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TWI758930B - Ultrasonic sensor - Google Patents

Ultrasonic sensor Download PDF

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TWI758930B
TWI758930B TW109138162A TW109138162A TWI758930B TW I758930 B TWI758930 B TW I758930B TW 109138162 A TW109138162 A TW 109138162A TW 109138162 A TW109138162 A TW 109138162A TW I758930 B TWI758930 B TW I758930B
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ultrasonic
sensing
transducer
ultrasonic transducer
waves
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TW109138162A
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TW202136984A (en
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王地寶
范成至
周正三
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神盾股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/10—Number of transducers
    • G01N2291/105—Number of transducers two or more emitters, two or more receivers

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  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Acoustics & Sound (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Image Input (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Abstract

An ultrasonic sensor is provided. The ultrasonic sensor includes a sensing array. The sensing array includes a plurality of sensing units arranged in an array. Each of the plurality of sensing units includes a first ultrasonic transducer and a second ultrasonic transducer. The first ultrasonic transducer transmits and senses ultrasonic waves. The second ultrasonic transducer receives reflected ultrasonic waves corresponding to the ultrasonic waves. The first ultrasonic transducer and the second ultrasonic transducer are arranged in parallel on a plane. The first ultrasonic transducer and the second ultrasonic transducer have the same central axis perpendicular to the plane.

Description

超聲波感測器Ultrasonic sensor

本發明是有關於一種感測器，且特別是有關於一種超聲波感測器。The present invention relates to a sensor, and in particular to an ultrasonic sensor.

目前已知的超聲波指紋掃描原理中，大多單獨採用壓電式微加工超音波換能器(Piezoelectric Micromachined Ultrasonic Transducer，PMUT)架構來發射與接收超聲波。對此，傳統的超聲波感測技術由於具有超聲波信號強度不足，因此存在較難穿透較硬、較厚或多層固體結構的問題，或者是由PMUT架構的多個PMUT所發射的超聲波存在容易發散的缺點，而導致反射聲波具有低訊號雜訊比(Signal Noise Ratio，SNR)以及影像對比度不佳的問題。In the currently known ultrasonic fingerprint scanning principles, most of the piezoelectric micromachined ultrasonic transducers (Piezoelectric Micromachined Ultrasonic Transducer, PMUT) architecture are used alone to transmit and receive ultrasonic waves. In this regard, the traditional ultrasonic sensing technology has the problem of insufficient ultrasonic signal strength, so it is difficult to penetrate hard, thick or multi-layer solid structures, or the ultrasonic waves emitted by multiple PMUTs in the PMUT architecture are prone to divergence. As a result, the reflected sound waves have low signal-to-noise ratio (SNR) and poor image contrast.

有鑑於此，本發明提供一種超聲波感測器可具有良好的超聲指紋回聲信號品質。In view of this, the present invention provides an ultrasonic sensor with good echo signal quality of ultrasonic fingerprints.

本發明的超聲波感測器包括感測陣列。感測陣列包括陣列排列的多個感測單元，其中該些感測單元的各別包括第一超聲波換能器以及第二超聲波換能器。第一超聲波換能器用以發射感測超聲波。第二超聲波換能器用以接收對應於超聲波的反射超聲波。第一超聲波換能器與第二超聲波換能器平行設置於平面。第一超聲波換能器與第二超聲波換能器具有垂直於平面的相同中心軸。The ultrasonic sensor of the present invention includes a sensing array. The sensing array includes a plurality of sensing units arranged in an array, wherein each of the sensing units includes a first ultrasonic transducer and a second ultrasonic transducer. The first ultrasonic transducer is used to transmit and sense ultrasonic waves. The second ultrasonic transducer is used for receiving reflected ultrasonic waves corresponding to the ultrasonic waves. The first ultrasonic transducer and the second ultrasonic transducer are arranged parallel to the plane. The first ultrasonic transducer and the second ultrasonic transducer have the same central axis perpendicular to the plane.

基於上述，本發明的超聲波感測器可通過在超聲波感測器當中的陣列排列且設置於同一平面的多個感測單元來發射及接收超聲波，以使超聲波感測器可感測具有良好的超聲指紋回聲信號品質的反射超聲波。Based on the above, the ultrasonic sensor of the present invention can transmit and receive ultrasonic waves through a plurality of sensing units arranged in an array in the ultrasonic sensor and disposed on the same plane, so that the ultrasonic sensor can sense a good Ultrasonic fingerprint echo signal quality of reflected ultrasonic waves.

為讓本揭露的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present disclosure more obvious and easy to understand, the following embodiments are given and described in detail in conjunction with the accompanying drawings as follows.

為了使本揭露之內容可以被更容易明瞭，以下特舉實施例做為本揭露確實能夠據以實施的範例。另外，凡可能之處，在圖式及實施方式中使用相同標號的元件/構件/步驟，係代表相同或類似部件。In order to make the content of the present disclosure more comprehensible, the following specific embodiments are taken as examples by which the present disclosure can indeed be implemented. Additionally, where possible, elements/components/steps using the same reference numerals in the drawings and embodiments represent the same or similar parts.

