TWI745691B - Substrate treatment apparatus and substrate treatment method - Google Patents

Abstract

The subject of the present invention is to provide a technique for applying a processing liquid to a substrate to which a levitation force is imparted and being transported satisfactorily.

The coating device 1 of the present invention is provided with: a floating platform portion 3 that applies a floating force to the substrate W; a transport mechanism 5 that moves the substrate W to which the floating force is imparted along the first direction D1; and a nozzle 61 that transfers the processing liquid It is ejected toward the upper surface Wf of the floating substrate; a measuring device 70 that measures the vertical position of the upper surface Wf of the substrate W; and a moving mechanism 63 that moves the nozzle 61 and the measuring device 70. The moving mechanism 63 is such that the processing liquid from the nozzle 61 is attached to the horizontal position of the substrate W (that is, the attachment horizontal position) is close to the horizontal position (that is, the measurement horizontal position XM1) of the area where the measuring device 70 measures the vertical position of the substrate W in advance. The nozzle 61 and the measuring instrument 70 move.

Description

Substrate processing device and substrate processing method

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate, and more particularly to a technique for preferably applying a processing liquid to a substrate that is given a levitation force and is conveyed. The substrates to be processed include, for example, semiconductor substrates, liquid crystal display devices, and organic EL (Electroluminescence; electroluminescence) display devices such as FPD (Flat Panel Display) substrates, optical disk substrates, magnetic disk substrates, and optical disks. Substrates for magnetic disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

In the manufacturing process of electronic parts such as semiconductor devices or liquid crystal display devices, a coating device that coats the surface of the substrate with a coating liquid is used. As such a coating device, it is known that while blowing air on the back of the substrate to float the substrate, conveying the substrate while moving the substrate from a nozzle extending in the width direction of the substrate (equivalent to the surface of the substrate) Main surface) A device that discharges a coating liquid and applies the coating liquid to a substrate (for example, Patent Document 1).

In the substrate processing apparatus described in Patent Document 1, while the substrate is floated in a horizontal posture on the floating platform, the peripheral portion of the substrate is held and moved in the horizontal direction, thereby transporting the substrate and placing it on its own The coating liquid is discharged from the slit nozzle above the substrate conveying path.

In the substrate processing apparatus of Patent Document 1, an optical distance sensor for measuring the floating height of the substrate is provided above the substrate. The height of the slit nozzle is adjusted according to the floating height of the substrate, so that the coating liquid can be supplied from an appropriate height.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-142583

In the above-mentioned conventional technology, the optical distance sensor measures the horizontal position of the vertical position area, which is closer to the upstream side of the conveying direction than the horizontal position where the processing liquid from the nozzle adheres to the substrate. That is, in the prior art, the horizontal position where the processing liquid adheres to the substrate is far away from the horizontal position of the area where the optical distance sensor measures. Therefore, for example, even if there is an abnormality in the height of the substrate at the horizontal position where the processing liquid adheres, it is difficult to detect the abnormality by the above-mentioned optical distance sensor, so there is a possibility that coating failure may occur.

Therefore, an object of the present invention is to provide a technique for applying a processing liquid to a substrate to which a levitation force is given and transported well.

In order to solve the above-mentioned problems, the first aspect is a processing apparatus for processing a substrate having a first main surface and a second main surface. The substrate imparts a levitation force; a conveying mechanism that moves the substrate (ie, the levitation substrate) imparted with the levitation force in a horizontal direction (ie, a first direction); a nozzle that has a horizontal perpendicular to the first direction A discharge port extending in the direction (ie, the second direction), and the processing liquid can be discharged from the discharge port toward the first main surface of the floating substrate; a measuring instrument that measures the vertical position of the first main surface of the floating substrate; And a moving mechanism for attaching the processing liquid from the nozzle to the horizontal position of the floating substrate (ie, attaching horizontal position) close to the horizontal position of the area where the measuring device pre-measures the vertical position of the floating substrate (ie, measuring the horizontal position) ), move the nozzle and the measuring instrument.

In a second aspect, in the substrate processing apparatus of the first aspect, the moving mechanism moves the nozzle and the measuring instrument in such a manner that the attachment horizontal position is consistent with the measurement horizontal position.

The third aspect is the substrate processing apparatus of the first aspect or the second aspect, wherein the above-mentioned levitation mechanism includes: a platform having an upper surface; The air is ejected from the upper side in the direction; and a plurality of suction ports are provided on the upper surface to suck air from the upper side in the vertical direction.

The fourth aspect is the substrate processing apparatus of any one of the first aspect to the third aspect, wherein the moving mechanism positions the nozzle at a predetermined horizontal position (that is, the coating position), and can move the nozzle to Along the horizontal direction away from the position of the coating position.

The fifth aspect is the substrate processing apparatus of any one of the first aspect to the fourth aspect, wherein the moving mechanism positions the measuring instrument at a predetermined horizontal position (ie, measuring position), and the measuring instrument can be moved Move to a position away from the above measurement position in the horizontal direction.

The sixth aspect is the substrate processing apparatus of any one of the first aspect to the fifth aspect, wherein it is further provided with a connecting member that connects the nozzle and the measuring instrument, and the moving mechanism is moved by the connecting member. The connected nozzle moves integrally with the measuring instrument.

The seventh aspect is the substrate processing apparatus of the sixth aspect, wherein the connecting member connects the measuring instrument with respect to the nozzle on the upstream side of the first direction, and the moving mechanism causes the nozzle and the measuring instrument to face the first direction. The above-mentioned upstream movement in direction 1.

The eighth aspect is the substrate processing apparatus of any one of the first aspect to the seventh aspect, wherein the measuring device includes a reflective sensor that detects light reflected by the first main surface of the floating substrate Device.

The ninth aspect is the substrate processing apparatus of any one of the first aspect to the eighth aspect, wherein the transport mechanism stops the floating substrate after moving the floating substrate to a predetermined position, and the moving mechanism stops at the floating substrate In the state of the predetermined position, the measuring instrument that measures the vertical position of the floating substrate at the measurement horizontal position is moved to another position, and the nozzle is moved closer to the measurement horizontal position.

The tenth aspect is the substrate processing apparatus of the ninth aspect, wherein the moving mechanism moves the measuring instrument that measures the vertical position of the floating substrate stopped at the predetermined position at the measurement horizontal position to the first For the position on the upstream side of the direction, the measuring instrument measures the vertical position of the floating substrate while moving toward the position on the upstream side of the first direction.

The eleventh aspect is the substrate processing apparatus of any one of the first aspect to the tenth aspect, wherein the moving mechanism changes the vertical position of the nozzle according to the vertical position of the floating substrate measured by the measuring instrument .

The twelfth aspect is the substrate processing apparatus of any one of the first aspect to the eleventh aspect, wherein a plurality of the measuring instruments are arranged at intervals in the second direction, and the plurality of measuring instruments can measure The vertical positions of the plurality of positions of the suspension substrate that are different in the second direction.

The thirteenth aspect is the substrate processing apparatus of the twelfth aspect, which further includes a difference acquiring unit that acquires the difference values of the vertical positions of the plurality of parts measured by the plurality of measuring instruments.

The fourteenth aspect is a substrate processing method for processing a substrate having a first main surface and a second main surface; it includes a conveying step, which imparts a levitation force to the first main surface in a vertical upward state The above-mentioned substrate (ie, the floating substrate) moves along the horizontal direction (ie, the first direction); the measuring step, which measures the vertical position of the first main surface of the above-mentioned floating substrate; the coating step, which starts from the nozzle after the above-mentioned measurement step Supplying the treatment liquid to the first main surface of the suspension substrate moved in the first direction by the conveying step; and a moving step of attaching the treatment liquid after the measuring step and before the coating step When the horizontal position of the floating substrate (ie, the attachment horizontal position) is close to the measurement step, the measuring device measures the horizontal position of the area of the vertical position of the floating substrate in advance (ie, measuring the horizontal position), so that the nozzle and the measurement器动。 Move.

