TWI752732B - Via hole alignment assembly and via hole alignment method - Google Patents
Via hole alignment assembly and via hole alignment method Download PDFInfo
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Abstract
Description
本發明關於一種對位總成及對位方法;特別關於一種穿孔對位總成及穿孔對位方法。 The present invention relates to an alignment assembly and an alignment method; in particular, to a perforation alignment assembly and a perforation alignment method.
探針卡(probe card)是待測電子元件(如:晶圓或晶片等)與電子測試系統之間的媒介。探針卡的使用,乃是在待測電子元件尚未封裝前,對待測電子元件以探針(probe)電接觸做功能測試,藉此篩選出不良品後再進行之後的封裝工程。 The probe card is the medium between the electronic components to be tested (such as wafers or chips, etc.) and the electronic test system. The use of the probe card is to perform functional testing on the electronic components to be tested with probe electrical contacts before the electronic components to be tested are packaged, so as to screen out defective products before proceeding with the subsequent packaging process.
探針卡上的探針,其一端用於與待測電子元件電接觸,另一端則被設置於探針卡的複數層導板上,並透過複數層導板來達到固定探針及減少測試訊號被干擾等效果,因此各導板將對應於探針的數量而具有複數穿孔。 One end of the probe on the probe card is used for electrical contact with the electronic component to be tested, and the other end is set on the multiple layers of guide plates of the probe card, and the multiple layers of guide plates are used to fix the probe and reduce the test. Signals are disturbed and other effects, so each guide plate will have a plurality of perforations corresponding to the number of probes.
詳細而言,在進行探針卡的組裝作業時,需先將各導板上的複數穿孔進行對位,且確保其正位度處於誤差範圍內,才能夠在後續組裝步驟中使探針正確無誤地裝設於導板上。換言之,一旦穿孔的對位不精準,導致正位度超出誤差範圍,那麼所組裝完成的探針卡便會出現良率偏低的情況。 In detail, when assembling the probe card, it is necessary to first align the plurality of perforations on each guide plate, and ensure that the alignment is within the error range, so that the probes can be made correct in the subsequent assembly steps. Installed correctly on the guide plate. In other words, once the alignment of the through holes is inaccurate and the alignment degree exceeds the error range, the assembled probe card will have a low yield rate.
另一方面,隨著半導體工藝製程的進步,待測電子元件所需檢測的接點數量也相應暴增,使得導板上需檢測並定位的穿孔數量達到1萬孔以 上,因此在現有技術中,利用人工操作單一光學檢測裝置,如:CCD(Charge Coupled Device、感光耦合元件),以抽檢導板單面的穿孔後再進行疊圖的檢測方式,便難以準確地獲得穿孔內部狀況及各穿孔間的正位度,從而嚴重影響穿孔檢測的工作效率及探針卡的組裝良率。 On the other hand, with the advancement of semiconductor technology, the number of contacts to be tested for the electronic components to be tested has also increased correspondingly, so that the number of holes to be detected and positioned on the guide plate has reached more than 10,000 holes. Therefore, in the prior art, it is difficult to accurately detect a single optical detection device such as a CCD (Charge Coupled Device, photosensitive coupling element) by manually operating a single optical detection device to spot the perforations on one side of the guide plate and then perform an overlay detection method. The internal conditions of the through holes and the alignment between the through holes are obtained, which seriously affects the work efficiency of the hole inspection and the assembly yield of the probe card.
有鑑於此,如何提供一種穿孔對位總成及穿孔對位方法,使其能以一自動化方式對複數導板上的複數穿孔進行檢測並完成對位,從而提高穿孔檢測的工作效率及探針卡的組裝良率,乃為此一業界亟待解決的問題。 In view of this, how to provide a perforation alignment assembly and a perforation alignment method, which can detect and complete the alignment of a plurality of perforations on a plurality of guide plates in an automated manner, thereby improving the work efficiency of perforation detection and the probe The assembly yield of the card is an urgent problem to be solved in this industry.
本發明之一目的在於提供一種穿孔對位總成及穿孔對位方法,其能以一自動化方式對導板上的複數穿孔進行檢測並完成對位,從而提高穿孔檢測的工作效率及探針卡的組裝良率。 One object of the present invention is to provide a perforation alignment assembly and a perforation alignment method, which can detect and align a plurality of perforations on a guide plate in an automated manner, thereby improving the work efficiency of perforation detection and the probe card assembly yield.