圖1是本發明的一實施例的超聲波感測器的示意圖。參考圖1，超聲波感測器100包括感測陣列110以及集成電路120。感測陣列110包括陣列排列的多個感測單元，並且集成電路120耦接感測陣列110的所述多個感測單元。集成電路120可用於驅動所述多個感測單元，並接收所述多個感測單元的感測結果。在本實施例中，集成電路120可例如包括本發明各實施例所提到的驅動電路、感測電路、延遲電路及影像合成電路的至少其中之一，但本發明並不限於此。在一實施例中，集成電路120可包括可程式設計的一般用途或特殊用途的微處理器(microprocessor)、數位訊號處理器(digital signal processor，DSP)、可程式設計控制器、專用積體電路(application specific integrated circuit，ASIC)、圖形處理器(graphics processing unit，GPU)或其他類似元件或上述元件的組合且可用於實現本發明的相關功能電路。FIG. 1 is a schematic diagram of an ultrasonic sensor according to an embodiment of the present invention. Referring to FIG. 1 , an ultrasonic sensor 100 includes a sensing array 110 and an integrated circuit 120 . The sensing array 110 includes a plurality of sensing units arranged in an array, and the integrated circuit 120 is coupled to the plurality of sensing units of the sensing array 110 . The integrated circuit 120 may be used to drive the plurality of sensing units and receive sensing results of the plurality of sensing units. In this embodiment, the integrated circuit 120 may include, for example, at least one of the driving circuit, the sensing circuit, the delay circuit and the image synthesis circuit mentioned in the embodiments of the present invention, but the present invention is not limited thereto. In one embodiment, the integrated circuit 120 may include a programmable general-purpose or special-purpose microprocessor (microprocessor), a digital signal processor (DSP), a programmable controller, a dedicated integrated circuit An application specific integrated circuit (ASIC), a graphics processing unit (GPU), or other similar elements or a combination of the above elements can be used to implement the relevant functional circuits of the present invention.

圖2是本發明的一實施例的感測單元的俯視示意圖。參考圖2，圖1的感測陣列110中的每一個感測單元的俯視結構可如圖2所示的感測單元210。在本實施例中，感測單元210包括超聲波換能器211、212。在本實施例中，超聲波換能器211、212可為電容式超音波微換能器(Capacitive Micromachined Ultrasonic Transducer，CMUT)，但本發明並不限於此。在本實施例中，超聲波換能器211、212平行設置於如沿著方向D1、D2延伸所形成的平面，其中方向D1、D2、D3彼此垂直。超聲波換能器211、212具有垂直於所述平面的相同中心軸210C。在本實施例中，超聲波換能器211為環形，並且超聲波換能器211在所述平面上環繞超聲波換能器212來設置。值得注意的是，在本實施例中，超聲波換能器211可用以發射感測超聲波，並且超聲波換能器212可用以接收對應於超聲波的反射超聲波。然而，在一實施例中，超聲波換能器212也可用以發射感測超聲波，並且超聲波換能器211也可用以接收對應於超聲波的反射超聲波。FIG. 2 is a schematic top view of a sensing unit according to an embodiment of the present invention. Referring to FIG. 2 , the top-view structure of each sensing unit in the sensing array 110 of FIG. 1 may be the sensing unit 210 shown in FIG. 2 . In this embodiment, the sensing unit 210 includes ultrasonic transducers 211 and 212 . In this embodiment, the ultrasonic transducers 211 and 212 may be capacitive ultrasonic microtransducers (Capacitive Micromachined Ultrasonic Transducer, CMUT), but the present invention is not limited thereto. In the present embodiment, the ultrasonic transducers 211, 212 are arranged in parallel on a plane formed by extending along the directions D1, D2, wherein the directions D1, D2, D3 are perpendicular to each other. The ultrasonic transducers 211, 212 have the same central axis 210C perpendicular to the plane. In this embodiment, the ultrasonic transducer 211 is annular, and the ultrasonic transducer 211 is arranged around the ultrasonic transducer 212 on the plane. It is worth noting that, in this embodiment, the ultrasonic transducer 211 can be used to transmit sensing ultrasonic waves, and the ultrasonic transducer 212 can be used to receive reflected ultrasonic waves corresponding to the ultrasonic waves. However, in one embodiment, the ultrasonic transducer 212 may also be used to transmit sensing ultrasonic waves, and the ultrasonic transducer 211 may also be used to receive reflected ultrasonic waves corresponding to the ultrasonic waves.

圖3是本發明的一實施例的感測單元的側視剖面示意圖。參考圖2及圖3，圖3為圖2的感測單元210的側視剖面圖。在本實施例中，基板220上形成支撐層230，並且感測單元210形成於支撐層230當中。在本實施例中，超聲波換能器211包括金屬層2111、2112，並且金屬層2111、2112之間包括介電層2113以及腔體2114，其中腔體2114可包括介質材料，或為具有空氣或為真空的空腔體結構。金屬層2111、2112作為電極，並且可耦接驅動電路或感測電路。在本實施例中，超聲波換能器212包括金屬層2121、2122，並且金屬層2121、2122之間包括介電層2123以及腔體2124，其中腔體2124可包括介質材料或為空腔。金屬層2121、2122作為電極，並且可耦接驅動電路或感測電路。舉例而言，在一實施例中，腔體2114、2124的至少其中之一可填充滿所述介質材料，並且所述介質材料可為軟性材料。在另一實施例中，上述的介質材料可為聚合物(Polymer)材料。3 is a schematic cross-sectional side view of a sensing unit according to an embodiment of the present invention. Referring to FIGS. 2 and 3 , FIG. 3 is a side cross-sectional view of the sensing unit 210 of FIG. 2 . In this embodiment, the support layer 230 is formed on the substrate 220 , and the sensing unit 210 is formed in the support layer 230 . In this embodiment, the ultrasonic transducer 211 includes metal layers 2111 and 2112, and a dielectric layer 2113 and a cavity 2114 are included between the metal layers 2111 and 2112, wherein the cavity 2114 may include a dielectric material, or be made of air or It is a vacuum hollow body structure. The metal layers 2111 and 2112 serve as electrodes, and can be coupled to a driving circuit or a sensing circuit. In this embodiment, the ultrasonic transducer 212 includes metal layers 2121 and 2122, and between the metal layers 2121 and 2122 includes a dielectric layer 2123 and a cavity 2124, wherein the cavity 2124 may include a dielectric material or be a cavity. The metal layers 2121 and 2122 serve as electrodes, and can be coupled to a driving circuit or a sensing circuit. For example, in one embodiment, at least one of the cavities 2114 and 2124 can be filled with the dielectric material, and the dielectric material can be a soft material. In another embodiment, the above-mentioned dielectric material may be a polymer material.

