[go: up one dir, main page]

TWI743529B - Pick and place alignment apparatus and method thereof - Google Patents

Pick and place alignment apparatus and method thereof Download PDF

Info

Publication number
TWI743529B
TWI743529B TW108128715A TW108128715A TWI743529B TW I743529 B TWI743529 B TW I743529B TW 108128715 A TW108128715 A TW 108128715A TW 108128715 A TW108128715 A TW 108128715A TW I743529 B TWI743529 B TW I743529B
Authority
TW
Taiwan
Prior art keywords
carrier
pick
unit
place
light source
Prior art date
Application number
TW108128715A
Other languages
Chinese (zh)
Other versions
TW202107605A (en
Inventor
黃良印
語尚 林
Original Assignee
均華精密工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 均華精密工業股份有限公司 filed Critical 均華精密工業股份有限公司
Priority to TW108128715A priority Critical patent/TWI743529B/en
Publication of TW202107605A publication Critical patent/TW202107605A/en
Application granted granted Critical
Publication of TWI743529B publication Critical patent/TWI743529B/en

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A pick and place alignment apparatus comprises: a visual image capture module; a pick and place module disposed below the visual image capture module; a carrier disposed below the pick and place module; and a light source module disposed below the carrier; wherein, the light source module illuminates the carrier from bottom to top, the visual image capturing module sees through the pick and place unit to capture image information of the carrier to achieve the effect of accurate alignment and facilitate the subsequent process.

Description

取放對位裝置及其方法Pick-and-place alignment device and method

一種取放對位裝置及其方法,尤指一種能夠將亮光由下往上照射位於上方之載具,而使一影像擷取模組能夠清晰地擷取載具之影像資訊,藉此達到精準地對位效果。A pick-and-place alignment device and method, especially a vehicle that can irradiate bright light from bottom to top, so that an image capture module can clearly capture the image information of the vehicle, thereby achieving accuracy Ground counterpoint effect.

現有的晶粒吸取的實施方式為一光源模組係設於相鄰一視覺影像擷取模組或設於視覺影像擷取模組的下方;光源模組係將一亮光照射至一晶粒承載盤,以使位於晶粒承載盤之晶粒產生反射光,視覺影像擷取模組擷取反射光或晶粒之影像資訊;影像資訊係傳送給一取放裝置,以使取放裝置由晶粒承載盤取出一晶粒,再將晶粒放置於另一位置,以進行下一製程。The existing implementation of die absorption is that a light source module is arranged at an adjacent visual image capturing module or under the visual image capturing module; the light source module irradiates a bright light onto a die carrier Disk, so that the die located on the die carrier plate generates reflected light, the visual image capture module captures the reflected light or the image information of the die; the image information is sent to a pick-and-place device so that the pick-and-place device is A die is taken out from the die-carrying tray, and then the die is placed in another position for the next process.

雖上述之晶粒取放方式係為各廠商所使用,但仍存有數個問題。第一,若取放模組移動至欲吸取的晶粒上方時,取放模組會擋住視覺影像擷取模組的視野,而使視覺影像擷取模組無法有效地擷取晶粒之影像資訊,其係可能造成取放模組無法精準對位晶粒之位置,進而造成於後續製程中因對位缺失所造成的製程缺陷。第二,現有的光源模組皆由上方將亮光投射至位於下方的晶粒,故視覺影像擷取模組所擷取的影像資訊可能為模糊的,而使取放模組無法有效地對位晶粒之位置。Although the above-mentioned die pick-and-place method is used by various manufacturers, there are still several problems. First, if the pick-and-place module moves over the die to be sucked, the pick-and-place module will block the view of the visual image capturing module, making the visual image capturing module unable to effectively capture the image of the die Information, it may cause the pick-and-place module to be unable to accurately align the position of the die, thereby causing process defects due to lack of alignment in the subsequent manufacturing process. Second, the existing light source modules all project bright light from the top to the die located below, so the image information captured by the visual image capture module may be blurred, making the pick-and-place module unable to effectively align. The location of the crystal grains.

除了上述之晶粒外,更包含有覆晶基板、IC基板、LED散熱基板、LED藍寶石基板、玻璃基板、陶瓷基板、銅箔基板或晶圓(Wafer),而目前業界係通稱前述之元件為基板。故現有的基板皆有被上述之模組取放的可能性。In addition to the above-mentioned dies, it also includes flip-chip substrates, IC substrates, LED heat sink substrates, LED sapphire substrates, glass substrates, ceramic substrates, copper foil substrates or wafers (Wafer). At present, the industry generally refers to the aforementioned components as Substrate. Therefore, all existing substrates may be picked and placed by the above-mentioned modules.

如上所述,因取放模組所在的位置與光源模組提供亮光的方式,其係可能影響基板之對位,進而造成後續製程之不準確性,故如何提高基板之對位的精準度就成為各廠商所研究的題目。As mentioned above, due to the location of the pick-and-place module and the way the light source module provides bright light, it may affect the alignment of the substrate and cause inaccuracies in the subsequent process. Therefore, how to improve the accuracy of the substrate alignment is Become the subject of research by various manufacturers.

