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TWI761533B - Conductive composition and conductor and laminated structure using the same - Google Patents

Conductive composition and conductor and laminated structure using the same Download PDF

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TWI761533B
TWI761533B TW107120896A TW107120896A TWI761533B TW I761533 B TWI761533 B TW I761533B TW 107120896 A TW107120896 A TW 107120896A TW 107120896 A TW107120896 A TW 107120896A TW I761533 B TWI761533 B TW I761533B
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silver powder
conductive composition
conductor
particle size
elastomer
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TW201907764A (en
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塩澤直行
落合真二
山藤征矢
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日商太陽油墨製造股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14Conductive material dispersed in non-conductive inorganic material
    • H01B1/16Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00Compositions of unspecified rubbers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0806Silver
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/005Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

本發明之課題在於提供一種導電性組成物,其能得到即使伸縮的重複或增大伸張時,也電阻的安定性優異之導電體。   本發明之手段為包含彈性體與銀粉之導電性組成物,其特徵為:前述銀粉係經表面處理過,前述銀粉係其平均一次粒徑為1.0μm以下且表觀空隙率為50~95%,導電性組成物中,前述銀粉的二次粒子之粒度分布中累積95%粒徑(D95粒徑)為3.0~25.0μm。An object of the present invention is to provide a conductive composition capable of obtaining a conductor having excellent electrical resistance stability even when expansion and contraction are repeated or when the expansion is increased. The means of the present invention is a conductive composition comprising an elastomer and silver powder, characterized in that the silver powder is surface-treated, the average primary particle size of the silver powder is 1.0 μm or less and the apparent porosity is 50-95% , In the conductive composition, the cumulative 95% particle size (D95 particle size) in the particle size distribution of the secondary particles of the silver powder is 3.0 to 25.0 μm.

Description

導電性組成物及使用該組成物之導電體與積層構造體Conductive composition and conductor and laminated structure using the same

本發明關於導電性組成物、使導電性組成物固化之導電體、具有該導電體的層之積層構造體以及具備該導電體或積層構造體之電子零件。The present invention relates to a conductive composition, a conductor for curing the conductive composition, a laminate structure having a layer of the conductor, and an electronic component including the conductor or the laminate structure.

作為形成印刷配線板等之電極等的圖案狀導電體之材料,使用在有機黏結劑中混合有金屬粉末的糊狀導電性組成物。藉由以往的導電性組成物,在圖案狀塗佈後使其固化,可形成所欲的導電體,但所得之導電體一般具有高硬度。因此,於可撓性印刷配線板中,要求經固化的導電體具有耐彎曲性般的導電性組成物。As a material for forming patterned conductors such as electrodes of printed wiring boards, etc., a paste-like conductive composition in which metal powder is mixed with an organic binder is used. A desired conductor can be formed by applying a conventional conductive composition in a pattern and then curing it, but the resulting conductor generally has high hardness. Therefore, in a flexible printed wiring board, the hardened conductor is required to have an electroconductive composition which is resistant to bending.

另一方面,隨著近年的穿戴式裝置領域之成長,亦要求對於導電體賦予伸縮性。特別地,與身體的密著度愈高的穿戴式裝置,愈要求高度的伸縮性。On the other hand, with the recent growth in the field of wearable devices, it is also required to impart stretchability to conductors. In particular, a wearable device with a higher degree of adhesion to the body requires a higher degree of stretchability.

對於如此之要求,例如作為含有金屬粉末的有機黏結劑,有提案使用彈性體,在導電體不僅彎曲性而且具有伸縮性的導電性組成物(參照專利文獻1等)。 [先前技術文獻]In response to such a demand, for example, as an organic binder containing a metal powder, there has been proposed a conductive composition using an elastomer and having not only flexibility but also stretchability in the conductor (refer to Patent Document 1, etc.). [Prior Art Literature]

[專利文獻]   [專利文獻1] 國際公開第2015/005204號小冊[Patent Document] [Patent Document 1] International Publication No. 2015/005204 Pamphlet

[發明所欲解決的課題][Problems to be solved by the invention]

然而,即使為使用如上述的導電性組成物之導電體,也因重複伸縮,或若導電體被伸長某程度而電阻值急劇地增大,或取決於情況,有時會斷線,要求能得到即使伸縮的重複或伸長時,也電阻的安定性優異之導電體的導電性組成物。However, even if it is a conductor using the above-mentioned conductive composition, the resistance value increases rapidly due to repeated expansion and contraction, or if the conductor is stretched to a certain extent, or the wire may be disconnected depending on the situation. Even when expansion and contraction are repeated or stretched, a conductive composition of a conductor excellent in electrical resistance stability can be obtained.

因此,本發明之目的在於提供一種導電性組成物,其能得到即使伸縮的重複或增大伸張時,也電阻的安定性優異之導電體。Therefore, an object of the present invention is to provide an electroconductive composition capable of obtaining a conductor having excellent electrical resistance stability even when expansion and contraction are repeated or when the expansion and contraction are increased.

又,本發明之另一目的在於提供:如此的導電性組成物經固化之導電體、具有該導電體的層之積層構造體以及具備該導電體或積層構造體之電子零件。 [解決課題的手段]Another object of the present invention is to provide a conductor in which such a conductive composition is cured, a laminate structure having a layer of the conductor, and an electronic component including the conductor or the laminate structure. [Means to solve the problem]

本發明者們得到以下的知識見解:作為摻合於彈性體的導電性金屬粉,藉由使施有表面處理之具有特定的平均一次粒徑之銀粉,在組成物中成為特定的凝集狀態,可實現一種導電性組成物,其能得到即使重複伸縮時,或例如大地伸張至400%以上時,也電阻的安定性優異之導電體。本發明係以該知識見解為基礎者。The inventors of the present invention have obtained the following knowledge and insight: as the conductive metal powder blended with the elastomer, the surface-treated silver powder having a specific average primary particle size is brought into a specific agglomerated state in the composition, It is possible to realize an electroconductive composition which can obtain a conductor having excellent electrical resistance stability even when repeatedly stretched or stretched, for example, when it is stretched to 400% or more. The present invention is based on this knowledge.

即,本發明之導電性組成物係包含彈性體與銀粉之導電性組成物,   前述銀粉係經表面處理過,   前述銀粉係其平均一次粒徑為1.0μm以下且表觀空隙率為50~95%,   導電性組成物中,前述銀粉的二次粒子之粒度分布中累積95%粒徑(D95粒徑)為3.0~25.0μm。That is, the conductive composition of the present invention is a conductive composition comprising an elastomer and a silver powder, the silver powder is surface-treated, and the silver powder has an average primary particle size of 1.0 μm or less and an apparent porosity of 50 to 95 %, In the conductive composition, the cumulative 95% particle size (D95 particle size) in the particle size distribution of the secondary particles of the silver powder is 3.0 to 25.0 μm.

於本發明之實施態樣中,相對於導電性組成物全體,前述銀粉以固形份量計含有60~95質量%。In the embodiment of this invention, the said silver powder is 60-95 mass % in solid content with respect to the whole electroconductive composition.

又,本發明之另一實施態樣的導電體係使上述導電性組成物固化者。Moreover, the electroconductive system which concerns on another embodiment of this invention hardens the said electroconductive composition.

另外,本發明之另一實施態樣的積層構造體係於基材上具有上述導電體的層者。Moreover, the laminated structure system which concerns on another embodiment of this invention has the layer of the said conductor on a base material.

還有,本發明之另一實施態樣的電子零件係具備上述導電體的層或上述積層構造體者。 [發明的效果]Moreover, the electronic component which concerns on another embodiment of this invention is provided with the layer of the said conductor or the said laminated structure. [Effect of invention]

依照本發明之導電性組成物,作為摻合於彈性體之導電性金屬粉,藉由使施有表面處理之具有特定的平均一次粒徑之銀粉,在組成物中成為特定的凝集狀態,可得到即使伸縮的重複或增大伸張時,也電阻的安定性優異之導電體。According to the conductive composition of the present invention, as the conductive metal powder mixed with the elastomer, the surface-treated silver powder having a specific average primary particle size is brought into a specific agglomerated state in the composition. Even when the expansion and contraction are repeated or the expansion is increased, a conductor having excellent electrical resistance stability is obtained.

[實施發明的形態][The form of carrying out the invention]

本發明之導電性組成物係包含彈性體與銀粉者,藉由在彈性體中摻合特定的銀粉,可得到不僅彎曲時,而且即使伸縮或大地伸張時,也電阻的安定性優異之導電體等。結果,本發明之導電性組成物係可利用如此的特性,適用於體外裝置、體表裝置、電子皮膚裝置、體內裝置等穿戴式裝置用的導電體之形成。以下,詳述本發明之導電性組成物所含有的各成分。The conductive composition of the present invention contains an elastomer and a silver powder, and by blending a specific silver powder with the elastomer, a conductor with excellent resistance stability can be obtained not only when it is bent, but also when stretched or stretched. Wait. As a result, the conductive composition of the present invention can utilize such characteristics and is suitable for the formation of conductors for wearable devices such as in vitro devices, body surface devices, electronic skin devices, and in vivo devices. Hereinafter, each component contained in the conductive composition of the present invention will be described in detail.

