TWI753631B - Cooling system - Google Patents

Abstract

A processing system for processing a workpiece, comprising: a processing enclosure having an entrance end for receiving and an exit end for unloading a workpiece; a conveyor equipment that provides a returning path external of the process enclosure, the returning path is configured to move the workpiece from the exit end to the entrance end; and a cooling module in the returning path arranged in fluid communication with the ambient environment outside the processing enclosure. The cooling module includes: a heat dissipation plate having a cooling surface configured to contact the workpiece; and a liquid interface generating module arranged on the heat dissipation plate, configured to generate a liquid interface between the cooling surface and the workpiece.

Description

cooling system

The present disclosure relates to process systems, and in particular, to coating systems with cooling devices.

Vacuum coating technology can be applied in many technical fields. For example, PVD coating technology can be used in the conformal shielding (Conformal Shielding) fabrication of system-in-package (SiP) to achieve miniaturization, light weight, and high-efficiency prevention of electromagnetic interference (Electro-magnetic interference). , EMI) effect. For example, chip modules (such as RF front end modules), communication modules (WiFi/BT), power modules, or NAND Flash flash memory modules of early electronic devices (such as smart phones) Most of the EMI shielding technologies at the board level use a stamped metal shield at the board level, but it occupies the PCB area and the internal space of the electronic device; the conformal shielding technology at the package level uses PVD coating. , and cover the shielding layer on the packaged chip. This conformal shielding technology has several advantages: 1. Reduce the interference or interference of the packaged chip by adjacent components, especially the requirements of 5G high-frequency communication, high-speed computing (HPC), etc.; 2. The package size is almost unchanged, saving equipment 3. Shorten the design cycle; 4. Improve production efficiency and reduce the processing and assembly costs of special mask components. In addition, the vacuum coating technology can also be used to coat an anti-electromagnetic interference (EMI) coating on the casing of a portable 3C electronic device, or even coat a transparent anti-electromagnetic interference (Electro-magnetic interference, EMI) coating on a transparent substrate. EMI) coating or coating with optical film (optical film) and other situations.

The system using continuous multi-chamber PVD coating technology is widely used in large-scale applications because of its advantages of high speed, high output, good coating quality, high yield, and the ability to greatly reduce production costs. in the coating process of production. However, when the system performs the coating process, the carrier of the workpiece is often heated up due to the plasma environment, which may affect or damage the quality of the coating or the object to be plated.

One aspect of the present disclosure provides a cooling plate assembled to support an object to be cooled, comprising: a plate body having a bearing surface, the bearing surface having two side regions, and a center located between the side regions region; a first flow channel structure distributed in the side region and configured to transport fluid in a first phase, the first flow channel structure having a plurality of distribution in the two side regions and openings formed in the plate a spout on the bearing surface of the body, the spout is arranged to avoid the central area; and a second flow channel structure, embedded in the plate body and corresponding to the central area, configured to transport the fluid in the second phase; Wherein, in the direction orthogonal to the side region, the width of the plate body is smaller than the width of the object to be cooled.

An aspect of the present disclosure provides a cooling system configured to cool an object to be cooled, the cooling system comprising: a cooling module including a cooling plate for carrying the object to be cooled, the cooling plate having two side edge regions , and a central area between the side areas; a sensing module, configured to sense at least one of the temperature and humidity of the environment where the cooling plate is located, and generate a sensing result; and a processing module , the signal is connected to the sensing module and the cooling module, and is configured to obtain the dew point temperature condition of the environment according to the sensing result from the sensing module, and to control the temperature setting of the cooling module , so that the temperature state of the cooling plate is not higher than the dew point temperature of the environment, thereby condensing the cooling plate.

One aspect of the present disclosure provides a process system configured to process a workpiece, Including a process station, including an inlet end and an outlet end, and assembled from the inlet end to receive the workpiece, and the outlet end to move the workpiece out of the process station; reflow equipment, including a reflow track set outside the process station, The return track is assembled to move the workpiece from the outlet end to the inlet end; and a cooling module is arranged on the return track and is in fluid communication with the external environment. The cooling module includes: a cooling plate with a cooling surface configured to contact the workpiece, the cooling surface defines two side regions and a central region between the side regions; and a liquid interface generation The module is arranged on the cooling plate and assembled to generate a liquid interface between the cooling surface and the workpiece.

100: Process System

11: Process Station

111: Vacuum chamber

111a: between buffers

111b: Coating interval

112: Cathode sputtering target combination

112a: Target

113: Transmission Mechanism

114: Inlet valve

115: Outlet valve

116: Load Out Cavity

117: Load Cavity

118: Pretreatment cavity

12: Reflow equipment

121, 122: Lifting device

123: Return Track

1231: Settlement Section

1232: Climbing segment

1233: hop

100a: Cooling system

100b, 100c: Cooling system

14: Collimating Thermometer

x, y, z: direction

C: vehicle

200b: Cooling System

2233: hop

223a: Conveyor Wheel

25: Drive mechanism

210: Cooling Plate

216: Notch

300b: Cooling System

31: Cooling Module

310: Cooling Plate

311: Board body

311a: Side Area

311b: Central Area

316: Notch

314: Fluid Supply Systems

312: First runner structure

313: Second runner structure

312a: spout

315: Buffer chamber

41a, 41b, 42a, 42b: Curves

501, 502: Curves

610: Cooling Plate

611: Board body

611c: Motherboard layer

611d: Upper board layer

611c’: Motherboard layer

611d’: Upper board layer

611e: Lower sublayer

611f: Upper sublayer

613a: Trench

613c: Second runner structure

710: Cooling Plate

711: Board body

711a: Side Area

711b: Central Area

716: Notch

712: First runner structure

712x: first direction runner

712y: second direction runner

712z: 3rd directional runner

810: Cooling Plate

811: Board body

811a: Side Area

811b: Central Area

812: First runner structure

812x: first direction runner

812y: second direction runner

812z: 3rd directional runner

812c: Intake port

813: Second runner structure

911: Board body

911a: Side Area

911b: Central Area

912: First runner structure

912x: first direction runner

912y: second direction runner

912z: 3rd directional runner

912c: Air intake

913a: Channel

913b: Channel Cover

D ₁ : first depth

D ₂ : Second depth

For a detailed understanding of the above-described features of the present case, a more specific description of the present case, briefly described above, may be provided with reference to embodiments, some of which are illustrated in the accompanying drawings. It is to be noted, however, that the appended drawings illustrate only typical implementations of this case and are therefore not to be considered limiting of its scope, as this case may admit other equivalent implementations.

Figure 1 shows a schematic diagram of a process system according to some embodiments of the present disclosure; Figure 2 shows a schematic perspective view of a cooling system according to some embodiments of the present disclosure; Figure 3 shows a schematic diagram of a cooling system according to some embodiments of the present disclosure Schematic top view of the cooling system; Figures 4a and 4b respectively show experimental data according to some embodiments of the present disclosure; Figure 5 shows simulated experimental data according to some embodiments of the present disclosure; Figures 6a and 6b respectively show A schematic cross-sectional view of a cooling plate according to some embodiments of the present disclosure; FIG. 7 shows a schematic perspective view of a cooling plate according to some embodiments of the present disclosure; FIG. 8 shows a schematic diagram of a cooling plate according to some embodiments of the present disclosure and FIG. 9 shows a schematic cross-sectional view of a cooling plate according to some embodiments of the present disclosure.

It is to be noted, however, that the appended drawings illustrate only exemplary embodiments of this disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.