The fifteenth aspect is the substrate processing method of the fourteenth aspect, wherein the transport step includes a step of moving the floating substrate to a predetermined position and then stopping it, and the moving step includes stopping the floating substrate at the predetermined position In this state, the measuring device that measures the vertical position of the measuring horizontal position is moved to another position, and the floating substrate is stopped at the predetermined position, and the nozzle is brought close to the measuring horizontal position.

According to the substrate processing apparatus of the first aspect, the processing liquid from the nozzle is attached to the horizontal position of the floating substrate (attachment horizontal position), close to the horizontal position of the vertical direction area of the suspended substrate measured by the measuring instrument (measurement horizontal position). Therefore, it is possible to measure the area in the vertical direction of the suspension substrate or an area close to the area in the measuring instrument, and supply the processing liquid to the suspension substrate. Therefore, the treatment liquid can be applied to the suspension substrate well.

According to the substrate processing apparatus of the second aspect, the processing liquid is supplied to the floating substrate in the area where the measuring device measures the vertical direction of the floating substrate. Therefore, the treatment liquid can be applied to the suspension substrate well.

According to the substrate processing apparatus of the third aspect, the air from the plurality of ejection ports can be used to impart a levitation force to the substrate, while the suction of the air from the suction port is used to balance, thereby stably holding the floating substrate on the substrate. The established vertical position.

According to the substrate processing apparatus of the fourth aspect, the nozzle can be positioned at the coating position and the processing liquid can be supplied to the suspended substrate. In addition, the nozzle can be moved to a position away from the coating position in the horizontal direction.

According to the substrate processing apparatus of the fifth aspect, the measuring device can be positioned at the measurement position and the vertical position of the floating substrate can be measured. In addition, the measuring instrument can be moved to a position away from the measuring position in the horizontal direction.

According to the substrate processing apparatus of the sixth aspect, since the nozzle and the measuring instrument are connected, the moving mechanism can move them integrally. Therefore, compared to the case where the nozzle and the measuring instrument are moved separately, the moving mechanism can be easily constructed.

According to the substrate processing apparatus of the seventh aspect, after the measuring instrument measures the vertical position of the floating substrate at the measuring position, the moving mechanism can move the nozzle and the measuring instrument to the upstream side in the first direction, thereby bringing the predetermined attachment position closer to the measuring position .

According to the substrate processing apparatus of the eighth aspect, the light-receiving sensor is used to detect the light reflected by the first main surface of the floating substrate, thereby the vertical position of the first main surface can be measured.

According to the substrate processing apparatus of the ninth aspect, in the state where the floating substrate is stopped, the measuring instrument that has measured the vertical position of the floating substrate in the measurement horizontal position is moved to another position, and the nozzle is approached to the measurement horizontal position. Therefore, the nozzle can be approached and arranged at the position where the vertical position is measured in advance. Thereby, the treatment liquid can be appropriately applied to the suspension substrate.

According to the substrate processing apparatus of the tenth aspect, it is possible to measure the vertical position of the floating substrate within the horizontal range from the measurement horizontal position to a position on the upstream side of the measurement horizontal position.

According to the substrate processing apparatus of the eleventh aspect, the vertical position of the nozzle can be adjusted in accordance with the vertical position of the suspended substrate measured by the measuring device. Thereby, since the processing liquid can be supplied to the suspension substrate from the nozzle in an appropriate vertical position, the processing liquid can be applied to the suspension substrate well.

According to the substrate processing apparatus of the twelfth aspect, it is possible to measure the vertical positions of a plurality of different positions in the second direction in the floating substrate.

According to the substrate processing apparatus of the thirteenth aspect, by obtaining the difference values of the vertical positions measured at a plurality of positions, it is possible to easily detect the abnormal position in the vertical position of the suspension substrate.

According to the substrate processing method of the 14th aspect, the processing liquid from the nozzle is attached to the horizontal position of the floating substrate (attachment horizontal position), and the horizontal position (measurement horizontal position) of the vertical direction area of the suspended substrate is measured by the measuring instrument. Therefore, it is possible to measure the area in the vertical direction of the suspension substrate or an area close to the area by the measuring instrument, and supply the processing liquid to the suspension substrate. Therefore, the treatment liquid can be applied to the suspension substrate well.

According to the substrate processing method of the fifteenth aspect, in the state where the floating substrate is stopped, the measuring instrument that has measured the vertical position of the floating substrate in the measurement horizontal position is moved to another position, and the nozzle is approached to the measurement horizontal position. Therefore, the nozzle can be placed close to the position where the vertical position is measured in advance. Thereby, the treatment liquid can be appropriately applied to the suspension substrate.

1‧‧‧Coating device (substrate processing device)

2‧‧‧Input transfer part

3‧‧‧Suspended Platform Department (Suspended Mechanism)

4‧‧‧Output transfer part

5‧‧‧Transportation mechanism

6‧‧‧Coating mechanism

9‧‧‧Control Unit

10‧‧‧Abutment

21, 41, 101, 111‧‧‧roller conveyor

22‧‧‧Rotary drive mechanism

31‧‧‧Entrance suspended platform

31h, 33h, 321h‧‧‧ nozzle

32‧‧‧Coating platform

33‧‧‧Export Suspended Platform

35‧‧‧Suspended control mechanism

42‧‧‧Rotary drive mechanism

51‧‧‧Chuck

51L、51R‧‧‧Chuck components

52‧‧‧Adsorption/Migration Control Mechanism

60‧‧‧Nozzle unit

61‧‧‧Nozzle

63‧‧‧Mobile mechanism

65‧‧‧Maintenance Unit

70‧‧‧Measurer

70a‧‧‧Light Projection Department

70b‧‧‧Light receiving part

72‧‧‧Connector

81L、81R‧‧‧Moving guide

82L, 82R‧‧‧Linear motor

83L, 83R‧‧‧Linear scale

84L、84R‧‧‧Moving guide

85‧‧‧Linear Motor

86‧‧‧Linear scale

87L、87R‧‧‧Moving guide

88L, 88R‧‧‧Linear motor

89L, 89R‧‧‧Linear scale

91‧‧‧CPU

92‧‧‧Memory

93‧‧‧Display

100‧‧‧Input conveyor

102‧‧‧Rotary drive mechanism

110‧‧‧Output conveyor

112‧‧‧Rotary drive mechanism

322h‧‧‧Suction port

511, 636, 637, 666, 667‧‧‧Slide

512‧‧‧Base

513‧‧‧Support

611‧‧‧Exit

631‧‧‧Beam member

632、633‧‧‧Column member

634、635‧‧‧Lifting mechanism

651‧‧‧Cylinder Groove

652‧‧‧Prepare to spit out the roller

653‧‧‧Nozzle cleaner

654‧‧‧Maintenance control mechanism

661‧‧‧Beam member

662、663‧‧‧Column member

664‧‧‧Board

D1‧‧‧1st direction

D2‧‧‧2nd direction

L11‧‧‧Coating position

L12‧‧‧Downstream position

L13‧‧‧Preparation position

L14‧‧‧Washing position

L11, L12, L13, L14‧‧‧Stop position

L21a, L21b‧‧‧Measurement position

L22a, L22b‧‧‧Upstream position

LW1‧‧‧Established location

S11‧‧‧Transfer procedure

S12‧‧‧Measurement procedure

S13‧‧‧Movement steps

S14‧‧‧Coating Step

S111‧‧‧Stop phase

S131‧‧‧Measurement device moving stage

S132‧‧‧Nozzle movement stage

S133‧‧‧Nozzle vertical position adjustment stage

W‧‧‧Substrate (Floating Substrate)

Wf‧‧‧Upper surface (1st main surface)

XM1‧‧‧Measure horizontal position

FIG. 1 is a side view schematically showing the overall configuration of a coating apparatus 1 as an example of the substrate processing apparatus of the embodiment.

Fig. 2 is a schematic plan view of the coating device 1 of the embodiment viewed from the upper side in the vertical direction.

FIG. 3 is a schematic plan view showing the coating device 1 without the coating mechanism 6 according to the embodiment.