<銀粉>   構成本發明之導電性組成物的銀粉係經表面處理過,使用其平均一次粒徑為1.0μm以下,較佳為0.1~1.0μm,且表觀空隙率為50~95%,較佳為60~95%者。使用如此的銀粉,藉由成為組成物中之銀粉的二次粒子之粒度分布為如後述的範圍之凝集狀態,即使伸縮的重複或增大伸張時,也可維持電阻的安定性。再者,於本發明中,所謂銀粉的平均一次粒徑,就是意指用掃描型電子顯微鏡,以10,000倍之倍率觀察粉體狀態的銀粉,隨機地抽出10個一次粒子,測定其粒徑時,彼等粒徑之平均值。又,銀粉的表觀空隙率係表示銀粉的一次粒子連結而適度的空隙存在之凝集構造(二次粒子)的狀態之指標,可如以下地測定。   即,   將銀的密度當作ρ0 (g/cm3 ),   於將對於質量M(g)的銀粉施加1kg重的荷重時之銀粉體積當作V(cm3 )之情況中,表觀密度ρ(g/cm3 )係定義為:   ρ=M/V   可從表觀密度,藉由下述式算出表觀空隙率(P)。   P=(1-ρ/ρ0 )×100   再者,銀的密度ρ0 為10.49g/cm3 ,1kg重荷重時的銀粉體積V係在附加荷重後,經過1小時後的銀粉體積。<Silver powder> The silver powder constituting the conductive composition of the present invention is surface-treated, and its average primary particle size is 1.0 μm or less, preferably 0.1 to 1.0 μm, and the apparent porosity is 50 to 95%, preferably The best is 60 to 95%. By using such a silver powder, since the particle size distribution of the secondary particles serving as the silver powder in the composition is in an agglomerated state in the range described later, stability of electrical resistance can be maintained even when expansion and contraction are repeated or increased. Furthermore, in the present invention, the average primary particle size of the silver powder means that the silver powder in the powder state is observed with a scanning electron microscope at a magnification of 10,000 times, 10 primary particles are randomly extracted, and the particle size is measured. , the average of their particle sizes. In addition, the apparent porosity of the silver powder is an index indicating the state of an aggregated structure (secondary particle) in which the primary particles of the silver powder are connected and appropriate voids exist, and can be measured as follows. That is, when the density of silver is regarded as ρ 0 (g/cm 3 ), and the volume of silver powder when a load of 1 kg is applied to the silver powder of mass M (g) is regarded as V (cm 3 ), the apparent density ρ (g/cm 3 ) is defined as: ρ=M/V The apparent porosity (P) can be calculated from the apparent density by the following formula. P=(1-ρ/ρ 0 )×100 Furthermore, the density ρ 0 of silver is 10.49 g/cm 3 , and the silver powder volume V under a heavy load of 1 kg is the silver powder volume after 1 hour after additional loading.

上述表觀空隙率P係在本發明中,表示與彈性體混合前的銀粉之一次粒子彼此的凝集狀態之指標。若對於銀粉施加一定荷重,則經填充的銀粉進行壓縮。此時,當銀粉不是凝集狀態而是一次粒子彼此分離的狀態時,壓縮後的表觀空隙率變小。另一方面,當銀粉形成凝集狀態時,由於凝集內部的空隙,表觀空隙率變大。藉此,可將銀粉的一次粒子彼此之凝集狀態作為表觀空隙率評價。The said apparent porosity P is an index which shows the aggregation state of the primary particle of the silver powder before mixing with an elastomer in this invention. When a certain load is applied to the silver powder, the filled silver powder is compressed. At this time, when the silver powder is not in an aggregated state but in a state in which primary particles are separated from each other, the apparent porosity after compression becomes small. On the other hand, when the silver powder is in an agglomerated state, the apparent porosity increases due to the voids inside the agglomeration. Thereby, the aggregated state of the primary particles of the silver powder can be evaluated as the apparent porosity.

又,於本發明中,銀粉的一次粒子之形狀較佳為略球狀,略球狀的一次粒子係以三次元且無規地連結之二次粒子的形態存在於導電性組成物中,如上述,即使導電性組成物的固化物大地伸張時,也不減少一次粒子彼此的接點,銀粉能追隨導電性組成物的固化物中之彈性體的伸張變形。In addition, in the present invention, the shape of the primary particles of the silver powder is preferably slightly spherical, and the slightly spherical primary particles exist in the conductive composition in the form of three-dimensional and randomly connected secondary particles, such as As described above, even when the cured product of the conductive composition is greatly stretched, the contact points of the primary particles are not reduced, and the silver powder can follow the stretching deformation of the elastomer in the cured product of the conductive composition.

再者,銀粉的一次粒子之形狀係不限定於略球狀者,於不損害本發明的效果之範圍內,當然亦可包含略球狀以外的形狀之銀粉。In addition, the shape of the primary particles of the silver powder is not limited to the slightly spherical shape, and it is of course also possible to include silver powder with shapes other than the slightly spherical shape within the range that does not impair the effect of the present invention.

平均一次粒徑及表觀空隙率為如上述範圍的銀粉係可使用市售者,另外亦可將市售的銀粉,使用分級機等,分級成具有特定的平均一次粒徑及表觀空隙率之銀粉而得。The silver powder with the average primary particle size and apparent porosity in the above-mentioned ranges can be used commercially. In addition, commercially available silver powder can be classified into a specific average primary particle size and apparent porosity using a classifier, etc. of silver powder.

本發明中使用的銀粉(即,作為導電性組成物調製之前的銀粉)係其平均二次粒徑較佳為5.0~40.0μm,更佳為超過10.0~40.0μm,尤佳為超過15.0~40.0μm。由於平均二次粒徑在上述範圍,使銀粉分散於組成物中時,容易調整至如後述的特定範圍之粒徑。再者,所謂作為導電性組成物調製之前的銀粉之平均二次粒徑,就是意指藉由雷射繞射散射式粒度分布測定法測定粉體狀態的銀粉之粒徑的平均值(D50)。The average secondary particle size of the silver powder used in the present invention (that is, the silver powder before preparation as a conductive composition) is preferably 5.0 to 40.0 μm, more preferably more than 10.0 to 40.0 μm, particularly preferably more than 15.0 to 40.0 μm μm. Since the average secondary particle size is in the above-mentioned range, when the silver powder is dispersed in the composition, it is easy to adjust the particle size to the specific range described later. In addition, the average secondary particle size of the silver powder before preparation as the conductive composition means the average value (D50) of the particle size of the silver powder in the powder state measured by the laser diffraction scattering particle size distribution measurement method. .

又,本發明中使用的銀粉(作為導電性組成物調製之前的銀粉)係依據JIS K 6217-4(2017)所測定的DBP吸油量較佳為30~200ml/100g。所謂銀粉的DBP吸油量,就是意指依據JIS K 6217-4,測定被100g的銀粉所吸收的鄰苯二甲酸二丁酯之量的值,於本發明中,表示銀粉的一次粒子之連結程度或凝集程度之指標。由於使用DBP吸油量在上述範圍之銀粉,使銀粉分散於組成物中時,容易調整至如後述的特定範圍之粒徑。In addition, the silver powder used in the present invention (silver powder before preparation as a conductive composition) is preferably 30 to 200 ml/100 g of DBP oil absorption measured in accordance with JIS K 6217-4 (2017). The DBP oil absorption of silver powder refers to the value of measuring the amount of dibutyl phthalate absorbed by 100 g of silver powder according to JIS K 6217-4, and in the present invention, indicates the degree of bonding of primary particles of silver powder or an indicator of the degree of agglutination. Since the silver powder whose DBP oil absorption is in the above-mentioned range is used, when the silver powder is dispersed in the composition, it is easy to adjust the particle size to the specific range described later.

本發明之導電性組成物係使用上述的銀粉,使其分散於彈性體中者,導電性組成物中銀粉的二次粒子之粒度分布中累積95%粒徑(D95粒徑)為3.0~25.0μm之範圍。本發明係將如後述之經過表面處理過的具有特定的平均一次粒徑之銀粉,且在特定的凝集狀態(即,特定的表觀空隙率)之較佳具有特定的DBP吸油量之銀粉,摻合於彈性體中而成為組成物時,藉由控制組成物中的銀粉之凝集狀態(即,使二次粒子之粒度分布中累積95%粒徑成為特定之範圍),而改善導電性組成物經固化的硬化物之導電性,可成為即使伸縮的重複或增大伸張時,也電阻的安定性優異之導電體。In the conductive composition of the present invention, when the above-mentioned silver powder is used and dispersed in an elastomer, the cumulative 95% particle size (D95 particle size) of the secondary particles of the silver powder in the conductive composition is 3.0 to 25.0 range of μm. In the present invention, the surface-treated silver powder having a specific average primary particle size as described later, and preferably a silver powder having a specific DBP oil absorption in a specific agglomerated state (that is, a specific apparent porosity), When it is blended into an elastomer to form a composition, the conductive composition is improved by controlling the aggregation state of the silver powder in the composition (that is, making the cumulative 95% particle size in the particle size distribution of the secondary particles within a specific range). The electrical conductivity of the cured cured product can be used as a conductor with excellent resistance stability even when the expansion and contraction are repeated or the expansion is increased.

