TWI761287B - Magnetic induction structure - Google Patents
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- 230000006698 induction Effects 0.000 title claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000000903 blocking effect Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005674 electromagnetic induction Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
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Abstract
Description
本發明涉及一種感應結構,尤其涉及一種磁感應結構。The present invention relates to an induction structure, in particular to a magnetic induction structure.
現有磁感應結構(例如:平板變壓器)為了符合安全規範所規定的安全距離,因此其印刷電路板線圈(PCB)大多採用盲孔(blind hole)與埋孔(Buried hole)的製程。然而,盲孔與埋孔於製程工藝較為繁瑣,亦即成本高昂,這使得磁感應結構為了符合安全規範卻導致整體成本居高不下。In order to meet the safety distance stipulated by safety regulations, the existing magnetic induction structures (such as flat-panel transformers) mostly use blind holes and buried holes for their printed circuit board coils (PCBs). However, the manufacturing process of blind vias and buried vias is relatively complicated, that is, the cost is high, which makes the overall cost of the magnetic induction structure remain high in order to comply with safety regulations.
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種磁感應結構,能有效地改善現有磁感應結構所可能產生的缺陷。The technical problem to be solved by the present invention is to provide a magnetic induction structure in view of the deficiencies of the prior art, which can effectively improve the possible defects of the existing magnetic induction structure.
本發明實施例公開一種磁感應結構,其包括:一第一線圈組件,包含一第一本體、多個導電件、至少一個導通孔(via hole)、及多個導電圈,多個所述導電圈埋置於所述第一本體內,並且通過至少一個所述導通孔彼此電性耦接,所述第一本體具有一延伸部及一主體部,所述第一本體於所述主體部具有一第一適配孔,多個所述導電件設置於所述延伸部,至少一個所述導通孔設置於所述主體部,並且多個所述導電件與至少一個所述導通孔電性耦接多個所述導電圈;一絕緣單元,包覆局部的所述第一線圈組件,所述絕緣單元包含:一覆蓋部,包覆至少一個所述導通孔及所述第一適配孔,並且所述延伸部裸露於所述覆蓋部的外側,所述覆蓋部的兩側各具有一設置面;及一擋牆部,由所述覆蓋部的一端沿所述第一本體的一厚度方向所延伸形成;以及一第二線圈組件,設置於所述絕緣單元上,所述第二線圈組件包含一第二本體及連接所述第二本體的兩個連接件,所述第二本體跨置於所述覆蓋部上,使兩個所述連接件分別位於兩個所述設置面上,並且所述第二本體具有位置對應所述第一適配孔的一第二適配孔;以及一磁性組件,包含:一柱塊,設置於所述第一適配孔及所述第二適配孔內;及兩個板塊,連接所述柱塊的兩端且覆蓋所述第二線圈組件沿所述厚度方向的兩側面,並且兩個所述板塊於所述覆蓋部遠離所述擋牆部的一端形成一開口,所述開口能使兩個所述連接件裸露於兩個所述板塊的外側;其中,所述磁性組件及所述第二線圈組件被定義為一間隔目標,並且任一個所述導電件及至少一個所述導通孔至所述間隔目標具有一最短距離,並且所述最短距離不小於0.4公釐(mm)。The embodiment of the present invention discloses a magnetic induction structure, which includes: a first coil component, including a first body, a plurality of conductive parts, at least one via hole, and a plurality of conductive coils, a plurality of the conductive coils embedded in the first body and electrically coupled to each other through at least one of the via holes, the first body has an extension part and a main body part, the first body has a main body part a first fitting hole, a plurality of the conductive parts are disposed in the extension part, at least one of the conductive holes is disposed in the main body part, and a plurality of the conductive parts are electrically coupled to the at least one of the conductive holes a plurality of the conducting coils; an insulating unit covering part of the first coil assembly, the insulating unit comprising: a covering part covering at least one of the conducting holes and the first fitting hole, and The extension part is exposed on the outer side of the covering part, and both sides of the covering part have a setting surface; extending and forming; and a second coil assembly disposed on the insulating unit, the second coil assembly comprising a second body and two connecting pieces connecting the second body, the second body straddling On the covering part, the two connecting pieces are respectively located on the two setting surfaces, and the second body has a second fitting hole corresponding to the first fitting hole; and a magnetic The assembly includes: a column block, disposed in the first adapter hole and the second adapter hole; and two plates, connecting the two ends of the column block and covering the second coil assembly along the The two sides in the thickness direction, and the two plates form an opening at one end of the covering part away from the retaining wall part, and the opening can enable the two connectors to be exposed on the outside of the two plates ; wherein, the magnetic component and the second coil component are defined as an interval target, and any one of the conductive members and at least one of the via holes has a shortest distance from the interval target, and the shortest distance Not less than 0.4 millimeters (mm).
