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TWI763424B - Power supply system for vertical continuous electroplating frame - Google Patents

Power supply system for vertical continuous electroplating frame Download PDF

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Publication number
TWI763424B
TWI763424B TW110113052A TW110113052A TWI763424B TW I763424 B TWI763424 B TW I763424B TW 110113052 A TW110113052 A TW 110113052A TW 110113052 A TW110113052 A TW 110113052A TW I763424 B TWI763424 B TW I763424B
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Taiwan
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power supply
rail
electrode
vertical continuous
electroplating
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TW110113052A
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Chinese (zh)
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TW202240031A (en
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游新基
林渙鈞
彭旭正
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宇泰和股份有限公司
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Abstract

本發明有關一種垂直連續電鍍框架之供電系統,其包括有:一供電軌,設置於垂直連續電鍍設備上;以及一電極盒,將一盒體設置於電鍍框架的頂部,該盒體內相對該供電軌設置一電極片,該電極片底部設有彈性件,該盒體頂面相對該電極片具有一定位穿槽,當該電極片與該供電軌電性接觸時,遂經由電鍍框架提供電鍍電流至被鍍物。藉此,用以解決先前技術提供至被鍍物的電鍍電流不穩定之問題,而具有提供穩定電鍍電流至被鍍物之功效。The present invention relates to a power supply system for a vertical continuous electroplating frame, which includes: a power supply rail arranged on the vertical continuous electroplating equipment; and an electrode box, a box body is arranged on the top of the electroplating frame, and the box body is opposite to the power supply The rail is provided with an electrode sheet, the bottom of the electrode sheet is provided with an elastic member, and the top surface of the box body has a positioning slot relative to the electrode sheet. When the electrode sheet is in electrical contact with the power supply rail, the electroplating current is provided through the electroplating frame. to the plated material. Thereby, it is used to solve the problem of unstable electroplating current provided to the object to be plated in the prior art, and has the effect of providing a stable electroplating current to the object to be plated.

Description

垂直連續電鍍框架之供電系統Power supply system for vertical continuous electroplating frame

本發明有關一種垂直連續電鍍框架之供電系統,尤指一種提供穩定電鍍電流至被鍍物之設計者。The present invention relates to a power supply system for a vertical continuous electroplating frame, especially to a designer for providing stable electroplating current to objects to be plated.

按,垂直連續電鍍(Vertical Continuous Plating) 設備可將被鍍物(例如印刷電路板)垂直定位於電鍍框架上,並利用輸送裝置讓被鍍物隨著電鍍框架於電鍍槽內連續移送,同時供電至電鍍框架而對被鍍物進行電鍍;再者,習知的電鍍框架供電方式,係於垂直連續電鍍設備上設置供電軌道,並令電鍍框架相對供電軌道形成導電槽,而讓電鍍框架利用導電槽與供電軌道的電性接觸提供電鍍電流至被鍍物,俾以對被鍍物進行電鍍;然而,電鍍框架在進行電鍍的移送過程中,通常不會全程都非常平順,造成導電槽與供電軌道的電性接觸有時可能僅是點接觸,甚至是斷路,導致提供至被鍍物的電鍍電流不穩定,從而影響被鍍物的電鍍品質。Press, the vertical continuous plating (Vertical Continuous Plating) equipment can vertically position the object to be plated (such as a printed circuit board) on the plating frame, and use the conveying device to continuously move the object to be plated in the plating tank along with the plating frame, and supply power at the same time To the electroplating frame, the object to be plated is electroplated; furthermore, the conventional electroplating frame power supply method is to set a power supply track on a vertical continuous electroplating equipment, and make the electroplating frame form a conductive groove relative to the power supply track, and let the electroplating frame use the conductive The electrical contact between the tank and the power supply track provides the electroplating current to the object to be plated, so as to electroplate the object to be plated; however, the electroplating frame is usually not very smooth throughout the transfer process of the electroplating, resulting in the conductive tank and the power supply. The electrical contact of the track may sometimes only be a point contact, or even an open circuit, resulting in unstable plating current supplied to the object to be plated, thereby affecting the plating quality of the object to be plated.

本發明之主要目的,欲解決先前技術提供至被鍍物的電鍍電流不穩定之問題,而具有提供穩定電鍍電流至被鍍物之功效。The main purpose of the present invention is to solve the problem that the electroplating current provided to the object to be plated is unstable in the prior art, and has the effect of providing a stable electroplating current to the object to be plated.

