TWI768239B - Manufacturing method of a patterned resin device - Google Patents

Abstract

A manufacturing method of a patterned resin device includes a substrate preparation step, a protective film setting step, a patterning step, and a cleaning step. The substrate preparation step is to provide a resin substrate. The protective film setting step is to provide a protective film on the resin substrate. The patterning step applies energy to a predetermined area on the resin substrate to pattern the surface of the glue substrate. The cleaning step is to clean and remove the protective film to form a patterned resin device. By forming a protective film formed on the surface of the resin substrate, the dust or debris generated during the pattering step can be fully removed from the surface of the resin substrate in the cleaning step, such that the defects caused by the dust or debris in subsequent processes can be prevented. Therefore, the patterned resin device can be applied to precise processes.

Description

Manufacturing method of patterned glue device

The present application relates to the field of glue material patterning, and in particular, to a manufacturing method of a patterned glue material device.

Due to the characteristics of the soft colloidal material itself, it has controllable viscosity and is suitable for various component transfer processes. Therefore, patterned adhesive materials have been more and more widely used in various fields, such as patterned sapphire substrate imprinting materials. optical applications, etc.

At present, a common manufacturing method for fabricating a patterned adhesive material device is thermal embossing or UV embossing. However, due to the characteristics of the soft colloidal material, it may be difficult to control the displacement when it is released from the mold due to shrinkage, uneven curing, etc. It is also possible that the surface characteristics are affected by the imprinted mold, or there is residual release agent. These problems have caused problems such as easy residues of materials and difficult control of precision, which have caused restrictions on subsequent processes.

In addition, if the patterning is performed by post-curing processing, the surface is likely to be greatly damaged, and because of its stickiness, it is easy to adhere to debris, which is difficult to clean and remove. This is prone to debris and pollution when applied to high-precision processes, which affects the yield of subsequent processes and requires more time for equipment maintenance.

Herein, a manufacturing method of a patterned adhesive material device is provided. The manufacturing method of the patterned adhesive material device includes a substrate preparation step, a protective film setting step, a patterning step, and a cleaning step step. The substrate preparation step is to provide a plastic substrate. The step of disposing the protective film is to dispose the protective film on the plastic substrate. The patterning step is to apply energy to a predetermined area on the adhesive substrate to pattern the surface of the adhesive substrate. The cleaning step is to clean and remove the protective film to form a patterned adhesive material device.

In some embodiments, the patterning step is to perform laser cutting on a predetermined area on the rubber substrate to form a groove in the predetermined area. Further, in some embodiments, the wavelength of the laser source for laser cutting is 200-580 nm.

In some embodiments, the adhesive substrate is made of silicone, polydimethylsiloxane (PDMS), polyimide (PI), polyurethane (PU), acrylic , latex, and epoxy resin to choose at least one of them.

In some embodiments, in the step of disposing the protective film, the protective film is disposed on the adhesive substrate in a covering manner. In other embodiments, in the step of setting the protective film, the protective liquid is applied on the surface of the adhesive material substrate, and then the protective film is formed by drying.

In some embodiments, the thickness of the protective film is 0.2 to 15 um.

In some embodiments, the protective film includes an amphoteric polymer and a light absorber.

In more detail, in some embodiments, the amphiphilic polymer is made of polyvinylpyrrolidone (PVP), polyvinylpyrrolidone-vinyl acetate (PVP/VA), polyethylene glycol (polyethylene glycol). Polyethylene glycol (PEG), polyethylene oxide (PEO), poly(2-ethyl-2-oxazoline) (poly(2-ethyl-2-oxazoline)), and polyacrylic acid (PAA) ) to select at least one of them.

In more detail, in some embodiments, the light absorber is light-absorbing by salicylates Collecting agent, benzotriazole light absorber, triazine light absorber, tetrapyrrole pigment, terpene pigment, polyphenol pigment, food color yellow No. 4 and food color red Choose at least one of the seven to make.

To sum up, by forming a protective film on the surface of the plastic substrate, during the patterning step, the removed debris can be prevented from adhering to the surface of the plastic substrate and difficult to be removed, resulting in serious defects in subsequent processes. Further, the manufacturing method can make the pattern fine and can be applied in precise manufacturing process.