綜上所述,本發明實施例所公開的磁感應結構,能通過“所述絕緣單元包覆至少一個所述導通孔及所述第一適配孔,並且所述第二本體跨置於所述絕緣單元的所述覆蓋部上”及“所述第一線圈組件的任一個所述導電件及任一個所述導通孔至所述間隔目標具有一最短距離,並且所述最短距離不小於0.4公釐(mm)”的設計,使所述磁感應結構能以最低製作成本達到安全規範。To sum up, the magnetic induction structure disclosed in the embodiment of the present invention can cover at least one of the through hole and the first fitting hole by the insulating unit, and the second body can straddle the "On the covering part of the insulating unit" and "Any one of the conductive parts and any one of the via holes of the first coil assembly has a shortest distance to the distance target, and the shortest distance is not less than 0.4 cm. The design of millimeter (mm)” enables the magnetic induction structure to meet safety specifications with the lowest manufacturing cost.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。For a further understanding of the features and technical content of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“磁感應結構”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following are specific embodiments to illustrate the implementation of the "magnetic induction structure" disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.
[第一實施例][First Embodiment]
參閱圖1至圖12所示,本實施例提供一種磁感應結構100。如圖1及圖2所示,所述磁感應結構100包含一第一線圈組件1、包覆局部的所述第一線圈組件1的一絕緣單元2、設置於所述絕緣單元2的一第二線圈組件3、及穿經所述第一線圈組件1、所述絕緣單元2與所述第二線圈組件3的一磁性組件4。其中,所述第一線圈組件1及所述第二線圈組件3能分別作為所述磁感應結構100的初級側及次級側,從而使所述磁感應結構100實現調整電壓之目的。Referring to FIG. 1 to FIG. 12 , the present embodiment provides a
如圖5至圖7所示,所述第一線圈組件1包含一第一本體11、設置於所述第一本體11上的多個導電件12與多個導通孔13(via hole)、及埋置於所述第一本體11內的多個導電圈(圖中未示)。As shown in FIG. 5 to FIG. 7 , the
配合圖7所示,所述第一本體11為板狀結構的印刷電路板線圈(即,PCB),並且所述第一本體11具有一長度方向D1、垂直所述長度方向D1的一寬度方向D2、以及垂直所述長度方向D1與所述寬度方向D2的一厚度方向D3。其中,所述長度方向D1與所述寬度方向D2為所述第一本體11的寬側面W11的長邊與寬邊的延伸方向,所述厚度方向D3為所述第一本體11(連接兩個所述寬側面W11)的窄邊緣N11的短邊的延伸方向。As shown in FIG. 7 , the
所述第一本體11埋置有以印刷方式(layout)所形成的多個所述導電圈(圖中未示),並且所述第一本體11具有一主體部111、連接所述主體部111的一延伸部112、以及位於所述主體部111上的一第一適配孔H11。The
