TWI746821B - Laser processing method of frame unit and processed object - Google Patents

Abstract

[Problem] 　　 provides a frame unit that can be used instead of the adhesive tape to reduce the cost required for processing the workpiece. [Solution] 　　 A frame unit for the user to hold the object to be processed, including: a ring-shaped frame having an opening for accommodating the object to be processed; The electrode layer; and the power supply unit, equipped with a battery that supplies power to the electrode, and controls the power supply from the battery to the electrode; the object to be processed is absorbed and maintained by electrostatic force.

Description

Laser processing method of frame unit and processed object

The present invention relates to a frame unit used to hold a processed object and a laser processing method of the processed object using the frame unit.

When dividing a semiconductor wafer, an optical device wafer, a package substrate, and the like into a plurality of wafers, the workpiece is first held by a clamping table or the like. After that, the laser beam is irradiated along the planned dividing line (cutting path) set in the workpiece, or a rotating ring-shaped cutting tool is cut in, so that the workpiece can be divided into a plurality of wafers (for example, refer to the patent Literature 1).

In such a method, before dividing the workpiece, the central part of the adhesive tape (cutting tape) with a larger diameter than the workpiece is attached to the workpiece, and the outer peripheral part of the adhesive tape is fixed to surround the workpiece. Ring-shaped frame. Thereby, it is possible to prevent the workpiece from directly contacting the clamping table and being damaged. Furthermore, the dispersion of the wafers obtained by dividing the workpiece into pieces is prevented, so that it can be easily transported (for example, refer to Patent Document 2). [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2012-84720 　　 [Patent Document 2] Japanese Patent Application Publication No. 9-27543

[The problem to be solved by the invention]

However, in the above-mentioned method, the adhesive tape after use cannot be reused, so the cost required for processing of the workpiece tends to increase. In particular, high-performance adhesive tapes that hardly leave the adhesive material on the workpiece are also expensive. Therefore, when such adhesive tapes are used, the cost for processing the workpiece also increases.

The present invention was created in view of this problem, and its purpose is to provide a frame unit and a laser processing method for a processed object using the frame unit. The frame unit is used instead of an adhesive tape to meet the processing requirements of the processed object. The cost is suppressed to the lower one. [Technical means to solve the problem]

According to an aspect of the present invention, there is provided a frame unit for the user to hold the object to be processed. The frame unit is provided with: a ring-shaped frame having an opening for accommodating the object to be processed; and an electrode sheet covering the opening of the frame A part of it is provided with an electrode layer including positive and negative electrodes; and a power supply unit equipped with a battery that supplies power to the electrode to control the power supply from the battery to the electrode; the workpiece is attracted and held by electrostatic force.

In one aspect of the present invention, the electrode layer may include a pair of comb-shaped electrodes formed by aligning positive and negative electrodes into a pair of mutually different electrodes. In addition, the electrode sheet may be provided on a resin sheet fixed to the frame at the outer peripheral portion. Furthermore, the electrode sheet may be configured to transmit a laser beam of a wavelength that is transmissive to the workpiece, and the frame unit may be used when the laser beam is irradiated to the workpiece through the electrode sheet.

According to another aspect of the present invention, a laser processing method of a processed object is provided. The processing method of the processed object using the above-mentioned frame unit includes: an adsorption step to place the processed object on the frame The electrode sheet of the unit supplies power to the electrode to attract the workpiece with electrostatic force; the frame unit supports the step to have the first surface and the second surface opposite to the first surface and make the The first surface side of the plate-shaped support table through which the laser beam with the transmissive wavelength of the processed object is transmitted supports the electrode sheet side of the frame unit under the processed object; the laser processing step starts from On the second surface side of the support table, the laser beam is irradiated to the workpiece through the support table and the electrode sheet, and the interior of the workpiece is modified to form a modified layer; the frame unit removal step, After the laser processing step is performed, the frame unit is removed from the support table; and the peeling step, after the frame unit removal step, the power supply to the electrode is adjusted, and the processed object is removed from the frame unit. The electrode sheet is peeled off. [Compared with the effect of the previous technology]

A related frame unit of one aspect of the present invention has a ring-shaped frame, an electrode sheet having an electrode layer including positive and negative electrodes, a power supply unit that is equipped with a battery that supplies power to the electrode and controls the power supply from the battery to the electrode. The force to be processed is absorbed and maintained, so it is different from the adhesive tape that uses the adhesive material, and it can be used repeatedly. Therefore, using this frame unit instead of the adhesive tape makes it possible to suppress the cost required for the processing of the workpiece to be low.