在本實施例中，金屬層2111、2112、2121、2122可例如是鋁(Al)、鎳(Ni)、鈦(Ti)、銅(Cu)或銀(Ag)等材料。介電層2113、2123可例如是二氧化矽(Silicon Dioxide)、氧化鋁(Aluminum Oxide)或氮化矽(Silicon Nitride)等介電半導體材料。腔體2114、2124的間隙可例如介於0.03微米(um)至1.5微米之間。In this embodiment, the metal layers 2111 , 2112 , 2121 , and 2122 may be, for example, materials such as aluminum (Al), nickel (Ni), titanium (Ti), copper (Cu), or silver (Ag). The dielectric layers 2113 and 2123 can be, for example, dielectric semiconductor materials such as silicon dioxide (Silicon Dioxide), aluminum oxide (Aluminum Oxide) or silicon nitride (Silicon Nitride). The gap of the cavities 2114, 2124 may be, for example, between 0.03 micrometers (um) to 1.5 micrometers.

圖4是本發明的第一實施例的超聲波感測器的操作示意圖。圖5A是本發明的第一實施例的超聲波感測器的發射電路圖。圖5B是本發明的第一實施例的超聲波感測器的接收電路圖。參考圖4，在本實施例中，超聲波感測器400包括基板420、支撐層430、黏合層440以及面板450，其中面板450可為透光面板或非透光面板，例如玻璃、顯示面板或一般板材等。在本實施例中，超聲波感測器400例如包括感測單元431~437，其中感測單元431~437的每一個可如上述圖2、3的感測單元210。FIG. 4 is a schematic view of the operation of the ultrasonic sensor according to the first embodiment of the present invention. 5A is a transmission circuit diagram of the ultrasonic sensor according to the first embodiment of the present invention. 5B is a receiving circuit diagram of the ultrasonic sensor according to the first embodiment of the present invention. Referring to FIG. 4 , in this embodiment, the ultrasonic sensor 400 includes a substrate 420 , a support layer 430 , an adhesive layer 440 and a panel 450 , wherein the panel 450 can be a translucent panel or a non-transparent panel, such as glass, a display panel or General plates, etc. In this embodiment, the ultrasonic sensor 400 includes, for example, sensing units 431 - 437 , wherein each of the sensing units 431 - 437 can be the same as the sensing unit 210 in FIGS. 2 and 3 .

參考圖4及圖5A，超聲波感測器400還包括驅動電路460，其中驅動電路460例如設置於上述圖1實施例所述的集成電路120當中，但本發明並不限於此。在本實施例中，驅動電路460是以並聯的方式耦接至感測單元431~437的超聲波換能器431T~437T，以輸出驅動信號至超聲波換能器431T~437T。感測單元431~437的超聲波換能器431T~437T依據驅動信號同時發射多個感測超聲波，其中所述多個感測超聲波可為多個球面波。所述多個感測超聲波形成平面波。所述平面波經由支撐層430、黏合層440以及面板450傳遞至感測目標401的表面，以使感測目標401的表面產生反射超聲波。所述反射超聲波經由面板450、黏合層440以及支撐層430回傳至感測單元431~437。感測目標401可為手指，並且感測目標401的表面可具有指紋紋路。Referring to FIG. 4 and FIG. 5A , the ultrasonic sensor 400 further includes a driving circuit 460 , wherein the driving circuit 460 is, for example, disposed in the integrated circuit 120 described in the above-mentioned embodiment of FIG. 1 , but the present invention is not limited thereto. In this embodiment, the driving circuit 460 is coupled to the ultrasonic transducers 431T-437T of the sensing units 431-437 in parallel to output driving signals to the ultrasonic transducers 431T-437T. The ultrasonic transducers 431T to 437T of the sensing units 431 to 437 simultaneously transmit a plurality of sensing ultrasonic waves according to the driving signal, wherein the plurality of sensing ultrasonic waves can be a plurality of spherical waves. The plurality of sensed ultrasonic waves form plane waves. The plane wave is transmitted to the surface of the sensing target 401 through the support layer 430 , the adhesive layer 440 and the panel 450 , so that the surface of the sensing target 401 generates reflected ultrasonic waves. The reflected ultrasonic waves are transmitted back to the sensing units 431 to 437 through the panel 450 , the adhesive layer 440 and the support layer 430 . The sensing target 401 may be a finger, and the surface of the sensing target 401 may have fingerprint patterns.

在本實施例中，超聲波換能器431T~437T可例如是圖2的超聲波換能器211及超聲波換能器212的其中之一。值得注意的是，本實施例的感測單元431~437的超聲波換能器431T~437T可發射具有第一頻率的感測超聲波(中低頻機械彈性波)，其中第一頻率可例如為5~50兆赫(MHz)。In this embodiment, the ultrasonic transducers 431T to 437T may be, for example, one of the ultrasonic transducers 211 and 212 of FIG. 2 . It is worth noting that the ultrasonic transducers 431T to 437T of the sensing units 431 to 437 of this embodiment can emit sensing ultrasonic waves (medium and low frequency mechanical elastic waves) having a first frequency, wherein the first frequency can be, for example, 5 to 5 50 megahertz (MHz).