有鑑於上述之課題,本發明之目的在於提供一種取放對位裝置及其方法,其係能使一亮光由下往上照射位於載具。視覺影像擷取模組能夠穿視取放單元,故當視覺影像擷取模組擷取被亮光由下往上照射之載具的影像資訊時,視覺影像擷取模組能夠不受到取放單元的阻礙,並能清晰地擷取載具的影像資訊。In view of the above-mentioned problems, the object of the present invention is to provide a pick-and-place alignment device and method thereof, which can make a bright light illuminate the carrier from bottom to top. The visual image capturing module can pass through the viewing and placing unit, so when the visual image capturing module captures the image information of the vehicle illuminated by bright light from bottom to top, the visual image capturing module can not be affected by the picking and placing unit Obstacles, and can clearly capture the image information of the vehicle.

為了達到上述之目的,本發明之技術手段在於提供一種取放對位裝置,其具有: 一視覺影像擷取模組; 一取放單元,其係設於該視覺影像擷取模組的下方; 一載具,其係設於該取放單元的下方;以及 一光源模組,其係設於該載具的下方; 其中,該光源模組係由下往上照射該載具,該視覺影像擷取模組係穿視該取放單元,以擷取該載具之影像資訊。In order to achieve the above objective, the technical means of the present invention is to provide a pick-and-place alignment device, which has: A visual image capturing module; A pick-and-place unit, which is arranged under the visual image capturing module; A carrier, which is arranged under the pick-and-place unit; and A light source module, which is arranged under the carrier; Wherein, the light source module illuminates the carrier from bottom to top, and the visual image capturing module traverses the pick-and-place unit to capture image information of the carrier.

於一實施例,一透明體係設於該取放單元的頂端。該視覺影像擷取模組係為一電荷耦合裝置;該透明體係為一玻璃或一透鏡。該取放單元更耦接一正負壓模組。該正負壓模組係為一抽氣馬達與供氣馬達。一載具位移單元係設於該取放單元的下方,該光源單元係設於該載具位移單元的下方。In one embodiment, a transparent system is provided on the top of the pick-and-place unit. The visual image capturing module is a charge-coupled device; the transparent system is a glass or a lens. The pick-and-place unit is further coupled to a positive and negative pressure module. The positive and negative pressure module is a suction motor and an air supply motor. A carrier displacement unit is arranged below the pick-and-place unit, and the light source unit is arranged below the carrier displacement unit.

於一實施例,該載具位移單元係為一滾輪裝置、一機械夾座、一線性滑軌、一履帶結構或一軌道結構。一位移模組耦接該視覺影像擷取模組。該位移模組係為一履帶結構、一線性滑軌或一軌道結構。該光源模組係設於該載具的內部的底端。該載具為一托盤或一連續膜體;或者該載具為一透明體,該載具的頂端具有一記號;或者該載具具有複數個容置部與複數個透孔,各該透孔係相通該容置部。In one embodiment, the carrier displacement unit is a roller device, a mechanical clamp base, a linear slide, a crawler structure, or a track structure. A displacement module is coupled to the visual image capturing module. The displacement module is a crawler structure, a linear slide rail or a track structure. The light source module is arranged at the bottom end of the inside of the carrier. The carrier is a tray or a continuous membrane body; or the carrier is a transparent body, and the top of the carrier has a mark; or the carrier has a plurality of accommodating parts and a plurality of through holes, each of the through holes The system communicates with the accommodating part.

於一實施例,一第一視覺影像擷取單元係位於該載具位移單元的上方,該第一視覺影像擷取單元係擷取位於該載具之一記號的影像資訊。In one embodiment, a first visual image capturing unit is located above the vehicle displacement unit, and the first visual image capturing unit captures image information of a mark located on the vehicle.

本發明復提供一種取放對位方法,其步驟包含有: 提供一亮光給一載具,該亮光係由下往上照射該載具; 一視覺影像擷取模組係於穿視一取放單元,以擷取該載具之影像資訊;以及 一取放單元係依據該影像資訊,並移動至一預設位置,而將一基板放置於該載具;或者該取放單元依據該影像資訊,並移動至該預設位置,並將所吸取的該基板放置於該載具。The present invention further provides a pick-and-place alignment method, the steps of which include: Provide a bright light to a vehicle, and the bright light illuminates the vehicle from bottom to top; A visual image capturing module is attached to the traversing-fetching unit to capture the image information of the vehicle; and A pick-and-place unit moves to a preset position based on the image information, and places a substrate on the carrier; or the pick-and-place unit moves to the preset position based on the image information, and picks up The substrate is placed on the carrier.

於一實施例,該載具係於一載具位移單元的頂端移動,該載具位移單元的下方設有一光源單元,該光源單元係將該亮光由下往上照射至該載具。In one embodiment, the carrier moves on the top of a carrier displacement unit, and a light source unit is arranged under the carrier displacement unit, and the light source unit irradiates the bright light to the carrier from bottom to top.

於一實施例,該載具內部的底端設有一光源單元,該光源單元係將該亮光由下往上照射至該載具。In one embodiment, a light source unit is provided at the bottom of the inside of the carrier, and the light source unit irradiates the bright light to the carrier from bottom to top.

