[go: up one dir, main page]

TWI757583B - Method and testing device for testing memory - Google Patents

Method and testing device for testing memory Download PDF

Info

Publication number
TWI757583B
TWI757583B TW108104851A TW108104851A TWI757583B TW I757583 B TWI757583 B TW I757583B TW 108104851 A TW108104851 A TW 108104851A TW 108104851 A TW108104851 A TW 108104851A TW I757583 B TWI757583 B TW I757583B
Authority
TW
Taiwan
Prior art keywords
memory circuit
memory
circuit
responses
comparison result
Prior art date
Application number
TW108104851A
Other languages
Chinese (zh)
Other versions
TW202001918A (en
Inventor
呂士濂
Original Assignee
台灣積體電路製造股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/011,215 external-priority patent/US10515713B2/en
Application filed by 台灣積體電路製造股份有限公司 filed Critical 台灣積體電路製造股份有限公司
Publication of TW202001918A publication Critical patent/TW202001918A/en
Application granted granted Critical
Publication of TWI757583B publication Critical patent/TWI757583B/en

Links

Images

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor

Landscapes

  • Tests Of Electronic Circuits (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)

Abstract

A testing device is disclosed for testing a memory, and the memory includes a first memory circuit and a second memory circuit. The second memory circuit is configured to store a first response of the first memory circuit. The testing device includes a comparing circuit and a calculating circuit. The comparing circuit is configured to compare the first response stored in the second memory circuit with a plurality of responses of the first memory circuit operated in conditions that are different from each other, to generate a plurality of first comparing results. The calculating circuit is configured to output, according to the plurality of first comparing results, a maximum hamming distance between two of the first responses and the plurality of responses of the first memory circuit. A method for testing a memory is also disclosed herein.

Description

用以測試記憶體的測試裝置及方法 Test device and method for testing memory

本揭露是關於一種用以測試記憶體的測試裝置,特別是關於一種漢明距離(Hamming Distance)分析器及其分析方法。 The present disclosure relates to a test device for testing memory, and more particularly, to a Hamming Distance analyzer and an analysis method thereof.

由於許多製程因素的緣故,即使積體電路係以相同的製程及相同的材料所製造,每一個積體電路(Integrated Circuit,IC)都是獨特的。每一個積體電路都有機會根據其實際應用而在不同的操作環境下操作。因此,多個積體電路之一在不同操作環境下的穩固性(Robustness)為半導體科技領域中的關鍵課題。 Due to many process factors, each integrated circuit (IC) is unique even though the integrated circuits are fabricated with the same process and the same materials. Every integrated circuit has the opportunity to operate in different operating environments depending on its actual application. Therefore, the robustness of one of the plurality of integrated circuits under different operating environments is a key issue in the field of semiconductor technology.

本揭露之一態樣係揭露一種用以測試記憶體的測試裝置,且記憶體包含第一記憶體電路及第二記憶體電路。第二記憶體電路係配置以儲存第一記憶體電路的複數個應對中的第一應對,並且該第一記憶體電路係配置以儲存該第二記憶體電路的複數個應對中之一第二應對。測試裝置包 含比較電路及計算電路。比較電路係配置以比較儲存在第二記憶體電路之第一應對與第一記憶體電路在對應不同的操作環境的多個操作條件下操作的複數個應對,以產生複數個第一比較結果,且配置以比較儲存在第一記憶體電路的第二應對與第二記憶體電路在對應不同操作環境的多個操作條件下操作的多個應對,以產生多個第二比較結果,其中比較電路更是配置以根據第一比較結果及第二比較結果產生一最終結果。計算電路係配置以根據最終結果輸出最大漢明距離,其中最大漢明距離係在第一記憶體電路的複數個應對之其中二者之間。 An aspect of the present disclosure discloses a test apparatus for testing a memory, and the memory includes a first memory circuit and a second memory circuit. The second memory circuit is configured to store a first one of the plurality of responses of the first memory circuit, and the first memory circuit is configured to store a second one of the plurality of responses of the second memory circuit response. Test Set Package Including comparison circuit and calculation circuit. The comparison circuit is configured to compare the first response stored in the second memory circuit with a plurality of responses that the first memory circuit operates under a plurality of operating conditions corresponding to different operating environments to generate a plurality of first comparison results, and configured to compare a second response stored in the first memory circuit with a plurality of responses of the second memory circuit operating under a plurality of operating conditions corresponding to different operating environments to generate a plurality of second comparison results, wherein the comparison circuit It is further configured to generate a final result according to the first comparison result and the second comparison result. The calculation circuit is configured to output the maximum Hamming distance according to the final result, wherein the maximum Hamming distance is between two of the plurality of responses of the first memory circuit.

本揭露之一態樣係揭露一種用以測試記憶體的方法,包含:維持在多個操作條件的一第一操作條件下的一記憶體的一第一記憶體電路的多個應對中的一第一應對;儲存在記憶體的一第二記憶體電路內的第一應對依序地與在對應不同操作環境的操作條件下的第一記憶體電路的應對比較,以產生多個第一比較結果,其中第一比較結果的每一個比較結果是通過調整第一比較結果的前一比較結果而產生;維持在操作條件的一第二操作條件下的記憶體的一第二記憶體電路的多個應對中的一第二應對;儲存在記憶體的第一記憶體電路內的第二應對依序地與在對應不同操作環境的操作條件下的第一記憶體電路的應對比較,以產生多個第二比較結果,其中第二比較結果的每一個比較結果是通過調整第二比較結果的前一比較結果而產生;基於依序地比較第一應對與第一記憶體電路的應對以及依序地比較第二應對 與第二記憶體電路的應對產生一最終結果;以及根據最終結果,獲得介於第一記憶體電路的應對的其中二者之間的一最大差值。 One aspect of the present disclosure discloses a method for testing a memory, comprising: maintaining one of a plurality of responses of a first memory circuit of a memory under a first operating condition of a plurality of operating conditions a first response; the first responses stored in a second memory circuit of the memory are sequentially compared with the responses of the first memory circuit under operating conditions corresponding to different operating environments to generate a plurality of first comparisons As a result, wherein each comparison result of the first comparison result is generated by adjusting the previous comparison result of the first comparison result; maintaining a plurality of a second memory circuit of a memory under a second operation condition of the operation condition A second response among the responses; the second responses stored in the first memory circuit of the memory are sequentially compared with responses of the first memory circuit under operating conditions corresponding to different operating environments to generate multiple responses a second comparison result, wherein each comparison result of the second comparison result is generated by adjusting the previous comparison result of the second comparison result; second response The coping with the second memory circuit produces a final result; and according to the final result, a maximum difference between the two of the copings with the first memory circuit is obtained.

本揭露之一態樣係揭露一種用以測試記憶體的方法,包含:操作在對應不同操作環境的多個操作條件下的一記憶體的一第一記憶體電路,以獲得第一記憶體電路的多個應對,以及儲存第一記憶體電路的應對的一第一應對在記憶體的第二記憶體電路內;依序進行儲存在記憶體的第二記憶體電路的第一記憶體電路的應對的第一應對與第一記憶體電路的應對的其他多個應對的一互斥或操作,以產生第一記憶體電路的應對的多個比較結果;操作在對應不同操作環境的多個操作條件下的第二記憶體電路,以獲得第二記憶體電路的多個應對,以及儲存第二記憶體電路的應對的一第二應對在第一記憶體電路內;依序進行儲存在記憶體的第一記憶體電路的第二記憶體電路的應對的第二應對與第二記憶體電路的應對的其他多個應對的一互斥或操作,以產生第二記憶體電路的應對的多個比較結果;根據第一記憶體電路的應對的第一應對的互斥或操作及第二記憶體電路的應對的第二應對的互斥或操作產生一最終比較結果;以及根據最終比較結果,輸出第一記憶體電路的應對的其中二者之間的一最大漢明距離。 An aspect of the present disclosure discloses a method for testing a memory, comprising: operating a first memory circuit of a memory under a plurality of operating conditions corresponding to different operating environments to obtain the first memory circuit A plurality of responses, and a first response that stores the responses of the first memory circuit is in the second memory circuit of the memory; the first memory circuit of the second memory circuit stored in the memory is sequentially performed. A mutually exclusive OR operation of the first response to the response and the other responses of the first memory circuit to generate multiple comparison results of the response of the first memory circuit; the operations are performed in a plurality of operations corresponding to different operating environments the second memory circuit under the condition to obtain a plurality of responses of the second memory circuit, and store a second response of the response of the second memory circuit in the first memory circuit; sequentially store in the memory The second response of the first memory circuit, the second response of the second memory circuit, and the second response of the second memory circuit are mutually exclusive or operated with a plurality of responses of the second memory circuit to generate a plurality of responses of the second memory circuit a comparison result; a final comparison result is generated according to the mutual exclusion or operation of the first response of the first memory circuit and the mutual exclusion or operation of the second response of the second memory circuit; and according to the final comparison result, output A maximum Hamming distance between the two for the response of the first memory circuit.

100:裝置 100: Device

105:待測裝置 105: Device to be tested

120:記憶體陣列 120: Memory array

140:比較電路 140: Comparison circuit

142:互斥或閘 142: mutex or gate

160:計算電路 160: Computational Circuits

162:計數器 162: Counter

164:最大漢明距離產生電路 164: Maximum Hamming distance generation circuit

180:記錄器 180: Recorder

100A:裝置 100A: Device

101A/103A:記憶體電路 101A/103A: Memory circuit

105A:待測裝置 105A: Device under test

140A:比較電路 140A: Comparison circuit

160A:計算電路 160A: Computing Circuits

162A:計數器 162A: Counter

164A:最大漢明距離產生電路 164A: Maximum Hamming Distance Generation Circuit

180A:記錄器 180A: Recorder

182A/184A:記錄電路 182A/184A: Recording Circuit

200:方法 200: Method

202-216:操作 202-216: Operations

202A-216A:操作 202A-216A: Operation

C0:起始參考值 C0: Start reference value

C1-C4:比較結果 C1-C4: Comparison results

R1-R5:應對 R1-R5: Coping

FC:最終比較結果 FC: Final Comparison Results

HD:漢明距離 HD: Hamming distance

根據以下詳細說明並配合附圖閱讀,使本揭露的態樣獲致較佳的理解。需注意的是,如同業界的標準作法,許多特徵並不是按照比例繪示的。事實上,為了進行清楚討論,許多特徵的尺寸可以經過任意縮放。 Aspects of the present disclosure will be better understood from the following detailed description read in conjunction with the accompanying drawings. It should be noted that, as is standard practice in the industry, many features are not drawn to scale. In fact, the dimensions of many features can be arbitrarily scaled for clarity of discussion.

[圖1]係繪示根據本揭露各種實施例之裝置及待測裝置的示意圖。 [FIG. 1] is a schematic diagram illustrating a device and a device under test according to various embodiments of the present disclosure.

[圖2]係繪示根據本揭露各種實施例之圖1的裝置對待測裝置操作之方法的流程圖。 [ FIG. 2 ] is a flowchart illustrating a method of operating the device under test of the device of FIG. 1 according to various embodiments of the present disclosure.

[圖3]係繪示根據本揭露各種實施例之針對圖1的裝置及待測裝置之比較步驟的示意圖。 [ FIG. 3 ] is a schematic diagram illustrating a comparison step for the device of FIG. 1 and the device under test according to various embodiments of the present disclosure.

[圖4]係繪示根據本揭露各種實施例之裝置及記憶體的示意圖。 4 is a schematic diagram illustrating a device and a memory according to various embodiments of the present disclosure.

[圖5]係繪示根據本揭露各種實施例之圖4的裝置對記憶體執行操作之方法的流程圖。 [ FIG. 5 ] is a flowchart illustrating a method for the device of FIG. 4 to perform operations on memory according to various embodiments of the present disclosure.

