TWI750228B - Light emitting device and method for manufacturing light emitting device - Google Patents

Abstract

A light emitting device includes a resin molding, first and second leads, and a light emitting element. The resin molding includes a front surface defining an opening, and a lower surface adjacent to the front surface. The first and second leads each includes an outer lead portion and an inner lead portion. The outer lead portion protrudes from the lower surface of the resin molding, and includes a bent portion bent along the lower surface. A surface on an inner side of the bent portion including a first recessed section. The inner lead portion includes an embedded portion embedded in the resin molding, and an exposed portion exposed in the opening. A surface of the embedded portion opposite from the surface where the first recessed section is provided includes a second recessed with a part of the resin molding being positioned in the second recessed section.

Description

Light-emitting device and method of manufacturing the same

The present invention relates to a light-emitting device and a manufacturing method thereof.

In recent years, high-brightness, high-output light-emitting elements and small light-emitting devices have been developed and used in various fields. For example, in order to miniaturize and reduce the weight of a light source used in a backlight of a liquid crystal display device, the thinning of the light source is being sought. Therefore, for example, various forms of side-view light-emitting devices are being developed. A side-view light-emitting device is generally configured such that a light-emitting element is mounted on a package having an opening for emitting light from the front side of the package, and two lead electrodes are drawn out from the lower surface of the package as external terminals. The two lead electrodes drawn out are bent to the front side or the opposite side of the package, that is, the back side, and the lower surface side of the bent lead electrodes is used as a mounting surface (for example, refer to Japanese Patent Laid-Open No. 2008-258233).

In the above light-emitting device, the two lead electrodes drawn from the lower surface of the package are bent at a predetermined angle, but there are deviations in machining accuracy such as deviation of the bending position and change of the bending angle, which may reduce the installation accuracy of the light-emitting device.

An object of an embodiment of the present invention is to provide a light-emitting device with high installation accuracy A device and a method of manufacturing a light-emitting device.

(1) A light-emitting device according to an embodiment of the present invention includes: a first lead wire and a second lead wire; and a resin molded body having an opening in the front surface and a portion in which the first lead wire and the second lead wire are embedded, and which is connected to the front surface. adjoining the lower surface; and a light-emitting element mounted in the opening; and the first lead and the second lead respectively have an outer lead portion protruding from the lower surface of the resin molded body and having an outer lead portion along the resin molded body A bent portion whose lower surface is bent; and an inner lead portion having a buried portion embedded in the resin molded body and an exposed portion exposed in the opening portion; the first lead or the second lead has: a first concave portion, which is The outer lead portion is provided on the inner side of the bending portion; and a second recessed portion is provided on the surface opposite to the surface on which the first recessed portion is provided in the embedded portion of the inner lead portion; A part of the above-mentioned resin molded body is arranged in the concave portion.

(2) The method of manufacturing a light-emitting device according to an embodiment of the present invention includes the following steps: a step of preparing a package having: a first lead and a second lead; and a resin molded body having an opening on the front surface and a buried a portion of the first lead and the second lead, and a lower surface adjacent to the front surface; and The first lead and the second lead respectively have: an outer lead portion protruding from the lower surface of the resin molded body; an inner lead portion having a buried portion embedded in the resin molded body and an exposed portion exposed in the opening portion; A first recessed portion is provided on the inner side of the bent portion in the outer lead portion; a second recessed portion is provided on a surface opposite to the surface on which the first recessed portion is provided in the embedded portion of the inner lead portion, and A part of the resin molded body is arranged; and the step of bending the outer lead portion in the first concave portion so as to follow the lower surface of the resin molded body.

(3) A light-emitting device according to another embodiment of the present invention includes: a first lead wire and a second lead wire; and a resin molded body having an opening in the front surface and a portion in which the first and second lead wires are embedded, and which is connected to the front surface. adjoining the lower surface; and a light-emitting element mounted in the opening; and the first lead and the second lead respectively have an outer lead portion protruding from the lower surface of the resin molded body and having an outer lead portion along the resin molded body A bent portion with a bent lower surface; an inner lead portion having a buried portion embedded in the resin molded body and an exposed portion exposed in the opening portion; the first lead or the second lead having the aforementioned bend in the outer lead portion The embedded portion of the inner lead portion has a thin-walled portion or a hole thinner than the average thickness of the first lead and the second lead.

According to the light-emitting device and the manufacturing method thereof according to an embodiment of the present invention, a light-emitting device with high mounting accuracy can be obtained with high precision.

