TWI758963B - Bump disposed method for reducing border of flat panel display and touch and display driver integrated circuit using the same - Google Patents

Abstract

A bump disposed method for reducing border of flat panel display and a touch and display driver integrated circuit using the same are provided in the present invention. The method includes: dividing the integrated circuit into a left-side area, a middle-side area and a right-side area; sequentially disposing OLBs along with the first coordinate to the second coordinate of the second axis from the border of the middle-side area; and respectively disposing at least a dummy bump on vacant position of the left-side area and the right side area, wherein the first coordinate is not equal to the second coordinate.

Description

Pin assignment method of integrated circuit and in-cell touch display driving integrated circuit using the same

The present invention relates to a technology of a display driving integrated circuit, and further, the present invention relates to a pin configuration method of an integrated circuit and an in-cell touch display driving integrated circuit using the same.

FIG. 1 is a schematic diagram illustrating the configuration of outer lead bonding (OLB) pins and inner lead bonding (ILB) pins of an in-cell touch display driver IC of the prior art. Please refer to FIG. 1. In a conventional display touch driving device, the inner pins 101 and the outer pins 102 are evenly placed on the upper and lower sides of the touch display driving IC, as shown in FIG. 1. Show. Therefore, when the touch display driver IC is attached to the panel, the bonding stress will be evenly distributed on the pins on the upper and lower sides of the touch display driver IC, and the touch display driver IC will not be affected. The problem of uneven power.

However, due to the requirement of a full screen, the panel has a high requirement for the height limit of the lower edge. This pin design cannot meet the requirement of reducing the lower edge.

An object of the present invention is to provide a pin configuration method of an integrated circuit and an in-cell touch display driving integrated circuit using the same, so as to achieve a narrow frame design of a display panel.

An object of the present invention is to provide a pin configuration method of an integrated circuit and an in-cell touch display driving integrated circuit using the same, so as to achieve stress balance and avoid improper bonding.

In view of this, the present invention provides a method for configuring the pins of an integrated circuit, wherein the integrated circuit is used for driving a display panel, and the method for configuring the pins of the integrated circuit includes: on the surface of the integrated circuit along a first axis The direction is divided into the middle block, the left block and the right block; the outer pins of the integrated circuit are defined by the edge of the border between the middle block and the left and right blocks, along the first coordinate of the second axis The second coordinates to the second axis are sequentially arranged; and at least one auxiliary bump is respectively arranged in the left block and the right block, wherein the first coordinate is not equal to the second coordinate.

The present invention further provides an in-cell touch display driving integrated circuit for driving a display panel. The in-cell touch display driving integrated circuit includes a plurality of pins, a left side block, a middle block and A block on the right. The outer pins of the middle block are arranged along the first axis. The outer pin positions of the left block and the right block are respectively arranged from the edge of the middle block, along the first coordinate of the second axis to the second coordinate of the second axis; and the left block is arranged in sequence; and the vacant position of the right block, at least one auxiliary bump is respectively arranged, wherein the first coordinate is not equal to the second coordinate.

According to the method for arranging pins of an integrated circuit and an in-cell touch display driving integrated circuit using the same, the method for arranging the auxiliary bumps includes: a passivation protection layer on the integrated circuit. , the configuration of the auxiliary bumps is performed directly. In another preferred embodiment, the above-mentioned method for arranging the auxiliary bumps includes: setting a preset auxiliary metal at a preset position of the integrated circuit corresponding to the auxiliary bump; and assisting the blocks of the preset auxiliary metal Bump configuration.

The spirit of the present invention is that in the pin configuration of the integrated circuit, the outer pins are arranged in a trapezoidal-like sinking pin arrangement, that is, the outer pins on the left and right blocks of the integrated circuit The pin configuration is slightly lower than the outer pins of the central block, making it a trapezoid-like arrangement. By overlapping the concept of data fanout, the lower edge of the panel can be reduced, and auxiliary bumps (Dummy Bump) are set in the vacant positions in the left and right blocks of the IC to allow bonding. Or when bonding the above-mentioned integrated circuit, the problem of skew caused by uneven stress can be avoided.

