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TWI758901B - Display device - Google Patents

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Publication number
TWI758901B
TWI758901B TW109135309A TW109135309A TWI758901B TW I758901 B TWI758901 B TW I758901B TW 109135309 A TW109135309 A TW 109135309A TW 109135309 A TW109135309 A TW 109135309A TW I758901 B TWI758901 B TW I758901B
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insulating layer
signal line
display device
opening
disposed
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TW109135309A
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Chinese (zh)
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TW202145173A (en
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戴名柔
蔡嘉豪
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群創光電股份有限公司
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

A display device includes a substrate, a scan line, a first signal line, a first insulating layer, a second signal line, a transistor and a pixel electrode. The scan line is disposed on the substrate. The first signal line is disposed on the substrate. The first insulating layer is disposed on the first signal line and has an opening. The second signal line is disposed on the first insulating layer. The second signal line is electrically connected to the first signal line through the opening. The transistor is electrically connected to the scan line and the first signal line. The pixel electrode is electrically connected to the transistor and has a first side adjacent to the scan line and a second side opposite to the first side. The opening is adjacent to the second side and away from the first side.

Description

顯示裝置display device

本揭露是有關於一種電子裝置,且特別是有關於一種可降低訊號線阻值的顯示裝置。The present disclosure relates to an electronic device, and more particularly, to a display device capable of reducing the resistance of signal lines.

隨電子產品蓬勃發展,應用於電子產品上的顯示技術也不斷改良。用於顯示的電子裝置不斷朝向更大及更高解析度的顯示效果改進。With the vigorous development of electronic products, the display technology applied to electronic products is also constantly improving. Electronic devices for display continue to improve towards larger and higher resolution displays.

本揭露提供一種顯示裝置,其可降低訊號線阻值或增加面板驅動能力。The present disclosure provides a display device which can reduce the resistance value of the signal line or increase the driving capability of the panel.

本揭露的顯示裝置包括基板、掃描線、第一訊號線、第一絕緣層、第二訊號線、電晶體以及像素電極。掃描線設置於基板上。第一訊號線設置於基板上。第一絕緣層設置於第一訊號線上且具有開口。第二訊號線設置於第一絕緣層上。第二訊號線通過開口與第一訊號線電性連接。電晶體電性連接至掃描線以及第一訊號線。像素電極電性連接至電晶體且具有相鄰於掃描線的第一側以及與第一側相對的第二側。開口鄰近第二側且遠離第一側。The display device of the present disclosure includes a substrate, a scan line, a first signal line, a first insulating layer, a second signal line, a transistor, and a pixel electrode. The scan lines are arranged on the substrate. The first signal line is arranged on the substrate. The first insulating layer is disposed on the first signal line and has an opening. The second signal line is disposed on the first insulating layer. The second signal line is electrically connected to the first signal line through the opening. The transistor is electrically connected to the scan line and the first signal line. The pixel electrode is electrically connected to the transistor and has a first side adjacent to the scan line and a second side opposite to the first side. The opening is adjacent to the second side and away from the first side.

基於上述,在本揭露實施例的顯示裝置中,由於第二訊號線設置於第一訊號線上,且第二訊號線可通過第一絕緣層的開口電性連接至第一訊號線,因而使得本實施例的顯示裝置可利用雙層的訊號線(即第一訊號線以及第二訊號線)來進行訊號傳輸。因此,本實施例的顯示裝置可藉由雙層的訊號線(即第一訊號線以及第二訊號線)的設置來降低訊號線的阻值(resistance),以增加面板驅動能力,並利於高頻(例如大於90Hz)驅動。Based on the above, in the display device of the embodiment of the present disclosure, since the second signal line is disposed on the first signal line, and the second signal line can be electrically connected to the first signal line through the opening of the first insulating layer, the present invention The display device of the embodiment can utilize double-layered signal lines (ie, the first signal line and the second signal line) for signal transmission. Therefore, in the display device of the present embodiment, the resistance of the signal lines can be reduced by the arrangement of the double-layered signal lines (ie, the first signal line and the second signal line), so as to increase the panel driving capability and facilitate high frequency (eg greater than 90Hz) drive.

為讓本揭露的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present disclosure more obvious and easy to understand, the following embodiments are given and described in detail in conjunction with the accompanying drawings as follows.

通過參考以下的詳細描述並同時結合附圖可以理解本揭露,須注意的是,為了使讀者能容易瞭解及為了圖式的簡潔,本揭露中的多張圖式只繪出電子裝置的一部分,且圖式中的特定元件並非依照實際比例繪圖。此外,圖中各元件的數量及尺寸僅作為示意,並非用來限制本揭露的範圍。The present disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, in order to facilitate readers' understanding and to simplify the drawings, the drawings in the present disclosure only depict a part of an electronic device. And specific elements in the drawings are not drawn according to actual scale. In addition, the number and size of each element in the figures are for illustration only, and are not intended to limit the scope of the present disclosure.

在下文說明書與權利要求書中,「含有」與「包括」等詞為開放式詞語,因此其應被解釋為「含有但不限定為…」之意。In the following description and claims, the words "comprising" and "including" are open-ended words, so they should be interpreted as meaning "including but not limited to...".

應了解到,當元件或膜層被稱為在另一個元件或膜層「上」或「連接到」另一個元件或膜層時,它可以直接在此另一元件或膜層上或直接連接到此另一元件或層,或者兩者之間存在有插入的元件或膜層(非直接情況)。相反地,當元件被稱為「直接」在另一個元件或膜層「上」或「直接連接到」另一個元件或膜層時,兩者之間不存在有插入的元件或膜層。It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or directly connected to the other element or layer Hereto another element or layer, or there is an intervening element or layer in between (indirect case). In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present.

雖然術語第一、第二、第三…可用以描述多種組成元件,但組成元件並不以此術語為限。此術語僅用於區別說明書內單一組成元件與其他組成元件。權利要求中可不使用相同術語,而依照權利要求中元件宣告的順序以第一、第二、第三…取代。因此,在下文說明書中,第一組成元件在權利要求中可能為第二組成元件。Although the terms first, second, third . . . may be used to describe various constituent elements, the constituent elements are not limited by the terms. This term is only used to distinguish a single constituent element from other constituent elements in the specification. The same terms may not be used in the claims, but replaced by first, second, third, . . . in the order in which the elements are recited in the claims. Therefore, in the following description, the first constituent element may be the second constituent element in the claims.

在本揭露一些實施例中,關於接合、連接之用語例如「連接」、「互連」等,除非特別定義,否則可指兩個結構係直接接觸,或者亦可指兩個結構並非直接接觸,其中有其它結構設於此兩個結構之間。且此關於接合、連接之用語亦可包括兩個結構都可移動,或者兩個結構都固定之情況。此外,用語「耦接」包含任何直接及間接的電性連接手段。In some embodiments of the present disclosure, terms related to bonding and connection, such as "connection", "interconnection", etc., unless otherwise defined, may mean that two structures are in direct contact, or may also mean that two structures are not in direct contact, There are other structures located between these two structures. And the terms of joining and connecting can also include the case where both structures are movable, or both structures are fixed. Furthermore, the term "coupled" includes any direct and indirect means of electrical connection.

在本揭露中,長度與寬度的量測方式可以是採用光學顯微鏡量測而得,厚度則可以由電子顯微鏡中的剖面影像量測而得,但不以此為限。另外,任兩個用來比較的數值或方向,可存在著一定的誤差。In the present disclosure, the measurement method of length and width can be measured by using an optical microscope, and the thickness can be measured by a cross-sectional image in an electron microscope, but it is not limited thereto. In addition, any two values or directions used for comparison may have certain errors.

本揭露的電子裝置可包括顯示裝置、天線裝置、感測裝置、觸控電子裝置(touch display)、曲面電子裝置(curved display)或非矩形電子裝置(free shape display),但不以此為限。電子裝置可為可彎折或可撓式電子裝置。電子裝置可例如包括發光二極體(light emitting diode,LED)、液晶(liquid crystal)、螢光(fluorescence)、磷光(phosphor)、其它合適的顯示介質、或前述之組合,但不以此為限。發光二極體可例如包括有機發光二極體(organic light emitting diode,OLED)、無機發光二極體(inorganic light-emitting diode,LED)、次毫米發光二極體(mini LED)、微發光二極體(micro LED)或量子點(quantum dot,QD)發光二極體(QLED、QDLED)、或其他適合之材料或上述的任意排列組合,但不以此為限。顯示裝置可例如包括拼接顯示裝置,但不以此為限。天線裝置可例如是液晶天線,但不以此為限。天線裝置可例如包括天線拼接裝置,但不以此為限。需注意的是,電子裝置可為前述之任意排列組合,但不以此為限。此外,電子裝置的外型可為矩形、圓形、多邊形、具有彎曲邊緣的形狀或其他適合的形狀。電子裝置可以具有驅動系統、控制系統、光源系統、層架系統…等週邊系統以支援顯示裝置、天線裝置或拼接裝置。下文將以顯示裝置說明本揭露內容,但本揭露不以此為限。The electronic device of the present disclosure may include, but is not limited to, a display device, an antenna device, a sensing device, a touch display, a curved display, or a free shape display . The electronic device may be a bendable or flexible electronic device. The electronic device may include, for example, light emitting diode (LED), liquid crystal, fluorescence, phosphor, other suitable display medium, or a combination of the foregoing, but not limited to limit. The light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), inorganic light-emitting diodes (LEDs), sub-millimeter light-emitting diodes (mini LEDs), micro-LEDs Polar body (micro LED) or quantum dot (quantum dot, QD) light emitting diode (QLED, QDLED), or other suitable materials or any combination of the above, but not limited thereto. The display device may include, for example, but not limited to, a tiled display device. The antenna device may be, for example, a liquid crystal antenna, but not limited thereto. The antenna device may include, for example, but not limited to, an antenna splicing device. It should be noted that, the electronic device can be any arrangement and combination of the foregoing, but not limited to this. In addition, the shape of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a driving system, a control system, a light source system, a shelf system, etc. to support a display device, an antenna device or a splicing device. Hereinafter, the present disclosure will be described with a display device, but the present disclosure is not limited thereto.

