the second display signal; in a first stage The screens are driven in two stages to receive a touch signal of an object; a touch sensing circuit of a touch electrode layer of each of the screens receives the touch signal in the second stage; A first circuit of the touch sensing circuit determines the touch signal according to the touch signal. A voltage level of a storage capacitor of the touch sensing circuit is determined, wherein the touch sensing circuit includes a second circuit, wherein the second circuit includes an amplifier and a diode, wherein the diode is A cathode terminal is coupled to the first circuit and a first input terminal of the amplifier, and an anode terminal of the diode is coupled to an output terminal of the amplifier; and the touch control by each of the screens The first circuit and the second circuit of the touch sensing circuit of the electrode layer jointly determine the voltage level of the storage capacitor of the touch sensing circuit according to the touch signal. 如請求項4所述之驅動方法,其中該些屏幕包含一中央區域、一第一側及一第二側,且該第一側及該第二側位於該中央區域之外側,其中於該第一階段根據該些屏幕之該位置資訊設定該主屏幕之該位置之步驟包含:根據該些屏幕之一屏幕數量及該些屏幕之一拼接形狀設定該主屏幕位於該些屏幕之該第一側或該第二側。 The driving method of claim 4, wherein the screens include a central area, a first side and a second side, and the first side and the second side are located outside the central area, wherein the A step of setting the position of the main screen according to the position information of the screens includes: setting the main screen to be located on the first side of the screens according to a screen number of the screens and a mosaic shape of the screens or this second side. 如請求項5所述之驅動方法,其中該些副屏幕包含一第一副屏幕及一第二副屏幕,其中於該第一階段藉由該主屏幕根據該第一顯示訊號依序輸出該些第二顯示訊號至該些屏幕之該些副屏幕之步驟包含:藉由該主屏幕之一裝置控制器根據該第一顯示訊號輸出該些第二顯示訊號其中一者至該第一副屏幕。 The driving method of claim 5, wherein the sub-screens include a first sub-screen and a second sub-screen, and the main screen outputs the sub-screens in sequence according to the first display signal in the first stage The step of sending the second display signal to the sub-screens of the screens includes: outputting one of the second display signals to the first sub-screen by a device controller of the main screen according to the first display signal. 如請求項6所述之驅動方法,其中於該第一 階段藉由該主屏幕根據該第一顯示訊號依序輸出該些第二顯示訊號至該些屏幕之該些副屏幕之步驟更包含:藉由該第一副屏幕根據該些第二顯示訊號其中一者輸出一次級第二顯示訊號至該第二副屏幕。 The driving method according to claim 6, wherein in the first The step of sequentially outputting the second display signals to the sub-screens of the screens through the main screen according to the first display signal further includes: using the first sub-screen according to the second display signals wherein One outputs a primary second display signal to the second secondary screen. 如請求項4所述之驅動方法,其中於該第二階段驅動該些屏幕以接收該物體之該觸控訊號之步驟包含:驅動該些屏幕之一觸控感測電路根據該觸控訊號辨別該物體為導體或非導體。 The driving method of claim 4, wherein the step of driving the screens to receive the touch signal of the object in the second stage comprises: driving a touch sensing circuit of the screens to identify according to the touch signal The object is a conductor or a non-conductor.
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