10: Package

20a: Side 1

20b: Side 2

21, 121, 221: 1st lead

21a: Inner lead portion of the first lead

21b, 121b, 221b: first lead outer lead portion

21x, 22x: Branches

22, 122, 222: 2nd lead

22a: Inner lead part of the second lead

22b, 122b, 222b: second lead outer lead portion

30, 130, 230: resin molded body

30a: Front

30b: Back

30c: lower surface

30d: upper surface

32: Opening

34a: Lead configuration part

34b: convex part

40: Light-emitting element

50: 1st recess

50x: Recess

51: 2nd recess

52a: protrusion

52b: Sag

60: Translucent resin

71: Upper mold

72: Lower mold

73: Top surface

74: Gate

75: Space

78: Resin material

100: Lighting device

150, 151: slot

230c: Lower surface

250, 251: hole

W: Thickness

FIG. 1A is a schematic front view of a light-emitting device according to an embodiment of the present invention.

FIG. 1B is a schematic bottom view of the light-emitting device of FIG. 1A .

FIG. 1C is a schematic cross-sectional view taken along line II-II' of FIG. 1A .

FIG. 1D is a schematic cross-sectional view taken along the line III-III′ of FIG. 1A .

FIG. 1E is an enlarged view of the leads of FIG. 1D .

FIG. 1F is a schematic cross-sectional view of a modification of the light-emitting device of FIG. 1A .

FIG. 2A is a schematic front and rear view for illustrating a package used in the light emitting device of FIG. 1A.

FIG. 2B is a schematic front view of FIG. 2A and an enlarged view thereof.

FIGS. 3( a ) to ( f ) are schematic cross-sectional views showing examples of the first concave portion and/or the second concave portion in the first lead and the second lead.

FIG. 4A is a schematic rear view and an enlarged view of a package for illustrating a modification of the light-emitting device of FIG. 1A .

Figure 4B is an enlarged view of the schematic front view of Figure 4A.

FIG. 5A is a schematic rear view and an enlarged view of a package for illustrating a modification of the light-emitting device of FIG. 1A .

Fig. 5B is an enlarged view of the schematic front view of Fig. 5A.

FIG. 6A is a schematic top view of the lead wires for explaining the first lead wire and the second lead wire of the light-emitting device of FIG. 1A .

FIG. 6B is a schematic rear view of the leads of FIG. 6A.

FIGS. 7( a ) to ( c ) are schematic cross-sectional step diagrams showing the manufacturing steps of the light-emitting device according to an embodiment of the present invention.

FIGS. 8( a ) and ( b ) are schematic cross-sectional step diagrams showing the manufacturing steps of the light-emitting device according to one embodiment of the present invention.

Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the forms described below are not particularly prescribed descriptions in order to embody the technical idea of the present invention, and the present invention is not limited to the following forms. In addition, the size, positional relationship, etc. of the members shown in the drawings may be exaggerated for the sake of clarity.

Embodiment 1: Light-emitting device

As shown in FIGS. 1A to 1D , the light-emitting device 100 of this embodiment includes a first lead 21 and a second lead 22 , an opening 32 on the front surface 30 a and a portion where the first lead 21 and the second lead 22 are embedded, and The front surface 30 a is adjacent to the resin molded body 30 on the lower surface 30 c ; and the light emitting element 40 placed in the opening 32 .

In this case, a container including the first lead 21, the second lead 22, and the resin molded body 30, housing the light-emitting element 40, and having terminals (electrodes) for supplying power to the light-emitting element 40 from the outside may be referred to as a package. In the package 10, the surface having the light emitting surface of the resin molded body 30 is called the front surface 30a, the surface on the opposite side is called the back surface 30b, the surface adjacent to the front surface is called the lower surface 30c, and the The surface on the opposite side is referred to as the upper surface 30d. The package 10 shown in FIG. 1A and the like is used for a side-emission type light-emitting device, for example, and generally, the lower surface 30 c becomes the mounting surface of the light-emitting device 100 .

The first lead 21 and the second lead 22

The first lead 21 and the second lead 22 constitute a pair of positive and negative terminals (electrodes) of the package 10 . The first lead 21 and the second lead 22 each have a first surface 20a and a second surface 20b which is a surface on the opposite side. The first surface 20 a is exposed on the bottom surface of the opening 32 of the resin molded body 30 , and is the surface on which the electric wire electrically connected to the light-emitting element 40 is provided. The first surface 20a of the first lead 21 and the first surface 20a of the second lead 22 are arranged on the same surface side. As will be described later, the first lead 21 and the second lead 22 are respectively provided on the first surface 20a. There is a second concave portion 51, and the second surface 20b has a first concave portion.

