TWI767561B - Vehicle with Offset Angle - Google Patents
Vehicle with Offset Angle Download PDFInfo
- Publication number
- TWI767561B TWI767561B TW110105251A TW110105251A TWI767561B TW I767561 B TWI767561 B TW I767561B TW 110105251 A TW110105251 A TW 110105251A TW 110105251 A TW110105251 A TW 110105251A TW I767561 B TWI767561 B TW I767561B
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- Prior art keywords
- vertical frame
- offset angle
- vertical
- carrier
- printed circuit
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Auxiliary Methods And Devices For Loading And Unloading (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
Abstract
一種具有偏移角度之載具,包含:一滑台,滑台設有一滑動路徑;一垂直框架,垂直框架之頂端結合滑台之底端,且垂直框架具有一垂直面,垂直面微量偏移滑動路徑,使垂直框架的垂直面與滑台的滑動路徑具有一偏移角度;以及複數夾持元件,各夾持元件設置在垂直框架上之預定處,使各夾持元件隨著垂直框架微量偏移。 A carrier with an offset angle, comprising: a sliding table, the sliding table is provided with a sliding path; a vertical frame, the top end of the vertical frame is combined with the bottom end of the sliding table, and the vertical frame has a vertical surface, the vertical surface is slightly offset The sliding path makes the vertical surface of the vertical frame and the sliding path of the sliding table have an offset angle; offset.
Description
本發明係有關一種具有偏移角度之載具,尤指一種垂直框架的垂直面與滑台的滑動路徑具有偏移角度。 The present invention relates to a carrier with an offset angle, especially a vertical plane of a vertical frame and a sliding path of a slide table with an offset angle.
按,在整個資訊、通訊、以及消費性電子產業中,而印刷電路板實為不可或缺,印刷電路板的製作過程需經過顯影製程、電鍍製程、剝膜製程及蝕刻製程等步驟以製造細密的配線,作為支撐電子零件及零件間相互接續電路的基地。其中,電鍍製程的進行方式,係先將印刷電路板夾持在電鍍掛架中,再透過驅動裝置驅動電鍍掛架在工程設備中行進,並使印刷電路板浸置於電鍍槽中與陽極產生電化學作用,促使電鍍槽液中之銅離子鍍覆於印刷電路板上。 Press, in the entire information, communication, and consumer electronics industries, printed circuit boards are indispensable. The production process of printed circuit boards needs to go through the steps of developing process, electroplating process, film stripping process and etching process to make fine The wiring is used as a base for supporting electronic components and interconnecting circuits between components. Among them, the electroplating process is carried out by first clamping the printed circuit board in the electroplating rack, and then driving the electroplating rack to travel in the engineering equipment through the driving device, and immersing the printed circuit board in the electroplating tank and generating the anode Electrochemical action promotes the copper ions in the electroplating bath to be plated on the printed circuit board.
次按,電鍍掛架於電鍍製程中係扮演著導電與固定印刷電路板之作用,而印刷電路板之表面規劃有電路圖案之區域稱為有效區域,反之,印刷電路板之表面未規劃有電路圖案之區域稱為無效區域,習知固定印刷電路板的方式多在電鍍掛架上安置複數固定夾,再以固定夾夾持印刷電路板之無效區域,使印刷電路板固定在電鍍掛架上,而避免夾持該有效區域,但電流會集中於該無效高電流區域,因此該有效區域的鍍銅厚度不均勻,在該有效區域中找出鍍銅厚度的最大值與最小值,而以公式:R值=最大值-最小值進行計算後,通常會得出較大的R值之問題點。是以,本發明人有鑑於上揭問題點,乃構思一種具有偏移角度之載具,為本發明所欲解決的課題。 Second, the electroplating rack plays the role of conducting electricity and fixing the printed circuit board in the electroplating process, and the area where the circuit pattern is planned on the surface of the printed circuit board is called the effective area. On the contrary, the surface of the printed circuit board is not planned with circuits. The area of the pattern is called the invalid area. In the conventional way of fixing the printed circuit board, a plurality of fixing clips are arranged on the electroplating rack, and then the inactive area of the printed circuit board is clamped by the fixing clips, so that the printed circuit board is fixed on the electroplating rack. , and avoid clamping the effective area, but the current will be concentrated in the ineffective high current area, so the copper plating thickness of the effective area is not uniform, find the maximum and minimum copper plating thickness in the effective area, and use Formula: R value = maximum value - minimum value After calculation, the problem of a larger R value is usually obtained. Therefore, in view of the above-mentioned problems, the present inventor conceives a vehicle with an offset angle, which is the problem to be solved by the present invention.
