TWI748535B - Test device - Google Patents
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- TWI748535B TWI748535B TW109121753A TW109121753A TWI748535B TW I748535 B TWI748535 B TW I748535B TW 109121753 A TW109121753 A TW 109121753A TW 109121753 A TW109121753 A TW 109121753A TW I748535 B TWI748535 B TW I748535B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- H10P72/0431—
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- H10P72/06—
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- Microelectronics & Electronic Packaging (AREA)
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- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
Abstract
Description
本揭露是有關於一種用於測試半導體或類似電子部件的測試元件,且更具體而言有關於一種包括散熱構件及用於按壓電子部件以進行測試的推動器的測試元件。 The present disclosure relates to a test element for testing semiconductors or similar electronic components, and more specifically to a test element including a heat dissipation member and a pusher for pressing the electronic component for testing.
在製造半導體及類似電子產品的製程中,需要測試元件來測試最終製造的電子產品是否有缺陷。此種測試元件需要發散測試電子產品時產生的熱量。此種所產生的熱量是增加測試電阻的一種因素,此會降低測試的可靠性且導致短路,從而導致產品故障。因此,發散所產生的熱量對於測試功率半導體、車輛半導體及系統半導體而言至關重要。 In the process of manufacturing semiconductors and similar electronic products, test components are required to test whether the final manufactured electronic products are defective. This kind of test element needs to dissipate the heat generated when testing electronic products. This kind of generated heat is a factor that increases the test resistance, which will reduce the reliability of the test and cause a short circuit, thereby leading to product failure. Therefore, the heat generated by divergence is very important for testing power semiconductors, vehicle semiconductors, and system semiconductors.
測試元件包括:測試插座,具有用於容納待測試的電子產品的插入件及用於傳輸測試訊號的探針;蓋體,耦合至測試插座且對插入件進行敞開及閉合;推動器,設置於蓋體中,且按壓容納於插入件中的電子產品;以及散熱部件,用於將熱量發散掉。此處,散熱部件可包括用於將傳遞到推動器的熱量傳導至外部的熱沈塊(heat sink block)。 The test components include: a test socket with an insert for accommodating the electronic product to be tested and a probe for transmitting test signals; a cover coupled to the test socket and open and close the insert; a pusher, which is arranged in In the cover body, the electronic product contained in the insert is pressed; and the heat dissipation component is used to dissipate heat. Here, the heat dissipation member may include a heat sink block for conducting heat transferred to the pusher to the outside.
然而,由於測試插座的大小非常小(例如6公分*6公分), 因此熱沈塊的表面積的擴大存在限制。換言之,熱沈塊需要被造型為非常薄且精確的板以擴大表面積,從而導致不僅增加生產成本而且降低耐久性的問題。 However, because the size of the test socket is very small (for example, 6 cm * 6 cm), Therefore, there is a limit to the expansion of the surface area of the heat sink block. In other words, the heat sink block needs to be shaped as a very thin and precise plate to enlarge the surface area, which leads to the problem of not only increasing the production cost but also reducing the durability.
本揭露的態樣旨在解決前述問題,並提供一種具有散熱結構的測試元件,所述測試元件可易於製造且在小體積內達成耐久性及熱沈效應(heat sink effect)方面的改善。 The aspect of the present disclosure aims to solve the aforementioned problems and provide a test element with a heat dissipation structure, which can be easily manufactured and achieves improvements in durability and heat sink effect in a small volume.
根據實施例,提供一種用於測試待測試對象的電特性的測試元件。所述測試元件包括:測試插座,包括被配置成將測試訊號傳輸至所述待測試對象的探針;以及推動器單元,被配置成按壓所述待測試對象以靠近及遠離所述探針移動,所述推動器單元包括:按壓突起,被配置成按壓所述待測試對象;推動器基座,在其第一側上包括所述按壓突起,且在其第二側上包括多個散熱柱插入部分;以及散熱柱,被造型為類似於杆,且包括欲插入所述散熱柱插入部分中的一個端部部分以及位於所述散熱柱的外圓周表面上的多個散熱翼。 According to an embodiment, a test element for testing the electrical characteristics of an object to be tested is provided. The test element includes: a test socket including a probe configured to transmit a test signal to the object to be tested; and a pusher unit configured to press the object to be tested to move closer to and away from the probe , The pusher unit includes: a pressing protrusion configured to press the object to be tested; a pusher base including the pressing protrusion on a first side thereof and a plurality of heat dissipation pillars on a second side thereof The insertion part; and the heat dissipation column, which is shaped like a rod, and includes an end portion to be inserted into the insertion part of the heat dissipation column and a plurality of heat dissipation wings located on the outer circumferential surface of the heat dissipation column.
