TWI742017B - Multi-layer cover tapes - Google Patents

Abstract

A multi-layer cover tape construction includes a polymeric substrate with a first major surface and a second major surface; an adhesive layer disposed on the first major surface of the first substrate; and an antistatic layer disposed on the first major surface of the first substrate. The polymeric substrate has a surface energy of between 5 and 500 mN/m, and a surface roughness of between 0.1 and 5μm.

Description

Multi-layer cover tape

This disclosure relates to multilayer covering tapes and the use of these covering tapes in a carrier tape assembly.

Various cover tapes have been incorporated for sealing electronic components in a carrier tape assembly. Such covering tapes are described in, for example, U.S. Patent Application No. 2003/0049437, U.S. Patent No. 4,963,405, and U.S. Patent No. 4,964,405.

This article discloses a multilayer cover tape structure, a carrier tape assembly including the multilayer cover tape structure, and a method of manufacturing the multilayer cover tape structure. In some embodiments, a multilayer covering tape structure includes a first substrate having a first major surface and a second major surface; an adhesive layer disposed on the first major surface of the first substrate On; and an antistatic structure, which is provided on the first main surface of the first substrate. The antistatic structure includes a second polymer substrate having a first main surface and a second main surface; and an antistatic layer disposed on the second main surface of the second substrate. The second polymeric substrate has a surface energy between 5 mN/m and 500 mN/m, and a surface roughness between 0.1 μm and 5 μm.

In some embodiments, the multilayer cover tape structure includes a polymeric substrate having a first major surface and a second major surface; an adhesive layer disposed on the first major surface of the first substrate; And an antistatic layer disposed on the first main surface of the first substrate. The polymeric substrate has a surface energy between 5 mN/m and 500 mN/m, and a surface roughness between 0.1 μm and 5 μm.

The foregoing summary of the present disclosure is not intended to illustrate various embodiments of the present invention. The details of one or more embodiments of the present disclosure are also presented in the following description. The other features, purposes and advantages of the present invention will be understood through this description and the scope of the patent application.

10‧‧‧Multi-layer covering tape structure

10’‧‧‧Multi-layer covering tape structure

11A‧‧‧Top surface

11B‧‧‧Bottom surface

12‧‧‧Substrate

12’‧‧‧Substrate

12A‧‧‧First main surface

12A’‧‧‧The first major surface

12B‧‧‧Second major surface

12B’‧‧‧Second main surface

13‧‧‧Primer layer

13’‧‧‧First primer layer

13"‧‧‧Second primer layer

14‧‧‧Adhesive layer

14’‧‧‧ Adhesive layer

16‧‧‧Low adhesion adhesive film

16’‧‧‧Low Adhesive Adhesive Layer

18‧‧‧Antistatic film structure

18’‧‧‧Antistatic layer

22‧‧‧Second base material

22A‧‧‧First main surface

22B‧‧‧Second major surface

24‧‧‧Antistatic layer

100‧‧‧Carrier tape assembly

101‧‧‧Carrier Tape

Section 102‧‧‧

104‧‧‧Longitudinal edge surface

106‧‧‧Longitudinal edge surface

108‧‧‧Advance hole

110‧‧‧Advance hole

112‧‧‧Cavity

114‧‧‧Sidewall

116‧‧‧Bottom Wall

117‧‧‧Porosity

118‧‧‧Component

122‧‧‧Parallel longitudinal joint

124‧‧‧Parallel longitudinal joint

Considering the following implementation manners of various embodiments of the present disclosure in conjunction with the accompanying drawings, the present application can be understood more completely.

Figure 1 shows a cross-sectional view of an exemplary embodiment of a multilayer cover tape of the present disclosure.

Figure 2 shows a cross-sectional view of an exemplary embodiment of a multilayer cover tape of the present disclosure.

FIG. 3 shows a cross-sectional view of an exemplary embodiment of a multilayer carrier tape structure of the present disclosure.

Fig. 4 is a graph showing the influence of FC4400 content on the surface resistivity of a coating film formed with SR740A dimethacrylate.

Fig. 5 is a graph showing (1) the obtained antistatic coating film and (2) the surface resistance after the tape peeling test.

Figure 6 is a graph showing the effect of FC5000i content on the surface resistivity of cellulose acetate and BOPP films.

Figure 7 is a graph showing the effect of ZnO filler on the surface resistivity of a cellulose acetate substrate.

Figure 8 is a graph showing the effect of FC4400 filler on the surface resistivity of matt and supermat PET surfaces.

Figure 9 is a contour plot showing the range of surface energy and surface roughness on the problem of die sticking.

Figure 10 is a photograph showing a test of a matte BOPP substrate as a cover tape on a carrier with LED dies encapsulated in polysilicon.

11A and 11B are respectively photographs showing the surface morphology of a cover tape without or with microstructures.

FIG. 12 is a graph showing the required peel force for each tested cover tape with a viscous silicone component.

In the description of the embodiments shown below, reference is made to the accompanying drawings, which illustrate various embodiments that can implement the present disclosure. It should be understood that these embodiments can be adopted and structural changes can be made without departing from the scope of this disclosure. The drawings are not necessarily drawn to scale. The like numbers used in the schema refer to similar components. However, it will be understood that the use of component symbols in a given drawing to refer to components is not intended to limit components with the same symbol in another drawing.

Prior art

As electronic components have become more miniaturized, storage, transportation, and disposal of these components have become more difficult, and professional methods have been developed. One method is to use carrier tape. The carrier tape can be formed of various materials, but is generally formed of a strip of plastic material. Multiple longitudinal recesses or indentions. These indented segments generally include an upper opening for placing the component in the concave surface, and then the opening is generally sealed by a covering tape.

The encapsulated LED dies are electronic components that are often transported using carrier tapes. The encapsulation of LED dies is generally implemented to provide protection against mechanical and thermal shocks, chemical degradation, and humidity and temperature cycles. In addition, the encapsulation process is intended to improve the light emission and heat transfer characteristics.

Various encapsulation materials (including polyurethane, epoxy, silicone, and other polymers) are often used with LED dies. Among these common encapsulation materials, polysiloxane is the most common due to its high refractive index and light transmittance, optical transparency, and thermal and light stability. This is particularly evident in encapsulation materials used for high-power LEDs.

It has been found that during the use of carrier tape to transport encapsulated LED dies (for example, LED dies encapsulated with polysiloxane), the encapsulated component has a pocket that runs out of the carrier tape and adheres to the The tendency of the cover tape (referred to herein as "die stick"). The die sticking phenomenon instead causes problems in picking and placing operations commonly used in surface mounting processes, and thus leads to high yield loss for end users of LED dies. Therefore, there is a need for covering tape materials or structures that can reduce or eliminate die sticking.

Generally, the present disclosure relates to the cover tape, the carrier tape structure, and the method of making both, which incorporate a polymer film and an electrostatic layer.

Definition of terms

As used herein, the term "adhesive" refers to a polymer composition that can be used to adhere two adherends together. Examples of adhesives are heat-activated adhesives and pressure-sensitive adhesives.

Heat-activated adhesives are not adhesive at room temperature, but become adhesive at elevated temperatures and can be bonded to the substrate. These adhesives usually have a T _g (glass transition temperature) or melting point (T _m ) higher than room temperature. When the temperature rises above T _g or T _m , the storage modulus usually decreases and the adhesive becomes sticky.

The pressure-sensitive adhesive composition is well-known to those with ordinary knowledge in this technical field, and it has the following properties: (1) strong and long-lasting viscosity; (2) adheres with no more than finger pressure; 3) Ability to hold on the adherend; and (4) Adequate bonding strength enough to cleanly remove from the adherend. It has been found that a material with a good pressure-sensitive adhesive effect is a polymer that is designed and formulated to exhibit the necessary viscoelasticity, resulting in a desired balance between adhesiveness, peel adhesion, and shear retention. Obtaining the proper balance of characteristics is not a simple procedure.

Unless otherwise specified, "optically transparent" means that an article, film, or adhesive composition has a high light transmittance in at least a part of the visible spectrum (about 400 to about 700 nm).

Unless otherwise specified, the term "optically clear" refers to an adhesive or article with high light transmittance in at least a part of the visible light spectrum (about 400 to about 700 nm), and which exhibits low haze. The term "haze" refers to the percentage of the transmitted light that deviates from the incident beam by more than 2.5° on average.

As used herein, the term "conductivity" means a measure of the ability of electrical charges to move in a material. "Resistivity" is the reciprocal of electrical conductivity.

As used herein, the term "cover tape" means an adhesive tape that is actually used to adhere to the surface of a carrier tape, which has a dent section for accommodating and transporting chips and other sensitive electronic components.

As used herein, the term "indented segment" refers to an individual carrier formed in a carrier tape to generally hold a single unit of a product, such as a cavity or a cup. These sections are generally formed by vacuum forming, thermoforming, molding, or other known methods.

As used herein, the term "strip portion" refers to the portion of the carrier tape along each longitudinal edge, which may or may not have sprocket holes for winding.

As used herein, when the term "adjacent" is used to describe two floors, it means that the two floors are close to each other and there is no intervening open space between the two floors. The two layers may be in direct contact with each other (e.g., laminated together) or an interposer may be present.

As used herein, when the term "directly adjacent" is used to describe two layers, it means that the two layers are in direct contact with each other and there is no intervening layer between the two layers.

As used herein, the singular forms "a/an" and "the" both include plural referents, unless the context clearly indicates otherwise. As used in this specification and the appended embodiments, the term "or" is usually used to include the meaning of "and/or" unless the content clearly indicates otherwise.

As used herein, a numerical range stated as an endpoint includes all numbers within the range (for example, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.8, 4, and 5).

Unless otherwise specified, all numbers expressing amounts or components, measurements of attributes, and the like in this specification and examples should be understood as modified by the term "about" in all cases. Therefore, unless otherwise indicated to the contrary, the numerical parameters set forth in the foregoing specification and the accompanying list of embodiments may vary according to the desired characteristics that those skilled in the art want to obtain by using the teachings of the present disclosure. At least, in view of the number of significant digits, and by applying ordinary rounding techniques, the numerical parameters are interpreted, but the intention is not to limit the application of the theory of equality of the claimed embodiments.

