TWI770588B - Substrate processing method and substrate processing apparatus - Google Patents

Abstract

An object of the present invention is to provide a substrate processing method and a substrate processing apparatus capable of appropriately processing a substrate.

The present application relates to a substrate processing method and a substrate processing apparatus 1 . The substrate processing method includes a step S39 of supplying a processing liquid to the substrate W supported by the fixing pins 103 at a position above the upper surface 102 of the first plate 101 . In step S39 of supplying the processing liquid to the substrate W, the gas is blown upward from the first outlet 105 , and the gas is blown upward from the second outlet 106 . The 1st blower outlet 105 is formed in the center part of the upper surface 102 of the 1st board 101. The second air outlet 106 is formed on the peripheral edge portion of the upper surface 102 of the first plate 101 . The second blower port 106 blows out gas at a larger flow rate than the first blower port 105 .

Description

Substrate processing method and substrate processing apparatus

The present invention relates to a substrate processing method and a substrate processing apparatus for processing a substrate. Substrates such as semiconductor wafers, substrates for liquid crystal displays, substrates for organic electroluminescence (EL, Electroluminescence), substrates for flat panel displays (FPD, Flat Panel Display), substrates for optical displays, substrates for magnetic disks, substrates for optical disks, Substrates for magneto-optical discs, substrates for masks or substrates for solar cells.

Japanese Patent Laid-Open No. 2015-65226 discloses a substrate processing apparatus. Hereinafter, the symbols described in Japanese Patent Laid-Open No. 2015-65226 are described in parentheses. The substrate processing apparatus includes a turntable (10) on which a substrate (100) is placed. The turntable (10) includes an upper surface portion (13) and a chuck portion (14). The upper surface part (13) and the chuck part (14) are opposed to the whole of the lower surface of the base plate (100). Specifically, the upper surface portion (13) is opposed to the outer peripheral portion of the lower surface of the substrate (100). The chuck part (14) is opposite to the central part of the lower surface of the base plate (100).

The turntable (10) is provided with several support pins (25). Each support pin (25) is provided on the upper surface portion (13). Each support pin (25) supports the outer peripheral portion of the substrate.

The turntable (10) is provided with a gas jetting port (15) and a gas jetting port (16). The gas ejection port (15) is provided in the chuck part (14). The gas jetting port (15) jets gas to the central portion of the lower surface of the substrate (100). The gas ejection port (16) is provided on the upper surface portion (13). The gas jetting port (16) jets gas to the outer peripheral portion of the lower surface of the substrate (100).

The substrate processing apparatus further includes a hollow motor (40) and a nozzle (98). The hollow motor (40) rotates the turntable (10). The nozzle (98) supplies the processing liquid to the substrate (100) placed on the turntable (10).

When the nozzle (98) does not supply the processing liquid to the substrate (100) placed on the turntable (10), the turntable (10) does not rotate, the gas ejection port (15) ejects gas, and the gas ejection port (16) does not eject gas .

When the nozzle (98) supplies the processing liquid to the substrate (100) placed on the turntable (10), the turntable (10) rotates, and the gas ejection port (15) and the gas ejection port (16) respectively eject gas.

(The problem that the invention intends to solve)

In recent years, the thickness and diameter of substrates have been reduced. If the thickness of the substrate is thinner and the diameter of the substrate becomes larger, the deflection amount of the substrate becomes significantly larger. Therefore, it is sometimes difficult for the processing unit of the conventional substrate processing apparatus to properly process the substrate.

The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate processing method and a substrate processing apparatus capable of appropriately processing a substrate. (Technical means to solve problems)

In order to achieve such an object, the present invention takes the following configuration. That is, the present invention relates to a substrate processing method comprising the steps of supplying a processing liquid to a substrate supported by a support portion at a position higher than the upper surface of the first plate, and In the step of supplying the processing liquid to the substrate, gas is blown upward from a first outlet formed in a central portion of the upper surface of the first plate, and a gas is blown upward from a first outlet formed in a peripheral portion of the upper surface of the first plate. 2 The air outlet blows gas upward at a flow rate larger than that of the first air outlet.

In the step of supplying the processing liquid to the substrate, the gas is blown from the first outlet and the second outlet. The gas blown out from the 1st blower outlet and the 2nd blower outlet is supplied between the upper surface of a 1st board and the lower surface of the board|substrate supported by a support part. The gas flows along the lower surface of the substrate. Thereby, a downward force (attraction force) can be applied to the substrate supported by the support portion, and the substrate can be preferably held.

In particular, the gas blown out from the 1st blowing port is blown to the lower surface of the center part of a board|substrate. Therefore, the lower surface of the central portion of the substrate can be preferably prevented from being bent downward. Therefore, it is possible to preferably prevent the substrate from coming into contact with the upper surface of the first plate when the processing liquid is supplied to the substrate.

In the step of supplying the processing liquid to the substrate, the second blowing port blows gas at a larger flow rate than the first blowing port. The gas flows relatively rapidly along the lower surface of the peripheral portion of the substrate. Thereby, a relatively strong attraction force acts on the peripheral portion of the substrate. Therefore, when the processing liquid is supplied to the substrate, the substrate can be held more preferably.

As described above, when the processing liquid is supplied to the substrate, the substrate can be held without contacting the first plate. Therefore, the substrate can be properly handled. Therefore, the present substrate processing method can properly process the substrate.

Preferably, in the above-mentioned substrate processing method, the following steps are included, that is, the substrate is handed over to the above-mentioned support part, and The said step of delivering a board|substrate to the said support part blows gas upward from the said 1st blower outlet, and does not blow out gas from the said 2nd blower outlet. The step of delivering the substrate to the support unit does not blow out gas from the second outlet. Therefore, the attractive force acting on the substrate is relatively weak. Therefore, the substrate can be properly handed over to the support portion. For example, the substrate may be slowly placed on the support.

Preferably, in the above-mentioned substrate processing method, the following steps are included, that is, the position of the substrate in the horizontal direction is adjusted by contacting the position adjusting portion with the substrate supported by the above-mentioned supporting portion, and The said process of adjusting the position of a board|substrate blows gas upward from the said 1st blower outlet, and does not blow out gas from the said 2nd blower outlet. The step of adjusting the position of the substrate is to blow out gas from the first outlet. Therefore, the contact between the substrate and the upper surface of the first plate can be preferably prevented when the position adjustment portion adjusts the position of the substrate. The step of adjusting the position of the substrate does not blow out gas from the second outlet. Therefore, the attractive force acting on the substrate is relatively weak. Therefore, the position adjustment portion can easily adjust the position of the substrate.

Preferably, in the above-mentioned substrate processing method, the following steps are included, that is, the above-mentioned position adjustment part is separated from the substrate supported by the above-mentioned support part, and In the step of separating the position adjustment portion from the substrate, gas is blown upward from the first outlet, and gas is blown upward from the second outlet at a flow rate larger than that of the first outlet. In the step of separating the position adjustment portion from the substrate, the gas is blown upward from the first outlet, and the gas is blown upward from the second outlet at a flow rate larger than that of the first outlet. Therefore, the attractive force acting on the substrate is relatively strong. Therefore, the substrate on the support portion can be preferably held before the position adjusting portion leaves the substrate. The movement of the base plate relative to the support part can be preferably prevented after the position adjusting part leaves the base plate.

Preferably in the above-mentioned substrate processing method, The above-mentioned step of supplying the processing liquid to the substrate is performed in a state in which the substrate is not in contact with the above-mentioned position adjusting portion. The quality of the substrate processing can be better improved.

Preferably, in the above-mentioned substrate processing method, the following steps are included, that is, the substrate is taken out from the above-mentioned support portion, and In the step of taking out the substrate from the support portion, the gas is blown upward from the first outlet, and the gas is not blown out from the second outlet. The step of taking out the substrate from the support part blows gas upward from the first blowing port. Therefore, the contact of the substrate with the upper surface of the first plate can be preferably prevented when the substrate is removed from the support portion. The step of taking out the substrate from the support part does not blow out gas from the second outlet. Therefore, the attractive force acting on the substrate is relatively weak. Therefore, the substrate can be easily removed from the support portion.

The present invention is A substrate processing apparatus comprising: a first processing unit that processes the substrate; and a control unit that controls the first processing unit; The above-mentioned first processing unit includes: plate 1; a support part, which is fixed to the first plate, protrudes upward from the upper surface of the first plate, contacts with at least one of the lower surface of the substrate and the edge of the substrate, and is higher than the upper surface of the first plate The high position supports the substrate; a first blow-off port formed in the center portion of the upper surface of the first plate, blowing gas between the upper surface of the first plate and the lower surface of the substrate supported by the support portion; a first blow-off adjustment part, which adjusts the flow rate of the gas blown out from the first blow-off port; a second blow-off port, which is formed on a peripheral edge portion of the upper surface of the first plate, and blows gas between the upper surface of the first plate and the lower surface of the substrate supported by the support portion; a second blow-off adjustment part, which adjusts the flow rate of the gas blown from the second blow-off port; and a processing liquid supply part, which supplies the processing liquid to the substrate supported by the above-mentioned support part; Under the control of the control unit, when the processing liquid supply unit supplies the processing liquid to the substrate supported by the support unit, the first blowing port blows gas, and the second blowing port blows out the gas at a larger flow rate than the first blowing port. gas.

When the processing liquid supply part supplies the processing liquid to the substrate supported by the support part, the first blowing port and the second blowing port blow out gas, respectively. The gas blown out from the 1st blower outlet and the 2nd blower outlet is supplied between the upper surface of a 1st board and the lower surface of the board|substrate supported by a support part. The gas flows along the lower surface of the substrate. Thereby, the downward force (attraction force) acts on the board|substrate supported by the support part. Therefore, the substrate can be preferably held.

In particular, the gas blown out from the 1st blowing port is blown to the lower surface of the center part of a board|substrate. Therefore, the lower surface of the central portion of the substrate can be preferably prevented from being bent downward. Therefore, it is possible to preferably prevent the substrate from coming into contact with the upper surface of the first plate when the processing liquid supply unit supplies the processing liquid to the substrate.

When the processing liquid supply portion supplies the processing liquid to the substrate supported by the support portion, the second blowing port blows gas at a larger flow rate than the first blowing port. The gas flows relatively rapidly along the lower surface of the peripheral portion of the substrate. Thereby, a relatively strong attraction force acts on the peripheral portion of the substrate. Therefore, when the processing liquid supply unit supplies the processing liquid to the substrate, the substrate can be held more preferably.

As described above, when the processing liquid is supplied to the substrate, the substrate can be held without contacting the first plate. Therefore, the substrate can be properly handled. Therefore, the present substrate processing apparatus can properly process the substrate.

Preferably in the above-mentioned substrate processing apparatus, When the said support part receives a board|substrate, the said 1st blower outlet blows out gas, and the said 2nd blower outlet does not blow out gas. When the support portion receives the substrate, the first outlet blows out gas. Therefore, it is possible to preferably prevent the substrate from contacting the upper surface of the first plate when the support portion receives the substrate. When the support portion receives the substrate, the second outlet does not blow out gas. Therefore, the attractive force acting on the substrate is relatively weak. Therefore, when the support portion receives the substrate, the support portion can gradually receive the substrate. That is, when the support portion receives the substrate, there is no possibility of damage to the substrate.

Preferably in the above-mentioned substrate processing apparatus, Before the support portion receives the substrate, the first outlet starts to blow out gas, and After the support portion receives the substrate and before the processing liquid supply portion supplies the processing liquid to the substrate supported by the support portion, the second blowing port starts blowing out gas. Before the support portion receives the substrate, the first outlet starts blowing out gas. Therefore, the support part can receive the board|substrate in the state which blows out the gas from the 1st blower outlet. After the support portion receives the substrate, the second outlet starts blowing out gas. Therefore, the support part can receive the board|substrate in the state which does not blow out gas from the 2nd blower outlet. Therefore, the support portion can properly receive the substrate. Before the processing liquid supply part supplies the processing liquid to the substrate supported by the support part, the second blowing port starts blowing out the gas. Therefore, the processing liquid supply unit can supply the processing liquid to the substrate in a state in which the gas is blown from the second outlet.

Preferably in the above-mentioned substrate processing apparatus, The first processing unit is provided with a position adjusting portion, and the position adjusting portion is supported on the first plate so as to be movable in the horizontal direction relative to the first plate, and is in contact with the substrate supported by the supporting portion to adjust the position in the horizontal direction. the position of the substrate, When the said position adjustment part adjusts the position of the board|substrate supported by the said support part, the said 1st blower outlet blows gas, and the said 2nd blower outlet does not blow out gas. When the position adjustment portion adjusts the position of the substrate supported by the support portion, the first outlet blows out gas. Therefore, the contact between the substrate and the upper surface of the first plate can be preferably prevented when the position adjustment portion adjusts the position of the substrate. When the position adjustment portion adjusts the position of the substrate supported by the support portion, the second outlet does not blow out gas. Therefore, the attractive force acting on the substrate is relatively weak. Therefore, the position adjustment portion can easily adjust the position of the substrate.

Preferably in the above-mentioned substrate processing apparatus, After the position adjustment unit adjusts the position of the substrate supported by the supporting unit and before the processing liquid supply unit supplies the processing liquid to the substrate supported by the supporting unit, the second outlet starts blowing gas. After the position adjustment portion adjusts the position of the substrate supported by the support portion, the second outlet starts blowing out gas. Therefore, the position adjustment portion can adjust the position of the substrate in a state where the second outlet does not blow out gas. Before the processing liquid supply part supplies the processing liquid to the substrate supported by the support part, the second blowing port starts blowing out the gas. Therefore, the processing liquid supply unit can supply the processing liquid to the substrate in a state in which the gas is blown from the second outlet.

Preferably in the above-mentioned substrate processing apparatus, The position adjustment portion is separated from the substrate after the gas is blown out from the second outlet and before the treatment liquid supply portion supplies the treatment liquid to the substrate supported by the support portion. After the gas is blown out from the second outlet, the position adjustment part is separated from the substrate. Therefore, the position adjustment portion is separated from the substrate in a state in which the gas is blown out from the second outlet. That is, the position adjustment portion leaves the substrate in a state in which the substrate is preferably held. Therefore, the movement of the base plate relative to the support part can be preferably prevented when the position adjustment part leaves the base plate and after the position adjustment part leaves the base plate. Before the processing liquid supply section supplies the processing liquid to the substrate supported by the support section, the position adjustment section is separated from the substrate. Therefore, the processing liquid supply unit can supply the processing liquid to the substrate in a state in which the position adjustment unit is separated from the substrate. Therefore, the quality of substrate processing can be better improved.

Preferably in the above-mentioned substrate processing apparatus, When the substrate is removed from the support portion, the first blowing port blows gas, and the second blowing port does not blow the gas. When the substrate is taken out from the support portion, the first outlet blows out gas. Therefore, the contact of the substrate with the upper surface of the first plate can be preferably prevented when the substrate is removed from the support portion. When the substrate is removed from the support portion, the second outlet does not blow out gas. Therefore, when the substrate is removed from the support portion, the attractive force acting on the substrate is relatively weak. Therefore, the substrate can be easily removed from the support portion.

Preferably in the above-mentioned substrate processing apparatus, After the processing liquid supply part supplies the processing liquid to the substrate supported by the support part and before the substrate is taken out from the support part, the second blowing port stops blowing gas, and After the substrate is removed from the support portion, the first blowing port stops blowing out the gas. After the processing liquid supply part supplies the processing liquid to the substrate supported by the support part, the second blowing port stops blowing out the gas. Therefore, the processing liquid supply unit can supply the processing liquid to the substrate in a state in which the gas is blown from the second outlet. Before the substrate is taken out from the support portion, the second blowing port stops blowing out the gas. Therefore, the board|substrate can be taken out from a support part in the state which does not blow out gas from a 2nd blower outlet. Therefore, the substrate can be easily removed from the support portion. After the substrate is taken out from the support portion, the first blowing port stops blowing out the gas. Therefore, the board|substrate can be taken out from a support part in the state which blows out gas from a 1st blower outlet. Therefore, the contact of the substrate with the first plate can be preferably prevented when the substrate is removed from the support portion.

Preferably in the above-mentioned substrate processing apparatus, The first processing unit includes an elevating portion, the elevating portion is supported by the first plate so as to be movable in the up-down direction relative to the first plate, and the substrate is lowered to deliver the substrate to the supporting portion, and When the said support part receives a board|substrate from the said raising/lowering part, the said 1st blower outlet blows out gas, and the said 2nd blower outlet does not blow out gas. The lift portion supports the substrate. The lifter lowers the substrate. Specifically, the lift portion lowers the substrate from a position higher than the support portion. Thereby, the lift portion delivers the substrate to the support portion. Here, when the support portion receives the substrate from the elevating portion, the first air outlet blows out the gas. Therefore, it is possible to reliably prevent the substrate from coming into contact with the upper surface of the first plate when the support portion receives the substrate from the elevating portion. When the support portion receives the substrate from the elevating portion, the second outlet does not blow out gas. Therefore, the support portion can properly receive the substrate from the elevating portion.

Preferably in the above-mentioned substrate processing apparatus, The substrate processing apparatus includes a first conveyance mechanism, and the first conveyance mechanism delivers the substrate to the lift unit, The control unit further controls the first conveyance mechanism, The elevating portion receives the substrate from the first conveying mechanism, and The said 1st outlet starts blowing out gas after the said raising/lowering part receives a board|substrate from the said 1st conveyance mechanism and before the said raising/lowering part delivers a board|substrate to the said support part. The lift portion receives the substrate from the first conveyance mechanism. Specifically, the lift portion receives the substrate from the first conveyance mechanism at a position higher than the support portion (for example, an upper position). Here, after the elevating part receives the substrate from the first conveying mechanism, the first blowing port starts blowing out the gas. Therefore, the elevating part can receive the board|substrate from the 1st conveyance mechanism in the state which does not blow out gas from the 1st blower outlet. Therefore, the elevating portion can appropriately receive the substrate from the first conveyance mechanism. Before the lift section delivers the substrate to the support section, the first outlet starts blowing out gas. Therefore, the support part can receive the board|substrate from the raising/lowering part in the state which blows out the gas from the 1st blower outlet.

Preferably, the substrate processing apparatus is provided with an elevating portion, the elevating portion is supported on the first plate so as to be movable in the vertical direction relative to the first plate, and the substrate is taken out from the supporting portion, and the substrate is elevated, and When the elevating portion removes the substrate from the support portion, the first blowing port blows gas, and the second blowing port does not blow gas. The lifting part takes away the substrate from the supporting part. The lift portion supports the substrate. The elevating portion elevates the substrate. Specifically, the lift portion lifts the substrate to a position higher than the support portion. Here, when the lifting portion takes out the substrate from the support portion, the first blowing port blows out the gas. Therefore, it is possible to preferably prevent the substrate from coming into contact with the upper surface of the first plate when the lifting portion removes the substrate from the supporting portion. When the lifter takes out the substrate from the support, the second outlet does not blow out gas. Therefore, the lift portion can easily take the substrate from the support portion.

Preferably in the above-mentioned substrate processing apparatus, After the processing liquid supply part supplies the processing liquid to the substrate supported by the supporting part and before the lifting part takes out the substrate from the supporting part, the second blowing port stops blowing out the gas. After the processing liquid supply part supplies the processing liquid to the substrate supported by the support part, the second blowing port stops blowing out the gas. Therefore, the processing liquid supply unit can supply the processing liquid to the substrate in a state in which the gas is blown from the second outlet. Before the lift portion takes out the substrate from the support portion, the second blowing port stops blowing out the gas. Therefore, the lift portion can take out the substrate from the support portion in a state in which the second outlet does not blow out gas.

Preferably in the above-mentioned substrate processing apparatus, The substrate processing apparatus includes a first conveyance mechanism, The first conveying mechanism removes the substrate from the elevating portion, The control unit further controls the first conveyance mechanism, The elevating portion conveys the substrate to the first conveying mechanism, and After the elevating part takes out the substrate from the support part and before the elevating part delivers the substrate to the first conveyance mechanism, the first blowing port stops blowing out the gas. The lift unit delivers the substrate to the first conveyance mechanism. Specifically, after the lift section takes the substrate from the support section, the lift section delivers the substrate to the first conveyance mechanism. The lift portion delivers the substrate to the first conveying mechanism at a position higher than the support portion (eg, an upper position). Here, after the lift portion takes out the substrate from the support portion, the first blowing port stops blowing out the gas. Therefore, the lift portion can take out the substrate from the support portion in a state in which the gas is blown out from the first outlet. The 1st blower port stops blowing out gas until the board|substrate is handed over to a 1st conveyance mechanism by an elevator part. Therefore, the elevating portion can deliver the substrate to the first conveying mechanism in a state where the first blowing port does not blow out gas. Therefore, the elevating portion can preferably deliver the substrate to the first conveying mechanism.

Preferably in the above-mentioned substrate processing apparatus, The substrate processing apparatus includes a first conveyance mechanism that conveys the substrate to the first processing unit, The control unit further controls the first conveyance mechanism, The above-mentioned first conveyance mechanism includes: a suction part that makes the gas flow along any one of the upper surface and the lower surface of the substrate to attract the substrate without contacting the substrate; and a suction adjustment part, which adjusts the flow rate of the gas supplied to the suction part; When the first conveyance mechanism conveys the substrate, the suction adjustment unit supplies gas to the suction unit, When the first conveyance mechanism delivers the substrate to the first processing unit, the suction adjustment unit does not supply gas to the suction unit, and the second outlet does not blow out gas. The first conveyance mechanism includes a suction unit. Therefore, the 1st conveyance mechanism can support a board|substrate suitably. The first conveyance mechanism includes a suction adjustment unit. The suction adjustment part adjusts the flow rate of the gas supplied to the suction part. Therefore, the attraction adjustment part can adjust the attraction force of the attraction part. When the substrate is conveyed by the first conveyance mechanism, the suction adjustment unit supplies gas to the suction unit. Therefore, when the substrate is conveyed by the first conveyance mechanism, the suction portion can preferably suck the substrate. Therefore, the 1st conveyance mechanism can convey favorably. When the first transfer mechanism delivers the substrate to the first processing unit, the suction adjustment unit does not supply gas to the suction unit. Therefore, when the first conveyance mechanism delivers the substrate to the first processing unit, the suction unit does not attract the substrate. Therefore, the first transfer mechanism can preferably deliver the substrate to the first processing unit. When the first conveyance mechanism delivers the substrate to the first processing unit, the second outlet does not blow out gas. Therefore, the first conveyance mechanism can better deliver the substrate to the first processing unit.

Preferably in the above-mentioned substrate processing apparatus, The substrate processing apparatus includes a first conveyance mechanism that conveys the substrate to the first processing unit, The control unit further controls the first conveyance mechanism, The above-mentioned first conveyance mechanism includes: a suction part that makes the gas flow along any one of the upper surface and the lower surface of the substrate to attract the substrate without contacting the substrate; and a suction adjustment part, which adjusts the flow rate of the gas supplied to the suction part; When the first conveying mechanism removes the substrate from the first processing unit, the flow rate of the gas blown out from the first blowing port is smaller than the flow rate of the gas supplied to the suction part, and the second blowing port does not blow out the gas. When the first conveyance mechanism takes out the substrate from the first processing unit, the flow rate of the gas blown out from the first outlet is smaller than the flow rate of the gas supplied to the suction part. Therefore, when the first conveying mechanism takes out the substrate from the first processing unit, the suction part can preferably attract the substrate of the first processing unit. Therefore, the first conveyance mechanism can easily take out the substrate from the first processing unit. When the 1st conveyance mechanism removes a board|substrate from a 1st processing unit, a 2nd blower outlet does not blow out gas. Therefore, the 1st conveyance mechanism can take out a board|substrate from a 1st processing unit more easily.

