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TWI766585B - A bonding method of an electrical connection point, and battery module including a bonding structure of an electrical connection point - Google Patents

A bonding method of an electrical connection point, and battery module including a bonding structure of an electrical connection point Download PDF

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TWI766585B
TWI766585B TW110106196A TW110106196A TWI766585B TW I766585 B TWI766585 B TW I766585B TW 110106196 A TW110106196 A TW 110106196A TW 110106196 A TW110106196 A TW 110106196A TW I766585 B TWI766585 B TW I766585B
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welding
metal material
shaped
electrode sheet
welding track
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TW110106196A
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TW202201844A (en
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吳玉雯
吳尚賢
王俊堯
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新普科技股份有限公司
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Priority to CN202110284455.0A priority Critical patent/CN113839150A/en
Priority to EP21171129.6A priority patent/EP3930430A1/en
Priority to US17/244,155 priority patent/US20210408644A1/en
Priority to JP2021078706A priority patent/JP2022008070A/en
Publication of TW202201844A publication Critical patent/TW202201844A/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Battery Mounting, Suspending (AREA)

Abstract

A bonding structure of an electrical connection point in a battery module includes a conductive portion and an electrode sheet, and the electrode sheet is welded to the conductive portion. The electrode sheet is made of a first metal material, and the conductive portion is made of a second metal material. A welding track is formed at the interface between the electrode sheet and the conductive portion, and the welding track is formed by mixing the first metal material and the second metal material. The welding tracks do not substantially overlap. Moreover, the welding track includes a moving path; and a lateral path of shaking or oscillating movement on the side of the moving path.

Description

電連接點的接合方法及包含一電連接點的接合結構的電 池模塊 Bonding method of electrical connection point and electrical connection structure including an electrical connection point pool module

本發明關於一種電連接點的接合結構、電連接點的接合方法及包含該電連接點的接合結構的電池模塊。尤其關於一種具有兩個不同材質之電連接點的接合結構,而且該接合結構具有連續的焊接軌跡。 The present invention relates to a bonding structure of an electrical connection point, a bonding method of the electrical connection point, and a battery module including the bonding structure of the electrical connection point. In particular, it relates to a joint structure with two electrical connection points of different materials, and the joint structure has a continuous welding track.

依據先前技術,例如台灣專利第M285125號,提出一種電池模塊(battery module),其將數個異材質金屬導片,設置於電池芯(battery cell)之間或是電路基板之間,利用電阻熔接焊(Resistance welding)方式或焊錫加工方式(Soldering welding),使數顆電池芯呈並聯或串聯接合,形成導通的電池組(battery device)。 According to the prior art, such as Taiwan Patent No. M285125, a battery module is proposed, in which several metal conductors of different materials are arranged between battery cells or between circuit substrates, and are welded by resistance. Resistance welding or soldering welding is used to connect several battery cells in parallel or in series to form a conductive battery device.

電阻熔接焊方式(Resistance welding):當焊接異材質材料必須以貫穿式方式焊接,然而其不良率高,例如形成黏棒針、空焊及點爆等,而且焊接速度慢及生產方式材料選擇有侷限性,例如當不同熔點材料的焊接排列方式,會有無法焊 接的問題。錫焊方式(Soldering welding):各焊接點需以錫絲作為熔接材料,耗費錫資源以及人力資源,並增加環境污染;又易因焊錫作業速度慢,當生產條件的不確實、焊接手法與技巧之不純熟,使得人為性的焊錫品質問題(如冷焊、漏焊、錫珠、錫渣、錫球、……等)無法徹底解決與避免。然而,因上述問題而造成電池組斷路時,則使用者所攜之電池模塊則無法使用,若是造成電池組短路,則將使得電池模塊安全性大幅降低。 Resistance welding: When welding dissimilar materials, it must be welded in a penetrating way, but its defect rate is high, such as the formation of sticky needles, empty welding and spot explosion, etc., and the welding speed is slow and the production method material selection is limited. For example, when the welding arrangement of materials with different melting points, there will be failure to weld pick up problem. Soldering welding: each welding point needs to use tin wire as the welding material, which consumes tin resources and human resources, and increases environmental pollution; it is also easy to be slow due to the slow soldering operation, when the production conditions are uncertain, welding methods and skills. The immaturity makes it impossible to completely solve and avoid artificial solder quality problems (such as cold soldering, missing soldering, tin beads, tin slag, tin balls, etc.). However, when the battery pack is disconnected due to the above problem, the battery module carried by the user cannot be used. If the battery pack is short-circuited, the safety of the battery module will be greatly reduced.

另外,一種接合方式為單點雷射焊接方式,例如由中國專利公開號第CN108140494A號所提出。單點雷射焊接方式(Single spot laser welding):利用非接觸雷射焊接技術,將能量集中在金屬表面,透過單點激光,使兩種異材質金屬達到熔接作用。但會因為焊接的兩種金屬材料的特性差異造成焊接異常(如焊接不牢、熔接過深造成擊穿金屬導片…等),若是造成電池組短路,則將使得電池模塊安全性大幅降低。 In addition, a joining method is a single-point laser welding method, which is proposed by, for example, Chinese Patent Publication No. CN108140494A. Single spot laser welding: Using non-contact laser welding technology, the energy is concentrated on the metal surface, and the two dissimilar metals can be welded through a single point laser. However, due to the difference in the characteristics of the two metal materials to be welded, abnormal welding will be caused (such as weak welding, too deep welding, resulting in breakdown of metal guides, etc.). If the battery pack is short-circuited, the safety of the battery module will be greatly reduced.

依據本發明一實施例之目的在於,提供一種電連接點的接合結構,其能夠減少接合結構中焊接過度現象;以及前述電連接點的接合結構的製造方法。另一實施例之目的在於,提供一種電池模塊,其包含電連接點的接合結構作為電池裝置及電路載體間的接合結構,而能夠減少焊接過度現象。另一實施例之目的在於,提供一種具有較佳的穩定性的電連接點的接合結構;一種前述電連接點的接合結構的製造方法;以及一種包含前述電連接點的接合結構的電池模塊。 According to an embodiment of the present invention, an object of the present invention is to provide a bonding structure for electrical connection points, which can reduce excessive soldering phenomenon in the bonding structure, and a method for manufacturing the foregoing bonding structure for electrical connection points. Another embodiment aims to provide a battery module, which includes a bonding structure of electrical connection points as a bonding structure between a battery device and a circuit carrier, which can reduce excessive soldering. Another embodiment aims to provide a bonding structure for electrical connection points with better stability; a method for manufacturing the aforementioned bonding structure for electrical connection points; and a battery module including the aforementioned bonding structure for electrical connection points.

依據本發明一實施例,提供一種電連接點的接合結構其包含一導電部及一電極片,該電極片被焊接於導電部。該電極片為一第一金屬材料,而該導電部為一第二金屬材料。在該電極片及該導電部的界面形成有一焊接軌跡,且該焊接軌跡為該第一金屬材料與該第二金屬材料混合而成。該焊接軌跡實質上不重疊。而且,該焊接軌跡包含一移動路徑;以及在該移動路徑的側向進行搖晃移動或振盪移動的一側向路徑。而且,該焊接軌跡在一橫切面上具有2個以上的焊接區域。 According to an embodiment of the present invention, a bonding structure of an electrical connection point is provided, which includes a conductive portion and an electrode sheet, and the electrode sheet is welded to the conductive portion. The electrode piece is made of a first metal material, and the conductive portion is made of a second metal material. A welding track is formed at the interface between the electrode sheet and the conductive portion, and the welding track is formed by mixing the first metal material and the second metal material. The welding trajectories do not substantially overlap. Furthermore, the welding track includes a moving path; and a lateral path that performs a wobbly movement or an oscillating movement in the lateral direction of the moving path. Furthermore, the welding track has two or more welding regions in one cross-section.

