TWI750398B - Wafer cassette - Google Patents
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- TWI750398B TWI750398B TW107124799A TW107124799A TWI750398B TW I750398 B TWI750398 B TW I750398B TW 107124799 A TW107124799 A TW 107124799A TW 107124799 A TW107124799 A TW 107124799A TW I750398 B TWI750398 B TW I750398B
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- 239000000463 material Substances 0.000 claims abstract description 33
- 238000005260 corrosion Methods 0.000 claims abstract description 15
- 230000007797 corrosion Effects 0.000 claims abstract description 15
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 7
- 229920002530 polyetherether ketone Polymers 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 102
- 239000002131 composite material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
本發明是有關於一種晶圓架,且特別是有關於一種能夠應用於晶圓傳送盒(Standard Mechanical Interface pod,SMIF pod)中的晶圓架。The present invention relates to a wafer holder, and more particularly, to a wafer holder that can be used in a wafer transfer pod (Standard Mechanical Interface pod, SMIF pod).
在晶圓的製程中,晶圓能夠設置在晶圓架中,進行運送、保存、清洗或者應用於半導體製程或機台自動化製程中,且能夠進一步設置於晶圓傳送盒中進行隔離。晶圓傳送盒例如包括基座、透明外罩與前述的晶圓架,其中晶圓設置於晶圓架後進一步連同晶圓架一併放置於基座上並以透明外罩覆蓋,使晶圓能構夠被水平地存放並進行隔離。如此,晶圓架與晶圓處於同一環境(即同時進行運送、保存、清洗或者上述應用),故提升晶圓架的剛性與強度並兼具抗腐蝕性也成為關注焦點。In the wafer manufacturing process, the wafer can be placed in a wafer rack for transportation, storage, cleaning, or used in a semiconductor process or machine automation process, and can be further placed in a wafer transfer box for isolation. The wafer transfer box includes, for example, a base, a transparent cover and the aforementioned wafer holder, wherein the wafer is placed on the wafer holder and then placed on the base together with the wafer holder and covered with a transparent cover, so that the wafer can be structured. enough to be stored horizontally and isolated. In this way, the wafer holder and the wafer are in the same environment (ie, transport, storage, cleaning or the above-mentioned applications are carried out at the same time), so improving the rigidity and strength of the wafer holder and having both corrosion resistance has also become the focus of attention.
本發明提供一種晶圓架,藉由複合材料的組合同時兼具實用性與保護性。The present invention provides a wafer holder, which has both practicability and protection through the combination of composite materials.
本發明的晶圓架包括一對支撐板、多個支架以及多個支撐件。支撐板彼此對向設置。支架設置於支撐板之間,並連接支撐板,以在支撐板之間構成一容置空間。支撐件對應設置於支架上,其中支撐件的材質不同於支架的材質,且支撐件的材質為具有抗腐蝕性的聚合材料。The wafer rack of the present invention includes a pair of support plates, a plurality of brackets, and a plurality of support members. The support plates are arranged opposite to each other. The brackets are arranged between the support plates and are connected to the support plates to form an accommodating space between the support plates. The supporting member is correspondingly disposed on the bracket, wherein the material of the supporting member is different from that of the bracket, and the material of the supporting member is a corrosion-resistant polymer material.
在本發明的一實施例中,上述的支撐件的材質包括聚醚醚酮(polyetheretherketone,PEEK)。In an embodiment of the present invention, the material of the support member includes polyetheretherketone (PEEK).
在本發明的一實施例中,上述的支撐板的材質與支架的材質相同。In an embodiment of the present invention, the material of the above-mentioned support plate is the same as that of the bracket.
在本發明的一實施例中,上述的支撐板的材質與支架的材質包括不鏽鋼(stainless steel)。In an embodiment of the present invention, the material of the support plate and the material of the bracket include stainless steel.
在本發明的一實施例中,上述的支架各自以嵌入的方式固定於支撐板上。In an embodiment of the present invention, the above-mentioned brackets are respectively fixed to the support plate in an embedded manner.
在本發明的一實施例中,上述的支撐件各自鎖附於支架的對應者上。In an embodiment of the present invention, the above-mentioned support members are respectively locked to the corresponding ones of the brackets.
在本發明的一實施例中,上述的支撐件各自包括多個凹槽。凹槽等間距地分散配置,且面向容置空間,而一晶圓適於穿入並架設於凹槽的對應者而設置於容置空間內。In an embodiment of the present invention, each of the above-mentioned support members includes a plurality of grooves. The grooves are distributed at equal distances and face the accommodating space, and a wafer is suitable for penetrating and erecting a corresponding one of the grooves and is disposed in the accommodating space.