Preferably in the above-mentioned substrate processing apparatus, The said 1st blower outlet can further discharge pure water to a board|substrate. The pure water discharged from the first blow-off port was discharged to the lower surface of the central portion of the substrate. Thereby, the lower surface of the central portion of the substrate can be better prevented from being bent downward. Therefore, the contact between the substrate and the upper surface of the first plate can be more preferably prevented.

Preferably in the above-mentioned substrate processing apparatus, The processing liquid supply part can be moved to a processing position supported at a position above the substrate belonging to the supporting part, When the processing liquid supply unit supplies the processing liquid from the processing position to the substrate supported by the support section, the first blowing port discharges pure water, and the second blowing port discharges a larger amount of gas than the first blowing port. The flow blows out the gas. When the processing liquid supply unit supplies the processing liquid to the substrate from the processing position, the first outlet discharges pure water. Therefore, the contact between the substrate and the upper surface of the first plate can be more preferably prevented.

Preferably in the above-mentioned substrate processing apparatus, The said processing liquid supply part can discharge a processing liquid to a board|substrate through the said 1st blower outlet. The processing liquid can be supplied to the lower surface of the substrate. Therefore, the lower surface of the substrate can be preferably processed.

Preferably in the above-mentioned substrate processing apparatus, The first processing unit includes a first rotational drive unit that rotates the first plate, and When the processing liquid supply part supplies the processing liquid to the substrate supported by the support part, the first rotation driving part rotates the first plate. The first processing unit can properly process the substrate.

Hereinafter, the substrate processing apparatus of the present invention will be described with reference to the drawings.

<Outline of substrate processing equipment> FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment. The substrate processing apparatus 1 processes the substrate W.

The substrate W is, for example, semiconductor wafers, substrates for liquid crystal displays, substrates for organic electroluminescence (EL, Electroluminescence), substrates for flat panel displays (FPD, Flat Panel Display), substrates for optical displays, substrates for magnetic disks, substrates for optical disks , Substrates for magneto-optical discs, substrates for masks or substrates for solar cells.

The substrate processing apparatus 1 includes a transfer unit 2 . The transfer unit 2 includes a plurality of (for example, four) carrier placement units 3 . Each carrier mounting part 3 mounts one carrier C, respectively. The carrier C accommodates several substrates W. As shown in FIG. The carrier C is, for example, a front opening unified pod (FOUP). The transfer unit 2 includes a transfer mechanism 4 . The conveyance mechanism 4 can access the carriers C mounted on all the carrier mounting portions 3 .

The substrate processing apparatus 1 includes a processing block 5 . The processing block 5 is connected to the transfer unit 2 .

The processing block 5 includes a placement unit 6 . The mounting part 6 mounts several substrates W. As shown in FIG. The processing block 5 includes a plurality of processing units 7 . Each processing unit 7 processes one substrate W, respectively. The processing block 5 includes a conveying mechanism 8 . The conveyance mechanism 8 can access the placing portion 6 and all the processing units 7 . The conveyance mechanism 8 conveys the substrate W to the placement portion 6 and the processing unit 7 .

The placement portion 6 is arranged between the conveyance mechanism 4 and the conveyance mechanism 8 . The conveyance mechanism 4 can also access the placement part 6 . The conveyance mechanism 4 conveys the substrate W to the placement portion 6 . The mounting part 6 mounts the board|substrate W conveyed between the conveyance mechanism 4 and the conveyance mechanism 8. As shown in FIG.

The substrate processing apparatus 1 includes a control unit 9 . The control unit 9 controls the conveyance mechanisms 4 and 8 and the processing unit 7 .

FIG. 2 is a control block diagram of the substrate processing apparatus 1 . The control unit 9 is connected to the conveyance mechanisms 4 and 8 and the processing unit 7 so as to be communicable.

The control unit 9 uses a central processing unit (Central Processing Unit (CPU)) that executes various processes, a random-access memory (RAM, Random-Access Memory), a hard disk, and the like that serve as a work area for arithmetic processing. memory media, etc. The memory medium stores various kinds of information in advance. The storage medium, for example, stores information related to the operation conditions of the conveying mechanisms 4 and 8 and the processing unit 7 . The information related to the operating conditions of the processing unit 7 is, for example, a processing recipe (processing program) for processing the substrate W. The storage medium, for example, stores information for identifying each substrate W.

An example of the operation of the substrate processing apparatus 1 will be described. The conveyance mechanism 4 conveys the substrate W to the placement portion 6 from the carrier C on the carrier placement portion 3 . The conveyance mechanism 8 conveys the substrate W to one processing unit 7 from the placement portion 6 . The processing unit 7 processes the substrate W. The conveyance mechanism 8 conveys the substrate W to the placement portion 6 from the processing unit 7 . The transport mechanism 4 transports the substrate W to the carrier C on the carrier mounting portion 3 from the mounting portion 6 .

The transport mechanism 4 is an example of the second transport mechanism in the present invention. The transport mechanism 8 is an example of the first transport mechanism in the present invention. The placing portion 6 is an example of the first position and the second position in the present invention. The processing unit 7 is another example of the first position and the second position in the present invention.

Refer to Figure 1. In this specification, for the sake of convenience, the direction in which the transfer unit 2 and the processing block 5 are arranged is referred to as the "front-rear direction X". The front-rear direction X is horizontal. In the front-rear direction X, the direction from the processing block 5 toward the transfer unit 2 is referred to as "forward". The direction opposite to the front is called "rear". The horizontal direction orthogonal to the front-rear direction X is called "width direction Y" or "sideways". One of the "width directions Y" is appropriately referred to as "right". The direction opposite to the right is called "left". The vertical direction is called "up-down direction Z". The up-down direction Z is orthogonal to the front-rear direction X, and is orthogonal to the width direction Y. In each drawing, front, rear, right, left, top, and bottom are appropriately indicated for reference.

<Shape of substrate W> FIG. 3 is a top view of the substrate W. FIG. The basic shape of the substrate W will be described. The substrate W has a thin flat plate shape. The substrate W has a substantially circular shape in plan view. The substrate W has a peripheral portion 12 and a main portion 13 . The main portion 13 is a portion of the substrate W located inside the peripheral portion 12 . A semiconductor device is formed on the main portion 13 . For convenience, the boundary between the peripheral portion 12 and the main portion 13 is indicated by a dotted line in FIG. 3 .

In this specification, the board|substrate W is classified into several types according to the shape of the board|substrate W. First, the substrate W is classified into a first substrate W1, a second substrate W2 and a third substrate W3 according to the thickness of the main portion 13 of the substrate W.

4A is a cross-sectional view of the first substrate W1. 4B is a cross-sectional view of the second substrate W2. FIG. 4C is a cross-sectional view of the third substrate W3. The 1st board|substrate W1 is the board|substrate W which contains the recessed part 14 formed when the main part 13 is recessed from the peripheral part 12, and does not contain the protective plate 15 made of glass. The concave portion 14 is formed by, for example, a grinding process (polishing process). The second substrate W2 is the substrate W that does not include the concave portion 14 . The 3rd board|substrate W3 is the board|substrate W which contains the recessed part 14 and the protective plate 15 made of glass. The first substrate W1 may be constituted only by the substrate body 11 . Alternatively, the first substrate W1 may include, in addition to the substrate body 11, at least any one of a resin coating, a resin tape, a resin sheet, and a resin film. The second substrate W2 may be constituted only by the substrate body 11 . Alternatively, the second substrate W2 may include, in addition to the substrate body 11 , at least any one of a resin coating film, a resin tape, a resin sheet, a resin film, and a protective plate 15 . The third substrate W3 includes the substrate body 11 and the protection plate 15 . The protection plate 15 is attached to, for example, the substrate body 11 . The third substrate W3 may further include at least one of a resin coating, a resin tape, a resin sheet, and a resin film.

The main portion 13 of the first substrate W1 is thinner than the main portion 13 of the second substrate W2. The main portion 13 of the first substrate W1 is thinner than the main portion 13 of the third substrate W3. The rigidity of the first substrate W1 is lower than that of the second substrate W2 and the third substrate W3. The 1st board|substrate W1 bends more easily than the 2nd board|substrate W2 and the 3rd board|substrate W3.

Specifically, the main portion 13 of the first substrate W1 has a thickness T1. The main portion 13 of the second substrate W2 has a thickness T2. The main portion 13 of the third substrate W3 has a thickness T3. Thickness T1 is smaller than thickness T2. Thickness T1 is smaller than thickness T3. The thickness T1 is, for example, 10 [μm] or more and 200 [μm] or less. The thickness T2 is, for example, 600 [μm] or more and 1000 [μm] or less. The thickness T3 is, for example, 800 [μm] or more and 1200 [μm] or less.

The peripheral portion 12 of the first substrate W1 has a thickness T4. The peripheral edge portion 12 of the second substrate W2 has a thickness T5. The peripheral edge portion 12 of the third substrate W3 has a thickness T6. Thickness T4 is the same as thickness T5, for example. Thickness T4 is smaller than thickness T6. The thickness T4 is, for example, 600 [μm] or more and 1000 [μm] or less. The thickness T5 is, for example, 600 [μm] or more and 1000 [μm] or less. The thickness T6 is, for example, 1400 [μm] or more and 2200 [μm] or less.

Second, according to the diameter D of the substrate W, the substrate W is classified into a normal-diameter substrate WN and a large-diameter substrate WL.

FIG. 5A is a top view of the normal diameter substrate WN. FIG. 5B is a top view of the large-diameter substrate WL. Usually the diameter substrate WN has a diameter D1. The major diameter WL has a diameter D2. The diameter D2 is larger than the diameter D1.

The diameter D1 is, for example, 300 [mm]. The diameter D2 is, for example, 301 [mm].

For example, the first substrate W1 and the second substrate W2 belong to the normal diameter substrate WN. For example, the third substrate W3 belongs to the large-diameter substrate WL.

The substrate processing apparatus 1 processes the first substrate W1, the second substrate W2, and the third substrate W3. The substrate processing apparatus 1 processes the normal-diameter substrate WN and the large-diameter substrate WL.

<Vehicle C> Figure 6 is a front view of Vehicle C. The carrier C includes a container 21 and a plurality of racks 22 . The bracket 22 is arranged inside the container 21 . The brackets 22 are arranged so as to be aligned in the vertical direction Z. The two brackets 22 adjacent to each other in the vertical direction Z are close to each other. The interval between two adjacent brackets 22 in the vertical direction Z is, for example, 10 [mm].

Each holder 22 mounts one substrate W in a horizontal posture, respectively. The bracket 22 is in contact with the lower surface 16 of the substrate W. For example, the bracket 22 is in contact with the lower surface 16 of the peripheral portion 12 of the substrate W. As shown in FIG. The holder 22 is not in contact with the upper surface 17 of the substrate W. Thereby, the holder 22 supports the substrate W. When the holder 22 supports the substrate W, the holder 22 allows the substrate W to move upward relative to the holder 22 .

Each holder 22 includes a first holder 23 and a second holder 24, respectively. The first holder 23 and the second holder 24 are separated from each other. The first bracket 23 and the second bracket 24 face each other in the horizontal direction. The interval E1 between the first brackets 23 and the second brackets 24 arranged in the horizontal direction is smaller than the diameter D of the substrate W. As shown in FIG.

FIG. 7 is a top view of the bracket 22 of the carrier C. FIG. The first holder 23 supports the first side portion 18 of the substrate W. As shown in FIG. The second holder 24 supports the second side portion 19 of the substrate W. The second side portion 19 is located on the opposite side to the first side portion 18 with respect to the center J of the substrate W. The first side portion 18 and the second side portion 19 include a part of the peripheral edge portion 12 of the substrate W, respectively. The first side portion 18 and the second side portion 19 may further include a part of the main portion 13 of the substrate W, respectively.

Carrier C has a barcode (not shown). The barcode is, for example, an identification code for identifying the carrier C. The barcode is, for example, an identification code used to identify the substrate W in the carrier C. As shown in FIG. A barcode is attached to the container 21, for example.

Hereinafter, the structure of each part of the substrate processing apparatus 1 is demonstrated.

<Transmission part 2> Refer to Figure 1. The carrier mounting parts 3 are arranged in a line along the width direction Y. As shown in FIG. The transfer unit 2 includes a barcode reader 31 . The barcode reader 31 reads the barcode attached to the carrier C mounted on the carrier mounting portion 3 . The barcode reader 31 is attached to the carrier mounting part 3, for example.

The transfer unit 2 includes a transfer space 32 . The conveyance space 32 is arranged behind the carrier placement portion 3 . The conveyance space 32 extends in the width direction Y. The conveyance mechanism 4 is installed in the conveyance space 32 . The conveyance mechanism 4 is arranged behind the carrier placement portion 3 .

The conveyance mechanism 4 includes a hand portion 33 and a hand portion driving portion 34 . The hand 33 supports one substrate W in a horizontal posture. The hand 33 supports the substrate W by being in contact with the lower surface 16 of the substrate W. The hand driving unit 34 is connected to the hand 33 . The hand drive unit 34 moves the hand 33 .

Refer to Figures 1 and 8. FIG. 8 is a left side view showing the configuration of the central portion of the substrate processing apparatus 1 in the width direction Y. As shown in FIG. The hand drive part 34 is provided with the rail 34a, the horizontal movement part 34b, the vertical movement part 34c, the rotation part 34d, and the advance and retreat movement part 34e. The rail 34a is fixedly provided. The rail 34a is arranged at the bottom of the conveyance space 32 . The rail 34a extends in the width direction Y. The horizontal moving part 34b is supported by the rail 34a. The horizontal moving part 34b moves in the width direction Y with respect to the rail 34a. The vertical moving part 34c is supported by the horizontal moving part 34b. The vertical moving part 34c moves in the vertical direction Z with respect to the horizontal moving part 34b. The rotating part 34d is supported by the vertical moving part 34c. The rotating part 34d rotates with respect to the vertical moving part 34c. The rotating part 34d rotates about the rotation axis A1. The rotation axis A1 is parallel to the vertical direction Z. The forward-backward moving portion 34e reciprocates in one of the horizontal directions determined by the direction of the rotating portion 34d.

The hand portion 33 is fixed to the forward and backward moving portion 34e. The hand 33 can move in parallel in the horizontal direction and the vertical direction Z. The hand 33 is rotatable about the rotation axis A1.

FIG. 9 is a top view of the hand 33 . FIG. 10 is a side view of the hand 33 . The structure of the hand portion 33 will be described. The hand portion 33 includes a connecting portion 35 . The connecting portion 35 is connected to the advancing and retreating moving portion 34e.

The hand 33 includes two rods 36 . Each rod 36 is supported by the connecting portion 35. The two rods 36 are separated from each other. The two rods 36 extend linearly, respectively. The two rods 36 extend from the connecting portion 35 in the same direction, respectively. The two rods 36 are parallel to each other. The direction in which each rod 36 extends is referred to as a first direction F1. The first direction F1 is horizontal. The first direction F1 is the same as the direction in which the forward and backward moving portion 34e reciprocates with respect to the rotating portion 34d. The horizontal direction orthogonal to the 1st direction F1 is called the 2nd direction F2. The two rods 36 are arranged in the 2nd direction F2.

The entire length L1 of the two rods 36 in the second direction F2 is smaller than the interval E1. Therefore, the two rods 36 can pass in the vertical direction Z between the first bracket 23 and the second bracket 24 which are opposite to each other in the horizontal direction.

Each rod 36 has a length approximately equal to the diameter D of the base plate W. As shown in FIG. That is, the length L2 of the rod 36 in the 1st direction F1 is substantially equal to the diameter of the board|substrate W.

The rods 36 are respectively thin. That is, the length L3 of one rod 36 in the second direction F2 is small. The length L3 is, for example, 10 [mm]. The length L3 is substantially constant throughout the first direction F1. That is, the length L3 is substantially constant from the base end portion of the rod 36 to the front end portion of the rod 36 . Each rod 36 has a substantially constant cross-sectional shape along the first direction F1. That is, the cross-sectional shape of the rod 36 is substantially constant from the base end of the rod 36 to the front end of the rod 36 .

The hand 33 includes several (for example, four) contact portions 37 . The contact portion 37 is attached to each rod 36 . Each contact portion 37 protrudes upward from each rod 36 . Each contact portion 37 is in contact with the lower surface 16 of the substrate W. As shown in FIG. More specifically, each contact portion 37 is in contact with the lower surface 16 of the peripheral portion 12 of the substrate W. As shown in FIG. Thereby, the hand 33 supports one board|substrate W in a horizontal attitude|position. Each contact portion 37 is not in contact with the upper surface 17 of the substrate W. As shown in FIG. The hand 33 allows the substrate W to move upward with respect to the hand 33 . When the hand 33 supports the substrate W, the contact portion 37 and the rod 36 overlap the substrate W in plan view.

The hand 33 includes a board detection unit 38 . The substrate detection unit 38 detects the substrate W supported by the hand 33 . The board detection unit 38 is attached to the rod 36 .

Refer to Figure 2. The barcode reader 31 is connected to the control unit 9 so as to be communicable. The hand drive part 34 and the board|substrate detection part 38 of the conveyance mechanism 4 are connected with the control part 9 so that communication is possible. The control unit 9 receives the detection results of the barcode reader 31 and the substrate detection unit 38 . The control unit 9 controls the hand driving unit 34 .

<Processing block 5> Refer to Figure 1. The arrangement of each element of the processing block 5 will be described. The processing block 5 includes a transport space 41 . The conveyance space 41 is arranged in the center of the processing block 5 in the width direction Y. As shown in FIG. The conveyance space 41 extends in the front-rear direction X. The conveyance space 41 is in contact with the conveyance space 32 of the transfer unit 2 .

The placement portion 6 and the conveyance mechanism 8 are provided in the conveyance space 41 . The placement portion 6 is arranged in front of the conveyance mechanism 8 . The placement portion 6 is arranged behind the conveyance mechanism 4 . The placement portion 6 is arranged between the conveyance mechanism 4 and the conveyance mechanism 8 .

The processing units 7 are arranged on both sides of the conveyance space 41 . The processing unit 7 is arranged so as to surround the side of the conveyance mechanism 8 . Specifically, the processing block 5 includes a first processing area 42 and a second processing area 43 . The first processing area 42, the conveyance space 41, and the second processing area 43 are arranged in the width direction Y in this order. The first processing area 42 is arranged on the right side of the conveyance space 41 . The second processing area 43 is arranged on the left side of the conveyance space 41 .

FIG. 11 is a left side view showing the configuration of the left portion of the substrate processing apparatus 1 . In the second processing area 43, a plurality of processing units 7 are arranged in a matrix in the front-rear direction X and the vertical direction Z. For example, in the second processing area 43, the six processing units 7 are arranged in two rows in the front-rear direction X and in three layers in the vertical direction Z.

Although not shown, in the first processing area 42, a plurality of processing units 7 are arranged in a matrix in the front-rear direction X and the vertical direction Z. For example, in the first processing area 42, the six processing units 7 are arranged in two rows in the front-rear direction X and in three layers in the vertical direction Z.

FIG. 12 is a front view of the mounting portion 6 . The structure of the mounting part 6 is demonstrated. The placing portion 6 can place several substrates W thereon. The placement portion 6 includes a plurality of brackets 45 and support walls 48 . The support walls 48 support the respective brackets 45 . The brackets 45 are arranged so as to be aligned in the vertical direction Z. The two brackets 45 adjacent to each other in the vertical direction Z are close to each other.

Each holder 45 mounts one substrate W in a horizontal posture, respectively. The bracket 45 is in contact with the lower surface 16 of the substrate W. For example, the bracket 45 is in contact with the lower surface 16 of the peripheral portion 12 of the substrate W. As shown in FIG. The bracket 45 is not in contact with the upper surface 17 of the substrate W. Thereby, the holder 45 supports the substrate W. When the holder 45 supports the substrate W, the holder 45 allows the substrate W to move upward relative to the holder 45 .

Each holder 45 includes a first holder 46 and a second holder 47, respectively. The first holder 46 and the second holder 47 are separated from each other. The first bracket 46 and the second bracket 47 face each other in the horizontal direction (specifically, the width direction Y). The interval E2 between the first brackets 46 and the second brackets 47 arranged in the horizontal direction is smaller than the diameter D of the substrate W. As shown in FIG. The interval E2 is greater than the length L1.

FIG. 13 is a plan view of the holder 45 of the placement portion 6 . The first holder 46 supports the first side portion 18 of the substrate W. As shown in FIG. The second holder 47 supports the second side portion 19 of the substrate W. As shown in FIG.

FIG. 14 is a detailed view of the holder 45 of the mounting portion 6 . The first bracket 46 has a first inclined surface 51 . The second bracket 47 includes a second inclined surface 55 . The first inclined surface 51 and the second inclined surface 55 are separated from each other. The second inclined surface 55 and the first inclined surface 51 face each other in the horizontal direction (specifically, the width direction Y). The first inclined surface 51 and the second inclined surface 55 are left-right symmetrical in a front view. The first inclined surface 51 and the second inclined surface 55 are left-right symmetrical when viewed from the front-rear direction X. The first inclined surface 51 is in contact with the first side portion 18 of the substrate W. As shown in FIG. The second inclined surface 55 is in contact with the second side portion 19 of the substrate W. As shown in FIG.

The interval E2 corresponds to the interval between the first inclined surface 51 and the second inclined surface 55 in the horizontal direction. The interval E2 decreases toward the downward direction.

The first inclined surface 51 has an upper end 51T. The second inclined surface 55 has an upper end 55T. The interval ET between the upper end 51T and the upper end 55T in the horizontal direction is larger than the diameter D of the substrate W. As shown in FIG. For example, the interval ET is 306 [mm]. For example, the difference between the spacer ET and the diameter D of the substrate W is 1 [%] or more of the diameter of the substrate W. For example, the difference between the space ET and the diameter D of the substrate W is 2 [mm] or more.

The first inclined surface 51 has a lower end 51B. The second inclined surface 55 has a lower end 55B. The interval EB between the lower end 51B and the lower end 55B in the horizontal direction is narrower than the interval ET. The interval EB is smaller than the diameter D of the substrate W. FIG.

The angle of the first inclined surface 51 is not constant over the entirety of the first inclined surface 51 . The first inclined surface 51 has an upper inclined surface 52 and a lower inclined surface 53 . The lower inclined surface 53 is arranged below the upper inclined surface 52 . The lower inclined surface 53 is in contact with the lower end of the upper inclined surface 52 . The upper inclined surface 52 is inclined at a first angle θ1 with respect to the horizontal plane. The lower inclined surface 53 is inclined at the second angle θ2 with respect to the horizontal plane. The second angle θ2 is smaller than the first angle θ1. The lower inclined surface 53 is closer to the horizontal than the upper inclined surface 52 .

Similarly, the second inclined surface 55 has an upper inclined surface 56 and a lower inclined surface 57 . The second inclined surface 55 has the same shape as the first inclined surface 51 except that it is bilaterally symmetrical. The upper sloped surface 56 and the lower sloped surface 57 also have the same shape as the upper sloped surface 52 and the lower sloped surface 53 except that they are symmetrical to each other.

The first inclined surface 51 has an intermediate point 51M. The middle point 51M is the connecting position of the upper inclined surface 52 and the lower inclined surface 53 . The second inclined surface 55 has an intermediate point 55M. The middle point 55M is the connecting position of the upper inclined surface 56 and the lower inclined surface 57 . The distance EM between the intermediate point 51M and the intermediate point 55M in the horizontal direction is substantially equal to the diameter D of the substrate W. As shown in FIG.

