TWI759381B - Diluted solution producing device and diluted solution producing method - Google Patents
Diluted solution producing device and diluted solution producing method Download PDFInfo
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Abstract
Description
本發明關於稀釋液製造裝置及稀釋液製造方法。The present invention relates to a dilution liquid manufacturing apparatus and a dilution liquid manufacturing method.
自以往,在半導體器件、液晶器件之製造程序中,就將半導體晶圓、玻璃基板等電子部件予以洗淨的洗淨液而言,係使用已高度除去雜質之超純水。已知使用如此之超純水的洗淨中,由於使用高電阻率值之超純水,洗淨時容易產生靜電,會有導致絕緣膜靜電破壞、微粒再附著之虞。因此,近年來為了將電阻率值(導電率)調整成預定之範圍,並抑制靜電的產生,係使用藉由在超純水中高精度地添加氨水、碳酸水等藥液而調整成預定之濃度的稀釋液。Conventionally, in the manufacturing process of semiconductor devices and liquid crystal devices, ultrapure water from which impurities have been highly removed has been used as a cleaning solution for cleaning electronic components such as semiconductor wafers and glass substrates. It is known that in cleaning using such ultrapure water, since ultrapure water having a high resistivity value is used, static electricity is easily generated during cleaning, which may lead to electrostatic breakdown of the insulating film and reattachment of particles. Therefore, in recent years, in order to adjust the resistivity value (conductivity) to a predetermined range and suppress the generation of static electricity, a chemical solution such as ammonia water and carbonated water is added to ultrapure water with high precision and adjusted to a predetermined concentration. diluent.
作為如此之稀釋液之製造裝置,專利文獻1中記載了一種製造裝置,具有:供給超純水的第1配管、儲存藥液的槽、將槽與第1配管予以連接的第2配管、調整槽內之壓力的壓力調整器;該製造裝置藉由壓力調整器將槽內之藥液壓送通過第2配管,並添加至第1配管內之超純水,而製造稀釋液。根據該製造裝置,藉由依據超純水或稀釋液之流量與稀釋液之濃度的測定值適當控制槽內之壓力,可高精度地調整藥液的添加量,其結果能製造已調整成預定濃度之稀釋液。 [先前技術文獻] [專利文獻]As an apparatus for producing such a diluent,
[專利文獻1]國際公開第2016/042933號[Patent Document 1] International Publication No. 2016/042933
[發明所欲解決之課題] 就稀釋液之製造裝置而言,將所製造之稀釋液使用於半導體晶圓、玻璃基板等電子部件之洗淨時,要求持續且穩定地製造已調整成預定濃度之稀釋液並供給至使用端。但,專利文獻1記載之製造裝置中,當槽內之藥液用罄時,需停止裝置的運轉,將槽內的壓力釋放並補充藥液,或更換成填充有藥液的另一個槽。如此情形下,裝置的運轉再開後需要時間使所製造之稀釋液的濃度穩定。又,考量裝置持續地運轉的觀點,也有人考慮在槽內之藥液用罄前,邊繼續從槽供給藥液邊對相同的槽中補充藥液。但,就如此之補充方法而言,從槽供給藥液係利用加壓用氣體將槽內控制成加壓狀態而進行,故隨著槽內的壓力控制之紊亂,導致所製造之稀釋液的濃度變得不穩定。[Problem to be Solved by the Invention] In the case of a production apparatus for a dilution liquid, when the produced dilution liquid is used for cleaning electronic components such as semiconductor wafers and glass substrates, it is required to continuously and stably produce a predetermined concentration adjusted The diluent is supplied to the end of use. However, in the manufacturing apparatus described in
因此,本發明之目的在於提供能持續且穩定地製造已調整成預定濃度之稀釋液的稀釋液製造裝置及稀釋液製造方法。 [解決課題之手段]Therefore, the objective of this invention is to provide the dilution liquid manufacturing apparatus and the dilution liquid manufacturing method which can continuously and stably manufacture the dilution liquid adjusted to predetermined density|concentration. [Means of Solving Problems]
為了達成上述目的,本發明之稀釋液製造裝置,係藉由對於第1液體添加第2液體,以製造第2液體之稀釋液,並將稀釋液供給至使用端;並具有:第1配管,供給第1液體;第1槽,儲存第2液體;第2配管,將第1槽與第1配管予以連接;壓力調整部,係調整第1槽內之壓力,將第1槽內之第2液體壓送通過第2配管並供給至第1配管;控制部,根據流經第1配管內之第1液體或稀釋液之流量與稀釋液之濃度的測定值,調整利用壓力調整部所為之第2液體對於第1液體的添加量,以使稀釋液之濃度成為預定之濃度。進一步,本發明之稀釋液製造裝置,於其中一態樣中具有與第1槽串聯連接,並暫時儲存待補充到第1槽之第2液體的第2槽,於另一態樣中具有與第1槽並聯連接,並儲存待供給至第1配管而不是第1槽之第2液體的第2槽。In order to achieve the above-mentioned object, the dilution liquid manufacturing apparatus of the present invention produces a dilution liquid of the second liquid by adding the second liquid to the first liquid, and supplies the dilution liquid to the end of use; and has: a first piping, Supply the first liquid; the first tank stores the second liquid; the second piping connects the first tank with the first piping; the pressure adjustment part adjusts the pressure in the first tank, and adjusts the pressure in the first tank to the second liquid in the first tank. The liquid is pressure-fed through the second pipe and supplied to the first pipe; the control unit adjusts the first liquid or the diluent flow through the first pipe according to the measured value of the flow rate of the first liquid or the diluent and the concentration of the diluent. 2. The amount of liquid added to the first liquid so that the concentration of the diluent becomes a predetermined concentration. Further, the dilution liquid manufacturing apparatus of the present invention has, in one aspect, a second tank that is connected in series with the first tank and temporarily stores the second liquid to be replenished to the first tank, and has a second tank that is connected to the first tank in another aspect. The 1st tank is connected in parallel, and the 2nd tank which stores the 2nd liquid to be supplied to the 1st piping instead of the 1st tank.
