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TWI768219B - 印刷配線基板用貼黏膜 - Google Patents

印刷配線基板用貼黏膜 Download PDF

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Publication number
TWI768219B
TWI768219B TW108123826A TW108123826A TWI768219B TW I768219 B TWI768219 B TW I768219B TW 108123826 A TW108123826 A TW 108123826A TW 108123826 A TW108123826 A TW 108123826A TW I768219 B TWI768219 B TW I768219B
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TW
Taiwan
Prior art keywords
wiring board
resin
layer
film
printed wiring
Prior art date
Application number
TW108123826A
Other languages
English (en)
Other versions
TW202006093A (zh
Inventor
渡邊正博
Original Assignee
日商拓自達電線股份有限公司
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Filing date
Publication date
Application filed by 日商拓自達電線股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW202006093A publication Critical patent/TW202006093A/zh
Application granted granted Critical
Publication of TWI768219B publication Critical patent/TWI768219B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/095—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/098—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/22—Layered products comprising a layer of synthetic resin characterised by the use of special additives using plasticisers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B32B2264/025—Acrylic resin particles, e.g. polymethyl methacrylate or ethylene-acrylate copolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B32B2264/0264—Polyamide particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B32B2264/0292—Polyurethane particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/101—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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Abstract

印刷配線基板貼黏膜係具備接著劑層111及絕緣保護層112。絕緣保護層112中，分離突出波谷部與核心部之負載面積率(Smr2)為91%以下。

Description

印刷配線基板用貼黏膜
本發明係關於一種印刷配線基板用貼黏膜、電磁波屏蔽膜及屏蔽配線基板。
為了避免電子電路遭受電磁雜訊之破壞，係使用貼合於印刷配線基板之電磁波屏蔽膜。電磁波屏蔽膜係具有導電性接著劑層及絕緣保護層，電磁波屏蔽膜經導電性接著劑層接著於印刷配線基板上，以便藉由該導電性接著劑層與印刷配線基板之接地電路導通。
以增加美觀、提高印字之視覺識別性等為目的，絕緣保護層有時含有著色劑。例如專利文獻1係欲使用含有黑色系著色劑之絕緣保護層提高印字之視覺識別性。
專利文獻1：日本特開2016-143751號公報。
印刷配線基板係具有底層、形成於底層上之銅箔所構成之電路圖案、及用以保護電路圖案之覆蓋膜。藉由於印刷配線基板黏貼電磁波屏蔽膜，亦期待獲得靠視覺無法從外部識別出印刷配線基板之電路圖案的隱蔽效果。近年來，要求印刷配線基板變薄，覆蓋膜有變薄之傾向。若覆蓋膜變薄，則容易在覆蓋膜表面產生反映電路圖案之凸部。本申請發明人等發現，若覆蓋膜變薄且凸部高度變高，則以往電磁波屏蔽膜無法充分隱蔽 電路圖案。
又，有時也有不要求電磁波屏蔽功能，而要求電路圖案隱蔽性的情形。
本發明之目的在於：於覆蓋膜較薄之情形，也能夠實現電路圖案隱蔽性良好之電磁波屏蔽膜或印刷配線基板用貼黏膜。
本發明之印刷配線基板用貼黏膜之一態樣係具備接著劑層及絕緣保護層，絕緣保護層中，分離突出波谷部與核心部之負載面積率(Smr2)為91%以下。
印刷配線基板用貼黏膜之一態樣中，絕緣保護層中，突出波谷部高度(Svk)可為0.45μm以上。
印刷配線基板用貼黏膜之一態樣中，接著劑層可具有導電性，且作為電磁波屏蔽膜發揮功能。此時，可在接著劑層及絕緣保護層之間進一步具備屏蔽層。
本發明之屏蔽配線基板之一態樣係具備配線基板、及接著於絕緣膜上之本發明之電磁波屏蔽膜，該配線基板係具有底層、設置於底層上之電路圖案、及以覆蓋電路圖案之方式接著於底層之絕緣膜。
根據本發明之電磁波屏蔽膜及印刷配線基板用貼黏膜，即使覆蓋膜較薄時亦可大幅提高電路圖案隱蔽性。
101‧‧‧電磁波屏蔽膜
102‧‧‧印刷配線基板
111‧‧‧導電性接著劑層
112‧‧‧絕緣保護層
113‧‧‧屏蔽層
121‧‧‧底層
122‧‧‧電路圖案
123‧‧‧接著劑層
124‧‧‧絕緣膜
圖1之剖視圖係表示一實施形態之印刷配線基板用貼黏膜。
圖2之剖視圖係表示一實施形態之屏蔽配線基板。
圖3之俯視圖係表示隱蔽性評價所使用之印刷配線基板。
圖4之照片係表示共焦顯微鏡觀察結果。
本實施形態之印刷配線基板用貼黏膜為具有電磁波屏蔽功能之電磁波屏蔽膜101，如圖1所示，係具有導電性接著劑層111及絕緣保護層112，絕緣保護層112中，分離突出波谷部與核心部之負載面積率(Smr2)為91%以下，較佳為90%以下。圖1中，在導電性接著劑層111與絕緣保護層112之間設置有導電性屏蔽層113，但導電性接著劑層111亦作為屏蔽層發揮功能時，可為不設置屏蔽層113之構成。
如圖2所示，本實施形態之電磁波屏蔽膜101接著於印刷配線基板102。印刷配線基板102例如具有底層121、設置於底層121表面之電路圖案122、及以覆蓋電路圖案122之方式於底層121透過接著劑層123接著之絕緣膜124。