Refer to Figures 1 and 7. The structure of the conveyance mechanism 8 is demonstrated.

The conveying mechanism 8 includes a hand 61 and a hand driving unit 62 . The hand 61 supports one substrate W in a horizontal posture. The hand driving unit 62 is connected to the hand 61 . The hand drive unit 62 moves the hand 61 .

The hand drive part 62 is provided with the support|pillar 62a, the vertical movement part 62b, the rotation part 62c, and the forward-backward movement part 62d. The pillar 62a is fixedly provided. The struts 62a extend in the vertical direction Z. The vertical movement part 62b is supported by the support|pillar 62a. The vertical moving part 62b moves in the vertical direction Z with respect to the support column 62a. The rotating part 62c is supported by the vertical moving part 62b. The rotation part 62c rotates with respect to the vertical movement part 62b. The rotating part 62c rotates about the rotation axis A2. The rotation axis A2 is parallel to the vertical direction Z. The advancing and retreating moving portion 62d reciprocates in one of the horizontal directions determined by the direction of the rotating portion 62c.

The hand portion 61 is fixed to the forward and backward moving portion 62d. The hand 61 can move in parallel in the horizontal direction and the vertical direction Z. The hand 61 is rotatable about the rotation axis A2.

FIG. 15 is a bottom view of the hand 61 . 16A and 16B are side views of the hand 61 . The structure of the hand portion 61 will be described. The hand 61 includes a connecting portion 64 . The connecting portion 64 is connected to the advancing and retreating moving portion 62d.

The hand 61 includes a base portion 65 . The base portion 65 is supported by the connecting portion 64 . The base portion 65 extends in the horizontal direction from the connecting portion 64 .

The base portion 65 includes two branch portions 66 . The respective branch portions 66 are separated from each other. Each branch portion 66 extends in the same direction from the connecting portion 64 . The direction in which each branch portion 66 extends is referred to as a third direction F3. The third direction F3 is horizontal. The third direction F3 is the same as the direction in which the forward and backward moving portion 62d reciprocates with respect to the rotating portion 62c. The horizontal direction orthogonal to the third direction F3 is referred to as the fourth direction F4. The two branch portions 66 are arranged in the fourth direction F4. The two branch portions 66 are line-symmetrical with respect to an imaginary line passing between the two branch portions 66 and parallel to the third direction F3 in plan view. Each branch portion 66 is curved. Each branch portion 66 has portions that are bent so as to be away from each other. In other words, each branch portion 66 has a portion that is curved so as to protrude outward in the fourth direction F4.

The hand 61 includes a suction part 68 . The suction part 68 is attached to the base part 65 . The suction part 68 blows gas. The suction part 68 blows gas downward. The suction part 68 blows gas toward the substrate W from a position above the substrate W. Here, "a position above the substrate W" is a position higher than the position of the substrate W and overlapping with the substrate W in a plan view. In FIG. 15 , the substrate W attracted by the attracting portion 68 is indicated by a broken line. The suction part 68 blows gas toward the upper surface 17 of the substrate W. As shown in FIG. The suction part 68 makes the gas flow along the upper surface 17 of the substrate W. As shown in FIG. Thereby, the suction part 68 sucks the substrate W without coming into contact with the substrate W. Specifically, the negative pressure is formed by the gas flowing along the upper surface 17 of the substrate W. As shown in FIG. That is, the air pressure received by the upper surface 17 of the substrate W is smaller than the air pressure received by the lower surface 16 of the substrate W. FIG. According to Bernoulli's principle, an upward force acts on the substrate W. That is, the substrate W is attracted upward. The substrate W is attracted toward the attracting portion 68 . However, the attracting portion 68 does not come into contact with the substrate W that the attracting portion 68 attracts. The base portion 65 is also not in contact with the substrate W attracted by the attracting portion 68 .

The suction part 68 includes several (six) suction pads 69 . Each suction pad 69 is disposed on the lower surface of the base portion 65 . The suction pad 69 is buried in the base portion 65 . The suction pads 69 are separated from each other. The suction pads 69 are arranged on a circumference around the center J of the substrate W attracted by the suction portion 68 in a plan view.

Each suction pad 69 is circular in plan view. Each suction pad 69 has a cylindrical shape having a central axis parallel to the vertical direction Z. Each suction pad 69 has a lower portion opened downward. The suction pad 69 blows gas from the lower part of the suction pad 69 . The suction pad 69 can also form a swirling flow. The swirling flow is the airflow swirling around the central axis of the suction pad 69 inside the suction pad 69 . For example, before the suction pad 69 blows out the gas, the suction pad 69 may form a swirling flow. For example, a swirling flow can also be formed for the suction pad 69 , and then the suction pad 69 releases the swirling flow to the outside of the suction pad 69 .

The conveying mechanism 8 includes a gas supply path 71 . The gas supply passage 71 supplies gas to the suction part 68 . The gas supply path 71 has a first end and a second end. The first end of the gas supply path 71 is connected to the gas supply source 72 . The second end of the gas supply passage 71 is connected to the suction part 68 . The second end of the gas supply path 71 is connected to each suction pad 69 . The gas supplied to the suction part 68 is nitrogen gas or air, for example. The gas supplied to the suction part 68 is, for example, high-pressure gas or compressed gas.

The conveyance mechanism 8 includes a suction adjustment unit 73 . The suction adjustment portion 73 is provided in the gas supply passage 71 . The suction adjustment part 73 adjusts the flow rate of the gas supplied to the suction part 68 . That is, the suction adjustment part 73 adjusts the flow rate of the gas blown from the suction part 68 . The suction adjustment part 73 can adjust the flow rate of the gas supplied to the suction part 68 in a stepless manner. The suction adjustment part 73 can also adjust the flow rate of the gas supplied to the suction part 68 in steps. The suction force acting on the substrate W increases as the flow rate of the gas supplied to the suction portion 68 increases. The suction adjustment unit 73 includes, for example, a flow rate adjustment valve. The suction adjustment portion 73 may further include an on-off valve.

The hand 61 includes a contact portion 74 . The contact portion 74 is mounted on the lower surface of the base portion 65 . The contact portion 74 protrudes downward from the base portion 65 . The contact portion 74 protrudes to a lower position than the attracting portion 68 . The contact portion 74 is arranged at a position overlapping the substrate W attracted by the attracting portion 68 in a plan view. The contact portion 74 is in contact with the upper surface 17 of the substrate W attracted by the attracting portion 68 . More specifically, the contact portion 74 is in contact with the upper surface 17 of the peripheral portion 12 of the substrate W. As shown in FIG. The contact portion 74 is not in contact with the lower surface 16 of the substrate W attracted by the attracting portion 68 . The contact portion 74 itself allows the substrate W to move downward relative to the contact portion 74 .

The substrate W is attracted upward by the suction portion 68 and the contact portion 74 is in contact with the upper surface 17 of the substrate W, so that the substrate W is supported and can be held at a predetermined position. That is, the substrate W is attracted upward by the suction portion 68 and the contact portion 74 is brought into contact with the upper surface 17 of the substrate W, and the hand portion 61 holds the substrate W.

The contact portion 74 is disposed at a position farther from the center J of the substrate W attracted by the attracting portion 68 than the attracting portion 68 . The contact portion 74 is disposed on the radially outer side of the substrate W attracted by the attracting portion 68 than the attracting portion 68 .

The contact portion 74 includes several (for example, two) first contact portions 75 and several (for example, two) second contact portions 76 . The position of the first contact portion 75 is substantially the same as the position of the first receiving portion 82 described below in a bottom view. The first contact portion 75 and the second contact portion 76 are separated from each other. The first contact portion 75 is attached to the front end portion of the base portion 65 . The first contact portion 75 is disposed at a position farther from the connection portion 64 than the suction portion 68 . The second contact portion 76 is attached to the base end portion of the base portion 65 . The second contact portion 76 is disposed at a position closer to the connection portion 64 than the suction portion 68 .

The hand portion 61 includes a wall portion 77 . The wall portion 77 is attached to the lower surface of the base portion 65 . The wall portion 77 extends downward from the base portion 65 . The wall portion 77 extends to a position lower than the contact portion 74 . The wall portion 77 extends to a position lower than the substrate W attracted by the attracting portion 68 . The wall part 77 is arrange|positioned in the position which does not overlap the board|substrate W attracted by the attraction|suction part 68 in planar view. The wall portion 77 is arranged on the side of the substrate W attracted by the attracting portion 68 . The wall portion 77 is not in contact with the substrate W attracted by the attracting portion 68 . However, when the substrate W is displaced by a predetermined value or more in the horizontal direction, the wall portion 77 comes into contact with the substrate W. Thereby, the wall portion 77 restricts the substrate W from being displaced by a predetermined value or more in the horizontal direction. The predetermined value is, for example, 3 [mm].

The wall portion 77 is disposed at a position farther from the center J of the substrate W attracted by the attracting portion 68 than the contact portion 74 . The wall portion 77 is disposed on the radially outer side of the substrate W attracted by the attracting portion 68 than the contact portion 74 .

The wall portion 77 includes several (for example, two) first wall portions 78 and several (for example, two) second wall portions 79 . The first wall portion 78 and the second wall portion 79 are fixed to the base portion 65 . The first wall portion 78 and the second wall portion 79 are separated from each other. The first wall portion 78 is attached to the front end portion of the base portion 65 . The first wall portion 78 is disposed at a position farther from the connecting portion 64 than the suction portion 68 . The second wall portion 79 is attached to the base end portion of the base portion 65 . The second wall portion 79 is disposed at a position closer to the connecting portion 64 than the suction portion 68 .

The first wall portion 78 is connected to the first contact portion 75 . The first wall portion 78 extends downward from the first contact portion 75 . The second wall portion 79 is connected to the second contact portion 76 . The second wall portion 79 extends downward from the second contact portion 76 .

The hand 61 includes a receiving portion 81 . The receiving portion 81 is supported by the base portion. The receiving portion 81 is arranged below the substrate W attracted by the attracting portion 68 . The receiving portion 81 is not in contact with the substrate W attracted by the attracting portion 68 . The receiving portion 81 can receive the lower surface 16 of the substrate W. As shown in FIG. That is, the receiving portion 81 can be in contact with the lower surface 16 of the substrate W. As shown in FIG. The receiving portion 81 can support the substrate W. The receiving portion 81 is not in contact with the upper surface 17 of the substrate W. As shown in FIG. The receiving portion 81 allows the substrate W to move upward relative to the receiving portion 81 .

The receiving portion 81 includes a plurality of (for example, two) first receiving portions 82 . The first receiving portion 82 is supported by the base portion 65 . The first receiving portion 82 is fixed to the base portion 65 . The first receiving portion 82 cannot move relative to the base portion 65 . The first receiving portion 82 is arranged below the substrate W attracted by the attracting portion 68 . The first receiving portion 82 can receive the lower surface 16 of the substrate W. As shown in FIG. That is, the first receiving portion 82 can be in contact with the lower surface 16 of the substrate W. As shown in FIG.

The first receiving portion 82 is disposed at a position farther from the center J of the substrate W attracted by the attracting portion 68 than the attracting portion 68 . The first receiving portion 82 is disposed on the radially outer side of the substrate W attracted by the attracting portion 68 than the attracting portion 68 . The first receiving portion 82 is arranged at the front end portion of the base portion 65 . The first receiving portion 82 is disposed at a position farther from the connecting portion 64 than the suction portion 68 .

The first receiving portion 82 is arranged below the first contact portion 75 . The first receiving portion 82 overlaps with the first contact portion 75 in a plan view.

The first receiving portion 82 is connected to the first wall portion 78 . The first receiving portion 82 extends in the horizontal direction from the first wall portion 78 . The first receiving portion 82 extends from the first wall portion 78 toward the center J of the substrate W attracted by the attracting portion 68 in plan view.

The above-mentioned first contact portion 75 , the first wall portion 78 and the first receiving portion 82 are integrally formed members. The first contact portion 75, the first wall portion 78, and the first receiving portion 82 cannot be separated from each other. The second contact portion 76 and the second wall portion 79 are integrally formed members. The second contact portion 76 and the second wall portion 79 cannot be separated from each other.

The receiving portion 81 includes a plurality of (for example, two) second receiving portions 83 . The second receiving portion 83 is supported by the base portion 65 . The second receiving portion 83 is arranged below the substrate W attracted by the attracting portion 68 . The second receiving portion 83 can receive the lower surface 16 of the substrate W. As shown in FIG. That is, the second receiving portion 83 can be in contact with the lower surface 16 of the substrate W. As shown in FIG.

The second receiving portion 83 is disposed at a position farther from the center J of the substrate W attracted by the attracting portion 68 than the attracting portion 68 . The second receiving portion 83 is disposed on the radially outer side of the substrate W attracted by the attracting portion 68 than the attracting portion 68 . The second receiving portion 83 is arranged at the base end portion of the base portion 65 . The second receiving portion 83 is arranged at a position closer to the connecting portion 64 than the suction portion 68 . The second receiving portion 83 is arranged between the two branch portions 66 . The second receiving portion 83 is arranged between the two second contact portions 76 .

The second receiving portion 83 is movable relative to the base portion 65 . The second receiving portion 83 is movable in the horizontal direction with respect to the base portion 65 . Specifically, the second receiving portion 83 can be moved to the drop-off preventing position and the retracted position. In FIG. 15, the 2nd receiving part 83 located in the fall-off prevention position is shown by the broken line. In FIG. 15, the 2nd receiving part 83 located in the retracted position is shown by the solid line. When the second receiving portion 83 moves from the retracted position to the anti-dropping position, the second receiving portion 83 approaches the first receiving portion 82 . When the second receiving portion 83 is moved from the fall-off prevention position to the retracted position, the second receiving portion 83 moves away from the first receiving portion 82 . When the second receiving portion 83 is located at the retracted position, the second receiving portion 83 does not overlap with the substrate W attracted by the attracting portion 68 in plan view.

FIG. 17 is a plan view of the suction part 68 , the substrate W attracted by the suction part 68 , and the receiving part 81 . In FIG. 17, the 2nd receiving part 83 is located in the preventing position. At least a part of the first receiving portion 82 overlaps with the substrate W attracted by the attracting portion 68 in a plan view. When the second receiving portion 83 is located at the anti-dropping position, at least a part of the second receiving portion 83 overlaps with the substrate W attracted by the attracting portion 68 in plan view. The second receiving portion 83 is arranged on the opposite side to the first receiving portion 82 with respect to the center J of the substrate W sucked by the suction portion 68 .

FIG. 18 is a plan view of the receiving portion 81 . In FIG. 18, the 2nd receiving part 83 is located in the retracted position. When the second receiving portion 83 is located at the retracted position, the space between the first receiving portion 82 and the second receiving portion 83 is larger than the substrate W. As shown in FIG. When the second receiving portion 83 is located at the retracted position, the substrate W can pass between the first receiving portion 82 and the second receiving portion 83 in the vertical direction Z in a horizontal posture. In FIG. 18, the board|substrate W is shown for convenience. Furthermore, the position of the substrate W shown in FIG. 18 is different from the position of the substrate W attracted by the attracting portion 68 .

15, 16A, 16B. The wall portion 77 further includes a third wall portion 80 . The third wall portion 80 is connected to the second receiving portion 83 . The third wall portion 80 extends upward from the second receiving portion 83 . The second receiving portion 83 extends in the horizontal direction from the third wall portion 80 . The second receiving portion 83 extends from the third wall portion 80 toward the center J of the substrate W attracted by the attracting portion 68 in plan view.

The second receiving portion 83 and the third wall portion 80 are integrally formed members. The second receiving portion 83 and the third wall portion 80 cannot be separated from each other. The second receiving portion 83 moves integrally with the third wall portion 80 . The third wall portion 80 may also move relative to the base portion 65 .

The hand portion 61 includes a receiving portion driving portion 86 . The receiving portion driving portion 86 is supported by, for example, the base portion 65 . The receiving portion driving portion 86 is connected to the second receiving portion 83 . For example, the receiving portion driving portion 86 is connected to the second receiving portion 83 via the third wall portion 80 . The receiving portion driving portion 86 moves the second receiving portion 83 relative to the base portion 65 . The receiving portion driving portion 86 moves the second receiving portion 83 in the horizontal direction. The receiving portion driving portion 86 reciprocates the second receiving portion 83 in the third direction F3. The receiving portion driving portion 86 brings the second receiving portion 83 close to the first receiving portion 82 and moves the second receiving portion 83 away from the first receiving portion 82 . The receiving portion driving portion 86 moves the second receiving portion 83 to the dropout preventing position and the retracted position.

The receiving portion driving portion 86 includes an actuator 87 . The actuator 87 moves the second receiving portion 83 by the power source input to the actuator 87 . The actuator 87 moves the second receiving portion 83 from the retracted position to the falling-off preventing position, and moves the second receiving portion 83 from the falling-off preventing position to the retracting position. The actuator 87 is, for example, an air cylinder. The power source of the cylinder is air pressure. The actuator 87 is, for example, an electric motor. The power source of the electric motor is electricity.

The receiving portion driving portion 86 further includes an elastic member 88 . The elastic member 88 presses the second receiving portion 83 from the retracted position toward the drop-off preventing position. The elastic member 88 is, for example, a spring. The elastic member 88 can also be disposed outside the actuator 87 . Alternatively, the elastic member 88 may also be disposed inside the actuator 87 .

When the power source of the actuator 87 stops, the second receiving portion 83 can be held at the retracted position by the elastic member 88 .

The hand 61 includes a board detection unit 89 . The substrate detection unit 89 detects the substrate W supported by the hand 61 . The board detection part 89 is attached to the base part 65 .

Refer to Figure 2. The control unit 9 is communicably connected to the hand drive unit 62 , the suction adjustment unit 73 , the receiving unit drive unit 86 (actuator 87 ), and the substrate detection unit 89 of the conveyance mechanism 8 . The control part 9 receives the detection result of the board|substrate detection part 89. The control part 9 controls the hand drive part 62, the suction adjustment part 73, and the receiving part drive part 86 (actuator 87).

Refer to Figures 1 and 11. The basic structure of the processing unit 7 will be described. Each processing unit 7 includes a substrate holding portion 91 , a rotation driving portion 92 , and a shield 93 . The substrate holding portion 91 holds one substrate W. The substrate holding portion 91 holds the substrate W in a horizontal posture. The rotation drive unit 92 is connected to the substrate holding unit 91 . The rotation drive unit 92 rotates the substrate holding unit 91 . The protective cover 93 is arranged so as to surround the side of the board holding portion 91 . The protective cover 93 receives the processing liquid.

The processing unit 7 is classified into a first processing unit 7A and a second processing unit 7B according to the structure of the substrate holding portion 91 . The substrate holding portion 91 of the first processing unit 7A is called a Bernoulli chuck or a Bernoulli gripper. The Bernoulli chuck is suitable for holding a relatively thin substrate W. The substrate holding portion 91 of the second processing unit 7B is called a mechanical chuck or a mechanical gripper. The mechanical chuck is suitable for holding a relatively thick substrate W.

For example, the six processing units 7 arranged in the first processing area 42 are the first processing units 7A, respectively. For example, the six processing units 7 arranged in the second processing area 43 are respectively the second processing units 7B.

Hereinafter, the substrate holding portion 91 of the first processing unit 7A will be appropriately described as "the first substrate holding portion 91A". The rotational drive unit 92 of the first processing unit 7A is appropriately described as "the first rotational drive unit 92A". The substrate holding portion 91 of the second processing unit 7B is appropriately described as "the second substrate holding portion 91B". The rotational drive unit 92 of the second processing unit 7B is appropriately described as "the second rotational drive unit 92B".

FIG. 19 is a diagram schematically showing the configuration of the first processing unit 7A. The illustration of the protective cover 93 is omitted in FIG. 19 . The configuration of the first processing unit 7A will be described.

The first substrate holding portion 91A includes the first plate 101 . The first plate 101 has a substantially disk shape. The first plate 101 has an upper surface 102 . The upper surface 102 is substantially horizontal. The upper surface 102 is substantially flat.

The first rotational drive portion 92A is connected to the lower portion of the first plate 101 . The first rotational drive unit 92A rotates the first plate 101 . The first plate 101 is rotated around the rotation axis A3 by the first rotational drive portion 92A. The rotation axis A3 is parallel to the vertical direction Z. The rotation axis A3 passes through the center of the first plate 101 .

FIG. 20 is a plan view of the first plate 101 . The upper surface 102 of the first plate 101 is circular in plan view. The upper surface 102 of the first board 101 is larger than the substrate W in plan view.

The first board holding portion 91A includes a plurality of (eg, 30) fixing pins 103 . The fixing pins 103 support the substrate W. Each fixing pin 103 is fixed to the first plate 101 . Each fixing pin 103 cannot move relative to the first plate 101 . Each fixing pin 103 cannot rotate with respect to the first plate 101 . Each fixing pin 103 does not have a movable portion that can move relative to the first plate 101 .

The fixing pins 103 are arranged on the peripheral edge portion of the upper surface 102 of the first plate 101 . The fixing pins 103 are arranged on the circumference around the rotation axis A3 in a plan view. The respective fixing pins 103 are separated from each other.

Referring to Figures 19 and 20 . The fixing pins 103 protrude upward from the upper surface 102 of the first plate 101 . The fixing pins 103 are in contact with the lower surface 16 of the substrate W. More specifically, the fixing pins 103 are in contact with the lower surface 16 of the peripheral portion 12 of the substrate W. As shown in FIG. Thereby, the fixing pins 103 support the substrate W at a position higher than the upper surface 102 of the first board 101 . In FIG. 20, the board|substrate W supported by the fixing pin 103 is shown by a dotted line.

The fixing pins 103 are not in contact with the upper surface 17 of the substrate W. The fixing pins 103 allow the substrate W to move upward with respect to the fixing pins 103 . The fixing pins 103 are not in contact with the edge 20 of the substrate W. The fixing pins 103 themselves allow the substrate W to slide relative to the fixing pins 103 . In this way, the fixing pins 103 themselves do not hold the substrate W.

The first substrate holding portion 91A includes a gas outlet 104 . The gas outlet 104 is formed on the upper surface 102 of the first plate 101 . The gas outlet 104 is arranged at a position overlapping the substrate W supported by the fixing pins 103 in a plan view. The gas blowing port 104 blows gas upward. The gas blowing port 104 blows gas between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 . The gas blowing port 104 blows gas toward the substrate W from a position below the substrate W supported by the fixing pins 103 . The gas is supplied between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 . The gas flows along the lower surface 16 of the substrate W supported by the fixing pins 103 . Thereby, the gas outlet 104 sucks the substrate W. Specifically, the negative pressure is formed by the gas flowing along the lower surface 16 of the substrate W. As shown in FIG. That is, the air pressure received by the lower surface 16 of the substrate W is smaller than the air pressure received by the upper surface 17 of the substrate W. According to Bernoulli's principle, a downward force acts on the substrate W. That is, the substrate W is attracted downward. The substrate W is sucked toward the gas outlet 104 and the first plate 101 . However, the gas outlet 104 is not in contact with the substrate W. The first plate 101 is not in contact with the substrate W either.

The substrate W is sucked downward by the gas outlet 104 and the fixing pins 103 are brought into contact with the lower surface 16 of the substrate W, so that the substrate W is supported and can be held in a predetermined position. Due to the attractive force acting on the substrate W, the substrate W does not slide in the horizontal direction relative to the fixing pins 103 . That is, the substrate W is sucked downward by the gas outlet 104 , the fixing pins 103 are brought into contact with the lower surface 16 of the substrate W, and the substrate W is held by the first substrate holding portion 91A.