茲認為構成本發明之導電性組成物的銀粉係即使與彈性體混合或混煉時,也一邊維持複數的一次粒子三次元且無規地連結之一定的凝集狀態,一邊分散於導電性組成物中。即,將具有特定的表觀空隙率之銀粉混合或混煉於彈性體中,則在銀粉的一次粒子所凝集的二次粒子之中,粒徑大的二次粒子係崩解,某程度地變小。藉由以當時的二次粒子之粒度分布中累積95%粒徑成為3.0~25.0μm之方式調整,而在銀粉的二次粒子中適度地殘存表觀上的空隙,由於彈性體進入該空隙,茲認為容易發揮本發明特有的效果。It is considered that even when the silver powder constituting the conductive composition of the present invention is mixed or kneaded with the elastomer, it is dispersed in the conductive composition while maintaining a constant aggregation state in which a plurality of primary particles are three-dimensionally and randomly connected. middle. That is, when silver powder having a specific apparent porosity is mixed or kneaded into an elastomer, among the secondary particles aggregated by the primary particles of the silver powder, the secondary particles with larger particle diameters disintegrate, and to some extent the secondary particles are disintegrated. become smaller. By adjusting so that the cumulative 95% particle size in the particle size distribution of the secondary particles at that time becomes 3.0 to 25.0 μm, the apparent voids remain moderately in the secondary particles of the silver powder, and since the elastomer enters the voids, It is considered that the effects peculiar to the present invention are easily exhibited.

達成此本發明特有的效果之詳細機制雖然未明,但判斷如以下。即,茲認為將如後述之經表面處理過的平均一次粒徑為1.0μm以下之銀粉,且表觀空隙率為50~95%,較佳DBP吸油量在上述範圍之銀粉,摻合於彈性體中,使其分散而調製組成物時,藉由使銀粉之凝集適度地崩解,以D95粒徑成為3.0~25.0μm之方式攪拌或混煉組成物,銀粉的二次粒子係表觀上的空隙適度地存在,由於彈性體充分地進入該空隙,即使導電性組成物的固化物大地伸張時,也一次粒子彼此的接點不減少,銀粉可追隨彈性體的伸張變形。Although the detailed mechanism which achieves this effect peculiar to this invention is not clear, it is judged as follows. That is, it is considered that the silver powder having an average primary particle size of 1.0 μm or less after surface treatment, an apparent void ratio of 50 to 95%, and a preferable DBP oil absorption in the above-mentioned range, as described later, is blended into the elastic powder. When the composition is prepared by dispersing it in the body, the agglomeration of the silver powder is appropriately disintegrated, and the composition is stirred or kneaded so that the D95 particle size becomes 3.0 to 25.0 μm. There are moderate voids, and since the elastomer sufficiently enters the voids, even when the cured product of the conductive composition is greatly stretched, the contact points of the primary particles are not reduced, and the silver powder can follow the stretch deformation of the elastomer.

導電性組成物中,銀粉的二次粒子之粒度分布中累積95%粒徑(D95粒徑)係可藉由雷射繞射散射式粒度分布測定法測定將銀粉與彈性體混合或混煉而得的導電性組成物。具體而言,使用丙二醇單甲基醚乙酸酯當作測定溶劑,以導電性組成物成為3000質量%之方式,用測定溶劑(丙二醇單甲基醚乙酸酯)稀釋,以銀粉的二次粒子不崩解之方式,用刮勺等適度地攪拌後,迅速地以測定範圍0.020μm~1000.00μm,將粒子的折射率當作1.33,將溶劑的折射率當作1.40,測定粒度分布,將作為該粒度分布的累積95%之粒徑所算出的值定義為D95粒徑。In the conductive composition, the cumulative 95% particle size (D95 particle size) in the particle size distribution of the secondary particles of the silver powder can be determined by mixing or kneading the silver powder and the elastomer by the laser diffraction scattering particle size distribution measurement method. The obtained conductive composition. Specifically, propylene glycol monomethyl ether acetate was used as the measurement solvent, and the conductive composition was diluted with the measurement solvent (propylene glycol monomethyl ether acetate) so that the conductive composition became 3000% by mass, and the secondary In a way that the particles do not disintegrate, after moderate stirring with a spatula, etc., the particle size distribution is quickly measured in the measurement range of 0.020 μm to 1000.00 μm, taking the refractive index of the particles as 1.33 and the refractive index of the solvent as 1.40. The value calculated as the particle size of the cumulative 95% of the particle size distribution is defined as the D95 particle size.

如此地,依照本發明之導電性組成物,由於以D95粒徑成為上述範圍之方式,使經表面處理過的銀粉分散於導電性組成物中,故判斷即使由該導電性組成物所構成的固化物係伸縮的重複或大地伸張時,也可得到電阻的安定性優異之導電體。In this way, according to the conductive composition of the present invention, since the surface-treated silver powder is dispersed in the conductive composition so that the D95 particle size falls within the above-mentioned range, it is judged that even if the conductive composition is composed of Even when the cured product repeats the expansion and contraction or expands greatly, a conductor with excellent resistance stability can be obtained.

若使通常的銀粉分散於彈性體中,則由於導電性組成物中的銀粉之凝集狀態過度崩解,當該導電性組成物的固化物大地伸張時,銀粉的一次粒子彼此之接點會因該伸張變形而減少。於此點,若為依照如上述的本發明之特徵構成,則於導電性組成物中之銀粉的二次粒子中,由於表觀上的空隙適度地存在,彈性體充分地進入該空隙,故判斷即使由如此的導電性組成物所構成的固化物係大地伸張時,也不減少一次粒子彼此之接點,銀粉可追隨彈性體的伸張變形。If the general silver powder is dispersed in the elastomer, the agglomerated state of the silver powder in the conductive composition disintegrates excessively, and when the cured product of the conductive composition is greatly stretched, the contact points of the primary particles of the silver powder This stretching deformation is reduced. In this regard, if it is structured according to the features of the present invention as described above, in the secondary particles of the silver powder in the conductive composition, the apparent voids are appropriately present, and the elastic body sufficiently enters the voids. It is judged that even when the cured product composed of such a conductive composition is largely stretched, the contact points of the primary particles are not reduced, and the silver powder can follow the stretch deformation of the elastic body.

於本發明之導電性組成物中,為了銀粉以如上述的形態存在,必須:銀粉藉由表面處理而與彈性體的親和性高,且具有銀粉的一次粒子互相連結而空隙適度地存在之凝集構造(二次粒子)。In the conductive composition of the present invention, in order for the silver powder to exist in the above-mentioned form, it is necessary that the silver powder has a high affinity with the elastomer by the surface treatment, and the primary particles of the silver powder are connected to each other, and it is necessary to have agglomeration in which the voids are appropriately present. Construct (secondary particles).

因此,於本發明中,為了調整上述的DBP吸油量及銀粉及與彈性體的親和性,使用經表面處理過的銀粉。作為此銀粉之表面處理,可舉出於含有分散液的溶液中投入銀粉,進行攪拌之濕式法,或一邊攪拌銀粉,一邊將含有分散液的溶液予以噴霧之乾式法等之方法。再者,亦可併用界面活性劑,進行表面處理。Therefore, in the present invention, in order to adjust the above-mentioned DBP oil absorption, silver powder, and affinity with the elastomer, surface-treated silver powder is used. The surface treatment of the silver powder includes a wet method in which the silver powder is put into a solution containing the dispersion liquid and stirred, or a dry method in which the solution containing the dispersion liquid is sprayed while stirring the silver powder. Furthermore, a surfactant may be used in combination to perform surface treatment.

作為如此的表面處理中使用的分散劑,例如可使用脂肪酸、有機金屬、明膠等的保護膠體,但若考慮雜質混入之虞或與疏水基的吸附性之提高,則較佳為脂肪酸或其鹽。又,作為此分散劑,較佳為脂肪酸或其鹽經界面活性劑所乳化者。較佳的分散劑為碳原子數6~24的脂肪酸,可更佳地使用硬脂酸、油酸、肉豆蔻酸、棕櫚酸、亞麻油酸、月桂酸、次亞麻油酸等。茲認為此等之脂肪酸係對於使用導電性組成物的配線層或電極之不良影響少。上述的脂肪酸係可單獨使用,且可組合複數而使用。As the dispersing agent used in such surface treatment, for example, protective colloids such as fatty acids, organometallics, and gelatin can be used, but in consideration of the possibility of contamination of impurities or the improvement of adsorption properties with hydrophobic groups, fatty acids or their salts are preferred. . Moreover, as this dispersing agent, what emulsified the fatty acid or its salt with a surfactant is preferable. A preferred dispersant is a fatty acid having 6 to 24 carbon atoms, and more preferably, stearic acid, oleic acid, myristic acid, palmitic acid, linoleic acid, lauric acid, hypolinoleic acid and the like can be used. It is considered that these fatty acids have little adverse effect on wiring layers and electrodes using the conductive composition. The above-mentioned fatty acids may be used alone or in combination.

如以上說明的銀粉係藉由將後述的彈性體及視需要溶劑予以摻合、攪拌或混煉,將銀粉的二次粒子之D95粒徑調整成3.0~25.0μm之範圍。例如,可使用溶解器或碟形混合機等之攪拌機或輥磨機或珠磨機等之混煉機,進行攪拌或混煉,可按照當時的攪拌機及/或混煉機之旋轉速度、攪拌葉片或混煉裝置之形狀、攪拌或混煉時間、攪拌或混煉時之溫度、珠填充率或輥間隔等各種條件,進行調整。The silver powder described above is adjusted to the range of 3.0 to 25.0 μm for the D95 particle size of the secondary particles of the silver powder by blending, stirring, or kneading the below-described elastomer and optionally a solvent. For example, a mixer such as a dissolver or a disc mixer, or a kneader such as a roll mill or a bead mill can be used for stirring or kneading. It can be adjusted according to various conditions such as the shape of the blade or the kneading device, the stirring or kneading time, the temperature during stirring or kneading, the bead filling rate or the roll interval.

