TWI749992B - Wafer manufacturing management method and system - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 88
- 238000007726 management method Methods 0.000 title claims description 29
- 238000000034 method Methods 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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Abstract
Description
本發明是有關於一種方法及系統,且特別是有關於一種管理方法及生產系統。 The present invention relates to a method and system, and particularly relates to a management method and production system.
在一些特定產業中例如電子組裝業,高精密度的晶圓製造需求往往依循特定的製造順序來維持製造出的晶圓品質。但製造過程中每個工作站的加工過程或加工工序所花費的時間並不相等,因此,造成了生產過程中,每個晶圓的總等待時間會由於特定某幾個加工過程或加工工序被顯著地拉長,造成生產效率的降低。 In some specific industries, such as the electronic assembly industry, high-precision wafer manufacturing needs often follow a specific manufacturing sequence to maintain the quality of the manufactured wafers. However, the time spent in the processing or processing procedures of each workstation in the manufacturing process is not equal. Therefore, the total waiting time of each wafer during the production process will be significantly affected by certain processing or processing procedures. The ground stretches, resulting in a decrease in production efficiency.
本發明提供一種管理方法及生產系統,其可動態地調整物件的製程順序並同時進行有效地管控。 The invention provides a management method and a production system, which can dynamically adjust the manufacturing process sequence of objects and simultaneously perform effective management and control.
本發明的管理方法適於管理多個工作站的加工。管理方法包括:藉由中控伺服器獲得對應於物件的工作站請求;使工作站偵測佇列狀態;藉由中控伺服器接收工作站的佇列狀態;以及回應 於工作站請求,藉由中控伺服器依據佇列狀態以由工作站中選出選中工作站,以控制物件進入選中工作站。 The management method of the present invention is suitable for managing the processing of multiple workstations. The management method includes: obtaining the workstation request corresponding to the object through the central control server; enabling the workstation to detect the queue status; receiving the queue status of the workstation through the central control server; and responding Upon request of the workstation, the central control server selects the selected workstation from the workstations according to the queue status to control the object to enter the selected workstation.
本發明的生產系統適於進行物件的加工,生產系統包括工作站及中控伺服器。工作站偵測佇列狀態。中控伺服器耦接工作站,以取得佇列狀態。其中當中控伺服器獲得對應物件的工作站請求時,回應於工作站請求,中控伺服器依據佇列狀態以由工作站中選出選中工作站,以控制物件進入選中工作站。 The production system of the present invention is suitable for processing objects, and the production system includes a workstation and a central control server. The workstation detects the queue status. The central control server is coupled to the workstation to obtain the queue status. When the central control server obtains the workstation request of the corresponding object, it responds to the workstation request. The central control server selects the selected workstation from the workstations according to the queue status to control the object to enter the selected workstation.
基於上述,管理方法及生產系統可動態地調整物件的製程順序並同時進行有效地管控,有效地降低每個物件的生產等待時間,進而提升生產效率。 Based on the above, the management method and production system can dynamically adjust the manufacturing process sequence of the objects and simultaneously perform effective management and control, effectively reducing the production waiting time of each object, and thereby improving production efficiency.
1、3a、3b、3c:生產系統 1, 3a, 3b, 3c: production system
10、30:中控伺服器 10, 30: Central control server
11-1~11-n、31-1~31-6:工作站 11-1~11-n, 31-1~31-6: Workstation
OBJ:物件 OBJ: Object
S11~S14、S20~S29、S251、S252:步驟 S11~S14, S20~S29, S251, S252: steps
圖1為本發明實施例一生產系統的示意圖。 Fig. 1 is a schematic diagram of a production system according to an embodiment of the present invention.
圖2為本發明實施例一管理方法的流程圖。 Fig. 2 is a flowchart of a management method according to an embodiment of the present invention.
圖3A為本發明實施例一生產系統的示意圖。 Fig. 3A is a schematic diagram of a production system according to an embodiment of the present invention.
圖3B為本發明實施例一生產系統的示意圖。 Fig. 3B is a schematic diagram of a production system according to the first embodiment of the present invention.
圖3C為本發明實施例一生產系統的示意圖。 Fig. 3C is a schematic diagram of a production system according to the first embodiment of the present invention.
圖4為本發明實施例一管理方法的流程圖。 Fig. 4 is a flowchart of a management method according to an embodiment of the present invention.