為達上述目的,本發明所揭示之一種穿孔對位總成包含一模具組、一滑台及一光學影像模組。模具組供安裝複數導板。滑台具有一中空區域,使模具組被設置於中空區域之上側。光學影像模組相對於滑台設置,用以拍攝模具組上的複數導板,並檢測複數導板所具有的複數穿孔。 To achieve the above purpose, a perforation alignment assembly disclosed in the present invention includes a mold set, a slide table and an optical image module. Die set for installation of multiple guide plates. The slide table has a hollow area, so that the die set is arranged on the upper side of the hollow area. The optical image module is arranged relative to the sliding table, and is used for photographing the plurality of guide plates on the die set and detecting the plurality of perforations of the plurality of guide plates.
本發明之穿孔對位總成所具有的光學影像模組包含一第一光學檢測裝置及一第二光學檢測裝置,且第一光學檢測裝置及第二光學檢測裝置分別設置於滑台的上側及下側。 The optical image module of the perforation alignment assembly of the present invention includes a first optical detection device and a second optical detection device, and the first optical detection device and the second optical detection device are respectively disposed on the upper side of the slide table and the second optical detection device. underside.
本發明之穿孔對位總成所具有的複數導板包含至少一第一導板及至少一第二導板,至少一第一導板設置於模具組之上側,且至少一第二導板設置於模具組之下側。 The plurality of guide plates of the perforation alignment assembly of the present invention include at least one first guide plate and at least one second guide plate, at least one first guide plate is disposed on the upper side of the die set, and at least one second guide plate is disposed on the underside of the die set.
本發明之穿孔對位總成所具有的第一光學檢測裝置用以檢測至少一第一導板所具有的複數第一穿孔,且第二光學檢測裝置用以檢測至少一第二導板所具有的複數第二穿孔。 The first optical detection device of the perforation alignment assembly of the present invention is used to detect the plurality of first perforations of at least one first guide plate, and the second optical detection device is used to detect the at least one second guide plate to have. the plural second perforations.
本發明之穿孔對位總成所具有的模具組更包含一調整裝置,調整裝置依據第一光學檢測裝置及第二光學檢測裝置的檢測結果,調整至少一第一導板及至少一第二導板的相對位置以進行複數第一穿孔及複數第二穿孔的對位。 The die set of the perforation alignment assembly of the present invention further includes an adjustment device, and the adjustment device adjusts the at least one first guide plate and the at least one second guide plate according to the detection results of the first optical detection device and the second optical detection device. The relative positions of the plates are used for alignment of the plurality of first through holes and the plurality of second through holes.
為達上述目的,本發明更揭示之一種穿孔對位方法,包含下列步驟:提供一模具組以安裝複數導板;提供一滑台以承載模具組;以及提供一光學影像模組以拍攝模具組上的複數導板,並檢測複數導板所具有的複數穿孔以完成複數穿孔的對位;其中,滑台具有一中空區域,且模具組被設置於中空區域之上側。 In order to achieve the above-mentioned purpose, the present invention further discloses a perforation alignment method, comprising the following steps: providing a mold set for installing a plurality of guide plates; providing a slide table for carrying the mold set; and providing an optical image module for photographing the mold set The plurality of guide plates on the upper part are detected, and the plurality of perforations of the plurality of guide plates are detected to complete the alignment of the plurality of perforations; wherein, the slide table has a hollow area, and the mold set is arranged on the upper side of the hollow area.
於本發明之穿孔對位方法中,光學影像模組包含一第一光學檢測裝置及一第二光學檢測裝置,且第一光學檢測裝置及第二光學檢測裝置分別設置於滑台的一上側及一下側。 In the perforation alignment method of the present invention, the optical image module includes a first optical detection device and a second optical detection device, and the first optical detection device and the second optical detection device are respectively disposed on an upper side of the slide table and a second optical detection device. down side.
於本發明之穿孔對位方法中,複數導板包含至少一第一導板及至少一第二導板,至少一第一導板設置於模具組之一上側,且至少一第二導板設置於模具組之一下側。 In the perforation alignment method of the present invention, the plurality of guide plates include at least one first guide plate and at least one second guide plate, at least one first guide plate is disposed on an upper side of the die set, and at least one second guide plate is disposed on the underside of one of the die sets.