在本發明的一實施例中,上述的支撐板包括兩相對側以及位於兩相對側的一背側,支撐件配置於支撐板之間並分散排列於兩相對側與背側。支撐件中排列於兩相對側者的凹槽彼此相對,支撐件中排列於背側者的凹槽面向位於兩相對側的另一端的一開口側,而晶圓適於從開口側穿入並架設於凹槽的對應者而設置於容置空間內,使得支撐件中排列於兩相對側者的凹槽支撐晶圓的兩相對端且支撐件中排列於背側者的凹槽支撐晶圓的後端。In an embodiment of the present invention, the above-mentioned support plate includes two opposite sides and a back side located on the two opposite sides, and the support members are disposed between the support plates and are distributed on the two opposite sides and the back side. The grooves arranged on the two opposite sides of the support member are opposite to each other, the grooves arranged on the back side of the support member face an open side located at the other end of the two opposite sides, and the wafer is suitable for penetrating from the open side and The corresponding ones are erected on the grooves and set in the accommodating space, so that the grooves arranged on the two opposite sides of the support member support two opposite ends of the wafer and the grooves arranged on the back side of the support member support the wafer the back end.
在本發明的一實施例中,上述的凹槽各自具有一斜面,而斜面以平行於支撐板所在的一虛擬平面為基準而相對於虛擬平面產生傾斜。In an embodiment of the present invention, each of the grooves has an inclined surface, and the inclined surface is inclined relative to the virtual plane based on a virtual plane parallel to the support plate.
在本發明的一實施例中,上述的晶圓架更包括一限位板,設置於支撐板的其中一者的外側,而晶圓架適於透過限位板設置於一晶圓傳送盒上。In an embodiment of the present invention, the above-mentioned wafer rack further includes a limiting plate disposed on the outer side of one of the supporting plates, and the wafer rack is adapted to be disposed on a wafer transfer box through the limiting plate .
基於上述,本發明的晶圓架將支架設置於彼此對向的一對支撐板之間,以在支撐板之間構成容置空間,並進一步將支撐件對應設置於支架上,其中支撐件的材質不同於支架的材質,且支撐件的材質為具有抗腐蝕性的聚合材料。如此,晶圓架藉由支撐板與支架作為架構以確保剛性與強度,並進一步藉由選用具有抗腐蝕性的聚合材料為材質的支撐件增加抗腐蝕性。藉此,本發明的晶圓架藉由複合材料的組合同時兼具實用性與保護性。Based on the above, in the wafer rack of the present invention, the support is arranged between a pair of support plates facing each other to form a accommodating space between the support plates, and the support is further correspondingly arranged on the support, wherein the support of the support is The material is different from that of the bracket, and the material of the support is a corrosion-resistant polymer material. In this way, the wafer rack uses the support plate and the bracket as the structure to ensure rigidity and strength, and further increases the corrosion resistance by selecting the support member made of corrosion-resistant polymer material as the material. Thereby, the wafer holder of the present invention has both practicality and protection through the combination of composite materials.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.