It should be noted that these drawings are intended to illustrate the general characteristics of the methods, structures and/or materials used in certain example embodiments and to supplement the written description provided below. These drawings, however, are not to scale and may not accurately reflect the precise structural or performance characteristics of any given embodiment, and should not be construed to define or limit the range of values or characteristics encompassed by example embodiments . For example, the relative thicknesses and positions of layers, regions and/or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numbers throughout the various figures is intended to indicate the presence of similar or identical elements or features.

The following description will refer to the accompanying drawings to more fully describe the present disclosure. Exemplary embodiments of the present disclosure are shown in the accompanying drawings. This disclosure may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Like reference numbers refer to the same or similar elements.

The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the present disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. Furthermore, when used herein, "include" and/or "include" or "include" and/or "include" or "have" and/or "have", integers, steps, operations, elements and/or components , but does not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Furthermore, unless explicitly defined in context, terms such as those defined in general dictionaries are to be said and construed as having meanings consistent with their meanings in the related art and this disclosure, and are not to be construed as idealized or overly formal meaning.

Exemplary embodiments will be described in conjunction with the drawings in FIGS. 1 to 9 . DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present disclosure will be described in detail with reference to the accompanying drawings, wherein the depicted elements are not necessarily to scale and wherein the same or similar reference numerals are designated by the same or similar reference numerals throughout the several views element.

1 shows a schematic diagram of a process system in accordance with some embodiments of the present disclosure. For simplicity and clarity of illustration, some details/subcomponents of the exemplary system are not explicitly labeled/shown in this figure.

Referring to FIG. 1, a processing system 100 includes a processing station 11 for processing workpieces. In some embodiments, a process station (eg, process station 11 ) is configured to coat a workpiece (eg, carrier C and the object to be plated thereon), and includes a vacuum chamber (eg, a vacuum chamber) 111), a cathode sputtering target assembly (eg, cathode sputtering target assembly 112 ) disposed in the vacuum chamber, and a transport mechanism 113 configured to transport the workpiece (eg, the carrier C and the objects to be plated thereon) .

In some embodiments, the process system 100 is implemented as a coating system having a continuous multi-chamber, wherein a vacuum chamber (eg, vacuum chamber 111 ) includes a plurality of alternately arranged buffer spaces (eg, buffer chambers) section 111a) and a coating section (eg, coating section 111b), and both ends of each coating section are provided with the buffer section. For example, the vacuum chamber 111 has four buffer zones 111a and three coating zones 111b alternately arranged along the arrangement direction x.

The processing station 11 includes an inlet port (eg, inlet valve 114 ) and an outlet port (eg, outlet valve 115 ) for workpieces to enter and remove the processing station, respectively. In the illustrated embodiment, the inlet end (eg, the inlet valve 114 ) is disposed at one end of the vacuum chamber 11 corresponding to the first buffer zone 111 a (ie, the leftmost buffer zone 111 a as shown in FIG. 1 ) left end). The outlet end (eg, the outlet valve 115 ) is disposed at the other end of the vacuum chamber 11 corresponding to the last buffer space 111 a (ie, the right end of the rightmost buffer space 111 a as shown in FIG. 1 ).

In some embodiments, the process station 100 further includes at least one vacuum unit (not shown in the figure) coupled to the vacuum chamber 11, and configured to vacuum the vacuum chamber 11, so that the vacuum chamber 11 can be evacuated. Each buffer space 111a and each coating space 111b of the vacuum chamber 11 have a working pressure.

In the illustrated embodiment, the number of the cathode sputtering target combinations 112 is three, which are respectively disposed in the coating section 111b, that is, the positions where the objects to be coated are coated. In other words, the process station 11 can simultaneously process The three objects to be plated are subjected to the coating process. Each sputtering target assembly 112 has at least one target (eg, target 112a). For example, in some embodiments, the sputtering target assembly 12 has two targets 112a; the targets 112a may comprise the same or different materials. In some operating situations, the object to be plated may be a package element, an optical element, or a housing of an electronic product, or the like.

The transmission mechanism 113 is disposed in the vacuum chamber 11 and extends through the buffer spaces 111 a and the coating spaces 111 b in the x-direction. The transfer mechanism 113 is configured to transfer the workpieces (eg, the carrier C and the objects to be plated thereon), so that the workpieces move in the x-direction in the vacuum chamber 11 . The transfer mechanism 113 may be designed to simultaneously stop, advance or reverse the plurality of carriers C, respectively. For example, the transfer mechanism 113 may be implemented to include a plurality of conveying assemblies (eg, a plurality of rollers arranged in the x-direction) configured to transfer workpieces, and a plurality of driving elements (eg, a plurality of driving elements configured to drive the conveying assemblies) For example, a motor); each of the buffer zones 111a and each of the coating zones 111b is provided with one of the conveying components. By controlling the actuation or non-actuation of each of the driving elements, the effect of making each of the carriers C stay, advance or retreat in the x-direction can be achieved. In other embodiments, the conveyor assembly may have a plurality of rollers, conveyor belts, or a combination thereof aligned in the x-direction.

In some embodiments, before each coating process is performed, the conveying mechanism 113 makes each carrier C pass through the inlet valve 114 along the arrangement direction x and enter the buffer spaces 111 a and the coating spaces 111 b in turn in turn, so that Perform each coating procedure. During the coating process, the transmission mechanism 113 moves the carrier C in the coating area 111b (in this area the carrier C will be exposed to the plasma environment under the target 112a) and the two buffer areas 111a before and after it (in this area). Interval vehicle C will be far away from the target 112a) Reciprocating movement among the three. In this way, the object to be plated can be prevented from being continuously exposed to the plasma environment under the target material 112a for a long time, thereby reducing the problem of overheating of the object to be plated. The number of back-and-forth displacements, or the time spent in the buffer zones 111a can be set according to process requirements. In addition, each carrier 13 can synchronously execute each coating procedure corresponding to each coating section 111b, which can prevent the coating section 111b from being in an idle state, thereby effectively improving productivity and reducing ineffective man-hours.

In some embodiments, the process station 11 further includes a load-out chamber 116 and a load-in chamber 117 . In addition, the process station 11 also has two pumping pumps (not shown in the figure), which are respectively coupled to the load-out chamber 116 and the load-in chamber 117 , and are assembled to make the load-out chamber 116 and the load-in chamber 116 . The pressure in 117 is substantially close to the working pressure in the two buffer spaces 111a at opposite ends respectively. In this embodiment, the transfer mechanism 113 not only extends through the vacuum chamber 111 in the x direction, but also extends to the load-out chamber 116 and the load-in chamber 117 , so as to transfer the carrier C and the object to be plated in the vacuum chamber The body 111 , the load-out cavity 116 , and the load-in cavity 117 move among them. In some embodiments, the process station 11 further includes a pretreatment chamber 118, which is connected to the inlet valve 114 of the vacuum chamber 111, and is used for plasma treatment (eg, etching, surface cleaning or surface activation modification, etc.) of the object to be plated. Process). In some operational scenarios, the etching process performed in the pretreatment chamber 118 may be used to remove the coating material remaining on the periphery of the carrier C in the previous coating process.

