TWI753549B - Manufacturing method of display device and display device - Google Patents

Abstract

The subject of the present invention is to appropriately display an image while suppressing an increase in the workload of manufacturing even when a defect occurs. The present manufacturing method includes: a detection step of detecting defective inorganic light-emitting elements 102 a from a plurality of inorganic light-emitting elements 102 formed on the formation substrate 200 ; The inorganic light-emitting element 102 other than the defective inorganic light-emitting element 102a is mounted on the array substrate 2; in the second mounting step, the substitute inorganic light-emitting element 102W that emits light of a different color from the defective inorganic light-emitting element 102a is mounted on the array substrate 2 and a filter portion forming step of forming a filter portion 96 at a position overlapping the replacement inorganic light emitting element 102W when viewed from the traveling direction of the light from the inorganic light emitting element 102 on the array substrate 2, the filter portion 96 The device portion 96 emits the light from the replacement inorganic light emitting element 102W as the light of the same color as the light from the defective inorganic light emitting element 102a.

Description

Manufacturing method of display device and display device

The present invention relates to a manufacturing method of a display device and a display device.

In recent years, a display device using a micro-sized light emitting diode (micro LED) as a display element has been attracting attention. For example, Patent Document 1 discloses a display device that expresses red by superimposing a red color filter on a light-emitting diode that emits white light. [Prior Art Literature] [Patent Literature]

[Patent Document 1] US Patent Application Publication No. 2018/0206299

[Problems to be Solved by Invention]

Here, the light-emitting diode is fabricated on, for example, a substrate, and then mounted on an array substrate (backplane) of the display device 1 . Light-emitting diodes are sometimes manufactured as defective products that cannot emit light properly, and if such defective products are mounted on a display device, there is a possibility that the display device cannot properly display an image. Other light-emitting diodes can also be mounted on the display device instead of defective products, but the workload of the mounting step may increase. Therefore, even when a defective light-emitting diode is manufactured, it is possible to suppress the increase in the manufacturing workload and to provide a display device that appropriately displays an image.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a display device and a method of manufacturing the display device which can suppress the increase in the manufacturing workload and appropriately display an image even when a defect occurs. [Technical means to solve problems]

A method of manufacturing a display device according to one aspect of the present invention is a method of manufacturing a display device including an array substrate and a plurality of inorganic light-emitting elements arranged in a matrix, and includes a detection step, which is formed from a plurality of the above-mentioned inorganic light-emitting elements formed on the forming substrate. Inorganic light-emitting element, the inorganic light-emitting element that has been detected as defective is a defective inorganic light-emitting element; and a first mounting step, which mounts the inorganic light-emitting element other than the defective inorganic light-emitting element among the inorganic light-emitting elements formed on the formation substrate. on the above-mentioned array substrate; a second mounting step of mounting a substitute inorganic light-emitting element that emits light of a different color from the defective inorganic light-emitting element on the above-mentioned array substrate; and a filter portion forming step, which is performed in the same manner as the above-mentioned substitute inorganic light-emitting element The position where the inorganic light emitting elements are overlapped forms a filter portion that emits light from the replacement inorganic light emitting element as light of the same color as the light from the defective inorganic light emitting element.

A display device according to an aspect of the present invention is a display device including a plurality of inorganic light-emitting elements arranged in a matrix, and the plurality of inorganic light-emitting elements include: an inorganic light-emitting element that emits light of a specific color; and an alternative inorganic light-emitting element that Emits light of a different color from the light of the specific color; and the display device is provided with a filter portion, the filter portion is arranged in a position overlapping with the substitute inorganic light emitting element, and the light from the substitute inorganic light emitting element is set as The light of the same color as the light of the above-mentioned specific color is emitted.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings. In addition, the disclosure is merely an example, and those skilled in the art can easily conceive of appropriate modifications to ensure the gist of the invention, and are of course included in the scope of the present invention. In addition, in order to clarify the description, the drawings may schematically show the width, thickness, shape, etc. of each part compared with the actual state, but this is only an example and is not intended to limit the interpretation of the present invention. In addition, in this specification and each drawing, the same code|symbol is attached|subjected to the same element as the one mentioned above with respect to the drawing which appeared, and a detailed description may be abbreviate|omitted suitably.

(Configuration of display device) FIG. 1 is a plan view showing a configuration example of the display device of the present embodiment. As shown in FIG. 1 , the display device 1 includes an array substrate 2 , pixels Pix, a driving circuit 12 , a driving IC (Integrated Circuit) 210 , and a cathode wiring 60 . The array substrate 2 is a driving circuit substrate for driving each pixel Pix, and is also called a backplane or an active matrix substrate. The array substrate 2 includes a substrate 10 , a plurality of transistors, a plurality of capacitors, various wirings, and the like.

As shown in FIG. 1 , the display device 1 has a display area AA and a peripheral area GA. The display area AA is an area where a plurality of pixels Pix are arranged, that is, an area where an image is displayed. The peripheral area GA is an area that does not overlap with the plurality of pixels Pix, and is disposed outside the display area AA.

A plurality of pixels Pix are arranged in the first direction Dx and the second direction Dy in the display area AA of the substrate 10 . In addition, the first direction Dx and the second direction Dy are directions parallel to the first surface 10 a (see FIG. 4 ) of the substrate 10 of the array substrate 2 . The first direction Dx is orthogonal to the second direction Dy. However, the first direction Dx may not intersect the second direction Dy at right angles. The third direction Dz is a direction orthogonal to the first direction Dx and the second direction Dy. The third direction Dz corresponds to, for example, the normal direction of the substrate 10 . Hereinafter, the plan view shows the positional relationship of the state viewed from the third direction Dz.

The driving circuit 12 is disposed in the peripheral area GA of the substrate 10 . The driving circuit 12 drives a plurality of gate lines (eg, the light emission control scan line BG, the reset control scan line RG, the initialization control scan line IG, and the write control scan line SG (see FIG. 3 ) based on various control signals from the drive IC 210 . ) circuit. The driving circuit 12 selects a plurality of gate lines sequentially or simultaneously, and supplies gate driving signals to the selected gate lines. Thereby, the driving circuit 12 selects a plurality of pixels Pix connected to the gate lines.

The driving IC 210 is a circuit for controlling the display of the display device 1 . The driving IC 210 may be mounted on the peripheral area GA of the substrate 10 as a COG (Chip On Glass: chip on glass). Not limited to this, the driver IC 210 may also be mounted on the wiring substrate connected to the peripheral area GA of the substrate 10 as a COF (Chip On Film). In addition, the wiring board connected to the board|substrate 10 is, for example, a flexible printed circuit board (FPC (Flexible Printed Circuit) board) or a rigid board (PCB (Printed Circuit Board: printed circuit board) board).

The cathode wiring 60 is provided in the peripheral area GA of the substrate 10 . The cathode wiring 60 is provided to surround the plurality of pixels Pix in the display area AA and the driving circuit 12 in the peripheral area GA. The cathodes (cathode electrodes 114 (see FIG. 4 )) of the plurality of inorganic light-emitting bodies 100 (see FIG. 4 ) are connected to the common cathode wiring 60 and supplied with a fixed potential (eg, ground potential). More specifically, the cathode electrode 114 of the inorganic light-emitting body 100 is connected to the cathode wiring 60 via the opposite cathode electrode 90 e on the array substrate 2 . In addition, the cathode wiring 60 may have a slit in a part, and may be formed by two different wirings on the substrate 10 .

FIG. 2 is a top view showing a plurality of pixels. As shown in FIG. 2 , one pixel Pix includes a plurality of pixels 49 . For example, the pixel Pix has a first pixel 49R, a second pixel 49G, and a third pixel 49B. The first pixel 49R displays red, which is the primary color of the first color. The second pixel 49G displays green as the primary color of the second color. The third pixel 49B displays blue which is the primary color of the third color. As shown in FIG. 2 , in one pixel Pix, the first pixel 49R and the third pixel 49B are arranged in the first direction Dx. In addition, the second pixel 49G and the third pixel 49B are arranged in the second direction Dy. In addition, the first color, the second color, and the third color are not limited to red, green, and blue, respectively, and arbitrary colors such as complementary colors may be selected. Hereinafter, when it is not necessary to distinguish the first pixel 49R, the second pixel 49G, and the third pixel 49B, it is referred to as the pixel 49 . In addition, the number of pixels 49 included in one pixel Pix is not limited to three, and four or more pixels 49 may be associated with each other. In addition, the arrangement of the plurality of pixels 49 is not limited to the configuration shown in FIG. 2 . For example, the first pixel 49R may be adjacent to the second pixel 49G in the first direction Dx. In addition, the first pixel 49R, the second pixel 49G, and the third pixel 49B may be repeatedly arranged in the first direction Dx in this order.

Each of the pixels 49 includes the inorganic light-emitting body 100 having the inorganic light-emitting element 102 . The display device 1 displays an image by emitting different light for each inorganic light-emitting body 100 in the first pixel 49R, the second pixel 49G, and the third pixel 49B. The inorganic light-emitting body 100 is an inorganic light-emitting diode (LED: Light Emitting Diode) chip having a size of several μm or more and 300 μm or less in a plan view. Generally speaking, a chip with a size of 100 μm or more is called a miniature chip. LEDs (miniLEDs), those with a size of less than 100 μm to several μm are called micro LEDs (micro LEDs). In the present invention, LEDs of any size can also be used, as long as they are used separately according to the screen size (size of one pixel) of the display device. A display device having a micro LED (micro LED) in each pixel is also called a micro LED display device. In addition, the micro size of the micro LED is not limited to the size of the inorganic light-emitting body 100 .

FIG. 3 is a circuit diagram showing a configuration example of a pixel circuit of a display device. The pixel circuit PICA shown in FIG. 3 is provided in each of the first pixel 49R, the second pixel 49G, and the third pixel 49B. The pixel circuit PICA is disposed on the substrate 10 and supplies the driving signal (current) to the circuit of the inorganic light-emitting body 100 . In addition, in FIG. 3, the description about the pixel circuit PICA can be applied to the pixel circuit PICA which each of the 1st pixel 49R, the 2nd pixel 49G, and the 3rd pixel 49B has.