Fig. 4 is a schematic cross-sectional view of the coating device 1 along the line A-A shown in Fig. 2.

Fig. 5 is a schematic plan view showing a part of the floating platform portion 3 of the embodiment.

Fig. 6 is a schematic plan view showing the nozzle 61 of the embodiment.

Fig. 7 is a schematic block diagram showing the control unit 9 of the embodiment.

8(a) to (d) are diagrams showing the steps of the substrate processing operation performed by the coating device 1 of the embodiment.

FIG. 9 is a diagram showing a modified example of the operation of the coating device 1 of the embodiment.

FIG. 10 is a diagram showing a modified example of the operation of the coating device 1 of the embodiment.

Hereinafter, the embodiments of the present invention will be described with reference to the formulas of the drawings. In addition, the constituent elements described in this embodiment are only examples, and are not intended to limit the scope of the present invention to only these constituent elements. In the drawings, for ease of understanding, there are cases where the size or quantity of each part may be exaggerated or simplified as necessary.

Representation of relative or absolute positional relationship (such as "parallel", "orthogonal", "center", "concentric", "coaxial", etc.) Unless otherwise specified, it not only strictly represents the positional relationship, but also It also refers to the state of being relatively displaced in angle or distance within the range of tolerance or the same degree of function can be obtained. Representation of the state of equality (such as "identical", "equal", "homogeneous", "identical", etc.) unless otherwise specified, not only means the state of being strictly quantitatively equal, but also means that there is a tolerance or possibility Those who have obtained the same degree of functional difference. Represents the performance of shapes (such as "square corners" or "cylindrical shapes", etc.) unless otherwise specified, not only strictly refers to these geometric shapes, but also within the range where the same degree of efficacy can be obtained , For example, has a shape such as unevenness or chamfering. The so-called "~above" unless otherwise stated, in addition to the case where two components are connected, it also includes the case where two components are separated.

FIG. 1 is a side view schematically showing the overall configuration of a coating apparatus 1 as an example of the substrate processing apparatus of the embodiment. Fig. 2 is a schematic plan view of the coating device 1 of the embodiment viewed from the upper side in the vertical direction. FIG. 3 is a schematic plan view showing the coating device 1 without the coating mechanism 6 according to the embodiment. Fig. 4 is a schematic cross-sectional view of the coating device 1 along the line A-A shown in Fig. 2. Fig. 5 is a schematic plan view showing a part of the floating platform portion 3 of the embodiment. Fig. 6 is a schematic plan view showing the nozzle 61 of the embodiment.

The coating device 1 conveys the rectangular substrate W in a horizontal position (the upper surface Wf (first main surface) and the lower surface (second main surface) of the substrate W are parallel to the horizontal plane (XY plane)), and A slit coater that coats the treatment liquid (coating liquid) on the upper surface Wf of the substrate W. In each figure, in order to clarify the positional relationship of the various parts of the coating device 1, the direction parallel to the first direction D1 conveyed by the substrate W is referred to as the "X direction", and the direction from the input conveyor 100 to the output conveyor 110 The direction is set to "+X direction", and the opposite direction is set to "-X direction". Set the horizontal direction orthogonal to the X direction as the "Y direction", the direction toward the front of Figure 1 as the "-Y direction", and the opposite direction as the "+Y direction". The vertical direction orthogonal to the X direction and the Y direction is set to the Z direction, the upward direction toward the coating mechanism 6 when viewed from the floating platform portion 3 is set to "+Z direction", and the opposite direction is set to "- Z direction".

The basic configuration or operating principle of the coating device 1 is partially common or similar to those described in Japanese Patent Laid-Open No. 2010-227850 and Japanese Patent Laid-Open No. 2010-240550. Therefore, in this specification, the configurations of the coating device 1 are the same as those described in these known documents or can be easily inferred based on technical common sense, etc., and there are cases in which they may be omitted as appropriate.

The coating device 1 is sequentially provided with an input conveyor 100, an input transfer unit 2, a floating platform unit 3, an output transfer unit 4, and an output conveyor along the first direction D1 (+X direction) where the substrate W is conveyed.机110. These are arranged so as to be close to each other, thereby forming a transfer path of the substrate W. Furthermore, in the following description, when the positional relationship is displayed in association with the first direction D1, which is the conveying direction of the substrate, the "upstream side of the first direction D1" may be simply referred to as the "upstream side". The "downstream side in the first direction D1" is simply referred to as the "downstream side". In this example, when viewed from a certain reference position, the -X side is the "upstream side", and the +X side is the "downstream side".

The input conveyor 100 includes a roller conveyor 101 and a rotary drive mechanism 102 that rotationally drives the roller conveyor 101. By the rotation of the roller conveyor 101, the substrate W is conveyed toward the downstream side (+X side) in a horizontal posture.

The input transfer unit 2 includes a roller conveyor 21 and a rotation drive mechanism 22 that rotates the roller conveyor 21. By the rotation of the roller conveyor 21, the substrate W is conveyed in the +X direction. In addition, as the roller conveyor 21 moves up and down, the vertical position (position in the vertical direction) of the substrate W is changed. By the operation of the input transfer unit 2, the substrate W is transferred from the input conveyor 100 to the floating platform unit 3. As shown in FIG.

The floating platform part 3 includes three flat platforms along the first direction D1. Specifically, the levitation platform portion 3 is sequentially provided with an entrance levitation platform 31, a coating platform 32, and an exit levitation platform 33 along the first direction D1. The upper surfaces of the platforms are on the same plane. The upper surface of each platform may be, for example, a horizontal surface.

On the upper surface of each of the inlet levitation platform 31 and the outlet levitation platform 33, a plurality of ejection ports 31h and 33h for ejecting air (compressed air) supplied from the levitation control mechanism 35 are arranged in a matrix. The substrate W is given a levitation force by the compressed air ejected from the plurality of ejection ports 31h, 33h, and the substrate W is separated from the upper surface of each platform 31, 33 when the lower surface of the substrate W (the second main surface) is separated from the upper surface of each platform 31, 33 W is supported in a horizontal posture. The distance between the lower surface of the substrate W and the upper surfaces of the platforms 31 and 33 can also be set to 10 μm (micrometers) to 500 μm, for example.

On the upper surface of the coating platform 32, a plurality of ejection ports 321h for ejecting air (compressed air) and a plurality of suction ports 322h for sucking ambient air above the coating platform 32 are provided. On the upper surface of the coating platform 32, an ejection port 321h and a suction port 322h are alternately provided along the X direction and the Y direction. The levitation control mechanism 35 balances the ejection amount of compressed air from each ejection port 321h and the suction amount of the ambient gas toward each suction port 322h to precisely control the lower surface of the substrate W and the coating The distance from the upper surface of the platform 32. Thereby, the vertical position of the upper surface Wf of the substrate W passing above the coating platform 32 is controlled to a predetermined value. As the structure of the floating platform portion 3, the one described in Japanese Patent Laid-Open No. 2010-227850 can also be applied.

The substrate W carried into the suspension platform 3 through the input transfer unit 2 is transferred to the entrance suspension platform 31 by obtaining a propelling force in the +X direction by the rotation of the roller conveyor 21. The transfer of the substrate W in the floating platform portion 3 is performed by the transfer mechanism 5.

The conveying mechanism 5 includes a chuck 51 and a suction/transfer control mechanism 52. The chuck 51 supports the substrate W from below by partially abutting on the peripheral edge of the lower surface of the substrate W. The suction/migration control mechanism 52 has a function of applying a negative pressure to the suction pad provided at the upper end of the chuck 51 to make the chuck 51 suck and hold the substrate W. In addition, the suction/travel control mechanism 52 has a function of causing the chuck 51 to linearly reciprocate in the X direction.

In the state where the chuck 51 holds the substrate W, the lower surface of the substrate W is located on the +Z side than the upper surface of each platform 31, 32, 33 of the floating platform portion 3. The substrate W is held by the chuck 51 sucking the peripheral portion, and the entire horizontal posture is maintained by the levitation force imparted from the levitation platform portion 3.

