TWI744016B - LED luminous source device and manufacturing method thereof - Google Patents

Abstract

An LED light-emitting source device includes: a first substrate, which is transparent and has a first bonding surface; The connecting portion is connected to the first bonding surface of the first substrate, and the outer connecting portion of each pin is exposed outside the first bonding surface; at least one control chip is fixed on the first bonding surface of the first substrate A bonding surface; at least one LED chip is fixed on the first bonding surface of the first substrate; at least one conductive wire is fixed on the first bonding surface of the first substrate, and is connected with The internal connections of the control chip, LED chip and pins are connected to conduct the electrical properties of the control chip, LED chip and pins; a second substrate is transparent and has a second bonding surface. The bonding surface is bonded and connected to the first bonding surface of the first substrate, so that the conductive wires, the control chip, the LED chip, and the internal connections of the pins are covered on the first bonding surface of the first substrate Between the second bonding surface and the second substrate; thereby achieving the effect of full-circle luminescence.

Description

LED luminous source device and manufacturing method thereof

This creation is related to LED light-emitting products, and more specifically refers to an LED light-emitting source device and its manufacturing method.

According to, in general, the current traditional LED packaging is mainly packaged by PCB Layout. The size and shape of the substrate are fixed when the mold is formed. Not only does each type of substrate need to develop a set of molds, which incurs manufacturing costs. It has greatly increased, and the shape of its wiring cannot be changed, and there are problems such as high manufacturing cost, poor versatility of fixed size and shape.

In addition, if the current LED light source is to achieve various patterns and fonts, it is assembled using patch components, but these patch components are all single-sided light, so the luminous effect is not very satisfactory.

In view of this, in order to improve the prior art, the conventional LED package has problems such as high manufacturing cost, poor versatility of fixed size and shape, and unsatisfactory light-emitting effect. For this reason, this creation provides an LED light-emitting source device, which includes: a first substrate that is transparent and has a first bonding surface; at least two pins, each of which has an internal connection part and an external connection part , The inner connecting portion of each pin is connected to the first bonding surface of the first substrate, and the outer connecting portion of each pin is exposed outside the first bonding surface; at least one control chip is fixedly installed On the first bonding surface of the first substrate; at least one LED chip is fixed on the first bonding surface of the first substrate; at least one conductive wire is fixed on the first bonding surface of the first substrate The bonding surface is connected to the control chip, the LED chip and the inner connecting part of the pin to conduct the electrical properties of the control chip, the LED chip and the pin; a second substrate is transparent and has a second substrate The bonding surface, the second bonding surface is bonded and connected to the first bonding surface of the first substrate to connect the conductive wire, control chip, LED chip and pins The inner connecting portion is wrapped between the first bonding surface of the first substrate and the second bonding surface of the second substrate, so as to achieve the effect of full-circle luminescence.

This creation further provides a method for manufacturing an LED light-emitting source device, which includes the following steps: step A, preparing a pin material: the pin material has at least two pins; step B, preparing a first substrate: the pin The blank is placed on a first mold, the first mold has at least one first mold cavity, and glue is injected into the first mold. After the glue is cooled and solidified, a transparent first substrate is obtained, and An internal connection portion located at one end of each pin is connected to a first bonding surface of the first substrate, and the portion where each pin is not connected to the first substrate is an external portion; step C, fixing Chip and wire bonding: fix at least one control chip, at least one LED chip and at least one conductive wire on the first bonding surface of the first substrate so that the conductive wire is within the control chip, LED chip and pins The connecting parts are connected to each other to conduct electricity; step D, bonding the second substrate: placing the first substrate together with the pin material on a second mold, the second mold having at least one second cavity, The first bonding surface of the first substrate faces the second mold cavity, and glue is injected into the second mold. After the glue is cooled and solidified, a light-transmitting second substrate is obtained, making one of the second substrates The second bonding surface is bonded and connected to the first bonding surface of the first substrate, and the inner connecting portion of the pin, the control chip, the LED chip and the conductive wire are covered on the first bonding surface of the first substrate Between the bonding surface and the second bonding surface of the second substrate; step E, cutting the desired shape: cutting the first substrate and the second substrate to the desired shape, so that the first substrate and the second substrate outside the predetermined shape The parts of the substrate and the pin material are cut off to obtain a finished product of the LED light-emitting source device; thereby achieving the effects of reducing manufacturing costs, better versatility, facilitating mass production, and significant light-emitting effects.