As shown in FIG. 3 , the pixel circuit PICA includes an inorganic light-emitting body 100 , five transistors, and two capacitors. Specifically, the pixel circuit PICA includes a light emission control transistor BCT, an initialization transistor IST, a write transistor SST, a reset transistor RST, and a drive transistor DRT. A part of the transistors can be shared by a plurality of adjacent pixels 49 . For example, the light emission control transistor BCT may be shared by the three pixels 49 via a common wiring. In addition, the reset transistor RST may also be disposed in the peripheral area GA, for example, one in each column of the pixel 49 . In this case, the reset transistor RST is connected to the sources of the plurality of driving transistors DRT through the common wiring.

The plurality of transistors included in the pixel circuit PICA are each constituted by an n-type TFT (Thin Film Transistor). However, it is not limited to this, and each transistor may be constituted by a p-type TFT, respectively. In the case of using a p-type TFT, the power supply potential or the connection of the holding capacitor Cs1 and the capacitor Cs2 can be appropriately adapted.

The light-emitting control scan line BG is connected to the gate of the light-emitting control transistor BCT. The initialization control scan line IG is connected to the gate of the initialization transistor IST. The write control scan line SG is connected to the gate of the write transistor SST. The reset control scan line RG is connected to the gate of the reset transistor RST.

The light emission control scan line BG, the initialization control scan line IG, the write control scan line SG, and the reset control scan line RG are respectively connected to the driving circuit 12 (see FIG. 1 ). The drive circuit 12 supplies the light emission control signal Vbg, the initialization control signal Vig, the write control signal Vsg, and the reset control to the light emission control scan line BG, the initialization control scan line IG, the write control scan line SG, and the reset control scan line RG, respectively. signal Vrg.

The drive IC 210 (see FIG. 1 ) supplies the video signal Vsig to each of the pixel circuits PICA of the first pixel 49R, the second pixel 49G, and the third pixel 49B in a time-divisional manner. A switch circuit such as a multiplexer is provided between each row of the first pixel 49R, the second pixel 49G, and the third pixel 49B, and the driver IC 210 . The video signal Vsig is supplied to the write transistor SST via the video signal line L2. Further, the drive IC 210 supplies the reset power supply potential Vrst to the reset transistor RST via the reset signal line L3. The drive IC 210 supplies the initialization potential Vini to the initialization transistor IST via the initialization signal line L4.

The light emission control transistor BCT, the initialization transistor IST, the write transistor SST, and the reset transistor RST function as switching elements for selecting conduction and non-conduction between the two nodes. The driving transistor DRT functions as a current control element that controls the current flowing in the inorganic light-emitting body 100 according to the voltage between the gate and the drain.

The cathode (cathode electrode 114) of the inorganic light-emitting body 100 is connected to the cathode power supply line L10. In addition, the anode (anode electrode 112) of the inorganic light-emitting body 100 is connected to the anode power supply line L1 (first power supply line) via the drive transistor DRT and the light emission control transistor BCT. The anode power supply potential PVDD (first potential) is supplied to the anode power supply line L1. The cathode power supply potential PVSS (second potential) is supplied to the cathode power supply line L10. The anode power supply potential PVDD is higher than the cathode power supply potential PVSS. The cathode power supply line L10 includes the cathode wiring 60 .

In addition, the pixel circuit PICA includes a capacitor Cs1 and a capacitor Cs2. The capacitor Cs1 is a holding capacitor formed between the gate electrode and the source electrode of the driving transistor DRT. The capacitor Cs2 is an additional capacitor formed between the source electrode of the driving transistor DRT, the anode electrode of the inorganic light-emitting body 100, and the cathode power supply line L10.

The display device 1 drives the first row of pixels 49 to the last row of pixels 49 to display an image corresponding to one frame during one frame period.

During the reset period, the potential of the light emission control scan line BG is at L (low) level, and the potential of the reset control scan line RG is at H (high) level by the control signals supplied from the driving circuit 12 . Thereby, the light emission control transistor BCT is turned off (non-conducting state), and the reset transistor RST is turned on (conducting state).

During the reset period, the potential of the light emission control scan line BG is at L (low) level, and the potential of the reset control scan line RG is at H (high) level by the control signals supplied from the driving circuit 12 . Thereby, the light emission control transistor BCT is turned off (non-conducting state), and the reset transistor RST is turned on (conducting state).

Thereby, the electric charge remaining in the pixel 49 flows to the outside through the reset transistor RST, and the source of the drive transistor DRT is fixed to the reset power supply potential Vrst. The reset power supply potential Vrst is set to have a specific potential difference with respect to the cathode power supply potential PVSS. In this case, the potential difference between the reset power supply potential Vrst and the cathode power supply potential PVSS is smaller than the potential difference at which the inorganic light-emitting body 100 starts to emit light.

Next, the potential of the control scan line IG is initialized to the H level by each control signal supplied from the drive circuit 12 . The initialization transistor IST is turned on. Through the initialization transistor IST, the gate of the driving transistor DRT is fixed to the initialization potential Vini.

In addition, the drive circuit 12 turns on the light emission control transistor BCT and turns off the reset transistor RST. When the source potential becomes (Vini-Vth), the driving transistor DRT is turned off. Thereby, the threshold voltage Vth of the driving transistor DRT can be obtained for each pixel 49 and the deviation of the threshold voltage Vth of each pixel 49 can be compensated.

Next, during the video signal writing operation period, the light-emitting control transistor BCT is turned off, the initialization transistor IST is turned off, and the writing transistor SST is turned on by each control signal supplied from the driving circuit 12 . In the pixels 49 belonging to one column, the video signal Vsig is input to the gate of the driving transistor DRT. The video signal line L2 extends along the second direction Dy, and is connected to a plurality of rows of pixels 49 belonging to the same row. Therefore, the video signal writing operation period is performed for each column.

Next, during the light-emitting operation period, the light-emitting control transistor BCT is turned on and the writing transistor SST is turned off by the respective control signals supplied from the driving circuit 12 . The anode power supply potential PVDD is supplied to the drive transistor DRT from the anode power supply line L1 via the light emission control transistor BCT. The driving transistor DRT supplies a current corresponding to the voltage between the gate and the source to the inorganic light-emitting body 100 . The inorganic light-emitting body 100 emits light with a brightness corresponding to the current.

In addition, the driving circuit 12 can drive the pixels 49 for every one column, simultaneously drive the pixels 49 in two columns, or simultaneously drive the pixels 49 in three or more columns.

In addition, the structure of the pixel circuit PICA shown in FIG. 3 mentioned above is only an example, and it can change suitably. For example, the number of wirings and the number of transistors in one pixel 49 may be different. In addition, the pixel circuit PICA may be constituted by a current mirror circuit or the like.

Fig. 4 is a cross-sectional view taken along line IV-IV' of Fig. 1 . As shown in FIG. 4 , the array substrate 2 of the display device 1 includes a substrate 10 and a plurality of transistors. The board|substrate 10 has the 1st surface 10a, and the 2nd surface 10b on the opposite side to the 1st surface 10a. The substrate 10 is an insulating substrate, such as a glass substrate, a quartz substrate, or a flexible substrate made of acrylic resin, epoxy resin, polyimide resin, or polyethylene terephthalate (PET) resin.

In addition, in this specification, in the direction perpendicular to the surface of the substrate 10, the direction from the substrate 10 toward the inorganic light-emitting body 100 is referred to as "upper side" or simply referred to as "upper side". In addition, the direction from the inorganic light-emitting body 100 toward the substrate 10 is referred to as "lower side" or simply referred to as "downward". In addition, when expressing the state of arranging other structures on top of a certain structure, when it is only expressed as "on", unless otherwise specified, it includes the way of connecting with a certain structure and arranging other structures directly above Both the case of a structure and the case of arranging other structures above a structure with another structure in between.

The primer layer 20 is provided on the first surface 10 a of the substrate 10 . A plurality of transistors are provided on the undercoat layer 20 . For example, in the display area AA of the substrate 10 , as a plurality of transistors, the driving transistor DRT and the writing transistor SST included in the pixel 49 are respectively provided. In the peripheral area GA of the substrate 10, as a plurality of transistors, the transistors TrC included in the driving circuit 12 are provided. In addition, although the driving transistor DRT, the writing transistor SST, and the transistor TrC among the plurality of transistors are shown, the light-emitting control transistor BCT, the initialization transistor IST, and the reset transistor RST included in the pixel circuit PICA are also It has the same multilayer structure as the drive transistor DRT. In addition, in the following description, when there is no need to distinguish and describe a plurality of transistors, only the transistor Tr is shown.

The transistor Tr is, for example, a TFT having a double-sided gate structure. Each of the transistors Tr has a first gate electrode 21, a second gate electrode 31, a semiconductor layer 25, a source electrode 41s, and a drain electrode 41d. The first gate electrode 21 is provided on the undercoat layer 20 . The insulating film 24 is provided on the primer layer 20 and covers the first gate electrode 21 . The semiconductor layer 25 is provided on the insulating film 24 . The semiconductor layer 25 uses, for example, polysilicon. However, the semiconductor layer 25 is not limited to this, and may be a microcrystalline oxide semiconductor, an amorphous oxide semiconductor, a low temperature polysilicon, or the like. The insulating film 29 is provided on the semiconductor layer 25 . The second gate electrode 31 is provided on the insulating film 29 .