為達上述功效,本發明技術手段之一,包括有:一供電軌,設置於垂直連續電鍍設備上;以及一電極盒,將一盒體設置於電鍍框架的頂部,該盒體內相對該供電軌設置一電極片,該電極片底部設有彈性件,該盒體頂面相對該電極片具有一定位穿槽,當該電極片與該供電軌電性接觸時,遂經由電鍍框架提供電鍍電流至被鍍物。其中,該電極片相對該供電軌的走向予以橫向設置;該供電軌設置於一C型結構體的頂部底緣,該C型結構體的內部高度配合該電極盒的設置高度,並於該C型結構體的底部頂緣設有耐磨軌;該供電軌將一固定軌設置於該C型結構體的頂部底緣,並相對該固定軌設置一下壓軌,而於該固定軌與該下壓軌之間設有彈性件,藉由該下壓軌與該電極片電性接觸。In order to achieve the above effect, one of the technical means of the present invention includes: a power supply rail, which is arranged on the vertical continuous electroplating equipment; and an electrode box, a box body is arranged on the top of the electroplating frame, and the box body is opposite to the power supply rail. An electrode sheet is provided, the bottom of the electrode sheet is provided with an elastic member, and the top surface of the box body has a positioning slot relative to the electrode sheet. When the electrode sheet is in electrical contact with the power supply rail, the electroplating current is provided through the electroplating frame to the plated. Wherein, the electrode sheet is arranged laterally relative to the direction of the power supply rail; the power supply rail is arranged on the top and bottom edge of a C-shaped structure body, and the inner height of the C-shaped structure body matches the setting height of the electrode box, and is in the C-shaped structure body. The bottom top edge of the C-shaped structure is provided with a wear-resistant rail; the power supply rail sets a fixed rail on the top bottom edge of the C-shaped structure, and a lower pressure rail is set relative to the fixed rail, and the fixed rail and the lower An elastic piece is arranged between the pressure rails, and the lower pressure rail is in electrical contact with the electrode sheet.

本發明技術手段之二,包括有:一供電軌,將一固定軌設置於垂直連續電鍍設備上,並相對該固定軌設置一下壓軌,而於該固定軌與該下壓軌之間設有彈性件;以及一電極盒,將一盒體設置於電鍍框架的頂部,該盒體內相對該供電軌的下壓軌設置一電極片,該盒體頂面相對該電極片具有一定位穿槽,當該電極片與該下壓軌電性接觸時,遂經由電鍍框架提供電鍍電流至被鍍物。其中,該電極片相對該供電軌的走向予以橫向設置;該供電軌的固定軌設置於一C型結構體的頂部底緣,該C型結構體的內部高度配合該電極盒的設置高度,並於該C型結構體的底部頂緣設有耐磨軌。The second technical means of the present invention includes: a power supply rail, a fixed rail is arranged on the vertical continuous electroplating equipment, a lower pressure rail is arranged relative to the fixed rail, and a lower pressure rail is arranged between the fixed rail and the lower pressure rail an elastic member; and an electrode box, a box body is arranged on the top of the electroplating frame, an electrode piece is arranged in the box body relative to the lower pressure rail of the power supply rail, and the top surface of the box body has a positioning slot relative to the electrode piece, When the electrode sheet is in electrical contact with the lower voltage rail, the electroplating current is supplied to the object to be plated through the electroplating frame. Wherein, the electrode sheet is arranged laterally relative to the direction of the power supply rail; the fixed rail of the power supply rail is arranged on the top and bottom edge of a C-shaped structure body, and the inner height of the C-shaped structure body matches the setting height of the electrode box, and A wear-resistant rail is provided on the top edge of the bottom of the C-shaped structure.

藉此,令電極片底部設有彈性件或/及令供電軌包含固定軌與下壓軌,並於固定軌與下壓軌之間設有彈性件,致使電鍍框架在進行電鍍的移送過程中縱使不平順,電極片與供電軌/下壓軌的電性接觸仍能持續緊密接觸。Thereby, the bottom of the electrode sheet is provided with an elastic piece or/and the power supply rail includes a fixed rail and a lower pressure rail, and an elastic piece is arranged between the fixed rail and the lower pressure rail, so that the electroplating frame is transferred during the electroplating process. Even if it is not smooth, the electrical contact between the electrode pads and the power supply rail/lower voltage rail can still keep in close contact.