所述測試元件可更包括散熱風扇,其中所述推動器單元包括設置於所述推動器基座的所述第二側上且支撐所述散熱風扇的至少一個風扇支撐柱。 The test element may further include a heat dissipation fan, wherein the pusher unit includes at least one fan support column disposed on the second side of the pusher base and supporting the heat dissipation fan.
所述風扇支撐柱可一體地形成於所述推動器基座的所述第二側上。 The fan support column may be integrally formed on the second side of the pusher base.
所述推動器基座可包括在所述多個散熱柱插入部分位 於其間的情況下一體地形成的多個散熱壁。 The pusher base may include a position where the plurality of heat dissipation posts are inserted A plurality of heat dissipation walls are integrally formed in between.
所述推動器基座的所述第二側可自中心朝外邊緣向下傾斜。 The second side of the pusher base may be inclined downward from the center toward the outer edge.
所述散熱柱可利用焊接材料焊接至所述散熱柱插入部分。 The heat dissipation pillar may be welded to the heat dissipation pillar insertion part using a welding material.
所述散熱柱插入部分可包括:柱插入孔,所述散熱柱的所述一個端部部分插入所述柱插入孔中;以及焊接材料容納器,與所述柱插入孔連通,且當所述散熱柱的所述一個端部部分插入所述柱插入孔中時,容納所述焊接材料而不溢出。 The heat dissipation column insertion portion may include: a column insertion hole into which the one end portion of the heat dissipation column is inserted; and a soldering material container that communicates with the column insertion hole, and when the When the one end portion of the heat dissipation column is inserted into the column insertion hole, the welding material is contained without overflowing.
所述柱插入孔可包括容納所述焊接材料的焊接材料容納凹槽。 The post insertion hole may include a welding material accommodating groove that accommodates the welding material.
1:測試元件 1: Test component
10:測試插座 10: Test socket
12:探針支撐本體 12: Probe support body
13:插入件 13: Insert
20:蓋體 20: Lid
22:蓋體本體 22: Lid body
24:閂鎖 24: Latch
26:手柄 26: handle
30:推動器單元 30: Pusher unit
32:推動器 32: Pusher
34:推動器框架 34: Pusher frame
36:推動器下部蓋體 36: Lower cover of the pusher
40:散熱風扇 40: cooling fan
221:蓋體裙部 221: Lid Skirt
222:推動器容納器 222: Pusher Holder
223:通孔 223: Through Hole
224:手柄引導件 224: handle guide
242:鎖定部分 242: Locked part
244:推動部分 244: push part
246、266:鉸鏈銷 246, 266: hinge pin
262:按壓器 262: Presser
321:柱區/正方形柱區 321: column area/square column area
322:推動器基座 322: Pusher base
323:第一彈簧凹槽 323: first spring groove
324:按壓突起 324: Press protrusion
325:第一彈簧 325: first spring
326:散熱柱 326: cooling column
327:散熱壁 327: Radiating Wall
328:風扇支撐柱 328: Fan Support Column
329:散熱柱插入部分 329: Insert part of heat sink
342:推動器裙部 342: Pusher skirt
344、3282:螺栓孔 344, 3282: Bolt hole
362:按壓突起容納器 362: Press the protrusion receiver
364:螺栓 364: Bolt
3262:散熱翼 3262: Cooling Wing
3264:耦合端部部分 3264: Coupling end part
3266:焊接材料填充部分 3266: Filling part of welding material
3267:平的部分 3267: flat part
3284:螺釘 3284: screw
3286:風扇支撐柱緊固部分 3286: Fastening part of fan support column
3292:柱插入孔 3292: Column insertion hole
3294:焊接材料容納器 3294: Welding material container
3296:焊接材料容納凹槽 3296: Welding material receiving groove
3422:第二彈簧凹槽 3422: second spring groove
3424:安置部分 3424: placement part
3426:第二彈簧 3426: second spring
藉由結合附圖閱讀示例性實施例的以下說明,上述及/或其他態樣將變得顯而易見且更易於理解,在附圖中:圖1是根據本揭露第一實施例的測試元件的立體圖。 The above and/or other aspects will become obvious and easier to understand by reading the following description of the exemplary embodiment in conjunction with the accompanying drawings. In the accompanying drawings: FIG. 1 is a perspective view of a test element according to the first embodiment of the present disclosure. .
