TWI757583B - Method and testing device for testing memory - Google Patents
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Abstract
Description
本揭露是關於一種用以測試記憶體的測試裝置,特別是關於一種漢明距離(Hamming Distance)分析器及其分析方法。 The present disclosure relates to a test device for testing memory, and more particularly, to a Hamming Distance analyzer and an analysis method thereof.
由於許多製程因素的緣故,即使積體電路係以相同的製程及相同的材料所製造,每一個積體電路(Integrated Circuit,IC)都是獨特的。每一個積體電路都有機會根據其實際應用而在不同的操作環境下操作。因此,多個積體電路之一在不同操作環境下的穩固性(Robustness)為半導體科技領域中的關鍵課題。 Due to many process factors, each integrated circuit (IC) is unique even though the integrated circuits are fabricated with the same process and the same materials. Every integrated circuit has the opportunity to operate in different operating environments depending on its actual application. Therefore, the robustness of one of the plurality of integrated circuits under different operating environments is a key issue in the field of semiconductor technology.
本揭露之一態樣係揭露一種用以測試記憶體的測試裝置,且記憶體包含第一記憶體電路及第二記憶體電路。第二記憶體電路係配置以儲存第一記憶體電路的複數個應對中的第一應對,並且該第一記憶體電路係配置以儲存該第二記憶體電路的複數個應對中之一第二應對。測試裝置包 含比較電路及計算電路。比較電路係配置以比較儲存在第二記憶體電路之第一應對與第一記憶體電路在對應不同的操作環境的多個操作條件下操作的複數個應對,以產生複數個第一比較結果,且配置以比較儲存在第一記憶體電路的第二應對與第二記憶體電路在對應不同操作環境的多個操作條件下操作的多個應對,以產生多個第二比較結果,其中比較電路更是配置以根據第一比較結果及第二比較結果產生一最終結果。計算電路係配置以根據最終結果輸出最大漢明距離,其中最大漢明距離係在第一記憶體電路的複數個應對之其中二者之間。 An aspect of the present disclosure discloses a test apparatus for testing a memory, and the memory includes a first memory circuit and a second memory circuit. The second memory circuit is configured to store a first one of the plurality of responses of the first memory circuit, and the first memory circuit is configured to store a second one of the plurality of responses of the second memory circuit response. Test Set Package Including comparison circuit and calculation circuit. The comparison circuit is configured to compare the first response stored in the second memory circuit with a plurality of responses that the first memory circuit operates under a plurality of operating conditions corresponding to different operating environments to generate a plurality of first comparison results, and configured to compare a second response stored in the first memory circuit with a plurality of responses of the second memory circuit operating under a plurality of operating conditions corresponding to different operating environments to generate a plurality of second comparison results, wherein the comparison circuit It is further configured to generate a final result according to the first comparison result and the second comparison result. The calculation circuit is configured to output the maximum Hamming distance according to the final result, wherein the maximum Hamming distance is between two of the plurality of responses of the first memory circuit.
本揭露之一態樣係揭露一種用以測試記憶體的方法,包含:維持在多個操作條件的一第一操作條件下的一記憶體的一第一記憶體電路的多個應對中的一第一應對;儲存在記憶體的一第二記憶體電路內的第一應對依序地與在對應不同操作環境的操作條件下的第一記憶體電路的應對比較,以產生多個第一比較結果,其中第一比較結果的每一個比較結果是通過調整第一比較結果的前一比較結果而產生;維持在操作條件的一第二操作條件下的記憶體的一第二記憶體電路的多個應對中的一第二應對;儲存在記憶體的第一記憶體電路內的第二應對依序地與在對應不同操作環境的操作條件下的第一記憶體電路的應對比較,以產生多個第二比較結果,其中第二比較結果的每一個比較結果是通過調整第二比較結果的前一比較結果而產生;基於依序地比較第一應對與第一記憶體電路的應對以及依序地比較第二應對 與第二記憶體電路的應對產生一最終結果;以及根據最終結果,獲得介於第一記憶體電路的應對的其中二者之間的一最大差值。 One aspect of the present disclosure discloses a method for testing a memory, comprising: maintaining one of a plurality of responses of a first memory circuit of a memory under a first operating condition of a plurality of operating conditions a first response; the first responses stored in a second memory circuit of the memory are sequentially compared with the responses of the first memory circuit under operating conditions corresponding to different operating environments to generate a plurality of first comparisons As a result, wherein each comparison result of the first comparison result is generated by adjusting the previous comparison result of the first comparison result; maintaining a plurality of a second memory circuit of a memory under a second operation condition of the operation condition A second response among the responses; the second responses stored in the first memory circuit of the memory are sequentially compared with responses of the first memory circuit under operating conditions corresponding to different operating environments to generate multiple responses a second comparison result, wherein each comparison result of the second comparison result is generated by adjusting the previous comparison result of the second comparison result; second response The coping with the second memory circuit produces a final result; and according to the final result, a maximum difference between the two of the copings with the first memory circuit is obtained.
本揭露之一態樣係揭露一種用以測試記憶體的方法,包含:操作在對應不同操作環境的多個操作條件下的一記憶體的一第一記憶體電路,以獲得第一記憶體電路的多個應對,以及儲存第一記憶體電路的應對的一第一應對在記憶體的第二記憶體電路內;依序進行儲存在記憶體的第二記憶體電路的第一記憶體電路的應對的第一應對與第一記憶體電路的應對的其他多個應對的一互斥或操作,以產生第一記憶體電路的應對的多個比較結果;操作在對應不同操作環境的多個操作條件下的第二記憶體電路,以獲得第二記憶體電路的多個應對,以及儲存第二記憶體電路的應對的一第二應對在第一記憶體電路內;依序進行儲存在記憶體的第一記憶體電路的第二記憶體電路的應對的第二應對與第二記憶體電路的應對的其他多個應對的一互斥或操作,以產生第二記憶體電路的應對的多個比較結果;根據第一記憶體電路的應對的第一應對的互斥或操作及第二記憶體電路的應對的第二應對的互斥或操作產生一最終比較結果;以及根據最終比較結果,輸出第一記憶體電路的應對的其中二者之間的一最大漢明距離。 An aspect of the present disclosure discloses a method for testing a memory, comprising: operating a first memory circuit of a memory under a plurality of operating conditions corresponding to different operating environments to obtain the first memory circuit A plurality of responses, and a first response that stores the responses of the first memory circuit is in the second memory circuit of the memory; the first memory circuit of the second memory circuit stored in the memory is sequentially performed. A mutually exclusive OR operation of the first response to the response and the other responses of the first memory circuit to generate multiple comparison results of the response of the first memory circuit; the operations are performed in a plurality of operations corresponding to different operating environments the second memory circuit under the condition to obtain a plurality of responses of the second memory circuit, and store a second response of the response of the second memory circuit in the first memory circuit; sequentially store in the memory The second response of the first memory circuit, the second response of the second memory circuit, and the second response of the second memory circuit are mutually exclusive or operated with a plurality of responses of the second memory circuit to generate a plurality of responses of the second memory circuit a comparison result; a final comparison result is generated according to the mutual exclusion or operation of the first response of the first memory circuit and the mutual exclusion or operation of the second response of the second memory circuit; and according to the final comparison result, output A maximum Hamming distance between the two for the response of the first memory circuit.
