TWI770466B - Three-dimensional surface detection method and semiconductor detection equipment - Google Patents

Abstract

The present invention provides a three-dimensional surface detection method and a semiconductor detection equipment. The three-dimensional surface detection method is provided for detecting an electronic component having two end surfaces and an annular surface arranged between the two end surfaces. The three-dimensional surface detection method includes an annular lateral surface detection step implemented by relatively moving the electronic component and a reflective component so as to dispose the electronic component between a reflective surface of the reflective component and a side viewing unit. The reflective surface defines a truncated cone space for receiving at least part of the annular surface, so that an image of the annular surface can reflected toward the side viewing unit by the reflective surface.

Description

Three-dimensional surface inspection method and semiconductor inspection equipment

The present invention relates to a detection method and detection equipment, in particular to a three-dimensional surface detection method and semiconductor detection equipment.

When the existing semiconductor inspection equipment and its inspection method are used for defect inspection on the ring side of an electronic component, the existing semiconductor inspection equipment needs to use a plurality of vision units to align and image different parts of the ring side of the electronic component, but the above The detection method is obviously too time-consuming. Furthermore, the types of electronic components that can be detected by the existing semiconductor testing equipment and its testing methods also have limitations, and it is difficult to meet the various electronic components that are increasing day by day.

Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.

The embodiments of the present invention provide a three-dimensional surface inspection method and a semiconductor inspection device, which can effectively improve the defects that may occur in the existing semiconductor inspection device and the inspection method.

An embodiment of the present invention discloses a three-dimensional surface detection method, which is used to detect an electronic component, and the outer surface of the electronic component includes two end surfaces and a ring side surface located between the two end surfaces. The three-dimensional surface detection method The method includes: a ring side detection step: making the electronic The element and a reflector are relatively moved to place the electronic element between a reflecting surface of the reflector and one side of the visual unit; wherein, the reflecting surface surrounds and forms a truncated cone-shaped space, and the At least a part of the side surface of the ring of the electronic component is located in the truncated cone-shaped space, so that the image of the side surface of the ring is projected to the side vision unit through the reflection of the reflective surface.

The embodiment of the present invention also discloses a semiconductor testing device, which is used for testing an electronic component, and the outer surface of the electronic component includes two end surfaces and a ring side surface located between the two end surfaces. The semiconductor testing device It includes: a reflector, the inner side of which includes a reflecting surface, and the reflecting surface surrounds a truncated cone-shaped space; a visual unit on one side is used to receive the light reflected from the reflecting surface; and a pick-and-place unit , can be used to hold and move the electronic component between the reflective surface and the side vision unit, so that at least part of the ring side is located in the frustoconical space, and the image of the ring side Projected to the side vision unit through the reflection of the reflective surface.

An embodiment of the present invention further discloses a semiconductor testing device, which is used for testing an electronic component, and the outer surface of the electronic component includes two end surfaces and a ring side surface located between the two end surfaces. The semiconductor testing device It includes: a reflector, the inner side of which includes a reflecting surface, and the reflecting surface surrounds a truncated cone-shaped space; a visual unit on one side is used to receive the light reflected from the reflecting surface; and a stage, used for placing the electronic components; wherein, when the electronic components are placed on the carrier, the reflector can be moved towards the electronic components so that at least part of the side of the ring is located on the stage inside the truncated cone-shaped space, and the image on the side surface of the ring is projected to the side vision unit through the reflection of the reflective surface.

To sum up, in the three-dimensional surface detection method and the semiconductor detection device disclosed in the embodiments of the present invention, a truncated cone-shaped space is formed on the reflection surface of the reflector, so that the electronic components located in the above-mentioned truncated cone-shaped space can pass the reflection The image of the side of the ring is projected to the side vision unit through the reflection of the surface, so that the side of the ring of the electronic component can be completely captured by the side vision unit. Accordingly, the three-dimensional surface inspection method and the semiconductor inspection apparatus can be applied to inspection of various types of electronic components.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.

100: Semiconductor testing equipment

1: Pick and place unit

11: Extractor

12: Bracket

2: Supply unit

3: Carrier

4: Correct the vision unit

5: Bearing unit

6: Reflector

61: Reflective surface

62: frustoconical space

63: Central axis

64: Through hole

7: Side Vision Unit

8: Bottom visual unit

P: annular projection area

E: electronic components

E1: end face

E2: Ring side

FIG. 1 is a schematic diagram of a semiconductor testing apparatus according to Embodiment 1 of the present invention.