以下揭露提供許多不同實施例或例示,以實施發明的不同特徵。以下敘述之成份和排列方式的特定例示是為了簡化本揭露。這些當然僅是做為例示,其目的不在構成限制。舉例而言,第一特徵形成在第二特徵之上或上方的描述包含第一特徵和第二特徵有直接接觸的實施例,也包含有其他特徵形成在第一特徵和第二特徵之間,以致第一特徵和第二特徵沒有直接接觸的實施例。許多特徵的尺寸可以不同比例繪示,以使其簡化且清晰。除此之外,本揭露在各種例 示中會重複元件符號及/或字母。此重複的目的是為了簡化和明確,並不表示所討論的各種實施例及/或配置之間有任何關係。 The following disclosure provides many different embodiments or illustrations for implementing various features of the invention. The specific illustrations of components and arrangements described below are for the purpose of simplifying the present disclosure. These are, of course, only examples and are not intended to be limiting. For example, a description that a first feature is formed on or over a second feature includes embodiments in which the first feature and the second feature are in direct contact, as well as embodiments where other features are formed between the first feature and the second feature, Embodiments such that the first feature and the second feature are not in direct contact. The dimensions of many features may be drawn at different scales for simplicity and clarity. In addition to this, this disclosure is Symbols and/or letters are repeated in the illustration. This repetition is for simplicity and clarity and does not imply any relationship between the various embodiments and/or configurations discussed.

在說明書中使用的用語一般具有其在本領域中的原有的意義,且每一個用語係用於特定的內容。在本說明書中使用的具體例(包含任何在此討論的用語之具體例)僅係用以說明,而非用以限制本揭露或任何說明用語的範圍及意義。同樣地,本揭露係不以本說明書中的各種實施例為限。 Terms used in the specification generally have their original meanings in the art, and each term is used for a specific context. Specific examples (including specific examples of any terms discussed herein) used in this specification are for illustration only, and are not intended to limit the scope and meaning of the disclosure or any explanatory terms. Likewise, the present disclosure is not limited to the various embodiments in this specification.

雖然「第一(first)」及「第二(second)」等用語在此可被用以描述各種元件,這些元件係不受這些用語所限制。這些用語僅是用以分辨此一元件與其他者。舉例而言,第一元件可為第二元件,且相似地,第二元件可為第一元件,而不偏離實施例的範圍。如所用者,用語「及/或」包含一或多個相關列示物件之任意組合及全部組合。 Although the terms "first" and "second" may be used herein to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish this element from the others. For example, a first element could be a second element, and similarly, a second element could be a first element, without departing from the scope of the embodiments. As used, the term "and/or" includes any and all combinations of one or more of the associated listed items.

用於本說明書之「包含(comprise)」、「包含(comprising)」、「包括(include)」、「包括(including)」、「有(has)」、「具有(having)」等用語為開放式的且表示「包含但不限於」。 Terms such as "comprise", "comprising", "include", "including", "has", "having", etc. used in this specification are open Formula and means "including but not limited to".

請參閱圖1。圖1為根據本揭露之各種實施例的裝置100及待測裝置105的示意圖。 See Figure 1. 1 is a schematic diagram of a device 100 and a device under test 105 according to various embodiments of the present disclosure.

在一些實施例中,裝置100為測試裝置。裝置100係配置以測試待測裝置105的穩固性(Robustness)。在一些實施例中,裝置100係應用於或建置為內漢明距離分析器(Intra-hamming Analyzer)。裝置100係配置以產生待 測裝置105的最大漢明距離(Hamming Distance;HD)。最大漢明距離HD代表待測裝置105的穩固性。在一些實施例中,漢明距離HD指出在二個二進制之間不同位元的數目。 In some embodiments, device 100 is a testing device. The device 100 is configured to test the robustness of the device under test 105 . In some embodiments, the apparatus 100 is applied or implemented as an Intra-hamming Analyzer. Device 100 is configured to generate the The maximum Hamming Distance (HD) of the measuring device 105 is measured. The maximum Hamming distance HD represents the robustness of the device under test 105 . In some embodiments, the Hamming distance HD indicates the number of different bits between two bins.

在一些實施例中,待測裝置105為待測記憶體陣列。在一些其他的實施例中,待測裝置105包含待測記憶體陣列。待測記憶體陣列為例如靜態隨機存取記憶體(static random access memory,SRAM)、快閃記憶體或相似者,但不限於此。用以建置各種記憶體陣列或單元在待測裝置105中或被建置於在待測裝置105中的各種記憶體陣列或單元係在本揭露的保護範圍內。 In some embodiments, the device under test 105 is a memory array under test. In some other embodiments, the device under test 105 includes a memory array under test. The memory array to be tested is, for example, but not limited to, static random access memory (SRAM), flash memory, or the like. Various memory arrays or cells used to construct various memory arrays or cells in or to be built into the device under test 105 are within the scope of the present disclosure.

在一些實施例中,待測裝置105根據其實際應用而在不同的操作條件下操作。操作條件係對應至不同的操作環境。為說明起見,不同的操作條件對應至不同的供應電壓、不同的操作溫度、不同的操作頻率或前述之組合。 In some embodiments, the device under test 105 operates under different operating conditions depending on its actual application. Operating conditions correspond to different operating environments. For illustration, different operating conditions correspond to different supply voltages, different operating temperatures, different operating frequencies, or a combination of the foregoing.

在一些實施例中,當待測裝置105在不同的操作條件下操作時,待測裝置105的應對為不同。在一些實施例中,每一個應對係在特定操作環境下之待測裝置105中的內容。為說明起見,待測裝置105在10℃下操作的應對係與待測裝置105在50℃下操作的應對不同。 In some embodiments, the device under test 105 responds differently when the device under test 105 operates under different operating conditions. In some embodiments, each response is related to the content of the device under test 105 under a particular operating environment. For the sake of illustration, the handling of the device under test 105 operating at 10°C is different from the handling of the device under test 105 operating at 50°C.

如圖1所示,在一些實施例中,裝置100包含記憶體陣列120、比較電路140及計算電路160。在一些實施例中,裝置100更包含記錄器180。記憶體陣列120係耦合至待測裝置105。比較電路140係耦合至記憶體陣列120及待測裝置105。記錄器180係耦合至比較電路140。計算電 路160係耦合至記錄器180。 As shown in FIG. 1 , in some embodiments, the device 100 includes a memory array 120 , a comparison circuit 140 and a computing circuit 160 . In some embodiments, the device 100 further includes a recorder 180 . The memory array 120 is coupled to the device under test 105 . The comparison circuit 140 is coupled to the memory array 120 and the device under test 105 . The recorder 180 is coupled to the comparison circuit 140 . Calculate electricity Road 160 is coupled to recorder 180 .

上述討論僅是根據各種不同實施例而描述可使用的例示連接方式。須理解的是,各種不同的實施例不受限於上述之特定連接或圖1所示者。 The above discussion is merely to describe exemplary connections that may be used in accordance with various embodiments. It should be understood that the various embodiments are not limited to the specific connections described above or those shown in FIG. 1 .

除此之外,在此說明書中,用語「耦合(coupled)」也可稱為「電性耦合(electrically coupled)」,而用語「連接(connected)」也可稱為「電性連接(electrically connected)」。「耦合(coupled)」及「連接(connected)」也可用以指出兩個或更多元件協作或與彼此交互作用。 In addition, in this specification, the term "coupled" may also be referred to as "electrically coupled", and the term "connected" may also be referred to as "electrically connected" )". "Coupled" and "connected" may also be used to indicate that two or more elements cooperate or interact with each other.

如圖1所示,記憶體陣列120係配置以產生待測裝置105的至少一個應對,並儲存至少一個應對。在一些實施例中,前述至少一個應對係從待測裝置105被複製或被複寫至記憶體陣列120。在一些實施例中,記憶體陣列120係待測裝置105的複本,據此,記憶體陣列120產生至少一個應對,其係與待測裝置105的至少一個應對相同。 As shown in FIG. 1 , the memory array 120 is configured to generate at least one response for the device under test 105 and store the at least one response. In some embodiments, the aforementioned at least one pair is copied or overwritten from the device under test 105 to the memory array 120 . In some embodiments, memory array 120 is a replica of device under test 105 , whereby memory array 120 generates at least one response that is identical to at least one response of device under test 105 .

在一些實施例中,記憶體陣列120的儲存容量係對應至待測裝置105之至少一個應對的位元數。舉例而言,若待測裝置105的至少一個應對具有n位元,記憶體陣列120的儲存容量具有至少n個位元。 In some embodiments, the storage capacity of the memory array 120 corresponds to the number of bits corresponding to at least one of the devices under test 105 . For example, if at least one pair of the device under test 105 has n bits, the storage capacity of the memory array 120 has at least n bits.

如圖1所示,比較電路140接收來自記憶體陣列120的應對。比較電路140亦接收來自待測裝置105在不同操作條件下所獲得的應對。比較電路140係配置以依序地比較來自於記憶體陣列120的應對與來自於待測裝置105的多 個應對,以產生對應的比較結果。 As shown in FIG. 1 , the comparison circuit 140 receives responses from the memory array 120 . The comparison circuit 140 also receives responses obtained from the device under test 105 under different operating conditions. Comparison circuit 140 is configured to sequentially compare responses from memory array 120 with multiple responses from device under test 105. a response to produce a corresponding comparison result.

如圖1所示,在一些實施例中,比較電路140包含至少一個互斥或閘(exclusive OR gate)142。互斥或閘142具有第一輸入端、第二輸入端及輸出端。第一輸入端係與記憶體陣列120耦合,以接收來自記憶體陣列120的應對。第二輸入端係與待測裝置105耦合,以接收來自待測裝置105在不同操作條件下所獲得的應對。互斥或閘142的輸出端係與記錄器180耦合。 As shown in FIG. 1 , in some embodiments, the comparison circuit 140 includes at least one exclusive OR gate 142 . The exclusive OR gate 142 has a first input terminal, a second input terminal and an output terminal. The first input terminal is coupled to the memory array 120 to receive responses from the memory array 120 . The second input is coupled to the device under test 105 to receive responses obtained from the device under test 105 under different operating conditions. The output of the mutex OR gate 142 is coupled to the recorder 180 .

互斥或閘142係配置以依序地進行來自記憶體陣列120之應對及來自於待測裝置105之應對的互斥或操作,以產生對應的比較結果。這些比較結果係被輸出至記錄器180。 The exclusive OR gate 142 is configured to sequentially perform the exclusive OR operation of the responses from the memory array 120 and the responses from the device under test 105 to generate corresponding comparison results. These comparison results are output to the recorder 180 .

比較電路140的配置僅供說明用途。比較電路140的各種配置係在本揭露的保護範圍內。舉例而言,在一些其他實施例中,比較電路140包含一個以上的互斥或閘,而在另一些實施例,比較電路140包含許多個互斥或閘,其數量係對應至來自於待測裝置105之應對的相同數量。在一些其他實施例中,比較電路140係藉由其他邏輯元件所建置。 The configuration of the comparison circuit 140 is for illustration purposes only. Various configurations of the comparison circuit 140 are within the scope of the present disclosure. For example, in some other embodiments, the comparison circuit 140 includes more than one mutex or gate, while in other embodiments, the comparison circuit 140 includes a plurality of mutex or gates, the number of which corresponds to the number of The same number as the device 105 should handle. In some other embodiments, the comparison circuit 140 is implemented by other logic elements.

如圖1所示,記錄器180係配置以暫時地儲存由比較電路140產生的比較結果。接著,根據比較結果,記錄器180產生最終比較結果FC。在一些實施例中,最終比較結果FC指出藉由比較來自於記憶體陣列120之應對與來自於待測裝置105之最終應對所產生的比較結果。 As shown in FIG. 1 , the recorder 180 is configured to temporarily store the comparison results generated by the comparison circuit 140 . Next, according to the comparison result, the recorder 180 generates a final comparison result FC. In some embodiments, the final comparison result FC indicates the comparison result produced by comparing the response from the memory array 120 with the final response from the device under test 105 .

記錄器180的數量僅供說明用途。各種數量的記錄器180係在本揭露的保護範圍內。在一些其他實施例中,裝置100包含一個以上的記錄器。舉例而言,在一些其他實施例中,裝置100包含二個記錄器。二個記錄器的第一記錄器係與比較電路140耦合,以暫時地儲存來自於比較電路140之兩個對應位元的比較。二個記錄器的第二記錄器係與第一記錄器耦合,且係配置以產生最終比較結果FC,其係根據來自第一記錄器之不同的兩個對應位元的複數個比較。 The number of recorders 180 is for illustration purposes only. Various numbers of recorders 180 are within the scope of the present disclosure. In some other embodiments, device 100 includes more than one recorder. For example, in some other embodiments, device 100 includes two recorders. A first recorder of the two recorders is coupled to the comparison circuit 140 to temporarily store the comparison of the two corresponding bits from the comparison circuit 140 . A second recorder of the two recorders is coupled to the first recorder and is configured to generate a final comparison result FC based on a plurality of comparisons of two corresponding bits that are different from the first recorder.