The process system 100 also includes a reflow apparatus 12 configured to transport workpieces (eg, carrier C and objects to be coated) from the outlet end (eg, outlet valve 115 ) to the inlet end (eg, inlet valve 114 ). The reflow apparatus 12 includes a reflow track 123 configured to move the workpiece (eg, the carrier C and the object to be coated) from the load-out cavity 116 to the load-in cavity 117 . In the illustrated embodiment, the return track 123 has a settling section 1231 adjacent to the load-out chamber 116, a climbing section 1232 adjacent to the load-out cavity 117, and is disposed below the process station 11 and located between the settling section 1231 and the settling section 1232. Relay segment 1233 between climb segments 1232 . In addition, the return device 12 further includes lifting devices 121 and 122 , which are respectively used to drive the lifting and lowering of the settling section 1231 and the climbing section 1232 . In a In some embodiments, the lifting devices 121 and 122 may be pneumatic cylinder lifting devices, electric cylinder lifting devices, or screw driving lifting devices. In some embodiments, the settling section 1231, the climbing section 1232, and the relay section 1233 respectively have a conveying component (eg, the same as the conveying component of the aforementioned transmission mechanism), and a conveying component for driving the conveying component. Drive elements (eg motors).

After the coating process is finished, the transmission mechanism 113 sends the carrier C and the object to be plated to the outlet valve 115, the load-out cavity 116, and the settling section 1231 in sequence. Take the finished product and clear Vehicle C. Then, the settling section 1231 is driven by the lifting device 121 and moves downward together with the carrier C to engage with the relay section 1233 , so that the carrier C can be conveyed to the climbing section 1232 through the relay section 1233 . After the climbing section 1232 receives the carrier C from the relay section 1233, it is driven by the lifting device 122 to move upward together with the carrier C, and transports the carrier C to the loading cavity 117, so that the carrier C can receive the waiting Coating and performing each coating procedure again.

The process system 100 further includes a cooling system (eg, a cooling system 100 a ) configured to cool the carrier C and the object/workpiece to be plated thereon, which is disposed in one of the buffer chambers 111 a of the vacuum chamber 111 within. In the illustrated embodiment, the cooling system 100a is located within the buffer cavity 111a closest to the outlet gate 115 . In other embodiments, the cooling system is located in the buffer cavity 111 a adjacent to the two sides of the coating area 111 b of the outlet gate 115 . In such an embodiment, the carrier C and the objects to be plated carried on it have already performed the coating process in the three coating sections 111b before reaching the cooling system 100a, so they have a relatively high temperature state, so that the cooling system 100a has a relatively high temperature state. A large temperature difference is generated between the vehicle and the carrier C, thereby improving the cooling efficiency. In some embodiments, the cooling system 100a is located in the conveying path of the conveying mechanism 113, and the carrier C and the object to be plated can be transported by the conveying mechanism 113 to the top of the cooling system 100a; when the cooling system 100a receives the carrier C together with the object to be plated It can be cooled while plating. In some embodiments, the first cooling system 100a may be a liquid-cooled cooling system configured to contact the carrier C.

In the illustrated embodiment, the process system 100 also includes a collimated optical high temperature An Optical pyrometer 14, which is installed in the vacuum chamber 111 and whose position corresponds to the cooling system 100a, is configured to measure the amount of the object to be plated carried by the carrier C on the cooling system 100a. temperature status. In the illustrated embodiment, the collimated optical thermometer 14 is located directly above the cooling system 100a. In some embodiments, the process system further includes a processing module (not shown in the figure, may include one or more processors), which is data-connected to the collimated optical thermometer 14 and the cooling system 100a, and is assembled to The parameters of the cooling system 100a (eg, the temperature setting of the liquid supply) are dynamically controlled according to the sensing results of the collimated optical thermometer 14; in such an embodiment, the variability of the temperature state of the object to be plated can be reduced , thereby improving the yield of finished products.

The process system 100 further includes cooling systems 100 b and 100 c disposed in the reflow apparatus 12 , which are configured to cool the carrier C in the reflow apparatus 12 . It should be noted that the cooling systems 100b and 100c are installed at the location of the reflow apparatus 12 to be in fluid communication with the outside world (eg, exposed to the plant environment where the process system 100 is located). For example, the second cooling system 100b, 100c may be disposed on the hop 1233 of the return track 123, and the hop 1233 may be placed on an open rack (not shown) to be connected with the External fluid communication (eg, atmospheric communication). In some embodiments, the entirety of the return track 123 is in fluid communication with the outside world. Similar to the cooling system 100a, the cooling systems 100b, 100c are respectively assembled to cool the carrier C (transported by the hop 1233) thereon.

In some embodiments, the process system 100 further includes a temperature sensor (eg, the temperature sensor 321 shown in FIG. 3 ) disposed in the cooling system (eg, the cooling system 100b ), and a temperature sensor (eg, the temperature sensor 321 shown in FIG. The cooling system 100b) and the processing module (eg, the processing module 33 shown in FIG. 3 ) to which the temperature sensor data is connected. The processing module is configured to dynamically control the temperature setting of the cooling system (eg, the cooling system 100b ) according to the sensing result of the temperature sensor, for example, by controlling the fluid output of the liquid cooling system of the cooling system (eg, the cooling system 100b ) (eg temperature or flow settings of the liquid) to control the temperature of the cooling plates of the cooling system (eg cooling system 100b) set up. In this way, the temperature setting of the cooling system (eg, the cooling system 100b ) can be continuously adjusted in real time according to the temperature state of the carrier C, thereby dynamically adjusting the temperature state of the carrier. In some cases, the maximum allowable temperature of Carrier C before feeding is 40°C; in some embodiments, the temperature is below 30°C. In some embodiments, the temperature is below 25°C. In some embodiments, the temperature is below 20°C.

In the illustrated embodiment, the installation position of the cooling system 100b can be designed to be adjacent to the load-out cavity 116 to receive the high-temperature carrier C nearby, resulting in a large temperature difference between the cooling system 100b and the carrier C ( For example, 60~70 degrees C), thereby improving the cooling efficiency. For example, in the illustrated embodiment, the cooling system 100b is provided at the head end of the hop 1233 (the end on the right in FIG. 1 ). On the other hand, the installation position of the cooling system 100c can be designed to be adjacent to the loading chamber 117, so that the temperature state of the carrier C can be accurately controlled before the carrier C enters the loading chamber 117 (feeding) (eg, at 25°C), which is conducive to maintaining the consistency of the coating process conditions. For example, in the illustrated embodiment, the cooling system 100c is disposed at the trailing end of the hop 1233 (the left end in FIG. 1).

In some embodiments, the cooling system 100b or 100c may select a set of pairings to cool the carrier C (transported by the hop 1233) thereon. For example, in some embodiments, the process system only configures the cooling system 100b. In such a state, even if the backside of the carrier is cooled by the cooling system 100b with a little dew on the back (described in detail later), the dew has evaporated in the process of the carrier being transported to the feed end, which can avoid The dew affects the vacuum state of the loading cavity; in addition, the temperature state of the carrier can not be lower than the room temperature, which can reduce the dew condensation on the surface of the carrier.

2 shows a schematic diagram of a cooling system according to some embodiments of the present disclosure. For simplicity and clarity of illustration, some details/subcomponents of the exemplary system are not explicitly labeled/shown in this figure. Cooling system 200b may be positioned in a return device (eg, return device 12) in fluid communication with the outside world. For example, the cooling system 200b shown in FIG. 2 is positioned adjacent to the settling section of the hop 2233 (eg settling section 1231). In order to show the relative positions of the hop 2233, the cooling system 200b, and the carrier C, a portion of the carrier C is hidden from FIG. 2 .

In the illustrated embodiment, the relay section 2233 has a plurality of conveying wheels 223a and a driving element (eg, a motor, not shown) assembled to drive the conveying wheels 223a. The conveying wheels 223a are arranged in the x-direction and assembled to carry the two long side regions of the carrier C extending in the x-direction; by controlling the actuation mode of the driving element, the movement of the carrier C in the x-direction can be controlled. move.

