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TWI776864B - 感光性樹脂組成物 - Google Patents

感光性樹脂組成物 Download PDF

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Publication number
TWI776864B
TWI776864B TW107107822A TW107107822A TWI776864B TW I776864 B TWI776864 B TW I776864B TW 107107822 A TW107107822 A TW 107107822A TW 107107822 A TW107107822 A TW 107107822A TW I776864 B TWI776864 B TW I776864B
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
mass
type epoxy
photosensitive
Prior art date
Application number
TW107107822A
Other languages
English (en)
Chinese (zh)
Other versions
TW201842407A (zh
Inventor
唐川成弘
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW201842407A publication Critical patent/TW201842407A/zh
Application granted granted Critical
Publication of TWI776864B publication Critical patent/TWI776864B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW107107822A 2017-03-28 2018-03-08 感光性樹脂組成物 TWI776864B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017063498A JP6720910B2 (ja) 2017-03-28 2017-03-28 感光性樹脂組成物
JP2017-063498 2017-03-28

Publications (2)

Publication Number Publication Date
TW201842407A TW201842407A (zh) 2018-12-01
TWI776864B true TWI776864B (zh) 2022-09-11

Family

ID=63864261

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107107822A TWI776864B (zh) 2017-03-28 2018-03-08 感光性樹脂組成物

Country Status (3)

Country Link
JP (1) JP6720910B2 (ja)
KR (1) KR102554514B1 (ja)
TW (1) TWI776864B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020203790A1 (ja) * 2019-03-29 2020-10-08 太陽インキ製造株式会社 フォトレジスト組成物およびその硬化物
CN112266576A (zh) * 2020-11-04 2021-01-26 纽宝力精化(广州)有限公司 一种纸基板用溴化环氧树脂组合物
CN112759668A (zh) * 2020-12-25 2021-05-07 深圳市容大感光科技股份有限公司 光引发剂组合物、含有其的感光阻焊组合物及印刷电路板
CN113311664B (zh) * 2021-06-24 2024-11-26 江苏广信感光新材料股份有限公司 一种具有稠环萘结构的碱可溶感光性树脂及其组合物和制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201214042A (en) * 2010-08-31 2012-04-01 Fujifilm Corp Photosensitive composition, photosensitive film, permanent pattern, method of forming a permanent pattern, and printed board
TW201602188A (zh) * 2014-07-10 2016-01-16 Taiyo Ink Mfg Co Ltd 樹脂絕緣層之形成方法、樹脂絕緣層以及印刷配線板
TW201704858A (zh) * 2015-01-28 2017-02-01 互應化學工業股份有限公司 感光性樹脂組成物、乾膜及印刷線路板（一）

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4023594B2 (ja) * 2002-07-09 2007-12-19 日本化薬株式会社 エポキシ樹脂組成物、及びその硬化物
JP2006335807A (ja) * 2005-05-31 2006-12-14 Taiyo Ink Mfg Ltd 絶縁性硬化性樹脂組成物及びその硬化物
TW200710571A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Curable resin composition and cured object obtained therefrom
JP5192542B2 (ja) 2008-04-10 2013-05-08 リンテック株式会社 貫通孔・凹凸パターンを有するシートの製造方法
JP5201008B2 (ja) 2009-03-05 2013-06-05 日本電気株式会社 ラック収容機器管理システム及びラック収容機器管理方法
KR101495533B1 (ko) 2010-12-21 2015-02-25 동우 화인켐 주식회사 스페이서 형성용 감광성 수지 조성물, 이를 이용하여 제조된 표시 장치용 스페이서 및 이를 포함하는 표시 장치
CN110083010A (zh) * 2011-08-10 2019-08-02 日立化成株式会社 感光性树脂组合物、感光性薄膜、永久抗蚀剂以及永久抗蚀剂的制造方法
JP6210060B2 (ja) 2012-04-23 2017-10-11 日立化成株式会社 感光性樹脂組成物、感光性フィルム、永久マスクレジスト及び永久マスクレジストの製造方法
JP6143090B2 (ja) * 2013-07-01 2017-06-07 日立化成株式会社 感光性樹脂組成物、これを用いた感光性フィルム、永久レジスト及び永久レジストの製造方法
JP5729495B2 (ja) 2014-01-24 2015-06-03 日立化成株式会社 感光性樹脂組成物を用いた感光性エレメント、ソルダーレジスト及びプリント配線板
JP6704224B2 (ja) * 2015-04-15 2020-06-03 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201214042A (en) * 2010-08-31 2012-04-01 Fujifilm Corp Photosensitive composition, photosensitive film, permanent pattern, method of forming a permanent pattern, and printed board
TW201602188A (zh) * 2014-07-10 2016-01-16 Taiyo Ink Mfg Co Ltd 樹脂絕緣層之形成方法、樹脂絕緣層以及印刷配線板
TW201704858A (zh) * 2015-01-28 2017-02-01 互應化學工業股份有限公司 感光性樹脂組成物、乾膜及印刷線路板（一）

Also Published As

Publication number Publication date
JP2018165798A (ja) 2018-10-25
TW201842407A (zh) 2018-12-01
KR102554514B1 (ko) 2023-07-13
KR20180109726A (ko) 2018-10-08
JP6720910B2 (ja) 2020-07-08

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