TWI765161B - Electrical component mounting package, array type package, and electrical device - Google Patents

Abstract

An electrical component mounting package includes: a flat substrate (10); and one or more bases (11) protruding from a surface (10a) of the substrate (10) and having a mounting surface (10a) on which the electrical component is mounted. 11a), the substrate (10) and the base (11) are integrally formed with ceramics. An electrical component mounting package includes: component terminals (12a) provided on a mounting surface (11a) of a base (11), and side conductors (13) provided on a side surface (11b) of the base (11) and extending in the thickness direction of the base (11); and the substrate side via conductors (15a), which are provided inside the substrate (10) and extend in the thickness direction of the substrate (10); the element terminals (12a) and the side conductors (13) ) and the board-side via conductor (15a) are connected.

Description

Electrical component mounting package, array type package, and electrical device

The disclosed embodiment relates to a package for mounting an electrical component, an array type package, and an electrical device.

Conventionally, as an electrical component mounting package for mounting an electrical component, there has been known a package including a metal base for releasing heat to the outside, and a ceramic-made package fixed to the metal base with a bonding material such as an adhesive. A sub mount is used, and electrical components are mounted on the sub mount (for example, refer to Patent Document 1).

prior art literature Patent Literature

Patent Document 1 Japanese Patent Laid-Open No. 2014-116514

A package system for mounting an electrical component according to an aspect of the embodiment includes: a flat board; The seat is integrally formed of ceramic.

Moreover, in the array type package of one aspect of the embodiment, a plurality of the above-described electrical component mounting packages are connected.

Further, an electrical device according to an aspect of the embodiment includes: the electrical component mounting package described above; and an electrical component mounted on the mounting surface of the electrical component mounting package.

According to one aspect of the embodiment, it is possible to provide a package for mounting an electrical element, an array type package, and an electrical device with high heat dissipation properties.

A1~A17‧‧‧Light-emitting element mounting package

C1‧‧‧Array Package

10‧‧‧Substrate

10a‧‧‧Surface

10b‧‧‧Back

10c‧‧‧Gutter

10d‧‧‧End face

10e‧‧‧Side

10f, 10g‧‧‧Recess

11‧‧‧Pedestal

11a‧‧‧Mounting surface

11b‧‧‧Side

11A‧‧‧First base

11B‧‧‧Second base

11C‧‧‧Mixed base

11C1‧‧‧Mixed base for red

11C2‧‧‧Green mixed base

11C3‧‧‧Mixed base for blue

12a, 12b‧‧‧Terminals for components

13‧‧‧Side conductor

14‧‧‧Planar conductors

15a, 15b‧‧‧Substrate side via conductor

16a, 16b‧‧‧Terminal for power supply

16c, 16d‧‧‧Edge

17a, 17b‧‧‧Wiring conductor

18a, 18b‧‧‧Terminal side via conductor

19‧‧‧Pedestal side via conductor

20‧‧‧Metal film for sealing

21‧‧‧Metal Film

30‧‧‧Light-emitting element

30a‧‧‧radiating surface

31‧‧‧Laser diodes

31R‧‧‧Red Laser Diode

31G‧‧‧Green Laser Diode

31B‧‧‧Blue Laser Diode

32, 32R, 32G, 32B‧‧‧Photodiode

40‧‧‧Cover

41‧‧‧Transverse window

1A is a perspective view of a package for mounting an electrical component according to the first embodiment.

FIG. 1B is a cross-sectional view taken along the line A-A shown in FIG. 1A in the direction of the arrow.

FIG. 1C is a cross-sectional view taken along the line B-B shown in FIG. 1A in the direction of the arrow.

2A is a perspective view of a package for mounting an electrical component according to the second embodiment.

FIG. 2B is a cross-sectional view taken along the line C-C shown in FIG. 2A in the direction of the arrow.

FIG. 2C is a cross-sectional view taken along the line D-D shown in FIG. 2A in the direction of the arrow.

3A is a cross-sectional view of a package for mounting an electrical component according to Modification 1 of the embodiment.

3B is a cross-sectional view of a package for mounting an electrical component according to Modification 2 of the embodiment.

3C is a cross-sectional view of a package for mounting an electrical component according to Modification 3 of the embodiment.

3D is a cross-sectional view of a package for mounting an electrical component according to Modification 4 of the embodiment.

4A is a perspective view of a package for mounting an electrical component according to Modification 5 of the embodiment.

4B is an enlarged cross-sectional view of a package for mounting an electrical component according to Modification 5 of the embodiment.

4C is an enlarged cross-sectional view of a connection portion where the edge of the power supply terminal is not aligned with the edge of the end face.

4D is a perspective view of a package for mounting an electrical component according to Modification 6 of the embodiment.

5A is a perspective view of a package for mounting an electrical component according to Modification 7 of the embodiment.

5B is an enlarged cross-sectional view of a package for mounting an electrical component according to Modification 7 of the embodiment.

5C is a perspective view of a package for mounting an electrical component according to Modification 8 of the embodiment.

5D is a perspective view of a package for mounting an electrical component according to Modification 9 of the embodiment.

5E is a perspective view of a package for mounting an electrical component according to Modification 10 of the embodiment.

5F is a perspective view of a package for mounting an electrical component according to Modification 11 of the embodiment.

5G is a perspective view of a package for mounting an electrical component according to Modification 12 of the embodiment.

6A is a perspective view of a package for mounting an electrical component according to Modification 13 of the embodiment.

6B is a perspective view of a package for mounting an electrical component according to Modification 14 of the embodiment.

6C is a side view of the package for mounting an electrical component according to Modification 14 of the embodiment.

6D is an enlarged plan view of a package for mounting an electrical component according to Modification 15 of the embodiment.

FIG. 7A is a perspective view of a base of Modification 16 of the embodiment.

FIG. 7B is a perspective view of the base of Modification 17 of the embodiment.

FIG. 7C is a side view of the base of Modification 17 of the embodiment.

FIG. 7D is a plan view showing the array type package of the embodiment.

8 is a plan view showing one of the manufacturing steps of the package for mounting an electrical component according to the first embodiment.

9 is a cross-sectional view showing another manufacturing step of the package for mounting an electrical component according to the first embodiment.

10 is a plan view showing one of the manufacturing steps of the package for mounting an electrical component according to the second embodiment.

FIG. 11 is a plan view showing another manufacturing step of the package for mounting an electrical component according to the second embodiment.

12 is a cross-sectional view showing another manufacturing step of the package for mounting an electrical component of the second embodiment.

13 is a cross-sectional view showing a manufacturing step of the package for mounting an electrical component according to Modification 1 of the embodiment.

14 is a cross-sectional view showing a manufacturing step of the package for mounting an electrical component according to Modification 3 of the embodiment.

Form for carrying out the invention

In the conventional electrical component mounting package, the heat dissipation from the outside of the electrical component is low. This is because the thermal resistance of the interface between the sub-carrier and the bonding material and the thermal resistance of the interface between the bonding material and the metal substrate are large, and heat is not efficiently transferred from the sub-carrier to the metal substrate.

One aspect of the embodiment was developed in view of the above-mentioned problems, and an object thereof is to provide a package for mounting an electrical element, an array-type package, and an electrical device with high heat dissipation.

Hereinafter, embodiments of the electrical component mounting package, the array type package, and the electrical device disclosed in the present invention will be described with reference to the accompanying drawings. In addition, in the following, as examples of the electrical element mounting package, the array type package, and the electrical device, a form in which the light emitting element is applied to the electrical element is shown (hereinafter, referred to as the light emitting element mounting package and the light emitting device.), However, the present invention is not limited to light-emitting elements, and it is needless to mention that it can be applied to all electrical elements having heat generation.

Here, as an electrical element having heat generation, a large scale integrated circuit (LSI: Large Scale Integrated circuit), a charge coupled element (CCD: Charge Coupled Device), a laser diode (Laser Diode) and Light Emitting Diode (LED: Light Emitting Diode) and the like. Each of the embodiments shown below is particularly useful as a laser diode.

<First Embodiment>

First, the outline of the package A1 for mounting a light-emitting element according to the first embodiment will be described with reference to FIGS. 1A and 1B .

As shown in FIG. 1A and the like, the package A1 for mounting a light emitting element according to the first embodiment includes a flat substrate 10 , and a base 11 protruding upward from a surface 10 a of the substrate 10 . Moreover, the mounting surface 11a is provided on the upper surface of the base 11, and the light-emitting element 30 is mounted on the mounting surface 11a.

Here, in the package A1 for mounting a light-emitting element according to the embodiment, the substrate 10 and the base 11 are integrally formed with ceramics. That is, in the light-emitting element mounting package A1, between the base 11 on which the light-emitting element 30 is mounted, and the substrate 10 having the function of releasing heat to the outside, there is no structure made of different materials and there is no large amount of heat generated. interface of thermal resistance.

Thereby, since the thermal resistance between the substrate 10 and the susceptor 11 can be reduced, heat can be efficiently transferred from the susceptor 11 to the substrate 10 . Therefore, the package A1 for mounting a light-emitting element with high heat dissipation can be realized.

Furthermore, the package A1 for mounting a light emitting element does not require a step of bonding the substrate 10 and the base 11, and also does not require a bonding material such as an adhesive. Therefore, the package A1 for mounting a light-emitting element with a low manufacturing cost can be realized.

Here, as shown in FIG. 1B , in the light-emitting element mounting package A1 , the side conductors 13 may be provided on the side surfaces 11 b of the base 11 , and the board-side via conductors 15 a may be provided inside the substrate 10 . Then, the side surface conductors 13 and the board-side via conductors 15a can be connected to each other in the thickness direction of the light-emitting element mounting package A1.