圖1是本發明的一實施例的晶圓架的立體圖。圖2是圖1的晶圓架的前視圖。圖3是圖1的晶圓架的上視圖。請參考圖1至圖3,在本實施例中,晶圓架100包括一對支撐板110與120、多個支架130以及多個支撐件140。支撐板110與120彼此對向設置。支架130設置於支撐板110與120之間,並連接支撐板110與120,以在支撐板110與120之間構成容置空間S。支撐件140對應設置於支架130上,且各自具有面向容置空間S的多個凹槽142。如此,晶圓W適於穿入並架設於凹槽142的對應者而設置於容置空間S內(如後續說明)。FIG. 1 is a perspective view of a wafer holder according to an embodiment of the present invention. FIG. 2 is a front view of the wafer holder of FIG. 1 . FIG. 3 is a top view of the wafer holder of FIG. 1 . Referring to FIGS. 1 to 3 , in this embodiment, the
具體而言,在本實施例中,支撐板110與120各自為板形結構,更進一步例如是板形框架,彼此大致上平行地對向設置(例如設置於圖式中的XYZ座標系中的XY平面但不以此為限制)。支架130例如是條狀支架,且其延伸方向大致上垂直於支撐板110與120(例如設置於圖式中的XYZ座標系中的Z軸但不以此為限制)。其中,支撐板110與120各自包括四個側邊,支架130固定在支撐板110與120之間且排列於支撐板110與120的三個側邊,而其中一側邊未設置支架130。Specifically, in this embodiment, the
詳細而言,以支撐板110為例,支撐板110具有兩相對側112、114以及位於兩相對側112、114之間且彼此相對的背側116與開口側118,而支撐板120具有類似配置。支架130固定在支撐板110與120之間且排列於支撐板110與120的兩相對側112、114及背側116這三個側邊,而開口側118未設置支架130。如此,支撐板110與120與設置在支撐板110與120的三個側邊(即兩相對側112、114及背側116)上的支架130構成晶圓架100的主要架構而提供容置空間S,而晶圓架100以開口側118作為晶圓W的進出口。然而,在其他未繪示的實施例中,可依據需求調整支架130的排列位置僅在支撐板110與120的兩相對側112、114而使背側116與開口側118都未設置支架130,本發明並不限於上述實施方式。In detail, taking the
再者,在本實施例中,支撐板110與120的材質與支架130的材質相同,例如是不鏽鋼。支架130各自以嵌入的方式固定於支撐板110與120上(如圖1的局部A與B的放大圖所示,支架130的底端嵌入於作為支撐板120的板狀框架上)。如此,由支撐板110與120與設置在支撐板110與120的三個側邊(即兩相對側112、114及背側116)上的支架130構成主要架構的晶圓架100具有良好的剛性與強度。然而,在其他未繪示的實施例中,可依據需求調整支撐板110與120與支架130的材質、形狀與固定方式(例如支撐板110與120與支架130亦可為不同材質),本發明不以此為限制。Furthermore, in this embodiment, the material of the
另一方面,支撐件140對應設置於支架130上,其例如是條狀支撐件,且其延伸方向大致上垂直於支撐板110與120(例如設置於圖式中的XYZ座標系中的Z軸但不以此為限制)。更進一步地說,支撐件140與支架130的數量與位置相同,且兩者彼此對應地設置在一起,例如是將支撐件140各自透過鎖附件132鎖附於支架130的對應者的其中一面上。然而,在其他未繪示的實施例中,可依據需求調整為支撐件140僅配置在部分支架130上,本發明並不限於上述實施方式。On the other hand, the
在本實施例中,支撐件140的設置方式是使多個凹槽142面向容置空間S。其中,支撐件140中排列於兩相對側112、114者的凹槽142彼此相對(即,排列於相對側112的支撐件140以其凹槽142面向相對側114,排列於相對側114的支撐件140以其凹槽142面向相對側112),而支撐件140中排列於背側116者的凹槽142面向開口側118(即,排列於背側116的支撐件140以其凹槽142面向開口側118)。如此,當晶圓W從開口側118進入晶圓架100時,晶圓W適於從開口側118穿入對應於同一水平高度的凹槽142並架設於凹槽142的對應者上,進而設置於晶圓架100的容置空間S內。In this embodiment, the supporting
詳細而言,在本實施例中,支撐件140的每一者中所設置的凹槽142等間距地分散配置,例如每一支撐件140都設有13個凹槽142,且支撐件140的凹槽142中位於同一次序者對應於同一水平高度,並適於對應支撐同一晶圓W。舉例而言,如圖1與圖2中所示的晶圓W是穿入並支撐於支撐件140中由上往下的次序為第5個的凹槽142中,而支撐件140的每一者中由上往下的次序為第5個的凹槽142位於同一水平高度。進入容置空間S後的晶圓W如圖1與圖3所示,支撐件140中排列於兩相對側112、114者的凹槽142支撐晶圓W的兩相對端且支撐件140中排列於背側116者的凹槽142支撐晶圓W的後端。In detail, in this embodiment, the
更進一步地說,由於晶圓W為圓形,當晶圓W穿入容置空間S後,排列於背側116的兩個支撐件140以其凹槽142對應支撐晶圓W的後端,而排列於兩相對側112、114中靠近背側116的左右各兩個(共四個)支撐件140以其凹槽142對應支撐晶圓W的兩相對端,其中排列於兩相對側112、114中最靠近背側116的兩個支撐件140呈斜向設置(即支撐板110與120上的背側116與兩相對側112、114之間並非呈現直角),使排列於背側116的兩個支撐件140與排列於兩相對側112、114中靠近背側116的四個支撐件140貼近圓形的晶圓W。如此,設置於容置空間S中的晶圓W在對應於支撐件140中由上往下的次序為第5個的凹槽142的水平高度上受到後側兩點與左右各兩點共六點的支撐,且此六點的支撐所涵蓋的範圍較佳地是涵蓋晶圓W的中心,即晶圓W超過一半部分受到支撐件140的上述六點支撐,使得晶圓W可以穩定地放置於容置空間S內。More specifically, since the wafer W is circular, after the wafer W penetrates into the accommodating space S, the two
