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TWI743522B - Substrate processing method, substrate processing apparatus and substrate processing system - Google Patents

Substrate processing method, substrate processing apparatus and substrate processing system Download PDF

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TWI743522B
TWI743522B TW108126419A TW108126419A TWI743522B TW I743522 B TWI743522 B TW I743522B TW 108126419 A TW108126419 A TW 108126419A TW 108126419 A TW108126419 A TW 108126419A TW I743522 B TWI743522 B TW I743522B
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image
substrate
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TW202023693A (en
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猶原英司
沖田有史
角間央章
増井達哉
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日商斯庫林集團股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
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    • G06T7/0004Industrial image inspection
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Abstract

相機藉由連續拍攝於處理區間內移動的噴嘴而獲取攝影圖像。基準圖像登記部登記藉由拍攝位於處理區間的第一端及第二端的噴嘴所獲得的第一基準圖像及第二基準圖像。位置偏離檢測部包括:圖像判定部,針對利用相機拍攝於處理區間內移動的噴嘴所獲得的實際圖像,根據既定的判定規則,判定是否為與所述第一端及所述第二端分別對應的圖像;以及圖像比較部,將第一基準圖像及第二基準圖像、與藉由圖像判定部而判定為與第一端及第二端分別對應的實際圖像進行比較。 The camera acquires photographic images by continuously photographing the nozzles moving in the processing section. The reference image registration unit registers the first reference image and the second reference image obtained by photographing nozzles located at the first end and the second end of the processing section. The positional deviation detection unit includes: an image determination unit, which determines whether the actual image obtained by the nozzle moving in the processing section with the camera is related to the first end and the second end according to a predetermined determination rule. Respectively corresponding images; and an image comparison unit that compares the first reference image and the second reference image with the actual image determined by the image determination unit to correspond to the first end and the second end, respectively Compare.

Description

基板處理方法、基板處理裝置以及基板處理系 統 Substrate processing method, substrate processing apparatus and substrate processing system Unify

本發明是有關於一種藉由自於基板上移動的噴嘴中噴出處理液來對基板進行處理的技術,且特別是有關於一種檢測噴嘴的位置偏離的技術。成為處理對象的基板例如包括:半導體基板、液晶顯示裝置及有機電致發光(Electroluminescence,EL)顯示裝置等平板顯示器(Flat Panel Display,FPD)用基板、光碟用基板、磁碟用基板、磁光碟用基板、光罩用基板、陶瓷基板、太陽電池用基板、印刷基板等。 The present invention relates to a technology for processing a substrate by ejecting a processing liquid from a nozzle that moves on the substrate, and particularly relates to a technology for detecting the positional deviation of the nozzle. The substrates to be processed include, for example, semiconductor substrates, liquid crystal display devices, and organic electroluminescence (Electroluminescence, EL) display devices, such as flat panel display (FPD) substrates, optical disk substrates, magnetic disk substrates, and magneto-optical disks. Use substrates, photomask substrates, ceramic substrates, solar cell substrates, printed substrates, etc.

於半導體器件等的製造步驟中,對基板供給純水、光阻液、蝕刻液等各種處理液來進行清洗處理或抗蝕劑塗佈處理等基板處理。作為使用該些處理液進行液體處理的裝置,有時使用一面使基板旋轉,一面自噴嘴朝所述基板的表面噴出處理液的基板處理裝置。 In the manufacturing steps of semiconductor devices and the like, various processing liquids such as pure water, photoresist liquid, and etching liquid are supplied to the substrate to perform substrate processing such as cleaning processing or resist coating processing. As an apparatus for performing liquid processing using these processing liquids, there are cases in which a substrate processing apparatus is used that spouts the processing liquid from a nozzle toward the surface of the substrate while rotating the substrate.

於專利文獻1中揭示有如下的技術:當檢測是否自已被 配置於處理位置的噴嘴中噴出了處理液時,檢測噴嘴是否已被正常地配置於處理位置。 Patent Document 1 discloses the following technology: When detecting whether one has been When the processing liquid is ejected from the nozzle arranged at the processing position, it is detected whether the nozzle is normally arranged at the processing position.

具體而言,事先獲取噴嘴正確地位於處理位置時的基準圖像,將於各處理程式(recipe)中使噴嘴移動至處理位置時的圖像與事先獲取的基準圖像進行比較。記載有當噴嘴自處理位置的偏離超過了規定的臨限值時,判定為位置異常。 Specifically, the reference image when the nozzle is correctly positioned at the processing position is acquired in advance, and the image when the nozzle is moved to the processing position in each processing recipe (recipe) is compared with the reference image acquired in advance. It is stated that when the deviation of the nozzle from the processing position exceeds a predetermined threshold, it is judged as an abnormal position.

[現有技術文獻] [Prior Art Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2015-173148號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2015-173148

但是,於先前技術的情況下,難以判定移動的噴嘴的位置異常。於先前技術的情況下,檢測一個基準圖像與一處的處理位置上的位置異常。有時一面自噴嘴中噴出處理液,一面使噴嘴於基板上移動,藉此對基板的表面進行液體處理。此時,期望一種檢測噴嘴是否正於既定的處理區間內正確地移動的技術。 However, in the case of the prior art, it is difficult to determine that the position of the moving nozzle is abnormal. In the case of the prior art, an abnormal position in a reference image and a processing position is detected. Sometimes, while spraying the treatment liquid from the nozzle, the nozzle is moved on the substrate, thereby performing liquid treatment on the surface of the substrate. At this time, a technique for detecting whether the nozzle is correctly moving within a predetermined processing interval is desired.

但是,若拍攝移動的噴嘴,則於在最初的位置與最後的位置上移動的期間內,於圖像上形狀、大小每時每刻地變化。因此,當將某一特定位置的噴嘴的圖像作為基準圖像,並與拍攝移動的噴嘴所得的圖像進行了匹配時,由於噴嘴的形狀於圖像上變化,因此匹配精度下降。因此,難以高精度地進行位置異常判定。 However, if a moving nozzle is photographed, the shape and size on the image will change every moment during the period of movement between the initial position and the final position. Therefore, when an image of a nozzle at a certain position is used as a reference image and matched with an image obtained by photographing a moving nozzle, the shape of the nozzle changes on the image, so the matching accuracy is reduced. Therefore, it is difficult to perform position abnormality determination with high accuracy.

本發明的目的在於提供一種高精度地檢測移動的噴嘴 的位置偏離的技術。 The object of the present invention is to provide a nozzle that detects movement with high precision The position deviation technology.

為了解決所述課題,第一形態是一種對基板進行處理的基板處理方法,包括:(a)使噴嘴於沿水平方向延伸的既定的處理區間內移動的步驟;(b)拍攝藉由所述步驟(a)而於所述處理區間內移動的所述噴嘴的步驟;(c)將於所述步驟(b)中,所述噴嘴位於作為所述處理區間的兩端的第一端及第二端時所獲得的攝影圖像作為第一基準圖像及第二基準圖像來登記的步驟;(d)使所述噴嘴於所述處理區間內移動的步驟;(e)拍攝藉由所述步驟(d)而於所述處理區間內移動的所述噴嘴的步驟;(f)針對藉由所述步驟(e)所獲得的多個攝影圖像,根據既定的判定規則,判定是否為與所述第一端及所述第二端分別對應的圖像的圖像判定步驟;以及(g)將所述第一基準圖像及所述第二基準圖像、與藉由所述步驟(f)而判定為與所述第一端及所述第二端分別對應的第一實際圖像及第二實際圖像進行比較,並檢測於所述步驟(d)中分別配置於所述處理區間的兩端的所述噴嘴的位置偏離的步驟。 In order to solve the problem, the first aspect is a substrate processing method for processing a substrate, including: (a) a step of moving a nozzle in a predetermined processing interval extending in a horizontal direction; (b) photographing by the Step (a) is the step of moving the nozzle in the treatment section; (c) In the step (b), the nozzle is located at the first end and the second end which are the two ends of the treatment section. The step of registering the photographic image obtained at the end as the first reference image and the second reference image; (d) the step of moving the nozzle in the processing interval; (e) the step of photographing by the Step (d) is the step of moving the nozzle in the processing interval; (f) For the multiple photographic images obtained by the step (e), determine whether the image is the same or not according to a predetermined determination rule The image determination step of the images corresponding to the first end and the second end respectively; and (g) comparing the first reference image and the second reference image with the steps ( f) It is determined that the first actual image and the second actual image respectively corresponding to the first end and the second end are compared, and the detection is respectively configured in the processing in the step (d) The step of deviating the positions of the nozzles at both ends of the interval.

第二形態根據第一形態的基板處理方法,更包括:(h)於所述步驟(c)後,且於所述步驟(d)前,將處理對象的基板保持於基板保持部的步驟。 The second aspect of the substrate processing method according to the first aspect further includes: (h) after the step (c) and before the step (d), the step of holding the substrate to be processed in the substrate holding portion.

第三形態根據第一形態或第二形態的基板處理方法,其中所述步驟(d)包含:(d1)使所述噴嘴自偏向所述第一端的位 置朝所述第二端移動的步驟,且所述步驟(f)包含:(f1)根據連續的攝影圖像間的差值,判定是否為與所述第一端及所述第二端分別對應的圖像的步驟。 The third aspect is the substrate processing method according to the first aspect or the second aspect, wherein the step (d) comprises: (d1) making the nozzle self-biased to the position of the first end The step of moving toward the second end, and the step (f) includes: (f1) determining whether it is different from the first end and the second end according to the difference between consecutive photographed images Corresponding image steps.

第四形態根據第一形態至第三形態的任一形態的基板處理方法,其中所述步驟(c)包含:(c1)登記藉由在所述步驟(b)中拍攝於所述處理區間的中間移動的所述噴嘴所獲得的中間基準圖像的步驟,且所述步驟(g)包含:(g1)根據所述中間基準圖像、與藉由在所述步驟(e)中拍攝於所述處理區間的中間移動的所述噴嘴所獲得的中間實際圖像的比較,檢測於所述步驟(d)中於所述處理區間的中間移動的所述噴嘴的位置偏離的步驟。 The fourth aspect is the substrate processing method according to any one of the first aspect to the third aspect, wherein the step (c) includes: (c1) registering the substrate by photographing in the processing section in the step (b) The step of obtaining an intermediate reference image obtained by the nozzle moving in the middle, and the step (g) includes: (g1) according to the intermediate reference image, and by photographing the intermediate reference image in the step (e) The comparison of the intermediate actual images obtained by the nozzles moving in the middle of the processing section is a step of detecting the positional deviation of the nozzles moving in the middle of the processing section in the step (d).

第五形態根據第四形態的基板處理方法,其中所述步驟(g)包含:(g2)根據所述中間基準圖像與所述中間實際圖像,檢測垂直方向上的所述噴嘴的位置偏離的步驟。 A fifth aspect is the substrate processing method according to the fourth aspect, wherein the step (g) includes: (g2) detecting the positional deviation of the nozzle in the vertical direction based on the intermediate reference image and the intermediate actual image A step of.

第六形態根據第四形態或第五形態的基板處理方法,更包括:(i)根據藉由所述步驟(c1)所登記的多個所述中間基準圖像,生成表示於所述處理區間內移動的所述噴嘴的軌道的基準軌道資訊的步驟,且所述步驟(g)包含:(g3)根據所述中間實際圖像與所述基準軌道資訊,檢測垂直方向上的所述噴嘴的位置偏離的步驟。 A sixth aspect is the substrate processing method according to the fourth aspect or the fifth aspect, further comprising: (i) generating a display in the processing section based on the plurality of intermediate reference images registered in the step (c1) And the step (g) includes: (g3) based on the intermediate actual image and the reference track information, detecting the nozzle in the vertical direction Steps to deviate from position.

第七形態根據第四形態至第六形態的任一形態的基板處理方法,其中所述步驟(c1)包含:(c11)將藉由在所述步驟(b)中拍攝於所述處理區間的中間移動的所述噴嘴所獲得的多個 攝影圖像中的一個作為第一中間基準圖像來登記的步驟;以及(c12)於所述步驟(c11)後,將如下的攝影圖像作為第二中間基準圖像來登記的步驟,所述攝影圖像是所述多個攝影圖像之中緊隨所述第一中間基準圖像之後的圖像,且為與所述第一中間基準圖像的一致度變成規定的臨限值以下的圖像。 The seventh aspect is the substrate processing method according to any one of the fourth aspect to the sixth aspect, wherein the step (c1) includes: (c11) photographing the substrate in the processing section in the step (b) The number of nozzles that move in the middle One of the photographic images is registered as the first intermediate reference image; and (c12) after the step (c11), the following photographic image is registered as the second intermediate reference image, so The photographed image is an image immediately following the first intermediate reference image among the plurality of photographed images, and the degree of coincidence with the first intermediate reference image becomes less than a predetermined threshold value Image.

第八形態根據第一形態至第七形態的任一形態的基板處理方法,其中所述步驟(a)包含:(a1)控制部將使所述噴嘴自所述第一端移動至所述第二端為止的控制訊號發送至噴嘴移動部的步驟,且所述步驟(b)包含:(b1)對應於所述控制訊號的發送來拍攝所述噴嘴,而獲取多個攝影圖像的步驟。 The eighth aspect is the substrate processing method according to any one of the first aspect to the seventh aspect, wherein the step (a) includes: (a1) a control unit moves the nozzle from the first end to the second The step of sending the control signal up to the two ends to the nozzle moving part, and the step (b) includes: (b1) the step of photographing the nozzle corresponding to the sending of the control signal, and acquiring a plurality of photographic images.

第九形態根據第八形態的基板處理方法,其中所述步驟(b)更包含:(b2)將所述控制訊號所示的控制資訊、與藉由對應於所述控制訊號的拍攝所獲取的多個攝影圖像建立對應來記錄的步驟。 The ninth aspect is the substrate processing method according to the eighth aspect, wherein the step (b) further comprises: (b2) comparing the control information indicated by the control signal with the control information obtained by shooting corresponding to the control signal The step of establishing correspondence between multiple photographic images and recording.

第十形態根據第九形態的基板處理方法,其中所述步驟(c)包含:(c2)將藉由所述步驟(b)所獲得的一連串的攝影圖像按獲取順序連續地顯示於顯示部的步驟,且所述步驟(c2)包含:(c21)指定所述控制資訊的步驟;以及(c22)將與藉由所述步驟(c21)所指定的所述控制資訊對應的攝影圖像顯示於所述顯示部的步驟。 A tenth aspect is the substrate processing method according to the ninth aspect, wherein the step (c) includes: (c2) successively displaying a series of photographic images obtained by the step (b) on the display unit in the order of acquisition And the step (c2) includes: (c21) the step of specifying the control information; and (c22) displaying the photographic image corresponding to the control information specified by the step (c21) Steps in the display section.

第十一形態是一種對基板進行處理的基板處理裝置,包括:基板保持部,以水平姿勢保持基板;噴嘴,對已由所述基板 保持部保持的基板供給處理液;噴嘴移動部,使所述噴嘴於沿水平方向延伸的既定的處理區間內移動;相機,藉由拍攝於所述處理區間內移動的所述噴嘴而獲取攝影圖像;基準圖像登記部,登記藉由所述相機拍攝位於作為所述處理區間的兩端的第一端及第二端的所述噴嘴所獲得的第一基準圖像及第二基準圖像;以及位置偏離檢測部,檢測所述第一端及所述第二端處的所述噴嘴的位置偏離;且所述位置偏離檢測部包括:圖像判定部,針對藉由利用所述相機拍攝於所述處理區間內移動的所述噴嘴所獲取的實際圖像,根據既定的判定規則,判定是否為與所述第一端及所述第二端分別對應的圖像;以及圖像比較部,將所述第一基準圖像及所述第二基準圖像、與藉由所述圖像判定部而判定為與所述第一端及所述第二端分別對應的第一實際圖像及第二實際圖像進行比較。 The eleventh aspect is a substrate processing apparatus for processing substrates, including: a substrate holding portion holding the substrate in a horizontal position; The substrate held by the holding portion supplies the processing liquid; the nozzle moving portion moves the nozzle in a predetermined processing section extending in the horizontal direction; and the camera acquires a photographed image by photographing the nozzle moving in the processing section Image; a reference image registration unit that registers a first reference image and a second reference image obtained by the camera capturing the nozzles located at the first end and the second end of the two ends of the processing section; and The positional deviation detection unit detects the positional deviation of the nozzles at the first end and the second end; The actual image acquired by the nozzle moving in the processing interval is determined according to a predetermined determination rule whether it is an image corresponding to the first end and the second end, respectively; and an image comparison unit, The first reference image and the second reference image, and the first actual image and the first actual image determined by the image determining unit to correspond to the first end and the second end, respectively Two actual images are compared.

第十二形態根據第十一形態的基板處理裝置,其中所述圖像判定部包含:特徵向量算出部,自所述多個攝影圖像的各個,提取多種特徵向量;以及分類器,對應於所述多種特徵向量,將所述多個攝影圖像的各個分類成與所述噴嘴的不同的位置對應的等級;且所述多個等級包含與所述第一端及所述第二端分別對應的等級。 A twelfth aspect is the substrate processing apparatus according to the eleventh aspect, wherein the image determination unit includes: a feature vector calculation unit that extracts a plurality of feature vectors from each of the plurality of photographed images; and a classifier corresponding to The plurality of feature vectors classify each of the plurality of photographed images into levels corresponding to different positions of the nozzles; and the plurality of levels include the first end and the second end respectively The corresponding level.

第十三形態是一種基板處理系統,包括對基板進行處理的基板處理裝置、及與所述基板處理裝置進行資料通訊的伺服器,所述基板處理裝置包括:基板保持部,以水平姿勢保持基板; 噴嘴,對已由所述基板保持部保持的基板供給處理液;噴嘴移動部,使所述噴嘴於沿水平方向延伸的既定的處理區間內移動;相機,藉由拍攝於所述處理區間內移動的所述噴嘴而獲取攝影圖像;基準圖像登記部,登記藉由所述相機拍攝位於作為所述處理區間的兩端的第一端及第二端的所述噴嘴所獲得的第一基準圖像及第二基準圖像;位置偏離檢測部,檢測所述第一端及所述第二端處的所述噴嘴的位置偏離;以及通訊部,與所述伺服器進行資料通訊;所述位置偏離檢測部包括:圖像判定部,針對藉由利用所述相機拍攝於所述處理區間內移動的所述噴嘴所獲取的實際圖像,根據既定的判定規則,判定是否為與所述第一端及所述第二端分別對應的圖像;以及圖像比較部,將所述第一基準圖像及所述第二基準圖像、與藉由所述圖像判定部而判定為與所述第一端及所述第二端分別對應的第一實際圖像及第二實際圖像進行比較;且所述圖像判定部包含:特徵向量算出部,自所述攝影圖像中提取多種特徵向量;以及分類器,根據所述多種特徵向量,將所述多個攝影圖像分類成與所述噴嘴的不同的位置對應的多個等級(class);所述多個等級包含與所述第一端及所述第二端分別對應的圖像的等級,所述伺服器包括機器學習部,所述機器學習部藉由將已被指教所述多個等級的任一個的所述多個攝影圖像作為教學資料的機器學習來生成所述分類器,且自所述伺服器對所述基板處理裝置提供所述分類器。 A thirteenth aspect is a substrate processing system, including a substrate processing apparatus for processing a substrate, and a server for data communication with the substrate processing apparatus, the substrate processing apparatus including: a substrate holding portion that holds the substrate in a horizontal posture ; The nozzle supplies the processing liquid to the substrate held by the substrate holding section; the nozzle moving section moves the nozzle in a predetermined processing section extending in the horizontal direction; the camera moves in the processing section by shooting The nozzle to obtain a photographic image; a reference image registration unit that registers the first reference image obtained by the camera photographing the nozzles located at the first end and the second end of the two ends of the processing section And a second reference image; a positional deviation detection unit that detects the positional deviation of the nozzles at the first end and the second end; and a communication unit that performs data communication with the server; the positional deviation The detection unit includes: an image determination unit that determines whether the actual image acquired by the nozzle moving in the processing interval by using the camera to determine whether it is the same as the first end And the images corresponding to the second end respectively; and an image comparison unit that determines the first reference image and the second reference image, and the image determination unit to determine the The first actual image and the second actual image respectively corresponding to the first end and the second end are compared; and the image determination unit includes: a feature vector calculation unit that extracts multiple features from the photographic image Vector; and a classifier for classifying the plurality of photographic images into a plurality of classes corresponding to different positions of the nozzle based on the plurality of feature vectors; the plurality of classes include the first One end and the second end respectively correspond to the level of the image, the server includes a machine learning unit, and the machine learning unit uses the plurality of images that have been taught to any one of the plurality of levels The image is used as a teaching material for machine learning to generate the classifier, and the classifier is provided to the substrate processing apparatus from the server.