The first lead 21 and the second lead 22 have inner lead portions 21a, 22a and outer lead portions 21b, 22b, respectively.

The outer lead portions 21b and 22b protrude outward from the lower surface 30c of the resin molded body 30, and are bent along the lower surface of the resin molded body. As in the present embodiment, the outer lead portions 21b and 22b may be bent so as to extend in the direction opposite to the front surface 30a of the resin molded body, that is, in the direction of the back surface 30b (see FIG. 1D ), or may be bent in the direction of the front surface 30a. extension (see Figure 1F). Since the outer lead portions 21b and 22b protrude from the lower surface 30c of the resin molded body 30, the heat dissipation path from the light-emitting element 40 to the mounting substrate can be shortened.

Further, the outer lead portions 21b and 22b preferably have extension portions extending to the left and right side surfaces of the resin molded body 30, and the extension portions are bent so as to extend upward along the side surfaces of the resin molded body 30, and are arranged on the side surfaces. Thereby, the stability when the light-emitting device 100 is mounted on a mounting board or the like can be improved. In particular, in this embodiment, the positions and angles of the bent portions of the outer lead portions 21 b and 22 b are stabilized by the first concave portions 50 . Accordingly, the position and angle of the portion of the side surface of the resin molded body 30 disposed in the extension portion can also be stabilized, and the mounting of the light-emitting device 100 can be further stabilized.

As shown in FIG. 2 , the outer lead portions 21b and 22b are bent at positions adjacent to the lower surface 30c of the resin molded body 30, and a first recess 50 is disposed on the second surface 20b side, that is, inside the bent portion. The first concave portion refers to a thin-walled portion that is thinner than the average thickness of the first lead and the second lead before the outer lead portion is bent. The thickness of the first lead and the second lead refers to the distance from the first surface 20a to the second surface 20b, and specifically refers to the thickness of the thinnest part of the first lead 21 and the second lead 22. The average thickness of the first lead wire and the second lead wire means the average value of the thicknesses of the first lead wire 21 and the second lead wire 22 measured at least 30 points at a substantially constant interval. The thickness of the thin portion (first concave portion) refers to the shortest thickness W from the first surface 20a to the second surface 20b as shown in FIG. 3( a ) before the outer lead portion is bent. Moreover, after the outer lead portion is bent, as shown in FIG. 3(d) and FIG. 1(E), for example, it refers to the thickness W at which the distance from the first surface 20a to the second surface 20b becomes the shortest (FIG. 3(e) and (f) the same). For example, as shown in FIG. 2, the first concave portion 50 may be arranged along the lower surface 30c of the resin molded body 30 from one end to the other end of the outer lead portions 21b, 22b, that is, over the entire width of the outer lead portions 21b, 22b A groove. Thereby, the outer lead portions 21b and 22b can be easily bent. In addition, a plurality of continuous grooves in the form of dotted lines may be used. Furthermore, as shown in FIG. 4 , it may be arranged along the lower surface 130c of the resin molded body 130, from the inner side of one end of the outer lead portions 121b, 122b to the inner side of the other end, that is, not over the outer lead portions 121b, 122b. One slot 150 across the width. 5, along the lower surface 230c of the resin molded body 230, from one end to the other end of the outer lead portions 221b, 222b may be arranged in parallel to form a plurality of holes 250 in a line. In addition, a plurality of the above-mentioned first recesses 50 may be provided. For example, two or more grooves may be provided over substantially the entire width of the inner lead portions 21a and 22a.

The first concave portion 50 is provided inside the bent portion of the outer lead portions 21b and 22b. Therefore, in the present embodiment in which the outer lead parts 21b and 22b are bent in the direction of the rear surface 30b of the resin molded body 30, the first recess 50 is arranged on the second surface 20b side of the outer lead parts 21b and 22b. However, when the outer lead portions 21b and 22b are bent toward the front surface 30a side of the resin molded body 30, the first concave portion 50 is provided on the first surface 20a of the outer lead portions 21b and 22b.

The inner lead portions 21a, 22a and the outer lead portions 21b, 22b are arranged continuously in correspondence with each other, and have a buried portion embedded in the resin molded body 30 and an exposed portion exposed on the bottom surface of the opening portion 32 of the resin molded body 30. .