100:裝置 100: Device
105:待測裝置 105: Device to be tested
120:記憶體陣列 120: Memory array
140:比較電路 140: Comparison circuit
142:互斥或閘 142: mutex or gate
160:計算電路 160: Computational Circuits
162:計數器 162: Counter
164:最大漢明距離產生電路 164: Maximum Hamming distance generation circuit
180:記錄器 180: Recorder
100A:裝置 100A: Device
101A/103A:記憶體電路 101A/103A: Memory circuit
105A:待測裝置 105A: Device under test
140A:比較電路 140A: Comparison circuit
160A:計算電路 160A: Computing Circuits
162A:計數器 162A: Counter
164A:最大漢明距離產生電路 164A: Maximum Hamming Distance Generation Circuit
180A:記錄器 180A: Recorder
182A/184A:記錄電路 182A/184A: Recording Circuit
200:方法 200: Method
202-216:操作 202-216: Operations
202A-216A:操作 202A-216A: Operation
C0:起始參考值 C0: Start reference value
C1-C4:比較結果 C1-C4: Comparison results
R1-R5:應對 R1-R5: Coping
FC:最終比較結果 FC: Final Comparison Results
HD:漢明距離 HD: Hamming distance
根據以下詳細說明並配合附圖閱讀,使本揭露的態樣獲致較佳的理解。需注意的是,如同業界的標準作法,許多特徵並不是按照比例繪示的。事實上,為了進行清楚討論,許多特徵的尺寸可以經過任意縮放。 Aspects of the present disclosure will be better understood from the following detailed description read in conjunction with the accompanying drawings. It should be noted that, as is standard practice in the industry, many features are not drawn to scale. In fact, the dimensions of many features can be arbitrarily scaled for clarity of discussion.
[圖1]係繪示根據本揭露各種實施例之裝置及待測裝置的示意圖。 [FIG. 1] is a schematic diagram illustrating a device and a device under test according to various embodiments of the present disclosure.
[圖2]係繪示根據本揭露各種實施例之圖1的裝置對待測裝置操作之方法的流程圖。 [ FIG. 2 ] is a flowchart illustrating a method of operating the device under test of the device of FIG. 1 according to various embodiments of the present disclosure.
[圖3]係繪示根據本揭露各種實施例之針對圖1的裝置及待測裝置之比較步驟的示意圖。 [ FIG. 3 ] is a schematic diagram illustrating a comparison step for the device of FIG. 1 and the device under test according to various embodiments of the present disclosure.
[圖4]係繪示根據本揭露各種實施例之裝置及記憶體的示意圖。 4 is a schematic diagram illustrating a device and a memory according to various embodiments of the present disclosure.
[圖5]係繪示根據本揭露各種實施例之圖4的裝置對記憶體執行操作之方法的流程圖。 [ FIG. 5 ] is a flowchart illustrating a method for the device of FIG. 4 to perform operations on memory according to various embodiments of the present disclosure.
以下揭露提供許多不同實施例或例示,以實施發明的不同特徵。以下敘述之成份和排列方式的特定例示是為了簡化本揭露。這些當然僅是做為例示,其目的不在構成限制。舉例而言,第一特徵形成在第二特徵之上或上方的描述包含第一特徵和第二特徵有直接接觸的實施例,也包含有其他特徵形成在第一特徵和第二特徵之間,以致第一特徵和第二特徵沒有直接接觸的實施例。許多特徵的尺寸可以不同比例繪示,以使其簡化且清晰。除此之外,本揭露在各種例 示中會重複元件符號及/或字母。此重複的目的是為了簡化和明確,並不表示所討論的各種實施例及/或配置之間有任何關係。 The following disclosure provides many different embodiments or illustrations for implementing various features of the invention. The specific illustrations of components and arrangements described below are for the purpose of simplifying the present disclosure. These are, of course, only examples and are not intended to be limiting. For example, a description that a first feature is formed on or over a second feature includes embodiments in which the first feature and the second feature are in direct contact, as well as embodiments where other features are formed between the first feature and the second feature, Embodiments such that the first feature and the second feature are not in direct contact. The dimensions of many features may be drawn at different scales for simplicity and clarity. In addition to this, this disclosure is Symbols and/or letters are repeated in the illustration. This repetition is for simplicity and clarity and does not imply any relationship between the various embodiments and/or configurations discussed.
在說明書中使用的用語一般具有其在本領域中的原有的意義,且每一個用語係用於特定的內容。在本說明書中使用的具體例(包含任何在此討論的用語之具體例)僅係用以說明,而非用以限制本揭露或任何說明用語的範圍及意義。同樣地,本揭露係不以本說明書中的各種實施例為限。 Terms used in the specification generally have their original meanings in the art, and each term is used for a specific context. Specific examples (including specific examples of any terms discussed herein) used in this specification are for illustration only, and are not intended to limit the scope and meaning of the disclosure or any explanatory terms. Likewise, the present disclosure is not limited to the various embodiments in this specification.
雖然「第一(first)」及「第二(second)」等用語在此可被用以描述各種元件,這些元件係不受這些用語所限制。這些用語僅是用以分辨此一元件與其他者。舉例而言,第一元件可為第二元件,且相似地,第二元件可為第一元件,而不偏離實施例的範圍。如所用者,用語「及/或」包含一或多個相關列示物件之任意組合及全部組合。 Although the terms "first" and "second" may be used herein to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish this element from the others. For example, a first element could be a second element, and similarly, a second element could be a first element, without departing from the scope of the embodiments. As used, the term "and/or" includes any and all combinations of one or more of the associated listed items.
用於本說明書之「包含(comprise)」、「包含(comprising)」、「包括(include)」、「包括(including)」、「有(has)」、「具有(having)」等用語為開放式的且表示「包含但不限於」。 Terms such as "comprise", "comprising", "include", "including", "has", "having", etc. used in this specification are open Formula and means "including but not limited to".
請參閱圖1。圖1為根據本揭露之各種實施例的裝置100及待測裝置105的示意圖。
See Figure 1. 1 is a schematic diagram of a
在一些實施例中,裝置100為測試裝置。裝置100係配置以測試待測裝置105的穩固性(Robustness)。在一些實施例中,裝置100係應用於或建置為內漢明距離分析器(Intra-hamming Analyzer)。裝置100係配置以產生待
測裝置105的最大漢明距離(Hamming Distance;HD)。最大漢明距離HD代表待測裝置105的穩固性。在一些實施例中,漢明距離HD指出在二個二進制之間不同位元的數目。
In some embodiments,
在一些實施例中,待測裝置105為待測記憶體陣列。在一些其他的實施例中,待測裝置105包含待測記憶體陣列。待測記憶體陣列為例如靜態隨機存取記憶體(static random access memory,SRAM)、快閃記憶體或相似者,但不限於此。用以建置各種記憶體陣列或單元在待測裝置105中或被建置於在待測裝置105中的各種記憶體陣列或單元係在本揭露的保護範圍內。
In some embodiments, the device under
在一些實施例中,待測裝置105根據其實際應用而在不同的操作條件下操作。操作條件係對應至不同的操作環境。為說明起見,不同的操作條件對應至不同的供應電壓、不同的操作溫度、不同的操作頻率或前述之組合。
In some embodiments, the device under
在一些實施例中,當待測裝置105在不同的操作條件下操作時,待測裝置105的應對為不同。在一些實施例中,每一個應對係在特定操作環境下之待測裝置105中的內容。為說明起見,待測裝置105在10℃下操作的應對係與待測裝置105在50℃下操作的應對不同。
In some embodiments, the device under
如圖1所示,在一些實施例中,裝置100包含記憶體陣列120、比較電路140及計算電路160。在一些實施例中,裝置100更包含記錄器180。記憶體陣列120係耦合至待測裝置105。比較電路140係耦合至記憶體陣列120及待測裝置105。記錄器180係耦合至比較電路140。計算電
路160係耦合至記錄器180。
As shown in FIG. 1 , in some embodiments, the
上述討論僅是根據各種不同實施例而描述可使用的例示連接方式。須理解的是,各種不同的實施例不受限於上述之特定連接或圖1所示者。 The above discussion is merely to describe exemplary connections that may be used in accordance with various embodiments. It should be understood that the various embodiments are not limited to the specific connections described above or those shown in FIG. 1 .