1, in some embodiments, the present disclosure relates to a multilayer cover tape structure 10 having a top surface 11A and a bottom surface 11B (the bottom surface 11B is intended to be closest to an electronic component located in a carrier tape). The cover tape structure 10 may include a first substrate 12 having a first main surface 12A and a second main surface 12B, an adhesive layer 14, and an antistatic structure 18 disposed on the first main surface 12A. As shown, the adhesive layer 14 may be disposed between the first main surface 12A and the antistatic structure 18. The antistatic structure 18 can be sized and shaped so that it covers only a part of the adhesive layer 14 (ie, the part of the adhesive layer 14 that remains exposed). For example, as shown, the two longitudinal edges of the adhesive layer 14 remain exposed. The multi-layer structure 10 may also include a low-adhesive back glue coating film 16, which is disposed on the second main surface 12B, and a primer layer 13 is disposed between the first main surface 12A and the adhesive layer 14.

In some embodiments, the antistatic structure 18 may include a second substrate 22 having a first main surface 22A and a second main surface 22B. The first main surface 22A is positioned adjacent to the adhesive layer 14. The antistatic structure 18 may further include an antistatic layer 24 disposed on the second main surface 22B of the second substrate 22.

In some embodiments, many materials are suitable for use in the first substrate 12 and the second substrate 22 of the cover tape structure 10. Generally, the substrates 12 and 22 can be a film made of a polymer material (a single polymer material or a blend of polymer materials). In some embodiments, the substrates 12, 22 may be optically transparent or optically clear. Suitable polymeric materials include many polymeric materials commonly used in tape construction as backing materials. Examples of suitable materials include: cellulose acetate; polyesters, such as, for example, polyethylene terephthalate (PET), and polyester copolymers; polyolefins, such as polyethylene (PE), including many grades of polyethylene ( Such as low density polyethylene (LDPE) and polyethylene copolymers), polypropylene (PP) (including biaxial polypropylene (BOPP)), and polyolefin copolymers; polyurethane, including polyurethane Copolymers; polyacrylate polymers and copolymers; polyethylene polymers and copolymers; polymethacrylate polymers and copolymers; polycarbonate polymers and copolymers; and combinations and mixtures thereof. The substrates 12, 22 may be formed of the same material or different materials. In some embodiments, the substrates 12, 22 may include PET, BOPP, or cellulose acetate or be formed of PET, BOPP, or cellulose acetate. In some embodiments Among them, the substrates 12 and 22 may include cellulose acetate or be formed of cellulose acetate.

The first substrate and the second substrate can be of any suitable thickness. Generally speaking, the substrate is in the range of about 5 microns (0.2 mils) to about 100 microns (4 mils), and more Generally, the substrate is in the range of about 6 microns (0.25 mils) to about 32 microns (1.25 mils), or 13 microns (0.5 mils) to 25 microns (1.0 mils).

In some embodiments, the second substrate (and optionally the first substrate) can be selected to have a specific surface energy and/or surface roughness. In this regard, it has been found that the problem of grain sticking can be eliminated or alleviated by selecting a specific combination of surface energy and surface roughness. In some embodiments, the surface roughness of the second substrate 22 (and optionally the first substrate 12) may be between 0.1 μm and 5 μm, between 0.1 μm and 1 μm, or between 0.2 μm and 0.5 μm. Between, or can be at least 0.5μm, 0.3μm, or 0.15μm; and the surface energy can be between 5mN/m and 500mN/m, 20mN/m and 100mN/m, or 20mN/m and 50mN/m Between, or may be at least 40mN/m, 30mN/m, or 20mN/m. As used herein, the surface energy value is as measured by ASTM D7490-13 (Standard Test Method for Measurement of the Surface Tension of Solid Coatings, Substrates and Pigments using Contact Angle Measurements)); and the surface roughness value is as measured by ASTM D7127-13 (using a portable stylus instrument to measure the surface roughness of a metal surface cleaned by abrasive blasting Standard Test Method for Measurement of Surface Roughness of Abrasive Blast Cleaned Metal Surfaces Using a Portable Stylus Instrument.

In some embodiments, the adhesive layer 14 may be disposed on any (at most all) part of the first major surface 12A of the first polymeric substrate. In some embodiments, the adhesive layer 14 may include a heat-activated adhesive, a pressure-sensitive adhesive, or a combination thereof.

Heat-activated adhesives are not adhesive at room temperature, but become adhesive at elevated temperatures and can be bonded to the substrate. These adhesives usually have a T _g (glass transition temperature) or melting point (T _m ) higher than room temperature. When the temperature rises above T _g or T _m , the storage modulus usually decreases and the adhesive becomes sticky.

Generally speaking, since it is desired that the cover tape is configured to be optically transparent or optically clear, the heat-activated adhesive may be optically transparent or optically clear. Many optically clear thermally activated adhesives can be used. Examples of suitable optically clear thermally activated adhesives include polyacrylate hot melt adhesives, polyvinyl butyral, ethylene vinyl acetate, ionomers, polyolefins, or combinations thereof.

The optically clear thermally activated adhesive can be a (meth)acrylate-based hot melt adhesive. The hot-melt adhesive is generally prepared from a (meth)acrylate polymer, which has a glass transition temperature (Tg) greater than room temperature, more generally greater than about 40°C, and is composed of alkane Base (meth)acrylate monomer preparation. Practical alkyl (meth)acrylates (ie, alkyl acrylate monomers) include linear or branched monofunctional unsaturated acrylates or methacrylates other than tertiary alkanols, the alkyl group of which has 4 To 14 carbon atoms, and specifically, 4 to 12 carbon atoms. The poly(meth)acrylic acid hot melt adhesive may also contain optional comonomer components, such as, for example: (meth)acrylic acid, vinyl acetate, N-vinylpyrrolidone, (meth)acrylamide , Vinyl ester, fumarate, styrene macromonomer, alkyl maleate and alkyl fumarate (based on maleic acid, respectively) And fumaric acid), or a combination thereof.

In some embodiments, the adhesive layer 14 may be at least partially formed of polyvinyl butyral. Can be through a known aqueous or solvent-based acetalization process (wherein the presence of acid In the case of a neutral catalyst, polyvinyl alcohol reacts with butyraldehyde) to form the polyvinyl butyraldehyde layer. In some cases, the polyvinyl butyral layer may include or be formed of polyvinyl butyral, which is available from Solutia Incorporated, of St. Louis, MO under the trade name "BUTVAR" resin.

In some cases, the polyvinyl butyral layer can be prepared by mixing resin and (optional) plasticizer and extruding the mixed formulation through a sheet die. If a plasticizer is included, the polyvinyl butyral resin may include about 20 to 80 parts of plasticizer or possibly about 25 to 60 parts of plasticizer per hundred parts of resin. Examples of suitable plasticizers include esters of polybasic acids or polyhydric alcohols. Suitable plasticizers are triethylene glycol bis (ethyl 2-butyrate), triethylene glycol bis-(2-ethylhexanoate), triethylene glycol diheptyl ester, tetraethylene glycol diheptyl ester, hexamethylene glycol Dihexyl adipate, dioctyl adipate, hexylcyclohexyl adipate, mixture of heptyl and nonyl adipate, diisononyl adipate, heptyl nonyl adipate, sebacic acid Dibutyl esters, polymeric plasticizers such as oil-modified sebacic alkyd, and mixtures of phosphate and adipic acid (such as those disclosed in U.S. Patent No. 3,841,890) and adipic acid (such as U.S. Patent No. 4,144,217) Revealer).

Examples of suitable ethylene vinyl acetate (EVA) adhesives include many commercially available EVA hot melt adhesives. Generally, these EVA hot melt adhesives have a vinyl acetate content of about 18% to 29% by weight of the polymer. These adhesives generally have large amounts of tackifiers and waxes. An exemplary composition has the following: 30 to 40% by weight of EVA polymer, 30 to 40% by weight of tackifier, 20 to 30% by weight of wax, and 0.5 to 1% by weight of stabilizer. Examples of suitable EVA hot melt adhesives are BYNEL SERIES 3800 resin (including BYNEL 3810, BYNEL 3859, BYNEL 3860, and BYNEL 3861) available from DuPont, Wilmington, DE. Especially suitable for EVA hot melt adhesion The agent is a material purchased from Bridgestone Corp. Tokyo, JP under the brand name "EVASAFE".

An example of a suitable ionic polymer adhesive is "ionoplast resin". Ionoplast resin is a copolymer of ethylene and unsaturated carboxylic acid, in which at least a part of the acid groups in the copolymer have been neutralized to the acid salt form. The extruded sheet of ionoplast resin suitable for use in the present disclosure is available from DuPont Chemicals, Wilmington, DE under the trade name "SENTRYGLASS PLUS".

Examples of suitable polyolefin adhesives include ethylene/α-olefin copolymers. As used herein, the term "ethylene/α-olefin copolymer" refers to a polymer containing a type of hydrocarbon produced by the catalyzed oligomerization (ie, polymerization into a low molecular weight product) of ethylene and linear α-olefin monomers. For example, single-site catalysts (such as metallocene catalysts) or multi-site catalysts (such as Ziegler-Natta and Phillips catalysts) can be used to make the ethylene/α-olefin Copolymer. The linear α-olefin monomer is generally 1-butene or 1-octene, but can range from C3 to C20 linear, branched or cyclic α-olefin. The alpha-olefin can be branched, but only if the branch is at least alpha to the double bond, such as 3-methyl-1-pentene. Examples of C3 to C20α-olefins include propylene, 1-butene, 4-methyl-1-butene, 1-hexene, 1-octene, 1-dodecene, 1-tetradecene, 1-decene Hexaene and 1-octadecene. The α-olefin may also contain a cyclic structure, such as cyclohexane or cyclopentane, which produces α-olefins such as 3-cyclohexyl-1-propene (allyl cyclohexane) and vinyl cyclohexane . Although there are no α-olefins in the typical meaning of the term, for the purposes of this disclosure, specific cyclic olefins (such as norbornene and related olefins) are α-olefins and can be used. Similarly, for the purposes of this disclosure, styrene and its related olefins (for example, α-methylstyrene) are α-olefins. However, For the purpose of this disclosure, acrylic acid and methacrylic acid and their respective ionic polymers, and acrylate and methacrylate are not α-olefins. Illustrative ethylene/α-olefin copolymers include ethylene/1-butene, ethylene/1-octene, ethylene/1-butene/1-octene, and ethylene/styrene. The polymer can be block or random. Exemplary commercially available low crystalline ethylene/α-olefin copolymers include ethylene/1-butene and ethylene/1-octene copolymers under the trade name "ENGAGE" and "FLEXOMER" ethylene/1-hexene copolymers (Available from Dow Chemical Co.) sales of resins; and homogeneously branched, substantially linear ethylene/α-olefin copolymers, such as "TAFMER" (available from Mitsui Petrochemicals Company Limited), and "EXACT" (Available from ExxonMobil Corp). As used herein, the term "copolymer" refers to a polymer made from at least two monomers.

