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TWI748300B - Testing system and method - Google Patents

Testing system and method Download PDF

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Publication number
TWI748300B
TWI748300B TW108144855A TW108144855A TWI748300B TW I748300 B TWI748300 B TW I748300B TW 108144855 A TW108144855 A TW 108144855A TW 108144855 A TW108144855 A TW 108144855A TW I748300 B TWI748300 B TW I748300B
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test
information
memory
control chip
mentioned
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TW108144855A
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TW202122815A (en
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劉謹禎
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新唐科技股份有限公司
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Priority to CN202010337264.1A priority patent/CN113030692B/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2894Aspects of quality control [QC]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A testing method is provided in the invention. The testing method comprises the steps of when a testing machine performs a test program to perform a test process for a tested object, reading tested object information stored in a first memory of a control chip to determine whether the tested object matches the tested object information, wherein the control chip is configured in a testing jig and the testing jig is mounted on the testing machine; when the tested object matches the tested object information, initiating the test process; and writing the test information corresponding to the test process into a second memory of the control chip.

Description

測試系統和測試方法Test system and test method

本發明之實施例主要係有關於一測試技術,特別係有關於藉由治具之一控制晶片紀錄每一測試流程之測試資訊之測試技術。The embodiment of the present invention mainly relates to a test technology, and particularly relates to a test technology that records test information of each test process by a control chip of a jig.

當測試完之產品(例如:晶片)出貨給客戶端後,若客戶端發現產品異常時,產品製造商往往需要花費很長的時間去釐清。進一步地說,產品若是在進行測試時的某一測試流程出了問題,產品製造商往往必須尋求測試廠商提供資訊或協助,除了增加溝通來往所花費的時間成本,也無法確認測試廠是否有隱匿實情以規避責任的行為,因而造成無法有效追蹤發生異常之產品係經過哪些測試流程。因此,如何使產品製造商更快速地去取得產品在每一測試流程之測試資訊,以及更有效率地去追蹤和查詢產品所經過的每一測試流程將係值得討論之課題。After the tested product (such as a chip) is shipped to the client, if the client finds the product is abnormal, the product manufacturer often takes a long time to clarify. Furthermore, if there is a problem in a certain test process of the product during the test, the product manufacturer must often seek information or assistance from the test manufacturer. In addition to increasing the time cost of communication, it is also impossible to confirm whether the test plant is hidden. The act of avoiding responsibility based on the facts has resulted in the inability to effectively track which testing procedures the abnormal product has undergone. Therefore, how to enable product manufacturers to obtain the test information of the product in each test process more quickly, and to track and query each test process of the product more efficiently will be a topic worthy of discussion.

有鑑於上述先前技術之問題,本發明之實施例提供了一種測試方法和系統。In view of the above-mentioned problems of the prior art, the embodiments of the present invention provide a testing method and system.

根據本發明之一實施例提供了一種測試方法。上述測試方法之步驟包括,當在一測試機台執行一測試程式,以對一待測物進行一測試流程時,讀取儲存在一控制晶片之一第一記憶體之待測物資訊,以判斷上述待測物是否符合上述待測物資訊,其中上述控制晶片配置在一測試治具中,且上述測試治具安裝在上述測試機台上;當上述待測物符合上述待測物資訊時,開始進行上述測試流程;以及將對應上述測試流程之測試資訊寫入上述控制晶片之一第二記憶體中。According to an embodiment of the present invention, a test method is provided. The steps of the above-mentioned test method include, when a test program is executed on a test machine to perform a test process on an object under test, reading the object under test information stored in a first memory of a control chip to Determine whether the object under test meets the information of the object under test, wherein the control chip is configured in a test fixture, and the test fixture is installed on the test machine; when the object under test meets the information of the object under test , Start the above-mentioned test process; and write the test information corresponding to the above-mentioned test process into a second memory of the control chip.

根據本發明一些實施例,上述待測物資訊包括一公司名稱、一產品名稱和一治具編號。根據本發明一些實施例,上述測試資訊包括一測試時間、一測試流程名稱和一測試編號。According to some embodiments of the present invention, the above-mentioned DUT information includes a company name, a product name, and a fixture number. According to some embodiments of the present invention, the above-mentioned test information includes a test time, a test process name, and a test number.