Thereby, the heat generated by the light-emitting element 30 mounted on the mounting surface 11a can be dissipated in the shortest distance to the surface of the substrate 10 having a large surface area and high heat dissipation through the side surface conductors 13 and the substrate-side via conductors 15a extending in the thickness direction. Back 10b. Therefore, the heat dissipation of the package A1 for mounting a light emitting element can be improved.

In this case, the area of the side surface conductors 13 may be 10% or more, particularly 50% or more, relative to the area of the one side surface 11 b of the base 11 on which the side surface conductors 13 are provided. In addition, the area of the side surface conductor 13 is preferably as close as possible to the area of the side surface 11b, and may be equal to the area of the side surface 11b.

In addition, as shown in FIG. 1B , the side conductors 13 and the board-side via conductors 15a are connected by the planar conductors 14, but the side conductors 13 and the board-side via conductors 15a may be directly connected without using the planar conductors 14.

Next, a more detailed configuration of the light-emitting element mounting package A1 will be described with reference to FIGS. 1A to 1C .

The package A1 for mounting a light-emitting element is formed of ceramics. As this ceramic, for example, alumina, silica, mullite, cordierite, forsterite, aluminum nitride, silicon nitride, silicon carbide, glass ceramics, etc. are suitable. In addition, since the thermal conductivity is high and the thermal expansion coefficient is close to that of the light-emitting element 30, it is preferable that the light-emitting element mounting package A1 contains aluminum nitride (AlN) as a main component.

Here, "containing aluminum nitride as a main component" means that the package A1 for mounting a light emitting element contains 80 mass % or more of aluminum nitride. When the aluminum nitride contained in the package A1 for mounting a light emitting element is less than 80 mass %, the thermal conductivity of the package A1 for mounting a light emitting element decreases, which may hinder heat dissipation.

In addition, it is preferable that the package A1 for mounting a light-emitting element contains 90 mass % or more of aluminum nitride. By setting the content of aluminum nitride to be 90 mass % or more, the thermal conductivity of the light-emitting element mounting package A1 can be set to 150 W/mK or more, so that the light-emitting element mounting package A1 excellent in heat dissipation can be realized.

The light-emitting element mounting package A1 includes the substrate 10 and the base 11 as described above, and the element terminals 12 a are provided on the mounting surface 11 a of the base 11 . Further, as shown in FIG. 1B , the element terminals 12a are connected to the back surface 10b via the above-mentioned side conductors 13, the plane conductors 14 provided on the front surface 10a of the substrate 10, and the above-mentioned board-side via conductors 15a. The power supply terminal 16a of the external power supply (not shown) is electrically connected.

Furthermore, as shown in FIG. 1A , on the surface 10 a of the substrate 10 , other element terminals 12 b are provided adjacent to the base 11 . Furthermore, as shown in FIG. 1C , the element terminal 12 b is also different from the element terminal 12 b that is connected to an external power supply via the other board-side via conductor 15 b extending in the thickness direction of the board 10 , similarly to the element-use terminal 12 a. The power supply terminal 16b is electrically connected. Here, the element terminals 12a and 12b may be formed of a metallized film sintered with metal powder. Since the metallized film can be bonded to the ceramic surfaces constituting the substrate 10 and the base 11 with high strength, a highly reliable light-emitting element mounting package A1 can be realized.

In addition, a plating film such as Ni may be formed on the surface of this metallized film. Furthermore, an adhesive or an Au—Sn plated film may be provided on the surface of the plated film.

As shown in FIG. 1A , on the surface 10 a of the substrate 10 , a metal film 20 for sealing is provided so as to surround the base 11 and the element terminals 12 b. When a cap 40 is provided so as to cover the surface 10 a of the substrate 10 , the metal film 20 for sealing is a portion to which the cap 40 is bonded.

The light-emitting element 30 and the cover 40 shown in FIG. 1A are mounted on the light-emitting element mounting package A1 described so far to constitute a light-emitting device.

As the light-emitting element 30, for example, a semiconductor laser (also referred to as a laser diode) or the like can be used. The light-emitting element 30 is arrange|positioned so that the radiation surface 30a provided in one end surface may face the predetermined direction of the package A1 for light-emitting element mounting.

The light-emitting element 30 is bonded to the mounting surface 11 a of the base 11 using a conductive bonding material such as an adhesive. At this time, the first electrode (not shown) provided on the lower surface of the light-emitting element 30 and the element terminal 12a provided on the mounting surface 11a can be electrically connected by the conductive bonding material.

Furthermore, the second electrode (not shown) provided on the upper surface of the light-emitting element 30 and the element terminal 12b adjacent to the base 11 are electrically connected by bonding wires (not shown) or the like.

The cover 40 is a member for hermetically sealing a region surrounded by the metal film 20 for sealing of the light-emitting element 30 and the like. The cover 40 may be made of a metal material, ceramics, or the like, and may be made of Kovar (Fe—Ni—Co alloy) in view of high heat resistance and heat dissipation, for example.

In the cover 40, the lateral window 41 is provided in the lateral window 41, and the transparent glass is inserted in the lateral window 41. As shown in FIG. The cover 40 is arranged so that the horizontal window 41 faces the same direction as the radiation surface 30 a of the light-emitting element 30 . Then, the light emitted from the radiation surface 30 a is radiated to the outside through the horizontal window 41 .

A brazing material may be used for the bonding of the cover 40 and the metal film 20 for sealing. By using the brazing material as the bonding material, since the airtightness of the area sealed by the cover 40 can be improved, the reliability of the light-emitting device can be improved.

<Second Embodiment>

Next, the configuration of the light-emitting element mounting package A2 of the second embodiment will be described with reference to FIGS. 2A to 2C .

The arrangement of the power supply terminals 16a and 16b for connecting to an external power source of the light emitting element mounting package A2 is different from that of the light emitting element mounting package A1 described above. The other points are basically the same as those of the light-emitting element mounting package A1, and the common components are assigned the same reference numerals and detailed descriptions thereof are omitted.

As shown in FIG. 2A and the like, the power supply terminals 16 a and 16 b of the light-emitting element mounting package A2 are provided on the front surface 10 a of the substrate 10 . In this way, by providing the power supply terminals 16a and 16b on the front surface 10a of the substrate 10 instead of the rear surface 10b, a heat dissipation member such as a heat sink can be provided in contact with the rear surface 10b of the substrate 10 as a whole. Therefore, the heat dissipation of the package can be further improved.

Here, when a metal heat dissipation member with high heat dissipation is provided on the back surface 10 b of the substrate 10 , the metal film 21 may be provided on the back surface 10 b in order to allow bonding using an adhesive or the like. By bonding the heat dissipating member using an adhesive or the like with high thermal conductivity, the thermal resistance of the bonding portion can be reduced compared to the case where the bonding is performed using a resin-made adhesive with low thermal conductivity. Therefore, the heat dissipation of the package can be further improved.

In this case, the area ratio of the metal film 21 on the back surface 10b may also be 50% or more, especially 80% or more. In addition, the planar shape of the metal film 21 may be similar to the planar shape of the back surface 10 b of the substrate 10 . In addition, when the area of the metal film 21 is smaller than the area of the back surface 10b, the metal film 21 may be arranged so that the center portion thereof is located directly below the base 11 .

Hereinafter, as differences from the above-described first embodiment, the power supply terminals 16a and 16b provided on the front surface 10a of the substrate 10 and the element terminals 12a and 12b provided on the inner side of the sealing metal film 20 will be described. wiring structure.

As shown in FIG. 2B , the side conductors 13 , the planar conductors 14 , and the board-side via conductors 15 a are wired and connected in this order to the element terminals 12 a , as in the light-emitting element mounting package A1 described above. On the other hand, the board-side via conductor 15 a does not penetrate to the back surface 10 b of the board 10 , but is connected inside the board 10 to one end side of the wiring conductor 17 a extending in the surface direction of the board 10 .

This wiring conductor 17a is extended so that it may pass under the metal film 20 for sealing, and the other end side may reach under the terminal 16a for power sources. And the other end side of the wiring conductor 17a and the terminal 16a for power supplies are electrically connected by the terminal side via conductor 18a.

That is, the power supply terminal 16a is electrically connected to the element terminal 12a via the terminal side via conductor 18a, the wiring conductor 17a, the board side via conductor 15a, the plane conductor 14, and the side surface conductor 13.

2C, the power supply terminal 16b is electrically connected to the element terminal 12b via another terminal-side via conductor 18b, another wiring conductor 17b, and another board-side via conductor 15b.

In this way, the package A2 for mounting a light emitting element is structured such that the wiring conductors 17a and 17b are interposed with the metal film 20 for sealing to constitute at least one insulating layer of the substrate 10, and three-dimensionally intersect. Thereby, the formation of unevenness due to the thickness of the wiring conductors 17a and 17b on the surface of the sealing metal film 20 three-dimensionally intersecting with the wiring conductors 17a and 17b can be reduced by interposing the insulating layer.

That is, when the cover 40 is bonded to the surface of the sealing metal film 20 , the airtightness of the inside of the cover 40 can be improved because the gap generated in the bonding surface can be reduced. Therefore, the reliability of the light emitting device can be improved.

Furthermore, as shown in FIGS. 2B and 2C , the wiring conductors 17 a and 17 b may be provided at a position closer to the rear surface 10 b than the front surface 10 a of the substrate 10 . By providing the metal wiring conductors 17a and 17b at positions close to the back surface 10b, when a metal heat radiation member is provided on the back surface 10b, the difference between the thermal expansion coefficient of the heat radiation member and the thermal expansion coefficient of the substrate 10 can be reduced.

As a result, it is possible to suppress deterioration of the bonding material provided at the bonding portion between the heat radiating member and the back surface 10b due to a thermal cycle that occurs when the light-emitting device operates. Therefore, a highly reliable light-emitting element mounting package A2 can be realized.