須知悉的是,以下所舉實施例可以在不脫離本揭露的精神下,可將數個不同實施例中的特徵進行替換、重組、混合以完成其他實施例。各實施例間特徵只要不違背發明精神或相衝突,均可任意混合搭配使用。It should be noted that, in the following embodiments, features in several different embodiments may be replaced, recombined, and mixed to complete other embodiments without departing from the spirit of the present disclosure. As long as the features of the various embodiments do not violate the spirit of the invention or conflict with each other, they can be mixed and matched arbitrarily.

現將詳細地參考本揭露的示範性實施例,示範性實施例的實例說明於附圖中。只要有可能,相同元件符號在圖式和描述中用來表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and description to refer to the same or like parts.

圖1A為本揭露一實施例的顯示裝置的上視示意圖。圖1B為圖1A的顯示裝置沿剖面線A-A’的剖面示意圖。圖1C為圖1A的顯示裝置沿剖面線B-B’的剖面示意圖。為了附圖清楚及方便說明,圖1A省略繪示了顯示裝置中的若干元件,例如省略繪示了開孔GIa、開孔GIb、開孔172a以及開孔172b,但不以此為限。FIG. 1A is a schematic top view of a display device according to an embodiment of the disclosure. FIG. 1B is a schematic cross-sectional view of the display device of FIG. 1A along the section line A-A'. FIG. 1C is a schematic cross-sectional view of the display device of FIG. 1A along the section line B-B'. For the sake of clarity and convenience of description of the drawings, FIG. 1A omits to illustrate some elements in the display device, for example, the opening GIa, the opening GIb, the opening 172a and the opening 172b are omitted, but not limited thereto.

請同時參照圖1A、圖1B以及圖1C,本實施例的顯示裝置100包括基板110、掃描線120、第一訊號線130、第一絕緣層140、第二訊號線131、電晶體150以及像素電極160。在本實施例中,基板110可例如為可撓式基板、剛性基板或前述之組合。舉例而言,基板110的材料可包括玻璃、石英、藍寶石(sapphire)、陶瓷、聚碳酸酯(polycarbonate,PC)、聚醯亞胺(polyimide,PI)、聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、其它合適的基板材料、或前述之組合,但不以此為限。1A , 1B and 1C at the same time, the display device 100 of this embodiment includes a substrate 110 , a scan line 120 , a first signal line 130 , a first insulating layer 140 , a second signal line 131 , a transistor 150 and pixels electrode 160. In this embodiment, the substrate 110 can be, for example, a flexible substrate, a rigid substrate, or a combination thereof. For example, the material of the substrate 110 may include glass, quartz, sapphire (sapphire), ceramics, polycarbonate (PC), polyimide (PI), polyethylene terephthalate (polyethylene terephthalate) terephthalate, PET), other suitable substrate materials, or a combination of the foregoing, but not limited thereto.

電晶體150設置於基板110上,且電晶體150包括閘極GE、絕緣層173、部分的閘極絕緣層GI、半導體層SE、源極SD1以及漏極SD2,但不以此為限。在本實施例中,閘極絕緣層GI具有開孔GIa、GIb,以暴露出部分的半導體層SE。在一些實施例中,源極SD1及/或漏極SD2的材料可包含透明導電材料或非透明導電材料,例如銦錫氧化物、銦鋅氧化物、氧化銦、氧化鋅、氧化錫、金屬材料(例如鋁、鉬、銅、銀等)、其它合適材料或上述組合,但不以此為限。在一些實施例中,半導體層SE的材料可包括非晶質矽(amorphous silicon)、低溫多晶矽(LTPS)、金屬氧化物(例如氧化銦鎵鋅IGZO)、其他合適之材料或上述之組合,但不以此為限。在本實施例中,雖然電晶體150的閘極GE為頂閘極結構,但本揭露不以此為限,也就是說,在其他實施例中,電晶體的閘極也可以為底閘極結構。The transistor 150 is disposed on the substrate 110, and the transistor 150 includes a gate GE, an insulating layer 173, a part of the gate insulating layer GI, a semiconductor layer SE, a source SD1 and a drain SD2, but not limited thereto. In this embodiment, the gate insulating layer GI has openings GIa and GIb to expose a part of the semiconductor layer SE. In some embodiments, the material of the source electrode SD1 and/or the drain electrode SD2 may include a transparent conductive material or a non-transparent conductive material, such as indium tin oxide, indium zinc oxide, indium oxide, zinc oxide, tin oxide, metal materials (eg, aluminum, molybdenum, copper, silver, etc.), other suitable materials, or combinations thereof, but not limited thereto. In some embodiments, the material of the semiconductor layer SE may include amorphous silicon, low temperature polysilicon (LTPS), metal oxide (eg, indium gallium zinc oxide IGZO), other suitable materials, or a combination of the above, but Not limited to this. In this embodiment, although the gate GE of the transistor 150 is a top gate structure, the present disclosure is not limited to this, that is, in other embodiments, the gate of the transistor may also be a bottom gate structure.

掃描線120設置於基板110上,第一訊號線130設置於基板110上,且掃描線120與第一訊號線130彼此相交。由於掃描線120可與電晶體150的閘極GE電性連接,且第一訊號線130可與電晶體150的源極SD1電性連接,因而使得電晶體150可分別通過閘極GE以及源極SD1電性連接至掃描線120以及第一訊號線130。在一些實施例中,掃描線120及第一訊號線130的材料例如可以包括鉬(molybdenum,Mo)、鈦(titanium,Ti)、鉭(tantalum,Ta)、鈮(niobium,Nb)、鉿(hafnium,Hf)、鎳(nickel,Ni),鉻(chromium,Cr)、鈷(cobalt,Co),、鋯(zirconium,Zr)、鎢(tungsten,W)、鋁(aluminum,Al)、銅(copper,Cu)、銀(argentum ,Ag),其他合適的金屬,或上述材料的合金或組合,但不以此為限。The scan lines 120 are disposed on the substrate 110 , the first signal lines 130 are disposed on the substrate 110 , and the scan lines 120 and the first signal lines 130 intersect each other. Since the scan line 120 can be electrically connected to the gate electrode GE of the transistor 150, and the first signal line 130 can be electrically connected to the source electrode SD1 of the transistor 150, the transistor 150 can pass through the gate electrode GE and the source electrode respectively. SD1 is electrically connected to the scan line 120 and the first signal line 130 . In some embodiments, the materials of the scan lines 120 and the first signal lines 130 may include, for example, molybdenum (Molybdenum, Mo), titanium (titanium, Ti), tantalum (tantalum, Ta), niobium (niobium, Nb), hafnium ( hafnium, Hf), nickel (nickel, Ni), chromium (chromium, Cr), cobalt (cobalt, Co), zirconium (zirconium, Zr), tungsten (tungsten, W), aluminum (aluminum, Al), copper ( copper, Cu), silver (argentum, Ag), other suitable metals, or alloys or combinations of the above materials, but not limited thereto.

在本實施例中,顯示裝置100還包括緩衝層170、遮蔽層171以及介電層172。緩衝層170以及遮蔽層171設置於電晶體150與基板110之間,且遮蔽層171對應於閘極GE設置。介電層172設置於源極SD1(或漏極SD2)與閘極絕緣層GI之間,以覆蓋閘極GE以及閘極絕緣層GI。介電層172具有開孔172a、172b,其中開孔172a連通開孔GIa以暴露出部分的半導體層SE,且開孔172b連通開孔GIb以暴露出部分的半導體層SE。在一些實施例中,緩衝層170、介電層172及閘極絕緣層GI亦可為單層或其他多層結構,且可例如包含有機材料、無機材料或前述之組合,但不以此為限。遮蔽層171可例如是金屬材料或其他遮光材料,並且在一些實施例中,顯示裝置100亦可不設置遮蔽層171。In this embodiment, the display device 100 further includes a buffer layer 170 , a shielding layer 171 and a dielectric layer 172 . The buffer layer 170 and the shielding layer 171 are disposed between the transistor 150 and the substrate 110 , and the shielding layer 171 is disposed corresponding to the gate GE. The dielectric layer 172 is disposed between the source electrode SD1 (or the drain electrode SD2 ) and the gate insulating layer GI to cover the gate electrode GE and the gate insulating layer GI. The dielectric layer 172 has openings 172a and 172b, wherein the opening 172a communicates with the opening GIa to expose a part of the semiconductor layer SE, and the opening 172b communicates with the opening GIb to expose a part of the semiconductor layer SE. In some embodiments, the buffer layer 170 , the dielectric layer 172 and the gate insulating layer GI may also be a single layer or other multi-layer structures, and may include organic materials, inorganic materials or combinations thereof, but not limited thereto . The shielding layer 171 may be, for example, a metal material or other light shielding material, and in some embodiments, the display device 100 may not be provided with the shielding layer 171 .