又,本發明之稀釋液製造方法,係藉由對於第1液體添加第2液體,以製造第2液體之稀釋液,並將稀釋液供給至使用端;並包括下列步驟:將第1液體供給至第1配管;將第2液體供給至第1配管,係調整儲存第2液體之第1槽內的壓力,將第1槽內之第2液體壓送通過將第1槽與第1配管予以連接的第2配管,並供給至第1配管,包括測定流經第1配管內之第1液體或稀釋液之流量與稀釋液之濃度,並根據該測定值調整第2液體對於第1液體的添加量,以使稀釋液之濃度成為預定之濃度。進一步,本發明之稀釋液製造方法,於其中一態樣中包括如下步驟:將第2液體暫時儲存在與第1槽串聯連接之第2槽;根據第1槽內之液位,將儲存於第2槽之第2液體補充到第1槽。於另一態樣中包括如下步驟:將第2液體儲存在與第1槽並聯連接之第2槽;根據第1槽內之液位,從第2槽而不是從第1槽供給第2液體到第1配管。In addition, the method for producing a diluent of the present invention is to produce a diluent of the second liquid by adding the second liquid to the first liquid, and supply the diluent to the end of use; and includes the steps of: supplying the first liquid To the first piping; supply the second liquid to the first piping, adjust the pressure in the first tank where the second liquid is stored, and pressurize the second liquid in the first tank by connecting the first tank and the first piping. Connect the second pipe and supply it to the first pipe, including measuring the flow rate and diluent concentration of the first liquid or diluent flowing through the first pipe, and adjusting the amount of the second liquid to the first liquid according to the measured value. Add the amount so that the concentration of the diluent becomes a predetermined concentration. Further, the method for producing a diluent of the present invention, in one aspect, includes the following steps: temporarily storing the second liquid in a second tank connected in series with the first tank; The second liquid of the second tank is replenished to the first tank. In another aspect comprising the steps of: storing the second liquid in a second tank connected in parallel with the first tank; supplying the second liquid from the second tank instead of the first tank according to the liquid level in the first tank to the first piping.
如此之稀釋液製造裝置及稀釋液製造方法中,藉由使用2個槽,可在其中一個槽用罄之前,從另一個槽補充第2液體到該槽,或切換成另一個槽供給第2液體。藉此,不需要槽的更換作業等、裝置的運轉停止,而可持續穩定地進行稀釋液的製造。 [發明之效果]In such a dilution liquid manufacturing apparatus and dilution liquid manufacturing method, by using two tanks, before one tank is used up, the second liquid can be supplied from the other tank to the tank, or the second liquid can be switched to the other tank to supply the second liquid. liquid. Thereby, the operation of replacing the tank, etc., and the stoppage of the operation of the apparatus are not required, and the production of the diluted solution can be continued stably. [Effect of invention]
以上,根據本發明,可持續且穩定地製造已調整成預定濃度的稀釋液。As described above, according to the present invention, a dilution liquid adjusted to a predetermined concentration can be produced continuously and stably.
以下,參照圖式針對本發明之實施形態進行說明。Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(第1實施形態) 圖1係本發明之第1實施形態之稀釋液製造裝置的概略構成圖。此外,圖示之構成僅係一例,當然可因應裝置之使用目的、用途、要求性能進行適當變更,例如追加閥、過濾器等係不言自明。(1st Embodiment) FIG. 1 is a schematic block diagram of the dilution liquid manufacturing apparatus which concerns on the 1st Embodiment of this invention. In addition, the configuration shown in the figure is only an example, and of course, it can be appropriately changed according to the purpose of use, application, and required performance of the device. For example, it is self-evident that a valve and a filter are added.
稀釋液製造裝置10具有:供給第1液體之第1配管11;儲存第2液體之2個槽12a、12b;將2個槽12a、12b與第1配管11予以連接,並彼此並聯連接的多支第2配管13。第2液體為待稀釋的藥液,第1液體為將第2液體予以稀釋的稀釋介質。故,稀釋液製造裝置10係藉由對於流經第1配管11之第1液體,通過第2配管13添加第2液體,以製造第2液體之稀釋液,並將製得之稀釋液通過第1配管11供給至使用端1。The dilution
就第1液體而言,其種類並無特別限制,可配合利用用途使用超純水、純水、使電解質、氣體溶解而得的水、異丙醇等醇類。又,就第2液體而言,只要是用於待稀釋的目的,其種類並無特別限制,可配合利用用途使用碳酸水、富氫水等使電解質、氣體溶解而得的水;異丙醇等醇類。製造之稀釋液使用於半導體晶圓的洗淨時,使用超純水作為第1液體,並使用氨水溶液作為第2液體較理想。或也可適當使用四甲基氫氧化銨(TMAH)水溶液作為第2液體。此外,此處所稱超純水,係指使用超純水製造裝置將離子及非離子性物質從被處理水(原水)除去而獲得的處理水,具體而言,係指電阻率值為18MΩ・cm以上之處理水。The type of the first liquid is not particularly limited, and alcohols such as ultrapure water, pure water, water obtained by dissolving electrolytes and gases, and isopropyl alcohol can be used according to the application. In addition, as for the second liquid, as long as it is used for the purpose of dilution, its type is not particularly limited, and water obtained by dissolving electrolytes and gases, such as carbonated water, hydrogen-rich water, etc., can be used according to the application; isopropyl alcohol and other alcohols. When the produced diluent is used for cleaning of semiconductor wafers, it is preferable to use ultrapure water as the first liquid and an aqueous ammonia solution as the second liquid. Alternatively, a tetramethylammonium hydroxide (TMAH) aqueous solution may be appropriately used as the second liquid. In addition, the ultrapure water referred to here refers to treated water obtained by removing ions and non-ionic substances from the water to be treated (raw water) using an ultrapure water production apparatus, and specifically refers to a resistivity value of 18MΩ・ Treated water above cm.