底層121係以絕緣性材料構成。絕緣性材料可使用絕緣性樹脂組成物或陶瓷等。絕緣性樹脂組成物可使用例如由聚醯亞胺系樹脂、聚醯胺醯亞胺系樹脂、聚醯胺系樹脂、聚醚醯亞胺系樹脂、聚酯醯亞胺系樹脂、聚醚腈系樹脂、聚醚碸系樹脂、聚苯硫醚系樹脂、聚對苯二甲酸乙二酯系樹脂、聚丙烯系樹脂、交聯聚乙烯系樹脂、聚酯系樹脂、聚苯并咪唑系樹脂、聚醯亞胺系樹脂、聚醯亞胺醯胺系樹脂、聚醚醯亞胺系樹脂及聚苯硫醚系樹脂所選擇至少一種。
電路圖案122係以導電性材料構成。導電性材料可使用將金屬箔或導電性填料與樹脂組成物的混合物進行印刷/硬化之導電性材料，但以費用觀點來看，較佳為使用銅箔。
電路圖案122之厚度並無特別限定，較佳為1μm~100μm，更佳為1~50μm。使電路圖案之厚度為1μm以上，藉此可降低印刷配線基板102的製造成本。使厚度為100μm以下，藉此可 使印刷配線基板102薄化。
接著劑層123係以絕緣性材料構成。絕緣性材料較佳為絕緣性樹脂組成物，可使用例如由聚醯亞胺系樹脂、聚醯胺醯亞胺系樹脂、聚醯胺系樹脂、聚醚醯亞胺系樹脂、聚酯醯亞胺系樹脂、聚醚腈系樹脂、聚醚碸系樹脂、聚苯硫醚系樹脂、聚對苯二甲酸乙二酯系樹脂、聚丙烯系樹脂、交聯聚乙烯系樹脂、聚酯系樹脂、聚苯并咪唑系樹脂、聚醯亞胺系樹脂、聚醯亞胺醯胺系樹脂、聚醚醯亞胺系樹脂及聚苯硫醚系樹脂所選擇至少一種。
接著劑層123之厚度並無特別限定，較佳為1μm~50μm。
絕緣膜124係以絕緣性材料構成。絕緣性材料較佳為絕緣性樹脂組成物，可使用例如由聚醯亞胺系樹脂、聚醯胺醯亞胺系樹脂、聚醯胺系樹脂、聚醚醯亞胺系樹脂、聚酯醯亞胺系樹脂、聚醚腈系樹脂、聚醚碸系樹脂、聚苯硫醚系樹脂、聚對苯二甲酸乙二酯系樹脂、聚丙烯系樹脂、交聯聚乙烯系樹脂、聚酯系樹脂、聚苯并咪唑系樹脂、聚醯亞胺系樹脂、聚醯亞胺醯胺系樹脂、聚醚醯亞胺系樹脂及聚苯硫醚系樹脂所選擇至少一種。
絕緣膜124之厚度並無特別限定，較佳為1μm~100μm，更佳為10μm~25μm。使厚度為1μm以上，藉此可降低印刷配線基板102的製造成本。使厚度為100μm以下，藉此可使印刷配線基板102薄化。
若使絕緣保護層112著色並使電磁波屏蔽膜101為不透明，則無法直接靠視覺識別電路圖案122。例如藉由全光線透過率較佳為20%以下，更佳為10%以下，又更佳為5%以下的膜而覆蓋電路圖案122，則幾乎無法直接靠視覺識別電路圖案122。但會因電路圖案122而在絕緣保護層112表面形成凹凸。一般電路圖 案122係藉由銅線而形成，其高度為數μm~十數μm。存在線的部分與不存在線的部分之高度差可藉由埋入接著劑層123及導電性接著劑層111而變小，故於絕緣保護層112表面產生凹凸之高度為數μm。但即使僅是如此大小的凹凸，在容易反射光之具光澤表面中亦可靠視覺識別凹凸的存在，無法隱蔽電路圖案122。
因此，為了隱蔽電路圖案122而考慮減低絕緣保護層112表面的光澤度。但本申請發明人等發現電路圖案隱蔽性係與85°光澤度無關。又，雖然光澤度會受到表面粗糙度很大的影響，但發現電路圖案隱蔽性係與根據為一般表面粗糙度指標之國際標準化機構(ISO)25178之三維算術平均高度(Sa)無關。
另一方面，本申請發明人還發現電路圖案隱蔽性係與根據國際標準化機構(ISO)25178之分離突出波谷部與核心部之負載面積率(Smr2)相關，Smr2為91%以下，較佳為90%以下時，電路圖案隱蔽性優異。認為其原因為存在一定程度的離開核心部之突出波谷部，藉此可使入射光更容易散射。又，Smr2較佳為70%以上，更佳為80%以上，又更佳為85%。使Smr2為70%以上，藉此突出波谷部比率減小，可抑制突出波谷底的表面反射，從而可提高隱蔽性。