As shown in FIG. 2, the buried portions of the inner lead portions 21a and 22a of the present embodiment have second recesses 51 provided on the surfaces opposite to the surfaces on which the first recesses 50 are respectively provided, that is, the first recesses 50. 1 side 20a side. The second recessed portion means a thin portion thinner than the average thickness of the first lead and the second lead. Book The second concave portion 51 of the embodiment is provided at a position closer to the outer lead than the exposed portion, and extends in a direction along the lower surface 30c. The second concave portion 51 may be, for example, a groove shape provided along the lower surface 30c of the resin molded body 30 over substantially the entire width of the inner lead portions 21a and 22a. Thereby, the adhesiveness of the inner lead parts 21a and 22a and the resin molding 30 can be improved. In addition, a plurality of continuous grooves in the form of dotted lines may be used. Also, as shown in FIG. 4 , it may be arranged along the lower surface 130c of the resin molded body 130 from the inner side of one end of the inner lead portions 121a, 122a to the inner side of the other end, that is, not over the inner lead portions 121a, 122a A slot 151 approximately the entire width. 5, along the lower surface 230c of the resin molded body 230, from one end to the other end of the inner lead portions 221a, 222a may be a plurality of holes 251 arranged in a line. In addition, a plurality of the above-mentioned second recesses 51 may be provided. For example, two or more grooves may be provided over substantially the entire width of the inner lead portions 221a and 222a. A part of the resin molded body 30 is arranged in the second concave portion 51 .

The 2nd recessed part 51 is provided in the surface opposite to the surface of the 1st recessed part 50 in which the outer lead parts 21b and 22b are provided. Therefore, in the present embodiment in which the first recesses 50 are arranged on the second surface 20b side of the outer lead parts 21b and 22b, the second recesses 51 are arranged on the first surfaces 20a of the inner lead parts 21a and 22a. However, when the outer lead portions 21b, 22b are bent toward the front surface 30a side of the resin molded body 30 and the first recessed portion 50 is provided on the first surface 20a side of the outer lead portions 21b, 22b, the second recessed portion 51 is provided on the inner lead The second surface 20b of the parts 21a and 22a.

2, 4 and 5, the first concave portion 50 and the second concave portion 51 have the same shape as each other, but the first concave portion 50 and the second concave portion 51 may be combined with shapes different from the above-mentioned shapes. , and different shapes may be combined between the first lead and the second lead.

The thickness of the first lead 21 and the second lead 22 can be appropriately adjusted according to the characteristics and dimensions of the light-emitting device to be obtained, for example, 0.05-1 mm, preferably 0.07-0.3 mm, and more preferably 0.1-0.2 mm.

The depths of the first concave portion 50 and the second concave portion 51 can be appropriately adjusted according to the thickness of the lead, for example, 1/5~1/2 of the thickness of the outer lead portion, more preferably 1/4~1/2.

The width of the first concave portion 50 and the second concave portion 51 is, for example, about 40 μm to 100 μm.

The length of the first recess 50 and the second recess 51 (the extending direction of the recess, eg, the length parallel to the lower surface 30 c of the resin molded body 30 ) is, for example, 1/2 to 1 times the width of the outer lead portion. As shown in FIG. 4A , when the groove 150 is formed from the vicinity of one end of the outer lead portions 121b and 122b to the vicinity of the other end, and the recesses are not formed at both ends of the groove 150, the groove 150 is preferably formed from the outer lead portions 121b, 122b, The distance between the ends of 122b is 30 μm~60 μm, preferably about 50 μm, and the distance is set at a distance of about 50 μm. With the above configuration, the strength of the bent portion of the lead wire can be ensured.

The distance between the first concave portion 50 and the second concave portion 51 in plan view can be appropriately adjusted according to the characteristics and dimensions of the light-emitting device to be obtained, the thickness of the resin molding, the thickness of the lead frame, etc. Preferably it is about 50-100 micrometers, More preferably, it is about 80 micrometers.

By selecting the above-mentioned range, the strength of the first lead 21 and the second lead 22 can be sufficiently secured.