於一實施例,該取放單元的頂端設有一透明體,該視覺影像擷取模組係透過該透明體,以穿視該取放單元,進擷取該基板的影像資訊。In one embodiment, a transparent body is provided on the top of the pick-and-place unit, and the visual image capturing module penetrates the transparent body to penetrate the pick-and-place unit to capture the image information of the substrate.

本發明復提供一種取放對位方法,其步驟包含有: 提供一亮光給一載具,該亮光係由下往上照射位於該載具之記號;以及 一第一視覺影像擷取模組取係於該載具的上方,以擷取該記號之影像資訊。The present invention further provides a pick-and-place alignment method, the steps of which include: Provide a bright light to a vehicle, and the bright light illuminates the mark located on the vehicle from bottom to top; and A first visual image capturing module is located above the carrier to capture the image information of the mark.

於一實施例,該載具係於一載具位移單元的頂端移動,該載具位移單元的下方設有一光源單元,該光源單元係將該亮光由下往上照射至該記號。In one embodiment, the carrier moves on the top of a carrier displacement unit, and a light source unit is arranged under the carrier displacement unit, and the light source unit irradiates the bright light to the mark from bottom to top.

於一實施例,該載具係於一載具位移單元的頂端移動,該載具位移單元的下方設有一光源單元,該光源單元係將該亮光由下往上照射至該記號。In one embodiment, the carrier moves on the top of a carrier displacement unit, and a light source unit is arranged under the carrier displacement unit, and the light source unit irradiates the bright light to the mark from bottom to top.

綜合上述之本發明之取放對位裝置及其方法,光源單元係將一亮光由下往上照射至載具,而使載具或記號能夠被視覺影像擷取模組能夠穿視取放單元,以清晰地擷取載具或記號的影像資訊,藉此達到精準對位的效果,以利後續製程之進行。Combining the above-mentioned pick-and-place alignment device and method of the present invention, the light source unit irradiates a bright light to the carrier from bottom to top, so that the carrier or mark can be seen through the pick-and-place unit by the visual image capturing module , In order to clearly capture the image information of the vehicle or the mark, so as to achieve the effect of precise alignment to facilitate the subsequent process.

以下係藉由特定的具體實施例說明本發明之實施方式,所屬技術領域中具有通常知識者可由本說明書所揭示之內容,輕易地瞭解本發明之其他優點與功效。The following is a description of the implementation of the present invention through specific specific examples. Those skilled in the art can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification.

請配合參考第1圖與第2圖所示,本發明係一種取放對位裝置之第一實施例,其具有一視覺影像擷取模組10、一透明體11、一取放單元12、一正負壓模組13、一光源模組2、一載具3、一載具位移單元4與一位移模組5。Please refer to FIG. 1 and FIG. 2. The present invention is a first embodiment of a pick-and-place alignment device, which has a visual image capturing module 10, a transparent body 11, a pick-and-place unit 12, A positive and negative pressure module 13, a light source module 2, a carrier 3, a carrier displacement unit 4 and a displacement module 5.

視覺影像擷取模組10係為一電荷耦合裝置(Charge-coupled Device,CCD)。The visual image capturing module 10 is a charge-coupled device (CCD).

取放單元12係位於視覺擷取模組10的下方。取放單元12係能夠呈。取放單元12係耦接正負壓模組13,正負壓模組13係為一抽氣馬達與供氣馬達。正負壓模組13係提供一正壓氣體或一負壓氣體給取放單元12。The pick-and-place unit 12 is located below the visual capture module 10. The pick-and-place unit 12 can be presented. The pick-and-place unit 12 is coupled to the positive and negative pressure module 13, and the positive and negative pressure module 13 is an air extraction motor and an air supply motor. The positive and negative pressure module 13 provides a positive pressure gas or a negative pressure gas to the pick-and-place unit 12.

透明體11係設於吸取單元120的上方。透明體11係為一玻璃或一透鏡。The transparent body 11 is arranged above the suction unit 120. The transparent body 11 is a glass or a lens.

請再配合參考圖1所示,載具位移單元4係設於取放單元12的下方。載具位移單元4係為一滾輪裝置、一機械夾座、一線性滑軌、一履帶結構或一軌道結構。Please refer to FIG. 1 again, as shown in FIG. 1, the carrier displacement unit 4 is arranged under the pick-and-place unit 12. The carrier displacement unit 4 is a roller device, a mechanical clamp base, a linear slide rail, a crawler structure or a track structure.

位移模組5係設於載具位移單元4的上方,並耦接視覺影像擷取模組10,以使視覺影像擷取模組10能夠相對於載具位移單元4升降與橫向位移。位移模組5係為一履帶結構、一線性滑軌或一軌道結構。The displacement module 5 is disposed above the carrier displacement unit 4 and is coupled to the visual image capturing module 10 so that the visual image capturing module 10 can move up and down and laterally shift relative to the carrier displacement unit 4. The displacement module 5 is a crawler structure, a linear slide rail or a track structure.

於本實施例中,光源模組2係設於載具位移單元4的下方。光源模組2係為一可見光源、一不可見光源、一紅外光源、一紫外光源、一特殊光源,一鹵素燈源、一發光二極體燈源或一般照明光源。In this embodiment, the light source module 2 is disposed under the carrier displacement unit 4. The light source module 2 is a visible light source, an invisible light source, an infrared light source, an ultraviolet light source, a special light source, a halogen light source, a light emitting diode light source or a general lighting source.