根據本發明一些實施例,上述待測物具有一專屬編碼。上述專屬編碼係根據上述待測物所對應之貨物編號、封裝廠商資訊、測試廠商資訊和生產序列所產生。根據本發明一些實施例,根據上述專屬編碼,可查詢及追蹤對應上述待測物對應之上述測試資訊,並進一步確認產品異常的可能原因。According to some embodiments of the present invention, the above-mentioned object to be tested has an exclusive code. The above-mentioned exclusive code is generated based on the goods number corresponding to the above-mentioned DUT, package manufacturer information, test manufacturer information and production sequence. According to some embodiments of the present invention, according to the above-mentioned exclusive code, the above-mentioned test information corresponding to the above-mentioned object to be tested can be inquired and tracked, and the possible cause of the product abnormality can be further confirmed.

根據本發明之一實施例提供了一種測試系統。上述測試系統包括一待測物、一測試機台和一測試治具。測試治具安裝在上述測試機台上,且具有一控制晶片。當上述測試機台執行一測試程式,以對上述待測物進行一測試流程時,上述測試機台讀取已儲存在上述控制晶片之一第一記憶體之待測物資訊,以判斷上述待測物是否符合上述待測物資訊。當上述待測物符合上述待測物資訊時,上述測試機台開始進行上述測試流程,並將對應上述測試流程之測試資訊寫入上述控制晶片之一第二記憶體中。According to an embodiment of the present invention, a test system is provided. The above-mentioned test system includes a test object, a test machine and a test fixture. The test fixture is installed on the above-mentioned test machine and has a control chip. When the test machine executes a test program to perform a test process on the object under test, the test machine reads the information about the object under test stored in the first memory of the control chip to determine the object under test. Whether the measured object meets the above-mentioned information of the measured object. When the object under test meets the information of the object under test, the testing machine starts the test process, and writes the test information corresponding to the test process into a second memory of the control chip.

關於本發明其他附加的特徵與優點,此領域之熟習技術人士,在不脫離本發明之精神和範圍內,當可根據本案實施方法中所揭露之測試系統和方法,做些許的更動與潤飾而得到。Regarding other additional features and advantages of the present invention, those skilled in the art, without departing from the spirit and scope of the present invention, can make some changes and modifications according to the test system and method disclosed in the implementation method of this case. get.

本章節所敘述的是實施本發明之較佳方式,目的在於說明本發明之精神而非用以限定本發明之保護範圍,本發明之保護範圍當視後附之申請專利範圍所界定者為準。The descriptions in this chapter are the preferred ways to implement the present invention. The purpose is to explain the spirit of the present invention and not to limit the scope of protection of the present invention. .

第1圖係顯示根據本發明之一實施例所述之一測試系統100之方塊圖。如第1圖所示,測試系統100可包含一測試機台110、一測試治具120以及一待測物130。注意地是,在第1圖中所示之方塊圖,僅係為了方便說明本發明之實施例,但本發明並不以第1圖為限。Fig. 1 shows a block diagram of a test system 100 according to an embodiment of the invention. As shown in FIG. 1, the testing system 100 may include a testing machine 110, a testing jig 120 and an object to be tested 130. Note that the block diagram shown in Figure 1 is only for the convenience of describing the embodiments of the present invention, but the present invention is not limited to Figure 1.

在本發明之實施例中,測試治具120會安裝在測試機台110上。當測試機台110要對待測物130進行測試時,待測物130會放置在測試治具120上,以進行測試。根據本發明一實施例,當待測物130在進行晶圓測試(chip probing(或circuit probing),CP)時,測試治具120可係一探針卡(probe card)。根據本發明另一實施例,當待測物130在進行晶片測試時,測試治具120可係一載板(load board)。晶片測試可包括相關性測試(correlation testing)、最終測試(final testing,FT)以及品質控制(quality control,QC)測試。根據本發明一實施例,待測物130可係一晶片(IC)或整批晶片。 In the embodiment of the present invention, the test fixture 120 is installed on the test machine 110. When the testing machine 110 is to test the object 130 to be tested, the object 130 to be tested is placed on the test fixture 120 for testing. According to an embodiment of the present invention, when the test object 130 is undergoing chip probing (or circuit probing, CP), the test fixture 120 may be a probe card. According to another embodiment of the present invention, when the test object 130 is undergoing a wafer test, the test fixture 120 can be a load board. Wafer testing may include correlation testing (correlation testing), final testing (FT), and quality control (QC) testing. According to an embodiment of the present invention, the test object 130 can be a chip (IC) or a batch of chips.