The above-described first recessed portion 50 and second recessed portion 51 can reduce variations in the bending position and bending angle of the lead wire when the outer lead portion is bent, as will be described later. In this way, by using the first surface 20a of the bent outer lead portions 21b and 22b as the mounting surface of the light-emitting device, a light-emitting device with high mounting accuracy can be formed. In particular, by arranging the second concave portion 51 in the embedded portion of the inner lead, a part of the resin molded body can be embedded in the second concave portion. Thereby, the stress at the time of bending can be further relaxed. In other words, even if the stress caused by the bending of the lead is applied, by having the second concave portion 51 on the outer side surface of the bent portion, a part of the resin molded body embedded in the second concave portion 51 exhibits an anchoring effect, so that the lead and the lead can be secured. The adhesiveness of the resin molded body can reduce the possibility of peeling off the resin molded body and the lead. As a result, it is possible to reduce the intrusion of moisture into the interior of the light-emitting device 100 from the gap between the resin and the lead wire to degrade the components of the light-emitting device 100 or the reduction of the light-emitting device 100 It is possible to provide the light-emitting device 100 with high reliability because of the possibility of soldering flux or the like used for mounting on the mounting board.

字狀，亦可為V字形狀。第1凹部50及第2凹部51較佳形成為分別使第2面20b側之寬度或者第1面20a側之寬度大於底部側之寬度。上述凹部、尤其是第1凹部50，如圖3(d)所示，對抑制引線之彎曲部分之回彈有效。 As shown in FIG. 3 , the first concave portion 50 or the second concave portion 51 may have a U-shaped cross-sectional shape, or may be

It can also be V-shaped. The first concave portion 50 and the second concave portion 51 are preferably formed so that the width on the side of the second surface 20b or the width on the side of the first surface 20a is larger than the width on the bottom side, respectively. The above-mentioned concave portion, especially the first concave portion 50, as shown in FIG. 3(d), is effective in suppressing the springback of the bent portion of the lead wire.

As a shape of the said recessed part, as shown in FIG.3(a), for example, it is preferable that the cross-sectional shape is a V shape. In this case, the opening angle of the V-shape is 60°~120°, more preferably 80°~100°, and the bottom of the V-shape groove can also be a smooth shape.

Moreover, as shown in FIG.3(b), the 1st recessed part 50 and the 2nd recessed part 51 may have the protrusion 52a on one side surface of the inside, and the recess 52b on the other side surface. In particular, when the outer lead portions 21b and 22b of the first concave portion 50 are bent, as shown in FIG. 3( e ), it is preferable that the protrusion 52a and the concave portion 52b are fitted into each other. Thereby, the bending angle of the lead wire can be stabilized.

In addition, as shown in FIG. 3( c ), the first concave portion 50 and the second concave portion 51 may have a V-shaped groove bottom in cross-section, and may have a larger inclination angle than the V-shaped inclined surface or a shape with a vertical surface. In particular, by making the first concave portion 50 into the above-mentioned shape, as shown in FIG. 3(f), a space can be provided inside the bent portion after the lead wire is bent, the stress acting on the bent portion can be relieved, and the bending angle of the lead wire can be stabilized. .

Resin molded body 30

The resin molding 30 of this embodiment has the opening part 32 in the front surface 30a. Moreover, the resin molding 30 has a part of the 1st lead 21 and the 2nd lead 22 embedded, and the lower surface 30c which adjoins the front surface 30a.

The lower surface 30c of the resin molded body 30 has leads on which the above-mentioned outer lead portions 21b and 22b are arranged The arrangement portion 34a and the convex portion 34b located below the lead arrangement portion 34a.

The shortest distance (thickness) between the lower surface 30c and the upper surface 30d of the resin molded body 30 is, for example, 0.1-1 mm, preferably 0.1-0.5 mm, and more preferably 0.2-0.3 mm. When the thickness of the resin molded body 30 is about 0.2 to 0.3 mm, since the wall thickness of the resin molded body 30, for example, the wall thickness between the opening portion 32 and the lower surface 30c, is reduced, the outer lead portions 21b and 22b are thinned. The resin molded body 30 is easily damaged during bending. However, in the present embodiment, since the stress at the time of bending the outer lead portions 21b and 22b can be further relaxed, the possibility of breakage or the like of the resin molded body 30 can be reduced.

The resin molded body 30 constitutes a part of the outer shape of the package 10 . From the viewpoint of the efficiency of outputting light forward, the resin molded body 30 preferably has a light reflectance of 70% or more at the light emission peak wavelength of the light-emitting element 40, more preferably 80% or more, and still more preferably 90% or more. The resin molded body 30 is preferably white. The resin molded body 30 can be molded by an injection molding method, a transfer molding method, or the like.