參考圖4及圖5B超聲波感測器400還包括感測電路481~487以及影像合成電路470，其中感測電路481~487以及影像合成電路470例如設置於上述圖1實施例所述的集成電路120當中，但本發明並不限於此。在本實施例中，感測電路481~487一對一地耦接至感測單元431~437的超聲波換能器431R~437R。超聲波換能器431R~437R用於接收上述的反射超聲波，並且感測電路481~487感測超聲波換能器431R~437R，而輸出多個感測信號至影像合成電路470。感測電路481~487分別耦接至影像合成電路470。影像合成電路470依據所述多個感測信號來產生感測影像(指紋影像)。在本實施例中，超聲波換能器431R~437R可例如是圖2的超聲波換能器211及超聲波換能器212的其中之另一。值得注意的是，本實施例的感測單元431~437的超聲波換能器431R~437R可例如接收具有第一頻率的一倍頻或兩倍頻的反射超聲波。Referring to FIGS. 4 and 5B , the ultrasonic sensor 400 further includes sensing circuits 481 to 487 and an image synthesis circuit 470 , wherein the sensing circuits 481 to 487 and the image synthesis circuit 470 are, for example, disposed in the integrated circuit described in the above-mentioned embodiment of FIG. 1 . 120, but the present invention is not limited to this. In this embodiment, the sensing circuits 481 ˜ 487 are coupled to the ultrasonic transducers 431R ˜ 437R of the sensing units 431 ˜ 437 one-to-one. The ultrasonic transducers 431R to 437R are used for receiving the above-mentioned reflected ultrasonic waves, and the sensing circuits 481 to 487 sense the ultrasonic transducers 431R to 437R to output a plurality of sensing signals to the image synthesis circuit 470 . The sensing circuits 481 - 487 are respectively coupled to the image synthesis circuit 470 . The image synthesis circuit 470 generates a sensing image (fingerprint image) according to the plurality of sensing signals. In this embodiment, the ultrasonic transducers 431R to 437R may be, for example, the other of the ultrasonic transducers 211 and 212 in FIG. 2 . It is worth noting that, the ultrasonic transducers 431R to 437R of the sensing units 431 to 437 of the present embodiment can receive, for example, reflected ultrasonic waves having one frequency or two times the first frequency.

圖6是本發明的第二實施例的超聲波感測器的操作示意圖。圖7A是本發明的第二實施例的超聲波感測器的發射電路圖。圖7B是本發明的第二實施例的超聲波感測器的接收電路圖。參考圖6，在本實施例中，超聲波感測器600包括基板620、支撐層630、黏合層640以及面板650，其中面板650可為透光面板或非透光面板，例如玻璃、顯示面板或一般板材等。在本實施例中，超聲波感測器600例如包括感測單元631~635，其中感測單元631~635的每一個可如上述圖2、3的感測單元210。6 is a schematic view of the operation of the ultrasonic sensor according to the second embodiment of the present invention. FIG. 7A is a transmission circuit diagram of the ultrasonic sensor according to the second embodiment of the present invention. 7B is a receiving circuit diagram of the ultrasonic sensor according to the second embodiment of the present invention. Referring to FIG. 6 , in this embodiment, the ultrasonic sensor 600 includes a substrate 620 , a support layer 630 , an adhesive layer 640 and a panel 650 , wherein the panel 650 can be a translucent panel or a non-transparent panel, such as glass, a display panel or General plates, etc. In this embodiment, the ultrasonic sensor 600 includes, for example, sensing units 631 - 635 , wherein each of the sensing units 631 - 635 can be the same as the sensing unit 210 in FIGS. 2 and 3 .

參考圖6及圖7A，超聲波感測器600還包括延遲電路661~665、驅動電路660，其中延遲電路661~665及驅動電路660例如設置於上述圖1實施例所述的集成電路120當中，但本發明並不限於此。在本實施例中，驅動電路660是以並聯的方式耦接至感測單元631~635的超聲波換能器631T~635T，並且延遲電路661~665一對一地分別與超聲波換能器631T~635T串聯耦接。因此，驅動電路660輸出驅動信號至延遲電路661~665，以使延遲電路661~665提供具有不同相位延遲的多個驅動信號至超聲波換能器631T~635T。感測單元631~635的超聲波換能器631T~635T依據具有不同相位延遲的所述多個驅動信號發射具有不同相位延遲的多個感測超聲波，其中所述多個感測超聲波可為多個球面波。具有不同相位延遲的所述多個感測超聲波可形成聚焦波。所述聚焦波經由支撐層630、黏合層640以及面板650傳遞至感測目標601的表面，以使感測目標601的表面產生反射超聲波。所述反射超聲波經由面板650、黏合層640以及支撐層630回傳至感測單元631~635。感測目標601可為手指，並且感測目標601的表面可具有指紋紋路。6 and 7A, the ultrasonic sensor 600 further includes delay circuits 661-665 and a driving circuit 660, wherein the delay circuits 661-665 and the driving circuit 660 are, for example, disposed in the integrated circuit 120 described in the above-mentioned embodiment of FIG. 1, However, the present invention is not limited to this. In this embodiment, the driving circuit 660 is coupled to the ultrasonic transducers 631T~635T of the sensing units 631~635 in parallel, and the delay circuits 661~665 are respectively connected to the ultrasonic transducers 631T~ 635T coupled in series. Therefore, the driving circuit 660 outputs the driving signals to the delay circuits 661 - 665 , so that the delay circuits 661 - 665 provide a plurality of driving signals with different phase delays to the ultrasonic transducers 631T - 635T. The ultrasonic transducers 631T to 635T of the sensing units 631 to 635 transmit a plurality of sensing ultrasonic waves having different phase delays according to the plurality of driving signals having different phase delays, wherein the plurality of sensing ultrasonic waves may be a plurality of spherical wave. The plurality of sensed ultrasonic waves with different phase delays may form focused waves. The focused wave is transmitted to the surface of the sensing target 601 through the support layer 630 , the adhesive layer 640 and the panel 650 , so that the surface of the sensing target 601 generates reflected ultrasonic waves. The reflected ultrasonic waves are transmitted back to the sensing units 631 to 635 through the panel 650 , the adhesive layer 640 and the support layer 630 . The sensing target 601 may be a finger, and the surface of the sensing target 601 may have fingerprint patterns.