The gas blowing port 104 includes one first blowing port 105 and a plurality of second blowing ports 106 . The 1st blower outlet 105 is arrange|positioned in the center part of the upper surface 102 of the 1st board 101. The 1st blower outlet 105 is arrange|positioned on the rotation axis A3. The 2nd blower outlet 106 is arrange|positioned at the radial direction outer side of the rotation axis A3 rather than the 1st blower outlet 105. The 2nd blower outlet 106 is arrange|positioned in the radial direction inner side of the rotation axis A3 rather than the fixing pin 103. The second air outlet 106 is arranged on the circumference around the rotation axis A3 in plan view.

The first processing unit 7A includes a first gas supply path 107 and a second gas supply path 108 . The first gas supply passage 107 supplies gas to the first blow-off port 105 . The second gas supply passage 108 supplies gas to the second outlet 106 . A part of the first gas supply path 107 and a part of the second gas supply path 108 are formed inside the first plate 101 . The first gas supply path 107 has a first end and a second end. The first end of the first gas supply path 107 is connected to the gas supply source 109 . The second end of the first gas supply passage 107 is connected to the first outlet 105 . The second gas supply path 108 has a first end and a second end. The first end of the second gas supply path 108 is connected to the gas supply source 109 . The second end of the second gas supply passage 108 is connected to the second outlet 106 . The gas supplied to the 1st blower port 105 and the 2nd blower port 106 is nitrogen gas or air, for example. The gas supplied to the 1st blower port 105 and the 2nd blower port 106 is, for example, high-pressure gas or compressed gas.

The first processing unit 7A includes a first blowing adjustment unit 111 and a second blowing adjustment unit 112 . The 1st blow-off adjustment part 111 is provided in the 1st gas supply path 107. The second blow-off adjustment unit 112 is provided in the second gas supply path 108 . The first blow-off adjustment unit 111 adjusts the flow rate of the gas blown from the first blow-off port 105 . That is, the 1st blow-off adjustment part 111 adjusts the flow rate of the gas supplied to the 1st blow-off port 105. The second blowing adjustment unit 112 adjusts the flow rate of the gas blown out from the second blowing port 106 . That is, the second blowing adjustment unit 112 adjusts the flow rate of the gas supplied to the second blowing port 106 . As the flow rate of the gas blown from the first blowing port 105 increases, the attractive force acting on the substrate W increases. As the flow rate of the gas blown from the second blowing port 106 increases, the attractive force acting on the substrate W increases.

The first blowing adjustment unit 111 cannot adjust the flow rate of the gas blown out from the second blowing port 106 . The second blowing adjustment unit 112 cannot adjust the flow rate of the gas blown out from the first blowing port 105 . The first blowing adjustment part 111 and the second blowing adjustment part 112 can operate independently of each other. Therefore, the flow rate of the gas blown out from the first blowing port 105 and the flow rate of the gas blown out from the second blowing port 106 can be adjusted independently of each other. Each of the first blowing adjustment unit 111 and the second blowing adjustment unit 112 includes, for example, a flow rate adjustment valve. The first blowing adjustment unit 111 and the second blowing adjustment unit 112 may further include an on-off valve, respectively.

See Figure 20. The processing unit 7 includes several (for example, six) position adjustment pins 113 . The position adjustment pins 113 are supported by the first plate 101 . The position adjustment pin 113 is movable in the horizontal direction with respect to the first plate 101 . When the position adjustment pins 113 move relative to the first plate 101 , the position adjustment pins 113 can come into contact with the substrate W supported by the fixing pins 103 and can be separated from the substrate W supported by the fixing pins 103 . More specifically, the position adjustment pin 113 can be in contact with the edge 20 of the substrate W supported by the fixing pin 103 . The position adjustment pin 113 adjusts the position of the substrate W supported by the fixing pin 103 . The position adjustment pins 113 adjust the position of the substrate W in the horizontal direction. The position adjustment pin 113 locates the center J of the substrate W supported by the fixing pin 103 on the rotation axis A3.

In this specification, the position of the position adjustment pin 113 in contact with the substrate W is referred to as an "adjustment position". The position of the position adjustment pin 113 away from the substrate W is referred to as a "retracted position". The position adjustment pin 113 can be moved to an adjustment position and a retracted position.

The position adjustment pins 113 are arranged on the peripheral edge portion of the upper surface 102 of the first plate 101 . The position adjustment pins 113 are arranged on the circumference around the rotation axis A3 in a plan view. The position adjustment pins 113 are arranged at substantially the same height as the substrate W supported by the fixing pins 103 .

21A and 21B are detailed plan views of the position adjustment pins. 22A and 22B are side views of the position adjustment pins. 21A and 22A show the position adjustment pin 113 at the retracted position. 21B and 22B show the position adjustment pin 113 at the adjustment position. Each of the position adjustment pins 113 is fixed to the shaft portion 114, respectively. The shaft portion 114 extends downward from the position adjustment pin 113 . The shaft portion 114 is supported by the first plate 101 . The position adjustment pin 113 is supported by the first plate 101 via the shaft portion 114 . The shaft portion 114 is rotatable relative to the first plate 101 . The shaft portion 114 is rotatable about the rotation axis A4. The rotation axis A4 is parallel to the vertical direction Z. The rotation axis A4 passes through the center of the shaft portion 114 . The position adjustment pin 113 is arranged at a position eccentric from the rotation axis A4. When the shaft portion 114 rotates relative to the first plate 101 , the position adjustment pin 113 moves in the horizontal direction relative to the first plate 101 . Specifically, the position adjustment pin 113 revolves around the rotation axis A4. Thereby, the position adjustment pin 113 approaches the rotation axis A3 and is away from the rotation axis A3. When the position adjustment pin 113 approaches the rotation axis A3, the position adjustment pin 113 moves to the adjustment position. When the position adjustment pin 113 is located at the adjustment position, the position adjustment pin 113 is in contact with the end edge 20 of the substrate W supported by the fixing pin 103 . Furthermore, the position adjustment pin 113 pushes the edge 20 of the substrate W in contact with the position adjustment pin 113 toward the rotation axis A3. The edge 20 of the substrate W is pushed by a plurality of position adjusting pins 113 disposed at different positions, and the substrate W is adjusted to a predetermined position. The position adjustment pin 113 is moved to the retracted position by the position adjustment pin 113 being away from the rotation axis A3. When the position adjustment pin 113 is located at the retracted position, the position adjustment pin 113 is away from the edge 20 of the substrate W supported by the fixing pin 103 . When the position adjustment pin 113 is located at the retracted position, the position adjustment pin 113 does not come into contact with the substrate W supported by the fixing pin 103 .

See Figure 20. The processing unit 7 includes several (for example, six) ejector pins 116 . The lift pins 116 are arranged on the peripheral edge portion of the upper surface 102 of the first plate 101 . The jacking pins 116 are arranged on the circumference around the rotation axis A3 in a plan view.

23A, 23B are side views of the jacking pin 116. FIG. The ejector pins 116 are supported by the first plate 101 . The lift pins 116 are supported so as to be movable in the vertical direction Z with respect to the first plate 101 . The lift pins 116 support the substrate W. The lift pins 116 move the substrate W supported by the lift pins 116 in the vertical direction Z.

Figure 23A shows the ejector pin 116 in the up position. The jacking pin 116 can be moved to the up position. The upper position is higher than the fixing pin 103 . The lift pins 116 can support the substrate W in the upper position. When the lift pins 116 support the substrate W at the upper position, the substrate W is located higher than the fixing pins 103 .

See Figure 23B. The jacking pin 116 can move downward from the upper position. The jack-up pins 116 lower the substrate W. Specifically, the lift pins 116 lower the substrate W from a position higher than the fixing pins 103 . Thereby, the lift pins 116 deliver the substrate W to the fixing pins 103 . In this way, when the ejector pins 116 move downward from the upper position in a state in which the ejector pins 116 support the substrate W, the ejector pins 116 deliver the substrate W to the fixing pins 103 . After the lift pins 116 deliver the substrate W to the fixing pins 103 , the lift pins 115 are further moved downward with respect to the first plate 101 and are separated from the substrate W supported by the fixing pins 103 .

In this specification, the position of the ejector pin 116 which is not in contact with the substrate W supported by the fixing pin 103 is referred to as a lower position. Figure 23B shows the ejector pin 116 in the down position. The lower position is lower than the upper position. The jacking pin 116 is movable to the down position.

The substrate W is removed from the fixing pins 103 by moving the lift pins 116 upward from the lower position.

In this way, the jacking pin 116 moves between the upper position and the lower position. Thereby, the lift pins 116 deliver the substrate W to the fixing pins 103 , and the substrate W is removed from the fixing pins 103 .

See Figure 19. The first processing unit 7A includes a processing liquid supply unit 121 . The processing liquid supply unit 121 supplies the processing liquid to the substrate W.

The processing liquid supply unit 121 includes a nozzle 122 . The nozzle 122 discharges the processing liquid toward the substrate W. The nozzle 122 is provided so as to be movable to the processing position and the retracted position. The nozzle 122 in the processing position is shown in phantom in FIG. 19 . In FIG. 19, the nozzle 122 in the retracted position is indicated by a solid line. The processing position is held at a position above the substrate W of the first substrate holding portion 91A. When the nozzle 122 is located at the processing position, the nozzle 122 overlaps the substrate W held by the first substrate holding portion 91A in plan view. When the nozzle 122 is located at the retracted position, the nozzle 122 does not overlap the substrate W held by the first substrate holding portion 91A in plan view.

The processing liquid supply unit 121 includes piping 123 . The piping 123 supplies the processing liquid to the nozzle 122 . The piping 123 has a first end and a second end. The first end of the piping 123 is connected to the processing liquid supply source 124 . The second end of the pipe 123 is connected to the nozzle 122 .

The first processing unit 7A includes a flow rate adjustment unit 125 . The flow rate adjustment part 125 is provided in the piping 123 . The flow rate adjustment unit 125 adjusts the flow rate of the processing liquid supplied to the substrate W by the processing liquid supply unit 121 . That is, the flow rate adjustment unit 125 adjusts the flow rate of the processing liquid discharged from the nozzle 122 .

The first processing unit 7A includes a substrate detection unit 127 . The substrate detection unit 127 detects the substrate W supported by the fixing pins 103 . Furthermore, the board|substrate detection part 127 detects the position of the board|substrate W supported by the fixing pin 103. The board|substrate detection part 127 images the edge 20 of the board|substrate W supported by the fixing pin 103, for example. The substrate detection unit 127 is, for example, an image sensor. The board|substrate detection part 127 is arrange|positioned above the 1st board|substrate holding part 91A, for example.

Refer to Figure 2. The control unit 9 is associated with the first rotational drive unit 92A of the first processing unit 7A, the position adjustment pin 113 , the jacking pin 116 , the first blowing adjustment unit 111 , the second blowing adjustment unit 112 , the flow rate adjustment unit 125 and the substrate detection unit 127 is communicatively connected. The control part 9 receives the detection result of the board|substrate detection part 127. The control unit 9 controls the first rotational drive unit 92A, the position adjustment pin 113 , the jacking pin 116 , the first blowing adjustment unit 111 , the second blowing adjustment unit 112 , and the flow rate adjustment unit 125 .

The fixing pin 103 is an example of a support portion in the present invention. The position adjustment pin 113 is an example of a position adjustment portion in the present invention. The jacking pin 116 is an example of a lifter in the present invention.

FIG. 24 is a diagram schematically showing the configuration of the second processing unit 7B. FIG. 24 omits illustration of the protective cover 93 . The structure of the second processing unit 7B will be described in detail. In addition, about the same structure as the 1st processing unit 7A, the detailed description is abbreviate|omitted by attaching the same code|symbol.

The second board holding portion 91B includes the second plate 131 . The second plate 131 has a substantially disk shape. The second plate 131 has an upper surface 132 . The upper surface 132 is substantially horizontal. The upper surface 132 is generally flat.

The second rotational drive portion 92B is connected to the lower portion of the second plate 131 . The second rotational drive unit 92B rotates the second plate 131 . The second plate 131 is rotated around the rotation axis A5 by the second rotational drive portion 92B. The rotation axis A5 is parallel to the vertical direction Z. The rotation axis A5 passes through the center of the second plate 131 .

FIG. 25 is a plan view of the second plate 131 . The upper surface 132 of the second plate 131 is circular in plan view. The upper surface 132 of the second plate 131 is larger than the substrate W in plan view.

The second board holding portion 91B includes a plurality of (for example, six) edge contact pins 133 . The edge contact pins 133 are attached to the second plate 131 . The edge contact pins 133 are supported by the second plate 131 . The edge contact pin 133 is movable relative to the second plate 131 . The edge contact pins 133 can be in contact with the edge 20 of the substrate W. For example, when the second rotation drive portion 92B rotates the second substrate holding portion 91B, the edge contact pins 133 come into contact with the edge 20 of the substrate W. When the second rotary drive portion 92B rotates the second substrate holding portion 91B, the edge contact pins 133 hold the edge 20 of the substrate W so that the substrate W does not slide relative to the edge contact pins 133 . In FIG. 25, the substrate W held by the edge contact pins 133 is indicated by a broken line.

The edge contact pins 133 are arranged on the peripheral edge portion of the second plate 131 . The edge contact pins 133 are arranged on the circumference around the rotation axis A5 in plan view.

26A and 26B are detailed plan views of the edge contact pin 133. FIG. 27A, 27B are side views of the edge contact pin 133. The edge contact pin 133 and the configuration related to the edge contact pin 133 are illustrated.

Each edge contact pin 133 is fixed to the small piece portion 134, respectively. The small piece portion 134 is sufficiently smaller than the second plate 131 . The small piece portion 134 has a wedge shape in plan view. The small piece portion 134 extends in the horizontal direction.

The tab portion 134 in turn supports the lower surface contact pin 135 . The lower surface contact pins 135 are also fixed to the small pieces 134 . The edge contact pin 133 and the lower surface contact pin 135 respectively protrude upward from the small piece portion 134 . The lower surface contact pins 135 are in contact with the lower surface 16 of the substrate W. More specifically, the lower surface contact pins 135 are in contact with the lower surface 16 in the peripheral edge portion 12 of the substrate W. As shown in FIG. Thereby, the lower surface contact pins 135 support the substrate W. The lower surface contact pins 135 are not in contact with the upper surface 17 of the substrate W. The lower surface contact pins 135 allow the substrate W to move upward relative to the lower surface contact pins 135 .

The small piece portion 134 is fixed to the shaft portion 136 . The shaft portion 136 extends downward from the small piece portion 134 . The shaft portion 136 is supported by the second plate 131 . The edge contact pin 133 and the lower surface contact pin 135 are supported by the second plate 131 via the shaft portion 136 . The shaft portion 136 is rotatable relative to the second plate 131 . The shaft portion 136 is rotatable about the rotation axis A6. The rotation axis A6 is parallel to the vertical direction Z. The rotation axis A6 passes through the center of the shaft portion 136 .

The lower surface contact pin 135 is arranged on the rotation axis A6. The rotation axis A6 passes through the center of the lower surface contact pin 135 . When the shaft portion 136 rotates relative to the second plate 131 , the lower surface contact pin 135 also rotates relative to the second plate 131 . However, the position of the lower surface contact pin 135 with respect to the second plate 131 does not substantially change. The distance between the lower surface contact pin 135 and the rotation axis A5 does not change.

The edge contact pin 133 is arranged at a position eccentric from the rotation axis A6. When the shaft portion 136 rotates relative to the second plate 131 , the edge contact pin 133 moves in the horizontal direction relative to the second plate 131 . Specifically, the edge contact pin 133 is close to the rotation axis A5, and is away from the rotation axis A5.

Referring to FIGS. 26A and 27A . The edge contact pin 133 is brought into contact with the edge 20 of the substrate W supported on the lower surface contact pin 135 by the edge contact pin 133 approaching the rotation axis A5. Furthermore, the edge contact pin 133 can also push the edge 20 of the substrate W that is in contact with the edge contact pin 133 toward the rotation axis A5.

Referring to FIGS. 26B and 27B . By moving the edge contact pin 133 away from the rotation axis A5, the edge contact pin 133 is separated from the edge 20 of the substrate W supported by the lower surface contact pin 135.

When the second rotational drive portion 92B rotates the second substrate holding portion 91B, the edge contact pins 133 are not separated from the substrate W. As shown in FIG. In a state in which the edge contact pins 133 are in contact with the edge 20 of the substrate W, the second rotational drive portion 92B rotates the second substrate holding portion 91B. Thereby, when the second substrate holding portion 91B is rotated, the substrate W does not slide with respect to the edge contact pins 133 . That is, the edge contact pins 133 hold the edge 20 of the substrate W. As shown in FIG.

In the second substrate holding portion 91B, the lift pins 116 can support the substrate W at a position higher than the lower surface contact pins 135 . The lift pins 116 can hand over the substrate W to the lower surface contact pins 135 and can remove the substrate W from the lower surface contact pins 135 .

Furthermore, the second substrate holding portion 91B does not attract the substrate W held by the edge contact pins 133 . The second substrate holding portion 91B does not blow gas between the upper surface 132 of the second plate 131 and the lower surface 16 of the substrate W held by the edge contact pins 133 . The second plate 131 does not have a gas outlet.

Refer to Figure 2. The control unit 9 is connected so as to be able to communicate with the second rotational drive unit 92B of the second processing unit 7B, the ejector pin 116 , the flow rate adjustment unit 125 , and the edge contact pin 133 . The control unit 9 controls the second rotational drive unit 92B, the push-up pin 116 , the flow rate adjustment unit 125 , and the edge contact pin 133 .

The edge contact pin 133 is an example of the edge contact portion in the present invention.

<Operation example of the substrate processing apparatus 1> The following operation examples will be sequentially described. a) Operation example of the control unit 9 acquiring the shape of the substrate W b) Operation example of the conveying mechanism 4 c) Operation example of the conveying mechanism 8 d) Operation example of the first processing unit 7A e) Operation example of the second processing unit 7B

<Example of the operation of the control unit 9 to acquire the shape of the substrate W> FIG. 28 is a flowchart showing a procedure of an example of the operation of the control unit 9 to acquire the shape of the substrate W. As shown in FIG.

Step S1 The barcode reader 31 reads the barcode attached to the carrier C. The barcode reader 31 outputs the detection result of the barcode reader 31 to the control unit 9 .

step S2 The control unit 9 determines the shape of the substrate W based on the detection result of the barcode reader 31 . Specifically, the control unit 9 specifies which of the first substrate W1 , the second substrate W2 and the third substrate W3 the substrate W in the carrier C belongs to. The control unit 9 specifies which of the normal-diameter substrate WN and the large-diameter substrate WL the substrate W in the carrier C belongs to.

Furthermore, the control unit 9 also manages the position of the substrate W in association with the shape of the substrate W after the substrate W is unloaded from the carrier C. Specifically, the control part 9 manages the shape of the board|substrate W conveyed by the conveyance mechanisms 4 and 8 at each timing. The control part 9 manages the shape of the board|substrate W mounted on the mounting part 6 at each timing. The control unit 9 manages the shape of the substrate W processed by the processing unit 7 at each time. In order for the control unit 9 to manage the position of the substrate W and the shape of the substrate W, the control unit 9 may appropriately refer to the detection results of the substrate detection units 38 , 89 and 127 .

<Example of operation of conveyance mechanism 4> FIG. 29 is a flowchart showing the control of the control unit 9 and the procedure of the operation of the conveyance mechanism 4 .

Step S11 The control part 9 determines the height position of the hand part 33 when inserting the hand part 33 of the conveyance mechanism 4 into the carrier C. FIG. Specifically, the control unit 9 determines the height position of the hand 33 when the hand 33 of the conveying mechanism 4 is inserted between the two brackets 22 adjacent in the vertical direction Z. Hereinafter, the height position of the hand 33 when the hand 33 of the conveying mechanism 4 is inserted between the two brackets 22 adjacent in the vertical direction Z is abbreviated as "height position HA". The control part 9 changes the height position HA according to the shape of the board|substrate W. The control unit 9 changes the height position HA according to at least one of the shape of the substrate W taken out from the rack 22 by the transport mechanism 4 and the shape of the substrate W placed on the rack 22 by the transport mechanism 4 .

Specifically, when the substrate W removed from the rack 22 by the transport mechanism 4 or the substrate W placed on the rack 22 by the transport mechanism 4 is the first substrate W1, the control unit 9 determines the height position HA as the first height position HA1. When the substrate W removed from the rack 22 by the transport mechanism 4 or the substrate W placed on the rack 22 by the transport mechanism 4 is the second substrate W2, the control unit 9 determines the height position HA as the second height position HA2. When the substrate W removed by the transport mechanism 4 from the rack 22 or the substrate W placed on the rack 22 by the transport mechanism 4 is the third substrate W3, the control unit 9 determines the height position HA as the third height position HA3. The second height position HA2 is higher than the first height position HA1. The third height position HA3 is higher than the first height position HA1. The third height position HA3 is the same as the second height position HA2.

Similarly, the control part 9 determines the height position of the hand part 33 when the hand part 33 of the conveyance mechanism 4 is inserted in the mounting part 6. Specifically, the control unit 9 determines the height position of the hand 33 when the hand 33 of the conveying mechanism 4 is inserted between the two brackets 45 adjacent in the vertical direction Z. Hereinafter, the height position of the hand 33 when the hand 33 of the conveying mechanism 4 is inserted between the two brackets 45 adjacent in the vertical direction Z is abbreviated as "height position HB". The control part 9 changes the height position HB according to the shape of the board|substrate W. The control part 9 changes the height position HB according to at least one of the shape of the board|substrate W removed from the holder 45 by the conveyance mechanism 4 and the shape of the board|substrate W placed on the holder 45 by the conveyance mechanism 4.

Specifically, when the substrate W removed from the rack 45 by the transport mechanism 4 or the substrate W placed on the rack 45 by the transport mechanism 4 is the first substrate W1, the control unit 9 determines the height position HB as the first height position HB1. When the substrate W removed from the rack 45 by the transport mechanism 4 or the substrate W placed on the rack 45 by the transport mechanism 4 is the second substrate W2, the control unit 9 determines the height position HB as the second height position HB2. When the substrate W removed from the rack 45 by the transport mechanism 4 or the substrate W placed on the rack 45 by the transport mechanism 4 is the third substrate W3, the control unit 9 determines the height position HB as the third height position HB3. The second height position HB2 is higher than the first height position HB1. The third height position HB3 is higher than the first height position HB1. The third height position HB3 is the same as the second height position HB2.

Step S12 The control part 9 determines the insertion amount of the hand part 33 when the hand part 33 of the conveyance mechanism 4 is inserted between the two brackets 22 adjacent in the vertical direction Z. The insertion amount of the hand 33 inserted between the two brackets 22 adjacent in the vertical direction Z corresponds to when the hand 33 of the conveying mechanism 4 is inserted between the two brackets 22 adjacent in the vertical direction Z The amount of movement of the hand 33 in the front-back direction X of . Hereinafter, the insertion amount of the hand 33 inserted between the two brackets 22 adjacent in the vertical direction Z is abbreviated as "insertion amount KA". The control part 9 changes the insertion amount KA according to the shape of the board|substrate W. The control unit 9 changes the insertion amount KA according to at least one of the shape of the substrate W removed from the rack 22 by the transport mechanism 4 and the shape of the substrate W placed on the rack 22 by the transport mechanism 4 .

