TWI745431B - Photosensitive resin composition, cured product and image display device - Google Patents

Abstract

(式(I)中，R¹ 〜R⁶ 、k、l、m、n及o分別與說明書所記載之定義相同)The subject of the present invention is to provide a photosensitive resin composition with high sensitivity and excellent fine line adhesion. The photosensitive resin composition of the present invention contains (a) alkali-soluble resin, (b) photopolymerizable monomer, (c) photopolymerization initiator and (d) colorant, and (c) photopolymerization initiator contains The photopolymerization initiator (c1) represented by the general formula (I) and the photopolymerization initiator (c2) having a maximum absorption wavelength of 334 nm or more in the wavelength range of 320 nm to 400 nm.

(In formula (I), R ¹ 〜R ⁶ , k, 1, m, n, and o are the same as the definitions described in the specification)

Description

Photosensitive resin composition, cured product and image display device

The present invention relates to a photosensitive resin composition, a cured product, and an image display device. In particular, it relates to a photosensitive resin composition with high sensitivity and excellent fine line adhesion, a cured product obtained by curing, and an image display device having the cured product. The photosensitive resin composition of the present invention is particularly suitable for use as a photosensitive resin composition for a high-sensitivity black matrix (Black Matrix; sometimes abbreviated as "BM") capable of forming high-definition fine lines.

Color filters usually form a black black matrix on the surface of transparent substrates such as glass, plastic, etc., and then sequentially form more than 3 different colors of red, green, and blue in lattice, stripe, or mosaic patterns. Of pixels. The size of the pattern varies according to the purpose of the color filter and the respective color, and is usually about 5 to 700 μm. As a representative manufacturing method of color filters, a pigment dispersion method is currently known. In the case of manufacturing a color filter by the pigment dispersion method, first, a photosensitive resin composition containing black pigment is coated on a transparent substrate and then dried, and then the image is exposed and developed. High temperature treatment hardens it, thereby forming BM. The above operations are repeated for each color such as red, green, and blue to form a color filter. BM is generally arranged in a grid, stripe, or mosaic pattern between red, green, blue, etc. pixels, and has the effect of suppressing color mixing between pixels to improve contrast or prevent light leakage. Therefore, higher light-shielding properties are required for BM. In addition, the edge portions of the red, green, and blue pixels formed after the formation of the BM partially overlap the BM, and therefore, are affected by the film thickness of the BM, and a step is formed in the overlapped portion. At the overlapping portion, the flatness of the pixels is impaired, resulting in unevenness of the liquid crystal cell gap or confusion of the liquid crystal alignment, resulting in low display capability. Therefore, in recent years, it is particularly required to make the BM film thicker and thinner. In order to exhibit sufficient light-shielding properties even when the film is thinned, the pigment content in the photosensitive resin composition tends to increase. Therefore, the ratio of the photopolymerization initiator that can be added tends to decrease, and an initiator that can maintain a high sensitivity of crosslinking even if it is added in a small amount is required. On the other hand, in order to save energy or extend the life of mobile batteries, the output of the backlight tends to be lower. In order to display high-brightness images even under such conditions, it is promoted as a shading The thinning of the BM of the department. In addition, in recent years, in the liquid crystal display market, miniaturization such as flat panels has become the mainstream, and the demand for high resolution for large-scale TVs has continued to increase. For these reasons, the requirements for high-definition BM are constantly increasing. In recent years, the requirements for the line width of BM fine lines have gradually changed from the previous 10 μm to the current 6-8 μm. In the area where the pattern line width of the exposure mask is less than 10 μm, the influence caused by the diffraction of the passing light becomes greater, and accordingly, the amount of light reaching the surface of the BM decreases. Therefore, a high-sensitivity initiator is required. In addition, in the development after exposure, in order to eliminate the residue, the development time is generally set to be longer, but this will cause the BM/substrate interface to dissolve (invade) and easily cause the line pattern to peel off. When the pattern line width is 10 μm or more, even if there is an intrusion of about 1 to 2 μm (the two sides of the line are about 2 to 4 μm in total), the thin line can be kept close, but if it is a thin line pattern of less than 10 μm , The BM/substrate adhesion area becomes smaller, and the reduction of the development adhesion caused by the reduction of the line width by 1 μm becomes significantly larger. In particular, the spray developing method used in color filter manufacturing equipment also requires the physical adhesion of BM, so it is difficult to form a fine line pattern of less than 10 μm. Therefore, it is necessary to improve the adhesion of fine lines by methods such as improving the internal curability during exposure. Under this background, a photosensitive resin composition for BM with high sensitivity and excellent adhesion to fine lines of less than 10 μm is required. Patent Document 1 describes that an oxime ester compound having a nitrated carbazolyl structure is a high-sensitivity photopolymerization initiator that efficiently absorbs long-wavelength light such as 405 nm or 365 nm and is activated. Patent Document 2 describes that an oxime ester compound having a benzo-unsaturated 5-membered ring-carbonyl group is highly sensitive. Prior Art Documents Patent Documents Patent Document 1: International Publication No. 2008/078678 Patent Document 2: International Publication No. 2015/036910

(式(I)中，R¹ 表示可具有取代基之烷基或可具有取代基之芳香族環基。 R² 表示可具有取代基之烷基或可具有取代基之芳香族環基。 k表示0或1。 R³ 〜R⁶ 分別獨立表示任意之1價取代基。 l、m及o分別獨立表示0〜3之整數。n表示0或1) [2]如[1]記載之感光性樹脂組合物，其中上述(c)光聚合起始劑相對於全部固形物成分之含有比率為2質量%以上。 [3]如[1]或[2]記載之感光性樹脂組合物，其中上述(c)光聚合起始劑中之上述光聚合起始劑(c1)之含有比率為1質量%以上。 [4]如[1]至[3]中任一項記載之感光性樹脂組合物，其中上述光聚合起始劑(c2)為具有茀骨架或咔唑骨架之光聚合起始劑。 [5]如[4]記載之感光性樹脂組合物，其中上述光聚合起始劑(c2)為下述通式(II)所表示之光聚合起始劑。 [化2]

(式(II)中，R⁷ 表示可具有取代基之烷基或可具有取代基之芳香族環基。 R⁸ 表示可具有取代基之烷基或可具有取代基之芳香族環基。 p表示0或1。 R⁹ 表示任意之1價取代基。q表示0〜3之整數。 X表示-N(R¹⁰ )-或-C(R¹¹ )(R¹² )-。 R¹⁰ 〜R¹² 分別獨立表示氫原子、可具有取代基之烷基或可具有取代基之芳香族環基。R^{1 1} 與R¹² 可相互鍵結而形成環) [6]如[1]至[5]中任一項記載之感光性樹脂組合物，其中上述(d)色料為碳黑。 [7]如[1]至[6]中任一項記載之感光性樹脂組合物，其中上述(d)色料相對於全部固形物成分之含有比率為30質量%以上。 [8]如[1]至[7]中任一項記載之感光性樹脂組合物，其中上述(a)鹼可溶性樹脂含有具有羧基之環氧(甲基)丙烯酸酯樹脂。 [9]一種硬化物，其係使如[1]至[8]中任一項記載之感光性樹脂組合物硬化而成。 [10]一種圖像顯示裝置，其具有如[9]記載之硬化物。 [發明之效果] 根據本發明，可提供一種高感度且細線密接性優異之感光性樹脂組合物。[Problem to be Solved by the Invention] The inventors of the present invention conducted BM evaluation using the photopolymerization initiator described in Patent Document 1. As a result, they found that although the sensitivity was improved, the adhesion of the thin lines under the spray development method was insufficient. In addition, the photopolymerization initiator described in Patent Document 2 was used for BM evaluation, and as a result, it was found that although fine line adhesion became good, the line width was reduced or the film on the upper part of the pattern was reduced, and the sensitivity was insufficient. Therefore, the object of the present invention is to provide a photosensitive resin composition having high sensitivity and excellent fine line adhesion. [Technical Means to Solve the Problem] In order to solve the above-mentioned problem, the inventors of the present invention conducted diligent studies and found that the above-mentioned problem can be solved by including a photopolymerization initiator of a specific combination in the photosensitive resin composition. That is, the main purpose of the present invention is as follows. [1] A photosensitive resin composition characterized in that it contains (a) an alkali-soluble resin, (b) a photopolymerizable monomer, (c) a photopolymerization initiator, and (d) a colorant, and The above-mentioned (c) photopolymerization initiator contains a photopolymerization initiator (c1) represented by the following general formula (I), and a photopolymerization with a maximum absorption wavelength of 334 nm or more in the wavelength range of 320 nm to 400 nm Starter (c2). [化1]

(In formula (I), R ¹ represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. R ² represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. k Represents 0 or 1. R ^{3 to} R ⁶ each independently represent an arbitrary monovalent substituent. l, m, and o each independently represent an integer of 0 to 3. n represents 0 or 1) [2] The photosensitivity as described in [1] A resin composition in which the content ratio of the above-mentioned (c) photopolymerization initiator with respect to all solid components is 2% by mass or more. [3] The photosensitive resin composition according to [1] or [2], wherein the content of the photopolymerization initiator (c1) in the photopolymerization initiator (c) is 1% by mass or more. [4] The photosensitive resin composition as described in any one of [1] to [3], wherein the photopolymerization initiator (c2) is a photopolymerization initiator having a sulfonium skeleton or a carbazole skeleton. [5] The photosensitive resin composition according to [4], wherein the photopolymerization initiator (c2) is a photopolymerization initiator represented by the following general formula (II). [化2]

(In formula (II), R ⁷ represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. R ⁸ represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. p Represents 0 or 1. R ⁹ represents an arbitrary monovalent substituent. q represents an integer from 0 to 3. X represents -N(R ¹⁰ )- or -C(R ¹¹ )(R ¹² )-. R ¹⁰ 〜R ¹² Each independently represents a hydrogen atom, an optionally substituted alkyl group, or an optionally substituted aromatic ring group. R ^{1 1} and R ¹² may be bonded to each other to form a ring) [6] As in [1] to [5] The photosensitive resin composition of any one of which the said (d) color material is carbon black. [7] The photosensitive resin composition according to any one of [1] to [6], wherein the content of the (d) colorant relative to all solid components is 30% by mass or more. [8] The photosensitive resin composition according to any one of [1] to [7], wherein the (a) alkali-soluble resin contains an epoxy (meth)acrylate resin having a carboxyl group. [9] A cured product obtained by curing the photosensitive resin composition as described in any one of [1] to [8]. [10] An image display device having the cured product as described in [9]. [Effects of the Invention] According to the present invention, it is possible to provide a photosensitive resin composition having high sensitivity and excellent fine line adhesion.

式(I)中，R¹ 表示可具有取代基之烷基或可具有取代基之芳香族環基。 R² 表示可具有取代基之烷基或可具有取代基之芳香族環基。 k表示0或1。 R³ 〜R⁶ 分別獨立表示任意之1價取代基。 l、m及o分別獨立表示0〜3之整數。n表示0或1。 本發明之感光性樹脂組合物可進而含有分散劑、硫醇類，視需要亦可含有密接提高劑、塗佈性提高劑、顯影改良劑、紫外線吸收劑、抗氧化劑、顏料衍生物等其他調配成分，通常各調配成分係以溶解或分散於有機溶劑中之狀態使用。 本發明之特徵在於：於感光性樹脂組合物中，(c)光聚合起始劑含有光聚合起始劑(c1)及光聚合起始劑(c2)。首先，對(c)光聚合起始劑進行說明。 ＜(c)光聚合起始劑＞ 本發明中之(c)光聚合起始劑含有下述通式(I)所表示之光聚合起始劑(c1)、及極大吸收波長為334 nm以上之光聚合起始劑(c2)。 ＜光聚合起始劑(c1)＞ 光聚合起始劑(c1)係下述通式(I)所表示之光聚合起始劑。 [化4]

式(I)中，R¹ 表示可具有取代基之烷基或可具有取代基之芳香族環基。 R² 表示可具有取代基之烷基或可具有取代基之芳香族環基。 k表示0或1。 R³ 〜R⁶ 分別獨立表示任意之1價取代基。 l、m及o分別獨立表示0〜3之整數。n表示0或1。 如此，認為藉由含有上述通式(I)所表示之光聚合起始劑(c1)，而促進光聚合起始劑向色料粒子表面之吸附，曝光時之光聚合起始劑之光吸收率提高，並且，樹脂成分之UV(Ultraviolet，紫外線)光透過性提昇，內部硬化性提高，細線密接性變得良好。 (R¹ ) 上述式(I)中，R¹ 表示可具有取代基之烷基或可具有取代基之芳香族環基。 R¹ 中之烷基可為直鏈狀，亦可為支鏈狀，亦可為環狀，亦可為該等鍵結而成之形狀。烷基之碳數並無特別限定，通常為1以上，又，較佳為12以下，更佳為6以下，進而較佳為3以下，尤佳為2以下。藉由將烷基之碳數設為上述上限值以下，存在交聯密度變高之傾向。 作為烷基之具體例，可列舉：甲基、乙基、丙基、異丙基、丁基、異丁基、第三丁基、戊基、異戊基、環戊基、己基、環己基等。該等之中，就感度之觀點而言，較佳為甲基、乙基、丙基、或丁基，更佳為甲基或乙基，進而較佳為甲基。 作為烷基可具有之取代基，可列舉：碳數1〜10之烷氧基、碳數1〜10之烷硫基、F、Cl、Br、I等鹵素原子、羥基、硝基等，就溶劑溶解性之觀點而言，較佳為甲氧基或羥基。又，就感度之觀點而言，較佳為未經取代。 作為R¹ 中之芳香族環基，可列舉：芳香族烴環基及芳香族雜環基。其碳數通常為4以上，較佳為6以上，又，較佳為12以下，更佳為10以下，進而較佳為8以下。藉由將芳香族環基之碳數設為上述下限值以上，存在保存穩定性變得良好之傾向，又，藉由設為上述上限值以下，存在溶劑溶解性變得良好之傾向。 作為芳香族烴環基中之芳香族烴環，可為單環，亦可為縮合環。作為芳香族烴環基，例如可列舉：具有1個自由原子價之苯環、萘環、蒽環、菲環、苝環、并四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、乙烷合萘環、螢蒽環、茀環等之基。 又，作為芳香族雜環基中之芳香族雜環，可為單環，亦可為縮合環。作為芳香族雜環基，例如可列舉：具有1個自由原子價之呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、呸啶環、喹唑啉環、喹唑啉酮環、薁環等之基。 該等之中，就溶劑溶解性之觀點而言，較佳為具有1個自由原子價之苯環或萘環，更佳為具有1個自由原子價之苯環。 作為芳香族環基可具有之取代基，可列舉：碳數1〜10之烷基、碳數1〜10之烷氧基、碳數1〜10之烷硫基、F、Cl、Br、I等鹵素原子、羥基、硝基等，就溶劑溶解性之觀點而言，較佳為甲氧基或羥基。又，就感度之觀點而言，較佳為未經取代。 該等之中，就硬化性之觀點而言，R¹ 較佳為可具有取代基之烷基，更佳為未經取代之烷基，進而較佳為甲基。 (R² ) 上述式(I)中，R² 表示可具有取代基之烷基或可具有取代基之芳香族環基。 R² 中之烷基可為直鏈狀，亦可為支鏈狀，亦可為環狀，亦可為該等鍵結而成之形狀，就溶劑溶解性之觀點而言，較佳為直鏈狀或支鏈狀，更佳為支鏈狀。 烷基之碳數並無特別限定，通常為1以上，較佳為2以上，更佳為3以上，進而較佳為4以上，尤佳為5以上，又，較佳為10以下，更佳為8以下，進而較佳為7以下，尤佳為6以下。藉由將烷基之碳數設為上述下限值以上，存在溶劑溶解性變得良好之傾向，藉由設為上述上限值以下，存在變為高感度之傾向。 作為烷基之具體例，可列舉：甲基、乙基、丙基、異丙基、丁基、異丁基、第三丁基、戊基、異戊基、環戊基、己基、環己基等。該等之中，就溶劑溶解性之觀點而言，較佳為異丙基、異丁基、異戊基、或環戊基，更佳為異丁基或異戊基，進而較佳為異戊基。 作為烷基可具有之取代基，可列舉：碳數6〜10之芳香族環基、碳數1〜10之烷氧基、碳數1〜10之烷硫基、F、Cl、Br、I等鹵素原子、羥基等，就溶劑溶解性之觀點而言，較佳為碳數1〜3之烷氧基。又，就感度之觀點而言，較佳為未經取代。 作為R² 中之芳香族環基，可列舉：芳香族烴環基及芳香族雜環基。其碳數通常為4以上，較佳為6以上，又，較佳為12以下，更佳為10以下，進而較佳為8以下。藉由將芳香族環基之碳數設為上述下限值以上，存在分子變得穩定之傾向，又，藉由設為上述上限值以下，存在溶劑溶解性變得良好之傾向。 作為芳香族烴環基中之芳香族烴環，可為單環，亦可為縮合環。作為芳香族烴環基，例如可列舉：具有1個自由原子價之苯環、萘環、蒽環、菲環、苝環、并四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、乙烷合萘環、螢蒽環、茀環等之基。 又，作為芳香族雜環基中之芳香族雜環，可為單環，亦可為縮合環。作為芳香族雜環基，例如可列舉：具有1個自由原子價之呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃璟、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、呸啶環、喹唑啉環、喹唑啉酮環、薁環等之基。 該等之中，就溶劑溶解性之觀點而言，較佳為具有1個自由原子價之苯環或萘環，更佳為具有1個自由原子價之苯環。 作為芳香族環基可具有之取代基，可列舉：碳數1〜10之烷基、碳數1〜10之烷氧基、碳數1〜10之烷硫基、F、Cl、Br、I等鹵素原子、羥基、硝基等，就溶劑溶解性之觀點而言，較佳為碳數1〜3之烷氧基或羥基。又，就感度之觀點而言，較佳為未經取代。 該等之中，就感度之觀點而言，R² 較佳為可具有取代基之烷基，更佳為未經取代之烷基，進而較佳為異戊基。 (k) 上述式(I)中，k表示0或1。就感度之觀點而言，k較佳為0，另一方面，就溶劑溶解性之觀點而言，k較佳為1。 (R³ 〜R⁶ ) 上述式(I)中，R³ 〜R⁶ 分別獨立表示任意之1價取代基。 作為任意之1價取代基，可列舉：甲基、乙基等碳數1〜10之烷基；甲氧基、乙氧基等碳數1〜10之烷氧基；F、Cl、Br、I等鹵素原子；碳數1〜10之醯基；碳數1〜10之烷基酯基；碳數1〜10之烷氧基羰基；碳數1〜10之鹵化烷基；碳數4〜10之芳香族環基；胺基；碳數1〜10之胺基烷基；羥基；硝基；CN基等。該等之中，就溶劑溶解性之觀點而言，較佳為甲基、甲氧基，更佳為甲基。 R³ 、R⁴ 及R⁶ 中，於l、m及o為2以上之情形時，複數個R³ 、R⁴ 及R⁶ 彼此可鍵結而形成環。環可為脂肪族環，亦可為芳香族環。 (l、m、n、o) 上述式(I)中，l、m及o分別獨立表示0〜3之整數，n表示0或1。 就感度之觀點而言，l、m及o分別獨立較佳為0或1，更佳為0。又，就感度之觀點而言，n較佳為0。 上述通式(I)所表示之光聚合起始劑就溶劑溶解性與感度之均衡性、以及與色料之適度之相互作用之觀點而言，較佳為下述通式(I-1)所表示之光聚合起始劑。 [化5]

式(I-1)中，R¹ 〜R⁶ 、k〜o與上述式(I)同義。 上述光聚合起始劑(c1)之極大吸收波長並無特別限定，就感度之觀點而言，較佳為322 nm以上，更佳為325 nm以上，進而較佳為328 nm以上，進而更佳為329 nm以上，尤佳為330 nm以上，又，較佳為337 nm以下，更佳為336 nm以下，進而較佳為334 nm以下，進而更佳為333 nm以下。藉由設為上述範圍內，存在可有效利用UV光源所發出之333 nm之明線至365 nm之明線(i射線)之間之光的傾向。 上述光聚合起始劑(c1)之製造方法並無特別限定，例如可採用國際公開第2015/036910號中記載之方法。 又，作為上述光聚合起始劑(c1)之具體例，例如可列舉以下者。 [化6]

[化7]

[化8]

[化9]

本發明中之(c)光聚合起始劑除含有上述光聚合起始劑(c1)以外，亦含有極大吸收波長為334 nm以上之光聚合起始劑(c2)。 ＜光聚合起始劑(c2)＞ 光聚合起始劑(c2)係極大吸收波長為334 nm以上之光聚合起始劑。 如此，認為藉由將光聚合起始劑(c1)與極大吸收波長為334 nm以上之光聚合起始劑(c2)併用，可有效利用之光波長範圍擴大，感度變得良好。 上述光聚合起始劑(c2)之極大吸收波長只要為334 nm以上，則並無特別限定，就感度之觀點而言，較佳為335 nm以上，更佳為336 nm以上，進而較佳為338 nm以上，進而更佳為340 nm以上，尤佳為345 nm以上，最佳為350 nm以上，又，較佳為390 nm以下，更佳為380 nm以下，進而較佳為375 nm以下，尤佳為370 nm以下。藉由將光聚合起始劑(c2)之極大吸收波長設為上述下限值以上，存在內部硬化程度變高之傾向，又，藉由設為上述上限值以下，存在變為高感度之傾向。 進而，光聚合起始劑(c2)與光聚合起始劑(c1)之極大吸收波長之差較佳為5 nm以上，更佳為10 nm以上，進而較佳為20 nm以上，尤佳為30 nm以上，又，較佳為60 nm以下，更佳為50 nm以下，進而較佳為40 nm以下，選擇使用具有適宜之極大吸收波長之光聚合起始劑(c1)與光聚合起始劑(c2)之組合即可。藉由將光聚合起始劑(c1)與光聚合起始劑(c2)之極大吸收波長之差設為上述下限值以上，可有效利用之光波長範圍擴大，存在高感度化之傾向，藉由設為上述上限值以下，存在對UV光之i射線(365 nm)之感度變高之傾向。 上述光聚合起始劑(c2)之化學結構並無特別限定，就感度之觀點而言，較佳為肟酯系光聚合起始劑，尤其較佳為具有茀骨架或咔唑骨架之光聚合起始劑。再者，所謂具有茀骨架或咔唑骨架，意指分子結構中具有茀環或咔唑環，該等環可經取代。 又，就表面硬化性之觀點而言，光聚合起始劑(c2)較佳為下述通式(II)所表示之光聚合起始劑。 [化10]

式(II)中，R⁷ 表示可具有取代基之烷基或可具有取代基之芳香族環基。 R⁸ 表示可具有取代基之烷基或可具有取代基之芳香族環基。 p表示0或1。 R⁹ 表示任意之1價取代基。q表示0〜3之整數。 X表示-N(R¹⁰ )-或-C(R¹¹ )(R¹² )-。 R^{1 0} 〜R¹² 分別獨立表示氫原子、可具有取代基之烷基或可具有取代基之芳香族環基。R¹¹ 與R¹² 可相互鍵結而形成環。 (R⁷ ) 上述式(II)中，R⁷ 表示可具有取代基之烷基或可具有取代基之芳香族環基。 R⁷ 中之烷基可為直鏈狀，亦可為支鏈狀，亦可為環狀，亦可為該等鍵結而成之形狀。烷基之碳數並無特別限定，較佳為10以下，更佳為7以下，進而較佳為5以下，尤佳為3以下，最佳為2以下，又，通常為1以上。藉由將烷基之碳數設為上述上限值以下，存在交聯密度變高之傾向。 作為烷基之具體例，可列舉：甲基、乙基、丙基、異丙基、丁基、異丁基、第三丁基、戊基、異戊基、環戊基、己基、環己基等。該等之中，就感度之觀點而言，較佳為甲基、乙基、丙基、或丁基，更佳為甲基或乙基，進而較佳為甲基。 作為烷基可具有之取代基，可列舉：碳數6〜10之芳香族環基、碳數1〜10之烷氧基、碳數1〜10之烷硫基、F、Cl、Br、I等鹵素原子、羥基等，就溶劑溶解性之觀點而言，較佳為碳數1〜3之烷氧基。又，就感度之觀點而言，較佳為未經取代。 作為R⁷ 中之芳香族環基，可列舉：芳香族烴環基及芳香族雜環基。其碳數通常為4以上，較佳為6以上，又，較佳為12以下，更佳為10以下，進而較佳為8以下。藉由將芳香族環基之碳數設為上述下限值以上，存在分子變得穩定之傾向，又，藉由設為上述上限值以下，存在溶劑溶解性變得良好之傾向。 作為芳香族烴環基中之芳香族烴環，可為單環，亦可為縮合環。作為芳香族烴環基，例如可列舉：具有1個自由原子價之苯環、萘環、蒽環、菲環、苝環、并四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、乙烷合萘環、螢蒽環、茀環等之基。 又，作為芳香族雜環基中之芳香族雜環，可為單環，亦可為縮合環。作為芳香族雜環基，例如可列舉：具有1個自由原子價之呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、呸啶環、喹唑啉瓖、喹唑啉酮環、薁環等之基。 該等之中，就溶劑溶解性之觀點而言，較佳為具有1個自由原子價之苯環或萘環，更佳為具有1個自由原子價之苯環。 作為芳香族環基可具有之取代基，可列舉：碳數1〜10之烷基、碳數1〜10之烷氧基、碳數1〜10之烷硫基、F、Cl、Br、I等鹵素原子、羥基、硝基等，就溶劑溶解性之觀點而言，較佳為碳數1〜3之烷氧基或羥基。 該等之中，就感度之觀點而言，R⁷ 較佳為可具有取代基之烷基，更佳為未經取代之烷基，進而較佳為甲基或乙基，尤佳為甲基。 (R⁸ ) 上述式(II)中，R⁸ 表示可具有取代基之烷基或可具有取代基之芳香族環基。 R⁸ 中之烷基可為直鏈狀，亦可為支鏈狀，亦可為環狀，亦可為該等鍵結而成之形狀，就溶劑溶解性之觀點而言，較佳為直鏈狀或支鏈狀，更佳為支鏈狀。另一方面，就感度之觀點而言，較佳為使直鏈狀烷基與環狀烷基鍵結而成之基。 烷基之碳數並無特別限定，通常為1以上，較佳為2以上，更佳為3以上，進而較佳為4以上，進而更佳為5以上，尤佳為6以上，最佳為7以上，又，較佳為12以下，更佳為10以下，進而較佳為9以下，尤佳為8以下。藉由將烷基之碳數設為上述下限值以上，存在溶劑溶解性變得良好之傾向，藉由設為上述上限值以下，存在變為高感度之傾向。 作為烷基可具有之取代基，可列舉：碳數6〜10之芳香族環基、碳數1〜10之烷氧基、碳數1〜10之烷硫基、碳數1〜10之烷氧基羰基、F、Cl、Br、I等鹵素原子、羥基等，就溶劑溶解性之觀點而言，較佳為碳數1〜3之烷氧基。又，就感度之觀點而言，較佳為未經取代。 作為烷基之具體例，可列舉：甲基、乙基、丙基、異丙基、丁基、異丁基、第三丁基、戊基、異戊基、環戊基、己基、環己基、環戊基甲基、環戊基乙基、環己基甲基、環己基乙基等。該等之中，就溶劑溶解性之觀點而言，較佳為異戊基、環己基甲基、環戊基乙基、或環己基乙基，更佳為環戊基乙基或環己基乙基，進而較佳為環己基乙基。 作為R⁸ 中之芳香族環基，可列舉：芳香族烴環基及芳香族雜環基。其碳數通常為4以上，較佳為6以上，又，較佳為12以下，更佳為10以下，進而較佳為8以下。藉由將芳香族環基之碳數設為上述下限值以上，存在分子變得穩定之傾向，又，藉由設為上述上限值以下，存在溶劑溶解性變得良好之傾向。 作為芳香族烴環基中之芳香族烴環，可為單環，亦可為縮合環。作為芳香族烴環基，例如可列舉：具有1個自由原子價之苯環、萘環、蒽環、菲環、苝環、并四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、乙烷合萘環、螢蒽環、茀環等之基。 又，作為芳香族雜環基中之芳香族雜環，可為單環，亦可為縮合環。作為芳香族雜環基，例如可列舉：具有1個自由原子價之呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、呸啶環、喹唑啉環、喹唑啉酮環、薁環等之基。 該等之中，就溶劑溶解性之觀點而言，較佳為具有1個自由原子價之苯環或萘環，更佳為具有1個自由原子價之苯環。 作為芳香族環基可具有之取代基，可列舉：碳數1〜10之烷基、碳數1〜10之烷氧基、碳數1〜10之烷硫基、F、Cl、Br、I等鹵素原子、羥基、硝基等，就溶劑溶解性之觀點而言，較佳為碳數1〜5之烷氧基或羥基。取代基之烷基鏈部分可為直鏈狀或支鏈狀，進而可具有碳數1〜3之烷氧基、碳數1〜3之烷硫基、鹵素原子、羥基、硝基等取代基。 該等之中，就光吸收波長之長波長化等觀點而言，R⁸ 較佳為可具有取代基之芳香族環基，更佳為可具有取代基之芳香族烴環基。 (p) 上述式(II)中，p表示0或1。就感度之觀點而言，p較佳為0，另一方面，就溶劑溶解性之觀點而言，p較佳為1。 (R⁹ ) 上述式(II)中，R⁹ 表示任意之1價取代基。 作為任意之1價取代基，可列舉：甲基、乙基等碳數1〜10之烷基；甲氧基、乙氧基等碳數1〜10之烷氧基；F、CI、Br、I等鹵素原子；碳數1〜10之醯基；碳數1〜10之烷基酯基；碳數1〜10之烷氧基羰基；碳數1〜10之鹵化烷基；碳數4〜10之芳香族環基；胺基；碳數1〜10之胺基烷基；羥基；硝基；CN基；可具有取代基之苯甲醯基；可具有取代基之噻吩甲醯基等。作為苯甲醯基、或噻吩甲醯基可具有之取代基，可列舉：碳數1〜3之烷基、碳數1〜3之烷氧基等，可於0〜3個之範圍內具有取代基。該等之中，就吸收波長之長波長化之觀點而言，較佳為硝基、2-噻吩甲醯基，更佳為硝基。 R⁹ 中，於q為2以上之情形時，複數個R⁹ 彼此可鍵結而形成環。環可為脂肪族環，亦可為芳香族環。 (q) 上述式(II)中，q表示0〜3之整數。就自由基生成效率之觀點而言，較佳為0或1，更佳為1。 (X) 上述式(II)中，X表示-N(R¹⁰ )-或-C(R¹¹ )(R¹² )-。該等之中，就感度之觀點而言，較佳為-N(R¹⁰ )-。 (R¹⁰ 〜R¹² ) 上述式(II)中，R¹⁰ 〜R¹² 分別獨立表示氫原子、可具有取代基之烷基或可具有取代基之芳香族環基。 R¹⁰ 〜R¹² 中之烷基可為直鏈狀，亦可為支鏈狀，亦可為環狀，亦可為該等鍵結而成之形狀，就感度之觀點而言，較佳為直鏈狀或支鏈狀，更佳為直鏈狀。 烷基之碳數並無特別限定，通常為1以上，較佳為2以上，更佳為3以上，進而較佳為4以上，尤佳為5以上，又，較佳為10以下，更佳為8以下，進而較佳為6以下，尤佳為4以下。藉由將烷基之碳數設為上述下限值以上，存在溶劑溶解性變得良好之傾向，藉由設為上述上限值以下，存在變為高感度之傾向。 作為烷基之具體例，可列舉：甲基、乙基、丙基、異丙基、丁基、異丁基、第三丁基、戊基、異戊基、環戊基、己基、環己基、2-乙基己基等。該等之中，就感度與溶劑溶解性之均衡性之觀點而言，較佳為乙基、丙基、異丙基、或丁基，更佳為乙基或丙基，進而較佳為乙基。 作為烷基可具有之取代基，可列舉：碳數6〜10之芳香族環基、碳數1〜10之烷氧基、碳數1〜10之烷硫基、F、Cl、Br、I等鹵素原子、羥基等，就溶劑溶解性之觀點而言，較佳為碳數1〜3之烷氧基。又，就感度之觀點而言，較佳為未經取代。 作為R^{1 0} 〜R¹² 中之芳香族環基，可列舉：芳香族烴環基及芳香族雜環基。其碳數通常為4以上，較佳為6以上，又，較佳為12以下，更佳為10以下，進而較佳為8以下。藉由將芳香族環基之碳數設為上述下限值以上，存在分子變得穩定之傾向，又，藉由設為上述上限值以下，存在溶劑溶解性變得良好之傾向。 作為芳香族烴環基中之芳香族烴環，可為單環，亦可為縮合環。作為芳香族烴環基，例如可列舉：具有1個自由原子價之苯環、萘環、蒽環、菲環、苝環、并四苯璋、芘環、苯并芘環、䓛環、聯三伸苯環、乙烷合萘環、螢蒽環、茀環等之基。 又，作為芳香族雜環基中之芳香族雜環，可為單環，亦可為縮合環。作為芳香族雜環基，例如可列舉：具有1個自由原子價之呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、呸啶環、喹唑啉環、喹唑啉酮環、薁環等之基。該等之中，就溶劑溶解性之觀點而言，較佳為具有1個自由原子價之苯環或萘環，更佳為具有1個自由原子價之苯環。 作為芳香族環基可具有之取代基，可列舉：碳數1〜10之烷基、碳數1〜10之烷氧基、碳數1〜10之烷硫基、F、Cl、Br、I等鹵素原子、羥基、硝基等，就溶劑溶解性之觀點而言，較佳為碳數1〜3之烷氧基或羥基。又，就感度之觀點而言，較佳為未經取代。 又，R¹¹ 與R¹² 可相互鍵結而形成環，該環可為脂肪族環，亦可為芳香族環。 該等之中，就感度之觀點而言，R^{1 0} 〜R¹² 較佳為各自獨立為可具有取代基之烷基，更佳為未經取代之烷基，進而較佳為R¹⁰ 為甲基或乙基、R¹¹ 及R¹² 為丁基。 又，作為光聚合起始劑(c2)之市售品，可列舉：BASF公司製造之OXE-02，常州強力電子新材料公司製造之TR-PBG-304、TR-PBG-314、TR-PBG-358等。又，亦可使用日本專利第4223071號公報所記載者、國際公開第2016/010036號所記載者、日本專利第5682094號公報所記載者。 作為光聚合起始劑(c2)之具體例，例如可列舉以下者。再者，式中，nBu表示正丁基。 [化11]

[化12]

[化13]

[化14]