In some of these embodiments, the α-olefin portion of the ethylene/α-olefin copolymer includes four or more carbons. In some embodiments, the ethylene/α-olefin copolymer is a low crystalline ethylene/α-olefin copolymer. As used herein, the term "low crystalline" means less than 50% crystallinity by weight (according to the method disclosed in ASTM F2625-07). In some embodiments, the low crystalline ethylene/α-olefin copolymer is a butene α-olefin. In some embodiments, the α-olefin of the low crystalline ethylene/α-olefin copolymer has 4 or more carbons.

In some embodiments, the low crystalline ethylene/α-olefin copolymer has a DSC peak melting point lower than or equal to 50°C. As used herein, the term "DSC peak melting point" means the melting point determined by DSC (10°/min) under nitrogen purge when the peak has the largest area below the DSC curve.

In some embodiments, the adhesive layer 14 may include or be formed of a pressure-sensitive adhesive. The pressure-sensitive adhesive composition is well-known to those with ordinary knowledge in this technical field, and it has the following properties: (1) strong and long-lasting viscosity; (2) adheres with no more than finger pressure; 3) Ability to hold on the adherend; and (4) Adequate bonding strength enough to cleanly remove from the adherend. Many pressure-sensitive adhesives are suitable for use in the covering tape structures disclosed in this disclosure.

Suitable pressure-sensitive adhesives include those based on the following: natural rubber, synthetic rubber, styrene block copolymer, polyvinyl ether, (meth)acrylate, poly-α-olefin, polysiloxane, amine-based Formate or urea. If combined with the above heat-activated adhesive, the pressure-sensitive adhesive is generally optically transparent or optically clear.

Useful natural rubber pressure-sensitive adhesives generally contain masticated natural rubber, 25 to 300 parts of one or more tackifying resins relative to 100 parts of natural rubber, and generally one or more of 0.5 to 2.0 parts. Antioxidants. The grades of natural rubber can range from light-colored crepe film grade to darker ribbed smoked film grade, and include, for example, CV-60 (a rubber grade with controlled viscosity), and SMR-5 (ribbed smoked film grade).

Tackifying resins used with natural rubber generally include, but are not limited to, wood rosin and its hydrogenated derivatives; terpene resins with various softening points, and petroleum-based resins (such as those derived from Exxon’s "ESCOREZ 1300" series) C5 aliphatic olefin resins, and polyterpenes from the "PICCOLYTE S" series of Hercules, Inc.). Antioxidants are used to delay the oxidative attack on natural rubber, which can lead to the loss of the cohesive strength of the natural rubber adhesive. Useful antioxidants include, but are not limited to, amines, such as N-N'bis-β-naphthyl-1,4-phenylenediamine, which can be purchased from "AGERITE D"; phenolic resins, such as 2,5-Di-(tertiary pentyl) hydroquinone, available from Monsanto Chemical Co. under the name "SANTOVAR A", tetrakis[methylene 3-(3',5'-di-tertiary butyl -4'-Hydroxyphenyl) propionate] methane, available from Ciba-Geigy Corp. under the name "IRGANOX 1010", and 2-2'-methylene bis(4-methyl-6-tertiary) Butylphenol), available under the name Antioxidant 2246; and dithiocarbamate, such as zinc dithiodibutyl carbamate. For special purposes, other materials can be added to the natural rubber adhesive, and the additives can include plasticizers, pigments, and hardeners that partially vulcanize the pressure-sensitive adhesive.

Another type of useful pressure-sensitive adhesives is these pressure-sensitive adhesives containing synthetic rubber. Such adhesives are generally rubber-like elastomers, which are self-tacky or non-tacky, and require a tackifier.

Self-adhesive synthetic rubber pressure-sensitive adhesives include, for example, butyl rubber, copolymers of isobutylene with less than 3% isoprene, polyisobutylene, homopolymers of isoprene, polybutadiene, such as ``TAKTENE 220 BAYER" or styrene/butadiene rubber. Butyl rubber pressure-sensitive adhesives often contain antioxidants, such as zinc dibutyl dithiocarbamate. Polyisobutylene pressure-sensitive adhesives generally do not contain antioxidants. Synthetic rubber pressure-sensitive adhesives generally require tackifiers and are generally easier to melt. They include polybutadiene or styrene/butadiene rubber, 10 to 200 parts of tackifier, and generally 0.5 to 2.0 parts of antioxidant rubber per 100 parts of rubber, such as "IRGANOX 1010" . An example of synthetic rubber is "AMERIPOL 1011A", which is a styrene/butadiene rubber available from BF Goodrich. Useful tackifiers include rosin derivatives (such as "FORAL 85"), stabilized rosin esters (available from Hercules, Inc.), rosin gums of the "SNOWTACK" series (available from Tenneco), and rosin gums of the "AQUATAC" series Pine oil-type rosin (available from Sylvachem); and synthetic hydrocarbon resins (such as "PICCOLYTE" series), polyterpenes from Hercules, Inc., "ESCOREZ 1300" series _{resins derived from C 5} aliphatic olefins, The "ESCOREZ 2000" series of C ₉ aromatic/aliphatic olefin-derived resins and polyaromatic C ₉ resins (such as the "PICCO 5000" series of aromatic hydrocarbon resins available from Hercules, Inc.). Other materials can be added for special purposes, including hydrogenated butyl rubber, pigments, plasticizers, liquid rubber (such as "VISTANEX LMMH" polyisobutylene liquid rubber available from Exxon), and hardening of the adhesive for partial vulcanization Agent.

Styrenic block copolymer pressure-sensitive adhesives generally contain AB or ABA type elastomers, where A represents a thermoplastic styrene block and B represents polyisopropylene, polybutadiene, or poly(ethylene/butene), and The rubber block of the resin. Examples of various block copolymers used in block copolymer pressure-sensitive adhesives include linear, radial, star, and tapered styrene-isopropylene block copolymers, such as those available from Shell Chemical Co.’s "KRATON D1107P" and "EUROPRENE SOL TE 9110" available from EniChem Elastomers Americas, Inc.; linear styrene-(ethylene-butene) block copolymers, such as "KRATON G1657", available from Shell Chemical Co.; linear styrene-(ethylene-propylene) block copolymers, such as "KRATON G1750X", available from Shell Chemical Co.; and linear, radial, and star styrene-butadiene blocks Copolymers such as "KRATON D1118X" available from Shell Chemical Co. and "EUROPRENE SOL TE 6205" available from EniChem Elastomers Americas, Inc. Polystyrene blocks tend to form spherical shapes, cylindrical shapes, or plate shapes The domain makes the block copolymer pressure-sensitive adhesive have a two-phase structure. Resins associated with rubber generally increase the viscosity of pressure-sensitive adhesives. Examples of rubber-related resins (rubber phase associating resins) include aliphatic olefin-derived resins, such as "ESCOREZ 1300" series and "WINGTACK" series available from Goodyear; rosin esters such as "FORAL" series and "STAYBELITE" "Ester 10, both available from Hercules, Inc.; hydrogenated hydrocarbons, such as the "ESCOREZ 5000" series, available from Exxon; polyterpenes, such as the "PICCOLYTE A" series; and derived from petroleum or turpentine sources Terpene phenolic resins, such as "PICCOFYN A100", can be purchased from Hercules, Inc. The resin associated with the thermoplastic phase tends to harden the pressure sensitive adhesive. Resins associated with the thermoplastic phase include polyaromatic compounds, such as the "PICCO 6000" series of aromatic hydrocarbon resins, available from Hercules, Inc.; such as the "CUMAR" series of lavender-indene resins, available from Neville ; And other resins that are derived from coal tar or petroleum and have a high solubility parameter with a softening point higher than about 85°C, such as alpha methyl styrene resins of the "AMOCO 18" series available from Amoco, available from Hercules, Inc.'s "PICCOVAR 130" alkyl aromatic polyindene resin, and the "PICCOTEX" series of alpha methyl styrene/vinyl toluene resins available from Hercules. Other materials can be added for special purposes, including rubber phase plasticized hydrocarbon oils, such as "TUFFLO 6056" available from Lydondell Petrochemical Co., polybutene-8 available from Chevron, and "KAYDOL available from Witco" "SHELLFLEX 371" available from Shell Chemical Co.; pigments; antioxidants, such as "IRGANOX 1010" and "IRGANOX 1076" available from Ciba-Geigy Corp., available from Uniroyal Chemical Co. "BUTAZATE", available from American Cyanamid's "CYANOX LDTP" and "BUTASAN" available from Monsanto Co.; antiozonants, such as "NBC", nickel dibutyldithiocarbamate, available from DuPont; liquid rubber, such as "VISTANEX LMMH" polyisobutylene rubber; and ultraviolet light inhibitors, such as "IRGANOX 1010" and "TINUVIN P", available from Ciba-Geigy Corp.

Polyvinyl ether pressure-sensitive adhesives are generally blends of homopolymers of vinyl methyl ether, vinyl ethyl ether or vinyl isobutyl ether, or homopolymers of vinyl ether and vinyl ether with Blends of copolymers of acrylates to obtain the desired pressure sensitive properties. Depending on the degree of polymerization, homopolymers can be viscous oils, viscous soft resins or rubber-like substances. Polyvinyl ethers used as raw materials in polyvinyl ether adhesives include polymers based on: vinyl methyl ether, such as "LUTANOL M 40" available from BASF; and "LUTANOL M 40" available from ISP Technologies, Inc. GANTREZ M 574" and "GANTREZ 555"; vinyl ethyl ether, such as "LUTANOL A 25", "LUTANOL A 50" and "LUTANOL A 100"; vinyl isobutyl ether, such as "LUTANOL I30", "LUTANOL "I60", "LUTANOL IC", "LUTANOL I60D" and "LUTANOL I 65D"; methacrylate/vinyl isobutyl ether/acrylic acid, such as "ACRONAL 550 D" available from BASF. Antioxidants used to stabilize the polyvinyl ether pressure-sensitive adhesive include, for example, "IONOX 30" available from Shell, "IRGANOX 1010" available from Ciba-Geigy, and antioxidant available from Bayer Leverkusen "ZKF". For special purposes, other materials such as those described in the BASF literature can be added. These materials include tackifiers, plasticizers, and pigments.