The cooling system 200b includes a cooling plate 210 configured to contact and cool the carrier C. In the illustrated embodiment, the cooling plate 210 is located between the conveying wheels 223a in the y-direction. In addition, the process system further includes a driving mechanism 25, which is configured to drive the lifting and lowering movement (in the z direction) of the cooling plate 210 of the cooling system 200b. In the illustrated situation, the carrier C has been transported over the cooling plate 210 by the transport wheel 223a; the current position of the cooling plate 210 is spaced from said carrier C to each other in the z-direction. At this time, the cooling plate 210 is driven by the driving mechanism 25 and can be lifted up to contact or support the carrier C, so as to cool the carrier C through heat conduction.

In order to prevent the conveying wheel 223a from interfering with or blocking the lifting and lowering movement of the cooling plate 210, the cooling plate 210 is designed to be formed with a plurality of notches 216 recessed inward from its outer edge. z-direction) is projected and superimposed on the conveying wheel 223a. In the illustrated embodiment, the notches 216 are arranged at intervals on the long side of the cooling plate 210 (extending in the x-direction), and are recessed toward the interior of the cooling plate 210 along the y-direction. The design of the notch 216 allows the width W1 of the cooling plate 210 in the y direction to be greater than the distance between the paired conveying wheels 223a in the y direction, thereby increasing the area of the cooling plate 210 and improving the heat dissipation efficiency. In other embodiments, if the cooling plate is not designed with a notch, its width must be smaller than the distance between the aforementioned conveying wheels 223a, so as to avoid the up-and-down movement of the cooling plate being blocked by the conveying wheels. In some embodiments, the area of the top surface of the cooling plate 210 (used as a bearing surface or cooling surface) is at least 50% of the area of the carrier C; On the premise of moving the cover, increase the width W1 of the cooling plate 216 and increase the area of the cooling surface to With more than 70% of the C area. In some embodiments, the cooling plate 210 has a high thermal conductivity material, such as aluminum.

In some embodiments, the width of the carrier C in the x-direction is about 30-100 cm. In some embodiments, the width ranges from 40 cm to 70 cm, such as 45 cm. In some embodiments, the width in the x-direction ranges from 60 cm to 65 cm, such as 60 cm. In some embodiments, the width in the x-direction ranges from 75 cm to 90 cm. In some embodiments, the width of the carrier C in the y direction is about 30-100 cm, for example, 70 cm. In some embodiments, the width of the carrier C in the y direction is about 70-90 cm, for example, 85 cm. In some embodiments, the thickness of the carrier C is 5 mm or more, eg, 10 mm. In some embodiments, the material of the carrier C includes a metallic material, such as aluminum or aluminum alloys, copper or copper alloys, stainless steel, titanium or titanium alloys. In some embodiments, the material of the carrier C includes a ceramic material, such as aluminum oxide, aluminum nitride. In some embodiments, the material of carrier C comprises a composite material.

3 shows a schematic top view of a cooling system according to some embodiments of the present disclosure. For simplicity and clarity of illustration, some details/subcomponents of the exemplary system are not explicitly labeled/shown in this figure.

The cooling system 300b includes a cooling module 31 including a cooling plate 310 configured to carry the object to be cooled (eg, the carrier C shown in FIG. 2 ). FIG. 3 shows an exemplary top view profile of the cooling plate 310 , the plate body 311 of which generally has two side regions 311 a and a central region 311 b located between the side regions 311 a. The side area 311a may be defined as an area extending a certain distance from the two long sides of the plate body 311 (extending in the x direction) toward the interior of the plate body 311 (in the y direction); the value of the distance is approximately the value of the plate body 311. The value of the width of the body 311 in the y direction is 10-20%, for example, 15%. The cooling plate 310 is designed to be formed with a plurality of notches 316 recessed inwardly from its outer edge. In the illustrated embodiment, the notches 316 are arranged at intervals on the long side of the cooling plate 310 (extending in the x-direction), and are recessed toward the interior of the cooling plate 310 along the y-direction. In some embodiments, the plate body 311 includes high thermal conductivity material, such as metal.

The cooling module 31 also includes a fluid supply system 314 configured to cool the cooling plate 310 . The plate body 311 has a bearing surface (such as a top surface), and the bearing surface is formed with a first flow channel structure 312 and a second flow channel structure 313 that are in fluid communication with the fluid supply system 314; when the low-temperature fluid is supplied to the first flow channel The channel structure 312 or the second flow channel structure 313, the temperature state of the cooling plate 310 is lowered so as to cool the object to be cooled. For example, the fluid supply system 314 is configured to provide the fluid in the second phase to the second flow channel structure 313 of the cooling plate 310 , thereby reducing the temperature state of the plate body 311 . In the illustrated embodiment, the second flow channel structure 313 has a curved and extended outline, and its distribution area roughly occupies most of the plan area of the central area 311b of the plate body 311 ; The low-temperature fluid of the supply system 314 flows through the second flow channel structure 313, which can have a better cooling effect. In some embodiments, the fluid in the second phase state is liquid, in other words, the second flow channel structure 313 may be a liquid flow channel configured to transport liquid. In other embodiments, in addition to the fluid supply system 314, a cooling wafer or a fan may be provided instead or further below the cooling plate to cool the cooling plate.

In some embodiments, the first flow channel structure 312 has a plurality of side regions 311a distributed in two (extending in the x-direction), and openings are formed on the bearing surface (eg, the top surface) of the plate body 311 . the spout 312a. In the illustrated embodiment, the spout 312a faces upwards (towards the z direction), and may be implemented as through holes (in the z direction) passing through the top and bottom surfaces of the plate body 311, and fluidly communicates with the The buffer chamber 315 is located on the bottom surface of the plate body 311 and extends along the two side regions 311a. In other embodiments, the through holes may be disposed obliquely (for example, toward the middle area of the bearing surface of the plate body 311 ). The fluid supply system 314 is configured to provide a first phase of fluid to the first flow channel structure. For example, the fluid supply system 314 is coupled to one end of the buffer chamber 315 (as shown by the light-colored bold arrow in FIG. 3 ), and is in fluid communication with the spout 312 a through the buffer chamber 315 , and is capable of supplying the buffer chamber 315 Inject the fluid in the first phase. In some embodiments, the The fluid in the first phase may be a gas, and the nozzles 312a are configured to allow the gas to be ejected through the buffer chamber 315 toward the top surface (in the z-direction) of the cooling plate 311 . In some embodiments, the diameter of the spout 312a is not greater than 2 mm, about 0.5-1 mm. If the diameter of the nozzle is too large (for example, larger than 2mm), a large amount of gas will be consumed, and the ejected gas may cause the carrier to float, thereby increasing the distance between the carrier and the cooling system, resulting in excessive thermal interface resistance. In addition, the excessively large diameter may also cause dust to affect the cleanliness of the carrier. Conversely, if the diameter of the nozzle is too small, it is difficult to process. In some embodiments, there is no fluid communication between the first and second flow channel structures 312 and 313 . In other embodiments, the fluids in the first phase state and the second phase state may be the same, for example, both are liquids.

In some embodiments, the first and second flow channel structures 312 and 313 are arranged in a staggered manner in the projection range of the cooling plate 310 along the thickness direction (eg, the z-direction shown in the figure). For example, the first flow channel structures 312 are distributed in the peripheral region of the plate body 311 ; the second flow channel structures 313 are embedded in the plate body 311 and correspond to the central region 311b and avoid the side regions 311a. In the illustrated embodiment, the distribution positions of the nozzles 312a avoid the central area 311b of the plate body 311 ; the liquid flow channel 312 embedded in the cooling plate is located between the nozzles 312a in the y direction And the nozzle 312a is dislocated.