FIG. 2 is a schematic plan view of the ring side of the electronic component in FIG. 1 projected onto the side vision unit.

FIG. 3 is a schematic diagram of the structural combination of the reflector and the side vision unit in FIG. 1 using aspect A. FIG.

FIG. 4 is a schematic diagram of the structural combination of the reflector and the side vision unit in FIG. 1 using aspect B. FIG.

FIG. 5 is a schematic diagram of the structural matching of the reflector and the side vision unit in FIG. 1 using aspect C. FIG.

FIG. 6 is a three-dimensional schematic diagram of the pick-and-place unit according to the first embodiment of the present invention.

FIG. 7 is a schematic diagram of a semiconductor testing device according to Embodiment 2 of the present invention.

FIG. 8 is a schematic diagram of a semiconductor testing device according to Embodiment 3 of the present invention.

The following are specific embodiments to illustrate the embodiments of the "three-dimensional surface inspection method and semiconductor inspection device" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention may be embodied in other different embodiments Embodiments are implemented or applied, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[Example 1]

Please refer to FIG. 1 to FIG. 6 , which are Embodiment 1 of the present invention. This embodiment discloses a three-dimensional surface inspection method and a semiconductor inspection apparatus 100, and the three-dimensional surface inspection method is implemented by the above-mentioned semiconductor inspection apparatus 100 in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the three-dimensional surface detection method may also be implemented by other detection devices.

Furthermore, as shown in FIG. 1 , the three-dimensional surface inspection method and the semiconductor inspection apparatus 100 are each used to inspect an electronic component E, and the outer surface of the electronic component E includes two end faces E1 and two end faces E1 located at two positions. A ring side E2 between the end faces E1. It should be noted that the types of electronic components that the existing semiconductor testing equipment and its testing methods are most unsuitable for testing are: the annular side surface of the electronic component contains a curved area, or the electronic component contains a cylindrical segment. Accordingly, the electronic component E in this embodiment is described as including a cylindrical segment (the corresponding ring side surface E2 is equivalent to including a curved surface area), but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the three-dimensional surface inspection method and the semiconductor inspection apparatus 100 may also be used to inspect electronic components in the shape of a square column. pieces.

In addition, in order to facilitate the description of this embodiment, the structure and functions of the semiconductor inspection apparatus 100 will be described below, and then the three-dimensional surface inspection method implemented by the semiconductor inspection apparatus 100 will be described. The semiconductor inspection apparatus 100 in this embodiment is mainly used to describe its components related to the three-dimensional surface inspection method, but the present invention is not limited thereto. That is, in other embodiments not shown in the present invention, the semiconductor inspection apparatus 100 may also include other components not described below.

The semiconductor inspection equipment 100 in this embodiment includes a pick and place unit 1 , a supply unit 2 , a stage 3 , a calibration vision unit 4 , a carrier unit 5 , a reflector 6 and a side vision unit 7 . . Wherein, the supply unit 2 , the carrier 3 , the reflector 6 , and the carrier unit 5 are located on the moving path of the pick-and-place unit 1 , the correction vision unit 4 is arranged corresponding to the carrier 3 , and the The side vision unit 7 is arranged corresponding to the reflector 6 .

The pick-and-place unit 1 is used to hold and move the electronic component E, so the pick-and-place unit 1 can be various components (eg, a robotic arm or an extractor) that can meet the above requirements, which is not limited in the present invention. Furthermore, the pick-and-place unit 1 is described by holding and moving a single electronic component E at one time in this embodiment, but in other embodiments not shown in the present invention, the pick-and-place unit 1 may also be capable of A structure for holding and moving a plurality of electronic components E at the same time.

The supply unit 2 (eg: a tray) is used for placing a plurality of the electronic components E, so that the pick-and-place unit 1 can extract the electronic components E from the supply unit 2 and move toward the carrier. Table 3 moves. When the electronic component E is placed on the above-mentioned carrier 3 , the carrier 3 can perform alignment correction on the electronic component E through the correction vision unit 4 . The correction vision unit 4 is, for example, an image capture device, and the stage 3 can relatively move the electronic component E according to the information obtained by the correction vision unit 4, so as to make the electronic component E in the predetermined position.