圖2及圖3是圖1中測試元件的分解立體圖。 2 and 3 are exploded perspective views of the test element in FIG. 1.
圖4是圖1中推動器的立體圖。 Fig. 4 is a perspective view of the pusher in Fig. 1.
圖5是圖1中推動器的拆解圖。 Fig. 5 is a disassembled view of the pusher in Fig. 1.
圖6是示出圖5中散熱柱的結構的立體圖。 FIG. 6 is a perspective view showing the structure of the heat dissipation column in FIG. 5.
圖7及圖8示出根據本揭露第二實施例的散熱柱與散熱柱插入部分被焊接之前及之後的狀態。 7 and 8 show the state before and after the heat dissipation pillar and the heat dissipation pillar insertion part are welded according to the second embodiment of the present disclosure.
圖9及圖10示出根據本揭露第三實施例的散熱柱與散熱柱插入部分被焊接之前及之後的狀態。 9 and 10 show the state before and after the heat dissipation pillar and the heat dissipation pillar insertion part are welded according to the third embodiment of the present disclosure.
圖11是根據本揭露第四實施例的推動器基座的柱區的立體圖。 Fig. 11 is a perspective view of a column area of a pusher base according to a fourth embodiment of the present disclosure.
圖12是示出根據本揭露第四實施例的推動器單元中的空氣流的側視圖。 Fig. 12 is a side view showing the air flow in the pusher unit according to the fourth embodiment of the present disclosure.
圖13是根據本揭露第五實施例的推動器單元的分解立體圖。 Fig. 13 is an exploded perspective view of a pusher unit according to a fifth embodiment of the present disclosure.
下面,將參照附圖詳細闡述本揭露的實施例。為說明方便起見,將僅闡述相關部件以便於理解本揭露,而在圖式及說明中不包括與本揭露不直接相關的部件,且相同的編號始終指代相同或類似的組件。 Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. For the convenience of description, only relevant components will be described to facilitate understanding of the present disclosure, and the drawings and descriptions do not include components that are not directly related to the present disclosure, and the same numbers always refer to the same or similar components.
此外,可不揭露對於此項技術中具有通常知識者而言顯而易見的細節。在本揭露中,「第一(first)」、「第二(second)」及類似的關係用語可僅用於將一個組件與另一組件區分開,但是其之間的實際關係及次序沒有任何意義。 In addition, details that are obvious to those with ordinary knowledge in the art may not be disclosed. In this disclosure, "first", "second" and similar relational terms can only be used to distinguish one component from another, but there is no actual relationship or order between them. significance.
圖1是根據本揭露第一實施例的測試元件的立體圖,且圖2及圖3是圖1中的測試元件的分解立體圖。 FIG. 1 is a perspective view of a test element according to the first embodiment of the present disclosure, and FIG. 2 and FIG. 3 are exploded perspective views of the test element in FIG. 1.
參照圖1至圖3,測試元件1可包括測試插座10、耦合至測試插座10的蓋體20、設置在蓋體20中的推動器單元30以及安裝至推動器單元30的散熱風扇40。
1 to 3, the
測試插座10包括探針支撐本體12及插入件13,探針支撐本體12用於支撐多個可彈性回縮的探針,插入件13設置在探針支撐本體12上且具有容納半導體或類似電子產品(下文中稱為「待測試對象」)的對象容納器。此種測試插座10僅是為說明而給出的實例,且不限於僅為前述結構。
The
待測試對象包括多個待測試的接觸點(例如凸塊),且可包括如疊層封裝(package-on-package,POP)半導體等堆疊半導體。 The object to be tested includes multiple contact points (such as bumps) to be tested, and may include stacked semiconductors such as package-on-package (POP) semiconductors.