根據第一形態的基板處理方法,可檢測處理區間內的噴嘴的移動範圍的偏離。 According to the substrate processing method of the first aspect, the deviation of the movement range of the nozzle in the processing section can be detected.

根據第二形態的基板處理方法,當對基板進行處理時,可檢測噴嘴的移動範圍的偏離。 According to the substrate processing method of the second aspect, when the substrate is processed, the deviation of the movement range of the nozzle can be detected.

根據第三形態的基板處理方法,藉由取得連續的攝影圖像間的差值,可檢測到噴嘴停止於處理區間的第一端及第二端。 According to the substrate processing method of the third aspect, by obtaining the difference between consecutive photographed images, it can be detected that the nozzle stops at the first end and the second end of the processing section.

藉此,可容易地確定與處理區間的第一端及第二端對應的實際圖像。 Thereby, the actual images corresponding to the first end and the second end of the processing interval can be easily determined.

根據第四形態的基板處理方法,可檢測於處理區間的中間移動的噴嘴的位置偏離。 According to the substrate processing method of the fourth aspect, the positional deviation of the nozzle moving in the middle of the processing section can be detected.

根據第五形態的基板處理方法,可檢測垂直方向的位置偏離。 According to the substrate processing method of the fifth aspect, the positional deviation in the vertical direction can be detected.

根據第六形態的基板處理方法,可根據基準軌道資訊來檢測噴嘴的垂直方向的位置偏離。 According to the substrate processing method of the sixth aspect, the positional deviation of the nozzle in the vertical direction can be detected based on the reference track information.

根據第七形態的基板處理方法,可自動地登記中間基準圖像。因此,可高效率地登記多個基準圖像。 According to the substrate processing method of the seventh aspect, the intermediate reference image can be automatically registered. Therefore, a plurality of reference images can be registered efficiently.

根據第八形態的基板處理方法,對應於使噴嘴移動的控制訊號來進行噴嘴的拍攝。因此,可自動地獲取表示移動的噴嘴的基準位置的基準圖像。 According to the substrate processing method of the eighth aspect, the nozzle is photographed in response to the control signal for moving the nozzle. Therefore, the reference image indicating the reference position of the moving nozzle can be automatically acquired.

根據第九形態的基板處理方法,藉由指定控制資訊,可容易地找出目標攝影圖像。 According to the substrate processing method of the ninth aspect, the target photographic image can be easily found by specifying the control information.

根據第十形態的基板處理方法,當存在多個控制訊號、 及與各控制訊號對應的一連串的基準圖像時,藉由指定控制資訊,可將目標攝影圖像顯示於顯示部。藉此,操作者可自多個攝影圖像中,有效率地指定應進行登記的基準圖像。 According to the substrate processing method of the tenth aspect, when there are multiple control signals, In the case of a series of reference images corresponding to each control signal, the target photographic image can be displayed on the display unit by specifying the control information. This allows the operator to efficiently designate the reference image to be registered from among the multiple captured images.

根據第十一形態的基板處理裝置,可檢測處理區間內的噴嘴的移動範圍的偏離。 According to the substrate processing apparatus of the eleventh aspect, the deviation of the movement range of the nozzle in the processing section can be detected.

根據第十二形態的基板處理裝置,可藉由分類器來確定與處理區間PS1的第一端及第二端分別對應的實際圖像。 According to the substrate processing apparatus of the twelfth aspect, the actual image corresponding to the first end and the second end of the processing section PS1 can be determined by the classifier.

根據第十三形態的基板處理系統,可檢測處理區間內的噴嘴的移動範圍的偏離。另外,可藉由自伺服器所提供的分類器來確定與處理區間PS1的第一端及第二端分別對應的實際圖像。 According to the substrate processing system of the thirteenth aspect, the deviation of the movement range of the nozzle in the processing section can be detected. In addition, the actual image corresponding to the first end and the second end of the processing interval PS1 can be determined by the classifier provided by the server.

1:清洗處理單元 1: Cleaning processing unit

8:伺服器 8: server

9、9A:控制部 9, 9A: Control Department

10:腔室 10: Chamber

11:側壁 11: side wall

12:頂壁 12: top wall

13:底壁 13: bottom wall

14:風扇過濾單元 14: Fan filter unit

15:分隔板 15: divider

18:排氣管 18: Exhaust pipe

20:旋轉夾頭 20: Rotating chuck

21:旋轉底座 21: Rotating base

21a:保持面 21a: Keep the face

22:旋轉馬達 22: Rotating motor

23:遮蓋構件 23: Covering member

24:旋轉軸 24: Rotation axis

25:凸緣狀構件 25: Flanged member

26:夾頭銷 26: Chuck pin

28:下表面處理液噴嘴 28: Lower surface treatment liquid nozzle

30、60、65:噴嘴 30, 60, 65: nozzle

31:噴出頭 31: ejection head

32、62、67:噴嘴臂 32, 62, 67: nozzle arm

33、63、68:噴嘴基座 33, 63, 68: nozzle base

40:處理杯 40: Treatment cup

41:內杯 41: inner cup

42:中杯 42: Middle Cup

43:外杯 43: Outer Cup

43a、52a:下端部 43a, 52a: lower end

43b、47b、52b:上端部 43b, 47b, 52b: upper end

43c、52c:翻折部 43c, 52c: Folding part

44:底部 44: bottom

45:內壁部 45: inner wall

46:外壁部 46: Outer wall

47:第一引導部 47: The first guide

48:中壁部 48: middle wall

49:廢棄槽 49: Abandoned Slot

50:內側回收槽 50: Inside recovery slot

51:外側回收槽 51: Outer recovery slot

52:第二引導部 52: The second guide

53:處理液分離壁 53: Treatment liquid separation wall

70:相機 70: Camera

71:照明部 71: Lighting Department

82:機器學習部 82: Machine Learning Department

90:基準圖像登記部 90: Reference image registration department

91、91A:位置偏離檢測部 91, 91A: Position deviation detection unit

92:指令發送部 92: Command sending department

94:記憶部 94: Memory Department

95:顯示部 95: Display

96:輸入部 96: Input section

97:通訊部 97: Ministry of Communications

100:基板處理裝置 100: Substrate processing device

102:分度器 102: Indexer

103:主搬送機器人 103: Main transport robot

332:馬達 332: Motor

910、910A:圖像判定部 910, 910A: Image judging section

912:圖像比較部 912: Image Comparison Department

9102:特徵向量算出部 9102: Feature vector calculation section

AR34、AR64、AR69:箭頭 AR34, AR64, AR69: Arrow

BT2:跳過按鈕 BT2: skip button

BT4:登記決定按鈕 BT4: Registration decision button

C1~C4:指令(控制資訊) C1~C4: Command (control information)

CX:旋轉軸線 CX: axis of rotation

GP:實際圖像 GP: Actual image

K2:分類器 K2: classifier

NN1:神經網路 NN1: Neural Network

PA:拍攝區域 PA: shooting area

PS1:處理區間 PS1: Processing interval

RP:基準圖像 RP: reference image

RP1:第一基準圖像 RP1: First reference image

RP2:第二基準圖像 RP2: Second reference image

RPM:中間基準圖像 RPM: Intermediate reference image

RPM1:第一中間基準圖像 RPM1: The first intermediate reference image

RPM2:第二中間基準圖像 RPM2: The second intermediate reference image

ST1:基準軌道資訊 ST1: Reference track information

TE1:第一端 TE1: first end

TE2:第二端 TE2: second end

W:基板 W: substrate

W1:登記畫面 W1: Registration screen

WR2:圖像顯示區域 WR2: Image display area

WR4:噴嘴/位置選擇區域 WR4: Nozzle/position selection area

WR6:顯示控制區域 WR6: Display control area

S11~S15、S21~S25:步驟 S11~S15, S21~S25: steps

圖1是表示第一實施方式的基板處理裝置100的整體構成的圖。 FIG. 1 is a diagram showing the overall configuration of a substrate processing apparatus 100 according to the first embodiment.

圖2是第一實施方式的清洗處理單元1的平面圖。 Fig. 2 is a plan view of the cleaning treatment unit 1 of the first embodiment.

圖3是第一實施方式的清洗處理單元1的縱剖面圖。 Fig. 3 is a longitudinal sectional view of the cleaning treatment unit 1 of the first embodiment.

圖4是表示相機70與噴嘴30的位置關係的圖。 FIG. 4 is a diagram showing the positional relationship between the camera 70 and the nozzle 30.

圖5是相機70及控制部9的方塊圖。 FIG. 5 is a block diagram of the camera 70 and the control unit 9.

圖6是表示用於由位置偏離檢測部91所進行的檢測處理的事前準備的程序的流程圖。 FIG. 6 is a flowchart showing a procedure for preliminarily preparing for the detection process performed by the positional deviation detection unit 91.

圖7是表示由位置偏離檢測部91所進行的檢測處理的程序的流程圖。 FIG. 7 is a flowchart showing the procedure of the detection process performed by the positional deviation detection unit 91.

圖8是表示相機70拍攝包含處理區間PS1內的噴嘴30的前端的拍攝區域PA所獲得的圖像的一例的圖。 FIG. 8 is a diagram showing an example of an image obtained by the camera 70 capturing the imaging area PA including the tip of the nozzle 30 in the processing section PS1.

圖9是概念性地表示基準圖像RP的登記處理的圖。 FIG. 9 is a diagram conceptually showing the registration process of the reference image RP.

圖10是概念性地表示確定與基準圖像RP對應的實際圖像GP的情況的圖。 FIG. 10 is a diagram conceptually showing how the actual image GP corresponding to the reference image RP is determined.

圖11是概念性地表示基準軌道資訊ST1的圖。 FIG. 11 is a diagram conceptually showing the reference track information ST1.

圖12是表示連續拍攝噴嘴30的情況的時序圖。 FIG. 12 is a timing chart showing a case where the nozzle 30 is continuously photographed.

圖13是表示用於進行基準圖像RP的登記的登記畫面W1的圖。 FIG. 13 is a diagram showing a registration screen W1 for performing registration of the reference image RP.

圖14是表示第二實施方式的控制部9A的圖。 FIG. 14 is a diagram showing the control unit 9A of the second embodiment.

圖15是概念性地表示分類器K2的圖。 Fig. 15 is a diagram conceptually showing the classifier K2.

以下,一面參照隨附的圖式,一面對本發明的實施方式進行說明。再者,該實施方式中記載的構成元件只是例示,並非將本發明的範圍僅限定於該些構成元件的意思。於圖式中,為了容易理解,有時視需要將各部的尺寸或數量誇張或簡化來圖示。 Hereinafter, the embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the constituent elements described in this embodiment are merely examples, and do not mean that the scope of the present invention is limited to only these constituent elements. In the drawings, for ease of understanding, the size or number of each part may be exaggerated or simplified as necessary.

只要事先無特別說明,則表示相等的狀態的表達(例如「相同」、「相等」、「均質」等)不僅定量地表示嚴格相等的狀態,亦表示存在公差或可獲得相同程度的功能的差的狀態。另外,只要事先無特別說明,則「~之上」除兩個元件接觸的情況以外,亦包含兩個元件分離的情況。 As long as there is no special explanation in advance, the expressions that indicate the state of equality (such as "same", "equal", "homogeneous", etc.) not only quantitatively indicate the state of strict equality, but also indicate that there is a tolerance or a difference in the same degree of function status. In addition, as long as there is no special description in advance, "~above" includes the case where two elements are separated in addition to the case where two elements are in contact.

<1.第一實施方式> <1. The first embodiment>

圖1是表示第一實施方式的基板處理裝置100的整體構成的圖。基板處理裝置100是對作為處理對象的基板W一片一片地進行處理的葉片式的處理裝置。此處,基板處理裝置100使用藥液(chemical solution)及純水等淋洗(rinse)液對圓形薄板狀的作為矽基板的基板W進行清洗處理後,進行乾燥處理。作為藥液,例如可使用:SC1(ammonia-hydrogen peroxide mixture:氨-過氧化氫水混合液)、SC2(hydrochloric hydrogen peroxide mixed water solution:鹽酸-過氧化氫水混合水溶液)、稀氫氟酸溶液(Diluted Hydrofluoric Acid solution,DHF solution)等。於以下的說明中,所謂處理液,將藥液與淋洗液總稱為「處理液」。再者,不僅用於清洗處理,而且用於成膜處理的光阻液等塗佈液、用於去除不需要的膜的藥液、用於蝕刻的藥液等也包含於「處理液」中。 FIG. 1 is a diagram showing the overall configuration of a substrate processing apparatus 100 according to the first embodiment. The substrate processing apparatus 100 is a blade-type processing apparatus that processes a substrate W as a processing target one by one. Here, the substrate processing apparatus 100 uses a rinse solution such as a chemical solution and pure water to clean a circular thin plate-shaped substrate W as a silicon substrate, and then perform a drying process. As the chemical solution, for example, SC1 (ammonia-hydrogen peroxide mixture: ammonia-hydrogen peroxide mixture), SC2 (hydrochloric hydrogen peroxide mixed water solution: hydrochloric hydrogen peroxide mixed water solution), dilute hydrofluoric acid solution can be used. (Diluted Hydrofluoric Acid solution, DHF solution) and so on. In the following description, the so-called treatment liquid is collectively referred to as the "treatment liquid" with the chemical liquid and the eluent. In addition, not only for cleaning, but also coating liquids such as photoresist liquids used for film formation processing, chemical liquids used to remove unnecessary films, chemical liquids used for etching, etc. are also included in the "treatment liquid" .

基板處理裝置100包括:多個清洗處理單元1、分度器(indexer)102及主搬送機器人103。 The substrate processing apparatus 100 includes a plurality of cleaning processing units 1, an indexer 102, and a main transport robot 103.

分度器102將已自裝置外接收的處理對象的基板W搬送至裝置內,並且將清洗處理已完成的處理完的基板W朝裝置外搬出。分度器102載置多個載體(carrier)(省略圖示),並且包括移送機器人(transfer robot)(省略圖示)。作為載體,亦可採用將基板W收納於密閉空間的前開式晶圓傳送盒(Front Opening Unified Pod,FOUP)或標準機械介面(Standard Mechanical InterFace,SMIF)盒、或者使基板W暴露於外部空氣中的開放式卡匣(Open Cassette,OC)。移送機器人在載體與主搬送機器人 103之間移送基板W。 The indexer 102 transports the substrate W to be processed that has been received from outside the apparatus into the apparatus, and transports the processed substrate W whose cleaning process has been completed to the outside of the apparatus. The indexer 102 mounts a plurality of carriers (not shown), and includes a transfer robot (not shown). As the carrier, a Front Opening Unified Pod (FOUP) or Standard Mechanical InterFace (SMIF) box that stores the substrate W in a closed space may also be used, or the substrate W may be exposed to the outside air. Open Cassette (OC). The transfer robot is on the carrier and the main transfer robot The substrate W is transferred between 103.

清洗處理單元1對一片基板W進行液體處理及乾燥處理。於基板處理裝置100配置有十二個清洗處理單元1。具體而言,分別包含於垂直方向上積層的三個清洗處理單元1的四個塔以包圍主搬送機器人103的周圍的方式配置。於圖1中,概略性地表示重疊成三段的清洗處理單元1的一個。再者,基板處理裝置100的清洗處理單元1的數量並不限定於十二個,亦可適宜變更。 The cleaning processing unit 1 performs liquid processing and drying processing on one substrate W. Twelve cleaning processing units 1 are arranged in the substrate processing apparatus 100. Specifically, the four towers each including the three washing treatment units 1 stacked in the vertical direction are arranged so as to surround the periphery of the main transport robot 103. In FIG. 1, one of the cleaning treatment units 1 overlapped in three stages is schematically shown. In addition, the number of cleaning processing units 1 of the substrate processing apparatus 100 is not limited to twelve, and can be changed as appropriate.

主搬送機器人103設置於將清洗處理單元1積層而成的四個塔的中央。主搬送機器人103將已自分度器102接收的處理對象的基板W搬入各清洗處理單元1。另外,主搬送機器人103自各清洗處理單元1搬出處理完的基板W並交給分度器102。 The main transport robot 103 is installed in the center of four towers formed by stacking the cleaning processing units 1. The main transport robot 103 transports the substrate W of the processing target received from the indexer 102 into each cleaning processing unit 1. In addition, the main transport robot 103 unloads the processed substrate W from each cleaning processing unit 1 and passes it to the indexer 102.

以下,對搭載於基板處理裝置100的十二個清洗處理單元1中的一個進行說明,關於其他清洗處理單元1,除噴嘴30、噴嘴60、噴嘴65的配置關係不同以外,亦具有相同的構成。圖2是第一實施方式的清洗處理單元1的平面圖。圖3是第一實施方式的清洗處理單元1的縱剖面圖。圖2表示基板W未保持於旋轉夾頭20的狀態,圖3表示基板W保持於旋轉夾頭(spin chuck)20的狀態。 Hereinafter, one of the twelve cleaning processing units 1 mounted in the substrate processing apparatus 100 will be described. The other cleaning processing units 1 have the same configuration except for the different arrangement relationships of the nozzles 30, 60, and 65. . Fig. 2 is a plan view of the cleaning treatment unit 1 of the first embodiment. Fig. 3 is a longitudinal sectional view of the cleaning treatment unit 1 of the first embodiment. FIG. 2 shows a state where the substrate W is not held by the spin chuck 20, and FIG. 3 shows a state where the substrate W is held by the spin chuck 20.

清洗處理單元1於腔室10內包括:旋轉夾頭20,將基板W保持成水平姿勢(基板W的表面的法線沿著垂直方向的姿勢);三個噴嘴30、60、65,用於朝已由旋轉夾頭20保持的基板 W的上表面供給處理液;處理杯40,包圍旋轉夾頭20的周圍;以及相機70,拍攝旋轉夾頭20的上方空間。另外,於腔室10內的處理杯40的周圍,設置有將腔室10的內側空間上下分隔的分隔板15。 The cleaning processing unit 1 in the chamber 10 includes: a rotating chuck 20 to hold the substrate W in a horizontal posture (posture where the normal to the surface of the substrate W is along the vertical direction); three nozzles 30, 60, 65 for Toward the substrate that has been held by the rotating chuck 20 The upper surface of W is supplied with processing liquid; the processing cup 40 surrounds the periphery of the rotating chuck 20; and the camera 70 photographs the space above the rotating chuck 20. In addition, a partition plate 15 that partitions the inner space of the chamber 10 up and down is provided around the processing cup 40 in the chamber 10.

