TWI745135B - Chip repair method - Google Patents

Abstract

A method for repairing a chip, which uses a chip repairing device controlled by a control system to perform the repairing operation of the defective chip of the intermediate product of the process by de-soldering and removing the defective chip from the carrier and welding and replacing the good chip. The chip repairing method inputs the process to be repaired After the intermediate product, a magnetically attractable object is placed on the defective wafer and cured to form a magnetically attractable marker, followed by the magnetically attractable marker fixed on the surface of the defective wafer by the wafer repair device with a magnetic work piece, The defective chip is heated and unsoldered and then removed, then the defective chip connected to the magnetic work piece is removed, and then the good chip is soldered on the carrier where the defective chip is removed by de-soldering.

Description

Chip repair method

The present invention relates to a chip repair method used in the semiconductor device assembly process to perform repair operations such as de-soldering removal and solder replacement of defective chips adhered to a carrier in the intermediate product of the process after inspection.

At present, semiconductor components such as micro light emitting diode (LED) components are circuits that can be connected to external electronic devices. The chips of semiconductor components such as micro LED components must be soldered to a lead frame or other carrier first, so as to make external connections through the lead frame or other carrier Medium. In order to ensure the quality of semiconductor devices, inspections are usually performed after specific procedures during the assembly process to screen out defective products.

In the aforementioned micro LED device and other semiconductor device assembly process, after the chip is soldered to a carrier such as a lead frame material, before the subsequent process, the defective chip on the carrier is removed and the defective chip on the carrier is repaired by soldering replacement. Operation.

At present, the chip repair work is mainly performed by the operator manually or by operating the machine. However, the known chip repair method requires manual manual marking of defective wafers, desoldering and removing the defective wafers, and then replacing the good quality wafers. Welding on the carrier where the defective chip has been removed, etc., since each of the foregoing steps must be performed one by one, the operation is time-consuming and labor-intensive.

The purpose of the present invention is to provide a chip repairing method, which solves the time-consuming and labor-consuming manual chip repairing operations of performing unsoldering removal on defective chips on the carrier and re-soldering the defective chips on the carrier after the process intermediate products in the existing semiconductor device manufacturing process are inspected. problem.

In order to achieve the foregoing objective, the present invention proposes a chip repairing method, which uses a chip repairing device controlled by a control system to perform the repairing operation of the defective chip of the intermediate product of the process from the carrier and the repairing operation of the good chip that is replaced by soldering. Repair methods include: The step of inputting process intermediate products to be repaired is to transport the process intermediate products with defective wafers to the wafer repairing device, and input the position data of each defective wafer on the carrier of the process intermediate products to the control system; In the step of arranging a magnetically attractable object on a defective chip, the control system controls the chip repair device to install a magnetically attractable object on the surface of each defective chip according to the position of each defective chip in the intermediate product of the process. Magnetically attractive objects; The step of curing a magnetically attractable object to form a magnetically attractable marker, which is performed by the control system to cause the chip repair device to solidify the magnetically attractable object provided on the surface of the defective chip to form a fixation on the defect Magnetically attractable markers on the surface of the chip; The step of de-soldering and removing defective chips is that the control system drives a magnetic work piece in the chip repairing device to magnetically fix the defective chips according to the position of each defective chip in the intermediate product of the process A magnetically attractable marker on the surface, heating and de-soldering the defective chip and the carrier, and removing the de-soldered defective chip from the carrier; The step of removing the defective chip connected to the magnetic work piece, in which the control system causes the chip repairing device to remove the defective chip connected to the end of the magnetic work piece by magnetic attraction; and In the step of soldering a good chip, the control system causes the chip repair device to solder a good chip on the carrier where the defective chip has been removed.