Pressure-sensitive adhesives based on (meth)acrylates generally have a glass transition temperature of about -20°C or lower and may contain from 100 to 80% by weight of C ₃ to C ₁₂ alkyl ester components (such as, for example, , Isooctyl acrylate, 2-ethyl-hexyl acrylate and n-butyl acrylate) and from 0 to 20% by weight of polar components (such as, for example, acrylic acid, methacrylic acid, ethylene vinyl acetate, n-ethylene Pyrolidone and styrene macromonomers). Generally speaking, the (meth)acrylate-based pressure-sensitive adhesive contains from 0 to 20% by weight of acrylic acid and from 100 to 80% by weight of isooctyl acrylate. The (meth)acrylate-based pressure-sensitive adhesive can be self-adhesive or tackifying. Useful tackifiers for acrylic acid are rosin esters, such as "FORAL 85" available from Hercules, Inc.; aromatic resins, such as "PICCOTEX LC-55WK"; aliphatic resins, such as available from Hercules, Inc. "PICCOTAC 95"; and terpene resins such as α-pinene and β-pinene ("PICCOLYTE A-115" and "ZONAREZ B-100" available from Arizona Chemical Co.). Other materials can be added for special purposes, including hydrogenated butyl rubber, pigments, and hardeners that partially vulcanize the adhesive.

Poly-α-olefin pressure-sensitive adhesives (also known as poly(1-olefin) pressure-sensitive adhesives) generally contain substantially non-crosslinked polymers or may have radiation-activated functional groups grafted thereon The non-cross-linked polymer of ® is as described in U.S. Patent No. 5,209,971 (Babu, et al.) (which is incorporated herein by reference). The poly-α-olefin may be self-adhesive and/or include one or more adhesion-promoting materials. If it is not crosslinked, the inherent viscosity of the polymer is generally between about 0.7 and 5.0 dL/g, as measured by ASTM D 2857-93, "Standard Practice for Dilute Solution Viscosity of Polymers". In addition, the polymer is generally mainly amorphous. Practical poly-α-olefin polymers include, for example, C ₃ to C ₁₈ poly(1-olefin) polymers, generally C ₅ to C ₁₂ α-olefins and their combinations with C ₃ or C ₆ to C ₈ the copolymers and their copolymers with C ₃ of. Tackifying materials are generally resins that are mutually soluble in poly-α-olefin polymers. Depending on the specific application, the total amount of tackifying resin in the poly-α-olefin polymer ranges from 0 to 150 parts by weight per 100 parts by weight of the poly-α-olefin polymer. Practical tackifying resins include _{resins derived from the polymerization of C 5} to C ₉ unsaturated hydrocarbon monomers, polyterpenes, synthetic polyterpenes, and the like. Examples of such commercially available resins based on this type of C ₅ olefin fraction are "WINGTACK 95" and "WINGTACK 15" tackifying resins available from Goodyear Tire and Rubber Co.. Other hydrocarbon resins include "REGALREZ 1078" and "REGALREZ 1126" available from Hercules Chemical Co., and "ARKON P115" available from Arakawa Chemical Co.. Other materials can be added for special purposes, including antioxidants, fillers, pigments, and radiation-activated crosslinkers.

Polysiloxane pressure-sensitive adhesive includes two main components: polymer or glue, and tackifying resin. The polymer is generally high molecular weight polydimethylsiloxane or polydimethyldiphenylsiloxane containing residual silanol functionality (SiOH) at the end of the polymer chain, or contains polydiorganosiloxane A block copolymer of alkane soft segment and urea-terminated hard segment. The tackifying resin is generally _{endcapped with trimethylsiloxy (OSiMe 3} ) and also contains a three-dimensional silicate structure with residual silanol functionality. Examples of tackifying resins include SR 545 from General Electric Co., Silicone Resins Division, Waterford, NY, and MQD-32-2 from Shin-Etsu Silicones of America, Inc., Torrance, Calif. The manufacture of a typical silicone pressure-sensitive adhesive is described in US Patent No. 2,736,721 (Dexter). The manufacture of polysiloxane urea block copolymer pressure-sensitive adhesives is described in US Patent No. 5,214,119 (Leir et al.). Other materials can be added for special purposes, including pigments, plasticizers, and fillers. The filler is generally used at 0 to 10 parts per 100 parts of silicone pressure-sensitive adhesive. Examples of fillers that can be used include zinc oxide, silica, carbon black, pigments, metal powder, and calcium carbonate. One type of suitable silicone-containing pressure-sensitive adhesives are those having ethylenediamide-terminated hard segments, such as those described in U.S. Patent No. 7,981,995 (Hays) and U.S. Patent No. 7,371,464 (Sherman ) Of their adhesives.

Useful polyurethane and useful polyurea pressure-sensitive adhesives include, for example, in WO 00/75210 (Kinning et al.) and in US Patent No. 3,718,712 (Tushaus); No. 3,437,622 (Dahl); And their adhesives disclosed in No. 5,591,820 (Kydonieus et al.). In addition, the urea-based pressure-sensitive adhesive described in U.S. Patent Publication No. 2011/0123800 (Sherman et al.) and the amine-based adhesive described in U.S. Patent Publication No. 2012/0100326 (Sherman et al.) Formate pressure-sensitive adhesives can be suitable.

A suitable optically clear pressure-sensitive adhesive is a (meth)acrylate-based pressure-sensitive adhesive and may contain acidic or basic copolymers. In many embodiments, the (meth)acrylate-based pressure-sensitive adhesive is an acid copolymer. Generally speaking, as the proportion of acidic monomers used to prepare the acidic copolymer increases, the cohesive strength of the resulting adhesive increases. The ratio of acidic monomers is generally adjusted depending on the ratio of acidic copolymers present in the blend of the present disclosure.

In order to achieve pressure-sensitive adhesive properties, the corresponding copolymer can be tailored to have a resulting glass transition temperature (Tg) below about 0°C. Suitable pressure sensitive adhesive Agent copolymer is a (meth)acrylate copolymer. Such copolymers are generally derived from at least one alkyl (meth)acrylate monomer containing from about 40% by weight to about 98% by weight, usually at least 70% by weight, or at least 85% by weight, or even about 90% by weight A monomer, which as a homopolymer has a Tg lower than about 0°C.

Examples of such (meth)acrylic acid alkyl ester monomers are monomers in which the alkyl group contains about 4 carbon atoms to about 12 carbon atoms, and such examples include, but are not limited to, n-butyl acrylate, 2-acrylic acid 2- Ethylhexyl, isooctyl acrylate, isononyl acrylate, isodecyl acrylate, and mixtures thereof. Optionally, other vinyl monomers and alkyl (meth)acrylate monomers that are homopolymers and have a Tg higher than 0° C., such as methyl acrylate, methyl methacrylate, isobornyl acrylate, Vinyl acetate, styrene, and the like, to combine one or more low Tg (meth)acrylate alkyl monomers and copolymerizable basic or acidic monomers, provided that the resulting (meth)acrylate copolymer is Tg is below about 0°C.

In some embodiments, it is desirable to use (meth)acrylate monomers that do not have alkoxy groups. The alkoxy group is understood by those with ordinary knowledge in the relevant technical field.

When used, the basic (meth)acrylate copolymer used as the base of the pressure-sensitive adhesive is generally derived from containing from about 2% by weight to about 50% by weight, or from about 5% to about 30% by weight. Basic monomers that can be copolymerized with basic monomers. Exemplary basic monomers include N,N-dimethylaminopropylmethacrylamide (DMAPMAm); N,N-diethylaminopropylmethacrylamide (DEAPMAm); N,N -Dimethylaminoethyl acrylate (DMAEA); N,N-diethylaminoethyl acrylate (DEAEA); N,N-dimethylaminopropyl acrylate (DMAPA); N, N-diethylaminopropyl acrylate (DEAPA); N,N-dimethylaminoethyl methacrylate (DMAEMA); N,N-diethylaminoethyl Methacrylate (DEAEMA); N,N-dimethylaminoethyl methacrylamide (DMAEAm); N,N-dimethylaminoethylmethacrylamide (DMAEMAm); N,N- Diethylaminoethyl acrylamide (DEAEAm); N,N-diethylaminoethylmethacrylamide (DEAEMAm); N,N-dimethylaminoethyl ethyl ether (DMAEVE ); N,N-diethylamino ethyl ethyl ether (DEAEVE); and mixtures of the above. Other useful basic monomers include vinyl pyridine, vinyl imidazole, tertiary amino-functional styrene (e.g., 4-(N,N-dimethylamino)-styrene (DMAS), 4-( N,N-diethylamino)-styrene (DEAS)), N-vinylpyrrolidone, N-vinylcaprolactam, acrylonitrile, N-vinylformamide, (meth)acrylic acid Amines, and mixtures thereof.

When used to form the pressure-sensitive adhesive matrix, acidic (meth)acrylate copolymers are generally derived from copolymers containing from about 2% to about 30% by weight, or from about 2% to about 15% by weight. Acidic monomer of acidic monomer. Useful acidic monomers include, but are not limited to, monomers selected from the group consisting of ethylenically unsaturated carboxylic acids, ethylenically unsaturated sulfonic acids, ethylenically unsaturated phosphonic acids, and mixtures thereof. Examples of such compounds include those selected from the following: acrylic acid, methacrylic acid, itaconic acid, fumaric acid, crotonic acid, citraconic acid, maleic acid, oleic acid, β-carboxyethyl acrylate, 2 -Sulfoethyl methacrylate, styrene sulfonic acid, 2-propenamido-2-methylpropane sulfonic acid, vinyl phosphonic acid, and the like, and mixtures thereof. Due to its easy availability, ethylenically unsaturated carboxylic acids are usually used.

In a specific embodiment, the poly(meth)acrylic acid pressure-sensitive adhesive matrix is derived from between about 1% by weight and about 20% by weight of acrylic acid and between about 99% by weight and about 80% by weight of isooctyl acrylic acid At least one of ester, 2-ethylhexyl acrylate, or n-butyl acrylate composition. In some embodiments, the pressure-sensitive adhesive matrix is derived From about 2% by weight to about 10% by weight of acrylic acid, and about 90% by weight to about 98% by weight of at least one of isooctyl acrylate, 2-ethylhexyl acrylate or n-butyl acrylate composition By.

Another type of (meth)acrylic acid-based pressure-sensitive adhesives with optical clarity are these (meth)acrylic block copolymers. These copolymers may contain only (meth)acrylic monomers or may contain other comonomers, such as styrene. Examples of such pressure sensitive adhesives are described in, for example, US Patent No. 7,255,920 (Everaerts et al.).