100: LED light source device

10: pin material

11: Material frame

12: Pin

121: Internal part

122: External part

20: The first substrate

21: The first bonding surface

30: The first mold

31: The first cavity

41: control chip

42: LED chip

43: conductive thread

44: conductive sheet

50: The second mold

51: second cavity

60: second substrate

61: The second bonding surface

91: Glue

The first to seventh figures are schematic diagrams of the manufacturing process of the manufacturing method of the LED light-emitting source device provided by this creation.

The eighth figure is a three-dimensional view of a preferred embodiment of this creation.

Figure 9 is a cross-sectional view of the embodiment shown in Figure 8.

The tenth picture is a schematic diagram of another real state of this creation.

The eleventh figure is a block diagram of the manufacturing process of the first embodiment of this creation.

The twelfth figure is a schematic diagram of another implementation aspect of this creation.

Figure 13 is a block diagram of the manufacturing process of the second embodiment of this creation.

Figure 14 is a block diagram of the manufacturing process of the third embodiment of this creation.

The fifteenth drawing is a partial structural drawing of another implementation aspect of this creation.

The sixteenth figure is a schematic diagram of the partial assembly of another embodiment of this creation.

In order to enable your reviewer to have a better understanding and recognition of the features and characteristics of this creation, the following examples are listed with the accompanying illustrations as follows: Please refer to the first to eleventh pictures, which is the first comparison of this creation The manufacturing method of the LED light source device 100 provided by the preferred embodiment includes the following steps: Step A, preparing the pin material 10: Please refer to the first and eleventh figures, and take at least one pin material 10 , The pin material 10 can be manufactured by itself or purchased from a supplier. The pin material 10 is made of silver-plated copper or silver-plated iron. The pin material 10 has a material frame 11 and at least two pins 12 extending from the inner side of the material frame 11.

Step B. Preparation of the first substrate 20: Please refer to the second, third, fourth and eleventh figures, take a first mold 30, the first mold 30 has at least one first cavity 31, the pin material The sheet 10 is placed on the first mold 30 with one end of the two pins 12 corresponding to the first mold cavity 31 (as shown in the second figure), and then glue is injected into the first mold cavity 31 91 (as shown in the third figure), the glue injection temperature is 100-160 degrees C, and the time is 3-15 minutes. The glue 91 can be epoxy resin (such as bisphenol A epoxy resin, bisphenol F ring Oxygen resin, novolac epoxy resin, tetrabromobisphenol epoxy resin, rubber modified epoxy resin, cycloaliphatic epoxy resin, aliphatic epoxy resin, or one of their mixtures and any combination thereof), silicone , Ceramics, aluminum oxide and other materials. Waiting to glue 91 in the first After the mold cavity 31 is cooled and solidified, a transparent first substrate 20 is obtained. At this time, at least two pins 12 on the pin blank 10 are bonded to the first substrate 20 with one end thereof. The surface 21 is connected, that is, the part where the pin 12 is connected to the first substrate 20 is an internal connection part 121, and the part that extends outside the first substrate 20 and is not connected to the first substrate 20 is an external part 122 (As shown in the fourth figure).

Step C. Fix the chip and wire bonding: Please refer to the fifth, sixth and eleventh figures, move the pin material 10 together with the first substrate 20 from the first mold 30 to a worktable, and put at least A control chip 41 and at least one LED chip 42 are fixed on the first bonding surface 21 of the first substrate 20 (as shown in the fifth figure), and conductive wires 43 are laid on the first substrate 20 through wire bonding technology. On the first bonding surface 21, the conductive wire 43 connects the control chip 41, the LED chip 42 and the inner connecting portion 121 of the pin 12 (as shown in the sixth figure), so that the control chip 41, LED The chip 42 and the pins 12 are electrically connected to each other by the conductive wire 43.