In order to make the above-mentioned and other objects, features and advantages of the present invention more clearly understood, preferred embodiments are hereinafter described in detail in conjunction with the accompanying drawings.

FIG. 2 shows the pins of Outer Lead Bonding (OLB) and Inner Lead Bonding (ILB) of the in-cell touch display driver IC according to a preferred embodiment of the present invention configuration diagram. Please refer to Figure 2, this in-cell touch display driver IC adopts another design method, which is to change the external pin position to a sinking type. The in-cell touch display driving IC is divided into three blocks in the X-axis direction, which are a left block 201 , a middle block 202 and a right block 203 respectively. The outer pins of the middle block 202 are arranged along the X-axis direction. The outer pin positions of the left block 201 and the right block 203 are respectively arranged in sequence along the Y-axis coordinate Y1 to the Y-axis coordinate Y2. Therefore, an arrangement of sinking pins similar to a trapezoid is formed. The lower edge of the panel can be reduced by the fan-out concept of overlapping data. That is to say, the outer pin position extends along the X-axis direction in the middle block 202, and in the left block 201 and the right block 203, the outer pin position is formed by the middle block 202, the left and right blocks 201, The edge of the junction on both sides of 203 is extended and arranged in a direction away from the edge of the junction in a way of gradually shifting a certain distance, so the distribution is similar to a trapezoid.

However, the arrangement of the sunken pins may cause uneven stress in the bonding and bonding of the outer pin and the inner pin, which may lead to the in-cell touch display. After the driving integrated circuit is bonded, the left or right side of the outer pins is inclined, which leads to the problem of poor bonding yield between the display touch driving element and the panel.

FIG. 3 is a schematic diagram illustrating the configuration of the outer lead (OLB) pin and the inner lead (ILB) pin of the in-cell touch display driver IC according to a preferred embodiment of the present invention. Please refer to Figure 2 and Figure 3. The difference between Figure 2 and Figure 3 is that the in-cell touch display driver IC in Figure 3 has additional pins 301 and 302. This pin 301 And 302 are auxiliary bumps (Dummy Bump) respectively. In this embodiment, in the left block 201 and the right block 203 at the vacant position where no outer pin is formed or between the outer pin and the long edge of the integrated circuit, three auxiliary auxiliary devices are respectively installed. Bumps 301 , 302 . The size and quantity of the auxiliary bumps are adjusted elastically to increase the support stress during bonding and binding, thereby solving the problem of uneven distribution of bonding stress in the arrangement of the sunken outer pins. Since the auxiliary bump is used for auxiliary support, it does not necessarily need to be glued, and the present invention is not limited to this.

FIG. 4 is a schematic diagram of the configuration of the outer lead (OLB) pin and the inner lead (ILB) pin of the in-cell touch display driver IC according to a preferred embodiment of the present invention and a cross-sectional view thereof . Please refer to FIG. 4, the lower half is a cross-sectional view cut by the dotted line in the upper view. In general, the in-cell touch display driver IC will open the passivation layer (Passivation Layer) of the IC through the passivation protection mask during the manufacturing process, as shown in Figure 4, the purpose is to open the window position. The metal of the in-cell touch display driver IC can be electrically connected with the pins on the in-cell touch display driver IC, so that the signal or power supply of the in-cell touch display driver IC can be interconnected with the external environment. However, in order to solve the auxiliary bumps caused by the uneven adhesion stress, it is also necessary to let the passivation protection mask open windows at the positions of the auxiliary bumps when the in-cell touch display driver IC is manufactured. When the location of the auxiliary bump is required, the passivation protection mask of the in-cell touch display driver IC must be changed repeatedly, as shown in Figure 5. FIG. 5 is a schematic diagram of the configuration of the outer pins and inner pins of the in-cell touch display driving IC according to a preferred embodiment of the present invention, and a cross-sectional view thereof. Compared with the above-mentioned embodiment in FIG. 4 , there are only two auxiliary bumps in the embodiment in FIG. 5 . It can be seen from the description of the above-mentioned Figures 4 and 5 that due to the different auxiliary bump designs, the position of the passivation protection mask is re-modified, thus resulting in an increase in the number of revisions of the mask of the in-cell touch display driver IC. The manufacturing cost of the in-cell touch display driver IC also increases.

