TWI742570B - Electronic assembly and heat dissipation assembly thereof - Google Patents

Abstract

An electronic assembly and a heat dissipation assembly thereof. The electronic assembly includes a circuit board and a heat dissipation assembly. The circuit board includes a plate and a heat source disposed on the plate. The heat dissipation assembly includes a fin assembly, a mount board and a heat dissipation pillar. The mount board is mounted on the fin assembly and have a through hole. Heat dissipation pillar is engaged into the through hole of the mount board. End of the heat dissipation pillar is in thermal contact with the fin assembly and the other end of the heat dissipation pillar is in thermal contact with the heat source of the circuit board.

Description

Electronic component and its heat dissipation component

The invention relates to an electronic component and its heat dissipation component.

Generally speaking, in many electrical systems, in order to assist in dissipating the heat generated by the heat source on the circuit board, the heat dissipation fin group is arranged on the circuit board or on the electrical system housing. In addition, in order to increase the efficiency of heat transfer from the heat source to the heat dissipation fin group, a heat dissipation column in thermal contact with the heat source and the heat dissipation fin group is provided to approach or contact the position of the heat source or the element generating the heat source. The traditional heat dissipating column is usually formed integrally with the heat dissipating fin group, or is attached to the heat dissipating fin group by screws.

However, the above-mentioned two combinations of the heat dissipation column and the heat dissipation fin group will cause the problem of increasing the manufacturing cost when multiple heat sources are provided on the circuit board. For the case where the heat dissipation column and the heat dissipation fin group are integrally formed, after the heat dissipation fin group and these heat dissipation pillars are formed by extrusion, a high processing cost is required to cut the heat dissipation column into the required shape. , It will also be disadvantageous to the conditions of commonality, modularization or mass production of heat dissipation fin groups or heat dissipation pillars. Furthermore, if screws are used to combine the heat sink and the heat sink fin group, using screws to lock the heat sink to the heat sink fin group one by one will also require higher assembly costs, even in terms of product yield. It will also have a negative impact.

The present invention is to provide an electronic component and its heat dissipation component. Its main purpose is to enhance the heat source of the electronic component to guide the heat dissipation component to effectively dissipate heat. To further reduce the cost of manufacturing and assembly of heat dissipation components.

Another object of the present invention is to provide a plurality of heat dissipation pillars to respectively adapt to the height or required contact area of each heat source on the electronic component.

Another object of the present invention is to provide a heat-dissipating column heat pipe structure, which can provide a higher heat conduction effect, so that the heat source on the electronic component can have better heat dissipation conditions.

The electronic component disclosed in an embodiment of the present invention includes a circuit board and a heat dissipation component. The circuit board includes a board body and a heat source. The heat source is arranged on the plate body. The heat dissipating component includes a heat dissipating fin group, a mounting plate and a heat dissipating pillar. The mounting board is fixed to the heat dissipation fin group and includes a mounting hole. The heat dissipation column is clamped to the mounting hole of the mounting plate. One end of the heat dissipation pillar is in thermal contact with the heat dissipation fin group, and the other end of the heat dissipation pillar is in thermal contact with the heat source of the circuit board.

The heat dissipation component disclosed in another embodiment of the present invention is used for thermally contacting a heat source and includes a heat dissipation fin set, a mounting plate and a heat dissipation pillar. The mounting board is fixed to the heat dissipation fin group and includes a mounting hole. The heat dissipation column is clamped to the mounting hole of the mounting plate. One end of the heat dissipation pillar is in thermal contact with the heat dissipation fin group, and the other end of the heat dissipation pillar is used for thermal contact with the heat source.

The heat dissipating component disclosed in still another embodiment of the present invention is used for thermal contact A heat source includes a heat dissipation fin group, a mounting plate and a heat dissipation pillar. The mounting board is fixed to the heat dissipation fin group. The heat dissipation column is glued to the mounting plate. One end of the heat dissipation pillar is in thermal contact with the heat dissipation fin group, and the other end of the heat dissipation pillar is used for thermal contact with the heat source.

According to the electronic components and the heat dissipation components disclosed in the above embodiments, the heat dissipation pillars are arranged on the mounting board fixed to the heat dissipation fin group through a non-screw-locking manner, and the heat dissipation pillars are, for example, clamped to the mounting holes of the mounting board. Therefore, compared with directly manufacturing the integrated heat dissipation fin group and the heat dissipation pillar, there is no need to perform complicated processing procedures to cut the heat dissipation pillar into the required shape.