Step D, bonding the second substrate 60: referring to the seventh and eleventh figures, take a second mold 50, the second mold 50 has at least one second cavity 51, the first substrate 20 together with the connection The blank piece 10 is placed on the second mold 50, and the first bonding surface 21 of the first substrate 20 faces the second mold cavity 51, and then glue 91 (such as As shown in Figure 7), the glue injection temperature is also 100 to 160 degrees C, and the time is 3 to 15 minutes. The material of the glue 91 is the same as that of the first substrate 20. After the glue 91 is cooled and solidified in the second mold cavity 51, a light-transmitting second substrate 60 is obtained, and the second bonding surface 61 of the second substrate 60 is the first bonding surface of the first substrate 20 21 is bonded and connected, and the internal connection 121 of the pin 12, the control chip 41, the LED chip 42, and the conductive wire 43 are all covered on the first bonding surface 21 of the first substrate 20 and the second bonding surface 21 and the second Between the second bonding surfaces 61 of the substrate 60.

Step E. Cut the desired shape: referring to the eighth and eleventh figures, cut the first substrate 20 and the second substrate 60 to the desired shape, that is, the first substrate 20 and the second substrate 60 outside the predetermined shape , The part of the pin material 10 is cut off to obtain the finished product of the LED light-emitting source device 100 of the present invention.

Therefore, the above is an introduction to the manufacturing method of the LED light-emitting source device 100 provided in the first preferred embodiment of this creation, and then the characteristics of this creation are introduced as follows: First, after the steps of the above-mentioned manufacturing method, the book Create the structure of the LED light-emitting source device 100, as shown in the eighth and ninth figures. The structure includes a first substrate 20, a second substrate 60, at least two pins 12, at least one control chip 41, and at least one LED chip 42 And at least one conductive wire 43. The first substrate 20 has a first bonding surface 21, the second substrate 60 has a second bonding surface 61, and the two pins 12 respectively have an inner connecting portion 121 and an outer connecting portion 122. The inner connecting portion 121 is connected to the first bonding surface 21 of the first substrate 20, the external part 122 is exposed outside the first substrate 20, and the control chip 41, the LED chip 42 and the conductive wire 43 are fixed on the first substrate 20. On the first bonding surface 21 of a substrate 20, the conductive wire 43 is connected to the control chip 41, the LED chip 42 and the inner connecting portion 121 of the pin 12 to be electrically conductive. The second substrate 60 is electrically conductive. The bonding surface 61 is bonded and connected to the first bonding surface 21 of the first substrate 20, that is, the conductive wire 43, the control chip 41, the LED chip 42, and the internal connection portion 121 of the pin 12 are covered with Between the first bonding surface 21 of the first substrate 20 and the second bonding surface 61 of the second substrate 60.

In this way, the first substrate 20 and the second substrate 60 are both light-transmissive, so this creation can achieve the effect of all-round luminescence. Under the same energy (electricity) consumption, this creation can achieve the two original technologies. More than double the brightness, greatly improving the utilization rate of energy and meeting people's demand for high-brightness LED light source.

In addition, in this creation, after the first substrate and the second substrate are formed, the external shape is cut. There is no need to prepare molds of various shapes, which can reduce mold opening costs, reduce manufacturing costs, and make mass production more efficient. , The production line is more flexible and adaptable.

Secondly, in the above-mentioned embodiment, in step C, the step of fixing the chip and wire bonding, a number of conductive sheets 44 can be fixed on the first bonding surface 21 of the first substrate, and the conductive wires 43 can be connected to the Wait for the conductive sheet 44 (as shown in the tenth figure) to prevent the conductive wire 43 from being broken.

In the above embodiment, in step C, although the control chip 41 and the LED chip 42 (and the conductive sheet 44) are fixed first, then the conductive wire 43 is applied. However, in fact, in step C, the conductive wire 43 can be printed first, and then the control chip 41, the LED chip 42 (and the conductive sheet 44) can be fixed, and the same effect can still be achieved.

In the above-mentioned embodiment, phosphor can also be added to the raw material (glue 91) of the first substrate 20 and the second substrate 60. The phosphor can be YAG phosphor, TAG phosphor, or aluminate. Any one of Aluminate, Silicatr, Nitride and Oxynitride and any combination thereof.

In the above embodiment, a light diffusing agent can also be added to the raw materials (glue 91) of the first substrate 20 and the second substrate 60. The light diffusing agent can be nano barium sulfate, calcium carbonate, silicon dioxide, pressure Acrylic type light diffusing agent, styrene type, acrylic resin type light diffusing agent, etc. In order to achieve the effect of light softening and fogging.