In some cases, the object to be cooled (such as the carrier C shown in FIG. 1 ) rises sharply due to a long-term coating process, or undergoes sandblasting, which may cause its temperature to rise and deform and/or the surface to be flat. degree destroyed. At this time, when the top surface of the cooling plate 310 supports the bottom surface of the object to be cooled (eg, the carrier C shown in FIG. 1 ), a gap will be formed between the two. Since the thermal conductivity of the air in the gap (about 0.026Wm ^-1 K ^-1 ) is extremely low, the object to be cooled (eg, the carrier C shown in FIG. 1 ) and the cooling plate 310 will be damaged. heat transfer efficiency between. In order to reduce the gap between the cooling plate 310 and the carrier C, a thermal pad can be covered on the top surface of the cooling plate 310, so that even if the carrier C is deformed, its bottom surface is expected to be better than the thermal pad. the tightness. However, the existing thermal pads cannot fully conformally fit, resulting in too high interfacial thermal resistance, which may significantly reduce the thermal conductivity.

In some embodiments, the cooling system 300b further includes a liquid interface generation module configured between the cooling surface (eg, the top surface) of the cooling plate 310 and the workpiece (eg, the carrier C) Generate liquid interface. In some embodiments, the cooling plate 310 of the cooling system 300b is disposed in a relay section (eg, relay section 2233 ) of the return system (eg, the return system 12 ) to be in fluid communication with the outside world. In such embodiments, the liquid interface The generating module can be designed to lower the temperature state of the cooling plate 310 to a temperature close to (eg, not higher than) the dew point temperature, so that dew water is condensed on the top surface of the cooling plate 310 to generate the liquid interface. When dew (thermal conductivity is about 0.6Wm ^-1 K ^-1 ) replaces the air in the void (thermal conductivity is about 0.026Wm ^-1 K ^-1 ), it can make up for the heat transfer efficiency sacrificed by air and reduce the interface thermal resistance. The following will describe how the liquid interface generation module makes the cooling plate 310 lower than the dew point temperature.

In the illustrated embodiment, the liquid interface generation module includes a sensing module 32 and a processing module 33 . The sensing module 32 is configured to sense at least one of the temperature and humidity of the environment where the cooling plate 310 is located, and generate a sensing result. For example, in the illustrated embodiment, the sensing module 32 includes five temperature sensors 321 (eg, thermocouples) disposed on (eg, attached to) the top surface of the cooling plate 310 , which are respectively located on the cooling plate The four corners and central area of the 310. In other implementations, the number and arrangement positions of the temperature sensors are not limited to the drawings. It should be noted that the cooling system 300b is located in the relay section (eg, the relay section 1233 ) and is in fluid communication with the outside world, so the sensing result of the temperature sensor 321 reflects the temperature state of the outside world. In some embodiments, the sensing module 32 further includes a hygrometer (not shown) configured to sense the relative humidity of the environment where the cooling plate 310 is located. The hygrometer can be arranged in a relay section (eg, relay section 1233 ) that is in fluid communication with the outside world, and can sense the humidity state of the outside world.

The processing module 33 may include one or more processors, data-connected to the sensing module 32 and the cooling module 31, and configured to obtain the dew point temperature condition of the environment according to the sensing result from the sensing module 32 , and control the temperature setting of the cooling module 31 to make the temperature of the cooling plate 310 The temperature state is near (eg, not higher than) the dew point temperature of the environment, thereby causing the cooling plate 310 to condense. For example, in an operation situation, when the processing module 33 obtains according to the sensing result of the sensing module 32 that the relative humidity of the environment where the cooling plate is located is 50% and the temperature is 25 degrees C, the processing module 33 Based on the relative humidity and temperature, the dew point temperature is calculated to be 15°C. Accordingly, the processing module 33 controls the output of the fluid (eg, liquid) supplied by the fluid supply system 314 of the cooling module 31 to the cooling plate 310 (eg, the setting of the temperature or flow rate of the liquid), thereby reducing the temperature of the cooling plate 310 To the dew point temperature below 15 degrees C. In this way, the cooling plate 310 can condense dew water. (Definition of dew point temperature: The temperature at which the air, under the condition of constant air pressure and humidity, gradually reduces its temperature until the amount of water vapor reaches saturation and begins to condense into dew.) In some operating situations, in order to further The dew condensed on the cooling plate 310 forms a water film to obtain a better cooling effect. The processing module 33 is further configured to control the temperature setting of the cooling module 31, so that the temperature state of the cooling plate 310 is higher than that of the environment. The dew point temperature is 10 to 20 degrees C lower, for example 15 degrees C. In some embodiments, the setting of the temperature is further based on the principle that the cooling plate does not freeze. In some embodiments, the cooling module 31 can be set at a constant temperature (or set artificially), so that the temperature state of the cooling plate is not higher than the dew point temperature, and the effect of condensation on the cooling plate can also be achieved.

Figures 4a and 4b respectively show the results of two experiments according to some embodiments of the present disclosure. In the two experiments, the area ratio of the top surface of the cooling plate (eg, cooling plate 310 ) to the carrier was set to 70%; the fluid supply module (eg, fluid supply module 314 ) was provided to the liquid flow channel (eg, The temperature of the liquid of the second flow channel structure 313) was set to 18°C. The difference between the two experiments is that the experiment corresponding to Fig. 4a used a thermal pad with a thermal conductivity value of 12Wm ^-1 K ^-1 and set it between the carrier and the cooling plate; In the experiment, the cooling plate was condensed (for example, using the aforementioned liquid interface generation module), but the thermal pad was not used. Curves 41a and 41b represent the sensing results of a temperature sensor (eg, thermocouple 321 ) disposed in the center of the cooling plate (eg, cooling plate 310 ); ) the sensing result of the temperature sensor (eg, thermocouple 321 ) in the corner. Comparing Figures 4a and 4b, it can be seen that if the thermal pad is used, it takes about 250~400 seconds to cool the carrier C to nearly 30 degrees C; The rate is significantly faster.

Referring back to FIG. 3 , in some embodiments, the liquid interface generation module may be designed to further include a fluid confinement module to further confine the dew generated on the top surface of the cooling plate 310 to the central region 311b of the cooling plate 310 , Thus, the heat dissipation efficiency of the carrier C is further improved. In the illustrated embodiment, since the distribution position of the nozzles 312a is in the peripheral area of the cooling plate 310, when the fluid supply system 314 provides gas (for example, via the buffer chamber 315) to the nozzles 312a, Then, the gas ejected through the nozzle 312 a will confine the formed dew in the central area 311 b of the plate body 311 . Based on the function of constraining the fluid, the first flow channel structure 312 (eg, the spout 312a ) and the fluid supply system 314 can jointly serve as a fluid confinement module. In other embodiments, the fluid confinement module is implemented as an annular hydrophobic area formed on the top surface of the cooling plate, which surrounds the central region 311b of the cooling plate, thereby achieving the purpose of confining dew.

In order to restrain the dew in the central area 311b, the distribution area of the spout 312a is approximately symmetrical to the center of the plate body 311. According to this design rule, in other embodiments, the nozzles can be designed to be distributed in the regions of the two short sides of the plate body (for example, the sides of the plate body 311 extending along the y direction in the figure); The four side regions of the substantially rectangular plate body surround the second flow channel structure 313 .