<Variation>

Next, various modifications of the light-emitting element mounting package according to the embodiment will be described with reference to FIGS. 3A to 7C . A light-emitting element mounting package A3 shown in FIG. 3A is a modification of the light-emitting element mounting package A1 of the first embodiment, and FIG. 3A is a cross-sectional view corresponding to FIG. 1B .

The package A3 for mounting a light emitting element is provided not by the side conductors 13 (see FIG. 1B ) but by the base-side via conductors 19 provided inside the base 11 and extending in the thickness direction of the base 11 . The element terminal 12a and the board-side via conductor 15a are electrically connected.

In this way, by disposing the columnar submount-side via conductors 19 having a larger volume than the thin-film side conductors 13 on the submount 11 , the heat generated from the light-emitting element 30 (see FIG. 1A ) can be more efficiently dissipated to the substrate 10 on the back side 10b. Therefore, the heat radiation property of the package A3 for mounting a light emitting element can be further improved.

The base-side via conductor 19 may be arranged at the center portion of the mounting surface 11 a on the upper surface of the base 11 . Thereby, the heat inside the base 11 farther from the side surface 11b can be dissipated more easily.

Furthermore, as shown in FIG. 3A , the base-side via conductors 19 and the board-side via conductors 15 a may be integrally formed so as to penetrate in the thickness direction of the base 11 and the board 10 . Thereby, by the via filling process performed in the manufacturing process mentioned later, the base side via conductor 19 and the board|substrate side via conductor 15a can be formed easily. Therefore, the increase in the manufacturing cost of the package A3 for mounting a light-emitting element can be suppressed.

A light-emitting element mounting package A4 shown in FIG. 3B is a modification of the light-emitting element mounting package A2 of the second embodiment, and FIG. 3B is a cross-sectional view corresponding to FIG. 2B .

The package A4 for mounting a light emitting element is electrically connected between the element terminal 12a and the board-side via conductor 15a by the base-side via conductor 19 provided in the base 11 as in the above-mentioned modification. Therefore, as described above, the heat dissipation of the package can be further improved. Also in this case, the shape and arrangement of the metal film 21 arranged on the back surface 10b of the substrate 10 can be the same as in the case of the light-emitting element mounting package A2 described above.

The light-emitting element mounting package A5 shown in FIG. 3C is another modification of the light-emitting element mounting package A2 of the second embodiment.

In the package A5 for mounting a light emitting element, a groove 10c is formed on the surface 10a of the substrate 10 so as to surround the base 11 and the element terminal 12b (see FIG. 2A ), and a bottom surface of the groove 10c is provided with a groove 10c for sealing Metal film 20 .

Here, when the cover 40 (see FIG. 2A ) is joined to the sealing metal film 20 , by providing the cover 40 so as to engage with the groove 10 c , the joint portion with the cover 40 can also be extended to side of the groove 10c. Thereby, since the airtightness of the area sealed by the cover 40 can be further improved, the reliability of the light-emitting device can be further improved.

In addition, by providing the grooves 10c in the substrate 10, the surface area of the substrate 10 having a heat dissipation function can be enlarged, so that the heat dissipation property of the package can be further improved.

In addition, in FIG. 3C, although the metal film 20 for sealing is provided in the bottom surface of the groove|channel 10c, the arrangement|positioning of the metal film 20 for sealing is not limited to this. For example, the sealing metal film 20 may be provided so as to extend from the bottom surface of the groove 10c to the side surface of the groove 10c or the surface 10a of the substrate 10 adjacent to the groove 10c.

The light-emitting element mounting package A6 shown in FIG. 3D is a modification of the light-emitting element mounting package A4 shown in FIG. 3B .

The light-emitting element mounting package A6 is the same as the light-emitting element mounting package A5 described above, and the sealing metal film 20 is provided inside the groove 10c formed on the surface 10a of the substrate 10 . Therefore, as described above, the reliability of the light-emitting device can be further improved, and the heat dissipation property of the package can be further improved.

The light-emitting element mounting package A7 shown in FIG. 4A is another modification of the light-emitting element mounting package A2 of the second embodiment.

In the light-emitting element mounting package A7, the edge 16c of the rectangular power supply terminals 16a and 16b on the opposite side (hereinafter, also referred to as the "rear side") of the light emitting direction is provided so as to be behind the substrate 10 The edges of the side end faces 10d are aligned. As described above, by shifting the power supply terminals 16a and 16b to the ends of the substrate 10, the useless substrate area on the substrate 10 can be reduced, and the light-emitting device can be reduced in size.

In addition, in the package A7 for mounting a light-emitting element, FPC (Flexible Printed Circuit) can be easily used as an external terminal connected to the power supply terminals 16a and 16b. The reason for this will be described with reference to FIGS. 4B and 4C .

As shown in FIG. 4B , the FPC 200 is formed by stacking a coverlay film 201 , a copper foil 202 and a base film 203 in this order from above. The copper foil 202 of the center layer is joined to the power supply terminals 16a and 16b by using a conductive bonding material such as solder, so that the power supply terminals 16a and 16b and the FPC 200 are electrically connected.

Here, as shown in FIG. 4B, when the edges 16c of the power supply terminals 16a and 16b are arranged to be aligned with the edges of the end face 10d, the FPC 200 can be kept flat by cutting off the front end of the base film 203 of the lower layer. In the state, it can be easily connected to the power supply terminals 16a and 16b.

On the other hand, as shown in FIG. 4C , when the edges 16c of the power supply terminals 16a and 16b are not aligned with the edges of the end face 10d, the FPC 200 cannot be attached to the FPC 200 unless the bent portion 202a is additionally provided at the front end portion of the copper foil 202 of the FPC 200. It is connected to the power supply terminals 16a and 16b. Also, in this case, the bent portion 202a may cause a problem in the durability of the connection portion between the FPC 200 and the power supply terminals 16a and 16b.

However, in the package A7 for mounting a light emitting element, the FPC 200 can be connected to the power supply terminals 16a and 16b in a flat state. Therefore, the durability of the connection part of FPC200 and the terminals 16a and 16b for power supplies can be improved.

The light-emitting element mounting package A8 shown in FIG. 4D is another modification of the light-emitting element mounting package A2 of the second embodiment.

In the light-emitting element mounting package A8, the edge 16d on the side perpendicular to the radiation direction of the light from the rectangular power supply terminals 16a and 16b (hereinafter, also referred to as the "side surface side") is provided so as to be connected to the substrate 10. The end surfaces on the side surfaces, that is, the edges of the side surfaces 10e are aligned. Thereby, since the degree of freedom of connection with external terminals such as the FPC 200 (see FIG. 4B ) can be improved, the module design of the light-emitting device can be facilitated.

Furthermore, as described above, when the edges 16d of the power supply terminals 16a and 16b are aligned with the edges of the side surfaces 10e, the FPC 200 can be connected to the FPC 200 in a flat state by cutting off the front end of the base film 203. Power supply terminals 16a, 16b. Therefore, the durability of the connection part of FPC200 and the terminals 16a and 16b for power supplies can be improved.

The light-emitting element mounting package A9 shown in FIG. 5A is a modification of the light-emitting element mounting package A7 shown in FIG. 4A . In the package A9 for mounting a light emitting element, the rear edge 16c of the rectangular power supply terminals 16a and 16b is provided so as to be aligned with the edge of the rear end surface 10d of the substrate 10 .

As a result, the FPC 200 can be connected to the power supply terminals 16a and 16b in a flat state as in the light emitting element mounting package A9 shown in FIG. 4A . Therefore, the durability of the connection part of FPC200 and the terminals 16a and 16b for power supplies can be improved.

In addition, in the package A9 for mounting a light emitting element, the terminals 16a and 16b for power sources are provided in the position one stage lower than the surface 10a of the board|substrate 10. In other words, a recessed portion 10f is formed at the rear edge of the front surface 10a of the substrate 10, and the power supply terminals 16a and 16b are arranged on the bottom surface of the recessed portion 10f.

Thereby, as shown in FIG. 5B , when the FPC 200 is connected to the power supply terminals 16a and 16b, the FPC 200 can be installed by pushing the front end of the FPC 200 against the side wall of the recess 10f. Therefore, the alignment of the FPC 200 is facilitated, and the FPC 200 can be firmly connected to the power supply terminals 16a and 16b.

Furthermore, as shown in FIG. 5B , by setting the depth of the concave portion 10f to be approximately the same as the sum of the thicknesses of the coverlay film 201 and the copper foil 202 of the FPC 200 or larger than the sum, the upper surface of the FPC 200 can be It is flush with the surface 10a of the substrate 10, or a position lower than the surface 10a.

Thereby, since scratches and the like are not easily generated in the FPC 200, the durability of the light-emitting device can be improved.

In addition, as shown in FIG. 5A , the recesses 10f may be separated from the surface 10a of the substrate 10 , but as shown in the light-emitting element mounting package A10 shown in FIG. 5C , the recesses 10f at two places may be separated. Consolidate into one construct. In this case, since the power supply terminals 16a and 16b can be arranged closer together, the size of the external terminals such as the package A10 for mounting a light emitting element and the FPC 200 can be reduced.

The light-emitting element mounting package A11 shown in FIG. 5D is a modification of the light-emitting element mounting package A8 shown in FIG. 4D . In the light-emitting element mounting package A11, the edge 16d on the side surface side of the rectangular power supply terminals 16a and 16b is provided so as to be aligned with the edge of the side surface 10e which is the end surface on the side surface side of the substrate 10. Thereby, since the degree of freedom of connection with external terminals such as the FPC 200 can be improved, the module design of the light-emitting device can be easily performed.

Also, in the light-emitting element mounting package A11 , as in the light-emitting element mounting package A9 shown in FIG. In other words, the concave portion 10f is formed at the edge on the side surface side of the front surface 10a of the substrate 10, and the power supply terminals 16a and 16b are arranged on the bottom surface of the concave portion 10f.