進一步地說,所述主體部111於本實施例中大致呈矩形,但本發明不受限於此。所述延伸部112自所述主體部111的一端遠離所述第一適配孔H11的方向所延伸形成,並且所述延伸部112與所述主體部111相互間隔一距離,使所述延伸部112與所述主體部111之間能共同形成一凹槽G,但本發明不受限於此。舉例來說,本發明於其他未繪示的實施例中,所述第一本體11也可以省略上述凹槽G。Further, the
於一優選實施例中,配合圖4及圖7所示,所述延伸部112沿所述寬度方向D2的長度L112大於所述主體部111沿所述寬度方向D2的長度L111,使局部的所述延伸部112能相較於所述主體部111突出,亦即所述主體部111朝所述延伸部112的正投影區域僅能覆蓋所述延伸部112面朝所述主體部111的部分側面。In a preferred embodiment, as shown in FIGS. 4 and 7 , the length L112 of the extending
如圖7所示,多個所述導電件12設置於所述延伸部112上,並且多個所述導電件12電性耦接位於所述第一本體11內的多個所述導電圈(圖中未示)。於本實施例中,多個所述導電件12可以是位於前述突出的延伸部112的金手指,但本發明不受限於此。As shown in FIG. 7 , a plurality of the
於實務上,多個所述導電件12的位置及種類是可以根據設計需求合理地做調整,例如:多個所述導電件12改採用導通孔(via hole)或導針(Pin)、或為金手指的所述導電件12佈滿整個所述延伸部112。In practice, the positions and types of the plurality of the
如圖7所述,至少一個所述導通孔13設置於所述主體部111鄰近所述第一適配孔H11的區域,並且至少一個所述導通孔13電性耦接位於所述第一本體11內的多個所述導電圈(圖中未示)。As shown in FIG. 7 , at least one of the
需說明的是,所述第一線圈組件1能通過多個所述導電圈、多個所述導電件12、以及至少一個所述導通孔13,使所述第一線圈組件1能具備電磁感應的作用。其中,所述第一線圈組件1通過多個所述導電圈、多個所述導電件12、以及至少一個所述導通孔13以實現電磁感應的方式為現有技術且非本發明的技術重點,故於此則不特別詳述。It should be noted that, the
配合圖5及圖8所示,所述絕緣單元2於本實施例中是以射出成形方式包覆局部的所述第一線圈組件1,並且所述絕緣單元2一體形成有一覆蓋部21及連接所述覆蓋部21的一擋牆部22。As shown in FIG. 5 and FIG. 8 , in this embodiment, the
詳細地說,如圖8所示,所述覆蓋部21包覆所述主體部111的外緣,使所述延伸部112裸露於所述覆蓋部21的外側,亦即至少一個所述導通孔13及所述第一適配孔H11是被所述覆蓋部21所包覆。其中,所述覆蓋部21會具有對應所述第一適配孔H11的一穿孔H21、以及分別對應所述主體部111相反兩側的兩個設置面221(即,寬側面)。Specifically, as shown in FIG. 8 , the
所述擋牆部22自所述覆蓋部21(鄰近所述延伸部112)的一端沿所述厚度方向D3(即圖8中的上下方向)所延伸形成,並且所述擋牆部22的所在位置對應所述凹槽G的位置(如圖2所示)。換個方式來看,所述擋牆部22與所述覆蓋部21於本實施例中各是呈矩形的板狀結構,並且所述擋牆部22垂直所述覆蓋部21。The
值得注意的是,如圖8所示,所述擋牆部22的寬側面W22的面積會大於所述延伸部112的窄邊緣N112的面積,亦即所述延伸部112正投影於所述擋牆部22的區域會位於所述擋牆部22的所述寬側面W22上,這使得位於所述延伸部112的多個所述導電件12能通過所述擋牆部22隔開所述主體部111、所述第二線圈組件3、及所述磁性組件4(將於後面進一步地介紹)。It should be noted that, as shown in FIG. 8 , the area of the wide side W22 of the