The resin molded body 30 can be formed using a thermosetting resin or a thermoplastic resin, and is preferably a thermoplastic resin because it is easy to mold by an injection molding method and is less expensive than a thermosetting resin. As the thermoplastic resin, any one of aliphatic polyamide resin, polyethylene terephthalate, and polyethylene terephthalate is preferable. Moreover, thermosetting resins are preferable from the viewpoints of good heat resistance and light resistance, long life, and high reliability compared with thermoplastic resins. As the thermosetting resin, any one of epoxy resin, silicone resin, and unsaturated polyester resin is preferable. In particular, unsaturated polyester resins and modified resins thereof are preferable because they have good heat resistance and light resistance of thermosetting resins, and can be molded by injection molding. The resin molded body 30 preferably contains, for example, titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, hydroxide Calcium, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, zirconia One or more than two kinds of white pigments and/or fillers. Among them, titanium oxide with high refractive index and good light shielding property is preferable.

As the material of the resin molded body 30, when a thermosetting resin, especially an unsaturated polyester fiber is used, the resin molded body 30 may become fragile and easily damaged. When the outer lead portions 21b and 22b are bent, the resin molded body 30 is easily damaged. However, in the present embodiment, since the stress at the time of bending the outer lead portions 21b and 22b can be further relaxed, the possibility of breakage or the like of the resin molded body 30 can be reduced.

light-emitting element

The light-emitting element 40 of the present embodiment is mounted on the first surface 20a of the inner lead portion 21a of the first lead 21 via an adhesive member. In addition, a pair of positive and negative electrodes of the light-emitting element 40 is electrically connected to the first surface 20a of the two inner lead portions 21a and 22a via wires. Alternatively, the light-emitting element may be flip-chip mounted on the first lead 21 and the second lead 22 .

As the light-emitting element, for example, a semiconductor light-emitting element such as a light-emitting diode can be used. The light-emitting element may include a light-transmitting substrate and a semiconductor laminate formed thereon. For the light-transmitting substrate, for example _{, a light-transmitting insulating material such as sapphire (Al 2} O ₃ ), a semiconductor material (for example, a nitride-based semiconductor material) that transmits light from a semiconductor laminate, and the like can be used. The semiconductor laminate includes, for example, a plurality of semiconductor layers such as an n-type semiconductor layer, a light-emitting layer (active layer), and a p-type semiconductor layer. Examples of the semiconductor layer include semiconductor materials such as group III-V compound semiconductors and group II-VI compound semiconductors. Specifically, the use of _{In X Al Y Ga 1-XY} N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) and other nitride-based semiconductor material. The light-emitting element may have a pair of electrodes on the same surface side, or may have a pair of electrodes on a different surface side. A pair of electrodes is preferably made of good electrical conductors, such as metals such as Cu.

Embodiment 2: Manufacturing method of light-emitting device

The manufacturing method of the light-emitting device of this embodiment includes the steps of preparing the package and bending the outer lead portion along the lower surface of the resin molded body in the first concave portion.

(1) Preparation of package 10

First, prepare the metal plate that becomes the lead frame. As shown in FIGS. 6A and 6B , the metal plate is formed by hollowing out the portion formed by the first lead 21 and the second lead 22, such as punching (including punching), etching, rolling, and other various processes. It is a lead frame having a first lead 21 and a second lead. Examples of the metal plate include copper, aluminum, gold, silver, tungsten, iron, nickel, cobalt, molybdenum, a single-layer flat plate of an alloy of the above-mentioned metals, a laminate of the above-mentioned metals or alloys, and the like. In particular, copper alloys (phosphor bronze, iron-containing copper, etc.) with copper as the main component are preferred. In addition, a light-reflecting film of silver, aluminum, rhodium, or an alloy of the above-mentioned metals may be provided on the surface, and among them, it is preferable to cover with a light-reflecting film of silver or a silver alloy with good light reflectivity. In FIGS. 6A and 6B , the lead frame having one unit of the portion formed by the first lead 21 and the second lead 22 is shown, but it is usually processed such that plural units of this unit are arranged in a matrix.

On the first surface 20a of the first lead 21 and the second lead 22, as shown in FIG. 2A, a second recess 51 is formed at a portion corresponding to the embedded portion of the inner lead portion. That is, the second concave portion 51 is formed extending in the direction along the lower surface 30c of the resin molded body 30 described later at a position closer to the portion corresponding to the outer lead than the portion corresponding to the exposed portion of the inner lead portion. On the second surface 20b of the first lead 21 and the second lead 22, as shown in FIG. 2B, a first recess 50 is provided at a portion corresponding to the outer lead portions 21b and 22b. This 1st recessed part is adjacent to the lower surface 30c of the resin molding 30 mentioned later, and is extended in the direction along the lower surface 30c. The 1st recessed part 50 can be formed after the resin molding mentioned later is formed.