The inner side of the reflecting member 6 includes a reflecting surface 61, and the reflecting surface 61 surrounds A truncated cone-shaped space 62 is formed, and the side vision unit 7 (eg, an image capture device) is used to receive the light reflected from the reflection surface 61 . Wherein, the matching relationship between the reflector 6 and the side vision unit 7 is preferably: the side vision unit 7 is located directly below the reflection surface 61, and the side vision unit 7 is located in the reflection On a central axis 63 of the surface 61 , the size (or volume) of the frustoconical space 62 increases gradually from the direction away from the side vision unit 7 toward the side vision unit 7 .

Further, after the electronic component E is aligned and corrected, the pick-and-place unit 1 can be held by the carrier 3 and move the electronic component E to the reflective surface 61 and the side vision unit 7 so that the electronic component E is held by the pick-and-place unit 1 and at least part of the ring side E2 is located in the frustoconical space 62, and the image of the ring side E2 passes through the The reflection from the reflective surface 61 is projected onto the side vision unit 7 . Furthermore, the carrying unit 5 (eg, a substrate) is used for the pick-and-place unit 1 to place the electronic component E on the side view unit 7 after receiving the image of the ring side E2. on it.

More specifically, the image projected to the annular side surface E2 of the side vision unit 7 is a circular projection area P (eg, FIG. 2 ), and a center of the circular projection area P is relatively Preferably, it is located on the central axis 63 of the reflecting surface 61 . The specific structure of the reflector 6 and the side vision unit 7 can be adjusted and changed according to design requirements. In this embodiment, the specific structure of the reflector 6 and the side vision unit 7 is as follows Aspects A to C are described as examples, but the present invention is not limited thereto.

Aspect A: As shown in FIG. 3 , the relative position of the reflector 6 and the side vision unit 7 remains unchanged, and the reflector 6 forms a communication with the truncated cone-shaped space 62 along the central axis 63 There is a through hole 64, and the through hole 64 is used for the pick-and-place unit 1 and the electronic component E held by it to pass through.

Aspect B: As shown in FIG. 4 , the reflector 6 is disposed corresponding to the pick-and-place unit 1 , And the relative position of the reflective surface 61 and the pick-and-place unit 1 remains unchanged (that is, the reflector 6 is fixed to the pick-and-place unit 1 ); when the pick-and-place unit 1 holds the electronic component E , at least part of the ring side surface E2 remains within the truncated cone-shaped space 62 , and the reflective surface 61 and the electronic component E can be moved to the side vision unit 7 synchronously.

Aspect C: As shown in FIG. 5 , the reflector 6 is disposed corresponding to the pick-and-place unit 1 , the reflective surface 61 and the pick-and-place unit 1 can move toward the side vision unit 7 synchronously, and all The pick-and-place unit 1 can move relative to the reflector 6; the reflector 6 forms a through hole 64 along the central axis 63 that communicates with the truncated cone-shaped space 62, and the through hole 64 is used for the The pick-and-place unit 1 and the electronic components E held by it pass through.

In addition, the semiconductor inspection apparatus 100 is mainly described in this embodiment as including the above-mentioned elements related to the three-dimensional surface inspection method, but the semiconductor inspection apparatus 100 may be further provided with other elements according to design requirements. For example, the semiconductor inspection apparatus 100 may be provided with a vision unit (not shown) above the supply unit 2 and the carrier unit 5, respectively, for performing the relative alignment correction of the electronic components E; or, the semiconductor inspection apparatus 100 may also include a bottom vision unit 8 disposed corresponding to the moving path of the pick-and-place unit 1 for capturing the image of the end surface E1 of the electronic component E. FIG. Alternatively, in other embodiments not shown in the present invention, the reflector 6 , the side vision unit 7 , and the pick-and-place unit 1 can also be integrated as a module, and then used separately (eg, sold) or combined used by other components.

The semiconductor inspection apparatus 100 of the present embodiment has been described above, and the three-dimensional surface inspection method realized by the semiconductor inspection apparatus 100 described above will be described below. Among them, the technical features that have been mentioned in the description of the semiconductor testing apparatus 100 above will not be repeated in the following description. But it should be emphasized again that the three-dimensional surface detection method of the present invention can also be implemented by other detection devices.