於本發明之穿孔對位方法中,第一光學檢測裝置用以檢測至少一第一導板所具有的複數第一穿孔,且第二光學檢測裝置用以檢測至少一第二導板所具有的複數第二穿孔。 In the perforation alignment method of the present invention, the first optical detection device is used to detect the plurality of first perforations of at least one first guide plate, and the second optical detection device is used to detect the at least one second guide plate to have. A plurality of second perforations.
本發明之穿孔對位方法更包含下列步驟: The perforation alignment method of the present invention further comprises the following steps:
提供一調整裝置,調整裝置依據第一光學檢測裝置及第二光學檢測裝置的檢測結果,調整至少一第一導板及至少一第二導板的相對位置以進行複數第一穿孔及複數第二穿孔的對位。 An adjustment device is provided, and the adjustment device adjusts the relative positions of at least one first guide plate and at least one second guide plate according to the detection results of the first optical detection device and the second optical detection device to perform a plurality of first perforations and a plurality of second holes Perforated alignment.
為讓上述目的、技術特徵及優點能更明顯易懂,下文係以較佳之實施例配合所附圖式進行詳細說明。 In order to make the above objects, technical features and advantages more clearly understood, the following is a detailed description of the preferred embodiments in conjunction with the accompanying drawings.
100:穿孔對位總成 100: perforated alignment assembly
110:模具組 110: Die set
112:調整裝置 112: Adjustment device
120:滑台 120: Slider
122:中空區域 122: hollow area
130:光學影像模組 130: Optical imaging module
132:第一光學檢測裝置 132: The first optical detection device
134:第二光學檢測裝置 134: Second optical detection device
200:導板 200: guide plate
202:穿孔 202: Perforation
210:第一導板 210: First guide plate
212:第一穿孔 212: First Piercing
220:第二導板 220: Second guide plate
222:第二穿孔 222: Second Piercing
圖1為本發明穿孔對位總成之示意圖;以及圖2為本發明穿孔對位方法之步驟圖。 FIG. 1 is a schematic diagram of a perforation alignment assembly of the present invention; and FIG. 2 is a step diagram of a perforation alignment method of the present invention.
如圖1所示,本發明所揭示之一種穿孔對位總成100包含一模具組110、一滑台120及一光學影像模組130。
As shown in FIG. 1 , a
其中,模具組110供安裝複數導板200。滑台120具有一中空區域122,使模具組110被設置於中空區域122之上側。光學影像模組130相對於滑台120設置,使光學影像模組130可用以拍攝模具組110上的複數導板200,並檢測複數導板200所具有的複數穿孔202。
The die
以下將以導板200的數量為二之實施例進行說明,但並非以此做為限制。
The following will describe an embodiment in which the number of the
請再次參閱圖1,於本發明之實施例中,穿孔對位總成100所具有的光學影像模組130包含一第一光學檢測裝置132及一第二光學檢測裝置134,且第一光學檢測裝置132及第二光學檢測裝置134分別設置於滑台120的上側及下側。
Please refer to FIG. 1 again, in the embodiment of the present invention, the
相應地,複數導板200包含一第一導板210及一第二導板220,第一導板210設置於模具組110之上側,且第二導板220設置於模具組110之下側。
Correspondingly, the plurality of
經由上述之設置,位於滑台120上側的第一光學檢測裝置132便可直接拍攝並檢測第一導板210所具有的複數第一穿孔212,而位於滑台120下側的第二光學檢測裝置134便可經由中空區域122拍攝並檢測第二導板220所具有的複數第二穿孔222。
Through the above arrangement, the first
需特別說明的是,設置於模具組110上側之第一導板210的數量、以及設置於模具組110下側之第二導板220的數量可依據實際的組裝需求進行調整。舉例而言,當因應不同的探針數及防干擾需求時,便可相應地增加第一導板210及第二導板220的數量。
It should be noted that, the number of the