待測試對象容納於插入件13的對象容納器中,同時對應於支撐於探針支撐本體12上的探針。此種所容納的待測試對象被稍後欲闡述的推動器單元30按壓,且朝對應的探針移動。因此,待測試對象的接觸點與探針接觸,且因此測試得以施行。
The object to be tested is accommodated in the object container of the
蓋體20可包括耦合至測試插座10的蓋體本體22以及設置在蓋體本體22中的一對閂鎖24及手柄26,以在測試時對測試插座10的頂部進行敞開及閉合。
The
蓋體本體22可藉由所述一對閂鎖24可拆卸地耦合至測試插座10。蓋體本體22可包括推動器容納器222,以在推動器容納器222的中心處容納推動器單元30。蓋體本體22的頂部形成有蓋體裙部(參見圖3中的「221」),所述蓋體裙部形成有開口,稍後欲闡述的推動器單元30的散熱柱326及風扇支撐柱328通過所述開口。蓋體本體22可包括沿手柄26的樞轉方向凹陷且引導樞轉的手柄26的一對手柄引導件(參見圖2中的「224」)。在每一
手柄引導件224的中間設置有通孔(參見圖3中的「223」)以穿透蓋體裙部221。在通孔223中,可設置耦合至手柄26的端部部分的按壓器(參見圖3中的「262」)。
The
所述一對閂鎖24設置在蓋體本體22中且彼此面對,推動器容納器222位於所述一對閂鎖24之間。每一閂鎖24可包括鎖定部分242及推動部分244。每一閂鎖24支撐於蓋體本體22上且藉由鉸鏈銷246彈性樞轉。
The pair of
手柄26像「∩」形狀一樣延伸,以在推動器容納器222上方的預定高度處繞過推動器容納器222。手柄26的兩個端部部分分別由鉸鏈銷266樞轉地支撐於手柄引導件224的中間。手柄26可在其端部部分處包括凸輪(未示出),所述凸輪被造型為具有三種不同的直徑。凸輪可與按壓器262連接,以用於按壓推動器單元30。因此,每次當手柄26設置於中間、當向左樞轉時設置於左邊且當向右樞轉時設置於右邊時,按壓器262的高度藉由凸輪以不同方式進行調節。因此,推動器單元30根據手柄26的樞轉位置被以不同方式按壓,且因此即使待測試的對象在厚度上不同,本揭露的測試元件1亦可在測試中通用。當然,按壓器262可被省略,且凸輪可直接按壓推動器單元30。
The
推動器單元30可包括推動器32、支撐推動器32的推動器框架34及覆蓋推動器框架34的底部的推動器下部蓋體36。
The
推動器32可包括推動器基座322、按壓突起324以及多個散熱柱326及風扇支撐柱328,推動器基座322被造型為類似於
板,按壓突起324自推動器基座322的底部突出且按壓置於測試插座10上的待測試對象的頂部,所述多個散熱柱326及風扇支撐柱328支撐於推動器基座322的頂部上。在推動器基座322的外圓周上,可設置有多個第一彈簧凹槽323。第一彈簧凹槽(參見圖2中的「323」)可容納第一彈簧(參見圖2中的「325」)的下部端部部分。第一彈簧325使得推動器32在容納於推動器框架34中的同時能夠與推動器框架34彈性地保持一定距離。推動器32的細節將在稍後闡述。
The
推動器框架34被造型為類似於盒,且向上及向下敞開。推動器框架34在上部部分處設置有推動器裙部342,以防止容納於推動器框架34中的推動器32向上分離。在推動器裙部342的底部上設置有與推動器基座322的第一彈簧凹槽323對應的多個第二彈簧凹槽3422。所述多個第二彈簧凹槽3422可容納第一彈簧325的上部端部部分。在推動器裙部342的頂部上設置有安置部分3424及設置在四個隅角處的第二彈簧(參見圖2中的「3426」),安置部分3424凹陷以在其上安置設置於蓋體20的手柄26的端部部分處的按壓器262。第二彈簧3426放置於蓋體本體22的蓋體裙部221的底部與推動器單元30的頂部之間,以使推動器單元30可彈性地懸掛於蓋體20上。
The
在推動器框架34的下部端部處可設置有多個螺栓孔344,以用於在將推動器32容納於推動器框架34中的同時與推動器下部蓋體36耦合。
A plurality of bolt holes 344 may be provided at the lower end of the
推動器下部蓋體36可包括向下凹陷的按壓突起容納器362。按壓突起容納器362可容納容納於推動器框架34中的推動器32的按壓突起324。推動器下部蓋體36可藉由多個螺栓364耦合至推動器框架34的多個螺栓孔344。
The pusher
散熱風扇40可安裝至推動器單元30的風扇支撐柱328,以將自產生熱量的待測試對象傳遞的熱量發散至推動器單元30。散熱風扇40將空氣自散熱柱326的側向側強制吸入及排出至上側或者自上側排出至側向側。
The
圖4是圖1中推動器32的立體圖,圖5是圖1中推動器32的拆解圖,且圖6是示出圖6中散熱柱326的結構的立體圖。