Thereby, as described above, when connecting the FPC 200 to the power supply terminals 16a and 16b, the FPC 200 can be installed by pushing the front end of the FPC 200 against the side wall of the recessed portion 10f. Therefore, the alignment of the FPC 200 is facilitated, and the FPC 200 can be firmly connected to the power supply terminals 16a and 16b.

Furthermore, as described above, by setting the depth of the concave portion 10f to be approximately the same as the sum of the thicknesses of the coverlay film 201 and the copper foil 202 of the FPC 200, or larger than the sum, the upper surface of the FPC 200 can be set to be the same as the substrate. Surface 10a of 10 is flush with, or lower than, surface 10a.

Thereby, since scratches and the like are not easily generated in the FPC 200, the durability of the light-emitting device can be improved.

The light-emitting element mounting package A12 shown in FIG. 5E is a modification of the light-emitting element mounting package A9 shown in FIG. 5A . In the package A12 for mounting a light emitting element, the rear edge 16C of the rectangular power supply terminals 16a and 16b is provided so as to be aligned with the edge of the rear end surface 10d of the substrate 10 .

Thereby, in the light emitting element mounting package A12, the FPC 200 can be connected to the power supply terminals 16a and 16b in a flat state, similarly to the light emitting element mounting package A7 shown in FIG. 4A . Therefore, the durability of the connection part of FPC200 and the terminals 16a and 16b for power supplies can be improved.

Moreover, in the package A12 for mounting a light emitting element, the edge 16d of the side surface side of the rectangular power supply terminals 16a and 16b is provided so that the edge of the side surface 10e which is the end surface of the side surface side of the board|substrate 10 may be aligned. Thereby, since the degree of freedom of connection with external terminals such as the FPC 200 can be improved, the module design of the light-emitting device can be easily performed.

In addition, in the package A12 for mounting a light emitting element, the terminals 16a and 16b for power sources are provided in the position one stage lower than the surface 10a of the board|substrate 10. In other words, a concave portion 10f is formed at the edge on the side surface side behind the front surface 10a of the substrate 10, and the power supply terminals 16a and 16b are arranged on the bottom surface of the concave portion 10f.

Thereby, when the FPC 200 is connected to the power supply terminals 16a and 16b, the FPC 200 can be installed by pressing the front end portion of the FPC 200 against both side walls of the recessed portion 10f from an oblique direction. Therefore, the alignment of the FPC200 becomes easy, and the FPC200 can be firmly connected even from an oblique direction.

Furthermore, as described above, by setting the depth of the concave portion 10f to be approximately the same as the sum of the thicknesses of the coverlay film 201 and the copper foil 202 of the FPC 200, or larger than the sum, the upper surface of the FPC 200 can be set to be the same as the substrate. Surface 10a of 10 is flush with, or lower than, surface 10a.

Thereby, since scratches and the like are not easily generated in the FPC 200, the durability of the light-emitting device can be improved.

The light-emitting element mounting package A13 shown in FIG. 5F is a modification of the light-emitting element mounting package A7 shown in FIG. 4A . In the package A13 for mounting a light emitting element, the region inside the metal film 20 for sealing is more recessed than the surface 10 a of the substrate 10 except for the portion of the base 11 . In other words, the concave portion 10 g is formed in the inner region of the metal film 20 for sealing, and the susceptor 11 is arranged on the bottom surface of the concave portion 10 g. Here, the mounting surface 11 a of the base 11 is arranged at a position higher than the front surface 10 a of the substrate 10 .

Thereby, in the package A13 for mounting a light-emitting element, since the position of the mounting surface 11a located at the highest position can be lowered, the light-emitting device can be further reduced in height.

Here, in order to lower the profile of the package for mounting a light-emitting element, if the recess 10g is not formed and the height of the base is only lowered, the distance between the mounting surface and the surface of the substrate in the region inside the metal film for sealing will be reduced. get closer. That is, in the region inside the metal film for sealing, the distance between the light-emitting element mounted on the mounting surface and the surface is shortened.

Thereby, since the light radiated obliquely downward from the radiation surface of the light-emitting element is mostly irradiated on the surface of the region inside the metal film for sealing, the amount of light reflected on the surface in directions other than the predetermined irradiating direction also changes. many. Therefore, inconveniences such as a decrease in luminous efficiency inside the light-emitting device are likely to occur.

However, in the light-emitting element mounting package A13, since the concave portion 10g is formed in the region inside the metal film 20 for sealing, the region inside the metal film 20 for sealing can secure the mounting surface 11a and the region located on the mounting surface 11a The distance of the concave portion 10g of the surrounding surface belonging to the surface 10a side of the substrate 10 . Therefore, the surface reflection of light from the surface 10a side in the area|region inside the metal film 20 for sealing can be suppressed.

That is, according to the package A13 for mounting a light-emitting element, it is possible to simultaneously achieve further lowering of the back of the light-emitting device and suppression of surface reflection of light from the surface 10a side.

The package A14 for mounting a light emitting element shown in FIG. 5G is a modification of the package A13 for mounting a light emitting element shown in FIG. 5F . In the light-emitting element mounting package A14, the region inside the metal film 20 for sealing is recessed from the surface 10a of the substrate 10 except for the base 11. Thereby, the further lowering of the back of the light-emitting device and the suppression of surface reflection of light from the surface 10a side can be achieved at the same time.

Moreover, in the package A14 for mounting a light emitting element, the edge 16c on the rear side of the rectangular power supply terminals 16a and 16b is provided so as to be aligned with the edge of the end surface 10d on the rear side of the substrate 10.

Thereby, in the light emitting element mounting package A14, the FPC 200 can be connected to the power supply terminals 16a and 16b in a flat state, similarly to the light emitting element mounting package A12 shown in FIG. 5E . Therefore, the durability of the connection part of FPC200 and the terminals 16a and 16b for power supplies can be improved.

In the light-emitting element mounting package A14, the side edges 16d of the rectangular power supply terminals 16a and 16b are provided so as to be aligned with the side end surfaces of the substrate 10, that is, the edges of the side surfaces 10e. Thereby, since the degree of freedom of connection with external terminals such as the FPC 200 can be improved, the module design of the light-emitting device can be facilitated.

In addition, in the package A14 for mounting a light emitting element, the terminals 16a and 16b for power supply are provided in the position one stage lower than the surface 10a of the board|substrate 10. In other words, the recessed portion 10f is formed at the edge on the lateral side behind the surface 10a of the substrate 10, and the power supply terminals 16a and 16b are arranged on the bottom surface of the recessed portion 10f.

Thereby, when the FPC 200 is connected to the power supply terminals 16a and 16b, the FPC 200 can be installed by pressing the front end portion of the FPC 200 against both side walls of the recessed portion 10f from an oblique direction. Therefore, the alignment of the FPC200 becomes easy, and the FPC200 can be firmly connected even from an oblique direction.

Furthermore, as described above, by setting the depth of the concave portion 10f to be approximately the same as the sum of the thicknesses of the coverlay film 201 and the copper foil 202 of the FPC 200 or larger than the sum, the upper surface of the FPC 200 can be set to be the same as the substrate. Surface 10a of 10 is flush with, or lower than, surface 10a.

Thereby, since scratches and the like are not easily generated in the FPC 200, the durability of the light-emitting device can be improved.

The light-emitting element mounting package A15 shown in FIG. 6A is a modification of the light-emitting element mounting package A7 shown in FIG. 4A . In the package A15 for mounting a light-emitting element, a plurality of (two in the figure) bases 11 are provided in the region inside the metal film 20 for sealing.

Thereby, a plurality of light emitting elements 30 can be mounted in the region inside the metal film 20 for sealing. That is, since the light-emitting device can be multi-chipped, the light-emitting device can be miniaturized.

In the package A15 for mounting a light emitting element, for example, the bases 11 are arranged in a row in a direction perpendicular to the radiation direction of light, and the light-emitting elements 30 are mounted on the mounting surfaces 11 a of the plurality of bases 11 . In this case, all the light-emitting elements 30 may be arranged so that all the radiation surfaces 30a face the radiation direction of light.

In addition, in the embodiment, the example in which two bases 11 are provided is shown, but three or more bases 11 may be provided. Moreover, in the embodiment, the susceptors 11 are arranged side by side in the direction perpendicular to the radiation direction of the light. However, if the light emitted from one light emitting element 30 among the plurality of light emitting elements 30 does not collide with other light emitting elements 30 or the base 11, it is not necessary to be arranged in a direction perpendicular to the radiating direction of the light.

The light-emitting element mounting package A16 shown in FIGS. 6B and 6C is a modification of the light-emitting element mounting package A15 shown in FIG. 6A . The light-emitting element mounting package A16 is provided with a first base 11A for mounting a laser diode 31 which is an example of the light-emitting element 30 , and a first base 11A for mounting a photodiode 31 in a region inside the sealing metal film 20 . The second base 11B of the photodiode 32 .

The first susceptor 11A and the second susceptor 11B are combined to form a hybrid susceptor 11C. In this hybrid susceptor 11C, the first susceptor 11A is arranged on the side of the light irradiation direction, and the second susceptor 11B is arranged on the opposite side of the light irradiation direction. In addition, the height of the second base 11B is lower than the height of the first base 11A.

The laser diode 31 mounted on the hybrid base 11C is, for example, 0.3 mm in width×1.0 mm in length×0.1 mm in height, and the photodiode 32 is, for example, 0.5 mm in width×0.5 mm in length×0.3 mm in height. Here, "width" refers to the dimension of one side in the horizontal direction and a direction substantially perpendicular to the radiation direction of light, and "length" refers to the dimension of one side in the horizontal direction and in a direction substantially parallel to the radiation direction of light (in addition to , the following descriptions are also the same).