The chuck 51 holds the substrate W carried in from the input transfer part 2 to the suspension platform part 3, and in this state, the chuck 51 moves in the +X direction, whereby the substrate W passes through the coating platform 32 from above the entrance suspension platform 31 It is transported toward the top of the exit floating platform 33. The substrate W is transferred to the output transfer part 4 arranged on the +X side of the exit floating platform 33.

The output transfer unit 4 includes a roller conveyor 41 and a rotation drive mechanism 42 that rotationally drives the roller conveyor 41. By the rotation of the roller conveyor 41, the substrate W is given a propelling force in the +X direction, and the substrate W is conveyed in the first direction D1. By the action of the output transfer unit 4, the substrate W is transferred to the output conveyor 110 from above the exit suspension platform 33.

The output conveyor 110 includes a roller conveyor 111 and a rotation drive mechanism 112 that rotates the roller conveyor 111. By the rotation of the roller conveyor 111, the substrate W is conveyed in the +X direction and sent out to the outside of the coating device 1. Although the input conveyor 100 and the output conveyor 110 may also be provided as part of the coating device 1, they may also be independent of the coating device 1. For example, the input conveyor 100 may also be a substrate sending mechanism of another unit installed on the upstream side of the coating device 1. In addition, the output conveyor 110 may also be a substrate receiving mechanism of another unit provided on the downstream side of the coating device 1.

A coating mechanism 6 for coating the upper surface Wf of the substrate W with a treatment liquid is provided on the conveyance path of the substrate W. The coating mechanism 6 includes a nozzle unit 60 including a nozzle 61 for discharging a processing liquid, a moving mechanism 63 for positioning the nozzle 61, and a maintenance unit 65 for maintaining the nozzle 61.

The nozzle 61 is a member extending in a second direction D2 (Y direction) that is a horizontal direction orthogonal to the first direction D1. The lower end of the nozzle 61 has a discharge port 611 extending in the width direction (Y direction) and opening downward (-Z side). The treatment liquid is discharged from the discharge port 611.

The moving mechanism 63 moves and positions the nozzle 61 in the X direction and the Z direction. By the movement of the moving mechanism 63, the nozzle 61 is positioned at the coating position L11 and the downstream position L12 above the coating platform 32. The horizontal position (position in the horizontal direction) of each of the coating position L11 and the downstream position L12 is set at a predetermined horizontal position. With the nozzle 61 positioned at the coating position L11, the nozzle 61 discharges the treatment liquid toward the upper surface Wf of the substrate W, and the treatment liquid is applied to the substrate W. In this way, the coating position L11 is the position of the nozzle 61 when coating is performed. The downstream position L12 is a position away from the coating position L11 toward the downstream side (+X side).

The maintenance unit 65 includes a vat 651, a preliminary discharge roller 652, a nozzle cleaner 653, and a maintenance control mechanism 654. The tank 651 stores the cleaning liquid used for cleaning the nozzle 61. The maintenance control mechanism 654 controls the preliminary discharge roller 652 and the nozzle cleaner 653. As the structure of the maintenance unit 65, for example, the structure described in Japanese Patent Laid-Open No. 2010-240550 can be applied.

The moving mechanism 63 positions the nozzle 61 at the preliminary discharge position L13 where the discharge port 611 is above the preliminary discharge roller 652 and opposes the surface of the preliminary discharge roller 652. The nozzle 61 discharges the treatment liquid from the discharge port 611 to the surface of the preliminary discharge roller 652 at the preliminary discharge position L13 (preliminary discharge process). The nozzle 61 is positioned at the preliminary discharge position L13 before being positioned at the application position L11 as described above, and performs preliminary discharge processing. Thereby, the ejection of the processing liquid toward the substrate W can be stabilized from the initial stage. When the maintenance control mechanism 654 rotates the preliminary discharge roller 652, the treatment liquid discharged from the nozzle 61 is mixed with the cleaning liquid stored in the tank 651 and recovered.

The moving mechanism 63 positions the nozzle 61 at the cleaning position L14 where the front end of the nozzle 61 (including the area around the discharge port 611 and its vicinity) faces the upper side of the nozzle cleaner 653. In the state where the nozzle 61 is at the cleaning position L14, the nozzle cleaner 653 moves along the width direction (Y direction) of the nozzle 61 while discharging the cleaning liquid, thereby causing the treatment liquid etc. attached to the front end of the nozzle 61 Was rinsed off.

The moving mechanism 63 can also position the nozzle 61 below the washing position L14 and the lower end of the nozzle 61 is accommodated in the standby position in the tank 651. When the coating device 1 is not performing the coating process using the nozzle 61, the nozzle 61 can also be positioned at the standby position. Although the illustration is omitted, a standby pod can also be installed to prevent the treatment liquid from drying out of the discharge port 611 of the nozzle 61 positioned at the standby position.

In FIG. 1, the nozzle 61 located at the preliminary discharge position L13 is represented by a solid line, and the nozzle 61 located at the coating position L11, the downstream position L12, and the cleaning position L14 is represented by a broken line.

Although the coating mechanism 6 of the present embodiment is provided with only one nozzle 61, it may be provided with a plurality of nozzles 61. A plurality of nozzles 61 may be installed at intervals along the first direction D1. In this case, different processing liquids can also be applied to the substrate W by supplying different processing liquids to a plurality of nozzles 61. Moreover, the movement mechanism 63 and the maintenance unit 65 corresponding to each nozzle 61 may be provided separately. Furthermore, the maintenance unit 65 may be shared by two or more nozzles 61 and used.

As shown in FIG. 4, the nozzle unit 60 has a bridge structure including a beam member 631 extending in the Y direction above the floating platform portion 3, and both ends of the beam member 631 (ends on both sides). Part) of the two column members 632, 633. The column members 632 and 633 are erected upward from the base 10. A lifting mechanism 634 is mounted on the column member 632, and a lifting mechanism 635 is mounted on the column member 633. Each elevating mechanism 634, 635 includes, for example, a ball screw mechanism. The +Y-side end (+Y-side end) of the beam member 631 is installed in the lifting mechanism 634, and the -Y-side end (-Y-side end) of the beam member 631 is installed in the lifting mechanism 635, and The beam member 631 is supported by the lifting mechanisms 634 and 635. As the lifting mechanisms 634 and 635 are linked in accordance with the control command from the control unit 9, the beam member 631 moves in the vertical direction (Z direction) while maintaining the horizontal posture.

A nozzle 61 which makes the discharge port 611 a downward posture is attached to the lower part of the center of the beam member 631. The movement of the nozzle 61 in the vertical direction (Z direction) can be realized by the action of the lifting mechanisms 634 and 635.

The column members 632 and 633 are configured to be movable on the base 10. The two traveling guides 81L and 81R extending in the X direction are provided on the +Y side end (+Y side end) and -Y side end (-Y side) on the upper surface of the base 10 Ends). The column member 632 is engaged with the traveling guide 81L on the +Y side via the slider 636 installed at the lower part of the column member 632, and the column member 633 is engaged with the slider 637 installed at the lower part of the column member 633. Fit the travel guide 81R on the -Y side. The sliders 636 and 637 move freely in the X direction along the travel guides 81L and 81R.

The column members 632 and 633 move in the X direction by the operation of the linear motors 82L and 82R. The linear motors 82L and 82R are provided with a magnet module as a stator and a coil module as a mover. The magnet module is set on the base 10 and extends along the X direction. The coil module is mounted on the lower part of each of the column members 632 and 633. The movers of the linear motors 82L and 82R operate in accordance with a control command from the control unit 9 to thereby move the nozzle unit 60 as a whole in the X direction. Thereby, the movement of the nozzle 61 in the X direction (first direction D1) can be realized. The X-direction positions (positions in the X-direction) of the column members 632 and 633 are detected by linear scales 83L and 83R arranged near the sliders 636 and 637.