一實施例中,較佳地,該移動路徑的圖形為UU字型、U字型、V字型、III字型、IIII字型、M字型、W字型、VV字型、S字型或II字型。 In an embodiment, preferably, the graphics of the moving path are UU-shaped, U-shaped, V-shaped, III-shaped, IIII-shaped, M-shaped, W-shaped, VV-shaped, S-shaped or font II.

一實施例中,該焊接軌跡的軌跡長度大於0.5mm,該些焊接區域在該橫切面上的寬度尺寸大於0.3mm。 In one embodiment, the track length of the welding track is greater than 0.5 mm, and the width dimension of the welding regions on the cross section is greater than 0.3 mm.

一實施例中,該焊接軌跡所產生的焊接部的拉力強度大於1Kgf。 In one embodiment, the tensile strength of the welded portion generated by the welding track is greater than 1 Kgf.

一實施例中,該焊接軌跡是利用一高能量線照射該電極片及該導電部的界面,使該第一金屬材料與該第二金屬材料混合。一實施例中,該電路載體為一印刷電路組裝板,而且該導電部包含一焊錫層及一銅箔。 In one embodiment, the welding track utilizes a high-energy ray to irradiate the interface between the electrode sheet and the conductive portion, so that the first metal material and the second metal material are mixed. In one embodiment, the circuit carrier is a printed circuit assembly board, and the conductive portion includes a solder layer and a copper foil.

依據本發明一實施例,提供一種電池模塊包含:如前所述的電連接點的接合結構、至少一電池裝置及一電路載體。至少一電池裝置包含該電連接點的接合結 構,該接合結構包含一電極片,且該電極片從該至少一電池裝置的本體延伸而出。電路載體包含該電連接點的接合結構,該接合結構包含一導電部。該橫切面的法線方向不垂直於該電極片從該至少一電池裝置延伸而出的延伸方向。一實施例中,較佳地,該橫切面的法線方向平行於該電極片從該至少一電池裝置延伸而出的該延伸方向。 According to an embodiment of the present invention, there is provided a battery module including: the aforementioned joint structure for electrical connection points, at least one battery device and a circuit carrier. At least one battery device includes a bonding junction of the electrical connection point The joint structure includes an electrode sheet, and the electrode sheet extends from the body of the at least one battery device. The circuit carrier includes a bonding structure of the electrical connection point, the bonding structure including a conductive portion. The normal direction of the cross section is not perpendicular to the extending direction of the electrode sheet extending from the at least one battery device. In one embodiment, preferably, the normal direction of the cross section is parallel to the extending direction of the electrode sheet extending from the at least one battery device.

一實施例中,該電極片從該至少一電池裝置延伸而出的該延伸方向,為該移動路徑的圖形的長度方向。 In one embodiment, the extending direction of the electrode sheet extending from the at least one battery device is the length direction of the pattern of the moving path.

依據本發明一實施例,提供一種電連接點的接合結構的製造方法,用以製造如前述電連接點的接合結構,該製造方法包含如下步驟。利用一高能量線照射該電極片及該導電部的界面,使該第一金屬材料與該第二金屬材料混合。使該高能量線沿該移動路徑移動。以及,使該高能量線在該移動路徑的側向進行搖晃移動或振盪移動來形成該側向路徑,而形成該焊接軌跡。 According to an embodiment of the present invention, there is provided a manufacturing method of a bonding structure of an electrical connection point for manufacturing the aforementioned bonding structure of an electrical connection point. The manufacturing method includes the following steps. A high-energy ray is used to irradiate the interface between the electrode sheet and the conductive portion, so that the first metal material and the second metal material are mixed. The high energy wire is moved along the movement path. And, the high-energy wire is caused to shake or oscillate in the lateral direction of the moving path to form the lateral path, thereby forming the welding track.

一實施例中,該利用一高能量線產生裝置所產生的一高能量線的步驟,包含以下步驟。控制該高能量線產生裝置的輸出的能量區間為70-100W之功率;以及使該高能量線在該移動路徑上移動的焊接速率為70-90mm/sec。 In one embodiment, the step of using a high-energy ray generated by a high-energy ray generating device includes the following steps. The energy range for controlling the output of the high-energy wire generating device is a power of 70-100 W; and the welding speed for moving the high-energy wire on the moving path is 70-90 mm/sec.

綜上所述,依據本發明一實施例之電連接點的接合結構,具有一焊接軌跡,且該焊接軌跡為第一金屬材料與第二金屬材料混合而成,焊接軌跡實質上不重疊,而且該焊接軌跡在一橫切面上具有2個以上的焊接區域,能夠減少破壞電路 載體的最低部,並且達到改善第一金屬材料與第二金屬材料間的焊接強度。一實施例中,電連接點的接合結構可以用於電池模塊,作為其電池裝置及電路載體間的接合結構。 To sum up, the bonding structure of the electrical connection point according to an embodiment of the present invention has a welding track, and the welding track is formed by mixing the first metal material and the second metal material, the welding track does not substantially overlap, and The welding track has more than 2 welding areas on a cross section, which can reduce the damage to the circuit The lowest part of the carrier, and to improve the welding strength between the first metal material and the second metal material. In one embodiment, the bonding structure of the electrical connection point can be used in the battery module as the bonding structure between the battery device and the circuit carrier.

111-114:焊接區域 111-114: Welding area

200:電池模塊 200: battery module

210:外殼 210: Shell

211:頂蓋 211: Top cover

212:框架 212: Frame

213:底蓋 213: Bottom cover

214:容置空間 214: accommodating space

220:電池裝置 220: Battery unit

221:正極片 221: positive electrode

222:負極片 222: negative electrode

230:電路載體 230: Circuit Carrier

300:接合結構 300: Joint structure

301:載體 301: Carrier

302:介質 302: Medium

303:底材 303: Substrate

304:基材 304: Substrate

A:雷射中心點 A: Laser center point

B:雷射中心點 B: Laser center point

D:拉力測試方向 D: Tensile test direction

Lf:焊接軌跡 Lf: welding track

Lv:移動路徑 Lv: movement path

Sa:橫切面 Sa: cross section

Wo:側向路徑 Wo: Lateral Path

圖1顯示本發明一實施例之電池模塊的分解圖。 FIG. 1 shows an exploded view of a battery module according to an embodiment of the present invention.

圖2顯示圖1實施例之電池模塊的內部的部分結構的平面圖。 FIG. 2 is a plan view showing a partial structure of the interior of the battery module of the embodiment of FIG. 1 .

圖3顯示本發明多個實施例之接合結構的俯視圖。 FIG. 3 shows a top view of a joint structure according to various embodiments of the present invention.

圖4顯示圖3之實施例(a)、(d)及(c)之接合結構的各部位尺寸。 FIG. 4 shows the dimensions of each part of the joint structure of the embodiments (a), (d) and (c) of FIG. 3 .

圖5A顯示圖3(a)實施例之焊接軌跡的圖案的放大示意圖。 FIG. 5A shows an enlarged schematic view of the pattern of the welding track in the embodiment of FIG. 3( a ).

圖5B顯示本發明一實施例之焊接軌跡的圖案的放大示意圖。 FIG. 5B shows an enlarged schematic view of the pattern of the welding track according to an embodiment of the present invention.

圖6顯示本發明一實施例之金屬接合結構的剖面圖。 FIG. 6 shows a cross-sectional view of a metal bonding structure according to an embodiment of the present invention.

圖7A顯示為具有側向的搖晃移動且呈M形的焊接軌跡的俯視圖。 7A shows a top view of an M-shaped weld trace with lateral rocking movement.

