TWI768892B - Measurement and calibration system for cutting tool diameter and method thereof - Google Patents
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本發明是有關一種刀徑量測與校正技術,尤其是一種刀徑量測與校正系統及其方法。The invention relates to a tool diameter measurement and correction technology, in particular to a tool diameter measurement and correction system and a method thereof.
一般市面上的刀徑量測儀器/裝置大部分都是以視覺辨識或是遮蔽雷射寬度來判斷銑刀的直徑,這樣的刀徑量測儀器/設備的體積大且成本高,同時由於銑刀表面呈現鋸齒狀而並非是完整的圓柱狀,使得在量測刀具時會發生精度不足的問題,量測出來的數值都會有0.1~0.3mm的誤差而超出可容許的範圍內,並且隨著銑刀的尺寸及形式不同,會造成這種刀徑量測儀器/裝置在量測上的誤差。因此,發展一種精準度高、體積小、成本低的刀徑量測儀器/裝置是必要的。Generally, most of the tool diameter measuring instruments/devices on the market judge the diameter of the milling cutter by visual identification or shielding the width of the laser. Such tool diameter measuring instruments/equipment are bulky and expensive. The surface of the knife is serrated instead of a complete cylindrical shape, which makes the problem of insufficient precision when measuring the tool, and the measured value will have an error of 0.1~0.3mm, which is beyond the allowable range, and with the Different sizes and forms of milling cutters will cause errors in the measurement of this tool diameter measuring instrument/device. Therefore, it is necessary to develop a tool diameter measuring instrument/device with high accuracy, small size and low cost.
本發明提供的刀徑量測與校正系統及其方法,是具有體積小、低成本、高精度的優點。The tool diameter measurement and correction system and the method thereof provided by the present invention have the advantages of small size, low cost and high precision.
本發明所提供的刀徑量測與校正方法包括:透過旋轉設備夾持並旋轉第一銑刀、透過位移設備帶動旋轉設備沿著一方向水平移動、透過量測設備偵測第一銑刀沿著所述方向水平移動時初始觸發量測設備的第一座標、透過位移設備帶動旋轉設備沿著所述方向的一反方向水平移動、透過量測設備偵測第一銑刀沿著反方向水平移動時初始觸發量測設備的第二座標、透過量測設備計算第一座標及第二座標的差值以作為第一銑刀的量測刀徑、以及透過量測設備計算第一銑刀的量測刀徑與其真實刀徑的差值以作為一校正值。其中,當量測設備獲得一第二銑刀的一量測刀徑時,量測設備相加第二銑刀的量測刀徑與校正值以獲得第二銑刀的真實刀徑。The tool diameter measurement and correction method provided by the present invention includes: clamping and rotating a first milling cutter through a rotating device, driving the rotating device to move horizontally in one direction through a displacement device, and detecting the edge of the first milling tool through a measuring device When moving horizontally in the direction, the first coordinate of the measuring device is initially triggered, the rotation device is driven to move horizontally in the opposite direction of the direction through the displacement device, and the first milling cutter is detected horizontally in the opposite direction through the measuring device When moving, the second coordinate of the measuring device is initially triggered, the difference between the first coordinate and the second coordinate is calculated by the measuring device to be used as the measuring tool diameter of the first milling cutter, and the measuring device is used to calculate the diameter of the first milling cutter. Measure the difference between the tool diameter and its real tool diameter as a correction value. Wherein, when the measuring device obtains a measured tool diameter of a second milling cutter, the measuring device adds the measured tool diameter of the second milling tool and the correction value to obtain the real tool diameter of the second milling tool.