又，突出波谷部較深則更容易散射入射光，故根據國際標準化機構(ISO)25178之突出波谷部高度Svk較佳為0.45μm以上，更佳為0.49μm以上，又更佳為0.60μm以上，又再更佳為0.70μm以上。又，Svk較佳為3.0μm以下，更佳為2.0μm以下，又更佳為1.5μm以下，又再更佳為1.0μm以下。使Svk為3.0μm以下，藉此可將剝離性基材之凹凸表面形狀轉印於絕緣保護層，製作具有凹凸形狀之絕緣保護層時，剝離性基材由絕緣保 護層的剝離性良好。
為了使絕緣保護層112之Smr2為91%以下，可於形成絕緣保護層112之樹脂中添加微粒子。
添加於絕緣保護層112之微粒子並無特別限定，例如可使用樹脂微粒子或無機微粒子。樹脂微粒子可為丙烯酸樹脂微粒子、聚丙烯腈微粒子、聚胺甲酸乙酯微粒子、聚醯胺微粒子、及聚醯亞胺微粒子等。又，無機微粒子可為碳酸鈣微粒子、矽酸鈣微粒子、黏土、高嶺土、滑石、二氧化矽微粒子、玻璃微粒子、矽藻土、雲母粉、氧化鋁微粒子、氧化鎂微粒子、氧化鋅微粒子、硫酸鋇微粒子、硫酸鋁微粒子、硫酸鈣微粒子、及碳酸鎂微粒子等。該等樹脂微粒子及無機微粒子可單獨使用或組合複數使用。
為了使絕緣保護層112之Smr2為91%以下，較佳為於表面設置凹凸。於表面形成凹凸之方法例如有以下方法，亦即於剝離性基材之藉由壓印加工等而形成有凹凸形狀之表面塗布絕緣保護層112用樹脂組成物並乾燥，藉此將剝離性基材之凹凸形狀轉印於絕緣保護層112。取代壓印加工，可將表面設置有表面具凹凸之消光層的膜作為剝離性基材。將含有微粒子之樹脂組成物塗布於膜表面、或將形成於膜表面之樹脂層壓印加工，藉此可形成消光層。
又，除了使用具有凹凸之剝離性基材以外，可舉出於屏蔽層表面塗布含有微粒子之樹脂組成物並乾燥，而形成具有凹凸形狀之絕緣保護層112之方法；於絕緣保護層112表面吹上乾冰等之方法；於屏蔽層表面塗上活性能量線硬化性組成物後，壓接具有凹凸形狀之鑄模，使該硬化性組成物層硬化，並剝離鑄模之方法等公知方法。
又，較佳為於絕緣保護層112添加黑色顏料或複數顏料減色混合而黑色化之混合顏料等黑色系著色劑。黑色顏料例如可為碳黑，科琴黑、碳奈米管(CNT)、苝黑、鈦黑、鐵黑、及苯胺黑等任一者或該等之組合。混合顏料例如可混合紅色、綠色、藍色、黃色、紫色、青藍及洋紅等顏料而使用。
構成絕緣保護層112之樹脂成分例如可為熱塑性樹脂、熱硬化性樹脂、或活性能量線硬化性樹脂等。
熱塑性樹脂並無特別限定，可使用苯乙烯系樹脂、乙酸乙烯系樹脂、聚酯系樹脂、聚乙烯系樹脂、聚丙烯系樹脂、醯亞胺系樹脂、或丙烯酸系樹脂等。熱硬化性樹脂並無特別限定，可使用苯酚系樹脂、環氧系樹脂、胺甲酸乙酯系樹脂、三聚氰胺系樹脂、聚醯胺系樹脂或醇酸系樹脂等。活性能量線硬化性樹脂並無特別限定，例如可使用分子中具有至少二個(甲基)丙烯醯氧基之聚合性化合物等。絕緣保護層112可藉由一種材料形成，也可由二種以上材料形成。又，絕緣保護層112可為材質或硬度或彈性模數等物理性質相異之二層以上積層體。此時，只要以最上層表面中的Smr2等成為特定值之方式進行控制即可。
絕緣保護層112中視需要可含有硬化促進劑、接著性賦予劑、抗氧化劑、顏料、染料、塑化劑、紫外線吸收劑、消泡劑、調平劑、充填劑、阻燃劑、黏度調節劑、及抗結塊劑等至少一種。
絕緣保護層112之厚度為無特別限定，可視需要適宜設定，較佳為1μm以上，更佳為4μm以上，又，較佳為20μm以下，更佳為10μm以下，又更佳為5μm以下。使絕緣保護層112之厚度為1μm以上，藉此可充分保護導電性接著劑層111及屏蔽層113。使絕緣保護層112之厚度為20μm以下，藉此可確保電磁 波屏蔽膜101，電磁波屏蔽膜101容易用於要求折彎性之構件。