首先,請參閱[圖1〕~[圖4〕所示,本發明第一實施例包括有:一供電軌10,設置於垂直連續電鍍設備上;以及一電極盒20,將一盒體21設置於電鍍框架30的頂部,該盒體21內相對該供電軌10設置一電極片22,該電極片22相對該供電軌10的走向予以橫向設置,該電極片22底部設有彈性件23,該盒體21頂面相對該電極片22具有一定位穿槽24,當該電極片22與該供電軌10電性接觸時,遂經由電鍍框架30提供電鍍電流至被鍍物31。First, please refer to [FIG. 1] to [FIG. 4], the first embodiment of the present invention includes: a power supply rail 10, which is arranged on the vertical continuous electroplating equipment; and an electrode box 20, which is provided with a box body 21. On the top of the electroplating frame 30, an electrode sheet 22 is arranged in the box body 21 relative to the power supply rail 10, and the electrode sheet 22 is arranged laterally relative to the direction of the power supply rail 10. The bottom of the electrode sheet 22 is provided with an elastic member 23, the The top surface of the box body 21 has a positioning slot 24 opposite to the electrode sheet 22 . When the electrode sheet 22 is in electrical contact with the power supply rail 10 , a plating current is supplied to the object 31 to be plated through the plating frame 30 .

接著,本發明第二實施例包括有:一供電軌10,將一固定軌11設置於垂直連續電鍍設備上,並相對該固定軌11設置一下壓軌12,而於該固定軌11與該下壓軌12之間設有彈性件13;以及一電極盒20,將一盒體21設置於電鍍框架30的頂部,該盒體11內相對該供電軌10的下壓軌12設置一電極片22,該電極片22相對該供電軌10的走向予以橫向設置,該盒體21頂面相對該電極片22具有一定位穿槽24,當該電極片22與該下壓軌12電性接觸時,遂經由電鍍框架30提供電鍍電流至被鍍物31。Next, the second embodiment of the present invention includes: a power supply rail 10, a fixed rail 11 is arranged on the vertical continuous electroplating equipment, and a lower pressure rail 12 is arranged relative to the fixed rail 11, and the fixed rail 11 and the lower pressure rail 12 are arranged. An elastic member 13 is arranged between the pressure rails 12 ; and an electrode box 20 , a box body 21 is arranged on the top of the electroplating frame 30 , and an electrode sheet 22 is arranged in the box body 11 relative to the lower pressure rail 12 of the power supply rail 10 , the electrode sheet 22 is arranged laterally relative to the direction of the power supply rail 10, and the top surface of the box body 21 has a positioning slot 24 relative to the electrode sheet 22. When the electrode sheet 22 is in electrical contact with the lower pressure rail 12, Thus, the plating current is supplied to the object to be plated 31 through the plating frame 30 .

再者,本發明第三實施例包括有:一供電軌10,將一固定軌11設置於垂直連續電鍍設備上,並相對該固定軌11設置一下壓軌12,而於該固定軌11與該下壓軌12之間設有彈性件13;以及一電極盒20,將一盒體21設置於電鍍框架30的頂部,該盒體21內相對該供電軌10設置一電極片22,該電極片22相對該供電軌10的走向予以橫向設置,該電極片22底部設有彈性件23,該盒體21頂面相對該電極片22具有一定位穿槽24,當該電極片22與該下壓軌12電性接觸時,遂經由電鍍框架30提供電鍍電流至被鍍物31。Furthermore, the third embodiment of the present invention includes: a power supply rail 10, a fixed rail 11 is arranged on the vertical continuous electroplating equipment, and a lower pressure rail 12 is arranged relative to the fixed rail 11, and the fixed rail 11 and the An elastic member 13 is arranged between the lower pressure rails 12; and an electrode box 20, a box body 21 is arranged on the top of the electroplating frame 30, and an electrode sheet 22 is arranged in the box body 21 relative to the power supply rail 10. The electrode sheet 22 is arranged laterally relative to the direction of the power supply rail 10, the bottom of the electrode sheet 22 is provided with an elastic member 23, and the top surface of the box body 21 has a positioning slot 24 relative to the electrode sheet 22. When the rails 12 are in electrical contact, the plating current is supplied to the object to be plated 31 through the plating frame 30 .