本發明所提供的刀徑量測與校正系統包括:旋轉設備、位移設備、以及量測設備。其中旋轉設備用以夾持並旋轉一第一銑刀。位移設備連接旋轉設備並用以帶動旋轉設備沿著一方向及所述方向的一反方向水平移動。量測設備連接位移設備並用以偵測第一銑刀沿著所述方向水平移動時初始觸發量測設備的一第一座標、偵測第一銑刀沿著所述反方向水平移動時初始觸發量測設備的一第二座標、計算第一座標及第二座標的差值以作為第一銑刀的一量測刀徑、以及計算第一銑刀的量測刀徑與其真實刀徑的差值以作為一校正值。其中,當量測設備獲得一第二銑刀的一量測刀徑時,量測設備相加第二銑刀的量測刀徑與校正值以獲得第二銑刀的真實刀徑。The tool diameter measurement and correction system provided by the present invention includes: rotating equipment, displacement equipment, and measuring equipment. The rotating device is used for clamping and rotating a first milling cutter. The displacement device is connected to the rotation device and used to drive the rotation device to move horizontally along a direction and an opposite direction of the direction. The measuring device is connected to the displacement device and is used to detect a first coordinate of the measuring device when the first milling tool moves horizontally along the direction, and initially trigger when the first milling tool moves horizontally along the opposite direction. Measure a second coordinate of the device, calculate the difference between the first coordinate and the second coordinate as a measured tool radius of the first milling cutter, and calculate the difference between the measured tool radius of the first milling tool and its real tool radius value as a correction value. Wherein, when the measuring device obtains a measured tool diameter of a second milling cutter, the measuring device adds the measured tool diameter of the second milling tool and the correction value to obtain the real tool diameter of the second milling tool.
在本發明的一實施例中,上述旋轉設備包括一PCB分板機主軸、以及連接PCB分板機主軸並用以夾持並旋轉第一銑刀的一夾頭。In an embodiment of the present invention, the above-mentioned rotating device includes a main shaft of a PCB splitter, and a chuck connected to the main shaft of the PCB splitter and used for clamping and rotating the first milling cutter.
在本發明的一實施例中,上述位移設備包括一伺服馬達、連接伺服馬達的一螺桿、以及連接螺桿及PCB分板機主軸的一線軌。其中,伺服馬達帶動螺桿轉動以推動線軌,以使線軌帶動PCB分板機主軸以沿著所述方向及所述反方向水平移動。In an embodiment of the present invention, the displacement device includes a servo motor, a screw connected to the servo motor, and a rail connected to the screw and the main shaft of the PCB splitter. Wherein, the servo motor drives the screw to rotate to push the line rail, so that the line rail drives the main shaft of the PCB splitter to move horizontally along the direction and the opposite direction.
在本發明的一實施例中,上述量測設備包括用以偵測第一座標及第二座標的一傳感器、以及連接傳感器並用以計算第一銑刀的量測刀徑、校正值、及第二銑刀的量測刀徑的一運動控制裝置。In an embodiment of the present invention, the above-mentioned measuring device includes a sensor for detecting the first coordinate and the second coordinate, and a sensor connected to the sensor for calculating the measured tool diameter, the correction value, and the first milling cutter. A motion control device for measuring the tool diameter of the second milling cutter.
在本發明的一實施例中,上述獲得第二銑刀的量測刀徑包括:透過旋轉設備夾持並旋轉第二銑刀、透過位移設備帶動旋轉設備沿著所述方向水平移動、透過量測設備偵測第二銑刀沿著所述方向水平移動時初始觸發量測設備的第三座標、透過位移設備帶動旋轉設備沿著所述反方向水平移動、透過量測設備偵測第二銑刀沿著所述反方向水平移動時初始觸發量測設備的第四座標、以及透過量測設備計算第三座標及第四座標的差值以作為第二銑刀的量測刀徑。In an embodiment of the present invention, obtaining the measuring tool diameter of the second milling cutter includes: clamping and rotating the second milling cutter through a rotating device, driving the rotating device to move horizontally along the direction through a displacement device, The measuring device detects the third coordinate of the measuring device when the second milling cutter moves horizontally along the direction, drives the rotating device to move horizontally along the opposite direction through the displacement device, and detects the second milling tool through the measuring device. When the tool moves horizontally in the opposite direction, the fourth coordinate of the measuring device is initially triggered, and the difference between the third coordinate and the fourth coordinate is calculated by the measuring device as the measuring tool diameter of the second milling tool.