In some embodiments, the cover tape 10 may include an optional primer layer 13. The primer layer 13 may be disposed between the first main surface 12A of the first polymeric substrate and the adhesive layer 14. Generally speaking, the primer layer can be any layer suitable for increasing the adhesion between the layers. In this case, the primer layer 13 can increase the adhesion between the polymeric substrate 12 and the adhesive layer 14. A variety of primers are suitable. If used, the composition of the primer layer will depend on the composition of the polymeric substrate 12 and the composition of the adhesive layer 14. For example, several primer technologies have been used to provide improved adhesion between polyester-based substrates and functional coatings (such as adhesive layers) applied to them: using aminosilane coating Film to improve adhesion below freezing temperature, as described in U.S. Patent No. 5,064,722 (Swofford et al.); PET (polyethylene terephthalate) coated with a polyallylamine film primer ) Film to improve the adhesion to the PET film of the polyvinyl butyral or ion plastic resin layer, as described in U.S. Patent No. 7,189,457 (Anderson); a glass laminate for reducing sound transmission, which It can include a three-layer laminate of polyester film between two different polymer layers, as described in U.S. Patent No. 7,297,407 (Anderson); and for many A primer layer of an optical film, wherein the primer layer may include a sulfopolyester and a crosslinking agent, as described in PCT Publication No. WO 2009/123921.

In some embodiments, the second major surface 12B of the first polymeric substrate may include a release coating layer. Many release coating layers can be suitably provided on the second main surface 12B. For example, suitable release coatings include materials such as those used on the back side of tape products to allow the tape to be wound and maintained intact, and then unwound for use. These materials are often referred to as low-adhesion adhesives or LAB. A variety of LABs have been developed for use with a variety of adhesives. Examples of suitable LAB or release coating films suitable for use in the cover tape construction of the present disclosure include: water-based fluorochemical materials described in U.S. Patent No. 7,411,020 (Carlson et al.); and U.S. Patent No. 5,753,346 (Leir et al.) Polysiloxane release coating film; Release composition described in U.S. Patent No. 7,229,687 (Kinning et al.); Polyvinyl N described in U.S. Patent No. 2,532,011 (Dalquist et al.) -Alkyl urethanes (polyurethanes); moisture-curable materials described in U.S. Patent No. 6,204,350 (Liu et al.); and organic materials described in U.S. Patent No. 5,290,615 (Tushaus et al.) Polysiloxane-polyurea copolymer mold release agent.

As discussed above, the antistatic film structure 18 may include an antistatic layer 24 disposed on the main surface 22B of the second substrate 22. Generally speaking, the antistatic layer can be any layer that dissipates static electricity accumulated during storage, transportation, and manufacturing of electronic parts. For example, the antistatic layer may include or be formed of: long-chain aliphatic amines, amides, or quaternary ammonium salts; metal oxides, such as indium tin oxide (ITO), antimony tin oxide (ATO), P-doped Hybrid ATO, titanium oxide (TiO ₂ ), zinc oxide (ZnO), vanadium oxide (V ₂ O ₅ ); conductive polymers such as PEDOT, PSS polyaniline nanofibers; ionic liquids, ionic salts, or polymer salts , Such as those described in U.S. Patent Nos. 6,706,920, 6,732,829, 6,740,413, and U.S. Patent Publication Nos. 2010/0136265 and 2007/0141329, which are hereby incorporated by reference in their entireties; Monomer/oligomer/polymer (for example, ethylamine chloride (N,N,N-trimethyl-2-[(2-methyl-1-oxo-2-propenyl)oxy]) (ethanaminium(N,N,N-trimethyl-2-[(2-methyl-1-oxo-2-propenyl)oxy]chloride)), which can be purchased from TEXNOL CP-81 of Nippon Nyukazai Co., LTD, Japan ; Metal salts, such as barium sulfate (BaSO ₄ ) or lithium chloride (LiCl); Nano particles, such as carbon nanotubes (CNT), graphene-like carbon (GLC); and combinations thereof.

In some embodiments, the antistatic layer may include an antistatic component and a resin component. Suitable antistatic components include ionic liquids, ionic salts, or polymer salts, such as described in U.S. Patent Nos. 6,706,920, 6,732,829, 6,740,413, and U.S. Patent Publication Nos. 2010/0136265 and 2007/0141329 By. For example, the antistatic component may include a nitrogen-containing organic cation and a weakly coordinated fluorine organic anion. Further suitable antistatic agents include ethylamine.

In some embodiments, the resin component may include acrylate or methacrylate monomers or oligomers and mixtures thereof, such as 2-hydroxyethyl methacrylate (2-hydroxyethyl methacrylate), 2-hydroxy- 3-phenoxypropyl acrylate (2-hydroxy-3-phenoxypropyl acrylate), isobornyl acrylate, methyl methacrylate, 2-(N,N-dimethylamine) ethyl acrylic acid Ester (2-(N,N-dimethylamino)ethyl acrylate), ethylene glycol dimethacrylate, pentaerythritol pentaacrylate (pentaerythritol pentaacrylate) (available as SR 399), and (4) bisphenol A diacrylate (dethoxylated (4) bisphenol A diacrylate) (available as SR 601). Further suitable resin components include, for example, polyolefin, polystyrene, polyacrylate, polymethacrylate, polyacrylonitrile, poly(vinyl acetate), polyvinyl alcohol, polyvinyl chloride, polyoxymethylene, polycarbonate , Polyamide, polyimide, polyurethane, phenols, polyamine, amino epoxy resin, polyester, polysiloxane, cellulose-based polymer, polysaccharide, or a combination thereof.

In some embodiments, based on the total weight of the antistatic component and the resin component, the antistatic component occupies between 1wt.% to 50wt.%, 1wt.% to 20wt. %, or between 1wt.% and 10wt.%. Based on the total weight of the antistatic component and the resin component, the resin component in the antistatic layer occupies between 50wt.% to 99wt.%, 70wt.% to 99wt.%, or Amount between 90wt.% and 99wt.%.

In various embodiments, the antistatic component and the resin component may be deposited on the cover tape as a solution including the antistatic component, the resin component, and a solvent. Suitable solvents can include alcohols, ketones, esters, aldehydes, chlorinated solvents, water, and combinations thereof. Suitable alcohols include, for example, methanol, ethanol, 1-propanol or 2-propanol, or 1-methoxy-2-propanol.

In some embodiments, after the solvent is removed, the antistatic layer (if any) can occupy a thickness from 0.01 μm to 100 μm, from 0.05 μm to 10 μm, or from 0.1 μm to 5 μm on the substrate.

The antistatic layer 24 can exhibit many desirable characteristics, making it particularly suitable for the multilayer cover tape of the present disclosure. For example, in some embodiments, the antistatic layer 24 may be an optically transparent layer. In this regard, the antistatic layer 24 may have a visible light transmittance (%T) of at least 75%, at least 80%, or higher.

In order to impart antistatic properties to the multilayer cover tape, in some embodiments, the antistatic layer 24 may have a surface impedance of less than 10E12 ohms/square, less than 10E10 ohms/square, or less than 10E7 ohms/square; or Surface impedance between 10E4 and 10E12 ohm/square, between 10E4 and 10E10 ohm/square, or between 10E4 and 10E8 ohm/square.

In some embodiments, the multilayer cover tape structure of the present disclosure can be sufficiently flexible to be wound on itself, so that the multilayer cover tape can be supplied and used in the form of a roll.

Referring now to Figure 2, a multilayer cover tape structure 10' according to some embodiments of the present disclosure is depicted. As shown, the belt structure 10' may include a substrate 12' having a first main surface 12A' and a second main surface 12B', an adhesive layer 14', and an antistatic layer disposed on the second main surface 12B' 18'. The adhesive layer 14' and the antistatic layer 18' may be configured such that the antistatic layer 18' is disposed closest to the second main surface 12B'. In some embodiments, the adhesive layer 14' may only be disposed on a part of the polymeric substrate 12'. For example, the adhesive layer 14' may be two or more adhesive strips disposed on a part of the substrate 12' (for example, on the opposite longitudinal edges of the substrate 12'), so that the antistatic layer 18' The other parts remain exposed between the adhesive strips. The belt structure 10' may also include a low-adhesive back adhesive layer 16', which is disposed on the first main surface 12A'. In addition, one or more optional primer layers can be provided on the second major surface On 12B’. For example, as shown, the first primer layer 13' can be disposed between the second main surface 12B' and the antistatic layer 18', and/or the second primer layer 13" can be disposed on the antistatic layer 18. Between'and the adhesive layer 14'.

Many of the elements of this second type of multilayer cover tape construction are the same or may be the same as those described above. Specifically, the adhesive layer, low-adhesion adhesive layer, primer layer and antistatic layer can be as described above. In some embodiments, the polymeric substrate 12' includes or is formed of cellulose acetate as described above.

In some embodiments, the present disclosure further relates to a carrier tape assembly incorporating the above-mentioned cover tape structure. The carrier tape assembly may include; (i) a carrier tape for electronic component transportation, which includes parallel strip portions in the longitudinal direction, the strip portions having a top surface and a bottom surface, and a plurality of dent sections (or concave Cavities) between the parallel strip portions, which are used for accommodating electronic components intermittently formed in the longitudinal direction of the tape; and (ii) a multilayer covering tape structure as described above, which is used for releasable sealing The cavities of the carrier tape.

Fig. 3 shows an embodiment of the carrier tape assembly 100 of the present disclosure, and includes the carrier tape 101 and any of the above-mentioned multilayer cover tapes 10 or 10'. The illustrated carrier tape assembly 100 is practical for storage and transportation of components (especially electronic components) through advanced mechanisms. More specifically, the flexible carrier tape 101 has a carrier or strip portion 102 that defines a top surface and a bottom surface opposite the top surface. The strip portion 102 includes longitudinal edge surfaces 104 and 106, and a row of aligned advance holes 108 and 110 formed in the edge surface and extending along one (preferably both) of the edge surface. The advancing holes 108 and 110 provide a member for receiving an advancing mechanism, such as a sprocket of a sprocket driver for advancing the carrier tape 101 toward a predetermined position.

A series of recesses 112 may be formed at intervals along the strip portion 102, and the recesses penetrate the top surface of the strip portion. In a given carrier tape, each cavity can be essentially the same as the other cavity. Generally speaking, the cavities are aligned with each other and equally spaced apart. In the illustrated embodiment, each cavity includes a side wall 114 that is coupled to the top surface of the bar portion and extends downward from the top surface of the bar portion, and is coupled to the bottom wall 116 to form the cavity 112. The bottom wall 116 may generally be flat and parallel to the plane of the strip portion 102. Optionally, the bottom wall 116 may include a hole or a through hole 117, the size of which accommodates a mechanical pusher (for example, a needle) to facilitate the removal of the component 118 (such as an electronic component (for example, Silicone encapsulated LED die)). The aperture 117 can also be used by an optical scanner to detect whether a component is present in any given cavity. In addition, the apertures 117 are useful for evacuating the cavities to allow more efficient loading of components into the cavities.