The undercoat layer 20 and the insulating films 24, 29, and 45 are inorganic insulating films, including, for example, silicon oxide (SiO ₂ ) or silicon nitride (SiN). In the third direction Dz, the first gate electrode 21 and the second gate electrode 31 face each other with the insulating film 24 , the semiconductor layer 25 and the insulating film 29 interposed therebetween. In the insulating films 24 and 29, the portion sandwiched between the first gate electrode 21 and the second gate electrode 31 functions as a gate insulating film. In addition, in the semiconductor layer 25, the portion sandwiched between the first gate electrode 21 and the second gate electrode 31 becomes the channel region 27 of the transistor Tr. In the semiconductor layer 25, the part connected to the source electrode 41s is the source region of the transistor Tr, and the part connected to the drain electrode 41d is the drain region of the transistor Tr. Low-concentration impurity regions are respectively provided between the channel region 27 and the source region and between the channel region 27 and the drain region. Also, as the transistor Tr, only n-type TFTs are shown, but p-type TFTs may be formed at the same time.

The gate line 31a is connected to the second gate electrode 31 of the driving transistor DRT. An insulating film 29 is provided between the substrate 10 and the gate line 31 a , and a capacitor CS is formed between the gate line 31 a and the substrate 10 . The first gate electrode 21, the second gate electrode 31, and the gate line 31a are formed of, for example, aluminum (Al), copper (Cu), silver (Ag), molybdenum (Mo), or an alloy film of these.

In the present embodiment, the transistor Tr is not limited to a double-sided gate structure. The transistor Tr may be a bottom gate type in which only the first gate electrode 21 constitutes a gate electrode. In addition, the transistor Tr may be a top gate type in which only the second gate electrode 31 constitutes a gate electrode. In addition, the primer layer 20 may not be provided.

The display device 1 has an insulating film 35 disposed on the first surface 10a of the substrate 10 and covering a plurality of transistors Tr. The source electrode 41 s is provided on the insulating film 35 , and is connected to the respective sources of the plurality of transistors Tr through through holes provided in the insulating film 35 . The drain electrode 41 d is provided on the insulating film 35 , and is connected to the drain electrodes of the plurality of transistors Tr through through holes provided in the insulating film 35 . In the peripheral area GA, the cathode wiring 60 is provided on the insulating film 35 . The insulating film 42 covers the source electrode 41 s , the drain electrode 41 d , and the cathode wiring 60 . The insulating film 35 is an inorganic insulating film, and the insulating film 42 is an organic insulating film. The source electrode 41s and the drain electrode 41d are formed of a laminated structure of titanium and aluminum, that is, a laminated film of TiAlTi or TiAl. In addition, an organic material such as photosensitive acryl is used for the insulating film 42 .

A part of the source electrode 41s is formed in a region overlapping with the gate line 31a. A capacitor Cs1 is formed by the gate line 31 a and the source electrode 41 s facing each other through the insulating film 35 . Also, the gate line 31 a is formed in a region partially overlapping with a portion of the semiconductor layer 25 . The capacitor Cs1 also includes a capacitor formed by the opposite semiconductor layer 25 and the gate line 31 a through the insulating film 24 .

The display device 1 includes a source connection wiring 43s, a drain connection wiring 43d, an insulating film 45, an opposite anode electrode 50e, an insulating film 66, a connection layer 50f, an inorganic light-emitting body 100, an insulating film 70, a planarizing film 80, an opposite The cathode electrode 90 e , the planarizing film 92 , and the lid portion 94 . The source connection wiring 43 s is provided on the insulating film 42 , and is connected to the source electrode 41 s through a through hole provided in the insulating film 42 . The drain connection wiring 43 d is provided on the insulating film 42 , and is connected to the drain electrode 41 d through a through hole provided in the insulating film 42 . The insulating film 45 is provided on the insulating film 42 and covers the source connection wiring 43s and the drain connection wiring 43d. The opposing anode electrode 50e is provided on the insulating film 45, and is connected to the drain connection wiring 43d of the driving transistor DRT through a through hole provided in the insulating film 45. The source connection wiring 43s and the drain connection wiring 43d are formed of, for example, a transparent conductor such as indium tin oxide (ITO, Indium Tin Oxide).

The insulating film 66 is provided on the insulating film 45 to cover the opposite anode electrode 50e. The connection layer 50 f is provided on the insulating film 66 , and is connected to the opposite anode electrode 50 e through a through hole provided in the insulating film 66 . The inorganic light-emitting body 100 is disposed on the connection layer 50f, and the opposite anode electrode 50e is connected to the anode electrode 112 of the inorganic light-emitting body 100 through the connection layer 50f. A capacitor Cs2 is formed between the opposing anode electrode 50e and the source connection wiring 43s opposite to each other through the insulating film 45 .

The insulating film 70 is disposed on the insulating film 66 and covers the connection layer 50f and the side surface of the anode electrode 112 of the inorganic light-emitting body 100 . The insulating film 70 has an opening for mounting the inorganic light-emitting body 100 at a position overlapping the anode electrode 112 . The planarizing film 80 is disposed on the insulating film 70 and covers the side surface of the inorganic light-emitting body 100 . The opposing cathode electrode 90 e is provided on the planarizing film 80 . The insulating film 70 is an inorganic insulating film, and includes, for example, a silicon nitride film (SiN). The planarizing film 80 is an organic insulating film or an inorganic-organic hybrid insulating film (a material such as an organic group (methyl group or phenyl group) is linked to the Si—O main chain). The upper surface (cathode electrode 114 ) of the inorganic light-emitting body 100 is exposed from the planarizing film 80 . The opposite cathode electrode 90e is connected to the cathode electrode 114 of the inorganic light-emitting body 100 . In addition, the laminated structure of FIG. 4 is an example. For example, the insulating film 70 may not be provided. For another example, the insulating film 66 and the connection layer 50f may not be provided, and in this case, for example, the opposite anode electrode 50e and the anode electrode 112 are directly connected.

The opposite cathode electrode 90e is connected to the cathode wiring 60 provided on the side of the array substrate 2 through the contact hole CH1 provided on the outer side of the display area AA. Specifically, the contact hole CH1 is provided in the planarizing film 80 and the insulating film 42, and the cathode wiring 14 is provided on the bottom surface of the contact hole CH1. The cathode wiring 60 is provided on the insulating film 35 . That is, the cathode wiring 60 is provided in the same layer as the source electrode 41s and the drain electrode 41d, and is formed of the same material. The opposite cathode electrode 90e is continuously disposed from the display area AA to the peripheral area GA, and is connected to the cathode wiring 60 at the bottom of the contact hole CH1.

The planarizing film 92 is provided on the opposite cathode electrode 90e. The planarizing film 92 is a light-transmitting insulating film, and may be an organic insulating film, an inorganic insulating film, a laminate of an inorganic insulating film and an organic insulating film, or the like. The cover portion 94 is provided on the planarizing film 92 . The cover portion 94 is a cover provided on the uppermost side of the display device 1 . The cover portion 94 is a translucent member, such as a cover glass. However, the planarizing film 92 and the lid portion 94 are not necessarily required.

Next, the configuration of the inorganic light-emitting body 100 will be described. FIG. 5 is a cross-sectional view showing a configuration example of the inorganic light-emitting body of the present embodiment. As shown in FIG. 5 , the inorganic light-emitting body 100 includes the inorganic light-emitting element 102 , the anode electrode 112 , and the cathode electrode 114 . Here, although the inorganic light emitting element 102 , the anode electrode 112 and the cathode electrode 114 are distinguished, the anode electrode 112 and the cathode electrode 114 may also be included as the inorganic light emitting element 102 .

The inorganic light-emitting element 102 is a light-emitting layer that emits light. The inorganic light-emitting element 102 has an n-type cladding layer 104 , a p-type cladding layer 106 , and a light-emitting layer 108 provided between the p-type cladding layer 106 and the n-type cladding layer 104 . In this embodiment, the inorganic light-emitting element 102 is configured by laminating the p-type cladding layer 106 , the light-emitting layer 108 , and the n-type cladding layer 104 in this order toward the upper side. As the inorganic light-emitting element 102, a compound semiconductor such as gallium nitride (GaN), aluminum indium gallium phosphide (AlInGaP), aluminum gallium arsenide (AlGaAs), or gallium arsenide phosphide (GaAsP) is used. Furthermore, in this embodiment, gallium nitride (GaN) or the like is used for the p-type cladding layer 106 and the n-type cladding layer 104 . In addition, as the light-emitting layer 108, indium gallium nitride (InGaN) or the like is used. The light-emitting layer 108 may also be a multiple quantum well structure (MQW: Multiple Quantum Well) in which InGaN and GaN are stacked.

An anode electrode 112 , a p-type cladding layer 106 , a light-emitting layer 108 , an n-type cladding layer 104 , and a cathode electrode 114 are laminated in this order toward the upper side of the inorganic light-emitting body 100 . Below the inorganic light-emitting body 100 , the opposite anode electrode 50 e is disposed, and above the inorganic light-emitting body 100 , the opposite cathode electrode 90 e is disposed.

The opposite anode electrode 50e includes a conductive member, which is a metal material here. In the present embodiment, the opposing anode electrode 50e contains titanium (Ti) and aluminum (Al), and for example, a titanium layer and an aluminum layer are laminated in the third direction Dz. The opposite anode electrode 50e is provided on each of the inorganic light-emitting bodies 100 (pixels 49) as a pixel electrode.

The anode electrode 110 is provided on the opposite anode electrode 50e. The anode electrode 110 is a light-transmitting conductive member, such as ITO. The anode electrode 110 is electrically connected to the opposite anode electrode 50e. On the anode electrode 110, a p-type cladding layer 106 is provided. The anode electrode 110 is connected to the p-type cladding layer 106 .

The cathode electrode 114 is provided on the n-type cladding layer 104 . The cathode electrode 114 is a light-transmitting conductive member, such as ITO. The cathode electrode 114 is connected to the opposite cathode electrode 90e.

The opposite cathode electrode 90e serving as the opposite electrode is a light-transmitting conductive member, such as ITO. The opposite cathode electrode 90e is provided in common to the common electrodes of the plural (here, all) inorganic light-emitting bodies 100 (pixels 49 ), and is connected to the cathode electrodes 114 of the plural (here, all) inorganic light-emitting bodies 100 .