在本實施例中,源極SD1與漏極SD2分別設置於介電層172上。部分的源極SD1還可填入於介電層172的開孔172a以及閘極絕緣層GI的開孔GIa內,以使源極SD1可電性連接至半導體層SE。部分的漏極SD2還可填入於介電層172的開孔172b以及閘極絕緣層GI的開孔GIb內,以使漏極SD2可電性連接至半導體層SE。In this embodiment, the source electrode SD1 and the drain electrode SD2 are respectively disposed on the dielectric layer 172 . Part of the source electrode SD1 can also be filled in the opening 172a of the dielectric layer 172 and the opening GIa of the gate insulating layer GI, so that the source electrode SD1 can be electrically connected to the semiconductor layer SE. Part of the drain SD2 can also be filled in the opening 172b of the dielectric layer 172 and the opening GIb of the gate insulating layer GI, so that the drain SD2 can be electrically connected to the semiconductor layer SE.

第一絕緣層140設置於第一訊號線130上,且覆蓋電晶體150的源極SD1、漏極SD2以及介電層172。第一絕緣層140與基板110分別設置於電晶體150的相對兩側。第一絕緣層140具有開口141以及開口142,其中開口141暴露出部分的第一訊號線130,且開口142暴露出部分的漏極SD2。第一絕緣層140亦可為單層或其他多層結構,且可例如包含有機材料、無機材料或前述之組合,但不以此為限。The first insulating layer 140 is disposed on the first signal line 130 and covers the source SD1 , the drain SD2 and the dielectric layer 172 of the transistor 150 . The first insulating layer 140 and the substrate 110 are respectively disposed on opposite sides of the transistor 150 . The first insulating layer 140 has an opening 141 and an opening 142, wherein the opening 141 exposes a part of the first signal line 130, and the opening 142 exposes a part of the drain electrode SD2. The first insulating layer 140 may also be a single layer or other multi-layer structures, and may include, for example, organic materials, inorganic materials or a combination of the foregoing, but not limited thereto.

第二訊號線131設置於第一絕緣層140上。部分的第二訊號線131還可設置於第一絕緣層140的開口141內,以使第二訊號線131可通過開口141與第一訊號線130電性連接。第二訊號線131與第一訊號線130分別位於第一絕緣層140的相對兩側。在本實施例中,第二訊號線131可包含的材料可與第一訊號線130相同或相似,於此不再贅述。在一些實施例中,第一訊號線130與第二訊號線131可以為相同或不相同的材料,但不以此為限。The second signal line 131 is disposed on the first insulating layer 140 . Part of the second signal line 131 can also be disposed in the opening 141 of the first insulating layer 140 , so that the second signal line 131 can be electrically connected to the first signal line 130 through the opening 141 . The second signal line 131 and the first signal line 130 are respectively located on opposite sides of the first insulating layer 140 . In this embodiment, the material of the second signal line 131 may be the same as or similar to that of the first signal line 130 , and details are not described herein again. In some embodiments, the first signal line 130 and the second signal line 131 may be made of the same or different materials, but not limited thereto.

此外,在本實施例中,第二訊號線131對應於第一訊號線130設置。第二訊號線131於基板110上的正投影與第一訊號線130於基板110上的正投影至少部分重疊。於一實施例中,第一訊號線130可有部分未與第二訊號線131重疊。在顯示裝置100的上視圖中(如圖1A所示),第一訊號線130的最大寬度為W1,第二訊號線131的最大寬度為W2,且第一訊號線130的最大寬度W1不同於第二訊號線131的最大寬度W2。在本實施例中,第二訊號線131的最大寬度W2例如是大於等於第一訊號線130的最大寬度W1,但不以此為限。在一些實施例中,第二訊號線131的最大寬度W2與第一訊號線130的最大寬度W1的比值例如是大於等於0.5且小於等於2,但不以此為限。當第二訊號線131的最大寬度W2與第一訊號線130的最大寬度W1的比值小於0.5時,則無法顯著地降低訊號線的阻值。當第二訊號線131的最大寬度W2與第一訊號線130的最大寬度W1的比值大於2時,會顯著地降低畫素的開口率(aperture ratio)。在本實施例中,第一訊號線130的最大寬度W1以及第二訊號線131的最大寬度W2例如是沿著掃描線120的延伸方向(即方向X)進行量測。In addition, in this embodiment, the second signal line 131 is disposed corresponding to the first signal line 130 . The orthographic projection of the second signal line 131 on the substrate 110 at least partially overlaps the orthographic projection of the first signal line 130 on the substrate 110 . In one embodiment, a portion of the first signal line 130 may not overlap with the second signal line 131 . In the top view of the display device 100 (as shown in FIG. 1A ), the maximum width of the first signal line 130 is W1 , the maximum width of the second signal line 131 is W2 , and the maximum width W1 of the first signal line 130 is different from The maximum width W2 of the second signal line 131 . In this embodiment, the maximum width W2 of the second signal line 131 is, for example, greater than or equal to the maximum width W1 of the first signal line 130 , but not limited thereto. In some embodiments, the ratio of the maximum width W2 of the second signal line 131 to the maximum width W1 of the first signal line 130 is, for example, greater than or equal to 0.5 and less than or equal to 2, but not limited thereto. When the ratio of the maximum width W2 of the second signal line 131 to the maximum width W1 of the first signal line 130 is less than 0.5, the resistance of the signal line cannot be significantly reduced. When the ratio of the maximum width W2 of the second signal line 131 to the maximum width W1 of the first signal line 130 is greater than 2, the aperture ratio of the pixels will be significantly reduced. In this embodiment, the maximum width W1 of the first signal line 130 and the maximum width W2 of the second signal line 131 are, for example, measured along the extending direction of the scan line 120 (ie, the direction X).

在本實施例中,顯示裝置100還包括第二絕緣層180以及第三絕緣層182。第二絕緣層180設置於第二訊號線131上,以覆蓋第二訊號線131以及第一絕緣層140。第二絕緣層180與電晶體150分別設置於第一絕緣層140的相對兩側。第二絕緣層180具有開口181,且開口181連通第一絕緣層140的開口142,以暴露出部分的漏極SD2。第三絕緣層182設置於第二絕緣層180上,以使第三絕緣層182與第一絕緣層140分別設置於第二絕緣層180的相對兩側。第三絕緣層182具有開口183,且開口183連通第二絕緣層180的開口181以及第一絕緣層140的開口142,以暴露出部分的漏極SD2。在本實施例中,雖然在第二訊號線131上設置有第二絕緣層180,但本揭露不以此為限,也就是說,在其他實施例中,也可省略第二絕緣層180,而將第三絕緣層182直接設置於第二訊號線131上。此外,在顯示裝置100的上視圖中,開口183、181、142、141的輪廓是指開口183、181、142、141的底部的輪廓,例如為矩形,但不以此為限。在一些實施例中,開口183、181、142、141的底部的輪廓也可以為圓形、橢圓形、梯形、正方形等,且上述輪廓可能包含些微邊緣變形及頂點具有圓角等結構。應知道的是,其他實施例的開口於上視圖中也可以具有上述的輪廓,但不以此為限。In this embodiment, the display device 100 further includes a second insulating layer 180 and a third insulating layer 182 . The second insulating layer 180 is disposed on the second signal line 131 to cover the second signal line 131 and the first insulating layer 140 . The second insulating layer 180 and the transistor 150 are respectively disposed on opposite sides of the first insulating layer 140 . The second insulating layer 180 has an opening 181, and the opening 181 communicates with the opening 142 of the first insulating layer 140 to expose a part of the drain electrode SD2. The third insulating layer 182 is disposed on the second insulating layer 180 , so that the third insulating layer 182 and the first insulating layer 140 are respectively disposed on opposite sides of the second insulating layer 180 . The third insulating layer 182 has an opening 183, and the opening 183 communicates with the opening 181 of the second insulating layer 180 and the opening 142 of the first insulating layer 140 to expose part of the drain electrode SD2. In this embodiment, although the second insulating layer 180 is disposed on the second signal line 131, the present disclosure is not limited to this, that is, in other embodiments, the second insulating layer 180 may also be omitted. The third insulating layer 182 is directly disposed on the second signal line 131 . In addition, in the top view of the display device 100 , the outlines of the openings 183 , 181 , 142 and 141 refer to the outlines of the bottoms of the openings 183 , 181 , 142 and 141 , such as rectangles, but not limited thereto. In some embodiments, the contours of the bottoms of the openings 183 , 181 , 142 , 141 can also be circular, oval, trapezoidal, square, etc., and the above contours may include slight edge deformation and rounded corners at the apex. It should be known that the openings of other embodiments may also have the above-mentioned outlines in the top view, but are not limited thereto.