此導電性組成物中的銀粉之摻合量,以導電性組成物所包含的全部固形份量為基準,較佳為60~95質量%。若為60質量%以上,則可容易得到低電阻值的導電體。若為95質量%以下,則在伸縮時更不易發生斷線。   再者,本發明之導電性組成物係在不損害本發明的效果之範圍內,亦可併用銀粉以外的碳等其他的導電粉。The blending amount of the silver powder in the conductive composition is preferably 60 to 95% by mass based on the total solid content contained in the conductive composition. If it is 60 mass % or more, a conductor with a low resistance value can be easily obtained. When it is 95 mass % or less, it becomes less likely that disconnection will occur at the time of expansion and contraction. Furthermore, in the conductive composition of the present invention, other conductive powders such as carbon other than silver powder may be used in combination within a range that does not impair the effects of the present invention.

<彈性體>   本發明之導電性組成物中所包含的彈性體,只要是在室溫下具有橡膠彈性的材料,則可無特別限制地使用,例如可適宜使用橡膠、熱塑性彈性體、含官能基的彈性體、嵌段共聚物等。<Elastomer> The elastomer contained in the conductive composition of the present invention can be used without particular limitation as long as it has rubber elasticity at room temperature. For example, rubber, thermoplastic elastomer, functional based elastomers, block copolymers, etc.

作為橡膠,可為二烯系橡膠、非二烯系橡膠之一者,可單獨或混合二種以上的周知慣用者而使用。As the rubber, either a diene-based rubber or a non-diene-based rubber may be used, and a known and customary one may be used alone or in a mixture of two or more.

又,作為熱塑性彈性體,可舉出苯乙烯系彈性體、烯烴系彈性體、胺基甲酸酯系彈性體、聚酯系彈性體、聚醯胺系彈性體、丙烯酸系彈性體、聚矽氧系彈性體等,可單獨或混合二種以上而使用。Further, as the thermoplastic elastomer, styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, acrylic-based elastomers, and polysilicon Oxygen-based elastomers and the like can be used alone or in combination of two or more.

作為含官能基的彈性體,從伸縮性之觀點來看,較佳為胺基甲酸酯系、烯烴系,從耐溶劑性之觀點來看,較佳為具有(甲基)丙烯醯基或酸酐基、羧基、環氧基等官能基者。As the functional group-containing elastomer, from the viewpoint of stretchability, urethane-based and olefin-based elastomers are preferred, and from the viewpoint of solvent resistance, those having a (meth)acryloyl group or Functional groups such as acid anhydride group, carboxyl group, epoxy group, etc.

作為嵌段共聚物,可使用硬鏈段與軟鏈段之嵌段共聚物,可單獨或混合二種以上而使用。As a block copolymer, the block copolymer of a hard segment and a soft segment can be used, and it can use individually or in mixture of 2 or more types.

於上述彈性體之中,嵌段共聚物由於結晶性低,分子間力弱,故玻璃轉移點(以下簡稱Tg)比其他的橡膠低,當與銀粉混合時,柔軟且伸長性良好而較宜。因此,嵌段共聚物係適合穿戴式裝置用的導電體之形成。特別地,Tg未達150℃的硬鏈段與Tg未達0℃的軟鏈段之嵌段共聚物係更合適。再者,玻璃轉移點Tg係藉由示差掃描熱量測定(DSC)進行測定。Among the above elastomers, the block copolymer has low crystallinity and weak intermolecular force, so the glass transition point (hereinafter referred to as Tg) is lower than that of other rubbers. When mixed with silver powder, it is soft and has good elongation and is suitable. . Therefore, block copolymers are suitable for the formation of electrical conductors for wearable devices. In particular, a block copolymer of a hard segment with a Tg of less than 150°C and a soft segment with a Tg of less than 0°C is more suitable. In addition, the glass transition point Tg is measured by differential scanning calorimetry (DSC).

如此的嵌段共聚物中之硬鏈段與軟鏈段之比率較佳為20:80~50:50之範圍。若為此範圍內,則導電性組成物經固化的導電體係在伸長時不易發生斷線而較宜。更佳為25:75~40:60。The ratio of the hard segment to the soft segment in such a block copolymer is preferably in the range of 20:80 to 50:50. Within this range, the conductive system in which the conductive composition has been cured is less likely to be disconnected during elongation, which is preferable. More preferably, it is 25:75-40:60.

此處,作為嵌段共聚物中的硬鏈段,可舉出(甲基)丙烯酸甲酯單元或苯乙烯單元等。又,作為軟鏈段單元,可舉出丙烯酸正丁酯或丁二烯單元等。嵌段共聚物較佳為聚(甲基)丙烯酸甲酯/聚(甲基)丙烯酸正丁酯/聚(甲基)丙烯酸甲酯之三嵌段共聚物。嵌段共聚物係可單獨使用1種,也可組合2種以上使用。再者,本案說明書中所謂的(甲基)丙烯酸酯,就是將丙烯酸酯及甲基丙烯酸酯總稱之用語,其他類似的表現亦同樣。Here, as a hard segment in a block copolymer, a methyl (meth)acrylate unit, a styrene unit, etc. are mentioned. Moreover, as a soft segment unit, n-butyl acrylate, a butadiene unit, etc. are mentioned. The block copolymer is preferably a triblock copolymer of poly(methyl)acrylate/poly(n-butyl(meth)acrylate/poly(meth)acrylate). A block copolymer system may be used individually by 1 type, and may be used in combination of 2 or more types. In addition, the so-called (meth)acrylate in the specification of this case is a term collectively referring to acrylate and methacrylate, and other similar expressions are also the same.

嵌段共聚物係可為市售品。市售品之例係ARKEMA公司製的使用活性聚合所製造之丙烯酸系三嵌段共聚物。具體而言,可使用以聚苯乙烯-聚丁二烯-聚甲基丙烯酸甲酯為代表的SBM類型、以聚甲基丙烯酸甲酯-聚丙烯酸丁酯-聚甲基丙烯酸甲酯為代表的MAM類型、及經羧酸改質處理或親水基改質處理的MAM N類型或MAM A類型。SBM類型之例為E41、E40、E21及E20。MAM類型之例為M51、M52、M53及M22。MAM N類型之例為52N及22N。MAM A類型之例為、SM4032XM10。市售品之另一例為KURARAY公司製的Clarity。此Clarity係由甲基丙烯酸甲酯及丙烯酸丁酯所衍生之嵌段共聚物。The block copolymer can be a commercially available product. An example of a commercial product is an acrylic triblock copolymer manufactured by using living polymerization, manufactured by ARKEMA. Specifically, SBM types represented by polystyrene-polybutadiene-polymethyl methacrylate, and SBM types represented by polymethyl methacrylate-polybutyl acrylate-polymethyl methacrylate can be used. MAM type, and MAM N type or MAM A type modified with carboxylic acid or hydrophilic group. Examples of SBM types are E41, E40, E21 and E20. Examples of MAM types are M51, M52, M53 and M22. Examples of MAM N types are 52N and 22N. An example of MAM A type is SM4032XM10. Another example of a commercially available product is Clarity manufactured by KURARAY. The Clarity is a block copolymer derived from methyl methacrylate and butyl acrylate.

如上述之包含(甲基)丙烯酸酯聚合物嵌段的嵌段共聚物,例如可藉由日本特表2007-516326號公報或日本特表2005-515281號公報中記載之方法而得。The block copolymer containing the (meth)acrylate polymer block as described above can be obtained, for example, by the method described in JP 2007-516326 A or JP 2005-515281 A.

嵌段共聚物之重量平均分子量較佳為20,000~400,000,更佳為50,000~300,000。由於重量平均分子量為20,000以上,可得到目的之強韌性及柔軟性之效果,在將導電性組成物予以薄膜狀地成形乾燥時或塗佈於基板上及乾燥時,得到優異的膠黏性。又,由於重量平均分子量為400,000以下,導電性組成物具有良好的黏度,可達成更高的印刷性及加工性。又,當重量平均分子量為50,000以上時,於對於來自外部的衝擊之緩和性中,得到優異的效果。The weight average molecular weight of the block copolymer is preferably 20,000 to 400,000, more preferably 50,000 to 300,000. Since the weight average molecular weight is 20,000 or more, the desired effects of toughness and flexibility can be obtained, and excellent adhesiveness can be obtained when the conductive composition is formed into a thin film and dried, or when it is coated on a substrate and dried. Moreover, since the weight average molecular weight is 400,000 or less, the conductive composition has good viscosity, and can achieve higher printability and processability. In addition, when the weight average molecular weight is 50,000 or more, an excellent effect is obtained in the alleviation of impact from the outside.

嵌段共聚物之依照國際標準化機構的國際規格ISO 37之測定方法測定的拉伸斷裂伸長率較佳為100~600%。若拉伸斷裂伸長率為100~600%,則導電體的伸縮性及電阻的安定性更優異。更佳為300~600%。   拉伸斷裂伸長率(%)=(斷裂點伸長(mm)-初期尺寸mm)/(初期尺寸mm)×100The tensile elongation at break of the block copolymer is preferably 100 to 600% as measured by the measurement method of the international standard ISO 37 of the International Organization for Standardization. When the tensile elongation at break is 100 to 600%, the stretchability of the conductor and the stability of electrical resistance are more excellent. More preferably, it is 300 to 600%. Tensile elongation at break (%) = (elongation at break point (mm) - initial size mm) / (initial size mm) × 100

於上述彈性體中的橡膠或含官能基的彈性體中,通常使用硫黃系硫化劑或非硫黃系硫化劑等。於如本發明之包含銀粉與彈性體之導電性組成物中,有因彈性體中之硫化劑中所包含的硫黃而配線中的銀粉氧化或硫化而腐蝕之虞,基於如此的觀點,於本發明中較佳為不含硫黃系硫化劑。Among the rubbers or functional group-containing elastomers, sulfur-based vulcanizing agents or non-sulfur-based vulcanizing agents are generally used. In the conductive composition comprising the silver powder and the elastomer according to the present invention, there is a risk that the silver powder in the wiring is oxidized or vulcanized due to sulfur contained in the vulcanizing agent in the elastomer and corroded. In the present invention, it is preferable not to contain a sulfur-based vulcanizing agent.