In this embodiment, the display device 1 includes, as the inorganic light-emitting body 100 (inorganic light-emitting element 102 ), a first inorganic light-emitting body 100R (first inorganic light-emitting element 102R) that emits light _LR of a first color, and a first inorganic light-emitting body 100R (first inorganic light-emitting element 102R) that emits light of a second color. The second inorganic light-emitting body 100G (second inorganic light-emitting element 102G) that emits light _LG , and the third inorganic light _- emitting body 100B (third inorganic light-emitting element 102B) that emits light LB of the third color. The first inorganic light-emitting body 100R, the second inorganic light-emitting body 100G, and the third inorganic light-emitting body 100B respectively emit light of the first color _LR and light of the second color due to the difference in the composition ratio of materials in the inorganic light-emitting element 102 , respectively. Light _LG and light of different colors of light _LB of the third color. The light L _R of the first color emitted by the first inorganic light-emitting body 100R is light in the first wavelength band, and the first wavelength band is, for example, 620 nm or more and less than 750 nm. In addition, the light of the first wavelength band refers to the light of at least one wavelength within the wavelength range of the first wavelength band, and the same applies to the light of other wavelength bands. The light _LG of the second color emitted by the second inorganic light-emitting body 100G is light in the second wavelength band, and the second wavelength band is, for example, 495 nm or more and less than 570 nm. The light L _B of the third color emitted by the third inorganic light-emitting body 100B is light in the third wavelength band, and the third wavelength band is, for example, 450 nm or more and less than 495 nm.

Here, the inorganic light emitting element 102 is formed on a substrate different from the array substrate 2 , that is, on the formation substrate, and migrates from the formation substrate to the array substrate 2 . When the inorganic light-emitting element 102 is formed on the formation substrate, it may become defective due to, for example, manufacturing defects. The defect here refers to a case where the inorganic light emitting element 102 does not emit light properly, or a case where a defect or the like is formed even in a case where the inorganic light emitting element 102 emits light properly, and the light emission becomes defective in a short period of time. Hereinafter, the defective inorganic light-emitting element 102 (inorganic light-emitting body 100 ) is described as the defective inorganic light-emitting element 102 a (defective inorganic light-emitting body 100 a ). If the defective inorganic light emitting element 102a is migrated to the array substrate 2, the display device 1 may not be able to properly display images and other quality problems due to poor light emission of the defective inorganic light emitting element 102a. Therefore, in this embodiment, instead of mounting the defective inorganic light-emitting element 102a on the array substrate 2, as a substitute inorganic light-emitting element 102, the substitute inorganic light-emitting element 102W is mounted on the array substrate 2 to form a substitute inorganic light-emitting body 100. Replacing the inorganic luminophore 100W.

The substitute inorganic light-emitting body 100W (the substitute inorganic light-emitting element 102W) is the inorganic light-emitting body 100 (the inorganic light-emitting element 102 ) that emits light L _W of a substitute color. The substitute color is light of a different color from the first color, the second color, and the third color, and in this embodiment, it is also referred to as the light synthesized by the light of the first color, the light of the second color, and the light of the third color . The alternative color is white light in this embodiment. The alternative color light LB emitted by the alternative inorganic light _- emitting body 100W includes light in the wavelength range of the first wavelength band, the second wavelength band, and the third wavelength band. The substitute inorganic light-emitting body 100W does not include a plurality of inorganic light-emitting bodies, but uses one inorganic light-emitting body to emit light of a substitute color (here, white). The alternative inorganic light-emitting body 100W has, as the light-emitting layer 108, a light-emitting layer composed of a multi-quantum well structure (MQW). The light-emitting layer 108 that replaces the inorganic light-emitting body 100W is formed by, for example, laminating a plurality of barrier layers and well layers. The well layer may be formed of, for example, a group III nitride semiconductor material containing gallium, and may be formed of gallium nitride or a mixed crystal of gallium nitride and indium nitride. The barrier layer may also be formed of, for example, a material with a band gap energy greater than that of the well layer, and may be formed of a group III nitride semiconductor material such as gallium nitride. However, the material and configuration of the alternative inorganic light-emitting body 100W are not limited to this as long as the alternative color can be emitted.

In addition, the display device 1 is provided with a filter portion 96 that is a color filter on the inorganic light-emitting body 100W in place of it. The filter portion 96 transmits the light of the same color as the light emitted by the defective inorganic light emitting element 102 a when the light of the substitute color L _W from the substitute inorganic light emitting body 100 W is normal, in other words, the light of the same color as the normal light mounted on the display device 1 . light of the same color as one of the inorganic light-emitting elements 102 . Here, the light of the same color refers to the light within the same wavelength range. It can be said that the filter portion 96 transmits the light within the same wavelength range as the light normally emitted by the defective inorganic light-emitting element 102a. Light of the same wavelength band as one of the other inorganic light-emitting elements 102 of the device 1 . Hereinafter, it demonstrates concretely.

FIG. 6 and FIG. 7 are schematic diagrams showing an example of a case where a substitute inorganic light-emitting body is mounted. FIG. 6 is a schematic view showing the state of the replacement inorganic light-emitting body 100W of the display device 1 from above, and FIG. 7 is a schematic cross-sectional view of the vicinity of the replacement inorganic light-emitting body 100W of the display device 1 . As shown in FIG. 6 , the replacement inorganic light-emitting body 100W is arranged in a matrix with the inorganic light-emitting body 100 other than the defective inorganic light-emitting body 100a, and as shown in FIG. 7, the inorganic light-emitting body 100 other than the defective inorganic light-emitting body 100a is arranged in the same place layer. The replacement inorganic light-emitting body 100W is mounted on the position where the defective inorganic light-emitting body 100a is intended to be mounted. 7 shows an example of a case where one first inorganic light-emitting body 100R is detected as a defective inorganic light-emitting body 100a. Therefore, in the example of FIG. 7 , the substitute inorganic light-emitting body 100W is mounted at the position where the first inorganic light-emitting body 100R detected as the defective inorganic light-emitting body 100a is to be mounted.

As shown in FIG. 7 , a filter portion 96 is provided on the substitute inorganic light-emitting body 100W. The filter portion 96 is disposed so as to overlap with the alternative inorganic light-emitting body 100W in plan view, and does not overlap with the inorganic light-emitting body 100 other than the alternative inorganic light-emitting body 100W. The filter portion 96 absorbs the light of the wavelength band (color) different from the light from the defective inorganic light-emitting body 100a replaced by the replacement inorganic light-emitting body 100W among the light _LW of the replacement color from the replacement inorganic light-emitting body 100W, and transmits the light of the wavelength (color) different from the light from the defective inorganic light-emitting body 100a replaced by the replacement inorganic light-emitting body 100W. The light of the same wavelength band (color) as the light of the defective inorganic light-emitting element 102a in place of the inorganic light-emitting body 100W is replaced. As shown in FIG. 7 , when the defective inorganic light-emitting element 102a is the first inorganic light-emitting element 102R, a filter is provided as the filter portion 96 overlapping the replacement inorganic light-emitting body 100W of the defective inorganic light-emitting element 102a Section 96R. The filter portion _96R blocks the light of colors other than the first color (outside the first wavelength range) from the light LW of the replacement color of the replacement inorganic light-emitting body 100W, and transmits the first color (within the first wavelength range) Light. When the defective inorganic light emitting element 102a is the second inorganic light emitting element 102G, a filter portion 96G is provided as the filter portion 96 overlapping the replacement inorganic light emitting body 100W of the defective inorganic light emitting element 102a. The filter portion _96G blocks light of colors other than the second color (outside the range of the second wavelength band) in the light LW of the substitute color from the substitute inorganic light-emitting body 100W, and transmits the light of the second color (in the range of the second wavelength band) )Light. When the defective inorganic light emitting element 102a is the third inorganic light emitting element 102B, a filter portion 96B is provided as the filter portion 96 overlapping the replacement inorganic light emitting body 100W of the defective inorganic light emitting element 102a. The filter portion 96B blocks light of colors other than the third color (outside the range of the third wavelength band) from the light _LW of the substitute color of the substitute inorganic light-emitting body 100W, and transmits the light of the third color (within the range of the third wavelength band) Light. In addition, as a material of the filter part 96, the color filter corresponding to red, green, and blue is mentioned, for example.

As shown in FIG. 7 , the light L _W emitted by the substitute inorganic light-emitting body 100W is incident on the filter part 96 on the upper side of the substitute inorganic light-emitting body 100W (the filter part 96R in the example of FIG. 7 ), and the filter part 96 Among them, light of the same color as the defective inorganic light emitting element 102a is transmitted, in other words, light of the same color as that of the other inorganic light emitting element 102 mounted on the display device 1 (in the example of FIG. 7 , the same color as the first inorganic light emitting element 102R is transmitted). The first color light L _R ) is emitted to the outside of the display device 1 . In this way, when the display device 1 of the present embodiment does not mount the defective inorganic light-emitting element 102a, the light emitted when the defective inorganic light-emitting element 102a is normally mounted can be irradiated by replacing the inorganic light-emitting body 100W and the color filter portion 96 . of the same color as the light of the same color. In other words, the display device 1 can replace the inorganic light-emitting body 100W and the filter portion 96 with a proxy to form the pixel 49 (the first pixel 49R in the example of FIG. 7 ) that is intended to be composed of the defective inorganic light-emitting element 102a. In this way, according to the present embodiment, since the defective inorganic light emitting element 102a is not mounted, the image display of the display device 1 is suppressed from becoming inappropriate, and the defective inorganic light emitting element 102a can be used instead of the inorganic light emitting body 100W and the filter portion 96 Due to the function of the responsible pixel 49, the image can be properly displayed even when the defective inorganic light-emitting element 102a is not mounted.