如圖1所示,計算電路160係配置以接收來自於記錄器180的最終比較結果FC。計算電路160係進一步地配置以根據最終比較結果FC輸出最大漢明距離HD。最大漢明距離HD代表來自待測裝置105之二個應對之間的最大差異。 As shown in FIG. 1 , the calculation circuit 160 is configured to receive the final comparison result FC from the recorder 180 . The calculation circuit 160 is further configured to output the maximum Hamming distance HD according to the final comparison result FC. The maximum Hamming distance HD represents the maximum difference between the two responses from the device under test 105 .

如圖1所示,在一些實施例中,計算電路160包含計數器162及最大漢明距離產生電路164。計數器162係與記錄器180耦合。最大漢明距離產生電路164係與計數器162耦合。 As shown in FIG. 1 , in some embodiments, the calculation circuit 160 includes a counter 162 and a maximum Hamming distance generating circuit 164 . Counter 162 is coupled to recorder 180 . The maximum Hamming distance generating circuit 164 is coupled to the counter 162 .

計數器162係配置以接收前述之來自於記錄器180的最終比較結果FC。根據最終比較結果FC,計數器162計數的數值指出最終比較結果FC具有相同邏輯值的位元數。在一些實施例中,相同邏輯值為「1」。換言之,若最終比較結果FC的4個位元具有邏輯值「1」,則計數器162輸出指示4的數據至最大漢明距離產生電路164。在一些實 施例中,計數器162係以由多個加法器(圖未繪示)所組成的群體計數器來執行。在另一些實施例中,計數器162係以其他邏輯閘來執行。 The counter 162 is configured to receive the aforementioned final comparison result FC from the recorder 180 . According to the final comparison result FC, the value counted by the counter 162 indicates the number of bits in which the final comparison result FC has the same logical value. In some embodiments, the same logic value is "1". In other words, if the 4 bits of the final comparison result FC have the logic value "1", the counter 162 outputs the data indicating 4 to the maximum Hamming distance generating circuit 164 . in some real In an embodiment, the counter 162 is implemented as a group counter composed of a plurality of adders (not shown). In other embodiments, the counter 162 is implemented with other logic gates.

接著,最大漢明距離產生電路164根據前述數值及最終比較結果FC的總位元數來產生最大漢明距離HD。最大漢明距離HD代表來自待測裝置105的二個應對之間的最大差異。在一些實施例中,最大漢明距離產生電路164係以減法器(圖未繪示)來建置或包含減法器,但不以此為限。在另一些實施例中,最大漢明距離產生電路164係以其他邏輯閘來建置。 Next, the maximum Hamming distance generating circuit 164 generates the maximum Hamming distance HD according to the aforementioned value and the total number of bits of the final comparison result FC. The maximum Hamming distance HD represents the maximum difference between the two responses from the device under test 105 . In some embodiments, the maximum Hamming distance generating circuit 164 is constructed with a subtractor (not shown) or includes a subtractor, but not limited thereto. In other embodiments, the maximum Hamming distance generating circuit 164 is implemented with other logic gates.

計算電路160的配置僅供說明用途。計算電路160的各種配置係在本揭露的保護範圍內。 The configuration of computing circuit 160 is for illustration purposes only. Various configurations of computing circuit 160 are within the scope of the present disclosure.

再者,圖1中之裝置100的配置僅供說明用途。裝置100的各種配置係在本揭露的保護範圍內。 Furthermore, the configuration of the device 100 in FIG. 1 is for illustration purposes only. Various configurations of device 100 are within the scope of the present disclosure.

請參閱圖2及圖3。圖2係繪示根據本揭露各種實施例之圖1的裝置100對待測裝置105之操作方法200的流程圖。圖3係繪示根據本揭露各種實施例之針對圖1的裝置100及待測裝置105之比較步驟的示意圖。 Please refer to Figure 2 and Figure 3. FIG. 2 is a flowchart illustrating a method 200 of operating the device under test 105 of the device 100 of FIG. 1 according to various embodiments of the present disclosure. 3 is a schematic diagram illustrating a comparison step for the device 100 and the device under test 105 of FIG. 1 according to various embodiments of the present disclosure.

圖1中的裝置100及待測裝置105之間的操作係藉由以下圖2所繪示之方法200來描述。為了更佳的了解本揭露,方法200係參閱圖1及圖3來說明。 The operation between the device 100 in FIG. 1 and the device under test 105 is described by the method 200 depicted in FIG. 2 below. For a better understanding of the present disclosure, the method 200 is described with reference to FIGS. 1 and 3 .

在操作202中,當待測裝置105係在第一操作條件下操作時,可獲得待測裝置105的應對R1。在一些實施例中,第一操作條件為待測裝置105的起始操作條件,但不以 此為限。因此,應對R1係待測裝置105在起始操作條件下的內容。如圖3所繪示,應對R1為01010101。換言之,當待測裝置105係在起始條件下操作,待測裝置105的內容為01010101。再者,當待測裝置105在第一操作條件下操作時,記錄器180中的起始參考值C0係重新設定為0000000。 In operation 202, when the device under test 105 is operated under the first operating condition, the response R1 of the device under test 105 can be obtained. In some embodiments, the first operating condition is the initial operating condition of the device under test 105, but not This is limited. Therefore, the contents of the R1 system under the initial operating condition of the device under test 105 should be addressed. As shown in Figure 3, the response R1 is 01010101. In other words, when the device under test 105 is operating under the initial condition, the content of the device under test 105 is 01010101. Furthermore, when the device under test 105 is operating under the first operating condition, the initial reference value C0 in the recorder 180 is reset to 0000000.

待測裝置105的應對R1及其他應對之位元數僅供說明用途。待測裝置105的應對R1及其他應對之各種位元數係在本揭露的保護範圍內。舉例而言,在另一些實施例中,待測裝置105的應對R1或其他每一個應對具有少於8個位元或多於8個位元。 The number of bits for response R1 and other responses of the device under test 105 are for illustration purposes only. The various bit numbers of the device under test 105 for R1 and other responses are within the scope of the present disclosure. For example, in other embodiments, the device under test 105 has less than 8 bits or more than 8 bits for each of the responses R1 or the other.

在操作204中,複寫應對R1至記憶體陣列120中。在一些實施例中,應對R1係從待測裝置105被複製或被複寫,並被保留在記憶體陣列120中。換言之,為說明起見,在以下操作中,01010101的應對R1係儲存在記憶體陣列120內且係不可改變的。在各種實施例中,記憶體陣列120為待測裝置105的複本,因此,記憶體陣列120產生至少一個應對,其係與來自待測裝置105的應對相同。 In operation 204 , pair R1 is copied into the memory array 120 . In some embodiments, the R1 should be copied or overwritten from the device under test 105 and retained in the memory array 120 . In other words, for the sake of illustration, in the following operations, the response R1 of 01010101 is stored in the memory array 120 and cannot be changed. In various embodiments, the memory array 120 is a replica of the device under test 105 , and thus, the memory array 120 generates at least one response that is identical to the response from the device under test 105 .

在操作206中,待測裝置105的操作條件改變。舉例而言,待測裝置105的操作條件係由第一操作條件改變成第二操作條件。在一些實施例中,第二操作條件係與第一操作條件不同。 In operation 206, the operating conditions of the device under test 105 are changed. For example, the operating condition of the device under test 105 is changed from the first operating condition to the second operating condition. In some embodiments, the second operating conditions are different from the first operating conditions.

在操作208中,獲得待測裝置105的新應對。如上所述,當待測裝置105的操作條件改變,待測裝置105的內容因而改變。在一些實施例中,新應對R2係被視為待測 裝置105中改變的內容。為了用以說明,待測裝置105的應對R2為01000101。 In operation 208, a new response for the device under test 105 is obtained. As described above, when the operating conditions of the device under test 105 change, the content of the device under test 105 changes accordingly. In some embodiments, the new coping R2 line is considered to be tested Contents changed in device 105. For illustration, the response R2 of the device under test 105 is 01000101.

在操作210中,比較電路140比較待測裝置105的應對R1及應對R2,以產生比較結果C1。在一些實施例中,互斥或閘142進行應對R1之每一個位元及應對R2之對應位元的互斥或操作,以調整起始參考值C0,以使起始參考值C0被調整為比較結果C1。 In operation 210, the comparison circuit 140 compares the response R1 and the response R2 of the device under test 105 to generate a comparison result C1. In some embodiments, the exclusive OR gate 142 performs an exclusive OR operation on each bit of R1 and the corresponding bit of R2 to adjust the starting reference value C0 so that the starting reference value C0 is adjusted to be Compare result C1.

參閱圖3進行說明,互斥或閘142在應對R1的第一位元及應對R2的第一位元上進行互斥或操作。在一些實施例中,第一位元係被視為例如圖3所示之應對R1內的八位元中的最右邊的位元,且第二位元係被視為應對R1內的八位元中與最右邊位元相鄰的位元,以此類推。以圖3說明之,應對R1的第一位元及應對R2的第一位元具有相同的邏輯值「1」,故在前述兩位元上之互斥或操作的結果為邏輯值「0」。因此,比較結果C1的第一位元保持為具有邏輯值「0」,其係與起始參考值C0的第一位元相同。 Referring to FIG. 3 for description, the exclusive OR gate 142 performs a mutually exclusive OR operation on the first element of R1 and the first element of R2. In some embodiments, the first bit is considered to correspond to the rightmost bit of the octets within R1, such as shown in FIG. 3, and the second bit is considered to correspond to the octets within R1 The bit adjacent to the rightmost bit in the cell, and so on. As illustrated in Figure 3, the first bit corresponding to R1 and the first bit corresponding to R2 have the same logical value "1", so the result of the mutually exclusive OR operation on the aforementioned two cells is the logical value "0" . Therefore, the first bit of the comparison result C1 remains with the logical value "0", which is the same as the first bit of the initial reference value C0.

接著,互斥或閘142在應對R1的第二位元與應對R2的第二位元上進行互斥或操作。由於應對R1的第二位元及應對R2的第二位元具有相同的邏輯值「0」,故在前述兩位元上之互斥或操作的結果為邏輯值「0」。因此,比較結果C1的第二位元保持為具有邏輯值「0」,其係與起始參考值C0的第二位元相同。 Next, the exclusive OR gate 142 performs an exclusive OR operation on the second bit corresponding to R1 and the second bit corresponding to R2. Since the second bit corresponding to R1 and the second bit corresponding to R2 have the same logical value "0", the result of the mutually exclusive OR operation on the aforementioned two bits is the logical value "0". Therefore, the second bit of the comparison result C1 remains with the logical value "0", which is the same as the second bit of the initial reference value C0.

相應地,比較結果C1的第三位元、比較結果C1的第四位元、比較結果C1的第六位元、比較結果C1的第七 位元及比較結果C1的第八位元保持為具有邏輯值「0」。 Correspondingly, the third bit of the comparison result C1, the fourth bit of the comparison result C1, the sixth bit of the comparison result C1, the seventh bit of the comparison result C1 The bit and the eighth bit of the comparison result C1 remain with the logical value "0".

為說明起見,應對R1的第五位元具有邏輯值「1」,但應對R2的第五位元具有邏輯值「0」,故在前述兩位元上之互斥或操作的結果為邏輯值「1」。因此,比較結果C1的第五位元從邏輯值「0」橫越至邏輯值「1」。 For the sake of illustration, the fifth bit of R1 should have a logical value of "1", but the fifth bit of R2 should have a logical value of "0", so the result of the mutually exclusive OR operation on the aforementioned two bits is logical Value "1". Therefore, the fifth bit of the comparison result C1 traverses from the logical value "0" to the logical value "1".

因此,起始參考值C0係調整為比較結果C1。比較結果C1為00010000。比較結果C1係暫時地儲存在記錄器180內。 Therefore, the initial reference value C0 is adjusted to the comparison result C1. The comparison result C1 is 00010000. The comparison result C1 is temporarily stored in the recorder 180 .