腔室10包括:沿著垂直方向並包圍四周的側壁11、堵塞側壁11的上側的頂壁12、以及堵塞側壁11的下側的底壁13。由側壁11、頂壁12及底壁13圍成的空間成為基板W的處理空間。另外,於腔室10的側壁11的一部分,設置有用於主搬送機器人103對腔室10搬入/搬出基板W的搬入/搬出口、及使所述搬入/搬出口開閉的閘門(均省略圖示)。 The chamber 10 includes a side wall 11 that surrounds the periphery along the vertical direction, a top wall 12 that blocks the upper side of the side wall 11, and a bottom wall 13 that blocks the lower side of the side wall 11. The space enclosed by the side wall 11, the top wall 12, and the bottom wall 13 becomes a processing space of the substrate W. In addition, a part of the side wall 11 of the chamber 10 is provided with a loading/unloading port for the main transfer robot 103 to load/unload the substrate W into and out of the chamber 10, and a gate for opening and closing the loading/unloading port (all omitted from the figure). ).

於腔室10的頂壁12安裝有風扇過濾單元(Fan Filter Unit,FFU)14,所述風扇過濾單元14用於將設置有基板處理裝置100的無塵室內的空氣進一步清潔化後供給至腔室10內的處理空間。FFU 14包括用於取入無塵室內的空氣並送出至腔室10內的風扇及過濾器(例如高效率空氣微粒(High Efficiency Particulate Air,HEPA)過濾器)。FFU 14於腔室10內的處理空間形成清潔空氣的降流。為了使自FFU 14所供給的清潔空氣均勻地分散,亦可於頂壁12的正下方設置穿設多個吹出孔的沖孔板。 A fan filter unit (FFU) 14 is installed on the top wall 12 of the chamber 10, and the fan filter unit 14 is used to further clean the air in the clean room where the substrate processing apparatus 100 is installed and supply it to the chamber. The processing space in the chamber 10. The FFU 14 includes a fan and a filter (for example, a High Efficiency Particulate Air (HEPA) filter) for taking in the air in the clean room and sending it out to the chamber 10. The FFU 14 forms a downflow of clean air in the processing space in the chamber 10. In order to uniformly disperse the clean air supplied from the FFU 14, a punching plate with a plurality of blowing holes may also be provided directly under the top wall 12.

旋轉夾頭20包括:旋轉底座21、旋轉馬達22、遮蓋構件23及旋轉軸24。旋轉底座21具有圓板形狀,且以水平姿勢固定於沿著垂直方向延伸的旋轉軸24的上端。旋轉馬達22設置於旋轉底座21的下方,且使旋轉軸24旋轉。旋轉馬達22經由旋轉 軸24而使旋轉底座21於水平面內旋轉。遮蓋構件23具有包圍旋轉馬達22及旋轉軸24的周圍的筒狀。 The rotating chuck 20 includes a rotating base 21, a rotating motor 22, a covering member 23 and a rotating shaft 24. The rotating base 21 has a circular plate shape, and is fixed to the upper end of the rotating shaft 24 extending in the vertical direction in a horizontal posture. The rotating motor 22 is provided below the rotating base 21 and rotates the rotating shaft 24. The rotating motor 22 rotates The shaft 24 causes the rotating base 21 to rotate in a horizontal plane. The covering member 23 has a cylindrical shape surrounding the rotation motor 22 and the rotation shaft 24.

圓板形狀的旋轉底座21的外徑較由旋轉夾頭20保持的圓形的基板W的直徑略大。因此,旋轉底座21具有與應保持的基板W的下表面的整個面相向的保持面21a。 The outer diameter of the disk-shaped rotating base 21 is slightly larger than the diameter of the circular substrate W held by the rotating chuck 20. Therefore, the rotating base 21 has a holding surface 21a facing the entire surface of the lower surface of the substrate W to be held.

於旋轉底座21的保持面21a的周緣部立設有多個(本實施方式中為四根)夾頭銷26。多個夾頭銷26沿著與圓形的基板W的外周圓的外徑對應的圓周上空開均等的間隔來配置。於本實施方式中,四個夾頭銷26以90°間隔來設置。藉由已被收容於旋轉底座21內的省略圖示的連桿機構來聯動地驅動多個夾頭銷26。旋轉夾頭20使多個夾頭銷26的各個抵接於基板W的外周端來握持基板W,藉此於旋轉底座21的上方以接近保持面21a的水平姿勢保持該基板W(參照圖3)。另外,旋轉夾頭20使多個夾頭銷26的各個自基板W的外周端分離,藉此解除基板W的握持。 A plurality of (four in this embodiment) chuck pins 26 are erected on the peripheral edge of the holding surface 21 a of the rotating base 21. The plurality of chuck pins 26 are arranged at equal intervals along the circumference corresponding to the outer diameter of the outer circumference of the circular substrate W. In this embodiment, the four collet pins 26 are arranged at 90° intervals. A plurality of chuck pins 26 are driven in linkage by a link mechanism (not shown) that has been housed in the rotating base 21. The rotating chuck 20 makes each of the plurality of chuck pins 26 abut on the outer peripheral end of the substrate W to hold the substrate W, thereby holding the substrate W in a horizontal posture close to the holding surface 21a above the rotating base 21 (refer to FIG. 3). In addition, the rotating chuck 20 separates each of the plurality of chuck pins 26 from the outer peripheral end of the substrate W, thereby releasing the holding of the substrate W.

覆蓋旋轉馬達22的遮蓋構件23的下端固定於腔室10的底壁13,上端到達旋轉底座21的正下方為止。於遮蓋構件23的上端部設置有凸緣狀構件25,所述凸緣狀構件25自遮蓋構件23朝外側大致水平地突出,進而朝下方彎曲並延伸。於旋轉夾頭20藉由利用多個夾頭銷26的握持來保持基板W的狀態下,旋轉馬達22使旋轉軸24旋轉,藉此可使基板W環繞穿過基板W的中心的沿著垂直方向的旋轉軸線CX進行旋轉。再者,旋轉馬達22的驅動由控制部9來控制。 The lower end of the cover member 23 covering the rotating motor 22 is fixed to the bottom wall 13 of the chamber 10, and the upper end reaches just below the rotating base 21. A flange-like member 25 is provided at the upper end of the covering member 23, and the flange-like member 25 protrudes substantially horizontally outward from the covering member 23, and then bends and extends downward. In the state in which the rotary chuck 20 holds the substrate W by holding the plurality of chuck pins 26, the rotary motor 22 rotates the rotation shaft 24, thereby allowing the substrate W to wrap around the center of the substrate W. The rotation axis CX in the vertical direction rotates. In addition, the driving of the rotation motor 22 is controlled by the control unit 9.

噴嘴30是於噴嘴臂32的前端安裝噴出頭31來構成。 噴嘴臂32的基端側固定並連結於噴嘴基座33。可藉由設置於噴嘴基座33的馬達332(噴嘴移動部),環繞沿著垂直方向的軸進行轉動。 The nozzle 30 is configured by attaching the ejection head 31 to the tip of the nozzle arm 32. The base end side of the nozzle arm 32 is fixed and connected to the nozzle base 33. The motor 332 (nozzle moving part) provided in the nozzle base 33 can be rotated around an axis along the vertical direction.

藉由噴嘴基座33進行轉動,如由圖2中的箭頭AR34所示,噴嘴30在旋轉夾頭20的上方的位置與較處理杯40更外側的待機位置之間,沿著水平方向呈圓弧狀地移動。藉由噴嘴基座33的轉動,噴嘴30於旋轉底座21的保持面21a的上方搖動。詳細而言,於較旋轉底座21更上方,於沿水平方向延伸的既定的處理區間PS1內移動。再者,使噴嘴30於處理區間PS1內移動與使前端的噴出頭31於處理區間PS1內移動的意思相同。 As the nozzle base 33 rotates, as shown by the arrow AR34 in FIG. 2, the nozzle 30 forms a circle in the horizontal direction between the position above the rotating chuck 20 and the standby position outside the processing cup 40 Move in an arc. Due to the rotation of the nozzle base 33, the nozzle 30 swings above the holding surface 21 a of the rotating base 21. In detail, it moves above the rotating base 21 in a predetermined processing section PS1 extending in the horizontal direction. In addition, moving the nozzle 30 in the processing section PS1 has the same meaning as moving the tip ejection head 31 in the processing section PS1.

於噴嘴30,以被供給多種處理液(至少包含純水)的方式構成,可自噴出頭31噴出多種處理液。再者,亦可於噴嘴30的前端設置多個噴出頭31,並自各噴出頭31個別地噴出相同或不同的處理液。噴嘴30(詳細而言,噴出頭31)一面於呈圓弧狀沿水平方向延伸的處理區間PS1內移動,一面噴出處理液。已被自噴嘴30噴出的處理液滴落於已由旋轉夾頭20保持的基板W的上表面。 The nozzle 30 is configured to be supplied with a plurality of processing liquids (including at least pure water), and a plurality of processing liquids can be ejected from the ejection head 31. Furthermore, a plurality of ejection heads 31 may be provided at the tip of the nozzle 30, and the same or different processing liquids may be ejected from each ejection head 31 individually. The nozzle 30 (specifically, the ejection head 31) ejects the processing liquid while moving in the processing section PS1 extending in the horizontal direction in an arc shape. The processing liquid that has been ejected from the nozzle 30 drops on the upper surface of the substrate W that has been held by the spin chuck 20.

於本實施方式的清洗處理單元1,除所述噴嘴30以外,進而設置有兩個噴嘴60、65。本實施方式的噴嘴60、噴嘴65包括與所述噴嘴30相同的構成。即,噴嘴60是於噴嘴臂62的前端安裝噴出頭來構成,藉由連結於噴嘴臂62的基端側的噴嘴基座 63,如由箭頭AR64所示,在旋轉夾頭20的上方的處理位置與較處理杯40更外側的待機位置之間呈圓弧狀地移動。同樣地,噴嘴65是於噴嘴臂67的前端安裝噴出頭來構成,藉由連結於噴嘴臂67的基端側的噴嘴基座68,如由箭頭AR69所示,在旋轉夾頭20的上方的處理位置與較處理杯40更外側的待機位置之間呈圓弧狀地移動。 In the cleaning processing unit 1 of this embodiment, in addition to the nozzle 30, two nozzles 60 and 65 are further provided. The nozzle 60 and the nozzle 65 of the present embodiment have the same configuration as the nozzle 30 described above. That is, the nozzle 60 is constructed by attaching the ejection head to the tip end of the nozzle arm 62, and the nozzle base is connected to the base end side of the nozzle arm 62. 63, as indicated by the arrow AR64, it moves in an arc shape between a processing position above the rotating chuck 20 and a standby position outside the processing cup 40. Similarly, the nozzle 65 is constructed by attaching an ejection head to the tip of the nozzle arm 67. The nozzle base 68 connected to the base end of the nozzle arm 67 is located above the rotating chuck 20 as indicated by the arrow AR69. The processing position and the waiting position outside the processing cup 40 move in an arc shape.

於噴嘴60、噴嘴65,亦以被供給至少包含純水的多種處理液的方式構成,於處理位置朝已由旋轉夾頭20保持的基板W的上表面噴出處理液。再者,噴嘴60、噴嘴65的至少一者亦可為二流體噴嘴,所述二流體噴嘴將純水等清洗液與經加壓的氣體混合來生成液滴,並將所述液滴與氣體的混合流體噴射至基板W。另外,設置於清洗處理單元1的噴嘴數並不限定於三根,只要是一根以上即可。 The nozzle 60 and the nozzle 65 are also configured to be supplied with a plurality of processing liquids containing at least pure water, and the processing liquid is sprayed toward the upper surface of the substrate W held by the spin chuck 20 at the processing position. Furthermore, at least one of the nozzle 60 and the nozzle 65 may also be a two-fluid nozzle that mixes a cleaning liquid such as pure water with a pressurized gas to generate liquid droplets, and combines the liquid droplets with the gas The mixed fluid is sprayed to the substrate W. In addition, the number of nozzles provided in the cleaning processing unit 1 is not limited to three, and it may be one or more.

無需使噴嘴30、噴嘴60、噴嘴65分別呈圓弧狀地移動。例如,亦可設置直道驅動部,藉此使噴嘴進行直線移動。 There is no need to move the nozzle 30, the nozzle 60, and the nozzle 65 in an arc shape, respectively. For example, it is also possible to provide a straight drive section to move the nozzle linearly.

以插通旋轉軸24的內側的方式,沿著垂直方向設置有下表面處理液噴嘴28。下表面處理液噴嘴28的上端開口形成於與已由旋轉夾頭20保持的基板W的下表面中央相向的位置。於下表面處理液噴嘴28,亦以被供給多種處理液的方式構成。已被自下表面處理液噴嘴28噴出的處理液滴落於已由旋轉夾頭20保持的基板W的下表面。 The lower surface treatment liquid nozzle 28 is provided along the vertical direction so as to penetrate the inner side of the rotating shaft 24. The upper end opening of the lower surface treatment liquid nozzle 28 is formed at a position facing the center of the lower surface of the substrate W held by the spin chuck 20. The lower surface treatment liquid nozzle 28 is also configured to be supplied with various treatment liquids. The treatment liquid droplets that have been ejected from the lower surface treatment liquid nozzle 28 land on the lower surface of the substrate W that has been held by the spin chuck 20.

包圍旋轉夾頭20的處理杯40包括可相互獨立地升降的 內杯41、中杯42及外杯43。內杯41包圍旋轉夾頭20的周圍,具有相對於穿過已由旋轉夾頭20保持的基板W的中心的旋轉軸線CX大致變成旋轉對稱的形狀。該內杯41一體地包括:俯視下為圓環狀的底部44;圓筒狀的內壁部45,自底部44的內周緣朝上方立起;圓筒狀的外壁部46,自底部44的外周緣朝上方立起;第一引導部47,自內壁部45與外壁部46之間立起,上端部畫出平滑的圓弧且朝中心側(靠近由旋轉夾頭20保持的基板W的旋轉軸線CX的方向)斜上方延伸;以及圓筒狀的中壁部48,自第一引導部47與外壁部46之間朝上方立起。 The processing cup 40 surrounding the rotating chuck 20 includes a Inner cup 41, middle cup 42, and outer cup 43. The inner cup 41 surrounds the rotation chuck 20 and has a shape that becomes substantially rotationally symmetrical with respect to the rotation axis CX passing through the center of the substrate W that has been held by the rotation chuck 20. The inner cup 41 integrally includes: a bottom 44 that is annular in plan view; a cylindrical inner wall 45 that rises upward from the inner periphery of the bottom 44; and a cylindrical outer wall 46 that extends from the bottom 44 The outer peripheral edge rises upward; the first guide portion 47 rises from the inner wall portion 45 and the outer wall portion 46, and the upper end draws a smooth arc and faces the center side (close to the substrate W held by the rotating chuck 20). The direction of the rotation axis CX) extends obliquely upward; and the cylindrical middle wall portion 48 rises upward from between the first guide portion 47 and the outer wall portion 46.

內壁部45形成為如下的長度:於內杯41最上升的狀態下,保持適當的間隙而收容於遮蓋構件23與凸緣狀構件25之間。中壁部48形成為如下的長度:於內杯41與中杯42最接近的狀態下,保持適當的間隙而收容於中杯42的後述的第二引導部52與處理液分離壁53之間。 The inner wall portion 45 is formed to have a length such that in a state where the inner cup 41 is the most elevated, it is accommodated between the covering member 23 and the flange-shaped member 25 while maintaining an appropriate gap. The middle wall portion 48 is formed to have a length such that when the inner cup 41 and the middle cup 42 are the closest to each other, it is accommodated between the second guide portion 52 and the processing liquid separation wall 53 of the middle cup 42 and the processing liquid separation wall 53 while maintaining an appropriate gap. .

第一引導部47具有畫出平滑的圓弧且朝中心側(靠近基板W的旋轉軸線CX的方向)斜上方延伸的上端部47b。另外,將內壁部45與第一引導部47之間設為用於收集並廢棄使用完的處理液的廢棄槽49。將第一引導部47與中壁部48之間設為用於收集並回收使用完的處理液的圓環狀的內側回收槽50。進而,將中壁部48與外壁部46之間設為用於收集並回收種類與內側回收槽50不同的處理液的圓環狀的外側回收槽51。 The first guide portion 47 has an upper end portion 47b that draws a smooth arc and extends obliquely upward toward the center side (the direction close to the rotation axis CX of the substrate W). In addition, the space between the inner wall portion 45 and the first guide portion 47 is provided as a waste tank 49 for collecting and discarding the used treatment liquid. The space between the first guide portion 47 and the middle wall portion 48 is an annular inner recovery tank 50 for collecting and recovering the used treatment liquid. Furthermore, between the middle wall portion 48 and the outer wall portion 46 is an annular outer recovery tank 51 for collecting and recovering a processing liquid of a different kind from the inner recovery tank 50.

於廢棄槽49連接有省略圖示的排氣/排液機構,所述排 氣/排液機構用於排出已被收集於該廢棄槽49的處理液,並且使廢棄槽49內強制地排氣。排氣/排液機構例如沿著廢棄槽49的圓周方向等間隔地設置四個。另外,於內側回收槽50及外側回收槽51連接有回收機構(均省略圖示),所述回收機構用於將已被分別收集於內側回收槽50及外側回收槽51的處理液回收至設置於基板處理裝置100的外部的回收罐。再者,內側回收槽50及外側回收槽51的底部相對於水平方向僅傾斜微少角度,於其變成最低的位置連接有回收機構。藉此,已流入內側回收槽50及外側回收槽51的處理液被順利地回收。 An exhaust/drain mechanism (not shown) is connected to the waste tank 49, and the drain The gas/liquid discharge mechanism is used to discharge the treatment liquid collected in the waste tank 49 and forcibly exhaust the inside of the waste tank 49. For example, four exhaust/drain mechanisms are provided at equal intervals along the circumferential direction of the waste groove 49. In addition, a recovery mechanism (both not shown) is connected to the inner recovery tank 50 and the outer recovery tank 51, and the recovery mechanism is used to recover the treated liquid collected in the inner recovery tank 50 and the outer recovery tank 51 to the installation. A recovery tank outside the substrate processing apparatus 100. Furthermore, the bottoms of the inner recovery tank 50 and the outer recovery tank 51 are inclined only a slight angle with respect to the horizontal direction, and a recovery mechanism is connected to the position where they become the lowest. Thereby, the processing liquid that has flowed into the inner recovery tank 50 and the outer recovery tank 51 is smoothly recovered.

中杯42包圍旋轉夾頭20的周圍,具有相對於穿過已由旋轉夾頭20保持的基板W的中心的旋轉軸線CX大致變成旋轉對稱的形狀。該中杯42具有:第二引導部52、及與該第二引導部52連結的圓筒狀的處理液分離壁53。 The middle cup 42 surrounds the circumference of the rotating chuck 20 and has a shape that becomes substantially rotationally symmetrical with respect to the rotation axis CX passing through the center of the substrate W that has been held by the rotating chuck 20. The middle cup 42 has a second guide portion 52 and a cylindrical processing liquid separation wall 53 connected to the second guide portion 52.