It can be said that the display device 1 of this embodiment includes an inorganic light-emitting body 100 that emits light of a specific color, a substitute inorganic light-emitting body 100W that emits light _LW of an alternate color different from the specific color, and a filter portion 96 . The filter portion 96 is disposed at a position overlapping the substitute inorganic light-emitting body 100W in plan view, and transmits light of a specific color in the light L _W from the substitute inorganic light-emitting body 100W. That is, in the display device 1 of the present embodiment, the color of the light emitted from the substitute inorganic light emitting element 102W and transmitted through the filter portion 96 is the same as the color of the light emitted from the other inorganic light emitting element 102 . More specifically, in one pixel Pix in which the replacement inorganic light emitting body 100W and the filter portion 96 are not provided, the first inorganic light emitting body 100R, the second inorganic light emitting body 100G, and the third inorganic light emitting body 100B are provided. On the other hand, in one pixel Pix provided with the replacement inorganic light-emitting body 100W and the filter portion 96, the inorganic light-emitting body 100 that emits light of the same color as the light transmitted through the filter portion 96 is not provided. For example, in the pixel Pix provided with the filter portion 96R, instead of the first inorganic light-emitting body 100R, the substitute inorganic light-emitting body 100W and the filter portion 96R, the second inorganic light-emitting body 100G, and the third inorganic light-emitting body are provided 100B. In addition, if looking at the entire display device 1, the pixel 49 (for example, the first pixel 49R) that displays a specific color (for example, the first color) includes an inorganic light-emitting body 100 (for example, the first pixel 49R) that emits light of the specific color. 1 The pixel 49 of the inorganic light emitting body 100R), the pixel 49 of the light filter portion 96 (eg, the filter portion _96R ) that transmits the light of the alternate color 100W including the alternate phosphor 100W and the light of the specific color.

In addition, in this embodiment, the light L _W of the substitute color from the substitute inorganic light-emitting body 100W includes light of the same wavelength band as the light of the defective inorganic light-emitting element 102a, and the filter portion 96 transmits the light of the substitute color from the substitute inorganic light-emitting body 100W. The light in the wavelength band (color) of the light L _W is the same wavelength band (color) as the wavelength band (color) of the light from the defective inorganic light-emitting element 102a. However, the light L _W of the alternative color may not include light of the same wavelength band as the light of the defective inorganic light-emitting element 102a. In this case, the filter portion 96 may also convert, for example, the wavelength (color) of the light L _W of the substitute color from the substitute inorganic light-emitting body 100W into a wavelength (color) of the same wavelength band (color) as the light from the defective inorganic light-emitting element 102a. wavelength conversion filter. That is, the filter portion 96 only needs to emit light L _W from the replacement inorganic light emitting body 100W as light of the same color as the light from the defective inorganic light emitting element 102a.

(Manufacturing method of display device) Next, a method of manufacturing the display device 1 , and more specifically, a method of replacing the inorganic light-emitting body 100W and the mounting method of the filter portion 96 will be described. FIG. 8 is a diagram illustrating a method of manufacturing the display device of the present embodiment. As shown in step S10 of FIG. 8 , in the manufacturing method of the display device 1 of the present embodiment, the array substrate 2 of the display device 1 is formed. That is, each portion of the display device 1 on the lower side than the anode electrode 112 and the anode electrode 112 are formed. Moreover, in this manufacturing method, the inorganic light-emitting element 102 is formed on the formation substrate 200 different from the array substrate 2 . In this embodiment, the inorganic light-emitting element 102 is formed using a different formation substrate 200 for each type of inorganic light-emitting element 102 . That is, the inorganic light emitting elements 102 emitting light of the same color are formed on one forming substrate 200 , in the example of FIG. 8 , a plurality of first inorganic light emitting elements 102R are formed on the forming substrate 200R, and a plurality of first inorganic light emitting elements 102R are formed on the forming substrate 200G The second inorganic light emitting element 102G is formed by forming a plurality of third inorganic light emitting elements 102B on the formation substrate 200B.

In this embodiment, the detection step is performed on the inorganic light emitting elements 102 formed on the formation substrate 200 , and the defective inorganic light emitting element 102 a is detected from the inorganic light emitting elements 102 formed on the formation substrate 200 . As a detection method of the defective inorganic light-emitting element 102a, for example, a photoluminescence method is used. In the photoluminescence method, the inorganic light emitting element 102 is irradiated with light, the light emitted when the excited electrons of the inorganic light emitting element 102 return to the ground state is detected, and the state of the inorganic light emitting element 102 such as defects is detected based on the light. Next, based on the state of the inorganic light emitting element 102 detected by, for example, a photoluminescence method, it is determined whether or not the inorganic light emitting element 102 a is defective. For example, the inorganic light emitting element 102 whose defects are detected by the photoluminescence method can be determined as the defective inorganic light emitting element 102a. However, the detection method of the defective inorganic light emitting element 102a is not limited to this, but is arbitrary.

In the present manufacturing method, the inorganic light emitting elements 102 other than the defective inorganic light emitting elements 102 a among the inorganic light emitting elements 102 formed on the formation substrate 200 are mounted on the array substrate 2 . In FIG. 8 , description will be given by taking as an example that the defective inorganic light emitting elements 102 a are detected from the plurality of first inorganic light emitting elements 102R formed on the substrate 200R. In step S10 , the first inorganic light emitting elements 102R other than the defective inorganic light emitting element 102a among the plurality of first inorganic light emitting elements 102R formed on the substrate 200R are mounted on the anode electrode 112 of the array substrate 2 . On the anode electrode 112 of the array substrate 2 on which the defective inorganic light emitting element 102a is to be mounted, the first inorganic light emitting element 102R is not mounted, and a space for mounting the inorganic light emitting element 102 is reserved. In this embodiment, the inorganic light-emitting element 102 is mounted on the array substrate 2 by laser lift-off. Specifically, the surface of the formation substrate 200R on which the first inorganic light emitting element 102R is formed and the surface of the array substrate 2 on which the anode electrode 112 is formed are made to face each other. Then, the laser light LI is irradiated to the first inorganic light emitting element 102R other than the defective inorganic light emitting element 102a on the formation substrate 200R from the surface on the opposite side of the formation substrate 200R and the surface on which the first inorganic light emitting element 102R is formed. Thereby, the first inorganic light emitting elements 102R other than the defective inorganic light emitting elements 102a are peeled off from the formation substrate 200R, and are transferred onto the anode electrode 112 of the array substrate 2 . In the present manufacturing method, the entire surface of the substrate 200R can be irradiated with the laser light LI, and the defective inorganic light-emitting element 102a can be shielded from the laser light LI by shielding or the like, so that only the first non-defective inorganic light-emitting element 102a can be irradiated with the laser light LI. The inorganic light-emitting element 102R irradiates the laser light LI. Thereby, for example, a plurality of first inorganic light emitting elements 102R other than the defective inorganic light emitting element 102a can be selectively peeled off by one irradiation of the laser light LI. However, each of the first inorganic light emitting elements 102R other than the defective inorganic light emitting element 102a may be individually irradiated with the laser light LI. In addition, the method of mounting the inorganic light-emitting element 102 on the array substrate 2 is not limited to laser lift-off, and may be arbitrary.

8, the position of the inorganic light emitting element 102 formed on the formation substrate 200 corresponds to the position of the anode electrode 112 formed on the array substrate 2, in other words, the inorganic light emitting element 102 formed on the formation substrate 200. The number and spacing (distance between centers of adjacent inorganic light-emitting elements 102 ) are the same as the number and spacing (distance between centers of adjacent inorganic light-emitting elements 102 ) of the anode electrodes 112 formed on the array substrate 2 . In other words, the coordinates of the inorganic light-emitting elements 102 on the formation substrate 200 can also be referred to as corresponding to the coordinates of the anode electrodes 112 on the array substrate 2 . In the example of FIG. 8 , the number and spacing of the first inorganic light emitting elements 102R formed on the substrate 200R correspond to the inorganic light emitting elements 102 to be mounted on the array substrate 2 (the first inorganic light emitting element 102R, the second inorganic light emitting element 102G, the 3. The number and spacing of the anode electrodes 112 of the inorganic light-emitting element 102B). However, the number and pitch of the first inorganic light-emitting elements 102R formed on the formation substrate 200 are not limited to this, and may be arbitrary. For example, the number and spacing of the first inorganic light emitting elements 102R formed on the substrate 200R may also correspond to the number and spacing of the anode electrodes 112 on the array substrate 2 intended to mount the first inorganic light emitting element 102R. For another example, the number of the first inorganic light-emitting elements 102R formed on the formation substrate 200R may be an arbitrary integer n times the number of the anode electrodes 112 on the array substrate 2 to be mounted with the inorganic light-emitting elements 102, so that the number of the first inorganic light-emitting elements 102R formed on the formation substrate 200 The distance between the first inorganic light emitting elements 102R on the substrate 200R is 1 times the integer n relative to the distance between the anode electrodes 112 on the array substrate 2 on which the first inorganic light emitting elements 102R are to be mounted. In this case, the laser light LI is irradiated only to the inorganic light emitting element 102 transferred on the formation substrate 200 of the array substrate 2 . The number and spacing of the second inorganic light emitting elements 102G and the third inorganic light emitting elements 102B on the formation substrates 200G and 200B, or the number and spacing of the alternative inorganic light emitting elements 102W on the formation substrate 202 described later, can all be the same as the formation substrates. The number and pitch of the first inorganic light-emitting elements 102R on the 200R are set in the same manner.

Next, as shown in step S12 , the plurality of second inorganic light-emitting elements 102G formed on the substrate 200G are mounted on the anode electrode 112 of the array substrate 2 . Specifically, the surface of the formation substrate 200G on which the second inorganic light emitting element 102G is formed and the surface of the array substrate 2 on which the anode electrode 112 is formed are made to face, from the surface of the formation substrate 200G and the surface of the formation of the second inorganic light emitting element 102G. The surface on the opposite side is irradiated with laser light LI to the second inorganic light emitting element 102G on the formation substrate 200G. Thereby, the second inorganic light emitting element 102G is peeled off from the formation substrate 200G, and the second inorganic light emitting element 102G is transferred onto the anode electrode 112 of the array substrate 2 . In addition, in this embodiment, the detection of defective inorganic light emitting elements 102a is also performed for the plurality of second inorganic light emitting elements 102G formed on the substrate 200G. The second inorganic light-emitting element 102G is mounted on the anode electrode 112 of the array substrate 2 .