在本實施例中，超聲波換能器631T~635T可例如是圖2的超聲波換能器211及超聲波換能器212的其中之一。值得注意的是，本實施例的感測單元631~635的超聲波換能器631T~635T可例如發射具有第一頻率的感測超聲波(中低頻機械彈性波)，其中第一頻率可例如為5~50兆赫。In this embodiment, the ultrasonic transducers 631T˜635T may be, for example, one of the ultrasonic transducers 211 and 212 of FIG. 2 . It is worth noting that the ultrasonic transducers 631T to 635T of the sensing units 631 to 635 of this embodiment can, for example, emit sensing ultrasonic waves (medium and low frequency mechanical elastic waves) with a first frequency, wherein the first frequency can be, for example, 5 ~50 MHz.

參考圖6及圖7B超聲波感測器600還包括感測電路681~685以及影像合成電路670，其中感測電路681~685以及影像合成電路670例如設置於上述圖1實施例所述的集成電路120當中，但本發明並不限於此。在本實施例中，感測電路681~685一對一地耦接至感測單元631~635的超聲波換能器631R~635R。超聲波換能器631R~635R用於接收上述的反射超聲波，並且感測電路681~685感測超聲波換能器631R~635R，而輸出多個感測信號至影像合成電路670。感測電路681~685分別耦接至影像合成電路670。影像合成電路670依據所述多個感測信號來產生感測影像(指紋影像)。在本實施例中，超聲波換能器631R~635R可例如是圖2的超聲波換能器211及超聲波換能器212的其中之另一。值得注意的是，本實施例的感測單元631~635的超聲波換能器631R~635R可接收具有第一頻率的一倍頻或兩倍頻的反射超聲波。Referring to FIG. 6 and FIG. 7B , the ultrasonic sensor 600 further includes sensing circuits 681 - 685 and an image synthesis circuit 670 , wherein the sensing circuits 681 - 685 and the image synthesis circuit 670 are disposed in the integrated circuit described in the above-mentioned embodiment of FIG. 1 , for example. 120, but the present invention is not limited to this. In this embodiment, the sensing circuits 681 ˜ 685 are coupled to the ultrasonic transducers 631R ˜ 635R of the sensing units 631 ˜ 635 one-to-one. The ultrasonic transducers 631R to 635R are used to receive the above-mentioned reflected ultrasonic waves, and the sensing circuits 681 to 685 sense the ultrasonic transducers 631R to 635R to output a plurality of sensing signals to the image synthesis circuit 670 . The sensing circuits 681 - 685 are respectively coupled to the image synthesis circuit 670 . The image synthesis circuit 670 generates a sensing image (fingerprint image) according to the plurality of sensing signals. In this embodiment, the ultrasonic transducers 631R to 635R can be, for example, the other of the ultrasonic transducers 211 and 212 in FIG. 2 . It is worth noting that the ultrasonic transducers 631R to 635R of the sensing units 631 to 635 of this embodiment can receive reflected ultrasonic waves having a frequency that is one times or twice the first frequency.

圖8是本發明的第三實施例的超聲波感測器的操作示意圖。圖9A是本發明的第三實施例的超聲波感測器的發射電路圖。圖9B是本發明的第三實施例的超聲波感測器的接收電路圖。參考圖8，在本實施例中，超聲波感測器800包括基板820、支撐層830、黏合層840以及面板850，其中面板850可為透光面板或非透光面板，例如玻璃、顯示面板或一般板材等。在本實施例中，超聲波感測器800例如包括感測單元831~837，其中感測單元831~837的每一個可如上述圖2、3的感測單元210。FIG. 8 is a schematic view of the operation of the ultrasonic sensor according to the third embodiment of the present invention. FIG. 9A is a transmission circuit diagram of the ultrasonic sensor according to the third embodiment of the present invention. 9B is a receiving circuit diagram of the ultrasonic sensor according to the third embodiment of the present invention. Referring to FIG. 8 , in this embodiment, the ultrasonic sensor 800 includes a substrate 820 , a support layer 830 , an adhesive layer 840 and a panel 850 , wherein the panel 850 may be a translucent panel or a non-transparent panel, such as glass, a display panel or General plates, etc. In this embodiment, the ultrasonic sensor 800 includes, for example, sensing units 831 to 837 , wherein each of the sensing units 831 to 837 can be the same as the sensing unit 210 of FIGS. 2 and 3 .