設置屏蔽層113時，屏蔽層113可藉由金屬箔、蒸鍍膜及導電性填料等而形成。
金屬箔並無特別限定，可為鎳、銅、銀、錫、金、鈀、鋁、鉻、鈦、及鋅等任一者或含有兩種以上之合金所構成之箔。
金屬箔之厚度並無特別限定，較佳為0.5μm以上，更佳為1.0μm以上。若金屬箔之厚度為0.5μm以上，傳送10MHz~100GHz之高頻訊號至屏蔽印刷配線基板時，可抑制高頻訊號的衰減量。又，金屬箔之厚度較佳為12μm以下，更佳為10μm以下，又更佳為7μm以下。若金屬層之厚度為12μm以下，則可確保良好之破裂延伸特性。
蒸鍍膜並無特別限定，可蒸鍍鎳、銅、銀、錫、金、鈀、鋁、鉻、鈦、及鋅等而形成。蒸鍍可使用電解電鍍法、化學電鍍法、濺鍍法、電子束蒸鍍法、真空蒸鍍法、化學氣相沈積(CVD)法、或有機金屬化學氣相沈積(MOCVD)法等。
蒸鍍膜之厚度並無特別限定，較佳為0.05μm以上，更佳為0.1μm以上。若蒸鍍膜之厚度為0.05μm以上，將電磁波屏蔽膜貼合於屏蔽印刷配線基板時，電磁波屏蔽膜屏蔽電磁波之特性優異。又，蒸鍍膜之厚度較佳為未滿0.5μm，更佳為未滿0.3μm。若蒸鍍膜之厚度為未滿0.5μm，則電磁波屏蔽膜之耐折彎性優異，可抑制因設置於印刷配線基板之台階而使屏蔽層被破壞。
導電性填料的情形，可將摻配導電性填料之溶劑塗布於絕緣保護層112表面並乾燥，藉此而形成屏蔽層113。導電性填料可使用金屬填料、覆蓋有金屬之樹脂填料、碳填料及該等之混合物。金屬填料可使用銅粉、銀粉、鎳粉、銀覆銅粉、金覆銅 粉、銀覆鎳粉、及金覆鎳粉等。該等金屬粉可藉由電解法、霧化法、還元法而製作。金屬粉之形狀可舉出球狀、薄片狀、纖維狀、樹枝狀等。
本實施形態中，屏蔽層113之厚度只要因應所求電磁屏蔽效果及重複折彎/滑動耐性而適宜選擇即可，但金屬箔的情形以確保破裂延伸特性之觀點來看較佳為12μm以下。
本實施形態中，導電性接著劑層111係含有熱塑性樹脂熱硬化性樹脂及活性能量線硬化性樹脂之至少一者、及導電性填料。
導電性接著劑層111含有熱塑性樹脂時，熱塑性樹脂可使用例如苯乙烯系樹脂、乙酸乙烯系樹脂、聚酯系樹脂、聚乙烯系樹脂、聚丙烯系樹脂、醯亞胺系樹脂、及丙烯酸系樹脂等。該等樹脂可單獨使用一種或併用二種以上。
導電性接著劑層111含有熱硬化性樹脂時，熱硬化性樹脂可使用例如苯酚系樹脂、環氧系樹脂、胺甲酸乙酯系樹脂、三聚氰胺系樹脂、聚醯胺系樹脂、聚醯亞胺系樹脂及醇酸系樹脂等。活性能量線硬化性樹脂並無特別限定，例如可使用分子中具有至少二個(甲基)丙烯醯氧基之聚合性化合物等。該等樹脂可單獨使用一種或併用二種以上。
熱硬化性樹脂例如含有具有反應性第一官能基之第一樹脂成分、及與第一官能基反應之第二樹脂成分。第一官能基例如可為環氧基、醯胺基、或羥基等。第二官能基可因應第一官能基選擇，例如第一官能基為環氧基時，可為羥基、羧基、環氧基及胺基等。具體而言，例如使第一樹脂成分為環氧樹脂時，第二樹脂成分可使用環氧基改質聚酯樹脂、環氧基改質聚醯胺樹脂、環氧基改質丙烯酸樹脂、環氧基改質聚胺甲酸乙酯 聚尿素樹脂、羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質丙烯酸樹脂、羧基改質聚胺甲酸乙酯聚尿素樹脂、及胺甲酸乙酯改質聚酯樹脂等。該等中較佳為羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質聚胺甲酸乙酯聚尿素樹脂、及胺甲酸乙酯改質聚酯樹脂。又，第一樹脂成分為羥基時，第二樹脂成分可使用環氧基改質聚酯樹脂、環氧基改質聚醯胺樹脂、環氧基改質丙烯酸樹脂、環氧基改質聚胺甲酸乙酯聚尿素樹脂、羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質丙烯酸樹脂、羧基改質聚胺甲酸乙酯聚尿素樹脂、及胺甲酸乙酯改質聚酯樹脂等。該等中較佳為羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質聚胺甲酸乙酯聚尿素樹脂、及胺甲酸乙酯改質聚酯樹脂。