除此之外,在此說明書中,用語「耦合(coupled)」也可稱為「電性耦合(electrically coupled)」,而用語「連接(connected)」也可稱為「電性連接(electrically connected)」。「耦合(coupled)」及「連接(connected)」也可用以指出兩個或更多元件協作或與彼此交互作用。 In addition, in this specification, the term "coupled" may also be referred to as "electrically coupled", and the term "connected" may also be referred to as "electrically connected" )". "Coupled" and "connected" may also be used to indicate that two or more elements cooperate or interact with each other.
如圖1所示,記憶體陣列120係配置以產生待測裝置105的至少一個應對,並儲存至少一個應對。在一些實施例中,前述至少一個應對係從待測裝置105被複製或被複寫至記憶體陣列120。在一些實施例中,記憶體陣列120係待測裝置105的複本,據此,記憶體陣列120產生至少一個應對,其係與待測裝置105的至少一個應對相同。
As shown in FIG. 1 , the
在一些實施例中,記憶體陣列120的儲存容量係對應至待測裝置105之至少一個應對的位元數。舉例而言,若待測裝置105的至少一個應對具有n位元,記憶體陣列120的儲存容量具有至少n個位元。
In some embodiments, the storage capacity of the
如圖1所示,比較電路140接收來自記憶體陣列120的應對。比較電路140亦接收來自待測裝置105在不同操作條件下所獲得的應對。比較電路140係配置以依序地比較來自於記憶體陣列120的應對與來自於待測裝置105的多
個應對,以產生對應的比較結果。
As shown in FIG. 1 , the
如圖1所示,在一些實施例中,比較電路140包含至少一個互斥或閘(exclusive OR gate)142。互斥或閘142具有第一輸入端、第二輸入端及輸出端。第一輸入端係與記憶體陣列120耦合,以接收來自記憶體陣列120的應對。第二輸入端係與待測裝置105耦合,以接收來自待測裝置105在不同操作條件下所獲得的應對。互斥或閘142的輸出端係與記錄器180耦合。
As shown in FIG. 1 , in some embodiments, the
互斥或閘142係配置以依序地進行來自記憶體陣列120之應對及來自於待測裝置105之應對的互斥或操作,以產生對應的比較結果。這些比較結果係被輸出至記錄器180。
The exclusive OR
比較電路140的配置僅供說明用途。比較電路140的各種配置係在本揭露的保護範圍內。舉例而言,在一些其他實施例中,比較電路140包含一個以上的互斥或閘,而在另一些實施例,比較電路140包含許多個互斥或閘,其數量係對應至來自於待測裝置105之應對的相同數量。在一些其他實施例中,比較電路140係藉由其他邏輯元件所建置。
The configuration of the
如圖1所示,記錄器180係配置以暫時地儲存由比較電路140產生的比較結果。接著,根據比較結果,記錄器180產生最終比較結果FC。在一些實施例中,最終比較結果FC指出藉由比較來自於記憶體陣列120之應對與來自於待測裝置105之最終應對所產生的比較結果。
As shown in FIG. 1 , the
記錄器180的數量僅供說明用途。各種數量的記錄器180係在本揭露的保護範圍內。在一些其他實施例中,裝置100包含一個以上的記錄器。舉例而言,在一些其他實施例中,裝置100包含二個記錄器。二個記錄器的第一記錄器係與比較電路140耦合,以暫時地儲存來自於比較電路140之兩個對應位元的比較。二個記錄器的第二記錄器係與第一記錄器耦合,且係配置以產生最終比較結果FC,其係根據來自第一記錄器之不同的兩個對應位元的複數個比較。
The number of
如圖1所示,計算電路160係配置以接收來自於記錄器180的最終比較結果FC。計算電路160係進一步地配置以根據最終比較結果FC輸出最大漢明距離HD。最大漢明距離HD代表來自待測裝置105之二個應對之間的最大差異。
As shown in FIG. 1 , the
如圖1所示,在一些實施例中,計算電路160包含計數器162及最大漢明距離產生電路164。計數器162係與記錄器180耦合。最大漢明距離產生電路164係與計數器162耦合。
As shown in FIG. 1 , in some embodiments, the
計數器162係配置以接收前述之來自於記錄器180的最終比較結果FC。根據最終比較結果FC,計數器162計數的數值指出最終比較結果FC具有相同邏輯值的位元數。在一些實施例中,相同邏輯值為「1」。換言之,若最終比較結果FC的4個位元具有邏輯值「1」,則計數器162輸出指示4的數據至最大漢明距離產生電路164。在一些實
施例中,計數器162係以由多個加法器(圖未繪示)所組成的群體計數器來執行。在另一些實施例中,計數器162係以其他邏輯閘來執行。
The
接著,最大漢明距離產生電路164根據前述數值及最終比較結果FC的總位元數來產生最大漢明距離HD。最大漢明距離HD代表來自待測裝置105的二個應對之間的最大差異。在一些實施例中,最大漢明距離產生電路164係以減法器(圖未繪示)來建置或包含減法器,但不以此為限。在另一些實施例中,最大漢明距離產生電路164係以其他邏輯閘來建置。
Next, the maximum Hamming
計算電路160的配置僅供說明用途。計算電路160的各種配置係在本揭露的保護範圍內。
The configuration of
再者,圖1中之裝置100的配置僅供說明用途。裝置100的各種配置係在本揭露的保護範圍內。
Furthermore, the configuration of the
請參閱圖2及圖3。圖2係繪示根據本揭露各種實施例之圖1的裝置100對待測裝置105之操作方法200的流程圖。圖3係繪示根據本揭露各種實施例之針對圖1的裝置100及待測裝置105之比較步驟的示意圖。
Please refer to Figure 2 and Figure 3. FIG. 2 is a flowchart illustrating a
圖1中的裝置100及待測裝置105之間的操作係藉由以下圖2所繪示之方法200來描述。為了更佳的了解本揭露,方法200係參閱圖1及圖3來說明。
The operation between the
在操作202中,當待測裝置105係在第一操作條件下操作時,可獲得待測裝置105的應對R1。在一些實施例中,第一操作條件為待測裝置105的起始操作條件,但不以
此為限。因此,應對R1係待測裝置105在起始操作條件下的內容。如圖3所繪示,應對R1為01010101。換言之,當待測裝置105係在起始條件下操作,待測裝置105的內容為01010101。再者,當待測裝置105在第一操作條件下操作時,記錄器180中的起始參考值C0係重新設定為0000000。
In
待測裝置105的應對R1及其他應對之位元數僅供說明用途。待測裝置105的應對R1及其他應對之各種位元數係在本揭露的保護範圍內。舉例而言,在另一些實施例中,待測裝置105的應對R1或其他每一個應對具有少於8個位元或多於8個位元。
The number of bits for response R1 and other responses of the device under
在操作204中,複寫應對R1至記憶體陣列120中。在一些實施例中,應對R1係從待測裝置105被複製或被複寫,並被保留在記憶體陣列120中。換言之,為說明起見,在以下操作中,01010101的應對R1係儲存在記憶體陣列120內且係不可改變的。在各種實施例中,記憶體陣列120為待測裝置105的複本,因此,記憶體陣列120產生至少一個應對,其係與來自待測裝置105的應對相同。
In
在操作206中,待測裝置105的操作條件改變。舉例而言,待測裝置105的操作條件係由第一操作條件改變成第二操作條件。在一些實施例中,第二操作條件係與第一操作條件不同。
In
在操作208中,獲得待測裝置105的新應對。如上所述,當待測裝置105的操作條件改變,待測裝置105的內容因而改變。在一些實施例中,新應對R2係被視為待測
裝置105中改變的內容。為了用以說明,待測裝置105的應對R2為01000101。
In
在操作210中,比較電路140比較待測裝置105的應對R1及應對R2,以產生比較結果C1。在一些實施例中,互斥或閘142進行應對R1之每一個位元及應對R2之對應位元的互斥或操作,以調整起始參考值C0,以使起始參考值C0被調整為比較結果C1。
In
參閱圖3進行說明,互斥或閘142在應對R1的第一位元及應對R2的第一位元上進行互斥或操作。在一些實施例中,第一位元係被視為例如圖3所示之應對R1內的八位元中的最右邊的位元,且第二位元係被視為應對R1內的八位元中與最右邊位元相鄰的位元,以此類推。以圖3說明之,應對R1的第一位元及應對R2的第一位元具有相同的邏輯值「1」,故在前述兩位元上之互斥或操作的結果為邏輯值「0」。因此,比較結果C1的第一位元保持為具有邏輯值「0」,其係與起始參考值C0的第一位元相同。