In addition, compared with attaching the screws to the heat dissipation posts one by one, the use of the above non-screw locking methods such as snapping to fix the heat dissipation posts and the mounting plate also improves the convenience and efficiency of the technicians in assembling the heat dissipation posts and the mounting plate. In summary, when the processing complexity of the heat dissipation component is reduced and the assembly convenience and efficiency of the heat dissipation component are improved, the manufacturing cost of the electronic component and the heat dissipation component can be reduced.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

10.10a: Electronic components

100, 100a: circuit board

101: Board body

102: heat source

200: cooling components

210, 210a: heat sink fin set

211: Pedestal

2110: first side

2111: second side

2112: The first locking hole

212, 212a: heat sink fins

213: Side Wall

214: containment slot

220, 220b, 220c: mounting plate

221: Third Side

222: fourth side

223, 223c: mounting hole

2230: wide section

2231: Narrow section

224: second locking hole

230, 230b, 230c: heat sink

231: Head

232: Body

300: Fastener

400: Thermal paste

500, 500a: base

W1, W2, W3, W4: width

FIG. 1 is a perspective view of an electronic component according to an embodiment of the invention.

Fig. 2 is an exploded view of the electronic component in Fig. 1.

FIG. 3 is a schematic cross-sectional view of the electronic component in FIG. 1.

4 is a schematic cross-sectional view of an electronic component according to another embodiment of the invention.

5 is a schematic cross-sectional view of a mounting board and a heat dissipation column according to still another embodiment of the present invention.

6 is a schematic cross-sectional view of a mounting board and a heat dissipation column according to still another embodiment of the present invention.

The detailed features and advantages of the present invention will be described in detail in the following embodiments. The content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of patent application and the drawings. Anyone who is familiar with relevant skills can easily understand the purpose and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

Please refer to FIG. 1, FIG. 2 and FIG. 3. FIG. 1 is a perspective view of an electronic component according to an embodiment of the present invention. FIG. 2 is an exploded view of the electronic component in FIG. 1, and FIG. 3 is a schematic cross-sectional view of the electronic component in FIG. 1.

In this embodiment, the electronic component 10 includes a circuit board 100, a heat dissipation component 200, a plurality of fasteners 300, a plurality of heat dissipation pastes 400 and a base 500.

The circuit board 100 includes a board body 101 and a plurality of heat sources 102. The heat source 102 is disposed on the board 101 and is, for example, a central processing unit (CPU).

The heat dissipation assembly 200 includes a heat dissipation fin group 210, a mounting board 220 and a plurality of heat dissipation pillars 230.

In this embodiment, the heat dissipation fin group 210 includes a base 211, a plurality of heat dissipation fins 212 and two side walls 213. In this embodiment, the base 211 includes a first side surface 2110, a second side surface 2111 and a plurality of first locking holes 2112. First The side surface 2110 and the second side surface 2111 are opposite to each other. The first locking hole 2112 is located on the second side surface 2111. The heat dissipation fins 212 protrude from the first side surface 2110. The two side walls 213 stand on the second side surface 2111 to form a receiving groove 214 together with the base 211.

The mounting plate 220 is fixed to the second side surface 2111 and is located in the receiving groove 214. In addition, the mounting plate 220 is formed by extruding aluminum, for example. In this embodiment, the mounting board 220 includes a third side surface 221, a fourth side surface 222, a plurality of mounting holes 223 and a plurality of second locking holes 224. The third side surface 221 is opposite to the fourth side surface 222. The mounting holes 223 and the second locking holes 224 penetrate the third side surface 221 and the fourth side surface 222.

In this embodiment, the fasteners 300 are respectively penetrated through the first locking holes 2112 of the base 211 of the heat dissipation fin assembly 210 and the second locking holes 224 of the mounting plate 220, and the mounting plate 220 The third side surface 221 is fixed to the second side surface 2111 of the base 211 of the heat dissipation fin set 210. However, the present invention is not limited to the fixing method of the mounting board 220 and the base 211 of the heat dissipation fin set 210. In other embodiments, the electronic component does not need to include fasteners, the base of the heat dissipation fin set does not need to include the first locking hole, the mounting plate does not need to include the second locking hole, and the mounting plate is fixed to the heat dissipation fin by welding Set of pedestals.

In addition, the present invention is not limited to the structure of the heat dissipation fin set 210. In other embodiments, the heat dissipation fin group does not need to include a side wall and does not include the receiving groove, and the mounting plate is fixed on the second side surface to protrude from the heat dissipation fin group.

Please additionally refer to FIG. 3, which is a schematic cross-sectional view of the electronic component in FIG. 1.