此外,上述第二、第三實施例還可令該供電軌10將該固定軌11設置於垂直連續電鍍設備上的一C型結構體40的頂部底緣,該C型結構體40的內部高度配合該電極盒20的設置高度,並於該C型結構體40的底部頂緣設有耐磨軌41。In addition, in the above-mentioned second and third embodiments, the power supply rail 10 can also be arranged on the top and bottom edge of a C-shaped structure 40 on the vertical continuous electroplating equipment. The inner height of the C-shaped structure 40 According to the setting height of the electrode box 20 , a wear-resistant rail 41 is provided on the top edge of the bottom of the C-shaped structure 40 .

基於如是之構成,本發明可如第一實施例令電極片22底部設有彈性件23;或如第二實施例令供電軌10包含固定軌11與下壓軌12,並於固定軌11與下壓軌12之間設有彈性件13;亦或如第三實施例令電極片22底部設有彈性件23、且令供電軌10包含固定軌11與下壓軌12,並於固定軌11與下壓軌12之間設有彈性件13;藉此,當電鍍框架30在進行電鍍的移送過程中縱使不平順,電極片22與供電軌10/下壓軌12的電性接觸仍能持續緊密接觸,而具有提供穩定電鍍電流至被鍍物之功效。Based on such a configuration, the present invention can make the bottom of the electrode sheet 22 provided with the elastic member 23 as in the first embodiment; or make the power supply rail 10 include the fixed rail 11 and the lower pressure rail 12 as in the second embodiment, and the fixed rail 11 and An elastic member 13 is provided between the lower pressure rails 12; or as in the third embodiment, the bottom of the electrode sheet 22 is provided with an elastic member 23, and the power supply rail 10 includes the fixed rail 11 and the lower pressure rail 12, and the fixed rail 11 The elastic member 13 is arranged between the lower pressure rail 12 ; thereby, even if the electroplating frame 30 is not smooth during the electroplating transfer process, the electrical contact between the electrode sheet 22 and the power supply rail 10 / the lower pressure rail 12 can still be continued. In close contact, it has the effect of providing stable plating current to the object to be plated.

綜上所述,本發明所揭示之技術手段,確具「新穎性」、「進步性」及「可供產業利用」等發明專利要件,祈請  鈞局惠賜專利,以勵發明,無任德感。To sum up, the technical means disclosed in the present invention do meet the requirements for invention patents such as "novelty", "progressiveness" and "availability for industrial use". Moral sense.

惟,上述所揭露之圖式、說明,僅為本發明之較佳實施例,大凡熟悉此項技術人士,依本案精神範疇所作之修飾或等效變化,仍應包括在本案申請專利範圍內。However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention, and modifications or equivalent changes made by those skilled in the art within the scope of the spirit of this case should still be included in the scope of the patent application of this case.

10:供電軌 11:固定軌 12:下壓軌 13:彈性件 20:電極盒 21:盒體 22:電極片 23:彈性件 24:定位穿槽 30:電鍍框架 31:被鍍物 40:C型結構體 41:耐磨軌 10: Power rail 11: Fixed rail 12: Lower pressure rail 13: Elastic parts 20: Electrode Box 21: Box 22: Electrode 23: Elastic 24: Positioning through the groove 30: Plating frame 31: Plating 40: C-type structure 41: Wear rails

[圖1〕係本發明之整體結構說明圖。 [圖2〕係[圖1〕中標註2處之放大圖。 [圖3〕係本發明之電極盒結構外觀圖。 [圖4〕係本發明之電極盒結構剖示圖。 [FIG. 1] is an explanatory diagram of the overall structure of the present invention. [Fig. 2] is an enlarged view of the place marked 2 in [Fig. 1]. [FIG. 3] is an external view of the structure of the electrode box of the present invention. [FIG. 4] is a cross-sectional view of the electrode box structure of the present invention.

11:固定軌 11: Fixed rail

12:下壓軌 12: Lower pressure rail

13:彈性件 13: Elastic parts

21:盒體 21: Box

22:電極片 22: Electrode

30:電鍍框架 30: Plating frame

31:被鍍物 31: Plating

40:C型結構體 40: C-type structure

41:耐磨軌 41: Wear rails

Claims (7)