Referring to FIG. 3 for description, the exclusive OR
接著,互斥或閘142在應對R1的第二位元與應對R2的第二位元上進行互斥或操作。由於應對R1的第二位元及應對R2的第二位元具有相同的邏輯值「0」,故在前述兩位元上之互斥或操作的結果為邏輯值「0」。因此,比較結果C1的第二位元保持為具有邏輯值「0」,其係與起始參考值C0的第二位元相同。
Next, the exclusive OR
相應地,比較結果C1的第三位元、比較結果C1的第四位元、比較結果C1的第六位元、比較結果C1的第七 位元及比較結果C1的第八位元保持為具有邏輯值「0」。 Correspondingly, the third bit of the comparison result C1, the fourth bit of the comparison result C1, the sixth bit of the comparison result C1, the seventh bit of the comparison result C1 The bit and the eighth bit of the comparison result C1 remain with the logical value "0".
為說明起見,應對R1的第五位元具有邏輯值「1」,但應對R2的第五位元具有邏輯值「0」,故在前述兩位元上之互斥或操作的結果為邏輯值「1」。因此,比較結果C1的第五位元從邏輯值「0」橫越至邏輯值「1」。 For the sake of illustration, the fifth bit of R1 should have a logical value of "1", but the fifth bit of R2 should have a logical value of "0", so the result of the mutually exclusive OR operation on the aforementioned two bits is logical Value "1". Therefore, the fifth bit of the comparison result C1 traverses from the logical value "0" to the logical value "1".
因此,起始參考值C0係調整為比較結果C1。比較結果C1為00010000。比較結果C1係暫時地儲存在記錄器180內。
Therefore, the initial reference value C0 is adjusted to the comparison result C1. The comparison result C1 is 00010000. The comparison result C1 is temporarily stored in the
在操作212中,確認是否有其他用以測試待測裝置105的操作條件。在一些實施例中,確認步驟係藉由控制器(圖未繪示)或製程電路(圖未繪示)來進行,但不以此為限。若有其他用以測試的操作條件(例如:第三操作條件),重新進行操作206。換言之,待測裝置105的操作條件係由第二操作條件改變為第三操作條件。在一些實施例中,第三操作條件係不同於第二操作條件,且係不同於第一操作條件。
In
當待測裝置105在第三操作條件下操作時,可獲得待測裝置105的新應對。如圖3所繪示,待測裝置105的新應對為01111001。接著,互斥或閘142在儲存於記憶體陣列120內的應對R1及應對R3上進行互斥或操作。
When the device under
在一些實施例中,若一個比較結果的第X位元具有預設邏輯值(例如:邏輯值「1」),維持以下比較結果的第X位元。為說明起見,比較結果C1的第五位元具有邏輯值「1」。無論互斥或操作在應對R1的第五位元及應對R3 的第五位元上的結果,以下比較結果C2的第五位元係維持為具有邏輯值「1」,如圖3所示。 In some embodiments, if the Xth bit of a comparison result has a predetermined logic value (eg, logic value "1"), the Xth bit of the following comparison result is maintained. For illustration, the fifth bit of the comparison result C1 has the logical value "1". Either the mutex or operation is in response to the fifth bit of R1 and in response to R3 The result on the fifth bit of , the fifth bit of the following comparison result C2 is maintained to have a logic value of "1", as shown in FIG. 3 .
除此之外,若比較結果的第Y位元具有特定邏輯值(例如:邏輯值「0」),以下比較結果的第Y位元有機會被改變。在一些實施例中,X及Y為正整數。為說明起見,如上所述,每一個應對具有n個位元。X及Y係小於或等於n,且Y係不同於X。 In addition, if the Y-th bit of the comparison result has a specific logic value (eg, logic value "0"), the Y-th bit of the following comparison results may be changed. In some embodiments, X and Y are positive integers. For illustration, as described above, each pair has n bits. X and Y are less than or equal to n, and Y is different from X.
為說明起見,由於應對R1的第一位元及應對R3的第一位元具有相同的邏輯值(例如:邏輯值「0」),故互斥或操作在前述兩位元上的結果為邏輯值「0」。因此,比較結果C2的第一位元係維持為具有邏輯值「0」。 For the sake of illustration, since the first bit corresponding to R1 and the first bit corresponding to R3 have the same logic value (for example, the logic value "0"), the result of the mutually exclusive OR operation on the aforementioned two bits is: Logical value "0". Therefore, the first bit of the comparison result C2 is maintained to have the logical value "0".
相應地,比較結果C2的第二位元、比較結果C2的第七位元及比較結果C2的第八位元係維持為具有邏輯值「0」。 Accordingly, the second bit of the comparison result C2, the seventh bit of the comparison result C2, and the eighth bit of the comparison result C2 are maintained to have the logical value "0".
為說明起見,由於應對R1的第三位元及應對R3的第三位元分別具有不同的邏輯值,故互斥或操作在前述兩位元上的結果為邏輯值「1」。因此,比較結果C2的第三位元係改變為邏輯值「1」。 For the sake of illustration, since the third bit corresponding to R1 and the third bit corresponding to R3 have different logic values, the result of the mutually exclusive OR operation on the aforementioned two bits is the logic value "1". Therefore, the third bit of the comparison result C2 is changed to the logical value "1".
相應地,比較結果C2的第三位元、比較結果C2的第四位元及比較結果C2的第六位元係維持為具有邏輯值「1」。 Accordingly, the third bit of the comparison result C2, the fourth bit of the comparison result C2, and the sixth bit of the comparison result C2 are maintained to have the logic value "1".