2個槽12a、12b彼此並聯連接。亦即,2個槽12a、12b在其出口側分別藉由閥14a、14b與多支第2配管13串聯連接。於多支第2配管13之入口側分別設置閥13a。在2個閥14a、14b與多個閥13a之間設置過濾器F1。此外,也可於2個槽12a、12b之出口側設置三向閥以替代2個閥14a、14b。又,2個槽12a、12b分別藉由閥15a、15b與將第2液體供給至各個槽12a、12b的藥液供給管線(液體供給手段)16連接。在閥15a與槽12a之間、及閥15b與槽12b之間分別設置過濾器F2、F3,於藥液供給管線16設置閥16a。進一步,於2個槽12a、12b分別設置大氣閥(atmospheric valve)17a、17b。此外,也可在2個槽12a、12b之入口側設置三向閥以替代2個閥15a、15b。The two
進一步,稀釋液製造裝置10具有調整槽12a、12b內之壓力的壓力調整部18,作為用於將槽12a、12b內之第2液體壓送通過第2配管13並供給至第1配管11的手段。壓力調整部18係由將槽加壓用氣體供給至槽12a、12b內的槽加壓用氣體供給管線18a、及設置於槽加壓用氣體供給管線18a的進排氣機構18b構成。進排氣機構18b由進氣閥18c與排氣閥18d構成,藉由使該等閥打開關閉,可對槽12a、12b內進行加壓或減壓。此外,進排氣機構18b並不限定於圖示之構成,亦即,不限定於進氣加壓機構(進氣閥18c)與排氣減壓機構(排氣閥18d)個別構成者,例如也可為電動氣動調節器(electric pneumatic regulator)等進氣加壓機構與排氣減壓機構構成為一體者。槽加壓用氣體供給管線18a藉由閥19a與其中一個槽(第1槽)12a連接,並藉由閥19b與另一個槽(第2槽)12b連接。又,於槽加壓用氣體供給管線18a設置測定槽加壓用氣體之供給壓力的壓力計19c。槽加壓用氣體的種類並無特別限制,宜使用可相對較輕易地利用之係鈍性氣體的氮氣。惟,製造之稀釋液使用於包括容易被氧化之材料之被處理體的洗淨、清洗時,就槽加壓用氣體而言應避免使用氧氣、空氣。因此,即使使用氮氣等鈍性氣體時,也有可能會受到以雜質的形式含有之氧的影響,故也需要充分考慮其純度。Further, the dilution
本實施形態中,製造稀釋液之正常運轉時,第2液體從2個槽12a、12b交替地供給至第1配管11。亦即,從第1槽12a供給第2液體至第1配管11的第1供給模式、和從第2槽12b供給第2液體至第1配管11的第2供給模式,係根據各個槽12a、12b內之液位進行適當切換。例如,在第1供給模式中,第1槽12a內之液位低於預定的下限液位的話,則停止從第1槽12a供給第2液體,而變成從第2槽12b供給第2液體。該切換動作如後述。In the present embodiment, at the time of the normal operation of producing the dilution liquid, the second liquid is alternately supplied to the first piping 11 from the two
又,本實施形態中,向第1配管11供給第2液體係通過多支第2配管13中之1支進行,但為了實現第2液體的廣範圍供給量,多支第2配管13以內徑及長度中之至少一者彼此不同的方式構成。亦即,多支第2配管13以內徑及長度中之至少一者彼此不同的方式構成,使得即使例如各個槽12a、12b內之壓力為固定仍能以彼此不同的流量使第2液體通過。該等第2配管13的構成亦如後述。In this embodiment, the supply of the second liquid system to the
進一步,稀釋液製造裝置10具有控制稀釋液製造裝置10之各種運轉動作的控制部20。尤其控制部20至少可以根據測定流經第1配管11內之第1液體之流量的流量測定手段21與測定稀釋液之濃度的濃度測定手段22的測定結果,調整利用壓力調整部18所為之第2液體對於第1液體的添加量,以使稀釋液之濃度成為預定之濃度。以下,針對利用控制部20所為的第2液體之添加量之調整方法進行說明,但在此之前,針對係該添加量調整之基礎的哈根佰意索意(Hagen-Poiseuille)法則進行簡單說明。Furthermore, the dilution
哈根佰意索意法則係關於圓形管路內之層流之水頭損失的法則,若定義管的內徑為D[m],管的長度為L[m],管兩端的壓力梯度為ΔP[Pa],液體的黏性係數為μ[Pa・s],流經管內之液體的流量為Q[m3 /s],則以下列關係式表示: Q=(π×D4 ×ΔP)/(128×μ×L)。 亦即,根據哈根佰意索意法則,流經圓管之液體的流量Q和圓管之內徑D的4次冪及兩端之壓力梯度ΔP成正比,和圓管的長度L及液體的黏性係數μ成反比。Hagen-Bailey's Law is a law about the head loss of laminar flow in a circular pipe. If the inner diameter of the pipe is defined as D[m], the length of the pipe is L[m], and the pressure gradient at both ends of the pipe is ΔP[Pa], the viscosity coefficient of the liquid is μ[Pa・s], and the flow rate of the liquid flowing through the pipe is Q[m 3 /s], then it is expressed by the following relationship: Q=(π×D 4 ×ΔP )/(128×μ×L). That is to say, according to Hagen-Bailey's Law, the flow rate Q of the liquid flowing through the circular tube is proportional to the 4th power of the inner diameter D of the circular tube and the pressure gradient ΔP at both ends, and is proportional to the length L of the circular tube and the liquid The viscosity coefficient μ is inversely proportional.
本實施形態之稀釋液製造裝置中,通過各第2配管的第2液體之供給適用哈根佰意索意法則。各第2配管的長度L及內徑D為固定的值,若第2液體的種類決定的話,則其黏性係數μ亦為固定的值。因此,只需控制對應於各第2配管兩端間之壓力梯度ΔP的槽內之壓力,即可比例地控制各第2配管內之流量Q。In the diluent manufacturing apparatus of the present embodiment, the Hagen-Bailey-Soil's law is applied to the supply of the second liquid through each of the second pipes. The length L and the inner diameter D of each second pipe are fixed values, and if the type of the second liquid is determined, the viscosity coefficient μ is also a fixed value. Therefore, only by controlling the pressure in the tank corresponding to the pressure gradient ΔP between the two ends of each second pipe, the flow rate Q in each second pipe can be proportionally controlled.