圖7B顯示6個螺旋點的點焊的焊接軌跡的俯視圖。 Figure 7B shows a top view of the weld trace of a 6 helical spot weld.

圖7C顯示為另一實施例之具有側向的搖晃移動且呈M形的焊接軌跡的俯視圖。 7C shows a top view of another embodiment of an M-shaped welding track with lateral rocking movement.

圖8A顯示有部分重疊之M形的焊接圖形的俯視圖。 FIG. 8A shows a top view of an M-shaped welding pattern with partial overlap.

圖8B顯示圖8A之重疊部的剖面圖。 FIG. 8B shows a cross-sectional view of the overlapping portion of FIG. 8A .

圖1顯示本發明一實施例之電池模塊的分解圖。圖2顯示圖1實施例之電池模塊的內部的部分結構的平面圖。如圖1及2所示,依據本發明一實施例,電池模塊200包含一外殼210、一接合結構300、至少一電池裝置220及一電路載體230。電池裝置220包含至少一電池芯。一實施例中,該至少一電池芯也可以為多數個,且電池裝置220為該些電池芯的串聯及並聯。外殼210界定出一容置空間214,用以容置電池裝置220及電路載體230。如圖2所示,電池裝置220通過接合結構300連接於電路載體230。外殼210包含一頂蓋211、底蓋213及一框架212,框架212位於頂蓋211及底蓋213之間,且界定出該容置空間214。 FIG. 1 shows an exploded view of a battery module according to an embodiment of the present invention. FIG. 2 is a plan view showing a partial structure of the interior of the battery module of the embodiment of FIG. 1 . As shown in FIGS. 1 and 2 , according to an embodiment of the present invention, the battery module 200 includes a casing 210 , a joint structure 300 , at least one battery device 220 and a circuit carrier 230 . The battery device 220 includes at least one battery cell. In one embodiment, the at least one battery cell may also be a plurality, and the battery device 220 is a series and parallel connection of the battery cells. The housing 210 defines an accommodating space 214 for accommodating the battery device 220 and the circuit carrier 230 . As shown in FIG. 2 , the battery device 220 is connected to the circuit carrier 230 through the bonding structure 300 . The casing 210 includes a top cover 211 , a bottom cover 213 and a frame 212 . The frame 212 is located between the top cover 211 and the bottom cover 213 and defines the accommodating space 214 .

圖2顯示圖1實施例之電池模塊的內部的部分結構的平面圖。如圖2所示,每一電池裝置220包含一負極片222和一正極片221以彼此隔開的方式從電池裝置220的本體延伸而出。負極片222和正極片221被焊接於電路載體230的多個導電部231,且於負極片222和電路載體230的一導電部231之間以及正極片221和電路載體230的另一導電部231之間,分別形成一接合結構300,藉以使左側及右側的電池裝置220電連接,並將電池裝置220的電力透過電路載體230輸出至外部。 FIG. 2 is a plan view showing a partial structure of the interior of the battery module of the embodiment of FIG. 1 . As shown in FIG. 2 , each battery device 220 includes a negative electrode sheet 222 and a positive electrode sheet 221 extending from the body of the battery device 220 in a spaced manner from each other. The negative electrode sheet 222 and the positive electrode sheet 221 are welded to the plurality of conductive parts 231 of the circuit carrier 230 , and between the negative electrode sheet 222 and one conductive part 231 of the circuit carrier 230 and between the positive electrode sheet 221 and the other conductive part 231 of the circuit carrier 230 Between them, a joint structure 300 is respectively formed, so as to electrically connect the battery devices 220 on the left and right sides, and output the power of the battery devices 220 to the outside through the circuit carrier 230 .

依據本發明,負極片222和正極片221的金屬材料可以為相同,也可以為不同。一實施例中,當電池裝置220為鋰離子電容器、鋰離子二次電池,且負極片222和正極片221為相同的金屬材料時,由於電化學的作用,其中一方會溶解,因此,較佳地負極片222和正極片221包括彼此不同的金屬材料。更具體而言,本實施例中,正極片221含有鋁,負極片222含有銅。電路載體230可以為電路板、金屬板及包含有電路的壓克力板。電路板可以為PCB板或一BMS控制板。 According to the present invention, the metal materials of the negative electrode sheet 222 and the positive electrode sheet 221 may be the same or different. In one embodiment, when the battery device 220 is a lithium ion capacitor or a lithium ion secondary battery, and the negative electrode sheet 222 and the positive electrode sheet 221 are made of the same metal material, one of them will dissolve due to electrochemical action. Therefore, it is preferable to The negative electrode tab 222 and the positive electrode tab 221 include metal materials different from each other. More specifically, in this embodiment, the positive electrode sheet 221 contains aluminum, and the negative electrode sheet 222 contains copper. The circuit carrier 230 may be a circuit board, a metal plate, and an acrylic plate containing circuits. The circuit board can be a PCB board or a BMS control board.

在負極片222與電路載體230的導電部231的接合結構300中,負極片222為一第一金屬材料,而電路載體230的導電部231為一第二金屬材料。在負極片222及電路載體230的導電部231的界面,形成有一焊接軌跡Lf(如後述),且焊接軌跡Lf為該第一金屬材料與該第二金屬材料混合而成。依據本發明一實施例提供一種接合結構300,其包含一第一金屬材料及一第二金屬材料,並且在第一金屬材料及第二金屬材料的的界面,形成有一焊接軌跡Lf。第一金屬材料及第二金屬材料可以為相同材料,也可以為相異材料。較佳地接合結構300的材質可以是純質金屬片(如銅鎳、鎳銅、銅銅、鎳鎳等)間的結合,也可以是化合物合金(如銅鍍鎳、鐵鍍鎳或銅鎳合金等金屬合金片)與鎳、鍍銀、鍍金或化銀及化金等金屬片間的焊接。 In the joint structure 300 of the negative electrode sheet 222 and the conductive portion 231 of the circuit carrier 230 , the negative electrode sheet 222 is a first metal material, and the conductive portion 231 of the circuit carrier 230 is a second metal material. A welding track Lf (as described later) is formed at the interface between the negative electrode sheet 222 and the conductive portion 231 of the circuit carrier 230 , and the welding track Lf is formed by mixing the first metal material and the second metal material. According to an embodiment of the present invention, a bonding structure 300 is provided, which includes a first metal material and a second metal material, and a welding track Lf is formed at the interface of the first metal material and the second metal material. The first metal material and the second metal material may be the same material or different materials. Preferably, the material of the bonding structure 300 can be a combination of pure metal sheets (such as copper-nickel, nickel-copper, copper-copper, nickel-nickel, etc.), or a compound alloy (such as copper-nickel plating, iron-nickel plating or copper-nickel plating). Welding between metal alloy sheets such as alloys) and nickel, silver-plated, gold-plated or silver and gold metal sheets.