第二引導部52於內杯41的第一引導部47的外側具有:下端部52a,與第一引導部47的下端部同軸且為圓筒狀;上端部52b,自下端部52a的上端起畫出平滑的圓弧且朝中心側(靠近基板W的旋轉軸線CX的方向)斜上方延伸;以及翻折部52c,使上端部52b的前端部朝下方翻折而形成。下端部52a於內杯41與中杯42最接近的狀態下,在第一引導部47與中壁部48之間保持適當的間隙而收容於內側回收槽50內。另外,上端部52b以與內杯41的第一引導部47的上端部47b於上下方向上重疊的方式設置,於內杯41與中杯42最接近的狀態下,對於第一引導部47的 上端部47b保持極微小的間隔來接近。翻折部52c於內杯41與中杯42最接近的狀態下,翻折部52c與第一引導部47的上端部47b的前端於水平方向上重疊。 The second guide portion 52 has, on the outside of the first guide portion 47 of the inner cup 41, a lower end portion 52a, which is coaxial with the lower end portion of the first guide portion 47 and is cylindrical; and an upper end portion 52b, which starts from the upper end of the lower end portion 52a A smooth arc is drawn and extends obliquely upward toward the center side (the direction close to the rotation axis CX of the substrate W); and the folded portion 52c is formed by folding the front end of the upper end 52b downward. The lower end portion 52a is received in the inner recovery groove 50 while maintaining an appropriate gap between the first guide portion 47 and the middle wall portion 48 when the inner cup 41 and the middle cup 42 are closest to each other. In addition, the upper end portion 52b is provided so as to overlap the upper end portion 47b of the first guide portion 47 of the inner cup 41 in the vertical direction. The upper end 47b keeps a very small interval to approach. In a state where the inner cup 41 and the middle cup 42 are closest to the folded portion 52c, the folded portion 52c overlaps with the front end of the upper end 47b of the first guide portion 47 in the horizontal direction.

第二引導部52的上端部52b以越是下方,壁厚變得越厚的方式形成。處理液分離壁53具有以自上端部52b的下端外周緣部朝下方延伸的方式設置的圓筒形狀。處理液分離壁53於內杯41與中杯42最接近的狀態下,在中壁部48與外杯43之間保持適當的間隙而收容於外側回收槽51內。 The upper end portion 52b of the second guide portion 52 is formed such that the lower it is, the thicker the wall thickness becomes. The processing liquid separation wall 53 has a cylindrical shape provided so as to extend downward from the outer peripheral edge portion of the lower end of the upper end portion 52b. The processing liquid separation wall 53 is accommodated in the outer recovery tank 51 while maintaining an appropriate gap between the middle wall portion 48 and the outer cup 43 in a state where the inner cup 41 and the middle cup 42 are the closest to each other.

外杯43具有相對於穿過已由旋轉夾頭20保持的基板W的中心的旋轉軸線CX大致變成旋轉對稱的形狀。外杯43於中杯42的第二引導部52的外側包圍旋轉夾頭20。該外杯43具有作為第三引導部的功能。外杯43具有:下端部43a,與第二引導部52的下端部52a同軸且形成圓筒狀;上端部43b,自下端部43a的上端起畫出平滑的圓弧且中心側朝(靠近基板W的旋轉軸線CX的方向)斜上方延伸;以及翻折部43c,使上端部43b的前端部朝下方翻折而形成。 The outer cup 43 has a shape that becomes substantially rotationally symmetric with respect to the rotation axis CX passing through the center of the substrate W that has been held by the spin chuck 20. The outer cup 43 surrounds the rotating chuck 20 on the outside of the second guide portion 52 of the middle cup 42. This outer cup 43 has a function as a third guide part. The outer cup 43 has: a lower end portion 43a, which is coaxial with the lower end portion 52a of the second guide portion 52 and formed into a cylindrical shape; The direction of the W rotation axis CX) extends diagonally upward; and the folded portion 43c is formed by folding the front end of the upper end portion 43b downward.

下端部43a於內杯41與外杯43最接近的狀態下,在中杯42的處理液分離壁53與內杯41的外壁部46之間保持適當的間隙而收容於外側回收槽51內。上端部43b以與中杯42的第二引導部52於上下方向上重疊的方式設置,於中杯42與外杯43最接近的狀態下,對於第二引導部52的上端部52b保持極微小的間隔來接近。於中杯42與外杯43最接近的狀態下,翻折部43c與 第二引導部52的翻折部52c於水平方向上重疊。 In the state where the inner cup 41 and the outer cup 43 are closest, the lower end 43a is accommodated in the outer recovery tank 51 while maintaining an appropriate gap between the processing liquid separation wall 53 of the middle cup 42 and the outer wall portion 46 of the inner cup 41. The upper end 43b is provided so as to overlap with the second guide 52 of the middle cup 42 in the vertical direction. When the middle cup 42 and the outer cup 43 are closest to each other, the upper end 52b of the second guide 52 is kept extremely small. The interval comes close. In the state where the middle cup 42 and the outer cup 43 are closest, the folded portion 43c and The folded portion 52c of the second guide portion 52 overlaps in the horizontal direction.

內杯41、中杯42及外杯43可相互獨立地升降。即,於內杯41、中杯42及外杯43分別個別地設置有升降機構(省略圖示),藉此個別獨立地升降。作為此種升降機構,例如可採用滾珠螺桿機構或氣缸等公知的各種機構。 The inner cup 41, the middle cup 42 and the outer cup 43 can be raised and lowered independently of each other. That is, the inner cup 41, the middle cup 42, and the outer cup 43 are respectively provided with a lifting mechanism (not shown), respectively, so that they can be raised and lowered individually and independently. As such an elevating mechanism, for example, various known mechanisms such as a ball screw mechanism and an air cylinder can be used.

分隔板15以於處理杯40的周圍將腔室10的內側空間上下分隔的方式設置。分隔板15可為包圍處理杯40的一片板狀構件,亦可為將多個板狀構件接合而成者。另外,於分隔板15,亦可形成有於厚度方向上貫穿的貫穿孔或切口,於本實施方式中,形成有用於使支持軸穿過的貫穿孔,所述支持軸用於支持噴嘴30、噴嘴60、噴嘴65的噴嘴基座33、噴嘴基座63、噴嘴基座68。 The partition plate 15 is provided to partition the inner space of the chamber 10 up and down around the processing cup 40. The partition plate 15 may be a single plate-shaped member surrounding the processing cup 40, or may be formed by joining a plurality of plate-shaped members. In addition, the partition plate 15 may also be formed with a through hole or a notch penetrating in the thickness direction. In this embodiment, a through hole for passing a support shaft is formed for supporting the nozzle 30 , The nozzle 60, the nozzle base 33 of the nozzle 65, the nozzle base 63, and the nozzle base 68.

分隔板15的外周端與腔室10的側壁11連結。另外,分隔板15的包圍處理杯40的端緣部以變成直徑較外杯43的外徑大的圓形狀的方式形成。因此,分隔板15不會成為外杯43的升降的障礙。 The outer peripheral end of the partition plate 15 is connected to the side wall 11 of the chamber 10. In addition, the edge portion of the partition plate 15 surrounding the processing cup 40 is formed so as to become a circular shape having a larger diameter than the outer diameter of the outer cup 43. Therefore, the partition plate 15 does not become an obstacle to the elevation of the outer cup 43.

另外,於腔室10的側壁11的一部分,且底壁13的附近設置有排氣管18。排氣管18與省略圖示的排氣機構連通連接。自FFU 14供給並於腔室10內向下流的清潔空氣之中,已在處理杯40與分隔板15之間穿過的空氣被自排氣管18朝裝置外排出。 In addition, an exhaust pipe 18 is provided in a part of the side wall 11 of the chamber 10 and in the vicinity of the bottom wall 13. The exhaust pipe 18 is connected to an exhaust mechanism (not shown) in communication. Among the clean air supplied from the FFU 14 and flowing downward in the chamber 10, the air that has passed between the processing cup 40 and the partition plate 15 is discharged from the exhaust pipe 18 to the outside of the device.

圖4是表示相機70與噴嘴30的位置關係的圖。相機70於腔室10內,且設置於較分隔板15更上方。相機70包括:例如 作為固體攝像元件之一的電荷耦合器件(Charge Coupled Device,CCD),及電子快門、透鏡等光學系統。噴嘴30藉由噴嘴基座33的驅動,在已由旋轉夾頭20保持的基板W的上方的處理區間PS1(圖4的虛線位置)與較處理杯40更外側的待機位置(圖4的實線位置)之間往返移動。處理區間PS1是自噴嘴30朝已由旋轉夾頭20保持的基板W的上表面噴出處理液來進行清洗處理的區間。此處,處理區間PS1是自已由旋轉夾頭20保持的基板W的一側的緣部附近的第一端TE1、至其相反側的緣部附近的第二端TE2為止的沿水平方向延伸的區間。待機位置是噴嘴30不進行清洗處理時停止處理液的噴出而待機的位置。於待機位置,亦可設置收容噴嘴30的噴出頭31的待機盒。 FIG. 4 is a diagram showing the positional relationship between the camera 70 and the nozzle 30. The camera 70 is in the chamber 10 and is arranged above the partition plate 15. The camera 70 includes: for example As one of the solid-state imaging elements, Charge Coupled Device (CCD), and optical systems such as electronic shutters and lenses. The nozzle 30 is driven by the nozzle base 33 in the processing section PS1 (the position of the dotted line in FIG. 4) above the substrate W held by the spin chuck 20 and the standby position outside the processing cup 40 (the actual position in FIG. 4). Line position) to move back and forth. The processing section PS1 is a section where the processing liquid is sprayed from the nozzle 30 to the upper surface of the substrate W held by the spin chuck 20 to perform cleaning processing. Here, the processing section PS1 extends in the horizontal direction from the first end TE1 near the edge of the substrate W held by the spin chuck 20 to the second end TE2 near the edge on the opposite side. Interval. The standby position is a position where the nozzle 30 stops the discharge of the processing liquid and stands by when the nozzle 30 is not performing cleaning processing. In the standby position, a standby box for accommodating the ejection head 31 of the nozzle 30 may also be provided.

相機70以於其拍攝視場中至少包含處理區間PS1內的噴嘴30的前端的方式設置,即設置於包含噴出頭31的附近的位置。於本實施方式中,如圖4所示,將相機70設置於自前方上方拍攝處理區間PS1內的噴嘴30的位置。因此,相機70可拍攝包含處理區間PS1內的噴嘴30的前端的拍攝區域。同樣地,相機70可拍攝包含各處理區間內的噴嘴60、噴嘴65的前端的拍攝區域。再者,當相機70設置於圖2及圖4中所示的位置時,使噴嘴30、噴嘴60於相機70的拍攝視場內朝橫方向移動,因此可適當地拍攝各處理區間的附近的移動,但使噴嘴65於相機70的拍攝視場內朝縱深方向移動,因此亦存在無法適當地拍攝處理區間的附近的移動量之虞。於此情況下,亦可設置有別於相機70的拍攝 噴嘴65的相機。 The camera 70 is installed so as to include at least the tip of the nozzle 30 in the processing section PS1 in its imaging field of view, that is, installed at a position including the vicinity of the ejection head 31. In the present embodiment, as shown in FIG. 4, the camera 70 is installed at a position where the nozzle 30 in the processing section PS1 is photographed from above and above. Therefore, the camera 70 can image the imaging area including the tip of the nozzle 30 in the processing section PS1. Similarly, the camera 70 can image the imaging area including the nozzle 60 and the tip of the nozzle 65 in each processing section. Furthermore, when the camera 70 is installed at the position shown in FIGS. 2 and 4, the nozzle 30 and the nozzle 60 are moved in the horizontal direction within the shooting field of view of the camera 70, so that the vicinity of each processing section can be appropriately photographed. However, the nozzle 65 is moved in the depth direction within the imaging field of view of the camera 70, so there is a possibility that the movement amount in the vicinity of the processing section cannot be appropriately captured. In this case, it can also be set to be different from the camera 70 shooting Nozzle 65 camera.

如圖3所示,於腔室10內且於較分隔板15更上方的位置設置有照明部71。於腔室10內為暗室的情況下,控制部9亦可控制照明部71,以於相機70進行拍攝時使照明部71對處理位置附近的噴嘴30、噴嘴60、噴嘴65照射光。 As shown in FIG. 3, an illuminating part 71 is provided in the cavity 10 and above the partition plate 15. When the chamber 10 is a dark room, the control unit 9 may control the illumination unit 71 so that the illumination unit 71 irradiates the nozzle 30, the nozzle 60, and the nozzle 65 near the processing position with light when the camera 70 is photographing.

圖5是相機70及控制部9的方塊圖。作為設置於基板處理裝置100的控制部9的硬體的構成與一般的電腦相同。即,控制部9包括如下構件而構成:進行各種運算處理的中央處理單元(Central Processing Unit,CPU)、作為記憶基本程式的讀出專用的記憶體的唯讀記憶體(Read Only Memory,ROM)、作為記憶各種資訊的讀寫自如的記憶體的隨機存取記憶體(Random Access Memory,RAM)、以及記憶控制用軟體或資料等的磁碟等。藉由控制部9的CPU執行規定的處理程式,基板處理裝置100的各動作機構由控制部9控制,而進行基板處理裝置100的處理。 FIG. 5 is a block diagram of the camera 70 and the control unit 9. The configuration of the hardware as the control unit 9 provided in the substrate processing apparatus 100 is the same as that of a general computer. That is, the control unit 9 includes the following components: a central processing unit (CPU) that performs various arithmetic processing, and a read-only memory (Read Only Memory, ROM) that is a memory dedicated to reading basic programs. , Random Access Memory (RAM) as a readable and writable memory for storing various information, and magnetic disks for memory control software or data, etc. When the CPU of the control unit 9 executes a predetermined processing program, each operation mechanism of the substrate processing apparatus 100 is controlled by the control unit 9 to perform the processing of the substrate processing apparatus 100.

圖5中所示的基準圖像登記部90、位置偏離檢測部91、指令發送部92是藉由控制部9的CPU執行規定的處理程式而於控制部9內實現的功能處理部。 The reference image registration unit 90, the positional deviation detection unit 91, and the command transmission unit 92 shown in FIG. 5 are functional processing units implemented in the control unit 9 when the CPU of the control unit 9 executes a predetermined processing program.

基準圖像登記部90將拍攝位於正確的位置的噴嘴30所獲得的攝影圖像作為基準圖像RP來登記。位置偏離檢測部91檢測作為判定對象的位置的判定位置上的噴嘴30的垂直方向或水平方向的位置偏離。位置偏離檢測部91包含圖像判定部910及圖像比較部912。圖像判定部910根據既定的判定規則,針對藉由對作 為判定對象的噴嘴30進行攝影所獲得的實際圖像GP,判定是否為位於判定噴嘴30的位置偏離的判定位置(例如,第一端TE1、第二端TE2)時的圖像。關於既定的判定規則,其後進行詳述。 圖像比較部912進行圖案匹配處理,所述圖案匹配處理將藉由圖像判定部910而判定為位於判定位置的實際圖像GP與表示正確的噴嘴30的位置的基準圖像RP進行比較。關於該圖案匹配處理,亦其後進行詳述。 The reference image registration unit 90 registers a photographed image obtained by photographing the nozzle 30 located at the correct position as the reference image RP. The positional deviation detection unit 91 detects the positional deviation of the nozzle 30 in the vertical direction or the horizontal direction at the determination position, which is the position of the determination target. The positional deviation detection unit 91 includes an image determination unit 910 and an image comparison unit 912. The image judging unit 910 according to the established judging rule It is determined whether the actual image GP obtained by shooting for the nozzle 30 of the judgment target is an image at the judgment position (for example, the first end TE1 and the second end TE2) where the positional deviation of the nozzle 30 is judged. The established determination rules will be described in detail later. The image comparison unit 912 performs pattern matching processing that compares the actual image GP determined to be located at the determination position by the image determination unit 910 with the reference image RP indicating the position of the correct nozzle 30. The pattern matching processing will also be described in detail later.

指令發送部92按照記述有用於對基板W進行處理的各種條件的處理程式,輸出指令(控制資訊),藉此使清洗處理單元1的各元件運作。具體而言,指令發送部92對噴嘴30、噴嘴60、噴嘴65輸出指令,使內置於噴嘴基座33、噴嘴基座63、噴嘴基座68的驅動源(馬達)運作。例如,若指令發送部92對噴嘴30發送朝處理區間PS1的第一端TE1移動的指令,則噴嘴30自待機位置朝第一端TE1移動。進而,若指令發送部92對噴嘴30發送朝處理區間PS1的第二端TE2移動的指令,則噴嘴30自第一端TE1朝第二端TE2移動。自噴嘴30中的處理液的噴出亦可對應於來自指令發送部92的指令發送而進行。 The command sending unit 92 outputs commands (control information) in accordance with a processing program in which various conditions for processing the substrate W are described, thereby operating each element of the cleaning processing unit 1. Specifically, the command sending unit 92 outputs commands to the nozzle 30, the nozzle 60, and the nozzle 65 to operate the driving source (motor) built in the nozzle base 33, the nozzle base 63, and the nozzle base 68. For example, if the command sending unit 92 sends a command to the nozzle 30 to move to the first end TE1 of the processing section PS1, the nozzle 30 moves from the standby position to the first end TE1. Furthermore, when the command sending unit 92 sends a command to the nozzle 30 to move to the second end TE2 of the processing section PS1, the nozzle 30 moves from the first end TE1 to the second end TE2. The ejection of the processing liquid from the nozzle 30 may also be performed in response to a command transmission from the command transmission unit 92.

控制部9包括記憶部94,所述記憶部94包含所述RAM或磁碟,記憶由相機70所拍攝的圖像的資料或輸入值等。於控制部9連接有顯示部95及輸人部96。顯示部95對應於來自控制部9的圖像訊號而顯示各種資訊。輸入部96包含與控制部9連接的鍵盤及滑鼠等輸入器件,受理操作者對控制部9進行的輸入操作。 The control unit 9 includes a storage unit 94 that includes the RAM or a magnetic disk, and stores data or input values of images captured by the camera 70. A display unit 95 and an input unit 96 are connected to the control unit 9. The display unit 95 displays various information corresponding to the image signal from the control unit 9. The input unit 96 includes input devices such as a keyboard and a mouse connected to the control unit 9 and accepts input operations performed by the operator on the control unit 9.

<動作說明> <Action description>

基板處理裝置100的基板W的通常的處理依次包括:主搬送機器人103將已自分度器102接收的處理對象的基板W搬入各清洗處理單元1的步驟、該清洗處理單元1對基板W進行清洗處理的步驟、主搬送機器人103將處理完的基板W自該清洗處理單元1中搬出並送回至分度器102的步驟。各清洗處理單元1的典型的基板W的清洗處理程序的概略如下:朝基板W的表面供給藥液來進行規定的藥液處理後,供給純水來進行純水淋洗處理,其後藉由使基板W高速旋轉來甩掉純水,以此對基板W進行乾燥處理。 The normal processing of the substrate W of the substrate processing apparatus 100 sequentially includes: the main transport robot 103 carries the substrate W of the processing target received from the indexer 102 into each cleaning processing unit 1, and the cleaning processing unit 1 performs cleaning processing on the substrate W The step of the main transport robot 103 transports the processed substrate W from the cleaning processing unit 1 and returns it to the indexer 102. The outline of a typical cleaning processing procedure for the substrate W of each cleaning processing unit 1 is as follows: after a chemical solution is supplied to the surface of the substrate W to perform a predetermined chemical solution treatment, pure water is supplied to perform a pure water rinsing treatment, and thereafter The substrate W is rotated at a high speed to shake off the pure water, so that the substrate W is dried.