With the aforementioned chip repair method, when it is applied to the semiconductor device manufacturing process, it has at least the following effects: 1. The chip repair method of the present invention uses a magnetically attractable marker on the surface of a defective wafer, and uses a magnetic work piece to magnetically attract a defective wafer with a magnetically attractable marker, and at the same time performs heating, de-soldering and self-carrier removal on the defective wafer Consistent actions, such as removing defective chips, increase the ease of operation, and can prevent the remaining chips soldered on the carrier from being affected, ensuring the quality of the chip soldering on the carrier. 2. In the chip repairing method of the present invention, the magnetic work piece is moved away from the carrier after the defective chip is magnetically absorbed and de-soldered, and the magnetic work piece is connected to the defective chip after the de-soldering by the magnetic attraction connection relationship. The subsequent defective chip can be easily removed from the end of the magnetic work piece, so that the subsequent magnetic work piece can perform the unsoldering and removal action of the next defective chip.

In the chip repairing method of the present invention, the chip repairing device can be further used to first place a paste or liquid magnetic or magnetic substrate on the surface of the defective wafer, and then place a thermosetting or light-curing glue on the surface of the defective wafer. The surface of the defective wafer, and the thermosetting or photocurable glue solution covers the magnetic or magnetic substrate to form the magnetically attractable object, thereby heating or irradiating the magnetically attractable object with ultraviolet rays After the step of curing to form a magnetically attractable label, the magnetically attractable label is formed into a multilayer structure with a magnetic or magnetic base material and a non-magnetic or magnetic thermosetting or photocurable colloid on the outside, In the subsequent step of unsoldering and removing the defective chip, when the magnetic work piece magnetically attracts the magnetically attractable marker on the surface of the defective chip, the magnetic work piece is close to or in contact with a non-magnetic or magnetically conductive thermosetting or photocurable colloid , It is indirectly magnetically attracted to the magnetic or magnetic substrate in the inner layer of the magnetically attractable marker, so it can help the subsequent step of unsoldering and removing the defective chip, so that the defective chip with the magnetically attractable marker It is easier to detach from the end of the magnetic work piece, which improves the convenience of operation.

Continuing from the above, in the chip repair method of the present invention, in the step of removing the defective chip connected to the magnetic work piece, ultrasonic vibration means can be used to shake off the defective chip with a magnetically attractable marker. Among them, the ultrasonic vibration method can directly use the magnetic work piece as the ultrasonic transmission medium, which helps to remove the welding defect chip connected to the magnetic work piece, and enhances the convenience of the operation.

Figures 1 to 4 show schematic flow diagrams of several preferred embodiments of the chip repair method of the present invention. The chip repairing method of the present invention uses a chip repairing device controlled by a control system to perform de-soldering and re-soldering repairs on defective wafers 12 welded to the carrier 11 of the process intermediate product 10, and the carrier 11 may be Lead frame material board or other circuit carrier. As shown in FIGS. 1 to 4, the specific implementation steps of the chip repair method include: the step of inputting the process intermediate product of the chip to be repaired, and the step of setting the magnetically attractable objects 20A, 20B, 20C, and 20D on the defective chip 12 Steps to solidify magnetically attractable objects 20A, 20B, 20C, and 20D to form magnetically attractable markers 2A, 2B, 2C, 2D, steps to remove defective chips 12 from soldering, and to remove defects in the connection of magnetic work pieces 30 The step of chip 12 and the step of soldering good chip 13.

The step of inputting the process intermediate product of the wafer to be repaired is to transport the process intermediate product 10 with the defective wafer 12 to the wafer repair device, and each defective wafer 12 in the process intermediate product 10 is located at the position of the carrier 11 Data and input to the control system.

In the step of arranging magnetically attractable objects 20A, 20B, 20C, 20D on the defective chip 12, the control system controls the chip repair device on the defective chip according to the position of each defective chip 12 of the intermediate product of the process The surface of is provided with magnetically attractable objects 20A, 20B, 20C, 20D. The magnetically attractable objects 20A, 20B, 20C, 20D refer to thermosetting magnetic objects with magnetism, or thermosetting magnetically conductive objects that can be magnetically attracted, Alternatively, the magnetically attractable object 20 can also be a photocurable magnetic object with magnetism (as shown in Figures 1 and 2), or a photocurable magnetically permeable object that can be magnetically attracted (as shown in Figures 3 and 2). (Shown in Figure 4), the chip repairing device can arrange magnetically attractable objects 20A, 20B, 20C, 20D on the surface of the defective chip. Or the jet printing method belongs to the prior art, and will not be repeated here.