然後,針對從第1槽12a添加第2液體至第1液體時,利用控制部20所為的第2液體之添加量之調整方法進行說明。Next, when adding the second liquid to the first liquid from the
首先,設定製造之稀釋液之濃度的目標值,針對所設定的目標濃度,計算出第2液體的添加量。具體而言,藉由流量測定手段21測定第1液體之流量,並計算出為了達成目標濃度的第2液體之目標添加量。然後,針對計算出之目標添加量,在多支第2配管13中決定欲使用的1支第2配管13,針對所決定的第2配管13,算出為了實現目標添加量(流量)的第1槽12a內之壓力的目標值。然後,將使用之第2配管13的閥13a打開後,利用壓力調整部18將第1槽12a內之壓力調整成算出之目標壓力,藉此,以預定的添加量將第2液體從第1槽12a通過第2配管13添加至第1配管11內之第1液體。First, a target value of the concentration of the dilution liquid to be produced is set, and the addition amount of the second liquid is calculated with respect to the set target concentration. Specifically, the flow rate of the first liquid is measured by the flow rate measuring means 21, and the target addition amount of the second liquid to achieve the target concentration is calculated. Then, with respect to the calculated target addition amount, one of the
此時,根據上述哈根佰意索意法則,流經第2配管13之第2液體的流量Q和第2配管13兩端的壓力梯度ΔP成正比。因此,例如當第1液體之流量變化時,以使壓力梯度ΔP相對於該變化以某一比例常數成正比的方式,使第1槽12a內之壓力發生變化。例如,第1液體之流量變為2倍時,使壓力梯度ΔP成為2倍,而第2液體之流量也成為2倍,第1液體之流量變為1/2時,使壓力梯度ΔP成為1/2,而第2液體之流量也成為1/2。藉由如此之調整方法,結果可保持第1液體之流量與第2液體之流量的比例關係,即使第1液體之流量發生變動時,仍能獲得穩定濃度之稀釋液。At this time, the flow rate Q of the second liquid flowing through the
惟,由於第1槽12a中之第2液體的揮發、分解等,也會有第2液體本身的濃度不是固定的情況。此時,即使當初已調整在包含目標濃度之預定濃度範圍內,製造之稀釋液之濃度也有可能會逐漸從該濃度範圍偏離。因此,本實施形態中,藉由濃度測定手段22測定稀釋液之濃度,若測得之稀釋液之濃度偏離預定之濃度範圍的話,則修正上述比例常數以使該稀釋液之濃度落回到預定之濃度範圍內。藉由該反饋控制,即使裝置之運轉剛啟動時、或稀釋液之濃度的目標值發生變更時,仍能自動地變更比例常數成為最適合的值。其結果,可穩定地製造已調整成預定濃度的稀釋液。However, due to volatilization, decomposition, etc. of the second liquid in the
就流量測定手段21而言,其構成並無特別限制,例如可使用卡曼渦漩流量計(Karman vortex flow meter)、超音波流量計。又,流量測定手段21只要是設置在能監測流經第1配管11內之第1液體之流量變動的位置即可,其設置位置並無特別限制。又,圖示之實施形態中,流量測定手段21係設置在第1配管11之比起與多支第2配管13之連接部更上游側的位置,也可設置在比起該連接部更下流側的位置,以測定流經第1配管11內之稀釋液的流量。其原因為:第2液體之供給量(流量)遠小於第1液體之流量,可將稀釋液之流量等同視為第1液體之流量處理。The configuration of the flow measurement means 21 is not particularly limited, and for example, a Karman vortex flow meter or an ultrasonic flow meter can be used. In addition, the flow measuring means 21 may be installed at a position where the flow rate fluctuation of the first liquid flowing in the
就濃度測定手段22而言,只要是可將稀釋液之濃度以電化學常數形式進行測定者即可,其構成並無特別限制,例如可使用導電率計、pH計、電阻率計、ORP計(氧化還原電位計)、或離子電極計等。製造之稀釋液以抗靜電、消除靜電為目的而使用於被處理體的洗淨、清洗時,宜使用導電率計、電阻率計作為濃度測定手段22。濃度測定手段22,如圖示般係設置在第1配管11之比起與多支第2配管13之連接部更下流側的位置,於該設置位置可直接安裝在第1配管11,也可安裝在與第1配管11並列設置之旁通配管。The concentration measuring means 22 is not particularly limited as long as it can measure the concentration of the diluent as an electrochemical constant. For example, a conductivity meter, a pH meter, a resistivity meter, and an ORP meter can be used. (redox potentiometer), or ion electrode meter, etc. When the produced diluent is used for cleaning and cleaning the object to be treated for the purpose of antistatic and elimination of static electricity, it is preferable to use a conductivity meter and a resistivity meter as the concentration measuring means 22 . As shown in the figure, the concentration measuring means 22 is installed at a position on the downstream side of the first piping 11 from the connection portion with the plurality of