圖1為本發明實施例一生產系統1的示意圖。生產系統
1可用於物件OBJ的加工。生產系統1中包括中控伺服器10及工作站11-1~11-n。工作站11-1~11-n可偵測各自的佇列狀態。中控伺服器10耦接於工作站11-1~11-n,並獲得工作站11-1~11-n所偵測的佇列狀態。如此一來,當物件OBJ要進入工作站11-1~11-n的一者或多者來進行加工時,中控伺服器10可獲得對應於物件OBJ的工作站請求。回應於工作站請求,中控伺服器10可依據工作站11-1~11-n的佇列狀態來選出選中工作站,並控制物件OBJ進入選中工作站來進行加工。
Fig. 1 is a schematic diagram of a
在一實施例中,物件OBJ可為待加工的半成品晶圓,而工作站11-1~11-n可對物件OBJ進行例如但非限制於氮化矽沉積、晶圓盒交換、去除微粒、厚度量測、瑕疵量測、硼及磷雜質氧化矽介電層沉積等的加工操作。 In one embodiment, the object OBJ can be a semi-finished wafer to be processed, and the workstations 11-1~11-n can perform, for example, but not limited to, silicon nitride deposition, cassette exchange, particle removal, and thickness of the object OBJ. Processing operations such as measurement, defect measurement, boron and phosphorus impurity silicon oxide dielectric layer deposition.
整體而言,生產系統1中的工作站11-1~11-n可對物件OBJ進行不同內容的加工操作,而工作站11-1~11-n對物件OBJ所進行的加工操作並沒有順序要求。在一示例中,物件OBJ先進入工作站11-1或先進入工作站11-2來進行加工操作,並不會影響生產系統1對物件OBJ所產生的加工結果。也就是說,在物件OBJ經過了生產系統1中所有工作站11-1~11-n的加工操作之後,先進入工作站11-1的物件或先進入工作站11-2的物件可產生出相同或相近的加工結果。因此,當生產系統1欲對物件OBJ進行加工操作,或是物件OBJ欲進入生產系統1中的一或多個工作站進行加工操作時,生產系統1可適應性地安排物件OBJ所要進入的
工作站,以降低生產系統1整體的等待時間,進而有效利用生產系統1的產能,改善生產系統1的工作站利用率。
In general, the workstations 11-1 to 11-n in the
詳細而言,工作站11-1~11-n都具有各自的佇列。當物件OBJ例如要進入工作站11-1進行加工操作時,物件OBJ需進入工作站11-1對應的佇列中等待,直到工作站11-1完成佇列中排在物件OBJ前其他物件的加工操作之後,才會進行物件OBJ的加工操作。工作站11-1~11-n可偵測各自的佇列狀態,並將各自的佇列狀態提供至中控伺服器10,其中工作站11-1~11-n所偵測的佇列狀態可包括佇列數量及處理時間。佇列數量為佇列中等待進行加工操作的物件數量,處理時間則為每個工作站進行加工操作所需要的時間。
In detail, workstations 11-1 to 11-n all have their own queues. When the object OBJ, for example, enters the workstation 11-1 for processing operations, the object OBJ needs to enter the queue corresponding to the workstation 11-1 and wait until the workstation 11-1 completes the processing operations of other objects in the queue before the object OBJ , The processing operation of the object OBJ will be carried out. The workstations 11-1~11-n can detect their respective queue states and provide their respective queue states to the
在中控伺服器10接收到工作站11-1~11-n所提供的佇列狀態之後,中控伺服器10可依據佇列狀態中的佇列數量及處理時間來計算每個工作站11-1~11-n的總等待時間。進一步,中控伺服器10可由總等待時間中選出最小總等待時間,中控伺服器10並可選擇出具有該最小總等待時間的工作站為選中工作站。如此一來,中控伺服器10即可控制物件OBJ進入具有最小總等待時間的選中工作站來進行加工操作,有效降低生產系統1的物件等待時間並提高產能利用率。
After the
圖2為本發明實施例一管理方法的流程圖。圖2所繪示的管理方法可應用於圖1所繪示的生產系統1,以下請共同參考圖1及圖2來理解下方關於管理方法的說明。
Fig. 2 is a flowchart of a management method according to an embodiment of the present invention. The management method shown in FIG. 2 can be applied to the