Further, as shown in FIG. 1 , the three-dimensional surface detection method is in this embodiment It includes: a first transfer step S10, a pair alignment step S20, a second transfer step S30, a bottom surface detection step S40, and a ring side surface detection step S50. The specific implementation means and sequence of the above steps S10 to S50 can be adjusted and changed according to design requirements, and are not limited to those in this embodiment.

Furthermore, although the ring side detection step S50 is described in conjunction with the above-mentioned steps S10 to S40 in this embodiment, in other embodiments not shown in the present invention, the ring side detection step S50 may also be is combined with other different steps. Next, each step S10 to S50 of the three-dimensional surface detection method of this embodiment will be described below.

The first transfer step S10 : use the pick-and-place unit 1 to pick up an electronic component E from the supply unit 2 and move it to the carrier 3 .

The alignment correction step S20 : performing alignment correction on the electronic component E compared to the carrier 3 by the correction vision unit 4 ; The obtained information is used to relatively move the electronic component E, so that the electronic component E is located at a predetermined position.

The second transferring step S30 : using the pick-and-place unit 1 to move the electronic component E from the carrier 3 to the carrier unit 5 along a predetermined path. In this embodiment, the position of the electronic component E on the carrier 3 after the alignment correction step S20 is performed through the side vision unit 7 and the carrier 3 is defined as a first predetermined position, And the position where the electronic component E is arranged on the carrying unit 5 is defined as a second predetermined position.

In this embodiment, before the electronic component E is moved to the second predetermined position, the bottom surface detection step S40 and the ring side surface detection step S50 are performed, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the bottom surface detection step S40 may also be performed before the electronic component E is moved to the stage 3 . Next, embodiments of the bottom surface detection step S40 and the ring side surface detection step S50 will be described below.

The bottom surface detection step S40: in the process of implementing the second transfer step S30, so as to move the electronic component E from the first predetermined position to the second predetermined position, use the bottom vision The unit 8 captures an image of the end surface E1 of the electronic component E away from the pick and place unit 1 (eg, the end surface E1 at the bottom in FIG. 1 ).

The ring side surface detection step S50: the electronic component E and the reflector 6 are moved relative to each other, so as to place the electronic component E between the reflective surface 61 of the reflector 6 and the side vision unit 7 (eg : At least part of the annular side surface E2 of the electronic component E is located within the truncated cone-shaped space 62 ), so that the image of the annular side surface E2 is projected to the side vision through the reflection of the reflective surface 61 Unit 7.

Further, when the electronic component E has a curved area, the curved area is located within the truncated cone-shaped space 62 , and on a section of the electronic component E perpendicular to the central axis 63 , the A curvature center of the curved area is located on the central axis 63 . Alternatively, when the electronic component E has a cylindrical section, the cylindrical section is located within the frustoconical space 62 , and a center line of the cylindrical section overlaps the central axis 63 .

In more detail, the specific structure of the ring side detection step S50 can be adjusted and changed according to design requirements, and in this embodiment, the ring side detection step S50 is performed through the above-mentioned aspects A to C to be implemented and exemplified, but the present invention is not limited thereto.

Aspect A: As shown in FIG. 1 and FIG. 3 , the side vision unit 7 is arranged corresponding to the preset path, and the reflector is arranged corresponding to the side vision unit 7 , so that the reflective surface 61 is arranged The relative position to the side vision unit 7 remains unchanged. In the ring side surface detection step S50, the pick-and-place unit 1 moves the electronic component E into the reflector 6, so that at least part of the ring side surface E2 of the electronic component E is located at the cross section. within the conical space 62 .

Aspect B: As shown in FIG. 1 and FIG. 4 , the side vision unit 7 is set corresponding to the preset path; the reflector 6 is set corresponding to the pick-and-place unit 1 , and the reflecting surface 61 is connected to the said The relative position of the pick and place unit 1 remains unchanged. In the ring side surface detection step S50 , the pick-and-place unit 1 captures the electronic component E, so that at least part of the ring side surface E2 of the electronic component E remains within the frustoconical space 62 , and the reflective surface 61 and the electronic component E are moved to the side vision unit 7 synchronously.