因此,調整00010000的比較結果C1,以形成00111100的比較結果C2。比較結果C2係暫時地儲存於記錄器180。換言之,比較結果C2係藉由調整先前的比較結果
C1而產生。
Therefore, the comparison result C1 of 00010000 is adjusted to form the comparison result C2 of 00111100. The comparison result C2 is temporarily stored in the
在比較結果C2產生之後,若進一步有其他用以測試的操作條件(例如:第四操作條件),操作206係再次被輸入。接著,待測裝置105在第四操作條件下操作。因此可獲得相應的應對R4。在一些實施例中,第四操作條件係不同於前述操作條件。
After the comparison result C2 is generated, if there are other operating conditions for testing (eg, the fourth operating condition), the
如圖3所示,待測裝置105的新應對R4為01000101。接著,互斥或閘142在來自於記憶體陣列120的應對R1及應對R4上進行互斥或操作。
As shown in FIG. 3 , the new response R4 of the device under
以圖3做為說明,只有應對R4的第五位元及應對R1的對應位元具有與彼此不同的邏輯值。比較結果C2的第五位元具有邏輯值「1」。因此,比較結果C3的第五位元仍然具有邏輯值「1」。應對R4的其他每一個位元與應對R1的對應位元具有相同的邏輯值。因此,維持比較結果C3的其他位元。因此,比較結果C3與比較結果C2相同。比較結果C3係暫時地儲存於記錄器180。
Taking FIG. 3 as an illustration, only the fifth bit corresponding to R4 and the corresponding bit corresponding to R1 have different logical values from each other. The fifth bit of the comparison result C2 has the logical value "1". Therefore, the fifth bit of the comparison result C3 still has the logic value "1". Every other bit corresponding to R4 has the same logical value as the corresponding bit corresponding to R1. Therefore, the other bits of the comparison result C3 are maintained. Therefore, the comparison result C3 is the same as the comparison result C2. The comparison result C3 is temporarily stored in the
在比較結果C3產生之後,若尚有其他用以測試的操作條件(例如:第五操作條件),操作206係再次被輸入。接著,待測裝置105的操作條件係從第四操作條件改變為第五操作條件。因此可獲得相應的應對R5。在一些實施例中,第五操作條件係不同於前述操作條件。
After the comparison result C3 is generated, if there are other operating conditions for testing (eg, the fifth operating condition),
以圖3做為說明,待測裝置105的新應對R5為10000110。接著,互斥或閘142在來自於記憶體陣列120的應對R1及應對R5上進行互斥或操作。
Taking FIG. 3 as an illustration, the new response R5 of the device under
應對R5的第一位元及應對R1的第一位元具有不同的邏輯值。因此,比較結果C4的第一位元係調整為具有邏輯值「1」。相應地,比較結果C4的第二位元、比較結果C4的第七位元及比較結果C4的第八位元係調整為具有邏輯值「1」。因此,調整00111100的比較結果C3,以形成11111111的比較結果C4。比較結果C4係暫時地儲存於記錄器180。
The first bit corresponding to R5 and the first bit corresponding to R1 have different logical values. Therefore, the first bit of the comparison result C4 is adjusted to have the logical value "1". Correspondingly, the second bit of the comparison result C4, the seventh bit of the comparison result C4, and the eighth bit of the comparison result C4 are adjusted to have the logical value "1". Therefore, the comparison result C3 of 00111100 is adjusted to form the comparison result C4 of 11111111. The comparison result C4 is temporarily stored in the
以圖3做為說明,在比較結果C4產生之後,若沒有用以測試的操作條件,進行方法200的操作214。比較結果C4係當作前述的最終比較結果FC。
Referring to FIG. 3 as an illustration, after the comparison result C4 is generated, if there is no operating condition for testing, the
在另一些實施例中,比較電路140包含複數個互斥或閘142。作為說明,比較電路140包含八個互斥或閘142。每一個互斥或閘進行應對R1之相應位元及其中一個應對之相應位元的互斥或操作。
In other embodiments, the
在比較電路140內之互斥或閘142的數目僅供說明用途。在比較電路140內之互斥或閘142的各種數目係在本揭露的保護範圍內。
The number of mutually exclusive OR
在操作214中,計數器162產生與比較結果C4內的位元具有相同邏輯值的數值。在一些實施例中,在比較結果C4內的位元之邏輯值為邏輯值「1」。換言之,計數器162計數在比較結果FC內具有邏輯值「1」之位元的數目。作為說明,比較結果FC為11111111。因此,計數器162所計數的值係等於數值8。如上所述,在一些實施例中,計數器162係以由多個加法器(圖未繪示)所組成的群體計數器
來建置。因此,在前述實施例中,數值8係二進位型式,例如1000,但不以此為限。
In
在操作216中,最大漢明距離產生電路164根據前述來自計數器162的數值及比較結果FC的總位元數來產生最大漢明距離HD。作為說明,最大漢明距離產生電路164計算由計數器產生之數值與比較結果FC之總位元數的比值。換言之,若比較結果C4具有n個位元,且比較結果C4具有m個有邏輯值「1」的位元,最大漢明距離HD係實質等於m/n,其中m及n為正整數。
In
在一些實施例中,最大漢明距離HD係以百分比的形式呈現。如圖3所示,比較結果FC的總位元數為8。在比較結果FC內之具有邏輯值「1」之位元的位元數也是8。因此,最大漢明距離HD為100%。 In some embodiments, the maximum Hamming distance HD is presented as a percentage. As shown in FIG. 3, the total number of bits of the comparison result FC is 8. The number of bits of the bit having the logical value "1" in the comparison result FC is also 8. Therefore, the maximum Hamming distance HD is 100%.
前述之方法200包含例示操作,但方法200的操作未必要以所述順序進行。本揭露所揭露之方法200之操作的順序係可以改變的,或操作係可以適當地同時或部分同時進行,其實本揭露之各種實施例的精神及範圍。
The foregoing
再者,由於前述最大漢明距離HD係根據相同待測裝置105的應對而產生,在一些實施例中,最大漢明距離HD係待測裝置105的內部漢明距離。最大漢明距離HD代表圖3所繪示之應對R1-R5之任二者之間的最大差異。以圖3作為說明,在待測裝置105之應對R1-R5之中,應對R3的所有位元係分別與應對R5之對應位元不同。換言之,應對R3及應對R5之間的差異為100%。因此,待測裝置105的最大
漢明距離HD為100%。
Furthermore, since the aforementioned maximum Hamming distance HD is generated according to the response of the same device under
在一些實施例中,當待測設備的最大漢明距離HD為0%,其代表待測設備在不同的操作環境下係完美地可重複且穩固的。 In some embodiments, when the maximum Hamming distance HD of the device under test is 0%, it means that the device under test is perfectly repeatable and robust in different operating environments.