當清洗處理單元1進行基板W的處理時,將基板W保持於旋轉夾頭20,並且處理杯40進行升降動作。當清洗處理單元1進行藥液處理時,例如僅外杯43上升,在外杯43的上端部43b與中杯42的第二引導部52的上端部52b之間,形成包圍已由旋轉夾頭20保持的基板W的周圍的開口。於該狀態下,基板W與旋轉夾頭20一同旋轉,自噴嘴30及下表面處理液噴嘴28朝基板W的上表面及下表面供給藥液。已被供給的藥液因由基板W的旋轉所產生的離心力而沿著基板W的上表面及下表面流動,不久自基板W的端緣部朝側方飛散。藉此,進行基板W的藥液處理。已自旋轉的基板W的端緣部飛散的藥液由外杯43的上端部43b擋住,沿著外杯43的內表面向下流,並被回收至外側回收槽51。 When the cleaning processing unit 1 processes the substrate W, the substrate W is held by the rotating chuck 20, and the processing cup 40 performs a lifting operation. When the cleaning processing unit 1 performs chemical treatment, for example, only the outer cup 43 rises, and an enclosure is formed between the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the second guide portion 52 of the middle cup 42 by the rotating chuck 20 An opening around the substrate W to be held. In this state, the substrate W rotates together with the spin chuck 20, and the chemical liquid is supplied from the nozzle 30 and the lower surface treatment liquid nozzle 28 to the upper surface and the lower surface of the substrate W. The supplied chemical liquid flows along the upper surface and the lower surface of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and then scatters laterally from the edge of the substrate W. Thereby, the chemical solution treatment of the substrate W is performed. The chemical liquid scattered from the end edge of the self-rotating substrate W is blocked by the upper end 43 b of the outer cup 43, flows downward along the inner surface of the outer cup 43, and is recovered to the outer recovery tank 51.

當清洗處理單元1進行純水淋洗處理時,例如內杯41、中杯42及外杯43全部上升,已由旋轉夾頭20保持的基板W的 周圍由內杯41的第一引導部47包圍。於該狀態下,基板W與旋轉夾頭20一同旋轉,自噴嘴30及下表面處理液噴嘴28朝基板W的上表面及下表面供給純水。已被供給的純水因由基板W的旋轉所產生的離心力而沿著基板W的上表面及下表面流動,不久自基板W的端緣部朝側方飛散。藉此,進行基板W的純水淋洗處理。 已自旋轉的基板W的端緣部飛散的純水沿著第一引導部47的內壁向下流,並被從廢棄槽49排出。再者,當藉由與藥液不同的路徑來回收純水時,亦可使中杯42及外杯43上升,在中杯42的第二引導部52的上端部52b與內杯41的第一引導部47的上端部47b之間,形成包圍已由旋轉夾頭20保持的基板W的周圍的開口。 When the cleaning processing unit 1 performs the pure water rinsing process, for example, the inner cup 41, the middle cup 42, and the outer cup 43 all rise, and the substrate W held by the rotating chuck 20 The periphery is surrounded by the first guide portion 47 of the inner cup 41. In this state, the substrate W rotates together with the spin chuck 20, and pure water is supplied from the nozzle 30 and the lower surface treatment liquid nozzle 28 to the upper surface and the lower surface of the substrate W. The supplied pure water flows along the upper and lower surfaces of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and then scatters laterally from the edge of the substrate W. Thereby, the pure water rinsing process of the substrate W is performed. The pure water scattered from the end edge of the self-rotating substrate W flows downward along the inner wall of the first guide portion 47 and is discharged from the waste tank 49. Furthermore, when the pure water is recovered through a path different from the chemical solution, the middle cup 42 and the outer cup 43 can also be raised. Between the upper end 47b of a guide part 47, an opening surrounding the periphery of the substrate W held by the spin chuck 20 is formed.

當清洗處理單元1進行甩掉乾燥處理時,內杯41、中杯42及外杯43全部下降,內杯41的第一引導部47的上端部47b、中杯42的第二引導部52的上端部52b及外杯43的上端部43b均位於較已由旋轉夾頭20保持的基板W更下方。於該狀態下,基板W與旋轉夾頭20一同高速旋轉,藉由離心力來甩掉已附著於基板W的水滴,而進行乾燥處理。 When the washing treatment unit 1 performs the spin-off drying process, the inner cup 41, the middle cup 42, and the outer cup 43 all descend, the upper end 47b of the first guide part 47 of the inner cup 41 and the second guide part 52 of the middle cup 42 The upper end 52b and the upper end 43b of the outer cup 43 are both located below the substrate W that has been held by the rotating chuck 20. In this state, the substrate W is rotated at a high speed together with the spin chuck 20, and the water droplets that have adhered to the substrate W are thrown off by centrifugal force, and the drying process is performed.

於本實施方式中,當自噴嘴30朝基板W的上表面噴出處理液時,相機70拍攝於處理區間PS1內移動的噴嘴30。然後,位置偏離檢測部91將藉由拍攝所獲得的一連串的攝影圖像與事先獲取的基準圖像進行比較,藉此檢測噴嘴30的位置偏離。以下,對該技術進行詳細說明。再者,以下對檢測噴嘴30的位置偏離的技術進行說明,但對於其他噴嘴60、噴嘴65亦可應用。 In the present embodiment, when the processing liquid is ejected from the nozzle 30 toward the upper surface of the substrate W, the camera 70 photographs the nozzle 30 moving in the processing section PS1. Then, the positional deviation detection unit 91 compares a series of photographed images obtained by shooting with a reference image acquired in advance, thereby detecting the positional deviation of the nozzle 30. Hereinafter, this technique will be described in detail. In addition, the technique for detecting the positional deviation of the nozzle 30 will be described below, but it can also be applied to other nozzles 60 and 65.

圖6是表示用於由位置偏離檢測部91所進行的檢測處理的事前準備的程序的流程圖。圖7是表示由位置偏離檢測部91所進行的檢測處理的程序的流程圖。圖6中表示用於位置偏離的檢測處理的事前準備的程序,圖7中表示成為處理對象的基板W已被搬入清洗處理單元1時所進行的判定處理的程序。於圖6中表示程序的事前準備是於成為實際的處理對象的基板W的處理製程之前實施者,例如亦可於基板處理裝置100的啟動時、或維護作業時實施。 FIG. 6 is a flowchart showing a procedure for preliminarily preparing for the detection process performed by the positional deviation detection unit 91. FIG. 7 is a flowchart showing the procedure of the detection process performed by the positional deviation detection unit 91. FIG. 6 shows a pre-prepared procedure for the detection processing of the positional deviation, and FIG. 7 shows a procedure of the determination processing performed when the substrate W to be processed has been carried into the cleaning processing unit 1. The pre-preparation of the program shown in FIG. 6 is performed before the processing process of the actual substrate W to be processed, and may be performed, for example, when the substrate processing apparatus 100 is started up or during maintenance work.

首先,當進行噴嘴30的教導(teaching)時,使噴嘴30移動至教導位置(步驟S11)。所謂教導,是指對噴嘴30指教適當的動作的作業,將處理區間PS1內的噴嘴30的停止位置修正成適當的位置(教導位置)。因此,於教導時,當已使噴嘴30移動至教導位置時,噴嘴30於適當的處理區間PS1內正確地移動。再者,所謂適當的處理區間PS1,是指如下的區間:於該處理區間PS1內若自噴嘴30噴出處理液,則可執行所要求的基板處理。 First, when the nozzle 30 is taught, the nozzle 30 is moved to the teaching position (step S11). The teaching refers to a task of instructing the nozzle 30 in an appropriate operation, and correcting the stop position of the nozzle 30 in the processing section PS1 to an appropriate position (teaching position). Therefore, at the time of teaching, when the nozzle 30 has been moved to the teaching position, the nozzle 30 correctly moves within the appropriate processing interval PS1. In addition, the appropriate processing section PS1 refers to a section in which the processing liquid is ejected from the nozzle 30 in the processing section PS1, so that the required substrate processing can be performed.

處理區間PS1是被定義於已由旋轉夾頭20保持的基板W的上方的區域,且為沿水平方向延伸的噴嘴30的移動範圍。處理區間PS1的兩端為第一端TE1與第二端TE2。藉由控制部9控制噴嘴基座33,噴嘴30於處理區間PS1內,自第一端TE1朝第二端TE2移動。 The processing section PS1 is a region defined above the substrate W held by the spin chuck 20, and is a movement range of the nozzle 30 extending in the horizontal direction. The two ends of the processing interval PS1 are a first end TE1 and a second end TE2. With the control unit 9 controlling the nozzle base 33, the nozzle 30 moves from the first end TE1 to the second end TE2 in the processing section PS1.

當噴嘴30於適當的處理區間PS1內移動時,相機70連續拍攝包含噴嘴30的前端的拍攝區域PA(步驟S12)。所謂連續 拍攝,是指以固定間隔對拍攝區域PA連續地進行拍攝。例如,相機70以33毫秒間隔進行連續拍攝。藉此,每一秒獲取30幀的攝影圖像。相機70於噴嘴30自待機位置到達處理區間PS1的第一端TE1後進行動畫攝影,直至噴嘴30到達第二端TE2為止。 When the nozzle 30 moves within the appropriate processing section PS1, the camera 70 continuously photographs the imaging area PA including the tip of the nozzle 30 (step S12). So-called continuous Shooting refers to continuously shooting the shooting area PA at a fixed interval. For example, the camera 70 performs continuous shooting at 33 millisecond intervals. In this way, 30 frames of photographic images are acquired every second. The camera 70 performs animation photography after the nozzle 30 reaches the first end TE1 of the processing section PS1 from the standby position until the nozzle 30 reaches the second end TE2.

圖8是表示相機70拍攝包含處理區間PS1內的噴嘴30的前端的拍攝區域PA所獲得的圖像的一例的圖。於拍攝區域PA中,包含位於已由旋轉夾頭20保持的基板W的上方的處理區間PS1的中間的噴嘴30的前端。於圖8中所示的例子中,於拍攝區域PA中包含基板W,但並非必須如此。例如,亦存在於維護時基板W未保持於旋轉夾頭20的情況,於此種情況下,亦能夠以於拍攝區域PA中不包含基板W的狀態進行拍攝。如圖8所示,利用固定於固定位置的相機70,對在處理區間PS1內移動的噴嘴30進行攝影的攝影圖像上的噴嘴30的形狀逐漸地變化。於圖8中所示的例子中,噴嘴30的水平方向的寬度自第一端TE1起逐漸地變大,隨著自中途向第二端TE2而逐漸地變小。再者,攝影圖像的噴嘴30的形狀變化並不限定於此種形狀變化。 FIG. 8 is a diagram showing an example of an image obtained by the camera 70 capturing the imaging area PA including the tip of the nozzle 30 in the processing section PS1. The imaging area PA includes the tip of the nozzle 30 located in the middle of the processing section PS1 above the substrate W held by the spin chuck 20. In the example shown in FIG. 8, the substrate W is included in the imaging area PA, but this is not necessary. For example, there is also a case where the substrate W is not held by the spin chuck 20 during maintenance. In this case, it is also possible to perform imaging in a state where the substrate W is not included in the imaging area PA. As shown in FIG. 8, the shape of the nozzle 30 on the photographed image of the nozzle 30 moving in the processing section PS1 is gradually changed by the camera 70 fixed at a fixed position. In the example shown in FIG. 8, the width of the nozzle 30 in the horizontal direction gradually increases from the first end TE1, and gradually decreases from the middle to the second end TE2. In addition, the shape change of the nozzle 30 of the photographed image is not limited to such a shape change.

繼而,自步驟S12中所獲得的多個攝影圖像進行基準圖像的登記(步驟S13)。於步驟S12中,噴嘴30藉由教導而自適當的處理區間PS1的第一端TE1正確地移動至第二端TE2為止。 因此,於步驟S12中藉由相機70所獲得的攝影圖像成為表示噴嘴30的適當的位置的基準圖像。於步驟S13中,基準圖像登記部90將多個攝影圖像中的一部分作為用於檢測噴嘴30的位置偏離的基 準圖像RP,登記於記憶部94。 Then, the registration of the reference image is performed from the plurality of captured images obtained in step S12 (step S13). In step S12, the nozzle 30 is correctly moved from the first end TE1 of the appropriate processing section PS1 to the second end TE2 by teaching. Therefore, the photographed image obtained by the camera 70 in step S12 becomes a reference image indicating the proper position of the nozzle 30. In step S13, the reference image registration unit 90 uses a part of the plurality of captured images as a basis for detecting the positional deviation of the nozzle 30. The quasi-image RP is registered in the storage unit 94.

如圖8所示,將基準圖像RP設為以包含噴嘴30的前端部的方式自攝影圖像中切出的圖像。圖像的切出可由操作員手動地指定區域來進行、或者亦可自動地進行切出。於後者的情況下,例如亦可藉由圖像識別來檢測噴嘴30的一部分(前端),並將其位置作為基準來切出包含噴嘴30的前端的區域。經切出的基準圖像RP與拍攝區域PA的位置資訊一同被保存於記憶部94。通常,於最初設定的腔室10中手動地進行切出。關於其後設定的其他腔室10,若腔室10間的構成相同,則可直接利用最初設定的腔室10的切出資訊來進行切出,亦可適宜進行調整來進行切出。 As shown in FIG. 8, let the reference image RP be an image cut out from the photographed image so as to include the tip portion of the nozzle 30. The image can be cut out by the operator manually specifying the area, or it can also be cut out automatically. In the latter case, for example, a part (tip) of the nozzle 30 may be detected by image recognition, and the position may be used as a reference to cut out an area including the tip of the nozzle 30. The cut-out reference image RP is stored in the storage unit 94 together with the position information of the shooting area PA. Usually, the cutting out is performed manually in the chamber 10 initially set. Regarding other chambers 10 to be set later, if the structure of the chambers 10 is the same, the cutting out information of the chamber 10 set initially can be used directly for cutting out, or it may be adjusted appropriately for cutting out.

於本實施方式中,作為被登記的基準圖像RP,包含:噴嘴30位於第一端TE1時的第一基準圖像RP1、位於第二端TE2時的第二基準圖像RP2、以及於處理區間PS1的中間(第一端TE1與第二端TE2之間的區域)進行移動時的中間基準圖像RPM。 In this embodiment, the registered reference image RP includes: a first reference image RP1 when the nozzle 30 is located at the first end TE1, a second reference image RP2 when the nozzle 30 is located at the second end TE2, and processing The intermediate reference image RPM when moving in the middle of the interval PS1 (the area between the first end TE1 and the second end TE2).

圖9是概念性地表示基準圖像RP的登記處理的圖。圖9中所示的第一登記處理是基準圖像登記部90自動地登記多個基準圖像RP的處理。圖9中,上側所示的噴嘴30的攝影圖像是連續拍攝自處理區間PS1的第一端TE1朝第二端TE2移動的噴嘴30所獲得的圖像。如圖8中所說明般,於藉由連續拍攝所獲得的攝影圖像中,於噴嘴30在處理區間PS1內移動的期間內噴嘴30的形狀變化。於圖9中所示的登記處理中,基準圖像登記部90對應於該噴嘴30的形狀變化來進行基準圖像RP的登記。 FIG. 9 is a diagram conceptually showing the registration process of the reference image RP. The first registration process shown in FIG. 9 is a process in which the reference image registration section 90 automatically registers a plurality of reference images RP. In FIG. 9, the photographed image of the nozzle 30 shown on the upper side is an image obtained by continuously photographing the nozzle 30 moving from the first end TE1 to the second end TE2 of the processing section PS1. As illustrated in FIG. 8, in the photographed image obtained by continuous photographing, the shape of the nozzle 30 changes during the period when the nozzle 30 moves in the processing section PS1. In the registration process shown in FIG. 9, the reference image registration unit 90 registers the reference image RP in accordance with the change in the shape of the nozzle 30.

首先,將第一端TE1的噴嘴30的攝影圖像設為作為第一基準圖像RP1來登記者。於該狀態下,基準圖像登記部90將第一基準圖像RP1與緊隨第一基準圖像RP1之後的攝影圖像依次進行比較,藉此進行算出一致度的圖案匹配處理。如上所述,於攝影圖像上,噴嘴30的形狀逐漸地變化,因此與第一基準圖像RP1的一致度逐漸地下降。基準圖像登記部90將一致度變成規定的臨限值以下的攝影圖像作為新的基準圖像RP來登記。具體而言,基準圖像登記部90取得第一基準圖像RP1與比較對象的攝影圖像的差值,於所述差值超過規定的臨限值的情況下,將所述攝影圖像作為新的基準圖像RP來登記。根據與第一基準圖像RP1的比較來登記的基準圖像RP是相當於第一個中間基準圖像RPM的第一中間基準圖像RPM1。 First, let the captured image of the nozzle 30 at the first end TE1 be the one registered as the first reference image RP1. In this state, the reference image registration unit 90 sequentially compares the first reference image RP1 with the photographed images following the first reference image RP1, thereby performing pattern matching processing for calculating the degree of coincidence. As described above, in the photographed image, the shape of the nozzle 30 gradually changes, so the degree of coincidence with the first reference image RP1 gradually decreases. The reference image registration unit 90 registers a photographed image whose degree of coincidence is equal to or less than a predetermined threshold value as a new reference image RP. Specifically, the reference image registration unit 90 obtains the difference between the first reference image RP1 and the photographed image to be compared, and when the difference exceeds a predetermined threshold, uses the photographed image as The new reference image RP is registered. The reference image RP registered based on the comparison with the first reference image RP1 is the first intermediate reference image RPM1 corresponding to the first intermediate reference image RPM.

繼而,基準圖像登記部90將新登記的第一中間基準圖像RPM1與緊隨對應於該第一中間基準圖像RPM1的攝影圖像之後的攝影圖像進行比較。然後,基準圖像登記部90將一致度變成規定的臨限值以下的攝影圖像作為相當於第二個中間基準圖像RPM的第二中間基準圖像RPM2來登記。基準圖像登記部90重覆進行此種登記處理,直至圖案匹配處理的對象變成第二端TE2的攝影圖像為止,藉此登記多個中間基準圖像RPM。 Then, the reference image registration unit 90 compares the newly registered first intermediate reference image RPM1 with the photographed image immediately following the photographed image corresponding to the first intermediate reference image RPM1. Then, the reference image registration unit 90 registers the captured image whose degree of coincidence is equal to or less than the predetermined threshold value as the second intermediate reference image RPM2 corresponding to the second intermediate reference image RPM. The reference image registration unit 90 repeats such a registration process until the target of the pattern matching process becomes the captured image of the second end TE2, thereby registering a plurality of intermediate reference images RPM.

返回至圖6,若多個基準圖像RP的登記完成,則操作員設定位置偏離判定的臨限值(步驟S14)。此處所設定的臨限值是用於後述的噴嘴30的位置偏離的判定處理(圖7所示的步驟 S25)的參數。該臨限值是步驟S13中所登記的基準圖像RP與對判定對象的噴嘴30進行攝影所獲得的攝影圖像中的噴嘴30的位置的偏離的臨限值。步驟S14中所設定的臨限值越低,判定基準變得越嚴格。即,即便判定對象的噴嘴30的自正確的位置的偏離量小,亦判定為產生了位置偏離。步驟S14中所設定的臨限值被儲存於記憶部94。 Returning to FIG. 6, when the registration of the plurality of reference images RP is completed, the operator sets the threshold value for the positional deviation determination (step S14). The threshold value set here is used for the determination processing of the positional deviation of the nozzle 30 described later (the step shown in FIG. 7 S25) parameters. This threshold value is the threshold value of the deviation of the position of the nozzle 30 in the photographed image obtained by photographing the nozzle 30 of the judgment target from the reference image RP registered in step S13. The lower the threshold value set in step S14, the stricter the judgment criterion becomes. That is, even if the amount of deviation from the correct position of the nozzle 30 to be determined is small, it is determined that a positional deviation has occurred. The threshold value set in step S14 is stored in the storage unit 94.