When the substrate W removed from the rack 22 by the transport mechanism 4 or the substrate W placed on the rack 22 by the transport mechanism 4 is the normal diameter substrate WN, the controller 9 determines the insertion amount KA as the first insertion amount KA1. When the substrate W removed from the rack 22 by the transport mechanism 4 or the substrate W placed on the rack 22 by the transport mechanism 4 is the large-diameter substrate WL, the controller 9 determines the insertion amount KA as the second insertion amount KA2. The second insertion amount KA2 is larger than the first insertion amount KA1.

Similarly, the control part 9 determines the insertion amount of the hand part 33 when the hand part 33 of the conveyance mechanism 4 is inserted between the two brackets 45 adjacent in the vertical direction Z. Hereinafter, the insertion amount of the hand 33 inserted between the two brackets 45 adjacent in the vertical direction Z will be abbreviated as "insertion amount KB". The control unit 9 changes the insertion amount KB according to the shape of the substrate W. The control unit 9 changes the insertion amount KB according to at least one of the shape of the substrate W removed from the rack 45 by the transport mechanism 4 and the shape of the substrate W placed on the rack 45 by the transport mechanism 4 .

When the substrate W removed from the rack 45 by the transport mechanism 4 or the substrate W placed on the rack 45 by the transport mechanism 4 is the normal diameter substrate WN, the controller 9 determines the insertion amount KB as the first insertion amount KB1. When the substrate W removed from the rack 45 by the transport mechanism 4 or the substrate W placed on the rack 45 by the transport mechanism 4 is the large-diameter substrate WL, the control unit 9 determines the insertion amount KB as the second insertion amount KB2. The second insertion amount KB2 is larger than the first insertion amount KB1.

Step S13 The control unit 9 determines the moving speed and acceleration of the hand 33 of the conveying mechanism 4 . Hereinafter, the moving speed of the hand portion 33 of the conveying mechanism 4 is abbreviated as "moving speed VA". Hereinafter, the acceleration of the hand 33 of the conveyance mechanism 4 is abbreviated as "acceleration AA". The control unit 9 changes the movement speed VA according to whether or not the substrate W is supported by the conveyance mechanism 4 . The control unit 9 changes the acceleration AA according to whether or not the substrate W is supported by the conveyance mechanism 4 .

When the control unit 9 determines the moving speed VA and the acceleration AA, the control unit 9 may appropriately refer to the detection result of the board detection unit 38 .

When the conveyance mechanism 4 supports the substrate W, the control unit 9 determines the moving speed VA as the first speed VA1. When the conveyance mechanism 4 is not supporting the substrate W, the control unit 9 determines the moving speed VA as the second speed VA2. The second speed VA2 is greater than the first speed VA1. For example, the first speed VA1 is equal to or less than 50% of the second speed VA2.

When the conveyance mechanism 4 supports the substrate W, the control unit 9 determines the acceleration AA as the first acceleration AA1. When the conveyance mechanism 4 does not support the substrate W, the control unit 9 determines the acceleration AA as the second acceleration AA2. The second acceleration AA2 is larger than the first acceleration AA1. For example, the first acceleration AA1 is equal to or less than 70% of the second acceleration AA2.

Step S14 The control part 9 controls the conveyance mechanism 4 (specifically, the hand drive part 34) based on the determined height position HA, HB, insertion amount KA, KB, moving speed VA, and acceleration AA.

Step S15 The hand drive unit 34 of the conveyance mechanism 4 moves the hand 33 under the control of the control unit 9 . Thereby, the conveyance mechanism 4 conveys the board|substrate W.

The following operation example will be specifically described. b1) An example of the operation of the conveyance mechanism 4 taking out the substrate W from the holder 22 of the carrier C b2) An example of the operation in which the transport mechanism 4 transports the substrate W from the carrier C to the mounting portion 6 b3) Operation example of the transport mechanism 4 placing the substrate W on the holder 45 of the placing portion 6

<<Example of the operation of the transfer mechanism 4 to remove the substrate W from the holder 22 of the carrier C>> 30A to 30D are diagrams schematically showing an example of the operation of the transfer mechanism 4 to take out the substrate W from the holder 22 of the carrier C. FIG.

See Figure 30A. The hand 33 does not support the substrate W. The hand 33 is moved to a position opposite to the carrier C. As shown in FIG. The hand 33 is adjusted to the height position HA determined by the control unit 9 .

See Figure 30B. The hand 33 enters into the interior of the carrier C. As shown in FIG. The hand 33 enters between the two brackets 22 adjacent in the vertical direction Z at the height position HA determined by the control unit 9 .

When the hand 33 enters the carrier C, the hand 33 moves in the horizontal direction. Specifically, the hand 33 moves in the front-rear direction X. The hand 33 moves forward. The first direction F1 in which the rod 36 extends corresponds to the moving direction of the hand 33 . In other words, the hand 33 enters between the two brackets 22 adjacent in the vertical direction Z while the first direction F1 is maintained as the moving direction of the hand 33 .

The hand 33 enters between the two brackets 22 adjacent in the vertical direction Z by the insertion amount KA determined by the control unit 9, and then stops.

In the procedure so far, the hand 33 moves at the second velocity VA2 and the second acceleration AA2.

See Figure 30C. The hand 33 moves upward. The hand 33 passes between the first bracket 23 and the second bracket 24 included in one bracket 22 . Thereby, the hand 33 takes out one substrate W from one holder 22 .

See Figure 30D. In the state where the substrate W is supported by the hand 33 , the hand 33 moves backward and is withdrawn to the outside of the carrier C. As shown in FIG. From this routine, the hand 33 moves at the first velocity VA1 and the first acceleration AA1.

In the above operation example, when the substrate W placed on the holder 22 belongs to the first substrate W1, the hand 33 enters between the two holders 22 adjacent in the vertical direction Z at the first height position HA1. When the substrate W placed on the holder 22 belongs to the second substrate W2, the hand 33 enters between the two holders 22 adjacent in the vertical direction Z at the second height position HA2. When the substrate W placed on the holder 22 belongs to the third substrate W3, the hand 33 enters between the two holders 22 adjacent in the vertical direction Z at the third height position HA3. When the substrate W placed on the holder 22 is the normal diameter substrate WN, the hand 33 enters between the two holders 22 adjacent in the vertical direction Z by the first insertion amount KA1, and then stops. When the substrate W placed on the holder 22 is the large-diameter substrate WL, the hand 33 enters between the two holders 22 adjacent in the vertical direction Z by the second insertion amount KA2, and then stops.

31A and 31B are diagrams showing the relationship between the substrate W placed on the holder 22 and the insertion height HA of the hand 33 . In FIG. 31A , the first substrate W1 is placed on the holder 22 . In FIG. 31B , the second substrate W2 or the third substrate W3 is placed on the holder 22 .

The first substrate W1 is more flexible than the second substrate W2 and the third substrate W3. Specifically, the first substrate W1 is curved so as to protrude downward. As described above, the first height position HA1 is lower than the second height position HA2 and the third height position HA3. Therefore, the hand 33 can enter between the two brackets 22 adjacent in the vertical direction Z without the hand 33 interfering with the first substrate W1.

The deflection amount of the second substrate W2 or the third substrate W3 is smaller than that of the first substrate W1. As described above, both the second height position HA2 and the third height position HA3 are higher than the first height position HA1. Therefore, the hand 33 can enter between the two brackets 22 adjacent in the vertical direction Z without the hand 33 interfering with the second substrate W2 or the third substrate W3.

<<Example of the operation of the transport mechanism 4 to transport the substrate W from the carrier C to the mounting portion 6>> The hand 33 is moved from the carrier C to the placing portion 6 in a state in which the hand 33 supports the substrate W. Thereby, the conveyance mechanism 4 conveys the board|substrate W from the carrier C to the mounting part 6. When the conveyance mechanism 4 conveys the substrate W from the carrier C to the placement portion 6, the hand 33 moves at the first speed VA1 and the first acceleration AA1.

<<Example of the operation of the transport mechanism 4 to place the substrate W on the holder 45 of the placement portion 6>> 32A to 32D are diagrams schematically showing an example of the operation of the transport mechanism 4 to place the substrate W on the holder 45 of the placement portion 6 .

See Figure 32A. The hand 33 supports the substrate W. The hand portion 33 is moved to a position opposite to the placement portion 6 . The hand 33 is adjusted to the height position HB determined by the control unit 9 .

See Figure 32B. The hand 33 moves rearward. The hand 33 enters the mounting portion 6 . The hand 33 enters between the two brackets 45 adjacent in the vertical direction Z at the height position HB determined by the control unit 9 . The hand 33 enters between the two brackets 45 adjacent in the vertical direction Z by the insertion amount KB determined by the control unit 9, and then stops.

In the procedure so far, the hand 33 moves at the first velocity VA1 and the first acceleration AA1.

See Figure 32C. The hand 33 moves downward. The hand 33 passes between the first bracket 46 and the second bracket 47 included in one bracket 45 . Thereby, the hand 33 places one substrate W on one holder 45 . The hand 33 leaves the substrate W on the bracket 45 .

As described above, the interval ET between the brackets 45 is larger than the diameter D of the substrate W. As shown in FIG. Therefore, even if the position of the substrate W delivered by the hand 33 to the bracket 45 is deviated, the bracket 45 can preferably receive the substrate W.

The substrate W is guided by the first inclined surface 51 and the second inclined surface 55 of the holder 45 . Thereby, when the substrate W is placed on the holder 45, the substrate W is positioned at a predetermined position. Even if the position of the substrate W where the hand 33 is placed on the bracket 45 is deviated, the bracket 45 adjusts the position of the substrate W so that the deviation of the position of the substrate W becomes smaller.

See Figure 32D. In a state in which the hand 33 does not support the substrate W, the hand 33 moves forward and is withdrawn to the outside of the placement portion 6 . From this routine, the hand 33 moves at the second velocity VA2 and the second acceleration AA2.

In the above operation example, when the substrate W supported by the hand 33 belongs to the first substrate W1, the hand 33 enters between the two brackets 45 adjacent in the vertical direction Z at the first height position HB1. When the substrate W supported by the hand 33 belongs to the second substrate W2, the hand 33 enters between the two brackets 45 adjacent in the vertical direction Z at the second height position HA2. When the substrate W supported by the hand 33 belongs to the third substrate W3, the hand 33 enters between the two brackets 45 adjacent in the vertical direction Z at the third height position HA3. When the substrate W supported by the hand 33 is a normal diameter substrate WN, the hand 33 enters between the two brackets 45 adjacent in the vertical direction Z by the first insertion amount KB1, and then stops. When the substrate W supported by the hand 33 is the large-diameter substrate WL, the hand 33 enters between the two brackets 45 adjacent in the vertical direction Z by the second insertion amount KB2, and then stops.

The operation of the transport mechanism 4 to take out the substrate W from the bracket 45 of the placement portion 6 is substantially the same as the operation of the transport mechanism 4 to take out the substrate W from the bracket 22 of the carrier C. The operation of the conveyance mechanism 4 to place the substrate W on the holder 22 of the carrier C is substantially the same as the operation of the conveyance mechanism 4 to place the substrate W on the holder 45 of the placement portion 6 .

<Example of operation of conveying mechanism 8> FIG. 33 is a flowchart showing the control of the control unit 9 and the procedure of the operation of the conveyance mechanism 8 .

Step S21 The control part 9 determines the height position of the hand part 33 when the hand part 61 of the conveyance mechanism 8 is inserted in the mounting part 6. Specifically, the control unit 9 determines the height position of the hand 61 when the hand 61 of the conveying mechanism 8 is inserted between the two brackets 45 adjacent in the vertical direction Z. Hereinafter, the height position of the hand 61 when the hand 61 of the conveying mechanism 8 is inserted between the two brackets 45 adjacent in the vertical direction Z is abbreviated as "height position HC". The control part 9 changes the height position HC according to the shape of the board|substrate W. The control unit 9 changes the height position HC according to at least one of the shape of the substrate W removed from the rack 45 by the transport mechanism 8 and the shape of the substrate W placed on the rack 45 by the transport mechanism 8 .

Specifically, when the substrate W removed from the rack 45 by the transport mechanism 8 or the substrate W placed on the rack 45 by the transport mechanism 8 is the first substrate W1, the control unit 9 determines the height position HC as the first height position HC1. When the substrate W removed from the rack 45 by the transport mechanism 8 or the substrate W placed on the rack 45 by the transport mechanism 8 is the second substrate W2, the controller 9 determines the height position HC as the second height position HC2. When the substrate W removed from the rack 45 by the transport mechanism 8 or the substrate W placed on the rack 45 by the transport mechanism 8 is the third substrate W3, the control unit 9 determines the height position HC as the third height position HC3. The second height position HC2 is higher than the first height position HC1. The third height position HC3 is higher than the first height position HC1. The third height position HC3 is the same as the second height position HC2.

Step S22 The control part 9 determines the insertion amount of the hand part 61 when the hand part 61 of the conveyance mechanism 8 is inserted between the two brackets 45 adjacent in the vertical direction Z. The insertion amount of the hand 61 inserted between the two brackets 45 adjacent in the vertical direction Z corresponds to when the hand 61 of the conveying mechanism 8 is inserted between the two brackets 45 adjacent in the vertical direction Z The amount of movement of the hand 61 in the front-back direction X of . Hereinafter, the insertion amount of the hand 61 inserted between the two brackets 45 adjacent in the vertical direction Z will be abbreviated as "insertion amount KC". The control part 9 changes the insertion amount KC according to the shape of the board|substrate W. The control unit 9 changes the insertion amount KC according to at least one of the shape of the substrate W removed from the rack 45 by the transport mechanism 8 and the shape of the substrate W placed on the rack 45 by the transport mechanism 8 .

When the substrate W removed from the rack 45 by the transport mechanism 8 or the substrate W placed on the rack 45 by the transport mechanism 8 is the normal diameter substrate WN, the controller 9 determines the insertion amount KC as the first insertion amount KC1. When the substrate W removed from the rack 45 by the transport mechanism 8 or the substrate W placed on the rack 45 by the transport mechanism 8 is the large-diameter substrate WL, the controller 9 determines the insertion amount KC as the second insertion amount KC2. The second insertion amount KC2 is larger than the first insertion amount KC1.

Step S23 The control unit 9 determines the flow rate of the gas supplied to the suction unit 68 . Hereinafter, the flow rate of the gas supplied to the suction part 68 is abbreviated as "flow rate M". The control part 9 changes the flow rate M according to the shape of the board|substrate W conveyed by the conveyance mechanism 8.

Specifically, when the conveyance mechanism 8 conveys the first substrate W1, the control unit 9 adjusts the flow rate M to the first flow rate M1. When the conveyance mechanism 8 conveys the second substrate W2, the control unit 9 adjusts the flow rate M to the second flow rate M2. When the conveyance mechanism 8 conveys the third substrate W3, the control unit 9 adjusts the flow rate M to the third flow rate M3. The second flow rate M2 is larger than the first flow rate M1. The third flow rate M3 is larger than the first flow rate M1.

Step S24 The control unit 9 determines the processing unit 7 for processing the substrate W. More specifically, the control unit 9 determines the processing unit 7 for processing the substrate W as any one of the first processing unit 7A and the second processing unit 7B according to the shape of the substrate W.

Specifically, when the substrate W is the first substrate W1, the control unit 9 determines to process the substrate W by the first processing unit 7A. When the substrate W is the second substrate W2, the control unit 9 determines to process the substrate W by the second processing unit 7B. When the substrate W is the third substrate W3, the control unit 9 determines to process the substrate W by the second processing unit 7B.

Step S25 The control unit 9 determines the moving speed and acceleration of the hand 61 of the conveying mechanism 8 . Hereinafter, the moving speed of the hand 61 of the conveying mechanism 8 is abbreviated as "moving speed VB". Hereinafter, the acceleration of the hand 61 of the conveyance mechanism 8 is abbreviated as "acceleration AB". The control unit 9 changes the moving speed VB according to whether or not the substrate W is supported by the conveyance mechanism 8 . The control unit 9 changes the acceleration AB according to whether or not the substrate W is supported by the conveyance mechanism 8 .

When the control unit 9 determines the moving speed VB and the acceleration AB, the control unit 9 may appropriately refer to the detection result of the board detection unit 89 .

Specifically, when the substrate W is supported by the conveyance mechanism 8, the control unit 9 determines the moving speed VB as the first speed VB1. When the conveyance mechanism 8 does not support the substrate W, the control unit 9 determines the moving speed VB as the second speed VB2. The second speed VB2 is greater than the first speed VB1. For example, the first speed VB1 is 50% or less of the second speed VB2.

When the substrate W is supported by the conveyance mechanism 8, the control unit 9 determines the acceleration AB as the first acceleration AB1. When the transport mechanism 8 does not support the substrate W, the control unit 9 determines the acceleration AB as the second acceleration AB2. The second acceleration AB2 is greater than the first acceleration AB1. For example, the first acceleration AB1 is equal to or less than 70% of the second acceleration AB2.

Step S26 The control unit 9 controls the conveyance mechanism 8 (specifically, the hand drive unit 62 ) based on the determined height position HC, insertion amount KC, flow rate M, processing unit 7, moving speed VB, and acceleration AB. The determined processing unit 7 is any one of the first processing unit 7A and the second processing unit 7B. Specifically, the determined processing unit 7 is one determined from the first processing unit 7A and the second processing unit 7B.

Step S27 The hand 61 is moved by the hand drive unit 62 of the conveyance mechanism 8 under the control of the control unit 9 . Thereby, the conveyance mechanism 8 conveys the board|substrate W.

The following operation example will be specifically described. c1) Example of the operation of the conveyance mechanism 8 to take out the substrate W from the holder 45 of the placement portion 6 c2) An example of the operation in which the transport mechanism 8 transports the substrate W from the mounting portion 6 to the processing unit 7 c3) Operation example of the transfer mechanism 8 delivering the substrate W to the substrate holding portion 91 of the processing unit c4) Example of the operation in which the conveyance mechanism 8 takes out the substrate W from the substrate holding portion 91 of the processing unit 7 c5) Operation example of the conveyance mechanism 8 delivering the substrate W to the holder 45 of the placement portion 6

<<Example of the operation of the conveyance mechanism 8 to remove the substrate W from the holder 45 of the placement portion 6>> FIGS. 34A to 34D and FIGS. 35A to 35D are diagrams schematically showing an example of the operation of the conveyance mechanism 8 to remove the substrate W from the holder 45 of the placement portion 6 .

See Figure 34A. The hand 61 does not hold the substrate W. The suction adjustment unit 73 does not supply gas to the suction unit 68 . The suction part 68 does not blow out gas. The attracting portion 68 does not attract the substrate W. The second receiving portion 83 is located at the retracted position. The hand 61 is moved to a position facing the placing portion 6 . The hand 61 is adjusted to the height position HC determined by the control unit 9 .

See Figure 34B. The hand 61 moves forward. The hand 61 enters into the placement portion 6 . The hand 61 enters between the two brackets 45 adjacent in the vertical direction Z at the height position HC determined by the control unit 9 . The hand 61 enters between the two brackets 45 adjacent in the vertical direction Z by the insertion amount KC determined by the control unit 9, and then stops. When the hand 61 is stopped, the first receiving portion 82 and the second receiving portion 83 do not overlap with the substrate W placed on the holder 45 in plan view.

See Figure 34C. The hand 61 moves downward. The first receiving portion 82 and the second receiving portion 83 are placed on the side of the substrate W of the one holder 45 . The first receiving portion 82 and the second receiving portion 83 are moved to a position lower than the substrate W placed on the holder 45 . The suction portion 68 is close to the upper surface 17 of the substrate W. As shown in FIG.

See Figure 34D. The hand 61 moves slightly in the horizontal direction. Thereby, the 1st receiving part 82 moves to the position which overlaps with the board|substrate W mounted on the holder 45 in planar view. The second receiving portion 83 still does not overlap with the substrate W placed on the holder 45 in a plan view.

In the procedure so far, the hand 61 moves at the second velocity VB2 and the second acceleration AB2.

See Figure 35A. The suction adjustment unit 73 supplies gas to the suction unit 68 at the flow rate M determined by the control unit 9 . The suction part 68 makes the gas flow along the upper surface 17 of the substrate W. As shown in FIG. Thereby, the suction part 68 suctions the substrate W upward. The substrate W floats upward. The substrate W leaves the holder 45 . The upper surface 17 of the substrate W is in contact with the contact portion 74 . In this way, the hand 61 removes one substrate W from the holder 45 . The hand 61 holds the substrate W.

See Figure 35B. The hand 61 moves upward. From this routine, the hand 61 moves at the first velocity VB1 and the first acceleration AB1.

See Figure 35C. The receiving portion driving portion 86 moves the second receiving portion 83 from the retracted position to the falling-off preventing position. Thereby, both of the 1st receiving part 82 and the 2nd receiving part 83 overlap with the board|substrate W attracted by the attraction|suction part 68 in planar view.

Therefore, even if the substrate W leaves the contact portion 74 and falls downward, the receiving portion 81 receives the substrate W. That is, there is no possibility that the hand 61 may drop the substrate W.

See Figure 35D. In a state in which the substrate W is held by the hand 61 , the hand 61 moves backward and is withdrawn to the outside of the mounting portion 6 .

In the above operation example, when the substrate W placed on the holder 45 belongs to the first substrate W1, the hand 61 enters between the two holders 45 adjacent in the vertical direction Z at the first height position HC1. Furthermore, the suction adjustment part 73 supplies the gas to the suction part 68 at the first flow rate M1. When the substrate W placed on the holder 45 belongs to the second substrate W2, the hand 61 enters between the two holders 45 adjacent in the vertical direction Z at the second height position HC2. Furthermore, the suction adjustment part 73 supplies the gas to the suction part 68 at the second flow rate M2. When the substrate W placed on the holder 45 belongs to the third substrate W3, the hand 61 enters between the two holders 45 adjacent in the vertical direction Z at the third height position HC3. Furthermore, the suction adjustment part 73 supplies the gas to the suction part 68 at the third flow rate M3. When the substrate W placed on the holder 45 is the normal diameter substrate WN, the hand 61 enters between the two holders 45 adjacent in the vertical direction Z by the first insertion amount KC1, and then stops. When the substrate W placed on the holder 45 is the large-diameter substrate WL, the hand 61 enters between the two holders 45 adjacent in the vertical direction Z by the second insertion amount KC2, and then stops.

<<Example of the operation in which the transport mechanism 8 transports the substrate W from the mounting portion 6 to the processing unit 7>> The hand 61 holds the substrate W. Specifically, the suction adjustment unit 73 supplies the gas to the suction unit 68 at the flow rate M determined by the control unit 9 . When the substrate W held by the hand 61 is the first substrate W1, the suction adjustment unit 73 supplies the gas to the suction unit 68 at the first flow rate M1. When the substrate W held by the hand 61 is the second substrate W2 or the third substrate W3, the suction adjustment unit 73 supplies the gas to the suction unit 68 at the second flow rate M2. The suction part 68 makes the gas flow along the upper surface 17 of the substrate W. As shown in FIG. The suction part 68 sucks the substrate W.

The second receiving portion 83 is located at the drop-out preventing position. Both the first receiving portion 82 and the second receiving portion 83 overlap with the substrate W attracted by the attracting portion 68 in plan view.