In this embodiment, the mounting holes 223 each include a wide-diameter section 2230 and a narrow-diameter section 2231 that are connected to each other. The width W1 of the wide-diameter section 2230 is greater than the width W2 of the narrow-diameter section 2231. The wide-diameter section 2230 is located on the third side surface 221 of the mounting board 220. The narrow section 2231 is located on the fourth side surface 222 of the mounting board 220.

The heat dissipation pillar 230 is made of, for example, aluminum extrusion. In this embodiment, the heat dissipation pillars 230 each include a head 231 and a body 232 connected to each other. The width W3 of the head 231 is greater than the width W4 of the body 232. The width W3 of the head 231 is between the width W1 of the wide section 2230 of the mounting hole 223 and the width W2 of the narrow section 2231 of the mounting hole 223, and the width W4 of the body 232 is smaller than the narrow section 2231 of the mounting hole 223 The width W2. As a result, as shown in FIG. 3, the head 231 is located at the wide-diameter section 2230 of the mounting hole 223 and is clamped by the heat dissipation fin set 210 and the mounting board 220, so that the heat dissipation column 230 is firmly engaged with the mounting board. 220 of the mounting hole 223. Moreover, one end of the heat dissipation pillar 230 is in thermal contact with the second side surface 2111 of the base 211 of the heat dissipation fin assembly 210, and the other end of the heat dissipation pillar 230 is in thermal contact with the heat source 102 of the circuit board 100.

In addition, in other embodiments, the heat dissipation column is a heat pipe embedded in the mounting plate, and the mounting plate is a good thermal conductor.

Furthermore, in this embodiment or other embodiments, the height of the heat dissipation pillar 230 can be designed according to the height of the corresponding heat source.

Of course, the present invention is not limited to the engagement manner between the heat dissipation column 230 and the mounting hole 223 of the mounting plate 220. In other embodiments, the heat dissipating column does not include heads and bodies with different widths, and the mounting holes do not include wide-diameter sections and narrow-diameter sections with different widths. And the heat dissipation column is clamped to the mounting hole in a tightly fitting manner.

In addition, the present invention is not limited to the number of heat dissipation pillars 230 and mounting holes 223. In other embodiments, the number of heat dissipation pillars and mounting holes is single.

Furthermore, the heat dissipation pillars 230 are respectively in thermal contact with the heat sources 102 of the circuit board 100 through the heat dissipation paste 400 to prevent the heat dissipation pillars 230 from being directly pressed against the heat source 102 to damage the heat source 102.

Of course, the electronic component 10 is not limited to include these thermal paste 400. In other embodiments, the electronic component does not need to include heat dissipation paste, and a small gap is maintained between the heat dissipation column and the heat source without affecting the heat transfer.

The base 500 is used for fixing the board body 101 of the circuit board 100. In addition, the base 500 is fixed to the heat dissipation fin set 210 and together with the heat dissipation fin set 210 accommodates the circuit board 100. In other words, the base 500 and the heat dissipation fin group 210 jointly constitute the housing of the electronic component 10, or in other words, the heat dissipation fins 212 of the heat dissipation fin group 210 are disposed on the housing such that the heat dissipation fins 212 are exposed to the outside. Of course, the electronic component 10 is not limited to include the base 500. In other embodiments, the electronic component does not need to include a base.

In this embodiment, the base 500 is fixed to the heat dissipating fin set 210 and the heat dissipating fins 212 of the heat dissipating fin set 210 are disposed in the shell formed by the base 500 and the heat dissipating fin set 210, but the present invention is not limited to this . Please refer to FIG. 4, which is a schematic cross-sectional view of an electronic component according to another embodiment of the present invention. In the electronic component 10a shown in FIG. 4, the heat dissipation fin group 210a can be arranged on a base 500a or on a circuit board 100a. That is to say, the heat dissipation fins 212a of the heat dissipation fin set 210a are arranged in the electronic component 10a, and the arrangement of the heat dissipation fin set 210a is not limited to the electronic components. On the housing of the component 10a.

In addition, the present invention is not limited to the fixing method between the heat dissipation column 230 and the mounting board 220. In other embodiments, the mounting plate does not include mounting holes and the heat dissipation column is fixed to the mounting plate by other non-threaded methods such as bonding.

For example, please refer to FIG. 5, which is a schematic cross-sectional view of a mounting board and a heat dissipation column according to still another embodiment of the present invention. In the embodiment shown in FIG. 5, the mounting board 220b does not have mounting holes and the heat dissipation pillar 230b is bonded to the mounting board 220b made of a good thermal conductor material.