配合圖5、圖9、及圖10所示,所述第二線圈組件3包含一第二本體31及連接所述第二本體31的兩個連接件32,並且所述第二本體31及兩個所述連接件32於本實施例中為一體連接的單一構件,但本發明不受限於此。所述第二本體31跨置於所述覆蓋部21上,使兩個所述連接件32能分別位於兩個所述設置面221上,以用來電性耦接一電子裝置(圖中未示)。As shown in FIG. 5 , FIG. 9 , and FIG. 10 , the
詳細地說,所述第二本體31於本實施例中為銅片線圈,並且包含有上下交錯配置的N個第一導電部311與N個第二導電部312、以及連接鄰近的所述第一導電部311與所述第二導電部312的一橫跨部313;其中,N為不小於2的正偶數。In detail, the
配合圖9及圖10所示N個所述第一導電部311是上下間隔配置,並且大致呈U字狀而具有一第一中段3111及連接所述第一中段3111的兩個第一側段3112。於本實施例中,兩個所述第一側段3112自所述第一中段3111的兩端所延伸形成,並且兩個所述第一側段3112相互平行且垂直所述第一中段3111,使兩個所述第一側段3112與所述第一中段3111能共同形成一第一開口K311,但本發明不受限於此。舉例來說,本發明於其他未繪示的實施例中,每個所述第一側段3112與所述第一中段3111之間的夾角不等於90度。As shown in FIGS. 9 and 10 , the N first
N個所述第二導電部312各設置於相鄰的兩個所述第一導電部311之間,並且每個所述第二導電部312電性耦接相鄰的兩個所述第一導電部311,亦即N個所述第二導電部312與N個所述第一導電部311是彼此上下交錯配置。Each of the N second
其中,每個所述第二導電部312大致呈U字狀,並具有一第二中段3121及連接所述第二中段3121的兩個第二側段3122。於本實施例中,兩個所述第二側段3122自所述第二中段3121的兩端所延伸形成,並且兩個所述第二側段3122相互平行且垂直所述第二中段3121,使兩個所述第二側段3122與所述第二中段3121能共同形成一第二開口K312,但本發明不受限於此。舉例來說,本發明於其他未繪示的實施例中,每個所述第二側段3122與所述第二中段3121之間的夾角不等於90度。Wherein, each of the second
值得一提的事,所述第二線圈組件3在堆疊情況(如圖9所示)及展開情況(如圖10所示)下,相鄰的所述第一導電部311的所述第一開口K311的方向與所述第二導電部312的所述第二開口K312的方向不同,亦即每個所述第二導電部312的兩個所述第二側段3122是垂直每個所述第一導電部311的兩個所述第一側段3112。It is worth mentioning that in the stacked state (as shown in FIG. 9 ) and the unfolded state (as shown in FIG. 10 ) of the
如圖1及圖5所示,所述橫跨部313於本實施例中位於所述覆蓋部21遠離所述擋牆部22的一側(即,所述覆蓋部21遠離所述延伸部112的窄邊緣N21),並且所述橫跨部313的長度較佳不小於所述覆蓋部21沿所述厚度方向D3的高度,所述橫跨部313的兩端分別電性耦接彼此鄰近的所述第一導電部311的所述第一側段3112及所述第二導電部312的所述第二側段3122。As shown in FIG. 1 and FIG. 5 , in this embodiment, the
需特別說明的是,於本實施例中,N個所述第一導電部311及N個所述第二導電部312是數量平均地設置於所述擋牆部22的兩個所述設置面221上,亦即其中N/2個所述第一導電部311及N/2個所述第二導電部312是位於其中一個所述設置面221上,而另外的N/2個所述第一導電部311及N/2個所述第二導電部312位於另一個所述設置面221上,並且所述橫跨部313是電性耦接相鄰的第N/2個所述第一導電部311的所述第一側段3112及第N/2個所述第二導電部312的所述第二側段3122,但本發明不受限於此。It should be noted that, in this embodiment, the N number of the first