Next, as shown in step S14 , the plurality of third inorganic light-emitting elements 102B formed on the substrate 200B are mounted on the anode electrode 112 of the array substrate 2 . Specifically, the surface on which the third inorganic light emitting element 102B is formed of the substrate 200B is made to face the surface on which the anode electrode 112 is formed on the array substrate 2, and the surface on which the third inorganic light emitting element 102B is formed is formed from the surface of the substrate 200B. The surface on the opposite side is irradiated with laser light LI to the third inorganic light emitting element 102B formed on the substrate 200B. Thereby, the third inorganic light emitting element 102B is peeled off from the formation substrate 200B, and the third inorganic light emitting element 102B is transferred onto the anode electrode 112 of the array substrate 2 . In addition, in this embodiment, the detection of defective inorganic light-emitting elements 102a is also performed for the plurality of third inorganic light-emitting elements 102B formed on the substrate 200B. The third inorganic light-emitting element 102B is mounted on the anode electrode 112 of the array substrate 2 .

In this way, in the example of FIG. 8 , the first inorganic light emitting element 102R, the second inorganic light emitting element 102G, and the third inorganic light emitting element 102B are mounted on the anode electrode 112 of the array substrate 2 in this order, but the mounting order is as follows: any. In addition, in this embodiment, the first inorganic light emitting element 102R, the second inorganic light emitting element 102G, and the third inorganic light emitting element 102B are formed on different forming substrates 200, respectively, and the first inorganic light emitting element 102R is formed at different timings, respectively. , the second inorganic light emitting element 102G, and the third inorganic light emitting element 102B migrate to the array substrate 2 . However, for example, the first inorganic light emitting element 102R, the second inorganic light emitting element 102G, and the third inorganic light emitting element 102B may be formed on one forming substrate 200 and transferred to the array substrate 2 at one time.

When the mounting of the first inorganic light emitting element 102R, the second inorganic light emitting element 102G, and the third inorganic light emitting element 102B on the array substrate 2 is completed, as shown in step S16, the substitute inorganic light emitting element 102W is mounted on the anode electrode of the array substrate 2 112 on. More specifically, the replacement inorganic light emitting element 102W is mounted on the position of the array substrate 2 where the defective inorganic light emitting element 102a is to be mounted. In the present embodiment, the substitute inorganic light emitting element 102W is formed on the forming substrate 202, that is, on a substrate different from the forming substrate 200 on which the first inorganic light emitting element 102R, the second inorganic light emitting element 102G, and the third inorganic light emitting element 102B are mounted. . Next, the replacement inorganic light emitting element 102W formed on the formation substrate 202 is mounted on the anode electrode 112 of the array substrate 2 . Specifically, the surface of the substrate 202 on which the substitute inorganic light emitting element 102W is formed is made to face the surface of the array substrate 2 on which the anode electrode 112 is formed, and the surface of the substrate 202 and the surface on which the substitute inorganic light emitting element 102W is formed are opposite. On the side surface, the laser light LI is irradiated to the substitute inorganic light-emitting element 102W on the formation substrate 202 . Thereby, the substitute inorganic light emitting element 102W is peeled off from the formation substrate 202 , and the substitute inorganic light emitting element 102W is transferred onto the anode electrode 112 of the array substrate 2 . In addition, here, the laser light LI is irradiated to the replacement inorganic light emitting element 102W at a position opposite to the anode electrode 112 of the array substrate 2 on which the defective inorganic light emitting element 102a is to be mounted. In this way, only the replacement inorganic light emitting element 102W located at the position opposite to the anode electrode 112 of the intended mounting defective inorganic light emitting element 102a among the replacement inorganic light emitting elements 102W on the formation substrate 202 can be peeled off, and the intended mounting defective inorganic light emitting element 102W can be peeled off. On the anode electrode 112 of the element 102a, a substitute inorganic light-emitting element 102W is mounted. In addition, the replacement inorganic light emitting element 102W on the formation substrate 202 may be inspected for defects, and the replacement inorganic light emitting element 102W that is not defective may be mounted on the array substrate 2 .

In step S16, the substitute inorganic light emitting element 102W is mounted on the array substrate 2, whereby as shown in step S18, the inorganic light emitting element 102 other than the defective inorganic light emitting element 102a and the substitute inorganic light emitting element 102W are mounted on the array substrate 2. In this embodiment, after the inorganic light-emitting element 102 other than the defective inorganic light-emitting element 102a is mounted in steps S10, S12, and S14 (the first mounting step), the substitute inorganic light-emitting element 102W is mounted in step S16 (the second mounting step), but The order is not limited to this, for example, the replacement inorganic light-emitting element 102W may be mounted first. In this case, the defective inorganic light emitting element 102a on the formation substrate 200 is detected in advance, and the anode electrode 112 corresponding to the defective inorganic light emitting element 102a on the array substrate 2 (the anode electrode 112 on which the defective inorganic light emitting element 102a is scheduled to be mounted) is detected in advance. Furthermore, the replacement inorganic light emitting element 102W may be mounted on the anode electrode 112 corresponding to the defective inorganic light emitting element 102a on the array substrate 2, and then the inorganic light emitting element 102 other than the defective inorganic light emitting element 102a may be mounted.

If the inorganic light-emitting element 102 other than the defective inorganic light-emitting element 102a and the replacement inorganic light-emitting element 102W have been mounted, as shown in step S20, each of the inorganic light-emitting elements 102 on the inorganic light-emitting element 102 is the inorganic light-emitting element 102 other than the defective inorganic light-emitting element 102a. And instead of each on the inorganic light-emitting element 102W, the cathode electrode 114 is formed. Thereby, the inorganic light-emitting body 100 including the anode electrode 112 , the inorganic light-emitting element 102 and the cathode electrode 114 is formed. Next, a counter-cathode electrode 90e is formed on the inorganic light-emitting body 100, that is, the inorganic light-emitting body 100 other than the defective inorganic light-emitting body 100a and the substitute inorganic light-emitting body 100W (counter electrode forming step). The opposite cathode electrode 90 e is provided in common with all the inorganic light-emitting bodies 100 . In addition, in the example of FIG. 8, the inorganic light emitting element 102 not including the anode electrode 112 and the cathode electrode 114 is formed on the formation substrate and transferred to the array substrate 2, but for example, the anode electrode 112 and the inorganic light emitting element 102 may also be formed and the cathode electrode 114 are formed on the formation substrate and transferred to the array substrate 2 .

If the opposite anode electrode 90e has been formed, as shown in step S22 (the step of forming the filter portion), the filter portion 96 is formed on the opposite cathode electrode 90e at the position overlapping the substitute inorganic light-emitting body 100W in plan view. . In the present manufacturing method, for example, the liquid filter portion 96 is applied on the opposing cathode electrode 90e at a position overlapping with the substitute inorganic light-emitting body 100W in plan view, and the liquid filter portion 96 is cured, whereby the liquid filter portion 96 is cured. This forms the filter portion 96 . However, for example, a solid filter portion 96 may be attached to a position on the opposite cathode electrode 90e overlapping the substitute inorganic light-emitting body 100W in plan view. In step S22, the filter portion 96 is selected according to the type of the unmounted defective inorganic light-emitting body 100a, that is, the color emitted by the defective inorganic light-emitting body 100a, and the selected filter portion 96 is formed on the opposite cathode electrode 90e . That is, when the defective inorganic light-emitting body 100a to be mounted at the position where the replacement inorganic light-emitting body 100W is mounted is the first inorganic light-emitting body 100R, the filter portion 96R is formed at the position overlapping the replacement inorganic light-emitting body 100W, When the defective inorganic light-emitting body 100a to be mounted at the position where the replacement inorganic light-emitting body 100W is mounted is the second inorganic light-emitting body 100G, the filter portion 96G is formed at the position overlapping the replacement inorganic light-emitting body 100W, and is mounted on the second inorganic light-emitting body 100G. When the defective inorganic light-emitting body 100a to be mounted at the position replacing the inorganic light-emitting body 100W is the third inorganic light-emitting body 100B, the filter portion 96B is formed at the position replacing the inorganic light-emitting body 100W.

After the filter portion 96 has been formed, as shown in step S24, the planarizing film 92 and the cover portion 94 are formed on the opposite cathode electrode 90e, and the manufacture of the display device 1 is completed. However, the step of step S24 is not necessary, and the filter portion 96 may be formed in step S22 to complete the manufacture of the display device 1 .

As described above, the manufacturing method of the display device 1 including the array substrate 2 and the plurality of inorganic light-emitting elements 102 arranged in a matrix according to the present embodiment includes the detection step, the first mounting step, the second mounting step, and the filter portion forming steps. In the detection step, the defective inorganic light emitting element 102 is detected from the inorganic light emitting element 102 formed on the formation substrate 200 , that is, the defective inorganic light emitting element 102 a. In the first mounting step, the inorganic light-emitting elements 102 other than the defective inorganic light-emitting elements 102 a among the inorganic light-emitting elements 102 formed on the formation substrate 200 are mounted on the array substrate 2 . In the second mounting step, the replacement inorganic light-emitting element 102W that emits light of a different color from the defective inorganic light-emitting element 102a is mounted on the array substrate 2 . In the filter portion forming step, when viewed from the traveling direction of the light from the inorganic light emitting element 102 on the array substrate 2 (planar view), at a position overlapping the substitute inorganic light emitting element 102W, the substitute inorganic light emitting element 102W is formed. The light _LW is set to the filter portion 96 from which the light of the same color as the light from the defective inorganic light-emitting element 102a is emitted.