本發明因採用刀徑量測與校正方法,因此可獲得刀徑量測儀器/裝置的誤差值以作為校正值。藉此,補償刀徑量測儀器/裝置的誤差,而更準確獲取刀具的真實刀徑,以提高刀徑量測儀器/裝置量測的精準度。並且,本發明因採用傳感器來進行量測銑刀的刀徑,有遠小於一般視覺辨識或是遮蔽雷射寬度來判斷銑刀直徑的儀器/裝置的體積及成本。因此,本發明提供的刀徑量測與校正系統及其方法,是具有體積小、低成本、高精度的優點。Since the present invention adopts the tool diameter measurement and correction method, the error value of the tool diameter measurement instrument/device can be obtained as the correction value. In this way, the error of the tool diameter measuring instrument/device is compensated, and the real tool diameter of the tool is obtained more accurately, so as to improve the measurement accuracy of the tool diameter measuring instrument/device. In addition, because the present invention uses a sensor to measure the cutter diameter of the milling cutter, the volume and cost of the instruments/devices for judging the milling cutter diameter are much smaller than those of general visual recognition or shielding the width of the laser. Therefore, the tool diameter measurement and correction system and the method thereof provided by the present invention have the advantages of small size, low cost and high precision.
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式,作詳細說明如下。In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and easy to understand, the following specific embodiments are given and described in detail in conjunction with the accompanying drawings.
在下文中,將藉由圖式說明本發明之各種實施例來詳細描述本發明。然而,本發明概念可能以許多不同形式來體現,且不應解釋為限於本文中所闡述之例示性實施例。此外,在圖式中相同參考數字可用以表示類似的元件。Hereinafter, the present invention will be described in detail by illustrating various embodiments of the invention in the drawings. However, the inventive concepts may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Furthermore, the same reference numbers may be used to refer to similar elements in the drawings.
參照圖1-5所示,本發明一實施例所提供的刀徑量測與校正系統1包括一旋轉設備2、一位移設備3、以及一量測設備4,其中旋轉設備2及量測設備4連接位移設備3。旋轉設備2用以夾持並旋轉銑刀5,位移設備3用以帶動旋轉設備2沿著一方向A及方向A的一反方向B水平移動,以及量測設備4用以偵測銑刀5沿著方向A水平移動時初始觸發量測設備4的一座標C1、偵測銑刀5沿著反方向B水平移動時初始觸發量測設備4的一座標C2、計算座標C1及座標C2的差值以作為銑刀5的一量測刀徑、以及計算銑刀5的量測刀徑與其真實刀徑的差值以作為一校正值。1-5, a tool diameter measurement and
詳細地說,旋轉設備2包括一PCB分板機主軸21以及一夾頭22,其中夾頭22連接PCB分板機主軸21並用以夾持並旋轉銑刀5,PCB分板機主軸21及夾頭22屬於PCB分板機內的組件,但這些組件僅是示例,本領域技術人員可依據實際需求選用不同的旋轉設備,因此本發明不以此為限。此外,夾頭22可為氣動、手動或其他方式夾持銑刀5,本發明亦不以此為限。位移設備3包括一伺服馬達31、一螺桿32、以及一線軌33,其中螺桿32連接伺服馬達31,線軌33連接螺桿32以及PCB分板機主軸21,伺服馬達31用以帶動螺桿32轉動以推動線軌33,以使線軌33帶動PCB分板機主軸21以沿著方向A及方向A的反方向B水平移動,伺服馬達31、螺桿32、及線軌33屬於PCB分板機內的組件,但這些組件僅是示例,本領域技術人員可依據實際需求選用不同的位移設備,因此本發明不以此為限。量測設備4包括一傳感器41以及一運動控制裝置42,其中傳感器41用以偵測座標C1及C2,運動控制裝置42連接傳感器41並用以計算銑刀5的量測刀徑及校正值,傳感器41及運動控制裝置42屬於PCB分板機內的組件,但這些組件僅是示例,本領域技術人員可依據實際需求選用不同的量測設備,因此本發明不以此為限。另外,可以注意的是,本發明所提供的刀徑量測與校正系統1應用在PCB分板機僅為示例,本領域技術人員可將本發明所提供的刀徑量測與校正系統1及方法應用於其他刀徑量測範圍。In detail, the