像素電極160設置於第三絕緣層182上,且位於第四絕緣層184與第三絕緣層182之間。部分的像素電極160還可設置於開口183、開口181以及開口142內,以使像素電極160可通過開口183、開口181以及、開口142以及漏極SD2電性連接至電晶體150。在一些實施例中,在顯示裝置100的上視圖中,像素電極160、160’可以與第二訊號線131有部分重疊,但不以此為限。第二絕緣層180及第三絕緣層182亦可為單層或其他多層結構,且可例如包含有機材料、無機材料或前述之組合,但不以此為限。像素電極160的材料可例如包含透明導電材料,但不以此為限。The pixel electrode 160 is disposed on the third insulating layer 182 and between the fourth insulating layer 184 and the third insulating layer 182 . Part of the pixel electrode 160 can also be disposed in the opening 183 , the opening 181 and the opening 142 , so that the pixel electrode 160 can be electrically connected to the transistor 150 through the opening 183 , the opening 181 and the opening 142 and the drain SD2 . In some embodiments, in the top view of the display device 100, the pixel electrodes 160 and 160' may partially overlap with the second signal line 131, but not limited thereto. The second insulating layer 180 and the third insulating layer 182 may also be a single layer or other multi-layer structures, and may include organic materials, inorganic materials or combinations thereof, but not limited thereto. The material of the pixel electrode 160 may include, for example, a transparent conductive material, but is not limited thereto.

在本實施例中,在顯示裝置100的上視圖中,將垂直於掃描線120的延伸方向的方向定義為方向Y (即垂直於方向X)。接著,如圖1A所示,在顯示裝置100的上視圖中,像素電極160對應於掃描線120(例如掃描線120可提供一電壓,使得第一訊號線130及/或第二訊號線131根據該電壓決定對像素電極160充電與否),像素電極160’對應於掃描線120’ (例如掃描線120’可提供一電壓,使得第一訊號線130及/或第二訊號線131根據該電壓決定對像素電極160’充電與否),且像素電極160於方向Y上相鄰於像素電極160’;像素電極160具有相鄰於掃描線120的第一側161以及與第一側161相對的第二側162,且像素電極160’具有相鄰於掃描線120’的第一側161’以及與第一側161’相對的第二側162’。在另一些實施例中,像素電極160、160’的第一側161、161’及第二側162、162’可以為非直線邊緣(例如具有圓弧或凹陷邊緣),第一側161及第二側162為分離的兩段側邊,且第一側161相對於第二側162鄰近掃描線120,第二側162相對於第一側161遠離掃描線120;第一側161’及第二側162’為分離的兩段側邊,且第一側161’相對於第二側162’鄰近掃描線120’,第二側162’相對於第一側161’遠離掃描線120’。接著,於方向Y上,掃描線120與像素電極160的第一側161之間的距離可小於掃描線120與像素電極160的第二側162之間的距離。在顯示裝置100的上視圖中,像素電極160的第一側161與沿著方向Y上相鄰的像素電極160’的第一側161’互相面對,且像素電極160的第二側162與沿著方向Y上相鄰的像素電極160’的第二側162’互相背對。舉例而言,像素電極160的第一側161與像素電極160’的第一側161’沿方向Y的距離小於像素電極160的第二側162與像素電極160’的第二側162’ 沿方向Y的距離。即,像素電極160與像素電極160’是以背對背(back-to-back)的方式進行配置。In this embodiment, in the top view of the display device 100 , the direction perpendicular to the extending direction of the scan lines 120 is defined as the direction Y (ie, perpendicular to the direction X). Next, as shown in FIG. 1A , in the top view of the display device 100 , the pixel electrodes 160 correspond to the scan lines 120 (for example, the scan lines 120 can provide a voltage, so that the first signal lines 130 and/or the second signal lines 131 are The voltage determines whether to charge the pixel electrode 160 or not), and the pixel electrode 160' corresponds to the scan line 120' (for example, the scan line 120' can provide a voltage, so that the first signal line 130 and/or the second signal line 131 can be based on the voltage determine whether to charge the pixel electrode 160 ′), and the pixel electrode 160 is adjacent to the pixel electrode 160 ′ in the direction Y; the pixel electrode 160 has a first side 161 adjacent to the scan line 120 and a first side 161 opposite to the first side 161 The second side 162, and the pixel electrode 160' has a first side 161' adjacent to the scan line 120' and a second side 162' opposite to the first side 161'. In other embodiments, the first sides 161 , 161 ′ and the second sides 162 , 162 ′ of the pixel electrodes 160 , 160 ′ may be non-linear edges (eg, have arc or concave edges). The two sides 162 are two separated sides, and the first side 161 is adjacent to the scan line 120 relative to the second side 162 , and the second side 162 is far away from the scan line 120 relative to the first side 161 ; the first side 161 ′ and the second side 161 The side 162' is two separated sides, and the first side 161' is adjacent to the scan line 120' relative to the second side 162', and the second side 162' is far from the scan line 120' relative to the first side 161'. Then, in the direction Y, the distance between the scan line 120 and the first side 161 of the pixel electrode 160 may be smaller than the distance between the scan line 120 and the second side 162 of the pixel electrode 160 . In the top view of the display device 100, the first side 161 of the pixel electrode 160 and the first side 161' of the pixel electrode 160' adjacent along the direction Y face each other, and the second side 162 of the pixel electrode 160 and The second sides 162' of adjacent pixel electrodes 160' along the direction Y face away from each other. For example, the distance between the first side 161 of the pixel electrode 160 and the first side 161' of the pixel electrode 160' along the direction Y is smaller than the distance between the second side 162 of the pixel electrode 160 and the second side 162' of the pixel electrode 160' along the direction Y Y distance. That is, the pixel electrode 160 and the pixel electrode 160' are arranged in a back-to-back manner.

此外,在顯示裝置100的上視圖中,第一絕緣層140的開口141可以鄰近像素電極160的第二側162且遠離像素電極160的第一側161。即,於方向Y上,第一絕緣層140的開口141與像素電極160的第二側162之間的距離可以小於第一絕緣層140的開口141與像素電極160的第一側161之間的距離。因此,藉由將像素電極160與像素電極160’以背對背(back-to-back)的方式進行配置,並將第一絕緣層140的開口141鄰近設置在像素電極160的第二側162,可使第一訊號線130與第二訊號線131的接觸孔(即第一絕緣層140的開口141)的設置遠離電晶體150的區域。因此,可使第一訊號線130與第二訊號線131的接觸孔的製程較簡單並提高製程良率,且可避免造成電晶體150的區域的開口率下降。In addition, in the top view of the display device 100 , the opening 141 of the first insulating layer 140 may be adjacent to the second side 162 of the pixel electrode 160 and away from the first side 161 of the pixel electrode 160 . That is, in the direction Y, the distance between the opening 141 of the first insulating layer 140 and the second side 162 of the pixel electrode 160 may be smaller than the distance between the opening 141 of the first insulating layer 140 and the first side 161 of the pixel electrode 160 distance. Therefore, by arranging the pixel electrode 160 and the pixel electrode 160 ′ in a back-to-back manner, and disposing the opening 141 of the first insulating layer 140 adjacent to the second side 162 of the pixel electrode 160 , it is possible to The contact holes of the first signal line 130 and the second signal line 131 (ie, the opening 141 of the first insulating layer 140 ) are arranged away from the area of the transistor 150 . Therefore, the manufacturing process of the contact holes of the first signal line 130 and the second signal line 131 can be simplified, the process yield can be improved, and the reduction of the aperture ratio of the region of the transistor 150 can be avoided.

在本實施例中,顯示裝置100可選擇性還包括第四絕緣層184、共用電極185以及第五絕緣層186。第四絕緣層184設置於像素電極160上以及/或第三絕緣層182的開口183內。共用電極185設置於第四絕緣層184上以及/或第三絕緣層182的開口183內,以使第四絕緣層184位於共用電極185與像素電極160之間。第五絕緣層186設置於像素電極160與第三絕緣層182之間。在本實施例中,第二絕緣層180與第五絕緣層186可於顯示裝置100的製作過程中降低第三絕緣層182和/或漏極SD2的損壞機率。然而,在一些實施例中,也可省略第五絕緣層186,而將像素電極160直接設置於第三絕緣層182上,如圖3B及圖5B所示。第四絕緣層184以及第五絕緣層186亦可為單層或其他多層結構,且可例如包含有機材料、無機材料或前述之組合,但不以此為限。共用電極185的材料可例如包含透明導電材料,但不以此為限。In this embodiment, the display device 100 may optionally further include a fourth insulating layer 184 , a common electrode 185 and a fifth insulating layer 186 . The fourth insulating layer 184 is disposed on the pixel electrode 160 and/or in the opening 183 of the third insulating layer 182 . The common electrode 185 is disposed on the fourth insulating layer 184 and/or in the opening 183 of the third insulating layer 182 , so that the fourth insulating layer 184 is located between the common electrode 185 and the pixel electrode 160 . The fifth insulating layer 186 is disposed between the pixel electrode 160 and the third insulating layer 182 . In this embodiment, the second insulating layer 180 and the fifth insulating layer 186 can reduce the damage probability of the third insulating layer 182 and/or the drain electrode SD2 during the manufacturing process of the display device 100 . However, in some embodiments, the fifth insulating layer 186 can also be omitted, and the pixel electrode 160 is directly disposed on the third insulating layer 182, as shown in FIG. 3B and FIG. 5B . The fourth insulating layer 184 and the fifth insulating layer 186 may also be a single layer or other multi-layer structures, and may include organic materials, inorganic materials or combinations thereof, but not limited thereto. The material of the common electrode 185 may include, for example, a transparent conductive material, but is not limited thereto.