In the above embodiment, when mass production is performed, the first mold and the second mold are different molds to improve the efficiency of the production line. In the case of low-volume production, the first mold and the second mold can be the same mold to reduce mold costs.

Please refer to the twelfth picture. In fact, this creation can be cut into different shapes according to the actual needs of different customers to make the scope of application more extensive.

In addition, although in the foregoing implementation, most of the pins 12 of the pin material 10 are protruding from the inner sides of the two of the frame 11. However, in fact, as shown in the fifteenth figure, the pins 12 can also only protrude from the same inner side of the material frame 11. This not only reduces the manufacturing cost, but also allows the control chip 41, the LED chip 42 and the conductive Line 43 has more space for laying (as shown in Figure 16).

Please refer to Figure 13, which is a method for manufacturing an LED light-emitting source device provided by the second preferred embodiment of the present creation. The steps include the following: Step A. Preparation of the pin material: Please refer to Figure 13, take At least one pin material, the pin material has a material frame and at least two pins protruding from the inner side of the material frame, and each pin has an inner connecting portion and an outer connecting portion.

Step B. Wiring: Please refer to Figure 13 to electrically connect at least one conductive wire with each internal connection portion of the two pins, and arrange solder pads at predetermined positions of the conductive wire.

Step C. Preparation of the first substrate: Please refer to Figure 13 and take a first mold with at least one first mold cavity. Place the pin blank on the first mold and let the two The inner connecting part of the pin corresponds to the first mold cavity, and then glue is injected into the first mold cavity. After the glue is cooled and solidified in the first mold cavity, a transparent first substrate is obtained, and at this time, the inner connecting portion of the two pin blanks and the conductive wire are the first bonding surface of the first substrate link.

Step D. Fixing the chip: Please refer to Figure 13, move the pin material, the conductive wire and the first substrate from the first mold to a workbench, and fix at least one control chip and at least one LED chip On the bonding pad of the conductive wire, the control chip and the LED chip are located on the first bonding surface of the first substrate, and are electrically connected to the conductive wire and the pins.

Step E. Laminating the second substrate: Please refer to Figure 13 and take a second mold with at least one second mold cavity. Place the first substrate and the pin blank on the second mold. On the mold, and make the first bonding surface of the first substrate face the second mold cavity, and then inject glue into the second mold cavity. After the glue is cooled and solidified in the second mold cavity, a transparent second substrate is obtained, and the second bonding surface of the second substrate is bonded and connected to the first bonding surface of the first substrate, and the The internal connection part of the pin, the control chip, the LED chip and the conductive wire are all covered between the first bonding surface of the first substrate and the second bonding surface of the second substrate.

Step F. Cut the desired shape: Please refer to the thirteenth figure, the first substrate and the second substrate are cut out to the desired shape, that is, the parts of the first substrate, the second substrate, and the pin material outside the predetermined shape are cut off, and the LED of this creation is obtained. Finished product of luminous source device

Although the steps in this embodiment are not the same as the steps in the previous embodiments, they can achieve the same effect and obtain the same finished product.

Please refer to Figure 14, which is a method for manufacturing an LED light-emitting source device provided by the third preferred embodiment of the present creation. The steps include the following: Step A. Preparation of the pin material: Please refer to Figure 14. At least one pin material, the pin material has a material frame and at least two pins protruding from the inner side of the material frame, and each pin has an inner connecting portion and an outer connecting portion.

Step B. Wiring and fixing the chip: Please refer to Figure 14 to electrically connect at least one conductive wire to each internal connection part of the two pins, and arrange a bonding pad at the predetermined position of the conductive wire, and At least one control chip and at least one LED chip are fixed on the bonding pad of the conductive wire, so that the control chip, the LED chip, and the conductive wire and pins are electrically connected.

Step C. Prepare the first substrate: Please refer to Figure 14, take a first mold, the first mold has at least one first mold cavity, place the pin blank on the first mold, and let the The inner connecting part of the two pins is corresponding to the first mold cavity, and then glue is injected into the first mold. After the glue is cooled and solidified in the first mold cavity, a transparent first substrate is obtained, and at this time, the inner connecting portion and the conductive wire of the two pin blanks are connected with the first bonding surface of the first substrate .