(c)光聚合起始劑亦可進而包含上述光聚合起始劑(c1)及上述光聚合起始劑(c2)以外之其他光聚合起始劑。 作為其他光聚合起始劑，例如可列舉：日本專利特開昭59-152396號公報、日本專利特開昭61-151197號各公報中記載之包含二茂鈦化合物之二茂金屬化合物；日本專利特開2000-56118號公報中記載之六芳基聯咪唑衍生物；日本專利特開平10-39503號公報記載之鹵甲基化㗁二唑衍生物、鹵甲基均三𠯤衍生物、N-苯基甘胺酸等N-芳基-α-胺基酸類、N-芳基-α-胺基酸鹽類、N-芳基-α-胺基酸酯類等自由基活性劑、α-胺基烷基苯酮衍生物；日本專利特開2000-80068號公報、日本專利特開2006-36750號公報等中記載之肟酯衍生物等。 具體而言，例如作為二茂鈦衍生物類，可列舉：二氯化二環戊二烯基鈦、二環戊二烯基鈦聯苯、二環戊二烯基鈦雙(2,3,4,5,6-五氟苯-1-基)、二環戊二烯基鈦雙(2,3,5,6-四氟苯-1-基)、二環戊二烯基鈦雙(2,4,6-三氟苯-1-基)、二環戊二烯基鈦二(2,6-二氟苯-1-基)、二環戊二烯基鈦二(2,4-二氟苯-1-基)、二(甲基環戊二烯基)鈦雙(2,3,4,5,6-五氟苯-1-基)、二(甲基環戊二烯基)鈦雙(2,6-二氟苯-1-基)、二環戊二烯基鈦[2,6-二氟-3-(吡咯-1-基)-苯-1-基]等。 又，作為聯咪唑衍生物類，可列舉：2-(2'-氯苯基)-4,5-二苯基咪唑二聚物、2-(2'-氯苯基)-4,5-雙(3'-甲氧基苯基)咪唑二聚物、2-(2'-氟苯基)-4,5-二苯基咪唑二聚物、2-(2'-甲氧基苯基)-4,5-二苯基咪唑二聚物、(4'-甲氧基苯基)-4,5-二苯基咪唑二聚物等。 又，作為鹵甲基化㗁二唑衍生物類，可列舉：2-三氯甲基-5-(2'-苯并呋喃基)-1,3,4-㗁二唑、2-三氯甲基-5-[β-(2'-苯并呋喃基)乙烯基]-1,3,4-㗁二唑、2-三氯甲基-5-[β-(2'-(6''-苯并呋喃基)乙烯基)]-1,3,4-㗁二唑、2-三氯甲基-5-呋喃基-1,3,4-㗁二唑等。 又，作為鹵甲基均三𠯤衍生物類，可列舉：2-(4-甲氧基苯基)-4,6-雙(三氯甲基)均三𠯤、2-(4-甲氧基萘基)-4,6-雙(三氯甲基)均三𠯤、2-(4-乙氧基萘基)-4,6-雙(三氯甲基)均三𠯤、2-(4-乙氧基羰基萘基)-4,6-雙(三氯甲基)均三𠯤等。 又，作為α-胺基烷基苯酮衍生物類，可列舉：2-甲基-1-[4-(甲硫基)苯基]-2-𠰌啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-𠰌啉基苯基)-丁酮-1、2-苄基-2-二甲基胺基-1-(4-𠰌啉基苯基)丁烷-1-酮、4-二甲基胺基苯甲酸乙酯、4-二甲基胺基苯甲酸異戊酯、4-二乙基胺基苯乙酮、4-二甲基胺基苯丙酮、1,4-二甲基胺基苯甲酸2-乙基己酯、2,5-雙(4-二乙基胺基亞苄基)環己酮、7-二乙基胺基-3-(4-二乙基胺基苯甲醯基)香豆素、4-(二乙基胺基)查耳酮等。 作為肟酯衍生物，可列舉：日本專利特表2004-534797號公報、日本專利特開2000-80068號公報、日本專利特開2006-36750號公報、日本專利特開2008-179611號公報、日本專利特表2012-526185號公報、日本專利特表2012-519191號公報等中記載之肟酯化合物。其中，就感度之觀點而言較佳為4-乙醯氧基亞胺基-5-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]-5-側氧戊酸甲酯，又，作為製品名，可列舉：OXE-01(BASF公司製造)、TR-PBG-305(常州強力公司製造)、NCI-930(ADEKA公司製造)等。 上述其他光聚合起始劑可單獨使用1種，亦可將2種以上併用。 ＜增感色素＞ 視需要可與光聚合起始劑併用與圖像曝光光源之波長對應之增感色素以提高感應感度。作為該等增感色素，可列舉：日本專利特開平4-221958號公報、日本專利特開平4-219756號公報等中記載之𠮿

色素，日本專利特開平3-239703號公報、日本專利特開平5-289335號公報等中記載之具有雜環之香豆素色素，日本專利特開平3-239703號公報、日本專利特開平5-289335號公報等中記載之3-酮基香豆素化合物，日本專利特開平6-19240號公報中記載之吡咯亞甲基色素，以及日本專利特開昭47-2528號公報、日本專利特開昭54-155292號公報、日本專利特公昭45-37377號公報、日本專利特開昭48-84183號公報、日本專利特開昭52-112681號公報、日本專利特開昭58-15503號公報、日本專利特開昭60-88005號公報、日本專利特開昭59-56403號公報、日本專利特開平2-69號公報、日本專利特開昭57-168088號公報、日本專利特開平5-107761號公報、日本專利特開平5-210240號公報、日本專利特開平4-288818號公報等中記載之具有二烷基胺基苯骨架之色素等。 該等增感色素中之較佳者為含有胺基之增感色素，更佳者為同一分子內具有胺基及苯基之化合物。尤佳者例如為4,4'-二甲基胺基二苯甲酮、4,4'-二乙基胺基二苯甲酮、2-胺基二苯甲酮、4-胺基二苯甲酮、4,4'-二胺基二苯甲酮、3,3'-二胺基二苯甲酮、3,4-二胺基二苯甲酮等二苯甲酮系化合物；2-(對二甲基胺基苯基)苯并㗁唑、2-(對二乙基胺基苯基)苯并㗁唑、2-(對二甲基胺基苯基)苯并[4,5]苯并㗁唑、2-(對二甲基胺基苯基)苯并[6,7]苯并㗁唑、2,5-雙(對二乙基胺基苯基)1,3,4-㗁唑、2-(對二甲基胺基苯基)苯并噻唑、2-(對二乙基胺基苯基)苯并噻唑、2-(對二甲基胺基苯基)苯并咪唑、2-(對二乙基胺基苯基)苯并咪唑、2,5-雙(對二乙基胺基苯基)1,3,4-噻二唑、(對二甲基胺基苯基)吡啶、(對二乙基胺基苯基)吡啶、(對二甲基胺基苯基)喹啉、(對二乙基胺基苯基)喹啉、(對二甲基胺基苯基)嘧啶、(對二乙基胺基苯基)嘧啶等含有對二烷基胺基苯基之化合物等。 其中，最佳者為4,4'-二烷基胺基二苯甲酮。 增感色素可單獨使用1種，亦可將2種以上併用。 關於(c)光聚合起始劑之含有比率，相對於本發明之感光性樹脂組合物之全部固形物成分，通常為0.1質量%以上，較佳為1質量%以上，更佳為2質量%以上，進而較佳為3質量%以上，尤佳為4質量%以上，又，通常為30質量%以下，較佳為20質量%以下，更佳為15質量%以下，進而較佳為10質量%以下，進而更佳為8質量%以下，尤佳為6質量%以下。藉由將(c)光聚合起始劑之含有比率設為上述下限值以上，存在可抑制氧阻聚之影響之傾向，又，藉由設為上述上限值以下，存在基板密接性變得良好之傾向。 (c)光聚合起始劑中之光聚合起始劑(c1)之含有比率並無特別限定，較佳為0.1質量%以上，更佳為1質量%以上，進而較佳為10質量%以上，進而更佳為20質量%以上，尤佳為30質量%以上，最佳為40質量%以上，又，較佳為99.9質量%以下，更佳為99質量%以下，進而較佳為90質量%以下，最佳為60質量%以下。藉由將光聚合起始劑(c1)之含有比率設為上述下限值以上，存在內部硬化性變得良好之傾向，又，藉由設為上述上限值以下，存在圖案之上部之硬化性變得良好之傾向。 (c)光聚合起始劑中之光聚合起始劑(c2)之含有比率並無特別限定，較佳為0.1質量%以上，更佳為1質量%以上，進而較佳為10質量%以上，最佳為40質量%以上，又，較佳為99.9質量%以下，更佳為99質量%以下，進而較佳為90質量%以下，進而更佳為80質量%以下，尤佳為60質量%以下。藉由將光聚合起始劑(c2)之含有比率設為上述下限值以上，存在圖案之上部之硬化性變得良好之傾向，又，藉由設為上述上限值以下，存在內部硬化性變得良好之傾向。 ＜(a)鹼可溶性樹脂＞ 本發明之感光性樹脂組合物包含(a)鹼可溶性樹脂。(a)鹼可溶性樹脂只要為如對塗佈感光性樹脂組合物並經乾燥獲得之塗膜進行曝光後，曝光部與非曝光部於鹼性顯影液中之溶解性發生變化者，則並無特別限定，較佳為具有羥基、羧基、磷酸基、磺酸基等酸性官能基之鹼可溶性樹脂，更佳為具有羧基之鹼可溶性樹脂。又，就硬化性之觀點而言，較佳為具有乙烯性不飽和基者，就硬化性與顯影性之觀點而言，更佳為具有乙烯性不飽和基與羧基之鹼可溶性樹脂。具體而言，可列舉具有羧基之環氧(甲基)丙烯酸酯樹脂或丙烯酸系共聚樹脂，作為較佳者，更具體而言，可列舉下述作為(A1-1)、(A1-2)、(A2-1)、(A2-2)、(A2-3)及(A2-4)所記載者，該等可使用1種或可使用2種以上。上述之中，尤其理想的是具有羧基之環氧(甲基)丙烯酸酯樹脂(A1-1)、(A1-2)。 具有羧基之環氧(甲基)丙烯酸酯樹脂係使環氧樹脂與α,β-不飽和單羧酸及/或於酯部分具有羧基之α,β-不飽和單羧酸酯之反應物中之經反應生成之羥基進而和多元酸及/或其無水物進行反應而獲得的樹脂。又，使羥基於與多元酸及/或其無水物反應前，先與具有2個以上之能夠和該羥基反應之取代基之化合物反應，其後再與多元酸及/或其無水物反應，如此獲得之樹脂亦包含於環氧(甲基)丙烯酸酯樹脂中。進而，使上述反應中獲得之樹脂之羧基與具有能夠進而和該羧基反應之官能基之化合物進行反應，如此獲得之樹脂亦包含於環氧(甲基)丙烯酸酯樹脂中。 如此，環氧(甲基)丙烯酸酯樹脂於化學結構中實質上不具有環氧基，且不限定於「(甲基)丙烯酸酯」，但由於以環氧樹脂作為原料，且「(甲基)丙烯酸酯」乃代表例，故而依照慣用命名為此。 作為具有羧基之環氧(甲基)丙烯酸酯樹脂，例如可列舉以下之環氧(甲基)丙烯酸酯樹脂(A1-1)及/或環氧(甲基)丙烯酸酯樹脂(A1-2)。 ＜環氧(甲基)丙烯酸酯樹脂(A1-1)＞ 藉由於環氧樹脂上加成α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯，進而與多元酸及/或其無水物進行反應而獲得之鹼可溶性樹脂。 ＜環氧(甲基)丙烯酸酯樹脂(A1-2)＞ 藉由於環氧樹脂上加成α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯，進而與多元醇、及多元酸及/或其無水物進行反應而獲得之鹼可溶性樹脂。 ＜環氧(甲基)丙烯酸酯樹脂(A1-1)＞ 所謂成為原料之環氧樹脂，亦包括藉由熱硬化而形成樹脂之前之原料化合物在內，作為該環氧樹脂，可自公知之環氧樹脂中適當選擇使用。又，環氧樹脂可採用使酚性化合物與表鹵醇反應而獲得之化合物。作為酚性化合物，較佳為具有2價以上之酚性羥基之化合物，可為單體亦可為聚合物。 作為環氧樹脂之種類，可較佳地使用甲酚酚醛清漆型環氧樹脂、苯酚酚醛清漆型環氧樹脂、雙酚A型環氧樹脂、雙酚F型環氧樹脂、三苯酚甲烷型環氧樹脂、聯苯酚醛清漆型環氧樹脂、萘酚醛清漆型環氧樹脂、作為二環戊二烯與苯酚或甲酚之加成聚合反應物和表鹵醇之反應生成物的環氧樹脂、含有金剛烷基之環氧樹脂、茀型環氧樹脂等，可較佳地使用如此於主鏈具有芳香族環者。 作為環氧樹脂之具體例，可較佳地使用：雙酚A型環氧樹脂(例如三菱化學公司製造之「jER(註冊商標。以下相同)828」、「jER1001」、「jER1002」、「jER1004」等)、藉由雙酚A型環氧樹脂之醇性羥基與表氯醇之反應所獲得之環氧樹脂(例如日本化藥公司製造之「NER-1302」(環氧當量323，軟化點76℃))、雙酚F型樹脂(例如三菱化學公司製造之「jER807」、「EP-4001」、「EP-4002」、「EP-4004」等)、藉由雙酚F型環氧樹脂之醇性羥基與表氯醇之反應所獲得之環氧樹脂(例如日本化藥公司製造之「NER-7406」(環氧當量350，軟化點66℃))、雙酚S型環氧樹脂、聯苯基縮水甘油醚(例如三菱化學公司製造之「YX-4000」)、苯酚酚醛清漆型環氧樹脂(例如日本化藥公司製造之「EPPN-201」，三菱化學公司製造之「EP-152」、「EP-154」，陶氏化學公司製造之「DEN-438」)、(鄰、間、對)甲酚酚醛清漆型環氧樹脂(例如日本化藥公司製造之「EOCN(註冊商標。以下相同)-102S」、「EOCN-1020」、「EOCN-104S」)、三縮水甘油基異氰尿酸酯(例如日產化學公司製造之「TEPIC(註冊商標)」)、三苯酚甲烷型環氧樹脂(例如日本化藥公司製造之「EPPN(註冊商標。以下相同)-501」、「EPPN-502」、「EPPN-503」)、脂環式環氧樹脂(Daicel公司製造之「Celloxide(註冊商標。以下相同)2021P」、「Celloxide EHPE」)、將由二環戊二烯與苯酚反應獲得之酚樹脂進行縮水甘油基化而獲得之環氧樹脂(例如DIC公司製造之「EXA-7200」、日本化藥公司製造之「NC-7300」)、下述通式(a1)〜(a5)所表示之環氧樹脂等。具體而言，作為下述通式(a1)所表示之環氧樹脂，可列舉日本化藥公司製造之「XD-1000」，作為下述通式(a2)所表示之環氧樹脂，可列舉日本化藥公司製造之「NC-3000」，作為下述通式(a4)所表示之環氧樹脂，可列舉新日鐵住金化學公司製造之「ESF-300」等。 [化15]

上述通式(a1)中，b11表示平均值，表示0〜10之數。R¹¹ 表示氫原子、鹵素原子、碳數1〜8之烷基、碳數3〜10之環烷基、苯基、萘基、或聯苯基。再者，1分子中存在之複數個R¹¹ 相互可相同亦可不同。 [化16]

上述通式(a2)中，b12表示平均值，表示0〜10之數。R²¹ 表示氫原子、鹵素原子、碳數1〜8之烷基、碳數3〜10之環烷基、苯基、萘基、或聯苯基。再者，1分子中存在之複數個R²¹ 相互可相同亦可不同。 [化17]

上述通式(a3)中，X表示下述通式(a3-1)或(a3-2)所表示之連結基。其中，分子結構中包含1個以上之金剛烷結構。b13表示2或3之整數。 [化18]

上述通式(a3-1)及(a3-2)中，R³¹ 〜R³⁴ 及R³⁵ 〜R³⁷ 分別獨立表示可具有取代基之金剛烷基、氫原子、可具有取代基之碳數1〜12之烷基、或可具有取代基之苯基。又，式中之*號表示(a3)中之鍵結部位。 [化19]

上述通式(a4)中，p及q分別獨立地表示0〜4之整數，R^{4 1} 及R⁴² 分別獨立表示碳數1〜20之烷基或鹵素原子。R⁴³ 及R⁴⁴ 分別獨立表示碳數1〜5之伸烷基。x及y分別獨立地表示0以上之整數。 [化20]