Aspect C: As shown in FIG. 1 and FIG. 5 , the side vision unit 7 is set corresponding to the preset path; the reflector 6 is set corresponding to the pick-and-place unit 1 , and the reflecting surface 61 is connected to the The pick-and-place unit 1 can move synchronously along the preset path. In the ring side detection step S50 , when the pick and place unit 1 moves the electronic component E to a position corresponding to the side vision unit 7 , the pick and place unit 1 makes the electronic component E face each other. The reflector 6 moves and penetrates into the reflector 6 , so that at least part of the annular side surface E2 is located within the truncated cone-shaped space 62 .

It should be added that the pick-and-place unit 1 may be a single suction device to realize all the movement of the electronic component E from the supply unit 2 to the carrying unit 5; or, the pick-and-place unit 1 There may be a plurality of suckers to respectively realize all the movement of the electronic components E from the supply unit 2 to the carrying unit 5 .

For example, as shown in FIG. 6 , the pick-and-place unit 1 includes four suckers 11 disposed between the carrier plate 3 and the carrier unit 5 and at least four suckers 11 connected to the four suckers 11 . One bracket 12 , and the above-mentioned four suction devices 11 are arranged and moved in a circular shape through the above-mentioned at least one bracket 12 . Wherein, the carrier board 3 , the bottom vision unit 8 , the reflector 6 , and the carrier unit 5 may respectively correspond to the above-mentioned four suckers 11 , so as to be able to pass through the at least one bracket 12 . Rotate, so that the above-mentioned four suckers 11 synchronously perform related operations on the carrier board 3 , the bottom vision unit 8 , the reflector 6 , and the carrier unit 5 .

In addition, in other embodiments not shown in the present invention, the number of suction devices 11 included in the pick-and-place unit 1 may also exceed four, instead of corresponding to the above-mentioned carrier board 3 , the bottom vision unit 8 , and the The reflector 6 and the suction device 11 of the carrying unit 5 can be used for other detection operations. Industry. In addition, the multiple suction devices 11 and at least one bracket 12 of the pick-and-place unit 1 can also be replaced by multiple robotic arms.

[Example 2]

Please refer to FIG. 7 , which is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments will not be repeated. The main difference is that the positions of the reflector 6 and the side vision unit 7 in this embodiment are roughly corresponding to the moving path of the pick-and-place unit 1 before the carrier 3 .

Further, after the side vision unit 7 receives the image of the ring side E2, the pick-and-place unit 1 can move the electronic component E to the stage 3 for the correction The vision unit 4 can perform alignment correction on the electronic component E. The carrying unit 5 is used for the pick-and-place unit 1 to place the electronic component E thereon after the electronic component E is aligned and corrected.

In other words, the position of the electronic component E on the supply unit 2 is defined as a first predetermined position, and the position of the electronic component E on the carrier 3 is defined as a second predetermined position . Accordingly, the ring side surface detection step S50 is also implemented before the electronic component E is moved to the second predetermined position.

[Example 3]

Please refer to FIG. 8 , which is the third embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments will not be repeated. The main difference is that: the side vision unit 7 of this embodiment is arranged corresponding to the carrier 3 and has the function of the correction vision unit 4, while the reflector 6 is movably arranged on the carrier 3 on.

Further, the matching relationship between the reflector 6 and the side vision unit 7 is preferably: the side vision unit 7 is located directly above the reflection surface 61 , and the side vision unit 7 is seated On the central axis 63 of the reflection surface 61 , the size (or volume) of the truncated cone-shaped space 62 increases gradually from the carrier 3 toward the side vision unit 7 .

Furthermore, when the electronic component E is placed on the carrier 3, the carrier 3 can perform alignment correction on the electronic component E through the side vision unit 7 (that is, implement all The alignment correction step S20); and the reflector 6 can move toward the electronic element E after the electronic element E performs alignment correction, so that at least part of the ring side surface E2 is located in the truncated cone shape Inside the space 62 , and the image of the side surface E2 of the ring is projected to the side vision unit 7 through the reflection of the reflective surface 61 .

In other words, the position of the electronic component E on the carrier 3 after the alignment correction step S20 is performed on the carrier 3 through the side vision unit 7 and the carrier 3 is defined as the first predetermined position, The position where the electronic component E is disposed on the carrying unit 5 is defined as a second predetermined position. Accordingly, the ring side surface detection step S50 is also implemented before the electronic component E is moved to the second predetermined position. Further, in the ring side surface detection step S150, the reflector 6 may be moved toward the electronic element E located at the first predetermined position (or toward the electronic element E that has been subjected to the alignment correction step S20), so that the At least part of the ring side surface E2 of the electronic component E is located within the truncated cone-shaped space 62 , but the invention is not limited thereto.