載具3係能夠於載具位移單元4的上方移動。載具3為一透明體,載具3的頂端具有至少一基板30。載具3為一托盤或一連續的膜體。The carrier 3 can move above the carrier displacement unit 4. The carrier 3 is a transparent body, and the top of the carrier 3 has at least one substrate 30. The carrier 3 is a tray or a continuous film body.

請配合參考圖5所示,本發明之取放對位裝置之第二實施例,於本實施例中,光源模組2A係設於載具3A的內部的底端。Please refer to FIG. 5 for the second embodiment of the pick-and-place alignment device of the present invention. In this embodiment, the light source module 2A is disposed at the bottom end of the inside of the carrier 3A.

本發明係一種取放對位方法,其步驟包含有:The present invention is a pick-and-place alignment method, and its steps include:

一載具3的頂端具有至少一基板30,載具3係於載具位移單元4的上方移動。The top of a carrier 3 has at least one substrate 30, and the carrier 3 moves above the carrier displacement unit 4.

如上述之載具位移單元4與載具3。若載具3為一連續膜體,載具位移單元4係為一供料滾輪與一收膜滾輪。前述之載具3係設於供料滾輪,收膜滾輪係接收已被取走基板30之膜體。The carrier displacement unit 4 and the carrier 3 are as described above. If the carrier 3 is a continuous film body, the carrier displacement unit 4 is a feeding roller and a film collecting roller. The aforementioned carrier 3 is set on the supply roller, and the film-receiving roller receives the film body from which the substrate 30 has been removed.

若載具3為托盤,載具位移單元4係為一滾輪裝置、一機械夾座、一線性滑軌、一履帶結構或一軌道結構,以使載具3能夠於載具位移單元4的上方移動。If the carrier 3 is a pallet, the carrier displacement unit 4 is a roller device, a mechanical clamp, a linear slide, a crawler structure or a track structure, so that the carrier 3 can be above the carrier displacement unit 4 move.

請配合參考第1圖、第3圖與第4圖所示,若為上述第一實施例所示,當載具3移動至光源模組2的上方時,載具3會停止移動,光源模組2係提供一亮光給載具3,該亮光係由下往上照穿載具3。Please refer to Figure 1, Figure 3, and Figure 4. If it is shown in the above first embodiment, when the carrier 3 moves above the light source module 2, the carrier 3 will stop moving, and the light source module Group 2 provides a bright light to the carrier 3, and the bright light illuminates the carrier 3 from bottom to top.

載具3具有多個容置部31與多個透孔32,透孔32係相通容置部31。上述之亮光會經由透孔32與容置部31照過載具3。或者載具3為一透明體,故上述之亮光會照過基板30。The carrier 3 has a plurality of accommodating portions 31 and a plurality of through holes 32, and the through holes 32 communicate with the accommodating portion 31. The above-mentioned bright light illuminates the carrier 3 through the through hole 32 and the accommodating portion 31. Or the carrier 3 is a transparent body, so the bright light mentioned above will shine through the substrate 30.

取放單元12係移動至視覺影像擷取模組10的下方,視覺影像擷取模組10係透過透明體11,以穿視過取放單元12,進而擷取欲所欲放置基板30之容置部31之影像資訊,因視覺影像擷取模組10係位於取放單元12的上方,而且上述之亮光由下往上照射,故視覺影像擷取模組10能夠清晰地擷取容置部31之影像資訊。The pick-and-place unit 12 moves below the visual image capture module 10. The visual image capture module 10 passes through the transparent body 11 to pass through the pick-and-place unit 12 to capture the content of the substrate 30 to be placed. Because the visual image capturing module 10 is located above the pick-and-place unit 12 and the above-mentioned bright light is irradiated from bottom to top, the image information of the placement portion 31 can clearly capture the containing portion. 31 image information.

取放單元10係朝向於所欲放置基板30之容置部31的位置下降。正負壓模組13係提供一正壓給取放單元12,以使取放單元12產生一釋放力,藉此將基板30放置於所欲放置之容置部31。若放置基板30,則取放單元13開始上升,並進行下一個放置基板30的程序。The pick-and-place unit 10 is lowered toward the position of the accommodating portion 31 where the substrate 30 is to be placed. The positive and negative pressure module 13 provides a positive pressure to the pick-and-place unit 12 so that the pick-and-place unit 12 generates a release force, thereby placing the substrate 30 in the receiving portion 31 to be placed. If the substrate 30 is placed, the pick-and-place unit 13 starts to rise, and the next procedure for placing the substrate 30 is performed.

若為上述之第二實施例,如第5圖所示,因光源模組2A係設於載具3A中,故當載具3A於載具位移單元移動至一預設位置後,光源模組2A會提供一亮光給基板30A,該亮光係由下往上照射載具3A,載具3A為一透明體,故亮光可穿透載具3A,上述之視取放單元係進行上述之基板30A之放置動作。In the second embodiment described above, as shown in Figure 5, since the light source module 2A is installed in the carrier 3A, when the carrier 3A is moved to a predetermined position by the carrier displacement unit, the light source module 2A will provide a bright light to the substrate 30A. The bright light illuminates the carrier 3A from bottom to top. The carrier 3A is a transparent body, so the bright light can penetrate the carrier 3A. The placement action.

