TWI771912B - Display device - Google Patents
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- TWI771912B TWI771912B TW110105606A TW110105606A TWI771912B TW I771912 B TWI771912 B TW I771912B TW 110105606 A TW110105606 A TW 110105606A TW 110105606 A TW110105606 A TW 110105606A TW I771912 B TWI771912 B TW I771912B
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- 239000000463 material Substances 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000002955 isolation Methods 0.000 claims abstract description 22
- 238000005192 partition Methods 0.000 claims description 68
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical class [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
Description
本發明是有關於一種顯示裝置,且特別是有關於一種具有隔離壁的顯示裝置。 The present invention relates to a display device, and more particularly, to a display device having a partition wall.
發光元件陣列顯示裝置是由設置於基板上的陣列排列的多個發光元件構成。繼承目前的發光元件的特性,發光元件陣列顯示裝置具有省電、高效率、高亮度及反應時間快等優點。發光元件陣列顯示裝置分為背向基板發光的上出光型與朝向基板發光的下出光型。其中,下出光型的出光效率較佳,且出光的場型較為均勻。但是,下出光型的顯示裝置存在相鄰的畫素區的光線彼此干擾而導致顯示品質下降的問題。 A light-emitting element array display device is composed of a plurality of light-emitting elements arranged on a substrate and arranged in an array. Inheriting the characteristics of the current light-emitting elements, the light-emitting element array display device has the advantages of power saving, high efficiency, high brightness and fast response time. The light-emitting element array display device is divided into an upper light emitting type that emits light away from the substrate and a lower light emitting type that emits light toward the substrate. Among them, the light emitting efficiency of the lower light emitting type is better, and the field pattern of the light emitting is relatively uniform. However, the downward light emitting type display device has the problem that the light rays of adjacent pixel regions interfere with each other, which leads to the degradation of the display quality.
本發明提供一種顯示裝置,可改善相鄰的畫素區的光線彼此干擾的現象。 The present invention provides a display device which can improve the phenomenon that the light rays of adjacent pixel regions interfere with each other.
本發明的顯示裝置包括一基板、一材料層、多個隔離壁以及多個發光元件。基板具有多個畫素區以及位於畫素區之間的 一電路區。材料層配置於基板上。隔離壁配置於基板上且嵌置於材料層中。各隔離壁圍繞對應的畫素區,且各隔離壁為不連續壁。發光元件配置於材料層上。各發光元件位於對應的畫素區內。各發光元件具有一第一導線與一第二導線。各該發光元件的第一導線與第二導線至少其中之一從對應的隔離壁的一破口延伸至電路區。 The display device of the present invention includes a substrate, a material layer, a plurality of partition walls and a plurality of light-emitting elements. The substrate has a plurality of pixel regions and a plurality of pixel regions located between the pixel regions a circuit area. The material layer is disposed on the substrate. The isolation wall is disposed on the substrate and embedded in the material layer. Each partition wall surrounds the corresponding pixel area, and each partition wall is a discontinuous wall. The light-emitting element is arranged on the material layer. Each light-emitting element is located in the corresponding pixel area. Each light-emitting element has a first wire and a second wire. At least one of the first wire and the second wire of each light-emitting element extends from a break in the corresponding partition wall to the circuit area.
在本發明的一實施例中,隔離壁的頂部暴露於材料層外,隔離壁的底部接觸基板。 In an embodiment of the present invention, the top of the isolation wall is exposed outside the material layer, and the bottom of the isolation wall is in contact with the substrate.
在本發明的一實施例中,各破口包括一第一破口與一第二破口。各第一導線從對應的隔離壁的第一破口延伸至電路區。各第二導線從對應的隔離壁的第二破口延伸至電路區。 In an embodiment of the present invention, each breach includes a first breach and a second breach. Each of the first wires extends from the corresponding first breach of the partition wall to the circuit area. Each of the second wires extends from the corresponding second opening of the partition wall to the circuit area.
在本發明的一實施例中,沿基板的一法線方向觀看,各隔離壁靠近對應的發光元件的一側的邊緣呈弧形。 In an embodiment of the present invention, when viewed along a normal direction of the substrate, the edge of the side of each partition wall close to the corresponding light-emitting element is arc-shaped.