如第1圖所示,根據本發明一實施例,一控制晶片200會配置在測試治具120中。根據本發明一實施例,控制晶片200可包含一第一記憶體210以及一第二記憶體220。注意地是,在第1圖中所示之控制晶片200,僅係為了方便說明本發明之實施例,但本發明並不以第1圖為限。控制晶片200亦可包含其他元件。根據本發明一實施例,第一記憶體210和第二記憶體220可係快閃記憶體(flash memory)。 As shown in FIG. 1, according to an embodiment of the present invention, a control chip 200 is disposed in the test fixture 120. According to an embodiment of the present invention, the control chip 200 may include a first memory 210 and a second memory 220. Note that the control chip 200 shown in FIG. 1 is only for the convenience of describing the embodiment of the present invention, but the present invention is not limited to FIG. 1. The control chip 200 may also include other components. According to an embodiment of the present invention, the first memory 210 and the second memory 220 may be flash memory.

根據本發明一實施例,第一記憶體210可用以儲存待測物130之待測物資訊。待測物資訊可預先被寫入第一記憶體210中。根據本發明一實施例,待測物資訊可包括待測物130對應之一公司名稱、一產品名稱和一治具編號,但本發明不以此為限。公司名稱可係表示待測物130之製造商之名稱。產品名稱可係表示待測物130之型號。治具編號可係表示對應待測物130之測試治具120之編號。根據本發明一實施例,當測試機台110執行一測試程式,要對待測物130進行一測試流程時,測試機台110會先讀取儲存在第一記憶體210之待測物資訊,以判斷目前在測試機台110上之測試治具120和待測物130是否符合待測物資訊。當符合待測物資訊時,測試機台110才能對待測物130進行測試。根據本發明一實施例,測試機台110僅能對第一記憶體210進行讀取之操作。According to an embodiment of the present invention, the first memory 210 can be used to store the test object information of the test object 130. The information of the test object can be written into the first memory 210 in advance. According to an embodiment of the present invention, the test object information may include a company name, a product name, and a fixture number corresponding to the test object 130, but the present invention is not limited to this. The company name may indicate the name of the manufacturer of the test object 130. The product name can indicate the model of the test object 130. The jig number can indicate the number of the test jig 120 corresponding to the test object 130. According to an embodiment of the present invention, when the test machine 110 executes a test program to perform a test process on the test object 130, the test machine 110 first reads the test object information stored in the first memory 210 to It is determined whether the test fixture 120 and the object under test 130 currently on the testing machine 110 meet the information of the object under test. When the information of the object under test is met, the testing machine 110 can test the object under test 130. According to an embodiment of the present invention, the testing machine 110 can only perform a reading operation on the first memory 210.

