TWI748431B - A burn in board with a subsystem - Google Patents

Abstract

The invention discloses a burn-in board with a subsystem, the burn-in board receives a power from a burn-in tester and has a plurality of test sockets. Each test socket is used for accommodating a device to be tested. The burn-in board has a plurality of subsystem modules electrically connecting to the corresponding test sockets. The plurality of subsystem modules is configured to convert the power into several different voltage values which are respectively outputted to the corresponding test sockets such that the burn-in board is able to carry out a burn-in testing with different voltage values at a same time.

Description

Aging board with subsystem

A subsystem used for burn-in boards, in particular, refers to a subsystem module that can adjust the input voltage and supply a specific voltage value to each test socket on the burn-in board.

Burn-in test is a test method that allows integrated circuits to work under strict conditions of high temperature and high voltage, so that defective components can be identified early. For example, when some multilayer metal wires or metal pillars in an integrated circuit are poorly made, too much of this situation will cause the yield of the product and cause loss. Therefore, the high temperature and high voltage Work under strict conditions, so that poorly produced products will be eliminated early, and good products will be screened out first.

When the integrated circuit (such as a chip) undergoes burn-in testing, the integrated circuit to be tested needs to be positioned and set on the test socket of the burn-in board, and pass the burn-in tester through the burn-in tester. Provide a unified power supply for burn-in testing. Therefore, the shortcoming of this method is that the burn-in test can only be carried out with one voltage value or a single power mode in the same test item, or when the integrated circuit burn-in test is carried out with a voltage exceeding the voltage provided by the test equipment, the burn-in board is required. A large number of power supplies can be connected to the side to supply voltages that exceed the equipment's ability to provide voltage, and integrated circuits are usually installed on multiple layers of burn-in boards for testing. It is not convenient to plug a large number of power supplies (occupying volume and The supplier is expensive). In addition, the external power supply directly transmits the voltage to the integrated circuit. In fact, the voltage received by the integrated circuit is not known. If a short circuit, open circuit or energy consumption occurs during the voltage transmission, the integrated circuit It is impossible to perform the test with the pre-test voltage value. Therefore, how to solve the above-mentioned deficiencies is the subject to be solved by the present invention.

The main purpose of the present invention is to solve the inconvenience of the external power supply. The present invention uses a subsystem module set on the burn-in board to control different input voltages to each test socket. Therefore, the present invention provides a burn-in board with a subsystem , Including: a burn-in board, which receives power supplied from a burn-in test bench, and has a plurality of test sockets, each test socket is used to house a device under test; and A plurality of subsystem modules are respectively electrically connected with the plurality of test sockets, and the plurality of subsystem modules are used for converting the power source into different voltage values and outputting the different voltage values to the corresponding test sockets.

And a burn-in test equipment, comprising: a burn-in test bench; a plurality of burn-in boards receiving a power supply from the burn-in test bench, each burn-in board has a plurality of test sockets, each test socket is used for accommodating a device to be tested; and A plurality of subsystem modules are respectively electrically connected with the plurality of test sockets, and the plurality of subsystem modules are used for converting the power source into different voltage values and outputting the different voltage values to the corresponding test sockets.

As the above-mentioned burn-in board and burn-in test equipment with a subsystem, the subsystem module has: a voltage adjustment unit that receives the power provided by the burn-in test bench through the burn-in board, converts the power into a test signal, and outputs To an input end of the test socket; a resistance adjustment unit, electrically connected between a feedback end of the voltage adjustment unit and the input end of the test socket, to provide a feedback signal to the feedback end of the voltage adjustment unit And a processing unit, coupled to the resistance adjustment unit, for determining a resistance value of the resistance adjustment unit.

As the above-mentioned burn-in board and burn-in test equipment with subsystems, the subsystem module further has a memory unit coupled to the processing unit for storing the resistance value; a control unit can be remotely provided to the Processing unit instruction; a digital analog converter, electrically connected between the processing unit and the output terminal of the voltage adjustment unit, for providing a detection signal to the processing unit.

Such as the above-mentioned burn-in board and burn-in test equipment with subsystem, wherein the processing unit determines a resistance value of the resistance adjustment unit according to the detection signal of the digital analog converter; the subsystem module is arranged inside the burn-in board ; The subsystem module is externally connected to the burn-in board; and the control unit uses a Universal Asynchronous Receiver/Transmitter (UART) for information transmission.