本發明之導電性組成物係在不對於導電性造成不良影響之範圍內(不損害本發明特有的效果之範圍內),亦可摻合若干量的硫黃化合物。The conductive composition of the present invention may contain a certain amount of sulfur compounds within a range not adversely affecting the conductivity (in a range not impairing the specific effects of the present invention).

又,於彈性體中,可包含軟化劑、可塑劑等眾所周知之添加劑。作為軟化劑,可舉出礦物油系軟化劑與植物油系軟化劑,例如作為礦物油系軟化劑,有石蠟系加工油、環烷系加工油、芳香族系加工油等的各種油。作為植物油系軟化劑,可舉出蓖麻油、棉實油、亞麻仁油、菜籽油、大豆油、棕櫚油、椰子油、落花生油、松油、妥爾油等,此等軟化劑係可單獨或併用二種以上。可藉由軟化劑之添加量,調整所欲的橡膠彈性或伸張性。Moreover, well-known additives, such as a softener and a plasticizer, may be contained in an elastomer. Examples of the softener include mineral oil-based softeners and vegetable oil-based softeners, and examples of mineral oil-based softeners include various oils such as paraffin-based processing oils, naphthenic-based processing oils, and aromatic-based processing oils. Examples of vegetable oil-based softeners include castor oil, cottonseed oil, linseed oil, rapeseed oil, soybean oil, palm oil, coconut oil, groundnut oil, pine oil, tall oil, and the like. Use alone or in combination of two or more. The desired rubber elasticity or extensibility can be adjusted by the amount of softener added.

如以上說明的彈性體,以導電性組成物中所包含的全部固形份量為基準,較佳為各自以5~40質量%之比例摻合,更佳為14~28質量%。特別地,含有如上述的嵌段共聚物時,相對於包含括其他彈性體的全部彈性體,此等嵌段共聚物之摻合量較佳為85~100質量%。若摻合量在上述範圍內,則所形成的塗膜之伸縮性變更良好。   再者,於不損害本發明的效果之範圍內,本發明之導電性組成物亦可併用彈性體以外的熱塑性樹脂等其他的有機黏結劑。The elastomers described above are preferably blended in a ratio of 5 to 40% by mass, more preferably 14 to 28% by mass, based on the total solid content contained in the conductive composition. In particular, when the above-mentioned block copolymers are contained, the blending amount of these block copolymers is preferably 85 to 100% by mass relative to the entire elastomer including other elastomers. When the blending amount is within the above range, the stretchability of the formed coating film will be improved. Furthermore, within the range that does not impair the effects of the present invention, other organic binders such as thermoplastic resins other than elastomers may be used in combination with the conductive composition of the present invention.

本發明之導電性組成物係為了組成物之調整,或為了塗布於基板上的黏度調整,可使用有機溶劑。The conductive composition of the present invention can use an organic solvent for adjustment of the composition or adjustment of the viscosity of the coating on a substrate.

作為如此的有機溶劑,可舉出酮類、芳香族烴類、二醇醚類、二醇醚乙酸酯類、酯類、醇類、脂肪族烴、石油系溶劑等。更具體而言,為甲基乙基酮、環己酮等之酮類;甲苯、二甲苯、四甲基苯等之芳香族烴類;溶纖劑、甲基溶纖劑、丁基溶纖劑、卡必醇、甲基卡必醇、丁基卡必醇、丙二醇單甲基醚、二丙二醇單甲基醚、二丙二醇二乙基醚、三乙二醇單乙基醚等之二醇醚類;醋酸乙酯、醋酸丁酯、二乙二醇單乙基醚乙酸酯、二丙二醇甲基醚乙酸酯、丙二醇甲基醚乙酸酯、丙二醇乙基醚乙酸酯、丙二醇丁基醚乙酸酯等之酯類;乙醇、丙醇、乙二醇、丙二醇等之醇類;辛烷、癸烷等之脂肪族烴;石油醚、石油腦、氫化石油腦、溶劑油等之石油系溶劑等。如此的有機溶劑係可單獨或作為2種以上的混合物使用。其中,從塗佈性之觀點來看,較佳為二乙二醇單乙基醚乙酸酯。Examples of such organic solvents include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, and petroleum-based solvents. More specifically, ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; cellosolve, methyl cellosolve, butyl cellosolve, Glycol ethers such as carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, triethylene glycol monoethyl ether, etc. ; Ethyl acetate, butyl acetate, diethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol butyl ether Esters such as acetate; alcohols such as ethanol, propanol, ethylene glycol, propylene glycol, etc.; aliphatic hydrocarbons such as octane and decane; petroleum systems such as petroleum ether, naphtha, hydrogenated naphtha, mineral spirits, etc. solvent, etc. Such an organic solvent system can be used individually or as a mixture of 2 or more types. Among them, from the viewpoint of coatability, diethylene glycol monoethyl ether acetate is preferred.

本發明之導電性組成物可進一步包含熱硬化成分。熱硬化成分之例為藉由硬化反應而分子量增加、交聯形成,能形成薄膜之聚酯樹脂(胺基甲酸酯改質體、環氧改質體、丙烯酸改質體等)、環氧樹脂、胺基甲酸酯樹脂、酚樹脂、三聚氰胺樹脂、乙烯系樹脂及聚矽氧樹脂。The conductive composition of the present invention may further contain a thermosetting component. Examples of thermosetting components include polyester resins (urethane-modified, epoxy-modified, acrylic-modified, etc.), epoxy Resins, urethane resins, phenolic resins, melamine resins, vinyl resins and silicone resins.

於不損害本發明的效果之範圍內,本發明之導電性組成物可包含其他的成分。例如可包含偶合劑、光聚合引發劑等之添加劑。The conductive composition of the present invention may contain other components within a range that does not impair the effects of the present invention. For example, additives such as a coupling agent and a photopolymerization initiator may be contained.

本發明之導電性組成物例如係可藉由將溶解在溶劑中的彈性體與上述銀粉予以混煉而製造。作為混煉方法,例如可舉出使用輥磨機等的攪拌混合裝置之方法。具體而言,調製在有機溶劑中溶解有彈性體的固形份50質量%之樹脂溶液,於此樹脂溶液中摻合銀粉,以攪拌機預備攪拌混合後,以三輥磨機混煉,可得到導電性組成物。取決於所使用的彈性體之種類或有機溶劑之摻合比例,可成為液狀的導電性組成物或成為糊狀(半固形狀)的導電性組成物。The conductive composition of the present invention can be produced, for example, by kneading an elastomer dissolved in a solvent and the above-mentioned silver powder. As a kneading method, the method of using a stirring mixing apparatus, such as a roll mill, is mentioned, for example. Specifically, a resin solution having a solid content of 50% by mass of an elastomer dissolved in an organic solvent is prepared, silver powder is mixed with the resin solution, and after preliminarily stirring and mixing with a mixer, it is kneaded with a three-roll mill to obtain a conductive sexual composition. Depending on the type of the elastomer to be used and the blending ratio of the organic solvent, a liquid conductive composition or a paste (semi-solid) conductive composition can be obtained.

於本發明中,如上述的導電性組成物例如係可藉由在基材上進行圖案塗佈,進行熱處理,而形成導電體。作為此熱處理,可舉出乾燥處理或熱硬化處理等。In the present invention, the conductive composition as described above can be formed as a conductor by, for example, pattern coating on a base material and heat treatment. As this heat treatment, drying treatment, thermosetting treatment, etc. are mentioned.

如此地,藉由本發明之導電性組成物,可得到伸縮性及電阻的安定性優異之導電體。又,藉由使用如上述之銀粉,塗佈適應性亦升高。In this way, the conductive composition of the present invention can provide a conductor excellent in stretchability and resistance stability. Moreover, by using the above-mentioned silver powder, coating suitability also improves.

<導電體的層及其用途>   上述的導電性組成物係可固化而成為導電體。例如,形成由導電性組成物所構成之塗佈膜,藉由使其乾燥、固化,可成為導電體的層。導電性組成物之固化係可藉由將導電性組成物予以乾燥或熱處理而進行。熱處理之例為熱風乾燥或熱硬化。於熱處理之前,亦可進行成形。例如,導電體的層係可藉由在基材上塗佈上述的導電性組成物而成為所欲的形狀後,使其固化而得到導電體的層。導電體的層係可為符合所使用的用途之各種形狀。例如,可適用於導體電路及配線等。<Conductor layer and its use> The above-mentioned conductive composition can be cured to become a conductor. For example, a coating film composed of a conductive composition can be formed, dried and cured to form a conductive layer. Curing of the conductive composition can be performed by drying or heat-treating the conductive composition. An example of the heat treatment is hot air drying or thermal hardening. Forming may also be performed before heat treatment. For example, the layer of the conductor can be obtained by applying the above-described conductive composition on the base material to obtain a desired shape, and then curing the conductor to obtain the layer of the conductor. The layers of electrical conductors can be of various shapes in accordance with the application being used. For example, it can be applied to conductor circuits, wirings, and the like.