The step of curing the pair of magnetically attractable objects 20A, 20B, 20C, and 20D to form magnetically attractable markers 2A, 2B, 2C, and 2D is performed by the control system to cause the chip repair device to be positioned on the defective chip 12 The magnetically attractable objects 20A, 20B, 20C, and 20D on the surface are cured and fixed on the surface of the defective wafer 12 by heating or light (such as ultraviolet rays) or other means to form a solid magnetically attractable marker 2A, 2B, 2C, 2D, wherein the magnetically attractable markers 2A, 2B, 2C, 2D are formed by solidifying magnetically attractable objects 20A, 20B, 20C, 20D, and have original magnetic properties or can be magnetized Magnetism of attraction.

The step of de-soldering and removing the defective chip 12 is that the control system drives the magnetic work piece 30 in the chip repairing device to magnetically fix the chip according to the position of each defective chip 12 of the intermediate product 10 of the process. The magnetically attractable markers 2A, 2B, 2C, and 2D on the surface of the defective chip 12 are simultaneously heated to de-soldering between the defective chip 12 and the carrier 11, and the de-soldering defect is removed from the carrier 11 For the chip 12, the heating and unsoldering can be performed by the magnetic work piece preheated to a predetermined temperature through the magnetically attractable markers 2A, 2B, 2C, 2D to heat and unsold the defective chip 12, or the control system controls the external The heating mechanism heats and unsolders the defective wafer 12 marked at a predetermined position. Preferably, the magnetic work piece 30 magnetically fixes the magnetically attractable markers 2A, 2B on the surface of the defective wafer 12 in a non-contact manner. , 2C, 2D, the defective chip 12 is detached from the carrier 11 by magnetic attraction.

In the step of removing the defective chip 12 connected to the magnetic work piece 30, the control system causes the chip repair device to remove the unsoldering defective chip 12 that is magnetically attached to the end of the magnetic work piece 30. Preferably, it is to be moved. Desoldering defective chips 12 are collected in a predetermined collection position of the chip repairing device.

In the step of soldering the good chip 13, the control system causes the chip repairing device to solder the good chip 13 on the carrier 11 where the defective chip has been removed.

In the aforementioned chip repair method, the step of arranging the magnetically attractable objects 20A, 20B, 20C, 20D on the defective wafer 12 and curing the magnetically attractable objects 20A, 20B, 20C, 20D to form the magnetically attractable marker 2A The steps of, 2B, 2C, and 2D can be performed in at least the following ways.

First, as shown in FIG. 1, the step of disposing a magnetically attractable object 20A on the defective chip 12 is performed by a single-stage setting of a thermosetting magnetically attractable object 20A, which is performed by the control system according to the middle of the process For the position of each defective chip 12 of the product 10, the chip repairing device is controlled to place a liquid or paste-like thermosetting colloid pre-mixed with magnetic material or magnetic conductive material on the surface of the defective chip 12 to mix with magnetic material or A thermosetting colloid of a magnetic conductive material is used as the magnetically attractable object 20A. In the step of curing the magnetically attractable object 20A to form the magnetically attractable marker 2A, the control system causes the chip repairing device to cure and solidify the magnetically attractable object 20A provided on the surface of the defective wafer 12 by heating means. On the surface of the defective wafer 12, a solid magnetically attractable marker 2A is formed. The aforementioned magnetic materials, magnetic conductive materials and thermosetting colloids can be selected from existing materials, which will not be repeated here.