詳細而言,管理方法包括步驟S11~S14。在步驟S11中,生產系統1可藉由中控伺服器10獲得對應於物件OBJ的工作站請求。在一實施例中,物件OBJ的工作站請求可包含工作站旗標。生產系統1的中控伺服器10可依據物件OBJ的工作站旗標來得知物件OBJ欲進行哪些工作站所對應的加工操作,或是物件OBJ經過了哪些工作站的加工操作。
In detail, the management method includes steps S11 to S14. In step S11, the
在步驟S12中,生產系統1可使工作站11-1~11-n偵測佇列狀態。在一實施例中,工作站11-1~11-n所偵測的佇列狀態可包含佇列數量及處理時間。佇列數量可用來指示每個工作站的佇列中等待進行加工操作的物件數量,處理時間可為每個工作站進行加工操作所需要的時間。
In step S12, the
在步驟S13中,生產系統1回應於工作站請求,可藉由中控伺服器10接收工作站11-1~11-n的佇列狀態。
In step S13, the
在步驟S14中,生產系統1可藉由中控伺服器10依據佇列狀態由工作站11-1~11-n中選擇出選中工作站,以控制物件OBJ進入選中工作站來進行加工操作。在一實施例中,中控伺服器10可依據佇列狀態中的佇列數量及處理時間來計算工作站11-1~11-n的總等待時間,中控伺服器10可進一步由工作站11-1~11-n中選出具有最小總等待時間的工作站作為選中工作站。中控伺服器10即可控制物件OBJ進入選中工作站的佇列中等待加工操作。
In step S14, the
在一實施例中,中控伺服器10可依據物件OBJ的工作站旗標及工作站11-1~11-n的佇列狀態來選出選中工作站。更具體
而言,工作站旗標可為多個數位記錄值,分別用來記錄物件OBJ於工作站11-1~11-n的完成狀態。舉例而言,物件OBJ的工作站旗標可起始設定為零,當物件OBJ完成例如為工作站11-1的加工操作後,物件OBJ於工作站11-1的工作站旗標可對應地修改為一。如此一來,中控伺服器10依據對應於物件OBJ的工作站旗標可得知物件OBJ已進行與尚未進行的加工操作。
In one embodiment, the
進一步,中控伺服器10可依據物件OBJ的工作站旗標由工作站11-1~11-n中來選出物件OBJ還未進行加工操作的一或多個待選工作站。接著,中控伺服器10在依據待選工作站的佇列狀態由待選工作站中選出選中工作站,並控制物件OBJ進入選中工作站的佇列中等待加工操作。
Further, the
如此一來,生產系統1即可確保物件OBJ的等待時間為最短,生產系統1可有效避免當單一工作站出現大量佇列等待的情況時,所有後續進入生產系統1的物件被該單一工作站耽擱,造成生產系統1中其他工作站的產能閒置且物件的生產等待時間增加。
In this way, the
圖3A為本發明實施例一生產系統3a的示意圖。生產系統3a中包括中控伺服器30及工作站31-1~31-6。詳細而言,工作站31-1~31-6可進行不同的加工操作。在一實施例中,工作站31-l可進行氮化矽沉積(silicon nitride deposition)的加工操作,工作站31-2可進行晶圓盒交換(front opening unified pod change,foup change)的加工操作,工作站31-3可進行去除微粒(particle
remove)的加工操作,工作站31-4可進行厚度量測(thickness measure)的加工操作,工作站31-5可進行瑕疵量測(defect inspection)的加工操作,工作站31-6可進行硼及磷雜質氧化矽介電層沉積(BPTEOS deposition)的加工操作。
Fig. 3A is a schematic diagram of a
在一實施例中,當物件OBJ進入生產系統3a後,需先進入工作站31-1,再進入工作站31-2~31-5所形成的群組,最後才進入工作站31-6。換句話說,當物件OBJ完成工作站31-1的加工操作之後,工作站31-2~31-5所進行的加工操作並沒有順序限制,只要工作站31-2~31-5所進行的加工操作是在工作站31-1的加工操作之後,且在工作站31-6的加工操作之前即可。
In one embodiment, after the object OBJ enters the
另外,在一實施例中,依據工作站31-1~31-6的加工操作性質,中控伺服器30可依據來設定或變更物件OBJ的工作站旗標。舉例而言,工作站31-4可為厚度量測的加工操作。在一實施例中,中控伺服器30可以抽樣的方式僅對一部份的物件OBJ進行厚度量測的加工操作即可。因此,中控伺服器30可依據預設或亂數來設定每個進入生產系統3a的物件OBJ是否要進行工作站31-4的厚度量測加工操作。當中控伺服器30判斷要對物件OBJ進行厚度量測的抽樣時,中控伺服器30設定或變更物件OBJ的工作站旗標,使物件OBJ對應於工作站31-4的工作站旗標被設定為待完成(例如為數位記錄值0)。反之,當中控伺服器30判斷不對物件OBJ進行工作站31-4的厚度量測加工操作時,中控伺服器30可設定或變更物件OBJ的工作站旗標為已完成(例如為數位記錄值
1)。
In addition, in an embodiment, the
圖3B為本發明實施例一生產系統3b的示意圖。生產系統3b包括中控伺服器30及工作站31-1~31-5。在此實施例中,工作站31-1、31-2所進行的交工操作可交換順序,故工作站31-1、31-2可形成一群組,且工作站31-4、31-5所進行的交工操作可交換順序,故工作站31-4、31-5可形成另一群組。如此一來,中控伺服器30可先控制物件OBJ完成工作站31-1、31-2所形成群組的加工操作之後,再進入工作站31-3,最後再進入工作站31-4、31-5所形成的群組。
FIG. 3B is a schematic diagram of a
因此,在生產系統3b中,中控伺服器30可依據工作站31-1~31-5的加工操作性質,彈性地控制物件OBJ所進入的工作站,以提升生產系統3b的工作站利用率。