The hand 61 is moved from the placing unit 6 to the processing unit 7 determined by the control unit 9 . Thereby, the conveyance mechanism 8 conveys the substrate W to the processing unit 7 determined by the control unit 9 . When the substrate W held by the hand 61 is the first substrate W1, the transport mechanism 8 transports the substrate W to the first processing unit 7A. When the substrate W held by the hand 61 is the second substrate W2 or the third substrate W3, the transport mechanism 8 transports the substrate W to the second processing unit 7B.

When the conveyance mechanism 8 conveys the substrate W from the placement unit 6 to the processing unit 7, the hand 61 moves at the first speed VB1 and the first acceleration AA1.

<<Example of the operation of the transfer mechanism 8 to deliver the substrate W to the substrate holding portion 91 of the processing unit 7>> 36A to 36F are diagrams schematically showing an example of the operation of the transfer mechanism 8 to deliver the substrate W to the substrate holding portion 91 of the processing unit 7 . In addition, regardless of whether the substrate holding portion 91 is the first substrate holding portion 91A or the second substrate holding portion 91B, the operation of the conveyance mechanism 8 to deliver the substrate W to the substrate holding portion 91 is the same.

See Figure 36A. The hand 61 holds the substrate W. Specifically, the suction adjustment unit 73 supplies the gas to the suction unit 68 at the flow rate M determined by the control unit 9 . The suction part 68 makes the gas flow along the upper surface 17 of the substrate W. As shown in FIG. The suction part 68 sucks the substrate W.

The second receiving portion 83 is located at the drop-out preventing position. The hand 61 enters into the interior of the processing unit 7 . The hand 61 is positioned above the substrate holding portion 91 . The jacking pin 116 is in the upper position.

See Figure 36B. The suction adjustment unit 73 stops supplying gas to the suction unit 68 . The suction part 68 stops sucking the substrate W. The substrate W falls downward. The receiving portion 81 receives the substrate W. More specifically, the first receiving portion 82 and the second receiving portion 83 receive the lower surface 16 of the substrate W. As shown in FIG. In this way, the suction of the substrate W is stopped by the suction portion 68 , and the substrate W is placed on the first receiving portion 82 and the second receiving portion 83 .

See Figure 36C. The hand 61 is moved slightly downward. Thereby, the first receiving portion 82 and the second receiving portion 83 deliver the substrate W to the ejector pins 116 . The lift pins 116 receive the substrate W from the receiving portion 81 . The lift pins 116 receive the substrate W at the upper position. The lift pins 116 support the substrate W at the upper position. The first receiving portion 82 and the second receiving portion 83 are moved to a position lower than the substrate W supported by the jacking pin 116 . The first receiving portion 82 and the second receiving portion 83 are separated from the substrate W supported by the ejector pins 116 .

In the procedure so far, the hand 61 moves at the first velocity VB1 and the first acceleration AB1.

See Figure 36D. The receiving portion driving portion 86 moves the second receiving portion 83 from the falling-off prevention position to the retracted position. Thereby, the 2nd receiving part 83 moves to the position which does not overlap with the board|substrate W supported by the push-up pin 116 in planar view. The first receiving portion 82 is still overlapped with the substrate W supported by the push-up pins 116 in a plan view.

See Figure 36E. The hand 61 moves slightly in the horizontal direction. Thereby, both the 1st receiving part 82 and the 2nd receiving part 83 are moved to the position which does not overlap with the board|substrate W supported by the push-up pin 116 in planar view. From this routine, the hand 61 moves at the second velocity VB2 and the second acceleration AB2.

See Figure 36F. The hand 61 moves upward. The first receiving portion 82 and the second receiving portion 83 are moved to a position higher than the substrate W supported by the jacking pin 116 by the side of the substrate W supported by the jacking pin 116 .

Thereafter, although illustration is omitted, in a state in which the hand 61 does not hold the substrate W, the hand 61 is separated from a position above the substrate holding portion 91 and withdrawn to the outside of the processing unit 7 .

<<Example of the operation of the conveyance mechanism 8 to remove the substrate W from the substrate holding portion 91 of the processing unit 7>> 37A to 37F are diagrams schematically showing an example of the operation in which the transfer mechanism 8 takes out the substrate W from the substrate holding portion 91 of the processing unit 7 . In addition, regardless of whether the substrate holding portion 91 is the first substrate holding portion 91A or the second substrate holding portion 91B, the operation of the transport mechanism 8 to remove the substrate W from the substrate holding portion 91 is the same.

Referring to Figure 37A. The hand 61 does not hold the substrate W. The suction adjustment unit 73 does not supply gas to the suction unit 68 . The suction part 68 does not cause the gas to flow along the upper surface 17 of the substrate W. As shown in FIG. The attracting portion 68 does not attract the substrate W. The second receiving portion 83 is located at the retracted position. The hand 61 enters into the interior of the processing unit 7 . The hand 61 is positioned above the substrate holding portion 91 . The lift pins 116 support the substrate W at the upper position. The first receiving portion 82 and the second receiving portion 83 do not overlap with the substrate W supported by the push-up pins 116 in plan view.

See Figure 37B. The hand 61 is moved slightly downward. The first receiving portion 82 and the second receiving portion 83 are supported by the side of the substrate W of the push-up pin 116 . The first receiving portion 82 and the second receiving portion 83 are moved to a position lower than the substrate W supported by the jacking pin 116 . The suction part 68 is close to the upper surface 17 of the substrate W. As shown in FIG.

See Figure 37C. The hand 61 moves slightly in the horizontal direction. Thereby, the 1st receiving part 82 moves to the position which overlaps with the board|substrate W supported by the push-up pin 116 in planar view. The second receiving portion 83 still does not overlap with the substrate W supported by the push-up pins 116 in a plan view.

See Figure 37D. The receiving portion driving portion 86 moves the second receiving portion 83 from the retracted position to the falling-off preventing position. Thereby, both of the 2nd receiving part 83 and the 1st receiving part 82 overlap with the board|substrate W attracted by the attracting part 68 in planar view.

In the procedure so far, the hand 61 moves at the second velocity VB2 and the second acceleration AB2.

See Figure 37E. The suction adjustment unit 73 supplies gas to the suction unit 68 at the flow rate M determined by the control unit 9 . The suction part 68 makes the gas flow along the upper surface 17 of the substrate W. As shown in FIG. Thereby, the suction part 68 suctions the substrate W upward. The substrate W floats upward. The substrate W leaves the ejector pins 116 . The upper surface 17 of the substrate W is in contact with the contact portion 74 . In this way, the hand 61 removes one substrate W from the ejector pins 116 . The hand 61 holds the substrate W.

See Figure 37F. In a state where the substrate W is held by the hand 61, the hand 61 moves upward.

From this routine, the hand 61 moves at the first velocity VB1 and the first acceleration AB1.

Thereafter, although illustration is omitted, in a state in which the substrate W is held by the hand 61 , the hand 61 is separated from a position above the substrate holding portion 91 and withdrawn to the outside of the processing unit 7 .

<<Example of the operation of the conveyance mechanism 8 to deliver the substrate W to the holder 45 of the placement portion 6>> FIGS. 38A to 38D and FIGS. 39A to 39D are diagrams schematically showing an example of the operation of the conveyance mechanism 8 to place the substrate W on the holder 45 of the placement portion 6 .

Referring to Figure 38A. The hand 61 holds the substrate W. The suction adjustment unit 73 supplies gas to the suction unit 68 at the flow rate M determined by the control unit 9 . The suction part 68 makes the gas flow along the upper surface 17 of the substrate W. As shown in FIG. The suction part 68 sucks the substrate W. The second receiving portion 83 is located at the drop-out preventing position. The hand 61 is moved to a position facing the placing portion 6 . The hand 61 is adjusted to the height position HC determined by the control unit 9 .

See Figure 38B. The hand 61 moves forward. The hand 61 enters into the placement portion 6 . The hand 61 enters between the two brackets 45 adjacent in the vertical direction Z at the height position HC determined by the control unit 9 . The hand 61 enters between the two brackets 45 adjacent in the vertical direction Z by the insertion amount KC determined by the control unit 9, and then stops.

See Figure 38C. The suction adjustment unit 73 stops supplying gas to the suction unit 68 . The attracting part 68 stops attracting the substrate W. The substrate W falls downward. The receiving portion 81 receives the substrate W. More specifically, the first receiving portion 82 and the second receiving portion 83 receive the lower surface 16 of the substrate W. As shown in FIG. In this way, the suction of the substrate W is stopped by the suction portion 68 , and the substrate W is placed on the first receiving portion 82 and the second receiving portion 83 .

See Figure 38D. The hand 61 is moved slightly downward. Thereby, the first receiving portion 82 and the second receiving portion 83 deliver the substrate W to the holder 45 . The holder 45 receives the substrate W from the receiving portion 81 . The holder 45 supports the substrate W. The first receiving portion 82 and the second receiving portion 83 are moved to positions lower than the substrate W supported by the bracket 45 . The first receiving portion 82 and the second receiving portion 83 are separated from the substrate W supported by the holder 45 .

In the procedure so far, the hand 61 moves at the first velocity VB1 and the first acceleration AB1.

See Figure 39A. The receiving portion driving portion 86 moves the second receiving portion 83 from the falling-off prevention position to the retracted position. Thereby, the 2nd receiving part 83 moves to the position which does not overlap the board|substrate W supported by the holder 45 in planar view. The first receiving portion 82 is still overlapped with the substrate W supported by the bracket 45 in a plan view.

See Figure 39B. The hand 61 moves slightly in the horizontal direction. Thereby, both of the 1st receiving part 82 and the 2nd receiving part 83 do not overlap with the board|substrate W supported by the holder 45 in planar view. From this routine, the hand 61 moves at the second velocity VB2 and the second acceleration AB2.

See Figure 39C. The hand 61 moves upward. The first receiving portion 82 and the second receiving portion 83 are moved to a position higher than the substrate W supported by the bracket 45 by being supported on the side of the substrate W of the bracket 45 .

See Figure 39D. In a state where the hand 61 does not hold the substrate W, the hand 61 retreats to the outside of the placement portion 6 .

<Example of operation of the first processing unit 7A> FIG. 40 is a flowchart showing a procedure of an example of the operation of the first processing unit 7A. FIG. 41 is a timing chart showing an example of the operation of the first processing unit 7A. t31 shown in FIG. 41 corresponds to the time when step S31 shown in FIG. 40 is executed. Similarly, t32-t35, t37-t39, and t41-t44 shown in FIG. 41 correspond to the times when steps S32-S35, S37-S39, and S41-S44 shown in FIG. 40 are executed, respectively. The operation of each element described below is controlled by the control unit 9 . A part of the operation example described below overlaps with the above-mentioned description of the operation example of the conveyance mechanism 8 .

Step S31 (time t31 ): the jack-up pin 116 rises The jacking pin 116 is moved to the upper position.

Step S32 (time t32 ): The lift pins 116 receive the substrate W from the conveyance mechanism 8 The transfer mechanism 8 delivers the substrate W to the ejector pins 116 . More specifically, the conveying mechanism 8 delivers one sheet of the first substrate W1 to the ejector pins 116 . The ejector pins 116 receive the substrate W from the conveyance mechanism 8 . The lift pins 116 support the substrate W at the upper position. The substrate W is located above the fixing pins 103 . The substrate W is not in contact with the fixing pins 103 .

Step S33 (time t33 ): The first blow-off port 105 starts blowing out gas The first blow-off adjustment unit 111 starts supplying gas to the first blow-off port 105 . The first blow-off port 105 starts blowing out gas. The first blow-off port 105 blows gas upward. The second blow-off adjustment unit 112 has not yet started supplying gas to the second blow-off port 106 . The second blow-off port 106 does not blow out gas.

Step S34 (time t34 ): the lifting pin 116 delivers the substrate W to the fixing pin 103 The jacking pin 116 moves from the upper position to the lower position. Thereby, the lift pins 116 lower the substrate W from a position higher than the fixing pins 103 . The jacking pins 116 deliver the substrate W to the fixing pins 103 . The fixing pins 103 receive the substrate W from the lift pins 116 . The fixing pins 103 support the substrate W. The lift pins 116 leave the substrate W supported by the fixing pins 103 .

Step S35 (time t35 ): the position adjustment pin 113 adjusts the position of the substrate W The position adjustment pin 113 moves from the retracted position to the adjustment position. Thereby, the position adjustment pins 113 come into contact with the substrate W supported by the fixing pins 103 . The position adjustment pins 113 adjust the position of the substrate W in the horizontal direction.

Step S36: Check the position of the substrate W. Check whether the position of the substrate W is in a predetermined position. Specifically, the substrate detection unit 127 detects the substrate W. The substrate detection unit 127 outputs the detection result of the substrate detection unit 127 to the control unit 9 . The control part 9 determines whether the board|substrate W is located in a predetermined position. When the control part 9 determines that the board|substrate W is located in a predetermined position, it progresses to step S37. Assuming that the control unit 9 determines that the substrate W is not located at the predetermined position, the control unit 9 executes abnormal processing without proceeding to step S37. The exception processing includes, for example, returning to step S35. Exception handling includes, for example, notifying the user that an exception has occurred.

Step S37 (time t36 ): The second blowing port 106 starts blowing out gas The second blow-off adjustment unit 112 starts supplying gas to the second blow-off port 106 . The second blowing port 106 starts blowing out gas. The second blow-off port 106 blows gas upward. The flow rate of the gas blown out from the second blowing port 106 is larger than the flow rate of the gas blown out from the first blowing port 105 .

Step S38 (time t38 ): the position adjustment pins 113 are separated from the substrate W The position adjustment pin 113 moves from the adjustment position to the retracted position. Thereby, the position adjustment pins 113 are separated from the substrate W. As shown in FIG.

Step S39 (time t39 ): processing the substrate W (supplying the processing liquid to the substrate W) The first rotation drive unit 92A rotates the first substrate holding unit 91A and the substrate W. The processing liquid supply unit 121 supplies the processing liquid to the substrate W supported by the fixing pins 103 . When the processing liquid supply unit 121 supplies the processing liquid to the substrate W, the first blowing port 105 also blows gas, and the second blowing port 106 blows the gas at a flow rate larger than that of the first blowing port 105 .

After a predetermined time has elapsed, the processing of the substrate is terminated. Then, it progresses to step S40.

Step S40: Check the position of the substrate W Check again whether the position of the substrate W is in the predetermined position. This step S40 is substantially the same as step S36.

Step S41 (time t41 ): The second blowing port 106 stops blowing gas The second blow-off adjustment unit 112 stops supplying gas to the second blow-off port 106 . The second blowing port 106 stops blowing gas.

Step S42 (time t42 ): the lifting pin 116 removes the substrate W from the fixing pin 103 The jacking pin 116 moves from the lower position to the upper position. Thereby, the lift pins 116 take out the substrate W from the fixing pins 103 . The lift pins 116 support the substrate W. The jack-up pins 116 lift the substrate W up. Specifically, the lift pins 116 lift the substrate W to a position higher than the fixing pins 103 . The substrate W is separated from the fixing pins 103 . The lift pins 116 support the substrate W at the upper position. The substrate W is supported at a position higher than the fixing pins 103 .

Step S43 (time t43 ): The first blowing port 105 stops blowing gas The first blow-off adjustment unit stops supplying gas to the first blow-off port 105 . The first blowing port 105 stops blowing out the gas.

Step S44 (time t44 ): The lift pins 116 deliver the substrate W to the transfer mechanism 8 . The conveyance mechanism 8 removes the substrate W from the ejector pins 116 . After that, the transport mechanism 8 transports the substrate W to the outside of the first processing unit 7A.

<Example of Operation of Second Processing Unit 7B> The operation example of the second processing unit 7B is similar to that obtained by omitting steps S33, S35-S38, and S40-S41 from the operation example of the first processing unit 7A. An example of the operation of the second processing unit 7B will be briefly described.

The jacking pin 116 is moved to the upper position. The lift pins 116 receive one substrate W (specifically, the second substrate W2 or the third substrate W3 ) from the conveyance mechanism 8 . The lift pins 116 deliver the substrate W to the lower surface contact pins 135 . The lower surface contact pins 135 support the substrate W. The edge contact pins 133 are in contact with the edge 20 of the substrate W supported by the lower surface contact pins 135 . Thereby, the edge contact pins 133 hold the substrate W.

The substrate W is processed while the substrate W is held on the edge contact pins 133 . Specifically, the second rotational drive unit 92B rotates the second substrate holding unit 91B and the substrate W. When the second rotary drive portion 92B rotates the second substrate holding portion 91B, the edge contact pins 133 hold the edge 20 of the substrate W so that the substrate W does not slide relative to the edge contact pins 133 . The processing liquid supply unit 121 supplies the processing liquid to the substrate W held by the edge contact pins 133 .

When the processing for the substrate W is completed, the edge contact pins 133 are separated from the substrate W. As shown in FIG. The lift pins 116 remove the substrate W from the lower surface contact pins 135 . The conveyance mechanism 8 removes the substrate W from the ejector pins 116 .

<Effect of the embodiment> The substrate processing method of the embodiment includes step S39 of supplying the processing liquid to the substrate W supported by the fixing pins 103 at a position above the upper surface 102 of the first plate 101 . In the step S39 of supplying the processing liquid to the substrate W, the gas is blown upward from the first outlet 105 formed in the center portion of the upper surface 102 of the first plate 101 and from the peripheral portion formed on the upper surface 102 of the first plate 102 . The second blowing port 106 blows gas upward at a flow rate larger than that of the first blowing port 105 .

The gas blown from the first outlet 105 and the second outlet 106 is supplied between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 . The gas flows along the lower surface 16 of the substrate W. Thereby, a downward force (attraction force) can be applied to the substrate W supported by the fixing pins 103, and the substrate W can be held preferably.

The gas blown from the first outlet 105 is blown to the lower surface 16 of the central portion of the substrate W, which can preferably prevent the lower surface 16 of the central portion of the substrate W from bending downward. Therefore, when the processing liquid is supplied to the substrate W, the contact between the substrate W and the upper surface 102 of the first plate 101 can be preferably prevented.

The second blower port 106 blows out gas at a larger flow rate than the first blower port 105 . The gas flows along the lower surface 16 of the peripheral portion 12 of the substrate W relatively rapidly. Thereby, a relatively strong suction force acts on the peripheral edge portion 12 of the substrate W. As shown in FIG. Therefore, when the processing liquid is supplied to the substrate W, the substrate W can be held more preferably.

As described above, when the processing liquid is supplied to the substrate W, the substrate W can be held without coming into contact with the first plate 101 . Therefore, the substrate W can be properly handled. Therefore, this substrate processing method can process the substrate W appropriately.

The substrate processing method includes step S34 of handing over the substrate W to the fixing pins 103 . In step S34 of handing over the substrate W to the fixing pins 103 , the gas is blown upward from the first blowing port 105 . Therefore, the contact between the substrate W and the upper surface 102 of the first board 101 can be preferably prevented when the substrate W is handed over to the fixing pins 103 .

In step S34 of handing over the substrate W to the fixing pins 103 , the gas is not blown out from the second outlet 106 . Therefore, the attractive force acting on the substrate W is relatively weak. Therefore, the substrate W can be properly handed over to the fixing pins 103 . For example, when the substrate W is handed over to the fixing pins 103 , the substrate W can be gradually landed on the fixing pins 103 .

The substrate processing method includes step S35 in which the position of the substrate W in the horizontal direction is adjusted by the position adjustment pins 113 coming into contact with the substrate W supported by the fixing pins 103 . In step S35 of adjusting the position of the substrate W, the gas is blown upward from the first outlet 105 . Therefore, it is possible to preferably prevent the substrate W from contacting the upper surface 102 of the first board 101 when the position of the substrate W is adjusted.

The step S35 of adjusting the position of the substrate W does not blow out the gas from the second outlet 106 . Therefore, the attractive force acting on the substrate W is relatively weak. Therefore, the position of the substrate W can be easily adjusted by the position adjustment pins 113 . Specifically, the position adjustment pins 113 can easily move the substrate W relative to the fixing pins 103 .

The substrate processing method includes step S38 in which the position adjustment pins 113 are separated from the substrate W supported by the fixing pins 103 . In step S38 of separating the position adjustment pins 113 from the substrate W, the gas is blown upward from the first outlet 105 , and the gas is blown upward from the second outlet 106 at a flow rate larger than that of the first outlet 105 . Therefore, the attractive force acting on the substrate W is relatively strong. Therefore, the substrate W can be preferably held before the position adjustment pins 113 leave the substrate W. As shown in FIG. The substrate W is preferably prevented from moving relative to the fixing pin 103 after the position adjusting pin 113 leaves the substrate W.

The step S39 of supplying the processing liquid to the substrate is performed in a state where the substrate W is not in contact with the position adjustment pins 113 . Accordingly, the processing quality of the substrate W can be preferably improved. For example, the occurrence of defects on the substrate W can be preferably suppressed.

The substrate processing method includes step S42 of removing the substrate W from the fixing pins 103 . The step S42 of removing the substrate W from the fixing pins 103 is to blow the gas upward from the first blowing port 105 . Therefore, when the substrate W is removed from the fixing pins 103, the substrate W can be preferably prevented from coming into contact with the upper surface 102 of the first board 101.

The step S42 of removing the substrate W from the fixing pins 103 does not blow out the gas from the second outlet 106 . Therefore, the attractive force acting on the substrate W is relatively weak. Therefore, the substrate W can be easily removed from the fixing pins 103 .

The substrate processing apparatus 1 includes a first processing unit 7A that processes the substrate W. The first processing unit 7A includes a first plate 101 , a fixing pin 103 , a first blow-off port 105 , a first blow-off adjustment unit 111 , a second blow-off port 106 , a second blow-off adjustment unit 112 , and a processing liquid supply unit 121 . The fixing pins 103 are fixed to the first plate 101 . The fixing pins 103 protrude upward from the upper surface 102 of the first plate 101 . The fixing pins 103 are in contact with the lower surface 16 of the substrate W. The fixing pins 103 mount the substrate W at a position higher than the upper surface 102 of the first board 101 . The 1st blower outlet 105 is formed in the center part of the upper surface 102 of the 1st board 101. The first air outlet 105 blows gas between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 . The first blow-off adjustment unit 111 adjusts the flow rate of the gas blown from the first blow-off port 105 . The second air outlet 106 is formed on the peripheral edge portion of the upper surface 102 of the first plate 101 . The second outlet 106 blows gas between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 . The second blowing adjustment unit 112 adjusts the flow rate of the gas blown out from the second blowing port 106 . The processing liquid supply unit 121 supplies the processing liquid to the substrate W supported by the fixing pins 103 .

The substrate processing apparatus 1 includes a control unit 9 that controls the first processing unit 7A. Specifically, the control unit 9 controls the first blowing adjustment unit 111 , the second blowing adjustment unit 112 , and the processing liquid supply unit 121 . Under the control of the control unit 9, when the processing liquid supply unit 121 supplies the processing liquid to the substrate W supported by the fixing pins 103, the first blowing port 105 blows gas, and the second blowing port 106 is larger than the first blowing port 105. The flow blows out the gas.

The gas blown from the first outlet 105 and the second outlet 106 is supplied between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 . The gas flows along the lower surface 16 of the substrate W. Thereby, a downward force (attraction force) can be applied to the substrate supported by the fixing pins 103, and the substrate W can be held more preferably.

The gas blown from the first outlet 105 is blown to the lower surface 16 of the central portion of the substrate W, which can preferably prevent the lower surface 16 of the central portion of the substrate W from bending downward. Therefore, it is possible to preferably prevent the substrate W from coming into contact with the upper surface 102 of the first plate 101 when the processing liquid supply unit 121 supplies the processing liquid to the substrate W.