上述通式(a5)中，R⁵¹ 〜R⁵⁴ 分別獨立為氫原子、碳數1〜20之烷基、碳原子6〜20之芳基、或碳原子7〜20之芳烷基，R⁵⁵ 為碳數1〜20之烷基、碳數6〜20之芳基、或碳數7〜20之芳烷基，R^{5 6} 分別獨立為碳數1〜5之伸烷基。k為1〜5之整數，l為0〜13之整數，m分別獨立為0〜5之整數。 該等之中，較佳為使用通式(a1)〜(a5)之任一者所表示之環氧樹脂。 作為α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯，可列舉：(甲基)丙烯酸、丁烯酸、鄰/間/對乙烯基苯甲酸、(甲基)丙烯酸之α位鹵烷基、烷氧基、鹵素、硝基、氰基取代體等單羧酸，琥珀酸2-(甲基)丙烯醯氧基乙酯、己二酸2-(甲基)丙烯醯氧基乙酯、鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、六氫鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、順丁烯二酸2-(甲基)丙烯醯氧基乙酯、琥珀酸2-(甲基)丙烯醯氧基丙酯、己二酸2-(甲基)丙烯醯氧基丙酯、四氫鄰苯二甲酸2-(甲基)丙烯醯氧基丙酯、鄰苯二甲酸2-(甲基)丙烯醯氧基丙酯、順丁烯二酸2-(甲基)丙烯醯氧基丙酯、琥珀酸2-(甲基)丙烯醯氧基丁酯、己二酸2-(甲基)丙烯醯氧基丁酯、氫鄰苯二甲酸2-(甲基)丙烯醯氧基丁酯、鄰苯二甲酸2-(甲基)丙烯醯氧基丁酯、順丁烯二酸2-(甲基)丙烯醯氧基丁酯； 作為(甲基)丙烯酸酯，可列舉：於(甲基)丙烯酸上加成ε-己內酯、β-丙內酯、γ-丁內酯、δ-戊內酯等內酯類而於末端具有1個羥基之單體，或者 於如(甲基)丙烯酸羥基烷基酯之於末端具有1個羥基之單體、或如季戊四醇三(甲基)丙烯酸酯之於末端具有1個羥基之化合物上加成琥珀酸(酐)、鄰苯二甲酸(酐)、順丁烯二酸(酐)等酸(酐)而具有1個以上之乙烯性不飽和基且末端具有1個羧基之(甲基)丙烯酸酯等。又，亦可列舉(甲基)丙烯酸二聚物等。 該等之中，就感度方面而言，尤佳者為(甲基)丙烯酸。 作為於環氧樹脂上加成α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之方法，可採用公知方法。例如可於酯化觸媒之存在下，於50〜150℃之溫度下，使α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯與環氧樹脂進行反應。作為此處使用之酯化觸媒，可使用三乙胺、三甲胺、苄基二甲基胺、苄基二乙基胺等三級胺，氯化四甲基銨、氯化四乙基銨、氯化十二烷基三甲基銨等四級銨鹽等。 再者，環氧樹脂、α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯、及酯化觸媒均可單獨使用1種，亦可將2種以上併用。 關於α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之使用量，相對於環氧樹脂之環氧基1當量，較佳為0.5〜1.2當量之範圍，進而較佳為0.7〜1.1當量之範圍。 若α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之使用量為上述下限值以上，則存在不飽和基之導入量充分，後續與多元酸及/或其無水物之反應亦會充分，又，亦可抑制環氧基之殘存的傾向。另一方面，若該使用量為上述上限值以下，則存在可對α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯作為未反應物殘存而導致硬化特性變差之情況加以抑制的傾向。 作為多元酸及/或其無水物，可列舉選自順丁烯二酸、琥珀酸、伊康酸、鄰苯二甲酸、四氫鄰苯二甲酸、六氫鄰苯二甲酸、均苯四甲酸、偏苯三甲酸、二苯甲酮四羧酸、甲基六氫鄰苯二甲酸、內亞甲基四氫鄰苯二甲酸、氯菌酸、甲基四氫鄰苯二甲酸、聯苯基四羧酸、及該等之無水物等中之1種或2種以上。 較佳為順丁烯二酸、琥珀酸、伊康酸、鄰苯二甲酸、四氫鄰苯二甲酸、六氫鄰苯二甲酸、均苯四甲酸、偏苯三甲酸、聯苯基四羧酸、或該等之無水物。尤佳為四氫鄰苯二甲酸、聯苯基四羧酸、四氫鄰苯二甲酸酐、或聯苯基四羧酸二酐。 關於多元酸及/或其無水物之加成反應，亦可採用公知方法，於與α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯向環氧樹脂上之加成反應相同之條件下，繼續使之反應而可獲得目標物。關於多元酸及/或其無水物成分之加成量，較佳為如使所生成之含有羧基之環氧(甲基)丙烯酸酯樹脂之酸值成為10〜150 mgKOH/g之範圍的程度，更佳為如成為20〜140 mgKOH/g之範圍的程度。藉由將含有羧基之環氧(甲基)丙烯酸酯樹脂之酸值設為上述下限值以上，存在鹼性顯影性變得良好之傾向，藉由設為上述上限值以下，存在硬化性變得良好之傾向。 ＜(A1-1)樹脂之合成與對(A1-1)樹脂添加多元醇而導入有支鏈結構之(A1-2)樹脂之合成＞ 於上述(A1-1)樹脂之多元酸及/或其無水物之加成反應合成時，可添加三羥甲基丙烷、季戊四醇、二季戊四醇等多元醇，而製作導入有多支鏈結構者。 含有羧基之環氧(甲基)丙烯酸酯樹脂通常藉由如下方式獲得：對環氧樹脂與α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之反應物混合多元酸及/或其無水物後，或者對環氧樹脂與α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之反應物混合多元酸及/或其無水物及多元醇後，進行加溫。於該情形時，多元酸及/或其無水物與多元醇之混合順序並無特別限制。藉由加溫，於環氧樹脂與α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之反應物和多元醇之混合物中存在之任一個羥基上，多元酸及/或其無水物進行加成反應。 含有羧基之環氧(甲基)丙烯酸酯樹脂可單獨使用1種，亦可將2種以上之樹脂混合使用。 關於多元醇之使用量，就抑制增黏或凝膠化並可顯示出效果之觀點而言，相對於環氧樹脂成分與α,β-不飽和單羧酸或於酯部分具有羧基之α,β-不飽和單羧酸酯成分之反應物，通常為0.01〜0.5質量倍左右，較佳為0.02〜0.2質量倍左右。 如此獲得之環氧(甲基)丙烯酸酯樹脂(A1-1)、(A1-2)之酸值通常為10 mgKOH/g以上，較佳為50 mgKOH/g以上，更佳為70 mgKOH/g以上，進而較佳為90 mgKOH/g以上，又，較佳為200 mgKOH/g以下，更佳為150 mgKOH/g以下，進而較佳為120 mgKOH/g以下。藉由將上述樹脂之酸值設為上述下限值以上，存在顯影性變得良好之傾向，藉由設為上述上限值以下，存在可優化耐鹼性之傾向。 環氧(甲基)丙烯酸酯樹脂(A1-1)、(A1-2)之藉由凝膠滲透層析法(GPC)測定所測得之聚苯乙烯換算之重量平均分子量(Mw)較佳為1,000以上，更佳為1,500以上。又，較佳為20,000以下，更佳為15,000以下，進而較佳為10,000以下，進而更佳為8,000以下，尤佳為6,000以下。藉由將重量平均分子量(Mw)設為上述下限值以上，存在感度、塗膜強度、耐鹼性變得良好之傾向，藉由設為上述上限值以下，存在可優化顯影性或再溶解性之傾向。 ＜丙烯酸系共聚樹脂(A2-1)、(A2-2)、(A2-3)、(A2-4)＞ 作為丙烯酸系共聚樹脂，可使用例如日本專利特開平7-207211號公報、日本專利特開平8-259876號公報、日本專利特開平10-300922號公報、日本專利特開平11-140144號公報、日本專利特開平11-174224號公報、日本專利特開2000-56118號公報、日本專利特開2003-233179號公報、日本專利特開2007-270147號公報等各公報等中記載之各種高分子化合物，可較佳地列舉以下之(A2-1)〜(A2-4)之樹脂等，其中，尤佳為(A2-1)樹脂。 (A2-1)：對含環氧基之(甲基)丙烯酸酯與其他自由基聚合性單體之共聚物，於該共聚物所具有之環氧基之至少一部分加成不飽和一元酸而成的樹脂，或者於由該加成反應所生成之羥基之至少一部分加成多元酸酐而獲得的樹脂 (A2-2)：主鏈含有羧基之直鏈狀鹼可溶性樹脂 (A2-3)：於上述(A2-2)樹脂之羧基部分加成有含環氧基之不飽和化合物的樹脂 (A2-4)：(甲基)丙烯酸系樹脂 本發明之感光性樹脂組合物就感度之觀點而言，更佳為包含(A1-1)、(A1-2)、(A2-1)、(A2-3)之至少任一者作為含有乙烯性不飽和基之鹼可溶性樹脂。本發明之感光性樹脂組合物就表面硬化性之觀點而言，尤佳為包含作為環氧(甲基)丙烯酸酯樹脂之(A1-1)、(A1-2)之至少任一者作為含有乙烯性不飽和基之鹼可溶性樹脂。 本發明之感光性樹脂組合物可併用其他鹼可溶性樹脂。 其他鹼可溶性樹脂並無限制，選擇彩色濾光片用感光性樹脂組合物通常所使用之樹脂即可。例如可列舉：日本專利特開2007-271727號公報、日本專利特開2007-316620號公報、日本專利特開2007-334290號公報等中記載之鹼可溶性樹脂等。 關於(a)鹼可溶性樹脂之含有比率，相對於本發明之感光性樹脂組合物之全部固形物成分，通常為5質量%以上，較佳為10質量%以上，更佳為15質量%以上，進而較佳為20質量%以上，又，通常為90質量%以下，較佳為70質量%以下，更佳為50質量%以下，進而較佳為30質量%以下。藉由將(a)鹼可溶性樹脂之含有比率設為上述下限值以上，存在未曝光部於顯影液中之溶解性變得良好之傾向，又，藉由設為上述上限值以下，可抑制顯影液過度地向曝光部滲透，存在圖像之鮮明性或密接性變得良好之傾向。 再者，如上所述，本發明之感光性樹脂組合物較佳為包含上述(A1-1)、(A1-2)、(A2-1)、(A2-2)、(A2-3)及(A2-4)之至少1種作為(a)鹼可溶性樹脂，於包含其他鹼可溶性樹脂之情形時，其含有比率相對於(a)鹼可溶性樹脂之合計而為20質量%以下，較佳為10質量%以下。 ＜(b)光聚合性單體＞ 本發明之感光性樹脂組合物就感度等方面而言含有(b)光聚合性單體。 作為本發明中使用之(b)光聚合性單體，可列舉分子內具有至少1個乙烯性不飽和基之化合物(以下有時稱為「乙烯性單體」)。具體而言，例如可列舉：(甲基)丙烯酸、(甲基)丙烯酸烷基酯、丙烯腈、苯乙烯、及具有1個乙烯性不飽和鍵之羧酸與多元或一元醇之酯等。 本發明中，尤其理想的是使用1分子中具有2個以上之乙烯性不飽和基之多官能乙烯性單體。多官能乙烯性單體中之乙烯性不飽和基之數量通常為2個以上，較佳為3個以上，更佳為4個以上，進而較佳為5個以上，尤佳為6個以上，又，通常為10個以下，較佳為8個以下。藉由將乙烯性不飽和基之數量設為上述下限值以上，存在感光性樹脂組合物變為高感度之傾向，又，藉由設為上述上限值以下，存在聚合時之硬化收縮變小之傾向。 作為多官能乙烯性單體之例，例如可列舉：脂肪族聚羥基化合物與不飽和羧酸之酯；芳香族聚羥基化合物與不飽和羧酸之酯；藉由脂肪族聚羥基化合物或芳香族聚羥基化合物等多價羥基化合物、與不飽和羧酸及多元羧酸之酯化反應所獲得之酯等。 作為上述脂肪族聚羥基化合物與不飽和羧酸之酯，可列舉：乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、三羥甲基乙烷三丙烯酸酯、季戊四醇二丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇四丙烯酸酯、二季戊四醇五丙烯酸酯、二季戊四醇六丙烯酸酯、甘油丙烯酸酯等脂肪族聚羥基化合物之丙烯酸酯，將該等例示化合物之丙烯酸酯替換為甲基丙烯酸酯所得之甲基丙烯酸酯，同樣地替換為伊康酸酯所得之伊康酸酯、替換為丁烯酸酯所得之丁烯酸酯、或替換為順丁烯二酸酯所得之順丁烯二酸酯等。 作為芳香族聚羥基化合物與不飽和羧酸之酯，可列舉：對苯二酚二丙烯酸酯、對苯二酚二甲基丙烯酸酯、間苯二酚二丙烯酸酯、間苯二酚二甲基丙烯酸酯、鄰苯三酚三丙烯酸酯等芳香族聚羥基化合物之丙烯酸酯及甲基丙烯酸酯等。 藉由多元羧酸及不飽和羧酸、與多價羥基化合物之酯化反應所獲得之酯未必是單一物質，但若舉出代表性之具體例，則可列舉：丙烯酸、鄰苯二甲酸及乙二醇之縮合物，丙烯酸、順丁烯二酸及二乙二醇之縮合物，甲基丙烯酸、對苯二甲酸及季戊四醇之縮合物，丙烯酸、己二酸、丁二醇及甘油之縮合物等。 除此以外，作為本發明中使用之多官能乙烯性單體之例，有用的是如使聚異氰酸酯化合物與含羥基之(甲基)丙烯酸酯反應、或使聚異氰酸酯化合物與多元醇及含羥基之(甲基)丙烯酸酯反應而獲得之(甲基)丙烯酸胺基甲酸酯類；如多價環氧化合物與羥基(甲基)丙烯酸酯或(甲基)丙烯酸之加成反應物之環氧丙烯酸酯類；伸乙基雙丙烯醯胺等丙烯醯胺類；鄰苯二甲酸二烯丙酯等烯丙酯類；鄰苯二甲酸二乙烯酯等含乙烯基之化合物等。 該等可單獨使用1種，亦可將2種以上併用。 關於(b)光聚合性單體之含有比率，相對於感光性樹脂組合物之全部固形物成分，通常為90質量%以下，較佳為70質量%以下，更佳為50質量%以下，進而較佳為30質量%以下，進而更佳為20質量%以下，尤佳為10質量%以下。藉由光聚合性單體之含量為上述上限值以下，存在顯影液向曝光部之滲透性適度而可獲得良好圖像之傾向。(b)光聚合性單體之含量之下限值通常為1質量%以上，較佳為5質量%以上。藉由為上述下限值以上，存在促進藉由紫外線照射而進行之光硬化且鹼性顯影性亦變得良好之傾向。 本發明之感光性樹脂組合物中，(a)鹼可溶性樹脂之含有比率相對於(b)光聚合性單體之含有比率的質量比通常為0.5以上，較佳為1以上，更佳為2以上，進而較佳為2.5以上，又，通常為15以下，較佳為10以下，更佳為8以下，進而較佳為5以下。藉由設為上述下限值以上，存在硬化時之硬化收縮變小之傾向，又，藉由設為上述上限值以下，存在硬化膜之硬度變高之傾向。 ＜(d)色料＞ 本發明之感光性樹脂組合物於用於彩色濾光片之像素、黑矩陣、著色間隔件之形成等之情形時，含有色料。色料係指使本發明之感光性樹脂組合物著色者。作為色料，可使用染料或顏料，就耐熱性、耐光性等方面而言，較佳為顏料。 作為顏料，可使用藍色顏料、綠色顏料、紅色顏料、黃色顏料、紫色顏料、橙色顏料、棕色顏料、黑色顏料等各種顏色之顏料。又，作為其結構，可利用偶氮系、酞菁系、喹吖啶酮系、苯并咪唑酮系、異吲哚啉酮系、二㗁𠯤系、陰丹士林系、苝系等之有機顏料，除此以外，亦可利用各種無機顏料等。 以下，將本發明中可使用之顏料之具體例以顏料編號表示。再者，以下所列之「C.I.顏料紅2」等用語意指色指數(C.I.)。 作為紅色顏料，可列舉：C.I.顏料紅1、2、3、4、5、6、7、8、9、12、14、15、16、17、21、22、23、31、32、37、38、41、47、48、48：1、48：2、48：3、48：4、49、49：1、49：2、50：1、52：1、52：2、53、53：1、53：2、53：3、57、57：1、57：2、58：4、60、63、63：1、63：2、64、64：1、68、69、81、81：1、81：2、81：3、81：4、83、88、90：1、101、101：1、104、108、108：1、109、112、113、114、122、123、144、146、147、149、151、166、168、169、170、172、173、174、175、176、177、178、179、181、184、185、187、188、190、193、194、200、202、206、207、208、209、210、214、216、220、221、224、230、231、232、233、235、236、237、238、239、242、243、245、247、249、250、251、253、254、255、256、257、258、259、260、262、263、264、265、266、267、268、269、270、271、272、273、274、275、276。其中，可較佳地列舉：C.I.顏料紅48：1、122、168、177、202、206、207、209、224、242、254，可更佳地列舉：C.I.顏料紅177、209、224、254。 作為藍色顏料，可列舉：C.I.顏料藍1、1：2、9、14、15、15：1、15：2、15：3、15：4、15：6、16、17、19、25、27、28、29、33、35、36、56、56：1、60、61、61：1、62、63、66、67、68、71、72、73、74、75、76、78、79。其中，可較佳地列舉：C.I.顏料藍15、15：1、15：2、15：3、15：4、15：6，可更佳地列舉：C.I.顏料藍15：6。 作為綠色顏料，可列舉：C.I.顏料綠1、2、4、7、8、10、13、14、15、17、18、19、26、36、45、48、50、51、54、55、58。其中，可較佳地列舉：C.I.顏料綠7、36、58。 作為黃色顏料，可列舉：C.I.顏料黃1、1：1、2、3、4、5、6、9、10、12、13、14、16、17、24、31、32、34、35、35：1、36、36：1、37、37：1、40、41、42、43、48、53、55、61、62、62：1、63、65、73、74、75、81、83、87、93、94、95、97、100、101、104、105、108、109、110、111、116、117、119、120、126、127、127：1、128、129、133、134、136、138、139、142、147、148、150、151、153、154、155、157、158、159、160、161、162、163、164、165、166、167、168、169、170、172、173、174、175、176、180、181、182、183、184、185、188、189、190、191、191：1、192、193、194、195、196、197、198、199、200、202、203、204、205、206、207、208。其中，可較佳地列舉：C.I.顏料黃83、117、129、138、139、150、154、155、180、185，可更佳地列舉：C.I.顏料黃83、138、139、150、180。 作為橙色顏料，可列舉：C.I.顏料橙1、2、5、13、16、17、19、20、21、22、23、24、34、36、38、39、43、46、48、49、61、62、64、65、67、68、69、70、71、72、73、74、75、77、78、79。其中，可較佳地列舉：C.I.顏料橙38、71。 作為紫色顏料，可列舉：C.I.顏料紫1、1：1、2、2：2、3、3：1、3：3、5、5：1、14、15、16、19、23、25、27、29、31、32、37、39、42、44、47、49、50。其中，可較佳地列舉：C.I.顏料紫19、23，可更佳地列舉：C.I.顏料紫23。 又，於本發明之感光性樹脂組合物為彩色濾光片之樹脂黑矩陣用感光性樹脂組合物之情形時，作為(d)色料，可使用黑色之色料。黑色色料可採用單獨之黑色色料，亦可採用紅色、綠色、藍色等之混合。又，該等色料可自無機或有機之顏料、染料之中適當選擇。 作為能夠混合用於製備黑色色料之色料，可列舉：維多利亞藍(42595)、金黃胺O(41000)、Cathilon Brilliant Flavine(鹼性黃13)、玫瑰紅6GCP(45160)、玫瑰紅B(45170)、番紅OK70：100(50240)、羊毛罌紅X(42080)、No.120/雷奧諾爾黃(21090)、雷奧諾爾黃GRO(21090)、斯姆勒堅牢黃8GF(21105)、聯苯胺黃4T-564D(21095)、斯姆勒堅牢紅4015(12355)、雷奧諾爾紅7B4401(15850)、Fastogen藍TGR-L(74160)、雷奧諾爾藍SM(26150)、雷奧諾爾藍ES(顏料藍15：6)、Lionogen紅GD(顏料紅168)、雷奧諾爾綠2YS(顏料綠36)等(再者，上述()內之數字意指色指數(C.I.))。 又，進而關於其他之能夠混合使用之顏料，若以C.I.編號表示，例如可列舉：C.I.黃色顏料20、24、86、93、109、110、117、125、137、138、147、148、153、154、166，C.I.橙色顏料36、43、51、55、59、61，C.I.紅色顏料9、97、122、123、149、168、177、180、192、215、216、217、220、223、224、226、227、228、240，C.I.紫色顏料19、23、29、30、37、40、50，C.I.藍色顏料15、15：1、15：4、22、60、64，C.I.綠色顏料7，C.I.棕色顏料23、25、26等。 又，作為能夠單獨使用之黑色色料，可列舉：碳黑、乙炔黑、燈黑、骨黑、石墨、鐵黑、苯胺黑、花青黑、鈦黑、苝黑、內醯胺黑等。 該等(d)色料之中，於使用黑色色料之情形時，就遮光率、圖像特性之觀點而言，較佳為碳黑。作為碳黑之例，可列舉如下碳黑。 三菱化學公司製造：MA7、MA77、MA8、MA11、MA100、MA100R、MA220、MA230、MA600、#5、#10、#20、#25、#30、#32、#33、#40、#44、#45、#47、#50、#52、#55、#650、#750、#850、#950、#960、#970、#980、#990、#1000、#2200、#2300、#2350、#2400、#2600、#3050、#3150、#3250、#3600、#3750、#3950、#4000、#4010、OIL7B、OIL9B、OIL11B、OIL30B、OIL31B Degussa公司製造：Printex(註冊商標；以下相同)3、Printex 3OP、Printex 30、Printex 30OP、Printex 40、Printex 45、Printex 55、Printex 60、Printex 75、Printex 80、Printex 85、Printex 90、Printex A、Printex L、Printex G、Printex P、Printex U、Printex V、Printex G、Special Black 550、Special Black 350、Special Black 250、Special Black 100、Special Black 6、Special Black 5、Special Black 4、Color Black FW1、Color Black FW2、Color Black FW2V、Color Black FW18、Color Black FW18、Color Black FW200、Color Black S160、Color Black S170 Cabot公司製造：Monarch(註冊商標；以下相同)120、Monarch280、Monarch460、Monarch800、Monarch880、Monarch900、Monarch1000、Monarch1100、Monarch1300、Monarch1400、Monarch4630、REGAL(註冊商標；以下相同)99、REGAL99R、REGAL415、REGAL415R、REGAL250、REGAL250R、REGAL330、REGAL400R、REGAL55R0、REGAL660R、BLACK PEARLS480、PEARLS130、VULCAN(註冊商標)XC72R、ELFTEX(註冊商標)-8 BIRLA公司製造：RAVEN11、RAVEN14、RAVEN15、RAVEN16、RAVEN22、RAVEN30、RAVEN35、RAVEN40、RAVEN410、RAVEN420、RAVEN450、RAVEN500、RAVEN780、RAVEN850、RAVEN890H、RAVEN1000、RAVEN1020、RAVEN1040、RAVEN1060U、RAVEN1080U、RAVEN1170、RAVEN1190U、RAVEN1250、RAVEN1500、RAVEN2000、RAVEN2500U、RAVEN3500、RAVEN5000、RAVEN5250、RAVEN5750、RAVEN7000 作為其他之黑色顏料之例，可使用鈦黑、苯胺黑、氧化鐵系黑色顏料，又，可將紅色、綠色、藍色三色之有機顏料混合而作為黑色顏料使用。 又，亦可使用硫酸鋇、硫酸鉛、氧化鈦、黃丹、鐵丹、氧化鉻等作為顏料。該等各種顏料亦可併用複數種。例如為了調整色度，可將綠色顏料與黃色顏料併用、或將藍色顏料與紫色顏料併用。 作為本發明中使用之顏料之平均粒徑，於製成彩色濾光片之著色層之情形時，只要能夠進行所需之顯色即可，並無特別限定，根據所使用顏料之種類而不同，較佳為10〜100 nm之範圍內，更佳為10〜70 nm之範圍內。藉由使該顏料之平均粒徑為上述範圍，存在使用本發明之感光性樹脂組合物所製造之液晶顯示裝置可實現高品質之色特性之傾向。 又，顏料為碳黑之情形時之平均粒徑較佳為60 nm以下，進而較佳為50 nm以下，又，較佳為20 nm以上。藉由將平均粒徑設為上述上限值以下，存在散射變小，可抑制遮光性或對比度等色特性之降低之傾向。又，藉由將平均粒徑設為上述下限值以上，存在避免分散劑之量過多，分散性變得良好之傾向。 再者，上述顏料之平均粒徑可藉由從電子顯微鏡照片直接測量一次粒子之大小之方法求出。具體而言，測量各個一次粒子之短軸徑與長軸徑，將其平均值作為該粒子之粒徑。繼而，針對100個以上之粒子，近似為所求出之粒徑之長方體而求出各粒子之體積(質量)，並求出體積平均粒徑，將其作為平均粒徑。再者，電子顯微鏡無論使用穿透式(TEM)或掃描式(SEM)，均可獲得相同結果。 又，本發明之感光性樹脂組合物較佳為至少包含顏料，此外，亦可於不影響本發明之效果之範圍內併用染料。作為可併用之染料，可列舉：偶氮系染料、蒽醌系染料、酞菁系染料、醌亞胺系染料、喹啉系染料、硝基系染料、羰基系染料、次甲基系染料等。 作為偶氮系染料，例如可列舉：C.I.酸性黃11、C.I.酸性橙7、C.I.酸性紅37、C.I.酸性紅180、C.I.酸性藍29、C.I.直接紅28、C.I.直接紅83、C.I.直接黃12、C.I.直接橙26、C.I.直接綠28、C.I.直接綠59、C.I.反應黃2、C.I.反應紅17、C.I.反應紅120、C.I.反應黑5、C.I.分散橙5、C.I.分散紅58、C.I.分散藍165、C.I.鹼性藍41、C.I.鹼性紅18、C.I.媒染紅7、C.I.媒染黃5、C.I.媒染黑7等。 作為蒽醌系染料，例如可列舉：C.I.還原藍4、C.I.酸性藍40、C.I.酸性綠25、C.I.反應藍19、C.I.反應藍49、C.I.分散紅60、C.I.分散藍56、C.I.分散藍60等。 另外，作為酞菁系染料，例如可列舉：C.I.還原藍5等，作為醌亞胺系染料，例如可列舉：C.I.鹼性藍3、C.I.鹼性藍9等，作為喹啉系染料，例如可列舉：C.I.溶劑黃33、C.I.酸性黃3、C.I.分散黃64等，作為硝基系染料，例如可列舉：C.I.酸性黃1、C.I.酸性橙3、C.I.分散黃42等。 關於(d)色料之含有比率，相對於感光性樹脂組合物中之全部固形物成分量，通常可於1〜70質量%之範圍內選擇。於該範圍之中，更佳為20質量%以上，進而較佳為30質量%以上，尤佳為40質量%以上，又，更佳為60質量%以下。 本發明之感光性樹脂組合物如上所述可用於各種用途，但優異之圖像形成性係於用於形成彩色濾光片用黑矩陣之情形時特別有效。於用於形成黑矩陣之情形時，作為(d)色料，使用上述碳黑或鈦黑等黑色色料，或將黑色以外之複數種色料混合而調整成黑色使用即可。其中，就分散穩定性及遮光性之觀點而言，尤佳為使用碳黑。 本發明尤其於黑色顏料之顏料濃度變大之區域中效果較明顯。特別是近年來，必須增大黑色顏料濃度以提高遮光度。關於如此效果變明顯之區域中之黑色顏料之含有比率，相對於感光性樹脂組合物之全部固形物成分而為40質量%以上，較佳為45質量%以上，更佳為50質量%以上。 藉由感光性樹脂組合物中之黑色顏料之含有比率為上述範圍內，可獲得遮光性(光學密度、OD值)較高之感光性樹脂組合物。具體而言，藉由將黑色顏料之含量設為45質量%以上，使用本發明之感光性樹脂組合物形成厚度1 μm之黑矩陣之情形時之光學濃度可成為4.0以上之值。光學濃度更佳為4.2以上。於遮光性較高之區域，紫外線不易透射至深部，由光聚合引起之交聯尤其於基板與細線之密接部分變弱，但於使用本發明之感光性樹脂組合物之情形時，尤其於該黑色顏料之含有比率較大之情形時，可顯著地確認到本發明之效果。黑色顏料之含有比率為40〜65質量%時特別有效。藉由將黑色顏料之含有比率設為上述下限值以上，存在可抑制相對於色濃度之膜厚變得過大之傾向，又，藉由設為上述上限值以下，存在容易確保充分之圖像形成性之傾向。 再者，感光性樹脂組合物中，關於(d)色料之含有比率，相對於(a)鹼可溶性樹脂100質量份，通常為20質量份以上，較佳為30質量份以上，更佳為40質量份以上，進而較佳為60質量份以上，進而更佳為80質量份以上，尤佳為120質量份以上，最佳為160質量份以上，又，通常為500質量份以下，較佳為300質量份以下，更佳為280質量份以下。藉由將(d)色料之含有比率設為上述下限值以上，存在容易抑制未曝光部於顯影液中之溶解性之降低之傾向，又，藉由設為上述上限值以下，存在容易獲得所需之圖像膜厚之傾向。 ＜(e)分散劑＞ 本發明中，色料微細地分散、且其分散狀態之穩定化對於確保品質之穩定性而言較重要，因此較佳為包含(e)分散劑。 作為分散劑，較佳為具有官能基之高分子分散劑，進而就分散穩定性之方面而言，較佳為具有羧基，磷酸基、磺酸基、或該等之鹽基，一級、二級或三級胺基，四級銨鹽基，源自吡啶、嘧啶、吡𠯤等含氮雜環之基等官能基的高分子分散劑。其中，尤佳為特別是具有一級、二級或三級胺基，四級銨鹽基，源自吡啶、嘧啶、吡𠯤等含氮雜環之基等鹼性官能基的高分子分散劑。藉由使用該等具有鹼性官能基之高分子分散劑，存在可優化分散性、可達成較高遮光性之傾向。 又，作為高分子分散劑，例如可列舉：胺基甲酸酯系分散劑、丙烯酸系分散劑、聚伸乙基亞胺系分散劑、聚烯丙胺系分散劑、包含具有胺基之單體與巨單體之分散劑、聚氧乙烯烷基醚系分散劑、聚氧乙烯二酯系分散劑、聚醚磷酸系分散劑、聚酯磷酸系分散劑、山梨醇酐脂肪族酯系分散劑、脂肪族改性聚酯系分散劑等。 作為上述分散劑之具體例，以商品名表示，可列舉：EFKA(註冊商標。EFKA-Chemicals B.V.(EFKA)公司製造)、Disperbyk(註冊商標。BYK-Chemie公司製造)、Disbaron(註冊商標。楠本化成公司製造)、SOLSPERSE(註冊商標。Lubrizol公司製造)、KP(信越化學工業公司製造)、Polyflow或Flowlen(註冊商標。共榮社化學公司製造)、Ajisper(註冊商標。Ajinomoto Fine-Techno公司製造)等。 該等高分子分散劑可單獨使用1種，亦可將2種以上併用。 該等之中，就密接性及直線性之方面而言，(e)分散劑尤佳為包含具有鹼性官能基之胺基甲酸酯系高分子分散劑及/或丙烯酸系高分子分散劑。尤其是胺基甲酸酯系高分子分散劑於密接性方面而言較佳。又，就分散性、保存性之方面而言，較佳為具有鹼性官能基、且具有聚酯及/或聚醚鍵之高分子分散劑。 高分子分散劑之重量平均分子量(Mw)通常為700以上，較佳為1,000以上，又，通常為100,000以下，較佳為50,000以下，更佳為30,000以下。藉由將重量平均分子量(Mw)設為上述上限值以下，存在即便於顏料濃度較高時鹼性顯影性亦良好之傾向。 作為胺基甲酸酯系及丙烯酸系高分子分散劑，例如可列舉：DISPERBYK-160〜167、182系列(均為胺基甲酸酯系)，DISPERBYK-2000、2001等(均為丙烯酸系)(以上全部由BYK-Chemie公司製造)。上述具有鹼性官能基、且具有聚酯及/或聚醚鍵之胺基甲酸酯系高分子分散劑之中，作為重量平均分子量30,000以下之尤佳者，可列舉：DISPERBYK-167、182等。 ＜胺基甲酸酯系高分子分散劑＞ 若具體地例示作為胺基甲酸酯系高分子分散劑較佳之化學結構，則例如可列舉藉由使聚異氰酸酯化合物、分子內具有1個或2個羥基之數量平均分子量300〜10,000之化合物、及同一分子內具有活性氫與三級胺基之化合物進行反應而獲得之重量平均分子量1,000〜200,000之分散樹脂等。 作為上述聚異氰酸酯化合物之例，可列舉：對苯二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、萘-1,5-二異氰酸酯、二異氰酸聯甲苯胺等芳香族二異氰酸酯，六亞甲基二異氰酸酯、離胺酸甲酯二異氰酸酯、2,4,4-三甲基六亞甲基二異氰酸酯、二聚物酸二異氰酸酯等脂肪族二異氰酸酯，異佛爾酮二異氰酸酯、4,4'-亞甲基雙(異氰酸環己酯)、ω,ω'-二異氰酸基二甲基環己烷等脂環族二異氰酸酯，苯二甲基二異氰酸酯、α,α,α',α'-四甲基苯二甲基二異氰酸酯等具有芳香環之脂肪族二異氰酸酯，離胺酸酯三異氰酸酯、1,6,11-十一烷三異氰酸酯、1,8-二異氰酸基-4-異氰酸基甲基辛烷、1,3,6-六亞甲基三異氰酸酯、聯環庚烷三異氰酸酯、三(異氰酸基苯基甲烷)、硫代磷酸三(異氰酸基苯基)酯等三異氰酸酯，及該等之三聚物、水加成物、及該等之多元醇加成物等。作為聚異氰酸酯，較佳為有機二異氰酸酯之三聚物，最佳為甲苯二異氰酸酯之三聚物與異佛爾酮二異氰酸酯之三聚物。該等可單獨使用1種，亦可將2種以上併用。 作為異氰酸酯之三聚物之製造方法，可列舉如下方法：對於上述聚異氰酸酯類，使用適宜之三聚化觸媒、例如三級胺類、膦類、烷氧化物類、金屬氧化物、羧酸鹽類等而進行異氰酸基之部分三聚化，藉由添加觸媒毒而中止三聚化後，藉由溶劑萃取、薄膜蒸餾而去除未反應之聚異氰酸酯，從而獲得目標之含異氰尿酸基之聚異氰酸酯。 作為同一分子內具有1個或2個羥基之數量平均分子量300〜10,000之化合物，可列舉：聚醚二醇、聚酯二醇、聚碳酸酯二醇、聚烯烴二醇等、及利用碳數1〜25之烷基將該等化合物之一末端羥基進行烷氧基化所得者、及該等2種以上之混合物。 作為聚醚二醇，可列舉：聚醚二醇(diol)、聚醚酯二醇(diol)、及該等2種以上之混合物。作為聚醚二醇(diol)，可列舉使環氧烷進行均聚或共聚所得者，例如聚乙二醇、聚丙二醇、聚乙二醇丙二醇、聚氧四亞甲基二醇、聚氧六亞甲基二醇、聚氧八亞甲基二醇及該等2種以上之混合物。 作為聚醚酯二醇(diol)，可列舉：使含醚基之二醇(diol)或和其他二醇之混合物與二羧酸或該等之無水物反應所獲得者、或者使聚酯二醇與環氧烷反應所獲得者，例如聚(聚氧四亞甲基)己二酸酯等。作為聚醚二醇最佳的是聚乙二醇、聚丙二醇、聚氧四亞甲基二醇或利用碳數1〜25之烷基將該等化合物之一末端羥基進行烷氧基化所得之化合物。 作為聚酯二醇，可列舉使二羧酸(琥珀酸、戊二酸、己二酸、癸二酸、反丁烯二酸、順丁烯二酸、鄰苯二甲酸等)或該等之無水物與二醇(乙二醇、二乙二醇、三乙二醇、丙二醇、二丙二醇、三丙二醇、1,2-丁二醇、1,3-丁二醇、1,4-丁二醇、2,3-丁二醇、3-甲基-1,5-戊二醇(diol)、新戊二醇、2-甲基-1,3-丙二醇(diol)、2-甲基-2-丙基-1,3-丙二醇(diol)、2-丁基-2-乙基-1,3-丙二醇(diol)、1,5-戊二醇(diol)、1,6-己二醇(diol)、2-甲基-2,4-戊二醇、2,2,4-三甲基-1,3-戊二醇(diol)、2-乙基-1,3-己二醇(diol)、2,5-二甲基-2,5-己二醇(diol)、1,8-八亞甲基二醇、2-甲基-1,8-八亞甲基二醇、1,9-壬二醇(diol)等脂肪族二醇，雙羥基甲基環己烷等脂環族二醇，苯二甲醇、雙羥基乙氧基苯等芳香族二醇，N-甲基二乙醇胺等N-烷基二烷醇胺等)進行縮聚所獲得者，例如聚己二酸乙二酯、聚己二酸丁二酯、聚六亞甲基己二酸酯、聚乙二醇丙二醇己二酸酯等；或可列舉使用上述二醇(diol)類或碳數1〜25之一元醇作為起始劑所獲得之聚內酯二醇(diol)或聚內酯單醇，例如聚己內酯二醇、聚甲基戊內酯及該等之2種以上之混合物。作為聚酯二醇最佳的是聚己內酯二醇或以碳數1〜25之醇作為起始劑所得之聚己內酯。 作為聚碳酸酯二醇，可列舉：聚(1,6-伸己基)碳酸酯、聚(3-甲基-1,5-伸戊基)碳酸酯等，作為聚烯烴二醇，可列舉：聚丁二烯二醇、氫化型聚丁二烯二醇、氫化型聚異戊二烯二醇等。 該等可單獨使用1種，亦可將2種以上併用。 同一分子內具有1個或2個羥基之化合物之數量平均分子量通常為300〜10,000，較佳為500〜6,000，進而較佳為1,000〜4,000。 對本發明中使用之同一分子內具有活性氫與三級胺基之化合物進行說明。作為活性氫，即直接鍵結於氧原子、氮原子或硫原子上之氫原子，可列舉羥基、胺基、硫醇基等官能基中之氫原子，其中，較佳為胺基、尤其是一級胺基之氫原子。 三級胺基並無特別限定，例如可列舉：具有碳數1〜4之烷基之胺基，或者雜環結構、更具體而言咪唑環或三唑環等。 若例示此種同一分子內具有活性氫與三級胺基之化合物，則可列舉：N,N-二甲基-1,3-丙二胺、N,N-二乙基-1,3-丙二胺、N,N-二丙基-1,3-丙二胺、N,N-二丁基-1,3-丙二胺、N,N-二甲基乙二胺、N,N-二乙基乙二胺、N,N-二丙基乙二胺、N,N-二丁基乙二胺、N,N-二甲基-1,4-丁二胺、N,N-二乙基-1,4-丁二胺、N,N-二丙基-1,4-丁二胺、N,N-二丁基-1,4-丁二胺等。 又，作為三級胺基為含氮雜環結構之情形時之該含氮雜環，可列舉：吡唑環、咪唑環、三唑環、四唑環、吲哚環、咔唑環、吲唑環、苯并咪唑環、苯并三唑環、苯并㗁唑環、苯并噻唑環、苯并噻二唑環等含氮雜5員環，吡啶環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、吖啶環、異喹啉環等含氮雜6員環。該等含氮雜環中之較佳者為咪唑環或三唑環。 若具體地例示該等具有咪唑環與胺基之化合物，則可列舉：1-(3-胺基丙基)咪唑、組胺酸、2-胺基咪唑、1-(2-胺基乙基)咪唑等。又，若具體地例示具有三唑環與胺基之化合物，則可列舉：3-胺基-1,2,4-三唑、5-(2-胺基-5-氯苯基)-3-苯基-1H-1,2,4-三唑、4-胺基-4H-1,2,4-三唑-3,5-二醇、3-胺基-5-苯基-1H-1,3,4-三唑、5-胺基-1,4-二苯基-1,2,3-三唑、3-胺基-1-苄基-1H-2,4-三唑等。其中，較佳為N,N-二甲基-1,3-丙二胺、N,N-二乙基-1,3-丙二胺、1-(3-胺基丙基)咪唑、3-胺基-1,2,4-三唑。 該等可單獨使用1種，亦可將2種以上併用。 關於製造胺基甲酸酯系高分子分散劑時之原料之較佳之調配比率，相對於聚異氰酸酯化合物100質量份，同一分子內具有1個或2個羥基之數量平均分子量300〜10,000之化合物為10〜200質量份，較佳為20〜190質量份，進而較佳為30〜180質量份；同一分子內具有活性氫與三級胺基之化合物為0.2〜25質量份，較佳為0.3〜24質量份。 胺基甲酸酯系高分子分散劑之製造係依據製造聚胺基甲酸酯樹脂之公知方法進行。作為製造時之溶劑，通常可使用：丙酮、甲基乙基酮、甲基異丁基酮、環戊酮、環己酮、異佛爾酮等酮類，乙酸乙酯、乙酸丁酯、乙酸溶纖劑等酯類，苯、甲苯、二甲苯、己烷等烴類，二丙酮醇、異丙醇、第二丁醇、第三丁醇等一部分醇類，二氯甲烷、氯仿等氯化物，四氫呋喃、二乙醚等醚類，二甲基甲醯胺、N-甲基吡咯啶酮、二甲基亞碸等非質子性極性溶劑等。該等可單獨使用1種，亦可將2種以上併用。 於上述製造時，通常使用胺基甲酸酯化反應觸媒。作為該觸媒，例如可列舉：二月桂酸二丁基錫、二月桂酸二辛基錫、二辛酸二丁基錫、辛酸亞錫等錫系，乙醯丙酮酸鉄、氯化鐵等鉄系，三基胺、三乙二胺等三級胺系等中之1種或2種以上。 ＜胺值之測定方法＞ 分散劑之三級胺值係由與分散劑試樣中除溶劑以外之固形物成分每1 g之鹼量當量之KOH之質量表示，可藉由如下方法測定。 精確稱取0.5〜1.5 g分散劑試樣置於100 mL之燒杯內，利用50 mL之乙酸使之溶解。使用具備pH電極之自動滴定裝置，將該溶液利用0.1 mol/L之HClO₄ (過氯酸)乙酸溶液進行中和滴定。以滴定pH曲線之反曲點作為滴定終點，根據下式求出胺值。 胺值[mgKOH/g]＝(561×V)/(W×S) [其中，W表示分散劑試樣稱取量[g]，V表示滴定終點時之滴定量[mL]，S表示分散劑試樣之固形物成分濃度[質量%]] 同一分子內具有活性氫與三級胺基之化合物之導入量較佳為控制為以反應後之胺值計1〜100 mgKOH/g之範圍。更佳為5〜95 mgKOH/g之範圍。胺值係利用酸中和滴定鹼性胺基時與酸值對應之以KOH之mg數表示的值。藉由將胺值設為上述下限值以上，存在分散能力變得良好之傾向，又，藉由設為上述上限值以下，存在顯影性變得良好之傾向。 再者，於以上之反應中高分子分散劑殘存異氰酸基之情形時，若進而利用醇或胺基化合物消除異氰酸基，則生成物之經時穩定性變高，因此較佳。 胺基甲酸酯系高分子分散劑之重量平均分子量(Mw)通常為1,000〜200,000，較佳為2,000〜100,000，更佳為3,000〜50,000之範圍。胺基甲酸酯系高分子分散劑之重量平均分子量(Mw)尤佳為30,000以下。藉由將重量平均分子量(Mw)設為上述下限值以上，存在分散性及分散穩定性變得良好之傾向，藉由設為上述上限值以下，存在溶解性變得良好、分散性亦變得良好之傾向。若分子量為30,000以下，則尤其即便於顏料濃度較高之情形時，亦存在鹼性顯影性變得良好之傾向。作為此種尤佳之市售之胺基甲酸酯分散劑之例，可列舉：DISPERBYK-167、182(BYK-Chemie公司)等。 關於(e)分散劑之含有比率，於感光性樹脂組合物之全部固形物成分中，通常為50質量%以下，較佳為30質量%以下，更佳為20質量%以下，進而較佳為15質量%以下，尤佳為10質量%以下，又，通常為1質量%以上，較佳為3質量%以上，更佳為5質量%以上，進而較佳為7質量%以上。又，關於分散劑之含有比率，相對於(d)色料100質量份，通常為5質量份以上，較佳為10質量份以上，又，通常為200質量份以下，較佳為80質量份以下，更佳為50質量份以下，進而較佳為30質量份以下，尤佳為20質量份以下。藉由將分散劑之含有比率設為上述下限值以上，存在容易確保充分之分散性之傾向，又，藉由設為上述上限值以下，存在不會使其他成分之比率減小，容易實現充分之色濃度、感度、成膜性等之傾向。 作為分散劑，尤佳為將高分子分散劑與顏料衍生物(分散助劑)併用，於該情形時，顏料衍生物之含有比率係相對於本發明之感光性樹脂組合物之全部固形物成分，通常為0.1質量%以上，較佳為0.5質量%以上，又，通常為10質量%以下，較佳為5質量%以下，更佳為2質量%以下。 ＜硫醇類＞ 本發明之感光性樹脂組合物為了實現高感度化、提高對基板之密接性，較佳為含有硫醇類。作為硫醇類之種類，可列舉：己二硫醇、癸二硫醇、1,4-二甲基巰基苯、丁二醇雙硫基丙酸酯、丁二醇雙硫基乙醇酸酯、乙二醇雙硫基乙醇酸酯、三羥甲基丙烷三硫基乙醇酸酯、丁二醇雙硫基丙酸酯、三羥甲基丙烷三硫基丙酸酯、三羥甲基丙烷三硫基乙醇酸酯、季戊四醇四硫基丙酸酯、季戊四醇四硫基乙醇酸酯、三羥基乙基三硫基丙酸酯、乙二醇雙(3-巰基丁酸酯)、丙二醇雙(3-巰基丁酸酯)(簡記為PGMB)、丁二醇雙(3-巰基丁酸酯)、1,4-雙(3-巰基丁醯氧基)丁烷(商品名：KarenzMT BD1，昭和電工股份有限公司製造)、丁二醇三羥甲基丙烷三(3-巰基丁酸酯)、季戊四醇四(3-巰基丁酸酯)(商品名：KarenzMT PE1，昭和電工股份有限公司製造)、季戊四醇三(3-巰基丁酸酯)、乙二醇雙(3-巰基異丁酸酯)、丁二醇雙(3-巰基異丁酸酯)、三羥甲基丙烷三(3-巰基異丁酸酯)、三羥甲基丙烷三(3-巰基丁酸酯)(簡記為TPMB)、三羥甲基丙烷三(2-巰基異丁酸酯)(簡記為TPMIB)、1,3,5-三(3-巰基丁氧基乙基)-1,3,5-三𠯤-2,4,6(1H,3H,5H)-三酮(商品名：KarenzMT NR1，昭和電工股份有限公司製造)等；該等各者可單獨使用1種，亦可將2種以上混合使用。較佳為上述PGMB、TPMB、TPMIB、KarenzMT BD1、KarenzMT PE1、KarenzMT NR1等多官能硫醇，其中，進而較佳為KarenzMT BD1、KarenzMT PE1、KarenzMT NR1，尤佳為KarenzMT PE1。 於使用硫醇化合物之情形時，關於硫醇化合物之含有比率，相對於本發明之感光性樹脂組合物之全部固形物成分，通常為0.1質量%以上，較佳為0.3質量%以上，進而較佳為0.5質量%以上，又，通常為10質量%以下，較佳為5質量%以下。藉由將硫醇化合物之含有比率設為上述下限值以上，存在可抑制感度低下之傾向，藉由設為上述上限值以下，存在容易優化保存穩定性之傾向。 ＜溶劑＞ 本發明之感光性樹脂組合物通常係以將(a)鹼可溶性樹脂、(b)光聚合性單體、(c)光聚合起始劑、(d)色料、及視需要使用之各種材料溶解或分散於有機溶劑之狀態使用。 作為有機溶劑，較佳為選擇沸點(壓力1013.25[hPa]條件下。以下，關於沸點均相同)為100〜300℃之範圍者。更佳為具有120〜280℃之沸點之溶劑。 作為此種有機溶劑，例如可列舉如下者。 乙二醇單甲醚、乙二醇單乙醚、乙二醇單丙醚、乙二醇單丁醚、丙二醇單甲醚、丙二醇單乙醚、丙二醇單正丁醚、丙二醇第三丁醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單正丁醚、甲氧基甲基戊醇、二丙二醇單乙醚、二丙二醇單甲醚、3-甲基-3-甲氧基丁醇、三乙二醇單甲醚、三乙二醇單乙醚、三丙二醇甲醚之類的二醇單烷基醚類； 乙二醇二甲醚、乙二醇二乙醚、二乙二醇二甲醚、二乙二醇二乙醚、二乙二醇二丙醚、二乙二醇二丁醚、二丙二醇二甲醚之類的二醇二烷基醚類； 乙二醇單甲醚乙酸酯、乙二醇單乙醚乙酸酯、乙二醇單正丁醚乙酸酯、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯、丙二醇單丙醚乙酸酯、丙二醇單丁醚乙酸酯、乙酸甲氧基丁酯、乙酸3-甲氧基丁酯、乙酸甲氧基戊酯、二乙二醇單甲醚乙酸酯、二乙二醇單乙醚乙酸酯、二乙二醇單正丁醚乙酸酯、二丙二醇單甲醚乙酸酯、三乙二醇單甲醚乙酸酯、三乙二醇單乙醚乙酸酯、乙酸3-甲基-3-甲氧基丁酯之類的二醇烷基醚乙酸酯類； 乙二醇二乙酸酯、1,3-丁二醇二乙酸酯、1,6-己醇二乙酸酯等二醇二乙酸酯類； 環己醇乙酸酯等烷基乙酸酯類； 戊醚、二乙醚、二丙醚、二異丙醚、二丁醚、二戊醚、乙基異丁醚、二己醚之類的醚類； 丙酮、甲基乙基酮、甲基戊基酮、甲基異丙基酮、甲基異戊基酮、二異丙基酮、二異丁基酮、甲基異丁基酮、環己酮、乙基戊基酮、甲基丁基酮、甲基己基酮、甲基壬基酮、甲氧基甲基戊酮之類的酮類； 乙醇、丙醇、丁醇、己醇、環己醇、乙二醇、丙二醇、丁二醇、二乙二醇、二丙二醇、三乙二醇、甲氧基甲基戊醇、甘油、苄醇之類的一元或多元醇類； 正戊烷、正辛烷、二異丁烯、正己烷、己烯、異戊二烯、二戊烯、十二烷之類的脂肪族烴類； 環己烷、甲基環己烷、甲基環己烯、聯環己基之類的脂環式烴類； 苯、甲苯、二甲苯、異丙苯之類的芳香族烴類； 甲酸戊酯、甲酸乙酯、乙酸乙酯、乙酸丁酯、乙酸丙酯、乙酸戊酯、異丁酸甲酯、乙二醇乙酸酯、丙酸乙酯、丙酸丙酯、丁酸丁酯、丁酸異丁酯、異丁酸甲酯、辛酸乙酯、硬脂酸丁酯、苯甲酸乙酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-甲氧基丙酸丙酯、3-甲氧基丙酸丁酯、γ-丁內酯之類的鏈狀或環狀酯類； 3-甲氧基丙酸、3-乙氧基丙酸之類的烷氧基羧酸類； 氯丁烷、氯戊烷之類的鹵化烴類； 甲氧基甲基戊酮之類的醚酮類； 乙腈、苯甲腈之類的腈類等。 作為相當於上述者之市售溶劑，可列舉：礦油精、Varsol#2、Apco#18溶劑、Apco稀釋劑、Socal Solvent No.1及No.2、Solvesso#150、Shell TS28溶劑、卡必醇、乙基卡必醇、丁基卡必醇、甲基溶纖劑(「溶纖劑」為註冊商標。以下相同)、乙基溶纖劑、乙酸乙基溶纖劑、乙酸甲基溶纖劑、二乙二醇二甲醚(diglyme)(均為商品名)等。 該等有機溶劑可單獨使用，亦可將2種以上併用。 於藉由光微影法形成彩色濾光片之像素或黑矩陣之情形時，作為有機溶劑，較佳為選擇沸點為100〜250℃之範圍者。更佳為具有120〜230℃之沸點者。 上述有機溶劑之中，就塗佈性、表面張力等之均衡性較佳、組合物中之構成成分之溶解度相對較高之方面而言，較佳為二醇烷基醚乙酸酯類。 又，二醇烷基醚乙酸酯類可單獨使用，亦可與其他有機溶劑併用。作為可併用之其他有機溶劑，尤佳為二醇單烷基醚類。其中，尤其就組合物中之構成成分之溶解性而言，較佳為丙二醇單甲醚。再者，二醇單烷基醚類之極性較高，若添加量過多，則存在顏料容易凝集，其後獲得之感光性樹脂組合物之黏度上升等保存穩定性降低之傾向，因此，溶劑中之二醇單烷基醚類之比率較佳為5質量%〜30質量%，更佳為5質量%〜20質量%。 又，亦較佳為與具有200℃以上之沸點之有機溶劑(以下有時稱為「高沸點溶劑」)併用。藉由併用此種高沸點溶劑，感光性樹脂組合物不易變乾，具有防止因急遽乾燥而破壞組合物中之顏料之均勻分散狀態之效果。即，例如具有防止於狹縫噴嘴前端產生由色料等之析出、固化引起之異物缺陷之效果。就此種效果較高之方面而言，上述各種溶劑之中，尤佳為二丙二醇甲醚乙酸酯、二乙二醇單正丁醚乙酸酯、及二乙二醇單乙醚乙酸酯、1,4-丁二醇二乙酸酯、1,3-丁二醇二乙酸酯、三乙酸甘油酯、1,6-己二醇(diol)二乙酸酯。 有機溶劑中之高沸點溶劑之含有比率較佳為0質量%〜50質量%，更佳為0.5質量%〜40質量%，尤佳為1質量%〜30質量%。藉由將高沸點溶劑之含有比率設為上述下限值以上，存在例如可避免於狹縫噴嘴前端發生色料等之析出、固化而引起異物缺陷之傾向，又，藉由設為上述上限值以下，存在可避免組合物之乾燥溫度推遲，減壓乾燥製程之工站時間(tact)不良或預烘烤之氣孔痕跡等問題之傾向。 本發明之感光性樹脂組合物中，有機溶劑之含有比率並無特別限定，就易塗佈性或黏度穩定性之觀點而言，感光性樹脂組合物中之全部固形物成分量較佳為5質量%以上，更佳為8質量%以上，進而較佳為10質量%以上，尤佳為12質量%以上，又，較佳為40質量%以下，更佳為30質量%以下，進而較佳為25質量%以下，尤佳為20質量%以下。 ＜感光性樹脂組合物之其他調配成分＞ 本發明之感光性樹脂組合物中，除上述成分以外，亦可適當調配密接提高劑、塗佈性提高劑、顏料衍生物、顯影改良劑、紫外線吸收劑、抗氧化劑等。 ＜密接提高劑＞ 為了改善與基板之密接性，可含有密接提高劑，例如可列舉：矽烷偶合劑、鈦偶合劑等，尤佳為矽烷偶合劑。 作為此種矽烷偶合劑，例如可列舉：KBM-402、KBM-403、KBM-502、KBM-5103、KBE-9007、X-12-1048、X12-1050(Shin-Etsu Silicones公司製造)，Z-6040、Z-6043、Z-6062(Dow Corning Toray公司製造)等。再者，矽烷偶合劑可使用1種，亦可以任意之組合及比率併用2種以上。 進而，本發明之感光性樹脂組合物亦可含有矽烷偶合劑以外之密接提高劑，例如可列舉：磷酸系密接提高劑、其他密接提高劑等。 作為磷酸系密接提高劑，較佳為含(甲基)丙烯醯氧基之磷酸酯類，其中，較佳為下述通式(g1)、(g2)、(g3)所表示者。 [化21]