如以上般進行針對噴嘴30的事前準備。針對其他噴嘴60、噴嘴65,亦執行與步驟S11~步驟S14中所示的事前準備相同的事前準備(步驟S15)。再者,當噴嘴30以外的其他噴嘴以於基板W上,在已停止於固定的處理位置的狀態下進行處理液的噴出的方式構成時,亦可於步驟S11中使噴嘴移動至所述處理位置,於步驟S12中對已停止於所述處理位置的狀態的噴嘴進行攝影。 然後,亦可於步驟S13中將藉由步驟S12所獲取的攝影圖像作為基準圖像。 Preliminary preparations for the nozzle 30 are performed as described above. For the other nozzles 60 and 65, the same pre-preparation as the pre-preparation shown in step S11 to step S14 is performed (step S15). Furthermore, when nozzles other than the nozzle 30 are configured to eject the processing liquid on the substrate W while stopping at a fixed processing position, the nozzles may also be moved to the processing in step S11. Position, in step S12, the nozzle that has stopped at the processing position is photographed. Then, in step S13, the photographed image obtained in step S12 may be used as the reference image.

圖6中所示的事前準備是只要於進行了教導時事先實施即可的準備,若實施一次,則亦可於教導位置被變更之前不再次實施。再者,針對固定的下表面處理液噴嘴28,亦可不進行如上所述的事前準備處理。 The pre-preparation shown in FIG. 6 is a preparation that only needs to be carried out in advance when the teaching is carried out, and if carried out once, it may not be carried out again until the teaching position is changed. In addition, for the fixed lower surface treatment liquid nozzle 28, the above-mentioned preliminary preparation processing may not be performed.

繼而,一面參照圖7,一面對噴嘴30的位置偏離的檢測處理的程序進行說明。主搬送機器人103將成為處理對象的基板W搬入清洗處理單元1(步驟S21)。已被搬入的基板W藉由旋轉夾頭20而以水平姿勢被保持。與此同時,處理杯40以到達規定 的高度位置的方式進行升降動作。 Next, referring to FIG. 7, the procedure of the detection processing of the positional deviation of the nozzle 30 will be described. The main transport robot 103 transports the substrate W to be processed into the cleaning processing unit 1 (step S21). The substrate W that has been carried in is held in a horizontal posture by the rotating chuck 20. At the same time, the cup 40 is processed to reach the regulations The lifting motion is carried out in the manner of the height position.

於已由旋轉夾頭20保持新的成為處理對象的基板W後,噴嘴30自待機位置朝處理區間PS1的第一端TE1開始移動(步驟S22)。噴嘴30的移動藉由控制部9按照事先設定的處理程式控制噴嘴基座33來進行。於處理程式以規定的資料形式記述有應對於對象物實施的處理的條件。具體而言,記述有處理程序或處理內容(處理時間、溫度、壓力或供給量)等。於噴嘴30到達處理區間PS1的第一端TE1並停止後,藉由控制部9的控制來使基板W旋轉,並且開始自噴嘴30中噴出處理液。然後,噴嘴30一面噴出處理液,一面自處理區間PS1的第一端TE1朝第二端TE2開始移動,其後,停止於第二端TE2。 After the new substrate W to be processed has been held by the spin chuck 20, the nozzle 30 starts to move from the standby position toward the first end TE1 of the processing section PS1 (step S22). The movement of the nozzle 30 is performed by the control unit 9 controlling the nozzle base 33 in accordance with a processing program set in advance. In the processing program, the conditions of the processing to be performed on the object are described in a predetermined data format. Specifically, the processing program or processing content (processing time, temperature, pressure, or supply amount), etc. are described. After the nozzle 30 reaches the first end TE1 of the processing section PS1 and stops, the substrate W is rotated under the control of the control unit 9 and the processing liquid is started to be discharged from the nozzle 30. Then, while spraying the treatment liquid, the nozzle 30 starts to move from the first end TE1 of the treatment section PS1 toward the second end TE2, and then stops at the second end TE2.

於步驟S22中,位置偏離檢測部91使相機70對照噴嘴30的移動開始拍攝(步驟S23)。相機70例如以33毫秒間隔對拍攝區域PA進行連續拍攝。即,相機70自如下的時間點開始連續拍攝,所述時間點是旋轉夾頭20保持成為處理對象的新的基板W後噴嘴30自待機位置朝處理區間PS1的第一端TE1開始移動的時間點。相機70開始連續拍攝的時間點亦為噴嘴30自待機位置開始移動的時間點,因此噴嘴30未到達拍攝區域PA。 In step S22, the positional deviation detection unit 91 causes the camera 70 to start imaging in accordance with the movement of the nozzle 30 (step S23). The camera 70 continuously photographs the photographing area PA at 33 millisecond intervals, for example. That is, the camera 70 starts continuous imaging from the time point when the spin chuck 20 holds the new substrate W as the processing target, and the nozzle 30 starts to move from the standby position toward the first end TE1 of the processing section PS1. point. The time point when the camera 70 starts continuous shooting is also the time point when the nozzle 30 starts to move from the standby position, so the nozzle 30 does not reach the shooting area PA.

於相機70開始連續拍攝後,位置偏離檢測部91確定與判定位置對應的實際圖像GP(步驟S24)。具體而言,位置偏離檢測部91的圖像判定部910自作為步驟S23中所獲得的圖像的多個實際圖像GP之中,確定與事前準備的步驟S13(圖6)中所登記 的多個基準圖像RP各自所示的判定位置對應的實際圖像GP。 After the camera 70 starts continuous shooting, the positional deviation detection unit 91 determines the actual image GP corresponding to the determined position (step S24). Specifically, the image determination unit 910 of the positional deviation detection unit 91 determines from among the plurality of actual images GP as the images obtained in step S23, and determines the value registered in step S13 (FIG. 6) of pre-preparation. The actual image GP corresponding to the determination position shown in each of the plurality of reference images RP.

圖10是概念性地表示確定與基準圖像RP對應的實際圖像GP的情況的圖。於圖10中所示的例子中,將基準圖像RP與實際圖像GP進行比較,藉此確定與基準圖像RP對應的實際圖像GP。於該比較中,亦可應用公知的圖案匹配的方法。 FIG. 10 is a diagram conceptually showing how the actual image GP corresponding to the reference image RP is determined. In the example shown in FIG. 10, the reference image RP is compared with the actual image GP, thereby determining the actual image GP corresponding to the reference image RP. In this comparison, a well-known pattern matching method can also be applied.

例如,將許多實際圖像GP之中,藉由圖案匹配而與對應於第一端TE1的第一基準圖像RP1一致度最大(差最小)的實際圖像GP設為噴嘴30位於第一端TE1時的第一實際圖像。另外,將與對應於第二端TE2的第二基準圖像RP21一致度最大的實際圖像GP設為噴嘴30位於第二端TE2時的第二實際圖像。將與多個中間基準圖像RPM的各個一致度最大的實際圖像GP分別設為如下的圖像,所述圖像是噴嘴30位於與處理區間PS1的中間的各中間基準圖像RPM(例如,包含圖9中所示的第一中間基準圖像RPM1及第二中間基準圖像RPM2)對應的各判定位置時的圖像。 For example, among many actual images GP, the actual image GP with the largest degree of coincidence (the smallest difference) with the first reference image RP1 corresponding to the first end TE1 by pattern matching is set as the nozzle 30 at the first end The first actual image at TE1. In addition, the actual image GP having the greatest degree of coincidence with the second reference image RP21 corresponding to the second end TE2 is set as the second actual image when the nozzle 30 is located at the second end TE2. The actual image GP with the greatest degree of coincidence with each of the plurality of intermediate reference images RPM is set as the following images, which are the respective intermediate reference images RPM (for example, , Including the images at each determination position corresponding to the first intermediate reference image RPM1 and the second intermediate reference image RPM2 shown in FIG. 9.

<停止判定> <Stop Judgment>

於圖10的說明中,作為判定規則,將與基準圖像RP的一致度作為基準,判定各實際圖像GP是否為與各判定位置對應的圖像。但是,判定規則並不限定於此。例如,針對與處理區間PS1的第一端TE1及第二端TE2的各位置對應的實際圖像GP,亦可將噴嘴30已停止確定為判定規則。 In the description of FIG. 10, as a determination rule, the degree of coincidence with the reference image RP is used as a reference, and it is determined whether each actual image GP is an image corresponding to each determination position. However, the judgment rule is not limited to this. For example, for the actual image GP corresponding to each position of the first end TE1 and the second end TE2 of the processing section PS1, it is also possible to determine that the nozzle 30 has stopped as a determination rule.

具體而言,噴嘴30的移動的停止判定亦可計算連續的兩個實際圖像GP、GP間的差值,並根據所述差值是否變成既定 的臨限值以下來進行。所謂連續的兩個實際圖像GP、GP間的差值,是指表示某一個實際圖像GP與緊隨其後的實際圖像GP的差值的差值圖像。另外,所謂計算差值,是指於該差值圖像中,求出將所有畫素的灰階值的絕對值累計所得的總和。 Specifically, the stop determination of the movement of the nozzle 30 may also calculate the difference between two consecutive actual images GP and GP, and determine whether the difference has become a predetermined value. Below the threshold. The so-called difference between two consecutive actual images GP and GP refers to a difference image representing the difference between a certain actual image GP and the actual image GP immediately following it. In addition, the calculation of the difference value refers to the sum of the absolute values of the grayscale values of all pixels in the difference image.

例如,噴嘴30自待機位置朝第一端TE1移動後,暫時停止於第一端TE1。於噴嘴30正朝第一端TE1移動時的連續的實際圖像GP、GP間,噴嘴30的像容易殘存於該些實際圖像GP、GP的差值圖像中。因此,差值圖像的灰階值的絕對值的總和變成比較大的值。相對於此,於噴嘴30停止於第一端TE1後的連續的實際圖像GP、GP間,噴嘴30的位置變成相同,因此於該些實際圖像GP、GP的差值圖像中噴嘴30被去除。因此,差值圖像的灰階值的絕對值的總和變成比較小的值。根據此種原理,藉由適當地設定臨限值,可容易且高精度地檢測噴嘴30已停止於第一端TE1。圖像判定部910亦可根據與第一端TE1處的噴嘴30的停止相同的原理,檢測第二端TE2處的噴嘴30的停止。 For example, after the nozzle 30 moves from the standby position to the first end TE1, it temporarily stops at the first end TE1. Between the continuous actual images GP and GP when the nozzle 30 is moving toward the first end TE1, the image of the nozzle 30 is likely to remain in the difference image of the actual images GP and GP. Therefore, the sum of the absolute values of the grayscale values of the difference image becomes a relatively large value. In contrast, between the continuous actual images GP and GP after the nozzle 30 stops at the first end TE1, the position of the nozzle 30 becomes the same. Therefore, the nozzle 30 is in the difference image between the actual images GP and GP. Is removed. Therefore, the sum of the absolute values of the grayscale values of the difference image becomes a relatively small value. According to this principle, by appropriately setting the threshold value, it is possible to easily and accurately detect that the nozzle 30 has stopped at the first end TE1. The image determination unit 910 may also detect the stop of the nozzle 30 at the second end TE2 based on the same principle as the stop of the nozzle 30 at the first end TE1.

再者,為了防止由雜訊等所引起的誤檢測,例如圖像判定部910亦可於連續的三個以上的實際圖像間計算差值。然後,圖像判定部910亦可於所獲得的差值均為臨限值以下的情況下,判定噴嘴30已停止。 Furthermore, in order to prevent false detection caused by noise or the like, for example, the image determination unit 910 may also calculate a difference between three or more consecutive actual images. Then, the image determination unit 910 may determine that the nozzle 30 has stopped when the obtained difference values are all equal to or less than the threshold value.

步驟S21~步驟S24的步驟是每當成為處理對象的基板W被搬入清洗處理單元1時執行的處理。即,於本實施方式中,每當旋轉夾頭20保持已被搬入清洗處理單元1的成為處理對象的 基板W且噴嘴30於處理區間PS1內移動時,確定與多個基準圖像RP的各個對應的實際圖像。 The steps from step S21 to step S24 are processes that are executed every time the substrate W to be processed is carried into the cleaning processing unit 1. That is, in the present embodiment, every time the rotating chuck 20 holds the processing target that has been carried into the cleaning processing unit 1 When the substrate W and the nozzle 30 move in the processing section PS1, the actual image corresponding to each of the plurality of reference images RP is determined.

於步驟S24後,位置偏離檢測部91的圖像比較部912將多個基準圖像RP與對應於各基準圖像RP的實際圖像進行比較,檢測噴嘴30於各判定位置上的位置偏離(步驟S25)。基準圖像RP是藉由在教導時,當噴嘴30正確地位於處理區間PS1的各判定位置時相機70對拍攝區域PA進行拍攝所獲取的圖像。另外,步驟S24中所確定的實際圖像是於旋轉夾頭20已保持作為處理對象的基板W的狀態下,噴嘴30於處理區間PS1內移動時相機70對拍攝區域PA進行拍攝所獲取的實際圖像,且為與各基準圖像RP對應(即,一致度高)的攝影圖像。因此,將各基準圖像RP與對應的實際圖像進行比較,藉此可判定於基板W的上方,噴嘴30是否於適當的位置上進行了移動、及噴嘴30是否已停止於適當的位置。 After step S24, the image comparison unit 912 of the positional deviation detection unit 91 compares the plurality of reference images RP with the actual image corresponding to each reference image RP, and detects the positional deviation of the nozzle 30 at each determination position ( Step S25). The reference image RP is an image acquired by the camera 70 photographing the imaging area PA when the nozzle 30 is correctly positioned at each determination position of the processing section PS1 during the teaching. In addition, the actual image determined in step S24 is the actual image obtained by the camera 70 photographing the imaging area PA when the nozzle 30 moves in the processing section PS1 in the state that the spin chuck 20 has held the substrate W as the processing target. The image is a photographed image corresponding to each reference image RP (that is, having a high degree of coincidence). Therefore, by comparing each reference image RP with the corresponding actual image, it can be determined whether the nozzle 30 has moved at an appropriate position above the substrate W, and whether the nozzle 30 has stopped at an appropriate position.

具體而言,圖像比較部912將步驟S13中所登記的多個基準圖像RP的各個與步驟S24中所確定的對應的實際圖像GP進行比較。然後,計算兩圖像的噴嘴30的座標的差(位置偏離)。 於該比較中,亦可應用公知的圖案匹配的方法。當藉由圖案匹配所計算的噴嘴30的位置偏離為步驟S14中所設定的臨限值以上時,圖像比較部912判定該判定位置上的噴嘴30的實際位置產生了位置偏離。當檢測到噴嘴30的位置偏離時,控制部9亦可進行規定的異常應對處理。作為異常應對處理,例如為發出警告(顯 示部95的警告的顯示、未圖示的燈的點亮、自未圖示的揚聲器中的警告聲的輸出等)、或清洗處理單元1的動作停止等。當所計算的噴嘴30的位置偏離較步驟S14中所設定的臨限值小時,判定於噴嘴30的實際位置未產生偏離。再者,於步驟S25中,不僅進行基於臨限值的位置偏離的判定,亦可將具體的位置偏離量顯示於例如顯示部95。 Specifically, the image comparison unit 912 compares each of the plurality of reference images RP registered in step S13 with the corresponding actual image GP determined in step S24. Then, the difference (positional deviation) of the coordinates of the nozzle 30 of the two images is calculated. In this comparison, a well-known pattern matching method can also be applied. When the positional deviation of the nozzle 30 calculated by the pattern matching is greater than or equal to the threshold value set in step S14, the image comparison unit 912 determines that the actual position of the nozzle 30 at the determined position has a positional deviation. When the positional deviation of the nozzle 30 is detected, the control unit 9 may also perform a predetermined abnormality response process. As an exception handling process, for example, to issue a warning (display The display of a warning by the indicator 95, the lighting of a lamp not shown, the output of a warning sound from a speaker not shown, etc.), the operation of the cleaning processing unit 1 is stopped, and the like. When the calculated position deviation of the nozzle 30 is smaller than the threshold value set in step S14, it is determined that the actual position of the nozzle 30 does not deviate. In addition, in step S25, not only the determination of the positional deviation based on the threshold value is performed, but the specific positional deviation amount may be displayed on the display unit 95, for example.

有時即便基準圖像RP上的噴嘴30的形狀與實際圖像GP上的噴嘴30的形狀一致,根據各圖像具有的位置資訊所求出的噴嘴30的位置亦於水平方向或垂直方向上偏離。於本實施方式中,當於實際圖像GP上,噴嘴30於水平方向上產生了位置偏離時,判定為存在噴嘴30於水平方向上產生了位置偏離的可能性。 另外,當於實際圖像GP上,噴嘴30於垂直方向產生了位置偏離時,判定為存在噴嘴30於垂直方向上產生了位置偏離的可能性。 噴嘴30的搜索可利用「基於形狀的圖案匹配」這一方法。具體而言,自實際圖像GP中搜索與已切出的基準圖像RP的噴嘴30的邊緣資訊一致的區域,並將已找到的區域的座標值與基準圖像RP的座標值進行比較,藉此判定是否產生了位置偏離。 Sometimes even if the shape of the nozzle 30 on the reference image RP is the same as the shape of the nozzle 30 on the actual image GP, the position of the nozzle 30 obtained from the position information of each image is also in the horizontal or vertical direction. Deviate. In this embodiment, when the position of the nozzle 30 is deviated in the horizontal direction on the actual image GP, it is determined that there is a possibility that the position of the nozzle 30 is deviated in the horizontal direction. In addition, when the nozzle 30 has a positional deviation in the vertical direction on the actual image GP, it is determined that there is a possibility that the nozzle 30 has a positional deviation in the vertical direction. The search of the nozzle 30 can use the method of "shape-based pattern matching". Specifically, the actual image GP is searched for an area consistent with the edge information of the nozzle 30 of the reference image RP that has been cut out, and the coordinate value of the found area is compared with the coordinate value of the reference image RP, This determines whether a positional deviation has occurred.

以上是關於噴嘴30的位置偏離的檢測處理的說明,但關於噴嘴30以外的其他噴嘴60、噴嘴65,亦能夠以與圖7中所示的流程相同的程序檢測位置偏離。再者,當噴嘴30以外的其他噴嘴以於已停止於基板W上的固定的處理位置的狀態下,進行處理液的噴出的方式構成時,如上所述,於作為事前準備的步驟S13 中,將已正確地停止於處理位置的狀態的噴嘴30的圖像作為基準圖像RP來登記。因此,於步驟S24中,藉由匹配或停止判定,將與處理位置對應的實際圖像GP作為與基準圖像RP對應的圖像來確定,於步驟S25中,亦可根據該些基準圖像RP與實際圖像GP的比較,判定其他噴嘴的位置偏離。 The above is the description of the detection processing for the positional deviation of the nozzle 30, but for nozzles 60 and 65 other than the nozzle 30, the positional deviation can be detected by the same procedure as the flow shown in FIG. 7. In addition, when nozzles other than the nozzle 30 are configured to eject the processing liquid in a state where they are stopped at a fixed processing position on the substrate W, as described above, step S13 is prepared in advance. Here, the image of the nozzle 30 in the state where it has stopped at the processing position correctly is registered as the reference image RP. Therefore, in step S24, by matching or stopping determination, the actual image GP corresponding to the processing position is determined as the image corresponding to the reference image RP, and in step S25, the actual image GP corresponding to the reference image The comparison between RP and the actual image GP determines the positional deviation of other nozzles.