Therefore, in the
圖3C為本發明實施例一生產系統3c的示意圖。生產系統3c包括中控伺服器30及工作站31-1~31-6。在此實施例中,工作站31-2~31-5可共同形成一群組,群組中包含兩個子群組,一個子群組包含有工作站31-2、31-3且另一個子群組包含有工作站31-4、31-5。當物件完成工作站31-1的加工操作而進入工作站31-2~31-5所形成的群組時,中控伺服器30可依據工作站31-2~31-5的佇列狀態來控制物件OBJ進入31-2、31-3的子群組或進入31-4、31-5的子群組。
FIG. 3C is a schematic diagram of a production system 3c according to the first embodiment of the present invention. The production system 3c includes a
在圖3C的一實施例中,在工作站31-2、31-3的子群組中,物件OBJ需要先被執行工作站31-2的加工操作再執行工作站 31-3的加工操作,且在工作站31-4、31-5的子群組中,物件OBJ需要先被執行工作站31-4的加工操作再執行工作站31-5的加工操作。也就是兩子群組中的工作站有執行順序的要求。舉例而言,工作站31-2、31-3可進行N井區佈植(N well implant)的加工操作,工作站31-4、31-5可進行P井區佈植(P well implant)的加工操作。 In an embodiment of FIG. 3C, in the subgroups of the workstations 31-2 and 31-3, the object OBJ needs to be processed by the workstation 31-2 before the workstation is executed. The processing operation of 31-3, and in the subgroups of workstations 31-4 and 31-5, the object OBJ needs to be processed by the processing operation of the workstation 31-4 and then the processing operation of the workstation 31-5. That is, the workstations in the two subgroups have requirements for the order of execution. For example, workstations 31-2 and 31-3 can perform N well implant processing operations, and workstations 31-4 and 31-5 can perform P well implant processing operations operate.
如此一來,當物件OBJ完成工作站31-1的加工操作之後,中控伺服器30可依據子群組中工作站31-2、31-3的佇列狀態以及另一子群組中工作站31-4、31-5的佇列狀態來判斷哪個子群組具有最小總等待時間,並選擇該子群組為選中子群組。中控伺服器30可控制物件OBJ以先進入該選中子群組進行加工操作之後,再進入另一子群組進行加工操作。
In this way, after the object OBJ completes the processing operation of the workstation 31-1, the
進一步而言,在物件OBJ進入工作站31-2、31-3所形成的子群組後,中控伺服器30可控制物件OBJ以依照預設的順序來進行加工操作,例如為先進入工作站31-2之後再進入工作站31-3或者反之。相似地,在工作站31-4、31-5所形成的子群組中,中控伺服器30亦可控制物件OBJ以預設順序來進入工作站31-4、31-5。
Furthermore, after the object OBJ enters the subgroup formed by the workstations 31-2 and 31-3, the
中控伺服器30計算子群組的最小總等待時間的方式可依據設計需求調整或修改。在一實施例中,當中控伺服器30在計算工作站31-2、31-3所形成子群組的最小總等待時間,以及計算工作站31-4、31-5所形成子群組的最小總等待時間時,中控伺服器
30可將工作站31-2、31-3的等待時間進行加總以作為子群組的總等待時間,中控伺服器30並可將工作站31-4、31-5的等待時間進行加總以作為該子群組的總等待時間。中控伺服器30可比較兩子群組的總等待時間以判斷出最小總等待時間。
The manner in which the
在一實施例中,由於工作站31-2、31-4分別為兩子群組中順序最先執行的兩工作站。故中控伺服器30可以將工作站31-2的等待時間設定為其所屬子群組的等待時間,且將工作站31-4的等待時間設定為另一子群組的等待時間。如此一來,中控伺服器30可比較兩子群組的等待時間來判斷出最小總等待時間,並控制物件OBJ進入具有最小總等待時間的子群組。
In an embodiment, since the workstations 31-2 and 31-4 are respectively the two workstations that are executed first in sequence in the two subgroups. Therefore, the