在另一些實施例中,共用電極185可以設置於像素電極160與電晶體150之間,且共用電極185可以包含一開口(未示出),像素電極160可以通過共用電極185的開口電性連接電晶體150,但本揭露不以此為限。In other embodiments, the common electrode 185 may be disposed between the pixel electrode 160 and the transistor 150 , and the common electrode 185 may include an opening (not shown), and the pixel electrode 160 may be electrically connected through the opening of the common electrode 185 The transistor 150, but the disclosure is not limited thereto.

簡言之,在本實施例顯示裝置100中,由於第二訊號線131設置於第一訊號線130上,且第二訊號線131可通過第一絕緣層140的開口141電性連接至第一訊號線130,因而使得本實施例的顯示裝置100可利用雙層的訊號線(即第一訊號線130以及第二訊號線131)來進行訊號傳輸。因此,相較於習知的高像素的顯示裝置因只有單層的訊號線而有高阻值(resistance)的問題,本實施例的顯示裝置100可藉由雙層的訊號線(即第一訊號線130以及第二訊號線131)的設置來降低訊號線的阻值(resistance),以增加面板驅動能力,並利於高頻(例如大於90Hz,但不限於此)驅動。In short, in the display device 100 of the present embodiment, since the second signal line 131 is disposed on the first signal line 130 , and the second signal line 131 can be electrically connected to the first signal line 131 through the opening 141 of the first insulating layer 140 The signal line 130 thus enables the display device 100 of the present embodiment to use double-layered signal lines (ie, the first signal line 130 and the second signal line 131 ) for signal transmission. Therefore, compared with the conventional high-pixel display device, which has a problem of high resistance due to only a single layer of signal lines, the display device 100 of the present embodiment can use a double layer of signal lines (ie, the first The setting of the signal line 130 and the second signal line 131) reduces the resistance of the signal line to increase the panel driving capability and facilitate high frequency (eg, greater than 90 Hz, but not limited to) driving.

以下將列舉其他實施例以作為說明。在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。Other examples are listed below for illustration. It must be noted here that the following embodiments use the element numbers and part of the contents of the previous embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and repeated descriptions in the following embodiments will not be repeated.

圖2A為本揭露另一實施例的顯示裝置的上視示意圖。圖2B為圖2A的顯示裝置沿剖面線C-C’的剖面示意圖。圖2A的顯示裝置沿剖面線A-A’的剖面示意圖請參考圖1B。請同時參照圖1A、1C與圖2A-2B,本實施例的顯示裝置100a大致相似於圖1A以及圖1C的顯示裝置100,因此兩實施例中相同與相似的構件於此不再重述。本實施例的顯示裝置100a不同於顯示裝置100之處主要在於,本實施例的第一絕緣層(未繪示)的開口141a為溝槽,且溝槽(即開口141a)的長軸或長邊以平行於掃描線120的方向(即方向X)進行延伸。FIG. 2A is a schematic top view of a display device according to another embodiment of the disclosure. FIG. 2B is a schematic cross-sectional view of the display device of FIG. 2A along the section line C-C'. Please refer to FIG. 1B for a schematic cross-sectional view of the display device of FIG. 2A along the section line A-A'. 1A , 1C and FIGS. 2A-2B at the same time, the display device 100 a of this embodiment is substantially similar to the display device 100 of FIGS. 1A and 1C , so the same and similar components in the two embodiments will not be repeated here. The display device 100a of the present embodiment is different from the display device 100 mainly in that the opening 141a of the first insulating layer (not shown) in the present embodiment is a trench, and the long axis or length of the trench (ie, the opening 141a) The edges extend in a direction parallel to the scan line 120 (ie, direction X).

具體來說,請同時參照圖1C與圖2A-2B,在本實施例的顯示裝置100a中,將圖1C中位於第二訊號線131與第一訊號線130之間的部分的第一絕緣層140移除,以形成以平行於掃描線120的方向(即方向X)進行延伸的溝槽(即開口141a),如圖2A所示。接著,如圖2B所示,由於位於第二訊號線131a與第一訊號線130之間的部分的第一絕緣層已被移除,而使得第二訊號線131a可於第一絕緣層的開口141a中以直接接觸的方式設置在第一訊號線130上,藉此可增加第二訊號線131a與第一訊號線130之間的接觸面積。Specifically, please refer to FIG. 1C and FIGS. 2A-2B at the same time. In the display device 100a of the present embodiment, the first insulating layer in the portion between the second signal line 131 and the first signal line 130 in FIG. 1C is divided into 140 is removed to form trenches (ie, openings 141 a ) extending in a direction parallel to the scan line 120 (ie, direction X), as shown in FIG. 2A . Next, as shown in FIG. 2B , since the first insulating layer between the second signal line 131a and the first signal line 130 has been removed, the second signal line 131a can be located in the opening of the first insulating layer The 141 a is disposed on the first signal line 130 in a direct contact manner, thereby increasing the contact area between the second signal line 131 a and the first signal line 130 .

圖3A為本揭露另一實施例的顯示裝置的上視示意圖。圖3B為圖3A的顯示裝置沿剖面線D-D’的剖面示意圖。圖3A的顯示裝置沿剖面線C-C’的剖面示意圖請參考圖2B。請同時參照圖1A-1B與圖2A-2B,本實施例的顯示裝置100b大致相似於圖1A-1B的顯示裝置100,因此兩實施例中相同與相似的構件於此不再重述。本實施例的顯示裝置100b不同於顯示裝置100之處主要在於,本實施例的顯示裝置100b還包括轉接墊190。FIG. 3A is a schematic top view of a display device according to another embodiment of the disclosure. FIG. 3B is a schematic cross-sectional view of the display device of FIG. 3A along the section line D-D'. Please refer to FIG. 2B for a schematic cross-sectional view of the display device of FIG. 3A along the section line C-C'. 1A-1B and FIGS. 2A-2B at the same time, the display device 100b of this embodiment is substantially similar to the display device 100 of FIGS. 1A-1B , so the same and similar components in the two embodiments will not be repeated here. The main difference between the display device 100 b of this embodiment and the display device 100 is that the display device 100 b of this embodiment further includes a transition pad 190 .

詳細來說,請同時參照圖3A與圖3B,在本實施例中,第一絕緣層140b具有開口142b,第二絕緣層180b具有開口181b,且第三絕緣層182b具有開口183b。第一絕緣層140b的開口142b暴露出部分的漏極SD2。第二絕緣層180b的開口181b連通第一絕緣層140b的開口142b也暴露出部分的漏極SD2。第三絕緣層182b的開口183b暴露出部分的轉接墊190。3A and 3B, in this embodiment, the first insulating layer 140b has an opening 142b, the second insulating layer 180b has an opening 181b, and the third insulating layer 182b has an opening 183b. The opening 142b of the first insulating layer 140b exposes a portion of the drain electrode SD2. The opening 181b of the second insulating layer 180b communicates with the opening 142b of the first insulating layer 140b and also exposes part of the drain electrode SD2. The opening 183b of the third insulating layer 182b exposes part of the transfer pad 190 .

在本實施例中,轉接墊190設置於第一絕緣層140b、第二訊號線131以及第二絕緣層180b上。第二絕緣層180b設置於第二訊號線131與轉接墊190之間。轉接墊190設置於第三絕緣層182b與第二絕緣層180b之間。轉接墊190還可設置於第二絕緣層180b的開口181b以及第一絕緣層140b的開口142b內,以使轉接墊190可通過第二絕緣層180b的開口181b以及第一絕緣層140b的開口142b電性連接至漏極SD2。接著,由於像素電極160b除了設置於第三絕緣層182b上,還可設置於開口183b內,以使像素電極160b可通過開口183b電性連接至轉接墊190。也就是說,漏極SD2可通過轉接墊190電性連接至像素電極160b。此外,由於轉接墊190 與第二訊號線131分別設置在不同的層別,因而可避免轉接墊190與第二訊號線131電性連接,以確保源極SD1與漏極SD2之間不會有短路(short circuit)的問題,且可使轉接墊190相較於漏極SD2有較大的面積可與像素電極160b接觸。In this embodiment, the transfer pad 190 is disposed on the first insulating layer 140b, the second signal line 131 and the second insulating layer 180b. The second insulating layer 180b is disposed between the second signal line 131 and the transfer pad 190 . The transfer pad 190 is disposed between the third insulating layer 182b and the second insulating layer 180b. The transfer pad 190 can also be disposed in the opening 181b of the second insulating layer 180b and the opening 142b of the first insulating layer 140b, so that the transfer pad 190 can pass through the opening 181b of the second insulating layer 180b and the opening 142b of the first insulating layer 140b. The opening 142b is electrically connected to the drain electrode SD2. Next, in addition to being disposed on the third insulating layer 182b, the pixel electrode 160b can also be disposed in the opening 183b, so that the pixel electrode 160b can be electrically connected to the transfer pad 190 through the opening 183b. That is, the drain electrode SD2 can be electrically connected to the pixel electrode 160b through the pad 190 . In addition, since the transfer pad 190 and the second signal line 131 are respectively disposed at different layers, it can avoid the electrical connection between the transfer pad 190 and the second signal line 131, so as to ensure that there is no connection between the source SD1 and the drain SD2. There is a short circuit problem, and the transfer pad 190 can have a larger area than the drain SD2 to be in contact with the pixel electrode 160b.