Step D. Laminating the second substrate: Please refer to the fourteenth figure, take a second mold, the second mold has at least one second cavity, and place the first substrate together with the pin blank on the second On the mold, and make the first bonding surface of the first substrate face the second mold cavity, and then inject glue into the second mold. After the glue is cooled and solidified in the second mold cavity, a light-transmitting second substrate is obtained, and the second bonding surface of the second substrate is bonded to the first bonding of the first substrate Surface bonding connection, and the internal connection part of the pin, control chip, LED chip and conductive wire are all covered on the first bonding surface of the first substrate and the second bonding surface of the second substrate between.

Step E. Cut the desired shape: Please refer to Figure 14 to cut the first substrate and the second substrate to the desired shape, that is, the positions of the first substrate, the second substrate, and the pin material outside the predetermined shape Cut it out to get the finished product of this creative LED light-emitting source device.

Although the steps in this embodiment are not the same as the steps in the previous embodiments, they can achieve the same effect and obtain the same finished product.

In addition, although the steps in the disclosed embodiments are not completely the same, the LED chips in each embodiment can be set in such a way that the light-emitting directions all face the same direction or the light-emitting directions face different directions. The luminous effect is more comprehensive.

The above disclosures are only the preferred embodiments provided by this creation, and are not intended to limit the scope of implementation of this creation. All relevant artisans in the technical field should make equal changes based on this creation and should belong to this creation. The scope of coverage.

100: LED light source device

12: Pin

121: Internal part

122: External part

20: The first substrate

21: The first bonding surface

41: control chip

42: LED chip

43: conductive thread

60: second substrate

61: The second bonding surface

Claims (11)