由哈根佰意索意法則也可理解,第2液體之供給量(流量Q)的精度會受到第2配管13兩端之壓力梯度ΔP較大的影響。因此,於第1配管11與第2配管13之連接部的壓力發生大的變動時,變得難以穩定地製造已調整成預定濃度的稀釋液。為了監測於該連接部之壓力變動,如圖示般設置測定第1配管11內之壓力的壓力測定手段23。故,控制部20可根據流量測定手段21、濃度測定手段22、及壓力測定手段23的測定結果,算出為了使稀釋液之濃度成為目標濃度的第1槽12a內之壓力的目標值,並進行第2液體之添加量的調整。壓力測定手段23的構成並無特別限制,關於其設置位置,在圖示之實施形態中,也在比起與多支第2配管13之連接部更上游側的位置,但只要是可測定於連接部之管內壓力,也可在比起連接部更下流側的位置。It can also be understood from Hagen-Bailey's Law that the accuracy of the supply amount (flow rate Q) of the second liquid is greatly affected by the pressure gradient ΔP at both ends of the
如到目前為止所重複記述般,流經第2配管13內之第2液體的流量Q和第2配管13兩端之壓力梯度ΔP成正比。因此,若能使該壓力梯度ΔP發生大的變化,即能實現第2液體的廣範圍供給量(流量),而可對應於較寬廣的濃度範圍。但,在實用上由於施加於各個槽12a、12b的壓力有上限,故難以使壓力梯度ΔP發生大的變化,第2液體之添加量的調整範圍也有界限。As described repeatedly so far, the flow rate Q of the second liquid flowing through the
另一方面,根據哈根佰意索意法則,第2液體的流量Q和第2配管13之內徑D(的4次冪)也成正比,和其長度L成反比。著眼於此點,本實施形態中為了實現第2液體的廣範圍供給量(流量),多支第2配管13以內徑及長度中之至少一者彼此不同的方式構成。亦即,多支第2配管13藉由內徑及長度中之至少一者彼此不同,構成為即使例如各個槽12a、12b內之壓力為固定時仍能以彼此不同的流量使第2液體通過。藉此,就裝置整體而言,可使第2液體之添加量的調整範圍變寬廣,能製造寬廣濃度範圍的稀釋液。On the other hand, according to Hagen-Bailey's Law, the flow rate Q of the second liquid is also proportional to the inner diameter D (4th power) of the
各第2配管13之內徑不限於特定的尺寸,但為了更加精密地控制所製造之稀釋液的濃度,各第2配管13之內徑宜為超過0.1mm且在4mm以下,為超過0.2mm且在0.5mm以下更佳。其原因為:第2配管13內之第2液體的流動容易變成層流(規則有序的流動)。亦即,係由於管內之流動為亂流(不規則的流動)的話,上述哈根佰意索意法則不成立,難以藉由第2配管兩端間之壓力梯度ΔP比例地控制流經第2配管內之第2液體的流量Q。換言之,為了維持流量Q與壓力梯度ΔP之良好比例關係,就各第2配管13而言,流經管內之第2液體的流動宜成為層流。此外,關於該內徑之理想範圍的詳細參照專利文獻1。The inner diameter of each
又,各第2配管13的長度也不限於特定的尺寸,但若長度過短的話,會容易影響管內的流量,變得難以藉由配管兩端之壓力梯度依比例控制液體的流量。又,長度過長的話,配管的設置變得困難,而且配管與液體之接觸面積變大,有可能會增加配管內之液體的污染。因此,各第2配管13的長度宜為0.01m以上100m以下之範圍,為0.1m以上10m以下之範圍更佳。Also, the length of each
進一步,第2配管13為內徑為0.1mm以下者、長度超過100m者的話,雖然仍取決於其組合,但第2液體流經第2配管13時的阻力容易變大,亦即,槽內之壓力容易變成高壓。故,就如此之內徑及長度而言,考量耐壓的觀點,構成裝置之部件類(配管、閥等)的選擇變得困難,故不佳。又,第2配管13為內徑超過4mm者、長度未達0.01m者的話,雖然也取決於其組合,但第2液體流經第2配管13時的阻力容易變小,亦即,第2液體之流量容易因槽內壓力的細微變化而發生變化。故,如此之內徑及長度會使得槽內之壓力控制變得困難而不佳。Furthermore, if the
第2配管13的材質、形狀並無特別限制,可適當使用樹脂製的柔軟的管。如此之樹脂,可列舉PFA、ETFE等氟樹脂、聚乙烯系樹脂、聚丙烯系樹脂等,製造之稀釋液使用於半導體晶圓的洗淨、清洗時,不易溶出的氟樹脂為特佳。又,第2液體為有揮發性的液體時,為了抑制因管內之液體揮發而擴散到外部所致之液體的濃度變動,宜使用透氣性低者作為第2配管13。在此情形,由於如上述般取決於製造之稀釋液的用途,也會有稀釋液所含之氧產生不良影響的情況,故就可抑制空氣中的氧從第2配管13之外側向內側擴散,並抑制第2液體中之溶存氧濃度上升的觀點亦佳。The material and shape of the
作為將第2配管13連接至第1配管11的方法,只要是將第1液體與第2液體適當地混合者即可,並無特別限制。例如宜以使第2配管13之前端位於第1配管11之中心部的方式使其與第1配管11連接,藉此,可有效率地混合第1液體與第2液體。又,關於多支第2配管13,考量結構簡單,為積液處少之結構的觀點,宜個別連接至第1配管11。The method of connecting the
圖示之例中設置有4支第2配管13,但第2配管13的數目不限於4支,可因應要求之稀釋液的濃度範圍適當變更為例如2支、3支、或5支以上。與此相應,內徑與長度之組合亦不限於特定的組合,可進行適當變更。就內徑與長度之組合而言,也可考慮僅其中任一者不同的組合。此時,由於如上述般施加於各個槽12a、12b的壓力有上限,考量使第2液體之添加量的調整範圍進一步變寬廣的觀點,宜組合內徑彼此不同者。由下列情事亦可知宜組合內徑彼此不同者:根據上述哈根佰意索意法則,對於流經第2配管13之第2液體之流量Q,長度L以1次冪影響,反觀內徑D係以4次冪影響。此外,本實施形態中,向第1配管11供給第2液體係通過多支第2配管13中之1支進行,但根據所要求之稀釋液的濃度範圍,也可通過多支第2配管13中之2支以上的第2配管13進行。In the illustrated example, four
如上述般在本實施形態中,製造稀釋液之正常運轉時,會實施從第1槽12a供給第2液體至第1配管11的第1供給模式、與從第2槽12b供給第2液體至第1配管11的第2供給模式的切換。藉此,不需要槽的更換作業等,且無需停止裝置的運轉,故可持續穩定地進行稀釋液之製造。以下,舉從第1供給模式切換成第2供給模式的情形為例,針對該切換動作進行說明。As described above, in the present embodiment, during the normal operation of producing the diluent, the first supply mode of supplying the second liquid from the