在操作212中,確認是否有其他用以測試待測裝置105的操作條件。在一些實施例中,確認步驟係藉由控制器(圖未繪示)或製程電路(圖未繪示)來進行,但不以此為限。若有其他用以測試的操作條件(例如:第三操作條件),重新進行操作206。換言之,待測裝置105的操作條件係由第二操作條件改變為第三操作條件。在一些實施例中,第三操作條件係不同於第二操作條件,且係不同於第一操作條件。 In operation 212 , it is confirmed whether there are other operating conditions for testing the device under test 105 . In some embodiments, the confirming step is performed by a controller (not shown) or a process circuit (not shown), but not limited thereto. If there are other operating conditions for testing (eg, the third operating condition), perform operation 206 again. In other words, the operating condition of the device under test 105 is changed from the second operating condition to the third operating condition. In some embodiments, the third operating condition is different from the second operating condition and is different from the first operating condition.

當待測裝置105在第三操作條件下操作時,可獲得待測裝置105的新應對。如圖3所繪示,待測裝置105的新應對為01111001。接著,互斥或閘142在儲存於記憶體陣列120內的應對R1及應對R3上進行互斥或操作。 When the device under test 105 operates under the third operating condition, a new response of the device under test 105 can be obtained. As shown in FIG. 3 , the new response of the device under test 105 is 01111001. Then, the exclusive OR gate 142 performs the exclusive OR operation on the pair R1 and the pair R3 stored in the memory array 120 .

在一些實施例中,若一個比較結果的第X位元具有預設邏輯值(例如:邏輯值「1」),維持以下比較結果的第X位元。為說明起見,比較結果C1的第五位元具有邏輯值「1」。無論互斥或操作在應對R1的第五位元及應對R3 的第五位元上的結果,以下比較結果C2的第五位元係維持為具有邏輯值「1」,如圖3所示。 In some embodiments, if the Xth bit of a comparison result has a predetermined logic value (eg, logic value "1"), the Xth bit of the following comparison result is maintained. For illustration, the fifth bit of the comparison result C1 has the logical value "1". Either the mutex or operation is in response to the fifth bit of R1 and in response to R3 The result on the fifth bit of , the fifth bit of the following comparison result C2 is maintained to have a logic value of "1", as shown in FIG. 3 .

除此之外,若比較結果的第Y位元具有特定邏輯值(例如:邏輯值「0」),以下比較結果的第Y位元有機會被改變。在一些實施例中,X及Y為正整數。為說明起見,如上所述,每一個應對具有n個位元。X及Y係小於或等於n,且Y係不同於X。 In addition, if the Y-th bit of the comparison result has a specific logic value (eg, logic value "0"), the Y-th bit of the following comparison results may be changed. In some embodiments, X and Y are positive integers. For illustration, as described above, each pair has n bits. X and Y are less than or equal to n, and Y is different from X.

為說明起見,由於應對R1的第一位元及應對R3的第一位元具有相同的邏輯值(例如:邏輯值「0」),故互斥或操作在前述兩位元上的結果為邏輯值「0」。因此,比較結果C2的第一位元係維持為具有邏輯值「0」。 For the sake of illustration, since the first bit corresponding to R1 and the first bit corresponding to R3 have the same logic value (for example, the logic value "0"), the result of the mutually exclusive OR operation on the aforementioned two bits is: Logical value "0". Therefore, the first bit of the comparison result C2 is maintained to have the logical value "0".

相應地,比較結果C2的第二位元、比較結果C2的第七位元及比較結果C2的第八位元係維持為具有邏輯值「0」。 Accordingly, the second bit of the comparison result C2, the seventh bit of the comparison result C2, and the eighth bit of the comparison result C2 are maintained to have the logical value "0".

為說明起見,由於應對R1的第三位元及應對R3的第三位元分別具有不同的邏輯值,故互斥或操作在前述兩位元上的結果為邏輯值「1」。因此,比較結果C2的第三位元係改變為邏輯值「1」。 For the sake of illustration, since the third bit corresponding to R1 and the third bit corresponding to R3 have different logic values, the result of the mutually exclusive OR operation on the aforementioned two bits is the logic value "1". Therefore, the third bit of the comparison result C2 is changed to the logical value "1".

相應地,比較結果C2的第三位元、比較結果C2的第四位元及比較結果C2的第六位元係維持為具有邏輯值「1」。 Accordingly, the third bit of the comparison result C2, the fourth bit of the comparison result C2, and the sixth bit of the comparison result C2 are maintained to have the logic value "1".

因此,調整00010000的比較結果C1,以形成00111100的比較結果C2。比較結果C2係暫時地儲存於記錄器180。換言之,比較結果C2係藉由調整先前的比較結果 C1而產生。 Therefore, the comparison result C1 of 00010000 is adjusted to form the comparison result C2 of 00111100. The comparison result C2 is temporarily stored in the recorder 180 . In other words, the comparison result C2 is adjusted by adjusting the previous comparison result produced by C1.

在比較結果C2產生之後,若進一步有其他用以測試的操作條件(例如:第四操作條件),操作206係再次被輸入。接著,待測裝置105在第四操作條件下操作。因此可獲得相應的應對R4。在一些實施例中,第四操作條件係不同於前述操作條件。 After the comparison result C2 is generated, if there are other operating conditions for testing (eg, the fourth operating condition), the operation 206 is input again. Next, the device under test 105 operates under the fourth operating condition. Therefore, the corresponding response R4 can be obtained. In some embodiments, the fourth operating conditions are different from the preceding operating conditions.

如圖3所示,待測裝置105的新應對R4為01000101。接著,互斥或閘142在來自於記憶體陣列120的應對R1及應對R4上進行互斥或操作。 As shown in FIG. 3 , the new response R4 of the device under test 105 is 01000101. Then, exclusive OR gate 142 performs an exclusive OR operation on pair R1 and pair R4 from memory array 120 .

以圖3做為說明,只有應對R4的第五位元及應對R1的對應位元具有與彼此不同的邏輯值。比較結果C2的第五位元具有邏輯值「1」。因此,比較結果C3的第五位元仍然具有邏輯值「1」。應對R4的其他每一個位元與應對R1的對應位元具有相同的邏輯值。因此,維持比較結果C3的其他位元。因此,比較結果C3與比較結果C2相同。比較結果C3係暫時地儲存於記錄器180。 Taking FIG. 3 as an illustration, only the fifth bit corresponding to R4 and the corresponding bit corresponding to R1 have different logical values from each other. The fifth bit of the comparison result C2 has the logical value "1". Therefore, the fifth bit of the comparison result C3 still has the logic value "1". Every other bit corresponding to R4 has the same logical value as the corresponding bit corresponding to R1. Therefore, the other bits of the comparison result C3 are maintained. Therefore, the comparison result C3 is the same as the comparison result C2. The comparison result C3 is temporarily stored in the recorder 180 .

在比較結果C3產生之後,若尚有其他用以測試的操作條件(例如:第五操作條件),操作206係再次被輸入。接著,待測裝置105的操作條件係從第四操作條件改變為第五操作條件。因此可獲得相應的應對R5。在一些實施例中,第五操作條件係不同於前述操作條件。 After the comparison result C3 is generated, if there are other operating conditions for testing (eg, the fifth operating condition), operation 206 is input again. Next, the operating condition of the device under test 105 is changed from the fourth operating condition to the fifth operating condition. Therefore, the corresponding response R5 can be obtained. In some embodiments, the fifth operating conditions are different from the preceding operating conditions.

以圖3做為說明,待測裝置105的新應對R5為10000110。接著,互斥或閘142在來自於記憶體陣列120的應對R1及應對R5上進行互斥或操作。 Taking FIG. 3 as an illustration, the new response R5 of the device under test 105 is 10000110. Then, exclusive OR gate 142 performs an exclusive OR operation on pair R1 and pair R5 from memory array 120 .

應對R5的第一位元及應對R1的第一位元具有不同的邏輯值。因此,比較結果C4的第一位元係調整為具有邏輯值「1」。相應地,比較結果C4的第二位元、比較結果C4的第七位元及比較結果C4的第八位元係調整為具有邏輯值「1」。因此,調整00111100的比較結果C3,以形成11111111的比較結果C4。比較結果C4係暫時地儲存於記錄器180。 The first bit corresponding to R5 and the first bit corresponding to R1 have different logical values. Therefore, the first bit of the comparison result C4 is adjusted to have the logical value "1". Correspondingly, the second bit of the comparison result C4, the seventh bit of the comparison result C4, and the eighth bit of the comparison result C4 are adjusted to have the logical value "1". Therefore, the comparison result C3 of 00111100 is adjusted to form the comparison result C4 of 11111111. The comparison result C4 is temporarily stored in the recorder 180 .

以圖3做為說明,在比較結果C4產生之後,若沒有用以測試的操作條件,進行方法200的操作214。比較結果C4係當作前述的最終比較結果FC。 Referring to FIG. 3 as an illustration, after the comparison result C4 is generated, if there is no operating condition for testing, the operation 214 of the method 200 is performed. The comparison result C4 is regarded as the aforementioned final comparison result FC.

在另一些實施例中,比較電路140包含複數個互斥或閘142。作為說明,比較電路140包含八個互斥或閘142。每一個互斥或閘進行應對R1之相應位元及其中一個應對之相應位元的互斥或操作。 In other embodiments, the comparison circuit 140 includes a plurality of mutually exclusive OR gates 142 . By way of illustration, compare circuit 140 includes eight exclusive OR gates 142 . Each mutex OR gate performs a mutex OR operation corresponding to the corresponding bit of R1 and one of the corresponding bits corresponding to it.

在比較電路140內之互斥或閘142的數目僅供說明用途。在比較電路140內之互斥或閘142的各種數目係在本揭露的保護範圍內。 The number of mutually exclusive OR gates 142 within comparison circuit 140 is for illustration purposes only. Various numbers of mutually exclusive OR gates 142 within comparison circuit 140 are within the scope of the present disclosure.

在操作214中,計數器162產生與比較結果C4內的位元具有相同邏輯值的數值。在一些實施例中,在比較結果C4內的位元之邏輯值為邏輯值「1」。換言之,計數器162計數在比較結果FC內具有邏輯值「1」之位元的數目。作為說明,比較結果FC為11111111。因此,計數器162所計數的值係等於數值8。如上所述,在一些實施例中,計數器162係以由多個加法器(圖未繪示)所組成的群體計數器 來建置。因此,在前述實施例中,數值8係二進位型式,例如1000,但不以此為限。 In operation 214, the counter 162 generates a value having the same logical value as the bit in the comparison result C4. In some embodiments, the logic value of the bit in the comparison result C4 is the logic value "1". In other words, the counter 162 counts the number of bits having the logical value "1" in the comparison result FC. As an illustration, the comparison result FC is 11111111. Therefore, the value counted by the counter 162 is equal to the value eight. As mentioned above, in some embodiments, the counter 162 is a group counter composed of a plurality of adders (not shown). to build. Therefore, in the foregoing embodiment, the value 8 is a binary format, such as 1000, but not limited thereto.

在操作216中,最大漢明距離產生電路164根據前述來自計數器162的數值及比較結果FC的總位元數來產生最大漢明距離HD。作為說明,最大漢明距離產生電路164計算由計數器產生之數值與比較結果FC之總位元數的比值。換言之,若比較結果C4具有n個位元,且比較結果C4具有m個有邏輯值「1」的位元,最大漢明距離HD係實質等於m/n,其中m及n為正整數。 In operation 216, the maximum Hamming distance generating circuit 164 generates the maximum Hamming distance HD according to the aforementioned value from the counter 162 and the total number of bits of the comparison result FC. Illustratively, the maximum Hamming distance generating circuit 164 calculates the ratio of the value generated by the counter to the total number of bits of the comparison result FC. In other words, if the comparison result C4 has n bits, and the comparison result C4 has m bits with logical value "1", the maximum Hamming distance HD is substantially equal to m/n, where m and n are positive integers.

在一些實施例中,最大漢明距離HD係以百分比的形式呈現。如圖3所示,比較結果FC的總位元數為8。在比較結果FC內之具有邏輯值「1」之位元的位元數也是8。因此,最大漢明距離HD為100%。 In some embodiments, the maximum Hamming distance HD is presented as a percentage. As shown in FIG. 3, the total number of bits of the comparison result FC is 8. The number of bits of the bit having the logical value "1" in the comparison result FC is also 8. Therefore, the maximum Hamming distance HD is 100%.