參考圖8及圖9A，超聲波感測器800還包括驅動電路861~867，其中驅動電路861~867例如設置於上述圖1實施例所述的集成電路120當中，但本發明並不限於此。在本實施例中，驅動電路861~867一對一地耦接至感測單元831~837的超聲波換能器831T~837T，以在不同時間點分別輸出多個驅動信號至超聲波換能器831T~837T。感測單元831~837的超聲波換能器831T~837T的至少一部分依據不同時間點所接收到的所述多個驅動信號來分時發射多個感測超聲波，其中所述多個感測超聲波可為多個球面波。舉例而言，感測單元833、836先發射感測超聲波，接著感測單元832、835發射感測超聲波，再接著感測單元831、834、837發射感測超聲波。因此，所述多個感測超聲波可形成多個高指向性超聲波。所述多個高指向性超聲波經由支撐層830、黏合層840以及面板850傳遞至感測目標801的表面，以使感測目標801的表面產生反射超聲波。感測目標801可為手指，並且感測目標801的表面可具有指紋紋路。所述反射超聲波經由面板850、黏合層840以及支撐層830回傳至感測單元831~837。8 and 9A, the ultrasonic sensor 800 further includes driving circuits 861-867, wherein the driving circuits 861-867 are, for example, disposed in the integrated circuit 120 described in the embodiment of FIG. 1, but the present invention is not limited thereto. In this embodiment, the driving circuits 861-867 are coupled to the ultrasonic transducers 831T-837T of the sensing units 831-837 one-to-one, so as to output a plurality of driving signals to the ultrasonic transducer 831T at different time points respectively ~837T. At least a part of the ultrasonic transducers 831T to 837T of the sensing units 831 to 837 transmits a plurality of sensing ultrasonic waves in a time-division according to the plurality of driving signals received at different time points, wherein the plurality of sensing ultrasonic waves may be for multiple spherical waves. For example, the sensing units 833, 836 first transmit the sensing ultrasonic waves, then the sensing units 832, 835 transmit the sensing ultrasonic waves, and then the sensing units 831, 834, 837 transmit the sensing ultrasonic waves. Therefore, the plurality of sensing ultrasonic waves may form a plurality of high-directivity ultrasonic waves. The plurality of high-directivity ultrasonic waves are transmitted to the surface of the sensing target 801 through the support layer 830 , the adhesive layer 840 and the panel 850 , so that the surface of the sensing target 801 generates reflected ultrasonic waves. The sensing target 801 may be a finger, and the surface of the sensing target 801 may have fingerprint patterns. The reflected ultrasonic waves are transmitted back to the sensing units 831 to 837 through the panel 850 , the adhesive layer 840 and the support layer 830 .

在本實施例中，超聲波換能器831T~837T可例如是圖2的超聲波換能器211及超聲波換能器212的其中之一。值得注意的是，本實施例的感測單元831~837的超聲波換能器831T~837T可例如發射具有第二頻率的感測超聲波(中高頻機械彈性波)，其中第二頻率可例如大於50兆赫(MHz)。In this embodiment, the ultrasonic transducers 831T˜837T may be, for example, one of the ultrasonic transducers 211 and 212 of FIG. 2 . It is worth noting that the ultrasonic transducers 831T to 837T of the sensing units 831 to 837 of this embodiment can, for example, emit sensing ultrasonic waves (mid-high frequency mechanical elastic waves) with a second frequency, where the second frequency can be greater than 50 Megahertz (MHz).

參考8及圖9B超聲波感測器800還包括感測電路881~887、帶通濾波器(band-pass filter )891~897以及影像合成電路870，其中感測電路881~887、帶通濾波器891~897以及影像合成電路870例如設置於上述圖1實施例所述的集成電路120當中，但本發明並不限於此。在本實施例中，感測電路881~887一對一地耦接至感測單元831~837的超聲波換能器831R~837R，並且帶通濾波器891~897一對一地耦接至感測電路881~887。超聲波換能器831R~837R用於接收上述的反射超聲波，並且感測電路881~887感測超聲波換能器831R~837R，而輸出多個感測信號至帶通濾波器891~897。值得注意的是，本實施例的感測單元831~837的超聲波換能器831R~837R可例如接收具有第二頻率的一倍頻或兩倍頻的反射超聲波。對此，帶通濾波器891~897可分離出具有第二頻率的一倍頻或兩倍頻的感測信號，並且將所述具有第二頻率的一倍頻或兩倍頻的感測信號輸出至影像合成電路870。帶通濾波器891~897分別耦接至影像合成電路870。影像合成電路870依據濾波後的所述多個感測信號來產生感測影像(指紋影像)。在本實施例中，超聲波換能器831R~837R可例如是圖2的超聲波換能器211及超聲波換能器212的其中之另一。Referring to 8 and FIG. 9B, the ultrasonic sensor 800 further includes sensing circuits 881-887, band-pass filters 891-897 and an image synthesis circuit 870, wherein the sensing circuits 881-887, the band-pass filters 891 to 897 and the image synthesis circuit 870 are, for example, disposed in the integrated circuit 120 described in the embodiment of FIG. 1 , but the present invention is not limited thereto. In this embodiment, the sensing circuits 881-887 are coupled to the ultrasonic transducers 831R-837R of the sensing units 831-837 one-to-one, and the band-pass filters 891-897 are one-to-one coupled to the sensor Test circuits 881~887. The ultrasonic transducers 831R-837R are used for receiving the above-mentioned reflected ultrasonic waves, and the sensing circuits 881-887 sense the ultrasonic transducers 831R-837R, and output a plurality of sensing signals to the band-pass filters 891-897. It is worth noting that, the ultrasonic transducers 831R to 837R of the sensing units 831 to 837 of this embodiment can receive, for example, reflected ultrasonic waves having a frequency that is one times or twice the frequency of the second frequency. In this regard, the band-pass filters 891-897 can separate out the sensing signals with one frequency or double frequency of the second frequency, and separate the sensing signals with one frequency or double frequency of the second frequency Output to the image synthesis circuit 870 . The bandpass filters 891 to 897 are respectively coupled to the image synthesis circuit 870 . The image synthesis circuit 870 generates a sensing image (fingerprint image) according to the filtered sensing signals. In this embodiment, the ultrasonic transducers 831R to 837R may be, for example, the other of the ultrasonic transducers 211 and 212 in FIG. 2 .