In this way, the nozzle 61 moves in the Z direction by the actions of the lifting mechanisms 634 and 635, and moves in the X direction by the actions of the linear motors 82L and 82R. That is, by controlling the lifting mechanisms 634 and 635 and the linear motors 82L and 82R by the control unit 9, the positioning of the nozzle 61 toward each stop position L11, L12, L13, and L14 can be realized. Therefore, the lifting mechanisms 634 and 635 and the linear motors 82L and 82R function as the moving mechanism 63.

As the maintenance unit 65, the one described in Japanese Patent Laid-Open No. 2010-240550 may also be adopted. The cylinder groove 651 is supported by a beam member 661 extending along the Y direction. Of the two ends of the beam member 661, one end is supported by the column member 662, and the other end is supported by the column member 663. The column members 662 and 663 are respectively installed at both ends in the Y direction (both ends in the Y direction) of the plate 664 extending along the Y direction.

Below the two ends of the plate 664, two traveling guides 84L and 84R extending along the X direction are respectively provided. Two traveling guides 84L and 84R are provided on the upper surface of the base 10. Among the two ends of the lower surface of the plate 664 in the Y direction, a slider 666 is provided at the +Y side end, and a slider 667 is provided at the -Y side end. The sliders 666 and 667 are engaged with the travel guides 84L and 84R to move freely in the X direction.

A linear motor 85 is provided under the plate 664. The linear motor 85 has a magnet module as a stator and a coil module as a mover. The magnet module is installed on the base 10 and extends along the X direction. The coil module is installed under the maintenance unit 65 (here, the board 664).

With the linear motor 85 operating in accordance with the control command from the control unit 9, the entire maintenance unit 65 moves along the X direction. The X-direction position of the maintenance unit 65 is detected by a linear scale 86 set near the sliders 666 and 667.

As shown in FIG. 4, the chuck 51 is equipped with two chuck members 51L and 51R. The chuck members 51L and 51R have mutually symmetrical shapes with respect to the XZ plane, and are arranged separately in the Y direction.

The chuck member 51L arranged on the +Y side is supported by a traveling guide 87L provided on the base 10 and extending in the X direction. The chuck member 51L is provided with a base portion 512 including two horizontal plate portions provided at different positions in the X direction, and a connection portion connecting the plate portions (refer to FIG. 2). A sliding block 511 is provided on the lower part of the two plate parts of the base part 512 respectively. The slider 511 is engaged with the moving guide 87L, whereby the chuck member 51L can move in the X direction along the moving guide 87L.

On the upper part of the two plate parts of the base part 512, respectively, a support part 513 is provided. The supporting portion 513 extends upward and has a suction pad (not shown) at its upper end. When the base portion 512 moves in the X direction along the travel guide 87L, the two support portions 513 move in the X direction integrally therewith. Furthermore, it can also be configured as follows: the two plate parts of the base portion 512 are separated from each other, and the plate parts move while keeping a certain distance in the X direction, thereby becoming an integral base in appearance. The seat part functions. If the distance is set according to the length of the substrate, it can correspond to substrates of various lengths.

The chuck member 51L is moved in the X direction by the linear motor 88L. The linear motor 88L has a magnet module as a stator and a coil module as a mover. The magnet module is set on the base 10 and extends along the X direction. The coil module is provided at the lower part of the chuck member 51L. As the linear motor 88L is operated in accordance with the control command from the control unit 9, the chuck member 51L moves in the X direction. The X-direction position of the chuck member 51L is detected by a linear scale 89L provided near the traveling guide 87L.

The chuck member 51R provided on the -Y side is provided with a base part 512 and two support parts 513 and 513 similarly to the chuck member 51L. Furthermore, the shape of the chuck member 51R is symmetrical to the chuck member 51L with respect to the XZ plane. A slider 511 is provided on the lower part of the two plate parts of the base part 512 of the chuck member 51R. The slider 511 is engaged with the moving guide 87R, whereby the chuck member 51R can move in the X direction along the moving guide 87R.

The chuck member 51R can be moved in the X direction by a linear motor 88R. The linear motor 88R includes a magnet module as a stator extending in the X direction and provided on the base 10, and a coil module as a mover provided under the chuck member 51R. When the linear motor 88R is operated in accordance with the control command from the control unit 9, the chuck member 51R moves in the X direction. The X-direction position of the chuck member 51R is detected by a linear scale 89R provided near the traveling guide 87R.

The control unit 9 performs these positional control so that the chuck members 51L and 51R always become the same position in the X direction. Thereby, a pair of chuck members 51L, 51R moves as the chuck 51 which is integrated in appearance. Thereby, compared to the case where the chuck members 51L and 51R are mechanically combined, the interference between the chuck 51 and the floating platform portion 3 can be easily avoided.

As shown in FIG. 3, the four support portions 513 are respectively arranged corresponding to the four corners of the substrate W to be held. That is, the two support portions 513 of the chuck member 51L respectively hold the +Y side peripheral edge portion (+Y side peripheral edge portion) of the substrate W, and the upstream end portion (upstream end portion) in the first direction D1 and The downstream end (the downstream end). The two support portions 513 and 513 of the chuck member 51R respectively hold the -Y side peripheral edge portion (-Y side peripheral edge portion) of the substrate W and the upstream end and downstream end in the first direction D1. If necessary, negative pressure is supplied to the suction pads of each support portion 513, whereby the four corners of the substrate W are sucked and held by the chuck 51 from below.

By the chuck 51 moving in the X direction while holding the substrate W, the substrate W is transported. In this way, the linear motors 88L, 88R, and a mechanism (not shown) for supplying negative pressure to each support portion 513 function as the suction/travel control mechanism 52 shown in FIG. 1.

As shown in FIG. 1 and FIG. 4, the chuck 51 is further away from the upper surface of the entrance suspension platform 31, the coating platform 32 and the exit suspension platform 33 to hold the substrate W. The chuck 51 holds the lower surface of the substrate W and conveys the substrate W. The chuck 51 only holds a part of the peripheral edge portion of the substrate W that is on the outer side (outer side in the Y direction) in the Y direction than the central portion opposed to the respective stages 31, 32, and 33. Therefore, the center portion of the substrate W is bent downward with respect to the peripheral edge portion. The floating platform portion 3 controls the vertical position of the substrate W by applying a floating force to the center portion of the substrate W in this state, and maintains the substrate W in a horizontal posture.

<Measurer>

The coating device 1 is provided with a plurality of (here, two) measuring instruments 70. The measuring device 70 measures the vertical position of the upper surface Wf of the substrate W to which the levitation force is given by the levitation platform portion 3. Specifically, the measuring device 70 measures the distance from the reference position of the predetermined vertical direction to the vertical position of the upper surface Wf, thereby measuring the vertical position of the upper surface Wf.

From the vertical position of the upper surface Wf measured by the measuring device 70, the height of the upper surface Wf can be obtained based on the height (vertical position) of the upper surface of the coating platform 32. In addition, the floating amount of the substrate W (the distance from the upper surface of the coating platform 32 to the lower surface of the floating substrate W) can be obtained from the height of the upper surface Wf and the thickness of the substrate W.

Each measuring device 70 is provided with a light projecting portion 70a that outputs light of a predetermined wavelength, and a photo sensor (such as a linear sensor) that detects light output from the light projecting portion 70a and reflected by the substrate W The light receiving part 70b (refer to FIG. 7). In this way, each measuring device 70 includes a reflective sensor that can measure the vertical position of the upper surface Wf in a non-contact manner.

Furthermore, the vertical position of the upper surface Wf can also be measured by ultrasonic waves instead of being measured by light. In this case, each measuring instrument 70 may be provided with an output unit that outputs ultrasonic waves, and a detection unit that detects the ultrasonic waves reflected by the upper surface Wf.

Each measuring instrument 70 is connected to the nozzle 61 via a connection member 72. One end (the end on the +X side) of the both side ends (ends on both sides in the X direction) of the connecting member 72 has a structure that can be installed on the upstream side surface (upstream side surface) of the nozzle 61, The other end (the end on the -X side) has a structure that can be mounted on the measuring device 70. Each measuring instrument 70 is arranged on the upstream side (−X side) of the nozzle 61 by being supported by the connecting member 72.