前述之方法200包含例示操作,但方法200的操作未必要以所述順序進行。本揭露所揭露之方法200之操作的順序係可以改變的,或操作係可以適當地同時或部分同時進行,其實本揭露之各種實施例的精神及範圍。 The foregoing method 200 includes exemplary operations, but the operations of the method 200 do not necessarily have to be performed in the described order. The order of the operations of the method 200 disclosed in the present disclosure may be varied, or the operations may be performed concurrently or partially concurrently, as appropriate, within the spirit and scope of the various embodiments of the present disclosure.

再者,由於前述最大漢明距離HD係根據相同待測裝置105的應對而產生,在一些實施例中,最大漢明距離HD係待測裝置105的內部漢明距離。最大漢明距離HD代表圖3所繪示之應對R1-R5之任二者之間的最大差異。以圖3作為說明,在待測裝置105之應對R1-R5之中,應對R3的所有位元係分別與應對R5之對應位元不同。換言之,應對R3及應對R5之間的差異為100%。因此,待測裝置105的最大 漢明距離HD為100%。 Furthermore, since the aforementioned maximum Hamming distance HD is generated according to the response of the same device under test 105 , in some embodiments, the maximum Hamming distance HD is the internal Hamming distance of the device under test 105 . The maximum Hamming distance HD represents the maximum difference between any of the responses R1-R5 shown in FIG. 3 . Referring to FIG. 3 as an illustration, among the corresponding bits R1-R5 of the device under test 105, all the bits corresponding to R3 are respectively different from the corresponding bits corresponding to R5. In other words, the difference between responding to R3 and responding to R5 is 100%. Therefore, the maximum value of the device under test 105 Hamming distance HD is 100%.

在一些實施例中,當待測設備的最大漢明距離HD為0%,其代表待測設備在不同的操作環境下係完美地可重複且穩固的。 In some embodiments, when the maximum Hamming distance HD of the device under test is 0%, it means that the device under test is perfectly repeatable and robust in different operating environments.

在一些實施例中,當最大漢明距離HD係高於預設值,待測裝置105需要被修正或偵錯。預設值係可動態地調整,而不限於此。 In some embodiments, when the maximum Hamming distance HD is higher than a preset value, the device under test 105 needs to be corrected or debugged. The preset value can be dynamically adjusted, but is not limited thereto.

在一些實施例中,裝置100及待測裝置105係設置在相同晶片或相同晶元上。因此,裝置100直接地在晶片或晶元上測量待測裝置105。在一些實施例中,裝置100在晶圓允收測試(wafer acceptance testing,WAT)臺上測量待測裝置105。 In some embodiments, the device 100 and the device under test 105 are disposed on the same wafer or the same die. Thus, the apparatus 100 measures the device under test 105 directly on the wafer or wafer. In some embodiments, the device 100 measures the device under test 105 on a wafer acceptance testing (WAT) station.

在本揭露中討論的裝置100,裝置100係線上測量待測裝置105,而不下載待測裝置105的任何應對。除此之外,僅最大漢明距離HD被輸出。因此,下載應對的時間係可被節省,且用以儲存下載之應對的儲存空間亦可被節省。 In the device 100 discussed in this disclosure, the device 100 measures the device under test 105 on-line without downloading any response of the device under test 105 . Besides, only the maximum Hamming distance HD is output. Therefore, the time for downloading the response can be saved, and the storage space for storing the downloading response can also be saved.

請參閱圖4。圖4係繪示根據本揭露各種實施例之裝置100A及記憶體105A的示意圖。 See Figure 4. 4 is a schematic diagram illustrating a device 100A and a memory 105A according to various embodiments of the present disclosure.

在一些實施例中,裝置100A為測試裝置。裝置100A係配置以測試記憶體105A的穩固性。在一些實施例中,裝置100A係應用於或建置為內漢明距離分析器。裝置100A係配置以產生記憶體105A的最大漢明距離HD。最大漢明距離HD代表記憶體105A的穩固性。在一些實施例中, 漢明距離HD指出在在二個二進制之間不同位元的數目。 In some embodiments, device 100A is a test device. Device 100A is configured to test the robustness of memory 105A. In some embodiments, the apparatus 100A is applied or implemented as an inner Hamming distance analyzer. Device 100A is configured to generate the maximum Hamming distance HD of memory 105A. The maximum Hamming distance HD represents the robustness of the memory 105A. In some embodiments, Hamming distance HD indicates the number of different bits between two bins.

在一些實施例中,記憶體105A為例如靜態隨機存取記憶體、快閃記憶體或相似者,但不限於此。用以建置待測裝置105或被建置在待測裝置105中之各種記憶體陣列或單元係在本揭露的保護範圍內。在另一些實施例中,記憶體105A包含記憶體電路101A及記憶體電路103A。在一些實施例中,記憶體電路101A為待測裝置。 In some embodiments, the memory 105A is, for example, but not limited to, static random access memory, flash memory, or the like. Various memory arrays or cells used to build the device under test 105 or to be built into the device under test 105 are within the scope of the present disclosure. In other embodiments, memory 105A includes memory circuit 101A and memory circuit 103A. In some embodiments, the memory circuit 101A is the device under test.

在一些實施例中,記憶體電路101A及記憶體電路103A係根據實際應用在各種操作條件下操作。各種條件對應至各種操作環境。作為說明,各種操作條件包含各種供應電壓、各種操作溫度、各種操作頻率或前述之組合。 In some embodiments, the memory circuit 101A and the memory circuit 103A operate under various operating conditions depending on the actual application. Various conditions correspond to various operating environments. By way of illustration, various operating conditions include various supply voltages, various operating temperatures, various operating frequencies, or combinations of the foregoing.

如圖4所示,在一些實施例中,裝置100A包含比較電路140A及計算電路160A。在一些實施例中,裝置100A更包含記錄器180A。比較電路140A係耦合至記憶體105A。記錄器180A係耦合至比較電路140A。計算電路160A係耦合至記錄器180A。在一些實施例中,比較電路140A包含互斥或閘或由互斥或閘所建置。 As shown in FIG. 4, in some embodiments, device 100A includes comparison circuit 140A and calculation circuit 160A. In some embodiments, device 100A further includes recorder 180A. Comparison circuit 140A is coupled to memory 105A. Recorder 180A is coupled to comparison circuit 140A. Computing circuit 160A is coupled to recorder 180A. In some embodiments, the comparison circuit 140A includes or is implemented by a mutex OR gate.

上述討論僅是描述根據各種不同的實施例所使用的例示連接方式。須理解的是,各種不同的實施例並不限於上述或圖4所示的特定連接方式。 The above discussion is merely a description of example connections that may be used in accordance with various embodiments. It should be understood that the various embodiments are not limited to the specific connection methods described above or shown in FIG. 4 .

如圖4所示,記憶體電路103A係配置以產生記憶體電路101A的至少一個應對,並儲存至少一個應對。在一些實施例中,前述至少一個應對係由記憶體電路101A被複製或被複寫至記憶體電路103A,故記憶體電路103A產生 的至少一個應對係與記憶體電路101A所產生的至少一個應對相同。 As shown in FIG. 4, memory circuit 103A is configured to generate at least one response of memory circuit 101A and store at least one response. In some embodiments, the aforementioned at least one response is copied by the memory circuit 101A or is overwritten to the memory circuit 103A, so the memory circuit 103A generates At least one response of is the same as at least one response generated by the memory circuit 101A.

如圖4所示,比較電路140A接收來自記憶體電路103A的應對。在一些實施例中,比較電路140A亦接收來自記憶體電路101A在不同操作條件下所獲得的應對。比較電路140A係配置以依序比較來自記憶體電路103A的應對及來自記憶體電路101A的應對,以產生對應的比較結果。 As shown in FIG. 4, the comparison circuit 140A receives the response from the memory circuit 103A. In some embodiments, comparison circuit 140A also receives responses obtained from memory circuit 101A under different operating conditions. The comparison circuit 140A is configured to sequentially compare the responses from the memory circuit 103A and the responses from the memory circuit 101A to generate corresponding comparison results.

在一些實施例中,比較電路140A係配置以依序地進行來自記憶體電路103A之應對及來自於記憶體電路101A之應對的互斥或操作,以產生對應的比較結果。這些比較結果係被輸出至記錄器180A。在一些實施例中,當獲得比較結果時,記憶體電路101A及記憶體電路103A的角色互換,且再次進行前述的操作。 In some embodiments, the comparison circuit 140A is configured to sequentially perform a mutually exclusive OR operation of the response from the memory circuit 103A and the response from the memory circuit 101A to generate corresponding comparison results. These comparison results are output to the recorder 180A. In some embodiments, when the comparison result is obtained, the roles of the memory circuit 101A and the memory circuit 103A are reversed, and the aforementioned operations are performed again.

如圖4所示,記錄器180A係配置以暫時儲存比較電路140A所產生的比較結果。接著,記錄器180A根據比較結果產生最終比較結果FC。在一些實施例中,最終比較結果FC指出,藉由比較來自於記憶體電路103A之應對及來自於記憶體電路101A之最終應對所產生的比較結果。 As shown in FIG. 4, the recorder 180A is configured to temporarily store the comparison results generated by the comparison circuit 140A. Next, the recorder 180A generates a final comparison result FC according to the comparison result. In some embodiments, the final comparison result FC indicates the comparison result produced by comparing the response from memory circuit 103A with the final response from memory circuit 101A.

在一些實施例中,記錄器180A包含記錄電路182A及記錄電路184A。記錄電路182A係配置以暫時儲存藉由比較來自於記憶體電路103A之應對及在不同操作條件下來自於記憶體電路101A之應對所產生的比較結果。記錄電路184A係配置以暫時儲存藉由比較來自於記憶體電路101A之應對及在不同操作條件下來自於記憶體電路103A 之應對所產生的比較結果。 In some embodiments, recorder 180A includes recording circuit 182A and recording circuit 184A. The recording circuit 182A is configured to temporarily store the comparison results generated by comparing the responses from the memory circuit 103A with the responses from the memory circuit 101A under different operating conditions. Recording circuit 184A is configured to temporarily store responses from memory circuit 101A by comparing responses from memory circuit 103A under different operating conditions corresponding to the results of the comparison.

如圖4所示,計算電路160A係配置以獲得來自於記錄電路182A及記錄電路184A的最終比較結果FC。計算電路160A係進一步地配置以根據最終比較結果FC輸出最大漢明距離HD。最大漢明距離HD代表來自記憶體電路101A之二個應對及來自記憶體電路103A之二個應對之間的最大差異。 As shown in FIG. 4, the calculation circuit 160A is configured to obtain the final comparison result FC from the recording circuit 182A and the recording circuit 184A. The calculation circuit 160A is further configured to output the maximum Hamming distance HD according to the final comparison result FC. The maximum Hamming distance HD represents the maximum difference between the two responses from memory circuit 101A and the two responses from memory circuit 103A.

如圖4所示,在一些實施例中,計算電路160A包含計數器162A及最大漢明距離產生電路164A。計數器162A係與記錄電路182A及記錄電路184A耦合。最大漢明距離產生電路164A係與計數器162A耦合。 As shown in FIG. 4, in some embodiments, the calculation circuit 160A includes a counter 162A and a maximum Hamming distance generating circuit 164A. Counter 162A is coupled to recording circuit 182A and recording circuit 184A. Maximum Hamming distance generating circuit 164A is coupled to counter 162A.

計數器162A係配置以接收前述之來自於記錄電路182A及記錄電路184A的最終比較結果FC。根據最終比較結果FC,計數器162A計數的數值指出最終比較結果FC具有相同邏輯值的位元數。在一些實施例中,相同邏輯值為「1」。換言之,若最終比較結果FC的4個位元具有邏輯值「1」,則計數器162A輸出指示4的數據至最大漢明距離產生電路164A。在一些實施例中,計數器162A係以由多個加法器(圖未繪示)所組成的群體計數器來建置。在另一些實施例中,計數器162A係以其他邏輯閘來建置。 The counter 162A is configured to receive the aforementioned final comparison result FC from the recording circuit 182A and the recording circuit 184A. According to the final comparison result FC, the value counted by the counter 162A indicates the number of bits in which the final comparison result FC has the same logical value. In some embodiments, the same logic value is "1". In other words, if the 4 bits of the final comparison result FC have the logic value "1", the counter 162A outputs the data indicating 4 to the maximum Hamming distance generating circuit 164A. In some embodiments, the counter 162A is implemented as a group counter composed of a plurality of adders (not shown). In other embodiments, the counter 162A is implemented with other logic gates.