And an aging test method, used in a device under test housed in a test socket, includes: providing a voltage adjustment unit for converting a power source into a test signal; providing a resistance adjustment unit, One end of the resistance adjustment unit is electrically connected to a feedback end of the voltage adjustment unit for providing a feedback signal to the feedback end, and the voltage adjustment unit has a first resistance value; a processing unit is based on the test signal The resistance adjustment unit is determined to be a second resistance value, so as to adjust the feedback signal; and the voltage adjustment unit at least outputs another test signal based on the adjusted feedback signal.

As in the above-mentioned aging test method, the voltage adjustment unit is a DC converter.

The above-mentioned aging test method further includes: the voltage adjustment unit outputs the test signal to an input terminal of the test socket.

As in the above-mentioned aging test method, the other end of the resistance adjustment unit is electrically connected to an input end of the test socket, the feedback signal is determined by the test signal and the first resistance value, and the resistance adjustment unit is A digital variable resistor, the first resistance value is a preset resistance value, and the preset resistance value is related to a desired test signal.

The above-mentioned aging test method further includes: in a test item for the device under test, the voltage adjusting unit dynamically converts the power source to make a voltage of the test signal or a voltage of the other test signal A voltage greater than the power supply.

The aspect of the present invention will be described below with reference to the schematic diagram of the ideal configuration of the present invention. The shapes and setting methods in these diagrams may vary due to manufacturing technology, design, and/or tolerances. Therefore, the aspects described in the text of the present invention should not be regarded as limiting the structure of the present invention to specific elements or shapes, and should include any difference in shape caused by manufacturing.

First, please refer to the schematic diagram of the burn-in test equipment 100 in FIG. 1. The burn-in test equipment 100 includes a burn-in chamber 400 capable of accommodating a plurality of burn-in boards 200 and a burn-in test bench 300 electrically connected to the burn-in chamber 400. The burn-in The test bench 300 can set a temperature and a fixed voltage value and provide power corresponding to the set value to the plurality of burn-in boards 200.

At the same time, please refer to FIG. 2 for a schematic diagram of a plurality of aging boards 200 arranged in the aging room 400 of the present invention. As shown in the figure, the plurality of aging boards 200 are arranged in the aging room in an orderly, parallel manner and with a certain interval. 400, and the top view schematic diagram of the burn-in board 200 and burn-in test bench 300 of the present invention in FIG. 3, as shown in the figure, the burn-in board 200 is provided with a plurality of test sockets 220, and the plurality of test sockets 220 are neatly arranged on the burn-in board 200 In addition, the burn-in board 200 and the burn-in test stand 300 are electrically connected to each other detachably (double arrows), so they can be applied to burn-in boards 200 of different specifications for burn-in tests. In some embodiments, the burn-in board 200 and the burn-in test station 300 may be electrically connected via at least one connector (not shown).

Next, the connection relationship of the aging boards with subsystems of the present invention will be described in detail. Please refer to the schematic diagram of the aging boards of the subsystems of the present invention in FIG. 4. Each aging board 200 in FIG. 3 is provided with a plurality of subsystem modules 210. They are electrically connected to the plurality of test sockets 220 respectively. That is, one sub-system module 210 is correspondingly connected to one test socket 220. In other possible embodiments, one subsystem module 210 may be connected to multiple test sockets 220 correspondingly. Although FIG. 4 only shows the connection relationship between one sub-system module 210 and the burn-in test platform 300, in fact, the burn-in test stand 300 can be configured to be electrically connected to a plurality of sub-system modules 210. The plurality of subsystem modules 210 are used to convert the power provided by the burn-in test bench 300 into different voltage values, and output the different voltage values to the corresponding test sockets 220, wherein the subsystem module 210 includes a The voltage adjustment unit 211 (the present invention is preferably configured as a DC converter) can receive the power provided by the burn-in test bench 300 through the burn-in board (such as a wire on the PCB), and convert a power source into a test signal (required Power supply). A resistance adjustment unit 212 (the preferred configuration of the present invention is a digital variable resistor), which is electrically connected between a feedback terminal 2111 of the voltage adjustment unit 211 and the input terminal 218 of the test socket 220 to provide a feedback signal To the feedback terminal 2111 of the voltage adjustment unit 211. A processing unit 213 (for example: Micro Control Unit, MCU) is coupled to the resistance adjustment unit 212, and is coupled to a memory unit 214 (the best configuration of the present invention is an electronic erasable rewritable read-only memory, EEPROM) And the information is connected to a control unit 215 (the best configuration of the present invention is a computer device capable of wireless transmission), wherein the test signal and the feedback signal can be a voltage value or a current value. In addition, a digital-to-analog converter 216 is electrically connected between the processing unit 213 and the output terminal 2112 of the voltage adjustment unit 211, or the digital-to-analog converter 216 is connected to the input terminal 218 of the test socket 220 and the processing unit 213 between.