上述通式(g1)、(g2)、(g3)中，R⁵¹ 分別獨立表示氫原子或甲基，I及I'分別獨立為1〜10之整數，m分別獨立為1、2或3。 作為其他密接提高劑，可列舉TEGO*Add Bond LTH(Evonik公司製造)等。該等含磷酸基之化合物或其他密接劑亦可單獨使用1種，亦可將2種以上組合使用。 感光性樹脂組合物中之密接提高劑之含有比率並無特別限定，於全部固形物成分中較佳為0.1質量%以上，更佳為0.3質量%以上，進而較佳為0.5質量%以上，尤佳為1質量%以上，又，較佳為25質量%以下，更佳為20質量%以下，進而較佳為10質量%以下，尤佳為8質量%以下，最佳為6質量%以下。藉由設為上述下限值以上，存在可優化與基板之密接性之傾向，又，藉由設為上述上限值以下，存在可抑制鹼性顯影時之殘渣之傾向。 ＜塗佈性提高劑＞ 為了提高塗佈性，本發明之感光性樹脂組合物可含有界面活性劑作為塗佈性提高劑。作為界面活性劑，例如可使用陰離子系、陽離子系、非離子系及兩性界面活性劑等各種者。其中，就對各特性產生不良影響之可能性較低之方面而言，較佳為使用非離子系界面活性劑，其中，就塗佈性之方面而言，有效的是氟系或矽系之界面活性劑。 作為此種界面活性劑，例如可列舉：TSF4460(Momentive Performance Materials公司製造)，DFX-18(NEOS公司製造)，BYK-300、BYK-325、BYK-330(BYK-Chemie公司製造)，KP340(Shin-Etsu Silicones公司製造)，F-470、F-475、F-478、F-554、F-559(DIC公司製造)，SH7PA(Dow Corning Toray公司製造)，DS-401(Daikin公司製造)，L-77(Nippon Unicar公司製造)及FC4430(3M Japan公司製造)等。再者，界面活性劑可使用1種，亦可以任意之組合及比率併用2種以上。 感光性樹脂組合物中之界面活性劑之含有比率並無特別限定，於全部固形物成分中較佳為0.01質量%以上，更佳為0.05質量%以上，進而較佳為0.10質量%以上，又，較佳為1.0質量%以下，更佳為0.7質量%以下，進而較佳為0.5質量%以下，尤佳為0.3質量%以下。藉由將界面活性劑之含有比率設為上述下限值以上，存在抗蝕劑塗佈均勻性變佳之傾向，又，藉由設為上述上限值以下，存在抗蝕劑感度不會降低之傾向。 ＜顏料衍生物＞ 為了提高分散性、保存性，本發明之感光性樹脂組合物可含有顏料衍生物。作為顏料衍生物，可列舉：偶氮系、酞菁系、喹吖啶酮系、苯并咪唑酮系、喹酞酮系、異吲哚啉酮系、二㗁𠯤系、蒽醌系、陰丹士林系、苝系、哌瑞酮系、吡咯并吡咯二酮系、二㗁𠯤系等之衍生物，其中，較佳為酞菁系、喹酞酮系。 作為顏料衍生物之取代基，可列舉磺酸基、磺醯胺基及其四級鹽、鄰苯二甲醯亞胺甲基、二烷基胺基烷基、羥基、羧基、醯胺基等，較佳為磺酸基，該等取代基直接或經由烷基、芳基、雜環基等而鍵結於顏料骨架。又，一個顏料骨架可經複數個該等取代基取代。作為顏料衍生物之具體例，可列舉：酞菁之磺酸衍生物、喹酞酮之磺酸衍生物、蒽醌之磺酸衍生物、喹吖啶酮之磺酸衍生物、吡咯并吡咯二酮之磺酸衍生物、二㗁𠯤之磺酸衍生物等。該等可單獨使用1種，亦可將2種以上併用。 ＜感光性樹脂組合物之製造方法＞ 本發明之感光性樹脂組合物(以下有時稱為「抗蝕劑」)係依據常規方法製造。 通常，(d)色料較佳為預先使用塗料調節器、砂磨機、球磨機、輥磨機、石磨機、噴射磨機、均質機等進行分散處理。藉由分散處理使(d)色料得以微粒子化，因此抗蝕劑之塗佈特性提高。又，於使用黑色色料作為(d)色料之情形時，有助於提高遮光能力。 分散處理通常較佳為針對併用有(d)色料、溶劑、及視需要之(e)分散劑、一部分或全部之(a)鹼可溶性樹脂的系統進行(以下，有時將供進行分散處理之混合物、及藉由該處理所獲得之組合物稱為「墨水」或「顏料分散液」)。尤其若使用高分子分散劑作為分散劑，則抑制所獲得之墨水及抗蝕劑之經時性增黏(分散穩定性優異)，因此較佳。 再者，於對含有感光性樹脂組合物中調配之全部成分之液體進行分散處理之情形時，由於分散處理時產生之發熱，故存在高反應性之成分改性之可能性。因此，較佳為針對包含高分子分散劑之系統進行分散處理。 於利用砂磨機使(d)色料分散之情形時，較佳為使用直徑0.1〜8 mm左右之玻璃珠或氧化鋯珠。關於分散處理條件，溫度通常為0℃至100℃，較佳為室溫至80℃之範圍。分散時間根據液體組成及分散處理裝置之尺寸等，適宜時間有所不同，因此適當調節。分散之標準係以抗蝕劑之20度鏡面光澤度(JIS Z8741)成為100〜200之範圍之方式控制墨水之光澤。於抗蝕劑之光澤度為上述下限值以上之情形時，存在分散處理充分，粗糙之顏料(色料)粒子鮮有殘留，顯影性、密接性、解像性等充分之傾向。又，於光澤值為上述上限值以下之情形時，存在可避免顏料破碎而產生大量超微粒子，反而有損分散穩定性之傾向。 繼而，將藉由上述分散處理所獲得之墨水、與抗蝕劑中所含之上述其他成分進行混合，製成均勻之溶液。於抗蝕劑之製造過程中，常會有微細異物混入液中，因此較理想為利用過濾器等對所獲得之抗蝕劑進行過濾處理。 [硬化物] 藉由使本發明之感光性樹脂組合物硬化，可獲得硬化物。使感光性樹脂組合物硬化而成之硬化物可較佳地用作像素、黑矩陣或著色間隔件等構成彩色濾光片之構件。 [黑矩陣] 其次，針對使用本發明之感光性樹脂組合物之黑矩陣，根據其製造方法進行說明。 (1)支持體 作為用以形成黑矩陣之支持體，只要具有適度之強度，則其材質無特別限定。主要使用透明基板，作為材質，例如可列舉：聚對苯二甲酸乙二酯等聚酯系樹脂、聚丙烯、聚乙烯等聚烯烴系樹脂、聚碳酸酯、聚甲基丙烯酸甲酯、聚碸等熱塑性樹脂製片材，環氧樹脂、不飽和聚酯樹脂、聚(甲基)丙烯酸系樹脂等熱硬化性樹脂片材，或各種玻璃等。其中，就耐熱性之觀點而言，較佳為玻璃、耐熱性樹脂。又，亦存在於基板之表面成膜有ITO(Indium Tin Oxides，氧化銦錫)、IZO(Indium Zinc Oxide，氧化銦鋅)等透明電極之情況。除透明基板以外，亦可形成於TFT陣列上。 為了改良接著性等表面物性，視需要亦可對支持體進行電暈放電處理、臭氧處理、大氣壓電漿處理、矽烷偶合劑或胺基甲酸酯系樹脂等各種樹脂之薄膜形成處理等。 透明基板之厚度通常設為0.05〜10 mm、較佳為0.1〜7 mm之範圍。又，於進行各種樹脂之薄膜形成處理之情形時，其膜厚通常為0.01〜10 μm、較佳為0.05〜5 μm之範圍。 (2)黑矩陣 於藉由上述本發明之感光性樹脂組合物形成本發明之黑矩陣時，於透明基板上塗佈本發明之感光性樹脂組合物並加以乾燥後，於塗膜之上放置光罩，隔著該光罩進行圖像曝光、顯影，視需要進行熱硬化或光硬化，藉此形成黑矩陣。 (3)黑矩陣之形成 (3-1)感光性樹脂組合物之塗佈 黑矩陣用之感光性樹脂組合物向透明基板上之塗佈可藉由旋轉塗佈法、線棒塗佈法、流塗法、模嘴塗佈法、輥式塗佈法、或噴塗法等進行。其中，若為模嘴塗佈法，則就可大幅削減塗佈液使用量，且全無藉由旋轉塗佈法進行時附著之霧(mist)等之影響，抑制異物產生等綜合觀點而言較佳。 塗膜之厚度以乾燥後之膜厚計，通常設為較佳為0.2〜10 μm之範圍，更佳為0.5〜6 μm之範圍，進而較佳為1〜4 μm之範圍。藉由設為上述上限值以下，存在圖案顯影變得容易，液晶單元化步驟中之間隙調整亦變得容易之傾向。又，藉由設為上述下限值以上，存在容易呈現出所需顏色之傾向。 (3-2)塗膜之乾燥 於基板上塗佈感光性樹脂組合物後之塗膜之乾燥較佳為藉由使用加熱板、IR(infra red，紅外線)烘箱或對流烘箱之乾燥法進行。乾燥條件可根據上述溶劑成分之種類、所使用之乾燥機之性能等而適當選擇。根據溶劑成分之種類、所使用之乾燥機之性能等，乾燥時間通常於40〜200℃之溫度下於15秒〜5分鐘之範圍內選擇，較佳為於50〜130℃之溫度下於30秒〜3分鐘之範圍內選擇。 乾燥溫度越高，則塗膜對透明基板之接著性越提高，但若過高，則存在鹼可溶性樹脂分解，誘發熱聚合而產生顯影不良之情況。再者，該塗膜之乾燥步驟亦可為不提高溫度而於減壓室內進行乾燥之減壓乾燥法。 (3-3)曝光 圖像曝光係於感光性樹脂組合物之塗膜上重疊負型之遮罩圖案，隔著該遮罩圖案照射紫外線區域至可見光區域之波長之光進行。此時，為了防止氧氣導致光聚合性層感度下降，可視需要於光聚合性之塗膜上形成聚乙烯醇層等隔氧層後進行曝光。上述圖像曝光所使用之光源並無特別限定。作為光源，例如可列舉：氙氣燈、鹵素燈、鎢絲燈、高壓水銀燈、超高壓水銀燈、金屬鹵化物燈、中壓水銀燈、低壓水銀燈、碳弧等燈光源等。於照射特定波長之光使用之情形時，亦可利用光學濾光片。 (3-4)顯影 本發明之黑矩陣可藉由如下方式製作：利用上述光源對由感光性樹脂組合物形成之塗膜進行圖像曝光後，使用有機溶劑或包含界面活性劑與鹼性化合物之水溶液進行顯影，藉此於基板上形成圖像。該水溶液可進而包含有機溶劑、緩衝劑、錯合劑、染料或顏料。 作為鹼性化合物，可列舉：氫氧化鈉、氫氧化鉀、氫氧化鋰、碳酸鈉、碳酸鉀、碳酸氫鈉、碳酸氫鉀、矽酸鈉、矽酸鉀、偏矽酸鈉、磷酸鈉、磷酸鉀、磷酸氫鈉、磷酸氫鉀、磷酸二氫鈉、磷酸二氫鉀、氫氧化銨等無機鹼性化合物，或者單、二或三乙醇胺、單、二或三甲胺、單、二或三乙胺、單或二異丙胺、正丁胺、單、二或三異丙醇胺、伸乙基亞胺、伸乙基二亞胺、氫氧化四甲基銨(TMAH)、膽鹼等有機鹼性化合物。該等鹼性化合物亦可為2種以上之混合物。 作為界面活性劑，例如可列舉：聚氧乙烯烷基醚類、聚氧乙烯烷基芳基醚類、聚氧乙烯烷基酯類、山梨醇酐烷基酯類、甘油單酸酯烷基酯類等非離子系界面活性劑，烷基苯磺酸鹽類、烷基萘磺酸鹽類、烷基硫酸鹽類、烷基磺酸鹽類、磺基琥珀酸酯鹽類等陰離子性界面活性劑，烷基甜菜鹼類、胺基酸類等兩性界面活性劑。 作為有機溶劑，例如可列舉：異丙醇、苄醇、乙基溶纖劑、丁基溶纖劑、苯基溶纖劑、丙二醇、二丙酮醇等。有機溶劑可單獨使用，又，亦可與水溶液併用。 顯影處理之條件並無特別限制，通常，顯影溫度為10〜50℃之範圍，其中，較佳為15〜45℃，尤佳為20〜40℃，顯影方法可採用浸漬顯影法、噴射顯影法、毛刷顯影法、超音波顯影法等任一方法。 (3-5)熱硬化處理 對顯影後之基板實施熱硬化處理或光硬化處理，較佳為實施熱硬化處理。關於此時之熱硬化處理條件，溫度係於100〜280℃之範圍、較佳為150〜250℃之範圍內選擇，時間係於5〜60分鐘之範圍內選擇。 藉由如上方式形成之黑矩陣之高度通常為0.5〜5 μm，較佳為0.8〜4 μm。 進而，厚度每1 μm之光學濃度(OD)為3.0以上，較佳為3.5以上，更佳為3.8以上，尤佳為4.0以上，最佳為4.2以上。 [其他彩色濾光片圖像之形成] 根據與上述(3-1)〜(3-5)相同之製程，於設置有黑矩陣之透明基板上塗佈含有紅色、綠色、藍色中之一種顏色之色料的感光性樹脂組合物，經乾燥後，於塗膜之上重疊光罩，隔著該光罩進行圖像曝光、顯影，視需要進行熱硬化或光硬化，藉此形成像素圖像，製作著色層。藉由對紅色、綠色、藍色三色之感光性樹脂組合物分別進行該操作，可形成彩色濾光片圖像。該等之順序並不限定於上述。 [著色間隔件] 本發明之感光性樹脂組合物除黑矩陣以外，亦可作為著色間隔件用之抗蝕劑使用。於TFT型LCD(Liquid Crystal Display，液晶顯示裝置)中使用間隔件之情形時，存在射入TFT之光導致作為開關元件之TFT出現誤動作之情況，著色間隔件係為了防止該情況而使用，例如日本專利特開平8-234212號公報中記載將間隔件設為遮光性。除使用著色間隔件用之遮罩以外，可藉由與上述黑矩陣相同之方法形成著色間隔件。 (3-6)透明電極之形成 彩色濾光片可直接於該狀態下，於圖像上形成ITO等透明電極而用作彩色顯示器、液晶顯示裝置等之零件之一部分使用，但亦可為了提高表面平滑性或耐久性而視需要於圖像上設置聚醯胺、聚醯亞胺等之面塗層。又，於一部分平面配向型驅動方式(IPS(In-Plane Switching，橫向電場效應)模式)等用途中，亦存在不形成透明電極之情況。 [圖像顯示裝置] 本發明之圖像顯示裝置具有使本發明之感光性樹脂組合物硬化而成之硬化物。作為圖像顯示裝置，只要為顯示圖像或影像之裝置，則不受特別限定，可列舉下述液晶顯示裝置或有機EL顯示器等。 [液晶顯示裝置] 本發明之液晶顯示裝置具有上述本發明之黑矩陣、彩色濾光片像素、著色間隔件等硬化物，彩色像素或黑矩陣之形成順序或形成位置等不受特別限制。 液晶顯示裝置通常係於彩色濾光片上形成配向膜，於該配向膜上散佈間隔件後，與對向基板貼合而形成液晶單元，對所形成之液晶單元注入液晶，接線至對向電極而完成。作為配向膜，宜為聚醯亞胺等之樹脂膜。配向膜之形成通常採用凹版印刷法及/或軟版印刷法，配向膜之厚度設為數10 nm。藉由熱焙燒對配向膜進行硬化處理後，藉由紫外線之照射或藉由磨擦布之處理而進行表面處理，加工成能夠調整液晶傾角之表面狀態。 作為間隔件，採用大小對應於與對向基板之間隙(gap)者，通常宜為2〜8 μm者。亦可於彩色濾光片基板上藉由光微影法形成透明樹脂膜之感光性間隔件(PS)，將其充分利用以代替間隔件。作為對向基板，通常使用陣列基板，尤其宜為TFT(薄膜電晶體)基板。 與對向基板貼合時之間隙根據液晶顯示裝置之用途而不同，通常於2〜8 μm之範圍內選擇。與對向基板貼合後，利用環氧樹脂等密封材料密封液晶注入口以外之部分。密封材料於UV照射及/或加熱下硬化，而將液晶單元周邊加以密封。 將周邊經密封之液晶單元切斷成面板單元後，於真空腔室內設為減壓，將上述液晶注入口浸漬於液晶中，其後使腔室內漏氣，藉此向液晶單元內注入液晶。液晶單元內之減壓度通常為1×10^{- 2} 〜1×10^{- 7} Pa，較佳為1×10^{- 3} 〜1×10^{- 6} Pa。又，減壓時較佳為對液晶單元進行加溫，加溫溫度通常為30〜100℃，更佳為50〜90℃。減壓時之加溫保持通常設為10〜60分鐘之範圍，其後浸漬於液晶中。使UV硬化樹脂硬化而將注入有液晶之液晶單元之液晶注入口進行密封，藉此完成液晶顯示裝置(面板)。 液晶之種類並無特別限制，可為芳香族系、脂肪族系、多環狀化合物等先前已知之液晶，可為向液性液晶、向熱性液晶等任意者。已知向熱性液晶包括向列型液晶、層列型液晶及膽固醇狀液晶等，可為其中之任一種。 [有機EL顯示器] 本發明之有機EL顯示器係使用本發明之彩色濾光片而製作。 於使用本發明之彩色濾光片製作有機EL顯示器之情形時，例如，如圖1所示，首先，製作於透明支持基板10上形成由感光性樹脂組合物形成之圖案(即，設置於像素20與鄰接之像素20之間的樹脂黑矩陣(未圖示))而成之彩色濾光片，於該彩色濾光片上隔著有機保護層30及無機氧化膜40而積層有機發光體500，藉此可製作有機EL元件100。再者，像素20及樹脂黑矩陣中之至少一者係使用本發明之感光性樹脂組合物而製作。作為有機發光體500之積層方法，可列舉：於彩色濾光片上表面依序形成透明陽極50、電洞注入層51、電洞傳輸層52、發光層53、電子注入層54及陰極55之方法，或將形成於另一基板上之有機發光體500貼合至無機氧化膜40上之方法等。可使用如此製作之有機EL元件100，藉由例如「有機EL顯示器」(OHM社，2004年8月20日發行，時任靜士、安達千波矢、村田英幸(著))中記載之方法等，製作有機EL顯示器。 再者，本發明之彩色濾光片能夠應用於被動驅動方式之有機EL顯示器或主動驅動方式之有機EL顯示器。 實施例 其次，列舉合成例、實施例及比較例而更具體地說明本發明，但本發明只要不超出其主旨，則並不限定於以下之實施例。 ＜碳黑墨水之製備＞ 根據以下之組成及方法，調配顏料、分散劑、分散助劑(顏料衍生物)、溶劑，而製備碳黑墨水。 具體而言，首先，以顏料、分散劑、分散助劑之固形物成分與溶劑成為以下量比之方式進行調配。 ·顏料：RAVEN1060U(Birla公司製造，碳黑)；52.00質量份 ·分散劑：DISPERBYK-167(BYK-Chemie公司製造，鹼性胺基甲酸酯分散劑)；7.30質量份(固形物成分換算) ·分散助劑(顏料衍生物)：S12000(Lubrizol公司製造，具有酸性基之酞菁系顏料衍生物)；1.03質量份 ·溶劑：丙二醇單甲醚乙酸酯(PGMEA)；112.04質量份 將該等充分攪拌、混合而獲得分散液。 繼而，利用塗料振盪機於25〜45℃之範圍內進行6小時之分散處理。作為珠粒，使用直徑0.5 mm之氧化鋯珠，相對於分散液60質量份，以180質量份之比率添加珠粒。分散結束後，利用過濾器將珠粒與分散液分離，而製備固形物成分35質量%之碳黑墨水。 ＜合成例1:鹼可溶性樹脂(1)之合成＞ [化22]

將上述化學結構之環氧化合物(環氧當量264)50 g、丙烯酸13.65 g、乙酸3-甲氧基丁酯60.5 g、三苯基膦0.936 g、及對甲氧基苯酚0.032 g裝入安裝有溫度計、攪拌機、冷卻管之燒瓶中，一面攪拌一面於90℃下反應直至酸值成為5 mgKOH/g以下。反應需要12小時，獲得環氧丙烯酸酯溶液。 將所獲得之環氧丙烯酸酯溶液25質量份及三羥甲基丙烷(TMP)0.76質量份、聯苯基四羧酸二酐(BPDA)3.3質量份、四氫鄰苯二甲酸酐(THPA)3.5質量份裝入安裝有溫度計、攪拌機、冷卻管之燒瓶中，一面攪拌一面緩慢升溫至105℃，使之反應。 待樹脂溶液變為透明，利用乙酸3-甲氧基丁酯(MBA)進行稀釋，製備成固形物成分50質量%，獲得酸值115 mgKOH/g、藉由GPC測得之聚苯乙烯換算之重量平均分子量(Mw)2,600之鹼可溶性樹脂(1)。 ＜合成例2:鹼可溶性樹脂(2)之合成＞ [化23]

將上述化學結構之環氧化合物(環氧當量240)7.3 g、丙烯酸2.2 g、丙二醇單甲醚乙酸酯6.4 g、氯化四乙基銨0.18 g、及對甲氧基苯酚0.007 g裝入安裝有溫度計、攪拌機、冷卻管之燒瓶中，一面攪拌一面於100℃下反應直至酸值成為5 mgKOH/g以下。反應需要9小時，獲得環氧丙烯酸酯溶液。 將所獲得之環氧丙烯酸酯溶液16質量份、三羥甲基丙烷(TMP)0.4質量份、聯苯基四羧酸二酐(BPDA)3.5質量份、四氫鄰苯二甲酸酐(THPA)0.06質量份、及丙二醇單甲醚乙酸酯(PGMEA)14質量份裝入安裝有溫度計、攪拌機、冷卻管之燒瓶中，一面攪拌一面緩慢升溫至105℃，使之反應，獲得固形物成分40質量%、酸值100 mgKOH/g、藉由GPC測得之聚苯乙烯換算之重量平均分子量(Mw)10,400之鹼可溶性樹脂(2)。 ＜光聚合起始劑(1)＞ [化24]

使用藉由國際公開第2015/036910號中記載之方法所合成之上述化學結構之光聚合起始劑(1)。使所獲得之光聚合起始劑(1)溶解於丙二醇單甲醚乙酸酯(PGMEA)而製備0.01質量%溶液，使用分光光度計U-3900H(日立高新技術公司製造)測定吸收光譜，結果於波長320 nm〜400 nm之範圍中之極大吸收波長為331 nm。 ＜光聚合起始劑(2)＞ [化25]

使用藉由國際公開第2008/078678號中記載之方法所合成之上述化學結構之光聚合起始劑(2)。藉由與光聚合起始劑(1)相同之方法測定吸收光譜，結果極大吸收波長為368 nm。 ＜光聚合起始劑(3)＞ 作為光聚合起始劑(3)，使用常州強力電子新材料公司製造之TR-PBG-314(具有以下化學結構之化合物)。 [化26]

藉由與光聚合起始劑(1)相同之方法測定吸收光譜，結果極大吸收波長為339 nm。 ＜光聚合起始劑(4)＞ 作為光聚合起始劑(4)，使用常州強力電子新材料公司製造之TR-PBG-358(具有以下化學結構之化合物)。 [化27]

藉由與光聚合起始劑(1)相同之方法測定吸收光譜，結果極大吸收波長為344 nm。 ＜光聚合性單體＞ 作為光聚合性單體，準備共榮社化學公司製造之Light Acrylate PE-4A、日本化藥製造之KAYARAD DPCA-20。 [化28]

[化29]

＜密接提高劑＞ 作為密接提高劑，準備作為矽烷偶合劑之信越化學工業公司製造之KBM-5103、及作為磷酸系密接提高劑之日本化藥公司製造之KAYAMER PM-21。 [化30]

[化31]

＜塗佈性提高劑＞ 作為塗佈性提高劑，準備作為界面活性劑之DIC公司製造之MEGAFAC F-554(含有含氟基、親油性基之低聚物、非離子型界面活性劑)。 ＜實施例1＞ (黑色抗蝕劑1之製備) 使用上述＜碳黑墨水之製備＞中所製備之碳黑墨水，以成為表1記載之比率之方式添加各成分，利用攪拌器進行攪拌，使之溶解，而製備黑色抗蝕劑1。黑色抗蝕劑1中之全部固形物成分為15質量%。 [表1]

再者，表1中之溶劑之簡稱之含義如下所述。 PGMEA：丙二醇單甲醚乙酸酯 MBA：乙酸3-甲氧基丁酯 EDGAC：二乙二醇單乙醚乙酸酯 ＜實施例2＞ (黑色抗蝕劑2之製備) 表1所示之黑色抗蝕劑1中，光聚合起始劑之合計量保持不變，將光聚合起始劑(1)及(2)之混合比率(質量%)變更為如表2所示，除此以外，藉由與黑色抗蝕劑1相同之方法製備固形物成分濃度15質量%之黑色抗蝕劑2。 [表2]

＜實施例3＞ (黑色抗蝕劑3之製備) 表1所示之黑色抗蝕劑1中，光聚合起始劑之合計量保持不變，將光聚合起始劑(1)及(2)之混合比率(質量%)變更為如表2所示，除此以外，藉由與黑色抗蝕劑1相同之方法製備固形物成分濃度15質量%之黑色抗蝕劑3。 ＜比較例1＞ (黑色抗蝕劑4之製備) 表1所示之黑色抗蝕劑1中，光聚合起始劑之合計量保持不變，將光聚合起始劑(1)及(2)之混合比率(質量%)變更為如表2所示，除此以外，藉由與黑色抗蝕劑1相同之方法製備固形物成分濃度15質量%之黑色抗蝕劑4。 ＜比較例2＞ (黑色抗蝕劑5之製備) 表1所示之黑色抗蝕劑1中，光聚合起始劑之合計量保持不變，將光聚合起始劑(1)及(2)之混合比率(質量%)變更為如表2所示，除此以外，藉由與黑色抗蝕劑1相同之方法製備固形物成分濃度15質量%之黑色抗蝕劑5。 ＜實施例4＞ (黑色抗蝕劑6之製備) 實施例2之黑色抗蝕劑2中，光聚合起始劑之合計量保持不變，將光聚合起始劑(2)變更為光聚合起始劑(3)，除此以外，藉由與黑色抗蝕劑2相同之方法製備固形物成分濃度15質量%之黑色抗蝕劑6。 ＜實施例5＞ (黑色抗蝕劑7之製備) 實施例2之黑色抗蝕劑2中，光聚合起始劑之合計量保持不變，將光聚合起始劑(2)變更為光聚合起始劑(4)，除此以外，藉由與黑色抗蝕劑2相同之方法製備固形物成分濃度15質量%之黑色抗蝕劑7。 (黑色抗蝕劑之評價) (1)黑矩陣(BM)細線圖案之製作 利用旋轉塗佈機於玻璃基板上塗佈所製備之黑色抗蝕劑1〜7，減壓乾燥後，利用加熱板於90℃下乾燥100秒。再者，分別以塗佈膜厚成為約1.2 μm之方式調整塗佈條件。繼而，對所獲得之乾燥塗佈膜，使用曝光機(OAK製作所公司製造之EXF-2829-F-00)，藉由高壓水銀燈(OAK製作所公司製造之ADH-3000M-F-N，無光學濾光片)，以35 mJ/cm² 、隔著具有開口寬度1〜10 μm(分別相差1 μm)及15 μm之直線狀開口部之曝光遮罩進行圖案曝光(近接間隙：180 μm)。其後，於室溫(23℃)下，使用利用超純水製備成0.04質量%之KOH水溶液作為鹼性顯影液，歷時溶解時間之2.2倍之時間進行噴射顯影(噴射壓力：0.1 MPa)，去除未曝光部後，利用超純水進行噴射洗淨(噴射壓力：0.1 MPa)，而形成BM細線圖案。再者，所謂溶解時間係於顯影處理時未曝光部之黑色抗蝕劑膜溶解直至開始見到基板表面為止之時間，各黑色抗蝕劑之溶解時間為20〜30秒之範圍。 (2)BM細線圖案評價 對所製作之顯影後之BM細線圖案進行光學顯微鏡觀察，確認BM細線形成狀態，進行細線密接與感度之評價。將結果示於表3。再者，細線密接與感度之評價係根據以下基準而進行。 (細線密接評價) BM細線存在於鹼性顯影中，BM細線/玻璃基板之接著面受到侵蝕而發生侵入，細線密接性變差之情況。利用光學顯微鏡觀察10 μm以下之線圖案部分，例如於8 μm以上之圖案密接且7 μm以下之圖案剝離之情形時，將細線密接評價為8 μm，如以下般進行分類(此處，例如將曝光遮罩之開口部之寬度為7 μm時對應之圖案記載為7 μm之圖案)。再者，若評價為「〇」，則可謂細線密接性良好，若為「◎」，則可謂更良好，評價為「×」表示細線密接性較差。 ◎:7 μm以上之圖案之細線密接。 〇：8 μm以上之圖案之細線密接(7 μm以下之圖案剝離)。 ×：9 μm以上之圖案之細線密接(8 μm以下之圖案剝離)。 (感度評價) 黑色抗蝕劑存在若作為感光性樹脂組合物之曝光感度提昇，則所形成之BM細線之線寬增大之傾向。利用光學顯微鏡測定15 μm之線圖案之線寬，如以下般對感度之判定進行分類(此處，例如將曝光遮罩之開口部之寬度為15 μm時對應之圖案記載為15 μm之圖案)。再者，若評價為「〇」，則可謂感度良好，評價為「×」表示感度較低。 〇：15 μm之圖案之線寬為15 μm以上。 ×：15 μm之圖案之線寬未達15 μm。 [表3]

如表3所示，實施例1〜5之BM細線其細線密接與感度均良好。比較例1之BM細線顯示出高感度，但另一方面，細線密接為較低結果。又，比較例2之BM細線顯示出良好之細線密接，但另一方面，感度為較低結果。 認為於比較例1中，BM表面之硬化程度較高，但BM內部之硬化不充分，因此儘管線寬較寬，但細線密接卻為較差結果。認為於比較例2中，BM表面之硬化程度較弱，但BM內部之硬化程度較高，因此儘管線寬較細，但細線密接卻為較佳結果。又，認為於實施例1〜5中，BM表面與內部以良好之均衡性進行硬化，此關係到細線密接與高感度實現兼備。 實施例1〜5由於為高感度，故線寬變寬，但就以下列舉之觀點而言，優點較多而令人期待。 ·感度非常充足，可相應地減少光聚合起始劑之量，將光聚合起始劑所減少之部分替換成鹼可溶性樹脂或光聚合性單體等，藉此助益於耐顯影性或基板密接性等之性能提高。 ·形成目標線寬所需之曝光量降低，相應地可加快曝光速度，生產性提高。另一方面，雖然比較例1亦為高感度之結果，但BM內部之硬化不充分，因此若減少光聚合起始劑之量或降低曝光量，則會使細線密接進一步變差。 關於本發明之效果，尚不明了其詳細機制，但考慮為如下。即，苯硫醚系之光聚合起始劑於330 nm附近之UV吸收能力優異，但通式(I)所表示之光聚合起始劑(c1)所具有之縮合雜環之苯并呋喃部可提高與色料、尤其碳黑之相互作用力，藉此促進光聚合起始劑(c1)於色料粒子表面之吸附。色料所吸收之光未參與聚合乃曝光感度低下之較大原因，藉由以光聚合起始劑被覆色料表面，光聚合起始劑之光吸收率提高。又，光聚合起始劑於色料上之吸附使得樹脂成分中之光聚合起始劑濃度相對降低，因此向深部之光透過性提高。藉此，認為抗蝕劑膜之內部硬化性提高，與之相關地，細線密接性改善。 但若僅為光聚合起始劑(c1)，則僅可利用曝光光源之UV波長域之低波長側之一部分，無法獲得充分之感度，因此，藉由與極大吸收波長位於長波長域之光聚合起始劑(c2)進行組合，可提高感度、尤其是表面感度。由於光聚合起始劑(c1)與光聚合起始劑(c2)之間存在極大吸收波長之差，故而可抑制由併用引起之對內部硬化性之影響。鑒於此，認為可同時提高表面感度與內部硬化。 根據上文，可知藉由使用本發明之感光性樹脂組合物，能夠提供高感度且細線密接性能優異之感光性樹脂組合物。 使用特定態樣而詳細地說明了本發明，但作為業者應明瞭可於不脫離本發明之主旨與範圍之情況下施加各種變更及變化。再者，本申請案係基於2016年9月16日提出申請之日本專利申請(日本專利特願2016-181932)，以引用之形式援用其全部內容。Hereinafter, embodiments of the present invention will be described in detail, but the present invention is not limited to the following embodiments, and can be implemented with various changes within the scope of the gist. In addition, in the present invention, "(meth)acrylic acid" means "acrylic acid and/or methacrylic acid", and the same applies to "(meth)acrylate" and "(meth)acrylic acid". Furthermore, in the present invention, all percentages or parts expressed by mass are equivalent to percentages or parts expressed by weight. In the present invention, the term "all solid components" means all components other than the solvent contained in the photosensitive resin composition or in the ink described below. In the present invention, the so-called weight average molecular weight refers to the weight average molecular weight (Mw) in terms of polystyrene measured by GPC (Gel Permeation Chromatography). In addition, in the present invention, unless otherwise specified, the so-called "amine value" means the amine value in terms of effective solid content, which is a value expressed by the weight of KOH equivalent to 1 g of the solid content of the dispersant. . Furthermore, the measurement method is described below. [Photosensitive resin composition] The photosensitive resin composition of the present invention is characterized in that it contains (a) alkali-soluble resin, (b) photopolymerizable monomer, (c) photopolymerization initiator, and (d) Colorants, and the above-mentioned (c) photopolymerization initiator contains the photopolymerization initiator (c1) represented by the following general formula (I), and the maximum absorption wavelength in the wavelength range of 320 nm to 400 nm is 334 Photopolymerization initiator (c2) above nm. Furthermore, in the present invention, the "maximum absorption wavelength" of (c) the photopolymerization initiator means the maximum absorption wavelength in the wavelength range of 320 nm to 400 nm. [化3]