Embodiments related to one aspect of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view schematically showing a configuration example of the frame unit 2 related to this embodiment, and FIG. 2 is a cross-sectional view schematically showing a configuration example of the frame unit 2.

As shown in FIGS. 1 and 2, the frame unit 2 includes a ring-shaped frame 4 made of a material such as aluminum. An opening 4c is formed in the center of the frame 4 to penetrate the frame 4 from the first surface 4a to the second surface 4b. The shape of the opening 4c is, for example, a substantially circular shape when viewed from the side of the first surface 4a (or the side of the second surface 4b). In addition, the material, shape, and size of the frame 4 are not particularly limited.

On the second surface 4b of the frame 4, a film-like back sheet (resin sheet) 6 made of materials such as polyethylene (PE) and polyethylene terephthalate (PET) is fixed so as to cover the opening 4c . Specifically, the outer peripheral portion on the first surface 6a side of the circular base sheet 6 is adhered to the second surface 4b of the frame 4.

The backsheet 6 has flexibility to the extent that it can protect the workpiece 11 (refer to FIG. 5 and the like), and insulation to the extent that it does not hinder the force of static electricity described later. However, the material, shape, thickness, size, etc. of the backsheet 6 are not particularly limited. The workpiece 11 is held on the first surface 6a side of the base sheet 6. On the other hand, the electrode sheet 8 is provided in the central part of the second surface 6b side of the bottom sheet 6.

FIG. 3 is a plan view schematically showing a configuration example of the electrode sheet 8, and FIG. 4 is a cross-sectional view schematically showing a configuration example of the electrode sheet 8. The electrode sheet 8 is composed of, for example, the same material as the substrate 6 The supporting piece 10 is formed into a substantially circular shape. The diameter of the support piece 10 is smaller than the diameter of the opening 4c and larger than the diameter of the workpiece 11. However, the material, shape, thickness, size, etc. of the support sheet 10 are not particularly limited.

An electrode layer 12 is arranged on one surface of the support sheet 10 (for example, the surface on the side of the back sheet 6). This electrode layer 12 is obtained, for example, by separating a conductive material layer formed on one side of the support sheet 10 with a conductive material into a positive electrode pattern (electrode) 12a and a negative electrode pattern (electrode) 12b. As for the conductive material forming the conductive material layer, for example, indium tin oxide (Indium Tin Oxide: ITO) and other materials that are transparent in the visible range can be mentioned.

In this case, for example, the conductive material layer may be separated into the positive electrode pattern 12a and the negative electrode pattern 12b by a method of irradiating a laser beam along an arbitrary planned separation line and performing ablation. That is, a laser beam of a wavelength that is easily absorbed by the conductive material layer is irradiated along a predetermined separation line to form an insulating region 12c where the conductive material layer is removed.

Thereby, the positive electrode pattern 12a and the negative electrode pattern 12b separated by the insulating region 12c are obtained. In this method, it is sufficient to irradiate the laser beam along the predetermined separation line of the conductive material layer, so the time required for processing can be easily shortened compared to methods such as etching under a mask.

Of course, the conductive material layer may be separated into the positive electrode pattern 12a and the negative electrode pattern 12b by etching or the like. In addition, the electrode layer 12 in a state where the positive electrode pattern 12a and the negative electrode pattern 12b are separated may be formed by a method such as screen printing, inkjet, or the like.

The shape of the positive electrode pattern 12a and the negative electrode pattern 12b may be, for example, the positive electrode and the negative electrode may be arranged in a pair of comb shapes that are different from each other. With regard to such comb-shaped electrodes (comb-shaped electrodes), positive electrodes and negative electrodes are arranged at a high density. Therefore, for example, an electrostatic force called a gradient force that acts between the electrode and the workpiece 11 is also Become stronger. That is, it becomes possible to hold the workpiece 11 with a strong force.

However, the shapes of the positive electrode pattern 12a and the negative electrode pattern 12b are not particularly limited. For example, the positive electrode pattern 12a and the negative electrode pattern 12b may be formed in a circle or the like. In addition, when the insulating region 12c shown in FIG. 3 is formed by using the ablation under the laser beam, the laser beam can be irradiated in one stroke to further shorten the processing time.