<效果> <Effect>

如以上般,於本實施方式的基板處理裝置100中,可檢測一面於處理區間PS1內移動一面噴出處理液的噴嘴30的位置偏離。 尤其可檢測第一端TE1及第二端TE2處的噴嘴30的位置偏離,因此可檢查噴嘴30是否正於應進行移動的處理區間PS1的兩端之間正確地移動。藉此,可適當地進行使用移動的噴嘴30的液體處理。 As described above, in the substrate processing apparatus 100 of the present embodiment, it is possible to detect the positional deviation of the nozzle 30 that discharges the processing liquid while moving in the processing section PS1. In particular, the positional deviation of the nozzle 30 at the first end TE1 and the second end TE2 can be detected, so it can be checked whether the nozzle 30 is correctly moving between the two ends of the processing section PS1 to be moved. Thereby, the liquid treatment using the moving nozzle 30 can be appropriately performed.

可判定於處理區間PS1的中途移動的噴嘴30是否正於正確的垂直方向上,於正確的位置上進行移動。因此,可判定是否正於自基板W起適當的高度,供給自噴嘴30中噴出的處理液。 藉此,可適當地進行使用移動的噴嘴30的液體處理。 It can be determined whether the nozzle 30 moved in the middle of the processing section PS1 is moving in the correct vertical direction and in the correct position. Therefore, it can be determined whether it is at an appropriate height from the substrate W and the processing liquid ejected from the nozzle 30 is supplied. Thereby, the liquid treatment using the moving nozzle 30 can be appropriately performed.

根據各判定位置的基準圖像RP與實際圖像GP的比較,進行噴嘴30於各判定位置上的位置偏離的判定。因此,即便噴嘴30因於處理區間PS1內移動而導致形狀變化,亦可對應於各判定位置的噴嘴30的形狀高精度地確定實際圖像GP。因此,可高精度地檢測各判定位置上的噴嘴30的位置偏離。 Based on the comparison between the reference image RP at each determination position and the actual image GP, the positional deviation of the nozzle 30 at each determination position is determined. Therefore, even if the shape of the nozzle 30 changes due to movement in the processing section PS1, the actual image GP can be determined with high accuracy corresponding to the shape of the nozzle 30 at each determination position. Therefore, the positional deviation of the nozzle 30 at each determination position can be detected with high accuracy.

<利用基準軌道資訊的位置偏離檢測> <Position deviation detection using reference track information>

於所述說明中,藉由圖案匹配來將基準圖像RP與實際圖像GP進行比較,藉此檢測噴嘴30的位置偏離。但是,亦可利用於處理區間PS1內移動的噴嘴30的軌道(路徑)的資訊,檢測噴嘴30的位置偏離。 In the above description, the reference image RP is compared with the actual image GP by pattern matching, thereby detecting the positional deviation of the nozzle 30. However, it is also possible to use the information of the trajectory (path) of the nozzle 30 moving in the processing section PS1 to detect the positional deviation of the nozzle 30.

圖11是概念性地表示基準軌道資訊ST1的圖。基準軌道資訊ST1是表示噴嘴30已自處理區間PS1的第一端TE1正確地移動至第二端TE2為止時的噴嘴30的路徑的資訊。基準軌道資訊ST1例如,可根據多個基準圖像RP來生成。 FIG. 11 is a diagram conceptually showing the reference track information ST1. The reference trajectory information ST1 is information indicating the path of the nozzle 30 when the nozzle 30 has correctly moved from the first end TE1 of the processing section PS1 to the second end TE2. The reference track information ST1 can be generated based on a plurality of reference images RP, for example.

基準軌道資訊ST1亦可藉由位置偏離檢測部91根據基準圖像RP確定噴嘴30的位置來生成。具體而言,如圖11所示,亦可根據第一基準圖像RP1及第二基準圖像RP2、以及多個中間基準圖像RPM確定噴嘴30的前端位置,並且藉由公知的內插處理來使該些前端位置相互接合,藉此生成基準軌道資訊ST1。基準軌道資訊ST1的生成亦可於步驟S13後,在適宜的時機進行。 再者,不僅根據步驟S13中所登記的多個基準圖像RP,亦可利用藉由步驟S12的連續拍攝所獲得的一連串的攝影圖像,生成基準軌道資訊ST1。於此情況下,可生成表示噴嘴30的精確的軌道的基準軌道資訊ST1。 The reference trajectory information ST1 may also be generated by the position deviation detection unit 91 determining the position of the nozzle 30 based on the reference image RP. Specifically, as shown in FIG. 11, the tip position of the nozzle 30 can also be determined based on the first reference image RP1, the second reference image RP2, and a plurality of intermediate reference images RPM, and the position of the tip of the nozzle 30 can be determined by a known interpolation process. The front ends are joined to each other, thereby generating reference track information ST1. The generation of the reference track information ST1 may also be performed at an appropriate time after step S13. Furthermore, not only based on the plurality of reference images RP registered in step S13, but also a series of photographed images obtained by continuous photographing in step S12, to generate reference trajectory information ST1. In this case, the reference trajectory information ST1 indicating the precise trajectory of the nozzle 30 can be generated.

於步驟S25中,當位置偏離檢測部91使用基準軌道資訊ST1來檢測噴嘴30的位置偏離時,根據步驟S24中所確定的實際圖像GP來求出噴嘴30的垂直位置,並與根據基準軌道資訊ST1所求出的垂直位置進行比較,藉此檢測噴嘴30的垂直方向的位置 偏離。 In step S25, when the positional deviation detection unit 91 uses the reference track information ST1 to detect the positional deviation of the nozzle 30, the vertical position of the nozzle 30 is calculated based on the actual image GP determined in step S24, and is compared with the reference track information ST1. The vertical position obtained by the information ST1 is compared to detect the vertical position of the nozzle 30 Deviate.

<基準圖像RP的其他登記處理> <Other registration processing of reference image RP>

於圖9中,基準圖像登記部90藉由圖案匹配處理而自動地登記多個基準圖像RP。但是,基準圖像登記部90亦可將操作員已指定的攝影圖像作為基準圖像RP來登記。 In FIG. 9, the reference image registration unit 90 automatically registers a plurality of reference images RP through the pattern matching process. However, the reference image registration unit 90 may also register a captured image designated by the operator as the reference image RP.

圖12是表示連續拍攝噴嘴30的情況的時序圖。如上所述,若指令發送部92對噴嘴30、噴嘴60、噴嘴65輸出指令,則使噴嘴基座33、噴嘴基座63、噴嘴基座68進行動作。此時,相機70對應於由指令發送部92所進行的指令發送,對拍攝區域PA進行連續拍攝。 FIG. 12 is a timing chart showing a case where the nozzle 30 is continuously photographed. As described above, when the command transmission unit 92 outputs commands to the nozzle 30, the nozzle 60, and the nozzle 65, the nozzle base 33, the nozzle base 63, and the nozzle base 68 are operated. At this time, the camera 70 responds to the command transmission by the command transmission unit 92 to continuously photograph the imaging area PA.

於指令中記錄有表示噴嘴30、噴嘴60、噴嘴65的任一個的資訊,及表示各噴嘴30、噴嘴60、噴嘴65的噴出頭的移動目的地的位置的資訊。如圖12所示,對應於指令C1~指令C4的發送進行連續拍攝,藉此獲取移動的噴嘴30、噴嘴60、噴嘴65的攝影圖像。 In the command, information indicating any one of the nozzle 30, nozzle 60, and nozzle 65 and information indicating the position of the movement destination of the ejection head of each nozzle 30, nozzle 60, and nozzle 65 are recorded. As shown in FIG. 12, continuous shooting is performed corresponding to the transmission of the commands C1 to C4, thereby acquiring photographic images of the nozzle 30, nozzle 60, and nozzle 65 that are moving.

於圖6中所示的步驟S11中,藉由將指令發送至噴嘴基座33,噴嘴30自待機位置移動至第一端TE1為止。然後,藉由進一步將指令發送至噴嘴基座33,噴嘴30自第一端TE1朝第二端TE2移動。另外,對應於該些指令發送,進行步驟S12的噴嘴30的連續拍攝。 In step S11 shown in FIG. 6, by sending a command to the nozzle base 33, the nozzle 30 moves from the standby position to the first end TE1. Then, by further sending the command to the nozzle base 33, the nozzle 30 moves from the first end TE1 to the second end TE2. In addition, in response to these command transmissions, continuous shooting of the nozzle 30 in step S12 is performed.

藉由對應於指令所執行的連續拍攝所獲取的一連串的攝影圖像與成為所述連續拍攝的觸發器的指令建立對應來保存。 例如,對應於指令C1所獲取的一連串的攝影圖像與該指令C1建立對應而保存於記憶部94。因此,藉由指定指令C1,可調出與該指令C1對應的一連串的攝影圖像。 A series of photographed images acquired by the continuous photographing executed corresponding to the instruction are stored in correspondence with the instruction that becomes the trigger of the continuous photographing. For example, a series of captured images acquired corresponding to the command C1 is associated with the command C1 and stored in the storage unit 94. Therefore, by specifying the command C1, a series of photographed images corresponding to the command C1 can be retrieved.

圖13是表示用於進行基準圖像RP的登記的登記畫面W1的圖。登記畫面W1是基準圖像登記部90顯示於顯示部95的畫面。登記畫面W1具有圖像顯示區域WR2、噴嘴/位置選擇區域WR4、顯示控制區域WR6、以及登記決定按鈕BT4。 FIG. 13 is a diagram showing a registration screen W1 for performing registration of the reference image RP. The registration screen W1 is a screen displayed on the display unit 95 by the reference image registration unit 90. The registration screen W1 has an image display area WR2, a nozzle/position selection area WR4, a display control area WR6, and a registration decision button BT4.

圖像顯示區域WR2是將一連串的攝影圖像按獲取順序連續地顯示的區域。噴嘴/位置選擇區域WR4是受理選擇多個噴嘴30、60、65的任一個的操作、及選擇已被選擇的噴嘴的移動目的地的操作的區域。 The image display area WR2 is an area in which a series of captured images are continuously displayed in the order of acquisition. The nozzle/position selection area WR4 is an area that accepts the operation of selecting any one of the plurality of nozzles 30, 60, 65 and the operation of selecting the movement destination of the selected nozzle.

顯示控制區域WR6是受理控制圖像顯示區域WR2的圖像顯示的操作的區域。於顯示控制區域WR6,準備有跳過按鈕BT2。跳過按鈕BT2受理選擇顯示於圖像顯示區域WR2的一連串的攝影圖像的操作。具體而言,操作員以於噴嘴/位置選擇區域WR4中選擇了特定的噴嘴、及該噴嘴的移動目的地的狀態,進一步操作跳過按鈕BT2。於是,基準圖像登記部90將與對應於已被選擇的噴嘴及移動目的地的指令建立了對應的一連串的攝影圖像之中,最初的圖像顯示於圖像顯示區域WR2。如此,操作員將噴嘴/位置選擇區域WR4與跳過按鈕BT2組合操作,藉此自於一個處理程式間所拍攝的所有攝影圖像中,找出目標噴嘴的攝影圖像並顯示於圖像顯示區域WR2。 The display control area WR6 is an area that accepts an operation of controlling image display in the image display area WR2. In the display control area WR6, a skip button BT2 is prepared. The skip button BT2 accepts an operation to select a series of captured images displayed in the image display area WR2. Specifically, the operator further operates the skip button BT2 in a state where a specific nozzle and the movement destination of the nozzle are selected in the nozzle/position selection area WR4. Then, the reference image registration unit 90 displays the first image in the image display area WR2 among the series of captured images that are associated with the command corresponding to the selected nozzle and the moving destination. In this way, the operator combines the nozzle/position selection area WR4 with the skip button BT2 to find out the photographic image of the target nozzle from all photographic images taken in one processing program and display it on the image display Area WR2.

登記決定按鈕BT4受理將已被顯示於圖像顯示區域WR2的攝影圖像作為基準圖像RP來登記的操作。操作員於顯示控制區域WR6中進行操作,藉此使所期望的攝影圖像顯示於圖像顯示區域WR2,並於該狀態下操作登記決定按鈕BT4。藉此,將已被顯示於圖像顯示區域WR2的攝影圖像作為基準圖像RP來登記。 The registration decision button BT4 accepts an operation of registering the captured image displayed in the image display area WR2 as the reference image RP. The operator operates in the display control area WR6 to display a desired captured image in the image display area WR2, and operates the registration decision button BT4 in this state. Thereby, the captured image that has been displayed in the image display area WR2 is registered as the reference image RP.

根據登記畫面W1,操作員藉由操作噴嘴/位置選擇區域WR4,而可指定指令發送部92發送的指令。藉此,將與指令建立了對應的一連串的攝影圖像選擇性地顯示於圖像顯示區域WR2。 因此,操作員可使表示作為基準圖像RP的登記對象的噴嘴移動的情況的一連串的攝影圖像有效率地顯示並加以確認。因此,操作員藉由操作登記決定按鈕BT4,而可有效率地登記基準圖像RP。 According to the registration screen W1, the operator can designate the command sent by the command sending unit 92 by operating the nozzle/position selection area WR4. Thereby, a series of captured images corresponding to the command is selectively displayed in the image display area WR2. Therefore, the operator can efficiently display and confirm a series of captured images indicating the movement of the nozzle that is the registration target of the reference image RP. Therefore, the operator can efficiently register the reference image RP by operating the registration decision button BT4.

再者,於本實施方式中,噴嘴30包括一個噴出頭31,但亦可包括多個噴出頭31。於此情況下,指令發送部92將指令發送至噴嘴基座33,藉此多個噴出頭中的目標噴出頭朝既定的位置移動。於所述指令中,亦可不僅包含表示噴嘴30的資訊,亦包含表示多個噴出頭中的任一個噴出頭的資訊。另外,亦可於噴嘴/位置選擇區域WR4中,受理指定特定的噴出頭的操作,藉此可指定指令。 Furthermore, in this embodiment, the nozzle 30 includes one ejection head 31, but may also include a plurality of ejection heads 31. In this case, the command sending unit 92 sends the command to the nozzle base 33, whereby the target ejection head among the plurality of ejection heads moves to a predetermined position. The command may include not only information indicating the nozzle 30, but also information indicating any one of a plurality of ejection heads. In addition, in the nozzle/position selection area WR4, an operation to designate a specific ejection head may be accepted, thereby allowing a command to be designated.

<2.第二實施方式> <2. Second embodiment>

繼而,對第二實施方式進行說明。再者,於以後的說明中,對具有與已說明的元件相同的功能的元件賦予相同的符號、或追 加了字母文字的符號,有時省略詳細的說明。 Next, the second embodiment will be described. In addition, in the following description, elements having the same functions as the elements already described are given the same reference numerals or Letters and symbols are added, and detailed descriptions are sometimes omitted.

圖14是表示第二實施方式的控制部9A的圖。本實施方式的控制部9A於包括位置偏離檢測部91A這一點上與控制部9不同。位置偏離檢測部91A與位置偏離檢測部91同樣地包括檢測噴嘴30的位置偏離的功能,但於包括圖像判定部910A這一點上與位置偏離檢測部91不同。 FIG. 14 is a diagram showing the control unit 9A of the second embodiment. The control unit 9A of this embodiment is different from the control unit 9 in that it includes a positional deviation detection unit 91A. The positional deviation detection unit 91A includes the function of detecting the positional deviation of the nozzle 30 similarly to the positional deviation detection unit 91, but is different from the positional deviation detection unit 91 in that it includes the image determination unit 910A.

圖像判定部910A包括特徵向量算出部9102與分類器K2。特徵向量算出部9102根據藉由步驟S23的連續拍攝所獲取的各實際圖像GP,算出作為多種特徵量的排列的特徵向量。特徵量的項目例如為各實際圖像GP的灰度中的畫素值的總和、亮度的總和、畫素值的標準偏差及亮度的標準偏差等。分類器K2根據藉由特徵向量算出部9102所算出的特徵向量,於等級間對實際圖像GP進行分類。此處,定義有與基板W上的噴嘴30的不同的位置對應的多個等級。 The image determination unit 910A includes a feature vector calculation unit 9102 and a classifier K2. The feature vector calculation unit 9102 calculates a feature vector that is an arrangement of a plurality of feature amounts based on each actual image GP acquired by the continuous shooting in step S23. The items of the feature amount are, for example, the sum of the pixel values in the gradation of each actual image GP, the sum of the brightness, the standard deviation of the pixel values, the standard deviation of the brightness, and the like. The classifier K2 classifies the actual image GP among the levels based on the feature vector calculated by the feature vector calculation unit 9102. Here, a plurality of levels corresponding to different positions of the nozzle 30 on the substrate W are defined.

更詳細而言,將與藉由基準圖像登記部90所登記的各基準圖像RP對應的噴嘴30的各判定位置以等級的形式來定義。例如,定義有與第一端TE1、第二端TE2分別對應的兩個等級。另外,定義有與處理區間PS1的中間的不同的判定位置分別對應的多個等級。 In more detail, each determination position of the nozzle 30 corresponding to each reference image RP registered by the reference image registration unit 90 is defined in the form of a level. For example, two levels are defined respectively corresponding to the first end TE1 and the second end TE2. In addition, a plurality of levels respectively corresponding to different determination positions in the middle of the processing section PS1 are defined.

圖像判定部910A與圖像判定部910同樣地,於圖7中所示的步驟S24中進行圖像判定處理。具體而言,當藉由分類器K2而將某一實際圖像GP分類成特定等級時,圖像判定部910A 判定該實際圖像GP是否為位於與所述特定等級對應的判定位置時的圖像。例如,當分類器K2將實際圖像GP分類成與第一端TE1對應的等級時,圖像判定部910A將該實際圖像GP判定為噴嘴30位於第一端TE1時的圖像。 The image determination unit 910A performs image determination processing in step S24 shown in FIG. 7 in the same way as the image determination unit 910. Specifically, when a certain actual image GP is classified into a specific level by the classifier K2, the image determination unit 910A It is determined whether or not the actual image GP is an image at the determined position corresponding to the specific level. For example, when the classifier K2 classifies the actual image GP into a level corresponding to the first end TE1, the image determination unit 910A determines the actual image GP as an image when the nozzle 30 is located at the first end TE1.

如圖14所示,於控制部9A連接有通訊部97。通訊部97是為了控制部9A與伺服器8進行資料通訊而設置。基板處理裝置100、通訊部97及伺服器8構成基板處理系統。所述分類器K2是伺服器8藉由機器學習所生成者,被自伺服器8提供至控制部9A。 As shown in FIG. 14, a communication unit 97 is connected to the control unit 9A. The communication unit 97 is provided for data communication between the control unit 9A and the server 8. The substrate processing apparatus 100, the communication unit 97, and the server 8 constitute a substrate processing system. The classifier K2 is generated by the server 8 through machine learning, and is provided from the server 8 to the control unit 9A.

伺服器8包括機器學習部82。機器學習部82藉由機器學習而生成分類器K2。作為機器學習,可採用神經網路、決策樹(decision tree)、支援向量機(Support Vector Machine,SVM)、辨別分析等公知的方法。另外,用於機器學習的教學資料包含:利用相機70對位於特定的判定位置的噴嘴30進行攝影所獲得的攝影圖像的特徵向量、及作為表示與所述特定的判定位置對應的等級的資訊的等級標籤。針對與多個判定位置分別對應的各等級來準備教學資料。 The server 8 includes a machine learning unit 82. The machine learning unit 82 generates a classifier K2 through machine learning. As machine learning, well-known methods such as neural network, decision tree (decision tree), support vector machine (SVM), discriminant analysis, etc. can be used. In addition, the teaching materials for machine learning include: a feature vector of a photographed image obtained by photographing a nozzle 30 located at a specific determination position by the camera 70, and information indicating a level corresponding to the specific determination position The grade label. Teaching materials are prepared for each level corresponding to a plurality of determination positions.

