TWI758781B - Liquid-cooled device for multi-heat cooling - Google Patents

Abstract

A liquid-cooled device for multi-heat cooling includes a first water tank, a second water tank, a plurality of coolers, a plurality of heat absorptions and a plurality of water pumps. The first water tank having a plurality of first storage grooves. The first storage grooves are adjacent but not connected to each other. The second water tank and first water tank are interval arrangement. The second water tank having a plurality of second storage grooves. The second storage grooves are adjacent but not connected to each other. The coolers are between the first water tank and the second water tank and connected to the first storage grooves and the second storage grooves. The heat absorption is connected to the second storage groove. The water pump is installed in the first storage grooves and the second storage grooves.

Description

Liquid-cooled heat sink for heat dissipation from multiple heat sources

The invention relates to a liquid-cooled heat-dissipating device technology, in particular to a liquid-cooled heat-dissipating device capable of dissipating heat from multiple heat sources.

With the continuous improvement of the computing speed of electronic components, the heat generated by them is also getting higher and higher. In order to effectively solve the problem of high heat generation, in addition to developing heat pipes or vapor chambers with high conductivity and heat dissipation efficiency, there are also manufacturers in the industry. Design and research in the direction of water-cooled heat sinks.

Existing water cooling devices mainly include water cooling heads, water pumps, water tanks, water cooling drains and multiple water delivery hoses. Most of the water cooling heads, water pumps and water cooling drains are connected through water delivery hoses and joints. In order to meet the heat dissipation requirements of server equipment, the industry arranges, stacks and combines the aforementioned water-cooled heat-dissipating devices to form a liquid-cooled heat-dissipating device capable of dissipating heat from multiple heat sources.

However, the existing liquid-cooled heat sinks that can dissipate heat from multiple heat sources can provide various heat dissipations at the same time, but the combined volume is large. When applied to server equipment, the whole of the equipment will become larger; There are many joints and exposed, so there is a problem of liquid leakage.

In view of this, the inventor of the present invention has devoted himself to the research and application of the theory, aiming at the above-mentioned deficiencies of the prior art, to try his best to solve the above-mentioned problems, which is the goal of the present inventor's improvement.

One objective of the present invention is to provide a liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources, which can not only be used by different heat sources at the same time, but also has a compact structure and occupies less space.

In order to achieve the above object, the present invention provides a liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources, comprising a first water tank, a second water tank, a plurality of water-cooling row components, a plurality of heat-absorbing components, and a plurality of water pumps. There are a plurality of first water storage tanks, and the first water storage tanks are adjacent to each other but not communicated with each other; the second water tank and the first water tank are arranged at intervals, and the second water tank is provided with a plurality of second water storage tanks, and each of the second water storage tanks The water tanks are adjacent to each other but not communicated with each other; each of the water-cooled row assemblies is arranged in parallel between the first water tank and the second water tank, and each of the water-cooled row assemblies communicates with a first water storage tank and a second water storage tank; Each of the heat-absorbing components communicates with a second water storage tank; each of the water pumps is respectively installed in each of the first water storage tanks and each of the second water storage tanks.

The present invention also has the following effects: an independent internal circulation system is formed by not connecting the independent water-cooling exhaust components and the independent heat-absorbing components, so that heat accumulation can be reduced, and heat can be uniformly dissipated, so as to facilitate the uniformity of the temperature points of each heat source, Make sure it's within the allowable range. Structurally, each water storage tank forming each independent internal circulation system is connected into one body, which can reduce the number of joints and sealing ports, thereby reducing the risk of leakage. The structure of the present case is compact, space-saving, and easy to assemble, thereby reducing the use cost of manpower.

10: The first water tank

11: The first box

111: The first water tank

112: Clapboard

113: Pump tank

114: The first pipe connection slot

12: Cover

121: Opening

20: Second water tank

21: The second box

211: Second water tank

212: Separator

213: Pump tank

214: Second pipe connection slot

215: Hydration hole

22: Cover

221: Opening

222: water inlet

223: water outlet

224: Hydration hole

23: Baffle

30: Water cooling row components

31: connecting pipe

32: heat sink

40: Heat absorbing components

41: The first water block

42: Second water block

43, 43A, 43B, 43C: water pipe group

431: First Water Pipe

432: Second Water Pipe

433: Third Water Pipe

434: Fourth Aqueduct

50: water pump

60: cooling fan

8: Servo device

81: Chassis

82: Motherboard

FIG. 1 is an external view of the present invention applied to a servo device assembly.

FIG. 2 is an external view of the combined appearance of the liquid-cooled heat dissipation device of the present invention.