另外,雖然排列於兩相對側112、114的其餘支撐件140並未以其凹槽142支撐圓形的晶圓W,但其在晶圓W進入晶圓架100的容置空間S時可以達到引導作用,即晶圓W在進入容置空間S時先穿入排列於兩相對側112、114中最靠近開口側118的兩個支撐件140中由上往下的次序為第5個的凹槽142,進而對應此水平高度往內移動而通過後續的支撐件140中由上往下的次序為第5個的凹槽142,進而放置於排列於背側116的支撐件140與排列於兩相對側112、114且靠近背側116的支撐件140中的由上往下的次序為第5個的凹槽142上,進而達到放置於晶圓架100的容置空間S的目的。雖然上述說明以支撐件140中由上往下的次序為第5個的凹槽142為例作為說明,但支撐件140中的13個凹槽142都可達到支撐晶圓W的作用,即在晶圓W不重疊的情況下,晶圓架100最多可收納13片晶圓W。然而,本發明並不限制凹槽142的數量,其可依據需求調整。In addition, although the
此外,請參考圖1,在本實施例中,晶圓架100更包括限位板150,設置於支撐板110與120的其中一者(如支撐板120)的外側,而晶圓架100適於透過限位板150設置於未繪示的晶圓傳送盒上,使晶圓W能構夠被水平地存放並進行隔離。如此,放置於晶圓架100中的晶圓W可據此進行運送、保存、清洗或者應用於半導體製程中。由於晶圓架100與晶圓W處於同一環境中,而有接觸具有腐蝕性的液體(如晶圓W的清洗液)的狀況,故提升晶圓架100的抗腐蝕性也成為重點。藉此,支撐件140除了以凹槽142提供支撐晶圓W的作用之外,還可以藉由其材料特性增加整體結構的抗腐蝕性。In addition, please refer to FIG. 1 , in this embodiment, the
詳細而言,在本實施例中,支撐件140的材質不同於支架130的材質,更進一步地說,支撐件140的材質為具有抗腐蝕性的聚合材料,例如是聚醚醚酮,但不限於此。如此,在支撐板110與120之間提供支撐作用的支撐結構是由支架130與支撐件140所構成,而支架130與支撐件140選用不同材料,即選用複合材料的組合(不鏽鋼與聚醚醚酮的組合),藉此使晶圓架100藉由選用不鏽鋼製作主要架構(即支撐板110與120與支架130)而確保晶圓架100的剛性與強度,並藉由選用具有抗腐蝕性的聚醚醚酮製作支撐件140而增加晶圓架100的抗腐蝕性。並且,除了上述技術特徵之外,晶圓架100的其餘設置方式(如整體尺寸或者凹槽數量)可以適用現有晶圓架的規格,使得本實施例的晶圓架100可應用於現有的晶圓傳送盒。藉此,晶圓架100藉由複合材料的組合同時兼具實用性與保護性。In detail, in this embodiment, the material of the
請參考圖1與圖2,特別是圖1的局部B與圖2的局部C的放大圖,在本實施例中,凹槽142各自具有斜面142a與平面142b,其中平面142b平行於支撐板110與120所在的虛擬平面(如XYZ座標系中的XY平面),斜面142a以平行於支撐板110與120所在的虛擬平面(如XYZ座標系中的XY平面)為基準而相對於虛擬平面產生傾斜(即相對於平面142b產生傾斜),且斜面142a位於平面142b的外側(即平面142b位於凹槽142內部且斜面142a面向容置空間S)。如此,凹槽142以平面142b達到支撐晶圓W的作用,而當晶圓架100連同晶圓W應用於具有液體的環境中時(如清洗),晶圓架100上特別是晶圓架100的凹槽142內的斜面142a,可協助液體留出凹槽142而不易殘留。然而,本發明並不限制斜面142a的設置與否,其可依據需求調整,只要凹槽142能達到支撐晶圓W的作用即可。Please refer to FIG. 1 and FIG. 2 , especially the enlarged views of part B of FIG. 1 and part C of FIG. 2 , in this embodiment, the
綜上所述,本發明的晶圓架將支架設置於彼此對向的一對支撐板之間,以在支撐板之間構成容置空間,並進一步將支撐件對應設置於支架上,其中支撐件的材質不同於支架的材質,且支撐件的材質為具有抗腐蝕性的聚合材料,使得支撐於支撐板之間的支撐結構(即支架與支撐件)是選用複合材料的組合(例如是不鏽鋼與聚醚醚酮的組合)。如此,晶圓架藉由支撐板與支架作為架構以確保剛性與強度,並藉由選用具有抗腐蝕性的聚合材料為材質的支撐件增加抗腐蝕性。並且,晶圓架以支撐件上的凹槽提供晶圓多點支撐,藉以提升晶圓於晶圓架中的穩定性。藉此,本發明的晶圓架藉由複合材料的組合同時兼具實用性與保護性。To sum up, in the wafer rack of the present invention, the support is arranged between a pair of support plates facing each other to form a accommodating space between the support plates, and the support members are further correspondingly arranged on the support, wherein the support The material of the parts is different from the material of the bracket, and the material of the support is a polymer material with corrosion resistance, so that the support structure (ie the bracket and the