綜上所述，本發明的超聲波感測器可通過設計特殊結構的超聲波換能器來有效地發射及接收超聲波。並且，本發明的超聲波感測器可透過同時發射多個感測超聲波來形成平面波的方式，或可透過發射具有不同相位延遲的多個感測超聲波來形成聚焦波的方式，或可透過分時發射多個高指向性超聲波的方式，來使超聲波感測器接收到的反射超聲波可具有高訊號雜訊比的優點，進而可產生具有良好影像品質的感測影像。To sum up, the ultrasonic sensor of the present invention can effectively transmit and receive ultrasonic waves by designing an ultrasonic transducer with a special structure. In addition, the ultrasonic sensor of the present invention can form a plane wave by emitting a plurality of sensing ultrasonic waves at the same time, or can form a focused wave by emitting a plurality of sensing ultrasonic waves with different phase delays, or can transmit a time-sharing method. The method of transmitting a plurality of high-directivity ultrasonic waves enables the reflected ultrasonic waves received by the ultrasonic sensor to have the advantage of high signal-to-noise ratio, thereby producing a sensing image with good image quality.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。指紋影像的背景雜訊。Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application. Background noise in fingerprint images.

100、400、600、800:超聲波感測器 110:感測陣列 120:集成電路 210、431~437、631~635、831~837:感測單元 210C:中心軸 211、212、431T~437T、431R~437R、631T~635T、631R~635R、831T~837T、831R~837R:超聲波換能器 2111、2112、2121、2122:金屬層 2113、2123:介電層 2114、2124:腔體 220、420、620、820:基板 230、430、630、830:支撐層 401、601、801:感測目標 440、640、840:黏合層 450、650、850:面板 460、660、861~867:驅動電路 470、670、870:影像合成電路 481~487、681~685、881~887:感測電路 661~665:延遲電路 891~897:帶通濾波器 D1、D2、D3:方向100, 400, 600, 800: Ultrasonic sensor 110: Sensing array 120: Integrated Circuits 210, 431~437, 631~635, 831~837: Sensing unit 210C: Center shaft 211, 212, 431T~437T, 431R~437R, 631T~635T, 631R~635R, 831T~837T, 831R~837R: Ultrasonic transducer 2111, 2112, 2121, 2122: Metal layer 2113, 2123: Dielectric layer 2114, 2124: cavity 220, 420, 620, 820: Substrate 230, 430, 630, 830: support layer 401, 601, 801: Sensing target 440, 640, 840: Adhesive layer 450, 650, 850: Panel 460, 660, 861~867: drive circuit 470, 670, 870: Image synthesis circuit 481~487, 681~685, 881~887: Sensing circuit 661~665: Delay circuit 891~897: Bandpass filter D1, D2, D3: Direction

圖1是本發明的一實施例的超聲波感測器的示意圖。 圖2是本發明的一實施例的感測單元的俯視示意圖。 圖3是本發明的一實施例的感測單元的側視剖面示意圖。 圖4是本發明的第一實施例的超聲波感測器的操作示意圖。 圖5A是本發明的第一實施例的超聲波感測器的發射電路圖。 圖5B是本發明的第一實施例的超聲波感測器的接收電路圖。 圖6是本發明的第二實施例的超聲波感測器的操作示意圖。 圖7A是本發明的第二實施例的超聲波感測器的發射電路圖。 圖7B是本發明的第二實施例的超聲波感測器的接收電路圖。 圖8是本發明的第三實施例的超聲波感測器的操作示意圖。 圖9A是本發明的第三實施例的超聲波感測器的發射電路圖。 圖9B是本發明的第三實施例的超聲波感測器的接收電路圖。FIG. 1 is a schematic diagram of an ultrasonic sensor according to an embodiment of the present invention. FIG. 2 is a schematic top view of a sensing unit according to an embodiment of the present invention. 3 is a schematic cross-sectional side view of a sensing unit according to an embodiment of the present invention. FIG. 4 is a schematic view of the operation of the ultrasonic sensor according to the first embodiment of the present invention. 5A is a transmission circuit diagram of the ultrasonic sensor according to the first embodiment of the present invention. 5B is a receiving circuit diagram of the ultrasonic sensor according to the first embodiment of the present invention. 6 is a schematic view of the operation of the ultrasonic sensor according to the second embodiment of the present invention. FIG. 7A is a transmission circuit diagram of the ultrasonic sensor according to the second embodiment of the present invention. 7B is a receiving circuit diagram of the ultrasonic sensor according to the second embodiment of the present invention. FIG. 8 is a schematic view of the operation of the ultrasonic sensor according to the third embodiment of the present invention. FIG. 9A is a transmission circuit diagram of the ultrasonic sensor according to the third embodiment of the present invention. 9B is a receiving circuit diagram of the ultrasonic sensor according to the third embodiment of the present invention.

100:超聲波感測器100: Ultrasonic sensor

110:感測陣列110: Sensing array

120:集成電路120: Integrated Circuits

Claims (13)