The cavity 112 is designed to conform to the size and shape of the component to be received. Although not specifically shown, the cavity may have more or fewer sidewalls than the four sidewalls shown. Generally speaking, each cavity includes at least one side wall, which is connected to the bar portion 102 and extends downward from the bar portion 102, and a bottom wall is connected to the side wall to form the cavity. Therefore, the cavities can be circular, oval, triangular, pentagonal, or have contours of other shapes. Each side wall can also be formed with a slight draft (that is, 2° to 12° inclined toward the center of the cavity) to facilitate the insertion of the component and help make the cavity self-mold or shape during the carrier tape manufacturing. Mold release. The depth of the cavity can also be changed according to the element to be received by the cavity. In addition, the inside of the cavity can be formed with ledges, ribs, pedestals, rods, rails, appurtenances, and other similar structural features to better accommodate or support Specific components. Although only a single row of cavities is shown in the figure, two or more aligned cavities can also be formed along the strip portion to facilitate simultaneous delivery of multiple components. It is expected that the rows of cavities will be arranged parallel to each other, and the cavities in one row are aligned with the cavities in the adjacent row(s) in a row.

The carrier tape 101 may be formed of any polymer material with sufficient gauge and flexibility to allow it to be wound around a hub of a storage reel. Preferably, the carrier tape 101 may be optically clear, which means that it is sufficiently transparent to allow the components stored in the cavities to be visually inspected without removing the multilayer cover tape 10 or 10'. A variety of polymer materials can be used, including but not limited to: polyester (such as polyethylene glycol modified polyethylene phthalate), polycarbonate, polypropylene, polystyrene, and acrylonitrile-butadiene-benzene Vinyl.

As shown in Fig. 3, a multi-layer cover tape (10 or 10') covers part or all of the cavities 112 and is disposed between the advancing holes 108 and 110 along the length of the strip portion 102. The multi-layer covering tape (10 or 10') is releasably fastened to the top surface of the strip portion 102 so that it can be removed to access the stored components. Regarding the multilayer cover tape 10, in some embodiments, the exposed portion of the adhesive layer 14 may generally correspond to the parallel longitudinal joining portions 122 and 124, which can be joined to the longitudinal edge surfaces 104 and 106 of the strip portion 102, respectively. Regarding the multi-layer cover tape 10', the striped adhesive layer 14 generally corresponds to the parallel longitudinal joining portions 122 and 124, and the parallel longitudinal joining portions 122 and 124 can be joined to the longitudinal edge surfaces 104 and 106 of the strip portion 102, respectively. The multi-layer cover tape (10 or 10’) can be located on the carrier tape 101, so that the multi-layer cover tape (10 or 10’) covers the cavities As far as the area of 112 is concerned, the antistatic layer is the layer of the multilayer covering tape (10 or 10') closest to the cavities 112.

This article also discloses a method of forming a multilayer cover tape structure. In some embodiments, the method includes providing an adhesive tape structure including a first substrate, the first substrate having a first major surface and a second major surface, the second polymeric substrate There is a low-adhesive back glue coating film on the main surface, and an adhesive layer is coated on the first main surface of the first substrate. The method further includes: forming an antistatic film structure including a second substrate (which includes cellulose acetate or is formed of cellulose acetate), the second substrate having a first major surface and a second major surface; And adhering the second main surface of the second substrate to the adhesive layer, so that parts of the adhesive layer remain exposed on each side of the second polymeric substrate. Forming the antistatic film structure includes: depositing an antistatic layer on the second main surface of the second substrate. Any conventional coating technique can be used to deposit the antistatic layer on the second substrate, including, for example, Meyer bar coating, knife coating, gravure coating, curtain coating, or slot mode coating. cloth.

In some embodiments, the method of forming a multilayer cover tape structure includes: providing a substrate having a first major surface and a second major surface, and the second major surface of the substrate has a low adhesiveness Adhesive coating film; and forming an antistatic layer on the first main surface of the substrate, and applying an adhesive layer to a part of the antistatic layer (for example, coating in two or more strips, So that part of the antistatic layer remains exposed between the adhesive layers). Forming the antistatic film structure includes: depositing an antistatic layer on the first main surface of the substrate. Any conventional coating technique can be used to deposit the antistatic layer on the substrate The above, for example, includes Meyer bar coating, knife coating, gravure coating, curtain coating or slit mode coating.

In some embodiments, the method of the present disclosure further includes applying a primer layer between one or more layers of the multilayer cover tape structure, as discussed above.

In some embodiments, in addition to the above-mentioned surface energy characteristics or instead of the above-mentioned surface energy characteristics, the multilayer cover tape of the present disclosure may also include microstructure protrusions having a width of 0.05 mm to 4.0 mm and a depth of 0.03 mm to 0.1 mm. . For example, these microstructure protrusions can be provided on any of the substrates on a surface of the substrate closest to the adhesive layer (which can be a heat activated adhesive (HAA)) superior. 11A and 11B respectively show the surface morphology of the cover tape without microstructure protrusions and with microstructure protrusions.

Together with the silicone used to encapsulate electronic components with considerable adhesiveness, the adhesion test of the cover tape is carried out. The adhesiveness of the microstructured HAA cover tape (2675-wm) was tested through commercially available cover tapes 2675, 2670, and 2671A. The lower the viscosity, the lower the grain adhesion, so the better the cover tape. Figure 12 shows the peeling force required for each of the tested cover tape and the cover tape containing the adhesive silicone component. Figure 12 compares the peel force requirements of different cover tapes when tested against the silicone composition, where the cover tape of the microstructure protrusions exhibiting the lowest peel force indicates lower die sticking characteristics.

Example list

1. A multilayer covering tape structure, comprising: a first substrate having a first main surface and a second main surface; An adhesive layer disposed on the first main surface of the first substrate; and an antistatic structure disposed on the first main surface of the first substrate; wherein the antistatic structure includes: A second polymeric substrate having a first major surface and a second major surface; and an antistatic layer disposed on the second major surface of the second substrate; and wherein the second polymeric substrate The material has a surface energy between 5 mN/m and 500 mN/m, and a surface roughness between 0.1 μm and 5 μm.

2. A multilayer covering tape structure comprising; a polymeric substrate having a first main surface and a second main surface; an adhesive layer disposed on the first main surface of the first substrate And an antistatic layer disposed on the first main surface of the first substrate; wherein the polymeric substrate has a surface energy between 5mN/m and 500mN/m, and between 0.1μm A surface roughness between 5μm and 5μm.

3. The multilayer covering tape structure of any one of the preceding embodiments, wherein the antistatic layer includes an antistatic component, which includes an ionic liquid, an ionic salt, a metal oxide, or a polymer salt.

4. The multilayer covering tape structure of any one of the preceding embodiments, wherein the antistatic layer includes an antistatic component, which includes (a) a nitrogen-containing organic cation and a weakly coordinated fluorine organic anion; or (b) ) Ethylamine.

5. The multilayer covering tape structure of any one of embodiments 3 to 4, wherein the antistatic layer further comprises a resin component.

6. The multilayer covering tape structure of embodiment 5, wherein the resin component contains acrylate or methacrylate monomers or low polymers, or isocyanate and epoxy monomers.

7. The multilayer covering tape structure of any one of embodiments 5 to 6, wherein based on the total weight of the antistatic component and the resin component, the antistatic component occupies between 1wt in the antistatic layer. % To 20wt.%.

8. The multilayer covering tape structure of any one of embodiments 5 to 7, wherein based on the total weight of the antistatic component and the resin component, the resin component occupies between 70wt in the antistatic layer. % To 99wt.%.

9. The multilayer covering tape structure of any one of the preceding embodiments, wherein the thickness of the antistatic layer is from 0.05 μm to 10 μm.

10. The multilayer covering tape structure according to any one of the preceding embodiments, wherein the first substrate or the second substrate comprises PET, BOPP, or cellulose acetate.

11. The multilayer covering tape structure of any one of the preceding embodiments, wherein the adhesive layer includes a pressure-sensitive adhesive.

12. The multilayer covering tape structure of any one of the preceding embodiments, which further comprises a release coating layer.

13. A carrier tape assembly, comprising: a carrier tape for the transportation of electronic components, the carrier tape comprising: a portion having a top surface, a bottom surface opposite to the top surface, and for carrying A plurality of cavities containing the electronic components, the The cavities are spaced along the strip portion and penetrate the top surface of the strip portion; and the multilayer covering tape structure as in any one of the preceding embodiments, wherein the multilayer covering tape structure covers at least a part of the cavities.

14. A method of forming a multilayer covering tape structure, comprising: providing an adhesive tape structure, which comprises: a first substrate having a first main surface and a second main surface; and an adhesive layer, It is coated on the first main surface of the substrate; an antistatic film structure is formed, which includes: a second polymeric substrate having a first main surface and a second main surface, wherein the second The polymeric substrate has a surface energy between 5mN/m and 500mN/m, and a surface roughness between 0.1μm and 5μm; and an antistatic layer disposed on the second main surface And the second main surface of the second substrate is adhered to the adhesive layer, so that parts of the adhesive layer remain exposed on each side of the second substrate.

Instance

These examples are for illustrative purposes only, and are not intended to limit the scope of the accompanying patent application.

Material Material

For the examples disclosed in this application, cellulose acetate can be purchased from 3M Company, which is located in St. Paul, MN and Clarifoil, UK. The BOPP material with a thickness of 13 μm can be purchased from PT.Trias Sentosa, Tbk Indonesia. PET film (ARYAPET A-491-single-side corona treated matte film (88% OT) and ARYAPET A391-single-side corona treated ultra-smooth film (69% OT)) can be purchased from JBF, Bahrain SPC, UAE .

Such as acrylate/methacrylate CD9053 (trifunctional acid ester), SR351NS (trimethylolpropane triacrylate, SR740A (dimethacrylate), SR340 (2-phenoxyethyl methacrylate) , CN9062 (acrylic esters urethane acrylate) resin can be purchased from Sartomer Company, Exton, PA, isobornyl acrylate can be purchased from Sigma Aldrich Pte Ltd, Singapore, and Desmodur 3300 and Desmodur 3800 isocyanate can be purchased from Bayer Materials, Germany.