The second blower port 106 blows out gas at a larger flow rate than the first blower port 105 . The gas flows along the lower surface 16 of the peripheral portion 12 of the substrate W relatively rapidly. Thereby, a relatively strong attraction force acts on the peripheral edge portion 12 of the substrate. Therefore, when the processing liquid supply unit 121 supplies the processing liquid to the substrate W, the substrate can be preferably held.

As described above, when the processing liquid is supplied to the substrate W, the substrate W can be held without coming into contact with the first plate 101 . Therefore, the substrate W can be properly handled. Therefore, the substrate processing apparatus 1 can process the substrate W appropriately.

Before the processing liquid supply unit 121 supplies the processing liquid to the substrate W supported by the fixing pins 103 , the first blowing port 105 starts blowing out the gas. Therefore, the processing liquid supply unit 121 can supply the processing liquid to the substrate W in a state in which the gas is blown out from the first outlet 105 .

Before the processing liquid supply unit 121 supplies the processing liquid to the substrate W supported by the fixing pins 103 , the second blowing port 106 starts blowing gas. Therefore, the processing liquid supply unit 121 can supply the processing liquid to the substrate W in a state in which the gas is blown out from the second outlet 106 .

After the processing liquid supply unit 121 supplies the processing liquid to the substrate W supported by the fixing pins 103 , the first blowing port 105 stops blowing out the gas. Therefore, the processing liquid supply unit 121 can supply the processing liquid to the substrate W in a state in which the gas is blown out from the first outlet 105 .

After the processing liquid supply unit 121 supplies the processing liquid to the substrate W supported by the fixing pins 103 , the second blowing port 106 stops blowing out the gas. Therefore, the processing liquid supply unit 121 can supply the processing liquid to the substrate W in a state in which the gas is blown out from the second outlet 106 .

When the fixing pins 103 receive the substrate W, the first outlet 105 blows out gas. Therefore, when the fixing pins 103 receive the substrate W, the substrate W can be preferably prevented from contacting with the upper surface 102 of the first board 101 .

When the fixing pins 103 receive the substrate W, the second outlet 106 does not blow out gas. Therefore, the attractive force acting on the substrate W is relatively weak. Therefore, when the fixing pins 103 receive the substrate W, the substrate W is not likely to be damaged.

Before the fixing pins 103 receive the substrate W, the first blowing port 105 starts blowing gas. Therefore, the fixing pins 103 can receive the substrate W in a state in which the gas is blown out from the first outlet 105 .

After the fixing pins 103 receive the substrate W, the second outlet 106 starts blowing gas. Therefore, the fixing pin 103 can receive the board|substrate W in the state which the 2nd blower outlet 106 does not blow out gas.

The first processing unit 7A includes the ejector pin 116 . The lift pins 116 are supported by the first plate 101 so as to be movable in the vertical direction Z with respect to the first plate 101 . The lift pins 116 support the substrate W. The jack-up pins 116 lower the substrate W. Specifically, the lift pins 116 lower the substrate W from a position higher than the fixing pins 103 . Thereby, the lift pins 116 deliver the substrate W to the fixing pins 103 . Here, when the fixing pins 103 receive the substrate W from the lift pins 116 , the first blowing port 105 blows gas. Therefore, when the fixing pins 103 receive the substrate W from the lift pins 116, the substrate W and the upper surface 102 of the first plate 101 can be prevented from contacting with certainty.

When the fixing pins 103 receive the substrate W from the lift pins 116, the second blowing port does not blow out gas. Therefore, the fixing pins 103 can properly receive the substrate W from the lift pins 116 .

The substrate processing apparatus 1 includes the conveyance mechanism 8 that delivers the substrate W to the ejector pins 116 . The control unit 9 further controls the conveying mechanism 8 . The ejector pins 116 receive the substrate W from the conveyance mechanism 8 . Specifically, the lift pins 116 receive the substrate W from the transport mechanism 8 at the upper position. Here, after the ejector pins 116 receive the substrate W from the conveyance mechanism 8, the first blowing port 105 starts blowing out the gas. Therefore, the ejector pins 116 can receive the substrate W from the transport mechanism 8 in a state in which the first outlet 105 does not blow out gas. Therefore, the lift pins 116 can properly receive the substrate W from the conveyance mechanism 8 .

Before the lift pins 116 deliver the substrate W to the fixing pins 103 , the first blowing port 105 starts blowing out the gas. Therefore, the fixing pins 103 can receive the substrate W from the ejector pins 116 in a state in which the gas is blown out from the first outlet 105 .

The first processing unit 7A includes a position adjustment pin 113 . The position adjustment pins 113 are supported by the first plate 101 so as to be movable in the horizontal direction with respect to the first plate 101 . The position adjustment pins 113 are in contact with the substrate W supported by the fixing pins 103 to adjust the position of the substrate W in the horizontal direction. When the position adjustment pin 113 adjusts the position of the substrate W supported by the fixing pin 103, the first blowing port 105 blows out gas. Therefore, it is possible to preferably prevent the substrate W from contacting the upper surface 102 of the first board 101 when the position adjustment pin 113 adjusts the position of the substrate W.

When the position adjustment pin 113 adjusts the position of the substrate W supported by the fixing pin 103, the second blowing port 106 does not blow out gas. Therefore, the attractive force acting on the substrate W is relatively weak. Therefore, the position of the substrate W can be easily adjusted by the position adjustment pins 113 .

After the position adjustment pin 113 adjusts the position of the board|substrate W supported by the fixing pin 103, the 2nd blower outlet 106 starts blowing out gas. Therefore, the position adjustment pin 113 can adjust the position of the substrate W in a state where the second outlet 106 does not blow out gas.

The position adjustment pins 113 are separated from the substrate W after the gas is blown out from the second outlet 106 . Therefore, the position adjustment pins 113 are separated from the substrate W in a state where the gas is blown out from the second outlet 106 . That is, the position adjustment pins 113 are separated from the substrate W in a state in which the substrate W is preferably held. Therefore, the movement of the substrate W relative to the fixing pins 103 can be preferably prevented when the position adjusting pins 113 are separated from the substrate W and after the position adjusting pins 113 are separated from the substrate W.

The position adjustment pins 113 are separated from the substrate W before the processing liquid supply unit 121 supplies the processing liquid to the substrate W supported by the fixing pins 103 . Therefore, the processing liquid supply unit 121 can supply the processing liquid to the substrate W in a state where the position adjustment pins 113 are separated from the substrate W. As shown in FIG. Therefore, the processing quality of the substrate W can be preferably improved.

When the substrate W is removed from the fixing pins 103, the first blowing port 105 blows gas. Therefore, when the substrate W is removed from the fixing pins 103, the substrate W can be preferably prevented from coming into contact with the upper surface 102 of the first board 101.

When the substrate W is removed from the fixing pins 103, the second outlet 106 does not blow out gas. Therefore, when the substrate W is removed from the fixing pins 103, the attractive force acting on the substrate W is relatively weak. Therefore, the substrate W can be easily removed from the fixing pins 103 .

Before the substrate is removed from the fixing pins 103, the second blowing port 106 stops blowing out the gas. Therefore, the board|substrate W can be taken out from the fixing pin 103 in the state in which the 2nd blower outlet 106 does not blow out gas.

After the substrate W is removed from the fixing pins 103, the first blowing port 105 stops blowing out the gas. Therefore, the substrate W can be taken out from the fixing pins 103 in a state in which the gas is blown out from the first outlet 105 .

The lift pins 116 take the substrate W from the fixing pins 103 . The jack-up pins 116 lift the substrate W up. Specifically, the lift pins 116 lift the substrate W to a position higher than the fixing pins 103 . Here, when the ejector pin 116 removes the substrate W from the fixing pin 103, the first blowing port 105 blows out the gas. Therefore, the contact of the substrate W with the upper surface 102 of the first board 101 can be preferably prevented when the lift pins 116 remove the substrate W from the fixing pins 103 .

When the lift pins 116 remove the substrate W from the fixing pins 103, the second blowing port 106 does not blow out gas. Therefore, the lift pins 116 can easily take out the substrate W from the fixing pins 103 .

Before the lift pins 116 remove the substrate W from the fixing pins 103 , the second blowing port 106 stops blowing out the gas. Therefore, the ejector pins 116 can take out the substrate W from the fixing pins 103 in a state in which the second outlet 106 does not blow out gas.

The transfer mechanism 8 removes the substrate from the ejector pins 116 . The ejector pins 116 deliver the substrate W to the transfer mechanism 8 . Specifically, after the lift pins 116 take out the substrate W from the fixing pins 103 , the lift pins 116 deliver the substrate W to the transfer mechanism 8 . The ejector pins 116 deliver the substrate W to the transfer mechanism 8 at the upper position. Here, after the lift pins 116 take out the substrate W from the fixing pins 103, the first blowing port 105 stops blowing out the gas. Therefore, the lift pins 116 can take out the substrate W from the fixing pins 103 in a state in which the gas is blown out from the first outlet 105 .

Before the ejector pins 116 deliver the substrate W to the conveyance mechanism 8 , the first blowing port 105 stops blowing out the gas. Therefore, the ejector pins 116 can deliver the substrate W to the conveying mechanism 8 in a state where the first outlet 105 does not blow out gas. Therefore, the lift pins 116 can preferably deliver the substrate W to the conveying mechanism 8 .

The conveying mechanism 8 includes a suction part 68 . The suction part 68 makes the gas flow along the upper surface 17 of the substrate W. As shown in FIG. The suction portion 68 sucks the substrate W without contacting the substrate W. As shown in FIG. Therefore, the substrate W can be favorably supported by the conveyance mechanism 8 (hand 61 ).

The conveyance mechanism 8 includes a suction adjustment unit 73 . The suction adjustment part 73 adjusts the flow rate of the gas supplied to the suction part 68 . Therefore, the suction adjustment part 73 can adjust the suction force of the suction part 68 .

When the substrate W is conveyed by the conveyance mechanism 8 , the suction adjustment unit 73 supplies gas to the suction unit 68 . Therefore, when the substrate W is transferred by the transfer mechanism 8, the suction portion 68 can suck the substrate W preferably. Therefore, the conveyance mechanism 8 can convey favorably.

When the transfer mechanism 8 delivers the substrate W to the first processing unit 7A, the suction adjustment unit 73 does not supply gas to the suction unit 68 . Therefore, when the transfer mechanism 8 delivers the substrate W to the first processing unit 7A, the suction portion 68 does not attract the substrate W. Therefore, the transfer mechanism 8 can preferably deliver the substrate W to the first processing unit 7A.

When the transfer mechanism 8 delivers the substrate W to the first processing unit 7A, the second outlet 106 does not blow out gas. Therefore, the conveyance mechanism 8 can better hand over the substrate W to the first processing unit 7A.

When the transport mechanism 8 takes out the substrate W from the first processing unit 7A, the flow rate of the gas blown out from the first outlet 105 is smaller than the flow rate of the gas supplied to the suction part 68 . Therefore, when the transport mechanism 8 takes the substrate W from the first processing unit 7A, the suction part 68 can preferably attract the substrate W of the first processing unit 7A. Therefore, the conveyance mechanism 8 can easily take out the substrate W from the first processing unit 7A.

When the conveyance mechanism 8 takes out the substrate W from the first processing unit 7A, the second outlet 106 does not blow out gas. Therefore, the transfer mechanism 8 can take out the substrate W from the first processing unit 7A more easily.

The first processing unit 7A includes a first rotational drive unit 92A that rotates the first plate 101 . When the processing liquid supply part 121 supplies the processing liquid to the substrate W supported by the fixing pins 103 , the first rotation driving part 92A rotates the first plate 101 . Therefore, the first processing unit 7A can process the substrate W appropriately.

The present invention is not limited to the embodiment, but can be modified and implemented as follows.

In the above embodiment, the holder 22 is in contact with the lower surface 16 of the substrate W. As shown in FIG. However, it is not limited to this. For example, the bracket 22 may also be in contact with at least any one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the bracket 22 can also contact the edge 20 of the substrate W from obliquely below.

In the above-described embodiment, the hand portion 33 is in contact with the lower surface 16 of the substrate W. As shown in FIG. However, it is not limited to this. For example, the hand 33 may also be in contact with at least any one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the hand 33 may also contact the edge 20 of the substrate W from an obliquely downward direction.

In the above-mentioned embodiment, the holder 45 is in contact with the lower surface 16 of the substrate W. As shown in FIG. However, it is not limited to this. For example, the bracket 45 may also be in contact with at least any one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the bracket 45 can also contact the edge 20 of the substrate W from obliquely below.

In the above-described embodiment, the contact portion 74 is in contact with the upper surface 17 of the substrate W. As shown in FIG. However, it is not limited to this. For example, the contact portion 74 may also be in contact with at least any one of the upper surface 17 of the substrate W and the edge 20 of the substrate W. As shown in FIG. For example, the contact portion 74 may also contact the edge 20 of the substrate W from obliquely above.

In the above-mentioned embodiment, the first receiving portion 82 can receive the lower surface 16 of the substrate W. As shown in FIG. However, it is not limited to this. For example, the first receiving portion 82 may also receive at least any one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. As shown in FIG. For example, the first receiving portion 82 may receive the edge 20 of the substrate W from an obliquely downward direction.

In the above-described embodiment, the second receiving portion 83 can receive the lower surface 16 of the substrate W. As shown in FIG. However, it is not limited to this. For example, the second receiving portion 83 may also receive at least any one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. As shown in FIG. For example, the second receiving portion 83 may receive the edge 20 of the substrate W from obliquely below.

In the above embodiment, the fixing pins 103 are in contact with the lower surface 16 of the substrate W. As shown in FIG. However, it is not limited to this. For example, the fixing pin 103 may also be in contact with at least any one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the fixing pin 103 may also contact the edge 20 of the substrate W from an obliquely downward direction.

In the above-described embodiment, the first receiving portion 82 is fixed to the base portion 65 . However, it is not limited to this. That is, the first receiving portion 82 may be movable relative to the base portion 65 . In this modified embodiment, the hand portion 61 may further include a drive portion (second support portion drive portion) that moves the first receiving portion 82 relative to the base portion 65 .

In the above-mentioned embodiment, the suction part 68 makes the gas flow along the upper surface 17 of the substrate W. As shown in FIG. The suction part 68 suctions the substrate W upward. However, it is not limited to this. The suction part 68 causes the gas to flow along the lower surface 16 of the substrate W. The suction part 68 may also attract the substrate W downward.

In the above-described embodiment, the hand portion 33 of the conveying mechanism 4 is not provided with the suction portion. However, it is not limited to this. The hand part 33 of the conveyance mechanism 4 may be provided with the suction part which makes a gas flow along the 1st surface of the board|substrate W. Here, the first surface is any one of the upper surface and the lower surface of the substrate W. The hand part 33 of the conveyance mechanism 4 may be provided with the attraction|suction part which attracts|sucks the board|substrate W. Furthermore, the conveyance mechanism 4 may be provided with the receiving part for preventing the board|substrate W from falling off from the hand part 33. As shown in FIG.

When the hand part 33 of the conveyance mechanism 4 is provided with a suction part, the conveyance mechanism 4 is also an example of the 1st conveyance mechanism in this invention. The carrier C is an example of the first position and the second position in the present invention. The placement portion 6 is another example of the first position and the second position in the present invention.

In the above-described embodiment, the control unit 9 changes the height positions HA, HB, and HC according to which of the first substrate W1, the second substrate W2, and the third substrate W3 the substrate W is. However, it is not limited to this. For example, the control unit 9 may also change the height positions HA, HB, and HC according to the thickness of the main portion 13 of the substrate W. For example, the control unit 9 may increase the height positions HA, HB, and HC as the thickness of the main portion 13 of the substrate W increases.

In the above-described embodiment, the control unit 9 determines the processing unit 7 for processing the substrate W as the first processing unit and the second processing unit according to which of the first substrate W1, the second substrate W2, and the third substrate W3 the substrate W is. either. However, it is not limited to this. For example, the control unit 9 may determine the processing unit 7 for processing the substrate W as any one of the first processing unit and the second processing unit according to the thickness of the main portion 13 of the substrate W. For example, the control part 9 may convey the board|substrate W which has the 1st thickness in the main part 13 of the board|substrate W to 7 A of 1st processing units. For example, the control part 9 may convey the board|substrate W whose main part 13 of the board|substrate W has a 2nd thickness which is larger than a 1st thickness to the 2nd processing unit 7B. For example, the control unit 9 may cause the main portion 13 of the substrate W to have the substrate W having the first thickness to be processed in the first processing unit 7A. The control part 9 can also make the main part 13 of the board|substrate W process the board|substrate W with the 2nd thickness which is larger than the 1st thickness in the 2nd processing unit 7B.

In the above-described embodiment, the control unit 9 changes the flow rate M according to which of the first substrate W1, the second substrate W2, and the third substrate W3 the substrate W is. However, it is not limited to this. For example, the control part 9 can also change the flow rate M according to the thickness of the main part 13 of the board|substrate W. For example, the control unit 9 may increase the flow rate M as the thickness of the main portion 13 of the substrate W increases.

In the above-described embodiment, the moving speed VA may be further subdivided. For example, the movement speed VA may be divided into the horizontal movement speed VAH, the vertical movement speed VAZ, and the rotation speed VAR. Here, the horizontal movement speed VAH is the movement speed of the hand 33 in the horizontal direction. The vertical movement speed VAZ is the movement speed of the hand 33 in the vertical direction Z. The rotation speed VAR is the movement speed of the hand 33 rotating around the rotation axis A1. The control unit 9 may individually determine the horizontal movement speed VAH, the vertical movement speed VAZ, and the rotation speed VAR in step S13.

In the above-mentioned embodiment, the acceleration AA may be further subdivided. For example, the acceleration AA may also be divided into horizontal acceleration AAH, vertical acceleration AAZ, and rotational acceleration AAR. Here, the horizontal acceleration AAH is the acceleration of the hand 33 in the horizontal direction. The vertical acceleration AAZ is the acceleration of the hand 33 in the vertical direction Z. As shown in FIG. The rotational acceleration AAR is the acceleration of the hand 33 rotating around the rotational axis A1. The control unit 9 may individually determine the horizontal acceleration AAH, the vertical acceleration AAZ, and the rotational acceleration AAR in step S13.

In the above-described embodiment, the moving speed VB may be further subdivided. For example, the movement speed VB may be divided into the horizontal movement speed VBH, the vertical movement speed VBZ, and the rotation speed VBR. Here, the horizontal movement speed VBH is the movement speed of the hand 61 in the horizontal direction. The vertical movement speed VBZ is the movement speed of the hand 61 in the vertical direction Z. The rotation speed VBR is the moving speed of the hand 61 rotating around the rotation axis A2. The control unit 9 may individually determine the horizontal movement speed VBH, the vertical movement speed VBZ, and the rotation speed VBR in step S25.

In the above-described embodiment, the acceleration AB may be further subdivided. For example, the acceleration AB may be divided into horizontal acceleration ABH, vertical acceleration ABZ, and rotational acceleration ABR. Here, the horizontal acceleration ABH is the acceleration of the hand 61 in the horizontal direction. The vertical acceleration ABZ is the acceleration of the hand 61 in the vertical direction Z. The rotational acceleration ABR is the acceleration of the hand 61 rotating around the rotational axis A2. The control unit 9 may individually determine the horizontal acceleration ABH, the vertical acceleration ABZ, and the rotational acceleration ABR in step S25.

In the said embodiment, the number of the 1st blower outlet 105 formed in the 1st board 101 is one. However, it is not limited to this. The number of the 1st blower outlet 105 formed in the 1st board 101 may be several.

In the above-described embodiment, the ejector pins 116 receive the substrate W from the conveyance mechanism 8 (step S32 ), and thereafter, the first outlet 105 starts blowing gas (step S33 ). However, it is not limited to this. For example, before the ejector pins 116 receive the substrate W from the conveyance mechanism 8 , the first blowing port 105 may start blowing out the gas. According to this modified embodiment, the ejector pins 116 can receive the substrate W from the transport mechanism 8 in a state in which the gas is blown out from the first outlet 105 .

In the said embodiment, the 1st blower outlet 105 stops blowing out gas (step S43), after that, the ejector pin 116 delivers the board|substrate W to the conveyance mechanism 8 (step S44). However, it is not limited to this. For example, after the ejector pins 116 hand over the substrate W to the conveying mechanism 8, the first blowing port 105 may stop blowing out the gas. According to this modified embodiment, the ejector pins 116 can deliver the substrate W to the transfer mechanism 8 in a state in which the gas is blown from the first outlet 105 .

In this modified embodiment, it is preferable that the flow rate of the gas blown out from the first blowing port 105 is smaller than the flow rate of the gas supplied to the suction part 68 of the conveying mechanism 8 . Accordingly, when the transport mechanism 8 removes the substrate W from the ejector pins 116 , the suction portion 68 can easily suck the substrate W. In other words, when the conveyance mechanism 8 removes the substrate W from the ejector pins 116 , the hand 61 can easily hold the substrate W.

In the above-described embodiment, the lift pins 116 receive the substrate W from the conveyance mechanism 8 . However, it is not limited to this. The fixing pins 103 may also receive the substrate W from the conveying mechanism 8 . In other words, the transfer mechanism 8 may directly deliver the substrate W to the fixing pins 103 without going through the ejector pins 116 .

In the above-described embodiment, the ejector pins 116 deliver the substrate W to the conveying mechanism 8 . However, it is not limited to this. The substrate W may also be handed over to the transfer mechanism 8 for the fixing pins 103 . In other words, the transfer mechanism 8 may directly take out the substrate W from the fixing pins 103 without going through the ejector pins 116 .

In the above-described embodiment, the first outlet 105 of the first processing unit 7A may discharge pure water in addition to gas.

FIG. 42 is a diagram schematically showing the configuration of the first processing unit 141 in the modified embodiment. In addition, about the same structure as 7A of 1st processing means of embodiment, the detailed description is abbreviate|omitted by attaching the same code|symbol.

The first processing unit 141 in the modified embodiment includes a pure water supply unit 142 . The pure water supply unit 142 discharges pure water toward the substrate W through the first outlet 105 .

The pure water supply unit 142 includes piping 143 . The piping 143 supplies pure water to the first blow-off port 105 . The piping 143 has a first end and a second end. The first end of the piping 143 is connected to the pure water supply source 144 . The second end of the piping 143 is connected to the first air outlet 105 .

The first processing unit 141 includes a flow rate adjustment unit 145 . The flow rate adjustment part 145 is provided in the piping 143 . The flow rate adjustment unit 145 adjusts the flow rate of the pure water supplied to the substrate W by the pure water supply unit 142 . That is, the flow rate adjustment unit 145 adjusts the flow rate of the pure water discharged from the first outlet 105 . The flow rate adjustment unit 145 is controlled by the control unit 9 .

The first blow-off port 105 may send out gas and pure water at the same time. Alternatively, the first blow-off port 105 may discharge pure water without blowing out gas. Accordingly, the pure water ejected from the first outlet 105 is ejected to the lower surface 16 of the central portion of the substrate W, and the lower surface 16 of the central portion of the substrate W can be prevented from being bent downward. Therefore, the contact between the substrate W and the upper surface 102 of the first plate 101 can be better prevented.

When supplying the processing liquid to the substrate W (step S39 ), the first outlet 105 may simultaneously send out gas and pure water. Alternatively, when the processing liquid is supplied to the substrate W (step S39 ), the first outlet 105 may discharge pure water without blowing out gas. Accordingly, it is possible to more preferably prevent the substrate W from contacting the upper surface 102 of the first plate 101 when the processing liquid supply unit 121 supplies the processing liquid to the substrate W.