一實施例中,接合結構300是利用一高能量線產生裝置(未圖示)所產生的一高能量線來焊接,較佳地是利用雷射焊接。一實施例中,高能量線可以為光纖維雷射器的照射光。在高功率雷射焊接設計中,最主要是用利用高功率雷射以不同的焊接方式連續焊接。利用雷射能量的強弱、移動速率及被焊接物的外形尺寸與材質型態差異,搭配精準的治工具的使用,將兩種獨立的金屬片達成界面熔接狀態,而能夠使用於電池裝置220的串聯或並聯。一實施例中,被焊接物可以是兩種獨立金屬片(如銅鎳、鎳銅、銅銅、鎳鎳等)間的結合,也可以是化合物合金(如銅鍍鎳、鐵鍍鎳或銅鎳合金等金屬合金片)與鎳、鍍銀、鍍金或化銀及化金等金屬片間的焊接。較佳地,此接合結構300係於電池裝置220及電路基板間之連結使用。 In one embodiment, the bonding structure 300 is welded by a high-energy beam generated by a high-energy beam generator (not shown), preferably by laser welding. In one embodiment, the high-energy line may be the irradiating light of an optical fiber laser. In the design of high-power laser welding, the most important thing is to use high-power lasers to continuously weld in different welding methods. Using the strength of the laser energy, the moving speed, and the difference in the dimensions and material types of the objects to be welded, together with the use of precise tools, the two independent metal sheets can be welded together at the interface, which can be used in the battery device 220. series or parallel. In one embodiment, the object to be welded can be a combination of two independent metal sheets (such as copper-nickel, nickel-copper, copper-copper, nickel-nickel, etc.), or a compound alloy (such as copper-nickel-plated, iron-nickel-plated or copper-plated) Welding between metal alloy sheets such as nickel alloys) and metal sheets such as nickel, silver-plated, gold-plated or silver and gold. Preferably, the bonding structure 300 is used for the connection between the battery device 220 and the circuit substrate.

如圖2所示,一實施例中,接合結構300可以為一種電連接點的接合結構,可以使用於一電池模塊200,其中接合結構300包含一導電部及一電極片。本實施例中,接合結構300的導電部,可以為電路載體230的一導電部231。然而本發明不限於此,於其他實施例中,接合結構300的導電部也可以是一導電片、匯流排、導電架或一金屬片等。本實施例中,接合結構300的電極片,可以為電池裝置220的正極片221,也可以為負極片222。 As shown in FIG. 2 , in one embodiment, the bonding structure 300 can be a bonding structure of electrical connection points, which can be used in a battery module 200 , wherein the bonding structure 300 includes a conductive portion and an electrode sheet. In this embodiment, the conductive portion of the bonding structure 300 may be a conductive portion 231 of the circuit carrier 230 . However, the present invention is not limited thereto, and in other embodiments, the conductive portion of the bonding structure 300 may also be a conductive sheet, a bus bar, a conductive frame, a metal sheet, or the like. In this embodiment, the electrode sheet of the bonding structure 300 may be the positive electrode sheet 221 of the battery device 220 or the negative electrode sheet 222 .

圖3顯示本發明多個實施例之接合結構300的俯視圖。圖4顯示圖3之實施例(a)、(d)及(c)之接合結構300的各部位尺寸。圖5A顯示圖3之實施例(a)之焊接軌跡的圖案的放大示意圖。圖5B顯示本發明一實施例之焊接軌跡的圖案的放大示意圖。圖3顯示多個實施例(a)~(f)之焊接軌跡Lf的圖形。如圖3(a)~(f)、圖5A及圖5B所示,該些焊接軌跡Lf實質上不重疊,而且焊接軌跡Lf包含一移動路徑Lv;以及在移動路徑Lv的側向進行搖晃(wobble)移動或振盪移動的一側向路徑Wo。焊接軌跡Lf的移動路徑Lv的圖形分別為UU字型、U字型、V字型、III字型、IIII字型(可以為M字型、VV字型或W字型)、S字型及II字型。圖3(d)的雷射軌跡是由4條直線所構成而且為由多個正反向的V、M或W字型的路徑所構成,而且該些4條直線的焊接軌跡Lf實質上不重疊。 FIG. 3 shows a top view of a bonding structure 300 according to various embodiments of the present invention. FIG. 4 shows the dimensions of each part of the bonding structure 300 of the embodiments (a), (d) and (c) of FIG. 3 . FIG. 5A shows an enlarged schematic view of the pattern of the welding track of the embodiment (a) of FIG. 3 . FIG. 5B shows an enlarged schematic view of the pattern of the welding track according to an embodiment of the present invention. FIG. 3 shows graphs of welding trajectories Lf of various embodiments (a) to (f). As shown in FIGS. 3(a)-(f), 5A and 5B, the welding tracks Lf do not substantially overlap, and the welding track Lf includes a movement path Lv; and shakes in the lateral direction of the movement path Lv ( wobble) moving or oscillating movement of a lateral path Wo. The graphics of the moving path Lv of the welding track Lf are UU-shaped, U-shaped, V-shaped, III-shaped, IIII-shaped (can be M-shaped, VV-shaped or W-shaped), S-shaped and Type II. The laser trajectory in FIG. 3(d) is composed of four straight lines and is composed of a plurality of forward and reverse V, M or W-shaped paths, and the welding trajectory Lf of these four straight lines is substantially different. overlapping.

如圖4所示,圖4之實施例(d)的圖形的線寬為0.5±0.1mm。依據本發明,在圖3的多個實施例(a)~(f)的焊接有效區域6mm*4mm的空間內,焊接區域尺寸大小約3mm*2mm(依據需求微調尺寸),雷射焊接的軌跡型態及軌跡長短的特 徵包含:雷射連續焊接軌跡為實質上不重疊。一實施例中,較佳地雷射連續焊接軌跡須獨立且單一。一實施例中,焊接有效區域可以為7.8mm*4mm的電極片;或者為導電部的區域,而3mm*2mm的焊接區域為焊接有效區域中的任一個區域。另一實施例中,焊接有效區域可以為電極片及導電部的重疊處,而3mm*2mm的焊接區域為焊接有效區域中的任一個區域。 As shown in FIG. 4 , the line width of the pattern in the embodiment (d) of FIG. 4 is 0.5±0.1 mm. According to the present invention, within the space of the welding effective area of 6mm*4mm in the various embodiments (a)~(f) of FIG. 3, the size of the welding area is about 3mm*2mm (fine-tuning the size according to the needs), and the trajectory of the laser welding is Characteristics of type and track length The characteristics include: the laser continuous welding trajectories are substantially non-overlapping. In one embodiment, preferably, the laser continuous welding track must be independent and single. In one embodiment, the welding effective area may be an electrode sheet of 7.8 mm*4 mm; or the area of the conductive portion, and the welding area of 3 mm*2 mm is any one of the welding effective areas. In another embodiment, the welding effective area may be the overlap of the electrode sheet and the conductive portion, and the welding area of 3 mm*2 mm is any one of the welding effective areas.

如圖5A及圖5B所示,一實施例中,焊接軌跡Lf可以為一雷射連續焊接軌跡。如圖5B所示,當雷射線不動時其所造成的焊接區域Sb大致為圓形,其焊接區域Sb的寬度尺寸為wb。更具體而言,雷射線呈大致圓形的形狀,其照射在金屬材料的表面後會熱擴散,而形成焊接區域Sb。雷射線移動時,舉例而言從雷射中心點A移動至雷射中心點B時焊接軌跡Lf形成連續的線,於本發明中較佳地,雷射中心點所形成的焊接軌跡Lf是不重疊,而不同時間點的雷射線的熱擴散區域重疊。一實施例中,較佳地,焊接軌跡Lf其軌跡長度大於焊接區域Sb的寬度wb。舉例而言,雷射中心點A及雷射中心點B之間焊接軌跡Lf的軌跡長度的距離Lab,大於焊接區域Sb寬度wb。當焊接軌跡Lf的長度小於焊接區域Sb寬度wb,雷射線實質上等於沒有移動,而會形成單個點,如此無法形成拉力強度大於1Kgf的焊接部分。一實施例中,焊接區域Sb的寬度wb大於或等於0.3mm。 As shown in FIG. 5A and FIG. 5B , in one embodiment, the welding track Lf may be a laser continuous welding track. As shown in FIG. 5B , when the laser ray does not move, the welding area Sb caused by the laser beam is approximately circular, and the width dimension of the welding area Sb is wb. More specifically, the laser beam has a substantially circular shape, and when it is irradiated on the surface of the metal material, it is thermally diffused to form the welding region Sb. When the laser line moves, for example, when moving from the laser center point A to the laser center point B, the welding track Lf forms a continuous line. In the present invention, preferably, the welding track Lf formed by the laser center point is not. overlap, while the thermal diffusion regions of the laser rays at different time points overlap. In one embodiment, preferably, the length of the welding track Lf is greater than the width wb of the welding region Sb. For example, the distance Lab of the track length of the welding track Lf between the laser center point A and the laser center point B is greater than the width wb of the welding region Sb. When the length of the welding track Lf is less than the width wb of the welding area Sb, the laser beam does not move substantially, but a single point is formed, so that the welding part with a tensile strength greater than 1Kgf cannot be formed. In one embodiment, the width wb of the welding region Sb is greater than or equal to 0.3 mm.