於製造導體電路時,包含將上述的導電性組成物印刷或塗佈於基材上而形成塗膜圖案之圖案形成步驟,及使經圖案化的塗膜固化之步驟。於塗膜圖案之形成中,可使用遮蔽法或採用阻劑的方法等。When manufacturing a conductor circuit, a pattern forming step of printing or coating the above-mentioned conductive composition on a substrate to form a coating film pattern, and a step of curing the patterned coating film are included. In the formation of the coating film pattern, a masking method, a method using a resist, or the like can be used.

作為圖案形成步驟,可舉出印刷方法及分配方法。作為印刷方法,例如可舉出凹版印刷、平版印刷、網版印刷等,當形成微細的電路時,較佳為網版印刷。又,作為大面積的塗佈方法,凹版印刷及平版印刷係適合。所謂的分配方法,就是控制導電性組成物之塗佈量,從針擠出而形成圖案之方法,適用於接地配線等部分的圖案形成或對於有凹凸的部分之圖案形成。As a pattern formation process, a printing method and a distribution method are mentioned. As a printing method, for example, gravure printing, offset printing, screen printing, etc. are mentioned, When a fine circuit is formed, screen printing is preferable. In addition, as a coating method for a large area, gravure printing and lithographic printing are suitable. The so-called dispensing method is a method of controlling the coating amount of the conductive composition and extruding it from a needle to form a pattern.

作為塗佈導電性組成物之基材,只要是電絕緣性者,則可無特別限制地使用,可舉出使用紙-酚樹脂、紙-環氧樹脂、玻璃布-環氧樹脂、玻璃-聚醯亞胺、玻璃布/不織布-環氧樹脂、玻璃布/紙-環氧樹脂、合成纖維-環氧樹脂、氟樹脂・聚乙烯・聚伸苯基醚、聚苯醚・氰酸酯等之複合材的全部等級(FR-4等)之覆銅積層板、由聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等之聚酯、聚醯亞胺、聚苯硫、聚醯胺等之塑膠所構成的薄片或薄膜、由胺基甲酸酯、矽橡膠、丙烯酸橡膠、丁二烯橡膠等之交聯橡膠所構成的薄片或薄膜、由聚酯系、聚胺基甲酸酯系、聚烯烴系、苯乙烯系嵌段共聚物系等之熱塑性彈性體所構成的薄片或薄膜等。於此等之中,藉由使用不僅具有彎曲性的材料而且具有伸縮性的材料(例如橡膠或熱塑性彈性體)作為基材,可將導電體應用於如後述之用途。作為具有伸縮性的材料,可使用與上述彈性體成分同樣者。As the base material to which the conductive composition is applied, it can be used without any particular limitation as long as it is electrically insulating, and examples include the use of paper-phenol resin, paper-epoxy resin, glass cloth-epoxy resin, glass- Polyimide, glass cloth/non-woven fabric-epoxy resin, glass cloth/paper-epoxy resin, synthetic fiber-epoxy resin, fluororesin・polyethylene・polyphenylene ether, polyphenylene ether・cyanate ester, etc. All grades of composite materials (FR-4, etc.) copper clad laminates, polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc. Sheets or films composed of plastics such as ester, polyimide, polyphenylene sulfide, polyamide, etc., and sheets composed of cross-linked rubber such as urethane, silicone rubber, acrylic rubber, butadiene rubber, etc. Or films, sheets or films made of thermoplastic elastomers such as polyester-based, polyurethane-based, polyolefin-based, and styrene-based block copolymers. Among them, by using not only a material having flexibility but also a material having stretchability (for example, rubber or thermoplastic elastomer) as a base material, the conductor can be applied to the application described later. As the material having stretchability, the same thing as the above-mentioned elastomer component can be used.

本發明之導電體的層,由於如上述地即使伸縮的重複或伸長時,也電阻的安定性優異,故除了導體電路及配線以外,還可適用於體外裝置、體表裝置、電子皮膚裝置、體內裝置等穿戴式裝置用的導電體之形成。又,亦可將導電體的層應用於可撓性印刷基板之電極。再者,本發明之導電性組成物亦適用於形成致動器電極等之導電體的層。又,亦適合於以往伸縮性或電阻的安定性不足而難以實現的設計之導電體的形成。例如,可舉出如以下者。The conductor layer of the present invention is excellent in resistance stability even when the expansion and contraction are repeated or stretched as described above, so it can be applied to external devices, body surface devices, electronic skin devices, other than conductor circuits and wirings. Formation of conductors for wearable devices such as in-vivo devices. Moreover, the layer of a conductor can also be used for the electrode of a flexible printed circuit board. Furthermore, the conductive composition of the present invention is also suitable for forming layers of conductors such as actuator electrodes. Moreover, it is also suitable for the formation of the conductor of the design which conventionally lacked the stability of elasticity and resistance, and was difficult to implement. For example, the following are mentioned.

<穿戴式生物體感測器>   為了取得/傳達從包括人類的動植物所發生的活動電位/生物體資訊,作為穿著於身體的穿戴式生物體感測器用配線材料,可採用本發明之導電體。感測器之安裝地方必須為密著或接近包括人類的動植物之表層組織的場所,但表層組織係發生伸縮。以往的硬質基板或可撓性基板係對於伸縮的安裝地方,沒有追隨性,感測器的安裝地方亦受限定,結果所得之生物體資訊亦受限。藉由本發明之導電體,由於即使對於包括人類的動植物之表層組織,感測器用配線材料也可適用,可成為即使在發生伸縮的地方也能安裝之穿戴式生物體感測器。<Wearable biosensor> The conductor of the present invention can be used as a wiring material for wearable biosensors worn on the body in order to acquire/transmit active potential/biological information generated from animals and plants including humans . The installation place of the sensor must be close to or close to the surface tissue of animals and plants including humans, but the surface tissue is stretched. Conventional rigid substrates or flexible substrates have no followability to the expansion and contraction installation places, and the installation places of the sensors are also limited, resulting in limited biological information obtained. According to the conductor of the present invention, since the wiring material for sensors can be applied even to the surface tissues of animals and plants including humans, it can be used as a wearable biosensor that can be installed even in places where expansion and contraction occur.

穿戴式生物體感測器中所使用的配線,由於可藉由網版印刷或分配法形成配線,故訊號配線之微細化亦成為可能,茲認為有助於感測器裝置之小型化。Since the wiring used in the wearable biosensor can be formed by screen printing or distribution, it is possible to miniaturize the signal wiring, which is considered to contribute to the miniaturization of the sensor device.

<智慧紡織品用配線材料>   近年來,正在看到使用布帛坯布作為感測器使用之所謂的「智慧紡織品」之領域擴大。使用本發明之導電體,在具有伸縮性且能熱壓接等的基材上進行配線形成之配線板或感測器,由於伸縮時之電阻的安定性優異,藉由貼附於具有伸縮性的布帛坯布之表面,而具有電子產品・裝置的機能之布帛坯布,即智慧紡織品之開發係成為可能。作為智慧紡織品,可將感壓感測器或觸控感測器、天線配線等之機能賦予至布帛坯布。<Wiring material for smart textiles> In recent years, the field of so-called "smart textiles" using grey fabrics as sensors has been expanding. Using the conductor of the present invention, a wiring board or a sensor formed by wiring on a substrate that has flexibility and can be thermocompressed, etc., is excellent in resistance stability during expansion and contraction. It is possible to develop a fabric with the functions of electronic products and devices, that is, the development of smart textiles. As a smart textile, functions such as pressure sensors, touch sensors, and antenna wiring can be imparted to the fabric.

<3D造形成形品用配線>   於以往的藉由FIM(薄膜-插入-模塑成型)工法之針對電子機器之殼體等的塑膠成型品中,採用將聚碳酸酯等的塑膠薄膜當作基底基材,於設計印刷之後,採用熱壓加工者。由在伸縮性的基材上設有本發明之導電體的積層構造體所構成之導體配線,由於在伸長時無斷線,具有抑制電阻值變化之特性,故在塑膠成型品的設計印刷時,形成導體配線,藉由進行其後的熱壓(發生部分地伸長)之成型加工,可實現內藏有3D形狀的配線之電子產品・裝置。<Wiring for 3D Molded Products> In the conventional plastic molding products for electronic equipment housings, etc. by the FIM (Film-Insert-Molding) method, a plastic film such as polycarbonate is used as the base. The substrate, after the design and printing, is processed by hot pressing. The conductor wiring composed of the laminated structure in which the conductor of the present invention is provided on a stretchable base material has the property of suppressing the change in resistance value without disconnection during extension, so it can be used in the design and printing of plastic molded products. , to form conductor wiring, and to perform subsequent hot pressing (partial elongation) molding process, it is possible to realize electronic products and devices with built-in 3D-shaped wiring.

又,藉由使用如上述之彈性體等的伸縮性基材進行熱壓加工,可實現在柔軟的殼體內具備柔軟的配線之能伸縮變形的電子產品・裝置。可適合利用作為感壓感測器或觸控感測器、或天線配線用等。In addition, by using a stretchable base material such as the above-mentioned elastic body to perform hot pressing, it is possible to realize electronic products and devices that can be stretched and deformed with flexible wiring in a flexible casing. Suitable for use as a pressure sensor, a touch sensor, or an antenna wiring.