10: Plastic substrate

15: Groove

20: Protective film

100: Patterned glue device

200: Laser source

500: carrier board

S1: Manufacturing method of patterned glue device

S10: Substrate Preparation Step

S20: Protective film setting steps

S30: Patterning step

S40: Cleaning step

FIG. 1 is a flow chart of a manufacturing method of a patterned adhesive device.

Figure 2 is a schematic diagram of the substrate preparation steps.

FIG. 3 is a schematic diagram of the steps of setting the protective film.

FIG. 4 is a schematic diagram of an embodiment of the patterning step.

FIG. 5 is a three-dimensional schematic diagram of a patterned adhesive material device.

FIG. 1 is a flow chart of a manufacturing method of a patterned adhesive device. Figure 2 is a schematic diagram of the substrate preparation steps. FIG. 3 is a schematic diagram of the steps of setting the protective film. FIG. 4 is a schematic diagram of an embodiment of the patterning step. FIG. 5 is a three-dimensional schematic diagram of a patterned adhesive material device. The manufacturing method of the patterned adhesive material device will be described below using FIGS. 1 to 5 .

As shown in FIG. 1 , the manufacturing method S1 of the patterned adhesive material device includes a substrate preparation step S10 , a protective film setting step S20 , a patterning step S30 , and a cleaning step S40 . As shown in FIG. 2 , the substrate preparation step S10 is to provide a plastic substrate 10 . Since the plastic substrate 10 is soft and easily deformed, Usually, the plastic substrate 10 is disposed on the carrier board 500 to facilitate subsequent steps. Further, the plastic material substrate 10 can also be formed on the carrier plate 500 by spin coating or pouring into a mold and pressurized, and then cured by heating or light. Here, the carrier plate 500 is usually a light-transmitting material with relatively hard hardness, such as a quartz plate, a glass plate, and the like.

Further, the adhesive material substrate 10 can be made of at least one of materials such as silicone, polydimethylsiloxane, polyimide, polyurethane, acrylic, latex, or epoxy resin. to make.

As shown in FIG. 3 , in the step S20 of disposing the protective film, the protective film 20 is disposed on the plastic substrate 10 . The thickness of the protective film 20 is 0.2-15um, preferably, 0.5-10um. In some embodiments, the protective film 20 may be pre-finished and disposed on the rubber substrate 10 in a whole-covering manner to cover the surface of the rubber substrate 10 . In other embodiments, the protective liquid is coated on the surface of the adhesive material substrate 10 by spin coating, and then the protective film 20 is formed by drying. However, the above is only an example, not a limitation. Further, the protective film 20 is further formed on the surface of the carrier board 500 .

The patterning step S30 is to apply energy to a predetermined area on the adhesive substrate 10 to pattern the surface of the adhesive substrate 10 . Here, various high-energy methods can be applied to implement patterning. As shown in FIG. 4 , in the first embodiment, the patterning step S30 is to perform laser cutting through the laser source 200 in a predetermined area on the plastic substrate 10 to form the groove 15 in the predetermined area. Therefore, the wavelength of the laser source 200 is 200-580 nm, that is, a wavelength band between ultraviolet light and green light. In more detail, the laser source 200 may use a green laser of 532 nm, a UV laser of 355 nm, or the like. Here, although it is only shown that the laser source 200 cuts in a unidirectional manner, in fact, the laser source 200 can cut through lateral and vertical movement. Since the focal point of the laser source 200 is small, fine patterns can be generated. In addition, in the selection of the laser source 200, the plastic substrate 10 can be selected not to absorb Therefore, the deterioration of the material of the plastic substrate 10 can be avoided.

In more detail, the laser cutting method of the laser source 200 can be cut from the inside to the outside gradually, so that the debris generated during patterning can be prevented from accumulating in the lateral direction. However, although laser dicing is used as an exemplary method for the patterning step S30, this is not intended to limit it, and other methods using high energy, such as plasma, lithography, and etching, can also be used for the patterning step. S30.

The cleaning step S40 is to remove the protective film 20 by cleaning. The cleaning can be performed by clean water, pickling or organic solvent, but it must be considered that it does not react with the adhesive material substrate 10 . Further, an ultrasonic water tank can also be used for cleaning, so that all particles adhering to the surface are removed together with the protective film 20 . Further, in the cleaning step S40, the protective film 20 formed on the carrier board 500 is also removed together.