綜合上述,如第2圖所示,本案係將視覺影像擷取模組10、取放單元12與透明體11三者予以組合,而使視覺影像擷取模組10能夠透視取放單元12。In summary, as shown in FIG. 2, in this case, the visual image capturing module 10, the picking and placing unit 12 and the transparent body 11 are combined, so that the visual image capturing module 10 can see through the picking and placing unit 12.

同理,請配合參考第1圖所示,當取放單元12欲吸取放置於載具3之基板30時,載具3移動至光源模組2的上方時,載具3會停止移動,光源模組2係提供一亮光給載具3,該亮光係由下往上照穿載具3。For the same reason, please refer to Figure 1. When the pick-and-place unit 12 is about to pick up the substrate 30 placed on the carrier 3, when the carrier 3 moves to the top of the light source module 2, the carrier 3 will stop moving and the light source The module 2 provides a bright light to the carrier 3, and the bright light illuminates the carrier 3 from bottom to top.

位移模組5係使視覺影像擷取模組10移動於欲被吸取之基板30的上方。上述之亮光經由透孔32會照過基板30,並且亮光會由基板30的四周向上照射。The displacement module 5 moves the visual image capturing module 10 above the substrate 30 to be sucked. The above-mentioned bright light will illuminate the substrate 30 through the through hole 32, and the bright light will be irradiated upward from the periphery of the substrate 30.

取放單元12係移動至視覺影像擷取模組10的下方,視覺影像擷取模組10係透過透明體11,以穿視過取放單元12,進而擷取欲被吸取之基板30之影像資訊,因視覺影像擷取模組10係位於取放單元12的上方,而且上述之亮光由下往上照射,故視覺影像擷取模組10能夠清晰地擷取基板30之影像資訊。The pick-and-place unit 12 moves below the visual image capture module 10. The visual image capture module 10 passes through the transparent body 11 to pass through the pick-and-place unit 12, and then captures the image of the substrate 30 to be absorbed. Information, because the visual image capturing module 10 is located above the pick-and-place unit 12, and the above-mentioned bright light is irradiated from bottom to top, the visual image capturing module 10 can clearly capture the image information of the substrate 30.

取放單元10係朝向於欲被吸取之基板30的位置下降。正負壓模組13係提供一負壓給取放單元12,以使取放單元12產生一真空吸力,藉此吸附基板30。若已吸附基板30,則取放單元13開始上升,並移動至另一放置基板30之位置。待取放單元12抵達該位置後,正負壓模組13係提供一正壓給取放單元12,以使取放單元12產生一吹力,藉此將基板30放置於該位置。The pick-and-place unit 10 is lowered toward the position of the substrate 30 to be sucked. The positive and negative pressure module 13 provides a negative pressure to the pick-and-place unit 12 so that the pick-and-place unit 12 generates a vacuum suction force, thereby adsorbing the substrate 30. If the substrate 30 has been adsorbed, the pick-and-place unit 13 starts to rise and moves to another position where the substrate 30 is placed. After the pick-and-place unit 12 reaches the position, the positive and negative pressure module 13 provides a positive pressure to the pick-and-place unit 12 so that the pick-and-place unit 12 generates a blowing force, thereby placing the substrate 30 at the position.

當視覺影像擷取模組10欲擷取載具3或基板30之影像資訊時,視覺影像擷取模組10的視野係能夠穿透透明體11與取放單元12,故影像擷取模組10於截取載具3或基板30之影像資訊時,視覺影像擷取模組10係不會受到吸取頭12的阻擋。When the visual image capturing module 10 wants to capture the image information of the carrier 3 or the substrate 30, the field of view of the visual image capturing module 10 can penetrate the transparent body 11 and the picking and placing unit 12, so the image capturing module 10 When capturing the image information of the carrier 3 or the substrate 30, the visual image capturing module 10 will not be blocked by the suction head 12.

請配合參考第6圖所示,本發明之取放對位裝置之第二實施例,於本實施例中,載具3B具有一記號33B。載具3B為一透明體。Please refer to FIG. 6 for the second embodiment of the pick-and-place alignment device of the present invention. In this embodiment, the carrier 3B has a mark 33B. The carrier 3B is a transparent body.

載具位移單元4的下方具有一光源模組2B。或者如上述之載具的第二實施例,載具3B的底端具有一光源模組。There is a light source module 2B under the carrier displacement unit 4. Or as in the second embodiment of the above-mentioned carrier, the bottom end of the carrier 3B has a light source module.

位移模組5A係設於載具位移單元4的上方。位移模組5A的底端耦接有視覺影像擷取模組10A。視覺影像擷取模組10A的下方具有一取放單元12A。取放單元12A耦接有正負壓模組。一第一視覺影像擷取模組14A係位於載具位移單元4的上方。The displacement module 5A is arranged above the carrier displacement unit 4. A visual image capturing module 10A is coupled to the bottom end of the displacement module 5A. There is a pick-and-place unit 12A below the visual image capturing module 10A. The pick-and-place unit 12A is coupled with a positive and negative pressure module. A first visual image capturing module 14A is located above the carrier displacement unit 4.