In formula (I), R¹ It represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. R² It represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. k represents 0 or 1. R³ ~R⁶ Each independently represents an arbitrary monovalent substituent. l, m, and o each independently represent an integer from 0 to 3. n represents 0 or 1. The photosensitive resin composition of the present invention may further contain a dispersant, mercaptans, and if necessary, may also contain other formulations such as adhesion enhancers, coatability enhancers, development modifiers, ultraviolet absorbers, antioxidants, pigment derivatives, etc. Ingredients, usually each formulated ingredient is used in a state of being dissolved or dispersed in an organic solvent. The present invention is characterized in that (c) the photopolymerization initiator contains a photopolymerization initiator (c1) and a photopolymerization initiator (c2) in the photosensitive resin composition. First, the (c) photopolymerization initiator will be described. <(c) Photopolymerization initiator> The (c) photopolymerization initiator in the present invention contains a photopolymerization initiator (c1) represented by the following general formula (I), and a maximum absorption wavelength of 334 nm or more The photopolymerization initiator (c2). <Photopolymerization initiator (c1)> The photopolymerization initiator (c1) is a photopolymerization initiator represented by the following general formula (I). [化4]

In formula (I), R¹ It represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. R² It represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. k represents 0 or 1. R³ ~R⁶ Each independently represents an arbitrary monovalent substituent. l, m, and o each independently represent an integer from 0 to 3. n represents 0 or 1. Thus, it is considered that by containing the photopolymerization initiator (c1) represented by the above general formula (I), the adsorption of the photopolymerization initiator to the surface of the toner particles is promoted, and the light absorption of the photopolymerization initiator during exposure The rate is improved, and the UV (Ultraviolet, ultraviolet) light transmittance of the resin component is improved, the internal curability is improved, and the fine line adhesion becomes better. (R¹ ) In the above formula (I), R¹ It represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. R¹ The alkyl group may be linear, branched, cyclic, or formed by these bonds. The carbon number of the alkyl group is not particularly limited, and is usually 1 or more, and is preferably 12 or less, more preferably 6 or less, still more preferably 3 or less, and particularly preferably 2 or less. By setting the carbon number of the alkyl group to the above upper limit or less, the crosslinking density tends to increase. Specific examples of alkyl groups include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, cyclopentyl, hexyl, and cyclohexyl. Wait. Among them, from the viewpoint of sensitivity, a methyl group, an ethyl group, a propyl group, or a butyl group is preferable, a methyl group or an ethyl group is more preferable, and a methyl group is still more preferable. Examples of substituents that the alkyl group may have include: alkoxy groups having 1 to 10 carbon atoms, alkylthio groups having 1 to 10 carbon atoms, halogen atoms such as F, Cl, Br, and I, hydroxyl groups, nitro groups, etc. From the viewpoint of solvent solubility, a methoxy group or a hydroxyl group is preferred. Also, from the viewpoint of sensitivity, it is preferably unsubstituted. As R¹ Examples of the aromatic ring group include: an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The carbon number is usually 4 or more, preferably 6 or more, more preferably 12 or less, more preferably 10 or less, and still more preferably 8 or less. By setting the carbon number of the aromatic ring group to be equal to or higher than the above lower limit, storage stability tends to become better, and by setting the carbon number of the aromatic ring group to be equal to or lower than the above upper limit value, there is a tendency that solvent solubility becomes better. The aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring. As the aromatic hydrocarbon ring group, for example, a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a naphthacene ring, a pyrene ring, a benzopyrene ring, a ring, and a bicyclic ring having one free valence can be mentioned. The base of terphenylene ring, ethane and naphthalene ring, fluoranthene ring, stilbene ring, etc. In addition, the aromatic heterocyclic ring in the aromatic heterocyclic group may be a monocyclic ring or a condensed ring. As the aromatic heterocyclic group, for example, a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, a diazole ring, and an indole having 1 free valence can be mentioned. Dole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzo Isoazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrimidine ring, pyrimidine ring, pyrimidine ring, tricyclic ring, quinoline ring, isoquinoline ring, quinoline ring, quinoline Ring, phenanthridine ring, benzimidazole ring, piperidine ring, quinazoline ring, quinazolinone ring, azulene ring, etc. Among them, from the viewpoint of solvent solubility, a benzene ring or a naphthalene ring having 1 free valence is preferable, and a benzene ring having 1 free valence is more preferable. Examples of substituents that the aromatic ring group may have include: alkyl groups with 1 to 10 carbons, alkoxy groups with 1 to 10 carbons, alkylthio groups with 1 to 10 carbons, F, Cl, Br, I From the viewpoint of solvent solubility, a methoxy group or a hydroxy group is preferable. Also, from the viewpoint of sensitivity, it is preferably unsubstituted. Among these, in terms of hardening, R¹ It is preferably an alkyl group which may have a substituent, more preferably an unsubstituted alkyl group, and still more preferably a methyl group. (R² ) In the above formula (I), R² It represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. R² The alkyl group may be linear, branched, cyclic, or a shape formed by these bonds. From the viewpoint of solvent solubility, it is preferably linear Or branched, more preferably branched. The carbon number of the alkyl group is not particularly limited, and is usually 1 or more, preferably 2 or more, more preferably 3 or more, still more preferably 4 or more, particularly preferably 5 or more, and preferably 10 or less, more preferably It is 8 or less, more preferably 7 or less, and particularly preferably 6 or less. When the carbon number of the alkyl group is set to the above lower limit or more, the solvent solubility tends to become better, and when it is set to the above upper limit or less, there is a tendency to become high sensitivity. Specific examples of alkyl groups include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, cyclopentyl, hexyl, and cyclohexyl. Wait. Among them, from the viewpoint of solvent solubility, isopropyl, isobutyl, isopentyl, or cyclopentyl is preferred, isobutyl or isopentyl is more preferred, and isopropyl is still more preferred. Amyl. Examples of substituents that the alkyl group may have include: aromatic ring groups with 6 to 10 carbons, alkoxy groups with 1 to 10 carbons, alkylthio groups with 1 to 10 carbons, F, Cl, Br, I From the viewpoint of solvent solubility, such as a halogen atom, a hydroxyl group, etc., an alkoxy group having 1 to 3 carbon atoms is preferred. Also, from the viewpoint of sensitivity, it is preferably unsubstituted. As R² Examples of the aromatic ring group include: an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The carbon number is usually 4 or more, preferably 6 or more, more preferably 12 or less, more preferably 10 or less, and still more preferably 8 or less. By setting the carbon number of the aromatic ring group to be equal to or higher than the above lower limit, the molecule tends to become stable, and by setting the carbon number of the aromatic ring group to be equal to or lower than the above upper limit, the solvent solubility tends to become better. The aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring. As the aromatic hydrocarbon ring group, for example, a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a naphthacene ring, a pyrene ring, a benzopyrene ring, a ring, and a bicyclic ring having one free valence can be mentioned. The base of terphenylene ring, ethane and naphthalene ring, fluoranthene ring, stilbene ring, etc. In addition, the aromatic heterocyclic ring in the aromatic heterocyclic group may be a monocyclic ring or a condensed ring. As the aromatic heterocyclic group, for example, a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, a diazole ring, and an indole having 1 free valence can be mentioned. Dole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzo Isoazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrimidine ring, pyrimidine ring, pyrimidine ring, tricyclic ring, quinoline ring, isoquinoline ring, quinoline ring, quinoline Ring, phenanthridine ring, benzimidazole ring, piperidine ring, quinazoline ring, quinazolinone ring, azulene ring, etc. Among them, from the viewpoint of solvent solubility, a benzene ring or a naphthalene ring having 1 free valence is preferable, and a benzene ring having 1 free valence is more preferable. Examples of substituents that the aromatic ring group may have include: alkyl groups with 1 to 10 carbons, alkoxy groups with 1 to 10 carbons, alkylthio groups with 1 to 10 carbons, F, Cl, Br, I From the viewpoint of solvent solubility, such as a halogen atom, a hydroxyl group, a nitro group, etc., an alkoxy group or a hydroxyl group having 1 to 3 carbon atoms is preferred. Also, from the viewpoint of sensitivity, it is preferably unsubstituted. Among these, in terms of sensitivity, R² It is preferably an alkyl group which may have a substituent, more preferably an unsubstituted alkyl group, and still more preferably an isopentyl group. (k) In the above formula (I), k represents 0 or 1. From the viewpoint of sensitivity, k is preferably 0. On the other hand, from the viewpoint of solvent solubility, k is preferably 1. (R³ ~R⁶ ) In the above formula (I), R³ ~R⁶ Each independently represents an arbitrary monovalent substituent. Examples of optional monovalent substituents include: alkyl groups having 1 to 10 carbon atoms such as methyl and ethyl groups; alkoxy groups having 1 to 10 carbon atoms such as methoxy and ethoxy groups; F, Cl, Br, I and other halogen atoms; acyl groups with 1 to 10 carbons; alkyl ester groups with 1 to 10 carbons; alkoxycarbonyl groups with 1 to 10 carbons; halogenated alkyl groups with 1 to 10 carbons; 4 to carbons Aromatic ring group of 10; Amino group; Amino alkyl group of 1 to 10 carbons; Hydroxyl group; Nitro group; CN group and the like. Among these, from the viewpoint of solvent solubility, a methyl group and a methoxy group are preferred, and a methyl group is more preferred. R³ , R⁴ And R⁶ In, when l, m and o are 2 or more, plural R³ , R⁴ And R⁶ They can be bonded to each other to form a ring. The ring may be an aliphatic ring or an aromatic ring. (l, m, n, o) In the above formula (I), l, m, and o each independently represent an integer of 0 to 3, and n represents 0 or 1. From the viewpoint of sensitivity, l, m, and o are each independently preferably 0 or 1, and more preferably 0. Also, from the viewpoint of sensitivity, n is preferably zero. The photopolymerization initiator represented by the above general formula (I) is preferably the following general formula (I-1) from the viewpoint of the balance of solvent solubility and sensitivity, and the appropriate interaction with the colorant The indicated photopolymerization initiator. [化5]

In formula (I-1), R¹ ~R⁶ , K~o is synonymous with the above formula (I). The maximum absorption wavelength of the photopolymerization initiator (c1) is not particularly limited. From the viewpoint of sensitivity, it is preferably 322 nm or more, more preferably 325 nm or more, still more preferably 328 nm or more, and still more preferably It is 329 nm or more, more preferably 330 nm or more, more preferably 337 nm or less, more preferably 336 nm or less, still more preferably 334 nm or less, and still more preferably 333 nm or less. By setting it in the above range, there is a tendency that the light between the bright line of 333 nm and the bright line of 365 nm (i-ray) emitted by the UV light source can be effectively used. The manufacturing method of the said photopolymerization initiator (c1) is not specifically limited, For example, the method described in International Publication No. 2015/036910 can be adopted. Moreover, as a specific example of the said photoinitiator (c1), the following can be mentioned, for example. [化6]

[化7]

[化8]

[化9]

The (c) photopolymerization initiator in the present invention contains, in addition to the above-mentioned photopolymerization initiator (c1), a photopolymerization initiator (c2) having a maximum absorption wavelength of 334 nm or more. <Photopolymerization initiator (c2)> The photopolymerization initiator (c2) is a photopolymerization initiator having a maximum absorption wavelength of 334 nm or more. In this way, it is considered that by combining the photopolymerization initiator (c1) and the photopolymerization initiator (c2) with a maximum absorption wavelength of 334 nm or more, the range of light wavelengths that can be effectively used is expanded and the sensitivity becomes better. The maximum absorption wavelength of the photopolymerization initiator (c2) is not particularly limited as long as it is 334 nm or more. From the viewpoint of sensitivity, it is preferably 335 nm or more, more preferably 336 nm or more, and still more preferably 338 nm or more, more preferably 340 nm or more, particularly preferably 345 nm or more, most preferably 350 nm or more, more preferably 390 nm or less, more preferably 380 nm or less, and still more preferably 375 nm or less, It is particularly preferably 370 nm or less. By setting the maximum absorption wavelength of the photopolymerization initiator (c2) above the above lower limit value, the degree of internal hardening tends to increase, and by setting it below the above upper limit value, there is a tendency for high sensitivity tendency. Furthermore, the difference between the maximum absorption wavelength of the photopolymerization initiator (c2) and the photopolymerization initiator (c1) is preferably 5 nm or more, more preferably 10 nm or more, still more preferably 20 nm or more, and particularly preferably 30 nm or more, more preferably 60 nm or less, more preferably 50 nm or less, and still more preferably 40 nm or less, the photopolymerization initiator (c1) and the photopolymerization starter having a suitable maximum absorption wavelength are selected and used The combination of agent (c2) is sufficient. By setting the difference between the maximum absorption wavelength of the photopolymerization initiator (c1) and the photopolymerization initiator (c2) to be more than the above lower limit, the effective wavelength range of light is expanded, and there is a tendency to increase sensitivity. By setting it below the above upper limit value, the sensitivity to i-rays (365 nm) of UV light tends to increase. The chemical structure of the above-mentioned photopolymerization initiator (c2) is not particularly limited. From the viewpoint of sensitivity, an oxime ester-based photopolymerization initiator is preferred, and a photopolymerization agent having a quince skeleton or a carbazole skeleton is particularly preferred. Starter. Furthermore, the term "having a sulphur skeleton or a carbazole skeleton" means having a sulphur ring or carbazole ring in the molecular structure, and these rings may be substituted. In addition, from the viewpoint of surface curability, the photopolymerization initiator (c2) is preferably a photopolymerization initiator represented by the following general formula (II). [化10]

In formula (II), R⁷ It represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. R⁸ It represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. p represents 0 or 1. R⁹ Represents any monovalent substituent. q represents an integer from 0 to 3. X means -N(R¹⁰ )-Or-C(R¹¹ )(R¹² )-. R^{1 0} ~R¹² Each independently represents a hydrogen atom, an optionally substituted alkyl group, or an optionally substituted aromatic ring group. R¹¹ With R¹² Can be bonded to each other to form a ring. (R⁷ ) In the above formula (II), R⁷ It represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. R⁷ The alkyl group may be linear, branched, cyclic, or formed by these bonds. The carbon number of the alkyl group is not particularly limited, and is preferably 10 or less, more preferably 7 or less, still more preferably 5 or less, particularly preferably 3 or less, most preferably 2 or less, and usually 1 or more. By setting the carbon number of the alkyl group to the above upper limit or less, the crosslinking density tends to increase. Specific examples of alkyl groups include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, cyclopentyl, hexyl, and cyclohexyl. Wait. Among them, from the viewpoint of sensitivity, a methyl group, an ethyl group, a propyl group, or a butyl group is preferable, a methyl group or an ethyl group is more preferable, and a methyl group is still more preferable. Examples of substituents that the alkyl group may have include: aromatic ring groups with 6 to 10 carbons, alkoxy groups with 1 to 10 carbons, alkylthio groups with 1 to 10 carbons, F, Cl, Br, I From the viewpoint of solvent solubility, such as a halogen atom, a hydroxyl group, etc., an alkoxy group having 1 to 3 carbon atoms is preferred. Also, from the viewpoint of sensitivity, it is preferably unsubstituted. As R⁷ Examples of the aromatic ring group include: an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The carbon number is usually 4 or more, preferably 6 or more, more preferably 12 or less, more preferably 10 or less, and still more preferably 8 or less. By setting the carbon number of the aromatic ring group to be equal to or higher than the above lower limit, the molecule tends to become stable, and by setting the carbon number of the aromatic ring group to be equal to or lower than the above upper limit, the solvent solubility tends to become better. The aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring. As the aromatic hydrocarbon ring group, for example, a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a naphthacene ring, a pyrene ring, a benzopyrene ring, a ring, and a bicyclic ring having one free valence can be mentioned. The base of terphenylene ring, ethane and naphthalene ring, fluoranthene ring, stilbene ring, etc. In addition, the aromatic heterocyclic ring in the aromatic heterocyclic group may be a monocyclic ring or a condensed ring. As the aromatic heterocyclic group, for example, a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, a diazole ring, and an indole having 1 free valence can be mentioned. Dole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzo Isoazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrimidine ring, pyrimidine ring, pyrimidine ring, tricyclic ring, quinoline ring, isoquinoline ring, quinoline ring, quinoline Ring, phenanthridine ring, benzimidazole ring, piperidine ring, quinazoline ring, quinazolinone ring, azulene ring, etc. Among them, from the viewpoint of solvent solubility, a benzene ring or a naphthalene ring having 1 free valence is preferable, and a benzene ring having 1 free valence is more preferable. Examples of substituents that the aromatic ring group may have include: alkyl groups with 1 to 10 carbons, alkoxy groups with 1 to 10 carbons, alkylthio groups with 1 to 10 carbons, F, Cl, Br, I From the viewpoint of solvent solubility, such as a halogen atom, a hydroxyl group, a nitro group, etc., an alkoxy group or a hydroxyl group having 1 to 3 carbon atoms is preferred. Among these, in terms of sensitivity, R⁷ It is preferably an alkyl group which may have a substituent, more preferably an unsubstituted alkyl group, further preferably a methyl group or an ethyl group, and particularly preferably a methyl group. (R⁸ ) In the above formula (II), R⁸ It represents an optionally substituted alkyl group or an optionally substituted aromatic ring group. R⁸ The alkyl group may be linear, branched, cyclic, or a shape formed by these bonds. From the viewpoint of solvent solubility, it is preferably linear Or branched, more preferably branched. On the other hand, from the viewpoint of sensitivity, a group formed by bonding a linear alkyl group to a cyclic alkyl group is preferred. The carbon number of the alkyl group is not particularly limited, and is usually 1 or more, preferably 2 or more, more preferably 3 or more, still more preferably 4 or more, still more preferably 5 or more, particularly preferably 6 or more, most preferably 7 or more, more preferably 12 or less, more preferably 10 or less, still more preferably 9 or less, and particularly preferably 8 or less. When the carbon number of the alkyl group is set to the above lower limit or more, the solvent solubility tends to become better, and when it is set to the above upper limit or less, there is a tendency to become high sensitivity. Examples of substituents that the alkyl group may have include: aromatic ring groups with 6 to 10 carbons, alkoxy groups with 1 to 10 carbons, alkylthio groups with 1 to 10 carbons, and alkanes with 1 to 10 carbons. From the viewpoint of solvent solubility, the oxycarbonyl group, halogen atoms such as F, Cl, Br, and I, and hydroxyl groups are preferably alkoxy groups having 1 to 3 carbon atoms. Also, from the viewpoint of sensitivity, it is preferably unsubstituted. Specific examples of alkyl groups include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, cyclopentyl, hexyl, and cyclohexyl. , Cyclopentylmethyl, cyclopentylethyl, cyclohexylmethyl, cyclohexylethyl, etc. Among them, from the viewpoint of solvent solubility, isopentyl, cyclohexylmethyl, cyclopentylethyl, or cyclohexylethyl is preferred, and cyclopentylethyl or cyclohexylethyl is more preferred. The group is more preferably cyclohexylethyl. As R⁸ Examples of the aromatic ring group include: an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The carbon number is usually 4 or more, preferably 6 or more, more preferably 12 or less, more preferably 10 or less, and still more preferably 8 or less. By setting the carbon number of the aromatic ring group to be equal to or higher than the above lower limit, the molecule tends to become stable, and by setting the carbon number of the aromatic ring group to be equal to or lower than the above upper limit, the solvent solubility tends to become better. The aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring. As the aromatic hydrocarbon ring group, for example, a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a naphthacene ring, a pyrene ring, a benzopyrene ring, a ring, and a bicyclic ring having one free valence can be mentioned. The base of terphenylene ring, ethane and naphthalene ring, fluoranthene ring, stilbene ring, etc. In addition, the aromatic heterocyclic ring in the aromatic heterocyclic group may be a monocyclic ring or a condensed ring. As the aromatic heterocyclic group, for example, a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, a diazole ring, and an indole having 1 free valence can be mentioned. Dole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzo Isoazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrimidine ring, pyrimidine ring, pyrimidine ring, tricyclic ring, quinoline ring, isoquinoline ring, quinoline ring, quinoline Ring, phenanthridine ring, benzimidazole ring, piperidine ring, quinazoline ring, quinazolinone ring, azulene ring, etc. Among them, from the viewpoint of solvent solubility, a benzene ring or a naphthalene ring having 1 free valence is preferable, and a benzene ring having 1 free valence is more preferable. Examples of substituents that the aromatic ring group may have include: alkyl groups with 1 to 10 carbons, alkoxy groups with 1 to 10 carbons, alkylthio groups with 1 to 10 carbons, F, Cl, Br, I From the viewpoint of solvent solubility, such as a halogen atom, a hydroxyl group, a nitro group, etc., an alkoxy group or a hydroxyl group having 1 to 5 carbon atoms is preferred. The alkyl chain part of the substituent may be linear or branched, and further may have substituents such as alkoxy groups with 1 to 3 carbons, alkylthio groups with 1 to 3 carbons, halogen atoms, hydroxyl groups, and nitro groups. . Among them, from the viewpoint of increasing the wavelength of light absorption, R⁸ The aromatic ring group which may have a substituent is preferable, and the aromatic hydrocarbon ring group which may have a substituent is more preferable. (p) In the above formula (II), p represents 0 or 1. From the viewpoint of sensitivity, p is preferably 0. On the other hand, from the viewpoint of solvent solubility, p is preferably 1. (R⁹ ) In the above formula (II), R⁹ Represents any monovalent substituent. The optional monovalent substituents include: alkyl groups having 1 to 10 carbon atoms such as methyl and ethyl; alkoxy groups having 1 to 10 carbon atoms such as methoxy and ethoxy; F, CI, Br, I and other halogen atoms; acyl groups with 1 to 10 carbons; alkyl ester groups with 1 to 10 carbons; alkoxycarbonyl groups with 1 to 10 carbons; halogenated alkyl groups with 1 to 10 carbons; 4 to carbons Aromatic ring group of 10; amino group; aminoalkyl group having 1 to 10 carbon atoms; hydroxyl group; nitro group; Examples of the substituents that the benzyl group or the thienoyl group may have include: an alkyl group with 1 to 3 carbons, an alkoxy group with 1 to 3 carbons, etc., which may be in the range of 0 to 3. Substituents. Among these, from the viewpoint of increasing the wavelength of the absorption wavelength, a nitro group and a 2-thienyl group are preferable, and a nitro group is more preferable. R⁹ In the case where q is 2 or more, plural R⁹ They can be bonded to each other to form a ring. The ring may be an aliphatic ring or an aromatic ring. (q) In the above formula (II), q represents an integer of 0 to 3. From the viewpoint of the efficiency of radical generation, 0 or 1 is preferred, and 1 is more preferred. (X) In the above formula (II), X represents -N(R¹⁰ )-Or-C(R¹¹ )(R¹² )-. Among them, from the viewpoint of sensitivity, -N(R¹⁰ )-. (R¹⁰ ~R¹² ) In the above formula (II), R¹⁰ ~R¹² Each independently represents a hydrogen atom, an optionally substituted alkyl group, or an optionally substituted aromatic ring group. R¹⁰ ~R¹² The alkyl group may be linear, branched, cyclic, or a shape formed by these bonds. From the viewpoint of sensitivity, it is preferably linear or branched. Chain shape, more preferably straight chain shape. The carbon number of the alkyl group is not particularly limited, and is usually 1 or more, preferably 2 or more, more preferably 3 or more, still more preferably 4 or more, particularly preferably 5 or more, and preferably 10 or less, more preferably It is 8 or less, more preferably 6 or less, and particularly preferably 4 or less. When the carbon number of the alkyl group is set to the above lower limit or more, the solvent solubility tends to become better, and when it is set to the above upper limit or less, there is a tendency to become high sensitivity. Specific examples of alkyl groups include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, cyclopentyl, hexyl, and cyclohexyl. , 2-Ethylhexyl, etc. Among them, from the viewpoint of the balance between sensitivity and solvent solubility, ethyl, propyl, isopropyl, or butyl is preferred, ethyl or propyl is more preferred, and ethyl is still more preferred. base. Examples of substituents that the alkyl group may have include: aromatic ring groups with 6 to 10 carbons, alkoxy groups with 1 to 10 carbons, alkylthio groups with 1 to 10 carbons, F, Cl, Br, I From the viewpoint of solvent solubility, such as a halogen atom, a hydroxyl group, etc., an alkoxy group having 1 to 3 carbon atoms is preferred. Also, from the viewpoint of sensitivity, it is preferably unsubstituted. As R^{1 0} ~R¹² Examples of the aromatic ring group include: an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The carbon number is usually 4 or more, preferably 6 or more, more preferably 12 or less, more preferably 10 or less, and still more preferably 8 or less. By setting the carbon number of the aromatic ring group to be equal to or higher than the above lower limit, the molecule tends to become stable, and by setting the carbon number of the aromatic ring group to be equal to or lower than the above upper limit, the solvent solubility tends to become better. The aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring. As the aromatic hydrocarbon ring group, for example, a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a naphthacene ring, a pyrene ring, a benzopyrene ring, a pyrene ring, and a bicyclic ring having one free valence can be mentioned. The base of terphenylene ring, ethane and naphthalene ring, fluoranthene ring, stilbene ring, etc. In addition, the aromatic heterocyclic ring in the aromatic heterocyclic group may be a monocyclic ring or a condensed ring. As the aromatic heterocyclic group, for example, a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, a diazole ring, and an indole having 1 free valence can be mentioned. Dole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzo Isoazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrimidine ring, pyrimidine ring, pyrimidine ring, tricyclic ring, quinoline ring, isoquinoline ring, quinoline ring, quinoline Ring, phenanthridine ring, benzimidazole ring, piperidine ring, quinazoline ring, quinazolinone ring, azulene ring, etc. Among them, from the viewpoint of solvent solubility, a benzene ring or a naphthalene ring having 1 free valence is preferable, and a benzene ring having 1 free valence is more preferable. Examples of substituents that the aromatic ring group may have include: alkyl groups with 1 to 10 carbons, alkoxy groups with 1 to 10 carbons, alkylthio groups with 1 to 10 carbons, F, Cl, Br, I From the viewpoint of solvent solubility, such as a halogen atom, a hydroxyl group, a nitro group, etc., an alkoxy group or a hydroxyl group having 1 to 3 carbon atoms is preferred. Also, from the viewpoint of sensitivity, it is preferably unsubstituted. Again, R¹¹ With R¹² They may be bonded to each other to form a ring, and the ring may be an aliphatic ring or an aromatic ring. Among these, in terms of sensitivity, R^{1 0} ~R¹² Preferably, each independently is an alkyl group which may have a substituent, more preferably an unsubstituted alkyl group, and still more preferably R¹⁰ Is methyl or ethyl, R¹¹ And R¹² For butyl. In addition, commercial products of the photopolymerization initiator (c2) include: OXE-02 manufactured by BASF, TR-PBG-304, TR-PBG-314, TR-PBG manufactured by Changzhou Qiangli Electronic New Materials Co., Ltd. -358 etc. In addition, those described in Japanese Patent No. 4223071, those described in International Publication No. 2016/010036, and those described in Japanese Patent No. 5682094 may also be used. As specific examples of the photopolymerization initiator (c2), for example, the following can be cited. Furthermore, in the formula, nBu represents n-butyl. [化11]

[化12]

[化13]

[化14]

(c) The photopolymerization initiator may further include other photopolymerization initiators other than the photopolymerization initiator (c1) and the photopolymerization initiator (c2). As other photopolymerization initiators, for example, the metallocene compound containing the titanocene compound described in Japanese Patent Laid-Open No. 59-152396 and Japanese Patent Laid-Open No. 61-151197; Japanese Patent The hexaarylbiimidazole derivatives described in JP 2000-56118 A; the halomethylated oxadiazole derivatives, halomethyl tristriazole derivatives, N- N-aryl-α-amino acids such as phenylglycine, N-aryl-α-amino acid salts, N-aryl-α-amino acid esters and other free radical activators, α- Amino alkyl phenone derivatives; oxime ester derivatives described in Japanese Patent Laid-Open No. 2000-80068, Japanese Patent Laid-Open No. 2006-36750, etc. Specifically, as the titanocene derivatives, for example, dicyclopentadienyl titanium dichloride, dicyclopentadienyl titanium biphenyl, dicyclopentadienyl titanium bis(2,3, 4,5,6-pentafluorophenyl-1-yl), dicyclopentadienyl titanium bis(2,3,5,6-tetrafluorophenyl-1-yl), dicyclopentadienyl titanium bis( 2,4,6-trifluorophenyl-1-yl), dicyclopentadienyl titanium bis(2,6-difluorophenyl-1-yl), dicyclopentadienyl titanium bis(2,4- Difluorobenzene-1-yl), bis(methylcyclopentadienyl) titanium bis(2,3,4,5,6-pentafluorophenyl-1-yl), bis(methylcyclopentadienyl) ) Titanium bis(2,6-difluorophenyl-1-yl), dicyclopentadienyl titanium [2,6-difluoro-3-(pyrrol-1-yl)-phenyl-1-yl] and the like. In addition, examples of biimidazole derivatives include 2-(2'-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-chlorophenyl)-4,5- Bis(3'-methoxyphenyl) imidazole dimer, 2-(2'-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-methoxyphenyl) )-4,5-diphenylimidazole dimer, (4'-methoxyphenyl)-4,5-diphenylimidazole dimer, etc. In addition, examples of the halomethylated oxadiazole derivatives include 2-trichloromethyl-5-(2'-benzofuranyl)-1,3,4-oxadiazole and 2-trichloro Methyl-5-[β-(2'-benzofuranyl)vinyl]-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-(6' '-Benzofuranyl)vinyl)]-1,3,4-oxadiazole, 2-trichloromethyl-5-furyl-1,3,4-oxadiazole and the like. In addition, as the derivatives of halomethyl s-tris, 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)ss-tris, 2-(4-methoxy -Naphthyl)-4,6-bis(trichloromethyl)s-tris, 2-(4-ethoxynaphthyl)-4,6-bis(trichloromethyl)ss-tris, 2-( 4-ethoxycarbonyl naphthyl)-4,6-bis(trichloromethyl)s-tri 𠯤 and so on. In addition, examples of α-aminoalkylphenone derivatives include 2-methyl-1-[4-(methylthio)phenyl]-2-𠰌line propan-1-one, 2- Benzyl-2-dimethylamino-1-(4-???????????-butanone-1, 2-benzyl-2-dimethylamino-1-(4-??????????? Yl)butane-1-one, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 4-diethylaminoacetophenone, 4-dimethylaminobenzoate Aminopropiophenone, 2-ethylhexyl 1,4-dimethylaminobenzoate, 2,5-bis(4-diethylaminobenzylidene)cyclohexanone, 7-diethylamine 3-(4-diethylaminobenzyl)coumarin, 4-(diethylamino)chalcone and the like. Examples of oxime ester derivatives include: Japanese Patent Application Publication No. 2004-534797, Japanese Patent Application Publication No. 2000-80068, Japanese Patent Application Publication No. 2006-36750, Japanese Patent Application Publication No. 2008-179611, Japan An oxime ester compound described in Patent Special Publication No. 2012-526185 and Japanese Patent Publication No. 2012-519191. Among them, 4-acetoxyimino-5-[9-ethyl-6-(2-methylbenzyl)-9H-carbazol-3-yl is preferred from the viewpoint of sensitivity ] Methyl-5-oxovalerate, and as product names, OXE-01 (manufactured by BASF Corporation), TR-PBG-305 (manufactured by Changzhou Qiangli Company), NCI-930 (manufactured by ADEKA Corporation), etc. can be cited . The above-mentioned other photopolymerization initiators may be used alone or in combination of two or more kinds. <Sensitizing dye> If necessary, a sensitizing dye corresponding to the wavelength of the image exposure light source can be used in combination with the photopolymerization initiator to improve the sensitivity. Examples of such sensitizing dyes include: the ones described in Japanese Patent Laid-Open No. 4-221958, Japanese Patent Laid-Open No. 4-219756, etc.