In some embodiments, the fluid confinement module can further concentrate dew toward the central region 311b of the plate body 311 . For example, the distribution positions of the nozzles (eg, the nozzles 212a, 312a) can be designed so that when the cooling plate (eg, the cooling plate 210, 310) supports the object to be cooled (eg, the carrier C), the object to be cooled (eg, the carrier C) is cooled by the cooling plate (eg, the cooling plate 210, 310). In addition, during the period when the cooling plate 310 receives the object to be cooled (eg, the carrier C), the fluid supply system 314 may be further enabled (eg, controlled by the processing module 33 ) to provide gas to the spout 312a; when the gas is released through the nozzle 312a, A part of the gas will be concentrated along the bottom surface of the carrier C from the side region 311a of the cooling plate 310 toward the central region 311b, so that the blowing dew will be concentrated toward the central region 311b of the plate body 311 .

Referring back to FIG. 2, the nozzles 212a are designed to be distributed in the two side regions (long side regions) 211a of the cooling plate 210 extending in the x direction, and avoid the central region 211b, on the other hand, the plate body 211 is in the y direction ( The width W1 in the direction orthogonal to the side region 211a) is designed to be smaller than the width W2 of the object to be cooled (eg, the carrier C); this structural design allows the carrier C to cover the spout 212a when it is carried by the cooling plate 210 . In other embodiments, the nozzles can be designed to be distributed in two side regions (short side regions) of the cooling plate extending in the y direction, and the width of the plate body in the x direction is designed to be smaller than the object to be cooled ( For example, the width of the carrier C) can also make the spout covered by the object to be cooled.

In order to properly concentrate or confine dew, in some embodiments, the pressure of the gas provided by the fluid supply system 314 is approximately between 0.1 kg/cm ² and 2 kg/cm ² . In some situations, when the pressure is greater than the upper limit (eg, 2 kg/cm ² ), the gas may blow off the coating material adhering to the carrier C, contaminating the process system, or causing the carrier to float. In some scenarios, when the pressure is less than a lower limit (eg, 0.1 kg/cm ² ), the dew-blowing effect of the gas will be significantly reduced.

FIG. 5 shows simulated experimental data according to some embodiments of the present disclosure. In the experimental setup of FIG. 5 , the temperature of the carrier is set to 110°C; the temperature of the liquid supplied by the fluid supply module (eg, the fluid supply module 314 ) to the liquid flow channel (eg, the liquid flow channel 313 ) is set by Set to 20 degrees C. The experiment represented by curve 501 did not use the fluid confinement module to confine dew; while the experiment represented by curve 502 used the fluid confinement module according to the present embodiment to confine dew. It can be seen from the experimental result graph that the experimental curve 502 using the fluid confinement module achieves better cooling efficiency. For example, at the 75th second, the temperature state of the vehicle in the curve 502 is relatively lower by 8 degrees C compared to the curve 501 .

6a and 6b show schematic diagrams of cooling plates according to some embodiments of the present disclosure. For simplicity and clarity of illustration, some details/subcomponents of the exemplary system are not explicitly labeled/shown in this figure. In some embodiments, FIGS. 6 a and 6 b may be schematic cross-sectional views along a cross-section parallel to the plane P3 shown in FIG. 3 .

As shown in FIG. 6a, in some embodiments, in order to further increase the heat conduction efficiency in the z-direction, the plate body 611 of the cooling plate 610 may adopt a composite metal structure. For example, the board body 611 shown in FIG. 6a includes a main board layer 611c having a first thermally conductive material, and an upper board layer 611d disposed on the mainboard layer 611c and having a second thermally conductive material, wherein the first thermally conductive material is The thermal conductivity is less than the thermal conductivity of the second thermally conductive material. The first thermal conductive material of the main board layer 611c may contain aluminum (thermal conductivity 237Wm ^-1 K ^-1 ), and the second thermal conductive material of the upper board layer 611d may contain copper (thermal conductivity 400 Wm ^-1 K ^-1 ). The main board layer 611c and the upper board layer 611d may have substantially the same top-view profile (viewed from the z-direction). In some embodiments, a spout (eg, spout 312a) may be implemented through the main board layer 611c and the upper board layer 611d. In some embodiments, the main board layer (eg, 611c of FIG. 6a ) and the upper board layer (eg, 611d of FIG. 6b ) can be made of homogeneous materials. In some embodiments, the main board layer (eg, the main board layer 611c ′ of FIG. 6b ) and the upper board layer (eg, the upper board layer 611d ′ of FIG. 6b ) may use heterogeneous materials or homogeneous materials. In some embodiments, the main board layer 611c' and the upper board layer 611d' can be made of metal materials, such as copper, copper alloy, aluminum, aluminum alloy, stainless steel, titanium, titanium alloy, and the like. In some embodiments, the thermal conductivity of the material of the upper board layer 611d' is equal to or greater than that of the main board layer 611c'. In the embodiment shown in FIG. 6b, when the main board layer 611c' and the upper board layer 611d' are made of different materials, friction welding, electron beam welding, laser welding, vacuum brazing, and O-ring sealing can be used to join the two. , or deep hole drilling and other technologies. The second flow channel structure may be formed on the main board layer. For example, in the embodiment shown in FIG. 6 b , the second flow channel structure 613 ′ can be formed using a computer numerical control (Computer Numerical Control; CNC) process. For example, the formation of the second flow channel structure 613' may include: using a computer numerical control (CNC) process to form a curved and extended channel 613a' on the top surface of the main board layer 611c', and joining the upper plate layer 611d' (for example, by friction welding, electron beam welding, laser welding, vacuum brazing, O-ring sealing, or deep hole drilling, etc.) on the top surface of the main board layer 611c' and close the channel 613a' , thereby forming the second flow channel structure 613 ′. When the main board layer (eg 611c') is made of the same material as the upper board layer (611d'), the difference in thermal expansion coefficient between the two materials can be reduced, and the peeling or warping of the upper sub-layer 611f due to temperature changes can be reduced. Therefore, the liquid flow channel (the second flow channel structure 613 ) is prevented from being damaged.

In the embodiment shown in FIG. 6a, the main board layer 611c has a double-layer structure including a lower sub-layer 611e and an upper sub-layer 611f. In some embodiments, the formation of the second flow channel structure 613 may include: using a computer numerical control (CNC) process to form a curved and extended channel 613a on the top surface of the lower sub-layer 611e of the main board layer 611c, The sublayer 611f is bonded (eg, by friction welding, electron beam welding, laser welding, vacuum brazing, O-ring sealing, or deep hole drilling, etc.) to the top surface of the lower sublayer 611e and closes the trench The channel 613a is formed, thereby forming the second flow channel structure 613 . The upper sub-layer 611f can be made of the same material as the lower sub-layer 611e, so as to reduce the difference in thermal expansion coefficient between the two materials, and reduce the chance of peeling or warping of the upper sub-layer 611f due to temperature changes, so as to avoid liquid The flow channel (second flow channel structure 613) is destroyed. In some embodiments, the upper/lower daughter board layers (eg, 611e/f of FIG. 6a ) of the main board layer (eg, the main board layer 611c of FIG. 6a ) may employ heterogeneous materials. In some embodiments, the upper sub-layer 611f and the lower sub-layer 611e may be made of metal materials, such as copper, copper alloy, aluminum, aluminum alloy, stainless steel, titanium, titanium alloy, and the like.