本發明為取放對位方法之又一實施例,其步驟包含有:The present invention is another embodiment of the pick-and-place alignment method, and its steps include:

如第6圖所示,提供一亮光給一載具3B,亮光係由下往上照射位於記號33B。亮光能夠由位於載具位移單元4下方的光源模組2B所提供,或者亮光能夠由位於載具底端之光源模組所提供。As shown in Fig. 6, a bright light is provided to a carrier 3B, and the bright light illuminates the location mark 33B from bottom to top. The bright light can be provided by the light source module 2B located under the carrier displacement unit 4, or the bright light can be provided by the light source module located at the bottom of the carrier.

第一視覺影像擷取模組14A取係於載具3B的上方,以擷取記號33B之影像資訊。The first visual image capturing module 14A is located above the carrier 3B to capture the image information of the mark 33B.

位移模組5A依據該影像資訊,而將取放單元12A移動至載具3B的上方。待取放單元12A移動至載具3B上方後,取放單元12A係相對於載具3B縱向移動,以將所吸附的基板放置於載具3B的頂端,或者吸取位於載具3B之基板。若前述之吸取或放置動作已完成,取放單元12A再次回復至最初位置。如上述之第一實施例,視覺影像擷取模組10A係穿視過取放單元12A,以擷取基板之影像資訊。The displacement module 5A moves the pick-and-place unit 12A to the top of the carrier 3B according to the image information. After the pick-and-place unit 12A moves above the carrier 3B, the pick-and-place unit 12A moves longitudinally relative to the carrier 3B to place the adsorbed substrate on the top of the carrier 3B, or to suck the substrate on the carrier 3B. If the aforementioned sucking or placing action has been completed, the picking and placing unit 12A returns to the original position again. As in the first embodiment described above, the visual image capturing module 10A passes through the access unit 12A to capture image information of the substrate.

另外,本發明之光源單元係設於載具的內部之底端或載具位移單元的下方,故光源單元所產生的亮光係由下往上照射,以使視覺影像擷取模組能夠清晰地擷取基板或記號之影像資訊,藉此達到精準定位之目的,以利後續製程之進行。In addition, the light source unit of the present invention is located at the bottom of the carrier or under the carrier displacement unit, so the bright light generated by the light source unit is irradiated from bottom to top, so that the visual image capturing module can clearly Capture the image information of the substrate or mark to achieve the purpose of precise positioning to facilitate the subsequent process.

以上所述之具體實施例,僅係用於例釋本發明之特點及功效,而非用於限定本發明之可實施範疇,於未脫離本發明上揭之精神與技術範疇下,任何運用本發明所揭示內容而完成之等效改變及修飾,均仍應為下述之申請專利範圍所涵蓋。The specific embodiments described above are only used to illustrate the features and effects of the present invention, rather than to limit the scope of implementation of the present invention. Without departing from the spirit and technical scope of the present invention, any application of the present invention The equivalent changes and modifications of the disclosed content of the invention shall still be covered by the following patent application scope.

10、10A:視覺影像擷取模組 11:透明體 12、12A:取放單元 13:正負壓模組 14A:第一視覺影像擷取模組 2、2A、2B:光源模組 3、3A、3B:載具 30、30A:基板 31:容置部 32:透孔 4、4A:載具位移單元 5、5A:位移模組 33B:記號 10.10A: Visual image capture module 11: Transparent body 12.12A: Pick and place unit 13: Positive and negative pressure module 14A: The first visual image capture module 2, 2A, 2B: light source module 3, 3A, 3B: vehicles 30, 30A: substrate 31: Containment Department 32: Through hole 4. 4A: Vehicle displacement unit 5. 5A: Displacement module 33B: Mark

第1圖為一種取放對位裝置之第一實施例之示意圖。 第2圖為一視覺影像擷取模組與一取放單元之剖面示意圖。 第3圖為一載具與一載具位移單元之動作示意圖。 第4圖為載具與載具位移單元之另一動作示意圖。 第5圖為載具之第二實施例之示意圖。 第6圖為本創作之取放對位裝置之第二實施例之示意圖。Figure 1 is a schematic diagram of a first embodiment of a pick-and-place alignment device. Figure 2 is a schematic cross-sectional view of a visual image capturing module and a pick-and-place unit. Figure 3 is a schematic diagram of the actions of a carrier and a carrier displacement unit. Figure 4 is a schematic diagram of another action of the carrier and the carrier displacement unit. Figure 5 is a schematic diagram of the second embodiment of the carrier. Figure 6 is a schematic diagram of the second embodiment of the created pick-and-place alignment device.