The electrode sheet 8 configured in this manner is arranged so that the electrode layer 12 side is in close contact with the second surface 6b side of the back sheet 6 through the cover sheet 14 having adhesive force, for example. Thereby, the electric field generated from the electrode layer 12 can be efficiently applied to the workpiece 11 on the first surface 6a side compared to the case where the support sheet 10 side is in close contact with the second surface 6b side.

The cover sheet 14 includes, for example, a circular base sheet formed of the same material as the base sheet 6 and a paste layer (adhesive layer) provided on one side of the base sheet. Here, the diameter of the cover sheet 14 (base material sheet) is larger than the diameter of the electrode sheet 8 (support sheet 10). However, the material, shape, thickness, size, structure, etc. of the cover sheet 14 are not particularly limited.

In addition, although the electrode layer 12 is formed of a material transparent in the visible range, such as indium tin oxide, in this embodiment, the material of the electrode layer 12 is changed according to the use of the frame unit 2 and the like. For example, when the workpiece 11 is irradiated with a laser beam through the electrode layer 12, it is necessary to form the electrode layer 12 with a material that transmits the laser beam. In this case, the negative film 6, the support film 10, and the cover film 14 also use materials that allow the laser beam to pass through.

On the other hand, when the workpiece 11 is irradiated with a laser beam without passing through the electrode layer 12, a ring-shaped cutting tool is cut into the workpiece 11, etc., it is not necessary to use a transparent material to form the electrode layer. 12. In this case, there is no need to use transparent materials for the bottom sheet 6, the support sheet 10, and the cover sheet 14.

A first wiring 16a connected to the positive electrode pattern 12a and a second wiring 16b connected to the negative electrode pattern 12b are arranged on the second surface 6b side of the base sheet 6. As shown in FIG. 1, a power supply unit 18 is provided on the side of the first surface 4 a of the frame 4. The first wiring 16a and the second wiring 16b are made to be connected to the power supply unit 18 around the frame 4, for example.

The power supply unit 18 includes a battery holder 18a for accommodating the battery 20 used for power supply to the positive electrode pattern 12a and the negative electrode pattern 12b described above. In addition, at a position adjacent to the battery holder 18a, a switch 18b for switching between power supply and non-power supply to the positive electrode pattern 12a and the negative electrode pattern 12b is provided.

For example, when the switch 18b is turned on (conduction state), the power of the battery 20 housed in the battery holder 18a is supplied to the positive electrode pattern 12a and the negative electrode pattern 12b via the first wiring 16a and the second wiring 16b. On the other hand, when the switch 18b is set to a non-conductive state (off state), the power supply to the positive electrode pattern 12a and the negative electrode pattern 12b is stopped.

In addition, although the power supply unit 18 is arranged on the side of the first surface 4a of the frame 4 in this embodiment, there is no particular limitation on the arrangement of the power supply unit 18 and the like. At least this power supply unit 18 may be arranged at a position where it does not become an obstacle when the frame unit 2 is used (for example, supported). For example, the power supply unit 18 may also be arranged in the opening 4c of the frame 4. In addition, the battery 20 may be a primary battery such as a button battery (coin battery), or a secondary battery that can be used repeatedly through charging.

Next, a description will be given of a laser processing method using the workpiece under the frame unit 2 as described above. In the laser processing method of the workpiece according to this embodiment, first, an adsorption step of adsorbing the workpiece 11 with the frame unit 2 is performed. Fig. 5 is a perspective view for explaining the adsorption step.

The workpiece 11 processed in this embodiment is a disc-shaped wafer made of a material such as silicon (Si), for example. The surface 11a side of the workpiece 11 is divided into a plurality of regions by planned dividing lines (cutting lanes) 13 set in a grid shape, and IC (Integrated Circuit), MEMS (Micro Electro Mechanical Systems), etc. are formed in each region.装置15。 Device 15.

In addition, although a disk-shaped wafer made of a material such as silicon is used as the workpiece 11 in this embodiment, the material, shape, structure, and size of the workpiece 11 are not limited. The workpiece 11 made of materials such as other semiconductors, ceramics, resins, and metals may also be used. Similarly, there are no restrictions on the type, number, shape, structure, size, and configuration of the device 15.

In the adsorption step, first, the workpiece 11 is placed on the base sheet 6 so that the back surface 11 b side of the workpiece 11 is in contact with the first surface 6 a side of the base sheet 6. More specifically, the workpiece 11 is placed on a region (central part) of the base sheet 6 corresponding to the electrode sheet 8. Next, the switch 18b of the power supply unit 18 is turned on, and the power of the battery 20 is supplied to the positive electrode pattern 12a and the negative electrode pattern 12b.