第1供給模式中,藉由將連接槽加壓用氣體供給管線18a與第1槽12a的閥19a打開,將槽加壓用氣體(例如氮氣)通過槽加壓用氣體供給管線18a導入到第1槽12a。然後,藉由進排氣機構18b將利用壓力計19c測得之測定值(第1槽12a內之壓力)調整成目標壓力。如此,第1槽12a內之第2液體會通過指定之第2配管13,並以預定的添加量添加至第1配管11內之第1液體。此外,此時下列閥均處於關閉狀態,亦即,連接槽加壓用氣體供給管線18a與第2槽12b的閥19b、藥液供給管線16的閥16a、藥液供給管線16與第1槽12a之間的閥15a、藥液供給管線16與第2槽12b之間的閥15b、第1槽12a之大氣閥17a、及第2槽12b之大氣閥17b均處於關閉狀態。又,第2槽12b處於儲存有少量第2液體的待機狀態。In the first supply mode, by opening the
藉由從第1槽12a供給第2液體到第1配管11,當第1槽12a內之液位低於預定的下限液位時,打開藥液供給管線16的閥16a,並打開第2槽12b的大氣閥17b。然後,打開藥液供給管線16與第2槽12b之間的閥15b,第2液體通過藥液供給管線16而供給至第2槽12b並儲存。然後,第2槽12b內之液位達到預定的上限液位時,關閉藥液供給管線16的閥16a、第2槽12b的大氣閥17b、及藥液供給管線16與第2槽12b之間的閥15b。之後,打開連接槽加壓用氣體供給管線18a與第2槽12b的閥19b,槽加壓用氣體通過槽加壓用氣體供給管線18a而導入到第2槽12b。此時,藉由進排氣機構18b將利用壓力計19c測得之測定值調整成目標壓力。亦即,於將第1槽12a內之壓力維持在已調整成之目標壓力的狀態,將第2槽12b內之壓力也調整成該目標壓力。第2槽12b內之壓力達到該目標壓力時,打開連接第2槽12b與第2配管13的閥14b,然後,關閉連接第1槽12a與第2配管13的閥14a。如此完成了由從第1槽12a供給第2液體之第1供給模式切換到從第2槽12b供給第2液體之第2供給模式的供給模式之切換。之後,關閉連接槽加壓用氣體供給管線18a與第1槽12a的閥19a,第1槽12a成為待機狀態,直到下一次為了第1供給模式而補充第2液體。By supplying the second liquid from the
該切換動作中,如上述般,從第2槽12b供給第2液體係在將第2槽12b內之壓力調整成與第1槽12a內之壓力一致之後進行。藉此,即使是剛從第1供給模式切換到第2供給模式時,也能以預定的添加量將第2槽12b內之第2液體添加到第1配管11內之第1液體。其結果,模式切換時可盡可能地抑制第2液體之添加量的變動,故,可盡可能地抑制製造之稀釋液的濃度變動。In this switching operation, as described above, the supply of the second liquid system from the
上述示例中,第2槽12b處於待機狀態時,大氣閥17b係處於關閉狀態。此係為了抑制氧進入到第2槽12b,並於之後補充第2液體到第2槽12b時抑制氧溶入到第2液體中。惟,當氧溶入第2槽12b中的第2液體並不會成為問題時,大氣閥17b可以不處於關閉狀態。又,在向第2槽12b補充第2液體時,並補充到槽內之氣體成分消失之程度的情況下,藉由將槽內之大氣從大氣閥17b排出,可減少氧溶入到第2液體中,故大氣閥17b可處於打開及關閉中之任意狀態。In the above example, when the
又,上述示例中,向第2槽12b補充第2液體係在第1供給模式即將結束前進行,但補充的時機不限於此。例如,可於剛切換成第1供給模式時等第1供給模式中之任意時機進行第2液體的補充。此時,第2液體為有揮發性的液體時,為了抑制第2液體的揮發,第2液體之補充後宜保持大氣閥17b關閉。In addition, in the above-mentioned example, the replenishment of the second liquid system to the
此外,於第1供給模式中,進行第2液體之供給直到第1槽12a用罄的話,第2配管中會有槽加壓用氣體積存,切換成下一次的第1供給模式時,該氣體會供給至第1配管,製造之稀釋液可能會發生濃度變動。因此,從第1供給模式切換成第2供給模式,宜如上述般於第1槽12a用罄前開始。In addition, in the first supply mode, if the supply of the second liquid is performed until the
本實施形態之稀釋液製造裝置10,在使用端1不需要稀釋液時等正常運轉之間隙,有時會轉換成暫時停止向第1配管11供給第1液體,並暫時停止稀釋液之製造的待機模式。此時,例如從第1供給模式轉換成待機模式時,據認為考慮安全面的話,已調整成目標壓力之第1槽12a內之壓力宜恢復成大氣壓。但,如此之減壓至大氣壓實際上就以下觀點而言為不佳。In the
亦即,若將第1槽12a內之壓力進行減壓而使其恢復到大氣壓的話,於高壓下溶解於第2液體之氣體成分會生成氣泡,而該氣泡會滯留在第2配管13內。因此,在正常運轉再開後,即使將第1槽12a再次加壓亦不會添加第2液體,且第1槽12a會成為過度加壓的狀態。之後,氣泡從第2配管13逸出,第2液體可再次添加至第1液體,但由於此時第2液體急劇地添加,會有無法良好地進行添加量調整,直到製造之稀釋液的濃度變得穩定需花費時間的情況。如此之氣泡所致之影響係本案發明人等首次發現的情事。That is, when the pressure in the
故,本實施形態之稀釋液製造裝置10中,即使例如從第1供給模式轉換成待機模式,第1槽12a內之壓力仍宜調整並保持在高於大氣壓的壓力。藉此,可抑制溶解於第2液體之氣體成分生成氣泡。其結果,第1供給模式再開後即可良好地進行第2液體的添加量調整。又,特別是第2液體為有揮發性的液體時,為了抑制第2液體的揮發並抑制濃度變動,處於待機模式之第1槽12a內的壓力宜比起大氣壓更高,並比起第2液體之飽和蒸氣壓更高較佳。惟,取決於第2液體與槽加壓用氣體之組合,正常運轉時槽加壓用氣體有時也會溶入到第2液體中。因此,如此之情形下,宜除了考慮第2液體之飽和蒸氣壓之外,也考慮槽加壓用氣體對於第2液體的溶解度,而決定處於待機模式之第1槽12a內的壓力。另一方面,考量正常運轉再開後可更迅速地再開良好的添加量調整,故即使處於待機模式,第1槽12a內之壓力亦可維持在與第1供給模式同樣已調整成目標壓力的狀態。如此之調整尤其適於第2液體為碳酸水、富氫水等使電解質、氣體溶解而得的水的情形。Therefore, in the
(第2實施形態) 圖2係本發明之第2實施形態之稀釋液製造裝置的概略構成圖。以下,關於與第1實施形態同樣的構成,圖式中附以相同的符號並省略其說明,僅對與第1實施形態不同的構成進行說明。(Second Embodiment) Fig. 2 is a schematic configuration diagram of a dilution liquid manufacturing apparatus according to a second embodiment of the present invention. Hereinafter, about the same structure as 1st Embodiment, the same code|symbol is attached|subjected to the drawing and the description is abbreviate|omitted, and only the structure different from 1st Embodiment is demonstrated.