Commercially available antistatic coating solution Texnol-CP81 and acrylic copolymer emulsion can be purchased from Nippon Nyukazai Company., Ltd, Japan. FC4400 and Fc5000i can be purchased from 3M Company, St. Paul, MN, and nano-ZnO can be purchased from Nanomaterials Technology (NMT), Singapore. Acrylate-based copolymer solution PMH-8899 (which is used as a LAB material for cellulose acetate) can be purchased from 3M Company, St. Paul, MN.

Methyl ethyl ketone (MEK), ethyl acetate and 1-methoxy-2-propanol, cross-linking agent 1,4-butanediol and catalyst dibutyl tin dilaurate (DBTDL) solvent can be purchased from Sigma-Aldrich Pte Ltd ,Singapore.

Coating method

A No. 2 Meyer rod (available from R.D. Specialties, Webster, N.Y.) was used to coat the antistatic coating solution on the substrate (PET, BOPP, and cellulose acetate) to obtain a wet film with a thickness of about 5 μm. The coatings are cured at room temperature or 100°C as required. In the acrylate/methacrylate example, UV curing is used. Generally speaking, depending on the solid content of the coating solution, the dry film thickness of the thermally cured coating is about 1 to 2 μm.

Surface resistivity, surface energy, surface roughness and grain adhesion measurement

The surface resistivity of the paint was measured with a HIRETA UP MCP HT 450 surface resistivity meter under an applied voltage of 10V. For each coating condition, three surface resistivity measurements were performed randomly on an area of 20 cm x 30 cm.

Mitutoyo surface profiler was used to measure the surface roughness of the obtained film and the antistatic coating film.

Surface energy is in accordance with ASTM D7490-13 (Standard Test Method for Measurement of the Surface Tension of Solid Coatings, Substrates and Pigments using Contact Angle Measurements)) quantity. The contact angle of this water and diiodomethane was measured using a goniometer from Attension, Finland.

The 3M internal testing method was used to measure the LED die adhesion, which used 20 LED dies encapsulated with silicone. The LED dies are placed on a smooth glass surface with an upwardly facing dome encapsulated with silicone. The surface of the film to be tested was placed in a dome encapsulated with polysiloxane and allowed to stay in that position for 15 minutes by placing a glass plate weighing 70 grams. After 15 minutes, the glass plate and film were removed, and the number of LED die sticking to the film was recorded.

Example 1

Antistatic coating formulations are based on different acrylate/methacrylate monomers/oligomers or their mixtures (CD9053-SR351NS 1:1 mixture; Sartomer CD9053-trifunctional ester, isobornyl acrylate, SR740 dimethacrylate) Ester (with 5, 10 and 20% FC4400), phenoxyethyl methacrylate, CN9062 acrylate urethane acrylates), and FC4400 ionic liquid as an antistatic agent, and listed in the table 1 in. The acrylate/methacrylate monomers/oligomers or mixtures thereof are prepared in 1-methoxy-2-propanol solvent to have a resin content of 20% by weight. The FC4400 ionic liquid was added to obtain a coating solution with 5wt%, 10wt%, and 20wt% FC4400 filler based on the weight of the resin. Irgacure 158 starter is used for UV crosslinking. A 5 μm Meyer rod was used to coat the cellulose acetate film with the above formulation. Generally speaking, if there is a solid content of 20wt% in the coating formulation, a dry thickness of about 1μm will be obtained after curing. membrane. The curing is achieved in a two-step process: (i) in the first step, the solvent is discharged by exposing the coated substrate to an oven at 100°C for 2 minutes; (ii) exposure to UV light.

The effects of acrylate/methacrylate monomers/oligomers or their mixtures on the coating properties (such as adhesion and surface resistance) are listed in Table 1. The initial formulation with 10 wt% FC4400 content was tested to select a monomer/oligomer suitable for the cellulose acetate film. Using different FC4400 content to further optimize the monomer/oligomer formulations with good adhesion enhancement to achieve the required surface resistivity.

Table 1 shows the influence of monomer/oligomer on coating adhesion and surface resistance.

The following observations are drawn from the above results.

The surface resistivity of the cellulose acetate before the antistatic coating is in the range of 5.99E+13 to 9.94E+13, which is closer to a non-conductor.

Sartomer CD9053 trifunctional ester and Sartomer CD9053-SR351NS 1:1 mixture of antistatic coatings all exhibited very poor adhesion to cellulose acetate substrates. However, both coatings exhibit surface resistivity in the static dissipation range (ohm/square).

In the case of isobornyl acrylate, the coating is uniform and adheres to the cellulose acetate substrate. However, in the case of 10wt% FC4400, the surface impedance of the coating is higher than the SR measurement range (greater than E14 ohms/square). Therefore, isobornyl acrylate was not used for further research.

In the case of 10wt% FC4400, the use of SR340 (phenoxyethyl methacrylate) results in a coating with quite good adhesion, but its surface resistance is relatively high (approximately E10 ohms/square). Increasing the Fc4400 filler to 20wt% or more did not reduce the surface resistivity.

The CN9062 (urethane acrylate acrylate) used with FC4400 ionic liquid forms a very stable and sticky coating on the cellulose acetate film. The coating with 10wt% FC4400 exhibits surface resistivity in the E9-E10 ohm/square range, making it suitable for cover tape applications.

In all the formulations of acrylate/methacrylate oligomer, SR740A (dimethacrylate oligomer) forms a very sticky and stable cellulose acetate film. Set paint. Therefore, with 5, 10, and 20wt% additives in the coating solution, the effect of FC4400 antistatic ionic liquid was tested. Although the 5wt% FC4400 additive exhibits surface resistivity in the range of E8 to E9 ohm/square, as the FC4400 content increases to 10wt%, the surface resistivity range decreases to E6 to E7 ohm/square. However, the FC4400 content was further increased to 20wt% without reducing the surface resistivity, which indicates that the optimal FC4400 content required to reduce the range of surface resistivity to E6 to E7 ohms/square is 10wt%.

Figure 4 shows the effect of FC4400 content on the surface resistance of coatings formed with SR740A dimethacrylate oligomer.

(i) Antistatic coatings based on FC4400 ionic liquid and various acrylate/methacrylate monomers/oligomers can be formed on the cellulose acetate film.

(ii) By changing the content of FC4400 ionic liquid, the surface resistance of the antistatic coating can be changed in the range of 10E7-10E11 ohm/square.

(iii) The antistatic coated cellulose acetate film exhibits the characteristic of not sticking to the parts cast with silicone and the LED dies encapsulated with silicone, which proves that it is good for handling the parts encapsulated with silicone / Suitability for the application of silicone parts.

Example 2

Texnol-CP81 is the chlorination of ethylamine (N,N,N-trimethyl-2-[(2-methyl) in a solvent mixture of methanol (MeOH), ethanol (EtOH), propanol (PrOH), and water Oxy-1-oxo-2-propenyl)oxy]), containing butyl-2-acrylate (n-butyl acrylate) and 2-methyl-2-methacrylate (methyl methacrylate) Mixture of polymers.

The paint was applied to cellulose acetate and thermally dried in an oven at 100°C for 2 minutes. The antistatic coating of Texnol-CP81 forms a uniform and sticky coating on the cellulose acetate film. The range of the surface resistance of the coating is 3.72E7-9.82E7 ohm/square. In order to test the adhesion of the paint, a tape peel test was performed using magic tape. The range of the surface resistivity of the coating exhibited a slight increase to 8.52E7-2.53E8 ohms/square. However, the coating remained adhered without being peeled off, exhibiting its durability.

Figure 5 shows (1) the obtained antistatic coating and (2) the surface resistance after the tape peel test.

In order to test the effect of the cellulose acetate film coated with Texnol-CP81 on the grain sticking problem, the cover tape structure of the cellulose acetate film coated with Texnol-CP81 was placed on a dome-shaped polycarbonate Silicone-encapsulated LED die carrier. The dome-shaped polysilicon-encapsulated parts appear to be perfectly placed in the carrier without the problem of die sticking. This further confirms the suitability of the cellulose acetate-based cover tape with an antistatic agent in solving the problem of grain sticking.

The cellulose acetate film coated with the commercially available antistatic coating Texnol-CP81 exhibits non-stick properties for LED dies encapsulated with polysiloxane. When the cellulose acetate film coated with Texnol-CP81 was tested as a cover tape on a polysilicon-encapsulated LED die in a carrier, it did not show the die sticking phenomenon, and all the LEDs The crystal grains are maintained in the carrier.

Example 3 1. FC5000i ionic liquid and nano-ZnO in acrylate polymer solution PMH-8899:

The acrylate polymer solution PMH-8899 was tested with 5wt% filler by diluting with ethyl acetate and toluene. For the 5% solution of PMH-8899, FC5000i ionic liquid and nano-ZnO particles were added as antistatic agents, and the surface resistance and grain adhesion were tested. For the weight of acrylic resin, the antistatic ionic liquid FC5000i was tested with 2.5, 5.7.5, 10, 20, and 30wt% filler. In a 5% PMH-8899 solution, 5, 7.5, and 10wt% fillers were used to test nano-ZnO. Mix antistatic additives and PMH-8899 solution in a vortex mixture, and use a 5 μm Meyer rod to coat the matte and non-matte surfaces of the cellulose acetate and BOPP substrate. The paint was dried in an oven at 80°C for 15 minutes.

The surface resistivity of the paint surface was measured, and the results of paints with FC5000i content of 10 wt% and higher are shown in FIG. 6. Below 10wt% of FC5000i, the surface resistivity of the coating exceeds E11 ohm/square, which is higher than the usable range, so it is not shown in this figure. For a FC5000i content of 10wt%, the surface resistivity is in the range of E11 ohms/square, which decreases to the range of E10 to E11 as the FC5000i filler increases to 20wt%. In addition, the FC5000i content increased to 30wt% reduced the surface resistivity to the range of E10 ohms/square. The change in the surface morphology of the surface (i.e., matte and non-matte) does not significantly affect the surface resistivity.

Figure 6 shows the effect of FC5000i content on the surface resistivity of cellulose acetate and BOPP films.

In 5% PMH-9900 solution, less than 5, 7.5, and 10wt% of nano-ZnO filler is coated on cellulose acetate and BOPP film. The coated substrate was dried at 80°C for 15 minutes. Figure 7 shows the surface resistivity of coatings formed on the matte surface of a cellulose acetate film under different nano-ZnO fillers.