support) supported between the support plates is a combination of composite materials (such as stainless steel) in combination with PEEK). In this way, the wafer rack uses the support plate and the bracket as a structure to ensure rigidity and strength, and uses a corrosion-resistant polymer material as the support member to increase corrosion resistance. In addition, the wafer holder provides multi-point support for the wafer through the grooves on the support member, so as to improve the stability of the wafer in the wafer holder. Thereby, the wafer holder of the present invention has both practicality and protection through the combination of composite materials.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.
100‧‧‧晶圓架110、120‧‧‧支撐板112、114‧‧‧相對側116‧‧‧背側118‧‧‧開口側130‧‧‧支架132‧‧‧鎖附件140‧‧‧支撐件142‧‧‧凹槽142a‧‧‧斜面142b‧‧‧平面150‧‧‧限位板A、B、C‧‧‧局部S‧‧‧容置空間W‧‧‧晶圓100‧‧‧
圖1是本發明的一實施例的晶圓架的立體圖。 圖2是圖1的晶圓架的前視圖。 圖3是圖1的晶圓架的上視圖。FIG. 1 is a perspective view of a wafer holder according to an embodiment of the present invention. FIG. 2 is a front view of the wafer holder of FIG. 1 . FIG. 3 is a top view of the wafer holder of FIG. 1 .
100‧‧‧晶圓架 100‧‧‧Wafer rack
110、120‧‧‧支撐板 110, 120‧‧‧Support plate
112、114‧‧‧相對側 112, 114‧‧‧ Opposite side
116‧‧‧背側 116‧‧‧Back
118‧‧‧開口側 118‧‧‧Open side
130‧‧‧支架 130‧‧‧Bracket
132‧‧‧鎖附件 132‧‧‧Lock accessories
140‧‧‧支撐件 140‧‧‧Support
142‧‧‧凹槽 142‧‧‧Grooving
142a‧‧‧斜面 142a‧‧‧Bevel
142b‧‧‧平面 142b‧‧‧Flat
150‧‧‧限位板 150‧‧‧Limiting plate
A、B‧‧‧局部 A, B‧‧‧Partial
W‧‧‧晶圓 W‧‧‧Wafer
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107124799A TWI750398B (en) | 2018-07-18 | 2018-07-18 | Wafer cassette |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107124799A TWI750398B (en) | 2018-07-18 | 2018-07-18 | Wafer cassette |
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| Publication Number | Publication Date |
|---|---|
| TW202006860A TW202006860A (en) | 2020-02-01 |
| TWI750398B true TWI750398B (en) | 2021-12-21 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107124799A TWI750398B (en) | 2018-07-18 | 2018-07-18 | Wafer cassette |
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| Country | Link |
|---|---|
| TW (1) | TWI750398B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI329604B (en) * | 2003-10-24 | 2010-09-01 | Entegris Inc | Substrate carrier |
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2018
- 2018-07-18 TW TW107124799A patent/TWI750398B/en active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI329604B (en) * | 2003-10-24 | 2010-09-01 | Entegris Inc | Substrate carrier |
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|---|---|
| TW202006860A (en) | 2020-02-01 |
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