In some embodiments, when the plate body adopts a composite plate structure, in order to form the second flow channel structure in the main plate layer and maintain the structural strength of the main plate layer, the thickness ratio between the heterogeneous plate layers is approximately set at about Between 4 and 5, for example between 4.2 and 4.4. For example, as shown in FIG. 6a, the lower limit of the thickness of the main board layer 611c is about 9~15mm, eg 13mm; the lower limit of the thickness of the heterogeneous upper board layer 611d is about 2~4mm, eg 3mm. In other embodiments, such as shown in FIG. 6b, the lower limit of the thickness of the main board layer 611c' is 9-13mm; the lower limit of the thickness of the heterogeneous upper board layer 611d' is 2mm, such as 3mm or 6mm. In some embodiments, an upper ply (eg, upper ply 61 Id) may be implemented The copper metal layer is formed on the main board layer (such as the main board layer 611c) by a process method such as cold spraying or copper plating or copper electroplating, or is implemented to be joined to the main board layer (such as the main board layer 611c) by welding. The copper layer (such as the upper board layer 611d') of the main board layer 611c') has good material density and adhesion to the main board layer (such as the main board layer 611c'), and has relatively good thermal conductivity.

7 shows a schematic perspective view of a cooling plate of a cooling system, generally representing a top surface of the cooling plate, in accordance with some embodiments of the present disclosure. For simplicity and clarity of illustration, some details/subcomponents of the exemplary system are not explicitly labeled/shown in this figure.

The plate body 711 of the cooling plate 710 is substantially rectangular, and has two side regions (eg, the side regions 711 a ) and a central region (eg, the central region 711 b ) located between the side regions. The side area 711a can be defined as an area extending a certain distance from the two long sides of the board body 711 in the x-direction and toward the interior of the board body 711 along the y-direction; the value of the distance is approximately the board body 711 10~20% of the value of the width in the y direction, such as 15%. The cooling plate 710 is designed to be formed with a plurality of notches 716 recessed inwardly from its outer edge. In the illustrated embodiment, the notches 716 are arranged at intervals on the long side of the cooling plate 710 (extending in the x-direction), and are recessed toward the interior of the cooling plate 710 along the y-direction. In some embodiments, the plate body 711 includes a high thermal conductivity material, such as metal.

The plate body 711 is formed with a first flow channel structure 712 configured to receive a first phase of fluid provided by a fluid supply system (eg, the fluid supply system 314 ). In the illustrated embodiment, the first flow channel structure 712 has a first direction flow channel 712x, a second direction flow channel 712y, and a third direction flow channel 712z extending along the x, y, and z directions, respectively. One-, two-, and three-directional flow channels are designed to be in fluid communication with each other. In some embodiments, the first and second direction flow channels 712x, 712y include (in the x, y directions) blind holes recessed from the side of the plate body 711; the third direction flow channel 712z includes (in the z direction) top) a blind hole recessed downward from the top surface of the plate body 711 , and its upward (toward z-direction) opening defines a spout 712a. The distribution position of the first flow channel structure 712 is designed as The central area 711b of the plate body 711 is avoided. In the illustrated embodiment, the distribution area of the spout 712 a is symmetrical to the center of the plate body 711 . According to the same design rules, in other embodiments, the nozzles can be designed to be distributed in the regions of the two short sides of the plate body (for example, the sides of the plate body 711 in the figure extending along the y direction); or, The nozzles may be designed to be distributed in four side regions of the substantially rectangular plate body to surround the second flow channel structure (eg, the second flow channel structure 813 ).

8 shows a schematic bottom view of a cooling plate of a cooling system according to some embodiments of the present disclosure. For the convenience of description, the shaded block in FIG. 8 is shown in a see-through manner, and the channel cover (eg, the channel cover 913b ) is omitted.

The first flow channel structure 812 is distributed in the side region 811a of the plate body 811 of the cooling plate 810, and has a first direction flow channel 812x, a second direction flow channel 812y, and a third direction flow channel (the third direction flow channel) which are in fluid communication with each other. shaded in the current view), and the spout (masked in the current view). In some embodiments, the first flow channel structure 812 further has an air intake channel (such as the air intake channel 812c) formed on the bottom surface, side surface and/or top surface of the plate body 811, which is configured to be coupled to a fluid supply system (such as an air intake channel 812c). fluid supply system 314). For example, the air intake channel 812c extends from the bottom surface of the plate body 811 toward the top surface in the z direction and is in fluid communication with the first direction flow channel 812x. In some embodiments, the fluid supply system has a fitting (not shown) configured to connect to the air inlet 812c, and is in fluid communication with the first flow channel structure 812 through the air inlet, and is capable of providing access to the air inlet. The fluid in the first phase is injected so that the fluid in the first phase is ejected from the nozzle 812a. In some embodiments, the cooling plate 810 further has a plurality of plugs 810, which are respectively assembled to fill the openings facing the x and y directions of the first and second direction flow channels 812x and 812y, thereby suppressing the x, y, and y directions. Exhale in the y direction.

The second flow channel structure 813 has an inlet end 813e and an outlet end 813f configured to be coupled to a fluid supply system; the fluid supply system has a joint (not shown) configured to be connected to the inlet end 813e and the outlet end 813f, In addition, the fluid in the second phase can be injected into the second channel structure 813 to cool the plate body 811 . In the embodiment shown in FIG. 8 , the second flow channel structure 813 has a wheel that is bent and extended and its distribution not only corresponds to the central region 811b but also extends to the side regions 811a, thus occupying most of the top-view area of the plate body 811; in this way, when the low-temperature fluid from the fluid supply system flows through the The second flow channel structure 813 can obtain a better cooling effect. In some embodiments, the projected range of the second flow channel structure 813 in the z direction overlaps the first flow channel structure 812 . For example, the bent section and the section extending in the x-direction of the second flow channel structure 813 are projected and overlapped with the first flow channel structure 812 .

9 shows a schematic cross-sectional view of a cooling plate of a cooling system according to some embodiments of the present disclosure. In some embodiments, FIG. 9 may be a schematic cross-sectional view along a cross-section parallel to the plane P8 shown in FIG. 8 .

Referring to FIG. 9 , the first, second, and third direction flow channels 912x, 912y, and 912z of the first flow channel structure 912 are in fluid communication. In some embodiments, the first flow channel structure 912 further has an air intake channel 912c, which extends from the bottom surface of the plate body 911 toward the top surface along the z direction and is in fluid communication with the first direction flow channel 912x. The fluid supply system (for example, the fluid supply system 314 ) is in fluid communication with the first flow channel structure 912 through the air inlet 912c, and can inject the first phase fluid into the air inlet 912c, so that the first phase fluid (for example, the gas ) is ejected from the nozzle 912a toward the top surface of the cooling plate 911 (in the z direction). In the illustrated embodiment, the three-directional flow channel 912z extends along the z-direction; in other embodiments, the three-directional flow channel can be designed to be inclined (for example, toward the cooling plate 911 ). the middle area of the top surface extends).

In the side region 911 a of the cooling plate 911 , the distribution ranges of the first and second flow channel structures 912 and 913 are staggered in the thickness direction (z direction). For example, in the illustrated embodiment, the distribution range of the first, second, and third direction flow channels 912x, 912y, and 912z in the z direction is relatively higher (relative to the bottom surface of the plate body 911 ) than the second flow channel structure 913 in the z direction. distribution in the direction. Such a height difference design allows the projection range of the second flow channel structure 913 in the z direction to overlap with the first flow channel structure 912 , which helps to maximize the distribution range of the second flow channel structure 913 , thereby improving cooling efficiency.

In some embodiments, the second flow channel structure 913 has a first depth D ₁ corresponding to the side region 911 a and a second depth D ₂ corresponding to the central region 911 b. The first depth D ₁ is designed to be relatively shallower than the second depth D ₂ . In some embodiments, such a design can simultaneously allow the projected regions of the second flow channel structure 913 and the first flow channel structure 912 to overlap each other in the z-direction, and maintain the volume of the second flow channel structure 913 corresponding to the central region. Effect.