For example, in other embodiments not shown in the present invention, the position of the electronic component E on the stage 3 but the alignment correction step S20 has not been performed can be defined as the first predetermined position, The position where the electronic component E is disposed on the carrying unit 5 is defined as a second predetermined position, so in the ring side surface detection step S150, the reflector 6 may be oriented and the alignment correction step S20 has not been performed. The electronic component E is moved so that at least part of the annular side surface E2 of the electronic component E is located within the frustoconical space 62 .

[Technical effects of the embodiments of the present invention]

To sum up, the three-dimensional surface detection method and semiconductor disclosed by the embodiments of the present invention Detection equipment, a truncated cone-shaped space is formed on the reflective surface of the reflector, so that the electronic components located in the truncated cone-shaped space can project the image of the side surface of the ring to the side vision unit through the reflection of the reflective surface, so as to The ring side of the electronic component can be completely imaged by the side vision unit. Accordingly, the three-dimensional surface inspection method and the semiconductor inspection apparatus can be applied to inspection of various types of electronic components.

The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

100: Semiconductor testing equipment

1: Pick and place unit

2: Supply unit

3: Carrier

4: Correct the vision unit

5: Bearing unit

6: Reflector

61: Reflective surface

62: frustoconical space

63: Central axis

64: Through hole

7: Side Vision Unit

8: Bottom visual unit

E: electronic components

E1: end face

E2: Ring side

Claims (17)