舉例來說,本發明於其他未繪示的實施例中,N個所述第一導電部311及N個所述第二導電部312可以是數量不平均地設置於兩個所述設置面221上,例如:其中N/4個所述第一導電部311及N/4個所述第二導電部312位於其中一個所述設置面221上,而另外的3N/4個所述第一導電部311及3N/4個所述第二導電部312位於另一個所述設置面221上,所述橫跨部313則可以是電性耦接相鄰的第N/4個所述第一導電部311的所述第一側段3112及第3N/4個所述第二導電部312的所述第二側段3122。For example, in other non-illustrated embodiments of the present invention, the N first
再舉另一例子來說,本發明於其他未繪示的實施例中,N個所述第一導電部311及N個所述第二導電部312可以是設置於其中一所述設置面221上,並且省略所述橫跨部313。For another example, in other not-shown embodiments of the present invention, the N first
另外,可以理解的是,所述第二本體31是由呈U字狀的N個所述第一導電部311與N個所述第二導電部312相互堆疊、並配合所述橫跨部313連接所組成的銅片線圈。也就是說,當所述第二本體31被攤開時,所述第二本體31通過前述N個第一導電部311、N個第二導電部312、及橫跨部313會形成連續S字狀的線性結構(如圖10所示)。In addition, it can be understood that the
需額外說明的是,如圖11所示,於另一個實施例中,所述第二本體31也可以是情況調整所述第一導電部311及所述第二導電部312的數量,亦即所述第二本體31除了所述橫跨部313之外,僅具有一個所述第一導電部311、一個所述第二導電部312。It should be noted that, as shown in FIG. 11 , in another embodiment, the
配合圖9及圖10所示,兩個所述連接件32於本實施例中大致呈L字狀的線性結構,並且是由所述第二本體31所一體延伸所形成,但本發明不受限於此,例如:兩個所述連接件32與所述第二本體31是各別獨立的構件。兩個所述連接件32分別位於所述覆蓋部21的兩側(即,兩個所述設置面221),並且兩個所述連接件32分別連接彼此最遠離的所述第一側段3112及所述第二側段3122,使兩個所述連接件32位於所述第二本體31的兩側。As shown in FIG. 9 and FIG. 10 , the two connecting
也就是說,其中一個所述連接件32會堆疊於第一個所述第一導電部311上,並且電性耦接其所述第一側段3112;另一個所述連接件則被第N個所述第二導電部312所堆疊,並且前述另一個連接件32電性耦接第N個所述第二導電部312的所述第二側段3122。That is to say, one of the connecting
另外,配合圖5、圖9、及圖10當兩個所述連接件32分別連接彼此最遠離的所述第一側段3112及所述第二側段3122時,N個所述第一導電部311、N個所述第二導電部312、與兩個所述連接件32能圍繞形成一第二適配孔H3,並且所述第二適配孔H3能位置對應所述覆蓋部21的所述穿孔H21及所述第一本體11的所述第一適配孔H11,亦即所述第二本體31具有所述第二適配孔H3。In addition, in accordance with FIG. 5 , FIG. 9 , and FIG. 10 , when the two connecting
值得注意的是,兩個所述連接件32與所述第二本體31沿所述厚度方向D3的高度較佳是不超出所述擋牆部22沿所述厚度方向D3的高度,這使得兩個所述連接件32與所述第二本體31能與位於所述第一本體11上的多個所述導電件12隔開。It is worth noting that the heights of the two connecting
配合圖3、圖5及圖6所示,所述磁性組件4於本實施例中採用導磁且不導電的材料所製成,並且包含一柱塊41及連接所述柱塊41兩端的兩個板塊42。所述柱塊41呈圓柱狀並設置於所述第一適配孔H11、所述第二適配孔H3、及所述穿孔H21內,並且所述柱塊41的兩端裸露於所述第二適配孔H3的外側。As shown in FIG. 3 , FIG. 5 and FIG. 6 , the
如圖3所示,兩個所述板塊42分別連接所述柱塊41的兩端,使兩個所述板塊42能覆蓋所述第二線圈組件3沿所述厚度方向D3的兩側面。也就是說,兩個所述板塊42沿所述厚度方向D3相互間隔,使兩個所述板塊42於所述覆蓋部21遠離所述擋牆部22的一端形成一開口K(如圖1所示),並且所述開口K能使兩個所述連接件32與所述橫跨部313裸露於兩個所述板塊42的外側。As shown in FIG. 3 , the two