3 is a perspective exploded view of the first water tank and each water pump of the present invention.

FIG. 4 is a perspective view of the combination of the first water tank and each water pump of the present invention.

5 is an exploded perspective view of the second water tank and each water pump of the present invention.

FIG. 6 is a perspective view of the combination of the second water tank and each water pump of the present invention.

FIG. 7 is another perspective view of the liquid cooling device of the present invention.

FIG. 8 is a bottom view of the liquid-cooled heat sink of the present invention.

FIG. 9 is a top view of the liquid-cooled heat dissipation device of the present invention.

Fig. 10 is a cross-sectional view of the assembly of the liquid-cooled heat sink of the present invention.

FIG. 11 is a cross-sectional view of the first water tank and each water pump assembly of the present invention.

12 is a cross-sectional view of the second water tank and each water pump assembly of the present invention.

FIG. 13 is a combined external view of another embodiment of the liquid cooling device of the present invention.

FIG. 14 is a combined appearance view of another embodiment of the liquid cooling heat dissipation device of the present invention.

FIG. 15 is a combined appearance view of another embodiment of the liquid-cooled heat dissipation device of the present invention.

The detailed description and technical content of the present invention are described below in conjunction with the drawings. However, the accompanying drawings are only for reference and description, and are not intended to limit the present invention.

Referring to FIGS. 1 to 12 , the present invention provides a liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources, which mainly includes a first water tank 10 , a second water tank 20 , a plurality of water-cooling row components 30 , and a plurality of heat-absorbing components 40 . and a plurality of water pumps 50.

Please refer to FIG. 1 and FIG. 2 first. The liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources of the present invention can be applied to a servo device 8 . The servo device 8 has a chassis 81 and a motherboard disposed in the chassis 81 . 82. A plurality of heat sources (not shown) are arranged on the motherboard 82, and each heat absorbing element 40 of the present invention is in thermal contact with each heat source, and conducts heat and heat dissipation.

Please continue to refer to FIG. 3 and FIG. 4 , the first water tank 10 is roughly in the shape of a rectangle, but not limited to this shape, and mainly includes a first tank 11 and a cover 12 . The interior of 11 is provided with a plurality of first water storage tanks 111, and the first water storage tanks 111 are adjacent to each other but not communicated. In addition, a cross-shaped partition plate 112 is arranged in the first water storage tank 111 , and a water pump container 113 is arranged in the partition plate 112 . In addition, a plurality of first pipe connection grooves 114 that communicate with the first water storage tank 111 are provided on the bottom surface of the first case 11 . Each of the water pump holding tanks 113 is provided for a water pump 50 to be installed.

The cover plate 12 is closed corresponding to the first casing 11 , and is provided with an opening 121 through which the water supply pump 50 penetrates at a position corresponding to the water pump 50 .

Please continue to refer to FIG. 5 and FIG. 6 , the second water tank 20 is also substantially rectangular, but not limited to this shape, and mainly includes a second tank body 21 and a cover plate 22 . The interior of the body 21 is provided with a plurality of second water storage tanks 211 , and the second water storage tanks 211 are adjacent to each other but not communicated with each other. In addition, a cross-shaped partition plate 212 is arranged in the second water storage tank 211 , and a water pump container 213 is arranged in the partition plate 212 . In addition, a plurality of second pipe connection grooves 214 that communicate with the second water storage tank 211 are provided on the bottom surface of the second case 21 . Each of the water pump holding tanks 213 is provided for a water pump 50 to be installed. Preferably, the first water tank 10 and the second water tank 20 are arranged parallel to each other at intervals.

The cover plate 22 is closed corresponding to the second box body 21 , and is provided with an opening 221 through which the water supply pump 50 penetrates at a position corresponding to the water pump 50 . In addition, a water inlet hole 222 and a water outlet hole 223 are respectively defined in the position of the cover plate 22 corresponding to each of the second water storage tanks 211 . In addition, a water replenishing hole 224 is provided on the lower side of the cover plate 22 corresponding to the positions of the second water storage tanks 211 .

Further, a baffle plate 23 is provided inside each second water storage tank 211 , and the baffle plate 23 is substantially L-shaped, one end of which is embedded on the cover plate 22 , and the other end is sandwiched by the water pump 50 and the partition plate 212 . (as shown in FIG. 10 ), so as to restrict the flow direction of the internal fluid, preferably, the water inlet hole 222 and the water outlet hole 223 can be opened by the baffle plate 23 as the boundary.