在本發明的一實施例中,沿垂直於基板的一法線方向的方向觀看,各隔離壁的剖面在靠近對應的發光元件的一側的邊緣呈弧形。 In an embodiment of the present invention, when viewed along a direction perpendicular to a normal direction of the substrate, the cross-section of each partition wall is arc-shaped at the edge of the side close to the corresponding light-emitting element.
在本發明的一實施例中,各畫素區內具有多個發光元件。同一畫素區內的發光元件的第一導線結構上彼此連接,以及同一畫素區內的發光元件的第二導線結構上彼此連接。 In an embodiment of the present invention, each pixel area has a plurality of light-emitting elements. The first wire structures of the light emitting elements in the same pixel area are connected to each other, and the second wire structures of the light emitting elements in the same pixel area are connected to each other.
在本發明的一實施例中,材料層是一堆疊層。沿垂直於基板的一法線方向的方向觀看,各隔離壁的剖面的兩側的邊緣呈階梯狀,且各隔離壁的壁厚從各隔離壁的底部往上增加。 In one embodiment of the invention, the material layer is a stacked layer. Viewed from a direction perpendicular to a normal direction of the substrate, the edges on both sides of the section of each partition wall are stepped, and the wall thickness of each partition wall increases from the bottom of each partition wall upward.
在本發明的一實施例中,發光元件是發光二極體。 In an embodiment of the present invention, the light emitting element is a light emitting diode.
在本發明的一實施例中,隔離壁的材料是高分子材料。 In an embodiment of the present invention, the material of the partition wall is a polymer material.
在本發明的一實施例中,顯示裝置更包括一反射材料層,配置於基板上且覆蓋材料層、隔離壁與發光元件。 In an embodiment of the present invention, the display device further includes a reflective material layer disposed on the substrate and covering the material layer, the isolation wall and the light-emitting element.
在本發明的一實施例中,反射材料層與隔離壁的材料相同。 In an embodiment of the present invention, the material of the reflective material layer is the same as that of the isolation wall.
在本發明的一實施例中,隔離壁的至少一部分還嵌置於基板。 In an embodiment of the present invention, at least a part of the isolation wall is also embedded in the substrate.
基於上述,在本發明的顯示裝置中,隔離壁圍繞畫素區,可避免光線進入鄰近的畫素區,進而提升顯示品質。 Based on the above, in the display device of the present invention, the partition wall surrounds the pixel area, which can prevent light from entering the adjacent pixel area, thereby improving the display quality.
100,200,300,400,500,600,700,800,900:顯示裝置 100, 200, 300, 400, 500, 600, 700, 800, 900: Display devices
110,510:基板 110,510: Substrate
120,420:材料層 120,420: Material Layer
130,132,330,530,630,830,930:隔離壁 130, 132, 330, 530, 630, 830, 930: partition walls
130T,132T:頂部 130T, 132T: top
130B,132B,430B:底部 130B, 132B, 430B: Bottom
140:發光元件 140: Light-emitting element
142,642,742:第一導線 142,642,742: First wire
144,644,744:第二導線 144,644,744: Second wire
150:反射材料層 150: Reflective material layer
P10:畫素區 P10: pixel area
C10:電路區 C10: Circuit area
G12,G14,G62:破口 G12, G14, G62: break
S12:出光面 S12: light-emitting surface
VSS:共用電路 VSS: common circuit
TFT:驅動電路 TFT: driver circuit
D12,D14:方向 D12, D14: Direction
W12,W14,W16:寬度 W12, W14, W16: width
332,432,833:邊緣 332,432,833: Edge
422:層 422: Layer
圖1是依照本發明的一實施例的顯示裝置的上視示意圖。 FIG. 1 is a schematic top view of a display device according to an embodiment of the present invention.
圖2是圖1的顯示裝置沿I-I線的局部剖面示意圖。 FIG. 2 is a partial cross-sectional schematic diagram of the display device of FIG. 1 taken along the line I-I.
圖3至圖7是依照本發明的另外五種實施例的顯示裝置的局部剖面示意圖。 3 to 7 are partial cross-sectional schematic views of display devices according to another five embodiments of the present invention.
圖8至圖11是依照本發明的另外四種實施例的顯示裝置的局部上視示意圖。 8 to 11 are schematic partial top views of display devices according to other four embodiments of the present invention.