As a result, an electric field is generated around the positive electrode pattern 12 a and the negative electrode pattern 12 b. As a result, electrostatic force acts between the workpiece 11 and the electrode layer 12. Due to this electrostatic force, the workpiece 11 is attracted and held by the frame unit 2. In addition, the electrostatic force acting between the workpiece 11 and the electrode layer 12 includes Coulomb force, JR force, gradient force, and the like.

After the adsorption step, a frame unit support step for supporting the frame unit 2 in a state where the workpiece 11 is adsorbed is performed. 6 is a perspective view schematically showing a configuration example of the laser processing apparatus 102 used in the frame unit supporting step, etc., and FIG. 7 is a cross-sectional view for explaining the frame unit supporting step and the like. In addition, in FIG. 6 and FIG. 7, a part of the constituent elements of the laser processing apparatus 102 are shown using functional blocks and the like.

As shown in FIG. 6, the laser processing apparatus 102 is provided with the base 104 which supports each component. At the rear end of the base 104, a support structure 106 extending in the Z-axis direction (vertical direction) is provided. A protruding portion 104a protruding upward is provided at a corner portion of the base 4 away from the front of the support structure 106.

A space is formed inside the protrusion 104a, and a cassette elevator 108 that is raised and lowered by a lifting mechanism (not shown) is provided in this space. On the upper surface of the cassette elevator 108, a cassette 110 for accommodating a plurality of to-be-processed objects 11 is placed. In addition, the workpiece 11 is housed in the carrier box 110 in a state of being sucked and held by the frame unit 2 after the above-mentioned sucking step.

At a position adjacent to the protrusion 104a, a position adjustment unit 112 for adjusting the rough position of the frame unit 2 holding the workpiece 11 is arranged. The position adjustment unit 112 includes, for example, a pair of guide rails that are approached and separated while maintaining a state parallel to the Y-axis direction (indexing feed direction). Each guide rail has a support surface that supports the frame 23 and a side surface perpendicular to the support surface.

For example, the frame unit 2 carried out from the carrier box 110 is multiplied by the guide rail of the position adjustment unit 112, and the frame unit 2 is clamped in the X-axis direction (processing feed direction) through this guide rail, so that the frame unit 2 can be positioned at a predetermined position. s position. In the vicinity of the position adjustment unit 112, a conveying unit 114 for conveying the frame unit 2 (workpiece 11) is arranged. The transport unit 114 includes a suction pad 116 that sucks the frame 4 in the frame unit 2.

A moving mechanism (processing feeding mechanism, indexing feeding mechanism) 118 is provided in the center of the base 4. The moving mechanism 118 includes a pair of Y-axis guide rails 120 arranged on the upper surface of the base 4 and parallel to the Y-axis direction. On the Y-axis guide rail 120, a Y-axis moving table 122 is slidably installed.

A nut portion (not shown) is provided on the back side (lower surface side) of the Y-axis moving table 122, and a Y-axis ball screw 124 parallel to the Y-axis guide 120 is screwed to this nut portion. A Y-axis pulse motor 126 is connected to one end of the Y-axis ball screw 124. When the Y-axis ball screw 124 is rotated by the Y-axis pulse motor 126, the Y-axis moving table 122 moves in the Y-axis direction along the Y-axis guide 120.

On the surface (upper surface) of the Y-axis moving table 122, a pair of X-axis guide rails 128 parallel to the X-axis direction are provided. On the X-axis guide rail 128, the X-axis moving table 130 is slidably installed.

On the back side (lower surface side) of the X-axis moving table 130, a nut portion (not shown) is provided, and an X-axis ball screw 132 parallel to the X-axis guide 128 is screwed to this nut portion. To one end of the X-axis ball screw 132, an X-axis pulse motor 134 is connected. When the X-axis ball screw 132 is rotated by the X-axis pulse motor 134, the X-axis moving table 130 moves in the X-axis direction along the X-axis guide rail 128.

A bottom 136 is provided on the surface side (upper surface side) of the X-axis moving table 130. On the upper part of the table bottom 136, a stand unit 138 for supporting the frame unit 2 is arranged. This stand unit 138 is connected to a rotation drive source (not shown) such as a motor via a base 136, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction).