在圖3C的另一實施例中,工作站31-2、31-3之間所執行的加工操作並沒有順序要求,且工作站31-4、31-5之間所執行的加工操作並沒有順序要求。如此一來,中控伺服器30可選擇出工作站31-2~31-5中何者具有最小總等待時間,並將最小總等待時間的工作站所屬的子群組設定為選中子群組,以控制物件OBJ進入該選中子群組。在此實施例中,中控伺服器30當然亦可計算子群組中工作站等待時間的總和做為子群組的總等待時間,據此以選擇出哪個子群組有最小總等待時間。
In another embodiment of FIG. 3C, there is no order requirement for the processing operations performed between the workstations 31-2 and 31-3, and there is no order requirement for the processing operations performed between the workstations 31-4 and 31-5. . In this way, the
因此,當生產系統3c中的多個子群組之間所進行的加工操作沒有順序要求時,中控系統3c可控制物件OBJ以進入子群組的其中一者,待完成該子群組的加工操作之後再進入另一子群組,以增加生產系統3c安排物件OBJ進行加工操作的彈性。 Therefore, when there is no sequence requirement for the processing operations performed between the multiple subgroups in the production system 3c, the central control system 3c can control the object OBJ to enter one of the subgroups, and the processing of the subgroup is to be completed After the operation, it enters another subgroup to increase the flexibility of the production system 3c to arrange the object OBJ for processing operations.
圖4為本發明實施例一管理方法的流程圖。圖4所繪示的管理方法可應用於圖1、3A~3C所繪示的生產系統1、3a~3c,以下請共同參考圖1、圖3A~3C來理解下方關於管理方法的說明。
Fig. 4 is a flowchart of a management method according to an embodiment of the present invention. The management method shown in Fig. 4 can be applied to the
圖4包含有步驟S20~S29。在步驟S20中,管理方法開始執行。在步驟S21中,中控伺服器可獲得對應於物件OBJ的工作站請求,其中工作站請求可包含有對應於生產系統中工作站的多個工作站旗標。在步驟S22中,工作站可偵測佇列狀態,藉由中控伺服器接收工作站的佇列狀態。 Figure 4 contains steps S20~S29. In step S20, the management method starts to execute. In step S21, the central control server can obtain a workstation request corresponding to the object OBJ, where the workstation request may include multiple workstation flags corresponding to the workstations in the production system. In step S22, the workstation can detect the queue status, and receive the queue status of the workstation through the central control server.
在步驟S23中,中控伺服器可判斷生產系統是否有允許調整工作站順序。在一實施例中,生產系統可接收使用者指令來開啟調整工作站順序的設定。在一實施例中,生產系統可量測物件的平均生產時間,當量測的平均生產時間大於預設時間時,生產系統可自動開啟動態調整工作站順序的設定。 In step S23, the central control server can determine whether the production system allows adjustment of the workstation sequence. In one embodiment, the production system may receive a user instruction to enable the setting of adjusting the workstation sequence. In one embodiment, the production system can measure the average production time of the object. When the measured average production time is greater than the preset time, the production system can automatically start the dynamic adjustment of the workstation sequence settings.
