TWI767129B - composite material - Google Patents

Abstract

A composite material is used for passive components. The composite material includes a metal layer and an insulating layer stacked on the metal layer. The resistivity of the metal layer is 1×10 ^-8 Ωm to 150×10 ^-8 Ωm. The alloy copper composition of the metal layer of the composite material makes the overall thickness of the composite material range from 66 μm to 325 μm. Compared with the conventional composite laminate, the thickness is greatly reduced, so that the passive components containing the composite material can be Miniaturized and compact design to meet market trends.

Description

composite material

The present invention relates to a composite material, especially a miniaturized composite material.

A passive component is an electronic component connected to an active component, which only consumes energy but cannot generate energy, such as resistance, capacitance, inductance, and so on. Generally, the composite stack in passive components is formed by a copper layer, an adhesive layer laid on one side of the copper layer, and a ceramic substrate layer fixed on the adhesive layer and stacked on the copper layer. . Generally speaking, limited by material properties, the thickness of the copper layer is about 150 μm to 300 μm, the thickness of the adhesive layer is about 50 μm to 100 μm, and the thickness of the ceramic substrate layer is about 300 μm. The total thickness of the layers is around 500 μm to 700 μm. However, in recent years, computer products, communication products or consumer electronic products are all moving towards the direction of component miniaturization and compact configuration. The thickness of the aforementioned passive components is not conducive to the trend of miniaturization and compact configuration. Therefore, a more advanced structure is required to Passive components are miniaturized to reduce the thickness of passive components.

Therefore, the object of the present invention is to provide a composite material suitable for passive components.

Therefore, the composite material of the present invention includes a metal layer and an insulating layer stacked on the metal layer. The resistivity of the metal layer is 1×10 ^-8 Ωm to 150×10 ^-8 Ωm.

The effect of the present invention is: the composition of alloy copper of the metal layer of the composite material makes the resistivity of the metal layer between 1×10 ^-8 Ωm and 150×10 ^-8 Ωm, which is not only suitable for passive components, but also makes the metal layer suitable for passive components. The overall thickness of the composite material ranges from 66 μm to 325 μm. Compared with the conventional composite laminate, the thickness is greatly reduced, so that the passive components containing the composite material can be miniaturized and compact in design to meet the market trend.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are designated by the same reference numerals.

Referring to FIG. 1 , it is a first embodiment of the composite material 1 of the present invention, which is suitable for a passive element. The composite material 1 includes an adhesive layer 11 having a first adhesive surface 111 and a second adhesive surface 112 opposite to the first adhesive surface 111 , and a first adhesive surface adhered to the adhesive layer 11 The metal layer 12 on the 111 , and an insulating layer 13 attached to the second adhesive surface 112 of the adhesive layer 11 and stacked on the metal layer 12 . The thickness of the adhesive layer 11 is between 10 μm and 50 μm, preferably 25 μm or 40 μm. The adhesive layer 11 contains a resin material, and in addition to the resin material, the adhesive layer 11 may also contain a group selected from an additive (Filler), a toughening agent (Rubber), a hardener (Hardener) or a mixture thereof. The resin material is selected from epoxy resin (Epoxy Resins), phenoxy resin (Phenoxy Resin), acrylic resin (Acrylic Resin), urethane resin (Polyurethane Resin), silicone rubber series (Silicone Rubber) resin, polyester Para-cycloxylylene resin (Poly-para-xylylene; Parylene), bismaleimide resin (Bimaleimide Resin), polyimide resin (Polyimide Resin), or a mixture thereof. The additive is selected from nitrogen-based flame retardant (Nitrogen flame retardant), organophosphorus flame retardant (organophosphorus flame retardant), inorganic phosphorus flame retardant (phosphorus flame retardant), hydroxides (such as aluminum hydroxide and magnesium hydroxide) , silica, or mixtures thereof. The toughening agent is a terminal butadiene-acrylonitrile copolymer (Carboxyl-Terminated Butadiene-Acrylonitrile Copolymer, CTBN for short). Preferably, the adhesive layer 11 contains 5-45wt% resin material, 5-30wt% additives, 20-60wt% toughening agent, and 0.5-5wt% hardener, the adhesive layer 11 is composed of the above The ingredients are dissolved and dispersed in a solvent system, and the heat resistance can be as high as 350°C.

The metal layer 12 contains alloyed copper and has a thickness ranging from 6 μm to 150 μm, preferably 75 μm. The resistivity is 1×10 ^-8 Ωm to 150×10 ^-8 Ωm, preferably 5×10 ^-8 Ωm to 50×10 ^-8 Ωm (measured at room temperature). The alloy copper contains copper (Cu), and is composed of nickel (Ni), manganese (Mn), tin (Sn), chromium (Cr), iron (Fe), aluminum (Al), cobalt (Co), magnesium (Mg) , silver (Ag), zinc (Zn), beryllium (Be), molybdenum (Mo), phosphorus (P), silicon (Si), and at least one metal composition of titanium (Ti). In the first embodiment, the content of manganese is 7.0wt% to 20.0wt%, preferably 12.0wt%, and the content of nickel is 1.0wt% to 5.0wt%, preferably 3.0wt%.

The thickness of the insulating layer 13 ranges from 50 μm to 125 μm, preferably 75 μm. The components of the insulating layer 13 are selected from the group consisting of Polyimide (PI), Polyethylene Terephthalate (PET), Teflon, Liquid Crystal Polymer (LCP) , Polyethylene (Polyethylene, PE), Polypropylene (Polypropylene', PP), Polystyrene (Polystyrene, PS), Polyvinyl Chloride (Polyvinyl Chloride, PVC), Nylon (Nylon or Polyamides), Acrylic (Acrylic) , Acrylonitrile-Butadiene-Styrene, Phenolic Resins, Epoxy, Polyester, Silicone, Polyurethane, PU ), polyamide-imide (PAI), or a group formed by any combination of the above.