在本實施例中,轉接墊190對應於漏極SD2設置。轉接墊190於基板110上的正投影與漏極SD2於基板110上的正投影至少部分重疊,且轉接墊190於基板110上的正投影大於漏極SD2於基板110上的正投影。在顯示裝置100b的上視圖中(如圖3A所示),沿方向Y上,轉接墊190的最大寬度W3大於漏極SD2的最大寬度W4。在本實施例中,轉接墊190的材料可包括透明導電材料或非透明導電材料,例如銦錫氧化物、銦鋅氧化物、氧化銦、氧化鋅、氧化錫、金屬材料、其它合適材料或上述組合,但不以此為限。在一些實施例中,前述金屬材料可包括鉬(Mo)、鈦(Ti)、鉭(Ta)、鈮(Nb)、鉿(Hf)、鎳(Ni),鉻(Cr)、鈷(Co),、鋯(Zr)、鎢(W)、鋁(Al)、銅(Cu)、銀(Ag),其他合適的金屬,或上述材料的合金或組合,但不以此為限。In this embodiment, the transfer pad 190 is disposed corresponding to the drain electrode SD2. The orthographic projection of the transfer pad 190 on the substrate 110 at least partially overlaps with the orthographic projection of the drain SD2 on the substrate 110 , and the orthographic projection of the transfer pad 190 on the substrate 110 is greater than the orthographic projection of the drain SD2 on the substrate 110 . In the top view of the display device 100b (as shown in FIG. 3A ), along the direction Y, the maximum width W3 of the transfer pad 190 is greater than the maximum width W4 of the drain electrode SD2 . In this embodiment, the material of the transfer pad 190 may include a transparent conductive material or a non-transparent conductive material, such as indium tin oxide, indium zinc oxide, indium oxide, zinc oxide, tin oxide, metal material, other suitable materials or The above combination, but not limited thereto. In some embodiments, the aforementioned metal material may include molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), nickel (Ni), chromium (Cr), cobalt (Co) ,, zirconium (Zr), tungsten (W), aluminum (Al), copper (Cu), silver (Ag), other suitable metals, or alloys or combinations of the above materials, but not limited thereto.

在本實施例中,由於轉接墊190於基板110上的正投影的面積大於漏極SD2於基板110上的正投影的面積,且在顯示裝置100b的上視圖中(如圖3A所示),轉接墊190的最大寬度W3大於漏極SD2的最大寬度W4,因此,相較於漏極SD2,轉接墊190可具有較大的面積與像素電極160b接觸。因此,本實施例的顯示裝置100b可藉由面積較大的轉接墊190與像素電極160b來增加接觸面積,以降低像素電極160b與漏極SD2之間的阻值。In this embodiment, since the area of the orthographic projection of the transfer pad 190 on the substrate 110 is larger than the area of the orthographic projection of the drain electrode SD2 on the substrate 110, and in the top view of the display device 100b (as shown in FIG. 3A ) , the maximum width W3 of the transfer pad 190 is greater than the maximum width W4 of the drain electrode SD2 . Therefore, compared with the drain electrode SD2 , the transfer pad 190 can have a larger area in contact with the pixel electrode 160 b . Therefore, in the display device 100b of the present embodiment, the contact area between the pixel electrode 160b and the contact pad 190 with a larger area can be increased, so as to reduce the resistance value between the pixel electrode 160b and the drain electrode SD2.

此外,在一些實施例中,還可在像素電極160b與第三絕緣層182b之間設置一絕緣層(未示出),以於顯示裝置100b的製作過程中降低第三絕緣層182b的損壞機率。在一些實施例中,也可在第三絕緣層182b與轉接墊190之間設置一絕緣層(未示出),以於顯示裝置100b的製作過程中降低轉接墊190的損壞機率。雖然本實施例中的第一絕緣層140b的開口141a為溝槽,但不以此為限,在一些實施例中,第一絕緣層140b的開口也可以為孔洞,如圖1A的開口141所示。In addition, in some embodiments, an insulating layer (not shown) may be disposed between the pixel electrode 160b and the third insulating layer 182b, so as to reduce the damage probability of the third insulating layer 182b during the manufacturing process of the display device 100b . In some embodiments, an insulating layer (not shown) may also be disposed between the third insulating layer 182b and the transfer pad 190 to reduce the damage probability of the transfer pad 190 during the manufacturing process of the display device 100b. Although the opening 141a of the first insulating layer 140b in this embodiment is a trench, it is not limited to this. In some embodiments, the opening 141a of the first insulating layer 140b can also be a hole, as shown in the opening 141 of FIG. 1A . Show.

圖4A為本揭露另一實施例的顯示裝置的上視示意圖。圖4B為圖4A的顯示裝置沿剖面線E-E’的剖面示意圖。請同時參照圖1A-1B與圖4A-4B,本實施例的顯示裝置100b大致相似於圖1A-1B的顯示裝置100,因此兩實施例中相同與相似的構件於此不再重述。本實施例的顯示裝置100c不同於顯示裝置100之處主要在於,在本實施例的顯示裝置100c的上視圖中(如圖4A所示),像素電極160c的第二側162c與方向Y上相鄰的像素電極160c’的第一側161c’互相面對。FIG. 4A is a schematic top view of a display device according to another embodiment of the disclosure. FIG. 4B is a schematic cross-sectional view of the display device of FIG. 4A along the section line E-E'. 1A-1B and FIGS. 4A-4B at the same time, the display device 100b of this embodiment is substantially similar to the display device 100 of FIGS. 1A-1B , so the same and similar components in the two embodiments will not be repeated here. The display device 100c of the present embodiment is different from the display device 100 mainly in that, in the top view of the display device 100c of the present embodiment (as shown in FIG. 4A ), the second side 162c of the pixel electrode 160c is in phase with the direction Y The first sides 161c' of adjacent pixel electrodes 160c' face each other.

詳細來說,請參照圖4A,在顯示裝置100c的上視圖中,像素電極160c對應於掃描線120c(例如掃描線120c可提供一電壓,使得第一訊號線130及/或第二訊號線131c根據該電壓決定對像素電極160c充電與否),像素電極160c’對應於掃描線120c’ (例如掃描線120c’可提供一電壓,使得第一訊號線130及/或第二訊號線131c根據該電壓決定對像素電極160c’充電與否),且像素電極160c於方向Y上相鄰於像素電極160c’;像素電極160c具有相鄰於掃描線120c的第一側161c以及與第一側161c相對的第二側162c,且像素電極160c’具有相鄰於掃描線120c’的第一側161c’以及與第一側161c’相對的第二側(未繪示)。4A, in the top view of the display device 100c, the pixel electrode 160c corresponds to the scan line 120c (for example, the scan line 120c can provide a voltage, so that the first signal line 130 and/or the second signal line 131c It is determined whether the pixel electrode 160c is charged or not according to the voltage), and the pixel electrode 160c' corresponds to the scan line 120c' (for example, the scan line 120c' can provide a voltage, so that the first signal line 130 and/or the second signal line 131c can be charged according to the voltage. The voltage determines whether the pixel electrode 160c' is charged or not), and the pixel electrode 160c is adjacent to the pixel electrode 160c' in the direction Y; the pixel electrode 160c has a first side 161c adjacent to the scan line 120c and opposite to the first side 161c and the pixel electrode 160c' has a first side 161c' adjacent to the scan line 120c' and a second side (not shown) opposite to the first side 161c'.

在本實施例的顯示裝置100c的上視圖中,像素電極160c的第二側162c與沿著方向Y上相鄰的像素電極160c’的第一側161c’互相面對。也就是說,像素電極160c’的第一側161c’鄰近像素電極160c的第二側162c,且像素電極160c’的第一側161c’遠離像素電極160c的第一側161c。在另一些實施例中,像素電極160c、160c’的第一側161c、161’及第二側162c(以及像素電極160c’的第二側(未繪示))可以為非直線邊緣(例如具有圓弧或凹陷邊緣),第一側161c及第二側162c為分離的兩段側邊,且第一側161c相對於第二側162c鄰近掃描線120c,第二側162c相對於第一側161c遠離掃描線120c;第一側161c’相對於像素電極160c’的第二側(未繪示)鄰近掃描線120c’, 像素電極160c’的第二側(未繪示)相對於第一側161c’遠離掃描線120c’。In the top view of the display device 100c of the present embodiment, the second side 162c of the pixel electrode 160c and the first side 161c' of the pixel electrode 160c' adjacent along the direction Y face each other. That is, the first side 161c' of the pixel electrode 160c' is adjacent to the second side 162c of the pixel electrode 160c, and the first side 161c' of the pixel electrode 160c' is away from the first side 161c of the pixel electrode 160c. In other embodiments, the first side 161c, 161' and the second side 162c of the pixel electrodes 160c, 160c' (and the second side (not shown) of the pixel electrode 160c') may be non-linear edges (eg, having arc or concave edge), the first side 161c and the second side 162c are two separated sides, and the first side 161c is adjacent to the scan line 120c relative to the second side 162c, and the second side 162c is opposite to the first side 161c Away from the scan line 120c; the second side (not shown) of the first side 161c' relative to the pixel electrode 160c' is adjacent to the scan line 120c', and the second side (not shown) of the pixel electrode 160c' is opposite to the first side 161c 'Away from scan line 120c'.