Moreover, as shown in FIG. 6C , the radiation surface 31a of the laser diode 31 is arranged to face the irradiation direction of light, and the detection surface 32a of the photodiode 32 is arranged to face upward. And the light L1 is radiated from the upper part of the radiation surface 31a of the laser diode 31 with the width|variety of about 30 degrees on one side. This light L1 is light emitted from the light-emitting device to the outside.

In addition, the weak light L2 is radiated from the upper part of the surface on the opposite side to the radiation surface 31a of the laser diode 31 with a width of about 30° on one side. The light quantity of the light L2 increases or decreases according to the light quantity of the light L1.

Here, in the embodiment, as shown in FIG. 6C , by making the height of the second base 11B lower than that of the first base 11A, even when the photodiode 32 having a height higher than the laser diode 31 is used In this case, the light L2 can also be detected using the upper detection surface 32a.

In this way, the light L2 from the laser diode 31 can be detected by the detection surface 32 a of the photodiode 32 , and the detection result can be fed back to the control unit of the laser diode 31 . Therefore, according to the embodiment, feedback control of the light quantity of the light L1 emitted from the laser diode 31 can be performed.

The light-emitting element mounting package A17 shown in FIG. 6D is a modification of the light-emitting element mounting package A16 shown in FIGS. 6B and 6C . In the package A17 for mounting a light-emitting element, three sets of hybrid susceptors 11C are provided in the inner region of the metal film 20 for sealing. Moreover, optical elements 25 and 26 are provided in the area|region inside the metal film 20 for sealing, and these optical elements 25 and 26 have the function of combining the incident light, and emitting it in a predetermined direction.

These optical elements 25 and 26 are arranged so as to be aligned along the irradiation direction of light (right in the figure), and the optical element 26 is arranged on the side of the irradiation direction of light rather than the optical element 25 .

In addition, the three sets of hybrid pedestals 11C have: a hybrid pedestal 11C1 for red on which the red laser diode 31R is mounted; a hybrid pedestal 11C2 for green on which the green laser diode 31G is mounted; Hybrid base 11C3 for blue of blue laser diode 31B.

The first susceptor 11A and the second susceptor 11B of the red hybrid susceptor 11C1 are arranged in a row along the light irradiation direction so as to face the optical element 25 . A red laser diode 31R and a red laser detection photodiode 32R can be mounted on the first base 11A and the second base 11B of the red mixed base 11C1, respectively.

The first susceptor 11A and the second susceptor 11B of the mixed susceptor 11C2 for green are arranged side by side in a direction perpendicular to the irradiation direction of light so as to face the optical element 25 . In addition, a green laser diode 31G and a green laser detection photodiode 32G are mounted on the first base 11A and the second base 11B of the green hybrid base 11C2, respectively.

The first susceptor 11A and the second susceptor 11B of the blue mixing susceptor 11C3 are arranged side by side in a direction perpendicular to the irradiation direction of light so as to face the optical element 26 . In addition, a blue laser diode 31B and a blue laser detection photodiode 32B are mounted on the first base 11A and the second base 11B of the blue mixing base 11C3, respectively.

In the embodiment having such a configuration, the red light _LR is irradiated to the optical element 25 from the red laser diode 31R, and the green light _LG is irradiated to the optical element 25 from the green laser diode 31G. Then, in the optical element 25 , the light _LR and the light _LG are combined, and the combined light _LRG is emitted toward the optical element 26 .

Next, the blue light _LB is irradiated from the blue laser diode 31B to the optical element 26, and in the optical element 26, the light _LRG and the light _LB are combined. The combined light L _RGB is emitted from the optical element 26 in the irradiation direction of the light.

That is, according to the embodiment, the red light _LR , the green light _LG , and the blue light _LB can be synthesized and combined by disposing the three sets of the hybrid susceptors 11C in the inner region of the metal film 20 for sealing. shoot outside. Therefore, an optical device that can be used as a light source for a display can be realized.

In addition, in the embodiment, the photodiode 32R for red laser detection, the photodiode 32G for green laser detection, and the photodiode 32B for blue laser detection are mounted on the corresponding second bases, respectively. 11B. Thereby, the light quantity of the light _LR from the red laser diode 31R, the light quantity of the light _LG from the green laser diode 31G, and the light quantity LB from the blue laser diode 31B can be _compared The amount of light is individually feedback controlled. Therefore, adjusted high-quality light L _RGB can be emitted.

Furthermore, in the embodiment, the interval D1 between the hybrid susceptor 11C1 for red and the hybrid susceptor 11C2 for green, or the interval D1 between the hybrid susceptor 11C1 for red and the hybrid susceptor 11C3 for blue is narrower than that of green The interval D2 between the mixing base 11C2 and the blue mixing base 11C3 is still wider.

As a result, the red laser diode 31R, which is easily affected by heat generated from other elements, can be disposed separately from the green laser diode 31G and the blue laser diode 31B. Therefore, the light _LR can be stably emitted from the red laser diode 31R.

Furthermore, in the embodiment, the direction of the light _LR emitted from the red laser diode 31R, the direction of the light LG emitted from the green laser diode 31G, and the direction of the light _LG emitted from the blue laser diode 31R _The direction of the light LB emitted from 31B is a direction that does not collide with the three sets of mixing bases 11C. Thereby, a compact and high-quality RGB-integrated module can be realized.

In addition, the dimensions of the light-emitting element mounting packages A1 to A17 shown so far may be about 2 to 5 mm in width and length, and about 0.2 to 1 mm in height.

In addition, in the light-emitting element mounting packages A1 to A17 shown so far, the element terminals 12 a are provided on the mounting surface 11 a of the base 11 , while the element terminals 12 b are arranged on the base 11 ( That is, the configuration of the position where the mounting surface 11a) is separated.

However, the case of the light-emitting element mounting packages A1 to A17 of the present embodiment is not limited to this, and as shown in FIG. 7A , the element terminals 12 a and the element terminals 12 b may be arranged on the mounting surface 11 a of the base 11 . are arranged to be separated from each other at a predetermined interval. In addition, in this case, the terminal 12a for elements and the terminal 12b for elements are in the state which mutually insulated by the ceramic which comprises the base 11 on the mounting surface 11a of the base 11.

In this way, when the element terminal 12a and the element terminal 12b are arranged close to each other on the base 11, the connection between the light-emitting element 30 and the element terminals 12a and 12b (especially, the element terminal 12b) can be shortened. the length of the line.

Therefore, according to the example of FIG. 7A , further miniaturization of the light-emitting element mounting packages A1 to A17 can be achieved. Moreover, according to the example of FIG. 7A, the inductance (inductance) by the current of an input and output can be reduced.

Furthermore, in the light-emitting element mounting packages A1 to A17 shown so far, as shown in FIG. 7B , the element terminals 12 a and the element terminals 12 b may be three-dimensionally formed on the mounting base 11 so as to have a predetermined height. face 11a.

As described above, in order to form the element terminals 12a, 12b three-dimensionally, for example, as shown in FIG. 7B, the small bases 11D, 11E corresponding to the area of each of the element terminals 12a, 12b are arranged to be connected with the bases 11D and 11E. The same material as 11 is integrally formed on the mounting surface 11a.

The element terminal 12a and the element terminal 12b are located at a position higher on the mounting surface 11a of the base 11 than other regions of the mounting surface 11a. In other words, the regions of the element terminal 12a and the element terminal 12b serve as convex portions, and the other regions serve as concave portions.

In this way, when the element terminals 12a and the element terminals 12b are provided in a three-dimensional structure with a predetermined height on the mounting surface 11a of the base 11, the light-emitting element 30 can be provided so as to float from the mounting surface 11a. state.

Thereby, the light emitted from the light-emitting element 30 can be suppressed from being reflected or absorbed on the mounting surface 11a. Therefore, according to the example of FIG. 7B , the stabilization of light emission of the light emitting element 30 can be achieved.

7B, as shown in FIG. 7C, in the element terminal 12a and the element terminal 12b, the height h2 of the element terminal 12b relative to the mounting surface 11a is higher than the element terminal 12a relative to the mounting surface 11a. It is better that the height h1 is higher. Furthermore, the height h2 of the element terminal 12b is preferably higher than the height h1 of the element terminal 12a by an amount corresponding to the thickness t of the light-emitting element 30 .

Thereby, as shown in FIG. 7C, the length of the connection wire W which connects the light-emitting element 30 and the terminal 12b for elements by wiring can be shortened. Therefore, according to the example of FIG. 7C, the inductance caused by the current of the input and output can be reduced.

FIG. 7D is a plan view showing the array type package C1 of the embodiment. The array type package C1 shown in FIG. 7D is a light-emitting element mounting package A1 in which a plurality of the light-emitting element mounting packages described above are connected.

<Manufacturing method of package for light-emitting element mounting>

Next, the manufacturing method of the package for light-emitting element mounting concerning each embodiment is demonstrated.

First, the manufacturing method of the package A1 for mounting a light-emitting element according to the first embodiment will be described with reference to FIGS. 8 and 9 . FIG. 8 is a plan view of each step of the first half viewed from above (only FIG. 8(d) is from below), and FIG. 9 is a sectional view of each step of the second half viewed from a side sectional view.

As shown in FIG. 8( a ), a green sheet 50 that has been previously processed into a predetermined shape is prepared. Next, predetermined two places of the green sheet 50 are punched into a circular shape in plan view, and the punched two holes are filled with via conductors 51a and 51b, respectively ( FIG. 8( b )).

Next, on the upper surface of the green sheet 50, the conductor pattern 52a is printed so as to be connected with the via conductor 51a, and the conductor pattern 52b is printed so as to be connected with the via conductor 51b. At the same time, a frame-shaped conductor pattern 52c is printed so as to surround the conductor patterns 52a and 52b ( FIG. 8( c )).

Next, on the lower surface of the green sheet 50, the conductor pattern 53a is printed so as to be connected with the via conductor 51a, and the conductor pattern 53b is printed so as to be connected with the via conductor 51b (FIG. 8(d)).