Please continue to refer to FIGS. 7 to 12 , the water-cooling row assemblies 30 are arranged in parallel between the first water tank 10 and the second water tank 20 , and each water-cooling row assembly 30 mainly includes a plurality of connecting pipes 31 and a plurality of cooling fins 32 ( 10), the two ends of each connecting pipe 31 are respectively connected to the first pipe connection grooves 114 of the first water storage tank 111 and the second pipe connection grooves 214 of the second water storage tank 211, and the cooling fins 32 Then, the sockets in sequence are connected to the connecting pipes 31 .

Each heat absorbing component 40 is connected to each second water storage tank 211 respectively. Each heat absorbing component 40 mainly includes a first water cooling head 41, a second water cooling head 42 and a water delivery pipe group 43, and the water delivery pipe group 43 mainly includes a first water cooling head 41. A water delivery pipe 431, a second water delivery pipe 432 and a third water delivery pipe 433, wherein the two ends of the first water delivery pipe 431 are respectively connected to the water outlet 223 and the first water cooling head 41, and the two ends of the second water delivery pipe 432 are respectively connected to each other. The first water-cooling head 41 and the second water-cooling head 42, and two ends of the third water-conveying pipe 433 are respectively connected to the second water-cooling head 42 and the water inlet hole 222.

Each of the water pumps 50 is installed in the first water storage tank 111 and each of the second water storage tanks 211 respectively.

Please continue to refer to FIGS. 13 to 15 , which are other embodiments of the liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources according to the present invention. The positions of the second water storage tanks 211 are respectively provided with a water replenishing hole 215 . Each heat absorption assembly 40 mainly includes a first water cooling head 41, a second water cooling head 42, and a water delivery pipe group 43A. The water delivery pipe group 43A mainly includes a first water delivery pipe 431, a second water delivery pipe 432, a first water delivery pipe Three water delivery pipes 433 and a fourth water delivery pipe 434, two ends of the first water delivery pipe 431 are respectively connected to the second water tank 20 and the first water cooling head 41, and two ends of the second water delivery pipe 432 are respectively connected to the first water cooling head 41 and the first water cooling head 41. The second water tank 20 . Two ends of the third water delivery pipe 433 are respectively connected to the first water tank 10 and the second water block 42 , and two ends of the fourth water pipe 434 are respectively connected to the second water block 42 and the first water tank 10 .

Each heat absorption assembly 40 in FIG. 14 mainly includes a first water block 41 , a second water block 42 and a water pipe group 43B. The water pipe group 43B mainly includes a first water pipe 431 and a second water pipe 432 and a third water delivery pipe 433, wherein the two ends of the first water delivery pipe 431 are respectively connected to the second water tank 20 and the first water cooling head 41, and the two ends of the second water delivery pipe 432 are respectively connected to the first water cooling head 41 and the second water cooling head 41 The head 42 and the two ends of the third water pipe 433 are respectively connected to the second water cooling head 42 and the first water tank 10 .

15, the first water tank 10, the second water tank 20, the water cooling exhaust assembly 30, the water pump 50 and the cooling fan 60 are first assembled into a main structure, and then arranged in an upright manner. Each heat absorption assembly 40 mainly includes a first water cooling head 41. A second water cooling head 42 and a water delivery pipe group 43C. The water delivery pipe group 43C mainly includes a first water delivery pipe 431, a second water delivery pipe 432 and a third water delivery pipe 433. The two ends are respectively connected to the second water tank 20 and the first water cooling head 41 , the two ends of the second water delivery pipe 432 are respectively connected to the first water cooling head 41 and the second water cooling head 42 , and the two ends of the third water delivery pipe 433 are respectively connected to the second water cooling head 433 Head 42 and second tank 20. Similarly, one end of the first water delivery pipe 431 and the third water delivery pipe 433 may also be communicated with the first water tank 10 .

To sum up, the liquid-cooled heat dissipation device of the present invention, which can dissipate heat from multiple heat sources, can indeed achieve the intended purpose of use, and solve the deficiencies of the conventional knowledge, and because of its novelty and progress, it fully conforms to the invention patent. In order to protect the rights of inventors, please review and approve the patent in this case.