請同時參照圖4A與圖4B,在本實施例中,第一絕緣層140c具有開口141c以及開口142c,第二絕緣層180c具有開口181c,且第三絕緣層182c具有開口183c。第一絕緣層140c的開口141c暴露出部分的源極SD1(或第一訊號線130)。第一絕緣層140c的開口142c暴露出部分的漏極SD2。第二絕緣層180c的開口181c連通第一絕緣層140b的開口142c也暴露出部分的漏極SD2。第三絕緣層182c的開口183c連通第二絕緣層180c的開口181c以及第一絕緣層140b的開口142c也暴露出部分的漏極SD2。4A and 4B, in this embodiment, the first insulating layer 140c has openings 141c and 142c, the second insulating layer 180c has openings 181c, and the third insulating layer 182c has openings 183c. The opening 141c of the first insulating layer 140c exposes a part of the source electrode SD1 (or the first signal line 130). The opening 142c of the first insulating layer 140c exposes a portion of the drain electrode SD2. The opening 181c of the second insulating layer 180c communicates with the opening 142c of the first insulating layer 140b and also exposes part of the drain electrode SD2. The opening 183c of the third insulating layer 182c communicates with the opening 181c of the second insulating layer 180c and the opening 142c of the first insulating layer 140b and also exposes part of the drain electrode SD2.

在本實施例中,第二訊號線131c可設置於第一絕緣層140c上以及第一絕緣層140c的開口141c內,以使第二訊號線131c可通過開口141c與源極SD1(或第一訊號線130)電性連接。像素電極160c可設置於第三絕緣層182c上,且位於開口183c、開口181c以及開口142c內,以使像素電極160c可通過開口183c、開口181c、開口142c與漏極SD2電性連接。In this embodiment, the second signal line 131c can be disposed on the first insulating layer 140c and in the opening 141c of the first insulating layer 140c, so that the second signal line 131c can pass through the opening 141c and the source SD1 (or the first The signal line 130) is electrically connected. The pixel electrode 160c can be disposed on the third insulating layer 182c and located in the opening 183c, the opening 181c and the opening 142c, so that the pixel electrode 160c can be electrically connected to the drain electrode SD2 through the opening 183c, the opening 181c and the opening 142c.

圖5A為本揭露另一實施例的顯示裝置的上視示意圖。圖5B為圖5A的顯示裝置沿剖面線F-F’的剖面示意圖。請同時參照圖4A-4B與圖5A-5B,本實施例的顯示裝置100d大致相似於圖4A-4B的顯示裝置100c,因此兩實施例中相同與相似的構件於此不再重述。本實施例的顯示裝置100d不同於顯示裝置100c之處主要在於,本實施例的顯示裝置100d還包括轉接墊190d。FIG. 5A is a schematic top view of a display device according to another embodiment of the disclosure. FIG. 5B is a schematic cross-sectional view of the display device of FIG. 5A along the section line F-F'. 4A-4B and FIGS. 5A-5B at the same time, the display device 100d of this embodiment is substantially similar to the display device 100c of FIGS. 4A-4B , so the same and similar components in the two embodiments will not be repeated here. The display device 100d of this embodiment is different from the display device 100c mainly in that the display device 100d of this embodiment further includes a transition pad 190d.

詳細來說,請同時參照圖5A與圖5B,在本實施例中,第一絕緣層140d具有開口142d,第二絕緣層180d具有開口181d,且第三絕緣層182d具有開口183d。第一絕緣層140d的開口142d暴露出部分的漏極SD2。第二絕緣層180d的開口181d連通第一絕緣層140d的開口142d也暴露出部分的漏極SD2。第三絕緣層182d的開口183d暴露出部分的轉接墊190d。5A and 5B, in this embodiment, the first insulating layer 140d has openings 142d, the second insulating layer 180d has openings 181d, and the third insulating layer 182d has openings 183d. The opening 142d of the first insulating layer 140d exposes a portion of the drain electrode SD2. The opening 181d of the second insulating layer 180d communicates with the opening 142d of the first insulating layer 140d and also exposes part of the drain electrode SD2. The opening 183d of the third insulating layer 182d exposes part of the transfer pad 190d.

在本實施例中,轉接墊190d設置於第一絕緣層140d、第二訊號線131c以及第二絕緣層180d上。第二絕緣層180d設置於第二訊號線131c與轉接墊190d之間。轉接墊190d設置於第三絕緣層182d與第二絕緣層180d之間。轉接墊190d還可設置於第二絕緣層180d的開口181d以及第一絕緣層140d的開口142d內,以使轉接墊190d可通過第二絕緣層180d的開口181d以及第一絕緣層140d的開口142d電性連接至漏極SD2。接著,由於像素電極160d除了設置於第三絕緣層182d上,還可設置於開口183d內,以使像素電極160d可通過開口183d電性連接至轉接墊190d。也就是說,漏極SD2可通過轉接墊190d電性連接至像素電極160d。In this embodiment, the transfer pad 190d is disposed on the first insulating layer 140d, the second signal line 131c and the second insulating layer 180d. The second insulating layer 180d is disposed between the second signal line 131c and the transfer pad 190d. The transfer pad 190d is disposed between the third insulating layer 182d and the second insulating layer 180d. The transfer pad 190d can also be disposed in the opening 181d of the second insulating layer 180d and the opening 142d of the first insulating layer 140d, so that the transfer pad 190d can pass through the opening 181d of the second insulating layer 180d and the opening 142d of the first insulating layer 140d. The opening 142d is electrically connected to the drain electrode SD2. Next, since the pixel electrode 160d is not only disposed on the third insulating layer 182d, but also can be disposed in the opening 183d, so that the pixel electrode 160d can be electrically connected to the transfer pad 190d through the opening 183d. That is to say, the drain electrode SD2 can be electrically connected to the pixel electrode 160d through the transfer pad 190d.

在本實施例中,轉接墊190d對應於漏極SD2設置。轉接墊190d於基板110上的正投影與漏極SD2於基板110上的正投影可至少部分重疊,且轉接墊190d於基板110上的正投影的面積大於漏極SD2於基板110上的正投影的面積。在顯示裝置100d的上視圖中(如圖5A所示),沿方向Y上,轉接墊190d的最大寬度W3’大於漏極SD2的最大寬度W4’。在本實施例中,轉接墊190d可包含的材料可與轉接墊190相同或相似,於此不再贅述。In this embodiment, the transfer pad 190d is disposed corresponding to the drain electrode SD2. The orthographic projection of the transfer pad 190 d on the substrate 110 and the orthographic projection of the drain SD2 on the substrate 110 may at least partially overlap, and the area of the orthographic projection of the transfer pad 190 d on the substrate 110 is larger than that of the drain SD2 on the substrate 110 . The area of the orthographic projection. In the top view of the display device 100d (as shown in FIG. 5A ), along the direction Y, the maximum width W3' of the transfer pad 190d is greater than the maximum width W4' of the drain electrode SD2. In this embodiment, the material of the transfer pad 190d may be the same as or similar to that of the transfer pad 190 , and details are not described herein again.

此外,在一些實施例中,還可在像素電極160d與第三絕緣層182d之間設置一絕緣層(未示出),以於顯示裝置100d的製作過程中降低第三絕緣層182d的損壞機率。在一些實施例中,也可在第三絕緣層182d與轉接墊190d之間設置一絕緣層(未示出),以於顯示裝置100d的製作過程中降低轉接墊190d的損壞機率。In addition, in some embodiments, an insulating layer (not shown) may be disposed between the pixel electrode 160d and the third insulating layer 182d, so as to reduce the damage probability of the third insulating layer 182d during the manufacturing process of the display device 100d . In some embodiments, an insulating layer (not shown) may also be disposed between the third insulating layer 182d and the transfer pad 190d to reduce the damage probability of the transfer pad 190d during the manufacturing process of the display device 100d.