In this modified embodiment, it is preferable that the space between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 is not filled with pure water (not liquid-tight). This is to allow the gas to flow into the space between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 , so that an appropriate attraction force acts on the substrate W supported by the fixing pins 103 .

In the above-described embodiment, the first blow-off port 105 may discharge the processing liquid in addition to the gas. The processing liquid supply unit 121 may discharge the processing liquid to the substrate W through the first blow-off port 105 .

FIG. 43 is a diagram schematically showing the configuration of the first processing unit 151 in the modified embodiment. In addition, about the same structure as 7A of 1st processing means of embodiment, the detailed description is abbreviate|omitted by attaching the same code|symbol.

The processing liquid supply unit 121 includes piping 153 . The piping 153 supplies the processing liquid to the first blow-off port 105 . The piping 153 has a first end and a second end. The first end of the piping 153 is connected to the processing liquid supply source 154 . The second end of the piping 153 is connected to the first air outlet 105 .

The first processing unit 141 includes a flow rate adjustment unit 155 . The flow rate adjustment part 155 is provided in the piping 153 . The flow rate adjustment unit 155 adjusts the flow rate of the processing liquid supplied to the substrate W by the processing liquid supply unit 121 . More specifically, the flow rate adjustment unit 155 adjusts the flow rate of the treatment liquid discharged from the first outlet 105 . The flow rate adjustment unit 155 is controlled by the control unit 9 .

When supplying the processing liquid to the substrate W (step S39 ), the first air outlet 105 may send out the gas and the processing liquid at the same time. Accordingly, the processing liquid can be supplied to the lower surface 16 of the substrate W. Therefore, the lower surface 16 of the substrate W can be preferably processed.

In this modified embodiment, it is preferable that the space between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 is not filled with treated water (not liquid-tight). This is for the purpose of applying an appropriate attractive force to the substrate W supported by the fixing pins 103 .

In the above-described embodiment, the control unit 9 acquires the shape of the substrate W based on the detection result of the barcode reader 31 . However, it is not limited to this. Four examples are shown below as modified embodiments in which the control unit 9 acquires the shape of the substrate W. FIG.

1st case The substrate processing apparatus 1 may also include a substrate information detection unit that reads substrate information added to the substrate W. The control part 9 can also judge the shape of the board|substrate W based on the detection result of the board|substrate information detection part. Here, the board information added to the board W is, for example, an identification code printed on the board W. The board information detection unit is, for example, a reader.

2nd case The substrate processing apparatus 1 may also include an imaging unit that images the substrate W. The control part 9 can also judge the shape of the board|substrate W based on the detection result of an imaging part. The imaging unit is, for example, a one-dimensional image sensor or a two-dimensional image sensor.

3rd case The control unit 9 may also acquire information related to the shape of the substrate W from an external device of the substrate processing apparatus 1 . An external device of the substrate processing apparatus 1 is, for example, a host computer. Before the control unit 9 acquires the information related to the shape of the substrate W from the external device, the control unit 9 may, for example, transmit the detection result of the barcode reader 31 to the external device. Before the control unit 9 acquires the information related to the shape of the substrate W from the external device, the control unit 9 may, for example, transmit the detection results of the substrate detection units 38 , 89 and 127 to the external device.

4th case The substrate processing apparatus 1 may also include an input unit capable of inputting information related to the shape of the substrate. The control part 9 can also acquire the information regarding the shape of the board|substrate W input to the input part.

In the third example or the fourth example, the information related to the shape of the substrate W may be information that directly indicates the shape of the substrate W. The information directly indicating the shape of the substrate W is, for example, information directly indicating which of the first substrate W1, the second substrate W2, and the third substrate W3 the substrate W belongs to. When the control part 9 has acquired the information which directly shows the shape of the board|substrate W, the control part 9 does not perform step S2 of determining the shape of the board|substrate W.

In the third example or the fourth example, the information related to the shape of the substrate W may be information indicating the shape of the substrate W indirectly. When the control part 9 has acquired the information which indirectly shows the shape of the board|substrate W, the control part 9 performs step S2 of determining the shape of the board|substrate W based on the information which indirectly shows the shape of the board|substrate W.

In the above-described embodiment, the control unit 9 executes step S11 of determining the height positions HA and HB, step S12 of determining the insertion amounts KA and KB, and step S13 of determining the moving speed VA and acceleration AA. However, it is not limited to this. For example, at least one of steps S11, S12, and S13 may be omitted. For example, the control unit 9 may not execute at least one of steps S11, S12, and S13.

In the above-described embodiment, the control unit 9 executes step S21 of determining the height position HC, step S22 of determining the insertion amount KC, step S23 of determining the flow rate M, step S24 of determining the processing unit 7, and determining the moving speed VB and acceleration AB. Step S25. However, it is not limited to this. For example, at least one of steps S21, S22, S23, S24, and S25 may be omitted. For example, the control unit 9 may not execute at least one of steps S21, S22, S23, S24, and S25.

In the above-mentioned embodiment, the structure of the conveyance mechanisms 4 and 8 was illustrated. However, it is not limited to this. For example, the conveyance mechanism 4 may be provided with a multi-joint arm instead of the rotation part 34d and the advance/retreat movement part 34e. The multi-joint arm is supported by the vertical moving part 34 c and supports the hand 33 . For example, the conveyance mechanism 4 may omit the rail 34a and the horizontal movement part 34b, and may be equipped with a stage or a support|pillar. A stage or a support column is fixedly installed and supports the vertical moving part 34c. For example, the conveyance mechanism 8 may be provided with a multi-joint arm instead of the rotating part 62c and the advancing and retreating moving part 62d. The multi-joint arm is supported by the vertical moving portion 62b and supports the hand 61 .

In the above-mentioned embodiment, the number of the conveyance mechanisms provided in the processing block 5 is one. However, it is not limited to this. The number of conveyance mechanisms provided in the processing block 5 may be two or more. That is, the processing block 5 may be equipped with two or more conveyance mechanisms. For example, several conveying mechanisms may also be provided in the conveying space 41 of the processing block 5 . For example, several conveyance mechanisms may be arrange|positioned so that it may line up in the front-back direction X. The number of processing units 7 can also be increased according to the number of conveying mechanisms in the processing block 5 . The number of the processing units 7 arranged in the front-rear direction X can also be appropriately changed.

About the above-mentioned embodiment and each modified embodiment, each configuration may be further changed as appropriate by substituting the configuration of other modified embodiment or combining with the configuration of other modified embodiment.

The present invention may be implemented in other specific forms without departing from its spirit or essence. Therefore, as an indication of the scope of the invention, reference should be made to the appended claims rather than the above description.

1: Substrate processing device

2: Transmission Department

3: Vehicle mounting part

4: Transfer mechanism (second transfer mechanism)

5: Process the block

6: Mounting part (1st position, 2nd position)

7: Processing unit (1st position, 2nd position)

7A, 141, 151: 1st processing unit

7B: 2nd processing unit

8: Conveying Mechanism (1st Conveying Mechanism)

9: Control Department

11: Substrate body

12: Peripheral part

13: Main Department

14: Recess

15: Protective plate

16: Lower surface

17: Top surface

18: 1st side

19: Side 2

20: end edge

21: Container

22,45: Bracket

23,46: 1st bracket

24,47: 2nd bracket

31: Barcode Reader

32,41: Transport space

33,61: Hands

34,62: Hand Drive

34a: Orbit

34b: Horizontal moving part

34c, 62b: Vertical moving part

34d, 62c: Rotary part

34e, 62d: Advance and retreat moving parts

35,64: Links

36: Rod

37,74: Contact Department

38, 89, 127: Board Inspection Department

42: 1st processing area

43: 2nd processing area

48: Support Wall

51: 1st inclined plane

51T: Upper end of the first inclined surface

51B: Lower end of the first inclined plane

51M: Middle point of the first inclined plane

52,56: Upper inclined plane

53,57: Lower slope

55: Second inclined plane

55B: Bottom

55M: Midpoint

62a: Pillar

65: base

66: Branch

68: Attraction Department

69: Attraction Pad

71: Gas supply path

72: Gas supply source

73: Attraction Adjustment Department

75: Contact Part 1

76: Contact Part 2

77: Wall

78: 1st Wall

79: 2nd Wall

80: 3rd wall

81: Undertaking Department

82: The 1st Undertaking Department

83: The 2nd Succession Department

86: Receiving part drive part

87: Actuator

88: Elastic member

91: Substrate holding part

91A: 1st board holding part

91B: Second board holding part

92: Rotary drive part

92A: 1st rotary drive unit

92B: 2nd rotary drive unit

93: protective cover

101: Board 1

102,132: Upper surface

103: Fixed pin (support part)

104: Gas blowing outlet

105: 1st outlet

106: 2nd outlet

107: 1st gas supply path

108: Second gas supply path

109: Gas supply source

111: 1st blowing adjustment section

112: The second blowing adjustment section

113: Position adjustment pin (position adjustment part)

114,136: Shaft

116: Lifting pin (lifting part)

121: Treatment liquid supply part

122: Nozzle

123, 143, 153: Piping

124: Treatment liquid supply source

125, 145, 155: Flow Adjustment Department

131: Plate 2

133: Edge contact pin (edge contact part)

134: Small Film Department

135: lower surface contact pin

142: Pure water supply department

144: Pure water supply source

154: Treatment liquid supply source

A1,A2,A3,A4,A5,A6: Rotation axis

C: Vehicle (1st position, 2nd position)

D: the diameter of the substrate

D1: The diameter of the normal diameter substrate

D2: Large diameter substrate

E1: the interval between the first bracket 23 and the second bracket 24 arranged in the horizontal direction

E2: The interval between the first bracket 46 and the second bracket 47 arranged in the horizontal direction (the interval between the first inclined surface and the second inclined surface in the horizontal direction)

ET: The distance between the upper end of the first inclined surface and the upper end of the second inclined surface in the horizontal direction

EB: The distance between the lower end of the first inclined surface and the lower end of the second inclined surface in the horizontal direction

EM: The distance between the middle point of the first inclined plane and the middle point of the second inclined plane in the horizontal direction

F1: 1st direction

F2: 2nd direction

F3: 3rd direction

F4: 4th direction

HA,HB,HC: height position

HA1, HB1, HC1: 1st altitude position

HA2, HB2, HC2: 2nd height position

HA3, HB3, HC3: 3rd altitude position

J: the center of the substrate

KA,KB: Insertion amount

KA1,KB1: the first insertion amount

KA2,KB2: 2nd insertion amount

L1: The overall length of the two rods in the second direction

L2: The length of the rod in the first direction

L3: The length of a rod in the second direction

T1, T2, T3: Thickness of the main part of the substrate

T4, T5, T6: Thickness of the peripheral portion of the substrate

VA,VB: Movement speed

VA1, VB1: 1st moving speed

VA2, VB2: 2nd movement speed

AA,AB: acceleration

AA1, AB1: 1st acceleration

AA2, AB2: 2nd acceleration

M: flow

M1: 1st flow

M2: 2nd flow

M3: 3rd flow

W: substrate

W1: 1st substrate

W2: 2nd substrate

W3: 3rd substrate

WL: Large diameter substrate

WN: normal diameter substrate

WD: Large diameter substrate

X: Front and rear direction

Y: width direction

Z: up and down direction

θ1: Angle of the upper inclined plane

θ2: Angle of the lower inclined plane

In order to explain the present invention, some aspects which are considered to be preferable at present are shown in the drawings, but it is hoped that the present invention is not limited to the configurations and countermeasures shown in the drawings. FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment. FIG. 2 is a control block diagram of the substrate processing apparatus. FIG. 3 is a top view of the substrate. 4A is a cross-sectional view of the first substrate, FIG. 4B is a cross-sectional view of the second substrate, and FIG. 4C is a cross-sectional view of the third substrate. FIG. 5A is a top view of a normal diameter substrate, and FIG. 5B is a top view of a large diameter substrate. Figure 6 is a front view of the vehicle. FIG. 7 is a top view of the support of the carrier. 8 is a left side view showing the configuration of the central portion of the substrate processing apparatus in the width direction. Figure 9 is a top view of the hand. Figure 10 is a side view of the hand. FIG. 11 is a left side view showing the structure of the left part of the substrate processing apparatus. Fig. 12 is a front view of the placement portion. Fig. 13 is a plan view of the holder of the placing portion. Fig. 14 is a detailed view of the holder of the placing portion. Figure 15 is a bottom view of the hand. 16A and 16B are side views of the hand, respectively. 17 is a top view of the suction part, the substrate attracted by the suction part, and the receiving part. Fig. 18 is a top view of the receiving portion. FIG. 19 is a diagram schematically showing the configuration of the first processing unit. Fig. 20 is a plan view of the first plate. 21A and 21B are detailed plan views of the position adjustment pins, respectively. 22A and 22B are side views of the position adjustment pins, respectively. Figures 23A and 23B are side views of the jacking pins, respectively. FIG. 24 is a diagram schematically showing the configuration of the second processing unit. Fig. 25 is a plan view of the second plate. Figures 26A and 26B are detailed plan views of edge contact pins. 27A and 27B are side views of edge contact pins. FIG. 28 is a flowchart showing a procedure for the operation of the control unit to acquire the shape of the substrate. FIG. 29 is a flowchart showing a program of the control of the control unit and the operation of the conveying mechanism. 30A to 30D are diagrams schematically showing an example of the operation of the transfer mechanism to remove the substrate from the support of the carrier. 31A and 31B are diagrams showing the relationship between the substrate placed on the holder and the insertion height of the hand. 32A to 32D are diagrams schematically showing an example of the operation of the conveying mechanism to remove the substrate from the holder of the placement portion. FIG. 33 is a flowchart showing the control of the control unit and the procedure of the operation of the conveying mechanism. 34A to 34D are diagrams schematically showing an example of the operation of the conveyance mechanism to take out the substrate from the holder of the placement portion. 35A to 35D are diagrams schematically showing an example of the operation of the conveyance mechanism to take out the substrate from the holder of the placement portion. 36A to 36F are diagrams schematically showing an example of the operation of the transfer mechanism to deliver the substrate to the substrate holding portion of the processing unit. 37A to 37F are diagrams schematically showing an example of the operation of the transfer mechanism to take out the substrate from the substrate holding portion of the processing unit. 38A to 38D are diagrams schematically showing an example of the operation of the transport mechanism to place the substrate on the holder of the placement portion. 39A to 39D are diagrams schematically showing an example of the operation of the transport mechanism to place the substrate on the holder of the placement portion. FIG. 40 is a flowchart showing a procedure of an example of the operation of the first processing unit. FIG. 41 is a timing chart showing an example of the operation of the first processing unit. FIG. 42 is a diagram schematically showing the configuration of the first processing unit in the modified embodiment. FIG. 43 is a diagram schematically showing the configuration of the first processing unit in the modified embodiment.

81: Undertaking Department

82: The 1st Undertaking Department

83: The 2nd Succession Department

J: the center of the substrate

W: substrate

Claims (25)

A substrate processing method, comprising the steps of supplying a processing liquid to a substrate supported by a support part at a position above an upper surface of a first plate, and the above-mentioned step of supplying the processing liquid to the substrate is formed in the above-mentioned The gas is blown upward from the first outlet in the center portion of the upper surface of the first plate, and is larger than the first outlet in the upward direction from the second outlet formed in the peripheral portion of the upper surface of the first plate. The flow rate blows out the gas. The substrate processing method according to claim 1, comprising the steps of delivering the substrate to the support portion, and the step of delivering the substrate to the support portion is blowing gas upward from the first outlet, and The gas was not blown out from the above-mentioned second outlet. The substrate processing method of claim 1, comprising the steps of: adjusting the position of the substrate in the horizontal direction by contacting the position adjusting portion with the substrate supported by the support portion, and the step of adjusting the position of the substrate is performed from The said 1st blower outlet blows gas upward, and gas is not blown out from the said 2nd blower outlet. The substrate processing method according to claim 3, comprising the steps of moving the position adjusting portion away from the substrate supported by the support portion, and the step of moving the position adjusting portion away from the substrate is directed upward from the first outlet. The gas is blown, and the gas is blown upward from the second blowing port at a flow rate larger than that of the first blowing port. The substrate processing method according to claim 3, wherein the step of supplying the processing liquid to the substrate is in a state in which the substrate is not in contact with the position adjusting portion Execute in state. The substrate processing method according to claim 1, comprising the steps of: taking out the substrate from the support part, and taking out the substrate from the support part by blowing gas upward from the first outlet, and The gas was not blown out from the above-mentioned second outlet. A substrate processing apparatus comprising: a first processing unit for processing a substrate; and a control unit for controlling the first processing unit; the first processing unit comprising: a first plate; and a support portion fixed to the first plate , protrudes upward from the upper surface of the first plate, contacts at least any one of the lower surface of the substrate and the edge of the substrate, and supports the substrate at a position higher than the upper surface of the first plate; the first air outlet , which is formed in the center portion of the upper surface of the first plate, and blows gas between the upper surface of the first plate and the lower surface of the substrate supported by the support portion; the first blowing adjustment portion adjusts the The flow rate of the gas blown out from the first outlet; a plurality of second outlets, which are formed on the peripheral edge portion of the upper surface of the first plate, toward the upper surface of the first plate and the substrate supported by the support portion The gas is blown between the above-mentioned lower surfaces; the second blow-off adjustment part adjusts the flow rate of the gas blown out from the second blow-out port; and the processing liquid supply part supplies the processing liquid to the substrate supported by the above-mentioned support part; In the control of the above-mentioned control part, the above-mentioned processing liquid supply part controls the base supported by the above-mentioned support part. When the plate is supplied with the treatment liquid, the first blowing port blows out gas, and the plurality of second blowing ports blow out gas at a flow rate larger than that of the first blowing port, and the plurality of second blowing ports are directed to the first plate by each of the plurality of second blowing ports. Gas is blown between the above-mentioned upper surface and the above-mentioned lower surface of the substrate supported by the above-mentioned support portion, and the substrate is sucked downward. The substrate processing apparatus according to claim 7, wherein when the support portion receives the substrate, the first blowing port blows gas, and the second blowing port does not blow gas. The substrate processing apparatus according to claim 7, wherein the first outlet starts blowing gas before the support portion receives the substrate, and after the support portion receives the substrate, the processing liquid supply portion supplies the substrate supported by the support portion Before the treatment liquid, the second blowing port starts blowing out gas. The substrate processing apparatus according to claim 7, wherein the first processing unit includes a position adjustment section, and the position adjustment section is supported by the first plate so as to be movable in a horizontal direction with respect to the first plate, and supported by the first plate. When the substrate of the support part contacts, adjusts the position of the substrate in the horizontal direction, and when the position adjustment part adjusts the position of the substrate supported by the support part, the first outlet blows gas, and the second outlet does not blow gas. The substrate processing apparatus according to claim 10, wherein after the position adjustment unit adjusts the position of the substrate supported by the supporting unit and before the processing liquid supply unit supplies the processing liquid to the substrate supported by the supporting unit, the second outlet Start blowing out gas. The substrate processing apparatus of claim 10, wherein, The position adjustment portion is separated from the substrate after the gas is blown out from the second outlet and before the processing liquid supply portion supplies the processing liquid to the substrate supported by the support portion. The substrate processing apparatus according to claim 7, wherein when the substrate is removed from the support portion, the first blowing port blows gas, and the second blowing port does not blow the gas. The substrate processing apparatus according to claim 7, wherein after the processing liquid supply part supplies the processing liquid to the substrate supported by the support part and before the substrate is taken out from the support part, the second blowing port stops blowing gas, and discharges the gas from the second outlet. After the said support part removes a board|substrate, the said 1st blower port stops blowing out gas. The substrate processing apparatus according to claim 7, wherein the first processing unit includes an elevating portion, and the elevating portion is supported by the first plate so as to be movable in the vertical direction relative to the first plate, and the substrate is lowered by lowering the substrate. When the substrate is handed over to the support portion and the support portion receives the substrate from the elevating portion, the first blowing port blows gas, and the second blowing port does not blow gas. The substrate processing apparatus according to claim 15, wherein the substrate processing apparatus includes a first conveying mechanism, the first conveying mechanism delivers the substrate to the elevating section, the control section further controls the first conveying mechanism, and the elevating section The first conveyance mechanism receives the substrate, and the first outlet starts blowing gas after the lifter receives the substrate from the first conveyance mechanism and before the lifter delivers the substrate to the support portion. The substrate processing apparatus according to claim 7, further comprising an elevating portion that supports the first plate so as to be movable in the vertical direction relative to the first plate, removes the substrate from the supporting portion, and elevates the substrate , and when the elevating portion removes the substrate from the support portion, the first blowing port blows gas, and the second blowing port does not blow gas. The substrate processing apparatus according to claim 17, wherein the second blowing port stops blowing gas after the processing liquid supply unit supplies the processing liquid to the substrate supported by the supporting unit and before the lifting unit removes the substrate from the supporting unit . The substrate processing apparatus according to claim 17, wherein the substrate processing apparatus includes a first conveying mechanism, the first conveying mechanism removes the substrate from the elevating portion, the control portion further controls the first conveying mechanism, and the elevating portion transfers the substrate to the substrate. After the lifter takes the substrate from the support part and before the lifter delivers the substrate to the first transport mechanism, the first outlet stops blowing gas. The substrate processing apparatus according to claim 7, wherein the substrate processing apparatus includes a first conveyance mechanism, the first conveyance mechanism conveys the substrate to the first processing unit, the control unit further controls the first conveyance mechanism, and the first conveyance The mechanism is provided with: a suction part which makes the gas flow along any one of the upper surface and the lower surface of the substrate, and sucks the substrate without contacting the substrate; and a suction adjustment part for adjusting the flow rate of the gas supplied to the suction part; when the first conveyance mechanism conveys the substrate, the suction adjustment part supplies gas to the suction part, and when the first conveyance mechanism delivers the substrate to the In the case of the first processing unit, the suction adjustment unit does not supply gas to the suction unit, and the second blowing port does not blow gas. The substrate processing apparatus according to claim 7, wherein the substrate processing apparatus includes a first conveyance mechanism, the first conveyance mechanism conveys the substrate to the first processing unit, the control unit further controls the first conveyance mechanism, and the first conveyance The mechanism is provided with: a suction part that makes gas flow along any one of the upper surface and the lower surface of the substrate to suck the substrate without contacting the substrate; and a suction adjustment part that adjusts the flow rate of the gas supplied to the suction part; when When the first conveyance mechanism removes the substrate from the first processing unit, the flow rate of the gas blown out from the first blowing port is smaller than the flow rate of the gas supplied to the suction part, and the second blowing port does not blow out the gas. The substrate processing apparatus according to claim 7, wherein the first outlet can further discharge pure water toward the substrate. The substrate processing apparatus according to claim 22, wherein the processing liquid supply portion is movable to a processing position supported at a position above the substrate belonging to the support portion, and the processing liquid supply portion is supported by the support portion from the processing position. substrate supply At the time of liquid treatment, the first blowing port discharges pure water upward, and the second blowing port blows out gas at a larger flow rate than the gas blowing out of the first blowing port. The substrate processing apparatus according to claim 7, wherein the processing liquid supply unit is capable of discharging the processing liquid to the substrate through the first outlet. The substrate processing apparatus according to claim 7, wherein the first processing unit includes a first rotational drive unit, the first rotational drive unit rotates the first plate, and the processing liquid supply unit supplies the substrate supported by the support unit. When the processing liquid is supplied, the first rotational drive unit rotates the first plate.

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