As shown in FIG. 5 , after the cleaning step S40 , the patterned adhesive material device 100 can be obtained. The carrier board 500 can be shipped together with the patterned adhesive material device 100 as a whole. The patterned structure of the patterned adhesive material device 100 can be applied to component transfer of various patterned arrangements.

In more detail, in some embodiments, the protective film 20 may include an amphoteric polymer and a light absorber. The amphoteric polymer can be in contact with the adhesive substrate 10 at the hydrophobic end, so as to strengthen the bonding property of the protective film 20 and the adhesive substrate 10 , and in addition, through the hydrophilic end, the protective film 20 is easily dissolved, so that it can be easily dissolved after the patterning step S30 . The water and cleaning liquid are removed, and the debris generated in the patterning step S30 is removed at the same time. In this way, debris will not adhere to the patterned adhesive material device 100 to avoid affecting subsequent processes. The light absorber further assists the protective film 20 in absorbing energy.

In more detail, the amphoteric polymer may include polyvinylpyrrolidone, polyvinylpyrrolidone-vinyl acetate copolymer, polyethylene glycol, polyethylene oxide, poly(2-ethyl-2-oxazole) at least one of polyacrylic acid), or polyacrylic acid. Light absorbers may include salicylate light absorbers, benzophenone light absorbers, benzotriazole light absorbers, triazine light absorbers, tetrapyrrole dyes, terpene dyes, polyphenols At least one of the coloring, food coloring yellow No. 4 and food coloring red No. 7 can be adjusted according to the laser source 200 or light used. The above are examples only and not intended to be limiting.

To sum up, the manufacturing method of the patterned adhesive material device can solve the problem of offset from the mold in the prior art. In addition, the protective film 20 is formed on the surface of the adhesive material substrate 10 by forming the protective film 20 . In step S30, the removed debris can be prevented from adhering to the surface of the plastic material substrate 10 and being difficult to be removed, resulting in serious defects in subsequent processes. Further, the manufacturing method S1 of the patterned adhesive material device can produce fine patterns on the adhesive material substrate 10 , and can be applied to precise manufacturing processes. For example, the viscosity of the patterned adhesive material device 100 can be used as an adhesive carrier for mass transfer of Micro-LEDs.

S1: Manufacturing method of patterned glue device

S10: Substrate Preparation Step

S20: Protective film setting steps

S30: Patterning step

S40: Cleaning step

Claims (5)

A manufacturing method of a patterned adhesive material device includes: a substrate preparation step, providing a polydimethylsiloxane (PDMS) substrate; a protective film setting step, arranging a protective film on the PDMS substrate, In the step of setting the protective film, a protective liquid is applied on the surface of the PDMS substrate, and then the protective film is formed by drying, and the protective film includes an amphoteric polymer and a light absorbing agent, wherein the protective film is The thickness of the film is 0.2 to 15um; in a patterning step, a laser source is cut from the inside to the outside by a laser source in a predetermined area on the PDMS substrate, so that a surface of the PDMS substrate is cut. patterning; and a cleaning step, cleaning and removing the protective film to form a patterned adhesive material device. The method for manufacturing a patterned adhesive material device as claimed in claim 1, wherein the patterning step is to perform laser cutting on the predetermined area on the PDMS substrate to form a groove in the predetermined area. The manufacturing method of the patterned adhesive material device according to claim 1, wherein the wavelength of one of the laser sources used for laser cutting is 200-580 nm. The manufacturing method of the patterned adhesive material device according to claim 1, wherein the amphoteric polymer is made of polyvinylpyrrolidone, polyvinylpyrrolidone-vinyl acetate copolymer, polyethylene glycol, polyethylene oxide, poly( 2-ethyl-2-oxazoline), and at least one of polyacrylic acid. The manufacturing method of the patterned adhesive material device as claimed in claim 1, wherein the The light absorber is composed of a monosalicylate light absorber, a benzophenone light absorber, a benzotriazole light absorber, a triazine light absorber, a tetrapyrrole pigment, and a terpene pigment. , polyphenol coloring, food coloring yellow No. 4 and food coloring red No. 7 at least one selected to make.

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