The sub-system module 210 of the present invention is further configured to dynamically convert the power provided by the burn-in test bench 300, for example, to make the sub-system module 210 output to a test socket 220 with a voltage greater than a voltage of the power supply. Therefore, during a test item (RUN) period for a device under test (such as a chip), the power supply can be dynamically converted by the subsystem module 210 or the voltage adjustment unit 211, so that the test signal input to the test socket has a dynamic change .

Next, the use process of the burn-in board with subsystems of the present invention will be described in detail. First, when the user wants to use different voltage values to test the devices under test (such as chips) of different test sockets on the burn-in board at the same time At this time, a different voltage value of each test socket 220 will be set through the control unit 215 first. For example, the control unit 215 remotely transmits a command about a set voltage value to the processing unit 213 (for example, WIFI or Bluetooth transmission) and records the set voltage value in the memory 214. The processing unit 213 adjusts the resistance value of the resistance adjustment unit 212 at least according to the test signal of the voltage adjustment unit 211 (that is, converted into a detection signal by the analog-to-digital converter 216) and the recorded set voltage value, and the resistance adjustment is started at the beginning The first resistance value preset by the unit 212 is adjusted to the second resistance value for pre-aging test, and the resistance adjustment unit 212 in the second resistance value state provides a feedback signal to the feedback terminal of the voltage adjustment unit 211 2111. Make the voltage adjustment unit 211 generate and output another test signal (ie, the voltage value set by the control unit 215) to the test socket 220 to perform an aging test on the device under test based on at least the feedback signal.

The digital-to-analog converter 216, which is electrically connected between the processing unit 213 and the output terminal 2112 of the voltage adjustment unit 211, converts the other test signal output by the voltage adjustment unit 211 into a detection signal, and Output the detection signal to the processing unit 213, and the processing unit 213 can control the resistance value of the resistance adjustment unit 212 according to the change of the detection signal in real time, so as to adjust the feedback signal of the resistance adjustment unit 212 to adjust the voltage The unit 211 outputs another test signal after adjustment. Specifically, the processing unit 213 can determine whether the detection signal from the digital-to-analog converter 216 is related to an inappropriate test signal based on a monitoring range (one or more threshold values) stored in the memory unit 214. The advantage of this is that due to the high accuracy of the aging test, if the voltage transmitted to the test socket 220 is unstable, interrupted, or affected by external factors, the processing unit 213 can immediately change the voltage and maintain it within a certain voltage range. A warning may be issued inside or outside, so that the device under test will not be damaged during the aging test.

In addition, the memory unit 214, which is electrically connected to the processing unit 213, can store the resistance value of the control unit 215 after adjusting the voltage value, so that the adjusted resistance value can be maintained when the power is turned on again; the control of the present invention The unit 215 and the processing unit 213 preferably adopt a Universal Asynchronous Receiver/Transmitter (UART) for information transmission, which has the advantage of quickly changing the resistance value to achieve the expected voltage output.

The above-mentioned aging board with subsystems is preferably configured such that a plurality of subsystem modules are arranged inside the aging board, but it can also be arranged outside the aging board without limitation. In addition, it has the advantages of the aging board of the subsystem To perform the following stage test after voltage adjustment is required during the aging test (for example, multiple devices to be tested at the same time to perform aging tests with different voltage values, and the aging test bench can only supply a fixed voltage at the same time) Therefore, the required test terminal voltage value can be changed by issuing instructions to the processing unit through the burn-in test bench; and it can adjust the voltage value and detect the correct voltage value according to different needs; and provide a circuit to provide power with a shorter path , Improve power supply stability and avoid interference.

100 Aging test equipment 200 Aging board 210 Subsystem module 211 Voltage adjustment unit 2111 Feedback End 2112 Output terminal 212 Resistance adjustment unit 213 Processing unit 214 Memory unit 215 Control unit 216 Digital to Analog Converter 220 Test socket 221 Input terminal 300 Aging test bench 400 Aging room

Figure 1 is a schematic diagram of the burn-in test equipment of the present invention.