The first concave portion 50 and the second concave portion 51 can be formed by, for example, pressing, cutting, etching, laser irradiation, or the like. The method by laser irradiation can form the 1st recessed part 50 with high precision after shaping|molding the resin molded object 30.

After that, as shown in FIG. 7( a ), the lead frame is placed between the upper mold 71 and the lower mold 72 . The top surface 73 of the portion of the upper mold 71 corresponding to the package opening is in contact with the first surfaces 20a of the inner lead portions 21a and 22a. At this time, in the space 75 sandwiched between the upper mold 71 and the lower mold 72, a part of the inner lead portion 21a of the first lead 21 including the second recessed portion 51 and the inner lead portion 22a of the second lead 22 are arranged. The outer lead portion 21 b of the first lead 21 and the outer lead portion 22 b of the second lead 22 are not arranged in the space 75 .

As shown in FIG. 7( b ), the resin material 78 is injected into the space 75 sandwiched by the upper mold 71 and the lower mold 72 from the gate 74 provided in the lower mold 72 . Thereby, a part of the inner lead part 21a of the first lead 21 and a part of the inner lead part 22a of the second lead 22 can be exposed on the bottom surface of the opening of the package 10 obtained. The resin molded body 30 is formed by curing or curing the resin material 78 filled in the mold. After that, as shown in FIG. 7( c ), the upper mold 71 and the lower mold 72 are removed.

After that, the lead wires are cut in accordance with the resin molded body 30, and the shape is arranged.

In the package 10 obtained as described above, for example, as shown in FIG. 2 , the outer lead portion 21b of the first lead 21 and the outer lead portion 22b of the second lead 22 are extended in the vertical direction from the lower surface 30c of the resin molded body 30 . In this case, the first concave portion 50 is exposed from the resin molded body 30, but the second concave portion 51 is embedded in the resin molded body 30. Therefore, the resin constituting the resin molded body 30 is embedded in the second concave portion.

By arranging the first concave portion 50 and the second concave portion 51, when the outer lead portions 21b and 22b to be described later are bent, the bending position and bending angle of the lead wires can be stabilized. In particular, since the second recess 51 and the portion of the resin molding body close to the outer lead portion are embedded in a part of the resin, the inner lead embedded portion can be maintained at an appropriate position even if stress due to lead bending is applied. Resin peeling can be prevented, stress can be further relieved, and lead wire bending can be stabilized.

(2) Step of bending the outer lead portion

In order to make the second surfaces 20b of the outer lead portions 21b of the first lead 21 and the outer lead portions 22b of the second leads 22 face the lower surface 30c of the resin molded body 30, the outer lead portions 21b, 22b is bent. Thus, the first surface 20a of the outer lead portions 21b and 22b is used as a mounting surface of the light-emitting device 100 .

The outer lead portions 21b and 22b have branch portions (refer to 21x and 22x in FIG. 1B ) at the front ends, and at least a part of the branch portions may be bent toward the front surface 30a along the left and right side surfaces of the resin molded body 30 . At this time, a concave portion (refer to 50x in FIG. 2 ) is also formed on the side of the second surface 20b of the curved portion of the branch portions 21x and 22x, and the branch portions 21x and 22x may be bent in the concave portion. It is preferable that this branch part is bent by a predetermined angle in advance before bending the part which becomes the mounting surface of the said outer lead part 21b, 22b.

In the light-emitting device 100 formed as described above, the outer lead portions 21b and 22b are bent along the first concave portion 50 of the lower surface 30c of the resin molded body 30 and in the vicinity of the second concave portion 51, so that the bending position of the lead wire can be reduced. Deviation of the bending angle. In this way, by using the first surface 20a of the bent outer lead portions 21b and 22b as the mounting surface of the light-emitting device, a light-emitting device with high mounting accuracy can be formed. In addition, the light-emitting device 100 can suppress the rebound of the bent portion. In addition, since a part of the resin molded body is embedded in the second concave portion 51, the stress at the time of bending can be further relieved, and the deviation of the bending position and bending angle of the lead wire can be further reduced. In addition, even if stress due to lead bending is applied, the buried portion of the inner lead can be maintained at an appropriate position, and the resin can be prevented from peeling off. As a result, it is possible to stabilize the fixation at the time of mounting the light-emitting device 100 on a mounting board or the like, and to suppress variations in the mounting angle after mounting.