接著,最大漢明距離產生電路164A根據前述數值及最終比較結果FC的總位元數來產生最大漢明距離HD。最大漢明距離HD代表來自記憶體電路101A的二個應對之間的最大差異。在一些實施例中,最大漢明距離產生電 路164A係以減法器(圖未繪示)來建置或包含減法器,但不以此為限。在另一些實施例中,最大漢明距離產生電路164A係以其他邏輯閘來建置。 Next, the maximum Hamming distance generating circuit 164A generates the maximum Hamming distance HD according to the aforementioned value and the total number of bits of the final comparison result FC. The maximum Hamming distance HD represents the maximum difference between the two responses from memory circuit 101A. In some embodiments, the maximum Hamming distance produces electrical The circuit 164A is constructed with a subtractor (not shown) or includes a subtractor, but is not limited thereto. In other embodiments, the maximum Hamming distance generating circuit 164A is implemented with other logic gates.

請參閱圖5。圖5係繪示根據本揭露各種實施例之圖4的裝置100A及記憶體105A進行操作之方法200A的流程圖。 See Figure 5. 5 is a flowchart illustrating a method 200A of operating the device 100A and memory 105A of FIG. 4 in accordance with various embodiments of the present disclosure.

以下由圖5所繪示之方法200A描述裝置100A及記憶體105A之間的操作。為了便於理解,方法200A係配合圖4進行討論。 The operations between the device 100A and the memory 105A are described below by the method 200A depicted in FIG. 5 . For ease of understanding, the method 200A is discussed in conjunction with FIG. 4 .

在操作202A中,當記憶體電路101A在第一操作條件下操作時,獲得記憶體電路101A的應對。在一些實施例中,第一操作條件為記憶體電路101A的起始操作條件,但不限於此。 In operation 202A, the response of the memory circuit 101A is obtained when the memory circuit 101A operates under the first operating condition. In some embodiments, the first operating condition is the initial operating condition of the memory circuit 101A, but is not limited thereto.

在操作204A中,複製或複寫應對至記憶體電路103A。在一些實施例中,應對係自記憶體電路101A被複製或被複寫,並維持在記憶體電路103A中。 In operation 204A, a copy or overwrite process is made to the memory circuit 103A. In some embodiments, the response is copied or overwritten from memory circuit 101A and maintained in memory circuit 103A.

在操作206A中,改變記憶體電路101A之操作條件。舉例而言,記憶體電路101A的操作條件由第一操作條件改變成第二操作條件。在一些實施例中,第二操作條件係與第一操作條件不同。 In operation 206A, the operating conditions of the memory circuit 101A are changed. For example, the operating condition of the memory circuit 101A is changed from the first operating condition to the second operating condition. In some embodiments, the second operating conditions are different from the first operating conditions.

在操作208A中,獲得記憶體電路101A的新應對。如上所述,當記憶體電路101A的操作條件改變,記憶體電路101A的內容因而改變。 In operation 208A, a new response for memory circuit 101A is obtained. As described above, when the operating conditions of the memory circuit 101A change, the contents of the memory circuit 101A change accordingly.

在操作210A中,比較電路140A比較新應對及 記憶體電路103A的應對,以產生比較結果。 In operation 210A, the comparison circuit 140A compares the new response and The response of the memory circuit 103A to generate the comparison result.

在操作212A中,確認是否有其他用以測試記憶體電路101A的操作條件。在一些實施例中,確認步驟係藉由控制器(圖未繪示)或製程電路(圖未繪示)進行,但不以此為限。若有其他用以測試的操作條件(例如:第三操作條件),重新進行操作206A。換言之,記憶體電路101A的操作條件係由第二操作條件改變為第三操作條件。在一些實施例中,第三操作條件係不同於第二操作條件,且係不同於第一操作條件。 In operation 212A, it is determined whether there are other operating conditions for testing the memory circuit 101A. In some embodiments, the confirming step is performed by a controller (not shown) or a process circuit (not shown), but not limited thereto. If there are other operating conditions for testing (eg, the third operating condition), perform operation 206A again. In other words, the operating condition of the memory circuit 101A is changed from the second operating condition to the third operating condition. In some embodiments, the third operating condition is different from the second operating condition and is different from the first operating condition.

若沒有其他用以測試的操作條件,進行方法200A的操作202B。在一些實施例中,記憶體電路101A及記憶體電路103A的角色互換,以下將進行描述。 If there are no other operating conditions to test, operation 202B of method 200A is performed. In some embodiments, the roles of the memory circuit 101A and the memory circuit 103A are reversed, as will be described below.

在操作202B中,當記憶體電路103A在第一對應操作條件下操作,獲得記憶體電路103A的應對。 In operation 202B, when the memory circuit 103A operates under the first corresponding operating condition, the response of the memory circuit 103A is obtained.

在操作204B中,複製或複寫應對至記憶體電路101A中。在一些實施例中,應對係自記憶體電路103A被複製或被複寫,並維持在記憶體電路101A。 In operation 204B, a copy or overwrite process is performed into the memory circuit 101A. In some embodiments, the response is copied or overwritten from memory circuit 103A and maintained in memory circuit 101A.

在操作206B中,改變記憶體電路103A之操作條件。舉例而言,記憶體電路103A的操作條件由第一操作條件改變成第二操作條件。在一些實施例中,第二操作條件係與第一操作條件不同。 In operation 206B, the operating conditions of the memory circuit 103A are changed. For example, the operating condition of the memory circuit 103A is changed from the first operating condition to the second operating condition. In some embodiments, the second operating conditions are different from the first operating conditions.

在操作208B中,獲得記憶體電路103A的新應對。如上所述,當記憶體電路103A的操作條件改變,記憶體電路103A的內容因而改變。 In operation 208B, a new response for memory circuit 103A is obtained. As described above, when the operating conditions of the memory circuit 103A change, the contents of the memory circuit 103A change accordingly.

在操作210B中,比較電路140A比較新應對及記憶體電路103A的應對,以產生比較結果。 In operation 210B, the comparison circuit 140A compares the new response with the response of the memory circuit 103A to generate a comparison result.

在操作212B中,確認是否有其他用以測試記憶體電路103A的操作條件。若有其他用以測試的操作條件(例如:第三操作條件),重新進行操作206B。 In operation 212B, it is determined whether there are other operating conditions for testing the memory circuit 103A. If there are other operating conditions for testing (eg, the third operating condition), perform operation 206B again.

若沒有其他用以測試的操作條件,進行方法200A的操作214A。 If there are no other operating conditions to test, operation 214A of method 200A is performed.

在操作214A中,計數器162A產生與比較結果內的位元具有相同邏輯值的數值。在一些實施例中,在比較結果內的位元之邏輯值為邏輯值「1」。換言之,計數器162A計數在比較結果FC內具有邏輯值「1」之位元的數目。作為說明,比較結果FC為11111111(二進制)。因此,計數器162A所計數的值係等於數值8。如上所述,在一些實施例中,計數器162A係以由多個加法器(圖未繪示)所組成的群體計數器來建置。因此,在前述實施例中,數值8係二進位型式,例如1000,但不以此為限。 In operation 214A, counter 162A generates a value having the same logical value as the bit in the comparison result. In some embodiments, the logical value of the bit in the comparison result is the logical value "1". In other words, the counter 162A counts the number of bits having the logical value "1" in the comparison result FC. As an illustration, the comparison result FC is 11111111 (binary). Therefore, the value counted by the counter 162A is equal to the value eight. As mentioned above, in some embodiments, the counter 162A is implemented as a group counter composed of a plurality of adders (not shown). Therefore, in the foregoing embodiment, the value 8 is a binary format, such as 1000, but not limited thereto.

在操作216A中,最大漢明距離產生電路164A根據前述來自計數器162A的數值及比較結果FC的總位元數來產生最大漢明距離HD。作為說明,最大漢明距離產生電路164A計算由計數器產生之數值與比較結果FC之總位元數的比值。換言之,若比較結果具有n個位元,且比較結果具有m個有邏輯值「1」的位元,最大漢明距離HD係實質等於m/n,其中m及n為正整數。 In operation 216A, the maximum Hamming distance generating circuit 164A generates the maximum Hamming distance HD according to the aforementioned value from the counter 162A and the total number of bits of the comparison result FC. Illustratively, the maximum Hamming distance generating circuit 164A calculates the ratio of the value generated by the counter to the total number of bits of the comparison result FC. In other words, if the comparison result has n bits, and the comparison result has m bits with logical value "1", the maximum Hamming distance HD is substantially equal to m/n, where m and n are positive integers.

相較於圖1所示之在一些實施例中為待測記憶 體陣列的記憶體陣列120及待測裝置105,圖4中的實施例僅繪示一個包含記憶體電路101A及記憶體電路103A的記憶體105A,其係分別配置為記憶體陣列及待測裝置,或反之亦然。在圖4中的實施例,記憶體105A可被配置為用以產生PUF位元的待測裝置,且記憶體陣列係用以儲存來自待測裝置的應對。因此,圖4中的裝置之整體面積可被減少。 Compared to that shown in FIG. 1 , in some embodiments, the memory to be tested is The memory array 120 and the device under test 105 of the bulk array, the embodiment in FIG. 4 only shows a memory 105A including the memory circuit 101A and the memory circuit 103A, which are configured as the memory array and the device under test, respectively , or vice versa. In the embodiment of FIG. 4, memory 105A may be configured as the DUT for generating PUF bits, and the memory array is used to store responses from the DUT. Therefore, the overall area of the device in FIG. 4 can be reduced.

在一些實施例中,揭露一種用以測試記憶體的裝置,此記憶體包含第一記憶體電路及第二記憶體電路。第二記憶體電路係配置以儲存第一記憶體電路的第一應對。此裝置包含比較電路及計算電路。比較電路係配置以比較儲存在第二記憶體電路之第一應對及第一記憶體電路在不同的條件下操作的複數個應對,以產生複數個第一比較結果。計算電路係配置以根據第一比較結果輸出最大漢明距離,其中最大漢明距離係在第一應對及第一記憶體電路的複數個應對之其中二者之間。 In some embodiments, an apparatus for testing a memory including a first memory circuit and a second memory circuit is disclosed. The second memory circuit is configured to store the first response of the first memory circuit. The device includes a comparison circuit and a calculation circuit. The comparison circuit is configured to compare the first response stored in the second memory circuit with a plurality of responses in which the first memory circuit operates under different conditions to generate a plurality of first comparison results. The calculation circuit is configured to output a maximum Hamming distance according to the first comparison result, wherein the maximum Hamming distance is between two of the first pair and the plurality of pairs of the first memory circuit.

在一些實施例中,第一記憶體電路係配置以儲存第二記憶體電路的第二應對。比較電路係配置以比較儲存在第一記憶體電路之第二應對及第二記憶體電路在不同的條件下操作的複數個應對,以產生複數個第二比較結果。 In some embodiments, the first memory circuit is configured to store the second response of the second memory circuit. The comparison circuit is configured to compare the second response stored in the first memory circuit with a plurality of responses operated by the second memory circuit under different conditions to generate a plurality of second comparison results.

在各種實施例中,計算電路係配置以根據第二比較結果輸出最大漢明距離,其中最大漢明距離係在第二應對及第二記憶體電路的多個應對之其中二者之間。 In various embodiments, the computing circuit is configured to output a maximum Hamming distance based on the second comparison result, wherein the maximum Hamming distance is between the second pair and two of the plurality of pairs of the second memory circuit.

在一些實施例中,裝置更包含記錄器,且記錄器係包含第一記錄電路及第二記錄電路。第一記錄電路係配 置以儲存用以計算最大漢明距離之第一比較結果,且第二記錄電路係配置以儲存用以計算最大漢明距離之第二比較結果。 In some embodiments, the device further includes a recorder, and the recorder includes a first recording circuit and a second recording circuit. The first recording circuit system The first comparison result for calculating the maximum Hamming distance is arranged to store, and the second recording circuit is configured to store the second comparison result for calculating the maximum Hamming distance.