4 is a perspective view of the
參照圖4及圖5,推動器32可包括推動器基座322、按壓突起(參見圖3中的「324」)、散熱柱326及風扇支撐柱328。
4 and 5, the
推動器基座322被造型為類似於板,且包括按壓突起324、多個散熱壁327、散熱柱插入部分329及風扇支撐柱328,按壓突起324自推動器基座322的底部突出,所述多個散熱壁327被設置成在推動器基座322的頂部上的正方形柱區321中在其間留有空間,散熱柱插入部分329設置在散熱壁327之間,且風扇支撐柱328一體地形成於柱區321的隅角處。
The
散熱壁327可自推動器基座322的頂部一體地延伸,且在寬度方向及長度方向上彼此間隔開。
The
風扇支撐柱328可分別在柱區321的四個隅角處一體地形成。在風扇支撐柱328的頂部端部表面上形成有螺栓孔3282,
散熱風扇40緊固至螺栓孔3282。
The
散熱柱插入部分329可例如藉由對推動器基座322的柱區321進行鑽孔而形成為類似於圓柱形孔。散熱柱插入部分329可形成於散熱壁327之間。
The heat dissipation
按壓突起324可一體地形成於推動器基座322的底部上。當然,按壓突起324可被單獨地製造,且然後耦合或黏合到推動器基座322的底部。
The
參照圖6,散熱柱326可被造型為類似於杆,且包括用於改善散熱效果的多個散熱翼3262以及設置在一側處的耦合端部部分3264。散熱柱326可被強制地配合、接合(焊接)或螺紋耦合至散熱柱插入部分329。
6, the
散熱翼3262可例如藉由透過車床對圓柱形杆形材料進行機加工來形成。為便於機加工,散熱翼3262可形成為橫向於長度方向。當然,散熱翼3262可形成為沿長度方向延伸。
The
耦合端部部分3264可在其外圓周表面上形成有至少一個焊接材料填充部分3266。焊接材料填充部分3266可填充有熔化焊接材料,例如,當散熱柱326焊接至散熱柱插入部分329時使用的熔化的銀(Ag)。熔化的銀由於熔點低而易於加工,且由於高導熱性而具有良好的散熱效果。由於散熱柱326在焊接材料填充部分3266填充有焊接材料的狀態下耦合至推動器基座322,因此散熱柱326被更牢固地支撐。
The
圖7及圖8示出根據本揭露第二實施例的散熱柱326與
散熱柱插入部分329被焊接之前及之後的狀態。
7 and 8 show the
參照圖7,散熱柱326可包括所述多個散熱翼3262及耦合端部部分3264。
Referring to FIG. 7, the
耦合端部部分3264可具有圓柱形形狀,且包括被設置成橫向於長度方向的至少一個焊接材料填充部分3266以及藉由在長度方向上切割外圓周表面而形成的平的部分3267。
The
散熱柱插入部分329可包括其中插入有耦合端部部分3264的柱插入孔3292及與柱插入孔3292連通的焊接材料容納器3294。當耦合端部部分3264插入柱插入孔3292中時,填充於柱插入孔3292中且用於焊接的焊接材料(例如,熔化的銀(Ag))可能滿溢。焊接材料容納器3294容納此種溢出的焊接材料,從而不僅更牢固地緊固散熱柱326,而且整潔地完成外觀。
The heat dissipation
參照圖8,當散熱柱326插入填充有焊接材料的柱插入孔3292中且然後冷卻時,由於焊接材料填充於焊接材料填充部分3266中、平的部分3267與柱插入孔3292的內表面之間以及焊接材料容納器3294中,因此焊接材料可硬化。因此,其中插入有耦合端部部分3264的柱插入孔3292被徹底地填充而無任何間隙,從而改善散熱效果且達成牢固的耦合。
8, when the
圖9及圖10示出根據本揭露第三實施例的散熱柱326與散熱柱插入部分329被焊接之前及之後的狀態。
9 and 10 show the state before and after the
參照圖9,散熱柱326可包括所述多個散熱翼3262及耦合端部部分3264。
9, the
耦合端部部分3264可具有圓柱形形狀,且包括被設置成橫向於長度方向的至少一個焊接材料填充部分3266。與圖7的耦合端部部分3264不同,圖9的耦合端部部分3264不包括藉由在長度方向上切割外圓周表面而形成的平的部分3267。
The
散熱柱插入部分329可包括其中插入有耦合端部部分3264的柱插入孔3292及與柱插入孔3292連通的焊接材料容納器3294。柱插入孔3292可包括多個焊接材料容納凹槽3296,所述多個焊接材料容納凹槽3296在其內圓周表面上在長度方向上延伸。
The heat dissipation
當耦合端部部分3264插入柱插入孔3292中時,填充於柱插入孔3292中且用於焊接的焊接材料(例如,熔化的銀(Ag))可能滿溢。焊接材料容納器3294及焊接材料容納凹槽3296提供足夠大的空間來容納熔化的焊接材料,從而不僅更牢固地緊固散熱柱326,而且防止焊接材料溢出並損壞外觀。