一種超聲波感測器，包括：一感測陣列，包括陣列排列的多個感測單元，其中該些感測單元的各別包括：一第一超聲波換能器，包括一第一腔體，該第一超聲波換能器用以發射一感測超聲波；以及一第二超聲波換能器，包括一第二腔體，該第二超聲波換能器用以接收對應於該超聲波的一反射超聲波，其中該第一超聲波換能器與該第二超聲波換能器平行設置於一平面，並且該第一超聲波換能器與該第二超聲波換能器具有垂直於該平面的相同中心軸。 An ultrasonic sensor, comprising: a sensing array, including a plurality of sensing units arranged in an array, wherein each of the sensing units includes: a first ultrasonic transducer, including a first cavity, the The first ultrasonic transducer is used to transmit a sensing ultrasonic wave; and a second ultrasonic transducer includes a second cavity, and the second ultrasonic transducer is used to receive a reflected ultrasonic wave corresponding to the ultrasonic wave, wherein the first ultrasonic wave An ultrasonic transducer and the second ultrasonic transducer are arranged in parallel on a plane, and the first ultrasonic transducer and the second ultrasonic transducer have the same central axis perpendicular to the plane. 如請求項1所述的超聲波感測器，其中該第一超聲波換能器為環形，並且該第一超聲波換能器在該平面上環繞該第二超聲波換能器來設置。 The ultrasonic sensor of claim 1, wherein the first ultrasonic transducer is annular, and the first ultrasonic transducer is arranged on the plane to surround the second ultrasonic transducer. 如請求項1所述的超聲波感測器，其中該第二超聲波換能器為環形，並且該第二超聲波換能器在該平面上環繞該第一超聲波換能器來設置。 The ultrasonic sensor of claim 1, wherein the second ultrasonic transducer is annular, and the second ultrasonic transducer is arranged on the plane to surround the first ultrasonic transducer. 如請求項1所述的超聲波感測器，更包括：一驅動電路，耦接該些感測單元的該些第一超聲波換能器，並且用以輸出多個驅動信號至該些第一超聲波換能器，其中該些第一超聲波換能器依據該些驅動信號發射該些感測超聲波，並且該些感測超聲波為多個球面波。 The ultrasonic sensor of claim 1, further comprising: a driving circuit, coupled to the first ultrasonic transducers of the sensing units, and used for outputting a plurality of driving signals to the first ultrasonic waves The transducer, wherein the first ultrasonic transducers transmit the sensing ultrasonic waves according to the driving signals, and the sensing ultrasonic waves are a plurality of spherical waves. 如請求項4所述的超聲波感測器，其中該些第一超聲波換能器同時發射該些感測超聲波，以形成一平面波傳遞至一感測目標的一表面。 The ultrasonic sensor of claim 4, wherein the first ultrasonic transducers simultaneously emit the sensing ultrasonic waves to form a plane wave and transmit to a surface of a sensing target. 如請求項4所述的超聲波感測器，更包括：多個延遲電路，分別耦接在該些第一超聲波換能器與該驅動電路之間，其中該些第一超聲波換能器以相位延遲的方式發射該些感測超聲波來形成一聚焦波傳遞至一感測目標的一表面。 The ultrasonic sensor of claim 4, further comprising: a plurality of delay circuits respectively coupled between the first ultrasonic transducers and the driving circuit, wherein the first ultrasonic transducers are in phase The sensing ultrasonic waves are emitted in a delayed manner to form a focused wave that is transmitted to a surface of a sensing target. 如請求項1所述的超聲波感測器，更包括：多個驅動電路，分別耦接該些感測單元的該些第一超聲波換能器，並且用以輸出多個驅動信號至該些第一超聲波換能器，其中該些第一超聲波換能器的至少一部分依據該些驅動信號非同步地發射該些感測超聲波。 The ultrasonic sensor of claim 1, further comprising: a plurality of driving circuits, respectively coupled to the first ultrasonic transducers of the sensing units, and used for outputting a plurality of driving signals to the first ultrasonic transducers An ultrasonic transducer, wherein at least a part of the first ultrasonic transducers transmit the sensing ultrasonic waves asynchronously according to the driving signals. 如請求項1所述的超聲波感測器，更包括：多個感測電路，分別耦接該些感測單元的該些第二超聲波換能器，並且用以感測該些第二超聲波換能器，以輸出多個感測信號；以及一影像合成電路，耦接該些感測電路，並且用以依據該些感測信號來產生一感測影像。 The ultrasonic sensor of claim 1, further comprising: a plurality of sensing circuits respectively coupled to the second ultrasonic transducers of the sensing units and used for sensing the second ultrasonic transducers The sensor is used to output a plurality of sensing signals; and an image synthesis circuit is coupled to the sensing circuits and used for generating a sensing image according to the sensing signals. 如請求項8所述的超聲波感測器，更包括：多個帶通濾波器，分別耦接在該些感測電路與該影像合成電路之間，並且用以提供該些感測信號至該影像合成電路。 The ultrasonic sensor of claim 8, further comprising: a plurality of band-pass filters, respectively coupled between the sensing circuits and the image synthesis circuit, and used for providing the sensing signals to the image synthesis circuit Video synthesis circuit. 如請求項8所述的超聲波感測器，其中該影像合成電路依據該些感測信號當中對應於一倍頻以及二倍頻的至少其中之一的該些反射超聲波的部分來產生該感測影像。 The ultrasonic sensor as claimed in claim 8, wherein the image synthesis circuit generates the sensing according to the portions of the reflected ultrasonic waves corresponding to at least one of the one-fold frequency and the two-fold frequency among the sensing signals image. 如請求項1所述的超聲波感測器，其中該第一超聲波換能器以及該第二超聲波換能器的至少其中之一為一電容式超音波微換能器，其中該第一腔體以及該第二腔體的至少其中之一具有一介質材料。 The ultrasonic sensor of claim 1, wherein at least one of the first ultrasonic transducer and the second ultrasonic transducer is a capacitive ultrasonic microtransducer, wherein the first cavity And at least one of the second cavities has a dielectric material. 如請求項11所述的超聲波感測器，其中該介質材料為一軟性材料。 The ultrasonic sensor of claim 11, wherein the dielectric material is a soft material. 如請求項11所述的超聲波感測器，其中該介質材料為一聚合物材料。 The ultrasonic sensor of claim 11, wherein the dielectric material is a polymer material.
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