在本實施例中,本發明所提供的刀徑量測與校正系統1執行刀徑量測與校正方法包括步驟S1:透過旋轉設備2夾持並旋轉銑刀5;步驟S3:透過位移設備3帶動旋轉設備2沿著方向A水平移動;步驟S5:透過量測設備4偵測銑刀5沿著方向A水平移動時初始觸發量測設備4的座標C1;步驟S7:透過位移設備3帶動旋轉設備2沿著方向A的反方向B水平移動;步驟S9:透過量測設備4偵測銑刀5沿著反方向B水平移動時初始觸發量測設備4的座標C2;步驟S11:透過量測設備4計算座標C1及座標C2的差值以作為銑刀5的一量測刀徑;以及步驟S13:透過量測設備4計算銑刀5的量測刀徑與其真實刀徑的差值以作為一校正值,如圖6所示。In this embodiment, the tool diameter measurement and
確切地說,本發明所執行的刀徑量測與校正方法是在旋轉設備2夾持銑刀5並持續地使銑刀5旋轉C下進行。當位移設備3帶動旋轉設備2沿著方向A水平移動時,銑刀5初始接觸到量測設備4中的傳感器41的感測點P以觸發傳感器41偵測感測點P的座標C1,以及運動控制裝置42接收並記錄感測點P的座標C1。然後,銑刀5持續地沿著方向A水平移動直到通過量測設備4中的傳感器41的感測點P。接著,當位移設備3帶動旋轉設備2沿著方向A的反方向B水平移動時,銑刀5初始接觸到量測設備4中的傳感器41的感測點P以觸發傳感器41偵測感測點P的座標C2,以及運動控制裝置42接收並記錄感測點P的座標C2。然後,銑刀5持續地沿著反方向B水平移動直到通過量測設備4中的傳感器41的感測點P。在運動控制裝置42接收到傳感器41被觸發的感測點P的座標C1及C2之後,運動控制裝置42計算感測點P的座標C1與座標C2之間的差值(距離)並當作銑刀5的量測刀徑,並且計算銑刀5的量測刀徑與其真實刀徑的差值以作為刀徑量測與校正系統1的校正值。Specifically, the tool diameter measurement and calibration method implemented by the present invention is performed under the condition that the
也就是說,當量測設備4獲得另一銑刀5的量測刀徑時,量測設備4可相加另一銑刀5的量測刀徑與校正值以獲得另一銑刀5的真實刀徑。而量測設備4獲得另一銑刀5的量測刀徑的步驟如本發明所執行的刀徑量測與校正方法中的步驟S1-S11,故不在贅述。That is, when the
綜上所述,本發明因採用刀徑量測與校正方法,因此可獲得刀徑量測儀器/裝置的誤差值以作為校正值。藉此,補償刀徑量測儀器/裝置的誤差,而更準確獲取刀具的真實刀徑,以提高刀徑量測儀器/裝置量測的精準度。並且,本發明因採用傳感器來進行量測銑刀的刀徑,有遠小於一般視覺辨識或是遮蔽雷射寬度來判斷銑刀直徑的儀器/裝置的體積及成本。因此,本發明提供的刀徑量測與校正系統及其方法,是具有體積小、低成本、高精度的優點。To sum up, because the present invention adopts the tool diameter measurement and correction method, the error value of the tool diameter measurement instrument/device can be obtained as the correction value. In this way, the error of the tool diameter measuring instrument/device is compensated, and the real tool diameter of the tool is obtained more accurately, so as to improve the measurement accuracy of the tool diameter measuring instrument/device. In addition, because the present invention uses a sensor to measure the cutter diameter of the milling cutter, the volume and cost of the instruments/devices for judging the milling cutter diameter are much smaller than those of general visual recognition or shielding the width of the laser. Therefore, the tool diameter measurement and correction system and the method thereof provided by the present invention have the advantages of small size, low cost and high precision.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope of the appended patent application.