根據本發明一實施例,第二記憶體220可用以紀錄當對待測物130進行一測試流程時,對應該次測試流程之測試資訊。根據本發明一實施例,測試資訊可包括該次測試流程對應之一測試時間、一測試流程名稱和一測試編號,但本發明不以此為限。測試時間可係表示測試開始的時間,例如:年、月、日、時、分、秒等。測試流程名稱可係表示此次所進行之測試流程,例如:若進行第一次晶圓測試之測試流程,測試流程名稱可記錄為CP1、若進行第二次晶圓測試之測試流程,測試流程名稱可記錄為CP2、若進行最終測試之測試流程,測試流程名稱可記錄為FT,以及若進行品質控制測試之測試流程,測試流程名稱可記錄為CP,但本發明不以此為限。測試編號可係表示所要進行測試之待測物130之貨批編號。每當測試機台110需要對待測物130進行一次測試流程,測試機台110就會啟動一次測試程式,和寫入一筆測試資訊至第二記憶體220中。因此,對應不同的測試流程,待測物130會有不同的測試資訊。當待測物130在測試廠之測試機台測試完畢後,待測物130之製造商從取回之測試治具120即可取得待測物130對應之測試資訊。根據本發明一實施例,待測物130對應之測試資訊可儲存在製造商之一管理系統(圖未顯示)中,以作為後續追蹤使用,藉此,若產品異常即可透過待測物及其對應之測試資訊確認造成異常的可能原因。也就是說,透過管理系統,可根據測試資訊得知發生異常的產品有經過哪些測試流程。According to an embodiment of the present invention, the second memory 220 can be used to record the test information corresponding to the test process when the test object 130 is subjected to a test process. According to an embodiment of the present invention, the test information may include a test time corresponding to the test process, a test process name, and a test number, but the present invention is not limited to this. The test time can be the time that the test starts, such as year, month, day, hour, minute, second, etc. The name of the test process can refer to the test process performed this time. For example, if the test process of the first wafer test is performed, the test process name can be recorded as CP1, if the test process of the second wafer test is performed, the test process The name can be recorded as CP2, if the test process of the final test is performed, the test process name can be recorded as FT, and if the test process of the quality control test is performed, the test process name can be recorded as CP, but the present invention is not limited to this. The test number may be the lot number of the test object 130 to be tested. Whenever the test machine 110 needs to perform a test process for the test object 130, the test machine 110 will start a test program and write a piece of test information into the second memory 220. Therefore, corresponding to different test procedures, the DUT 130 will have different test information. After the test object 130 has been tested by the testing machine of the testing factory, the manufacturer of the test object 130 can obtain the test information corresponding to the test object 130 from the retrieved test fixture 120. According to an embodiment of the present invention, the test information corresponding to the DUT 130 can be stored in a management system (not shown in the figure) of one of the manufacturers for follow-up tracking, so that if the product is abnormal, the DUT and the The corresponding test information confirms the possible cause of the abnormality. In other words, through the management system, the test information can be used to know which test procedures the abnormal product has undergone.

根據本發明一實施例,待測物130可具有一專屬編碼,專屬編碼可印在待測物130上。根據本發明一實施例,專屬編碼可係一二維條碼,例如:QR code,但本發明不以此為限。根據本發明一實施例,專屬編碼可係藉由一條碼產生器根據待測物130所對應之貨物編號(lot number)、封裝廠商資訊、測試廠商資訊和生產序列(data number)所產生。當客戶端認為產品(例如:待測物130)有問題時,在製造商端,可藉由讀取產品之專屬編碼,從管理系統來查詢產品對應之測試資訊,以迅速釐清發生問題的產品係那一批貨,以及異常產品係經過哪些測試流程。在製造商端,亦可在管理系統中發佈產品異常通知,以供客戶端查詢。具體來說,客戶端可藉由讀取待測物130之專屬編碼,連線到製造商之管理系統,以確認是否有對應待測物130之產品異常通知。若有產品異常通知時,客戶端即可得知待測物130或和待測物130屬於同一批之產品係有異常之產品。According to an embodiment of the present invention, the test object 130 may have an exclusive code, and the exclusive code may be printed on the test object 130. According to an embodiment of the present invention, the exclusive code may be a two-dimensional bar code, such as a QR code, but the present invention is not limited to this. According to an embodiment of the present invention, the exclusive code can be generated by a code generator based on the lot number, package manufacturer information, test manufacturer information, and data number corresponding to the DUT 130. When the client thinks that there is a problem with the product (for example: DUT 130), the manufacturer can read the product’s exclusive code and query the corresponding test information from the management system to quickly identify the product with the problem. Which batch of goods is it, and what testing process the abnormal product has undergone. On the manufacturer's side, product exception notifications can also be issued in the management system for client inquiries. Specifically, the client can read the exclusive code of the DUT 130 and connect to the manufacturer's management system to confirm whether there is a product abnormality notification corresponding to the DUT 130. If there is a product abnormality notification, the client can know that the DUT 130 or the product belonging to the same batch as the DUT 130 is an abnormal product.