FIG. 9 , which shows the subsequent steps, is a cross-sectional view taken in the direction of the arrow along the line E-E shown in FIG. 8( d ). As shown in FIG. 9( a ), using a press die 100 having a predetermined shape, the green sheet 50 is pressed downward from above to form the convex portions 54 ( FIG. 9( b )).

At the same time, the conductor pattern 52a (refer to FIG. 9(a) ) is deformed to form the conductor pattern 52a1 provided on the upper surface of the convex portion 54 , the conductive pattern 52a2 provided on the side surface of the convex portion 54 , and the conductive pattern 52a2 provided adjacent to the convex portion 54 . Instead, the conductor pattern 52a3 is provided.

Here, the convex portion 54 corresponds to a portion of the base 11 (see FIG. 1B ) of the light-emitting element mounting package A1 , and the conductor patterns 52a1 , 52a2 , and 52a3 correspond to the element terminal 12a (see FIG. 1B ) and the side surface, respectively. A portion of the conductor 13 (see FIG. 1B ) and the plane conductor 14 (see FIG. 1B ).

The via conductor 51a is a portion corresponding to the substrate-side via conductor 15a (refer to FIG. 1B ) of the light-emitting element mounting package A1, the conductor pattern 53a is a portion corresponding to the power supply terminal 16a (refer to FIG. 1B ), and the conductor pattern 52c This is a portion corresponding to the sealing metal film 20 (see FIG. 1B ).

In addition, although not shown in FIG.9(b), in the green sheet 50, the via conductor 51b (refer FIG.8(b)) is connected with the board|substrate side via conductor 15b of the package body A1 for light emitting element mounting. (Refer to Figure 1C) the corresponding part.

Further, the conductor pattern 52b (refer to FIG. 8(c) ) is a portion corresponding to the element terminal 12b (refer to FIG. 1C ) of the light-emitting element mounting package A1, and the conductor pattern 53b (refer to FIG. 8(d) ) is A portion corresponding to the power supply terminal 16b (see FIG. 1C ).

Next, at the end of the manufacturing step, the green sheet 50 formed as shown in FIG. 9( b ) is fired at a high temperature (about 1800° C.) to complete the light-emitting element mounting package A1 .

The green sheet 50 used in the above-mentioned production steps is basically composed of an inorganic powder, for example, a powder of aluminum nitride, which is a main raw material, and contains yttrium oxide (Y ₂ O ₃ ), calcium oxide, etc. Powders such as (CaO) and erbium oxide (Er ₂ O ₃ ) are mixed as a sintering aid. Then, an organic binder, a solvent, and a solvent are added and mixed to the inorganic powder to form a slurry, and a green embryo is formed by using the conventionally known doctor blade method and calendar roll method. slice 50.

In addition, the conductor patterns 52a, 52b, 52c, 53a, 53b and the via conductors 51a, 51b are formed of a paste made of, for example, tungsten (W), which is the main raw material, with aluminum nitride, Organic binders, solvents, etc. are mixed as co-agents.

Next, the manufacturing method of the package A2 for mounting a light-emitting element of the second embodiment will be described with reference to FIGS. 10 to 12 .

The package A2 for mounting a light-emitting element is formed by subjecting two green sheets to predetermined processing, and then laminating the two green sheets, and finally firing the laminated molded body.

Hereinafter, each step of the first half of the upper green sheet 60 of the two green sheets will be described with reference to the top view of FIG. 10 , and each step of the first half of the lower green sheet 70 will be described with reference to the top view of FIG. 11 . Finally, each step of the second half of the green sheets 60 and 70 will be described with reference to the top view of FIG. 12 .

As shown in FIG. 10( a ), a green sheet 60 processed into a predetermined shape in advance is prepared. Next, predetermined four places of the green sheet 60 are punched out in a circular shape in plan view, and the punched four holes are filled with via conductors 61a, 61b, 61c, and 61d, respectively ( FIG. 10( b )). .

Next, on the upper surface of the green sheet 60, the conductor pattern 62a is printed so as to be connected with the via conductor 61a, and the conductor pattern 62b is printed so as to be connected with the via conductor 61b. At the same time, a frame-shaped conductor pattern 62e is printed so as to surround the conductor patterns 62a and 62b. At the same time, the conductor pattern 62c is printed so as to be connected to the via conductor 61c, and the conductor pattern 62d is printed so as to be connected to the via conductor 61d (FIG. 10(c)).

Moreover, as shown to Fig.11 (a), the green sheet 70 processed into a predetermined shape in advance is prepared. Next, the conductor patterns 71a and 71b are printed on the upper surface of the green sheet 70 (FIG. 11(b)). The conductor pattern 71 a is formed at a position corresponding to the via conductors 61 a and 61 c provided in the green sheet 60 , and the conductor pattern 71 b is formed at a position corresponding to the via conductors 61 b and 61 d provided in the green sheet 60 .

Next, the conductor pattern 72a is printed so as to cover the lower surface of the green sheet 70 (FIG. 11(c)).

FIG. 12 showing the subsequent steps is a cross-sectional view taken in the direction of the arrow along the line F-F shown in (c) of FIG. 10 . As shown in FIG. 12( a ), using a press die 101 having a predetermined shape, the green sheet 60 is pressed downward from above to form the convex portions 63 ( FIG. 12( b )).

At the same time, the conductor pattern 62a (refer to FIG. 12(a) ) is deformed to form the conductor pattern 62a1 provided on the upper surface of the convex portion 63, the conductor pattern 62a2 provided on the side surface of the convex portion 63, and the convex portion 63. The conductor patterns 62a3 provided adjacent to each other.

Here, the convex portion 63 is a portion corresponding to the base 11 (see FIG. 2B ) of the light-emitting element mounting package A2, and the conductor patterns 62a1 , 62a2 , and 62a3 correspond to the element terminal 12a (see FIG. 2B ) and the side conductors, respectively. 13 (refer to FIG. 2B ), and a portion corresponding to the plane conductor 14 (refer to FIG. 2B ).

The via conductors 61a and 61c correspond to the substrate-side via conductors 15a (refer to FIG. 2B ) and the terminal-side via conductors 18a (refer to FIG. 2B ) of the light-emitting element mounting package A2, respectively. In addition, the conductor patterns 62c and 62e are parts corresponding to the power supply terminal 16a (refer to FIG. 2B ) and the sealing metal film 20 (refer to FIG. 2B ) of the light-emitting element mounting package A2, respectively.

Next, as shown in FIG.12(c), the green sheet 70 is arrange|positioned on the lower side of the press-processed green sheet 60, and it heats and presses, and the laminated body 80 is formed (FIG.12(d)).

Here, the conductor pattern 71a is a portion corresponding to the wiring conductor 17a (see FIG. 2B ) of the light-emitting element mounting package A2, and the conductor pattern 72a is a portion corresponding to the metal film 21 (see FIG. 2B ).

In addition, although not shown in FIG. 12( d ), in the laminated molded body 80 , the via conductors 61 b and 61 d (refer to FIG. 10 ( b )) are connected to the substrate side of the light-emitting element mounting package A2 , respectively. Parts corresponding to via conductor 15b (refer to FIG. 2C ) and terminal-side via conductor 18b (refer to FIG. 2C ).

Moreover, the conductor patterns 62b and 62d (see FIG. 10(c) ) correspond to the element terminals 12b (see FIG. 2C ) and the power supply terminals 16b (see FIG. 2C ) of the light-emitting element mounting package A2, respectively, The conductor pattern 71b (refer to FIG. 11(b) ) is a portion corresponding to the wiring conductor 17b (refer to FIG. 2C ).

Next, at the end of the manufacturing step, the laminated molded body 80 formed as shown in FIG. 12( d ) is fired at a high temperature (about 1800° C.) to complete the light-emitting element mounting package A2 .

Next, with reference to FIG. 13, the manufacturing method of the package A3 for light-emitting element mounting concerning the modification shown to FIG. 3A is demonstrated. In addition, the manufacturing process of the package A3 for light-emitting element mounting is basically the same as the manufacturing process of the package A1 for light-emitting element mounting shown in FIG. 8 and FIG. 9, and it demonstrates focusing on a different process here.

As shown in FIG. 13( a ), on the green sheet 50 on which a plurality of conductor patterns and via conductors are formed, a punching die 102 of a predetermined shape is used to press the green sheet 50 from above to the bottom to form protrusions. part 54 ( FIG. 13( b )).

Here, the conductor pattern 52 a provided on the upper surface of the green sheet 50 is printed so as to be arranged only on the upper surface of the convex portion 54 , and the via conductor 51 a penetrating the green sheet 50 is provided so as to be located inside the convex portion 54 .

Then, the conductor pattern 52a is a portion corresponding to the element terminal 12a (see FIG. 3A ) of the light-emitting element mounting package A3, and the via conductor 51a is a base-side via conductor 19 (see FIG. 3A ) and a board-side via A portion corresponding to the conductor 15a (see FIG. 3A ). Thereby, the package body A3 for mounting a light emitting element in which the base-side via conductor 19 is provided can be formed.

Next, the manufacturing method of the package A5 for mounting a light-emitting element shown in FIG. 3C is demonstrated using FIG. 14. FIG. In addition, the manufacturing steps of the light-emitting element mounting package A5 are basically the same as the manufacturing steps of the light-emitting element mounting package A2 shown in Figs.

The green sheet 60 on which a plurality of conductor patterns and via conductors are formed is punched from the upper side to the lower side of the green sheet 60 using a press die 103 of a predetermined shape ( FIG. 14( a )).

Here, since the protrusions 103a are provided at the positions corresponding to the conductor patterns 62e in the stamping die 103, the grooves 64 are provided on the surface of the green sheet 60 by the protrusions 103a, and the conductor patterns are arranged inside the grooves 64. 62e ((b) of FIG. 14 ).