本實施形態在變更第2槽12b之功能的方面與第1實施形態不同。具體而言,第2槽12b並非與第1槽12a並聯,而是藉由連接管線31與第1槽12a串聯連接。更具體而言,第2槽12b係以使第2槽12b內之第2液體藉由水頭壓供給至第1槽12a的方式和第1槽12a連接。因應上述而省略第1實施形態之閥14a、14b、15a、15b,多支第2配管13僅設置在第1槽12a與第1配管11之間,藥液供給管線16僅與第2槽12b連接。又,壓力計19c設置於第1槽12a,並在連接管線31設置閥31a、止回閥(圖中未顯示)。The present embodiment differs from the first embodiment in that the function of the
故,本實施形態中,第2槽12b係作為暫時儲存待補充到第1槽12a之第2液體的暫時儲存槽而發揮功能。亦即,製造稀釋液之正常運轉時,根據第1槽12a之液位,從第2槽12b適當補充第2液體到第1槽12a,其結果,可從第1槽12a持續地供給第2液體到第1配管11。藉此,可持續且穩定地進行稀釋液之製造,而不需要槽的更換作業,且無需停止裝置的運轉。以下,針對該補充動作進行說明。Therefore, in the present embodiment, the
正常運轉時,槽加壓用氣體(例如氮氣)通過槽加壓用氣體供給管線18a導入到第1槽12a,藉由進排氣機構18b將利用壓力計19c測得之測定值(第1槽12a內之壓力)調整成目標壓力。如此,第1槽12a內之第2液體會以預定的添加量通過指定之第2配管13並添加至第1配管11內之第1液體。此外,此時下列閥均處於關閉狀態,亦即,連接槽加壓用氣體供給管線18a與第2槽12b的閥19b、藥液供給管線16的閥16a、第2槽12b的大氣閥17b、及連接管線31的閥31a均處於關閉狀態。惟,此時的第2槽12b之大氣閥17b的狀態,與第1實施形態同樣不限於關閉狀態,也可視需要為打開的狀態。During normal operation, the tank pressurizing gas (for example, nitrogen gas) is introduced into the
藉由從第1槽12a供給第2液體到第1配管11,當第1槽12a內之液位低於預定的下限液位時,打開第2槽12b的大氣閥17b。然後,打開藥液供給管線16的閥16a,第2液體通過藥液供給管線16供給至第2槽12b並儲存。然後,當第2槽12b內之液位達到預定的上限液位時,關閉藥液供給管線16的閥16a,並關閉第2槽12b的大氣閥17b。之後,打開連接槽加壓用氣體供給管線18a與第2槽12b的閥19b,槽加壓用氣體通過槽加壓用氣體供給管線18a導入到第2槽12b。此時,藉由進排氣機構18b將利用壓力計19c測得之測定值調整成目標壓力。亦即,於將第1槽12a內之壓力維持在已調整成之目標壓力的狀態,將第2槽12b內之壓力也調整成該目標壓力。第2槽12b內之壓力達到該目標壓力時,打開連接管線31的閥31a,藉由水頭壓將第2液體從第2槽12b輸送至第1槽12a。第2液體的輸送結束時,關閉連接管線31的閥31a,第2槽12b成為待機狀態直到下一次的補充動作。By supplying the second liquid from the
該補充動作中,如上述般,從第2槽12b輸送第2液體到第1槽12a,係在將第2槽12b內之壓力調整成與第1槽12a內之壓力一致之後進行。藉此,藉由水頭壓將第2液體從第2槽12b輸送到第1槽12a時,可盡可能地抑制第1槽12a的壓力變動,並能盡可能地抑制製造之稀釋液的濃度變動。此外,為了使第2液體藉由水頭壓確實地輸送到第1槽12a,第2槽12b的底面宜在比起第1槽12a之頂面更高的位置。In this replenishment operation, as described above, the transfer of the second liquid from the
上述示例中,第2液體儲存到第2槽12b係在第1槽12a內之液位低於預定下限液位之時點開始,但不限於該時機,可在任意時機進行。此時,第2液體為有揮發性的液體時,為了抑制第2液體的揮發,特佳為於第2液體之補充後大氣閥17b保持關閉。同樣,從第2槽12b輸送第2液體到第1槽12a也可在第2液體儲存於第2槽12b之後的任意時機進行。惟,進行第2液體之供給直到第1槽12a用罄的話,第2配管中會有槽加壓用氣體積存,該氣體會供給至第1配管,而製造之稀釋液可能會發生濃度變動。因此,為了從第1槽12a持續地供給第2液體,至少宜於上述時機開始從第2槽12b輸送第2液體到第1槽12a,亦即在第1槽12a用罄前開始。 [實施例]In the above example, the second liquid is stored until the liquid level in the
然後,參照圖3所示之流程圖,針對對應於上述第2實施形態的實施例進行說明。圖3的流程圖中,與圖2所示之符號相同的符號,係表示與第2實施形態同樣的構成。Next, an example corresponding to the second embodiment described above will be described with reference to the flowchart shown in FIG. 3 . In the flowchart of FIG. 3, the same reference numerals as those shown in FIG. 2 denote the same configuration as that of the second embodiment.
(實施例1) 本實施例中,使用圖3所示之構成的稀釋液製造裝置10製造稀氨水作為稀釋液,並測定該稀氨水的導電率。(Example 1) In this example, dilute ammonia water was produced as a diluent using the
第2配管13係使用內徑及長度中之至少一者不同的5支ETFE製管A~E(管A、B:品號「7009」,管C~E:品號「7010」,均為Flom公司製)。各管A~E的內徑及長度如下。 管A 內徑:0.2mm、長度:3m 管B 內徑:0.2mm、長度:1m 管C 內徑:0.3mm、長度:1m 管D 內徑:0.3mm、長度:0.5m 管E 內徑:0.3mm、長度:0.3mThe
又,第1配管11、第1槽12a、及第2槽12b係分別使用PFA製者。In addition, the
使用電阻率值為18MΩ・cm以上,總有機碳(TOC)為1.0ppb以下之超純水作為第1液體,對於第1配管11以流量40L/min、水壓0.35MPa進行通水。使用29wt%的氨水(電子工業用,關東化學(股)製)作為第2液體,使用氮氣作為導入到第1槽12a的槽加壓用氣體。Ultrapure water with a resistivity value of 18 MΩ・cm or more and a total organic carbon (TOC) of 1.0 ppb or less was used as the first liquid, and water was passed through the
對於各個管A~E,使用導電率計(品號「M300」,METTLER TOLEDO公司製)測定使第1槽12a內之壓力變化,並使添加至超純水中之氨水的添加量改變時的稀氨水之導電率。圖4係顯示此時之測定結果的圖表,橫軸表示添加至超純水中的氨水量,縱軸表示獲得之稀釋液(稀氨水)的導電率。For each of the tubes A to E, a conductivity meter (product number "M300", manufactured by METTLER TOLEDO Co., Ltd.) was used to measure the pressure when the pressure in the
氨水為弱鹼,在低濃度區域,導電率相對於添加量的變化大,但在高濃度區域導,電率相對於添加量的變化變得遲緩。因此,管A中之氨水的最小添加量及此時的稀釋液之導電率分別為0.015mL/min及1.2μS/cm,反觀管E中之氨水的最大添加量及此時的稀釋液之導電率分別為8.18mL/min及62.1μS/cm。亦即,為了將稀釋液之導電率從1.2μS/cm(管A)到62.1μS/cm(管E)提高約50倍,需使氨水的添加量從0.015mL/min(管A)到8.18mL/min(管E)變化約545倍。由圖4之圖表亦可知,藉由使用內徑及長度中之至少一者不同的5支管,可對應於如此之氨水之添加量的調整範圍,且確認到可連續地製造寬廣濃度範圍的稀氨水。Ammonia water is a weak base, and in a low concentration region, the change in conductivity with respect to the addition amount is large, but in a high concentration region, the change in conductivity with respect to the addition amount becomes slow. Therefore, the minimum addition amount of ammonia water in tube A and the conductivity of the diluent at this time are 0.015 mL/min and 1.2 μS/cm, respectively. In contrast, the maximum addition amount of ammonia water in tube E and the conductivity of the diluent at this time are The rates were 8.18 mL/min and 62.1 μS/cm, respectively. That is, in order to increase the conductivity of the diluent from 1.2 μS/cm (tube A) to 62.1 μS/cm (tube E) by about 50 times, the amount of ammonia added needs to be changed from 0.015 mL/min (tube A) to 8.18 The mL/min (tube E) changed approximately 545-fold. As can be seen from the graph of FIG. 4 , by using five pipes different in at least one of the inner diameter and the length, it is possible to correspond to the adjustment range of the addition amount of ammonia water as described above, and it has been confirmed that dilute products with a wide concentration range can be produced continuously. ammonia.