第2圖係根據本發明之一實施例所述之測試方法之流程圖。此測試方法適用於測試系統100。如第2圖所示,在步驟S210,當在測試系統100之一測試機台執行一測試程式,以對一待測物進行一測試流程時,讀取儲存在一控制晶片之一第一記憶體之待測物資訊,以判斷待測物是否符合待測物資訊,其中控制晶片配置在測試系統100之一測試治具中,且測試治具安裝在測試機台上。當待測物符合待測物資訊時,進行步驟S220。在步驟S220,測試機台開始進行測試流程。當待測物不符合待測物資訊時,則不進行測試流程。在步驟S230,測試機台將對應測試流程之測試資訊寫入控制晶片之一第二記憶體中。Figure 2 is a flowchart of the testing method according to an embodiment of the present invention. This test method is applicable to the test system 100. As shown in Figure 2, in step S210, when a test program is executed on a test machine of the test system 100 to perform a test process on an object under test, a first memory stored in a control chip is read The test object information of the body is used to determine whether the test object meets the test object information. The control chip is configured in a test fixture of the test system 100, and the test fixture is installed on the test machine. When the object to be measured matches the information of the object to be measured, step S220 is performed. In step S220, the testing machine starts the testing process. When the DUT does not match the DUT information, the test process is not performed. In step S230, the test machine writes the test information corresponding to the test process into a second memory of the control chip.

根據本發明一些實施例,在測試方法之待測物資訊包括一公司名稱、一產品名稱和一治具編號。根據本發明一些實施例,在測試方法之測試資訊包括一測試時間、一測試流程名稱和一測試編號。According to some embodiments of the present invention, the DUT information in the test method includes a company name, a product name, and a fixture number. According to some embodiments of the present invention, the test information in the test method includes a test time, a test process name, and a test number.

根據本發明一些實施例,在測試方法之待測物具有一專屬編碼。根據本發明一些實施例,專屬編碼係根據待測物所對應之貨物編號、封裝廠商資訊、測試廠商資訊和生產序列所產生。根據本發明一些實施例,測試方法更包括,根據待測物之專屬編碼,查詢對應待測物對應之測試資訊。根據本發明一些實施例,測試方法更包括,根據待測物之專屬編碼,確認是否有對應待測物之產品異常通知被發佈。According to some embodiments of the present invention, the test object in the test method has an exclusive code. According to some embodiments of the present invention, the exclusive code is generated based on the goods number corresponding to the object under test, package manufacturer information, test manufacturer information, and production sequence. According to some embodiments of the present invention, the test method further includes, according to the unique code of the test object, querying the corresponding test information corresponding to the test object. According to some embodiments of the present invention, the test method further includes, according to the exclusive code of the test object, confirming whether a product abnormality notification corresponding to the test object is issued.

根據本發明之實施例所提出之測試系統和方法中,配置在測試治具中的控制晶片的第一記憶體中會儲存待測物資訊,以確認待測物是否符合待測物資訊。因此,將可避免測試程式被不法使用。此外,根據本發明之實施例所提出之測試系統和方法中,配置在測試治具中的控制晶片的第二記憶體中可記錄對應測試流程之測試資訊。因此,若產品有異常時,將可迅速地取得發生異常之產品所經過之測試流程之測試資訊。此外,根據本發明之實施例所提出之測試系統和方法中,製造商和客戶端都可根據待測物之專屬編碼,即時取得待測物對應之相關資訊。In the test system and method proposed according to the embodiment of the present invention, the information of the test object is stored in the first memory of the control chip configured in the test fixture to confirm whether the test object matches the information of the test object. Therefore, illegal use of the test program can be avoided. In addition, in the test system and method according to the embodiments of the present invention, the second memory of the control chip configured in the test fixture can record test information corresponding to the test process. Therefore, if the product is abnormal, the test information of the test process that the abnormal product has gone through can be quickly obtained. In addition, in the test system and method according to the embodiment of the present invention, both the manufacturer and the client can obtain the relevant information corresponding to the test object in real time according to the exclusive code of the test object.

在本說明書中以及申請專利範圍中的序號,例如「第一」、「第二」等等,僅係為了方便說明,彼此之間並沒有順序上的先後關係。The serial numbers in this specification and in the scope of the patent application, such as "first", "second", etc., are only for convenience of explanation, and there is no sequential relationship between them.