When the
參照圖10,當散熱柱326插入填充有焊接材料的柱插入孔3292中且然後冷卻時,由於焊接材料填充於焊接材料填充部分3266、焊接材料容納凹槽3296及焊接材料容納器3294中,因此焊接材料可硬化。因此,其中插入有耦合端部部分3264的柱插入孔3292被徹底地填充而無任何間隙,從而改善散熱效果且達成牢固的耦合。
10, when the
圖11是根據本揭露第四實施例的推動器基座322的柱區321的立體圖,且圖12是示出根據本揭露第四實施例的推動器32中的空氣流的側視圖。
FIG. 11 is a perspective view of the
參照圖11,推動器基座322的柱區321可被造型為類似於具有朝中心向上傾斜的四個坡面的四角錐。當然,柱區321不限於四角錐,而是可被造型為類似於圓錐、三角錐、五角錐或類似的多角錐。
Referring to FIG. 11, the
參照圖12,放置於推動器32上方的散熱風扇40進行操作以朝柱區321供應空氣。在此種情形中,如圖11中所示,空氣沿自推動器基座322的柱區321的中心朝外邊緣向下傾斜的坡面更平穩地排出,而無阻力。
Referring to FIG. 12, the
圖11示出在推動器基座322的頂部上省略了散熱壁及散熱柱。
FIG. 11 shows that the heat dissipation wall and the heat dissipation pillar are omitted on the top of the
圖12示出在推動器基座322的頂部上省略了散熱壁。
FIG. 12 shows that the heat dissipation wall is omitted on the top of the
圖13是根據本揭露第五實施例的推動器32的分解立體圖。
FIG. 13 is an exploded perspective view of the
參照圖13,風扇支撐柱328可不是一體製造的,而是單獨製造的,且耦合至推動器基座322的頂部。
Referring to FIG. 13, the
推動器32可被造型為類似於板,且包括推動器基座322、所述多個散熱壁327及風扇支撐柱緊固部分3286,推動器基座322在其頂部上具有正方形柱區321,所述多個散熱壁327被設置成在柱區321中在其間留有空間,風扇支撐柱緊固部分3286設置於推動器32的四個隅角處。
The
風扇支撐柱328的下端部部分可藉由螺釘3284緊固至風扇支撐柱緊固部分3286且支撐於風扇支撐柱緊固部分3286
上。
The lower end portion of the
在根據本揭露的測試元件中,按壓突起324設置於推動器32的第一側上,且被造型為類似於杆且具有多個翼的多個散熱柱組裝於推動器32的第二側上,從而有利於工作及組裝、充分擴大表面積、增強散熱效果及改善耐久性。此外,熱量容易藉由所述多個散熱柱之間的空間向外發散,從而增強散熱效果。
In the test element according to the present disclosure, the
在前述內容中,已參照具體實施例闡述本揭露的優點。然而,此項技術中具有通常知識者將理解,可在不背離隨附申請專利範圍中所界定的揭露內容的範圍的條件下作出各種潤飾及變化。因此,說明及圖式需要被解釋為本揭露的實例,而非對本揭露的限制。所有此種可能的潤飾應在本揭露的範圍內作出。 In the foregoing content, the advantages of the present disclosure have been described with reference to specific embodiments. However, those with ordinary knowledge in this technology will understand that various modifications and changes can be made without departing from the scope of the disclosure defined in the scope of the attached patent application. Therefore, the description and the drawings need to be interpreted as examples of the disclosure, rather than limitations on the disclosure. All such possible modifications should be made within the scope of this disclosure.