Here, the groove 64 corresponds to the groove 10c (see FIG. 3C ) of the light-emitting element mounting package A5 , and the conductor pattern 62e corresponds to the sealing metal film 20 (see FIG. 3C ). Thereby, the light-emitting element mounting package A5 in which the groove 10c is formed on the surface 10a of the substrate 10 and the sealing metal film 20 is provided inside the groove 10c can be formed.

[Example]

Hereinafter, the light-emitting element mounting packages A1 to A6 of the respective embodiments and the modified examples were specifically produced, and then, light-emitting devices to which the light-emitting element mounting packages A1 to A6 were applied were produced.

First, a mixed powder obtained by mixing yttrium oxide powder at a ratio of 5 mass % and calcium oxide powder at a ratio of 1 mass % in 94 mass % of aluminum nitride powder was prepared as a mixed powder for forming green chips.

To 100 parts by mass of this mixed powder (solid content), 20 parts by mass of an acrylic binder was added as an organic binder, and 50 parts by mass of toluene was added to prepare a slurry, and then a doctor blade method was used to prepare a predetermined thickness of Embryos.

In addition, in the formation of conductors such as conductor patterns and via conductors, 20 parts by weight of aluminum nitride powder, 8 parts by weight of acrylic binder, and terpine are appropriately added to 100 parts by weight of tungsten (W) powder. A conductor formed from terpineol.

Next, the green sheet 50 (refer to FIG. 9(b) and FIG. 13(b) ) and the laminated molded body are produced by the manufacturing method shown in FIGS. 8 to 14 using the green sheet and conductor having the above-mentioned components. 80 (refer to (d) of FIG. 12 ).

The obtained green sheets 50 and laminated molded bodies 80 were fired in a reducing gas atmosphere at a maximum temperature of 1800° C. for 2 hours to obtain light-emitting element mounting packages A1 to A6. In addition, the dimensions of the obtained light-emitting element mounting packages A1 to A6 were 2.5 mm in width×4.2 mm in length×0.6 mm in height after firing, and the dimensions of the mounting surface 11a were 0.5 mm in width×0.5 mm in length.

In the packages A1 to A6 for mounting a light-emitting element, the Ni plating film was formed with a thickness of about 5 μm, and then the Au plating film was formed with a thickness of about 0.1 μm.

Next, the light-emitting elements 30 are mounted on the mounting surfaces 11a of the light-emitting element mounting packages A1 to A6. Here, an Au—Sn adhesive (melting point: 280° C.) was used for the bonding of the light-emitting element 30 to the mounting surface 11 a.

Next, the cap 40 made of FeNiCo is bonded to the metal film 20 for sealing. Here, an Ag—Sn adhesive (melting point: 221° C.) was used for this bonding, and the internal atmosphere system of the cover 40 was replaced with He gas. In addition, a glass plate of a predetermined size that has been coated with antireflection coating is bonded to the horizontal window 41 of the cover 40 at about 430° C. with a low-melting glass paste.

In this manner, light-emitting devices to which the light-emitting element mounting packages A1 to A6 of the embodiment are applied were produced. Moreover, as a comparative example, a light-emitting device using a package for mounting a light-emitting element to which a known metal base was applied was also produced.

Next, the thermal resistance of each of the light-emitting devices produced was evaluated separately. Here, the number of samples n=5 was set for each structure, and the temperature difference between the temperature of the mounting surface 11 a of the susceptor 11 and the temperature of the back surface 10 b of the substrate 10 was evaluated. That is, the larger the value representing the temperature difference, the smaller the thermal resistance and the better the heat dissipation.

In addition, in the thermal resistance evaluation of each light-emitting device, the case where the heat dissipation member is not bonded to the back surface 10b of the substrate 10 and the case where the heat dissipation member is bonded to the back surface 10b are respectively evaluated. Regarding the samples in which the power supply terminals 16 a and 16 b were provided on the front surface 10 a of the substrate 10 , the heat dissipation member to be joined had a size (width 2 mm x length 3 mm x thickness 2 mm) in which the heat dissipation member was adhered to the entire back surface 10 b of the substrate 10 . .

On the other hand, regarding the samples in which the power supply terminals 16a and 16b were provided on the back surface 10b of the substrate 10, the heat dissipation member was dimensioned to deduct the power supply terminals 16a and 16b.

In addition to the thermal resistance evaluation, the leakability of the He gas inside the cover 40 was also evaluated. Specifically, the obtained light-emitting device was put into a vacuum container, and the time for detecting He gas was measured by a gas chromatograph. In addition, the value of this evaluation result is the relative time when the sample 1 to which the package A1 for light-emitting element mounting was applied and He was detected first was set to 1.0.

Table 1 shows the results of thermal resistance evaluation and He gas leak evaluation of each structure.

From the comparison between the sample 7 to which the conventional metal base was applied and the samples 1 to 6 to which the light-emitting element mounting packages A1 to A6 of the respective embodiments were applied, it was found that the light-emitting element mounting package of the present embodiment was A1 to A6 are excellent in heat dissipation.

Furthermore, from the comparison between the samples 1, 2, and 5 in which the side conductors 13 are provided on the base 11 and the samples 3, 4, and 6 in which the base 11 is provided with the base-side via conductors 19, it can be seen that the The base-side via conductor 19 is arranged at 11, and the heat dissipation is further improved.

In addition, the samples to which the light-emitting element mounting packages A7 to A17 were applied were produced and evaluated in the same manner. Regarding the thermal resistance of these samples, each value of the thermal resistance of Sample 6 was within the range of ±1°C with and without the heat-dissipating member. In addition, the result of the He leak test also stopped in the range of 0.95±0.01.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, Various changes are possible, unless it deviates from the meaning. For example, in the above-described embodiment, the light-emitting element 30 and the like are hermetically sealed using the cover 40 , but the member that is hermetically sealed is not limited to the cover 40 . For example, the light-emitting element 30 and the like may be hermetically sealed by combining a frame-shaped seal ring (sealing member) provided with a horizontal window at a predetermined position and a plate-shaped cover.

As described above, the packages for mounting electrical components (packages A1 to A17 for mounting light-emitting elements) according to the embodiment include the flat substrate 10 , and the electrical components (light-emitting elements 30 , One or more bases 11 on the mounting surface 11a of the laser diode 31, the red laser diode 31R, the green laser diode 31G, and the blue laser diode 31B), and the substrate 10 and the base The 11 series is made of ceramic. Thereby, a package for mounting an electrical component with high heat dissipation can be realized.

Further, the electrical element mounting package (the light emitting element mounting packages A1, A2, A5, A7 to A17) of the embodiment includes the element terminals 12a provided on the mounting surface 11a of the base 11, and the element terminals 12a provided on the base 11 side conductors 13 extending in the thickness direction of the base 11, and board side via conductors 15a provided inside the board 10 and extending in the thickness direction of the board 10, and the element terminals 12a and the side conductors 13 and the board side Via conductor 15a is connected. Thereby, the heat dissipation property of the package for mounting an electrical component can be improved.

Further, the electrical component mounting package (the light emitting element mounting packages A3, A4, A6) of the embodiment includes the component terminals 12a provided on the mounting surface 11a of the base 11, and the component terminals 12a provided inside the base 11 and extending Substrate-side via conductors 19 in the thickness direction of submount 11 , substrate-side via conductors 15 a provided inside substrate 10 and extending in the thickness direction of substrate 10 , element terminals 12 a , submount-side via conductors 19 and substrate The side via conductors 15a are connected. Thereby, the heat dissipation property of the package for mounting an electric component can be further improved.

In addition, the electrical component mounting package (the light emitting element mounting packages A2, A4 to A17) of the embodiment includes the wiring conductor 17a provided inside the substrate 10 and extending in the surface direction of the substrate 10, the wiring conductor 17a and the substrate The side via conductors 15a are connected. Thereby, the terminal 16a for power supply can be arrange|positioned not only on the back surface 10b of the board|substrate 10, but also on the front surface 10a of the board|substrate 10.

In addition, in the electrical component mounting packages (light emitting element mounting packages A2, A4 to A17) of the embodiment, the wiring conductors 17a are provided at positions closer to the back surface 10b of the substrate 10 than the front surface 10a of the substrate 10. Thereby, a highly reliable electrical component mounting package can be realized.

The packages for mounting electrical components (packages A2, A4 to A17 for mounting light-emitting elements) according to the embodiment are provided with the metal film 20 for sealing provided on the surface 10a side of the substrate 10 so as to surround the base 11, and the The power supply terminal 16a on the outer side of the sealing metal film 20 is connected to the power supply terminal 16a and the wiring conductor 17a. Thereby, the heat dissipation of the package can be further improved.

In addition, in the electrical element mounting package (the light emitting element mounting package A5, A6) of the embodiment, the groove 10c is provided on the surface 10a of the substrate 10 so as to surround the base 11, and the sealing metal film 20 is provided inside the groove 10c. Thereby, the reliability of the electrical device can be further improved, and the heat dissipation of the package can be further improved.

In addition, in the electrical element mounting packages (light emitting element mounting packages A9 to A12, A14) of the embodiment, the power supply terminals 16a and 16b are provided at positions lower than the surface 10a of the substrate 10 . Thereby, alignment of FPC200 becomes easy.

In addition, in the electrical component mounting package (light emitting element mounting packages A12, A14) of the embodiment, the outer edges of the power supply terminals 16a, 16b have two intersecting linear edges 16c, 16d, and the two edges 16c and 16d are arranged so as to be aligned with the edges of the end surface 10d and the side surface 10e of the substrate 10, respectively. Thereby, the module design of the electrical device can be facilitated.