Experimental example 1

As mentioned above, the composition of the adhesive layer 11 of the composite material 1 is 5-45wt% resin material, 5-30wt% additives, 20-60wt% toughening agent, and 0.5-5wt% hardening In this experimental example, a comparison group that does not meet the aforementioned mixing ratio, and three experimental groups that meet the aforementioned mixing ratio are used to detect its peel strength. Its composition is shown in Table 1 below. The comparison group and these experimental groups have The thickness is 25 μm. The experimental method is to coat the comparison group and the experimental groups on a black polyimide film (PI) of 3 mil (MIL), and press them together at 160 degrees Celsius for 2 minutes. It is then laminated with 0.15mm copper alloy, wherein the content of manganese contained in the copper alloy is 12.0wt%, the content of nickel is 3.0wt%, and the rest is copper. And after baking at 160 degrees Celsius for 1.5 hours, it was measured with the IPC-TM-650 2.4.9 test method. The measured peel strength is shown in Table 1 below.

Table I

From the above table 1, it can be clearly seen that the ratio of the adhesive layer 11 of the first embodiment can produce excellent peel strength, thereby achieving better adhesion, so the thickness of the adhesive layer 11 can be greatly reduced to reduce production costs and Productivity.

Experiment 2

This experimental example is to test the adhesion ability of the adhesive layer 11 to metals with different thicknesses. The two experimental groups take the adhesive layer 11 about 25 μm and coat it on a 3 mil (MIL) black polyimide film (PI) , pressed together at 160 degrees Celsius for 2 minutes, then laminated with 0.15mm and 0.3mm alloy copper, and baked at 160 degrees Celsius for 1.5 hours, and finally used IPC-TM-650 2.4.9 The test method is used for measurement, and the measured peel strength is shown in Table 2 below.

Table II

It can be seen from the above experimental results that the adhesive layer 11 can maintain good peel strength even with respect to alloy copper with a thickness greater than that of the present embodiment, and it can be seen that the adhesive layer 11 is indeed excellent in adhesion.

In the first embodiment, the content of manganese contained in the metal layer 12 of the composite material 1 is 12.0 wt %, the content of nickel is 3.0 wt %, and the rest is copper, so that the resistance range is 5×10 ^-8 Ωm ~50×10 ^-8 Ωm, which can ensure that the composite material 1 is suitable for passive components.

Referring to FIG. 2 , it is a second embodiment of the composite material 1 of the present invention. The second embodiment is substantially the same as the first embodiment, except that the insulating layer 13 of the second embodiment is made of Sandwich or multi-layer design, that is, the insulating layer 13 has two sub-insulating layers 131 , and an adhesive layer 132 between the sub-insulating layers 131 for bonding the sub-insulating layers 131 . In the second embodiment, the sub-insulating layers 131 are polyimide (PI), and the composition of the adhesive layer 132 is the same as that of the adhesive layer 11 . A plurality of sub-insulating layers 131 and a plurality of adhesive layers 132 may be alternately arranged according to requirements, and each adhesive layer 132 is located between two adjacent sub-insulating layers 131 to form a multi-layer structure. The second embodiment provides another configuration design of the insulating layer 13 to improve versatility.

To sum up, the composite material 1 can be controlled within a specific resistivity range, and can improve the bonding ability through the high peel strength of the adhesive layer 11 , so as to be suitable for passive components, so the object of the present invention can indeed be achieved.

However, the above are only examples of the present invention, and should not limit the scope of the present invention. All simple equivalent changes and modifications made according to the scope of the application for patent of the present invention and the contents of the patent specification are still within the scope of the present invention. within the scope of the invention patent.

1: Composite materials 11: Adhesive layer 111: The first adhesive side 112: Second adhesive side 12: Metal layer 13: Insulation layer 131: Sub insulating layer 132: Adhesive layer

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein: Fig. 1 is a schematic diagram showing a first embodiment of the composite material of the present invention; and FIG. 2 is a schematic diagram showing a second embodiment of the composite material of the present invention.

1: Composite materials

11: Adhesive layer

111: The first adhesive side

112: Second adhesive side

12: Metal layer

13: Insulation layer

Claims (3)

A composite material is used for passive components, the composite material comprises: a metal layer with a resistivity of 1 × 10 ^-8 Ωm to 150 × 10 ^-8 Ωm, the metal layer is copper alloy and contains copper, and contains manganese and at least one of nickel, the content of manganese is 7.0wt% to 20.0wt%, and the content of nickel is 1.0wt% to 5.0wt%; an insulating layer is stacked on the metal layer; and an adhesive layer is arranged on the Between the metal layer and the insulating layer, the adhesive layer contains 5-45wt% of resin material, 5-30wt% of additives, 20-60wt% of toughening agent, and 0.5-5wt% of hardener. The composite material of claim 1, wherein the resistivity of the metal layer is 5×10 ^-8 Ωm to 50×10 ^-8 Ωm. The composite material according to claim 1, wherein the components of the insulating layer are selected from the group consisting of polyimide, polyethylene terephthalate, Teflon, liquid crystal polymer, polyethylene, polypropylene, polystyrene , polyvinyl chloride, nylon, acrylic, acrylonitrile-butadiene-styrene copolymer, phenolic resin, epoxy resin, polyester, silicone, polyurethane, polyamide imide, or any combination of the above formed ethnic groups.

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