10:視覺影像擷取模組 10: Visual image capture module

12:取放單元 12: Pick and place unit

2:光源模組 2: Light source module

3:載具 3: Vehicle

30:基板 30: substrate

31:容置部 31: Containment Department

32:透孔 32: Through hole

4:載具位移單元 4: Vehicle displacement unit

5:位移模組 5: Displacement module

Claims (17)

一種取放對位裝置,其具有:一視覺影像擷取模組;一取放單元,其係設於該視覺影像擷取模組的下方;一載具,其係設於該取放單元的下方;一光源模組,其係設於該載具的下方;以及一載具位移單元,該載具位移單元係設於該取放單元的下方,該光源單元係設於該載具位移單元的下方;其中,該光源模組係由下往上照射該載具,該視覺影像擷取模組係穿視該取放單元,以擷取該載具之影像資訊。 A pick-and-place alignment device, which has: a visual image capture module; a pick-and-place unit arranged under the visual image capture module; and a carrier, which is arranged on the pick-and-place unit Below; a light source module, which is arranged below the carrier; and a carrier displacement unit, the carrier displacement unit is arranged below the pick-and-place unit, the light source unit is arranged on the carrier displacement unit Wherein, the light source module illuminates the carrier from bottom to top, and the visual image capturing module traverses the pick-and-place unit to capture the image information of the carrier. 如申請專利範圍第1項所述之取放對位裝置,其更具有一透明體,該透明體係設於該取放單元的頂端。 For example, the pick-and-place alignment device described in item 1 of the scope of patent application has a transparent body, and the transparent system is arranged on the top of the pick-and-place unit. 如申請專利範圍第2項所述之取放對位裝置,其中該視覺影像擷取模組係為一電荷耦合裝置;該透明體係為一玻璃或一透鏡。 In the pick-and-place alignment device described in item 2 of the scope of patent application, the visual image capturing module is a charge-coupled device; the transparent system is a glass or a lens. 如申請專利範圍第2項所述之取放對位裝置,其中該取放單元更耦接一正負壓模組。 The pick-and-place alignment device described in item 2 of the scope of patent application, wherein the pick-and-place unit is further coupled to a positive and negative pressure module. 如申請專利範圍第4項所述之取放對位裝置,其中該正負壓模組係為一抽氣馬達與供氣馬達。 For the pick-and-place alignment device described in item 4 of the scope of patent application, the positive and negative pressure module is an air extraction motor and an air supply motor. 如申請專利範圍第1項所述之取放對位裝置,其中該載具位移單元係為一滾輪裝置、一機械夾座、一線性滑軌、一履帶結構或一軌道結構。 The pick-and-place alignment device described in item 1 of the scope of patent application, wherein the carrier displacement unit is a roller device, a mechanical clamp, a linear slide, a crawler structure or a track structure. 如申請專利範圍第1項所述之取放對位裝置,其更具有一位移模組,該位移模組耦接該視覺影像擷取模組。 For the pick-and-place alignment device described in item 1 of the scope of patent application, it further has a displacement module, and the displacement module is coupled to the visual image capturing module. 如申請專利範圍第7項所述之取放對位裝置,其中該位移模組係為一履帶結構、一線性滑軌或一軌道結構。 For the pick-and-place alignment device described in item 7 of the scope of patent application, the displacement module is a crawler structure, a linear slide rail or a track structure. 如申請專利範圍第1項所述之取放對位裝置,其中該光源模組為一可見光源、一不可見光源、一紅外光源、一紫外光源、一特殊光源,一鹵素燈源、一發光二極體燈源或一般照明光源。 As described in item 1 of the scope of patent application, the light source module is a visible light source, an invisible light source, an infrared light source, an ultraviolet light source, a special light source, a halogen light source, and a light source. Diode light source or general lighting source. 如申請專利範圍第1項所述之取放對位裝置,其中該光源模組係設於該載具的內部的底端。 The pick-and-place alignment device described in item 1 of the scope of patent application, wherein the light source module is arranged at the bottom end of the inside of the carrier. 如申請專利範圍第1項所述之取放對位裝置,其中該載具為一托盤或一連續膜體;或者該載具為一透明體,該載具的頂端具有一記號;或者該載具具有複數個容置部與複數個透孔,各該透孔係相通該容置部。 The pick-and-place alignment device described in item 1 of the scope of patent application, wherein the carrier is a tray or a continuous film body; or the carrier is a transparent body, and the top of the carrier has a mark; or the carrier The utility model has a plurality of accommodating parts and a plurality of through holes, and each of the through holes communicates with the accommodating part. 如申請專利範圍第1項所述之取放對位裝置,其更具有一第一視覺影像擷取單元,該第一視覺影像擷取單元係位於該載具位移單元的上方,該第一視覺影像擷取單元係擷取位於該載具之一記號的影像資訊。 For the pick-and-place alignment device described in item 1 of the scope of patent application, it further has a first visual image capturing unit, the first visual image capturing unit is located above the carrier displacement unit, and the first visual The image capturing unit captures image information of a mark located on the vehicle. 一種取放對位方法,其步驟包含有:提供一亮光給一載具,該亮光係由下往上照射該載具;一視覺影像擷取模組係於穿視一取放單元,以擷取該載具之影像資訊;以及 一取放單元係依據該影像資訊,並移動至一預設位置,而將一基板放置於該載具;或者該取放單元依據該影像資訊,並移動至該預設位置,並將所吸取的該基板放置於該載具;其中該載具內部的底端設有一光源單元,該光源單元係將該亮光由下往上照射至該載具。 A pick-and-place alignment method, the steps include: providing a bright light to a carrier, the bright light illuminates the carrier from bottom to top; a visual image capturing module is attached to a pick-and-place unit to capture Obtain the image information of the vehicle; and A pick-and-place unit moves to a preset position based on the image information, and places a substrate on the carrier; or the pick-and-place unit moves to the preset position based on the image information, and picks up The substrate is placed on the carrier; wherein a light source unit is provided at the bottom of the inside of the carrier, and the light source unit irradiates the bright light to the carrier from bottom to top. 如申請專利範圍第13項所述之取放對位方法,其中該載具係於一載具位移單元的頂端移動,該載具位移單元的下方設有一光源單元,該光源單元係將該亮光由下往上照射至該載具。 The pick-and-place alignment method described in item 13 of the scope of patent application, wherein the carrier is moved on the top of a carrier displacement unit, and a light source unit is arranged under the carrier displacement unit, and the light source unit is used for the bright light Illuminate to the vehicle from bottom to top. 如申請專利範圍第13項所述之取放對位方法,其中該取放單元的頂端設有一透明體,該視覺影像擷取模組係透過該透明體,以穿視該取放單元,進擷取該基板的影像資訊。 The pick-and-place alignment method described in item 13 of the scope of patent application, wherein a transparent body is provided on the top of the pick-and-place unit, and the visual image capturing module penetrates the transparent body to see through the pick-and-place unit and enter Capture the image information of the substrate. 一種取放對位之方法,其步驟包含有:提供一亮光給一載具,該亮光係由下往上照射位於該載具之記號;以及一第一視覺影像擷取模組取係於該載具的上方,以擷取該記號之影像資訊;該載具係於一載具位移單元的頂端移動,該載具位移單元的下方設有一光源單元,該光源單元係將該亮光由下往上照射至該記號。 A pick-and-place alignment method, the steps include: providing a bright light to a carrier, the bright light irradiates a mark located on the carrier from bottom to top; and a first visual image capturing module is attached to the carrier Above the carrier to capture the image information of the mark; the carrier moves on the top of a carrier displacement unit, and a light source unit is arranged under the carrier displacement unit, and the light source unit moves the bright light from bottom to bottom Up to the mark. 如申請專利範圍第16項所述之取放對位方法,其中該載具內部的底端設有一光源單元,該光源單元係將該亮光由下往上照射至該記號。 For the pick-and-place alignment method described in item 16 of the scope of patent application, a light source unit is provided at the bottom of the inside of the carrier, and the light source unit irradiates the bright light to the mark from bottom to top.
TW108128715A 2019-08-13 2019-08-13 Pick and place alignment apparatus and method thereof TWI743529B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW108128715A TWI743529B (en) 2019-08-13 2019-08-13 Pick and place alignment apparatus and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108128715A TWI743529B (en) 2019-08-13 2019-08-13 Pick and place alignment apparatus and method thereof