圖1是依照本發明的一實施例的顯示裝置的上視示意
圖。圖2是圖1的顯示裝置沿I-I線的局部剖面示意圖。請參照圖1與圖2,本實施例的顯示裝置100包括一基板110、一材料層120、多個隔離壁130以及多個發光元件140。基板110具有多個畫素區P10以及位於畫素區P10之間的一電路區C10。材料層120配置於基板110上。隔離壁130配置於基板110上且嵌置於材料層120中。換言之,從圖2的剖面圖可以看到,隔離壁130穿過材料層120。每個隔離壁130圍繞對應的畫素區P10,且每個隔離壁130為不連續壁。換言之,從圖1的上視圖可以看到,每個隔離壁130大致位於對應的一個畫素區P10的周圍,但是隔離壁130並不環繞整個畫素區P10的周圍,而呈現不連續的外觀。
FIG. 1 is a schematic top view of a display device according to an embodiment of the present invention
picture. FIG. 2 is a partial cross-sectional schematic diagram of the display device of FIG. 1 taken along the line I-I. Referring to FIGS. 1 and 2 , the
發光元件140配置於材料層120上。每個發光元件140位於對應的畫素區P10內。每個發光元件140具有一第一導線142與一第二導線144。第一導線142與第二導線144從對應的隔離壁130的一破口(包括第一破口G12與第二破口G14)延伸至電路區C10。破口(包括第一破口G12與第二破口G14)也就是從圖1的上視圖看到的隔離壁130的不連續處。
The light-emitting
在本實施例的顯示裝置100中,因為畫素區P10的周圍大致被隔離壁130圍繞,所以一個畫素區P10內的發光元件140朝向基板110的方向發出的光線(朝向基板110的出光面S12發光)不會進到相鄰的其他畫素區P10內,且相鄰的其他畫素區P10的發光元件140發出的光線也不會進到這個畫素區P10內。如此一來,可以得到很好的顯示畫質。此外,隔離壁130具有第一破口
G12與第二破口G14可供第一導線142與第二導線144通過,因此第一導線142與第二導線144可以在電路區C10連接共用電路VSS與驅動電路TFT。如此一來,畫素區P10內可以不用設置電路而提高出光率。
In the
在本實施例中,隔離壁130的頂部130T暴露於材料層120外,隔離壁130的底部130B接觸基板110。也就是,隔離壁130的底部130B與基板110之間沒有間隙,隔離壁130的頂部130T也沒有材料層120,可以減少從該處漏光的機會。在本實施例中,發光元件140可以是發光二極體。本實施例的隔離壁130的材料可以是高分子材料。從另一觀點來看,本實施例的隔離壁130的材料可以是高反射材料。隔離壁130的材料可以是聚對羥基苯乙烯、聚酯環族丙烯酸酯、聚脂衍生物和分子玻璃等及其衍生物為主體材料,其中可添加氧化鈦(TiO2)。
In this embodiment, the tops 130T of the
在本實施例中,每個隔離壁130具有一第一破口G12與一第二破口G14。每個第一導線142從對應的隔離壁130的第一破口G12延伸至電路區C10。每個第二導線144從對應的隔離壁130的第二破口G14延伸至電路區C10。第一導線142在電路區C10可藉由導電通孔而向下連接共用電路VSS,而第二導線144在電路區C10可藉由導電通孔而向下連接驅動電路TFT。驅動電路TFT可以包括薄膜電晶體。此外,本實施例的畫素區P10內具有發光元件140、第一導線142與第二導線144,不具有其他驅動元件,也就是電路淨空區。
In this embodiment, each
在本實施例中,每個畫素區P10內具有多個發光元件140。同一個畫素區P10內的發光元件140共用一條第一導線142與一條第二導線144。但在其他實施例中,也可能每一個發光元件140使用自己的第一導線142與第二導線144。
In this embodiment, each pixel region P10 has a plurality of
圖3是依照本發明的另一實施例的顯示裝置的局部剖面示意圖。請參照圖3,本實施例的顯示裝置200大致與圖1及圖2的顯示裝置100相同,在此僅說明不同處。顯示裝置200更包括一反射材料層150,配置於基板110上且覆蓋材料層120、隔離壁130與發光元件140。反射材料層150可進一步確保發光元件140發出的光線由出光面S12射出,不會從遠離基板110的方向射出,以提高出光率。此外,本實施例的反射材料層150與隔離壁130的材料可以是相同的,但本發明不以此為限。換言之,可在材料層120中挖出坑洞,並填入適當的材料而一次形成反射材料層150與隔離壁130。
3 is a partial cross-sectional schematic diagram of a display device according to another embodiment of the present invention. Referring to FIG. 3 , the
圖4是依照本發明的再一實施例的顯示裝置的局部剖面示意圖。請參照圖4,本實施例的顯示裝置300大致與圖1及圖2的顯示裝置100相同,在此僅說明不同處。沿垂直於基板110的一法線方向D12的方向D14觀看,每個隔離壁330的剖面在靠近對應的發光元件140的一側的邊緣332呈弧形。換言之,沿垂直於基板110的出光面S12的一法線方向D12的方向D14觀看,每個隔離壁330的剖面在靠近對應的發光元件140的一側的邊緣332呈弧形。如此,可提升隔離壁330對於發光元件140發出的光線