一實施例中,較佳地,焊接軌跡Lf的軌跡長度大於(>)0.5mm。一實施例中,較佳地,焊接軌跡Lf在拉力測試方向D(如圖2及圖5A所示)的大部分(最佳的是全部)的橫切面Sa具有2個以上的焊接區域111-114,且焊接區域111-114在橫切面Sa上的寬度尺寸為大於或等於0.3mm(橫切面需>=2個焊接區域、以及焊接區域 在橫切面Sa上的寬度尺寸>=0.3mm)。所謂大部分是指一半以上,此外一實施例中,當焊接區域111-114在橫切面Sa剛好位於焊接區域Sb的直徑上時,焊接區域111-114在橫切面Sa上的寬度尺寸實質上等於焊接區域Sb的寬度wb。較佳的情況是,如圖3之實施例(b)及圖5A所示,焊接軌跡Lf在方向D的任一橫切面Sa具有2個以上的焊接區域111-114。於圖5A實施例中,焊接軌跡Lf在方向D的任一橫切面Sa具有4個焊接區域111-114。一實施例,較佳地,焊接軌跡Lf所產生的焊接部的拉力強度大於1Kgf(拉力強度需>1Kgf以符合需求)。如圖4(a)所示,單個U字型的寬度L1為1.2±0.3mm,而其長度L3為2±0.8mm。兩個U字型的總寬度L2為3±0.8mm,而且兩個U字型的中心線之間的距離L4為1.9±0.3mm。如圖5A所示,側向路徑Wo之2倍的振幅或距離最遠的兩個端點(一實施例中亦可以為焊接軌跡Lf的移動路徑Lv之線寬)的距離L5為0.5±0.1mm。 In one embodiment, preferably, the track length of the welding track Lf is greater than (>) 0.5 mm. In one embodiment, preferably, most (best is all) of the cross-section Sa of the welding track Lf in the tensile test direction D (as shown in FIG. 2 and FIG. 5A ) has more than two welding areas 111- 114, and the width dimension of the welding areas 111-114 on the cross-section Sa is greater than or equal to 0.3mm (the cross-section needs to be >= 2 welding areas, and the welding area Width dimension on cross section Sa >=0.3mm). The so-called “majority” refers to more than half. In addition, in an embodiment, when the welding areas 111-114 are just on the diameter of the welding area Sb on the cross-section Sa, the width dimension of the welding areas 111-114 on the cross-section Sa is substantially equal to The width wb of the welding area Sb. Preferably, as shown in the embodiment (b) of FIG. 3 and FIG. 5A , the welding track Lf has two or more welding regions 111 to 114 on any cross-section Sa in the direction D. As shown in FIG. In the embodiment of FIG. 5A , the welding track Lf has four welding areas 111 - 114 on any cross-section Sa in the direction D. As shown in FIG. In one embodiment, preferably, the tensile strength of the welded portion generated by the welding track Lf is greater than 1Kgf (the tensile strength needs to be >1Kgf to meet the requirements). As shown in FIG. 4( a ), the width L1 of a single U-shape is 1.2±0.3 mm, and the length L3 thereof is 2±0.8 mm. The total width L2 of the two U-shapes is 3±0.8 mm, and the distance L4 between the center lines of the two U-shapes is 1.9±0.3 mm. As shown in FIG. 5A , the amplitude of the lateral path Wo is twice the amplitude or the distance L5 between the two farthest endpoints (in one embodiment, the line width of the moving path Lv of the welding track Lf) is 0.5±0.1 mm.

如圖2及圖5A所示,一實施例中,拉力測試方向D為負極片222或正極片221從電池裝置220的延伸而出的延伸方向。一實施例中,橫切面Sa的法線方向N不垂直於拉力測試方向D。較佳地,橫切面Sa的法線方向N平行於拉力測試方向D。一實施例中,拉力測試方向D(負極片222或正極片221從電池裝置220的延伸而出的延伸方向)為焊接圖形(U、I或S字型)的長度方向。如圖2所示,測試方向D為U字型的長度方向。一實施例中,測試方向D大致上平行於電池裝置的長軸的延伸方向。一實施例中,測試方向D大致上平行於電極片凸出電池裝置220的延伸方向。一實施例中,焊接圖形的長度方向,可以為該圖形中具有最長長度的移動路徑Lv的延伸方向。 As shown in FIG. 2 and FIG. 5A , in one embodiment, the tensile test direction D is the extending direction of the negative electrode sheet 222 or the positive electrode sheet 221 extending from the battery device 220 . In one embodiment, the normal direction N of the transverse plane Sa is not perpendicular to the tensile test direction D. Preferably, the normal direction N of the transverse plane Sa is parallel to the tensile test direction D. In one embodiment, the tensile test direction D (the extending direction of the negative electrode sheet 222 or the positive electrode sheet 221 from the battery device 220 ) is the length direction of the welding pattern (U, I or S shape). As shown in FIG. 2 , the test direction D is the longitudinal direction of the U-shape. In one embodiment, the testing direction D is substantially parallel to the extending direction of the long axis of the battery device. In one embodiment, the test direction D is substantially parallel to the extending direction of the electrode sheet protruding from the battery device 220 . In one embodiment, the length direction of the welding pattern may be the extending direction of the moving path Lv with the longest length in the pattern.

圖6顯示本發明一實施例之金屬接合結構的剖面圖。焊接材料的說明及效果,如下。電接點的接合結構300中的該電極片及該導電部的材質,依據不同的產品需求可以是同質或異材質金屬,在PCBA(Printed Circuit Board Assembly,印刷電路組裝板)上進行焊接。如圖6所示,接合結構300的結構,從上往下分別疊層,包含一基材304、一底材303、一介質302以及一載體301。基材304的厚度h4為0.05~0.25mm,基材材料可以是鎳、銅、銅鍍鎳、銅鎳合金、鐵鍍鎳、鋁。底材303的厚度h3為0.1~0.6mm,底材材料可以是鎳、銅、銅鍍鎳、銅鎳合金、化金(Electroless Nickle Immersion Gold)及化銀(Electroless Nickle Immersion Silver)板。介質材料可以是焊錫,而作為介質302的焊錫的厚度h2可以為0.05~0.15mm。載體材料可以是PCB、金屬板、壓克力。載體301的厚度h1可以為0.5~1.5mm。 FIG. 6 shows a cross-sectional view of a metal bonding structure according to an embodiment of the present invention. The description and effects of welding materials are as follows. The material of the electrode sheet and the conductive portion in the bonding structure 300 of the electrical contact may be metal of the same quality or different material according to different product requirements, and are welded on a PCBA (Printed Circuit Board Assembly). As shown in FIG. 6 , the structure of the bonding structure 300 is laminated from top to bottom, and includes a substrate 304 , a substrate 303 , a medium 302 and a carrier 301 . The thickness h4 of the base material 304 is 0.05-0.25 mm, and the material of the base material can be nickel, copper, nickel-plated copper, copper-nickel alloy, nickel-plated iron, or aluminum. The thickness h3 of the substrate 303 is 0.1-0.6 mm, and the substrate material can be nickel, copper, nickel-plated copper, copper-nickel alloy, Electroless Nickle Immersion Gold and Electroless Nickle Immersion Silver. The dielectric material may be solder, and the thickness h2 of the solder used as the medium 302 may be 0.05-0.15 mm. The carrier material can be PCB, metal plate, acrylic. The thickness h1 of the carrier 301 may be 0.5˜1.5 mm.