In some embodiments, the formation of the second flow channel structure 913 may include: using a computer numerical control (Computer Numerical Control; CNC) process to form a bent and extended channel 913 a on the bottom surface of the plate body 911 , and the bent and extended channel The cover plate 913b is joined (eg, by welding) to the plate body 911 and closes the channel 913a, thereby forming the second flow channel structure 913 . The plate body 911 can be made of the same material as the channel cover plate 911b, so as to reduce the difference in thermal expansion coefficient between the two materials and reduce the damage of the liquid flow channel caused by the temperature change. In the embodiment shown in FIG. 9 , when the plate body 911 is made of the same material as the cover body, the lower limit of the thickness of the plate body 911 can be about 12 mm; this thickness range can allow machining ( In the z direction), the first flow channel structure 912 and the second flow channel structure 913 are projected and overlapped with each other, and the structural strength of the plate body 911 can be maintained. In some embodiments, when the plate body (such as the plate body 911 ) is made of high-strength metal (such as high-strength aluminum alloy, high-strength copper alloy, stainless steel, titanium or titanium alloy), the lower limit of the thickness can be reduced to about 6mm.

Therefore, an aspect of the present disclosure provides a cooling plate assembled to support an object to be cooled, comprising: a plate body having a bearing surface, the bearing surface having two side regions and located between the side regions the central area of the radiator; the first flow channel structure, distributed in the side area, is configured to transport the fluid of the first phase, the first flow channel structure has a plurality of distribution in the two side areas and the opening is formed in the a spout on the bearing surface of the plate body, the spout is arranged to avoid the central area; and a second flow channel structure, embedded in the plate body and corresponding to the central area, configured to transport the second phase state fluid; wherein, in the direction orthogonal to the side region, the width of the plate body is smaller than the width of the to-be-to-be- The width of the cooling object.

In some embodiments, the board body has: a main board layer with a first thermally conductive material, wherein the second flow channel structure is provided in the main board layer; an upper board layer is provided on the main board layer There is a second thermally conductive material; wherein, the thermal conductivity of the first thermally conductive material is smaller than that of the second thermally conductive material.

In some embodiments, the thickness ratio between the main board layer and the upper board layer is about 4 to 5.

Accordingly, an aspect of the present disclosure provides a cooling system configured to cool an object to be cooled, the cooling system comprising: a cooling module including a cooling plate for carrying the object to be cooled, the cooling plate having two sides a side area, and a central area between the side areas; a sensing module, configured to sense at least one of the temperature and humidity of the environment where the cooling plate is located, and generate a sensing result; and processing a module, the signal is connected to the sensing module and the cooling module, and is configured to obtain the dew point temperature condition of the environment according to the sensing result from the sensing module, and to control the cooling module The temperature is set so that the temperature state of the cooling plate is not higher than the dew point temperature of the environment, thereby causing condensation of the cooling plate.

In some embodiments, the cooling plate is further formed with a flow channel structure; the cooling module further includes a fluid supply system configured to provide fluid to the flow channel structure of the cooling plate; the processing module further includes The signal is connected to the fluid supply system and configured to control the fluid output of the fluid supply system according to the sensing result.

In some embodiments, the cooling plate is formed with a plurality of nozzles in fluid communication with the fluid supply system and opening upward; the nozzles are located away from a central region of the cooling plate; the nozzles are positioned when all When the cooling plate carries the object to be cooled, it is covered by the object to be cooled; the processing module is further configured to make the fluid supply system release fluid to the cooling plate during the period when the cooling plate receives the object to be cooled the nozzle.

Accordingly, one aspect of the present disclosure provides a processing system configured to process a workpiece, comprising a processing station including an inlet port and an outlet port, configured to receive the workpiece from the inlet port, and to process the workpiece by the outlet port The workpiece is moved out of the process station; the reflow device includes a recirculation track arranged outside the process station, the reflow track is assembled to make the workpiece move from the outlet end to the inlet end; and a cooling module, located in The return track is in fluid communication with the external environment. The cooling module includes: a cooling plate with a cooling surface configured to contact the workpiece, the cooling surface defines two side regions and a central region between the side regions; and a liquid interface generation The module is arranged on the cooling plate and assembled to generate a liquid interface between the cooling surface and the workpiece.

In some implementations, the liquid interface generation module includes a fluid confinement module configured to constrain the fluid on the cooling surface.

In some implementations, the fluid confinement module has a plurality of nozzles, the openings of which are upward and distributed in a peripheral area of the cooling plate and are disposed away from the central area; and a fluid supply system, assembled to Fluid is provided to the spout during receipt of the workpiece by the cooling plate; wherein the spout is configured to be covered by the workpiece when the workpiece is carried by the cooling plate.

In some embodiments, the system further includes a driving mechanism configured to drive the lifting and lowering movement of the cooling plate; wherein, the return track has a plurality of conveying wheels configured to convey the workpiece; wherein, the The cooling plate is formed with a plurality of notches recessed inward from its outer edge; and wherein the notches projectively overlap the conveying wheel.

However, the above are only examples of the present invention, and should not limit the scope of the present invention. All simple equivalent changes and modifications made according to the scope of the application for patent of the present invention and the contents of the patent specification are still within the scope of the present invention. within the scope of the invention patent.

100: Process System

11: Process Station

111: Vacuum chamber

111a: between buffers

111b: Coating interval

112: Cathode sputtering target combination

112a: Target

113: Transmission Mechanism

114: Inlet valve

115: Outlet valve

116: Load Out Cavity

117: Load Cavity

118: Pretreatment cavity

12: Reflow equipment

121, 122: Lifting device

123: Return Track

1231: Settlement Section

1232: Climbing segment

1233: hop

100a: Cooling system

100b, 100c: Cooling system

14: Collimating Thermometer

x, y, z: direction

C: vehicle

Claims (3)

A cooling system configured to cool an object to be cooled, the cooling system comprising: a cooling module, including a cooling plate for carrying the object to be cooled, the cooling plate comprising: a plate body having a bearing surface, the The bearing surface has a central area and a peripheral area outside the central area; a first flow channel structure, distributed in the peripheral area, is configured to transport gaseous fluid, and the first flow channel structure has a plurality of flow channel structures distributed in the peripheral area and an opening is formed on a spout on the bearing surface of the plate body, and the setting position of the spout avoids the central area; and a second flow channel structure is embedded in the plate body and corresponding to the central area, and is arranged to deliver liquid fluid to control the temperature of the cooling plate, so that the temperature of the cooling plate is not higher than the dew point temperature of the environment where the cooling plate is located, thereby causing the cooling plate to condense; wherein, the cooling system It further includes a fluid supply system configured to supply the gaseous fluid and the liquid fluid to the first flow channel structure and the second flow channel structure of the cooling plate, respectively, wherein the fluid supply system It is further configured to allow the gaseous fluid to be released from the bearing surface through the nozzle during the period when the cooling plate is in contact with the object to be cooled, and to control the pressure of the gaseous fluid so as not to In the case of making the object to be cooled air float, make at least the dew formed on the cooling plate A part is concentrated to the central area through the gap between the object to be cooled and the bearing surface. The cooling system of claim 1, wherein, in a direction orthogonal to the peripheral region, the width of the plate body is smaller than the width of the object to be cooled. The cooling system according to claim 1, further comprising: a sensing module connected to the processing module by a signal, the sensing module is configured to sense at least one of a temperature state and a humidity state of the environment , and generate a sensing result; wherein, the processing module is further configured to obtain the dew point temperature condition of the environment according to the sensing result, and control the temperature setting of the cooling plate according to the dew point temperature condition.

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