在各種實施例中,比較電路包含互斥或閘。互斥或閘係配置以進行第一應對及第一記憶體電路之每一個應對的互斥或操作,以及進行第二應對及第二記憶體電路之每一個應對的互斥或操作。 In various embodiments, the comparison circuit includes a mutex or gate. The mutual exclusion or gates are configured to perform a mutually exclusive OR operation of the first pair and each of the first memory circuits, and to perform a mutually exclusive OR operation of the second pair and each of the second memory circuits.

在一些實施例中,計算電路包含計數器。計數器係配置以產生第一數值,其中第一數值指出在第一比較結果之對應比較結果中具有相同邏輯值之位元的數目,且計數器係配置以產生第二數值,其中第二數值指出在第二比較結果之對應比較結果中具有相同邏輯值之位元的數目。 In some embodiments, the computing circuit includes a counter. The counter is configured to generate a first value, wherein the first value indicates the number of bits having the same logical value in a corresponding comparison result of the first comparison result, and the counter is configured to generate a second value, wherein the second value indicates a The number of bits with the same logic value in the corresponding comparison result of the second comparison result.

在各種實施例中,計算電路更係配置以根據第一數值及第一比較結果之對應比較結果的位元數,以產生最大漢明距離,並根據第二數值及第二比較結果之對應比較結果的位元數,以產生最大漢明距離。 In various embodiments, the calculation circuit is further configured to generate the maximum Hamming distance according to the first value and the number of bits of the corresponding comparison result of the first comparison result, and to generate the maximum Hamming distance according to the corresponding comparison of the second value and the second comparison result The number of bits of the result to yield the maximum Hamming distance.

亦揭露一種方法,其係包含以下操作。維持在第一操作條件下之記憶體之第一記憶體電路的第一應對。儲存在記憶體之第二記憶體電路內之第一應對係依序地與在操作條件下之第一記憶體電路的複數個應對比較,以產生複數個第一比較結果。前述操作條件係彼此不同。複數個第一比較結果之每一個比較結果係藉由調整複數個第一比較結果之前一比較結果而產生。根據複數個第一比較結果,獲得最大差值,其中最大差值係介於第一應對及第一記憶體電路 之應對之其中二者之間。 Also disclosed is a method comprising the following operations. A first response of the first memory circuit of the memory under the first operating condition is maintained. The first pair stored in the second memory circuit of the memory is sequentially compared with the plurality of pairs of the first memory circuit under operating conditions to generate a plurality of first comparison results. The aforementioned operating conditions are different from each other. Each of the plurality of first comparison results is generated by adjusting a previous comparison result of the plurality of first comparison results. Obtain the maximum difference value according to the plurality of first comparison results, wherein the maximum difference value is between the first pair and the first memory circuit The response is between the two.

在一些實施例中,方法更包含以下操作。維持在第二操作條件下之記憶體之第二記憶體電路的第二應對。儲存在記憶體之第一記憶體電路內之第二應對係依序與在操作條件下之第二記憶體電路的複數個應對比較,以產生複數個第二比較結果。前述操作條件係彼此不同。複數個第二比較結果之每一個比較結果係藉由調整複數個第二比較結果之前一比較結果而產生。 In some embodiments, the method further includes the following operations. A second response of the second memory circuit maintaining the memory under the second operating condition. The second pair stored in the first memory circuit of the memory is sequentially compared with the plurality of responses of the second memory circuit under operating conditions to generate a plurality of second comparison results. The aforementioned operating conditions are different from each other. Each of the plurality of second comparison results is generated by adjusting a previous comparison result of the plurality of second comparison results.

在各種實施例中,維持第一記憶體電路之第一應對包含以下操作。複製第一應對至記憶體之第二記憶體電路內。維持被複製之第一應對在第二記憶體電路內。 In various embodiments, maintaining the first response of the first memory circuit includes the following operations. The first pair is copied into the second memory circuit of the memory. The replicated first pair is maintained within the second memory circuit.

在一些實施例中,維持第一應對包含以下操作。藉由第二記憶體電路,產生第一應對。 In some embodiments, maintaining the first response includes the following operations. The first response is generated by the second memory circuit.

在各種實施例中,維持第二記憶體電路之第二應對包含以下操作。複製第二應對至記憶體之第一記憶體電路內。維持被複製之第二應對在第一記憶體電路內。 In various embodiments, maintaining the second response of the second memory circuit includes the following operations. The second pair is copied into the first memory circuit of the memory. The replicated second pair is maintained within the first memory circuit.

在一些實施例中,維持第二應對包含以下操作。藉由第一記憶體電路,產生第二應對。 In some embodiments, maintaining the second response includes the following operations. A second response is generated by the first memory circuit.

在一些實施例中,方法更包含以下操作。暫時儲存第一比較結果及第二比較結果,以計算最大漢明距離。 In some embodiments, the method further includes the following operations. The first comparison result and the second comparison result are temporarily stored to calculate the maximum Hamming distance.

在各種實施例中,獲得最大差值之操作包含以下操作。產生第一數值,其中第一數值指出在第一比較結果之對應比較結果中具有相同邏輯值之位元的數目。產生第二數值,其中第二數值指出在第二比較結果之對應比較結果中 具有相同邏輯值之位元的數目。 In various embodiments, the operation of obtaining the maximum difference value includes the following operations. A first value is generated, wherein the first value indicates the number of bits having the same logical value in a corresponding comparison result of the first comparison result. generates a second value, where the second value is indicated in the corresponding comparison result of the second comparison result The number of bits with the same logical value.

在一些實施例中,輸出最大漢明距離更包含以下操作。根據第一數值及第一比較結果之對應比較結果的位元數,以產生該最大漢明距離。根據第二數值及第二比較結果之對應比較結果的位元數,以產生最大漢明距離。 In some embodiments, outputting the maximum Hamming distance further includes the following operations. The maximum Hamming distance is generated according to the first value and the number of bits of the corresponding comparison result of the first comparison result. The maximum Hamming distance is generated according to the second value and the number of bits of the corresponding comparison result of the second comparison result.

在各種實施例中,比較儲存在記憶體之第二記憶體電路之第一應對與第一記憶體電路之應對包含以下操作。進行儲存在第二記憶體電路之第一應對與第一記憶體電路之每一個應對的互斥或操作。 In various embodiments, comparing the first pair of the second memory circuit stored in the memory with the pair of the first memory circuit includes the following operations. A mutually exclusive OR operation of the first pair stored in the second memory circuit and each pair of the first memory circuit is performed.

在一些實施例中,比較儲存在記憶體之第一記憶體電路之第二應對與第二記憶體電路之應對包含以下操作。進行儲存在第一記憶體電路之第二應對與第二記憶體電路之每一個應對的互斥或操作。 In some embodiments, comparing the second pair of the first memory circuit stored in the memory with the pair of the second memory circuit includes the following operations. A mutually exclusive OR operation of the second pair stored in the first memory circuit and each pair of the second memory circuit is performed.

更揭露一種方法,其係包含以下操作。操作在彼此不同的條件下之記憶體之第一記憶體電路,以獲得第一記憶體電路之複數個應對。第一記憶體電路之複數個應對係儲存在記憶體之第二記憶體電路內。依序進行儲存在記憶體之第二記憶體電路之第一記憶體電路之複數個應對與第一記憶體電路之應對之其他應對的互斥或操作,以產生最終比較結果。根據最終比較結果,輸出介於第一應對及其他應對之其中二者之間的最大漢明距離。 Further disclosed is a method comprising the following operations. The first memory circuits of the memories under mutually different conditions are operated to obtain a plurality of responses of the first memory circuits. A plurality of responses of the first memory circuit are stored in the second memory circuit of the memory. The mutual exclusion or operation of the plurality of responses of the first memory circuit stored in the second memory circuit of the memory and the other responses of the responses of the first memory circuit is sequentially performed to generate a final comparison result. According to the final comparison result, output the maximum Hamming distance between the first response and the other responses.

在一些實施例中,輸出最大漢明距離包含以下操作。產生數值,其中數值指出在最終比較結果中具有相同邏輯值之位元的數目。根據數值及最終比較結果之位元數, 以產生最大漢明距離。 In some embodiments, outputting the maximum Hamming distance includes the following operations. Generates a numerical value that indicates the number of bits that have the same logical value in the final comparison result. According to the value and the number of bits of the final comparison result, to produce the maximum Hamming distance.

上述摘要許多實施例的特徵,因此本領域具有通常知識者可更了解本揭露的態樣。本領域具有通常知識者應理解利用本揭露為基礎可以設計或修飾其他製程和結構以實現和所述實施例相同的目的及/或達成相同優勢。本領域具有通常知識者也應了解與此同等的架構並沒有偏離本揭露的精神和範圍,且可以在不偏離本揭露的精神和範圍下做出各種變化、交換和取代。 The foregoing summarizes the features of many embodiments so that those of ordinary skill in the art may better understand aspects of the present disclosure. Those of ordinary skill in the art should appreciate that using the present disclosure as a basis, other processes and structures can be devised or modified to achieve the same purposes and/or achieve the same advantages as the described embodiments. Those skilled in the art should also understand that the equivalent structure does not deviate from the spirit and scope of the present disclosure, and can make various changes, exchanges and substitutions without departing from the spirit and scope of the present disclosure.

100:裝置 100: Device

105:待測裝置 105: Device to be tested

120:記憶體陣列 120: Memory array

140:比較電路 140: Comparison circuit

142:互斥或閘 142: mutex or gate

160:計算電路 160: Computational Circuits

162:計數器 162: Counter

164:最大漢明距離產生電路 164: Maximum Hamming distance generation circuit

180:記錄器 180: Recorder

FC:最終比較結果 FC: Final Comparison Results

HD:漢明距離 HD: Hamming distance

Claims (10)