的聚光效果。在本實施例中,每個隔離壁330的剖面在遠離對應的發光元件140的一側的邊緣也呈弧形,但本發明不以此為限。
FIG. 4 is a partial cross-sectional schematic diagram of a display device according to still another embodiment of the present invention. Referring to FIG. 4 , the
圖5是依照本發明的又一實施例的顯示裝置的局部剖面示意圖。請參照圖5,本實施例的顯示裝置400大致與圖1及圖2的顯示裝置100相同,在此僅說明不同處。材料層420包含多層子材料層422,也就是材料層420由多個子材料層422堆疊而成。沿垂直於基板110的一法線方向D14的方向D12觀看,每個隔離壁430的剖面的兩側的邊緣432呈階梯狀。從另一方面來說,隔離壁430在圖5的水平方向上的寬度W12、W14與W16是從底部430B往上增加。如此,也可提升隔離壁430對於發光元件140發出的光線的聚光效果。在本實施例中,每個隔離壁430的剖面的兩側的邊緣432呈階梯狀,但也可以僅有靠近對應的發光元件140的一側的邊緣呈階梯狀,本發明不以此為限。舉例來說,可以在形成材料層420的每一子材料層422之後形成一個坑洞,並在形成下一層子材料層422之後在前一層422的坑洞上形成更大的坑洞,即可形成所需的階梯狀結構。
5 is a partial cross-sectional schematic diagram of a display device according to still another embodiment of the present invention. Referring to FIG. 5 , the
圖6是依照本發明的更一實施例的顯示裝置的局部剖面示意圖。請參照圖6,本實施例的顯示裝置500大致與圖1及圖2的顯示裝置100相同,在此僅說明不同處。在本實施例中,一個畫素區內的一個隔離壁530的至少一部分還嵌置於基板510。舉例來說,這個隔離壁530在圖5中的左邊的部分未嵌入基板510,而這個隔離壁530在圖5中的右邊的部分嵌入基板510。如此,可更
進一步提升隔離壁530對於發光元件140發出的光線的聚光效果。在其他實施例中,一個畫素區內的一個隔離壁530也可以是整個都嵌置於基板510。
6 is a partial cross-sectional schematic diagram of a display device according to a further embodiment of the present invention. Referring to FIG. 6 , the
圖7是依照本發明的又一實施例的顯示裝置的局部剖面示意圖。請參照圖7,本實施例的顯示裝置大致與圖1及圖2的顯示裝置100相同,在此僅說明不同處。在本實施例中,隔離壁132的頂部132T沒有與材料層120的表面共平面,亦即隔離壁132的頂部132T凸出於材料層120的表面而形成段差結構。因為第一導線142與第二導線144是通過如圖1所示的第一破口G12與第二破口G14,所以不會遇到隔離壁630所形成的段差結構,可以避免出現斷線的問題。此外,隔離壁132的底部132B也可以不接觸基板110。
FIG. 7 is a partial cross-sectional schematic diagram of a display device according to still another embodiment of the present invention. Referring to FIG. 7 , the display device of this embodiment is substantially the same as the
圖8是依照本發明的另一實施例的顯示裝置的局部上視示意圖。請參照圖8,本實施例的顯示裝置600大致與圖1的顯示裝置100相同,在此僅說明不同處。本實施例的隔離壁630只有一個破口G62,第一導線642與第二導線644都從破口G62向外延伸。
FIG. 8 is a schematic partial top view of a display device according to another embodiment of the present invention. Referring to FIG. 8 , the
圖9是依照本發明的再一實施例的顯示裝置的局部上視示意圖。請參照圖9,本實施例的顯示裝置700大致與圖1的顯示裝置100相同,在此僅說明不同處。本實施例的第一導線742與第二導線744的佈線方式與圖1不同,以因應以不同方位擺放的發光元件140。
FIG. 9 is a schematic partial top view of a display device according to still another embodiment of the present invention. Referring to FIG. 9 , the
圖10是依照本發明的又一實施例的顯示裝置的局部上視示意圖。請參照圖10,本實施例的顯示裝置800大致與圖1的顯示裝置100相同,在此僅說明不同處。沿基板110的一法線方向D12觀看,每個隔離壁830靠近對應的發光元件140的一側的邊緣833呈弧形。如此,可提升隔離壁830對於發光元件140發出的光線的聚光效果。此外,本實施例中,每個畫素區P10內只有一個發光元件140。