本發明之說明書所揭露之方法和演算法之步驟,可直接透過執行一處理器直接應用在硬體以及軟體模組或兩者之結合上。一軟體模組(包括執行指令和相關數據)和其它數據可儲存在數據記憶體中,像是隨機存取記憶體(RAM)、快閃記憶體(flash memory)、唯讀記憶體(ROM)、可抹除可程式化唯讀記憶體(EPROM)、電子式可抹除可程式化唯讀記憶體(EEPROM)、暫存器、硬碟、可攜式應碟、光碟唯讀記憶體(CD-ROM)、DVD或在此領域習知技術中任何其它電腦可讀取之儲存媒體格式。一儲存媒體可耦接至一機器裝置,舉例來說,像是電腦/處理器(爲了說明之方便,在本說明書以處理器來表示),上述處理器可透過來讀取資訊(像是程式碼),以及寫入資訊至儲存媒體。一儲存媒體可整合一處理器。一特殊應用積體電路(ASIC)包括處理器和儲存媒體。一用戶設備則包括一特殊應用積體電路。換句話說,處理器和儲存媒體以不直接連接用戶設備的方式,包含於用戶設備中。此外,在一些實施例中,任何適合電腦程序之產品包括可讀取之儲存媒體,其中可讀取之儲存媒體包括和一或多個所揭露實施例相關之程式碼。在一些實施例中,電腦程序之產品可包括封裝材料。The steps of the method and algorithm disclosed in the specification of the present invention can be directly applied to hardware and software modules or a combination of the two directly by executing a processor. A software module (including execution commands and related data) and other data can be stored in data memory, such as random access memory (RAM), flash memory (flash memory), and read-only memory (ROM) , Erasable Programmable Read-Only Memory (EPROM), Electronically Erasable Programmable Read-Only Memory (EEPROM), Register, Hard Disk, Portable Disk, CD-ROM Read-Only Memory ( CD-ROM), DVD or any other computer-readable storage media format known in this field. A storage medium can be coupled to a machine device, such as a computer/processor (for the convenience of description, it is represented by a processor in this manual), and the processor can read information (such as a program) Code), and write information to the storage medium. A storage medium can integrate a processor. An application-specific integrated circuit (ASIC) includes a processor and a storage medium. A user equipment includes a special application integrated circuit. In other words, the processor and the storage medium are included in the user equipment in a way that they are not directly connected to the user equipment. In addition, in some embodiments, any product suitable for computer programs includes a readable storage medium, where the readable storage medium includes code related to one or more of the disclosed embodiments. In some embodiments, the product of the computer program may include packaging materials.

以上段落使用多種層面描述。顯然的,本文的教示可以多種方式實現,而在範例中揭露之任何特定架構或功能僅為一代表性之狀況。根據本文之教示,任何熟知此技藝之人士應理解在本文揭露之各層面可獨立實作或兩種以上之層面可以合併實作。The above paragraphs use multiple levels of description. Obviously, the teachings of this document can be implemented in a variety of ways, and any specific structure or function disclosed in the example is only a representative situation. According to the teachings in this article, anyone who is familiar with this technique should understand that each level disclosed in this article can be implemented independently or two or more levels can be implemented in combination.

雖然本揭露已以實施例揭露如上,然其並非用以限定本揭露,任何熟習此技藝者,在不脫離本揭露之精神和範圍內,當可作些許之更動與潤飾,因此發明之保護範圍當視後附之申請專利範圍所界定者為準。Although this disclosure has been disclosed in the above embodiments, it is not intended to limit the disclosure. Anyone who is familiar with this technique can make some changes and modifications without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of the invention When the scope of the attached patent application is defined, it shall prevail.

100:測試系統 110:測試機台 120:測試治具 130:待測物 200:控制晶片 210:第一記憶體 220:第二記憶體 S210~S230:步驟100: test system 110: Test machine 120: test fixture 130: DUT 200: control chip 210: first memory 220: second memory S210~S230: steps

第1圖係顯示根據本發明之一實施例所述之一測試系統100之方塊圖。 第2圖係根據本發明之一實施例所述之測試方法之流程圖。Fig. 1 shows a block diagram of a test system 100 according to an embodiment of the invention. Figure 2 is a flowchart of the testing method according to an embodiment of the present invention.