綜上所述,在本揭露實施例的顯示裝置中,由於第二訊號線設置於第一訊號線上,且第二訊號線可通過第一絕緣層的開口電性連接至第一訊號線,因而使得本實施例的顯示裝置可利用雙層的訊號線(即第一訊號線以及第二訊號線)來進行訊號傳輸。因此,本實施例的顯示裝置可藉由雙層的訊號線(即第一訊號線以及第二訊號線)的設置來降低訊號線的阻值(resistance),以增加面板驅動能力,例如可有利於高頻(例如大於90Hz)驅動。To sum up, in the display device of the embodiment of the present disclosure, since the second signal line is disposed on the first signal line, and the second signal line can be electrically connected to the first signal line through the opening of the first insulating layer, the As a result, the display device of this embodiment can utilize the double-layered signal lines (ie, the first signal line and the second signal line) for signal transmission. Therefore, in the display device of this embodiment, the resistance of the signal lines can be reduced by the arrangement of the double-layered signal lines (ie, the first signal line and the second signal line), so as to increase the panel driving capability. For example, it is beneficial to Drive at high frequencies (eg greater than 90Hz).

雖然本揭露已以實施例揭露如上,然其並非用以限定本揭露,任何所屬技術領域中具有通常知識者,在不脫離本揭露的精神和範圍內,當可作些許的更動與潤飾,故本揭露的保護範圍當視後附的申請專利範圍所界定者為準。Although the present disclosure has been disclosed above with examples, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present disclosure. The scope of protection of the present disclosure shall be determined by the scope of the appended patent application.

100、100a、100b、100c、100d:顯示裝置 110:基板 120、120’、120c、120c’:掃描線 130:第一訊號線 131、131c:第二訊號線 140、140b、140c、140d:第一絕緣層 141、141a、141c、142、142b、142c、142d、181、181b、181c、181d、183、183b、183c、183d:開口 150:電晶體 160、160’、160b、160c、160c’、160d:像素電極 161、161’、161c、161c’:第一側 162、162’、162c:第二側 170:緩衝層 171:遮蔽層 172:介電層 172a、172b:開孔 180、180b、180c、180d:第二絕緣層 182、182b、182c、182d:第三絕緣層 184:第四絕緣層 185:共用電極 186:第五絕緣層 190、190d:轉接墊 GE:閘極 GI:閘極絕緣層 GIa、GIb:開孔 SD1:源極 SD2:漏極 SE:半導體層 W1、W2、W3、W3’、W4、W4’:最大寬度 X、Y:方向 100, 100a, 100b, 100c, 100d: Display devices 110: Substrate 120, 120', 120c, 120c': scan lines 130: The first signal line 131, 131c: The second signal line 140, 140b, 140c, 140d: first insulating layer 141, 141a, 141c, 142, 142b, 142c, 142d, 181, 181b, 181c, 181d, 183, 183b, 183c, 183d: Opening 150: Transistor 160, 160', 160b, 160c, 160c', 160d: pixel electrodes 161, 161', 161c, 161c': first side 162, 162', 162c: second side 170: Buffer layer 171: Masking layer 172: Dielectric layer 172a, 172b: Opening 180, 180b, 180c, 180d: the second insulating layer 182, 182b, 182c, 182d: the third insulating layer 184: Fourth insulating layer 185: Common electrode 186: Fifth insulating layer 190, 190d: Adapter pad GE: gate GI: gate insulating layer GIa, GIb: Opening SD1: source SD2: Drain SE: Semiconductor layer W1, W2, W3, W3', W4, W4': maximum width X, Y: direction

圖1A為本揭露一實施例的顯示裝置的上視示意圖。 圖1B為圖1A的顯示裝置沿剖面線A-A’的剖面示意圖。 圖1C為圖1A的顯示裝置沿剖面線B-B’的剖面示意圖。 圖2A為本揭露另一實施例的顯示裝置的上視示意圖。 圖2B為圖2A的顯示裝置沿剖面線C-C’的剖面示意圖。 圖3A為本揭露另一實施例的顯示裝置的上視示意圖。 圖3B為圖3A的顯示裝置沿剖面線D-D’的剖面示意圖。 圖4A為本揭露另一實施例的顯示裝置的上視示意圖。 圖4B為圖4A的顯示裝置沿剖面線E-E’的剖面示意圖。 圖5A為本揭露另一實施例的顯示裝置的上視示意圖。 圖5B為圖5A的顯示裝置沿剖面線F-F’的剖面示意圖。 FIG. 1A is a schematic top view of a display device according to an embodiment of the disclosure. FIG. 1B is a schematic cross-sectional view of the display device of FIG. 1A along the section line A-A'. FIG. 1C is a schematic cross-sectional view of the display device of FIG. 1A along the section line B-B'. FIG. 2A is a schematic top view of a display device according to another embodiment of the disclosure. FIG. 2B is a schematic cross-sectional view of the display device of FIG. 2A along the section line C-C'. FIG. 3A is a schematic top view of a display device according to another embodiment of the disclosure. FIG. 3B is a schematic cross-sectional view of the display device of FIG. 3A along the section line D-D'. FIG. 4A is a schematic top view of a display device according to another embodiment of the disclosure. FIG. 4B is a schematic cross-sectional view of the display device of FIG. 4A along the section line E-E'. FIG. 5A is a schematic top view of a display device according to another embodiment of the disclosure. FIG. 5B is a schematic cross-sectional view of the display device of FIG. 5A along the section line F-F'.

100:顯示裝置 110:基板 120、120’:掃描線 130:第一訊號線 131:第二訊號線 141、142、181、183:開口 160、160’:像素電極 161、161’:第一側 162、162’:第二側 SD2:漏極 SE:半導體層 W1、W2:最大寬度 X、Y:方向 100: Display device 110: Substrate 120, 120': scan line 130: The first signal line 131: The second signal line 141, 142, 181, 183: Openings 160, 160': pixel electrode 161, 161': first side 162, 162': second side SD2: Drain SE: Semiconductor layer W1, W2: maximum width X, Y: direction

Claims (10)

一種顯示裝置,包括:基板;掃描線,設置於所述基板上;第一訊號線,設置於所述基板上;第一絕緣層,設置於所述第一訊號線上,且具有開口;第二訊號線,設置於所述第一絕緣層上,且通過所述開口與所述第一訊號線電性連接;電晶體,電性連接至所述掃描線以及所述第一訊號線;以及像素電極,電性連接至所述電晶體,且具有相鄰於所述掃描線的第一側以及與所述第一側相對的第二側,其中所述開口鄰近所述第二側,且遠離所述第一側,其中所述第一訊號線的延伸方向大致上平行於所述第二訊號線的延伸方向。 A display device, comprising: a substrate; a scanning line disposed on the substrate; a first signal line disposed on the substrate; a first insulating layer disposed on the first signal line and having an opening; a second a signal line, disposed on the first insulating layer, and electrically connected to the first signal line through the opening; a transistor, electrically connected to the scan line and the first signal line; and a pixel an electrode electrically connected to the transistor and having a first side adjacent to the scan line and a second side opposite the first side, wherein the opening is adjacent to the second side and away from the second side On the first side, the extending direction of the first signal line is substantially parallel to the extending direction of the second signal line. 如請求項1所述的顯示裝置,其中所述開口為溝槽,且所述溝槽以平行於所述掃描線的方向進行延伸。 The display device of claim 1, wherein the openings are trenches, and the trenches extend in a direction parallel to the scan lines. 如請求項1所述的顯示裝置,更包括:轉接墊,設置於所述第一絕緣層以及所述第二訊號線上,其中所述電晶體包括漏極,且所述漏極通過所述轉接墊電性連接至所述像素電極。 The display device of claim 1, further comprising: a transfer pad disposed on the first insulating layer and the second signal line, wherein the transistor includes a drain, and the drain passes through the The transfer pad is electrically connected to the pixel electrode. 如請求項3所述的顯示裝置,更包括:第二絕緣層,設置於所述第二訊號線與所述轉接墊之間。 The display device of claim 3, further comprising: a second insulating layer disposed between the second signal line and the transfer pad. 如請求項4所述的顯示裝置,其中所述第一絕緣層還具有另一開口,所述第二絕緣層具有開口,且所述第二絕緣層的所述開口連通所述第一絕緣層的所述另一開口。 The display device according to claim 4, wherein the first insulating layer further has another opening, the second insulating layer has an opening, and the opening of the second insulating layer communicates with the first insulating layer of said other opening. 如請求項5所述的顯示裝置,其中所述轉接墊通過所述第二絕緣層的所述開口以及所述第一絕緣層的所述另一開口電性連接至所述漏極。 The display device of claim 5, wherein the transfer pad is electrically connected to the drain electrode through the opening of the second insulating layer and the other opening of the first insulating layer. 如請求項3所述的顯示裝置,其中所述轉接墊的最大寬度大於所述漏極的最大寬度。 The display device of claim 3, wherein a maximum width of the transfer pad is greater than a maximum width of the drain. 如請求項1所述的顯示裝置,其中所述第一訊號線的最大寬度不同於所述第二訊號線的最大寬度。 The display device of claim 1, wherein a maximum width of the first signal line is different from a maximum width of the second signal line. 如請求項8所述的顯示裝置,其中所述第二訊號線的所述最大寬度與所述第一訊號線的所述最大寬度的比值大於等於0.5且小於等於2。 The display device of claim 8, wherein a ratio of the maximum width of the second signal line to the maximum width of the first signal line is greater than or equal to 0.5 and less than or equal to 2. 如請求項1所述的顯示裝置,其中所述第二訊號線的最大寬度大於等於所述第一訊號線的最大寬度。 The display device of claim 1, wherein a maximum width of the second signal line is greater than or equal to a maximum width of the first signal line.
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