In addition, the stand unit 138 and the table bottom 136 are moved in the X-axis direction and the Y-axis direction (processing feed, index feed) through the above-mentioned moving mechanism 118. The details of the stand unit 138 will be described later.

The support structure 106 is provided with a support arm 106a protruding forward (on the side of the stand unit 138), and at the top end of the support arm 106a, a laser irradiation unit 140 for irradiating a laser beam downward is arranged. In addition, at a position adjacent to the laser irradiation unit 140, an imaging unit (camera) 142 for imaging the workpiece 11 and the like is provided.

The laser irradiation unit 140 includes a laser oscillator (not shown) that pulses a laser beam of a wavelength that is transparent to the workpiece 11. For example, when the workpiece 11 is a wafer made of a semiconductor material such as silicon, a laser medium such as Nd: YAG can be used to pulse a laser beam with a wavelength of 1000 nm or more (for example, 1064 nm). Laser oscillators, etc.

In addition, the laser irradiation unit 140 is equipped with a concentrator that condenses the laser beam pulsed by the laser oscillator, and irradiates and condenses the laser beam on a beam supported by the stand unit 138 via the frame unit 2 The inside of the workpiece 11. For example, by irradiating the laser beam with the laser irradiation unit 140 and moving the support unit 138 in the X-axis direction, the inside of the workpiece 11 can be modified along the X-axis direction.

After the workpiece 11 is processed, for example, the frame unit 2 is housed in the carrier box 110 through the conveying unit 114 again. Components such as the cassette elevator 108, the position adjustment unit 112, the conveying unit 114, the moving mechanism 118, the stand unit 138, the laser irradiation unit 140, and the imaging unit 142 are connected to the control unit 144, respectively.

This control unit 144 controls each of the above-mentioned constituent elements in accordance with a series of programs required for the processing of the workpiece 11. In addition, the control unit 144 is connected to a touch panel type monitor 146 as a user interface.

As shown in FIG. 7, the stand unit 138 is formed, for example, in a box shape having a bottom wall 138 a, a side wall 138 b provided on the outer peripheral portion of the bottom wall 138 a, and an upper top wall 138 c connected to the upper end of the side wall 138 b. An opening is formed in a part of the side wall 138b, and the frame unit 2 in a state where the workpiece 11 is sucked is carried in into the stand unit 138 through this opening.

In the central part of the upper top wall 138c, a circular opening is formed that penetrates the upper top wall 138c up and down. In this opening, a plate-shaped support member (support stand) 138d formed of a material that transmits the laser beam emitted from the laser irradiation unit 140 is inserted.

In other words, the support member 138d transmits the laser beam having a wavelength that is transparent to the workpiece 11. In addition, for the convenience of description in FIG. 7, the hatching of the supporting member 138d is omitted. The diameter of the support member 138d (opening) is larger than the diameter of the workpiece 11. For this reason, the entire surface of the workpiece 11 can be supported through the support member 138d.

On the lower surface side of the upper ceiling wall 138c, a jig 138e for fixing the frame 4 of the frame unit 2 is provided. In addition, the lower surface of the upper ceiling wall 138c close to this jig 138e has an opening on one end side of the suction path 138f. The other end side of the suction path 138f is connected to the suction source 150 via a valve 148 and the like.

In the frame unit supporting step, first, the frame unit 2 in the state where the workpiece 11 is sucked is carried out from the carrier box 110 and carried into the stand unit 138. Specifically, the frame 4 is fixed with a jig 138e so that the second surface 6b side (electrode sheet 8 side, cover sheet 14 side) of the bottom sheet 6 is in close contact with the lower surface (first surface) of the support member 138d.

In this state, the valve 148 is opened, and the negative pressure of the suction source 150 is applied. Thereby, the frame unit 2 can be supported by the lower surface side of the support member 138d. In this way, the workpiece 11 is held by the stand unit 138 via the frame unit 2 in a state where the surface 11a side is exposed below.

After the frame unit support step, a laser processing step of processing the workpiece 11 by irradiating the laser beam from the upper surface (second surface) side of the support member 138d is performed. The laser processing step is then performed using the laser processing device 102. Specifically, first, the stand unit 138 is rotated so that the direction of extension of the planned dividing line 13 to be processed is aligned with the X-axis direction of the laser processing device 12.