在一些實施例中,當最大漢明距離HD係高於預設值,待測裝置105需要被修正或偵錯。預設值係可動態地調整,而不限於此。
In some embodiments, when the maximum Hamming distance HD is higher than a preset value, the device under
在一些實施例中,裝置100及待測裝置105係設置在相同晶片或相同晶元上。因此,裝置100直接地在晶片或晶元上測量待測裝置105。在一些實施例中,裝置100在晶圓允收測試(wafer acceptance testing,WAT)臺上測量待測裝置105。
In some embodiments, the
在本揭露中討論的裝置100,裝置100係線上測量待測裝置105,而不下載待測裝置105的任何應對。除此之外,僅最大漢明距離HD被輸出。因此,下載應對的時間係可被節省,且用以儲存下載之應對的儲存空間亦可被節省。
In the
請參閱圖4。圖4係繪示根據本揭露各種實施例之裝置100A及記憶體105A的示意圖。
See Figure 4. 4 is a schematic diagram illustrating a
在一些實施例中,裝置100A為測試裝置。裝置100A係配置以測試記憶體105A的穩固性。在一些實施例中,裝置100A係應用於或建置為內漢明距離分析器。裝置100A係配置以產生記憶體105A的最大漢明距離HD。最大漢明距離HD代表記憶體105A的穩固性。在一些實施例中,
漢明距離HD指出在在二個二進制之間不同位元的數目。
In some embodiments,
在一些實施例中,記憶體105A為例如靜態隨機存取記憶體、快閃記憶體或相似者,但不限於此。用以建置待測裝置105或被建置在待測裝置105中之各種記憶體陣列或單元係在本揭露的保護範圍內。在另一些實施例中,記憶體105A包含記憶體電路101A及記憶體電路103A。在一些實施例中,記憶體電路101A為待測裝置。
In some embodiments, the
在一些實施例中,記憶體電路101A及記憶體電路103A係根據實際應用在各種操作條件下操作。各種條件對應至各種操作環境。作為說明,各種操作條件包含各種供應電壓、各種操作溫度、各種操作頻率或前述之組合。
In some embodiments, the
如圖4所示,在一些實施例中,裝置100A包含比較電路140A及計算電路160A。在一些實施例中,裝置100A更包含記錄器180A。比較電路140A係耦合至記憶體105A。記錄器180A係耦合至比較電路140A。計算電路160A係耦合至記錄器180A。在一些實施例中,比較電路140A包含互斥或閘或由互斥或閘所建置。
As shown in FIG. 4, in some embodiments,
上述討論僅是描述根據各種不同的實施例所使用的例示連接方式。須理解的是,各種不同的實施例並不限於上述或圖4所示的特定連接方式。 The above discussion is merely a description of example connections that may be used in accordance with various embodiments. It should be understood that the various embodiments are not limited to the specific connection methods described above or shown in FIG. 4 .
如圖4所示,記憶體電路103A係配置以產生記憶體電路101A的至少一個應對,並儲存至少一個應對。在一些實施例中,前述至少一個應對係由記憶體電路101A被複製或被複寫至記憶體電路103A,故記憶體電路103A產生
的至少一個應對係與記憶體電路101A所產生的至少一個應對相同。
As shown in FIG. 4,
如圖4所示,比較電路140A接收來自記憶體電路103A的應對。在一些實施例中,比較電路140A亦接收來自記憶體電路101A在不同操作條件下所獲得的應對。比較電路140A係配置以依序比較來自記憶體電路103A的應對及來自記憶體電路101A的應對,以產生對應的比較結果。
As shown in FIG. 4, the comparison circuit 140A receives the response from the
在一些實施例中,比較電路140A係配置以依序地進行來自記憶體電路103A之應對及來自於記憶體電路101A之應對的互斥或操作,以產生對應的比較結果。這些比較結果係被輸出至記錄器180A。在一些實施例中,當獲得比較結果時,記憶體電路101A及記憶體電路103A的角色互換,且再次進行前述的操作。
In some embodiments, the comparison circuit 140A is configured to sequentially perform a mutually exclusive OR operation of the response from the
如圖4所示,記錄器180A係配置以暫時儲存比較電路140A所產生的比較結果。接著,記錄器180A根據比較結果產生最終比較結果FC。在一些實施例中,最終比較結果FC指出,藉由比較來自於記憶體電路103A之應對及來自於記憶體電路101A之最終應對所產生的比較結果。
As shown in FIG. 4, the
在一些實施例中,記錄器180A包含記錄電路182A及記錄電路184A。記錄電路182A係配置以暫時儲存藉由比較來自於記憶體電路103A之應對及在不同操作條件下來自於記憶體電路101A之應對所產生的比較結果。記錄電路184A係配置以暫時儲存藉由比較來自於記憶體電路101A之應對及在不同操作條件下來自於記憶體電路103A
之應對所產生的比較結果。
In some embodiments,
如圖4所示,計算電路160A係配置以獲得來自於記錄電路182A及記錄電路184A的最終比較結果FC。計算電路160A係進一步地配置以根據最終比較結果FC輸出最大漢明距離HD。最大漢明距離HD代表來自記憶體電路101A之二個應對及來自記憶體電路103A之二個應對之間的最大差異。
As shown in FIG. 4, the
如圖4所示,在一些實施例中,計算電路160A包含計數器162A及最大漢明距離產生電路164A。計數器162A係與記錄電路182A及記錄電路184A耦合。最大漢明距離產生電路164A係與計數器162A耦合。
As shown in FIG. 4, in some embodiments, the
計數器162A係配置以接收前述之來自於記錄電路182A及記錄電路184A的最終比較結果FC。根據最終比較結果FC,計數器162A計數的數值指出最終比較結果FC具有相同邏輯值的位元數。在一些實施例中,相同邏輯值為「1」。換言之,若最終比較結果FC的4個位元具有邏輯值「1」,則計數器162A輸出指示4的數據至最大漢明距離產生電路164A。在一些實施例中,計數器162A係以由多個加法器(圖未繪示)所組成的群體計數器來建置。在另一些實施例中,計數器162A係以其他邏輯閘來建置。
The
接著,最大漢明距離產生電路164A根據前述數值及最終比較結果FC的總位元數來產生最大漢明距離HD。最大漢明距離HD代表來自記憶體電路101A的二個應對之間的最大差異。在一些實施例中,最大漢明距離產生電
路164A係以減法器(圖未繪示)來建置或包含減法器,但不以此為限。在另一些實施例中,最大漢明距離產生電路164A係以其他邏輯閘來建置。
Next, the maximum Hamming
請參閱圖5。圖5係繪示根據本揭露各種實施例之圖4的裝置100A及記憶體105A進行操作之方法200A的流程圖。
See Figure 5. 5 is a flowchart illustrating a
以下由圖5所繪示之方法200A描述裝置100A及記憶體105A之間的操作。為了便於理解,方法200A係配合圖4進行討論。
The operations between the
在操作202A中,當記憶體電路101A在第一操作條件下操作時,獲得記憶體電路101A的應對。在一些實施例中,第一操作條件為記憶體電路101A的起始操作條件,但不限於此。
In
在操作204A中,複製或複寫應對至記憶體電路103A。在一些實施例中,應對係自記憶體電路101A被複製或被複寫,並維持在記憶體電路103A中。
In
在操作206A中,改變記憶體電路101A之操作條件。舉例而言,記憶體電路101A的操作條件由第一操作條件改變成第二操作條件。在一些實施例中,第二操作條件係與第一操作條件不同。
In operation 206A, the operating conditions of the
在操作208A中,獲得記憶體電路101A的新應對。如上所述,當記憶體電路101A的操作條件改變,記憶體電路101A的內容因而改變。
In operation 208A, a new response for
在操作210A中,比較電路140A比較新應對及
記憶體電路103A的應對,以產生比較結果。
In
在操作212A中,確認是否有其他用以測試記憶體電路101A的操作條件。在一些實施例中,確認步驟係藉由控制器(圖未繪示)或製程電路(圖未繪示)進行,但不以此為限。若有其他用以測試的操作條件(例如:第三操作條件),重新進行操作206A。換言之,記憶體電路101A的操作條件係由第二操作條件改變為第三操作條件。在一些實施例中,第三操作條件係不同於第二操作條件,且係不同於第一操作條件。
In
若沒有其他用以測試的操作條件,進行方法200A的操作202B。在一些實施例中,記憶體電路101A及記憶體電路103A的角色互換,以下將進行描述。
If there are no other operating conditions to test, operation 202B of
在操作202B中,當記憶體電路103A在第一對應操作條件下操作,獲得記憶體電路103A的應對。
In operation 202B, when the
在操作204B中,複製或複寫應對至記憶體電路101A中。在一些實施例中,應對係自記憶體電路103A被複製或被複寫,並維持在記憶體電路101A。
In
在操作206B中,改變記憶體電路103A之操作條件。舉例而言,記憶體電路103A的操作條件由第一操作條件改變成第二操作條件。在一些實施例中,第二操作條件係與第一操作條件不同。
In
在操作208B中,獲得記憶體電路103A的新應對。如上所述,當記憶體電路103A的操作條件改變,記憶體電路103A的內容因而改變。
In
在操作210B中,比較電路140A比較新應對及記憶體電路103A的應對,以產生比較結果。
In
在操作212B中,確認是否有其他用以測試記憶體電路103A的操作條件。若有其他用以測試的操作條件(例如:第三操作條件),重新進行操作206B。
In
若沒有其他用以測試的操作條件,進行方法200A的操作214A。
If there are no other operating conditions to test, operation 214A of
在操作214A中,計數器162A產生與比較結果內的位元具有相同邏輯值的數值。在一些實施例中,在比較結果內的位元之邏輯值為邏輯值「1」。換言之,計數器162A計數在比較結果FC內具有邏輯值「1」之位元的數目。作為說明,比較結果FC為11111111(二進制)。因此,計數器162A所計數的值係等於數值8。如上所述,在一些實施例中,計數器162A係以由多個加法器(圖未繪示)所組成的群體計數器來建置。因此,在前述實施例中,數值8係二進位型式,例如1000,但不以此為限。
In operation 214A, counter 162A generates a value having the same logical value as the bit in the comparison result. In some embodiments, the logical value of the bit in the comparison result is the logical value "1". In other words, the