Pigments, coumarin pigments with heterocycles described in Japanese Patent Laid-Open No. 3-239703, Japanese Patent Laid-Open No. 5-289335, etc., Japanese Patent Laid-Open No. 3-239703, Japanese Patent Laid-Open No. 5-289335, etc. 3-ketocoumarin compounds described in 289335, etc., pyrromethene pigments described in Japanese Patent Laid-Open No. 6-19240, and Japanese Patent Laid-Open No. 47-2528 and Japanese Patent Laid-Open 54-155292, Japanese Patent Publication No. 45-37377, Japanese Patent Publication No. 48-84183, Japanese Patent Publication No. 52-112681, Japanese Patent Publication No. 58-15503, Japanese Patent Application Publication No. 60-88005, Japanese Patent Application Publication No. 59-56403, Japanese Patent Application Publication No. 2-69, Japanese Patent Application Publication No. 57-168088, Japanese Patent Application Publication No. 5-107761 Dye having a dialkylaminobenzene skeleton described in Japanese Patent Publication No. 5-210240, Japanese Patent Application Publication No. 4-288818, etc. Among these sensitizing dyes, preferably, sensitizing dyes containing an amine group, and more preferably a compound having an amine group and a phenyl group in the same molecule. Particularly preferred ones are, for example, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 2-aminobenzophenone, 4-aminobenzophenone Benzophenone compounds such as ketone, 4,4'-diaminobenzophenone, 3,3'-diaminobenzophenone, 3,4-diaminobenzophenone; 2- (P-Dimethylaminophenyl)benzoxazole, 2-(p-diethylaminophenyl)benzoxazole, 2-(p-dimethylaminophenyl)benzo[4,5 ]Benzoazole, 2-(p-dimethylaminophenyl)benzo[6,7]benzoxazole, 2,5-bis(p-diethylaminophenyl)1,3,4 -Azole, 2-(p-dimethylaminophenyl)benzothiazole, 2-(p-diethylaminophenyl)benzothiazole, 2-(p-dimethylaminophenyl)benzo Imidazole, 2-(p-diethylaminophenyl) benzimidazole, 2,5-bis(p-diethylaminophenyl) 1,3,4-thiadiazole, (p-dimethylaminophenyl) Phenyl)pyridine, (p-diethylaminophenyl)pyridine, (p-dimethylaminophenyl)quinoline, (p-diethylaminophenyl)quinoline, (p-dimethylaminophenyl) Phenyl)pyrimidine, (p-diethylaminophenyl)pyrimidine and other compounds containing p-dialkylaminophenyl. Among them, the best is 4,4'-dialkylaminobenzophenone. A sensitizing dye may be used individually by 1 type, and may use 2 or more types together. (C) The content ratio of the photopolymerization initiator is usually 0.1% by mass or more, preferably 1% by mass or more, and more preferably 2% by mass relative to the total solid content of the photosensitive resin composition of the present invention Above, more preferably 3% by mass or more, more preferably 4% by mass or more, and usually 30% by mass or less, preferably 20% by mass or less, more preferably 15% by mass or less, and still more preferably 10% by mass % Or less, more preferably 8 mass% or less, and particularly preferably 6 mass% or less. By setting the content ratio of the (c) photopolymerization initiator to be higher than the above lower limit, there is a tendency that the influence of oxygen inhibition can be suppressed, and by setting the content of the photopolymerization initiator to be lower than the above upper limit, there is a tendency for the adhesion of the substrate to be reduced. The tendency to get good. (c) The content ratio of the photopolymerization initiator (c1) in the photopolymerization initiator is not particularly limited, but is preferably 0.1% by mass or more, more preferably 1% by mass or more, and still more preferably 10% by mass or more , And more preferably 20% by mass or more, particularly preferably 30% by mass or more, most preferably 40% by mass or more, more preferably 99.9% by mass or less, more preferably 99% by mass or less, and still more preferably 90% by mass % Or less, preferably 60% by mass or less. By setting the content ratio of the photopolymerization initiator (c1) to be higher than the above lower limit value, the internal curability tends to become better, and by setting the content ratio of the photopolymerization initiator (c1) to be lower than the upper limit value, there is a hardening of the upper part of the pattern. The tendency of sex to become good. (c) The content ratio of the photopolymerization initiator (c2) in the photopolymerization initiator is not particularly limited, but is preferably 0.1% by mass or more, more preferably 1% by mass or more, and still more preferably 10% by mass or more , Preferably 40% by mass or more, more preferably 99.9% by mass or less, more preferably 99% by mass or less, still more preferably 90% by mass or less, still more preferably 80% by mass or less, particularly preferably 60% by mass %the following. By setting the content ratio of the photopolymerization initiator (c2) to be more than the above lower limit, the curability of the upper part of the pattern tends to become better, and by setting the content of the photopolymerization initiator (c2) below the above upper limit, there is an internal curing The tendency of sex to become good. <(a) Alkali-soluble resin> The photosensitive resin composition of this invention contains (a) alkali-soluble resin. (a) Alkali-soluble resin, as long as the coating film obtained by applying the photosensitive resin composition and drying is exposed, the solubility of the exposed part and the non-exposed part in the alkaline developer is changed, there is no Specifically, it is preferably an alkali-soluble resin having acidic functional groups such as a hydroxyl group, a carboxyl group, a phosphoric acid group, and a sulfonic acid group, and more preferably an alkali-soluble resin having a carboxyl group. In addition, from the viewpoint of curability, it is preferably one having an ethylenically unsaturated group, and from the viewpoint of curability and developability, it is more preferably an alkali-soluble resin having an ethylenically unsaturated group and a carboxyl group. Specifically, epoxy (meth)acrylate resins or acrylic copolymer resins having carboxyl groups can be cited. Preferred ones, more specifically, the following can be cited as (A1-1) and (A1-2) As described in (A2-1), (A2-2), (A2-3), and (A2-4), one type or two or more types of these can be used. Among the above, epoxy (meth)acrylate resins (A1-1) and (A1-2) having a carboxyl group are particularly desirable. Epoxy (meth)acrylate resin with carboxyl group is the reactant of epoxy resin and α,β-unsaturated monocarboxylic acid and/or α,β-unsaturated monocarboxylic acid ester with carboxyl group in the ester part A resin obtained by reacting the hydroxyl group generated by the reaction with a polybasic acid and/or its anhydride. Furthermore, before reacting the hydroxyl group with the polybasic acid and/or its anhydride, first react with a compound having two or more substituents capable of reacting with the hydroxyl group, and then react with the polybasic acid and/or its anhydride, The resin thus obtained is also contained in the epoxy (meth)acrylate resin. Furthermore, the carboxyl group of the resin obtained in the above reaction is reacted with a compound having a functional group capable of further reacting with the carboxyl group, and the resin thus obtained is also included in the epoxy (meth)acrylate resin. In this way, epoxy (meth)acrylate resin does not substantially have epoxy groups in its chemical structure, and is not limited to "(meth)acrylate", but because epoxy resin is used as a raw material, and "(methyl) )Acrylic" is a representative example, so it is named as usual. Examples of the epoxy (meth)acrylate resin having a carboxyl group include the following epoxy (meth)acrylate resin (A1-1) and/or epoxy (meth)acrylate resin (A1-2) . <Epoxy (meth)acrylate resin (A1-1)> By adding α,β-unsaturated monocarboxylic acid or α,β-unsaturated monocarboxylic acid ester with carboxyl group to epoxy resin, Alkali-soluble resin obtained by reacting polybasic acid and/or its anhydrate. <Epoxy (meth)acrylate resin (A1-2)> By adding α,β-unsaturated monocarboxylic acid or α,β-unsaturated monocarboxylic acid ester with carboxyl group to epoxy resin, Alkali-soluble resin obtained by reacting polyhydric alcohol, polybasic acid and/or its anhydrate. <Epoxy (meth)acrylate resin (A1-1)> The epoxy resin used as a raw material includes the raw material compound before the resin is formed by heat curing. The epoxy resin can be from a known ring Appropriate selection and use among oxygen resins. In addition, as the epoxy resin, a compound obtained by reacting a phenolic compound with epihalohydrin can be used. The phenolic compound is preferably a compound having a phenolic hydroxyl group having a valence of two or more, and it may be a monomer or a polymer. As the type of epoxy resin, cresol novolak type epoxy resin, phenol novolak type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, trisphenol methane type epoxy resin can be preferably used. Oxygen resin, biphenol novolac type epoxy resin, naphthalene novolac type epoxy resin, epoxy resin as the reaction product of the addition polymerization reaction product of dicyclopentadiene and phenol or cresol and epihalohydrin, Epoxy resins containing adamantyl groups, sulphur-type epoxy resins, etc., can be preferably used as those having an aromatic ring in the main chain. As specific examples of epoxy resins, bisphenol A epoxy resins (for example, "jER (registered trademark. The same hereinafter) 828" manufactured by Mitsubishi Chemical Corporation, "jER1001", "jER1002", and "jER1004" can be preferably used as specific examples of epoxy resins. "Etc 76℃)), bisphenol F type resin (such as "jER807", "EP-4001", "EP-4002", "EP-4004" manufactured by Mitsubishi Chemical Corporation, etc.), by bisphenol F type epoxy resin The epoxy resin obtained by the reaction of the alcoholic hydroxyl group and epichlorohydrin (such as "NER-7406" manufactured by Nippon Kayaku Co., Ltd. (Epoxy equivalent 350, softening point 66°C)), bisphenol S type epoxy resin, Biphenyl glycidyl ether (for example, "YX-4000" manufactured by Mitsubishi Chemical Corporation), phenol novolac type epoxy resin (for example, "EPPN-201" manufactured by Nippon Kayaku Corporation, and "EP-152" manufactured by Mitsubishi Chemical Corporation ", "EP-154", "DEN-438" manufactured by The Dow Chemical Company), (ortho, meta, p) cresol novolac epoxy resin (for example, "EOCN (registered trademark) manufactured by Nippon Kayaku Co., Ltd." The following is the same) -102S", "EOCN-1020", "EOCN-104S"), triglycidyl isocyanurate (for example, "TEPIC (registered trademark)" manufactured by Nissan Chemical Co., Ltd.), triphenol methane type ring Oxygen resin (e.g. "EPPN (registered trademark. The same below)-501", "EPPN-502", "EPPN-503" manufactured by Nippon Kayaku Co., Ltd.), alicyclic epoxy resin ("Celloxide ( Registered trademark. Same as below) 2021P", "Celloxide EHPE"), epoxy resin obtained by glycidylating a phenol resin obtained by the reaction of dicyclopentadiene and phenol (for example, "EXA-7200" manufactured by DIC Corporation , "NC-7300" manufactured by Nippon Kayaku Co., Ltd.), epoxy resin represented by the following general formulas (a1)~(a5), etc. Specifically, the epoxy resin represented by the following general formula (a1) includes "XD-1000" manufactured by Nippon Kayaku Co., Ltd., and the epoxy resin represented by the following general formula (a2) includes The "NC-3000" manufactured by Nippon Kayaku Co., Ltd., as an epoxy resin represented by the following general formula (a4), includes "ESF-300" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., etc. [化15]

In the above general formula (a1), b11 represents an average value and represents a number from 0 to 10. R¹¹ It represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a phenyl group, a naphthyl group, or a biphenyl group. Furthermore, there are multiple Rs in 1 molecule¹¹ They may be the same or different. [化16]

In the above general formula (a2), b12 represents an average value and represents a number from 0 to 10. R^{twenty one} It represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a phenyl group, a naphthyl group, or a biphenyl group. Furthermore, there are multiple Rs in 1 molecule^{twenty one} They may be the same or different. [化17]

In the above general formula (a3), X represents a linking group represented by the following general formula (a3-1) or (a3-2). Among them, the molecular structure contains more than one adamantane structure. b13 represents an integer of 2 or 3. [化18]

In the above general formulas (a3-1) and (a3-2), R³¹ ~R³⁴ And R³⁵ ~R³⁷ Each independently represents an adamantyl group which may have a substituent, a hydrogen atom, an alkyl group with 1 to 12 carbons which may have a substituent, or a phenyl group which may have a substituent. In addition, the * in the formula represents the bonding position in (a3). [化19]

In the above general formula (a4), p and q each independently represent an integer from 0 to 4, and R^{4 1} And R⁴² Each independently represents an alkyl group having 1 to 20 carbon atoms or a halogen atom. R⁴³ And R⁴⁴ Each independently represents an alkylene group having 1 to 5 carbon atoms. x and y each independently represent an integer of 0 or more. [化20]