Next, the stand unit 138 is moved, for example, the position of the laser irradiation unit 140 is aligned with the extension line of the planned dividing line 13 to be the target. And, as shown in FIG. 7, while the laser beam 152 is irradiated from the laser irradiation unit 140 to the workpiece 11, the support unit 138 is moved in the X-axis direction.

Here, the irradiation conditions (processing conditions) of the laser beam 152 are adjusted within a range in which the inside of the workpiece 11 can be modified by multiphoton absorption through multiphoton absorption. Specifically, for example, the laser beam 152 is focused on the inside of the workpiece 11. Other conditions are as follows, for example.　　Laser beam wavelength: 1000nm or more 　　Laser beam output: 1W 　　Laser beam repetition frequency: 80kHz 　　 Moving speed of the stand unit 138: 800nm/s

As described above, the support member 138d of the stand unit 138 is formed of a material that transmits the laser beam 152. In addition, the bottom sheet 6, the support sheet 10, the electrode layer 12, and the cover sheet 14 of the frame unit 2 are also formed of a material that allows the laser beam 152 to transmit.

Therefore, the laser beam 152 is irradiated to the inside of the workpiece 11 via the support member 138d and the frame unit 2 to form the modified layer 17 along the planned dividing line 13. Such operations are repeated, for example, when the modified layer 17 is formed along all the planned dividing lines 13, the laser processing step ends.

After the laser processing step, the frame unit removal step of removing the frame unit 2 from the stand unit 138 (support member 138d) is performed. Specifically, first, the valve 148 is closed, and the negative pressure of the suction source 150 is blocked. Then, the frame unit 2 is carried out from the stand unit 138 by the transport unit 114 or the like. The frame unit 2 that has been carried out is housed in the carrier box 110 again.

After the frame unit removal step, a peeling step of peeling the workpiece 11 from the bottom sheet 6 (electrode sheet 8) of the frame unit 2 is performed. 8(A) and 8(B) are perspective views for explaining the peeling step. In this peeling step, for example, the frame unit 2 holding the processed object 11 is taken out of the carrier box 110, as shown in FIG. 8(A), the surface 21a side of the adhesive tape 21 is adhered to the surface of the processed object 11 11a.

Next, the switch 18b of the power supply unit 18 is set to a non-conductive state, and the power supply to the positive electrode pattern 12a and the negative electrode pattern 12b is stopped. Thereby, the force of static electricity acting between the workpiece 11 and the electrode layer 12 is weakened or lost. In this state, for example, the frame unit 2 is reversed up and down so that the back 21b side of the adhesive tape 21 faces downward, so that as shown in FIG. 8(B), the workpiece 11 can be peeled from the bottom sheet 6 (electrode sheet 8).

As described above, the frame unit 2 related to the present embodiment has a ring-shaped frame 4, an electrode sheet 8 having an electrode layer 12 including a positive electrode pattern (electrode) 12a and a negative electrode pattern (electrode) 12b, and is arranged to be aligned. The battery 20 powered by the electrode pattern 12a and the negative electrode pattern 12b of the battery 20 and the power supply unit 18 that controls the power supply from the battery 20 to the positive electrode pattern 12a and the negative electrode pattern 12b, attracts and holds the workpiece 11 with electrostatic force , So it is different from the adhesive tape that uses the adhesive material, which can be used repeatedly. Therefore, using this frame unit instead of the adhesive tape makes it possible to suppress the cost required for processing the workpiece 11 to be low.

In addition, the present invention is not limited to the description of the above-mentioned embodiment and the like, and can be implemented with various modifications. For example, although the above embodiment described the case where the modified layer 17 is formed inside the workpiece 11, the case where the workpiece 11 is not irradiated with the laser beam via the electrode layer 12, the ring-shaped cutting tool is cut into In the case of the to-be-processed object 11, etc., the frame unit 2 of this embodiment can also be used.

In addition, the structures, methods, and the like related to the above-mentioned embodiments can be modified and implemented as appropriate as long as they do not depart from the scope of the object of the present invention.