實務上,如圖1及圖4所示,兩個所述板塊42及所述柱塊41(即,所述磁性組件4)沿所述厚度方向D3的高度E4較佳是不超出所述擋牆部22沿所述厚度方向D3的高度E22,並且兩個所述板塊42沿所述寬度方向D2的長度L42較佳是不超出所述擋牆部22沿所述寬度方向D2的長度L22。也就是說,所述磁性組件4正投影於所述擋牆部22的區域是完全位於所述擋牆部22上,這使得所述磁性組件4能與位於所述第一本體11上的多個所述導電件12隔開。In practice, as shown in FIG. 1 and FIG. 4 , the height E4 of the two
需特別注意的是,本發明的磁感應結構100在上述結構下,必須滿足以下技術特徵,才能確保所述磁感應結構100能以最低製作成本達到安全規範。具體來說,配合圖12所示,所述磁性組件4及所述第二線圈組件3被定義為一間隔目標A,並且任一個所述導電件12及至少一個所述導通孔13至所述間隔目標A具有一最短距離,並且所述最短距離較佳不小於0.4公釐(mm);其中,前述最短距離是指為電氣間隙(clearance)、或爬電距離(creepage distance)。It should be noted that, under the above structure, the
進一步地說,電氣間隙是指:相鄰的兩個導體(例如:至少一個所述導通孔13與所述第二線圈組件3)或一個導體與相鄰電機殼的表面(例如:任一個所述導電件12與所述磁性組件4的表面)沿空氣測量的最短距離,亦即通過空氣能實現絕緣的最短距離。Further, the electrical clearance refers to: two adjacent conductors (for example: at least one of the through
爬電距離是指:相鄰的兩個導體(例如:任一個所述導電件12與所述第二線圈組件3)或一個導體與相鄰電機殼表面(例如:至少一個所述導通孔13與所述絕緣單元2的表面)的沿絕絕緣表面測量的最短距離,亦即導體周圍的絕緣材料被電極化,所導致絕緣材料呈現帶電現象的區域半徑,即為爬電距離。Creepage distance refers to: two adjacent conductors (for example: any one of the
需特別說明的是,電氣間隙、與爬電距離(即,所述最短距離)的實際應用為本領域具有通常知識者所悉知的名詞,因此於此則不特別詳述磁感應結構100實際的距離計算。It should be noted that the actual application of the electrical clearance and the creepage distance (ie, the shortest distance) are terms known to those of ordinary knowledge in the art, so the actual application of the
[第二實施例][Second Embodiment]
如圖13所示,其為本發明的第二實施例,本實施例的磁感應結構100’類似於上述第一實施例的磁感應結構100,兩個實施例的相同處則不再加以贅述,而本實施例的磁感應結構100’與第一實施例的差異主要在於:As shown in FIG. 13 , which is the second embodiment of the present invention, the
於本實施例中,所述第二線圈組件3’為相互電性耦接的兩個印刷電路板線圈。具體來說,所述第二線圈組件3’的一第二本體31’及連接所述第二本體31’的兩個連接件32’。In this embodiment, the second coil assembly 3' is two printed circuit board coils that are electrically coupled to each other. Specifically, a second body 31' of the second coil assembly 3' and two connecting pieces 32' connecting the second body 31'.