A method for manufacturing an LED light source device includes the following steps: step A, preparing a pin material: the pin material has at least two pins; step B, preparing a first substrate: placing the pin material on On a first mold, the first mold has at least one first mold cavity. Glue is injected into the first mold. After the glue is cooled and solidified, a light-transmitting first substrate is obtained. An inner connecting portion of one end of the pin is connected to a first bonding surface of the first substrate, and the portion where each pin is not connected to the first substrate is an outer portion; step C, fixing the chip and bonding wire : Fixing at least one control chip, at least one LED chip and at least one conductive wire on the first bonding surface of the first substrate, so that the conductive wire is connected to the control chip, the LED chip and the inner connecting portion of the pin, By virtue of mutual electrical conductivity; step D, bonding the second substrate: placing the first substrate together with the pin material on a second mold, the second mold having at least one second cavity, and the first substrate The first bonding surface faces the second mold cavity, and the glue is injected into the second mold. After the glue is cooled and solidified, a light-transmitting second substrate is obtained, so that one of the second substrates is second bonded The surface is bonded and connected to the first bonding surface of the first substrate, and the inner connecting portion of the pin, the control chip, the LED chip and the conductive wire are covered on the first bonding surface of the first substrate and the Between the second bonding surfaces of the second substrate; step E, cutting the desired shape: cutting the first substrate and the second substrate to the desired shape, so that the first substrate, the second substrate, and the The parts of the scrap pieces are cut off to obtain a finished LED light source device. According to the manufacturing method of the LED light-emitting source device of claim 1, in step A, the pin material is made of any one of copper-plated silver or iron-silvered material, and the pin material further has A material frame, and the two pins protrude from the inner side of the material frame. According to the manufacturing method of the LED light-emitting source device of claim 1, in step B and step D, the glue can be any one of epoxy resin, silicon glue, ceramic, and aluminum oxide. The method for manufacturing an LED light source device according to claim 3, wherein the epoxy resin can be a bisphenol A epoxy resin, a bisphenol F epoxy resin, a novolac epoxy resin, or a tetrabromobisphenol epoxy resin. Any one or any combination of resin, rubber-modified epoxy resin, cyclic epoxy resin, and aliphatic epoxy resin. According to the manufacturing method of the LED light-emitting source device of claim 1, in step C, at least one conductive sheet is fixed on the first bonding surface of the first substrate, and the conductive wire is connected to the conductive sheet. According to the manufacturing method of the LED light-emitting source device of claim 1, in step B and step D, the glue contains phosphor. According to the manufacturing method of the LED light-emitting source device of claim 1, in step B and step D, the glue contains a light diffusing agent. An LED light-emitting source device includes: a first substrate, which is transparent and has a first bonding surface; The connecting portion is connected to the first bonding surface of the first substrate, and the outer connecting portion of each pin is exposed outside the first bonding surface; at least one control chip is fixed on the first bonding surface of the first substrate A bonding surface; at least one LED chip is fixed on the first bonding surface of the first substrate; at least one conductive wire is fixed on the first bonding surface of the first substrate, and is connected with The internal connections of the control chip, LED chip and pins are connected to conduct the electrical properties of the control chip, LED chip and pins; A second substrate is light-transmissive and has a second bonding surface, and the second bonding surface is bonded and connected to the first bonding surface of the first substrate for the conductive wire, control chip, and LED chip And the inner connecting portion of the pin is wrapped between the first bonding surface of the first substrate and the second bonding surface of the second substrate. The LED light-emitting source device according to claim 8, further comprising at least one conductive sheet, the conductive sheet is fixed on the first bonding surface of the first substrate and connected with the conductive wire. A method for manufacturing an LED light source device includes the following steps: step A, preparing a pin material: the pin material has at least two pins, and each pin has an internal connection part and an external connection part; step B , Wiring: electrically connect at least one conductive wire with each internal connection part of the two pins, and arrange a number of solder pads at predetermined positions of the conductive wire; step C, preparing the first substrate: the pin material The sheet is placed on a first mold, the first mold has at least one first mold cavity, and glue is injected into the first mold cavity. After the glue cools and solidifies, a transparent first substrate is obtained, and this When the inner connecting portion of the two-pin material and the conductive wire are connected with a first bonding surface of the first substrate; step D, fixing the chip: fixing at least one control chip and at least one LED chip on the conductive On the bonding pad of the wire, so that the control chip and the LED chip are located on the first bonding surface of the first substrate, and are electrically connected to the conductive wires and pins; step E, bonding the second substrate: A substrate and the pin material are placed on a second mold. The second mold has at least one second mold cavity. The first bonding surface of the first substrate faces the second mold cavity and faces the second mold cavity. Glue is injected into the two mold cavities. After the glue is cooled and solidified, a light-transmitting second substrate is obtained. A second bonding surface of the second substrate is bonded and connected to the first bonding surface of the first substrate , And make the internal connection part of the pin, the control chip, The LED chip and the conductive wire are both wrapped between the first bonding surface of the first substrate and the second bonding surface of the second substrate; step F, cutting the desired shape: the first substrate and the second substrate Cut out the desired shape, so that the parts of the first substrate, the second substrate, and the pin material outside the predetermined shape are cut off to obtain a finished LED light-emitting source device. A method for manufacturing an LED light source device includes the following steps: step A, preparing a pin material: the pin material has at least two pins, and each pin has an internal connection part and an external connection part; step B , Wiring and fixed chip: at least one conductive wire is electrically connected to each internal connection part of the two pins, and a number of bonding pads are arranged at the predetermined position of the conductive wire to connect at least one control chip and at least one LED chip Fixed on the bonding pad of the conductive wire, so that the control chip, the LED chip, the conductive wire and the pins are electrically connected; step C, preparing the first substrate: placing the pin material on a first mold, The first mold has at least one first mold cavity. Glue is injected into the first mold cavity. After the glue cools and solidifies, a light-transmitting first substrate is obtained. The connecting portion and the conductive wire are connected to a first bonding surface of the first substrate; step D, bonding the second substrate: placing the first substrate together with the pin material on a second mold, the first The two molds have at least one second mold cavity, and the first bonding surface of the first substrate faces the second mold cavity, and the glue is injected into the second mold cavity. After the glue cools and solidifies, it becomes transparent. The second substrate of light, one of the second bonding surfaces of the second substrate is bonded and connected with the first bonding surface of the first substrate, and the internal connection part of the pin, the control chip, the LED chip and the conductive The wires are covered between the first bonding surface of the first substrate and the second bonding surface of the second substrate; step E, cutting to a desired shape: The first substrate and the second substrate are cut to the desired shape, and the parts of the first substrate, the second substrate, and the pin material outside the predetermined shape are cut off to obtain a finished LED light-emitting source device.

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