Furthermore, after the package 10 is obtained, and before or after the outer leads are bent, the light-emitting element 40 is attached to the package 10 , for example, on the first surface 20 a of the first leads 21 by an adhesive member. After that, the light-emitting element 40 is electrically connected to the first lead 21 and the second lead 22 via wires catch. Then, the light-transmitting resin 60 is preferably filled in the opening 32 of the resin molded body 30 to seal the light-emitting element 40 .

[Industrial Availability]

The light-emitting device according to an embodiment of the present invention can be used in backlight devices for liquid crystal displays, various lighting fixtures, large-scale displays, various display devices such as advertisements and destination guide boards, projector devices, and digital video cameras, facsimile machines, and photocopiers. , scanners and other image reading devices, etc.

20a‧‧‧Side 1

21‧‧‧Lead 1

21a‧‧‧Inner lead part of the first lead

22‧‧‧Lead 2

22a‧‧‧Inner lead part of the second lead

30‧‧‧Resin molding

30c‧‧‧Lower surface

30d‧‧‧Top surface

51‧‧‧Second recess

Claims (11)

A light-emitting device comprising: a first lead and a second lead; a resin molded body having an opening in a front surface and a lower surface adjacent to the front surface with a portion embedded in the first lead and the second lead; and light-emitting The element is placed in the opening; the first lead and the second lead respectively have: an outer lead portion protruding from the lower surface of the resin molded body and having a curved portion curved along the lower surface of the resin molded body; and an inner lead portion, which has a buried portion embedded in the resin molded body and an exposed portion exposed in the opening portion; the first lead or the second lead has a first recess provided in the outer lead portion an inner side of the bent portion; and a second recessed portion provided on a surface opposite to the surface provided with the first recessed portion in the buried portion of the inner lead portion; the second recessed portion is located closer to the outer portion than the exposed portion At the position of the lead wire, it is formed to extend in the direction along the lower surface, and a part of the resin molded body is arranged in the second concave portion. The light-emitting device of claim 1, wherein the first recessed portion or the second recessed portion is a groove. The light-emitting device of claim 1 or 2, wherein the first concave portion is formed on the inner side of the curved portion There is space. The light-emitting device according to claim 1 or 2, wherein the depth of the first recessed portion or the second recessed portion is 1/5 or more and 1/2 or less of the thickness of the outer lead portion. The light-emitting device according to claim 1 or 2, wherein the outer lead portion is bent so as to extend in the direction of the surface opposite to the front surface of the resin molded body. The light-emitting device according to claim 1 or 2, wherein the outer lead portion is bent so as to extend in the direction of the front surface of the resin molded body. The light-emitting device according to claim 1 or 2, wherein the cross-sectional shape of the first recessed portion or the second recessed portion is a V-shape. The light-emitting device according to claim 1 or 2, wherein the shortest distance between the lower surface of the resin molded body and the upper surface on the side opposite to the lower surface is 0.2 to 0.3 mm. The light-emitting device according to claim 1 or 2, wherein the material of the resin molded body is a thermosetting resin. A method of manufacturing a light-emitting device, comprising the steps of: preparing a package, the package having: a first lead and a second lead; and a resin molded body having an opening in a front surface and a lower surface adjacent to the front surface having a portion in which the first lead and the second lead are embedded, and the first lead and the second lead There are respectively: an outer lead portion protruding from the lower surface of the resin molded body; an inner lead portion having a buried portion embedded in the resin molded body and an exposed portion exposed in the opening portion; A lead portion is provided inside the bent portion; a second recess is provided on a surface opposite to the surface on which the first recess is provided in the embedded portion of the inner lead portion, and a part of the resin molded body is arranged The second recessed portion is formed to extend in the direction along the lower surface at a position closer to the outer lead than the exposed portion; The steps of bending in the way of the lower surface. A light-emitting device comprising: a first lead and a second lead; a resin molded body having an opening in a front surface and a lower surface adjacent to the front surface having an opening in which the first lead and the second lead are embedded, and a lower surface adjacent to the front surface; The element is placed in the opening; and the first lead and the second lead respectively have: an outer lead part that protrudes from the lower surface of the resin molded body and has a curved part that is bent along the lower surface of the resin molded body an inner lead portion having a buried portion embedded in the resin molded body and an exposed portion exposed in the opening portion; the first lead or the second lead has the bent portion in the outer lead portion, and The buried portion of the inner lead portion has a thin-walled portion or a hole that is thinner than the average thickness of the first lead and the second lead, and at least one or a plurality of the thin-walled portion or the hole is connected to the outer lead than the exposed portion. At the position, it is formed by extending in the direction along the above-mentioned lower surface.

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