FIG. 10 is a schematic partial top view of a display device according to still another embodiment of the present invention. Referring to FIG. 10 , the
圖11是依照本發明的更一實施例的顯示裝置的局部上視示意圖。請參照圖11,本實施例的顯示裝置900大致與圖1的顯示裝置100相同,在此僅說明不同處。本實施例中,每個畫素區P10內有三個發光元件140,也就是每個隔離壁930圍繞三個發光元件140。同一個畫素區P10內的三個發光元件140的第一導線142結構上彼此連接,以及同一畫素區內P10內的三個發光元件140的第二導線144結構上彼此連接。換言之,同一個畫素區P10的發光元件140共用一條第一導線142與一條第二導線144。
FIG. 11 is a schematic partial top view of a display device according to a further embodiment of the present invention. Referring to FIG. 11 , the
綜上所述,在本發明的顯示裝置中,圍繞畫素區的隔離壁可避免光線進入鄰近的畫素區,因此可以提升顯示品質。並且,隔離壁保留供導線通過的破口,可降低斷線的機率而提升良率。 To sum up, in the display device of the present invention, the partition walls surrounding the pixel regions can prevent light from entering the adjacent pixel regions, so that the display quality can be improved. In addition, the isolation wall retains a hole for the wire to pass through, which can reduce the probability of wire breakage and improve the yield.
110:基板110: Substrate
120:材料層120: Material Layer
130:隔離壁130: Separation Wall
130T:頂部130T: top
130B:底部130B: Bottom
140:發光元件140: Light-emitting element
142:第一導線142: First wire
144:第二導線144: Second wire
P10:畫素區P10: pixel area
C10:電路區C10: Circuit area
VSS:共用電路VSS: common circuit
TFT:驅動電路TFT: driver circuit
S12:出光面S12: light-emitting surface
Claims (12)
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| TW201613086A (en) * | 2014-09-30 | 2016-04-01 | Ye Xin Technology Consulting Co Ltd | Display panel and manufacturing method thereof |
| TW201733105A (en) * | 2016-03-14 | 2017-09-16 | 群創光電股份有限公司 | Display device |
| US20190229235A1 (en) * | 2018-01-24 | 2019-07-25 | Sharp Kabushiki Kaisha | Micro light emitting element and image display device |
| TW202009580A (en) * | 2018-08-22 | 2020-03-01 | 隆達電子股份有限公司 | Pixel array package structure and display panel |
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| TW201613086A (en) * | 2014-09-30 | 2016-04-01 | Ye Xin Technology Consulting Co Ltd | Display panel and manufacturing method thereof |
| TW201733105A (en) * | 2016-03-14 | 2017-09-16 | 群創光電股份有限公司 | Display device |
| US20190229235A1 (en) * | 2018-01-24 | 2019-07-25 | Sharp Kabushiki Kaisha | Micro light emitting element and image display device |
| TW202009580A (en) * | 2018-08-22 | 2020-03-01 | 隆達電子股份有限公司 | Pixel array package structure and display panel |
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