熱硬化性樹脂可含有促進熱硬化反應之硬化劑。熱硬化性樹脂具有第一官能基與第二官能基時，硬化劑可因應第一官能基及第二官能基之種類而適宜選擇。第一官能基為環氧基且第二官能基為羥基時，可使用咪唑系硬化劑、苯酚系硬化劑、及陽離子系硬化劑等。該等可單獨使用一種或併用二種以上。此外，可含有消泡劑、抗氧化劑、黏度調整劑、稀釋劑、沉降防止劑、調平劑、耦合劑、著色劑、及阻燃劑等作為任意成分。
導電性填料並無特別限定，例如可使用金屬填料，覆蓋有金屬之樹脂填料，碳填料及該等之混合物。金屬填料可舉出銅粉、銀粉、鎳粉、銀覆銅粉、金覆銅粉、銀覆鎳粉、及金覆鎳粉等。該等金屬粉可藉由電解法、霧化法、或還元法等而製作。其中較佳為銀粉、銀覆銅粉及銅粉之任一者。
以填料彼此接觸之觀點來看，導電性填料之平均粒徑較佳為1μm以上，更佳為3μm以上，較佳為50μm以下，更佳為 40μm以下。導電性填料之形狀無特別限定，可為球狀、薄片狀、樹枝狀、或纖維狀等。
導電性填料含量可因應用途而適宜選擇，在全固體成分中較佳為5質量%以上，更佳為10質量%以上，較佳為95質量%以下，更佳為90質量%以下。以埋入性之觀點來看，較佳為70質量%以下，更佳為60質量%以下。又，要實現異向導電性時，較佳為40質量%以下，更佳為35質量%以下。
以埋入性之觀點來看，導電性接著劑層111之厚度較佳為1μm~50μm。
導電性接著劑層111可在常溫(例如20℃)環境下具有黏性，亦即可為具接著劑性的層。導電性接著劑層111在常溫環境下具有黏性，藉此可在印刷配線基板102之任意位置容易地貼合電磁波屏蔽膜101。
電磁波屏蔽膜101具有金屬箔等所構成之屏蔽層113時，全光線透過率通常幾乎為0。未設置屏蔽層113時，只要調整於絕緣保護層112及/或導電性接著劑層111添加之著色劑或填料等的量，藉此使全光線透過率成為較佳為20%以下，更佳為10%以下，又更佳為5%以下即可。使全光線透過率為20%以下，藉此在已將電磁波屏蔽膜101貼合於印刷配線基板102時，不易直接靠視覺識別電路圖案122。又，全光線透過率可根據JIS K 7136而測得。
本實施形態中表示印刷配線基板用貼黏膜為電磁波屏蔽膜的例子，但可為不具電磁波屏蔽功能之印刷配線基板用貼黏膜。此時，取代導電性接著劑層，可使用不含有導電性填料之非導電性接著劑層。不需電磁波屏蔽功能時，可不設置屏蔽層。但為了降低全光線透過率，可於接著劑層及絕緣保護層之 間設置金屬箔等。
【實施例】
以下使用實施例進一步詳細說明本發明之印刷配線基板貼黏膜。以下實施例僅為例示，並無限定本發明之意圖。
<剝離性基材之製作>
於厚度25μm之聚對苯二甲酸乙二酯膜(以下稱為PET膜)表面吹上乾冰微粒子而形成凹凸後，設置三聚氰胺系樹脂所構成之剝離層，而得剝離性基材1。
調整由二氧化矽粒子、三聚氰胺系樹脂、甲苯所構成之消光層組成物，於厚度25μm之聚對苯二甲酸乙二酯膜表面使用線棒塗布並加熱乾燥，而得具有厚度5μm之消光層之離性基材2。改變二氧化矽粒子之粒徑及添加量，藉此以相同方式獲得表面狀態相異之剝離基材3~9。剝離性基材1~9表面(形成隱蔽層的面)之表面性質狀態示於表1。
Figure 108123826-A0202-12-0012-5
<絕緣保護層之製作>