在步驟S24中,生產系統可判斷物件是否要進入群組、物件已在群組中或物件已離開群組。以圖3A所繪示的生產系統3a為例,當物件OBJ完成工作站31-1的加工操作且尚未進入工作站31-2~31-5的任一時,中控伺服器30可判斷物件OBJ為「進入工作站31-2~31-5的群組」。當物件OBJ已進入過工作站31-2~31-5的任一者進行加工操作後,中控伺服器30可判斷物件OBJ為「已在工作站31-2~31-5的群組中」。當物件OBJ已執行過工作站31-2~31-5每一者的加工操作後,中控伺服器30可判斷物件OBJ已完成工作站31-2~31-5的群組的加工操作,且物件OBJ為
「離開工作站31-2~31-5的群組」。
In step S24, the production system can determine whether the object is going to enter the group, the object is already in the group, or the object has left the group. Taking the
當中控伺服器判斷物件為進入群組後,則執行步驟S25,以設定物件的工作站旗標。詳細而言,步驟S25包含步驟S251、S252。在步驟S251中,中控伺服器可設定物件的工作站旗標為起始值。在步驟S252中,中控伺服器可判斷物件是否在每個工作站進行抽樣。以圖3A所繪示的生產系統3a為例,在步驟S251中,中控伺服器30可將物件OBJ對應於工作站31-2~31-5的工作站旗標設定為起始值(例如為數位記錄值0)。在步驟S252中,當中控伺服器30判斷物件OBJ需要被工作站31-4抽樣並進行厚度量測的加工操作時,中控伺服器30可維持對應於工作站31-4的工作站旗標為起始值(例如為數位記錄值0)。反之,當中控伺服器30判斷物件OBJ不需要被工作站31-4抽樣時,中控伺服器30可調整對應於工作站31-4的工作站旗標為已完成(例如為數位記錄值1)。因此,在步驟S25中,中控伺服器30可依據操作需求設定物件OBJ的工作站旗標。
After the central control server determines that the object is in the group, it executes step S25 to set the workstation flag of the object. Specifically, step S25 includes steps S251 and S252. In step S251, the central control server may set the workstation flag of the object as an initial value. In step S252, the central control server can determine whether the object is sampled at each workstation. Taking the
當中控伺服器在步驟S24中判斷物件是在群組中,或完成步驟S25之後,則執行步驟S26。在步驟S26中,中控伺服器可依據工作站旗標來判斷物件是否已完成群組中每個工作站的加工操作。在一實施例中,中控伺服器可檢查每個工作站旗標是否皆被設定為已完成。在另一實施例中,當工作站旗標是以數位值0記錄未完成且以數位值1記錄完成時,中控伺服器可檢查所有工作站旗標的乘積。中控伺服器可於乘積為零時判斷物件尚未完成群
組中所有工作站的加工操作,且於乘積不為零時判斷物件已完成群組中所有工作站的加工操作。
The central control server determines in step S24 that the object is in the group, or after completing step S25, it executes step S26. In step S26, the central control server can determine whether the object has completed the processing operation of each workstation in the group according to the workstation flag. In one embodiment, the central control server can check whether each workstation flag is set as completed. In another embodiment, when the workstation flag is not completed with the digital value 0 and the recording is completed with the
當中控伺服器判斷物件未完成群組中所有工作站的加工操作後,則執行步驟S27。在步驟S27中,中控伺服器可判斷最小總等待時間。在一實施例中,中控伺服器可依據工作站旗標來選出物件尚未進行加工操作的工作站,並依據這些工作站的佇列狀態來計算出每個工作站的總等待時間,進而選出最有最小總等待時間的工作站作為選中工作站。 After the central control server determines that the object has not completed the processing operations of all workstations in the group, step S27 is executed. In step S27, the central control server may determine the minimum total waiting time. In one embodiment, the central control server can select workstations where the object has not yet been processed according to the workstation flag, and calculate the total waiting time of each workstation based on the queue status of these workstations, and then select the smallest total The workstation with the waiting time is regarded as the selected workstation.
在步驟S28中,中控伺服器可控制物件進入具有最小總等待時間的工作站進行加工操作。 In step S28, the central control server can control the object to enter the workstation with the minimum total waiting time for processing operations.
另外,當中控伺服器在步驟S24中判斷物件為離開群組,或中控伺服器在步驟S26中判斷物件已完成群組中所有工作站的加工操作時,則執行步驟S29,以結束管理方法。 In addition, when the central control server determines in step S24 that the object is leaving the group, or the central control server determines in step S26 that the object has completed the processing operations of all workstations in the group, step S29 is executed to end the management method.
綜上所述,本發明的生產系統及管理方法可動態地調整物件的製程順序並同時進行有效地管控,以降低進入生產系統的物件等待時間,進而有效利用生產系統的產能並提升生產效率,改善生產系統的工作站利用率。 In summary, the production system and management method of the present invention can dynamically adjust the manufacturing process sequence of objects and simultaneously perform effective management and control, so as to reduce the waiting time of objects entering the production system, thereby effectively utilizing the production capacity of the production system and improving production efficiency. Improve the workstation utilization rate of the production system.
S11~S14:步驟 S11~S14: steps
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