Since each measuring instrument 70 is connected to the nozzle 61 via the connection member 72, it follows the nozzle 61 and moves. That is, if the nozzle 61 is moved in the horizontal direction or the vertical direction by the moving mechanism 63, each measuring instrument 70 also follows it and moves in the same direction.

In this embodiment, by the movement of the moving mechanism 63, the measuring instruments 70 are positioned at the measuring positions L21a, L21b and the upstream positions L22a, L22b above the coating platform 32 (refer to FIG. 8). The horizontal position of each of the measurement positions L21a, L21b and the upstream positions L22a, L22b is set to a predetermined horizontal position. In a state where each measuring instrument 70 is positioned at the measurement positions L21a and L21b, each measuring instrument 70 measures the vertical position of the upper surface Wf of the substrate W. The upstream positions L22a, L22b are positions away from the measurement positions L21a, L21b toward the upstream side (-X side) of the first direction D1. In this embodiment, if the nozzle 61 is arranged at the downstream position L12, the measuring instruments 70 are arranged at the measuring positions L21a, L21b, and if the nozzle 61 is arranged at the coating position L11, the measuring instruments 70 are arranged at the upstream position. L22a, L22b (refer to Figure 8).

The connecting member 72 may directly connect the measuring instrument 70 to the nozzle 61 as in the present embodiment, but the measuring instrument 70 may be indirectly connected to the nozzle 61 via other members. For example, the connecting member 72 may also have a structure that can be installed on the beam member 631 for the nozzle 61 to be installed. In this case, the connector 72 connects the measuring instrument 70 to the nozzle 61 via the beam member 631.

As shown in FIG. 6, two measuring instruments 70 are provided in the second direction D2 at an interval shorter than the width of the substrate W (length in the width direction). By providing these two measuring devices 70, the vertical positions of two different parts of the substrate W in the width direction can be measured. In addition, the number of measuring instruments 70 is not limited to two, and may be a single one, or may be three or more.

Fig. 7 is a schematic block diagram showing the control unit 9 of the embodiment. The coating device 1 is provided with a control unit 9 for controlling the operation of each part. The hardware structure of the control unit 9 can also be set to be the same as that of a general computer. The control unit 9 is equipped with a CPU (Central Processing Unit) 91 for performing various arithmetic processing, a ROM (Read-Only Memory) as a read-only memory for storing basic programs, and storing various information The memory 92 can be read and written freely, and the display unit 93 including a display for displaying various information. As the memory 92, in addition to the main storage device (RAM (Random Access Memory)), it also includes a fixed disk that stores control application software (programs) and data. The control unit 9 may also have an interface for information exchange with users or external devices, and read information stored in a removable storage medium (optical media, magnetic media, semiconductor memory, etc.) ( Program) reading device.

As described later, the CPU 91 of the control unit 9 operates in accordance with the program, thereby obtaining the difference value of the vertical positions of the two positions on the upper surface Wf of the substrate W measured by the two measuring devices 70. In this way, the CPU 91 functions as a difference acquisition unit. Furthermore, the difference acquisition unit may also be constituted by a dedicated circuit.

FIG. 8 is a diagram showing each step of the substrate processing operation performed by the coating device 1 of the embodiment. The substrate processing operation first, as shown in FIG. 8(a), includes a transport step S11. In the transport step S11, the control unit 9 controls the transport mechanism 5 to direct the substrate W (hereinafter also referred to as "floating substrate W") to which the levitation force is given from the levitation platform portion 3 toward the downstream side (+X) in the first direction D1 Direction) transport. That is, at this time, the upper surface Wf (first main surface) of the suspension substrate W is facing upward in the vertical direction, and the lower surface (second main surface) of the suspension substrate W is given a suspension force from the suspension platform portion 3.

As shown in FIG. 8(b), the transport step S11 includes a stop phase S111. In the stop phase S111, the control unit 9 controls the transport mechanism 5 to transport the floating substrate W to a predetermined position LW1, and stops the floating substrate W at the predetermined position LW1.

Here, the floating substrate W arranged at the predetermined position LW1 straddles the coating platform 32 and the entrance floating platform 31. In addition, the horizontal position (the position in the horizontal direction) of the upstream end (upstream end) of the floating substrate W arranged at the predetermined position LW1 is set on the upstream side of the center of the coating platform 32.

As shown in FIG. 8(b), in the state where the floating substrate W is stopped at the predetermined position LW1 by the stop stage S111, the measurement step S12 is performed. The measurement step S12 is a step in which each measuring device 70 measures the vertical position of the floating substrate W. Each measuring device 70 measures the vertical position on the floating substrate W at the measurement horizontal position XM1. The measurement horizontal position XM1 is a horizontal position in the first direction D1 (X direction) of the area where each measuring device 70 of the measurement positions L21a and L21b measures the vertical position of the floating substrate W. Here, the measurement horizontal position XM1 is set at the coating platform 32 (here, the center position of the coating platform 32 in the first direction D1) that can hold the floating substrate W in a precise vertical position. In this embodiment, since the vertical position of the suspended substrate W in the stopped state is measured, it is possible to perform measurement with high accuracy compared with the case where the floating substrate W in motion is used as the object.

After the measurement step S12, a first determination step in which the control unit 9 determines whether there is an abnormality in the vertical position of the suspension substrate W measured by each measuring device 70 may also be performed. When the values of the vertical position of the floating substrate W measured by each measuring device 70 are set to A1 and A2, it can be determined in the first determination step whether the values A1 and A2 are within a predetermined reference range. When any one or both of the values A1 and A2 are outside the reference range, the control unit 9 may also notify the content to the outside through a predetermined output means (display unit 93 or lamp, speaker, etc.). In addition, at this time, the control unit 9 may also stop the operation of the coating device 1 in a manner that the operator can confirm.

As the reason why the vertical position of the floating substrate W is abnormal, for example, the floating substrate may be caused by clogging of any one of the plurality of ejection ports 321h or the plurality of suction ports 322h provided on the upper surface of the coating platform 32. The floating amount of W is abnormal. In addition, as another reason, the thickness of the floating substrate W may be abnormal (in addition to the abnormal thickness of the floating substrate W itself, it also includes an abnormality that physically changes the vertical position of the upper surface Wf of the floating substrate W). By detecting the abnormality of the vertical position of the floating substrate W, it is possible to prevent the occurrence of the coating failure of the processing liquid on the floating substrate W. In addition, by measuring the vertical position of the floating substrate W at a plurality of different locations in the second direction D2 by each measuring device 70, it is possible to easily perform the clogging of the plurality of ejection ports 321h or the plurality of suction ports 322h. Specify or specify the portion of the floating substrate W where the thickness is abnormal.

After the measurement step S12, the control unit 9 may also determine the difference value from the values A1, A2 of the vertical position of the suspension substrate W measured by each measuring device 70, and determine whether the difference value is within the first reference range. 2 Judgment steps. The difference value can be the value of the difference between the value A1 and the value A2. By obtaining the difference value, the abnormal position of the vertical position can be easily specified. In the second determination step, when the control unit 9 determines that the difference value is outside the reference range, the control unit 9 may also notify the content to the outside through a predetermined output means. In addition, the control unit 9 may also stop the operation of the coating device 1 in such a way that the operator can confirm it.

If the measurement step S12 is completed, as shown in FIG. 8(c), the control unit 9 proceeds to the movement step S13. The moving step S13 includes a measuring device moving phase S131 and a nozzle moving phase S132. In the measuring instrument moving stage S131, the moving mechanism 63 moves each measuring instrument 70 toward the upstream positions L22a, L22b which are positions different from the measuring positions L21a, L21b. In the nozzle movement stage S132, the movement mechanism 63 moves the nozzle 61 closer to the measurement horizontal position XM1 from the downstream position L12.

Here, each measuring instrument 70 is connected to the upstream side of the nozzle 61 by a connecting member 72, respectively. Therefore, the movement mechanism 63 executes the nozzle movement stage S132 in which the nozzle 61 is approached from the downstream position L12 to the measurement horizontal position XM1 on the upstream side, so that the measuring device movement of the measuring devices 70 to the upstream side can also be performed in parallel at the same time. Stage S131.