FIG. 6 is a schematic diagram showing the configuration of the outer pins and inner pins of the in-cell touch display driving IC according to a preferred embodiment of the present invention, and a cross-sectional view thereof. Please refer to FIG. 6 , in this embodiment, regardless of the arrangement of the sinking pins and the position of the auxiliary bumps, except that the normal solder pads need to be opened in the passivation protection mask, the other auxiliary bumps correspond to The mask does not allow it to open the window, and directly in the packaging process, the auxiliary bump is grown on the position required by the passivation protection layer, so that the position of the auxiliary bump can be adjusted flexibly without repeating the passivation protection. The benefits of reticle. Therefore, many integrated circuit manufacturing costs can be saved. That is, in this embodiment, the auxiliary bump is electrically isolated from the upper metal of the integrated circuit.

In the above-mentioned embodiment, if the number of auxiliary bumps is changed, the pin layout diagram of this embodiment is as shown in FIG. 7 . FIG. 7 is a schematic diagram of the configuration of the outer pins and inner pins of the in-cell touch display driving IC according to a preferred embodiment of the present invention, and a cross-sectional view thereof. Compared with the above-mentioned embodiment in FIG. 6 , there is only one auxiliary bump in the embodiment in FIG. 7 .

In the above-mentioned embodiment, the above-mentioned auxiliary bumps may also be called auxiliary pins, and the number of the above-mentioned auxiliary bumps is exemplified as 1-3, and the design positions are, for example, the lower left corner and the lower right corner, respectively. However, those with ordinary knowledge in the art should know that the number and position of the above-mentioned auxiliary bumps can be changed according to the actual design and cost. Therefore, as long as the bumps or pins are used for auxiliary support, the problem of stress distribution can be solved. All problems belong to the scope of the present invention. In addition, the shapes of the above-mentioned auxiliary bumps are all rectangular parallelepipeds. However, those skilled in the art should know that the shape of the auxiliary bumps can also be circular or other regular or irregular shapes. Therefore, the present invention does not limit the auxiliary bumps. block shape.

FIG. 8 is a flow chart of a method for configuring pins of an integrated circuit according to a preferred embodiment of the present invention. Please refer to Figure 8, the pin assignment method of the integrated circuit includes the following steps:

Step S800: Start.

Step S801: Divide the surface of the integrated circuit into a middle block, a left block and a right block along the first axis. As described in the above embodiment, in the X-axis direction, the integrated circuit is divided into a middle block, a left block and a right block.

Step S802: Arrange the outer pins of the integrated circuit in sequence from the edge of the middle block and the border of the left and right blocks along the first coordinate of the second axis to the second coordinate of the second axis . As described in the above embodiments, for example, the arrangement of the sinking pins.

Step S803: Disposing at least one auxiliary bump in the vacant position in the left block and the right block respectively. By means of auxiliary bumps, the incidence of tilt is reduced and the stress balance is achieved.

Step S804: End.

To sum up, the spirit of the present invention is that, in terms of pin configuration, the outer pin pins are arranged in a trapezoidal-like sinking pin arrangement. By means of the fan-out concept of overlapping data, the edge of the panel can be reduced, and in the vacant position of the integrated circuit, that is, the position vacated after the outer pin is sunk, auxiliary bumps are arranged to allow bonding. In the case of the above-mentioned integrated circuit, the problem of distortion caused by uneven stress can be avoided.

The specific embodiments proposed in the detailed description of the preferred embodiments are only used to facilitate the description of the technical content of the present invention, rather than restricting the present invention to the above-mentioned embodiments in a narrow sense, without exceeding the spirit of the present invention and applying for patents below The situation of the scope, the various changes and implementations made, all belong to the scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope of the appended patent application.