(實施例2) 本實施例中使用圖3所示之構成的稀釋液製造裝置10,並將作為第1液體之超純水以水壓0.16MPa通入到第1配管11,除此之外,以和實施例1同樣之條件製造稀氨水。然後,暫時停止第1液體之供給,亦即,暫時停止稀釋液之製造,測定其前後的稀氨水之導電率。此外,將超純水及氨水的溫度調整成23℃,稀釋液之導電率的目標值設定為40μS/cm。此時的測定結果(第1液體之流量、第1槽內之壓力、及稀氨水之導電率之時間變化)顯示於圖5A。此外,圖5B中亦顯示暫時停止第1液體之供給時第1槽12a內之壓力恢復到大氣壓之情形的測定結果作為比較例。(Example 2) In this example, the
本實施例中,如圖5A所示般可確認到:即使在第1液體之供給再開後(正常運轉再開後),仍可良好地調整稀釋液之導電率。另一方面,在比較例中,如圖5B所示般,暫時停止第1液體之供給時,由於第1槽12a內之壓力恢復到大氣壓,儘管正常運轉再開後使第1槽12a內之壓力比以前更高,仍無法良好地進行稀釋液之導電率的調整。據認為其原因為:本實施例中暫時停止第1液體之供給時,由於第1槽12a內之壓力保持在高於大氣壓的壓力,可抑制氣泡的生成。In this example, as shown in FIG. 5A , it was confirmed that even after the supply of the first liquid was restarted (after the normal operation was restarted), the conductivity of the diluent could be well adjusted. On the other hand, in the comparative example, as shown in FIG. 5B, when the supply of the first liquid is temporarily stopped, the pressure in the
1‧‧‧使用端10‧‧‧稀釋液製造裝置11‧‧‧第1配管12a‧‧‧第1槽12b‧‧‧第2槽13‧‧‧第2配管13a‧‧‧閥14a、14b‧‧‧閥15a、15b‧‧‧閥16‧‧‧藥液供給管線(液體供給手段)16a‧‧‧閥17a、17b‧‧‧大氣閥18‧‧‧壓力調整部18a‧‧‧槽加壓用氣體供給管線18b‧‧‧進排氣機構18c‧‧‧進氣閥18d‧‧‧排氣閥19a、19b‧‧‧閥19c‧‧‧壓力計20‧‧‧控制部21‧‧‧流量測定手段22‧‧‧濃度測定手段23‧‧‧壓力測定手段31‧‧‧連接管線31a‧‧‧閥F2、F3‧‧‧過濾器1‧‧‧Use
[圖1]係本發明之第1實施形態之稀釋液製造裝置的概略構成圖。 [圖2]係本發明之第2實施形態之稀釋液製造裝置的概略構成圖。 [圖3]係本發明之一實施例之稀釋液製造裝置的流程圖。 [圖4]係將實施例1中之稀氨水之導電率相對於氨水之添加量作圖而得的圖表。 [圖5A]係顯示實施例2中之第1液體之流量、第1槽內之壓力、及稀氨水之導電率之時間變化的圖表。 [圖5B]係顯示比較例中之第1液體之流量、第1槽內之壓力、及稀氨水之導電率之時間變化的圖表。Fig. 1 is a schematic configuration diagram of a dilution liquid manufacturing apparatus according to a first embodiment of the present invention. [ Fig. 2] Fig. 2 is a schematic configuration diagram of an apparatus for producing a diluent according to a second embodiment of the present invention. Fig. 3 is a flow chart of an apparatus for producing a diluent according to an embodiment of the present invention. Fig. 4 is a graph obtained by plotting the conductivity of the diluted ammonia water in Example 1 with respect to the addition amount of the ammonia water. 5A is a graph showing time changes of the flow rate of the first liquid, the pressure in the first tank, and the conductivity of dilute ammonia water in Example 2. FIG. [ Fig. 5B ] is a graph showing temporal changes in the flow rate of the first liquid, the pressure in the first tank, and the conductivity of the dilute ammonia water in the comparative example.
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| JP2016254938A JP6777533B2 (en) | 2016-12-28 | 2016-12-28 | Diluting solution manufacturing equipment and diluent manufacturing method |
| JP2016254940A JP6738726B2 (en) | 2016-12-28 | 2016-12-28 | Diluting liquid manufacturing apparatus and diluting liquid manufacturing method |
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| TW352451B (en) * | 1996-12-23 | 1999-02-11 | Samsung Electron Co Ltd | Automatic thinner supplying apparatus and method for semiconductor manufacturing process |
| TW392238B (en) * | 1997-08-21 | 2000-06-01 | Fujitsu Ltd | Apparatus and method for supplying chemicals |
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