1:刀徑量測與校正系統 2:旋轉設備 3:位移設備 4:量測設備 5:銑刀 21:PCB分板機主軸 22:夾頭 31:伺服馬達 32:螺桿 33:線軌 41:傳感器 42:運動控制裝置 A:方向 B:反方向 C:旋轉 C1,C2:座標 P:感測點 S1,S3,S5,S7,S9,S11,S13:步驟1: Tool diameter measurement and correction system 2: Rotating equipment 3: Displacement equipment 4: Measuring equipment 5: Milling cutter 21: PCB splitter spindle 22: Chuck 31: Servo motor 32: Screw 33: Line rail 41: Sensor 42: Motion Control Device A: Direction B: reverse direction C: rotate C1, C2: coordinates P: Sensing point S1, S3, S5, S7, S9, S11, S13: Steps
圖1為本發明一實施例所提供的刀徑量測與校正系統的方塊圖; 圖2-5為本發明一實施例所提供的刀徑量測與校正的示意圖;以及 圖6為本發明一實施例所提供的刀徑量測與校正方法的流程圖。 1 is a block diagram of a tool radius measurement and correction system provided by an embodiment of the present invention; 2-5 are schematic diagrams of tool diameter measurement and calibration provided by an embodiment of the present invention; and FIG. 6 is a flowchart of a method for measuring and calibrating a tool radius provided by an embodiment of the present invention.
S1,S3,S5,S7,S9,S11,S13:步驟 S1, S3, S5, S7, S9, S11, S13: Steps
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| JP2000263379A (en) * | 1999-03-16 | 2000-09-26 | Kawasaki Steel Corp | Method and apparatus for measuring average outer diameter of rotating body |
| JP2014008588A (en) * | 2012-07-02 | 2014-01-20 | Nagoya Univ | Machine tool with workpiece diameter measurement function |
| CN103852006A (en) * | 2012-11-30 | 2014-06-11 | 昆山允可精密工业技术有限公司 | Device and method for automatically measuring cutter |
| TWI449589B (en) * | 2008-12-26 | 2014-08-21 | Foxnum Technology Co Ltd | Testing system and method for parameter of cutting tool |
| CN112361975A (en) * | 2020-10-28 | 2021-02-12 | 浙江中茂科技有限公司 | Method for detecting diameter of miniature milling cutter of PCB (printed circuit board) |
-
2021
- 2021-05-12 TW TW110117036A patent/TWI768892B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000263379A (en) * | 1999-03-16 | 2000-09-26 | Kawasaki Steel Corp | Method and apparatus for measuring average outer diameter of rotating body |
| TWI449589B (en) * | 2008-12-26 | 2014-08-21 | Foxnum Technology Co Ltd | Testing system and method for parameter of cutting tool |
| JP2014008588A (en) * | 2012-07-02 | 2014-01-20 | Nagoya Univ | Machine tool with workpiece diameter measurement function |
| CN103852006A (en) * | 2012-11-30 | 2014-06-11 | 昆山允可精密工业技术有限公司 | Device and method for automatically measuring cutter |
| CN112361975A (en) * | 2020-10-28 | 2021-02-12 | 浙江中茂科技有限公司 | Method for detecting diameter of miniature milling cutter of PCB (printed circuit board) |
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|---|---|
| TW202243792A (en) | 2022-11-16 |
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