一種垂直連續電鍍框架之供電系統,包括有:一供電軌,設置於一C型結構體的頂部底緣,該C型結構體設置於垂直連續電鍍設備上;以及一電極盒,將一盒體設置於電鍍框架的頂部,且令該C型結構體的內部高度配合該電極盒的設置高度,該盒體內相對該供電軌設置一電極片,該電極片底部設有彈性件,該盒體頂面相對該電極片具有一定位穿槽,當該電極片與該供電軌電性接觸時,遂經由電鍍框架提供電鍍電流至被鍍物。 A power supply system for a vertical continuous electroplating frame, comprising: a power supply rail, arranged on the top and bottom edge of a C-shaped structure body, the C-shaped structure body is set on the vertical continuous electroplating equipment; and an electrode box, a box body It is arranged on the top of the electroplating frame, and the inner height of the C-shaped structure is matched with the setting height of the electrode box. An electrode sheet is arranged in the box relative to the power supply rail, and an elastic member is arranged at the bottom of the electrode sheet. The surface opposite to the electrode sheet has a positioning through slot, and when the electrode sheet is in electrical contact with the power supply rail, the electroplating current is supplied to the object to be plated through the electroplating frame. 如請求項1所述之垂直連續電鍍框架之供電系統,其中,該電極片相對該供電軌的走向予以橫向設置。 The power supply system for a vertical continuous electroplating frame as claimed in claim 1, wherein the electrode pads are arranged laterally relative to the direction of the power supply rail. 如請求項2所述之垂直連續電鍍框架之供電系統,其中,該C型結構體的底部頂緣設有耐磨軌。 The power supply system for a vertical continuous electroplating frame as claimed in claim 2, wherein the top edge of the bottom of the C-shaped structure is provided with wear-resistant rails. 如請求項3所述之垂直連續電鍍框架之供電系統,其中,該供電軌將一固定軌設置於該C型結構體的頂部底緣,並相對該固定軌設置一下壓軌,而於該固定軌與該下壓軌之間設有彈性件,藉由該下壓軌與該電極片電性接觸。 The power supply system of the vertical continuous electroplating frame according to claim 3, wherein the power supply rail sets a fixed rail on the top and bottom edge of the C-shaped structure, and sets a lower pressure rail relative to the fixed rail, and the fixed rail is arranged on the fixed rail. An elastic element is arranged between the rail and the lower pressure rail, and the lower pressure rail is in electrical contact with the electrode sheet. 一種垂直連續電鍍框架之供電系統,包括有:一供電軌,將一固定軌設置於一C型結構體的頂部底緣,該C型結構體設置於垂直連續電鍍設備上,並相對該固定軌設置一下壓軌,而於該固定軌與該下壓軌之間設有彈性件;以及一電極盒,將一盒體設置於電鍍框架的頂部,且令該C型結構體的內部 高度配合該電極盒的設置高度,該盒體內相對該供電軌的下壓軌設置一電極片,該盒體頂面相對該電極片具有一定位穿槽,當該電極片與該下壓軌電性接觸時,遂經由電鍍框架提供電鍍電流至被鍍物。 A power supply system for a vertical continuous electroplating frame, comprising: a power supply rail, a fixed rail is arranged on the top bottom edge of a C-shaped structure body, the C-shaped structure body is arranged on the vertical continuous electroplating equipment, and is opposite to the fixed rail A lower pressure rail is arranged, and an elastic member is arranged between the fixed rail and the lower pressure rail; and an electrode box, a box body is arranged on the top of the electroplating frame, and the inner part of the C-shaped structure is made The height matches the setting height of the electrode box, an electrode piece is arranged in the box relative to the lower pressure rail of the power supply rail, and the top surface of the box body has a positioning slot relative to the electrode piece. During the sexual contact, the electroplating current is supplied to the object to be plated through the electroplating frame. 如請求項5所述之垂直連續電鍍框架之供電系統,其中,該電極片相對該供電軌的走向予以橫向設置。 The power supply system for a vertical continuous electroplating frame as claimed in claim 5, wherein the electrode pads are arranged laterally relative to the direction of the power supply rail. 如請求項6所述之垂直連續電鍍框架之供電系統,其中,該C型結構體的底部頂緣設有耐磨軌。 The power supply system for a vertical continuous electroplating frame as claimed in claim 6, wherein the bottom top edge of the C-shaped structure is provided with wear-resistant rails.
TW110113052A 2021-04-12 2021-04-12 Power supply system for vertical continuous electroplating frame TWI763424B (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1742119A (en) * 2003-01-23 2006-03-01 株式会社荏原制作所 Electroplating apparatus and electroplating method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1742119A (en) * 2003-01-23 2006-03-01 株式会社荏原制作所 Electroplating apparatus and electroplating method

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