At this time, the horizontal position in the first direction D1 of the discharge port 611 of the nozzle 61 coincides with the measurement horizontal position XM1.

If the moving step S13 is completed, as shown in FIG. 8(d), the coating step S14 is performed. In the coating step S14, the nozzle 61 discharges the processing liquid from the discharge port 611, the processing liquid is supplied to the upper surface Wf of the suspension substrate W, and the conveyance mechanism 5 conveys the suspension substrate W in the first direction D1. Thereby, the treatment liquid is applied to the area of the predetermined width in the second direction D2 on the upper surface Wf of the suspension substrate W.

As shown in Fig. 8(c), if each measuring device 70 reaches the predetermined upstream position L22a, L22b by moving step S13, the horizontal position in the first direction D1 of the discharge port 611 of the nozzle 61 will be the same as the measuring The horizontal position XM1 is consistent. Here, since the discharge port 611 of the nozzle 61 opens vertically downward, the processing liquid is discharged vertically downward. In this way, the adhesion horizontal position, which is the horizontal position in the first direction D1 where the processing liquid discharged from the nozzle 61 adheres to the upper surface Wf of the suspension substrate W, will be the same as the measurement horizontal position XM1 (overlap in the vertical direction) . In this way, in this embodiment, since the processing liquid can be supplied to the suspension substrate W in the area where the vertical position of the suspension substrate W is measured, the suspension substrate W can be coated with the processing liquid satisfactorily.

Furthermore, it is not necessary to make the attachment horizontal position coincide with the measurement horizontal position XM1. It is also possible to set the attachment horizontal position to be near the measurement horizontal position XM1 (within a certain area centered on the measurement horizontal position XM1).

FIG. 9 is a diagram showing a modified example of the operation of the coating device 1 of the embodiment. In this modification, in the movement step S13, after the measuring instrument movement stage S131 and the nozzle movement stage S132 (refer to FIG. 8(c)), as shown in FIG. 9, the nozzle vertical position adjustment stage S133 is performed.

In the nozzle vertical position adjustment stage S133, the vertical position of the nozzle 61 is adjusted based on the vertical position of the floating substrate W measured by each measuring device 70. In the nozzle vertical position adjustment stage S133, the CPU 91 of the control unit 9 calculates the vertical position of the upper surface Wf from the measurement result of each measuring instrument 70 by a predetermined calculation. As a method of obtaining the vertical position, for example, when the values of the vertical position of the suspension substrate W measured by the two measuring devices 70 are set as A1 and A2, the average value of the equivalent values A1 and A2 can be set It is the vertical position of the floating substrate W. Alternatively, any of these values may be set as the vertical position of the floating substrate W. With the vertical position of the nozzle 61 relative to the determined vertical position of the floating substrate W arranged at an appropriate vertical position, the control unit 9 controls the elevating mechanisms 634 and 635 to raise and lower the beam member 631. If the nozzle vertical position adjustment stage S133 is completed, as shown in FIG. 8(d), the coating step S14 can be performed.

Through the nozzle vertical position adjustment stage S133, the vertical position of the nozzle 61 can be optimized according to the vertical position of the floating substrate W. Thereby, since the processing liquid can be supplied to the suspension substrate W from the most appropriate vertical position, the processing liquid can be applied to the suspension substrate W satisfactorily.

Furthermore, the nozzle vertical position adjustment stage S133 may be performed before the nozzle movement stage S132 (here before the measuring device movement stage S131) in which the nozzle 61 is moved to the upstream side, or it may be performed synchronously with the nozzle movement stage S132 (here The processing is performed synchronously with the measuring instrument moving stage S131). In the latter case, when the vertical position of the nozzle 61 needs to be adjusted, the nozzle 61 will move in the combined direction of the horizontal direction and the vertical direction.

Fig. 10 is a diagram showing a modified example of the operation of the coating device 1 of the embodiment. In this modification, in the measuring machine moving stage S131, the vertical position of the floating substrate W is measured while each measuring machine 70 moves from the measuring positions L21a, L21b to the upstream positions L22a, L22b. In this case, it is possible to measure the vertical position of the floating substrate W without the treatment liquid in the horizontal range from the measuring horizontal position XM1 to the predetermined position on the upstream side. It is also possible to perform a third determination step in which the control unit 9 determines whether there is an abnormality in the vertical position of the floating substrate W within the horizontal range. For example, the control unit 9 can determine whether the vertical positions of all the locations measured by each measuring device 70 are within a predetermined reference range. In addition, the control unit 9 may also obtain the difference value of the vertical position of the suspension substrate W between different points in the first direction D1 to determine whether the difference value is within a predetermined reference range.

In the present embodiment, the nozzle 61 and each measuring instrument 70 are connected by a connecting member 72, and the moving mechanism 63 can move these together in the horizontal direction and the vertical direction. However, it is also possible to separate the nozzle 61 and each measuring instrument 70 from each other, and the moving mechanism to move them individually without interfering with each other. However, as in the present embodiment, by connecting each measuring instrument 70 with respect to the nozzle 61 to move them integrally, the structure of the moving mechanism can be simplified.

Although the present invention has been described in detail, the above description is only illustrative in all aspects, and the present invention is not limited by these aspects. The countless modified examples not illustrated can be interpreted as those that can be inferred without departing from the scope of the present invention. The configurations described in the above-mentioned embodiments and modifications may be appropriately combined or omitted as long as they do not contradict each other.

1‧‧‧Coating device (substrate processing device)

3‧‧‧Suspended Platform Department (Suspended Mechanism)

5‧‧‧Transportation mechanism

31‧‧‧Entrance suspended platform

31h, 33h, 321h‧‧‧ nozzle

32‧‧‧Coating platform

33‧‧‧Export Suspended Platform

51R‧‧‧Chuck components

61‧‧‧Nozzle

63‧‧‧Mobile mechanism

70‧‧‧Measurer

72‧‧‧Connector

322h‧‧‧Suction port

611‧‧‧Exit

D1‧‧‧1st direction

L11‧‧‧Coating position

L12‧‧‧Downstream position

L21a, L21b‧‧‧Measurement position

L22a, L22b‧‧‧Upstream position

LW1‧‧‧Established location

S11‧‧‧Transfer procedure

S12‧‧‧Measurement procedure

S13‧‧‧Movement steps

S14‧‧‧Coating Step

S111‧‧‧Stop phase

S131‧‧‧Measurement device moving stage

S132‧‧‧Nozzle movement stage

W‧‧‧Substrate (Floating Substrate)

Wf‧‧‧Upper surface (1st main surface)

XM1‧‧‧Measure horizontal position

Claims (15)