本發明之穿孔對位總成100所具有的模具組110更包含一調整裝置112。如圖1所示,於本實施例中,調整裝置112乃是設置於第一導板210之週緣,如此一來,在第二導板220為固定不動的情況下,調整裝置112便可依據第一光學檢測裝置132及第二光學檢測裝置134的檢測結果,使第一導板210在X-Y平面上微調移動,藉由調整第一導板210及第二導板220的相對位置以進行複數第一穿孔212及複數第二穿孔222的對位,同時確保複數第一穿孔212及複數第二穿孔222的正位度處於誤差範圍內。
The die
實際操作上,當第一導板210及第二導板220已分別設置於模具組110之上側及下側後,可先透過模具組110下側的第二光學檢測裝置134拍攝第二導板220所具有的複數第二穿孔222,並根據拍攝所獲得的檢測結果在X-Y平面上移動滑台120進行第二導板220的初步定位。接著,以滑台120上側的第一光學檢測裝置132拍攝並檢測第一導板210所具有的複數第一穿孔212,透過比對第一光學檢測裝置132及第二光學檢測裝置134的檢測結果來疊圖計算複數第一穿孔212及複數第二穿孔222之間的正位度。此時,倘若複數第一穿孔212
及複數第二穿孔222之間的正位度大於誤差範圍,便可在第二導板220固定不動的情況下,透過調整裝置112的操作,於模具組110的上側沿X-Y平面進行第一導板210位置的微調,藉此變動第一導板210及第二導板220的相對位置以進行複數第一穿孔212及複數第二穿孔222的對位,確保複數第一穿孔212及複數第二穿孔222的正位度處於誤差範圍內。
In practice, after the
由於上述關於第一光學檢測裝置132、第二光學檢測裝置134的拍攝與疊圖計算、滑台120的移動、以及調整裝置112的操作皆可以一自動化方式進行,故相對於現有的人員檢測方式,本發明之穿孔對位總成將能夠大幅提高穿孔的檢測結果與對位效率。
Since the above-mentioned photographing and overlay calculation of the first
然而,於其他實施例中,也可先固定第一導板210,接著使第二導板220在X-Y平面上被調整裝置112微調移動的方式來調整第一導板210及第二導板220之間的相對位置。又或者,亦能夠使第一導板210與第二導板220皆未被固定,而都可在X-Y平面上被調整裝置112微調移動的方式來調整第一導板210及第二導板220之間的相對位置。
However, in other embodiments, the
本發明更揭示之一種穿孔對位方法,如圖2所示,包含下列步驟:S10:提供一模具組110以安裝複數導板200;S20:提供一滑台120以承載模具組110;以及S30:提供一光學影像模組130以拍攝模具組110上的複數導板200,並檢測複數導板200所具有的複數穿孔202以完成複數穿孔202的對位。
The present invention further discloses a perforation alignment method, as shown in FIG. 2 , which includes the following steps: S10 : providing a
其中,滑台120具有一中空區域122,且模具組110被設置於中空區域122之上側。
The slide table 120 has a
於本發明之穿孔對位方法中,光學影像模組130包含一第一光學檢測裝置132及一第二光學檢測裝置134,且第一光學檢測裝置132及第二光學檢測裝置134分別設置於滑台120的一上側及一下側。
In the perforation alignment method of the present invention, the
於本實施例中,複數導板200包含一第一導板210及一第二導板220,第一導板210設置於模具組110之一上側,且第二導板220設置於模具組110之一下側。
In this embodiment, the plurality of
相似於前述,設置於模具組110上側之第一導板210的數量、以及設置於模具組110下側之第二導板220的數量可依據實際的組裝需求進行調整。舉例而言,當因應不同的探針數及防干擾需求時,便可相應增加第一導板210及第二導板220的數量,故第一導板210及第二導板220的數量於此並不加以限制。
Similar to the above, the number of the
於本發明之穿孔對位方法中,位於滑台120上側的第一光學檢測裝置132用以直接拍攝並檢測第一導板210所具有的複數第一穿孔212,位於滑台120下側的第二光學檢測裝置134則經由中空區域122拍攝並檢測第二導板220所具有的複數第二穿孔222。
In the perforation alignment method of the present invention, the first
本發明之穿孔對位方法更包含下列步驟: The perforation alignment method of the present invention further comprises the following steps:
S40:提供一調整裝置112,使調整裝置112依據第一光學檢測裝置132及第二光學檢測裝置134的檢測結果,調整第一導板210及第二導板220的相對位置以進行複數第一穿孔212及複數第二穿孔222的對位。
S40: Provide an
於實際的穿孔對位方法中,當第一導板210及第二導板220已分別設置於模具組110之上側及下側後,可先透過模具組110下側的第二光學檢測裝置134拍攝第二導板220所具有的複數第二穿孔222,並根據拍攝所獲得的檢測結果在X-Y平面上移動滑台120進行第二導板220的初步定位。接著,以滑台120上側的第一光學檢測裝置132拍攝並檢測第一導板210所具有的複數第一穿孔212,
透過比對第一光學檢測裝置132及第二光學檢測裝置134的檢測結果來疊圖計算複數第一穿孔212及複數第二穿孔222之間的正位度。此時,倘若複數第一穿孔212及複數第二穿孔222之間的正位度大於誤差範圍,便可在第二導板220固定不動的情況下,透過調整裝置112的操作,於模具組110的上側沿X-Y平面進行第一導板210位置的微調,藉此變動第一導板210及第二導板220的相對位置以進行複數第一穿孔212及複數第二穿孔222的對位,確保複數第一穿孔212及複數第二穿孔222的正位度處於誤差範圍內。
In the actual perforation alignment method, after the
於其他穿孔對位方法中,也可先固定第一導板210,接著使第二導板220在X-Y平面上被調整裝置112微調移動的方式來調整第一導板210及第二導板220之間的相對位置。又或者,亦能夠使第一導板210與第二導板220皆未被固定,而都可在X-Y平面上被調整裝置112微調移動的方式來調整第一導板210及第二導板220之間的相對位置。