10: The first water tank

11: The first box

12: Cover

20: Second water tank

21: The second box

22: Cover

30: Water cooling row components

40: Heat absorbing components

41: The first water block

42: Second water block

43: Water pipe group

431: First Water Pipe

432: Second Water Pipe

433: Third Water Pipe

50: water pump

60: cooling fan

Claims (11)

A liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources, comprising: a first water tank with a plurality of first water storage tanks, each of which is adjacent to each other but not in communication; a second water tank, which is connected with the first water tank The second water tank is provided with a plurality of second water storage tanks, and the second water storage tanks are adjacent to each other but not communicated with each other; a plurality of water cooling row assemblies are arranged in parallel between the first water tank and the second water tank, each The water-cooling row assembly communicates with a first water storage tank and a second water storage tank; a plurality of heat absorbing components, each of which is connected with a second water storage tank; and a plurality of water pumps, respectively installed in each of the first water storage tank and the second water storage tank each of the second water storage tanks; wherein the second water tank includes a second box body, each of the second water storage tanks is formed inside the second box body, and a cross-shaped partition is arranged in each of the second water storage tanks a plate, and a water pump holding tank for a fixed installation of the water pump is arranged on the partition plate. The liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources as claimed in claim 1, wherein the second water tank further includes a cover plate, the cover plate is closed corresponding to the second box body, and the cover plate corresponds to the cover plate. The position of the water pump is provided with an opening for the water pump to pass through. The liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources as described in claim 2, wherein a baffle is arranged inside each of the second water storage tanks, the baffle is L-shaped, and one end of the baffle is embedded in the second water storage tank. The cover plate, the other end of the baffle plate is clamped by the water pump and the partition plate. The liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources as claimed in claim 1, wherein a plurality of pipe connecting grooves that communicate with each of the second water storage tanks are arranged on the bottom surface of the second box body, and each of the water-cooled row components It includes a plurality of connecting pipes and a plurality of radiating fins sleeved on each of the connecting pipes, and one end of each of the connecting pipes is respectively connected to each of the pipe connecting grooves. The liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources according to claim 3, wherein a water inlet hole and a water outlet hole are respectively provided at the positions of the cover plate corresponding to the second water storage tanks, and each of the heat absorbing components includes A first water block, a second water block and a water pipe group, the water pipe group includes a first water pipe, a second water pipe and a third water pipe, wherein the two ends of the first water pipe are respectively The water outlet is communicated with the first water-cooled head, the two ends of the second water-conveying pipe are respectively connected with the first water-cooled head and the second water-cooled head, and the two ends of the third water-conveying pipe are respectively connected with the second water-cooled head and the second water-cooled head. water inlet. The liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources according to claim 5, wherein a water replenishing hole is respectively provided at a position of the cover plate corresponding to each of the second water storage tanks. The liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources as claimed in claim 1, wherein the first water tank includes a first tank body, each of the first water storage tanks is formed inside the first tank body, and each of the first water storage tanks is formed in the first tank. A cross-shaped partition is arranged in the first water storage tank, and a water pump accommodating tank is arranged on the partition plate, and the water pump accommodating tank is used for a fixed installation of the water pump. The liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources as claimed in claim 7, wherein the first water tank further comprises a cover plate, the cover plate is closed corresponding to the first box body, and the cover plate corresponds to the cover plate. The position of the water pump is provided with an opening for the water pump to pass through. The liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources as claimed in claim 7, wherein a plurality of first pipe connecting grooves that communicate with each of the first water storage tanks are arranged on the bottom surface of the first box body, and the second water tank Including a second box body, the bottom surface of the second box body is provided with a plurality of second pipe connecting grooves that communicate with the second water storage tank, and each of the water-cooling row components includes a plurality of connecting pipes and a plurality of connecting pipes sleeved on the connecting pipes. A plurality of cooling fins, two ends of each of the connecting pipes are respectively connected to each of the first pipe connection grooves and each of the second pipe connection grooves. The liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources as claimed in claim 1, wherein each of the heat absorbing components includes a first water block, a second water block and a water pipe group, and the water pipe group includes a A first water pipe, a second water pipe, a third water pipe and a fourth water pipe, the two ends of the first water pipe and the second water pipe are respectively connected to the second water tank and the first water block, Two ends of the third water delivery pipe and the fourth water delivery pipe are respectively connected to the first water tank and the second water cooling head. The liquid-cooled heat dissipation device capable of dissipating heat from multiple heat sources as claimed in claim 1, wherein each of the heat absorbing components includes a first water block, a second water block, and a water pipe group, and the water pipe group includes a first water block. A water delivery pipe, a second water delivery pipe and a third water delivery pipe, the two ends of the first water delivery pipe are respectively connected to the second water tank and the first water cooling head, and the two ends of the second water delivery pipe are respectively connected to the first water cooling head The second water-cooling head and the second water-cooling head, and the two ends of the third water-conveying pipe are respectively connected to the second water-cooling head and the first water tank.

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