所述第二本體31’包含兩個子電路板314、及電性耦接兩個所述子電路板314的至少一個橫跨件315。其中,兩個所述子電路板314各別為印刷電路板線圈,並且兩個所述子電路板314分別設置於所述絕緣單元2的兩個所述設置面221上,亦即每個所述子電路板314具有一絕緣載體3141、埋置於所述絕緣載體3141內的多個線圈(圖中未示)、電性耦接多個所述線圈的至少一個導通孔3142(via hole)。The second body 31' includes two
更詳細地來看,每個所述子電路板314的所述絕緣載體3141於本實施例中為板狀結構,並且所述絕緣載體3141的寬側面W3141的面積與所述覆蓋部21的寬側面W21的面積大致相等。每個所述子電路板314的所述絕緣載體3141具有對應所述第一適配孔H11的一開孔H3141,亦即兩個所述開孔H3141形成所述第二適配孔H3。多個所述線圈是以印刷方式(layout)形成於所述絕緣載體3141的內部,並且多個所述線圈通過至少一個所述導通孔3142相互電性耦接。In more detail, the insulating
至少一個所述橫跨件315為導電結構,於本實施例中是以導針(Pin)為例子,但本發明不受限於此。至少一個所述橫跨件315位於所述覆蓋部21遠離所述延伸部112的窄邊緣N21,亦即位於所述開口K的位置而裸露於兩個所述板塊42的外側,並且所述橫跨件315的兩端能電性耦接兩個所述子電路板314。其中,所述橫跨件315電性耦接任一個所述子電路板314方式可以是直接穿經所述絕緣載體3141而電性耦接多個所述線圈、電性耦接裸露於所述絕緣載體3141的至少一個所述導通孔3142、或電性耦接所述子電路板314所進一步形成的金手指。At least one of the
需說明的是,每個所述子電路板能通過其絕緣載體3141、多個所述線圈、至少一個所述導通孔3142,以具備電磁感應的作用。但實現電磁感應的方式為現有技術且非本發明的技術重點,故於此則不特別詳述。It should be noted that, each of the sub-circuit boards can have the effect of electromagnetic induction through its insulating
兩個所述連接件32’分別設置於兩個所述子電路板314上,並且兩個所述連接件32’於本實施例中是位於兩個所述子電路板314相對應所述開口K的位置,亦即兩個所述連接件32’能經由所述開口K以用來電性耦接所述電子裝置。於本實施例中,兩個所述連接件32’是以金手指為例,並且位於兩個所述子電路板314相互遠離的一側面,但本發明不受限於此。The two connecting
[本發明實施例的技術效果][Technical effects of the embodiments of the present invention]
綜上所述,本發明實施例所公開的磁感應結構,能通過“所述絕緣單元包覆至少一個所述導通孔及所述第一適配孔,並且所述第二本體跨置於所述絕緣單元的所述覆蓋部上”及“所述第一線圈組件的任一個所述導電件及任一個所述導通孔至所述間隔目標具有一最短距離,並且所述最短距離不小於0.4公釐(mm)”的設計,使所述磁感應結構能以最低製作成本達到安全規範。To sum up, the magnetic induction structure disclosed in the embodiment of the present invention can cover at least one of the through hole and the first fitting hole by the insulating unit, and the second body can straddle the "On the covering part of the insulating unit" and "Any one of the conductive parts and any one of the via holes of the first coil assembly has a shortest distance to the distance target, and the shortest distance is not less than 0.4 cm. The design of millimeter (mm)” enables the magnetic induction structure to meet safety specifications with the lowest manufacturing cost.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.
100、100’:磁感應結構
1:第一線圈組件
11:第一本體
111:主體部
112:延伸部
12:導電件
13:導通孔
2:絕緣單元
21:覆蓋部
22:擋牆部
221:設置面
3、3’:第二線圈組件
31、31’:第二本體
311:第一導電部
3111:第一中段
3112:第一側段
312:第二導電部
3121:第二中段
3122:第二側段
313:橫跨部
314:子電路板
3141:絕緣載體
3142:導通孔
315:橫跨件
32、32’:連接件
4:磁性組件
41:柱塊
42:板塊
D1:長度方向
D2:寬度方向
D3:厚度方向
G:凹槽
H11:第一適配孔
H3:第二適配孔
H21:穿孔
H3141:開孔
K:開口
A:間隔目標
K311:第一開口
K312:第二開口
W11、W22、W21、W3141:寬側面
N11、N112、N21:窄邊緣
E22、E4:高度
L112、L111、L42、L22:長度100, 100': Magnetic induction structure
1: The first coil assembly
11: The first body
111: main body
112: Extensions
12: Conductive parts
13: Via hole
2: Insulation unit
21: Covering Department
22: Retaining Wall Department
221: set
圖1為本發明第一實施例的磁感應結構的立體示意圖。FIG. 1 is a three-dimensional schematic diagram of a magnetic induction structure according to a first embodiment of the present invention.