以固體成分的量成為20質量%之方式，於甲苯摻配雙酚A型環氧系樹脂(三菱化學製jER1256)100質量份、硬化劑(三菱化學製ST14)0.1質量份、作為黑色系著色劑之碳粒子(Tokai Carbon製TOKABLACK #8300/F)15質量份，而調製出了絕緣保護層用樹脂組成物。將該組成物使用線棒塗布於剝離性基材表面並加熱 乾燥，而於剝離性基材表面製作厚度5μm之絕緣保護層。接著在保護層上形成0.1μm之Ag蒸鍍膜作為屏蔽層。
<接著劑層之製作>
以固體成分的量達到20質量%之方式，於甲苯摻配雙酚A型環氧系樹脂(三菱化學製jER1256)100質量份、硬化劑(三菱化學製ST14)0.1質量份、平均粒徑15μm之樹枝狀銀覆銅粉30質量份，攪拌混合而調製出了接著劑層組成物。將所得接著劑層組成物使用線棒塗布於表面經脫模處理之PET膜(以下稱為支持膜)並加熱乾燥，藉此於支持膜表面形成厚度5μm之接著劑層。
<印刷配線基板貼黏膜之製作>
貼合形成於剝離性基材表面的絕緣保護層之Ag蒸鍍膜側的面與形成於支持膜表面的接著劑層，使用已加熱至100℃之一對金屬輥，以5MPa之壓力加壓，而得到為電磁波屏蔽膜之印刷配線基板貼黏膜。
<屏蔽配線基板之製作>
將所得印刷配線基板貼黏膜與印刷配線基板使用壓製機以溫度：170℃，時間：3分鐘，壓力：2~3MPa之條件接著後，剝離剝離性基材，而製作出了屏蔽配線基板。
印刷配線基板係使用於聚醯亞胺膜所構成之底層121上形成如圖4所示電路圖案122者。電路圖案122係藉由線寬度為0.1mm、高度為12μm之銅箔而形成。在底層121上，以覆蓋電路圖案122之方式設置厚度為25μm之接著劑層、及厚度為12.5μm之聚醯亞胺膜所構成之覆蓋膜(絕緣膜)。
<光澤度之測量>
85°光澤度係使用攜帶型光澤度計(BYK-Gardner．Micro-gloss，東洋精機製作所)，並根據JIS Z 8741而測得。
<表面粗糙度之測量>
使用共焦顯微鏡(Lasertec公司製OPTELICS HYBRID，對物透鏡20倍)，根據ISO25178測量了表面任意五處。其後使用資料解析軟體(LMeye7)進行表面傾斜修正，測量了Smr2、Svk及Sa。又，S過濾器之截止波長為0.0025mm，L過濾器之截止波長為0.8mm。又，各數值為測量表面任意五處所得值的平均值。
<隱蔽性評價>
將屏蔽配線基板置於平坦桌台面上，在屏蔽配線基板表面照度為500Lux之環境下，以距離屏蔽配線基板30cm之高度且以45度之角度，看看是否可由絕緣保護層側靠視覺識別電路圖案。將無法靠視覺識別電路圖案之情形評價為隱蔽性良好(○)，將可靠視覺識別電路圖案之情形評價為隱蔽性不良(×)。
(實施例1)
藉由使用剝離性基材1所形成之絕緣保護層而製作印刷配線基板貼黏膜，而得屏蔽配線基板。去除剝離性基材後測得的屏蔽配線基板之絕緣保護層的Smr2為90.1%，Svk為0.62μm。又，85°光澤度為33.7，Sa為0.48μm。目視檢查時，無法靠視覺識別電路圖案，隱蔽性非常良好。透過共焦顯微鏡觀察時，亦幾乎無法靠視覺識別電路圖案。
(實施例2)
除了使用剝離性基材2以外，以與實施例1相同方式獲得了屏蔽配線基板。去除剝離性基材後測得的屏蔽配線基板之絕緣保護層的Smr2為90.8%，Svk為0.55μm。又，85°光澤度為28.7，Sa為0.41μm。目視檢查時，無法靠視覺識別電路圖案，隱蔽性非常良好。透過共焦顯微鏡觀察時，亦幾乎無法靠視覺識別電路圖案。
(實施例3)
除了使用剝離性基材3以外，以與實施例1相同方式獲得了屏蔽配線基板。去除剝離性基材後測得的屏蔽配線基板之絕緣保護層的Smr2為90.0%，Svk為0.71μm。又，85°光澤度為32.3，Sa為0.51μm。目視檢查時，無法靠視覺識別電路圖案，隱蔽性非常良好。透過共焦顯微鏡觀察時，亦幾乎無法靠視覺識別電路圖案。
(實施例4)