In the above general formula (a5), R⁵¹ ~R⁵⁴ Each independently a hydrogen atom, an alkyl group with 1-20 carbon atoms, an aryl group with 6-20 carbon atoms, or an aralkyl group with 7-20 carbon atoms, R⁵⁵ Is an alkyl group with 1-20 carbons, an aryl group with 6-20 carbons, or an aralkyl group with 7-20 carbons, R^{5 6} Each is independently an alkylene group having 1 to 5 carbon atoms. k is an integer from 1 to 5, l is an integer from 0 to 13, and m is independently an integer from 0 to 5. Among these, it is preferable to use an epoxy resin represented by any one of general formulas (a1) to (a5). Examples of α,β-unsaturated monocarboxylic acids or α,β-unsaturated monocarboxylic acid esters having carboxyl groups include (meth)acrylic acid, crotonic acid, ortho/m/p-vinyl benzoic acid, (form Yl) α-position haloalkyl, alkoxy, halogen, nitro, cyano substituted monocarboxylic acids of acrylic acid, 2-(meth)acryloyloxyethyl succinate, 2-(methyl adipic acid) Oxyethyl acrylate, 2-(meth) acrylate oxyethyl phthalate, 2-(meth) acrylate oxyethyl hexahydrophthalate, maleic acid 2-(meth)acryloyloxy ethyl ester, 2-(meth)acryloyloxypropyl succinate, 2-(meth)acryloyloxypropyl adipic acid, tetrahydrophthalic acid 2-(meth)acryloxypropyl ester, 2-(meth)acryloxypropyl phthalate, 2-(meth)acryloxypropyl maleate, succinic acid 2-(Meth)acrylic acid oxybutyl ester, adipic acid 2-(meth)acrylic acid oxybutyl ester, hydrogen phthalate 2-(meth)acrylic acid oxybutyl ester, phthalic acid 2-(meth)acryloyloxy butyl formate, 2-(meth)acryloyloxybutyl maleate; as the (meth)acrylate, there may be mentioned: on (meth)acrylic acid Addition of ε-caprolactone, β-propiolactone, γ-butyrolactone, δ-valerolactone and other lactones to have a hydroxyl group at the end, or to a monomer such as (meth)acrylic acid hydroxyalkane The base ester is a monomer having a hydroxyl group at the end, or pentaerythritol tri(meth)acrylate is added to a compound having a hydroxyl group at the end by adding succinic acid (anhydride), phthalic acid (anhydride), cis Acids (anhydrides) such as butenedioic acid (anhydride) have one or more ethylenically unsaturated groups and (meth)acrylates having one carboxyl group at the end. Moreover, (meth)acrylic acid dimer etc. can also be mentioned. Among them, (meth)acrylic acid is particularly preferable in terms of sensitivity. As a method of adding α,β-unsaturated monocarboxylic acid or α,β-unsaturated monocarboxylic acid ester having a carboxyl group to an epoxy resin, a known method can be used. For example, α,β-unsaturated monocarboxylic acid or α,β-unsaturated monocarboxylic acid ester with carboxyl group can be reacted with epoxy resin in the presence of an esterification catalyst at a temperature of 50~150℃ . As the esterification catalyst used here, tertiary amines such as triethylamine, trimethylamine, benzyldimethylamine, benzyldiethylamine, tetramethylammonium chloride, and tetraethylammonium chloride can be used. , Quaternary ammonium salts such as dodecyl trimethyl ammonium chloride, etc. Furthermore, epoxy resin, α,β-unsaturated monocarboxylic acid or α,β-unsaturated monocarboxylic acid ester with carboxyl group, and esterification catalyst can be used alone, or two or more of them can be used in combination . Regarding the usage amount of α,β-unsaturated monocarboxylic acid or α,β-unsaturated monocarboxylic acid ester with carboxyl group, relative to 1 equivalent of epoxy group of epoxy resin, it is preferably in the range of 0.5~1.2 equivalent, More preferably, it is in the range of 0.7 to 1.1 equivalents. If the usage amount of α,β-unsaturated monocarboxylic acid or α,β-unsaturated monocarboxylic acid ester with carboxyl group is more than the above lower limit, the amount of introduction of unsaturated groups is sufficient, and subsequent contact with polybasic acid and/ The reaction of its anhydrate will be sufficient, and the tendency of epoxy groups to remain can also be suppressed. On the other hand, if the usage amount is less than the above upper limit, the presence of α,β-unsaturated monocarboxylic acid or α,β-unsaturated monocarboxylic acid ester having a carboxyl group will remain as unreacted product and cause hardening. The tendency to suppress the deterioration of characteristics. Examples of polybasic acids and/or their anhydrates include those selected from maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, and pyromellitic acid , Trimellitic acid, benzophenone tetracarboxylic acid, methyl hexahydrophthalic acid, endo-methylene tetrahydrophthalic acid, chlorosacic acid, methyl tetrahydrophthalic acid, biphenyl One or more of tetracarboxylic acid and these anhydrides. Preferably maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, biphenyltetracarboxylic acid Acid, or such anhydrous substances. Particularly preferred is tetrahydrophthalic acid, biphenyltetracarboxylic acid, tetrahydrophthalic anhydride, or biphenyltetracarboxylic dianhydride. Regarding the addition reaction of polybasic acids and/or their anhydrates, well-known methods can also be used to add α,β-unsaturated monocarboxylic acids or α,β-unsaturated monocarboxylic acid esters with carboxyl groups to epoxy resins. Under the same conditions of the addition reaction, continue to react to obtain the target. Regarding the addition amount of the polybasic acid and/or its anhydrous component, it is preferably such an extent that the acid value of the carboxyl-containing epoxy (meth)acrylate resin is in the range of 10 to 150 mgKOH/g, More preferably, it is such an extent that it falls within the range of 20 to 140 mgKOH/g. By setting the acid value of the carboxyl group-containing epoxy (meth)acrylate resin to be higher than the above lower limit, the alkali developability tends to become better, and by setting the acid value below the above upper limit, the curability The tendency to become good. <The synthesis of (A1-1) resin and the synthesis of (A1-2) resin with branched structure introduced by adding polyol to (A1-1) resin> Polyacid and/or polyacid in the above (A1-1) resin During the synthesis by the addition reaction of the anhydrate, polyols such as trimethylolpropane, pentaerythritol, and dipentaerythritol can be added to produce a multi-branched structure introduced. The epoxy (meth)acrylate resin containing carboxyl group is usually obtained by the following method: the reaction product of epoxy resin and α,β-unsaturated monocarboxylic acid or α,β-unsaturated monocarboxylic acid ester with carboxyl group After mixing the polybasic acid and/or its anhydrate, or mixing the polybasic acid and/or the reactant of the epoxy resin with α,β-unsaturated monocarboxylic acid or α,β-unsaturated monocarboxylic acid ester with carboxyl group After anhydrous and polyol, heat up. In this case, the mixing sequence of the polybasic acid and/or its anhydrate and the polyhydric alcohol is not particularly limited. By heating, on any hydroxyl group existing in the mixture of epoxy resin and α,β-unsaturated monocarboxylic acid or α,β-unsaturated monocarboxylic acid ester with carboxyl group and polyhydric alcohol, the polyvalent The acid and/or its anhydrate undergo an addition reaction. The epoxy (meth)acrylate resin containing a carboxyl group can be used alone or in combination of two or more resins. Regarding the amount of polyol used, from the viewpoint of suppressing thickening or gelation and exhibiting an effect, relative to the epoxy resin component and α, β-unsaturated monocarboxylic acid or α, which has a carboxyl group in the ester part, The reactant of the β-unsaturated monocarboxylic acid ester component is usually about 0.01 to 0.5 mass times, preferably about 0.02 to 0.2 mass times. The acid value of the epoxy (meth)acrylate resin (A1-1), (A1-2) thus obtained is usually 10 mgKOH/g or more, preferably 50 mgKOH/g or more, more preferably 70 mgKOH/g Above, more preferably 90 mgKOH/g or more, more preferably 200 mgKOH/g or less, more preferably 150 mgKOH/g or less, and still more preferably 120 mgKOH/g or less. By setting the acid value of the resin above the above lower limit value, the developability tends to become better, and by setting the acid value below the above upper limit value, there is a tendency that alkali resistance can be optimized. Epoxy (meth)acrylate resins (A1-1), (A1-2) are preferably measured by gel permeation chromatography (GPC) to convert the weight average molecular weight (Mw) of polystyrene. It is 1,000 or more, more preferably 1,500 or more. Furthermore, it is preferably 20,000 or less, more preferably 15,000 or less, still more preferably 10,000 or less, still more preferably 8,000 or less, and particularly preferably 6,000 or less. By setting the weight average molecular weight (Mw) to be higher than the above lower limit, the sensitivity, coating film strength, and alkali resistance tend to become better. By setting the weight average molecular weight (Mw) to be lower than the above upper limit, there is a possibility that the developability can be optimized or renewed. The tendency of solubility. <Acrylic copolymer resins (A2-1), (A2-2), (A2-3), (A2-4)> As acrylic copolymer resins, for example, Japanese Patent Laid-Open No. 7-207211 and Japanese Patent Japanese Patent Laid-Open No. 8-259876, Japanese Patent Laid-Open No. 10-300922, Japanese Patent Laid-Open No. 11-140144, Japanese Patent Laid-Open No. 11-174224, Japanese Patent Laid-Open No. 2000-56118, Japanese Patent The various polymer compounds described in various publications such as JP 2003-233179 and JP 2007-270147, etc., preferably include the following resins (A2-1) to (A2-4), etc. Among them, (A2-1) resin is particularly preferred. (A2-1): To a copolymer of epoxy group-containing (meth)acrylate and other radical polymerizable monomers, an unsaturated monobasic acid is added to at least a part of the epoxy group contained in the copolymer Or resin obtained by adding polybasic acid anhydride to at least a part of the hydroxyl group generated by the addition reaction (A2-2): linear alkali-soluble resin containing carboxyl group in the main chain (A2-3): (A2-2) Resin in which an epoxy group-containing unsaturated compound is added to the carboxyl part of the resin (A2-2) (A2-4): (meth)acrylic resin The photosensitive resin composition of the present invention is from the viewpoint of sensitivity It is more preferable to include at least any one of (A1-1), (A1-2), (A2-1), and (A2-3) as an alkali-soluble resin containing an ethylenically unsaturated group. From the viewpoint of surface curability, the photosensitive resin composition of the present invention preferably contains at least one of (A1-1) and (A1-2) as epoxy (meth)acrylate resins as containing Alkali-soluble resin with ethylenic unsaturated group. The photosensitive resin composition of the present invention may use other alkali-soluble resins in combination. There are no restrictions on other alkali-soluble resins, and resins generally used in photosensitive resin compositions for color filters may be selected. For example, the alkali-soluble resin etc. which are described in Japanese Patent Laid-Open No. 2007-271727, Japanese Patent Laid-Open No. 2007-316620, Japanese Patent Laid-Open No. 2007-334290, etc. are mentioned. Regarding (a) the content ratio of the alkali-soluble resin, relative to the total solid content of the photosensitive resin composition of the present invention, it is usually 5 mass% or more, preferably 10 mass% or more, and more preferably 15 mass% or more, It is more preferably 20% by mass or more, and usually 90% by mass or less, preferably 70% by mass or less, more preferably 50% by mass or less, and still more preferably 30% by mass or less. By setting the content ratio of (a) alkali-soluble resin to the above lower limit or more, the solubility of the unexposed part in the developer solution tends to become better, and by setting it to be less than the above upper limit, Excessive penetration of the developer into the exposed area is suppressed, and there is a tendency that the sharpness or adhesion of the image becomes better. Furthermore, as described above, the photosensitive resin composition of the present invention preferably contains the aforementioned (A1-1), (A1-2), (A2-1), (A2-2), (A2-3) and At least one of (A2-4) as (a) alkali-soluble resin, when other alkali-soluble resin is included, its content is 20% by mass or less with respect to the total of (a) alkali-soluble resin, preferably 10% by mass or less. <(b) Photopolymerizable monomer> The photosensitive resin composition of the present invention contains (b) a photopolymerizable monomer in terms of sensitivity and the like. As the (b) photopolymerizable monomer used in the present invention, a compound having at least one ethylenically unsaturated group in the molecule (hereinafter may be referred to as "ethylenic monomer") can be cited. Specifically, for example, (meth)acrylic acid, (meth)acrylic acid alkyl esters, acrylonitrile, styrene, and esters of carboxylic acids having one ethylenically unsaturated bond and polyhydric or monohydric alcohols, etc. can be cited. In the present invention, it is particularly desirable to use a multifunctional ethylenic monomer having two or more ethylenic unsaturated groups in one molecule. The number of ethylenically unsaturated groups in the multifunctional ethylenic monomer is usually 2 or more, preferably 3 or more, more preferably 4 or more, still more preferably 5 or more, particularly preferably 6 or more, Moreover, it is usually 10 or less, preferably 8 or less. By setting the number of ethylenically unsaturated groups to be higher than the above lower limit, there is a tendency for the photosensitive resin composition to become highly sensitive, and by setting the number of ethylenically unsaturated groups to be lower than the above upper limit, there is a change in curing shrinkage during polymerization. The tendency to be small. Examples of polyfunctional ethylenic monomers include, for example, esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids; Polyvalent hydroxy compound such as polyhydroxy compound, ester obtained by esterification reaction with unsaturated carboxylic acid and polycarboxylic acid, etc. Examples of the esters of the above-mentioned aliphatic polyhydroxy compounds and unsaturated carboxylic acids include ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, and trimethylolethane triacrylate. Acrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, glycerol acrylate and other aliphatic polyhydroxy compound acrylates. The acrylate of the exemplified compounds is replaced by the methacrylate obtained by replacing the methacrylate, similarly by the iconate obtained by replacing it with the crotonate obtained by replacing the crotonate, or by the Maleic acid ester derived from maleic acid ester, etc. Examples of esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids include: hydroquinone diacrylate, hydroquinone dimethacrylate, resorcinol diacrylate, resorcinol dimethyl Acrylate and methacrylate of aromatic polyhydroxy compounds such as acrylate and pyrogallol triacrylate. The ester obtained by the esterification reaction of polyvalent carboxylic acid and unsaturated carboxylic acid with polyvalent hydroxyl compound is not necessarily a single substance, but if a representative specific example is given, it can include: acrylic acid, phthalic acid and Condensation products of ethylene glycol, condensation products of acrylic acid, maleic acid and diethylene glycol, condensation products of methacrylic acid, terephthalic acid and pentaerythritol, condensation products of acrylic acid, adipic acid, butylene glycol and glycerin Things and so on. In addition, as an example of the multifunctional ethylenic monomer used in the present invention, it is useful to react a polyisocyanate compound with a hydroxyl-containing (meth)acrylate, or to react a polyisocyanate compound with a polyol and a hydroxyl-containing (meth)acrylate. (Meth)acrylate urethanes obtained by the reaction of (meth)acrylate; such as the epoxy of the addition reactant of polyvalent epoxy compound and hydroxyl (meth)acrylate or (meth)acrylic acid Acrylic esters; acrylamides such as ethylene bisacrylamide; allyl esters such as diallyl phthalate; vinyl-containing compounds such as divinyl phthalate. These may be used individually by 1 type, and may use 2 or more types together. (B) The content ratio of the photopolymerizable monomer is usually 90% by mass or less, preferably 70% by mass or less, more preferably 50% by mass or less with respect to the total solid content of the photosensitive resin composition. It is preferably 30% by mass or less, more preferably 20% by mass or less, and particularly preferably 10% by mass or less. When the content of the photopolymerizable monomer is below the above upper limit, there is a tendency that the permeability of the developing solution to the exposed portion is moderate and a good image can be obtained. (b) The lower limit of the content of the photopolymerizable monomer is usually 1% by mass or more, preferably 5% by mass or more. By being more than the said lower limit, there exists a tendency for the photohardening by ultraviolet irradiation to promote and alkali developability also becomes favorable. In the photosensitive resin composition of the present invention, the mass ratio of the content ratio of (a) alkali-soluble resin to the content ratio of (b) photopolymerizable monomer is usually 0.5 or more, preferably 1 or more, more preferably 2 Above, it is more preferably 2.5 or more, and it is usually 15 or less, preferably 10 or less, more preferably 8 or less, and still more preferably 5 or less. By setting it as the above-mentioned lower limit or more, the curing shrinkage at the time of curing tends to decrease, and by setting it as the above-mentioned upper limit value or less, there is a tendency for the hardness of the cured film to become higher. <(d) Colorant> The photosensitive resin composition of the present invention contains a colorant when it is used for the formation of pixels of a color filter, a black matrix, and a colored spacer. The colorant refers to one that colors the photosensitive resin composition of the present invention. As the coloring material, dyes or pigments can be used, and in terms of heat resistance, light resistance, etc., pigments are preferred. As the pigment, various colors such as blue pigments, green pigments, red pigments, yellow pigments, purple pigments, orange pigments, brown pigments, and black pigments can be used. In addition, as its structure, azo series, phthalocyanine series, quinacridone series, benzimidazolone series, isoindolinone series, dimethicone series, indanthrene series, perylene series, etc. can be used. In addition to organic pigments, various inorganic pigments and the like can also be used. Hereinafter, specific examples of pigments that can be used in the present invention are indicated by pigment numbers. Furthermore, terms such as "C.I. Pigment Red 2" listed below mean color index (C.I.). Examples of red pigments include: CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48: 1, 48: 2, 48: 3, 48: 4, 49, 49: 1, 49: 2, 50: 1, 52: 1, 52: 2, 53, 53: 1, 53: 2, 53: 3, 57, 57: 1, 57: 2, 58: 4, 60, 63, 63: 1, 63: 2, 64, 64: 1, 68, 69, 81, 81: 1, 81: 2, 81: 3, 81: 4, 83, 88, 90: 1, 101, 101: 1, 104, 108, 108: 1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 151, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179, 181, 184, 185, 187, 188, 190, 193, 194, 200, 202, 206, 207, 208, 209, 210, 214, 216, 220, 221, 224, 230, 231, 232, 233, 235, 236, 237, 238, 239, 242, 243, 245, 247, 249, 250, 251, 253, 254, 255, 256, 257, 258, 259, 260, 262, 263, 264, 265, 266, 267, 268, 269, 270, 271, 272, 273, 274, 275, 276. Among them, CI Pigment Red 48:1, 122, 168, 177, 202, 206, 207, 209, 224, 242, 254 can be better listed, and CI Pigment Red 177, 209, 224, 254. Examples of blue pigments include: CI Pigment Blue 1, 1: 2, 9, 14, 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 17, 19, 25 , 27, 28, 29, 33, 35, 36, 56, 56: 1, 60, 61, 61: 1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78 , 79. Among them, C.I. Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6 can be preferably cited, and C.I. Pigment Blue 15:6 can be more preferably cited. Examples of green pigments include: CI Pigment Green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 45, 48, 50, 51, 54, 55, 58. Among them, C.I. Pigment Green 7, 36, 58 can be preferably cited. Examples of yellow pigments include: CI Pigment Yellow 1, 1: 1, 2, 3, 4, 5, 6, 9, 10, 12, 13, 14, 16, 17, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 41, 42, 43, 48, 53, 55, 61, 62, 62: 1, 63, 65, 73, 74, 75, 81, 83, 87, 93, 94, 95, 97, 100, 101, 104, 105, 108, 109, 110, 111, 116, 117, 119, 120, 126, 127, 127: 1, 128, 129, 133, 134, 136, 138, 139, 142, 147, 148, 150, 151, 153, 154, 155, 157, 158, 159, 160, 161, 162, 163, 164, 165, 166, 167, 168, 169, 170, 172, 173, 174, 175, 176, 180, 181, 182, 183, 184, 185, 188, 189, 190, 191, 191:1, 192, 193, 194, 195, 196, 197, 198, 199, 200, 202, 203, 204, 205, 206, 207, 208. Among them, C.I. Pigment Yellow 83, 117, 129, 138, 139, 150, 154, 155, 180, 185 can be preferably cited, and C.I. Pigment Yellow 83, 138, 139, 150, 180 can be more preferably cited. Examples of orange pigments include CI pigment orange 1, 2, 5, 13, 16, 17, 19, 20, 21, 22, 23, 24, 34, 36, 38, 39, 43, 46, 48, 49, 61, 62, 64, 65, 67, 68, 69, 70, 71, 72, 73, 74, 75, 77, 78, 79. Among them, C.I. Pigment Orange 38 and 71 can be preferably cited. Examples of purple pigments include: CI Pigment Violet 1, 1: 1, 2, 2: 2, 3, 3: 1, 3: 3, 5, 5: 1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, 50. Among them, C.I. Pigment Violet 19 and 23 can be preferably cited, and C.I. Pigment Violet 23 can be more preferably cited. In addition, when the photosensitive resin composition of the present invention is a photosensitive resin composition for a resin black matrix of a color filter, a black colorant can be used as the (d) colorant. The black color material can be a single black color material, or a mixture of red, green, blue, etc. In addition, these color materials can be appropriately selected from inorganic or organic pigments and dyes. As a colorant that can be mixed and used to prepare a black colorant, include: Victoria Blue (42595), Chrysanthemum O (41000), Cathilon Brilliant Flavine (Basic Yellow 13), Rose Red 6GCP (45160), Rose Red B ( 45170), Safranin OK70: 100 (50240), Wool Poppy Red X (42080), No.120/Leonor Yellow (21090), Leonor Yellow GRO (21090), Smoler Fast Yellow 8GF (21105) , Benzidine Yellow 4T-564D (21095), Smoller Fast Red 4015 (12355), Leonor Red 7B4401 (15850), Fastogen Blue TGR-L (74160), Leonor Blue SM (26150), Leonor Noll Blue ES (Pigment Blue 15:6), Lionogen Red GD (Pigment Red 168), Leonor Green 2YS (Pigment Green 36), etc. (Furthermore, the numbers in the above () refer to the color index (CI)). In addition, regarding other pigments that can be mixed for use, if indicated by CI number, for example, CI yellow pigment 20, 24, 86, 93, 109, 110, 117, 125, 137, 138, 147, 148, 153 can be listed. , 154, 166, CI orange pigment 36, 43, 51, 55, 59, 61, CI red pigment 9, 97, 122, 123, 149, 168, 177, 180, 192, 215, 216, 217, 220, 223 , 224, 226, 227, 228, 240, CI purple pigment 19, 23, 29, 30, 37, 40, 50, CI blue pigment 15, 15:1, 15: 4, 22, 60, 64, CI green Pigment 7, CI brown pigment 23, 25, 26, etc. In addition, as the black colorant that can be used alone, carbon black, acetylene black, lamp black, bone black, graphite, iron black, aniline black, cyanine black, titanium black, perylene black, and amide black can be cited. Among these (d) color materials, when a black color material is used, carbon black is preferable from the viewpoint of light-shielding rate and image characteristics. As an example of carbon black, the following carbon black can be mentioned. Manufactured by Mitsubishi Chemical Corporation: MA7, MA77, MA8, MA11, MA100, MA100R, MA220, MA230, MA600, #5, #10, #20, #25, #30, #32, #33, #40, #44, #45, #47, #50, #52, #55, #650, #750, #850, #950, #960, #970, #980, #990, #1000, #2200, #2300, #2350 , #2400, #2600, #3050, #3150, #3250, #3600, #3750, #3950, #4000, #4010, OIL7B, OIL9B, OIL11B, OIL30B, OIL31B Degussa company manufacture: Printex (registered trademark; the following Same) 3. Printex 3OP, Printex 30, Printex 30OP, Printex 40, Printex 45, Printex 55, Printex 60, Printex 75, Printex 80, Printex 85, Printex 90, Printex A, Printex L, Printex G, Printex P, Printex U, Printex V, Printex G, Special Black 550, Special Black 350, Special Black 250, Special Black 100, Special Black 6, Special Black 5, Special Black 4, Color Black FW1, Color Black FW2, Color Black FW2V, Color Black FW18, Color Black FW18, Color Black FW200, Color Black S160, Color Black S170 Made by Cabot: Monarch (registered trademark; the same below) 120, Monarch280, Monarch460, Monarch800, Monarch880, Monarch900, Monarch1000, Monarch1100, Monarch1300, Monarch1400, Monarch4630 , REGAL (registered trademark; the same below) 99, REGAL99R, REGAL415, REGAL415R, REGAL250, REGAL250R, REGAL330, REGAL400R, REGAL55R0, REGAL66 0R, BLACK PEARLS480, PEARLS130, VULCAN (registered trademark) XC72R, ELFTEX (registered trademark)-8 BIRLA company manufacture: RAVEN11, RAVEN14, RAVEN15, RAVEN16, RAVEN22, RAVEN30, RAVEN35, RAVEN40, RAVEN410, RAVEN420, RAVEN450, RAVEN500, RAVEN780 , RAVEN850, RAVEN890H, RAVEN1000, RAVEN1020, RAVEN1040, RAVEN1060U, RAVEN1080U, RAVEN1170, RAVEN1190U, RAVEN1250, RAVEN1500, RAVEN2000, RAVEN2500U, RAVEN3500, RAVEN5000, RAVEN5250, RAVEN5750, RAVEN7000 as examples of other black titanium pigments and aniline. Black and iron oxide-based black pigments can be used as black pigments by mixing organic pigments of red, green and blue. Moreover, barium sulfate, lead sulfate, titanium oxide, yellow plum, iron plum, chromium oxide, etc. can also be used as a pigment. A plurality of these various pigments can also be used in combination. For example, in order to adjust the chromaticity, a green pigment and a yellow pigment may be used together, or a blue pigment and a purple pigment may be used together. The average particle size of the pigment used in the present invention is not particularly limited as long as the coloring layer of the color filter is used as the coloring layer, and it varies according to the type of pigment used. , Preferably in the range of 10 to 100 nm, more preferably in the range of 10 to 70 nm. By setting the average particle diameter of the pigment within the above-mentioned range, there is a tendency that a liquid crystal display device manufactured using the photosensitive resin composition of the present invention can realize high-quality color characteristics. In addition, when the pigment is carbon black, the average particle diameter is preferably 60 nm or less, more preferably 50 nm or less, and more preferably 20 nm or more. By setting the average particle size to be equal to or less than the above upper limit, scattering tends to be reduced, and it is possible to suppress a decrease in color characteristics such as light-shielding properties and contrast. In addition, by setting the average particle diameter to be equal to or greater than the above lower limit value, there is a tendency for the dispersant to be prevented from being excessively used and the dispersibility becomes good. Furthermore, the average particle size of the above-mentioned pigment can be obtained by directly measuring the size of the primary particle from an electron microscope photograph. Specifically, the minor axis diameter and the major axis diameter of each primary particle are measured, and the average value is used as the particle diameter of the particle. Then, for 100 or more particles, the volume (mass) of each particle is obtained by approximating the rectangular parallelepiped of the obtained particle size, and the volume average particle size is obtained, and this is taken as the average particle size. Furthermore, no matter whether the electron microscope uses a transmission (TEM) or a scanning (SEM), the same results can be obtained. In addition, the photosensitive resin composition of the present invention preferably contains at least a pigment, and a dye may be used in combination within a range that does not affect the effects of the present invention. Examples of dyes that can be used in combination include azo dyes, anthraquinone dyes, phthalocyanine dyes, quinonimine dyes, quinoline dyes, nitro dyes, carbonyl dyes, methine dyes, etc. . Examples of azo dyes include CI Acid Yellow 11, CI Acid Orange 7, CI Acid Red 37, CI Acid Red 180, CI Acid Blue 29, CI Direct Red 28, CI Direct Red 83, CI Direct Yellow 12, CI Direct Orange 26, CI Direct Green 28, CI Direct Green 59, CI Reactive Yellow 2, CI Reactive Red 17, CI Reactive Red 120, CI Reactive Black 5, CI Disperse Orange 5, CI Disperse Red 58, CI Disperse Blue 165, CI Basic Blue 41, CI Basic Red 18, CI Mordant Red 7, CI Mordant Yellow 5, CI Mordant Black 7, etc. Examples of anthraquinone dyes include: CI Vat Blue 4, CI Acid Blue 40, CI Acid Green 25, CI Reaction Blue 19, CI Reaction Blue 49, CI Disperse Red 60, CI Disperse Blue 56, CI Disperse Blue 60, etc. . In addition, examples of phthalocyanine dyes include CI Vat Blue 5 and the like, examples of quinoneimine dyes include CI Basic Blue 3, CI Basic Blue 9, etc., and examples of quinoline dyes include Examples include CI Solvent Yellow 33, CI Acid Yellow 3, CI Disperse Yellow 64, and the like. Examples of nitro dyes include CI Acid Yellow 1, CI Acid Orange 3, CI Disperse Yellow 42, and the like. Regarding (d) the content ratio of the colorant, it can usually be selected in the range of 1 to 70% by mass relative to the total solid content in the photosensitive resin composition. Within this range, it is more preferably 20% by mass or more, still more preferably 30% by mass or more, particularly preferably 40% by mass or more, and still more preferably 60% by mass or less. The photosensitive resin composition of the present invention can be used for various applications as described above, but its excellent image forming properties are particularly effective when used for forming a black matrix for color filters. When used to form a black matrix, as the color material (d), black color materials such as carbon black or titanium black described above may be used, or a plurality of color materials other than black may be mixed to adjust to black. Among them, from the viewpoint of dispersion stability and light-shielding properties, it is particularly preferable to use carbon black. The present invention is particularly effective in areas where the pigment concentration of the black pigment becomes larger. Especially in recent years, it has been necessary to increase the concentration of black pigments to increase the degree of shading. Regarding the content ratio of the black pigment in the region where the effect becomes apparent, it is 40% by mass or more, preferably 45% by mass or more, and more preferably 50% by mass or more with respect to the total solid content of the photosensitive resin composition. When the content ratio of the black pigment in the photosensitive resin composition is within the above range, a photosensitive resin composition with high light-shielding properties (optical density, OD value) can be obtained. Specifically, by setting the content of the black pigment to 45% by mass or more, the optical density when the photosensitive resin composition of the present invention is used to form a black matrix with a thickness of 1 μm can become a value of 4.0 or more. The optical density is more preferably 4.2 or more. In areas with high light-shielding properties, ultraviolet rays are not easily transmitted to the deep part, and the cross-linking caused by photopolymerization is particularly weak in the adhesion part between the substrate and the thin wires. However, when the photosensitive resin composition of the present invention is used, it is particularly When the content ratio of the black pigment is large, the effect of the present invention can be clearly confirmed. It is particularly effective when the content of the black pigment is 40 to 65% by mass. By setting the content ratio of the black pigment to be higher than the above lower limit value, there is a tendency that the film thickness with respect to the color density can be suppressed from becoming too large, and by setting the content ratio of the black pigment below the above upper limit value, it is easy to ensure sufficient The tendency of image formation. Furthermore, in the photosensitive resin composition, the content ratio of the (d) colorant is usually 20 parts by mass or more, preferably 30 parts by mass or more, and more preferably, relative to 100 parts by mass of the alkali-soluble resin (a) 40 parts by mass or more, more preferably 60 parts by mass or more, still more preferably 80 parts by mass or more, particularly preferably 120 parts by mass or more, most preferably 160 parts by mass or more, and usually 500 parts by mass or less, more preferably It is 300 parts by mass or less, more preferably 280 parts by mass or less. By setting the content ratio of (d) colorant to above the above lower limit, there is a tendency to easily suppress the decrease in the solubility of the unexposed part in the developer solution, and by setting it below the above upper limit, there is a tendency The tendency to easily obtain the desired image film thickness. <(e) Dispersant> In the present invention, the color material is finely dispersed and the stabilization of the dispersed state is important for ensuring the stability of quality. Therefore, it is preferable to include the (e) dispersant. As the dispersant, a polymer dispersant having a functional group is preferred, and in terms of dispersion stability, it is preferred to have a carboxyl group, a phosphoric acid group, a sulfonic acid group, or a salt group of these, primary and secondary Or tertiary amine group, quaternary ammonium salt group, derived from functional groups such as pyridine, pyrimidine, pyrimidine, and other nitrogen-containing heterocyclic groups. Among them, particularly preferred are polymer dispersants having primary, secondary or tertiary amine groups, quaternary ammonium salt groups, and basic functional groups such as pyridine, pyrimidine, pyrimidine, and other nitrogen-containing heterocyclic groups. By using these polymer dispersants with basic functional groups, there is a tendency to optimize dispersibility and achieve higher shading properties. In addition, examples of polymer dispersants include urethane-based dispersants, acrylic-based dispersants, polyethyleneimine-based dispersants, polyallylamine-based dispersants, and monomers containing amine groups. Dispersant with macromonomers, polyoxyethylene alkyl ether dispersant, polyoxyethylene diester dispersant, polyether phosphoric acid dispersant, polyester phosphoric acid dispersant, sorbitan aliphatic ester dispersant , Aliphatic modified polyester dispersant, etc. Specific examples of the above-mentioned dispersants are represented by trade names, and include: EFKA (registered trademark. EFKA-Chemicals BV (EFKA) Corporation), Disperbyk (registered trademark. BYK-Chemie Corporation), Disbaron (registered trademark. Kusumoto) Kasei Co., Ltd.), SOLSPERSE (registered trademark. Lubrizol Co., Ltd.), KP (Shin-Etsu Chemical Industry Co., Ltd.), Polyflow or Flowlen (registered trademark. Kyoeisha Chemical Co., Ltd.), Ajisper (registered trademark. Ajinomoto Fine-Techno Co., Ltd. )Wait. These polymer dispersants may be used individually by 1 type, and may use 2 or more types together. Among them, in terms of adhesion and linearity, (e) the dispersant is particularly preferably a urethane-based polymer dispersant and/or an acrylic polymer dispersant having a basic functional group . In particular, a urethane-based polymer dispersant is preferable in terms of adhesion. Moreover, in terms of dispersibility and storage properties, a polymer dispersant having a basic functional group and having a polyester and/or polyether bond is preferred. The weight average molecular weight (Mw) of the polymer dispersant is usually 700 or more, preferably 1,000 or more, and usually 100,000 or less, preferably 50,000 or less, and more preferably 30,000 or less. By setting the weight average molecular weight (Mw) to the above upper limit or less, there is a tendency that the alkali developability is good even when the pigment concentration is high. Examples of urethane-based and acrylic-based polymer dispersants include: DISPERBYK-160~167, 182 series (all are urethane-based), DISPERBYK-2000, 2001, etc. (all are acrylic-based) (All the above are manufactured by BYK-Chemie). Among the above-mentioned urethane-based polymer dispersants having basic functional groups and polyester and/or polyether bonds, those having a weight average molecular weight of 30,000 or less are particularly preferred: DISPERBYK-167, 182 Wait. <Urethane-based polymer dispersant> If a chemical structure suitable as a urethane-based polymer dispersant is specifically exemplified, for example, it can be exemplified by making a polyisocyanate compound have 1 or 2 in the molecule. A compound with a number average molecular weight of each hydroxyl group of 300 to 10,000, and a compound with active hydrogen and a tertiary amine group in the same molecule are reacted to obtain a dispersion resin with a weight average molecular weight of 1,000 to 200,000, etc. Examples of the above-mentioned polyisocyanate compound include: p-phenylene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, naphthalene-1,5- Aromatic diisocyanates such as diisocyanate and toluidine diisocyanate, hexamethylene diisocyanate, methyl lysine diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, dimer Aliphatic diisocyanates such as acid diisocyanate, isophorone diisocyanate, 4,4'-methylenebis(cyclohexyl isocyanate), ω,ω'-diisocyanatodimethylcyclohexane Alicyclic diisocyanate, xylylene diisocyanate, α,α,α',α'-tetramethylxylylene diisocyanate and other aliphatic diisocyanates with aromatic rings, lysine triisocyanate, 1,6,11-undecane triisocyanate, 1,8-diisocyanato-4-isocyanatomethyl octane, 1,3,6-hexamethylene triisocyanate, bicycloheptane Triisocyanates, triisocyanates, tris(isocyanatophenylmethane), tris(isocyanatophenyl) thiophosphate and other triisocyanates, and such trimers, water adducts, and such polyols Additives, etc. The polyisocyanate is preferably a trimer of organic diisocyanate, and most preferably a trimer of toluene diisocyanate and isophorone diisocyanate. These may be used individually by 1 type, and may use 2 or more types together. Examples of methods for producing isocyanate terpolymers include the following methods: for the above-mentioned polyisocyanates, suitable trimerization catalysts such as tertiary amines, phosphines, alkoxides, metal oxides, and carboxylic acids are used. The partial trimerization of isocyanate groups is carried out by salt, etc. After the trimerization is stopped by adding catalyst poison, unreacted polyisocyanate is removed by solvent extraction and thin film distillation, so as to obtain the target isocyanate-containing Uric acid-based polyisocyanate. As a compound with a number average molecular weight of 300 to 10,000 having 1 or 2 hydroxyl groups in the same molecule, polyether diols, polyester diols, polycarbonate diols, polyolefin diols, etc., and the number of carbons used The alkyl group of 1-25 is obtained by alkoxylation of one of the terminal hydroxyl groups of these compounds, and a mixture of these two or more kinds. Examples of polyether diols include polyether diols (diol), polyether ester diols (diol), and mixtures of two or more of these. Examples of polyether glycols (diols) include those obtained by homopolymerizing or copolymerizing alkylene oxides, such as polyethylene glycol, polypropylene glycol, polyethylene glycol propylene glycol, polyoxytetramethylene glycol, and polyoxane Methylene glycol, polyoxyoctamethylene glycol, and a mixture of two or more of these. Examples of polyether ester diols (diols) include those obtained by reacting ether group-containing diols (diols) or mixtures with other diols with dicarboxylic acids or these anhydrates, or polyesters Obtained by the reaction of alcohol and alkylene oxide, such as poly(polyoxytetramethylene) adipate and the like. The best polyether glycol is polyethylene glycol, polypropylene glycol, polyoxytetramethylene glycol, or the alkoxylation of one of the terminal hydroxyl groups of these compounds using an alkyl group with 1 to 25 carbon atoms. Compound. Examples of polyester diols include dicarboxylic acids (succinic acid, glutaric acid, adipic acid, sebacic acid, fumaric acid, maleic acid, phthalic acid, etc.) or the like Anhydrate and glycol (ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol Alcohol, 2,3-butanediol, 3-methyl-1,5-pentanediol (diol), neopentyl glycol, 2-methyl-1,3-propanediol (diol), 2-methyl- 2-propyl-1,3-propanediol (diol), 2-butyl-2-ethyl-1,3-propanediol (diol), 1,5-pentanediol (diol), 1,6-hexanedi Alcohol (diol), 2-methyl-2,4-pentanediol, 2,2,4-trimethyl-1,3-pentanediol (diol), 2-ethyl-1,3-hexanedi Alcohol (diol), 2,5-dimethyl-2,5-hexanediol (diol), 1,8-octamethylene glycol, 2-methyl-1,8-octamethylene glycol , 1,9-nonanediol (diol) and other aliphatic diols, bishydroxymethylcyclohexane and other alicyclic diols, benzenedimethanol, bishydroxyethoxybenzene and other aromatic diols, N-methyl Diethanolamine and other N-alkyl dialkanolamine, etc.) obtained by polycondensation, such as polyethylene adipate, polybutylene adipate, polyhexamethylene adipate, polyethylene two Alcohol propylene glycol adipate, etc.; or polylactone diol (diol) or polylactone monool obtained by using the above-mentioned diols or monohydric alcohols with 1 to 25 carbons as the initiator, For example, polycaprolactone diol, polymethylvalerolactone, and a mixture of two or more of these. The most preferred polyester diol is polycaprolactone diol or polycaprolactone obtained from an alcohol with 1 to 25 carbon atoms as a starting agent. Examples of polycarbonate diols include poly(1,6-hexylene) carbonate, poly(3-methyl-1,5-pentylene) carbonate, and the like. Examples of polyolefin diols include: Polybutadienediol, hydrogenated polybutadienediol, hydrogenated polyisoprenediol, etc. These may be used individually by 1 type, and may use 2 or more types together. The number average molecular weight of a compound having one or two hydroxyl groups in the same molecule is generally 300 to 10,000, preferably 500 to 6,000, and more preferably 1,000 to 4,000. The compound having active hydrogen and tertiary amine group in the same molecule used in the present invention will be described. The active hydrogen, that is, a hydrogen atom directly bonded to an oxygen atom, a nitrogen atom, or a sulfur atom, includes hydrogen atoms in functional groups such as a hydroxyl group, an amino group, and a thiol group. Among them, an amino group is preferred, especially The hydrogen atom of the primary amino group. The tertiary amino group is not particularly limited, and examples thereof include an amino group having an alkyl group having 1 to 4 carbon atoms, or a heterocyclic structure, more specifically an imidazole ring or triazole ring, and the like. Examples of such compounds having active hydrogen and tertiary amino groups in the same molecule include: N,N-dimethyl-1,3-propanediamine, N,N-diethyl-1,3- Propylenediamine, N,N-dipropyl-1,3-propanediamine, N,N-dibutyl-1,3-propanediamine, N,N-dimethylethylenediamine, N,N -Diethylethylenediamine, N,N-dipropylethylenediamine, N,N-dibutylethylenediamine, N,N-dimethyl-1,4-butanediamine, N,N- Diethyl-1,4-butanediamine, N,N-dipropyl-1,4-butanediamine, N,N-dibutyl-1,4-butanediamine, etc. In addition, when the tertiary amino group is a nitrogen-containing heterocyclic structure, the nitrogen-containing heterocyclic ring includes: pyrazole ring, imidazole ring, triazole ring, tetrazole ring, indole ring, carbazole ring, and indole ring. Azole ring, benzimidazole ring, benzotriazole ring, benzoxazole ring, benzothiazole ring, benzothiadiazole ring and other nitrogen-containing hetero 5-membered ring, pyridine ring, pyridine ring, pyrimidine ring, three 𠯤 ring, quinoline ring, acridine ring, isoquinoline ring and other 6-membered nitrogen-containing heterocyclic ring. Preferred among these nitrogen-containing heterocycles is an imidazole ring or a triazole ring. If these compounds having an imidazole ring and an amino group are specifically exemplified, they include: 1-(3-aminopropyl)imidazole, histidine, 2-aminoimidazole, 1-(2-aminoethyl) ) Imidazole and so on. In addition, if a compound having a triazole ring and an amino group is specifically exemplified, 3-amino-1,2,4-triazole, 5-(2-amino-5-chlorophenyl)-3 -Phenyl-1H-1,2,4-triazole, 4-amino-4H-1,2,4-triazole-3,5-diol, 3-amino-5-phenyl-1H- 1,3,4-triazole, 5-amino-1,4-diphenyl-1,2,3-triazole, 3-amino-1-benzyl-1H-2,4-triazole, etc. . Among them, N,N-dimethyl-1,3-propanediamine, N,N-diethyl-1,3-propanediamine, 1-(3-aminopropyl)imidazole, 3 -Amino-1,2,4-triazole. These may be used individually by 1 type, and may use 2 or more types together. Regarding the preferable blending ratio of the raw materials when manufacturing the urethane-based polymer dispersant, relative to 100 parts by mass of the polyisocyanate compound, a compound with a number average molecular weight of 300 to 10,000 having 1 or 2 hydroxyl groups in the same molecule is 10~200 parts by mass, preferably 20~190 parts by mass, and more preferably 30~180 parts by mass; the compound having active hydrogen and tertiary amine group in the same molecule is 0.2-25 parts by mass, preferably 0.3~ 24 parts by mass. The production of the urethane-based polymer dispersant is carried out according to a known method for producing polyurethane resins. As a solvent in the manufacture, usually used: ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, isophorone, ethyl acetate, butyl acetate, acetic acid Cellosolve and other esters, benzene, toluene, xylene, hexane and other hydrocarbons, diacetone alcohol, isopropanol, second butanol, tertiary butanol and other alcohols, dichloromethane, chloroform and other chlorides , Ethers such as tetrahydrofuran and diethyl ether, aprotic polar solvents such as dimethylformamide, N-methylpyrrolidone, dimethyl sulfide, etc. These may be used individually by 1 type, and may use 2 or more types together. In the above-mentioned production, a urethane reaction catalyst is usually used. Examples of the catalyst include: dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin dioctoate, stannous octoate and other tin systems, iron systems such as acetopyruvate and ferric chloride, triyl One or more of tertiary amines such as amine and triethylenediamine. <Measurement method of amine value> The tertiary amine value of the dispersant is expressed by the mass of KOH equivalent to 1 g of the solid content in the dispersant sample except the solvent, and can be measured by the following method. Accurately weigh 0.5~1.5 g of dispersant sample into a 100 mL beaker, and dissolve it with 50 mL of acetic acid. Use an automatic titration device with a pH electrode to use 0.1 mol/L of HClO for the solution₄ (Perchloric acid) acetic acid solution for neutralization titration. With the inflection point of the titration pH curve as the titration end point, the amine value is calculated according to the following formula. Amine value [mgKOH/g]=(561×V)/(W×S) [Where, W represents the weighed amount of the dispersant sample [g], V represents the titration at the end of the titration [mL], and S represents the dispersion The concentration of solid content of the reagent sample [mass%]] The introduction amount of the compound having active hydrogen and tertiary amine group in the same molecule is preferably controlled to be in the range of 1-100 mgKOH/g based on the amine value after the reaction. More preferably, it is in the range of 5 to 95 mgKOH/g. The amine value is the value expressed in mg of KOH corresponding to the acid value when the basic amine group is titrated by acid neutralization. By setting the amine value to be equal to or higher than the above lower limit value, the dispersibility tends to become better, and by setting the amine value to be equal to or lower than the above upper limit value, the developability tends to become better. Furthermore, when isocyanate groups remain in the polymer dispersant in the above reaction, if the isocyanate groups are further eliminated by alcohol or an amino compound, the stability of the product over time will increase, which is preferable. The weight average molecular weight (Mw) of the urethane-based polymer dispersant is usually 1,000 to 200,000, preferably 2,000 to 100,000, and more preferably 3,000 to 50,000. The weight average molecular weight (Mw) of the urethane-based polymer dispersant is particularly preferably 30,000 or less. By setting the weight average molecular weight (Mw) to be higher than the above lower limit value, the dispersibility and dispersion stability tend to become better, and by setting the weight average molecular weight (Mw) to be lower than the above upper limit value, the solubility becomes better and the dispersibility is also improved. The tendency to become good. If the molecular weight is 30,000 or less, especially when the pigment concentration is high, the alkali developability tends to become good. As an example of such a particularly preferred commercially available urethane dispersant, DISPERBYK-167, 182 (BYK-Chemie company) and the like can be cited. (E) The content ratio of the dispersant is usually 50% by mass or less, preferably 30% by mass or less, more preferably 20% by mass or less, and still more preferably, in the total solid content of the photosensitive resin composition. 15% by mass or less, particularly preferably 10% by mass or less, and usually 1% by mass or more, preferably 3% by mass or more, more preferably 5% by mass or more, and still more preferably 7% by mass or more. In addition, the content ratio of the dispersant is usually 5 parts by mass or more, preferably 10 parts by mass or more, and usually 200 parts by mass or less, preferably 80 parts by mass relative to 100 parts by mass of the (d) colorant. Hereinafter, it is more preferably 50 parts by mass or less, still more preferably 30 parts by mass or less, and particularly preferably 20 parts by mass or less. By setting the content ratio of the dispersant to be higher than the above lower limit value, it tends to be easy to ensure sufficient dispersibility. Moreover, by setting the content ratio of the dispersant below the above upper limit value, the ratio of other components does not decrease, and it is easy to The tendency to achieve sufficient color density, sensitivity, and film-forming properties. As a dispersant, it is particularly preferable to use a polymer dispersant and a pigment derivative (dispersion aid) together. In this case, the content of the pigment derivative is relative to the total solid components of the photosensitive resin composition of the present invention , Usually 0.1% by mass or more, preferably 0.5% by mass or more, and usually 10% by mass or less, preferably 5% by mass or less, more preferably 2% by mass or less. <Thiols> The photosensitive resin composition of the present invention preferably contains mercaptans in order to achieve high sensitivity and improve adhesion to the substrate. The types of mercaptans include hexamethylene dithiol, decandithiol, 1,4-dimethyl mercaptobenzene, butanediol dithiopropionate, butanediol dithioglycolate, Ethylene glycol dithioglycolate, trimethylolpropane trithioglycolate, butanediol dithiopropionate, trimethylolpropane trithiopropionate, trimethylolpropane three Thioglycolate, pentaerythritol tetrathiopropionate, pentaerythritol tetrathioglycolate, trihydroxyethyl trithiopropionate, ethylene glycol bis(3-mercaptobutyrate), propylene glycol bis(3 -Mercaptobutyrate) (abbreviated as PGMB), butanediol bis(3-mercaptobutyrate), 1,4-bis(3-mercaptobutanoyloxy)butane (trade name: KarenzMT BD1, Showa Denko Co., Ltd.), butanediol trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptobutyrate) (trade name: KarenzMT PE1, manufactured by Showa Denko Co., Ltd.), pentaerythritol Tris(3-mercaptobutyrate), ethylene glycol bis(3-mercaptoisobutyrate), butanediol bis(3-mercaptoisobutyrate), trimethylolpropane tris(3-mercaptoisobutyrate) Acid ester), trimethylolpropane tris(3-mercaptobutyrate) (abbreviated as TPMB), trimethylolpropane tris(2-mercaptoisobutyrate) (abbreviated as TPMIB), 1,3,5 -Tris(3-mercaptobutoxyethyl)-1,3,5-tris-2,4,6(1H,3H,5H)-trione (trade name: KarenzMT NR1, manufactured by Showa Denko Co., Ltd. ), etc.; each of these can be used alone or in a mixture of two or more. Preferable are the above-mentioned multifunctional mercaptans such as PGMB, TPMB, TPMIB, KarenzMT BD1, KarenzMT PE1, KarenzMT NR1, among which KarenzMT BD1, KarenzMT PE1, KarenzMT NR1 are more preferable, and KarenzMT PE1 is particularly preferable. In the case of using a thiol compound, the content ratio of the thiol compound relative to the total solid content of the photosensitive resin composition of the present invention is usually 0.1% by mass or more, preferably 0.3% by mass or more, and more Preferably it is 0.5 mass% or more, and it is 10 mass% or less normally, Preferably it is 5 mass% or less. By setting the content ratio of the thiol compound to be more than the above lower limit value, there is a tendency to suppress the decrease in sensitivity, and by setting the content ratio of the thiol compound to be less than the above upper limit value, there is a tendency to easily optimize the storage stability. <Solvent> The photosensitive resin composition of the present invention is usually composed of (a) alkali-soluble resin, (b) photopolymerizable monomer, (c) photopolymerization initiator, (d) colorant, and if necessary The various materials are used in the state of being dissolved or dispersed in an organic solvent. As the organic solvent, it is preferable to select a boiling point (under a pressure of 1013.25 [hPa]. Hereinafter, the boiling point is the same) to be in the range of 100 to 300°C. More preferably, it is a solvent having a boiling point of 120 to 280°C. As such an organic solvent, the following can be mentioned, for example. Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol tertiary butyl ether, diethyl Glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, methoxymethylpentanol, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxy Glycol monoalkyl ethers such as butyl butanol, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, and tripropylene glycol methyl ether; ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene two Glycol dialkyl ethers such as ethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, and dipropylene glycol dimethyl ether; ethylene glycol monomethyl ether Acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl Ether acetate, methoxybutyl acetate, 3-methoxybutyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, two Ethylene glycol mono-n-butyl ether acetate, dipropylene glycol monomethyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, 3-methyl-3-methyl acetate Glycol alkyl ether acetates such as oxybutyl ester; glycol diacetate, 1,3-butanediol diacetate, 1,6-hexanol diacetate, etc. Acetates; alkyl acetates such as cyclohexanol acetate; one of amyl ether, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, dipentyl ether, ethyl isobutyl ether, and dihexyl ether Class of ethers; acetone, methyl ethyl ketone, methyl amyl ketone, methyl isopropyl ketone, methyl isoamyl ketone, diisopropyl ketone, diisobutyl ketone, methyl isobutyl ketone Ketones such as ketones, cyclohexanone, ethyl amyl ketone, methyl butyl ketone, methyl hexyl ketone, methyl nonyl ketone, methoxy methyl pentanone and the like; ethanol, propanol, butanol, Mono- or polyhydric alcohols such as hexanol, cyclohexanol, ethylene glycol, propylene glycol, butylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, methoxymethylpentanol, glycerin, and benzyl alcohol ; Aliphatic hydrocarbons such as n-pentane, n-octane, diisobutene, n-hexane, hexene, isoprene, dipentene, dodecane; cyclohexane, methylcyclohexane, methyl Alicyclic hydrocarbons such as cyclohexene and bicyclohexyl; aromatic hydrocarbons such as benzene, toluene, xylene, cumene; pentyl formate, ethyl formate, ethyl acetate, butyl acetate, Propyl acetate, pentyl acetate, methyl isobutyrate, ethylene glycol acetate, ethyl propionate, propyl propionate, butyl butyrate, isobutyl butyrate, methyl isobutyrate, ethyl caprylate Esters, butyl stearate, ethyl benzoate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, 3-methoxypropionic acid Chain or cyclic esters such as ethyl ester, propyl 3-methoxypropionate, butyl 3-methoxypropionate, γ-butyrolactone; 3-methoxypropionic acid, 3-ethyl Alkoxycarboxylic acids such as oxypropionic acid; halogenated hydrocarbons such as chlorobutane and chloropentane; ether ketones such as methoxymethylpentanone; nitriles such as acetonitrile and benzonitrile Class etc. Examples of commercially available solvents equivalent to the above include mineral spirits, Varsol#2, Apco#18 solvent, Apco thinner, Socal Solvent No.1 and No.2, Solvesso#150, Shell TS28 solvent, Carbital Alcohol, ethyl carbitol, butyl carbitol, methyl cellosolve ("cellosolve" is a registered trademark. The same below), ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve acetate Cellulose, diglyme (all trade names), etc. These organic solvents may be used alone or in combination of two or more kinds. In the case of forming the pixel or black matrix of the color filter by photolithography, as the organic solvent, it is preferable to select a boiling point in the range of 100 to 250°C. More preferably, it has a boiling point of 120~230°C. Among the above-mentioned organic solvents, glycol alkyl ether acetates are preferred in terms of good balance of coatability, surface tension, etc., and relatively high solubility of constituent components in the composition. In addition, glycol alkyl ether acetates may be used alone or in combination with other organic solvents. As other organic solvents that can be used in combination, glycol monoalkyl ethers are particularly preferred. Among them, propylene glycol monomethyl ether is particularly preferred in terms of the solubility of the constituent components in the composition. In addition, glycol monoalkyl ethers have high polarity. If the amount of addition is too large, the pigments tend to agglomerate, and the viscosity of the photosensitive resin composition obtained later tends to decrease, such as storage stability. The ratio of the glycol monoalkyl ether is preferably 5 mass% to 30 mass%, more preferably 5 mass% to 20 mass%. In addition, it is also preferable to use it in combination with an organic solvent having a boiling point of 200°C or higher (hereinafter sometimes referred to as a "high boiling point solvent"). By using such a high boiling point solvent in combination, the photosensitive resin composition is not easy to dry out, and has the effect of preventing the rapid drying from destroying the uniform dispersion state of the pigment in the composition. That is, for example, it has the effect of preventing the occurrence of foreign matter defects caused by the precipitation and solidification of the colorant and the like at the tip of the slit nozzle. In terms of the higher effect, among the above-mentioned various solvents, dipropylene glycol methyl ether acetate, diethylene glycol mono-n-butyl ether acetate, and diethylene glycol monoethyl ether acetate are particularly preferred. 1,4-butanediol diacetate, 1,3-butanediol diacetate, glycerol triacetate, 1,6-hexanediol (diol) diacetate. The content ratio of the high boiling point solvent in the organic solvent is preferably 0% by mass to 50% by mass, more preferably 0.5% by mass to 40% by mass, and particularly preferably 1% by mass to 30% by mass. By setting the content ratio of the high-boiling point solvent to be higher than the above lower limit, for example, there is a tendency to prevent the occurrence of foreign matter defects due to the precipitation and solidification of the colorant at the tip of the slit nozzle. In addition, by setting the above upper limit Below the value, there is a tendency to avoid problems such as delay of the drying temperature of the composition, poor tact of the vacuum drying process, or traces of pores in the pre-baking process. In the photosensitive resin composition of the present invention, the content ratio of the organic solvent is not particularly limited. From the viewpoint of ease of coating or viscosity stability, the total solid content in the photosensitive resin composition is preferably 5 % By mass or more, more preferably 8% by mass or more, still more preferably 10% by mass or more, particularly preferably 12% by mass or more, more preferably 40% by mass or less, more preferably 30% by mass or less, and still more preferably It is 25% by mass or less, particularly preferably 20% by mass or less. <Other components of the photosensitive resin composition> In the photosensitive resin composition of the present invention, in addition to the above-mentioned components, an adhesion enhancer, a coatability enhancer, a pigment derivative, a development modifier, and ultraviolet absorber can also be appropriately formulated Agents, antioxidants, etc. <Adhesion-enhancing agent> In order to improve the adhesion to the substrate, an adhesion-enhancing agent may be contained. Examples thereof include a silane coupling agent, a titanium coupling agent, and the like, and a silane coupling agent is particularly preferred. As such a silane coupling agent, for example, KBM-402, KBM-403, KBM-502, KBM-5103, KBE-9007, X-12-1048, X12-1050 (manufactured by Shin-Etsu Silicones), Z -6040, Z-6043, Z-6062 (manufactured by Dow Corning Toray), etc. In addition, one type of silane coupling agent may be used, or two or more types may be used in any combination and ratio. Furthermore, the photosensitive resin composition of this invention may contain adhesion improving agents other than a silane coupling agent, for example, a phosphoric acid type adhesion improving agent, other adhesion improving agents, etc. are mentioned. The phosphoric acid-based adhesion improving agent is preferably a (meth)acryloyloxy group-containing phosphoric acid ester, and among them, those represented by the following general formulas (g1), (g2), and (g3) are preferred. [化21]