本發明之主要目的,係在提供一種具有偏移角度之載具,其垂直框架的垂直面與滑台的滑動路徑具有偏移角度,可微量偏移印刷電路板,使各無效區域交疊,讓電流經過各無效區域至各有效區域,因此有效區域的鍍銅厚度均勻,進而具有讓有效區域的鍍銅厚度的R值變小之功效增進。 The main purpose of the present invention is to provide a carrier with an offset angle, the vertical plane of the vertical frame and the sliding path of the slide table have an offset angle, and the printed circuit board can be slightly offset, so that the invalid areas overlap, The current passes through each inactive area to each active area, so the copper plating thickness of the active area is uniform, and the effect of reducing the R value of the copper plating thickness of the active area is improved.
本發明之又一目的,則在提供一種具有偏移角度之載具,其以輕量化之板件構成垂直框架,進而減輕載具的重量之功效增進。 Another object of the present invention is to provide a carrier with an offset angle, which uses lightweight plates to form a vertical frame, thereby improving the effect of reducing the weight of the carrier.
為達上述目的,本發明採用之技術手段包含:一滑台,該滑台設有一滑動路徑;一垂直框架,該垂直框架之頂端結合該滑台之底端,且該垂直框架具有一垂直面,該垂直面微量偏移該滑動路徑,使該垂直面與該滑動路徑具有一偏移角度;以及複數夾持元件,各該夾持元件設置在該垂直框架上之預定處,使各該夾持元件隨著該垂直框架微量偏移。 In order to achieve the above object, the technical means adopted in the present invention include: a sliding table, which is provided with a sliding path; a vertical frame, the top end of the vertical frame is combined with the bottom end of the sliding table, and the vertical frame has a vertical surface , the vertical surface slightly offsets the sliding path, so that the vertical surface and the sliding path have an offset angle; The holding element is slightly offset with this vertical frame.
依據前揭特徵,該偏移角度為1度~5度。 According to the features of the front cover, the offset angle is 1 degree to 5 degrees.
依據前揭特徵,該垂直框架由複數輕量板件所構成。 According to the feature of the front opening, the vertical frame is composed of a plurality of lightweight panels.
依據前揭特徵,該垂直框架下方設有複數導正桿。 According to the feature of the front opening, a plurality of guide rods are arranged under the vertical frame.
依據前揭特徵,該夾持元件為彈簧夾子。 According to the front-disclosed feature, the clamping element is a spring clip.
依據前揭特徵,更包括一電極桿,該電極桿設在該滑台上。 According to the aforementioned features, it further includes an electrode rod, and the electrode rod is arranged on the sliding table.
依據前揭特徵,更包括複數印刷電路板,該印刷電路板之表面具有一有效區域與一包圍該有效區域之無效區域,並配合該具有偏移角度之載具為複數個,並以各該夾持元件可夾持該無效區域,使該印刷電路板隨著該垂直框架微量偏移,當各該滑台之間在預定一輸送距離時,則其中一個垂直框架之後側面與另一個垂直框架之前側面交錯,使其中一個垂直框架之後側面稍微凸出該無效區域與另一垂直框架之前側面稍微凸出該無效區域可交疊。 According to the aforementioned features, it further includes a plurality of printed circuit boards, the surface of the printed circuit board has an effective area and an ineffective area surrounding the effective area, and is matched with the carrier with the offset angle to form a plurality of, and each of the The clamping element can clamp the invalid area, so that the printed circuit board is slightly offset with the vertical frame. When the sliding table is at a predetermined conveying distance, the rear side of one of the vertical frames will be connected to the other vertical frame. The front sides are staggered so that one vertical frame slightly protrudes from the back side of the invalid area and the front side of the other vertical frame slightly protrudes from the invalid area to overlap.