According to the present embodiment, by not mounting the defective inorganic light emitting element 102a on the display device 1, it is possible to prevent the image display of the display device 1 from becoming inappropriate due to poor light emission of the defective inorganic light emitting element 102a. Furthermore, by replacing the defective inorganic light-emitting element 102a with the substitute inorganic light-emitting body 100W and the filter portion 96, the pixel 49 that should be responsible for the defective inorganic light-emitting element 102a can be replaced by the inorganic light-emitting body 100W and the filter portion 96. Therefore, even when the defective inorganic light-emitting element 102a is manufactured, an image can be appropriately displayed. In addition, all of the first inorganic light emitting element 102R, the second inorganic light emitting element 102G, and the third inorganic light emitting element 102B may be defective. In this case, if the inorganic light-emitting element 102 that emits light of the same color as the defective inorganic light-emitting element 102a is used as a substitute inorganic light-emitting body, the first inorganic light-emitting element 102R, the second inorganic light-emitting element 102G, and the third inorganic light-emitting element 102R must be replaced. Each of the inorganic light-emitting elements 102B is mounted on the display device 1 as an alternative inorganic light-emitting body. In this case, for example, a step of mounting the substitute inorganic light-emitting body three times for the first inorganic light-emitting element 102R, the second inorganic light-emitting element 102G, and the third inorganic light-emitting element 102B is required. On the other hand, in this embodiment, since the color that should be emitted by the defective inorganic light emitting element 102a is expressed by the filter portion 96, only the first inorganic light emitting element 102R, the second inorganic light emitting element 102G, and the third inorganic light emitting element For any one of the light-emitting elements 102B, it is sufficient to prepare one type of the inorganic light-emitting element 102W instead. Therefore, the mounting step of the substitute inorganic light emitting element 102W can be set once, and the load of the step of mounting the substitute inorganic light emitting element 102W, that is, the manufacturing workload can be reduced.

In addition, in the second mounting step, the replacement inorganic light emitting element 102W is mounted on the position on the array substrate 2 where the defective inorganic light emitting element 102a is to be mounted. Thereby, the function of the pixel 49 predetermined by the defective inorganic light emitting element 102a can be performed by the substitute inorganic light emitting element 102W, and the image can be appropriately displayed even when the defective inorganic light emitting element 102a is manufactured.

In addition, in the second mounting step, the substitute inorganic light emitting element 102W formed on the substrate (forming substrate 202 ) different from the forming substrate 200 is mounted on the array substrate 2 . According to this manufacturing method, since the substitute inorganic light emitting element 102W formed on the formation substrate 202 is mounted on the array substrate 2 , the substitute inorganic light emitting element 102W can be appropriately mounted on the array substrate 2 .

Furthermore, the present manufacturing method further includes a counter electrode forming step of forming a counter electrode (counter cathode electrode 90e) on the inorganic light emitting element 102 mounted on the array substrate 2 and the substitute inorganic light emitting element 102W. In the filter portion forming step, the filter portion 96 is formed on the opposite cathode electrode 90e. According to the present manufacturing method, since the filter portion 96 is formed on the opposing cathode electrode 90e, an image can be appropriately displayed even when the defective inorganic light-emitting element 102a is manufactured.

Moreover, the filter part 96 is comprised by the member which transmits the light of the same wavelength band as the light from the defective inorganic light emitting element 102a among the light L _W from the substitute inorganic light emitting element 102W. By using such a filter portion 96, even when the defective inorganic light-emitting element 102a is manufactured, an image can be appropriately displayed.

The inorganic light-emitting element 102 formed on the formation substrate 200 emits any one of red, green, or blue light, instead of the inorganic light-emitting element 102W, which emits white light. By using the replacement inorganic light emitting element 102W that emits white light, red, green, and blue light can be set by the filter portion 96, and even when the defective inorganic light emitting element 102a is produced, it can be appropriately Display the image.

The display device 1 of the present embodiment includes a plurality of inorganic light-emitting elements 102 arranged in a matrix, and a filter portion 96 . The plurality of inorganic light emitting elements 102 include inorganic light emitting elements 102 that emit light of a specific color, and substitute inorganic light emitting elements 102W that emit light L _W of a different color (substitute color) from the light of the specific color. When viewed from the traveling direction of the light from the inorganic light-emitting element 102 (planar view), the filter portion 96 is provided at a position overlapping the substitute inorganic light-emitting element 102W, and the light LW from the substitute inorganic light-emitting element _102W is set to be the same as the specific light-emitting element 102W. Light of color is emitted from light of the same color. That is, in the display device 1 of the present embodiment, the color of the light emitted from the substitute inorganic light emitting element 102W and transmitted through the filter portion 96 is the same as the color of the light emitted from the other inorganic light emitting elements 102 . Therefore, according to the display device 1, light of the color that should be emitted by the unmounted defective inorganic light emitting element 102a can be emitted by substituting the inorganic light emitting element 102W and the filter portion 96, so even when the defective inorganic light emitting element 102a is manufactured In this case, images can also be appropriately displayed.

Hereinafter, another example of this embodiment will be described. FIG. 9 is a schematic view showing another example of a case where a substitute inorganic light-emitting body is mounted. For example, as shown in FIG. 9 , the present manufacturing method may also form a concave portion 90eb on a surface 90ea1 on the upper side of the opposite cathode electrode 90e of the display device 1 . The concave portion 90eb is an opening formed in the upper surface 90ea1 of the opposing cathode electrode 90e, and does not penetrate to the lower surface 90ea2 of the opposing cathode electrode 90e. The recessed part 90eb is provided in the position which overlaps with the substitute inorganic light-emitting element 102W in plan view. By providing the concave portion 90eb in this way, the filter portion 96 can be provided in the concave portion 90eb, the filter portion 96 can be easily positioned, and when the liquid filter portion 96 is applied, filtering can be suppressed. The device portion 96 extends to a position overlapping the other inorganic light-emitting bodies 100 . In addition, the concave portion 90eb may be formed only at a position overlapping the substitute inorganic light emitting element 102W, or may be formed at a position overlapping all the inorganic light emitting bodies 100 . When the concave portion 90eb is provided at a position overlapping all the inorganic light-emitting bodies 100, the filter portion 96 is formed only in the concave portion 90eb overlapping with the substitute inorganic light-emitting element 102W.

FIG. 10 is a schematic view showing another example of a case where a substitute inorganic light-emitting body is mounted. As shown in FIG. 5 , the inorganic light-emitting body 100 of this embodiment is a type in which the anode electrode 112 provided in the lower part is connected to the counter anode electrode 50e, and the cathode electrode 114 provided in the upper part is connected to the counter cathode electrode 90e (hereinafter , called the face-up type). However, the inorganic light-emitting body 100 is not limited to the face-up type. For example, as shown in FIG. 10 , the inorganic light-emitting body 100 may also be a face-down type in which the lower part is connected to both the opposite anode electrode 50e and the opposite cathode electrode 90e.

In the face-down type, the n-type cladding layer 104 of the inorganic light-emitting element 102 is configured to have a larger area than the p-type cladding layer 106 and the light-emitting layer 108 when viewed from above. The inorganic light-emitting body 100 includes a region AR1 where the n-type cladding layer 104 overlaps with the p-type cladding layer 106 and the light-emitting layer 108 , and a region AR2 where the n-type cladding layer 104 does not overlap with the p-type cladding layer 106 and the light-emitting layer 108 . In the region AR1, the inorganic light-emitting body 100 faces upward, and the opposing anode electrode 50e, the connection layer 50f, the anode electrode 112, the p-type cladding layer 106, the light-emitting layer 108, and the n-type cladding layer 104 are laminated in this order. On the other hand, in the region AR2, the inorganic light-emitting body 100 faces upward, and the opposing cathode electrode 90e, the connection layer 90f, the cathode electrode 114a, and the n-type cladding layer 104 are laminated in this order. Different from FIG. 5 , the opposite cathode electrode 90 e of FIG. 0 is disposed on the lower side of the inorganic light-emitting element 102 . The connection layer 90f may be formed of, for example, the same member as the connection layer 50f. In addition, the cathode electrode 114a may be different from the cathode electrode 114 shown in FIG. 5 and not have light transmittance, as long as it is a material having conductivity. For example, the cathode electrode 114a includes titanium (Ti) and aluminum (Al), and for example, a titanium layer and an aluminum layer are laminated in the third direction Dz.

In the face-down type, since the opposite cathode electrode 90e is provided on the lower side of the inorganic light-emitting element 102, in the substitute inorganic light-emitting body 100W, a filter is provided on the upper side of the n-type cladding layer 104 of the substitute inorganic light-emitting body 100W. Optical part 96 .

FIG. 11 is a schematic view showing another example of a case where a substitute inorganic light-emitting body is mounted. FIG. 7 shows an example of a case where the first inorganic light emitting element 102R is a defective inorganic light emitting element 102a, but FIG. 11 shows an example of a case where the other first inorganic light emitting element 102R is a defective inorganic light emitting element 102a.

FIG. 11(A) shows an example of a case where one second inorganic light-emitting element 102G is detected as a defective inorganic light-emitting element 102a. In this case, the substitute inorganic light emitting element 102W is mounted at the position where the second inorganic light emitting element 102G detected as the defective inorganic light emitting element 102a is to be mounted. In addition, in a plan view, the filter portion 96G is provided at a position overlapping with the substitute inorganic light-emitting body 100W. FIG. 11(B) shows an example of a case where one third inorganic light emitting element 102B is detected as a defective inorganic light emitting element 102a. In this case, the substitute inorganic light emitting element 102W is mounted at the position where the third inorganic light emitting element 102B detected as the defective inorganic light emitting element 102a is to be mounted. In addition, in a plan view, the filter portion 96B is provided at a position overlapping with the substitute inorganic light-emitting body 100W.

FIG. 11(C) shows an example of a case where the first inorganic light emitting element 102R and the second inorganic light emitting element 102G are detected as the defective inorganic light emitting element 102a. In this case, at the position where the first inorganic light emitting element 102R detected as the defective inorganic light emitting element 102a is scheduled to be mounted, and the position where the second inorganic light emitting element 102G detected as the defective inorganic light emitting element 102a is scheduled to be mounted, a substitute is mounted. Inorganic light-emitting element 102W. Moreover, the filter part 96R is provided in the position which overlaps with the substitute inorganic light emitting element 102W mounted in the position where the 1st inorganic light emitting element 102R is to be mounted. Moreover, the filter part 96G is provided in the position which overlaps with the substitute inorganic light emitting element 102W mounted in the position where the 2nd inorganic light emitting element 102G is to be mounted.