除了使用剝離性基材4以外，以與實施例1相同方式獲得了屏蔽配線基板。去除剝離性基材後測得的屏蔽配線基板之絕緣保護層的Smr2為89.6%，Svk為0.49μm。又，85°光澤度為41.1，Sa為0.42μm。目視檢查時，無法靠視覺識別電路圖案，隱蔽性為良好。透過共焦顯微鏡觀察時，靠視覺稍微地識別出電路圖案。
(實施例5)
除了使用剝離性基材5以外，以與實施例1相同方式獲得了屏蔽配線基板。去除剝離性基材後測得的屏蔽配線基板之絕緣保護層的Smr2為90.8%，Svk為0.90μm。又，85°光澤度為12.6，Sa為0.83μm。目視檢查時，無法靠視覺識別電路圖案，隱蔽性非常良好。透過共焦顯微鏡觀察時，亦幾乎無法靠視覺識別電路圖案。
(實施例6)
除了使用剝離性基材6以外，以與實施例1相同方式獲得了屏蔽配線基板。去除剝離性基材後測得的屏蔽配線基板之絕緣保護層的Smr2為89.1%，Svk為0.63μm。又，85°光澤度為30.0，Sa為0.47μm。目視檢查時，無法靠視覺識別電路圖案，隱蔽性 非常良好。透過共焦顯微鏡觀察時，亦幾乎無法靠視覺識別電路圖案。
(比較例1)
除了使用剝離性基材7以外，以與實施例1相同方式獲得了屏蔽配線基板。去除剝離性基材後測得的屏蔽配線基板之絕緣保護層的Smr2為92.1%，Svk為0.39μm。又，85°光澤度為30.6，Sa為0.45μm。目視檢查可靠視覺識別電路圖案，隱蔽性不良。透過共焦顯微鏡觀察時，靠視覺可清楚地識別出電路圖案。
(比較例2)
除了使用剝離性基材8以外，以與實施例1相同方式獲得了屏蔽配線基板。去除剝離性基材後測得的屏蔽配線基板之絕緣保護層的Smr2為93.9%，Svk為0.29μm。又，85°光澤度為39.9，Sa為0.43μm。目視檢查時，可靠視覺識別電路圖案，隱蔽性不良。透過共焦顯微鏡觀察時，靠視覺可清楚識別出電路圖案。
(比較例3)
除了使用剝離性基材9以外，以與實施例1相同方式獲得了屏蔽配線基板。去除剝離性基材後測得的屏蔽配線基板之絕緣保護層的Smr2為92.8%，Svk為0.43μm。又，85°光澤度為37.0，Sa為0.45μm。目視檢查時，可靠視覺識別電路圖案，隱蔽性不良。透過共焦顯微鏡觀察時，靠視覺可清楚識別出了電路圖案。
表2表示各實施例及比較例之絕緣保護層特性及電路圖案隱蔽性。Smr2為91以下時，隱蔽性良好。
【表2】
Figure 108123826-A0202-12-0017-6
圖4表示各實施例及比較例中的共焦顯微鏡觀察結果。各實施例中幾乎無法確認電路圖案形狀，相對於此，各比較例中可清楚確認電路圖案形狀。
-產業上的可利用性-
本發明之電磁波屏蔽膜及印刷配線基板貼黏膜之隱蔽性優異，可利用於要求隱蔽電路圖案之用途。
111‧‧‧導電性接著劑層
113‧‧‧屏蔽層
112‧‧‧絕緣保護層
101‧‧‧電磁波屏蔽膜

Claims (5)

  1. 一種印刷配線基板用貼黏膜，係具備接著劑層及絕緣保護層，前述絕緣保護層中，分離突出波谷部與核心部之負載面積率(Smr2)為91%以下。
  2. 如請求項1所記載之印刷配線基板用貼黏膜，其中前述絕緣保護層中，突出波谷部高度(Svk)為0.45μm以上。
  3. 如請求項1或2所記載之印刷配線基板用貼黏膜，其中前述接著劑層係具有導電性，且作為電磁波屏蔽膜發揮功能。
  4. 如請求項3所記載之印刷配線基板用貼黏膜，其中在前述接著劑層與前述絕緣保護層之間進一步具備屏蔽層。
  5. 一種屏蔽配線基板，係具有配線基板、及接著於前述絕緣膜上之如請求項3或4所記載之印刷配線基板用貼黏膜，
    前述配線基板係具有底層、設置於前述底層上之電路圖案、及以覆蓋前述電路圖案之方式接著於前述底層之絕緣膜。
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