再請參照圖5A,焊接軌跡Lf構成為在一移動路徑Lv上移動的同時,在移動路徑Lv的側向進行搖晃(wobble)移動或振盪移動的側向路徑Wo。移動路徑Lv用以決定焊接軌跡Lf的圖案主要形狀,而側向路徑Wo用以決定焊接軌跡Lf的圖案的線條的寬度。應注意的是,本發明不限定圖案的主要形狀,可以為線形或弧形。線形例如可以為雙直線、三直線或兩直兩斜線等。而弧形例如可以為雙U、單U或S線等無端點交會之圖形。更具體地,焊接軌跡Lf的圖案主要形狀可以為UU字型、U字型、III字型、IIII字型(較佳地可以為M字型或W字型)、S字型及II字型等。一實施例中,較佳地為UU字型、U字型、M字型或W字型、及S字型等,該些圖形的移動路徑Lv並不是只包含有平行的線,因此可靠度較高。一實施例中,較佳地為UU字型、U字型,這樣的字型雷射的移動較為容易操作。藉由在移動路徑Lv的側向的搖晃移動或振盪移動,能夠增加焊接面積,而可以增加拉力強度。 此外,由於雷射束在移動路徑Lv的前進方向及側向移動,因此可以減少熱累積,避免過度焊接。 Referring again to FIG. 5A , the welding track Lf is configured as a lateral path Wo that performs wobble movement or oscillating movement in the lateral direction of the moving path Lv while moving on a moving path Lv. The moving path Lv is used to determine the main shape of the pattern of the welding track Lf, and the lateral path Wo is used to determine the width of the lines of the pattern of the welding track Lf. It should be noted that the present invention does not limit the main shape of the pattern, which may be a line shape or an arc shape. The line shape can be, for example, double straight lines, three straight lines, or two straight and two oblique lines. The arc shape can be, for example, a double-U, single-U, or S-line, etc., without end-point intersection. More specifically, the main shape of the pattern of the welding track Lf can be UU-shaped, U-shaped, III-shaped, IIII-shaped (preferably M-shaped or W-shaped), S-shaped and II-shaped. Wait. In one embodiment, it is preferably UU-shaped, U-shaped, M-shaped or W-shaped, and S-shaped, etc. The moving paths Lv of these figures do not only include parallel lines, so the reliability is higher. In one embodiment, it is preferably U-shaped or U-shaped, and the movement of such a font laser is easier to operate. The welding area can be increased and the tensile strength can be increased by the rocking movement or the oscillating movement in the lateral direction of the movement path Lv. In addition, since the laser beam moves in the forward direction and the lateral direction of the moving path Lv, heat accumulation can be reduced and excessive welding can be avoided.

圖7A顯示為具有側向的搖晃移動且呈M形的焊接軌跡的俯視圖。圖7B顯示6個螺旋點的點焊的焊接軌跡的俯視圖。在接合結構300中,焊接軌跡Lf的圖形,有時會造成溫度過高形成熔錫(tin melting)現象,致使底材脫落形成不良品。用熱電偶溫度記錄儀測量焊接軌跡Lf的焊縫近旁時,焊接溫度為最大值。圖7A之M形的焊接圖形的最高溫度為82.9℃。圖7B之6個螺旋點的焊接圖形的最高溫度為247.8℃。螺旋點的焊接圖形,因軌跡線與軌跡線之間的間距較小,因此會造成較高的溫度。螺旋點的焊接圖形是利用螺旋狀圖型由內而外連續焊接,且達到希望得到的單點尺寸,其軌跡線密集,故在定點位置有熱聚集現象造成溫度過高。圖7C顯示為另一實施例之具有側向的搖晃移動且呈M形的焊接軌跡的俯視圖。圖7C實施例相似於圖7A實施例,兩者差異在於圖7A的4條線的焊接軌跡不連續,而圖7C的4條線的焊接軌跡為連續。如圖7C所示,焊接軌跡Lf也可以為連續狀,只要實質上不重疊而造成過度焊接即可。 7A shows a top view of an M-shaped weld trace with lateral rocking movement. Figure 7B shows a top view of the weld trace of a 6 helical spot weld. In the bonding structure 300, the pattern of the welding track Lf may cause the temperature to be too high to form a tin melting phenomenon, which may cause the substrate to fall off and form a defective product. When using a thermocouple temperature recorder to measure the vicinity of the welding seam of the welding track Lf, the welding temperature is the maximum value. The maximum temperature of the M-shaped solder pattern of FIG. 7A is 82.9°C. The maximum temperature of the welding pattern of the six helical points in FIG. 7B is 247.8°C. The welding pattern of the spiral point will cause a higher temperature due to the small distance between the trace lines and the trace lines. The welding pattern of the helical point is continuously welded from the inside to the outside by the spiral pattern, and the desired single point size is achieved. 7C shows a top view of another embodiment of an M-shaped welding track with lateral rocking movement. The embodiment in FIG. 7C is similar to the embodiment in FIG. 7A , the difference between the two is that the welding trajectories of the four lines in FIG. 7A are discontinuous, while the welding trajectories of the four lines in FIG. 7C are continuous. As shown in FIG. 7C , the welding track Lf may be continuous as long as it does not substantially overlap and cause excessive welding.

一實施例中,因銅材質屬高反射材料,在對雷射激光的吸收率較低,在焊接中需要較大的能量才能穿透銅與其他金屬進行焊接作業。但由於銅的導熱性良好,經過熱的傳導容易使下層被焊物的焊錫層產生影響,於一實施例中,當溫度超過230℃會造成底部焊錫層熔解造成錫珠錫渣的產生,破壞焊接部位的穩定性,造成電性異常。圖7B的焊接圖形的最高溫度為247.8℃,因此會有焊接穩定性不佳且電性異常的現象。相對於此,於本發明中,可以利用在不同的焊接圖形,產 生不同表層溫度的特性,在不破壞最低部的焊錫層及PCBA銅箔的要求下,達到控制雙金屬材質焊接的焊接強度。 In one embodiment, since the copper material is a highly reflective material, the absorption rate of the laser light is low, and a large amount of energy is required in welding to penetrate copper and other metals for welding operations. However, due to the good thermal conductivity of copper, it is easy to affect the solder layer of the lower layer of the object to be soldered through heat conduction. In one embodiment, when the temperature exceeds 230°C, the bottom solder layer will melt, resulting in the generation of tin balls and tin slag, and damage The stability of the welding part, resulting in electrical abnormalities. The maximum temperature of the soldering pattern in FIG. 7B is 247.8° C., so the soldering stability is not good and the electrical properties are abnormal. On the other hand, in the present invention, different welding patterns can be used to produce With the characteristics of different surface temperature, it can control the welding strength of bimetal welding without damaging the solder layer of the lowest part and the PCBA copper foil.