Second, as shown in FIG. 2, it is implemented in a two-stage setting of a thermosetting magnetically attractable object 20B. The control system controls the chip according to the position of each defective chip 12 of the intermediate product 10 of the process. The repairing device first places a paste-like or liquid-like magnetic or magnetic substrate 21 on the surface of the defective wafer 12, and then drops a thermosetting glue 22B on the surface of the defective wafer 12, and causes the The thermosetting glue 22B covers the magnetic or magnetic substrate 21 to form the magnetically attractable object 20B. In the foregoing, the viscosity of both the magnetic or magnetically conductive substrate 21 and the thermosetting glue 22B is controlled so that the thermosetting glue 22B can cover the magnetic or magnetically conductive substrate 21 and adhere to the surface of the defective chip 12. In the step of curing the magnetically attractable object 20B to form the magnetically attractable marker 2B, the control system causes the chip repair device to cure and solidify the magnetically attractable object 20 provided on the surface of the defective wafer 12 by heating means. On the surface of the defective wafer 12, a solid magnetically attractable marker 2B is formed. The aforementioned magnetic or magnetic substrate 21B and thermosetting glue 22B can be selected from existing materials, and the viscosity of the magnetic or magnetic substrate 21B and thermosetting glue 22B can be adjusted appropriately according to the selected materials, and will not be repeated here. .

In the foregoing, in the step of curing the magnetically attractable objects 20A, 20B to form the magnetically attractable markers 2A, 2B, when the magnetically attractable objects 20A, 20B are thermosetting colloids, the heating temperature depends on the magnetically attractable The material selected for the object is set. Basically, the heating temperature must be sufficient to solidify and set the magnetically attractable objects 20A, 20B, but less than the melting point temperature of the solder 14 soldered on the carrier 11 to make the intermediate product 10 in the process During the heating process of the chip, the state of the chip being welded and fixed on the carrier 11 is maintained. In this preferred embodiment, a heating temperature of 150°C to 280°C is applied, so that the magnetically attractable objects 20A and 20B provided on the surface of the defective wafer 12 are cured by heating to form a solid magnetically attractable marker 2A , 2B.

The third, as shown in FIG. 3, is performed in a single-stage setting of a photocurable magnetically attractable object 20C, which is executed by the control system according to the position of each defective chip 12 of the intermediate product 10 of the process. The control chip repairing device sets a liquid or paste-like light-curing gel pre-mixed with magnetic materials or magnetic materials on the surface of the defective chip 12, and uses the light-curing gel mixed with magnetic materials or magnetic materials as the magnetically attractable material.性物20C. In the step of curing the magnetically attractable object 20C to form the magnetically attractable marker 2C, the control system causes the chip repairing device to cure the magnetically attractable object 20C provided on the surface of the defective wafer 12 by irradiating ultraviolet rays. It is fixed on the surface of the defective wafer 12 to form a solid magnetically attractable marker 2C. The aforementioned magnetic materials, magnetic conductive materials, and photocurable colloids can be selected from existing materials, which will not be repeated here.

Fourth, as shown in FIG. 4, it is performed in a two-stage setting of a light-cured magnetically attractable object 20D, which is controlled by the control system according to the position of each defective chip 12 of the intermediate product 10 of the process The chip repairing device first places a paste-like or liquid-like magnetic or magnetic substrate 21 on the surface of the defective wafer 12, and then drops a photocurable glue 22D on the surface of the defective wafer 12, and The photocurable glue 22D is made to cover the magnetic or magnetic substrate 21 to form the magnetically attractable object 20D. In the foregoing, the viscosity of the magnetic or magnetic substrate 21 and the photocurable glue 22D is controlled so that the photocurable glue 22D can cover the magnetic or magnetic substrate 21 and adhere to the defective chip 12 s surface. In the step of curing the magnetically attractable object 20D to form the magnetically attractable marker 2D, the control system causes the chip repair device to cure the magnetically attractable object 20D provided on the surface of the defective wafer 12 by irradiating ultraviolet rays. It is fixed on the surface of the defective wafer 12 to form a solid magnetically attractable marker 2D. The aforementioned magnetic or magnetic substrate 21 and photocurable glue 22D can be selected from existing materials, and the viscosity of the magnetic or magnetic substrate 21 and photocurable glue 22D can be adjusted appropriately according to the selected materials. This will not be repeated here.