<能伸縮變形的配線薄片或配線基板>   由在伸縮性的基材上設有本發明之導電體的層的積層構造體所構成之導體配線,係可利用作為能伸縮變形的配線板薄片。例如,如此的導體配線係對於成型加工品等之具有立體形狀的對象物之表面,沒有發生配線的斷線,可一邊使其伸張或變形,一邊貼附於對象物。因此,在伸縮性的基材上設本發明之導電體的層之積層構造體,係可適合利用作為感壓感測器或觸控感測器、或天線配線用。<Stretchable and Deformable Wiring Sheet or Wiring Board> A conductor wiring comprising a laminated structure in which a layer of the conductor of the present invention is provided on a stretchable base material can be used as a stretchable and deformable wiring board sheet. For example, such a conductor wiring can be attached to the object while being stretched or deformed on the surface of an object having a three-dimensional shape such as a molded product without breaking the wiring. Therefore, a laminated structure in which a layer of the conductor of the present invention is provided on a stretchable base material can be suitably used as a pressure sensor, a touch sensor, or an antenna wiring.

<可撓性配線薄片或配線基板>   於以往之使用導電性糊的可撓性配線薄片或配線基板中,於進行折爪之極度折彎時,發生配線發生斷線的事件。此點係在使用本發明的導電體時,由於為具有伸長特性的導電材料,在迄今為止的導電糊所無法對應承擔的範圍之折彎性,亦可對應,可實現即使折爪時也沒有發生配線的斷線之可撓性配線薄片或配線基板。<Flexible Wiring Sheet or Wiring Board> In the conventional flexible wiring sheet or wiring board using conductive paste, when extreme bending of the claws is performed, the wiring may be disconnected. This point is that when the conductor of the present invention is used, since it is a conductive material with elongation properties, it can cope with the bending properties in the range that the conventional conductive paste cannot handle, and it can be realized that there is no occurrence even when the claws are folded. Flexible wiring sheet or wiring board for wire breakage.

[實施例][Example]

以下,舉出實施例,更詳細地說明本發明,惟本發明不受此等實施例所限定。Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

<銀粉之準備>   作為調製導電性組成物用的銀粉,準備以下的3種銀粉。   銀粉A:平均一次粒徑0.3μm,表觀空隙率為92%之銀粉,經次亞麻油酸施予表面處理者。   銀粉B:平均一次粒徑0.5μm,表觀空隙率為63%之銀粉,經次亞麻油酸施予表面處理者。   銀粉C:平均一次粒徑1.3μm,表觀空隙率為44%之銀粉,經次亞麻油酸施予表面處理者。<Preparation of silver powder> As the silver powder for preparing the conductive composition, the following three types of silver powder were prepared. Silver powder A: silver powder with an average primary particle size of 0.3 μm and an apparent porosity of 92%, which has been surface-treated with secondary linoleic acid. Silver powder B: silver powder with an average primary particle size of 0.5 μm and an apparent void ratio of 63%, which has been surface-treated with secondary linoleic acid. Silver powder C: silver powder with an average primary particle size of 1.3 μm and an apparent porosity of 44%, which has been surface-treated with secondary linoleic acid.

再者,銀粉之平均一次粒徑係使用掃描型電子顯微鏡(日本電子股份有限公司製,JSM-6360L),以10,000倍觀察銀粉,測定經隨機抽出之10個銀粉粒子的粒徑,當作其平均值。   又,各銀粉的表觀空隙率P係如以下地算出。即,將銀粉填充於圓筒狀的容器中,使容器數次振動,補充銀粉直到銀粉的上面成為一定的高度為止,將填充於容器的銀粉之量當作M(g),使用具有符合容器內徑的外徑之圓柱,在銀粉之上面施加1kg重的荷重,將放置1小時後的銀粉體積(圓筒狀容器的底面積與從容器底部到銀粉的上面為止的高度之積)當作V(cm3 ),算出以ρ=M/V定義的表觀密度ρ(g/cm3 ),使用銀的真密度ρ0 (10.49g/cm3 ),算出下述式:   P=(1-ρ/ρ0 )×100   所示的銀粉之表觀空隙率P(%)。Furthermore, the average primary particle size of the silver powder was measured using a scanning electron microscope (manufactured by Nippon Electronics Co., Ltd., JSM-6360L), and the silver powder was observed at 10,000 times. average value. In addition, the apparent porosity P of each silver powder was calculated as follows. That is, a cylindrical container is filled with silver powder, the container is vibrated several times, and the silver powder is replenished until the upper surface of the silver powder becomes a certain height. A cylinder with an inner diameter and an outer diameter is applied with a load of 1 kg on the silver powder, and the volume of the silver powder after being left for 1 hour (the product of the bottom area of the cylindrical container and the height from the bottom of the container to the top of the silver powder) is regarded as V(cm 3 ), the apparent density ρ (g/cm 3 ) defined by ρ=M/V is calculated, and the following formula is calculated using the true density ρ 0 (10.49 g/cm 3 ) of silver: P=(1 The apparent porosity P (%) of the silver powder represented by -ρ/ρ 0 )×100.

<導電性組成物之調製>   作為調製導電性組成物用的彈性體,準備以下的2種。   ・彈性體A(KURARAY股份有限公司製,LA2330)   ・彈性體B(KURARAY股份有限公司製,LA2250)   ・聚酯C(東洋紡股份有限公司製,Vylon 290)   關於上述之彈性體A及B,使彈性體溶解於二乙二醇單乙基醚乙酸酯中,以成為固形份50質量%之方式,調製樹脂溶液。又,關於聚酯C,使其溶解於二乙二醇單乙基醚乙酸酯中,以成為固形份30質量%之方式,調製樹脂溶液。<Preparation of the conductive composition> As the elastomer for preparing the conductive composition, the following two types were prepared.・Elastomer A (manufactured by KURARAY Co., Ltd., LA2330) ・Elastomer B (manufactured by KURARAY Co., Ltd., LA2250) ・Polyester C (manufactured by Toyobo Co., Ltd., Vylon 290) The elastomer was dissolved in diethylene glycol monoethyl ether acetate, and a resin solution was prepared so that the solid content would be 50% by mass. Moreover, about polyester C, it melt|dissolved in diethylene glycol monoethyl ether acetate, and it prepared a resin solution so that it might become 30 mass % of solid content.

依照下述表1中所示的組成,摻合上述的銀粉與彈性體或聚酯之樹脂溶液,以攪拌機預備攪拌混合後,使用三輥磨機(EXAKT公司製,EXAKT50),改變三輥磨機的混煉次數、旋轉速度、輥間隔等之條件而進行混煉,得到實施形態之導電性組成物。還有,表1中,彈性體或聚酯與銀粉之摻合量的數值表示質量份。According to the composition shown in the following Table 1, the above-mentioned silver powder and the resin solution of elastomer or polyester were mixed, and after preliminary stirring and mixing with a mixer, a three-roll mill (manufactured by EXAKT Corporation, EXAKT50) was used to change the three-roll mill. The kneading was carried out under the conditions of the number of times of kneading of the machine, the rotational speed, the interval between the rolls, and the like, and the conductive composition of the embodiment was obtained. In addition, in Table 1, the numerical value of the compounding quantity of elastomer or polyester and silver powder shows mass parts.

測定所得之導電性組成物中所包含的銀粉之二次粒子D95粒徑。D95粒徑係如以下地進行。首先,以3000質量%的丙二醇單甲基醚乙酸酯稀釋導電性組成物,調製溶液。對於該溶液,使用雷射繞射散射式粒度分布測定裝置(MicrotracBEL公司製,TM3000),將粒子的折射率當作1.33,將溶劑的折射率當作1.40,於0.020μm~1000.00μm之測定範圍中,進行粒度分布之測定,從該粒度分布求出累積95%的粒徑,當作D95粒徑。The secondary particle D95 particle size of the silver powder contained in the obtained conductive composition was measured. D95 particle size is performed as follows. First, the conductive composition was diluted with 3000 mass % of propylene glycol monomethyl ether acetate to prepare a solution. This solution was measured in the range of 0.020 μm to 1000.00 μm using a laser diffraction scattering particle size distribution analyzer (TM3000, manufactured by MicrotracBEL Corporation), with the refractive index of the particles being 1.33 and the refractive index of the solvent being 1.40 Among them, the particle size distribution was measured, and the cumulative 95% particle size was obtained from the particle size distribution, which was regarded as the D95 particle size.

<導電性組成物之評價> (1)比電阻之測定   以網版印刷,將各導電性組成物塗佈於基材,在80℃熱處理30分鐘而得到導電體。作為基材,使用PET薄膜。以4端子法測定所得之導電體的兩端之電阻值,更測定線寬、線長及厚度,求出比電阻(體積電阻率)。表1中顯示結果。<Evaluation of the conductive composition> (1) Measurement of specific resistance Each conductive composition was applied to a substrate by screen printing, and heat-treated at 80°C for 30 minutes to obtain a conductor. As the base material, a PET film was used. The resistance value at both ends of the obtained conductor was measured by the 4-terminal method, and the line width, line length, and thickness were further measured, and the specific resistance (volume resistivity) was obtained. The results are shown in Table 1.