基板處理裝置100並非必須與伺服器8連接。例如,基板處理裝置100亦可不包括機器學習部82。於此情況下,可於基板處理裝置100中生成分類器K2。 The substrate processing apparatus 100 does not necessarily need to be connected to the server 8. For example, the substrate processing apparatus 100 may not include the machine learning unit 82. In this case, the classifier K2 can be generated in the substrate processing apparatus 100.

再者,藉由分類器K2來判定噴嘴30位於判定位置時的實際圖像GP,與其同樣地,針對其他噴嘴60、噴嘴65,亦準備 於對應於不同的位置的等級間進行分類的分類器,亦可藉由該分類器來確定位於判定位置時的實際圖像GP。 Furthermore, the actual image GP when the nozzle 30 is determined to be at the determination position is determined by the classifier K2, and similarly, the other nozzles 60 and 65 are also prepared A classifier that classifies between levels corresponding to different positions can also use the classifier to determine the actual image GP at the determined position.

圖15是概念性地表示分類器K2的圖。圖15中所示的分類器K2是藉由神經網路NN1來構築者。神經網路NN1包括輸入層、中間層、輸出層,於輸入層,被輸入作為分類對象的圖像(作為檢查對象的實際圖像GP)的多種特徵量。另外,針對噴嘴30的不同的各判定位置定義有多個等級,於輸出層中,實際圖像GP被分類成任一個等級。再者,當實際圖像GP未被分類成任一個等級時,分類器K2輸出無法分類。於圖15中,分類器K2包括一個中間層,但亦可包括多個中間層。 Fig. 15 is a diagram conceptually showing the classifier K2. The classifier K2 shown in Fig. 15 is constructed by the neural network NN1. The neural network NN1 includes an input layer, an intermediate layer, and an output layer. In the input layer, various feature quantities of the image as the classification target (the actual image GP as the inspection target) are input. In addition, multiple levels are defined for different determination positions of the nozzle 30, and in the output layer, the actual image GP is classified into any one level. Furthermore, when the actual image GP is not classified into any level, the classifier K2 outputs that it cannot be classified. In FIG. 15, the classifier K2 includes an intermediate layer, but may also include multiple intermediate layers.

於圖15中所示的分類器K2中,根據作為相機70的拍攝區域PA的整體圖像算出特徵向量,分類器K2根據該特徵向量進行分類。但是,亦可將以包含噴嘴30的前端部的方式自整體圖像中切取一部分而成的圖像作為教學資料,機器學習部82進行學習,藉此生成分類器K2。 In the classifier K2 shown in FIG. 15, a feature vector is calculated from the overall image of the photographing area PA of the camera 70, and the classifier K2 performs classification based on the feature vector. However, an image obtained by cutting out a part of the entire image so as to include the tip portion of the nozzle 30 may be used as a teaching material, and the machine learning unit 82 may perform learning, thereby generating the classifier K2.

如此,根據本實施方式,藉由利用由機器學習所生成的分類器K2的分類,可高精度地確定與判定位置對應的實際圖像GP。因此,藉由基準圖像RP與實際圖像GP的比較,可適當地檢測判定位置上的噴嘴30的位置偏離。 In this way, according to the present embodiment, by using the classification by the classifier K2 generated by machine learning, the actual image GP corresponding to the determination position can be specified with high accuracy. Therefore, by comparing the reference image RP with the actual image GP, the positional deviation of the nozzle 30 at the determination position can be appropriately detected.

雖然對本發明進行了詳細說明,但所述說明於所有方面均為例示,本發明並不限定於此。將未例示的無數的變形例解釋為可不脫離本發明的範圍而想到者。所述各實施方式及各變形例 中所說明的各構成只要不相互矛盾,則可適宜組合、或省略。 Although this invention was demonstrated in detail, the said description is an illustration in all respects, and this invention is not limited to this. The countless modified examples not illustrated are interpreted as those that can be thought of without departing from the scope of the present invention. The various embodiments and modifications described above As long as the components described in the above do not contradict each other, they may be combined or omitted as appropriate.

S11~S15:步驟 S11~S15: steps

Claims (13)

一種基板處理方法,其是對基板進行處理的基板處理方法,包括:(a)使噴嘴於沿水平方向延伸的既定的處理區間內移動的步驟;(b)拍攝藉由所述步驟(a)而於所述處理區間內移動的所述噴嘴的步驟;(c)將於所述步驟(b)中,所述噴嘴位於作為所述處理區間的兩端的第一端及第二端時所獲得的攝影圖像作為第一基準圖像及第二基準圖像來登記的步驟;(d)使所述噴嘴於所述處理區間內移動的步驟;(e)拍攝藉由所述步驟(d)而於所述處理區間內移動的所述噴嘴的步驟;(f)針對藉由所述步驟(e)所獲得的多個攝影圖像,根據判定規則,判定是否為與所述第一端及所述第二端分別對應的圖像的圖像判定步驟;以及(g)將所述第一基準圖像及所述第二基準圖像、與藉由所述步驟(f)而判定為與所述第一端及所述第二端分別對應的第一實際圖像及第二實際圖像進行比較,並檢測於所述步驟(d)中分別配置於所述處理區間的兩端的所述噴嘴的位置偏離的步驟;所述步驟(f)中的所述判定規則,是將與所述第一及第二基準圖像的一致度作為基準的判定規則,或是將所述噴嘴已停止作 為判定規則。 A substrate processing method, which is a substrate processing method for processing a substrate, includes: (a) a step of moving a nozzle in a predetermined processing interval extending in a horizontal direction; (b) photographing by the step (a) And the step of moving the nozzle in the treatment section; (c) will be obtained when the nozzle is located at the first end and the second end as the two ends of the treatment section in the step (b) The step of registering the photographed image as the first reference image and the second reference image; (d) the step of moving the nozzle within the processing interval; (e) the step of photographing by the step (d) And the step of the nozzle moving in the processing interval; (f) for the plurality of photographic images obtained by the step (e), according to the determination rule, determine whether the first end and the The image determination step of the images corresponding to the second ends; The first actual image and the second actual image respectively corresponding to the first end and the second end are compared, and the step (d) is respectively configured at the two ends of the processing interval. The step of deviating the position of the nozzle; the determination rule in the step (f) is a determination rule based on the degree of coincidence with the first and second reference images, or the nozzle has stopped do It is the judgment rule. 如申請專利範圍第1項所述的基板處理方法,更包括:(h)於所述步驟(c)後,且於所述步驟(d)前,將處理對象的基板保持於基板保持部的步驟。 The substrate processing method described in the first item of the patent application further includes: (h) after the step (c) and before the step (d), holding the substrate to be processed in the substrate holding portion step. 如申請專利範圍第1項或第2項所述的基板處理方法,其中所述步驟(d)包含:(d1)使所述噴嘴自偏向所述第一端的位置朝所述第二端移動的步驟,且所述步驟(f)包含:(f1)根據連續的攝影圖像間的差值,判定是否為與所述第一端及所述第二端分別對應的圖像的步驟。 The substrate processing method according to item 1 or item 2 of the scope of patent application, wherein the step (d) comprises: (d1) moving the nozzle from a position biased toward the first end toward the second end And the step (f) includes: (f1) a step of determining whether it is an image corresponding to the first end and the second end, respectively, based on the difference between the consecutive photographed images. 如申請專利範圍第1項或第2項所述的基板處理方法,其中所述步驟(c)包含:(c1)登記藉由在所述步驟(b)中拍攝於所述處理區間的中間移動的所述噴嘴所獲得的中間基準圖像的步驟,且所述步驟(g)包含:(g1)根據所述中間基準圖像、與藉由在所述步驟(e)中拍攝於所述處理區間的中間移動的所述噴嘴所獲得的中間實際圖像的比較,檢測於所述步驟(d)中於所述處理區間的中間移動的所述噴嘴的位置偏離的步驟。 The substrate processing method described in item 1 or item 2 of the scope of patent application, wherein the step (c) includes: (c1) registration by moving in the middle of the processing section by shooting in the step (b) The step of obtaining an intermediate reference image obtained by the nozzle, and the step (g) includes: (g1) according to the intermediate reference image, and by photographing in the process in the step (e) The comparison of the intermediate actual images obtained by the nozzles moving in the middle of the interval is detected in the step of detecting the positional deviation of the nozzles moving in the middle of the processing interval in the step (d). 如申請專利範圍第4項所述的基板處理方法,其中所述步驟(g)包含: (g2)根據所述中間基準圖像與所述中間實際圖像,檢測垂直方向上的所述噴嘴的位置偏離的步驟。 The substrate processing method according to item 4 of the scope of patent application, wherein the step (g) comprises: (g2) A step of detecting the positional deviation of the nozzle in the vertical direction based on the intermediate reference image and the intermediate actual image. 如申請專利範圍第4項所述的基板處理方法,更包括:(i)根據藉由所述步驟(c1)所登記的多個所述中間基準圖像,生成表示於所述處理區間內移動的所述噴嘴的軌道的基準軌道資訊的步驟,且所述步驟(g)包含:(g3)根據所述中間實際圖像與所述基準軌道資訊,檢測垂直方向上的所述噴嘴的位置偏離的步驟。 The substrate processing method described in claim 4 further includes: (i) based on the plurality of intermediate reference images registered in the step (c1), generating a movement in the processing interval The step of reference track information of the nozzle track, and the step (g) includes: (g3) detecting the position deviation of the nozzle in the vertical direction based on the intermediate actual image and the reference track information A step of. 如申請專利範圍第4項所述的基板處理方法,其中所述步驟(c1)包含:(c11)將藉由在所述步驟(b)中拍攝於所述處理區間的中間移動的所述噴嘴所獲得的多個攝影圖像中的一個作為第一中間基準圖像來登記的步驟;以及(c12)於所述步驟(c11)後,將如下的攝影圖像作為第二中間基準圖像來登記的步驟,所述攝影圖像是所述多個攝影圖像之中緊隨所述第一中間基準圖像之後的圖像,且為與所述第一中間基準圖像的一致度變成規定的臨限值以下的圖像。 The substrate processing method according to claim 4, wherein the step (c1) includes: (c11) photographing the nozzle moving in the middle of the processing section in the step (b) The step of registering one of the obtained multiple photographic images as the first intermediate reference image; and (c12) after the step (c11), the following photographic image is used as the second intermediate reference image In the registration step, the photographed image is an image immediately following the first intermediate reference image among the plurality of photographed images, and the degree of coincidence with the first intermediate reference image becomes a predetermined The image below the threshold. 如申請專利範圍第1項或第2項所述的基板處理方法,其中所述步驟(a)包含:(a1)控制部將使所述噴嘴自所述第一端移動至所述第二端為止的控制訊號發送至噴嘴移動部的步驟,且 所述步驟(b)包含:(b1)對應於所述控制訊號的發送來拍攝所述噴嘴,而獲取多個攝影圖像的步驟。 The substrate processing method according to item 1 or item 2 of the scope of patent application, wherein the step (a) includes: (a1) the control unit moves the nozzle from the first end to the second end The control signal so far is sent to the nozzle moving part, and The step (b) includes: (b1) a step of photographing the nozzle corresponding to the transmission of the control signal, and acquiring a plurality of photographed images. 如申請專利範圍第8項所述的基板處理方法,其中所述步驟(b)更包含:(b2)將所述控制訊號所示的控制資訊、與藉由對應於所述控制訊號的拍攝所獲取的多個攝影圖像建立對應來記錄的步驟。 The substrate processing method as described in item 8 of the scope of patent application, wherein the step (b) further comprises: (b2) combining the control information indicated by the control signal with the photographing method corresponding to the control signal A step of establishing correspondences between the acquired multiple photographic images and recording them. 如申請專利範圍第9項所述的基板處理方法,其中所述步驟(c)包含:(c2)將藉由所述步驟(b)所獲得的一連串的攝影圖像按獲取順序連續地顯示於顯示部的步驟,且所述步驟(c2)包含:(c21)指定所述控制資訊的步驟;以及(c22)將與藉由所述步驟(c21)所指定的所述控制資訊對應的攝影圖像顯示於所述顯示部的步驟。 The substrate processing method according to the ninth patent application, wherein the step (c) includes: (c2) a series of photographic images obtained by the step (b) are successively displayed in the order of acquisition The step of displaying the part, and the step (c2) includes: (c21) the step of specifying the control information; and (c22) the photographed image corresponding to the control information specified by the step (c21) The step of displaying an image on the display unit. 一種基板處理裝置,其是對基板進行處理的基板處理裝置,包括:基板保持部,以水平姿勢保持基板;噴嘴,對已由所述基板保持部保持的基板供給處理液;噴嘴移動部,使所述噴嘴於沿水平方向延伸的既定的處理區間內移動;相機,藉由拍攝於所述處理區間內移動的所述噴嘴而獲取攝 影圖像;基準圖像登記部,登記藉由所述相機拍攝位於作為所述處理區間的兩端的第一端及第二端的所述噴嘴所獲得的第一基準圖像及第二基準圖像;以及位置偏離檢測部,檢測所述第一端及所述第二端處的所述噴嘴的位置偏離;且所述位置偏離檢測部包括:圖像判定部,針對藉由利用所述相機拍攝於所述處理區間內移動的所述噴嘴所獲取的實際圖像,根據判定規則,判定是否為與所述第一端及所述第二端分別對應的圖像;以及圖像比較部,將所述第一基準圖像及所述第二基準圖像、與藉由所述圖像判定部而判定為與所述第一端及所述第二端分別對應的第一實際圖像及第二實際圖像進行比較;所述圖像判定部中的所述判定規則,是將與所述第一及第二基準圖像的一致度作為基準的判定規則,或是將所述噴嘴已停止作為判定規則。 A substrate processing apparatus, which is a substrate processing apparatus for processing substrates, includes: a substrate holding portion that holds the substrate in a horizontal position; a nozzle that supplies a processing liquid to the substrate held by the substrate holding portion; and a nozzle moving portion that makes The nozzle moves in a predetermined processing interval extending in the horizontal direction; the camera acquires a photograph by photographing the nozzle moving in the processing interval A shadow image; a reference image registration unit that registers the first reference image and the second reference image obtained by the camera shooting the nozzles located at the first and second ends of the two ends of the processing section And a positional deviation detection unit that detects the positional deviation of the nozzle at the first end and the second end; and the positional deviation detection unit includes: an image determination unit for shooting by using the camera The actual image acquired by the nozzle moving in the processing interval is determined according to a determination rule whether it is an image corresponding to the first end and the second end, respectively; and an image comparison unit, The first reference image and the second reference image, and the first actual image and the first actual image determined by the image determining unit to correspond to the first end and the second end, respectively The two actual images are compared; the judgment rule in the image judgment unit is a judgment rule based on the degree of coincidence with the first and second reference images, or the nozzle has stopped As a judgment rule. 如申請專利範圍第11項所述的基板處理裝置,其中所述圖像判定部包含:特徵向量算出部,自所述多個攝影圖像的各個,提取多種特徵向量;以及分類器,對應於所述多種特徵向量,將所述多個攝影圖像的各個分類成與所述噴嘴的不同的位置對應的等級;且 所述多個等級包含與所述第一端及所述第二端分別對應的等級。 The substrate processing apparatus according to claim 11, wherein the image determination unit includes: a feature vector calculation unit that extracts a plurality of feature vectors from each of the plurality of photographed images; and a classifier corresponding to The plurality of feature vectors classify each of the plurality of photographic images into levels corresponding to different positions of the nozzles; and The multiple levels include levels corresponding to the first end and the second end, respectively. 一種基板處理系統,其是包括對基板進行處理的基板處理裝置、及與所述基板處理裝置進行資料通訊的伺服器的基板處理系統,所述基板處理裝置包括:基板保持部,以水平姿勢保持基板;噴嘴,對已由所述基板保持部保持的基板供給處理液;噴嘴移動部,使所述噴嘴於沿水平方向延伸的既定的處理區間內移動;相機,藉由拍攝於所述處理區間內移動的所述噴嘴而獲取攝影圖像;基準圖像登記部,登記藉由所述相機拍攝位於作為所述處理區間的兩端的第一端及第二端的所述噴嘴所獲得的第一基準圖像及第二基準圖像;位置偏離檢測部,檢測所述第一端及所述第二端處的所述噴嘴的位置偏離;以及通訊部,與所述伺服器進行資料通訊;所述位置偏離檢測部包括:圖像判定部,針對藉由利用所述相機拍攝於所述處理區間內移動的所述噴嘴所獲取的實際圖像,根據判定規則,判定是否為與所述第一端及所述第二端分別對應的圖像;以及 圖像比較部,將所述第一基準圖像及所述第二基準圖像、與藉由所述圖像判定部而判定為與所述第一端及所述第二端分別對應的第一實際圖像及第二實際圖像進行比較;所述圖像判定部中的所述判定規則,是將與所述第一及第二基準圖像的一致度作為基準的判定規則,或是將所述噴嘴已停止作為判定規則,且所述圖像判定部包括:特徵向量算出部,自所述攝影圖像中提取多種特徵向量;以及分類器,根據所述多種特徵向量,將所述多個攝影圖像分類成與所述噴嘴的不同的位置對應的多個等級;所述多個等級包含與所述第一端及所述第二端分別對應的圖像的等級,所述伺服器包括機器學習部,所述機器學習部藉由將已被指教所述多個等級的任一個的所述多個攝影圖像作為教學資料的機器學習來生成所述分類器,且自所述伺服器對所述基板處理裝置提供所述分類器。 A substrate processing system is a substrate processing system including a substrate processing device for processing substrates and a server for data communication with the substrate processing device, the substrate processing device includes: a substrate holding portion that is held in a horizontal posture The substrate; the nozzle, which supplies the processing liquid to the substrate held by the substrate holding section; the nozzle moving section, which moves the nozzle in a predetermined processing section extending in the horizontal direction; the camera, by photographing in the processing section The nozzle that moves inside to obtain a photographic image; a reference image registration unit that registers the first reference obtained by the camera photographing the nozzles located at the first end and the second end that are the two ends of the processing section An image and a second reference image; a position deviation detection unit that detects the position deviation of the nozzles at the first end and the second end; and a communication unit that performs data communication with the server; the The positional deviation detection unit includes: an image determination unit for determining whether the actual image acquired by the nozzle moving in the processing section by the camera is in line with the first end according to a determination rule And the images respectively corresponding to the second end; and The image comparison unit compares the first reference image and the second reference image with the first end and the second end determined by the image determination unit as corresponding to the first end and the second end, respectively. A real image and a second real image are compared; the judgment rule in the image judgment unit is a judgment rule based on the degree of agreement with the first and second reference images, or The nozzle has stopped as a determination rule, and the image determination unit includes: a feature vector calculation unit that extracts a variety of feature vectors from the photographic image; and a classifier, based on the multiple feature vectors, to The plurality of photographed images are classified into a plurality of levels corresponding to different positions of the nozzle; the plurality of levels include the levels of the images corresponding to the first end and the second end, respectively, the servo The machine includes a machine learning unit that generates the classifier by machine learning that uses the plurality of photographic images that have been taught to any one of the plurality of levels as teaching materials, and generates the classifier from the The server provides the classifier to the substrate processing apparatus.
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