A substrate processing device for processing a substrate having a first main surface and a second main surface; it is provided with: a levitation mechanism that imparts a levitation force to the substrate on the first main surface facing upward in the vertical direction; and a transport mechanism , Which moves the substrate (ie, the levitation substrate) imparted with the levitation force in the horizontal direction (ie, the first direction); the nozzle has a horizontal direction (ie, the second direction) orthogonal to the first direction The extended ejection port can eject the processing liquid from the ejection port toward the first main surface of the floating substrate; a measuring instrument that measures the vertical position of the first main surface of the floating substrate; and a moving mechanism that comes from The processing liquid of the nozzle is attached to the horizontal position of the floating substrate (ie, the attachment horizontal position) is close to the horizontal position of the area where the measuring device measures the vertical position of the floating substrate in advance (ie, measuring the horizontal position), so that the nozzle And the measuring instrument moves; the moving mechanism positions the measuring instrument at the measurement horizontal position, and positions the nozzle at a downstream position that is measured downstream in the first direction than the measurement horizontal position, and the transport mechanism makes the The floating substrate is moved to a predetermined position and then stopped. The measuring instrument measures the vertical position of the floating substrate in a state where the measuring instrument and the floating substrate are stopped. After the above-mentioned measuring instrument has measured the above-mentioned vertical position of the above-mentioned floating substrate under the state that the substrates are all stopped, the above-mentioned With the floating substrate stopped at the predetermined position, the measuring instrument is moved to another position, and the nozzle is moved so that the nozzle approaches the measurement horizontal position from the downstream position. The substrate processing apparatus of claim 1, wherein the moving mechanism moves the measuring instrument after measuring the vertical position of the floating substrate stopped at the predetermined position at the measurement horizontal position to the upstream side in the first direction For the position, the measuring instrument measures the vertical position of the floating substrate while moving toward the position on the upstream side in the first direction. A substrate processing device for processing a substrate having a first main surface and a second main surface; it is provided with: a levitation mechanism that imparts a levitation force to the substrate on the first main surface facing upward in the vertical direction; and a transport mechanism , Which moves the substrate (ie, the levitation substrate) imparted with the levitation force in the horizontal direction (ie, the first direction); the nozzle has a horizontal direction (ie, the second direction) orthogonal to the first direction The extended ejection port is capable of ejecting the processing liquid from the ejection port toward the first main surface of the floating substrate; a measuring device that measures the vertical position of the first main surface of the floating substrate; and a moving mechanism that comes from the above The processing liquid of the nozzle is attached to the horizontal position of the floating substrate (ie, the attachment horizontal position) is close to the horizontal position of the area where the measuring device measures the vertical position of the floating substrate in advance (ie, measuring the horizontal position), so that the nozzle and The measuring instrument moves; and the control unit; the transport mechanism stops the floating substrate after it moves to a predetermined position, The moving mechanism moves the measuring instrument that measures the vertical position of the floating substrate at the measurement horizontal position to another position while the floating substrate is stopped at the predetermined position, and moves the nozzle close to the measurement horizontal position, The moving mechanism moves the measuring instrument that measures the floating substrate stopped at the predetermined position at the vertical position of the measuring horizontal position from the measuring horizontal position to a position on the upstream side of the first direction, and the measuring instrument is at While moving from the measurement horizontal position to the position on the upstream side of the first direction, the vertical position of the floating substrate is measured, and the control unit performs at least one of the following judgments: During the movement of the position on the upstream side in the first direction, determine whether all the vertical positions of the suspended substrates measured are within a predetermined reference range; and, when the measuring instrument moves from the measurement horizontal position to the upstream in the first direction During the movement of the side position, for the vertical position of the floating substrate measured at different locations in the first direction, it is determined whether the difference value between the different locations is within a predetermined reference range. The substrate processing apparatus according to any one of claims 1 to 3, wherein the moving mechanism moves the nozzle and the measuring instrument in such a manner that the attachment horizontal position is consistent with the measurement horizontal position. The substrate processing apparatus according to any one of claims 1 to 3, wherein the suspension mechanism includes: a platform having an upper surface; and a plurality of ejection ports, which are provided on the upper surface, and eject toward the upper side of the vertical direction Air; and a plurality of suction ports, which are provided on the upper surface, suck the above vertical direction Side of the air. The substrate processing apparatus according to any one of claims 1 to 3, wherein the moving mechanism positions the nozzle at a predetermined horizontal position (ie coating position), and can move the nozzle to leave the coating position in a horizontal direction的的位置。 The location. The substrate processing apparatus of any one of claims 1 to 3, wherein the moving mechanism positions the measuring instrument at a predetermined horizontal position (ie, measuring position), and can move the measuring instrument to move away from the measuring instrument in a horizontal direction. The location of the measurement location. The substrate processing apparatus according to any one of claims 1 to 3, wherein it is further provided with a connecting member that connects the nozzle and the measuring instrument, and the moving mechanism makes the nozzle and the measuring instrument connected by the connecting member Move in one body. The substrate processing apparatus according to claim 8, wherein the connecting member connects the measuring instrument with respect to the nozzle on the upstream side in the first direction, and the moving mechanism causes the nozzle and the measuring instrument to move toward the upstream in the first direction Move sideways. The substrate processing apparatus according to any one of claims 1 to 3, wherein the measuring device includes a reflective sensor that detects light reflected by the first main surface of the floating substrate. The substrate processing apparatus according to any one of claims 1 to 3, wherein the moving mechanism changes the vertical position of the nozzle based on the vertical position of the floating substrate measured by the measuring device. The substrate processing apparatus according to any one of claims 1 to 3, wherein a plurality of the measuring instruments are provided at intervals in the second direction, and the plurality of measuring instruments can measure the floating substrate in the second direction Different The vertical position of multiple parts. The substrate processing apparatus according to claim 12, which further includes a difference acquiring unit that acquires the difference value of the vertical position of the plurality of parts measured by the plurality of measuring instruments. A substrate processing method for processing a substrate having a first main surface and a second main surface; it includes a conveying step of imparting a levitation force to the first main surface in a state where the first main surface faces upward in the vertical direction The substrate (that is, the floating substrate) moves along the horizontal direction (that is, the first direction); the measuring step, wherein the measuring instrument measures the vertical position of the first main surface of the floating substrate; the coating step, which is after the measuring step, The nozzle supplies the treatment liquid to the first main surface of the suspension substrate moved in the first direction by the conveying step; and a moving step of using the treatment liquid after the measuring step and before the coating step The horizontal position attached to the suspended substrate (ie, the attached horizontal position) is close to the horizontal position of the area where the measuring device measures the vertical position of the suspended substrate in advance in the measurement step (ie, the measurement of the horizontal position), so that the nozzle and the above The measuring device moves; the conveying step includes the following stages: positioning the measuring device at the measuring horizontal position, and positioning the nozzle at a downstream position that is more downstream in the first direction than the measuring horizontal position, so that the above-mentioned floating The stage of stopping the substrate after moving to a predetermined position; the above-mentioned measurement step includes the following stages: when the measuring instrument and the floating substrate are stopped, the measuring instrument measures the vertical position of the floating substrate Section; the moving step includes the following stages: in the state where the floating substrate is stopped at the predetermined position, the measuring instrument that measures the vertical position of the measurement horizontal position is moved to another position; and the floating substrate is stopped at In the state of the predetermined position, the nozzle is moved so that the nozzle approaches the measurement horizontal position from the downstream position. A substrate processing method for processing a substrate having a first main surface and a second main surface; it includes a conveying step of imparting a levitation force to the first main surface in a state where the first main surface faces upward in the vertical direction The substrate (that is, the floating substrate) moves along the horizontal direction (that is, the first direction); the measuring step, wherein the measuring instrument measures the vertical position of the first main surface of the floating substrate; the coating step, which is after the measuring step, The nozzle supplies the processing liquid to the first main surface of the suspension substrate moved in the first direction by the conveying step; the moving step includes attaching the processing liquid after the measuring step and before the coating step When the horizontal position of the floating substrate (ie, the attachment horizontal position) is close to the measurement step, the measuring device measures the horizontal position of the area of the vertical position of the floating substrate in advance (ie, measuring the horizontal position), so that the nozzle and the measurement And; the determination step; the transport step includes the step of stopping the floating substrate after moving to a predetermined position, and the measurement step includes the following step: the floating substrate stops at the predetermined position In the state of the position, the measuring instrument measures the vertical position of the floating substrate at the measurement horizontal position; the moving step includes the following phase: the floating substrate is stopped at the predetermined position, and the measurement horizontal position is measured The stage in which the measuring instrument in the vertical position moves from the measuring horizontal position to the position on the upstream side of the first direction; the stage in which the nozzle approaches the measuring horizontal position with the floating substrate stopped at the predetermined position; And the measuring instrument measures the vertical position of the floating substrate while the measuring instrument moves from the measuring horizontal position to the position on the upstream side of the first direction; the determining step includes at least one of the following stages: determining that the measurement is performed During the period when the device moves from the measurement horizontal position to the position on the upstream side of the first direction, whether all the vertical positions of the floating substrate measured are within the predetermined reference range; and, it is determined that the measurement device is from the measurement During the period when the horizontal position moves toward the position on the upstream side of the first direction, for the vertical position of the floating substrate measured at different points in the first direction, whether the difference between the different points is within the predetermined reference range .

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