在操作216A中,最大漢明距離產生電路164A根據前述來自計數器162A的數值及比較結果FC的總位元數來產生最大漢明距離HD。作為說明,最大漢明距離產生電路164A計算由計數器產生之數值與比較結果FC之總位元數的比值。換言之,若比較結果具有n個位元,且比較結果具有m個有邏輯值「1」的位元,最大漢明距離HD係實質等於m/n,其中m及n為正整數。
In
相較於圖1所示之在一些實施例中為待測記憶
體陣列的記憶體陣列120及待測裝置105,圖4中的實施例僅繪示一個包含記憶體電路101A及記憶體電路103A的記憶體105A,其係分別配置為記憶體陣列及待測裝置,或反之亦然。在圖4中的實施例,記憶體105A可被配置為用以產生PUF位元的待測裝置,且記憶體陣列係用以儲存來自待測裝置的應對。因此,圖4中的裝置之整體面積可被減少。
Compared to that shown in FIG. 1 , in some embodiments, the memory to be tested is
The
在一些實施例中,揭露一種用以測試記憶體的裝置,此記憶體包含第一記憶體電路及第二記憶體電路。第二記憶體電路係配置以儲存第一記憶體電路的第一應對。此裝置包含比較電路及計算電路。比較電路係配置以比較儲存在第二記憶體電路之第一應對及第一記憶體電路在不同的條件下操作的複數個應對,以產生複數個第一比較結果。計算電路係配置以根據第一比較結果輸出最大漢明距離,其中最大漢明距離係在第一應對及第一記憶體電路的複數個應對之其中二者之間。 In some embodiments, an apparatus for testing a memory including a first memory circuit and a second memory circuit is disclosed. The second memory circuit is configured to store the first response of the first memory circuit. The device includes a comparison circuit and a calculation circuit. The comparison circuit is configured to compare the first response stored in the second memory circuit with a plurality of responses in which the first memory circuit operates under different conditions to generate a plurality of first comparison results. The calculation circuit is configured to output a maximum Hamming distance according to the first comparison result, wherein the maximum Hamming distance is between two of the first pair and the plurality of pairs of the first memory circuit.
在一些實施例中,第一記憶體電路係配置以儲存第二記憶體電路的第二應對。比較電路係配置以比較儲存在第一記憶體電路之第二應對及第二記憶體電路在不同的條件下操作的複數個應對,以產生複數個第二比較結果。 In some embodiments, the first memory circuit is configured to store the second response of the second memory circuit. The comparison circuit is configured to compare the second response stored in the first memory circuit with a plurality of responses operated by the second memory circuit under different conditions to generate a plurality of second comparison results.
在各種實施例中,計算電路係配置以根據第二比較結果輸出最大漢明距離,其中最大漢明距離係在第二應對及第二記憶體電路的多個應對之其中二者之間。 In various embodiments, the computing circuit is configured to output a maximum Hamming distance based on the second comparison result, wherein the maximum Hamming distance is between the second pair and two of the plurality of pairs of the second memory circuit.
在一些實施例中,裝置更包含記錄器,且記錄器係包含第一記錄電路及第二記錄電路。第一記錄電路係配 置以儲存用以計算最大漢明距離之第一比較結果,且第二記錄電路係配置以儲存用以計算最大漢明距離之第二比較結果。 In some embodiments, the device further includes a recorder, and the recorder includes a first recording circuit and a second recording circuit. The first recording circuit system The first comparison result for calculating the maximum Hamming distance is arranged to store, and the second recording circuit is configured to store the second comparison result for calculating the maximum Hamming distance.
在各種實施例中,比較電路包含互斥或閘。互斥或閘係配置以進行第一應對及第一記憶體電路之每一個應對的互斥或操作,以及進行第二應對及第二記憶體電路之每一個應對的互斥或操作。 In various embodiments, the comparison circuit includes a mutex or gate. The mutual exclusion or gates are configured to perform a mutually exclusive OR operation of the first pair and each of the first memory circuits, and to perform a mutually exclusive OR operation of the second pair and each of the second memory circuits.
在一些實施例中,計算電路包含計數器。計數器係配置以產生第一數值,其中第一數值指出在第一比較結果之對應比較結果中具有相同邏輯值之位元的數目,且計數器係配置以產生第二數值,其中第二數值指出在第二比較結果之對應比較結果中具有相同邏輯值之位元的數目。 In some embodiments, the computing circuit includes a counter. The counter is configured to generate a first value, wherein the first value indicates the number of bits having the same logical value in a corresponding comparison result of the first comparison result, and the counter is configured to generate a second value, wherein the second value indicates a The number of bits with the same logic value in the corresponding comparison result of the second comparison result.
在各種實施例中,計算電路更係配置以根據第一數值及第一比較結果之對應比較結果的位元數,以產生最大漢明距離,並根據第二數值及第二比較結果之對應比較結果的位元數,以產生最大漢明距離。 In various embodiments, the calculation circuit is further configured to generate the maximum Hamming distance according to the first value and the number of bits of the corresponding comparison result of the first comparison result, and to generate the maximum Hamming distance according to the corresponding comparison of the second value and the second comparison result The number of bits of the result to yield the maximum Hamming distance.
亦揭露一種方法,其係包含以下操作。維持在第一操作條件下之記憶體之第一記憶體電路的第一應對。儲存在記憶體之第二記憶體電路內之第一應對係依序地與在操作條件下之第一記憶體電路的複數個應對比較,以產生複數個第一比較結果。前述操作條件係彼此不同。複數個第一比較結果之每一個比較結果係藉由調整複數個第一比較結果之前一比較結果而產生。根據複數個第一比較結果,獲得最大差值,其中最大差值係介於第一應對及第一記憶體電路 之應對之其中二者之間。 Also disclosed is a method comprising the following operations. A first response of the first memory circuit of the memory under the first operating condition is maintained. The first pair stored in the second memory circuit of the memory is sequentially compared with the plurality of pairs of the first memory circuit under operating conditions to generate a plurality of first comparison results. The aforementioned operating conditions are different from each other. Each of the plurality of first comparison results is generated by adjusting a previous comparison result of the plurality of first comparison results. Obtain the maximum difference value according to the plurality of first comparison results, wherein the maximum difference value is between the first pair and the first memory circuit The response is between the two.