藉助上揭技術手段,本發明揭露該垂直框架的垂直面與該滑台的滑動路徑具有該偏移角度,可微量偏移該印刷電路板,使各該無效區域交疊,讓電流經過各該無效區域至各該有效區域,因此該有效區域的鍍銅厚度均勻,並配合該輕量化之板件所構成該垂直框架,不僅具有讓該有效區域的鍍銅厚度的R值變小之功效增進,也能減輕該載具的重量之功效增進。 With the help of the above-mentioned technical means, the present invention discloses that the vertical plane of the vertical frame and the sliding path of the slide table have the offset angle, which can slightly offset the printed circuit board, so that the inactive areas overlap and the current flows through the The ineffective area is to each of the effective areas, so the copper plating thickness of the effective area is uniform, and the vertical frame formed by the lightweight plate not only has the effect of reducing the R value of the copper plating thickness of the effective area, and enhances the effect , and the effect of reducing the weight of the vehicle is increased.
10:具有偏移角度之載具 10: Vehicle with offset angle
11:滑台 11: Slider
12:垂直框架 12: Vertical Frame
121:輕量板件 121: Lightweight board
122:導正桿 122: guide rod
123:前側面 123: Front side
124:後側面 124: rear side
13:夾持元件 13: Clamping element
20:電極桿 20: Electrode rod
30:印刷電路板 30: Printed Circuit Board
31:有效區域 31: Effective area
32:無效區域 32: Invalid area
D:輸送距離 D: conveying distance
S:垂直面 S: vertical plane
X:滑動路徑 X: sliding path
θ:偏移角度 θ: offset angle
圖1係本發明具有偏移角度之載具之立體圖。 FIG. 1 is a perspective view of a carrier having an offset angle according to the present invention.
圖2係本發明夾持印刷電路板之立體圖。 FIG. 2 is a perspective view of the present invention for clamping the printed circuit board.
圖3係本發明具有偏移角度之載具之俯視圖。 FIG. 3 is a top view of a carrier having an offset angle of the present invention.
圖4係本發明具有偏移角度之載具為複數個之示意圖。 FIG. 4 is a schematic diagram of a plurality of carriers with offset angles according to the present invention.
圖5係本發明框架的垂直面與滑台的滑動路徑具有偏移角度之示意圖。 FIG. 5 is a schematic diagram showing that the vertical plane of the frame and the sliding path of the slide table have an offset angle according to the present invention.
圖6係圖5中6所示之放大圖。 FIG. 6 is an enlarged view of 6 in FIG. 5 .
圖7係本發明各無效區域交疊之示意圖。 FIG. 7 is a schematic diagram of the overlapping of invalid regions according to the present invention.
以下係藉由特定的具體實施例說明本發明之實施方式,熟習此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點與功效。本發明亦可藉由其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明之精神下進行各種修飾與變更。 The following describes the implementation of the present invention through specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied by other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention.