101: Inner pin position 102: External pin position 201: Left block 202: Intermediate block 203: Right block 301, 302: Auxiliary bumps S801-S804: the process steps of the method for configuring the pins of the integrated circuit according to the embodiment of the present invention

FIG. 1 is a schematic diagram showing the configuration of the external pins and the internal pins of the in-cell touch display driver IC of the prior art. FIG. 2 is a schematic diagram illustrating the configuration of the external pins and the internal pins of the in-cell touch display driver IC according to a preferred embodiment of the present invention. FIG. 3 is a schematic diagram illustrating the configuration of the outer pins and the inner pins of the in-cell touch display driving IC according to a preferred embodiment of the present invention. FIG. 4 is a schematic diagram illustrating the configuration of the outer pins and inner pins of the in-cell touch display driving IC according to a preferred embodiment of the present invention, and a cross-sectional view thereof. FIG. 5 is a schematic diagram of the configuration of the outer pins and inner pins of the in-cell touch display driving IC according to a preferred embodiment of the present invention, and a cross-sectional view thereof. FIG. 6 is a schematic diagram showing the configuration of the outer pins and inner pins of the in-cell touch display driving IC according to a preferred embodiment of the present invention, and a cross-sectional view thereof. FIG. 7 is a schematic diagram of the configuration of the outer pins and inner pins of the in-cell touch display driving IC according to a preferred embodiment of the present invention, and a cross-sectional view thereof. FIG. 8 is a flow chart of a method for configuring pins of an integrated circuit according to a preferred embodiment of the present invention.

S801-S804: the process steps of the method for configuring the pins of the integrated circuit according to the embodiment of the present invention

Claims (10)

A pin configuration method of an integrated circuit, wherein the integrated circuit is used to drive a display panel, and the pin configuration method of the integrated circuit includes: The surface of the integrated circuit is divided into a middle block, a left block and a right block along the first axis; The outer pins of the integrated circuit are sequentially arranged along the first coordinate of the second axis to the second coordinate of the second axis from the edge between the middle block and the two sides of the left and right blocks; and In the left block and the right block, at least one auxiliary bump is respectively arranged, Wherein, the first coordinate is not equal to the second coordinate. The method for arranging pins of an integrated circuit according to claim 1, wherein the method for arranging the auxiliary bumps includes: On the passivation protection layer of the integrated circuit, the auxiliary bumps are directly arranged. The method for arranging pins of an integrated circuit according to claim 1, wherein the method for arranging the auxiliary bumps includes: setting a preset auxiliary metal at a preset position of the integrated circuit corresponding to the auxiliary bump; and The auxiliary bumps are configured for the blocks of the preset auxiliary metal. The method for arranging the pins of an integrated circuit according to claim 1, wherein the arrangement of the outer pins on the left and right blocks includes gradually shifting a certain distance away from the border edge of the central block. Orientation configuration at the junction edge. The method for arranging pins of an integrated circuit according to claim 1, wherein the auxiliary bumps in the left block and the right block are located between the outer pin pins and the long edge of the integrated circuit. An in-cell touch display driving integrated circuit for driving a display panel, comprising: multiple pins; A left block, including a plurality of external pins; a middle block including a plurality of outer pin positions, the outer pin positions of the middle block are arranged along the first axis; A right block, including a plurality of external pins; Wherein, the outer pin positions of the left block and the right block are respectively from the border between the middle block and the two sides of the left and right blocks, along the first coordinate of the second axis to the second axis of the second axis. The two coordinates are arranged in sequence; and At least one auxiliary bump is respectively arranged in the vacant position of the left block and the right block, Wherein, the first coordinate is not equal to the second coordinate. The in-cell touch display driving integrated circuit according to claim 6, wherein auxiliary bumps are directly arranged on the passivation protection layer of the in-cell touch display driving integrated circuit. The in-cell touch display driving integrated circuit as recited in claim 6, wherein the in-cell touch display driving integrated circuit further includes auxiliary metals at the preset positions corresponding to the auxiliary bumps. The in-cell touch display driving integrated circuit according to claim 6, wherein the arrangement of the outer pins on the left and right blocks includes gradually shifting a predetermined distance from the border edge with the central block , oriented away from the junction edge. The pin assignment method for an in-cell touch display driving integrated circuit as described in claim 6, wherein the auxiliary bumps in the left block and the right block are located between the outer pin pins and the integrated circuit between the long edges.

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