圖8A顯示有部分重疊之M形的焊接圖形的俯視圖。於圖8A中圈出來的部分為重疊部分,更具體而言,除了熱擴散區域之外,其雷射線的中心點也發生了重疊。圖8B顯示圖8A之重疊部分的剖面圖。如圖8B所示,因焊接軌跡Lf的路徑重疊,容易造成在同一個位置過度焊接造成溫度過高且熔深過深形成熔穿現象,造成下層銅箔受損而使其電性不良;若在圓柱型電池的正極片或負極片上與導電部直接焊接時,所造成的熔穿現象甚至會造成擊穿的危險。相較於此,在本發明的實施例中,如圖7A及圖7C所示,焊接軌跡Lf為實質上不重疊,而且焊接軌跡Lf的路徑是獨立,而可以在不破壞最底部的焊錫層及PCBA銅箔的要求下,達到控制雙金屬材質焊接的焊接強度。 FIG. 8A shows a top view of an M-shaped welding pattern with partial overlap. The part circled in FIG. 8A is the overlapping part, and more specifically, the center point of the laser beam is also overlapped in addition to the thermal diffusion area. FIG. 8B shows a cross-sectional view of the overlapping portion of FIG. 8A. As shown in FIG. 8B , due to the overlapping paths of the welding tracks Lf, it is easy to cause excessive welding at the same position, resulting in too high temperature and too deep penetration to form a penetration phenomenon, resulting in damage to the underlying copper foil and poor electrical properties; if When the positive electrode or negative electrode of the cylindrical battery is directly welded with the conductive part, the resulting melt-through phenomenon may even cause the danger of breakdown. In contrast, in the embodiment of the present invention, as shown in FIG. 7A and FIG. 7C , the soldering tracks Lf do not substantially overlap, and the paths of the soldering tracks Lf are independent, so as not to damage the bottommost solder layer And under the requirements of PCBA copper foil, it can control the welding strength of bimetal welding.

在接合結構300中,因焊接圖形的橫切面的有效焊接數量及線徑粗細會影響焊接強度,當焊接區域的個數小於(<)2點時,容易出現拉力不足,而造成脫落異常及製程能力不穩定等的現象。 In the joint structure 300, the effective welding number and wire diameter of the cross-section of the welding pattern will affect the welding strength. When the number of welding areas is less than (<) 2 points, insufficient tension is likely to occur, resulting in abnormal shedding and manufacturing process. Instable ability, etc.

[拉力測試] [pull test]

以下,針對0.15銅與0.4鎳;以及0.1銅與0.4鎳的不同比例的金屬材料,以各種不同圖形的焊接軌跡Lf,來形成不同的接合結構300,並且針對該些接合結構300進行拉力測試。更具體地,比較例1為圖7B的6點圖形、實施例1為圖3(f)的II圖形、實施例2為圖3(e)的S圖形及實施例3為圖3(a)的UU圖形,而且前述各實 施例1-3或比較例1的金屬比為0.15銅與0.4鎳。另外,實施例4為圖3(f)的II圖形、實施例5為圖3(c)的III圖形、實施例6為圖3(d)的IIII圖形及實施例7為圖3(a)的UU圖形,而且前述各實施例1-3或比較例1的金屬比為0.1銅與0.4鎳。同時,將測試的結果,於表一中。 Hereinafter, for metal materials with different ratios of 0.15 copper and 0.4 nickel; and 0.1 copper and 0.4 nickel, different bonding structures 300 are formed with different patterns of welding tracks Lf, and tensile tests are performed on these bonding structures 300 . More specifically, Comparative Example 1 is the 6-dot pattern in FIG. 7B , Example 1 is the II pattern in FIG. 3( f ), Example 2 is the S pattern in FIG. 3( e ), and Example 3 is the S pattern in FIG. 3( a ) UU graphics, and the aforementioned real The metal ratio of Examples 1-3 or Comparative Example 1 was 0.15 copper to 0.4 nickel. In addition, Example 4 is the II pattern of FIG. 3(f), Example 5 is the III pattern of FIG. 3(c), Example 6 is the IIII pattern of FIG. 3(d), and Example 7 is FIG. 3(a) , and the metal ratio of each of the foregoing Examples 1-3 or Comparative Example 1 is 0.1 copper to 0.4 nickel. At the same time, the test results are listed in Table 1.

Figure 110106196-A0305-02-0016-1
Figure 110106196-A0305-02-0016-1

如表一所示,圖7B所顯示的6個螺旋點的焊接圖形,其拉力測試的最小值小於1Kgf。因此,其焊接穩定性不良。相較於此,本發明之表一各實施例的焊接圖形,其拉力測試皆大於1Kgf。另外,表一中CPK是指製程能力指標,數值越高越穩定。 As shown in Table 1, for the welding pattern of the 6 helical points shown in Figure 7B, the minimum value of the tensile test is less than 1Kgf. Therefore, its welding stability is poor. In contrast, the welding patterns of each embodiment in Table 1 of the present invention are all greater than 1 Kgf in the tensile test. In addition, CPK in Table 1 refers to the process capability index, and the higher the value, the more stable it is.

依據本發明一實施例,提供一種電連接點的接合結構300的製造方法,用以製造如前述的接合結構300,該製造方法包含如下步驟。 According to an embodiment of the present invention, a method for manufacturing a bonding structure 300 of an electrical connection point is provided for manufacturing the aforementioned bonding structure 300 . The manufacturing method includes the following steps.

步驟S02:利用一高能量線照射一電極片及一導電部相疊而成的界面,一實施例中可以為負極片222及電路載體230的導電部231相疊而成的界面,使負極片222的第一金屬材料與電路載體230的導電部231的第二金屬材料混合,來形成材料混合部。 Step S02: Using a high-energy ray to irradiate an interface formed by overlapping an electrode sheet and a conductive portion. The first metal material of 222 is mixed with the second metal material of the conductive portion 231 of the circuit carrier 230 to form a material mixed portion.

步驟S04:使該高能量線沿移動路徑Lv移動。 Step S04: Move the high-energy line along the moving path Lv.

步驟S06:使該高能量線在移動路徑Lv的側向進行搖晃移動或振盪移動來形成側向路徑Wo,而形成焊接軌跡Lf。 Step S06 : the high-energy wire is made to shake or oscillate in the lateral direction of the moving path Lv to form a lateral path Wo, thereby forming a welding track Lf.

一實施例中,步驟S02的該利用一高能量線產生裝置所產生的一高能量線的步驟,包含以下步驟。步驟S20:控制高能量線產生裝置的輸出的能量區間為70-100W之功率;以及步驟S40:使該高能量線在移動路徑Lv上移動的焊接速率為70-90mm/sec。此外,依據路徑上任一點單位時間需要的能量的功率是固定的,且僅依材料的不同而相異,所以當能量區間的功率越大,則焊接的移動速度越快,當能量區間的功率越小,則焊接的移動速度越慢。 In one embodiment, the step of using a high-energy beam generated by a high-energy beam generating device in step S02 includes the following steps. Step S20 : control the output energy range of the high-energy wire generating device to a power of 70-100W; and Step S40 : make the high-energy wire move on the moving path Lv at a welding speed of 70-90 mm/sec. In addition, the power of the energy required per unit time at any point on the path is fixed, and only varies according to the material, so when the power in the energy interval is greater, the moving speed of the welding is faster. Smaller, the slower the welding movement speed.