首先,請參閱圖1~圖7所示,本發明一種具有偏移角度之載具10之較佳實施例,包含:一滑台11,該滑台11設有一滑動路徑X,在本實
施例中,更包括一電極桿20,該電極桿20設在該滑台11上,但不限定於此。
First, please refer to FIGS. 1 to 7 , a preferred embodiment of a
一垂直框架12,該垂直框架12之頂端結合該滑台11之底端,且該垂直框架12具有一垂直面S,該垂直面S微量偏移該滑動路徑X,使該垂直框架12的垂直面S與該滑台11的滑動路徑X具有一偏移角度θ,在本實施例中,該偏移角度θ為1度~5度;該垂直框架12由複數輕量板件121所構成;該垂直框架12下方設有複數導正桿122,但不限定於此。
A
複數夾持元件13,各該夾持元件13設置在該垂直框架12上之預定處,使各該夾持元件13隨著該垂直框架12微量偏移,在本實施例中,該夾持元件13為彈簧夾子,但不限定於此。
A plurality of
如圖2、圖4、圖5、圖6及圖7所示,更包括複數印刷電路板30,該印刷電路板30之表面具有一有效區域31與一包圍該有效區域31之無效區域32,並配合該具有偏移角度之載具10為複數個,並以各該夾持元件13可夾持該無效區域32,使該印刷電路板30隨著該垂直框架12微量偏移,當各該滑台11之間在預定一輸送距離D時,則其中一個垂直框架12之後側面124與另一個垂直框架12之前側面123交錯,使其中一個垂直框架12之後側面124稍微凸出該無效區域32與另一垂直框架12之前側面123稍微凸出該無效區域32可交疊。
As shown in FIG. 2 , FIG. 4 , FIG. 5 , FIG. 6 and FIG. 7 , it further includes a plurality of
基於如此之構成,當電流流經該電極桿20、該滑台11、該垂直框架12、該夾持元件13至該印刷電路板30,使電流均勻分布於交疊的各該無效區域32至各該有效區域31,因此該有效區域31的鍍銅厚度均勻,在該有效區域31中找出鍍銅厚度的最大值與最小值,而以公式:R值=最大值-最小值進行計算後,亦得出較小的R值,與各該輕量化之板件121所構成該垂直框架12,亦減輕該具有偏移角度之載具10的重量,乃具有相輔相乘之功
效。
Based on such a configuration, when the current flows through the
綜上所述,本發明所揭示之技術手段,確具「新穎性」、「進步性」及「可供產業利用」等發明專利要件,祈請 鈞局惠賜專利,以勵創作,無任德感。 To sum up, the technical means disclosed in the present invention do meet the requirements of an invention patent such as "novelty", "progressiveness" and "available for industrial use". Moral sense.
惟,上述所揭露之圖式、說明,僅為本發明之較佳實施例,大凡熟悉此項技藝人士,依本案精神範疇所作之修飾或等效變化,仍應包括在本案申請專利範圍內。 However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention, and modifications or equivalent changes made by those skilled in the art according to the spirit of the present case should still be included in the scope of the patent application of this case.
10:具有偏移角度之載具 10: Vehicle with offset angle
11:滑台 11: Slider
12:垂直框架 12: Vertical Frame
121:輕量板件 121: Lightweight board
122:導正桿 122: guide rod
123:前側面 123: Front side
124:後側面 124: rear side
13:夾持元件 13: Clamping element
20:電極桿 20: Electrode rod
S:垂直面 S: vertical plane
X:滑動路徑 X: sliding path
θ:偏移角度 θ: offset angle
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110105251A TWI767561B (en) | 2021-02-17 | 2021-02-17 | Vehicle with Offset Angle |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110105251A TWI767561B (en) | 2021-02-17 | 2021-02-17 | Vehicle with Offset Angle |
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| Publication Number | Publication Date |
|---|---|
| TWI767561B true TWI767561B (en) | 2022-06-11 |
| TW202233904A TW202233904A (en) | 2022-09-01 |
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|---|---|---|---|
| TW110105251A TWI767561B (en) | 2021-02-17 | 2021-02-17 | Vehicle with Offset Angle |
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| Country | Link |
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| TW (1) | TWI767561B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005336561A (en) * | 2004-05-27 | 2005-12-08 | Sanwa Coatex Kk | Article holder for electrodeposition coating and electroplating |
| TWI578419B (en) * | 2012-03-27 | 2017-04-11 | 荏原製作所股份有限公司 | Plating method and plating apparatus |
| TWM613607U (en) * | 2021-02-17 | 2021-06-21 | 柏承科技股份有限公司 | Carrier with deviation angle |
-
2021
- 2021-02-17 TW TW110105251A patent/TWI767561B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005336561A (en) * | 2004-05-27 | 2005-12-08 | Sanwa Coatex Kk | Article holder for electrodeposition coating and electroplating |
| TWI578419B (en) * | 2012-03-27 | 2017-04-11 | 荏原製作所股份有限公司 | Plating method and plating apparatus |
| TWM613607U (en) * | 2021-02-17 | 2021-06-21 | 柏承科技股份有限公司 | Carrier with deviation angle |
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| Publication number | Publication date |
|---|---|
| TW202233904A (en) | 2022-09-01 |
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