圖2為本發明第一實施例的磁感應結構的另一視角的立體示意圖。FIG. 2 is a schematic perspective view of the magnetic induction structure according to the first embodiment of the present invention from another perspective.
圖3為本發明第一實施例的磁感應結構的側視示意圖。3 is a schematic side view of the magnetic induction structure according to the first embodiment of the present invention.
圖4為本發明第一實施例的磁感應結構的俯視示意圖。FIG. 4 is a schematic top view of the magnetic induction structure according to the first embodiment of the present invention.
圖5為本發明第一實施例的磁感應結構的分解示意圖。FIG. 5 is an exploded schematic diagram of the magnetic induction structure according to the first embodiment of the present invention.
圖6為本發明第一實施例的磁感應結構的另一視角的分解示意圖。FIG. 6 is an exploded schematic view of the magnetic induction structure according to the first embodiment of the present invention from another perspective.
圖7為本發明第一實施例的第一線圈組件的立體示意圖。FIG. 7 is a schematic perspective view of the first coil assembly according to the first embodiment of the present invention.
圖8為本發明第一實施例的絕緣單元設置於第一線圈組件上的立體示意圖。FIG. 8 is a three-dimensional schematic diagram of the insulating unit disposed on the first coil assembly according to the first embodiment of the present invention.
圖9為本發明第一實施例的第二線圈組件的立體示意圖。FIG. 9 is a schematic perspective view of the second coil assembly according to the first embodiment of the present invention.
圖10為本發明第一實施例的第二線圈組件展開時的立體示意圖。FIG. 10 is a three-dimensional schematic diagram of the second coil assembly when the first embodiment of the present invention is unfolded.
圖11為本發明第一實施例的另一態樣的第二線圈組件展開時的立體示意圖。FIG. 11 is a schematic perspective view of the second coil assembly of another aspect of the first embodiment of the present invention when it is unfolded.
圖12為圖1沿XII-XII剖線的剖面示意圖。FIG. 12 is a schematic cross-sectional view along the line XII-XII of FIG. 1 .
圖13為本發明第二實施例的磁感應結構的分解示意圖。FIG. 13 is an exploded schematic view of the magnetic induction structure according to the second embodiment of the present invention.
100:磁感應結構 100: Magnetic induction structure
1:第一線圈組件 1: The first coil assembly
2:絕緣單元 2: Insulation unit
3:第二線圈組件 3: Second coil assembly
4:磁性組件 4: Magnetic components
D1:長度方向 D1: length direction
D2:寬度方向 D2: Width direction
D3:厚度方向 D3: Thickness direction
K:開口 K: open
N21:窄邊緣 N21: Narrow edge
W22:寬側面 W22: Wide side
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110133128A TWI761287B (en) | 2021-09-07 | 2021-09-07 | Magnetic induction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110133128A TWI761287B (en) | 2021-09-07 | 2021-09-07 | Magnetic induction structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI761287B true TWI761287B (en) | 2022-04-11 |
| TW202312194A TW202312194A (en) | 2023-03-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110133128A TWI761287B (en) | 2021-09-07 | 2021-09-07 | Magnetic induction structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI761287B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI671769B (en) * | 2018-05-02 | 2019-09-11 | 聯寶電子股份有限公司 | Magnetic induction element and method of manufacturing same |
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- 2021-09-07 TW TW110133128A patent/TWI761287B/en active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI671769B (en) * | 2018-05-02 | 2019-09-11 | 聯寶電子股份有限公司 | Magnetic induction element and method of manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202312194A (en) | 2023-03-16 |
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