In addition, in the electrical element mounting package (the light emitting element mounting packages A13 and A14) of the embodiment, the region inside the sealing metal film 20 is larger than the surface 10a of the substrate 10 except for the portion of the base 11 . sunken. Thereby, it is possible to achieve further lowering of the back of the electrical device and suppression of surface reflection of light from the surface 10a side at the same time.

Moreover, in the electric element mounting package (the light emitting element mounting packages A15 to A17) of the embodiment, a plurality of bases 11 are provided in the region inside the metal film 20 for sealing. Thereby, the miniaturization of the electric device can be achieved.

In addition, in the package for mounting an electrical element (packages A16 and A17 for mounting a light-emitting element) of the embodiment, the inner region of the metal film 20 for sealing is provided with a first base 11A and a second base 11B. The mixing base 11C serves as the base 11, and the height of the second base 11B of the mixing base 11C is lower than the height of the first base 11A. Thereby, the light L1 ( _LR , LG, _LG , LG, LG, LR) emitted from the laser diodes 31 (the red laser diode 31R, the green laser diode 31G, and the blue laser diode 31B) can be detected. The light quantity of L _B ) is controlled by feedback.

Moreover, in the package for mounting an electric element (package A17 for mounting a light-emitting element) of the embodiment, three sets of hybrid susceptors 11C are provided in the inner region of the metal film 20 for sealing. Thereby, it is possible to realize an optical device that can emit the adjusted high-quality light L _RGB and use it as a light source for a display.

Moreover, in the package for mounting an electrical component (package A17 for mounting a light-emitting element) of the embodiment, the three sets of hybrid pedestals 11C include: Hybrid base 11C1 for red, mixed base 11C2 for green having first base 11A for mounting green laser diode 31G, and first base for mounting blue laser diode 31B The space between the mixed base 11C3 for blue and the mixed base 11C1 for red and the mixed base 11C2 for green, or the space between the mixed base 11C1 for red and the mixed base 11C3 for blue in the seat 11A is narrower D1 is an interval wider than the interval D2 between the mixed susceptor 11C2 for green and the mixed susceptor 11C3 for blue. Thereby, stable light LR can be emitted from the red laser diode _31R .

In addition, in the package for mounting an electrical element (package A17 for mounting a light-emitting element) of the embodiment, the three sets of hybrid bases 11C are arranged so that the respective mounted laser diodes (the red laser diode 31R, _The directions of the lights L _R , _LG , and LB emitted by the green laser diode 31G and the blue laser diode 31B) are directed in a direction that does not collide with the three sets of hybrid bases 11C. Thereby, a compact and high-quality RGB-integrated module can be realized.

In addition, the array type package C1 of the embodiment has a plurality of electrical element mounting packages (light emitting element mounting packages A1 to A17 ) connected to each other. Thereby, an array type electrical device can be obtained.

In addition, the array type package C1 of the embodiment is formed by integrally sintering the electrical element mounting packages (light-emitting element mounting packages A1 to A17 ). Thereby, an array-type electrical device with high heat dissipation and high strength can be obtained.

Further, the electrical device according to the embodiment includes: packages for mounting electrical components (packages A1 to A17 for mounting light-emitting elements); and a mounting surface to be mounted on the packages for mounting electrical components (packages A1 to A17 for mounting light-emitting elements). The electrical components of 11a (light-emitting element 30, laser diode 31, red laser diode 31R, green laser diode 31G, blue laser diode 31B). Thereby, an electrical device with high heat dissipation can be realized.

Further, the electrical device according to the embodiment includes: packages for mounting electrical components (packages A1 to A17 for mounting light-emitting elements); and a mounting surface 11a mounted on the packages for mounting electrical components (packages A1 to A17 for mounting light-emitting elements) electrical components (light-emitting element 30, laser diode 31, red laser diode 31R, green laser diode 31G, blue laser diode 31B); The cover 40 of the horizontal window 41 above. Thereby, a highly reliable electrical device can be realized.

Further, the electrical device of the embodiment includes: an array type package C1; and electrical elements (light-emitting element 30, laser diode 31, red laser diode 31R, Green laser diode 31G, blue laser diode 31B). Thereby, an array-type electrical device with high heat dissipation and high strength can be obtained.

Further effects and modifications can be easily derived by those skilled in the art to which the present invention pertains. Therefore, the broader aspects of the invention are not limited to the specific details and representative embodiments shown and described above. Therefore, various modifications can be made without departing from the spirit or scope of the general inventive concept defined by the appended claims and equivalents.

A1‧‧‧Light-emitting element mounting package

10‧‧‧Substrate

10a‧‧‧Surface

11‧‧‧Pedestal

11a‧‧‧Mounting surface

12a, 12b‧‧‧Terminals for components

20‧‧‧Metal film for sealing

30‧‧‧Light-emitting element

30a‧‧‧radiating surface

40‧‧‧Cover

41‧‧‧Transverse window

Claims (17)

An electrical component mounting package comprising: a flat substrate; one or more bases protruding from a surface of the substrate and having a mounting surface on which an electrical component is mounted; and wiring conductors provided inside the substrate , and extends in the surface direction of the substrate; the substrate and the base are integrally formed with ceramics, and the distance from the wiring conductor to the back surface of the substrate is smaller than the distance from the wiring conductor to the surface of the substrate, further comprising: : an element terminal provided on the mounting surface of the base; a side conductor provided on a side surface of the base and extending in the thickness direction of the base; and a board-side via conductor provided inside the base, and extending in the thickness direction of the substrate, the element terminal, the side conductor and the substrate side via conductor are connected, the wiring conductor and the substrate side via conductor are connected, further comprising: a sealing metal film to surround the A base is provided on the surface side of the substrate; and a power supply terminal is provided on the outer side of the sealing metal film, and the power supply terminal and the wiring conductor are connected. A package for mounting an electrical component, comprising: a flat substrate; one or more bases protruding from the surface of the substrate and having a mounting surface for mounting electrical components; and wiring conductors provided inside the substrate and extending in the surface direction of the substrate; the The substrate and the base are integrally formed with ceramics, and the distance from the wiring conductor to the back surface of the substrate is smaller than the distance from the wiring conductor to the surface of the substrate, and further comprising: an element terminal provided on the base of the base. the mounting surface; the base-side via conductors provided inside the base and extending in the thickness direction of the base; and the board-side via conductors provided inside the base and extending in the thickness direction of the base, The element terminal is connected to the base-side via conductor and the board-side via conductor, the wiring conductor is connected to the board-side via conductor, and further comprising: a metal film for sealing provided so as to surround the base On the surface side of the substrate; and a power supply terminal, which is provided on the outer side of the sealing metal film, and the power supply terminal and the wiring conductor are connected. The package for mounting an electrical component according to claim 1 or 2, wherein a groove is provided on the surface of the substrate so as to surround the base, The metal film for sealing is provided inside the groove. The package for mounting an electrical component according to claim 1 or 2, wherein the power supply terminal is provided at a position lower than the surface of the substrate. The package for mounting an electrical component according to claim 1 or 2, wherein the outer edge of the power supply terminal has two intersecting linear edges arranged to be aligned with the edge of the end surface and the side surface of the substrate, respectively. The package for mounting an electrical component according to claim 1 or 2, wherein the inner region of the metal film for sealing is more recessed than the surface of the substrate except for the base portion. The package for mounting an electrical component according to claim 1 or 2, wherein a plurality of the bases are provided in a region inside the metal film for sealing. The package for mounting an electrical component according to claim 7, wherein a hybrid susceptor having a first susceptor and a second susceptor is provided in a region inside the metal film for sealing, and as the susceptor, the hybrid susceptor is provided. The height of the second base is lower than the height of the first base. The package for mounting an electrical component according to claim 8, wherein three sets of the hybrid susceptor are provided in a region inside the metal film for sealing. The package for mounting an electrical component according to claim 9, wherein the three sets of the aforementioned hybrid bases include: a red hybrid base with a red laser diode for mounting the aforementioned first pedestal; the green hybrid pedestal having the aforementioned first pedestal for mounting the green laser diode; and the blue hybrid pedestal having the aforementioned first pedestal for mounting the blue laser diode The first susceptor, the distance between the first susceptor of the mixed susceptor for red and the first susceptor of the mixed susceptor for green, or the first susceptor of the mixed susceptor for red and the blue The interval between the first susceptors of the color mixing susceptor is narrower than that of the first susceptor and the second susceptor of the green mixing susceptor and the first susceptor of the blue mixing susceptor. The space between the first base and the second base is also wide. The package for mounting an electrical component according to claim 9, wherein the three sets of the hybrid susceptors are arranged so that the orientations of the light emitted by the respective mounted laser diodes do not collide with the three sets of the hybrid susceptors direction. An array type package in which a plurality of packages for mounting electrical components according to any one of claims 1 to 11 are connected. The array type package of claim 12 is formed by integrally sintering packages for mounting electrical components. An electrical device comprising: the electrical component mounting package according to any one of claims 1 to 11; and an electrical component mounted on the mounting surface of the electrical component mounting package. An electrical device comprising: the electrical component mounting package according to any one of claims 1 to 11; an electrical component mounted on the mounting surface of the electrical component mounting package; and a cover having a The transverse window on the aforementioned metal film for sealing. An electrical device comprising: an array type package as claimed in claim 12; and an electrical component mounted on a mounting surface of the array type package. An electrical component mounting package comprising: a flat substrate; one or more bases protruding from a surface of the substrate and having a mounting surface on which an electrical component is mounted; and wiring conductors provided inside the substrate , and extends in the surface direction of the substrate; the substrate and the base are integrally formed with ceramics, and the wiring conductor system is arranged at a position closer to the back of the substrate than the surface of the substrate; the package for mounting electrical components The body includes: a metal film for sealing provided on the surface side of the substrate so as to surround the base; and a terminal for power supply provided on the outer side of the metal film for sealing; the terminal for power supply and the wiring conductor are connected to the system .

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