For another example, please refer to FIG. 6, which is a schematic cross-sectional view of a mounting board and a heat dissipation column according to still another embodiment of the present invention. In the embodiment shown in FIG. 6, the mounting plate 220c has a mounting hole 223c, and the mounting hole 223c is a perforation with a constant width. In addition, the heat dissipation column 230c is provided in the mounting hole 223c in a tight fitting manner, but it is not limited to this. In other embodiments, the heat dissipating column can also be adhered to the wall surface of the mounting plate where the mounting hole is formed.

According to the electronic components and the heat dissipation components disclosed in the above embodiments, the heat dissipation pillars are arranged on the mounting board fixed to the heat dissipation fin group through a non-screw-locking manner, and the heat dissipation pillars are, for example, clamped to the mounting holes of the mounting board. Therefore, compared with directly manufacturing the integrated heat dissipation fin group and the heat dissipation pillar, there is no need to perform complicated processing procedures to cut the heat dissipation pillar into the required shape.

In addition, compared with attaching the screws to the heat dissipation posts one by one, the use of the above non-screw locking methods such as snapping to fix the heat dissipation posts and the mounting plate also improves the convenience and efficiency of the technicians in assembling the heat dissipation posts and the mounting plate. In summary, in the processing of heat dissipation components When the complexity is reduced and the assembly convenience and efficiency of the heat dissipation components are improved, the manufacturing cost of the electronic components and the heat dissipation components can be reduced.

In an embodiment of the present invention, the technology of the present invention can be applied to in-vehicle devices, such as self-driving cars, electric cars, or semi-self-driving cars, and so on.

Although the present invention is disclosed in the foregoing embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

101...Board body 102...heat source 211...Base 2110...First side 2111...Second side 212...heat sink fins 213...side wall 220...Mounting plate 221...the third side 222...Fourth side 2230...Wide diameter section 2231...Narrow section 230... cooling column 231...Head 232...body 400...Thermal paste W1, W2, W3, W4...width

Claims (7)

An electronic component includes: a circuit board, including a board body and a heat source, the heat source is arranged on the board; a heat dissipation assembly, including a heat dissipation fin group, a mounting board and a heat dissipation column, the mounting board is fixed on The heat dissipating fin group includes a mounting hole, the heat dissipating post is engaged with the mounting hole of the mounting board, one end of the heat dissipating post is in thermal contact with the heat dissipating fin group, and the other end of the heat dissipating post is in thermal contact with the heat dissipating fin group The heat source of the circuit board; and a base, which is fixed to the heat dissipation fin group and together with the heat dissipation fin group to accommodate the circuit board. The electronic component according to claim 1, wherein the heat dissipation column includes a head and a body that are connected, the width of the head is greater than the width of the body, and the mounting board includes a first side face and a body opposite to each other The second side surface, the mounting hole passes through the first side surface and the second side surface, the first side surface is fixed to the heat dissipation fin set, and the mounting holes each include a connected wide diameter section and a narrow diameter section. The width of the diameter section is greater than the width of the narrow diameter section, the wide diameter section is located on the first side surface and the narrow diameter section is located on the second side surface, and the width of the head is between the width of the wide diameter section and the narrow diameter section The width of the body is smaller than the width of the narrow section, and the head is located in the wide section of the mounting hole and is clamped by the heat dissipation fin group and the mounting plate. The electronic component according to claim 1, further comprising a plurality of fasteners, and the mounting board is fixed to the heat dissipation fin group through the fasteners. The electronic component according to claim 1, wherein the mounting board is soldered The method is fixed to the heat dissipation fin group. The electronic component according to claim 1, wherein the heat dissipation fin set includes a base, a plurality of heat dissipation fins, and two side walls, the base includes a first side surface and a second side surface opposite to each other, the The heat dissipation fins protrude from the first side surface, the two side walls stand on the second side surface to form a receiving groove with the base, the mounting plate is fixed to the second side surface and is located in the receiving groove, and One end of the heat dissipation column is in thermal contact with the second side surface of the base of the heat dissipation fin set. The electronic component according to claim 1, wherein the number of the heat source, the heat dissipation pillar and the mounting hole is multiple, the heat dissipation pillars are in thermal contact with the heat sources, and the heat dissipation pillars are respectively clamped to the heat sources. Mounting holes. The electronic component according to claim 1, wherein the mounting board includes a first side surface and a second side surface opposite to each other, the mounting hole passes through the first side surface and the second side surface, and the width of the mounting hole Constant.

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