Figure 7 shows the effect of ZnO filler on the surface resistivity of a cellulose acetate substrate.

As the ZnO content increases from 5wt% to 10wt%, the surface resistivity of the coating exhibits a steady decline. After drying, the nano-ZnO-PMH-8899 coating formed on the cellulose acetate film was clear and transparent. The coated cellulose acetate and BOPP films exhibited 95% light transmittance, which is similar to uncoated films.

Example 4

This example describes the structure of a multilayer cover tape based on a PET substrate to solve the problem of die sticking of LED dies and components encapsulated by polysiloxy. In this multilayer structure, an ionic liquid containing FC4400 is used as an antistatic agent to form an antistatic coating layer by polymerizing isocyanate oligomers (Desmodur 3300 and Desmodur 3800).

This example shows the effect of surface processing of PET substrates (non-matte, matte, and super-matte) on die sticking.

In this regard, Desmodur 3300 and Desmodur 3800, 1,4-butanediol crosslinker, ionic liquid FC4400, and catalyst dibutyltin dilaurate (DBTDL) were used to prepare a two-tank system.

Part 1 consists of Desmodur 3300/3800 and FC4400, which is diluted with 1.5 gm of MEK. The solids content of Part 1 is approximately 50%. Part 2 consists of 1,4-butanediol and catalyst (dibutyl tin dilaurate DBTDL), which is diluted with 0.5 gm of MEK. The solids content of Part 2 is approximately 45%. Before coating, mix Part 1 and Part 2 in a vortex mixture to obtain a homogeneous solution.

Immediately after mixing, a No. 2 Meyer rod (from R.D. Specialties, Webster, N.Y.) was used to coat the solution on a non-mat, mat, and super-mat PET substrate to obtain a wet film with a thickness of 5 μm. The coating was cured in an oven at 100°C for 2 minutes.

Table 2 shows the effect of surface roughness and surface energy on the grain sticking problem of three different PET substrates.

The following observations are drawn from these results.

Using matte and super matte PET substrates, there is no problem of sticking of the crystal grains. It is observed that the matte and super matte surfaces have a surface roughness in the range of 0.31-0.36 μm, which is much higher than the unmatted surface (0.11 μm). On the other hand, the surface energy of these PETs only fluctuates by about 10% to 20%. Therefore, it can be said that for a substrate having a surface energy ranging from 40 mN/m to 60 mN/m, the higher the surface roughness of the substrate plays an important role in determining the grain adhesion characteristics.

Mix the ionic liquid FC4400 with 2.5, 5, and 10wt% filler with Desmodur 3800 isocyanate, solvent, and crosslinking agent, and coat it on the surface of non-matte, matte, and super-matte PET. Since the surface resistivity value of FC4400 when the additive is 2.5wt% is higher than E11 ohm/square, the results of FC4400 with 5 and 10wt% filler are shown. Since shiny PET exhibits a problem of grain sticking, compare the results of the surface resistivity of the anti-static coated matting and super matting surfaces in Figure 8.

Figure 8 shows the effect of FC4400 filler on the surface resistivity of matt and supermat PET surfaces.

Using 5wt% FC4400 filler, the surface resistivity of the coated surface is about E10 ohm/square, and the increase of FC4400 filler to 10wt% reduces the surface resistivity to the range of E9 ohm/square. However, grain sticking is not affected by changes in FC4400 filler.

Example 5 The influence of film surface energy and surface roughness on the problem of grain sticking

Since it is found that the surface energy and surface roughness of the substrate play a major role in determining the adhesion characteristics of the crystal grains, the test of various substrates (cellulose acetate, BOPP, and PET) with non-matting, matting, and super-matting surface processing These two parameters. These substrates (some substrates have antistatic coatings, and some substrates are in the conditions as obtained) were tested for adhesion to the LED dies encapsulated with polysilicon. Table 2 shows the types of films tested, their surface energy and surface roughness values, and their corresponding effects on the problem of grain sticking.

Table 3 shows the effect of surface roughness and surface energy on the grain sticking problem of different substrates.

In order to further understand the surface energy and surface roughness range of the film on the problem of grain sticking, the results are shown in the form of a contour map in FIG. 9.

Figure 9 shows the range of surface energy and surface roughness on the problem of die sticking.

The following observations are drawn from the figure.

1. In the range of surface roughness of 0.20μm to 0.50μm and surface energy of 22mN/m to 60mN/m, the problem of grain sticking does not exist or is minimal. Within this range, as the surface energy increases, the surface roughness needs to be similarly increased to solve the problem of grain sticking. For a film with a surface energy of 25mN/m, a surface roughness of 0.22μm is sufficient to solve the problem of grain sticking. As the surface energy increases to 50 mN/m, the surface roughness needs to be increased to about 0.35 μm.

2. Although in general, low surface energy is a good solution to the problem of die sticking (for example, using low surface energy fluoropolymer-coated lining material as the adhesive-coated film/tape), low Surface energy does not solve the problem of grain sticking. In addition to surface energy, surface roughness plays an important role. It is observed that when the surface roughness value is lower than 0.22 μm, even the film with a lower or lower surface energy of 25 mN/m has the problem of grain sticking. Therefore, it can be said that the minimum surface roughness of 0.22μm is for the solution It is necessary to solve the problem of grain sticking, regardless of the surface energy value (20mN/m to 50mN/m).

3. In addition to the surface roughness value, similarly, it is also necessary to meet the minimum surface energy requirement to solve the problem of grain sticking. It is observed that when the surface energy value is lower than 22mN/m, the film has a problem of grain sticking, regardless of the surface roughness (0.01μm to 0.4μm).

Compared with the non-matte surface, the matte surface of both cellulose acetate and BOPP substrates exhibits better non-die adhesion performance for LED dies encapsulated with polysiloxane.

The surface roughness value and surface energy value of the substrate have a clear role in the problem of grain sticking, and the smallest is observed in the surface roughness range of 0.20μm to 0.50μm and the surface energy range of 22mN/m to 60mN/m Grain sticking or no grain sticking is observed.

The test uses matte BOPP to manufacture heat activated adhesive (HAA) and pressure sensitive adhesive (PSA) covering tapes. The heat activated adhesive was coated on the edge of the BOPP substrate and tested on a carrier to know its suitability as a HAA cover tape. Similarly, in order to test the use of matte BOPP as a PSA cover tape, a PET substrate with adhesive was laminated on the matte BOPP so that the PET adhesive layer can be adhered to the carrier. The cover tape structure with the matte BOPP equipped with antistatic coating and the LED die encapsulated with polysilicone were tested for die sticking, and no die sticking was observed. In addition, a cover tape is tested on a carrier on which LED dies encapsulated with polysilicon are stacked. With the matte BOPP film, no sticking of the crystal grains was observed, which is shown in FIG. 10.

Figure 10 shows the test of a matte BOPP substrate as a cover tape on a carrier stacked with LED dies encapsulated with polysilicon.

10‧‧‧Multi-layer covering tape structure

12‧‧‧Substrate

12A‧‧‧First main surface

12B‧‧‧Second major surface

13‧‧‧Primer layer

14‧‧‧Adhesive layer

16‧‧‧Low adhesion adhesive film

18‧‧‧Antistatic film structure

22‧‧‧Second base material

22A‧‧‧First main surface

22B‧‧‧Second major surface

24‧‧‧Antistatic layer

Claims (14)

A multilayer covering tape structure, comprising: a first substrate having a first main surface and a second main surface; an adhesive layer disposed on the first main surface of the first substrate; And an antistatic structure disposed on the first main surface of the first substrate; wherein the antistatic structure includes: a second polymeric substrate having a first main surface and a second main surface; And an antistatic layer disposed on the second main surface of the second substrate; and wherein the second polymeric substrate has a surface energy between 5mN/m and 500mN/m, and A surface roughness between 0.1μm and 5μm. The multilayer covering tape structure of claim 1, wherein the antistatic layer includes an antistatic component, which includes an ionic liquid, an ionic salt, a metal oxide, or a polymer salt. The multilayer covering tape structure of claim 1, wherein the antistatic layer includes an antistatic component, which includes (a) a nitrogen-containing organic cation and a weakly coordinated fluorine organic anion; or (b) ethylamine. The multilayer covering tape structure of claim 1, wherein the antistatic layer further comprises a resin component. The multilayer covering tape structure of claim 4, wherein the resin component contains acrylate or methacrylate monomers or oligomers, or isocyanate and epoxy monomers. Such as the multilayer covering tape structure of claim 5, wherein based on the total weight of the antistatic component and the resin component, the antistatic component occupies between 1wt.% to 20wt.% in the antistatic layer quantity. Such as the multilayer covering tape structure of claim 6, wherein based on the total weight of the antistatic component and the resin component, the resin component occupies between 70wt.% and 99wt.% in the antistatic layer quantity. Such as the multilayer covering tape structure of claim 1, wherein the thickness of the antistatic layer is from 0.05μm To 10μm. The multilayer covering tape structure of claim 1, wherein the first substrate or the second substrate comprises PET, BOPP, or cellulose acetate. The multilayer covering tape structure of claim 1, wherein the adhesive layer contains a pressure-sensitive adhesive. Such as the multilayer covering tape structure of claim 1, which further includes a release coating layer. A carrier tape assembly, comprising: a carrier tape for electronic component transportation, the carrier tape comprising: a section having a top surface, a bottom surface opposite to the top surface, and a carrier tape for carrying the And the plurality of cavities of the electronic component, the cavities are spaced along the strip portion and penetrate the top surface of the strip portion; and the multilayer covering tape structure of claim 1, wherein the multilayer covering tape structure covers the recesses At least part of the hole. A method for forming a multilayer covering tape structure, comprising: providing an adhesive tape structure, comprising: a first substrate having a first main surface and a second main surface; and an adhesive layer, which is coated On the first main surface of the substrate; forming an antistatic film structure, which includes: a second polymer substrate having a first main surface and a second main surface, wherein the second polymer base The material has a surface energy between 5 mN/m and 500 mN/m, and a surface roughness between 0.1 μm and 5 μm; and an antistatic layer disposed on the second main surface; and The second main surface of the second substrate is adhered to the adhesive layer, so that parts of the adhesive layer remain exposed to each side of the second substrate. A multilayer covering tape structure, comprising: a polymeric substrate having a first main surface and a second main surface; An adhesive layer disposed on the first main surface of the first substrate; and an antistatic layer disposed on the first main surface of the first substrate; wherein the polymeric substrate has a dielectric A surface energy between 5mN/m and 500mN/m, and a surface roughness between 0.1μm and 5μm.

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