(2)20%伸縮試驗的最大電阻值之測定   以網版印刷,將各導電性組成物塗佈於基材,在80℃熱處理30分鐘,而在基材上形成線寬1mm、厚度20μm、長度40mm之導電體。作為基材,使用胺基甲酸酯薄膜(武田產業股份有限公司製,TG88-I,厚度70μm)。一邊從2.5%的伸縮狀態(無撓曲的狀態)到20%的伸縮,費250秒100往復重複,一邊測定導電體之電阻值。表1中顯示期間最大的電阻值。(2) Determination of the maximum resistance value of the 20% expansion and contraction test Using screen printing, each conductive composition was coated on the substrate, and heat-treated at 80°C for 30 minutes to form a line width of 1 mm, a thickness of 20 μm, Conductor with a length of 40mm. As a base material, a urethane film (Takeda Sangyo Co., Ltd. make, TG88-I, thickness 70 micrometers) was used. The resistance value of the conductor was measured while repeating 100 reciprocations for 250 seconds from a state of expansion and contraction of 2.5% (state without deflection) to expansion and contraction of 20%. The maximum resistance values during the period are shown in Table 1.

(3)50%伸縮試驗的有無斷線   以網版印刷,將各導電性組成物塗佈於基材,在80℃熱處理30分鐘,而在基材上形成線寬1mm、厚度20μm、長度40mm之導電體。作為基材,使用胺基甲酸酯薄膜(武田產業股份有限公司製,TG88-I,厚度70μm)。從0%的非伸縮狀態到50%的伸縮,費700秒100往復重複,評價有無斷線。表1中顯示測定結果。(3) The presence or absence of wire breakage in the 50% expansion and contraction test was screen-printed, each conductive composition was coated on a substrate, and heat-treated at 80°C for 30 minutes to form a line width of 1 mm, a thickness of 20 μm, and a length of 40 mm on the substrate. the conductor. As a base material, a urethane film (Takeda Sangyo Co., Ltd. make, TG88-I, thickness 70 micrometers) was used. From the non-stretching state of 0% to the expansion and contraction of 50%, it takes 700 seconds and 100 reciprocating repetitions to evaluate whether there is a disconnection. The measurement results are shown in Table 1.

(4)400%伸張時的電阻值   以網版印刷,將各導電性組成物塗佈於基材,在80℃熱處理30分鐘,而在基材上形成線寬1mm、厚度20μm、長度40mm之導電體。作為基材,使用胺基甲酸酯薄膜(武田產業股份有限公司製,TG88-I,厚度70μm)。以5mm/秒之速度伸張25%後,保持15秒,評價有無斷線。重複此操作,進行直到導電體伸長400%為止。表1中顯示評價結果。(4) The resistance value at 400% elongation was screen-printed, each conductive composition was coated on the substrate, and heat-treated at 80°C for 30 minutes to form a line width of 1 mm, thickness of 20 μm, and length of 40 mm on the substrate. conductor. As a base material, a urethane film (Takeda Sangyo Co., Ltd. make, TG88-I, thickness 70 micrometers) was used. After stretching 25% at a speed of 5 mm/sec, it was held for 15 seconds, and the presence or absence of thread breakage was evaluated. This operation is repeated until the conductor is elongated by 400%. The evaluation results are shown in Table 1.

Figure 02_image001
Figure 02_image001

如由表1中所示的結果可明知,使用平均一次粒徑為1.0μm以下且表觀空隙率為50~95%的銀粉與彈性體,以D95粒徑成為3.0~25μm之方式攪拌或混煉的導電性組成物(實施例1~4),可得到即使伸縮的重複或伸長時,也電阻的安定性優異,無斷線之導電體。As is clear from the results shown in Table 1, using silver powder and an elastomer having an average primary particle size of 1.0 μm or less and an apparent void ratio of 50 to 95%, stirring or mixing so that the D95 particle size becomes 3.0 to 25 μm The smelted conductive compositions (Examples 1 to 4) were able to obtain conductors with excellent electrical resistance stability and no disconnection even when the expansion and contraction were repeated or stretched.

另一方面,即使使用平均一次粒徑為1.0μm以下且表觀空隙率為50~95%的銀粉與彈性體時,也D95粒徑不在3.0~25μm之範圍的導電性組成物(比較例2),雖然初期的導電性良好,但是可知在伸縮的重複或伸長時,導電性急劇地降低。又,使用平均一次粒徑不在1.0μm以下,表觀空隙率不在50~95%之範圍的銀粉時(比較例1及比較例3),可知初期的導電性亦不充分,於伸縮的重複或伸長時,導電性急劇地降低。On the other hand, even when silver powder and an elastomer having an average primary particle size of 1.0 μm or less and an apparent porosity of 50 to 95% were used, the D95 particle size of the conductive composition was not in the range of 3.0 to 25 μm (Comparative Example 2 ), although the initial electrical conductivity was good, it was found that the electrical conductivity dropped sharply when the expansion and contraction were repeated or stretched. In addition, when using silver powder with an average primary particle size of not less than 1.0 μm and an apparent porosity of not in the range of 50 to 95% (Comparative Examples 1 and 3), it was found that the electrical conductivity at the initial stage was also insufficient, and the repetition of expansion and contraction or Upon elongation, the conductivity decreases sharply.

Claims (5)

一種導電性組成物,係包含彈性體與銀粉之導電性組成物,其特徵為前述銀粉係經表面處理過者,前述銀粉的一次粒子之形狀係略球狀者,前述銀粉係其平均一次粒徑為1.0μm以下且表觀空隙率為50~95%,導電性組成物中,前述銀粉的二次粒子之粒度分布中累積95%粒徑(D95粒徑)為3.0~25.0μm。 A conductive composition, which is a conductive composition comprising elastomer and silver powder, characterized in that the aforementioned silver powder is surface-treated, the shape of the primary particles of the aforementioned silver powder is slightly spherical, and the aforementioned silver powder is the average primary particle of the aforementioned silver powder. The diameter is 1.0 μm or less and the apparent porosity is 50 to 95%. In the conductive composition, the cumulative 95% particle size (D95 particle size) of the secondary particles of the silver powder in the particle size distribution is 3.0 to 25.0 μm. 如請求項1之導電性組成物,其中相對於導電性組成物全體,前述銀粉以固形份量計含有60~95質量%。 The conductive composition according to claim 1, wherein the silver powder is contained in an amount of 60 to 95 mass % in terms of solid content with respect to the entire conductive composition. 一種導電體,其特徵係使如請求項1或2之導電性組成物固化而成者。 A conductor characterized by curing the conductive composition according to claim 1 or 2. 一種積層構造體,其特徵係於基材上設有如請求項3之導電體的層而成者。 A laminated structure characterized by providing a layer of the conductor as claimed in claim 3 on a base material. 一種電子零件,其特徵係具備如請求項3之導電體的層或如請求項4之積層構造體而成者。 An electronic component comprising a layer of a conductor as claimed in claim 3 or a laminated structure as claimed in claim 4.
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KR102803088B1 (en) * 2019-02-28 2025-05-07 세키스이가가쿠 고교가부시키가이샤 Challenging particles, challenging materials and interconnect structures
JP7205896B2 (en) * 2019-05-22 2023-01-17 株式会社 ベアック Sticking device and sticking method
JP2021095440A (en) * 2019-12-13 2021-06-24 東洋インキScホールディングス株式会社 Resin composition, elastic conductor, electronic device and adhesive film
JP7592389B2 (en) * 2020-01-08 2024-12-02 太陽ホールディングス株式会社 Conductive composition and solid material thereof, and transducer
JP2021163962A (en) * 2020-03-31 2021-10-11 太陽インキ製造株式会社 Conductive paste, cloth to which electrical conduction coating film is transferred, and pattern wiring formation method
JP7659375B2 (en) * 2020-09-14 2025-04-09 太陽ホールディングス株式会社 Conductive composition, and conductor, laminate structure, and electronic component using the same
JP7659376B2 (en) * 2020-09-14 2025-04-09 太陽ホールディングス株式会社 Conductive composition, and conductor, laminate structure, and electronic component using the same
KR20230075473A (en) * 2020-09-28 2023-05-31 가부시끼가이샤 레조낙 Adhesive film for circuit connection, inorganic filler-containing composition, circuit connection structure, and manufacturing method thereof
JP7511448B2 (en) 2020-11-13 2024-07-05 信越化学工業株式会社 Polyurethane, method for producing polyurethane, conductive paste composition, conductive wiring, and method for producing conductive wiring
JP7150962B1 (en) 2021-10-15 2022-10-11 信越化学工業株式会社 Polyurethane, method for producing polyurethane, conductive paste composition, conductive wiring, and method for producing conductive wiring
WO2023120484A1 (en) * 2021-12-20 2023-06-29 太陽ホールディングス株式会社 Electroconductive composition, conductor using same, laminated structure, and electronic component
WO2025229830A1 (en) * 2024-04-30 2025-11-06 東洋紡エムシー株式会社 Electrically conductive composition for molding

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105378854A (en) * 2013-07-08 2016-03-02 东洋纺株式会社 Conductive Paste

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916633B2 (en) * 1977-02-28 1984-04-17 松下電工株式会社 Folding door with return prevention device
JPS56149006A (en) * 1980-04-21 1981-11-18 Nippon Telegr & Teleph Corp <Ntt> Production of single polarization mode optical fiber
CN103339685B (en) * 2011-01-26 2017-03-15 纳美仕有限公司 Conductive paste and its manufacture method
WO2017026130A1 (en) * 2015-08-07 2017-02-16 太陽インキ製造株式会社 Conductive composition, conductor and base
WO2017026420A1 (en) * 2015-08-07 2017-02-16 太陽インキ製造株式会社 Electroconductive composition, conductor, and flexible printed wiring board
JP6103404B1 (en) * 2016-03-11 2017-03-29 福田金属箔粉工業株式会社 Conductive paste

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105378854A (en) * 2013-07-08 2016-03-02 东洋纺株式会社 Conductive Paste

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