2‧‧‧Frame unit 4‧‧‧Frame 4a‧‧‧First side 4b‧‧‧Second side 4c‧‧‧Opening 6‧‧‧Negative sheet (resin sheet) 6a‧‧‧First side 6b‧‧‧ Second side 8‧‧‧Electrode sheet 10‧‧‧Support sheet 12‧‧‧Electrode layer 12a‧‧‧Positive electrode pattern (electrode) 12b‧‧‧Negative electrode pattern (electrode) 12c‧‧‧Insulation area 14 ‧‧‧Cover sheet 16a‧‧‧First wiring 16b‧‧‧Second wiring 18‧‧‧Power supply unit 18a‧‧‧Battery holder 18b‧‧‧Switch 20‧‧‧Battery 102‧‧‧Laser processing device 104‧‧‧Base 104a‧‧‧Protrusion 106‧‧‧Support structure 106a‧‧‧Support arm 108‧‧‧Carrier lift 110‧‧‧Carrier 112‧‧‧Position adjustment unit 114‧‧‧Transport Unit 116. ‧‧Y-axis pulse motor 128‧‧‧X-axis guide rail 130‧‧‧X-axis moving stage 132‧‧‧X-axis ball screw 134 138a. ‧‧Camera unit (camera) 144‧‧‧Control unit 146‧‧‧Monitor 148‧‧‧Valve 150‧‧‧Suction source 152‧‧‧Laser beam 11‧‧‧Working object 11a‧‧‧Surface 11b ‧‧‧Back surface 13‧‧‧Preparation line (cutting path) 15‧‧‧Device 17‧‧‧Modified layer 21‧‧‧Adhesive tape 21a‧‧‧Surface 21b‧‧‧Back

[Fig. 1] A perspective view schematically showing an example of the structure of the frame unit.　　[FIG. 2] A cross-sectional view schematically showing an example of the structure of the frame unit.　　[Figure 3] A schematic plan view of a part of the frame unit.　　[Figure 4] A cross-sectional view schematically showing a part of the frame unit.　　[Figure 5] is a perspective view for explaining the adsorption step.　　[FIG. 6] A perspective view schematically showing a configuration example of a laser processing device.　　[Figure 7] is a cross-sectional view for explaining the supporting steps of the frame unit and the laser processing steps.　　[Fig. 8] Fig. 8(A) and Fig. 8(B) are perspective views for explaining the peeling step.

2‧‧‧Frame unit

4‧‧‧Frame

4a‧‧‧Side 1

4b‧‧‧Side 2

4c‧‧‧Opening

6‧‧‧Negative film (resin film)

6a‧‧‧Side 1

8‧‧‧Electrode

12‧‧‧Electrode layer

12a‧‧‧Positive electrode pattern (electrode)

12b‧‧‧Negative electrode pattern (electrode)

12c‧‧‧Insulation area

14‧‧‧Mask

16a‧‧‧First wiring

16b‧‧‧Second wiring

18‧‧‧Power Supply Unit

18a‧‧‧Battery holder

18b‧‧‧switch

20‧‧‧Battery

Claims (5)

A frame unit is provided for the user when holding a processed object, and has: a ring-shaped frame provided with an opening for accommodating the processed object; an electrode sheet covering a part of the opening of the frame and provided with an electrode including positive and negative electrodes Layer; and a power supply unit, equipped with a battery that supplies power to the electrode, and controls the power supply from the battery to the electrode; the object to be processed is adsorbed and held by electrostatic force. The frame unit according to claim 1, wherein the electrode layer is provided with a pair of comb-shaped electrodes in which positive and negative electrodes are arranged in different rows. The frame unit of claim 1 or 2, wherein the electrode sheet is provided on the outer peripheral portion of the resin sheet fixed to the frame. The frame unit of claim 1 or 2, wherein the electrode sheet is configured to transmit a laser beam of a wavelength that is transmissive to the workpiece, and the laser beam is irradiated to the workpiece through the electrode sheet On the occasion of use. A laser processing method of the processed object, for the use of such as claim 4 The processing method of the processed object of the frame unit includes: an adsorption step of placing the processed object on the electrode sheet of the frame unit, supplying power to the electrode, and adsorbing the processed object with electrostatic force; the frame unit supports Step: The first surface side of a plate-shaped support base that has a first surface and a second surface opposite to the first surface and transmits the laser beam having a wavelength that is transmissive to the workpiece , Supporting and adsorbing the electrode sheet side of the frame unit under the workpiece; the laser processing step, from the second surface side of the support table, irradiating the workpiece with the mine through the support table and the electrode sheet Beam to modify the inside of the object to be processed to form a modified layer; a frame unit removal step, after performing the laser processing step, remove the frame unit from the support table; and a peeling step, in the frame After the unit removal step, the power supply to the electrode is adjusted, and the workpiece is peeled from the electrode sheet of the frame unit.

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