10:測試插座 10: Test socket
12:探針支撐本體 12: Probe support body
13:插入件 13: Insert
20:蓋體 20: Lid
22:蓋體本體 22: Lid body
24:閂鎖 24: Latch
26:手柄 26: handle
30:推動器單元 30: Pusher unit
32:推動器 32: Pusher
34:推動器框架 34: Pusher frame
36:推動器下部蓋體 36: Lower cover of the pusher
40:散熱風扇 40: cooling fan
222:推動器容納器 222: Pusher Holder
224:手柄引導件 224: handle guide
242:鎖定部分 242: Locked part
244:推動部分 244: push part
246、266:鉸鏈銷 246, 266: hinge pin
322:推動器基座 322: Pusher base
323:第一彈簧凹槽 323: first spring groove
325:第一彈簧 325: first spring
326:散熱柱 326: cooling column
328:風扇支撐柱 328: Fan Support Column
342:推動器裙部 342: Pusher skirt
362:按壓突起容納器 362: Press the protrusion receiver
364:螺栓 364: Bolt
3424:安置部分 3424: placement part
3426:第二彈簧 3426: second spring
Claims (7)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0082405 | 2019-07-09 | ||
| KR1020190082405A KR102233283B1 (en) | 2019-07-09 | 2019-07-09 | A test device |
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| Publication Number | Publication Date |
|---|---|
| TW202104902A TW202104902A (en) | 2021-02-01 |
| TWI748535B true TWI748535B (en) | 2021-12-01 |
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| TW109121753A TWI748535B (en) | 2019-07-09 | 2020-06-29 | Test device |
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| Country | Link |
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| KR (1) | KR102233283B1 (en) |
| TW (1) | TWI748535B (en) |
| WO (1) | WO2021006609A1 (en) |
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| CN113466599B (en) * | 2021-07-29 | 2024-09-20 | 深圳市禹龙通电子股份有限公司 | Ageing equipment |
| TWI809985B (en) * | 2022-07-19 | 2023-07-21 | 伊士博國際商業股份有限公司 | Sliding burner socket and its operation method |
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| US20030003782A1 (en) * | 2000-05-17 | 2003-01-02 | Enplas Corporation | Contact pin assembly, contact pin assembly manufacturing method, contact pin assembling structure, contact pin assembling structure manufacturing method, and socket for electrical parts |
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| KR20020039076A (en) * | 2000-11-20 | 2002-05-25 | 이형도 | Cooling fan |
| JP2010015894A (en) * | 2008-07-04 | 2010-01-21 | Asuka Denki Seisakusho:Kk | Inspection connector |
| KR20140079192A (en) * | 2012-12-18 | 2014-06-26 | 주식회사 현대엠앤케이 | Heat sink |
| KR20140132172A (en) * | 2013-05-07 | 2014-11-17 | 주식회사 에코룩스 | A radiation structure of led liiuminator |
-
2019
- 2019-07-09 KR KR1020190082405A patent/KR102233283B1/en active Active
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- 2020-06-29 TW TW109121753A patent/TWI748535B/en active
- 2020-07-08 WO PCT/KR2020/008897 patent/WO2021006609A1/en not_active Ceased
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030003782A1 (en) * | 2000-05-17 | 2003-01-02 | Enplas Corporation | Contact pin assembly, contact pin assembly manufacturing method, contact pin assembling structure, contact pin assembling structure manufacturing method, and socket for electrical parts |
| TW200714189A (en) * | 2005-09-23 | 2007-04-01 | Foxconn Tech Co Ltd | Heat dissipating assembly with heat pipes |
| TW200743943A (en) * | 2006-05-19 | 2007-12-01 | Foxconn Tech Co Ltd | Heat dissipation apparatus |
| TW201217694A (en) * | 2010-10-27 | 2012-05-01 | Foxconn Tech Co Ltd | Heat dissipation device and LED lamp using the same |
| CN102883584A (en) * | 2012-06-28 | 2013-01-16 | 蔡州 | A high-efficiency cooling device |
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| TW201632887A (en) * | 2015-02-05 | 2016-09-16 | 李諾工業股份有限公司 | A test device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202104902A (en) | 2021-02-01 |
| KR20210006596A (en) | 2021-01-19 |
| KR102233283B1 (en) | 2021-03-29 |
| WO2021006609A1 (en) | 2021-01-14 |
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