In other perforation alignment methods, the
綜上所述,本發明之穿孔對位總成及穿孔對位方法,其能以自動化方式操作第一光學檢測裝置132、第二光學檢測裝置134、滑台120、及調整裝置112以對複數導板上的複數穿孔進行檢測並完成對位,從而提高穿孔檢測的工作效率及探針卡的組裝良率。
To sum up, the perforation alignment assembly and the perforation alignment method of the present invention can automatically operate the first
上述之實施例僅用來例舉本發明之實施態樣,以及闡釋本發明之技術特徵,並非用來限制本發明之保護範疇。任何熟悉此技術者可輕易完成之改變或均等性之安排均屬於本發明所主張之範圍,本發明之權利保護範圍應以申請專利範圍為準。 The above-mentioned embodiments are only used to illustrate the embodiments of the present invention and to illustrate the technical characteristics of the present invention, and are not used to limit the protection scope of the present invention. Any changes or equality arrangements that can be easily accomplished by those skilled in the art fall within the claimed scope of the present invention, and the scope of protection of the present invention should be subject to the scope of the patent application.
100:穿孔對位總成 100: perforated alignment assembly
110:模具組 110: Die set
112:調整裝置 112: Adjustment device
120:滑台 120: Slider
122:中空區域 122: hollow area
130:光學影像模組 130: Optical imaging module
132:第一光學檢測裝置 132: The first optical detection device
134:第二光學檢測裝置 134: Second optical detection device
200:導板 200: guide plate
202:穿孔 202: Perforation
210:第一導板 210: First guide plate
212:第一穿孔 212: First Piercing
220:第二導板 220: Second guide plate
222:第二穿孔 222: Second Piercing
Claims (8)
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200417449A (en) * | 2003-03-03 | 2004-09-16 | Seiko Precision Kk | Perforating device and method for plate-like works |
| WO2016047486A1 (en) * | 2014-09-26 | 2016-03-31 | 株式会社アルバック | Xy stage, alignment device, and vapor deposition device |
| TW201734463A (en) * | 2016-01-14 | 2017-10-01 | 新光電氣工業股份有限公司 | Probe guide plate and method of manufacturing the same and probe device |
| TW201935017A (en) * | 2018-01-31 | 2019-09-01 | 中華精測科技股份有限公司 | Probe detection device and detection module thereof |
| TW202002149A (en) * | 2018-06-22 | 2020-01-01 | 台灣積體電路製造股份有限公司 | Method for alignment, process tool and method for wafer-level alignment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200417449A (en) * | 2003-03-03 | 2004-09-16 | Seiko Precision Kk | Perforating device and method for plate-like works |
| WO2016047486A1 (en) * | 2014-09-26 | 2016-03-31 | 株式会社アルバック | Xy stage, alignment device, and vapor deposition device |
| TW201734463A (en) * | 2016-01-14 | 2017-10-01 | 新光電氣工業股份有限公司 | Probe guide plate and method of manufacturing the same and probe device |
| TW201935017A (en) * | 2018-01-31 | 2019-09-01 | 中華精測科技股份有限公司 | Probe detection device and detection module thereof |
| TW202002149A (en) * | 2018-06-22 | 2020-01-01 | 台灣積體電路製造股份有限公司 | Method for alignment, process tool and method for wafer-level alignment |
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