In the aforementioned chip repair method, the step of removing the defective chip 12 connected to the magnetic work piece 30 is to shake off the defect of the magnetic work piece 30 with the magnetically attractable marker 20A by the chip repairing device using ultrasonic vibration means. The chip 12, or other mechanical means to remove the magnetic work piece, the magnetic chuck is provided with a magnetically attractable marker. When the magnetic work piece 30 magnetically fixes the magnetically attractable markers 2A, 2B, 2C, 2D on the surface of the defective wafer 12 in a non-contact manner, it helps to remove the defect of the connection of the magnetic work piece 30 The step of wafer 12 is carried out.

In the aforementioned chip repair method, the step of removing the defective chip 12 by de-soldering is to heat the magnetic work piece 30 to 280°C~400°C by a controlled chip repair device, and conduct heat to it through the defective chip 12 The solder 14 on the bottom surface is desoldered.

In the aforementioned chip repair method, the step of soldering the good chip 13 is to use a controlled chip repair device to pick up the good chip 13 and move the good chip 13 on the carrier 11 to remove the soldering defects. For the position of the chip, the good chip 13 is continuously applied with appropriate pressure and heated to 280°C~350°C, and then the temperature is lowered to below 250°C, so that the good chip 13 is soldered on the carrier 11.

It can be seen from the description of the preferred embodiment of the aforementioned chip repair method that when the chip repair method is applied to the semiconductor device manufacturing process, the repair operation of the defective wafer of the carrier of the intermediate product of the inspection after the process is performed, The chip repairing method of the present invention uses a magnetically attractable marker on the surface of a defective wafer, and uses a magnetic work piece to magnetically attract a defective wafer with a magnetically attractable marker, and at the same time, it can directly heat a specific defective wafer through the magnetic work piece. Desoldering and removing defective chips from the carrier increase the ease of operation; on the other hand, by removing the defective chips from the carrier after the magnetic work piece is magnetically absorbed, it can use the magnetic work piece relative to the carrier. After unsoldering, the defective chips are easily separated from the magnetic connection relationship, so that the subsequent magnetic work pieces can remove the connected defective chips, and then perform the unsoldering removal operation of the next defective chip. Therefore, the present invention can provide a very valuable chip repair method in the semiconductor device manufacturing process.

10: Process intermediate products 11: Carrier 12: Defective chip 13: good chip 14: Solder 20A: Magnetically attractable objects 20B: Magnetically attractable objects 20C: Magnetically attractable objects 20D: Magnetically attractable objects 21: Magnetic or permeable substrate 22B: Thermosetting glue 22D: Light-curing glue 2A: Magnetically attractable label 2B: Magnetically attractable label 2C: Magnetically attractable label 2D: Magnetically attractable marker 30: Magnetic work piece

FIG. 1 is a schematic flowchart of the first preferred embodiment of the chip repair method of the present invention. FIG. 2 is a schematic flowchart of a second preferred embodiment of the chip repair method of the present invention. FIG. 3 is a schematic flowchart of a third preferred embodiment of the chip repair method of the present invention. 4 is a schematic flowchart of a fourth preferred embodiment of the chip repair method of the present invention.

10: Process intermediate products

11: Carrier

12: Defective chip

13: good chip

14: Solder

20B: Magnetically attractable objects

21: Magnetic or permeable substrate

22B: Thermosetting glue

2B: Magnetically attractable label

30: Magnetic work piece

Claims (8)