100:測試系統100: test system

110:測試機台110: Test machine

120:測試治具120: test fixture

130:待測物130: DUT

200:控制晶片200: control chip

210:第一記憶體210: first memory

220:第二記憶體220: second memory

Claims (6)

一種測試方法,包括:當在一測試機台執行一測試程式,以對一待測物進行一測試流程時,讀取儲存在一控制晶片之一第一記憶體之待測物資訊,以判斷上述待測物是否符合上述待測物資訊,其中上述控制晶片配置在一測試治具中,且上述測試治具安裝在上述測試機台上,且其中上述待測物係一晶片;當上述待測物符合上述待測物資訊時,開始進行上述測試流程;以及將對應上述測試流程之測試資訊寫入上述控制晶片之一第二記憶體中;其中上述待測物資訊包括一公司名稱、一產品名稱和一治具編號,其中上述第二記憶體中儲存上述待測物進行不同測試資訊所對應的不同測試資訊,其中上述每一測試資訊包括一測試時間、一測試流程名稱和一測試編號。 A test method includes: when a test program is executed on a test machine to perform a test process on a test object, reading the test object information stored in a first memory of a control chip to determine Whether the object under test meets the information of the object under test, wherein the control chip is arranged in a test fixture, and the test fixture is installed on the test machine, and the object under test is a chip; When the test object meets the information of the test object, the test process is started; and the test information corresponding to the test process is written into a second memory of the control chip; wherein the information of the test object includes a company name and a second memory of the control chip. Product name and a fixture number, wherein the second memory stores different test information corresponding to different test information of the test object, wherein each test information includes a test time, a test process name, and a test number . 如申請專利範圍第1項所述之測試方法,其中上述待測物具有一專屬編碼。 The test method described in item 1 of the scope of patent application, wherein the above-mentioned object to be tested has an exclusive code. 如申請專利範圍第2項所述之測試方法,其中上述專屬編碼係根據上述待測物所對應之貨物編號、封裝廠商資訊、測試廠商資訊和生產序列所產生。 As for the test method described in item 2 of the scope of patent application, the above-mentioned exclusive code is generated based on the goods number corresponding to the above-mentioned object under test, package manufacturer information, test manufacturer information and production sequence. 一種測試系統,包括:一待測物,其中上述待測物係一晶片;一測試機台;以及 一測試治具,安裝在上述測試機台上,且具有一控制晶片;其中當上述測試機台執行一測試程式,以對上述待測物進行一測試流程時,上述測試機台讀取儲存在上述控制晶片之一第一記憶體之待測物資訊,以判斷上述待測物是否符合上述待測物資訊;以及其中當上述待測物符合上述待測物資訊時,上述測試機台開始進行上述測試流程,並將對應上述測試流程之測試資訊寫入上述控制晶片之一第二記憶體中;其中上述待測物資訊包括一公司名稱、一產品名稱和一治具編號,其中上述第二記憶體中儲存上述待測物進行不同測試資訊所對應的不同測試資訊,其中上述每一測試資訊包括一測試時間、一測試流程名稱和一測試編號。 A testing system includes: an object to be tested, wherein the object to be tested is a chip; a testing machine; and A test fixture is installed on the test machine and has a control chip; wherein when the test machine executes a test program to perform a test process on the object under test, the test machine reads and stores it in The test object information of the first memory of the control chip is used to determine whether the test object meets the test object information; and when the test object meets the test object information, the test machine starts to perform The above-mentioned test process, and the test information corresponding to the above-mentioned test process is written into a second memory of the control chip; wherein the information of the object to be tested includes a company name, a product name, and a fixture number, and the second Different test information corresponding to different test information of the above-mentioned object to be tested is stored in the memory, wherein each of the above-mentioned test information includes a test time, a test process name, and a test number. 如申請專利範圍第4項所述之測試系統,其中上述待測物具有一專屬編碼。 For the test system described in item 4 of the scope of patent application, the above-mentioned object to be tested has an exclusive code. 如申請專利範圍第5項所述之測試系統,其中上述專屬編碼係根據上述待測物所對應之貨物編號、封裝廠商資訊、測試廠商資訊和生產序列所產生。For the test system described in item 5 of the scope of patent application, the above-mentioned exclusive code is generated based on the goods number corresponding to the above-mentioned object under test, package manufacturer information, test manufacturer information and production sequence.
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