In the above general formulas (g1), (g2), (g3), R⁵¹ Each independently represents a hydrogen atom or a methyl group, I and I'are each independently an integer of 1-10, and m is independently 1, 2 or 3, respectively. Examples of other adhesion improving agents include TEGO*Add Bond LTH (manufactured by Evonik). These phosphoric acid group-containing compounds or other adhesives may be used alone or in combination of two or more. The content ratio of the adhesion enhancer in the photosensitive resin composition is not particularly limited, but it is preferably 0.1% by mass or more in the total solid content, more preferably 0.3% by mass or more, and still more preferably 0.5% by mass or more, especially It is preferably 1% by mass or more, more preferably 25% by mass or less, more preferably 20% by mass or less, still more preferably 10% by mass or less, particularly preferably 8% by mass or less, and most preferably 6% by mass or less. By setting it above the above lower limit value, there is a tendency that the adhesion to the substrate can be optimized, and by setting it below the above upper limit value, there is a tendency that residues during alkaline development can be suppressed. <Coatability improver> In order to improve coating properties, the photosensitive resin composition of the present invention may contain a surfactant as a coating property improver. As the surfactant, for example, various surfactants such as anionic, cationic, nonionic, and amphoteric surfactants can be used. Among them, it is preferable to use non-ionic surfactants in terms of the possibility of having a low possibility of adversely affecting each characteristic. Among them, in terms of coating properties, it is effective to use fluorine-based or silicon-based surfactants. Surfactant. Examples of such surfactants include: TSF4460 (manufactured by Momentive Performance Materials), DFX-18 (manufactured by NEOS), BYK-300, BYK-325, BYK-330 (manufactured by BYK-Chemie), KP340 ( Shin-Etsu Silicones Corporation), F-470, F-475, F-478, F-554, F-559 (manufactured by DIC Corporation), SH7PA (manufactured by Dow Corning Toray Corporation), DS-401 (manufactured by Daikin Corporation) , L-77 (manufactured by Nippon Unicar) and FC4430 (manufactured by 3M Japan). Furthermore, one type of surfactant may be used, or two or more types may be used in any combination and ratio. The content ratio of the surfactant in the photosensitive resin composition is not particularly limited, but it is preferably 0.01% by mass or more in the total solid content, more preferably 0.05% by mass or more, and still more preferably 0.10% by mass or more, and , Preferably 1.0% by mass or less, more preferably 0.7% by mass or less, still more preferably 0.5% by mass or less, and particularly preferably 0.3% by mass or less. By setting the content ratio of the surfactant to be higher than the above lower limit, there is a tendency that the uniformity of resist coating becomes better, and by setting it below the upper limit, there is a possibility that the resist sensitivity does not decrease tendency. <Pigment derivative> In order to improve dispersibility and storage properties, the photosensitive resin composition of the present invention may contain a pigment derivative. Examples of pigment derivatives include: azo series, phthalocyanine series, quinacridone series, benzimidazolone series, quinophthalone series, isoindolinone series, bis-㗁𠯤 series, anthraquinone series, anion Derivatives of danslin series, perylene series, piperidone series, diketopyrrolopyrrole series, diacetone series, etc., among which phthalocyanine series and quinophthalone series are preferred. As the substituent of the pigment derivative, a sulfonic acid group, a sulfonamide group and its quaternary salt, a phthaliminomethyl group, a dialkylaminoalkyl group, a hydroxyl group, a carboxyl group, an amide group, etc. can be mentioned , Preferably a sulfonic acid group, and these substituents are bonded to the pigment skeleton directly or via an alkyl group, an aryl group, a heterocyclic group, and the like. In addition, one pigment skeleton may be substituted by a plurality of these substituents. Specific examples of pigment derivatives include: phthalocyanine sulfonic acid derivatives, quinophthalone sulfonic acid derivatives, anthraquinone sulfonic acid derivatives, quinacridone sulfonic acid derivatives, pyrrolopyrrole two The sulfonic acid derivatives of ketones, the sulfonic acid derivatives of bis-㗁𠯤, etc. These may be used individually by 1 type, and may use 2 or more types together. <The manufacturing method of the photosensitive resin composition> The photosensitive resin composition of this invention (it may be called "resist" hereafter) is manufactured according to the conventional method. Generally, the (d) color material is preferably dispersed in advance using a paint conditioner, sand mill, ball mill, roll mill, stone mill, jet mill, homogenizer, or the like. The (d) colorant is made into fine particles by the dispersion treatment, so that the coating properties of the resist are improved. In addition, when a black color material is used as the (d) color material, it helps to improve the light-shielding ability. The dispersion treatment is usually preferably performed for a system that uses (d) colorants, solvents, and optionally (e) dispersant, and part or all of (a) alkali-soluble resin (hereinafter, sometimes it will be used for dispersion treatment) The mixture and the composition obtained by this treatment are called "ink" or "pigment dispersion"). In particular, if a polymer dispersant is used as a dispersant, it is preferable to suppress the time-dependent thickening of the obtained ink and resist (excellent in dispersion stability). Furthermore, when the liquid containing all the components formulated in the photosensitive resin composition is subjected to dispersion treatment, there is a possibility of modification of highly reactive components due to heat generated during the dispersion treatment. Therefore, it is preferable to perform a dispersion treatment for a system containing a polymer dispersant. In the case of using a sand mill to disperse the (d) colorant, it is preferable to use glass beads or zirconia beads with a diameter of about 0.1-8 mm. Regarding the dispersion treatment conditions, the temperature is usually 0°C to 100°C, preferably in the range of room temperature to 80°C. The dispersing time depends on the composition of the liquid and the size of the dispersing treatment device. The appropriate time is different, so adjust it appropriately. The standard of dispersion is to control the gloss of the ink in such a way that the 20-degree specular gloss of the resist (JIS Z8741) is in the range of 100 to 200. When the gloss of the resist is higher than the above lower limit, there is a tendency that the dispersion treatment is sufficient, coarse pigment (colorant) particles rarely remain, and developability, adhesion, resolution, etc. are sufficient. In addition, when the gloss value is less than the above upper limit value, there is a tendency to prevent the pigment from breaking and generating a large number of ultrafine particles, which, on the contrary, impairs the dispersion stability. Then, the ink obtained by the above-mentioned dispersion treatment and the above-mentioned other components contained in the resist are mixed to form a uniform solution. In the resist manufacturing process, fine foreign matter is often mixed into the liquid, so it is better to filter the obtained resist with a filter or the like. [Cured product] By curing the photosensitive resin composition of the present invention, a cured product can be obtained. The cured product obtained by curing the photosensitive resin composition can be preferably used as a member constituting a color filter such as a pixel, a black matrix, or a colored spacer. [Black Matrix] Next, the black matrix using the photosensitive resin composition of the present invention will be described based on its manufacturing method. (1) Support The material of the support used to form the black matrix is not particularly limited as long as it has an appropriate strength. Transparent substrates are mainly used. Examples of materials include polyester resins such as polyethylene terephthalate, polyolefin resins such as polypropylene and polyethylene, polycarbonate, polymethyl methacrylate, and polycure Such as thermoplastic resin sheets, epoxy resin, unsaturated polyester resin, poly(meth)acrylic resin and other thermosetting resin sheets, various glasses, etc. Among them, from the viewpoint of heat resistance, glass and heat-resistant resin are preferred. In addition, there are also cases where transparent electrodes such as ITO (Indium Tin Oxides) and IZO (Indium Zinc Oxide) are formed on the surface of the substrate. In addition to the transparent substrate, it can also be formed on the TFT array. In order to improve surface properties such as adhesiveness, the support may be subjected to corona discharge treatment, ozone treatment, atmospheric pressure slurry treatment, silane coupling agent or urethane-based resin film formation treatment, etc., if necessary. The thickness of the transparent substrate is usually set in the range of 0.05-10 mm, preferably 0.1-7 mm. In addition, in the case of performing thin film formation processing of various resins, the film thickness is usually in the range of 0.01 to 10 μm, preferably 0.05 to 5 μm. (2) Black matrix. When the black matrix of the present invention is formed from the above-mentioned photosensitive resin composition of the present invention, the photosensitive resin composition of the present invention is coated on a transparent substrate and dried, and then placed on the coating film The photomask is used for image exposure and development through the photomask, and thermal curing or photocuring as necessary, thereby forming a black matrix. (3) Formation of black matrix (3-1) Coating of photosensitive resin composition Flow coating method, die nozzle coating method, roll coating method, or spraying method, etc. are carried out. Among them, if the die nozzle coating method is used, the amount of coating liquid used can be greatly reduced, and there is no effect of mist that adheres when the spin coating method is performed, and the generation of foreign matter is suppressed from a comprehensive point of view. Better. The thickness of the coating film is calculated as the film thickness after drying, and is usually set preferably in the range of 0.2 to 10 μm, more preferably in the range of 0.5 to 6 μm, and still more preferably in the range of 1 to 4 μm. By setting it as the upper limit or less, pattern development becomes easy, and there exists a tendency for the gap adjustment in a liquid crystal cell formation process also to become easy. Moreover, by setting it as the above-mentioned lower limit or more, there exists a tendency for a desired color to appear easily. (3-2) Drying of the coating film The drying of the coating film after coating the photosensitive resin composition on the substrate is preferably performed by a drying method using a hot plate, an IR (infra red) oven, or a convection oven. The drying conditions can be appropriately selected according to the type of the above-mentioned solvent components, the performance of the dryer used, and the like. According to the type of solvent, the performance of the dryer used, etc., the drying time is usually selected within the range of 15 seconds to 5 minutes at a temperature of 40~200°C, preferably at a temperature of 50~130°C at 30 Choose from the range of seconds to 3 minutes. The higher the drying temperature, the better the adhesion of the coating film to the transparent substrate, but if it is too high, the alkali-soluble resin may decompose and induce thermal polymerization to cause poor development. Furthermore, the drying step of the coating film may also be a reduced-pressure drying method in which drying is performed in a reduced-pressure chamber without increasing the temperature. (3-3) Exposure Image exposure is performed by superimposing a negative mask pattern on the coating film of the photosensitive resin composition, and irradiating light with wavelengths from the ultraviolet region to the visible light region through the mask pattern. At this time, in order to prevent oxygen from degrading the sensitivity of the photopolymerizable layer, an oxygen barrier layer such as a polyvinyl alcohol layer may be formed on the photopolymerizable coating film and then exposed. The light source used for the above-mentioned image exposure is not particularly limited. Examples of the light source include light sources such as xenon lamps, halogen lamps, tungsten filament lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, medium-pressure mercury lamps, low-pressure mercury lamps, and carbon arc lamps. When irradiating light of a specific wavelength, optical filters can also be used. (3-4) Development The black matrix of the present invention can be produced by using the above light source to image the coating film formed of the photosensitive resin composition, using an organic solvent or containing a surfactant and a basic compound The aqueous solution is developed to form an image on the substrate. The aqueous solution may further contain organic solvents, buffers, complexing agents, dyes or pigments. Examples of basic compounds include sodium hydroxide, potassium hydroxide, lithium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate, sodium silicate, potassium silicate, sodium metasilicate, sodium phosphate, Potassium phosphate, sodium hydrogen phosphate, potassium hydrogen phosphate, sodium dihydrogen phosphate, potassium dihydrogen phosphate, ammonium hydroxide and other inorganic alkaline compounds, or mono, di or triethanolamine, mono, di or trimethylamine, mono, di or trimethylamine Ethylamine, mono- or diisopropylamine, n-butylamine, mono-, di- or triisopropanolamine, ethyleneimine, ethylenediimide, tetramethylammonium hydroxide (TMAH), choline Basic compound. These basic compounds may also be a mixture of two or more kinds. As the surfactant, for example, polyoxyethylene alkyl ethers, polyoxyethylene alkyl aryl ethers, polyoxyethylene alkyl esters, sorbitan alkyl esters, and monoglyceride alkyl esters can be cited. Non-ionic surfactants such as alkylbenzene sulfonates, alkyl naphthalene sulfonates, alkyl sulfates, alkyl sulfonates, sulfosuccinates and other anionic surfactants Agents, amphoteric surfactants such as alkyl betaines and amino acids. Examples of the organic solvent include isopropanol, benzyl alcohol, ethyl cellosolve, butyl cellosolve, phenyl cellosolve, propylene glycol, diacetone alcohol, and the like. The organic solvent may be used alone or in combination with an aqueous solution. The conditions of the development treatment are not particularly limited. Generally, the development temperature is in the range of 10-50°C, among which 15-45°C is preferred, and 20-40°C is particularly preferred. The developing method can be immersion developing method or jet developing method. , Brush development method, ultrasonic development method and other methods. (3-5) Thermal hardening treatment The developed substrate is subjected to thermal hardening treatment or light hardening treatment, preferably thermal hardening treatment. Regarding the thermal hardening treatment conditions at this time, the temperature is selected in the range of 100 to 280°C, preferably 150 to 250°C, and the time is selected in the range of 5 to 60 minutes. The height of the black matrix formed by the above method is usually 0.5-5 μm, preferably 0.8-4 μm. Furthermore, the optical density (OD) per thickness of 1 μm is 3.0 or more, preferably 3.5 or more, more preferably 3.8 or more, particularly preferably 4.0 or more, and most preferably 4.2 or more. [Formation of other color filter images] According to the same process as the above (3-1) ~ (3-5), a transparent substrate with a black matrix is coated with one of red, green, and blue The photosensitive resin composition of the color pigment is dried, and a photomask is superimposed on the coating film, and the image is exposed and developed through the photomask, and thermally or photocured as necessary to form a pixel image. Like, make a colored layer. By performing this operation on the photosensitive resin compositions of the three colors of red, green, and blue, respectively, a color filter image can be formed. The order of these is not limited to the above. [Colored Spacer] The photosensitive resin composition of the present invention can also be used as a resist for colored spacers in addition to the black matrix. When spacers are used in TFT LCD (Liquid Crystal Display, liquid crystal display devices), the light entering the TFT may cause the TFT as a switching element to malfunction. The colored spacers are used to prevent this, for example Japanese Patent Laid-Open No. 8-234212 describes that the spacer is light-shielding. Except for using the mask for the colored spacers, the colored spacers can be formed by the same method as the above-mentioned black matrix. (3-6) Formation of transparent electrodes The color filter can directly form transparent electrodes such as ITO on the image in this state and be used as part of the parts of color displays, liquid crystal display devices, etc., but it can also be used to improve For surface smoothness or durability, a top coat of polyamide, polyimide, etc. may be placed on the image as needed. In addition, in some applications such as a planar alignment type driving method (IPS (In-Plane Switching, Lateral Electric Field Effect) mode) and other applications, there are cases where transparent electrodes are not formed. [Image display device] The image display device of the present invention has a cured product obtained by curing the photosensitive resin composition of the present invention. The image display device is not particularly limited as long as it is a device that displays images or video, and the following liquid crystal display devices, organic EL displays, and the like can be cited. [Liquid crystal display device] The liquid crystal display device of the present invention has the above-mentioned hardened materials such as the black matrix, color filter pixels, and colored spacers of the present invention, and the formation order or formation position of the color pixels or the black matrix is not particularly limited. Liquid crystal display devices usually form an alignment film on a color filter. After spreading spacers on the alignment film, the alignment film is bonded to a counter substrate to form a liquid crystal cell. The formed liquid crystal cell is injected with liquid crystal and connected to the counter electrode. And done. As the alignment film, a resin film such as polyimide is suitable. The formation of the alignment film usually adopts the gravure printing method and/or the flexible printing method, and the thickness of the alignment film is set to a few 10 nm. After the alignment film is hardened by thermal baking, the surface is treated by ultraviolet irradiation or by rubbing cloth, and processed into a surface state capable of adjusting the tilt angle of the liquid crystal. As the spacer, one having a size corresponding to the gap with the counter substrate is used, and it is usually 2-8 μm. It is also possible to form a photosensitive spacer (PS) of a transparent resin film on the color filter substrate by photolithography, and make full use of it to replace the spacer. As the counter substrate, an array substrate is usually used, and a TFT (Thin Film Transistor) substrate is particularly suitable. The gap when bonding to the counter substrate varies according to the application of the liquid crystal display device, and is usually selected in the range of 2-8 μm. After bonding with the counter substrate, seal the part other than the liquid crystal injection port with a sealing material such as epoxy resin. The sealing material is cured under UV irradiation and/or heating to seal the periphery of the liquid crystal cell. After cutting the sealed liquid crystal cell into the panel unit, the pressure is reduced in the vacuum chamber, the liquid crystal injection port is immersed in the liquid crystal, and then the cavity is leaked to inject the liquid crystal into the liquid crystal cell. The decompression degree in the liquid crystal cell is usually 1×10^{- 2} ~1×10^{- 7} Pa, preferably 1×10^{- 3} ~1×10^{- 6} Pa. In addition, it is preferable to heat the liquid crystal cell during decompression, and the heating temperature is usually 30 to 100°C, more preferably 50 to 90°C. The heating and holding during decompression is usually set in the range of 10 to 60 minutes, and then immersed in the liquid crystal. The UV curing resin is cured to seal the liquid crystal injection port of the liquid crystal cell in which the liquid crystal is injected, thereby completing the liquid crystal display device (panel). The type of liquid crystal is not particularly limited, and it may be a previously known liquid crystal such as an aromatic, aliphatic, and polycyclic compound, and it may be any of liquid crystals, thermotropic liquid crystals, and the like. Known thermotropic liquid crystals include nematic liquid crystals, smectic liquid crystals, cholesteric liquid crystals, etc., and may be any of them. [Organic EL Display] The organic EL display of the present invention is produced using the color filter of the present invention. In the case of using the color filter of the present invention to produce an organic EL display, for example, as shown in FIG. A color filter formed by a resin black matrix (not shown) between 20 and adjacent pixels 20, on which an organic light-emitting body 500 is laminated via an organic protective layer 30 and an inorganic oxide film 40 Thus, the organic EL device 100 can be manufactured. Furthermore, at least one of the pixel 20 and the resin black matrix is produced using the photosensitive resin composition of the present invention. As a layering method of the organic light-emitting body 500, one may include: forming a transparent anode 50, a hole injection layer 51, a hole transport layer 52, a light emitting layer 53, an electron injection layer 54 and a cathode 55 in order on the upper surface of the color filter. Method, or a method of bonding the organic light-emitting body 500 formed on another substrate to the inorganic oxide film 40, etc. The organic EL device 100 produced in this way can be used, for example, by the method described in "Organic EL Display" (Ohm Corporation, issued on August 20, 2004, by Shishishi, Adachi, Chinami, and Hideyuki Murata (author)). Production of organic EL displays. Furthermore, the color filter of the present invention can be applied to an organic EL display in a passive driving mode or an organic EL display in an active driving mode. Examples Next, the present invention will be explained more specifically by citing synthesis examples, examples, and comparative examples, but the present invention is not limited to the following examples as long as it does not exceed the gist. <Preparation of Carbon Black Ink> According to the following composition and method, the pigment, dispersant, dispersing aid (pigment derivative), and solvent are formulated to prepare carbon black ink. Specifically, first, the solid components of the pigment, the dispersant, and the dispersing auxiliary agent and the solvent are blended so that the ratio of the solid content is as follows. ·Pigment: RAVEN1060U (manufactured by Birla, carbon black); 52.00 parts by mass · Dispersant: DISPERBYK-167 (manufactured by BYK-Chemie, basic urethane dispersant); 7.30 parts by mass (conversion of solid content) · Dispersing aid (pigment derivative): S12000 (manufactured by Lubrizol, a phthalocyanine pigment derivative with an acidic group); 1.03 parts by mass · Solvent: propylene glycol monomethyl ether acetate (PGMEA); 112.04 parts by mass Stir and mix thoroughly to obtain a dispersion. Then, a paint shaker was used for 6 hours of dispersion treatment in the range of 25~45°C. As the beads, zirconia beads with a diameter of 0.5 mm were used, and the beads were added at a ratio of 180 parts by mass to 60 parts by mass of the dispersion. After the dispersion is completed, the beads and the dispersion are separated by a filter to prepare a carbon black ink with a solid content of 35% by mass. <Synthesis example 1: Synthesis of alkali-soluble resin (1)> [Chemical 22]

Put 50 g of epoxy compound (epoxy equivalent 264) of the above chemical structure, 13.65 g of acrylic acid, 60.5 g of 3-methoxybutyl acetate, 0.936 g of triphenylphosphine, and 0.032 g of p-methoxyphenol into the installation In a flask equipped with a thermometer, a stirrer, and a cooling tube, the reaction is carried out at 90°C while stirring until the acid value becomes less than 5 mgKOH/g. The reaction required 12 hours to obtain an epoxy acrylate solution. 25 parts by mass of the obtained epoxy acrylate solution, 0.76 parts by mass of trimethylolpropane (TMP), 3.3 parts by mass of biphenyltetracarboxylic dianhydride (BPDA), and tetrahydrophthalic anhydride (THPA) 3.5 parts by mass were put into a flask equipped with a thermometer, a stirrer, and a cooling tube, and the temperature was slowly raised to 105°C while stirring to make it react. When the resin solution becomes transparent, it is diluted with 3-methoxybutyl acetate (MBA) to prepare a solid content of 50% by mass, and an acid value of 115 mgKOH/g is obtained, which is converted from polystyrene measured by GPC Alkali-soluble resin (1) with a weight average molecular weight (Mw) of 2,600. <Synthesis Example 2: Synthesis of Alkali-soluble Resin (2)> [Chemical 23]

Add 7.3 g of epoxy compound (epoxy equivalent 240) of the above chemical structure, 2.2 g of acrylic acid, 6.4 g of propylene glycol monomethyl ether acetate, 0.18 g of tetraethylammonium chloride, and 0.007 g of p-methoxyphenol In a flask equipped with a thermometer, a stirrer, and a cooling tube, the reaction was carried out at 100°C while stirring until the acid value became less than 5 mgKOH/g. The reaction required 9 hours to obtain an epoxy acrylate solution. 16 parts by mass of the obtained epoxy acrylate solution, 0.4 parts by mass of trimethylolpropane (TMP), 3.5 parts by mass of biphenyltetracarboxylic dianhydride (BPDA), and tetrahydrophthalic anhydride (THPA) 0.06 parts by mass and 14 parts by mass of propylene glycol monomethyl ether acetate (PGMEA) were put into a flask equipped with a thermometer, a stirrer, and a cooling tube. While stirring, the temperature was slowly raised to 105°C and reacted to obtain a solid content of 40 Alkali-soluble resin (2) by mass%, acid value 100 mgKOH/g, and weight average molecular weight (Mw) converted from polystyrene measured by GPC of 10,400. ＜Photopolymerization initiator (1)＞ [Chemical 24]

The photopolymerization initiator (1) of the above chemical structure synthesized by the method described in International Publication No. 2015/036910 was used. The obtained photopolymerization initiator (1) was dissolved in propylene glycol monomethyl ether acetate (PGMEA) to prepare a 0.01% by mass solution, and the absorption spectrum was measured using a spectrophotometer U-3900H (manufactured by Hitachi High-Technologies Corporation). The maximum absorption wavelength in the wavelength range of 320 nm to 400 nm is 331 nm. ＜Photopolymerization initiator (2)＞ [Chem 25]

The photopolymerization initiator (2) of the above chemical structure synthesized by the method described in International Publication No. 2008/078678 was used. The absorption spectrum was measured by the same method as the photopolymerization initiator (1). As a result, the maximum absorption wavelength was 368 nm. <Photopolymerization initiator (3)> As the photopolymerization initiator (3), TR-PBG-314 (compound with the following chemical structure) manufactured by Changzhou Qiangli Electronic New Materials Co., Ltd. was used. [化26]

The absorption spectrum was measured by the same method as the photopolymerization initiator (1). As a result, the maximum absorption wavelength was 339 nm. <Photopolymerization initiator (4)> As the photopolymerization initiator (4), TR-PBG-358 (compound with the following chemical structure) manufactured by Changzhou Qiangli Electronic New Materials Co., Ltd. was used. [化27]

The absorption spectrum was measured by the same method as the photopolymerization initiator (1). As a result, the maximum absorption wavelength was 344 nm. <Photopolymerizable monomer> Light Acrylate PE-4A manufactured by Kyoeisha Chemical Co., Ltd. and KAYARAD DPCA-20 manufactured by Nippon Kayaku are prepared as photopolymerizable monomers. [化28]

[化29]

<Adhesion improving agent> As an adhesion improving agent, KBM-5103 manufactured by Shin-Etsu Chemical Co., Ltd. as a silane coupling agent, and KAYAMER PM-21 manufactured by Nippon Kayaku Co., Ltd. as a phosphoric acid-based adhesion improving agent are prepared. [化30]

[化31]

<Coatability improver> As a coatability improver, MEGAFAC F-554 (oligomer containing fluorine group and lipophilic group, nonionic surfactant) manufactured by DIC Corporation, which is a surfactant, is prepared. <Example 1> (Preparation of black resist 1) Using the carbon black ink prepared in the above-mentioned <Preparation of carbon black ink>, each component was added in a ratio described in Table 1, and stirred with a stirrer. This was dissolved, and a black resist 1 was prepared. The total solid content in the black resist 1 is 15% by mass. [Table 1]

Furthermore, the meanings of the abbreviations of the solvents in Table 1 are as follows. PGMEA: Propylene glycol monomethyl ether acetate MBA: 3-methoxybutyl acetate EDGAC: Diethylene glycol monoethyl ether acetate <Example 2> (Preparation of black resist 2) The black color shown in Table 1 In Resist 1, the total amount of the photopolymerization initiator remained unchanged, and the mixing ratio (mass%) of the photopolymerization initiator (1) and (2) was changed as shown in Table 2. Otherwise, A black resist 2 with a solid content of 15% by mass was prepared by the same method as the black resist 1. [Table 2]

<Example 3> (Preparation of black resist 3) In the black resist 1 shown in Table 1, the total amount of the photopolymerization initiator was kept unchanged, and the photopolymerization initiators (1) and (2) The mixing ratio (% by mass) of) was changed as shown in Table 2. Except for this, a black resist 3 with a solid content concentration of 15% by mass was prepared by the same method as the black resist 1. <Comparative Example 1> (Preparation of Black Resist 4) In the black resist 1 shown in Table 1, the total amount of the photopolymerization initiator was kept unchanged, and the photopolymerization initiators (1) and (2) The mixing ratio (% by mass) of) was changed as shown in Table 2. Except for this, a black resist 4 with a solid content concentration of 15% by mass was prepared by the same method as the black resist 1. <Comparative Example 2> (Preparation of Black Resist 5) In the black resist 1 shown in Table 1, the total amount of the photopolymerization initiator was kept unchanged, and the photopolymerization initiators (1) and (2) The mixing ratio (% by mass) of) was changed as shown in Table 2. Except for this, a black resist 5 with a solid content concentration of 15% by mass was prepared by the same method as the black resist 1. <Example 4> (Preparation of black resist 6) In the black resist 2 of Example 2, the total amount of the photopolymerization initiator was kept unchanged, and the photopolymerization initiator (2) was changed to photopolymerization Except for the starter (3), a black resist 6 with a solid content concentration of 15% by mass was prepared by the same method as the black resist 2. <Example 5> (Preparation of black resist 7) In the black resist 2 of Example 2, the total amount of the photopolymerization initiator was kept unchanged, and the photopolymerization initiator (2) was changed to photopolymerization Except for the starter (4), a black resist 7 with a solid content concentration of 15% by mass was prepared by the same method as the black resist 2. (Evaluation of Black Resist) (1) Preparation of black matrix (BM) fine line pattern. Use a spin coater to coat the prepared black resists 1 to 7 on a glass substrate. After drying under reduced pressure, use a hot plate Dry at 90°C for 100 seconds. In addition, the coating conditions were adjusted so that the coating film thickness became approximately 1.2 μm. Then, for the obtained dry coating film, an exposure machine (EXF-2829-F-00 manufactured by OAK Manufacturing Co., Ltd.) was used with a high-pressure mercury lamp (ADH-3000M-FN manufactured by OAK Manufacturing Co., Ltd., without optical filter). ), with 35 mJ/cm² , Pattern exposure is performed through an exposure mask with an opening width of 1-10 μm (with a difference of 1 μm respectively) and a linear opening of 15 μm (close gap: 180 μm). Thereafter, at room temperature (23°C), a KOH aqueous solution prepared with ultrapure water to be 0.04% by mass was used as an alkaline developer, and spray development was performed for 2.2 times the dissolution time (spray pressure: 0.1 MPa), After removing the unexposed part, it was spray-washed with ultrapure water (spray pressure: 0.1 MPa) to form a BM thin line pattern. Furthermore, the so-called dissolution time is the time from when the black resist film in the unexposed part is dissolved during the development process until the surface of the substrate starts to be seen, and the dissolution time of each black resist is in the range of 20-30 seconds. (2) Evaluation of BM fine line pattern The developed BM fine line pattern was observed with an optical microscope to confirm the formation state of the BM fine line, and then the fine line adhesion and sensitivity were evaluated. The results are shown in Table 3. In addition, the evaluation of the close adhesion and sensitivity of the thin wire was performed based on the following criteria. (Evaluation of Fine Line Adhesion) BM fine lines are present in alkaline development, and the bonding surface of the BM fine lines/glass substrate is corroded and intruded, and the fine line adhesiveness deteriorates. Observe the line pattern part of 10 μm or less with an optical microscope. For example, when the pattern of 8 μm or more is in close contact and the pattern of 7 μm or less is peeled off, the fine line close adhesion is evaluated as 8 μm, and the classification is as follows (here, for example, When the width of the opening of the exposure mask is 7 μm, the corresponding pattern is recorded as a 7 μm pattern). In addition, if the evaluation is "○", it can be said that the thin wire adhesion is good, and if it is "◎", it can be said to be more good, and the evaluation "×" indicates that the thin wire adhesion is poor. ◎: The fine lines of patterns above 7 μm are closely connected. ○: The fine lines of the pattern over 8 μm are closely connected (the pattern under 7 μm is peeled off). ×: The fine lines of the pattern over 9 μm are closely connected (the pattern under 8 μm is peeled off). (Evaluation of Sensitivity) When the exposure sensitivity of the black resist as a photosensitive resin composition increases, the line width of the formed BM thin line tends to increase. Measure the line width of the 15 μm line pattern with an optical microscope, and classify the sensitivity as follows (here, for example, when the width of the opening of the exposure mask is 15 μm, the corresponding pattern is described as a 15 μm pattern) . In addition, if the evaluation is "○", the sensitivity can be said to be good, and the evaluation "×" indicates that the sensitivity is low. ○: The line width of the 15 μm pattern is 15 μm or more. ×: The line width of the 15 μm pattern is less than 15 μm. [table 3]

As shown in Table 3, the BM thin wires of Examples 1 to 5 have good thin wire adhesion and sensitivity. The BM thin line of Comparative Example 1 showed high sensitivity, but on the other hand, the close adhesion of the thin line was a low result. In addition, the BM thin wire of Comparative Example 2 showed good thin wire adhesion, but on the other hand, the sensitivity was low. It is considered that in Comparative Example 1, the degree of hardening of the surface of the BM is relatively high, but the hardening of the inside of the BM is insufficient. Therefore, although the line width is wide, the tightness of the thin line is a poor result. It is considered that in Comparative Example 2, the degree of hardening of the surface of the BM is relatively weak, but the degree of hardening of the inside of the BM is relatively high. Therefore, although the line width is thinner, the tightness of the thin lines is a better result. In addition, it is considered that in Examples 1 to 5, the surface and the inside of the BM are cured in a good balance, which is related to the realization of both fine wire adhesion and high sensitivity. Since Examples 1 to 5 have high sensitivity, the line width is widened, but from the viewpoints listed below, they have many advantages and are expected. ·The sensitivity is very sufficient, and the amount of photopolymerization initiator can be reduced accordingly, and the reduced part of the photopolymerization initiator can be replaced with alkali-soluble resin or photopolymerizable monomer, etc., thereby contributing to development resistance or substrate Improved performance such as adhesion. ·The amount of exposure required to form the target line width is reduced, and the exposure speed can be increased accordingly, and the productivity can be improved. On the other hand, although Comparative Example 1 is also a result of high sensitivity, the curing of the inside of the BM is insufficient. Therefore, if the amount of the photopolymerization initiator is decreased or the exposure amount is decreased, the fine line adhesion will be further deteriorated. Regarding the effect of the present invention, the detailed mechanism is not yet clear, but it is considered as follows. That is, the phenylsulfide-based photopolymerization initiator has excellent UV absorption ability near 330 nm, but the benzofuran part of the condensed heterocycle contained in the photopolymerization initiator (c1) represented by the general formula (I) It can increase the interaction force with the color material, especially carbon black, thereby promoting the adsorption of the photopolymerization initiator (c1) on the surface of the color material particles. The light absorbed by the pigment does not participate in the polymerization, which is a major cause of the low exposure sensitivity. By covering the surface of the pigment with a photopolymerization initiator, the light absorption rate of the photopolymerization initiator is increased. In addition, the absorption of the photopolymerization initiator on the colorant relatively reduces the concentration of the photopolymerization initiator in the resin component, and therefore the light transmittance to the deep portion is improved. As a result, it is considered that the internal curability of the resist film is improved, and in relation to this, the fine line adhesion is improved. However, if it is only the photopolymerization initiator (c1), only a part of the low-wavelength side of the UV wavelength range of the exposure light source can be used, and sufficient sensitivity cannot be obtained. Therefore, by using the light with the maximum absorption wavelength in the long-wavelength range The polymerization initiator (c2) can be combined to improve sensitivity, especially surface sensitivity. Since there is a maximum absorption wavelength difference between the photopolymerization initiator (c1) and the photopolymerization initiator (c2), it is possible to suppress the influence on the internal curability caused by the combined use. In view of this, it is considered that the surface sensitivity and internal hardening can be improved at the same time. From the foregoing, it can be seen that by using the photosensitive resin composition of the present invention, a photosensitive resin composition having high sensitivity and excellent fine line adhesion performance can be provided. The present invention has been described in detail using a specific aspect, but it should be clear to the industry that various changes and changes can be added without departing from the spirit and scope of the present invention. In addition, this application is based on a Japanese patent application (Japanese Patent Application No. 2016-181932) filed on September 16, 2016, and the entire content is used by reference.

10‧‧‧Transparent Supporting Substrate 20‧‧‧Pixel 30‧‧‧Organic Protective Layer 40‧‧‧Inorganic Oxide Film 50‧‧‧Transparent Anode 51‧‧‧Hole Injection Layer 52‧‧‧Hole Transport Layer 53‧ ‧‧Emitting layer 54‧‧‧Electron injection layer 55‧‧‧Cathode 100‧‧‧Organic EL element 500‧‧‧Organic light-emitting body

FIG. 1 is a schematic cross-sectional view showing an example of an organic EL (Electro Luminescence) device equipped with the color filter of the present invention.

10‧‧‧Transparent support substrate

20‧‧‧ pixels

30‧‧‧Organic protective layer

40‧‧‧Inorganic oxide film

50‧‧‧transparent anode

51‧‧‧ Hole injection layer

52‧‧‧Hole Transmission Layer

53‧‧‧Light-emitting layer

54‧‧‧Electron injection layer

55‧‧‧Cathode

100‧‧‧Organic EL element

500‧‧‧Organic luminous body

Claims (20)

A photosensitive resin composition characterized in that it contains (a) an alkali-soluble resin, (b) a photopolymerizable monomer, (c) a photopolymerization initiator, and (d) a colorant, and the above (c) ) The photopolymerization initiator contains the photopolymerization initiator (c1) represented by the following general formula (I), and the photopolymerization initiator (c2) with a maximum absorption wavelength of 334nm or more in the wavelength range of 320nm~400nm ,

(In formula (I), R ¹ represents an optionally substituted alkyl group or an optionally substituted aromatic ring group; R ² represents an optionally substituted alkyl group or an optionally substituted aromatic ring group; k Represents 0 or 1; R ³ to R ⁶ each independently represent any monovalent substituent; l, m, and o each independently represent an integer of 0 to 3; n represents 0 or 1). The photosensitive resin composition according to claim 1, wherein the content of the (d) colorant with respect to all solid components is 20% by mass or more. The photosensitive resin composition of claim 2, wherein the above-mentioned (d) colorant is relative to all solids The content of the ingredients is 30% by mass or more. The photosensitive resin composition according to claim 2, wherein the content of the (d) colorant relative to the total solid content is 60% by mass or less. The photosensitive resin composition according to claim 3, wherein the content of the (d) colorant relative to the total solid content is 60% by mass or less. The photosensitive resin composition according to any one of claims 1 to 5, wherein the above-mentioned photopolymerization initiator (c2) is a photopolymerization initiator having a quince skeleton or a carbazole skeleton. The photosensitive resin composition of claim 6, wherein the photopolymerization initiator (c2) is a photopolymerization initiator represented by the following general formula (II),

(In formula (II), R ⁷ represents an optionally substituted alkyl group or an optionally substituted aromatic ring group; R ⁸ represents an optionally substituted alkyl group or an optionally substituted aromatic ring group; p Represents 0 or 1; R ⁹ represents any monovalent substituent; q represents an integer from 0 to 3; X represents -N(R ¹⁰ )- or -C(R ¹¹ )(R ¹² )-; R ¹⁰ ~R ¹² Each independently represents a hydrogen atom, an optionally substituted alkyl group, or an optionally substituted aromatic ring group; R ¹¹ and R ¹² may be bonded to each other to form a ring). The photosensitive resin composition according to any one of claims 1 to 5, wherein the content ratio of the above-mentioned (c) photopolymerization initiator to all solid components is 2% by mass or more. The photosensitive resin composition according to claim 6, wherein the content ratio of the above-mentioned (c) photopolymerization initiator with respect to all solid components is 2% by mass or more. The photosensitive resin composition according to claim 7, wherein the content ratio of the above-mentioned (c) photopolymerization initiator with respect to all solid components is 2% by mass or more. The photosensitive resin composition according to any one of claims 1 to 5, wherein the content ratio of the photopolymerization initiator (c1) in the photopolymerization initiator (c) is 1% by mass or more. The photosensitive resin composition according to claim 6, wherein the content ratio of the photopolymerization initiator (c1) in the photopolymerization initiator (c) is 1% by mass or more. The photosensitive resin composition according to claim 7, wherein the content ratio of the photopolymerization initiator (c1) in the photopolymerization initiator (c) is 1% by mass or more. The photosensitive resin composition according to claim 8, wherein the above-mentioned in the above-mentioned (c) photopolymerization initiator The content ratio of the photopolymerization initiator (c1) is 1% by mass or more. The photosensitive resin composition according to claim 9, wherein the content ratio of the photopolymerization initiator (c1) in the photopolymerization initiator (c) is 1% by mass or more. The photosensitive resin composition according to claim 10, wherein the content ratio of the photopolymerization initiator (c1) in the photopolymerization initiator (c) is 1% by mass or more. The photosensitive resin composition according to any one of claims 1 to 5, wherein the above-mentioned (d) color material is carbon black. The photosensitive resin composition according to any one of claims 1 to 5, wherein the (a) alkali-soluble resin contains an epoxy (meth)acrylate resin having a carboxyl group. A cured product obtained by curing the photosensitive resin composition according to any one of claims 1 to 18. An image display device having a hardened object as claimed in claim 19.

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