A method for repairing a chip, which uses a chip repairing device controlled by a control system to perform the repairing operation of the defective chip of the intermediate product of the process by de-soldering and removing the defective chip from the carrier and welding and replacing the good chip. The chip repairing method includes: inputting the repaired chip The process intermediate product step is to transport the process intermediate product with defective wafers to the wafer repairing device, and input the position data of each defective wafer on the carrier of the process intermediate product to the control system; set the defective wafer In the step of magnetically attractable objects, the control system controls the chip repair device to install a magnetically attractable object on the surface of each defective chip according to the position of each defective chip of the intermediate product of the process The step of curing a magnetically attractable object to form a magnetically attractable marker, which is caused by the control system to cause the chip repair device to solidify the magnetically attractable object provided on the surface of the defective chip to form a fixation on the Magnetically attractable markers on the surface of defective chips; the step of unsoldering and removing defective chips is driven by the control system according to the position of each defective chip in the intermediate product of the process to drive one of the chip repairing devices A magnetic work piece magnetically fixes the magnetically attractable marker on the surface of the defective chip, heats the defective chip and the carrier, and removes the unsoldered defective chip from the carrier; The step of removing the defective chip connected to the magnetic work piece is that the control system causes the chip repair device to remove the defective chip that is magnetically attached to the end of the magnetic work piece; and the step of soldering a good chip is performed by the The control system makes the chip repairing device solder a good chip on the carrier where the defective chip has been removed. The chip repair method according to claim 1, wherein, in the step of arranging a magnetically attractable object on the defective chip, the chip repair device mixes a liquid or paste with a magnetic material or a magnetic material in advance The thermosetting colloid is arranged on the surface of the defective chip to be mixed with magnetic material Or a thermosetting colloid of a magnetically conductive material is the magnetically attractable object; in the step of curing the magnetically attractable object to form a magnetically attractable marker, the magnetically attractable object provided on the surface of the defective chip is heated It is cured to form a magnetically attractable marker fixed on the surface of the defective wafer. The chip repair method according to claim 1, wherein, in the step of arranging a magnetically attractable object on the defective chip, the chip repair device first removes a paste-like or liquid-like magnetic or magnetic substrate It is arranged on the surface of the defective wafer, and then a thermosetting glue drop is attached to the surface of the defective wafer, and the magnetic or magnetic substrate is covered to form the magnetically attractable object; In the step of curing the object to form a magnetically attractable marking body, the magnetically attractable object provided on the surface of the defective chip is heated and solidified to form a magnetically attractable marking body fixed on the surface of the defective chip. The chip repair method according to claim 1, wherein, in the step of arranging a magnetically attractable object on the defective chip, the chip repair device mixes a liquid or paste with a magnetic material or a magnetic material in advance The photo-curable colloid is arranged on the surface of the defective chip, and the photo-curable colloid mixed with magnetic material or magnetic conductive material is used as the magnetically attractable object; the magnetically attractable object is cured to form a magnetically attractable mark In the step of forming, ultraviolet light is irradiated to the magnetically attractable object provided on the surface of the defective wafer to be cured to form a magnetically attractable marker fixed on the surface of the defective wafer. The chip repair method according to claim 1, wherein, in the step of arranging a magnetically attractable object on the defective chip, the chip repair device first removes a paste-like or liquid-like magnetic or magnetic substrate It is arranged on the surface of the defective chip, and then a photocurable glue is dropped on the surface of the defective chip, and the magnetic or magnetic substrate is covered to form the magnetically attractable object; In the step of curing the absorbent object to form a magnetically attractable marking body, the magnetically attractable object provided on the surface of the defective wafer is irradiated with ultraviolet rays to be cured to form a magnetically attractable marking fixed on the surface of the defective wafer body. The chip repair method according to any one of claims 1 to 5, wherein the step of removing the defective chip connected to the magnetic work piece is performed by the chip repair device using ultrasonic vibration to shake off the magnetic work piece. Defective wafer with magnetically attractable marker. The chip repair method according to any one of claims 1 to 5, wherein the step of removing the defective chip by desoldering is to pass the magnetic work piece preheated to a predetermined temperature through the magnetically attractable marker The defective wafer is heated and desoldered. The chip repairing method according to any one of claims 1 to 5, wherein the step of removing the defective chip by desoldering is by the control system to control an external heating mechanism to heat and desolder the defective chip.

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