A three-dimensional surface detection method is used to detect an electronic component, and the outer surface of the electronic component includes two end surfaces and a ring side surface located between the two end surfaces, the three-dimensional surface detection method comprises: a ring side surface Detection step: the electronic component and a reflector are relatively moved, and a pick-and-place unit is used to place the electronic component between a reflective surface of the reflector and a visual unit on one side; wherein, the reflector A truncated cone-shaped space is formed around the surface, the electronic component is held by the pick-and-place unit and at least a part of the side surface of the ring is located in the truncated cone-shaped space, so that the image of the side surface of the ring can pass through the The reflection of the reflective surface is projected to the side vision unit; wherein, the pick-and-place unit can be used to move the electronic components to a carrier, so that the carrier can pass through a correction vision unit corresponding to it. to align the electronic components. The three-dimensional surface detection method according to claim 1, wherein the reflective surface defines a central axis; in the step of detecting the side surface of the ring, the image projected on the side surface of the ring of the side vision unit is in the shape of a circle An annular projection area, and a center of the annular projection area is located on the central axis. The three-dimensional surface detection method according to claim 2, wherein the ring side surface of the electronic component includes a curved surface area; in the ring side surface detection step, the curved surface area is located within the truncated cone-shaped space , and on a section of the electronic component perpendicular to the central axis, a center of curvature of the curved area is located on the central axis. The three-dimensional surface detection method according to claim 2, wherein the electronic component includes a cylindrical segment; in the step of detecting the side surface of the ring, the cylindrical segment is within the truncated cone-shaped space, and a center line of the cylindrical segment overlaps the center axis. The three-dimensional surface detection method according to claim 1, wherein the three-dimensional surface detection method comprises: a transfer step: using the pick-and-place unit to move the electronic component along a predetermined path from a first predetermined position moving to a second predetermined position, and performing the ring side detection step before the electronic component is moved to the second predetermined position. The three-dimensional surface detection method according to claim 5, wherein the side vision unit is arranged corresponding to the preset path, and the reflector is arranged corresponding to the side vision unit, so that the reflection surface and the The relative position of the side vision unit remains unchanged; in the ring side detection step, the pick-and-place unit moves the electronic component through the reflector, so that at least part of the ring of the electronic component The sides are located within the frustoconical space. The three-dimensional surface detection method according to claim 5, wherein the side vision unit is set corresponding to the preset path; the reflector is set corresponding to the pick-and-place unit, and the reflective surface is connected to the pick-and-place unit. The relative position of the placement unit remains unchanged; in the ring side surface detection step, the pick and place unit captures the electronic component, so that at least part of the ring side surface of the electronic component remains in the truncated cone shape within the space, and the reflective surface and the electronic components are moved to the side vision unit synchronously. The three-dimensional surface detection method according to claim 5, wherein the side vision unit corresponds to the preset path setting; the reflector corresponds to the pick-and-place list element setting, and the reflective surface and the pick-and-place unit can move synchronously along the preset path; in the ring side surface detection step, when the pick-and-place unit moves the electronic component to a position corresponding to the When the side vision unit is positioned, the pick-and-place unit moves the electronic component relative to the reflector and penetrates into the reflector, so that at least part of the annular side surface is located within the truncated cone-shaped space . The three-dimensional surface detection method according to claim 5, wherein the side vision unit is disposed corresponding to the carrier, and the electronic components are implemented on the carrier through the side vision unit and the carrier The position after the alignment step is defined as the first predetermined position; in the step of detecting the side surface of the ring, the reflector is moved toward the electronic component located at the first predetermined position, so that the At least part of the ring side of the electronic component is located within the frustoconical space. The three-dimensional surface detection method according to claim 5, wherein the three-dimensional surface detection method comprises: a bottom surface detection step: performing the transfer step, so that the electronic component faces from the first predetermined position toward During the movement of the second predetermined position, a bottom vision unit is used to capture the image of the end face of the electronic component away from the pick-and-place unit. A semiconductor testing device is used for testing an electronic component, and the outer surface of the electronic component includes two end surfaces and a ring side surface located between the two end surfaces, the semiconductor testing device comprises: a reflector, The inner side includes a reflective surface, and the reflective surface surrounds and forms a truncated cone-shaped space; A side vision unit, which is used to receive the light reflected from the reflective surface; a pick-and-place unit, which can be used to hold and move the electronic components between the reflective surface and the side vision unit, so that the The electronic component is held by the pick-and-place unit and at least a part of the side surface of the ring is located in the frustoconical space, and the image of the side surface of the ring is projected to the side by the reflection of the reflective surface Vision unit; a supply unit and a stage, the supply unit is used for placing a plurality of the electronic components, so that the pick-and-place unit can extract the electronic components from the supply unit and move toward the The carrier moves; and a correction vision unit is arranged corresponding to the carrier; wherein, the carrier can perform alignment correction on the electronic components through the correction vision unit. The semiconductor inspection device according to claim 11, wherein the relative position of the reflecting member and the side vision unit remains unchanged, the reflecting surface defines a central axis, and the reflecting member forms communication along the central axis A through hole to the frusto-conical space, and the through hole is used for the pick-and-place unit and the electronic component held by it to pass through. The semiconductor testing device according to claim 11, wherein the reflector is disposed corresponding to the pick-and-place unit, and the relative position of the reflective surface and the pick-and-place unit remains unchanged; when the pick-and-place unit When holding the electronic component, at least part of the side surface of the ring remains within the truncated cone-shaped space, and the reflective surface and the electronic component can be moved synchronously toward the side vision unit. The semiconductor inspection device according to claim 11, wherein the reflector is disposed corresponding to the pick-and-place unit, the reflective surface and the pick-and-place unit can move toward the side vision unit synchronously, and the pick-and-place unit can move toward the side vision unit. put unit can be relative to the inverse The reflective element moves; the reflective surface defines a central axis, and the reflective element forms a through hole that communicates with the truncated cone-shaped space along the central axis, and the through hole is used for the pick-and-place unit and its components. The held electronic components pass through. The semiconductor inspection device according to claim 11, wherein the reflective surface defines a central axis, the image projected to the side surface of the ring of the side vision unit is a circular projection area, and the circular ring A center of the projection area is located on the central axis. The semiconductor testing device according to claim 11, wherein after the electronic components are aligned and corrected, the pick-and-place unit can be held by the carrier and move the electronic components to the reflective surface and the between side vision units; the semiconductor inspection equipment includes: a carrying unit for the pick-and-place unit to place the electronic components after the side vision unit receives the image on the side of the ring on it. The semiconductor inspection apparatus of claim 11, wherein after the side vision unit receives the image of the side surface of the ring, the pick-and-place unit can move the electronic component to the stage, so that the The calibration vision unit can perform alignment and correction on the electronic components; the semiconductor inspection equipment includes: a carrying unit for the pick-and-place unit to align the electronic components after alignment and correction. Electronic components are placed thereon.

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