Fig. 2 is a schematic diagram of a plurality of burn-in boards arranged inside the burn-in chamber of the present invention.

Fig. 3 is a schematic top view of the burn-in board and burn-in test bench of the present invention.

Figure 4 is a schematic diagram of the burn-in board of the subsystem of the present invention.

100 Aging test equipment 200 Aging board 210 Subsystem module 211 Voltage adjustment unit 2111 Feedback End 2112 Output terminal 212 Resistance adjustment unit 213 Processing unit 214 Memory unit 215 Control unit 216 Digital to Analog Converter 220 Test socket 221 Input terminal

Claims (17)

A burn-in board with subsystems, comprising: a burn-in board, which receives power supplied from a burn-in test bench, and has a plurality of test sockets, each test socket is used for accommodating a device to be tested; and a plurality of subsystem modules, respectively Correspondingly and electrically connected to the plurality of test sockets, the plurality of subsystem modules are used for converting the power supply into different voltage values, and outputting the different voltage values to the corresponding test sockets respectively. The burn-in board with a subsystem according to claim 1, wherein the subsystem module has: a voltage adjustment unit that receives the power provided by the burn-in test bench through the burn-in board, converts the power into a test signal, and outputs To an input end of the test socket; a resistance adjustment unit, electrically connected between a feedback end of the voltage adjustment unit and the input end of the test socket, to provide a feedback signal to the feedback end of the voltage adjustment unit And a processing unit, coupled to the resistance adjustment unit, for determining a resistance value of the resistance adjustment unit. The burn-in board with subsystem as described in claim 2, wherein the subsystem module is further provided with a memory unit coupled to the processing unit for storing the resistance value. The burn-in board with subsystem as described in claim 2, wherein the subsystem module is further equipped with a control unit, which can remotely give instructions to the processing unit. The burn-in board with subsystem as described in claim 2, wherein the subsystem module further has a digital-to-analog converter electrically connected between the processing unit and the output terminal of the voltage adjustment unit for providing a Detect the signal to the processing unit. The burn-in board with subsystems according to claim 5, wherein the processing unit determines a resistance value of the resistance adjustment unit according to the detection signal of the digital analog converter. The burn-in board with subsystem as described in claim 1, wherein the subsystem module is arranged inside the burn-in board. The burn-in board with subsystem as described in claim 1, wherein the subsystem module is externally connected to the burn-in board. The burn-in board with subsystems according to claim 4, wherein the control unit uses a Universal Asynchronous Receiver/Transmitter (UART) for information transmission. The burn-in board with a subsystem according to claim 1, wherein the subsystem module is also configured to dynamically convert the power provided by the burn-in test bench so that a voltage output by the subsystem module to a test socket is greater than the A voltage of the power supply. A burn-in test equipment, comprising: a burn-in test bench; a plurality of burn-in boards receiving a power supply from the burn-in test bench, each burn-in board has a plurality of test sockets, and each test socket is used for accommodating a device to be tested; and a plurality of burn-in boards. The sub-system modules are respectively electrically connected to the plurality of test sockets, and the plurality of sub-system modules are used to convert the power supply into different voltage values and output the different voltage values to the corresponding test sockets. An aging test method is used for a device under test accommodated in a test socket, including: providing a voltage adjustment unit for converting a power source into a test signal; providing a resistance adjustment unit, the One end of the resistance adjustment unit is electrically connected to a feedback end of the voltage adjustment unit for providing a feedback signal to the feedback end, and the voltage adjustment unit has a first resistance value; A processing unit, determining the resistance adjustment unit to a second resistance value based on the test signal, thereby adjusting the feedback signal; and The voltage adjustment unit outputs another test signal based on at least the adjusted feedback signal. The method according to claim 12, wherein the voltage adjustment unit is a DC converter. The method according to claim 12, further comprising: the voltage adjustment unit outputs the test signal to an input terminal of the test socket. The method according to claim 12, wherein the other end of the resistance adjustment unit is electrically connected to an input end of the test socket, and the feedback signal is determined by the test signal and the first resistance value. The method according to claim 12, wherein the resistance adjustment unit is a digital variable resistor, the first resistance value is a preset resistance value, and the preset resistance value is associated with a desired test signal. The method according to claim 12, further comprising: in a test item for the device under test, the voltage adjustment unit dynamically converts the power source to make a voltage of the test signal or a voltage of the other test signal The voltage is greater than a voltage of the power supply.

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