一種測試裝置,用以測試一記憶體,其中該記憶體包含一第一記憶體電路及一第二記憶體電路,該第二記憶體電路係配置以儲存該第一記憶體電路的複數個應對中之一第一應對,並且該第一記憶體電路係配置以儲存該第二記憶體電路的複數個應對中之一第二應對,該測試裝置包含:一比較電路,配置以比較儲存在該第二記憶體電路之該第一應對與該第一記憶體電路在對應不同的操作環境的多個操作條件下操作的該些應對,以產生複數個第一比較結果,且配置以比較儲存在該第一記憶體電路的該第二應對與該第二記憶體電路在對應該些不同操作環境的多個操作條件下操作的該些應對,以產生多個第二比較結果,其中該比較電路更是配置以根據該些第一比較結果及該些第二比較結果產生一最終結果;以及一計算電路,配置以根據該最終結果輸出一最大漢明距離,其中該最大漢明距離係在該第一記憶體電路之該些應對之其中二者之間。 A testing device for testing a memory, wherein the memory includes a first memory circuit and a second memory circuit, the second memory circuit is configured to store a plurality of responses of the first memory circuit one of the first responses, and the first memory circuit is configured to store a second response of the plurality of responses of the second memory circuit, the testing device includes: a comparison circuit configured to compare the responses stored in the second memory circuit The first response of the second memory circuit and the responses of the first memory circuit operating under a plurality of operating conditions corresponding to different operating environments to generate a plurality of first comparison results, and are configured to compare stored in The second responses of the first memory circuit and the responses of the second memory circuit operating under operating conditions corresponding to the different operating environments to generate second comparison results, wherein the comparison circuit It is further configured to generate a final result according to the first comparison results and the second comparison results; and a calculation circuit configured to output a maximum Hamming distance according to the final result, wherein the maximum Hamming distance is in the These responses of the first memory circuit are between the two. 如請求項1所述之測試裝置,其中該計算電路係配置以根據第二比較結果輸出最大漢明距離,其中最大漢明距離係在第二應對及第二記憶體電路的多個應對之其中二者之間。 The test apparatus of claim 1, wherein the computing circuit is configured to output a maximum Hamming distance according to the second comparison result, wherein the maximum Hamming distance is among the plurality of pairs of the second pair and the second memory circuit between the two. 如請求項2所述之測試裝置,更包含: 一記錄器,配置以儲存該些第一比較結果、該些第二比較結果及該最終結果,其中該記錄器包含第一記錄電路及第二記錄電路,該第一記錄電路是配置以儲存用以計算該最大漢明距離的該些第一比較結果,且該第二記錄電路是配置以儲存用以計算該最大漢明距離的該些第二比較結果。 The test device as described in claim 2, further comprising: a recorder configured to store the first comparison results, the second comparison results and the final result, wherein the recorder includes a first recording circuit and a second recording circuit, the first recording circuit is configured to store to calculate the first comparison results of the maximum Hamming distance, and the second recording circuit is configured to store the second comparison results used to calculate the maximum Hamming distance. 如請求項2所述之測試裝置,更包含:一互斥或閘,配置以進行該第一應對及該第一記憶體電路的該些應對的每一個的一互斥或操作,以及進行該第二應對及該第二記憶體電路的該些應對的每一個的一互斥或操作。 The test apparatus of claim 2, further comprising: a mutual exclusion OR gate configured to perform a mutual exclusion OR operation for each of the first pair and the responses of the first memory circuit, and to perform the A mutually exclusive OR operation of each of the pairs of the second pair and the second memory circuit. 如請求項2所述之測試裝置,更包含:一計數器,配置以產生一第一數值,其中該第一數值指出在該些第一比較結果之一對應比較結果中具有一相同邏輯值之多個位元的一數目,且該計數器係配置以產生一第二數值,其中該第二數值指出在該些第二比較結果之一對應比較結果中具有一相同邏輯值之多個位元的一數目。 The test apparatus of claim 2, further comprising: a counter configured to generate a first value, wherein the first value indicates that one of the first comparison results has a same logic value as much as a corresponding comparison result A number of bits, and the counter is configured to generate a second value, wherein the second value indicates a number of bits having a same logical value in a corresponding comparison result of one of the second comparison results number. 一種用以測試記憶體的方法,包含:維持在多個操作條件的一第一操作條件下的一記憶體的一第一記憶體電路的多個應對中的一第一應對;儲存在該記憶體的一第二記憶體電路內的該第一應對依序地與在對應不同操作環境的該些操作條件下的該第一 記憶體電路的該些應對比較,以產生多個第一比較結果,其中該些第一比較結果的每一個比較結果是通過調整該些第一比較結果的前一比較結果而產生;維持在該些操作條件的一第二操作條件下的該記憶體的一第二記憶體電路的多個應對中的一第二應對;儲存在該記憶體的該第一記憶體電路內的該第二應對依序地與在對應該些不同操作環境的該些操作條件下的該第一記憶體電路的該些應對比較,以產生多個第二比較結果,其中該些第二比較結果的每一個比較結果是通過調整該些第二比較結果的前一比較結果而產生;基於依序地比較該第一應對與該第一記憶體電路的該些應對以及依序地比較該第二應對與該第二記憶體電路的該些應對產生一最終結果;以及根據該最終結果,獲得介於該第一記憶體電路的該些應對的其中二者之間的一最大差值。 A method for testing a memory, comprising: maintaining a first response of a first memory circuit of a memory under a first operating condition of a plurality of operating conditions; storing a first response in the memory The first response in a second memory circuit of the body is sequentially matched with the first under the operating conditions corresponding to different operating environments The corresponding comparisons of the memory circuit generate a plurality of first comparison results, wherein each comparison result of the first comparison results is generated by adjusting the previous comparison result of the first comparison results; a second response of a plurality of responses of a second memory circuit of the memory under a second operating condition of some operating conditions; the second response stored in the first memory circuit of the memory sequentially compared with the responses of the first memory circuit under the operating conditions corresponding to the different operating environments to generate a plurality of second comparison results, wherein each of the second comparison results is compared A result is generated by adjusting a previous comparison result of the second comparison results; based on sequentially comparing the first pair with the responses of the first memory circuit and sequentially comparing the second pair with the first The responses of the two memory circuits produce a final result; and according to the final result, a maximum difference between two of the responses of the first memory circuit is obtained. 如請求項6所述之方法,其中維持該第一記憶體電路的該第一應對包含:複製該第一應對至該記憶體的該第二記憶體電路內;維持被複製的該第一應對在該第二記憶體電路內。 The method of claim 6, wherein maintaining the first correspondence of the first memory circuit comprises: copying the first correspondence into the second memory circuit of the memory; maintaining the copied first correspondence within the second memory circuit. 如請求項6所述之方法,其中維持該第一應對包含:藉由第二記憶體電路,產生第一應對,以及其中維持該第二記憶體電路的該第二應對包含: 複製該第二應對至該記憶體之該第一記憶體電路內;以及維持被複製之該第二應對在該第一記憶體電路內。 The method of claim 6, wherein maintaining the first response comprises: generating, by a second memory circuit, a first response, and wherein maintaining the second response of the second memory circuit comprises: Duplicating the second pair into the first memory circuit of the memory; and maintaining the duplicated second pair in the first memory circuit. 一種用以測試記憶體的方法,包含:操作在對應不同操作環境的多個操作條件下的一記憶體的一第一記憶體電路,以獲得該第一記憶體電路的多個應對,以及儲存該第一記憶體電路的該些應對的一第一應對在該記憶體的該第二記憶體電路內;依序進行儲存在該記憶體的該第二記憶體電路的該第一記憶體電路的該些應對的該第一應對與該第一記憶體電路的該些應對的其他多個應對的一互斥或操作,以產生該第一記憶體電路的該些應對的多個比較結果;操作在對應該些不同操作環境的多個操作條件下的該第二記憶體電路,以獲得該第二記憶體電路的多個應對,以及儲存該第二記憶體電路的該些應對的一第二應對在該第一記憶體電路內;依序進行儲存在該記憶體的該第一記憶體電路的該第二記憶體電路的該些應對的該第二應對與該第二記憶體電路的該些應對的其他多個應對的一互斥或操作,以產生該第二記憶體電路的該些應對的多個比較結果;根據該第一記憶體電路的該些應對的該第一應對的該互斥或操作及該第二記憶體電路的該些應對的該第二應對的該互斥或操作產生一最終比較結果;以及根據該最終比較結果,輸出該第一記憶體電路的該些 應對的其中二者之間的一最大漢明距離。 A method for testing memory, comprising: operating a first memory circuit of a memory under a plurality of operating conditions corresponding to different operating environments to obtain a plurality of responses of the first memory circuit, and storing A first pair of the correspondences of the first memory circuit is in the second memory circuit of the memory; the first memory circuit of the second memory circuit stored in the memory is sequentially performed a mutual exclusion or operation of the first correspondence of the correspondences and other correspondences of the correspondences of the first memory circuit to generate comparison results of the correspondences of the first memory circuit; operating the second memory circuit under a plurality of operating conditions corresponding to the different operating environments to obtain a plurality of responses of the second memory circuit, and a first memory circuit storing the responses of the second memory circuit Two pairs are in the first memory circuit; the second pair of the pairs of the second memory circuit of the first memory circuit stored in the memory and the second memory circuit of the second memory circuit are sequentially performed. A mutual exclusion or operation of the other responses of the responses to generate a plurality of comparison results of the responses of the second memory circuit; according to the first responses of the responses of the first memory circuit The mutually exclusive OR operation and the second counterpart of the mutual exclusive OR operation of the second memory circuit generate a final comparison result; and output the first memory circuit according to the final comparison result Coping with a maximum Hamming distance between the two. 如請求項9所述之方法,其中輸出該最大漢明距離包含:產生一數值,該數值指出在該最終比較結果中具有一相同邏輯值的多個位元的一數目;以及根據該數值及該最終比較結果的一位元數,產生該最大漢明距離。 The method of claim 9, wherein outputting the maximum Hamming distance comprises: generating a numerical value indicating a number of bits in the final comparison result having a same logical value; and according to the numerical value and The one-digit number of the final comparison result that yields the maximum Hamming distance.
TW108104851A 2018-06-18 2019-02-13 Method and testing device for testing memory TWI757583B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/011,215 US10515713B2 (en) 2016-11-28 2018-06-18 Hamming-distance analyzer and method for analyzing hamming-distance
US16/011,215 2018-06-18

Publications (2)

Publication Number Publication Date
TW202001918A TW202001918A (en) 2020-01-01
TWI757583B true TWI757583B (en) 2022-03-11

Family

ID=68921117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108104851A TWI757583B (en) 2018-06-18 2019-02-13 Method and testing device for testing memory

Country Status (2)

Country Link
CN (1) CN110619921B (en)
TW (1) TWI757583B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111883192B (en) * 2020-07-20 2023-02-03 安徽大学 Circuit for realizing Hamming distance calculation in memory based on 9T SRAM unit and 9T SRAM unit

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5951711A (en) * 1993-12-30 1999-09-14 Texas Instruments Incorporated Method and device for determining hamming distance between two multi-bit digital words
US6625225B1 (en) * 1999-10-29 2003-09-23 Matsushita Electric Industrial Co., Ltd. Trellis decoder and associated method
JP3766993B2 (en) * 1995-10-30 2006-04-19 ソニー株式会社 Sync signal detection circuit
US8339824B2 (en) * 2008-07-02 2012-12-25 Cooke Laurence H Nearest neighbor serial content addressable memory
US20160063510A1 (en) * 2013-04-24 2016-03-03 Steven Simske Validation in serialization flow

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3742878B2 (en) * 2002-05-31 2006-02-08 国立大学法人広島大学 Self-adjusting winner lineup amplifier
US7779334B2 (en) * 2006-06-26 2010-08-17 Taiwan Semiconductor Manufacturing Company, Ltd. Memory having an ECC system
US8429495B2 (en) * 2010-10-19 2013-04-23 Mosaid Technologies Incorporated Error detection and correction codes for channels and memories with incomplete error characteristics
GB2527604A (en) * 2014-06-27 2015-12-30 Ibm Data encoding in solid-state storage devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5951711A (en) * 1993-12-30 1999-09-14 Texas Instruments Incorporated Method and device for determining hamming distance between two multi-bit digital words
JP3766993B2 (en) * 1995-10-30 2006-04-19 ソニー株式会社 Sync signal detection circuit
US6625225B1 (en) * 1999-10-29 2003-09-23 Matsushita Electric Industrial Co., Ltd. Trellis decoder and associated method
US8339824B2 (en) * 2008-07-02 2012-12-25 Cooke Laurence H Nearest neighbor serial content addressable memory
US20160063510A1 (en) * 2013-04-24 2016-03-03 Steven Simske Validation in serialization flow

Also Published As

Publication number Publication date
TW202001918A (en) 2020-01-01
CN110619921B (en) 2025-02-11
CN110619921A (en) 2019-12-27

Similar Documents

Publication Publication Date Title
US20220198111A1 (en) Device for generating verification vector for circuit design verification, circuit design system, and reinforcement learning method of the device and the circuit design system
Hu et al. Memristor crossbar based hardware realization of BSB recall function
CN102884583B (en) There is the flash memory system of the cross coupling compensation at read operations
US12033710B2 (en) System and method for conducting built-in self-test of memory macro
CN115620795A (en) Memory fault testing method, device, equipment and storage medium
CN114582411B (en) Memory detection method, circuit, device, equipment and storage medium
Nair et al. Defect characterization and test generation for spintronic-based compute-in-memory
TWI757583B (en) Method and testing device for testing memory
US9472306B2 (en) Semiconductor device and its quality management method
Chaudhuri et al. Fault-tolerant neuromorphic computing systems
TW407209B (en) Test-circuit and method to test a digital semiconductor circuit-arrangement
TWI660360B (en) Test system and method of operating the same
US6634004B1 (en) Threshold analysis system capable of deciding all threshold voltages included in memory device through single processing
CN116298523A (en) Vehicle insulation resistance detection method, device, equipment, medium and product
Ravi et al. Memristor based memories: defects, testing, and testability techniques
TW202201416A (en) Memory system and method of operating memory
Münch et al. Defect characterization of spintronic-based neuromorphic circuits
CN109425815B (en) Apparatus and method for predicting characteristics of semiconductor device
TWI706414B (en) In-memory computation system and memory device thereof
US11195593B2 (en) Hamming-distance analyzer and method for analyzing hamming-distance
WO2021120136A1 (en) Storage computing array and module, and data computing method
US10515710B2 (en) Hamming-distance analyzer
Miyadera et al. Wigner-Araki-Yanase theorem on distinguishability
CN121208611A (en) Intermediate relay verification circuit, method, system and equipment
Hamdioui et al. Device-Aware Test: A Means to Attack Unmodelled Defects