Publications (2)

Publication Number Publication Date
TW202107605A TW202107605A (en) 2021-02-16
TWI743529B true TWI743529B (en) 2021-10-21

Family

ID=75745283

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108128715A TWI743529B (en) 2019-08-13 2019-08-13 Pick and place alignment apparatus and method thereof

Country Status (1)

Country Link
TW (1) TWI743529B (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM523186U (en) * 2015-10-08 2016-06-01 均華精密工業股份有限公司 Die precision pick-and-place device and suction module used therein

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM523186U (en) * 2015-10-08 2016-06-01 均華精密工業股份有限公司 Die precision pick-and-place device and suction module used therein

Also Published As

Publication number Publication date
TW202107605A (en) 2021-02-16

Similar Documents

Publication Publication Date Title
TWI652745B (en) Wafer bonding device and method
TW202025349A (en) Apparatus and method for repairing led substrate
CN101383277B (en) Expansion method and expansion apparatus
CN106920762A (en) Semiconductor- fabricating device, the manufacture method of semiconductor devices and chip attachment machine
KR102062121B1 (en) Semiconductor manufacturing device and manufacturing method of semiconductor device
KR20210017048A (en) Die bonding method and die bonding apparatus
TWI844024B (en) Die ejection device and die binding equipment having the same
TWI743529B (en) Pick and place alignment apparatus and method thereof
EP1378932B1 (en) Semiconductor chip mounting apparatus and mounting method
JP2814934B2 (en) Solder ball mounting device and mounting method
JPH10145100A (en) Lighting device for surface mounter and method of manufacturing the same
CN110676202A (en) Pick-and-place alignment device and method thereof
KR101294313B1 (en) Dryer apparatus using ir lamps and inspection module thereof
TWI473180B (en) Wafer bonding device
TWI408763B (en) A combination of wafer ejection devices and image capturing devices
JPWO2020090957A1 (en) Electronic component mounting device
CN109524319B (en) Die table unit and die bonding device with same
JP4514667B2 (en) Semiconductor manufacturing equipment
JP2013092661A (en) Illumination unit for imaging to be used for component mounting device and component mounting device
TW201810471A (en) Wafer appearance detecting device and method thereof
JP3778676B2 (en) Component mounting device
TWM602635U (en) Semiconductor wafer inspection module and inspection equipment after cutting
JP3077348B2 (en) Electronic component mounting apparatus and electronic component mounting method
TWM642014U (en) Printed circuit board automatic line width measurement equipment
JP2794666B2 (en) Lighting method of semiconductor chip