綜上所述,依據本發明一實施例之電連接點的接合結構,具有一焊接軌跡,焊接軌跡的路徑上不重疊,可以在不破壞電路載體的最底部並且達到改善第一金屬材料與第二金屬材料的焊接的強度。一實施例中,電連接點的接合結構可以用於電池模塊,作為其電池裝置及電路載體間的接合結構。一實施例中,焊接軌跡在一橫切面上具有2個以上的焊接區域,較佳地該些焊接區域在該橫切面上的 寬度尺寸大於0.3mm,藉以符合拉力測試的要求,而減少焊接穩定性不良的情況。一實施例中,電路載體為PCBA銅箔,因此能夠在不破壞電路載體的最低部的焊錫層及PCBA銅箔的要求下,達到改善雙金屬材質焊接的焊接強度。 To sum up, the bonding structure of the electrical connection point according to an embodiment of the present invention has a soldering track, and the paths of the soldering tracks do not overlap, so that the bottom of the circuit carrier is not damaged and the first metal material and the first metal material are improved. The strength of the welding of two metal materials. In one embodiment, the bonding structure of the electrical connection point can be used in the battery module as the bonding structure between the battery device and the circuit carrier. In one embodiment, the welding track has more than two welding areas on a cross-section, preferably the welding areas are on the cross-section. The width dimension is greater than 0.3mm, so as to meet the requirements of tensile test and reduce the situation of poor welding stability. In one embodiment, the circuit carrier is a PCBA copper foil, so the soldering strength of the bimetal material can be improved without damaging the solder layer and the PCBA copper foil of the lowest part of the circuit carrier.

111-114:焊接區域 111-114: Welding area

Lf:焊接軌跡 Lf: welding track

Lv:移動路徑 Lv: movement path

Sa:橫切面 Sa: cross section

Wo:側向路徑 Wo: Lateral Path

Claims (9)

一種電池模塊,包含:一電連接點的接合結構,包含:一導電部;及一電極片,被焊接於該導電部,其中,該電極片為一第一金屬材料,而該導電部為一第二金屬材料,在該電極片及該導電部的界面形成有一焊接軌跡,且該焊接軌跡為該第一金屬材料與該第二金屬材料混合而成,該焊接軌跡實質上不重疊,該焊接軌跡包含一移動路徑;以及在該移動路徑的側向進行搖晃移動或振盪移動的一側向路徑,而且該焊接軌跡在一橫切面上具有2個以上的焊接區域,至少一電池裝置包含該電連接點的接合結構的該電極片,且該電極片從該至少一電池裝置的本體延伸而出;及一電路載體包含該電連接點的接合結構的該導電部,其中,該橫切面的法線方向不垂直於該電極片從該至少一電池裝置延伸而出的延伸方向。 A battery module, comprising: a joint structure of an electrical connection point, comprising: a conductive part; and an electrode piece welded to the conductive part, wherein the electrode piece is a first metal material, and the conductive part is a For the second metal material, a welding track is formed at the interface between the electrode sheet and the conductive portion, and the welding track is formed by mixing the first metal material and the second metal material. The welding track does not substantially overlap, and the welding track The track includes a moving path; and a lateral path for shaking or oscillating movement in the lateral direction of the moving path, and the welding track has more than 2 welding areas on a cross-section, and at least one battery device includes the battery. the electrode sheet of the bonding structure of the connection point, and the electrode sheet extends from the body of the at least one battery device; and a circuit carrier including the conductive portion of the bonding structure of the electrical connection point, wherein the cross-section method The line direction is not perpendicular to the extending direction of the electrode sheet extending from the at least one battery device. 如請求項1所述的電池模塊,其中,該移動路徑的圖形為UU字型、U字型、V字型、III字型、IIII字型、M字型、W字型、VV字型、S字型或II字型。 The battery module according to claim 1, wherein the graphics of the movement path are UU-shaped, U-shaped, V-shaped, III-shaped, IIII-shaped, M-shaped, W-shaped, VV-shaped, S-shaped or II-shaped. 如請求項1所述的電池模塊,其中, 該焊接軌跡的軌跡長度大於0.5mm,該些焊接區域在該橫切面上的寬度尺寸大於0.3mm。 The battery module of claim 1, wherein, The track length of the welding track is greater than 0.5 mm, and the width dimension of the welding regions on the cross section is greater than 0.3 mm. 如請求項1至3任一項所述的電池模塊,其中,該焊接軌跡所產生的焊接部的拉力強度大於1Kgf。 The battery module according to any one of claims 1 to 3, wherein the tensile strength of the welded portion generated by the welding track is greater than 1 Kgf. 如請求項1至3任一項所述的電池模塊,其中,該焊接軌跡是利用一高能量線照射該電極片及該導電部的界面,使該第一金屬材料與該第二金屬材料混合。 The battery module according to any one of claims 1 to 3, wherein the welding track uses a high-energy ray to irradiate the interface between the electrode sheet and the conductive portion, so that the first metal material and the second metal material are mixed . 如請求項1至3任一項所述的電池模塊,其中,該橫切面的法線方向平行於該電極片從該至少一電池裝置延伸而出的該延伸方向。 The battery module according to any one of claims 1 to 3, wherein the normal direction of the cross section is parallel to the extending direction of the electrode sheet extending from the at least one battery device. 如請求項1至3任一項所述的電池模塊,其中,該電極片從該至少一電池裝置延伸而出的該延伸方向,為該移動路徑的圖形的長度方向。 The battery module according to any one of claims 1 to 3, wherein the extending direction of the electrode sheet extending from the at least one battery device is a length direction of the pattern of the moving path. 一種電連接點的接合結構的製造方法,用以製造一電連接點的接合結構,該電連接點的接合結構包含:一導電部;及一電極片,被焊接於該導電部,其中,該電極片為一第一金屬材料,而該導電部為一第二金屬材料,在該電極片及該導電部的界面形成有一焊接軌跡,且該焊接軌跡為該第一金屬材料與該第二金屬材料混合而成,該焊接軌跡實質上不重疊,該焊接軌跡包含一移動路徑;以及在該移動路徑的側向進行搖晃移動或振盪移動的一側向路徑,而且該焊接軌跡在一橫切面上具有2個以上的焊接區域,其中,該製造方法包含: 以一高能量線照射該電極片及該導電部相疊而成的界面,使該第一金屬材料與該第二金屬材料混合;使該高能量線沿該移動路徑移動;以及使該高能量線在該移動路徑的側向進行搖晃移動或振盪移動來形成該側向路徑,而形成該焊接軌跡。 A manufacturing method of a bonding structure of an electrical connection point, which is used to manufacture a bonding structure of an electrical connection point, the bonding structure of the electric connection point comprising: a conductive part; and an electrode piece, which is welded to the conductive part, wherein the The electrode piece is made of a first metal material, and the conductive part is a second metal material, a welding track is formed at the interface between the electrode piece and the conductive part, and the welding track is the first metal material and the second metal Mixed materials, the welding track does not substantially overlap, the welding track includes a moving path; and a lateral path of rocking or oscillating movement lateral to the moving path, and the welding track is on a transverse plane There are two or more welding regions, wherein the manufacturing method includes: Irradiate the interface formed by the superposition of the electrode sheet and the conductive portion with a high-energy ray to mix the first metal material and the second metal material; move the high-energy ray along the moving path; and make the high-energy ray The wire performs a rocking or oscillating movement lateral to the moving path to form the lateral path, thereby forming the welding track. 如請求項8所述的電連接點的接合結構的製造方法,其中,該利用一高能量線產生裝置所產生的一高能量線的步驟,包含:控制該高能量線產生裝置的輸出的能量區間為70-100W之功率;以及使該高能量線在該移動路徑上移動的焊接速率為70-90mm/sec。 The method for manufacturing a bonding structure of an electrical connection point as claimed in claim 8, wherein the step of using a high-energy ray generated by a high-energy ray generating device comprises: controlling the output energy of the high-energy ray generating device The power ranged from 70-100W; and the welding speed for moving the high-energy wire on the travel path was 70-90mm/sec.
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CN102201472A (en) * 2011-04-30 2011-09-28 常州天合光能有限公司 Modular battery plate connected with central hole and connecting structure thereof

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CN102201472A (en) * 2011-04-30 2011-09-28 常州天合光能有限公司 Modular battery plate connected with central hole and connecting structure thereof

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