在一些實施例中,方法更包含以下操作。維持在第二操作條件下之記憶體之第二記憶體電路的第二應對。儲存在記憶體之第一記憶體電路內之第二應對係依序與在操作條件下之第二記憶體電路的複數個應對比較,以產生複數個第二比較結果。前述操作條件係彼此不同。複數個第二比較結果之每一個比較結果係藉由調整複數個第二比較結果之前一比較結果而產生。 In some embodiments, the method further includes the following operations. A second response of the second memory circuit maintaining the memory under the second operating condition. The second pair stored in the first memory circuit of the memory is sequentially compared with the plurality of responses of the second memory circuit under operating conditions to generate a plurality of second comparison results. The aforementioned operating conditions are different from each other. Each of the plurality of second comparison results is generated by adjusting a previous comparison result of the plurality of second comparison results.
在各種實施例中,維持第一記憶體電路之第一應對包含以下操作。複製第一應對至記憶體之第二記憶體電路內。維持被複製之第一應對在第二記憶體電路內。 In various embodiments, maintaining the first response of the first memory circuit includes the following operations. The first pair is copied into the second memory circuit of the memory. The replicated first pair is maintained within the second memory circuit.
在一些實施例中,維持第一應對包含以下操作。藉由第二記憶體電路,產生第一應對。 In some embodiments, maintaining the first response includes the following operations. The first response is generated by the second memory circuit.
在各種實施例中,維持第二記憶體電路之第二應對包含以下操作。複製第二應對至記憶體之第一記憶體電路內。維持被複製之第二應對在第一記憶體電路內。 In various embodiments, maintaining the second response of the second memory circuit includes the following operations. The second pair is copied into the first memory circuit of the memory. The replicated second pair is maintained within the first memory circuit.
在一些實施例中,維持第二應對包含以下操作。藉由第一記憶體電路,產生第二應對。 In some embodiments, maintaining the second response includes the following operations. A second response is generated by the first memory circuit.
在一些實施例中,方法更包含以下操作。暫時儲存第一比較結果及第二比較結果,以計算最大漢明距離。 In some embodiments, the method further includes the following operations. The first comparison result and the second comparison result are temporarily stored to calculate the maximum Hamming distance.
在各種實施例中,獲得最大差值之操作包含以下操作。產生第一數值,其中第一數值指出在第一比較結果之對應比較結果中具有相同邏輯值之位元的數目。產生第二數值,其中第二數值指出在第二比較結果之對應比較結果中 具有相同邏輯值之位元的數目。 In various embodiments, the operation of obtaining the maximum difference value includes the following operations. A first value is generated, wherein the first value indicates the number of bits having the same logical value in a corresponding comparison result of the first comparison result. generates a second value, where the second value is indicated in the corresponding comparison result of the second comparison result The number of bits with the same logical value.
在一些實施例中,輸出最大漢明距離更包含以下操作。根據第一數值及第一比較結果之對應比較結果的位元數,以產生該最大漢明距離。根據第二數值及第二比較結果之對應比較結果的位元數,以產生最大漢明距離。 In some embodiments, outputting the maximum Hamming distance further includes the following operations. The maximum Hamming distance is generated according to the first value and the number of bits of the corresponding comparison result of the first comparison result. The maximum Hamming distance is generated according to the second value and the number of bits of the corresponding comparison result of the second comparison result.
在各種實施例中,比較儲存在記憶體之第二記憶體電路之第一應對與第一記憶體電路之應對包含以下操作。進行儲存在第二記憶體電路之第一應對與第一記憶體電路之每一個應對的互斥或操作。 In various embodiments, comparing the first pair of the second memory circuit stored in the memory with the pair of the first memory circuit includes the following operations. A mutually exclusive OR operation of the first pair stored in the second memory circuit and each pair of the first memory circuit is performed.
在一些實施例中,比較儲存在記憶體之第一記憶體電路之第二應對與第二記憶體電路之應對包含以下操作。進行儲存在第一記憶體電路之第二應對與第二記憶體電路之每一個應對的互斥或操作。 In some embodiments, comparing the second pair of the first memory circuit stored in the memory with the pair of the second memory circuit includes the following operations. A mutually exclusive OR operation of the second pair stored in the first memory circuit and each pair of the second memory circuit is performed.
更揭露一種方法,其係包含以下操作。操作在彼此不同的條件下之記憶體之第一記憶體電路,以獲得第一記憶體電路之複數個應對。第一記憶體電路之複數個應對係儲存在記憶體之第二記憶體電路內。依序進行儲存在記憶體之第二記憶體電路之第一記憶體電路之複數個應對與第一記憶體電路之應對之其他應對的互斥或操作,以產生最終比較結果。根據最終比較結果,輸出介於第一應對及其他應對之其中二者之間的最大漢明距離。 Further disclosed is a method comprising the following operations. The first memory circuits of the memories under mutually different conditions are operated to obtain a plurality of responses of the first memory circuits. A plurality of responses of the first memory circuit are stored in the second memory circuit of the memory. The mutual exclusion or operation of the plurality of responses of the first memory circuit stored in the second memory circuit of the memory and the other responses of the responses of the first memory circuit is sequentially performed to generate a final comparison result. According to the final comparison result, output the maximum Hamming distance between the first response and the other responses.
在一些實施例中,輸出最大漢明距離包含以下操作。產生數值,其中數值指出在最終比較結果中具有相同邏輯值之位元的數目。根據數值及最終比較結果之位元數, 以產生最大漢明距離。 In some embodiments, outputting the maximum Hamming distance includes the following operations. Generates a numerical value that indicates the number of bits that have the same logical value in the final comparison result. According to the value and the number of bits of the final comparison result, to produce the maximum Hamming distance.
上述摘要許多實施例的特徵,因此本領域具有通常知識者可更了解本揭露的態樣。本領域具有通常知識者應理解利用本揭露為基礎可以設計或修飾其他製程和結構以實現和所述實施例相同的目的及/或達成相同優勢。本領域具有通常知識者也應了解與此同等的架構並沒有偏離本揭露的精神和範圍,且可以在不偏離本揭露的精神和範圍下做出各種變化、交換和取代。 The foregoing summarizes the features of many embodiments so that those of ordinary skill in the art may better understand aspects of the present disclosure. Those of ordinary skill in the art should appreciate that using the present disclosure as a basis, other processes and structures can be devised or modified to achieve the same purposes and/or achieve the same advantages as the described embodiments. Those skilled in the art should also understand that the equivalent structure does not deviate from the spirit and scope of the present disclosure, and can make various changes, exchanges and substitutions without departing from the spirit and scope of the present disclosure.
100:裝置 100: Device
105:待測裝置 105: Device to be tested
120:記憶體陣列 120: Memory array
140:比較電路 140: Comparison circuit
142:互斥或閘 142: mutex or gate
160:計算電路 160: Computational Circuits
162:計數器 162: Counter
164:最大漢明距離產生電路 164: Maximum Hamming distance generation circuit
180:記錄器 180: Recorder
FC:最終比較結果 FC: Final Comparison Results
HD:漢明距離 HD: Hamming distance
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