FIG. 11(D) shows an example of the case where the first inorganic light emitting element 102R and the third inorganic light emitting element 102B are detected as the defective inorganic light emitting element 102a. In this case, at the position where the first inorganic light emitting element 102R detected as the defective inorganic light emitting element 102a is scheduled to be mounted, and the position where the third inorganic light emitting element 102B detected as the defective inorganic light emitting element 102a is scheduled to be mounted, a substitute is mounted. Inorganic light-emitting element 102W. Moreover, the filter part 96R is provided in the position which overlaps with the substitute inorganic light emitting element 102W mounted in the position where the 1st inorganic light emitting element 102R is to be mounted. Moreover, the filter part 96B is provided in the position which overlaps with the substitute inorganic light emitting element 102W mounted in the position where the 3rd inorganic light emitting element 102B is to be mounted.

FIG. 11(E) shows an example of a case where the second inorganic light emitting element 102G and the third inorganic light emitting element 102B are detected as the defective inorganic light emitting element 102a. In this case, at the position where the second inorganic light emitting element 102G detected as the defective inorganic light emitting element 102a is to be mounted, and the position where the third inorganic light emitting element 102B detected as the defective inorganic light emitting element 102a is scheduled to be mounted, a substitute is mounted. Inorganic light-emitting element 102W. Moreover, the filter part 96G is provided in the position which overlaps with the substitute inorganic light emitting element 102W mounted in the position where the 2nd inorganic light emitting element 102G is to be mounted. Moreover, the filter part 96B is provided in the position which overlaps with the substitute inorganic light emitting element 102W mounted in the position where the 3rd inorganic light emitting element 102B is to be mounted.

FIG. 11(F) shows an example of a case where the first inorganic light emitting element 102R, the second inorganic light emitting element 102G, and the third inorganic light emitting element 102B are detected as the defective inorganic light emitting element 102a. In this case, the position where the first inorganic light emitting element 102R detected as the defective inorganic light emitting element 102a is scheduled to be mounted, the position where the second inorganic light emitting element 102G detected as the defective inorganic light emitting element 102a is scheduled to be mounted, and the In the position of the third inorganic light emitting element 102B detected by the defective inorganic light emitting element 102a, a substitute inorganic light emitting element 102W is mounted. Moreover, the filter part 96R is provided in the position which overlaps with the substitute inorganic light emitting element 102W mounted in the position where the 1st inorganic light emitting element 102R is to be mounted. Moreover, the filter part 96G is provided in the position which overlaps with the substitute inorganic light emitting element 102W mounted in the position where the 2nd inorganic light emitting element 102G is to be mounted. Moreover, the filter part 96B is provided in the position which overlaps with the substitute inorganic light emitting element 102W mounted in the position where the 3rd inorganic light emitting element 102B is to be mounted.

In addition, it should be understood that other effects obtained by the aspect described in this embodiment, which are clear from the description of the present specification, or those that can be appropriately conceived by the industry, are of course obtained by the present invention.

1: Display device 2: Array substrate 10: Substrate 10a: First surface 10b: Second surface 12: Driving circuit 20: Undercoat layer 21: First gate electrode 24: Insulating film 25: Semiconductor layer 27: Channel region 29 : insulating film 31 : second gate electrode 31 a : gate line 35 : insulating film 41 d : drain electrode 41 s : source electrode 42 : insulating film 43 d : drain connection wiring 43 s : source connection wiring 45 : insulating film 49 : pixel 49B: 3rd pixel 49G: 2nd pixel 49R: 1st pixel 50e: opposite anode electrode 50f: connecting layer 60: cathode wiring 66: insulating film 70: insulating film 80: flattening film 90e: opposite cathode electrode (Counter electrode) 90ea1: Surface 90ea2: Surface 90eb: Recess 90f: Connection layer 92: Flattening film 94: Cover 96: Filter 96B: Filter 96G: Filter 96R: Filter Section 100: Inorganic light-emitting body 100a: Defective inorganic light-emitting body 100B: Third inorganic light-emitting body 100G: Second inorganic light-emitting body 100R: First inorganic light-emitting body 100W: Alternative inorganic light-emitting body 102: Inorganic light-emitting element 102a: Defective inorganic light-emitting element 102B: third inorganic light emitting element 102G: second inorganic light emitting element 102R: first inorganic light emitting element 102W: alternative inorganic light emitting element 104: n-type coating layer 106: p-type coating layer 108: light-emitting layer 110: anode electrode 112: anode Electrode 114: Cathode electrode 114a: Cathode electrode 200: Forming substrate 200B: Forming substrate 200G: Forming substrate 200R: Forming substrate 210: Driving IC AA: Display area AR1: Area AR2: Area BCT: Light emission control transistor BG: Light emission control scan Line CH1: Contact hole Cs1: Capacitance Cs2: Capacitance DRT: Driving transistor Dx: First direction Dy: Second direction Dz: Third direction GA: Peripheral area IG: Initialization control scan line IST: Initialization transistor L1: Anode power supply Line L2: Image Signal Line L3: Reset Signal Line L4: Initialization Signal Line L10: Cathode Power Line L _B : Light L _G : Light LI: Laser Light L _R : Light L _W : Light Pix: Pixel RG: Reset Control Scan Line RST: Reset Transistor S10: Step S12: Step S14: Step S16: Step S18: Step S20: Step S22: Step S24: Step SG: Write Control Scan Line SST: Write Transistor Tr: Transistor TrC : transistor PICA: pixel circuit PVDD: anode power supply potential PVSS: cathode power supply potential Vbg: light emission control signal Vig: initialization control signal Vini: initialization potential Vrg: reset control signal Vrst: reset power supply potential Vsg: write control signal Vsig : Video signal

FIG. 1 is a plan view showing a configuration example of the display device of the present embodiment. FIG. 2 is a top view showing a plurality of pixels. FIG. 3 is a circuit diagram showing a configuration example of a pixel circuit of a display device. Fig. 4 is a cross-sectional view taken along line IV-IV' of Fig. 1 . FIG. 5 is a cross-sectional view showing a configuration example of the inorganic light-emitting body of the present embodiment. FIG. 6 is a schematic view showing an example of a case where an alternative inorganic light-emitting body is mounted. FIG. 7 is a schematic diagram showing an example of a case where an alternative inorganic light-emitting body is mounted. FIG. 8 is a diagram illustrating a method of manufacturing the display device of the present embodiment. FIG. 9 is a schematic view showing another example of a case where a substitute inorganic light-emitting body is mounted. FIG. 10 is a schematic view showing another example of a case where a substitute inorganic light-emitting body is mounted. FIGS. 11(A) to (F) are schematic diagrams showing another example of the case where a substitute inorganic light-emitting body is mounted.

1: Display device

2: Array substrate

50f: Connection layer

70: insulating film

80: Flattening film

90e: Counter cathode electrode (counter electrode)

92: Flattening film

94: Cover

96: Filter part

96R: Filter section

100: Inorganic luminophore

100B: The third inorganic light-emitting body

100G: 2nd inorganic luminophore

100R: 1st inorganic light emitter

100W: Alternative to inorganic light emitters

102: Inorganic light-emitting element

102a: Defective inorganic light-emitting element

102B: The third inorganic light-emitting element

102G: Second inorganic light-emitting element

102R: The first inorganic light-emitting element

102W: Alternative to inorganic light-emitting elements

112: Anode electrode

114: Cathode electrode

200: Forming the substrate

200B: Forming the substrate

200G: Forming the substrate

200R: Forming the substrate

Dx: 1st direction

Dy: 2nd direction

Dz: 3rd direction

LI: laser light

S10: Steps

S12: Steps

S14: Steps

S16: Steps

S18: Steps

S20: Steps

S22: Step

S24: Step

Claims (6)

A method of manufacturing a display device, which is a method of manufacturing a display device including an array substrate and a plurality of inorganic light-emitting elements arranged in a matrix, and comprising: a detection step, which is formed from the plurality of inorganic light-emitting elements formed on a formation substrate, The above-mentioned inorganic light-emitting element that is defective in detection is the defective inorganic light-emitting element; the first mounting step is to mount the above-mentioned inorganic light-emitting element other than the above-mentioned defective inorganic light-emitting element among the above-mentioned inorganic light-emitting elements formed on the above-mentioned forming substrate on the above-mentioned array substrate. a second mounting step of mounting a substitute inorganic light-emitting element that emits light of a different color from the defective inorganic light-emitting element on the array substrate; and a filter portion forming step of overlapping the substitute inorganic light-emitting element A filter portion is formed at the position of the filter portion, and the filter portion emits the light from the replacement inorganic light emitting element as light of the same color as the light from the defective inorganic light emitting element. The method for manufacturing a display device according to claim 1, wherein in the second mounting step, the replacement inorganic light emitting element is mounted on the array substrate at a position where the defective inorganic light emitting element is to be mounted. The method for manufacturing a display device according to claim 1 or 2, wherein in the second mounting step, the replacement inorganic light-emitting element formed on a substrate different from the formation substrate is mounted on the array substrate. The method for manufacturing a display device according to claim 1 or 2, further comprising a counter electrode forming step, wherein the counter electrode forming step is: on the inorganic light emitting element and the substitute inorganic light emitting element mounted on the array substrate , forming a counter electrode, and in the filter part forming step, the filter part is formed on the counter electrode. The method of manufacturing a display device according to claim 1 or 2, wherein the filter portion is composed of a member that transmits light of the same wavelength band as the light from the defective inorganic light emitting element among the light from the substitute inorganic light emitting element. The method for manufacturing a display device according to claim 1 or 2, wherein the inorganic light-emitting element formed on the above-mentioned forming substrate emits any light of red, green, or blue, and the substitute inorganic light-emitting element emits white light.

Images